A full-laminating module process for a semi-spherical cover plate

Abstract

The application discloses a kind of full lamination module processes of hemispherical cover plate, comprising the following steps: S1, optimizing cover plate: increase "+" Mark silk screen line on the basis of cover plate;S2, adjust OCA attachment mode: OCA is changed from traditional mode to OCA on FOG on polaroid on cover plate;S3, full lamination feeding: by making special profiling feeding fixture of hemispherical cover plate and special profiling feeding fixture of FOG, hemispherical cover plate is fed below, and FOG is fed above;S4, pressure maintaining platform: change the cavity pressure maintaining platform of full lamination equipment, make hemispherical profiling structure under cavity pressure maintaining platform, and make hemispherical groove in platform.The application optimizes cover plate design, increases "+" Mark silk screen line, for controlling full lamination rotation angle, adjusts OCA attachment mode, changes OCA from traditional mode to OCA on FOG glass, effectively solves the problem that OCA on cover plate and OCA on hemispherical cover plate will cause tear OCA and heavy film difficulty (vacuum absorption of spherical cover plate is easy to break vacuum) problem.

Description

Technical Field

[0001] This invention relates to the field of full lamination technology for hemispherical products, and in particular to a full lamination module process for hemispherical cover plates. Background Technology

[0002] Hemispherical products have a magnifying effect like a convex lens, which is needed in special fields. Currently, in the bonding technology, the feeding of hemispherical products for full bonding is uneven. In the traditional feeding scheme, the cover plate is fed on top and the FOG is fed on the bottom. Using this process with hemispherical cover plates, it is easy to cause vacuum breakage of the suction nozzle, misalignment of the full bonding pre-pressure, and uneven pressure holding force. When OCA is applied to the cover plate in a conventional way, applying OCA to the hemispherical cover plate will make it difficult to remove the OCA film (vacuum adsorption of spherical cover plates is easy to break). The positioning of hemispherical products for full bonding is difficult, which can easily cause full bonding misalignment. The uneven pressure holding of hemispherical products for full bonding can easily cause bonding bubbles.

[0003] To address these issues, we propose a hemispherical cover plate fully laminated module process. Summary of the Invention

[0004] The purpose of this invention is to provide a process for a fully laminated module for hemispherical cover plates, aiming to solve the problems of uneven feeding of hemispherical products during full lamination in current lamination technologies. Traditional feeding methods place the cover plate on top and the FOG (foil-like gel) plate on the bottom. Using this process on hemispherical cover plates can easily cause vacuum breakage at the suction nozzle, misalignment of the pre-pressure during full lamination, uneven pressure holding, and difficulties in removing the OCA film when applying OCA to the cover plate on a hemispherical cover plate (vacuum adsorption on spherical cover plates is prone to vacuum breakage). Positioning of hemispherical products during full lamination is difficult, which can easily cause full lamination misalignment. Uneven pressure holding during full lamination of hemispherical products can easily cause lamination bubbles.

[0005] To achieve the above objectives, the present invention provides the following technical solution:

[0006] A process for fully bonding a hemispherical cover plate module includes the following steps:

[0007] S1. Optimize the cover plate: Add a "+" mark silkscreen line to the basic cover plate;

[0008] S2. Adjust the OCA attachment method: Change the traditional method of attaching the OCA to the cover plate, and change the method of attaching the OCA to the polarizer on the FOG.

[0009] S3, Full-fit feeding: By making a special contour feeding fixture for hemispherical cover plates and a special contour feeding fixture for FOG, the hemispherical cover plate is fed at the bottom and the FOG is fed at the top;

[0010] S4, Pressure Holding Platform: Modify the pressure holding platform of the cavity of the fully bonded equipment. The pressure holding platform is made into a hemispherical contour structure with a hemispherical groove inside.

[0011] Furthermore, in step S3, the FOG and the cover plate are aligned using a CCD, and the inner circle border line and the "+" mark are captured and pre-attached.

[0012] Compared with the prior art, the beneficial effects of the present invention are:

[0013] This invention optimizes the cover plate design by adding a "+" mark silkscreen line to control the full-lamination rotation angle. The OCA attachment method has been adjusted; instead of the traditional method of attaching OCA to the cover plate, it is now attached to the FOG glass. This effectively solves the problem of difficulty in removing the OCA re-film when attaching OCA to a hemispherical cover plate (due to the ease of vacuum breakage during vacuum adsorption on spherical cover plates). The full-lamination feeding scheme has also been adjusted by creating dedicated contour feeding fixtures for hemispherical cover plates and FOG, placing the hemispherical cover plate at the bottom and the FOG at the top. This solves the problems of vacuum breakage at the nozzle, misalignment during full-lamination pre-pressure, and uneven pressure holding force that often occur with traditional feeding methods where the cover plate is on top and the FOG at the bottom. Finally, the cavity pressure holding platform of the full-lamination equipment has been modified. The platform features a hemispherical contour structure with hemispherical grooves inside, ensuring the product is placed flat and the pressure holding force is uniform. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the optimized cover plate structure in this invention;

[0015] Figure 2 This is a schematic diagram of the OCA attachment structure in this invention;

[0016] Figure 3 This is a schematic diagram of the special contour feeding fixture for spherical cover plates in this invention;

[0017] Figure 4 This is a schematic diagram of the FOG-specific contour feeding fixture structure in this invention;

[0018] Figure 5 This is a schematic diagram of the hemispherical contour-following structure in this invention;

[0019] Figure 6 This is a schematic diagram of the OCA flexible patch structure in this invention;

[0020] Figure 7 This is a schematic diagram of the FOG feeding structure in this invention;

[0021] Figure 8 This is a schematic diagram of the cover plate loading structure in this invention;

[0022] Figure 9 This is a schematic diagram of the fully bonded rigid adhesive structure in this invention;

[0023] Figure 10This is a schematic diagram of the fully bonded pressure-holding structure in this invention. Detailed Implementation

[0024] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings and are used only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the invention. In the description of this invention, unless otherwise stated, "a plurality of" means two or more.

[0025] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art will understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0026] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0027] Please see Figure 1-5 A process for a hemispherical cover plate fully laminated module is developed through optimizations such as cover plate design, adjustment of OCA bonding method, full-lamination feeding, and pressure holding platform.

[0028] ② Adjusted OCA attachment method: Conventionally, OCA is attached to a cover plate. Attaching OCA to a hemispherical cover plate makes it difficult to remove the OCA re-film (vacuum adsorption on a spherical cover plate is prone to vacuum breakage). This invention adjusts the OCA attachment method, changing the traditional method of attaching OCA to the cover plate to attaching it directly to the FOG glass (e.g., ...). Figure 2 ).

[0029] ③ Full-Lamination Feeding: In traditional feeding methods, the cover plate is fed on top and the FOG is fed on the bottom. Using this process with a hemispherical cover plate easily leads to vacuum breaking at the suction nozzle, misalignment of the full-lamination pre-pressure, and uneven pressure holding. This invention adjusts the full-lamination feeding method by creating a special contour feeding fixture for the hemispherical cover plate (such as...). Figure 3 ) and FOG-specific contour feeding fixtures (such as Figure 4 The hemispherical cover plate is placed at the bottom and the FOG feeder is placed on top.

[0030] ④ Pressure Holding Platform: For conventional fully bonded products, the cavity platform is universal. However, due to the spherical cover plate, uneven placement of the product within the cavity and uneven stress during pressure holding can easily lead to product damage and pressure bubbles. This invention modifies the cavity pressure holding platform of the fully bonded equipment. Under cavity pressure holding, the platform adopts a hemispherical contour structure, with hemispherical grooves inside the platform (e.g., Figure 5 This ensures that the product is placed flat and that the pressure is evenly distributed.

[0031] Full bonding process:

[0032] ① Apply OCA to the polarizer surface of FOG; ② Remove the protective film from FOG_OCA; ③ Load the hemispherical cover plate; ④ Align FOG and cover plate using CCD, and pre-apply the inner circle frame line and "+" mark; ⑤ Transfer the pre-applied product to the cavity for pressure holding (the hemispherical cover plate is placed in the hemispherical groove of the cavity platform), and after pressure holding is completed, the product is transferred out; ⑥ Personnel receive the material and perform visual inspection.

[0033] Specifically as follows:

[0034] like Figure 6 As shown, the OCA soft patch consists of yellow OCA and gray FOG. First, place the FOG on the fixture, peel off the protective film from the FOG surface, and then start the equipment to apply the OCA onto the FOG.

[0035] like Figure 7 As shown, FOG loading: In the above picture, the yellow OCA is used and the gray FOG is used. Place the FOG with the OCA attached on the fixture, peel off the protective film on the OCA surface, and start the equipment to load the FOG.

[0036] like Figure 8 As shown, the cover plate is loaded: the cyan cover plate in the picture above, place the cover plate on the fixture, peel off the protective film on the surface of the cover plate, and start the equipment to load the cover plate;

[0037] like Figure 9 As shown, the fully laminated hard-mounted design is as follows: The gray FOG and the cyan cover plate are rigidly bonded together, with the FOG on top and the cover plate on the bottom.

[0038] like Figure 10 As shown, full bonding and pressure holding: The gray FOG in the picture above, the cyan cover plate, and the white cavity cover plate contour platform, with the FOG on top and the cover plate on the bottom. The hard bonding equipment conveys the product to the cavity platform, and the equipment starts to draw a vacuum and hold pressure.

[0039] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the invention can be implemented in other specific forms without departing from its spirit or essential characteristics. Therefore, the embodiments should be considered in all respects as exemplary and non-limiting, and the scope of the invention is defined by the appended claims rather than the foregoing description. Thus, all variations falling within the meaning and scope of equivalents of the claims are intended to be included within the present invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

[0040] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A process for fully bonding a hemispherical cover plate module, characterized in that: Includes the following steps: S1. Optimize the cover plate: Add a "+" mark silkscreen line to the basic cover plate; S2. Adjust the OCA attachment method: Change the traditional method of attaching the OCA to the cover plate, and change the method of attaching the OCA to the polarizer on the FOG. S3, Full-fit feeding: By making a special contour feeding fixture for hemispherical cover plates and a special contour feeding fixture for FOG, the hemispherical cover plate is fed at the bottom and the FOG is fed at the top; S4, Pressure Holding Platform: Modify the pressure holding platform of the cavity of the fully bonded equipment. The pressure holding platform is made into a hemispherical contour structure with a hemispherical groove inside.

2. The process for a hemispherical cover plate fully bonding module according to claim 1, characterized in that: In step S3, the FOG and the cover plate are aligned using a CCD, and the inner circle border line and the "+" mark are captured for pre-application.

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