An optical assembly, optical switching network, and related devices

Abstract

Embodiments of the present application provide an optical assembly, an optical switching network and related devices, which can avoid the situation that particles, contaminants and the like fall into the optical assembly in processes such as wafer cutting, sorting and packaging, and effectively improve the yield and reliability of the optical assembly. The optical assembly includes an optical chip, an optical window and N optical devices, N is any integer greater than 1, the N optical devices are located on the surface of the optical chip, the periphery of the optical window is connected to the surface of the optical chip, and a containing space is formed between the surface of the optical chip and the optical window, the N optical devices are located in the containing space, the optical chip includes a plurality of driving structures, each driving structure is connected with one optical device, and the driving structure is used to drive the optical device to work.

Description

Technical Field

[0001] This application relates to the field of laser technology, and more particularly to an optical component, an optical switching network, and related equipment. Background Technology

[0002] Micro-electro-mechanical systems (MEMS) have been widely used in the optical field due to their advantages such as low power consumption, relatively simple structure, small size, and easy integration.

[0003] The surface of a MEMS chip includes multiple mirrors and a driving structure. To improve the reliability of the MEMS chip, a ceramic shell is pre-fabricated. This ceramic shell includes a substrate for packaging the MEMS chip. An optical window for light transmission is opened on the top surface of the ceramic shell, and the mirrors included in the MEMS chip are aligned with the optical window. The substrate has pins that connect the driving structure inside the ceramic shell to a driving circuit outside the ceramic shell. The driving circuit applies a driving voltage to the driving structure through the pins, and the driving structure drives the mirrors to deflect according to the driving voltage.

[0004] However, when MEMS chips are packaged inside ceramic housings, particles and contaminants can fall into the MEMS chips during processes such as wafer dicing, sorting, and packaging before packaging, which can lead to yield loss and reduced reliability of the MEMS chips. Summary of the Invention

[0005] This application provides an optical component, an optical switching network, and related equipment, which can prevent particles and contaminants from falling into the optical component during processes such as wafer dicing, sorting, and packaging, thereby effectively improving yield and reliability of the optical component.

[0006] In a first aspect, this application provides an optical component, including an optical chip, an optical window, and N optical devices, where N is any integer greater than 1. The N optical devices are located on the surface of the optical chip, the periphery of the optical window is connected to the surface of the optical chip, and a receiving space is formed between the surface of the optical chip and the optical window. The N optical devices are located within the receiving space. The optical chip includes multiple driving structures, each of which is connected to one of the optical devices. The driving structure is used to drive the optical device to operate. For example, if the optical device is a mirror, then driving the optical device to operate means driving the mirror to deflect; if the optical device is a laser, then driving the optical device to operate means driving the laser to emit light; if the optical device is a modulator, then driving the optical device to operate means the modulator modulates the optical signal; if the optical device is a detector, then driving the optical device to operate means the detector performs electro-optic conversion.

[0007] As shown in this aspect, an optical window is connected to the surface of the optical chip. N optical devices are located within the space between the optical window and the optical chip, providing physical protection for the N optical devices. For example, this prevents dust, moisture, or other contaminants from directly contacting the optical devices. Furthermore, the optical window isolates the N optical devices from external vibrations or impacts, improving the reliability and lifespan of the optical assembly. Because the periphery of the optical window is connected to the surface of the optical chip, when the optical assembly is not yet diced from the wafer, directly connecting the optical window to the optical chip ensures that the optical devices remain within the space between the optical window and the optical chip during wafer dicing. This effectively prevents particles from falling onto or around the optical devices during wafer dicing, thus avoiding yield loss and reduced reliability. Moreover, during subsequent processes such as wafer sorting, packaging, and testing, the optical devices remain within the space between the optical window and the optical chip, effectively protecting them and improving yield and reliability.

[0008] Based on the first aspect, in one optional implementation, the optical device is a reflector, the plurality of driving structures include multiple pairs of comb tooth structures, each pair of comb tooth structures includes movable comb teeth and fixed comb teeth arranged along a direction perpendicular to the surface of the optical chip, the movable comb teeth are connected to one of the reflectors, and each pair of comb tooth structures is used to drive one of the reflectors to deflect.

[0009] In this implementation, because the optical chip includes multiple pairs of comb-like structures, the N mirrors are separated from these structures along a direction perpendicular to the chip surface. This means the N mirrors are located on top of the comb-like structures, effectively increasing the fill ratio of the N mirrors on the chip surface. This allows for a higher number of mirrors per unit area on the chip surface, enabling the optical component to be compatible with optical switching networks requiring a greater number of ports. Furthermore, the size of individual mirrors can be increased, and the deflection angle of the mirrors is not limited by the position of the comb-like structures, effectively improving the deflection angle. The shape and size of the mirrors are also not limited by the position of the comb-like structures, enhancing the flexibility of mirror shape and size design.

[0010] Based on the first aspect, in one optional implementation, an oxygen-buried layer for electrical isolation is included between the movable comb teeth and the fixed comb teeth.

[0011] By employing this implementation method, since there is an oxide layer between the movable and fixed comb teeth, the voltage applied to the movable comb teeth and the voltage applied to the fixed comb teeth can be controlled independently. That is, the voltage applied to the movable comb teeth will not affect the voltage applied to the fixed comb teeth, and similarly, the voltage applied to the fixed comb teeth will not affect the voltage applied to the movable comb teeth, thereby improving the accuracy and efficiency of biasing the reflector to the target deflection angle.

[0012] Based on the first aspect, in an optional implementation, the optical component further includes a substrate, the surface of the substrate facing the mirror being recessed to form a deflection space, and the orthographic projection of the mirror onto the surface of the optical chip is located within one of the orthographic projections of the deflection space onto the surface of the optical chip.

[0013] In this implementation, the fixed comb teeth and substrate may hinder the movement of the movable comb teeth and the reflector, which may lead to collisions between the movable comb teeth and the reflector, or between the movable comb teeth and the fixed comb teeth, resulting in reduced reliability or the movable comb teeth and the reflector getting stuck, making it impossible to drive the reflector to deflect. However, the existence of the deflection space shown in this aspect provides space for the movable comb teeth and the reflector to move in a direction perpendicular to the surface of the optical chip, preventing collisions or jamming during the deflection of the reflector and improving reliability.

[0014] Based on the first aspect, in one optional implementation, the movable comb teeth include a plurality of first comb teeth arranged sequentially along a path parallel to the surface of the optical chip, and the fixed comb teeth include a plurality of second comb teeth arranged sequentially along a path parallel to the surface of the optical chip, wherein the orthographic projection of the first comb teeth on the surface of the optical chip is located between the orthographic projections of two adjacent second comb teeth on the surface of the optical chip.

[0015] In this implementation, multiple first comb teeth and multiple second comb teeth in the same pair of comb teeth structure are interleaved. When a driving voltage is applied to the pair of comb teeth structure, a potential difference can be formed between the movable comb teeth and the fixed comb teeth. This potential difference can generate an electrostatic force to drive the reflector to deflect.

[0016] Based on the first aspect, in one optional implementation, the N optical devices include at least one of the following:

[0017] Lasers, modulators, detectors.

[0018] Using this implementation, the optical component can include various types of optical devices. N optical devices are located within the space between the optical window and the optical chip, providing physical protection for these N devices and improving the reliability and lifespan of the optical component. When the optical component is not yet diced from the wafer, the optical window is directly connected to the optical chip. During wafer dicing, the optical devices remain within the space between the optical window and the optical chip, effectively preventing particles from falling onto or around the optical devices during dicing, thus avoiding yield loss and reduced reliability. Furthermore, during subsequent processes such as wafer sorting, packaging, and testing, the optical devices remain within the space between the optical window and the optical chip, effectively protecting them and improving yield and reliability.

[0019] Based on the first aspect, in an optional implementation, the optical component further includes a substrate, the optical chip is located on the surface of the substrate, the substrate includes a redistribution layer RDL and a plurality of pads, the RDL includes M metal layers, where M is any integer greater than or equal to 1, the driving structure is connected to one of the pads through the M metal layers, and the plurality of pads are used to apply multiple driving voltages to the plurality of driving structures through the M metal layers, the multiple driving voltages being used to drive the N optical devices to work.

[0020] In this implementation, the metal layers of the RDL in the substrate are connected to the driving module via pads on the substrate surface. This effectively shortens the length of the metal wiring connecting the pads and the driving module, significantly reducing parasitic resistance and inductance, and preventing signal delay and attenuation. The metal layers in the RDL can support higher voltages, improving driving efficiency. The RDL stacks multiple metal layers, enabling ultra-high density interconnects within a limited area.

[0021] Based on the first aspect, in one optional implementation, the optical component further includes a substrate, the surface of which includes the substrate and a driving module, the driving module being connected to the plurality of pads, and the driving module being used to apply the multi-channel driving voltage to the plurality of pads.

[0022] By adopting this implementation method, the driver module is integrated into the optical component, which reduces the number of externally connected devices and lowers the manufacturing complexity.

[0023] Based on the first aspect, in one optional implementation, the optical device is a reflector, and the plurality of driving structures, including a first pair of comb teeth, a second pair of comb teeth, a third pair of comb teeth, and a fourth pair of comb teeth, are connected to the same reflector. The first pair of comb teeth is used to drive the reflector to deflect clockwise around a first direction X, the second pair of comb teeth is used to drive the reflector to deflect counterclockwise around the first direction X, the third pair of comb teeth is used to drive the reflector to deflect clockwise around a second direction Y, and the fourth pair of comb teeth is used to drive the reflector to deflect counterclockwise around the second direction Y. The surface of the optical chip includes intersecting first direction X and second direction Y.

[0024] Using this implementation method, the optical component can drive the reflector to achieve two-dimensional deflection through multiple pairs of comb structures, thereby improving the accuracy of the reflector's deflection direction for optical signal transmission.

[0025] Based on the first aspect, in one optional implementation, the top surface of the light window has a light-transmitting structure, the light-transmitting structure is used to transmit optical signals with the optical device, and the light-transmitting structure is parallel to the surface of the optical chip.

[0026] By adopting this implementation method, the light-transmitting structure on the top surface of the light window can ensure successful optical signal transmission outside the optical device and optical assembly, and ensure that the optical device can work successfully, such as successfully deflecting the direction of optical signal transmission.

[0027] Based on the first aspect, in one optional implementation, the top surface of the light window has a light-transmitting structure, the light-transmitting structure is used to transmit optical signals with the optical device, and the angle between the extension line of the light-transmitting structure and the surface of the optical chip is an acute angle.

[0028] In this implementation, the light-transmitting structure is tilted relative to the direction of the vertical light chip surface, which effectively suppresses the formation of stray light and effectively reduces crosstalk.

[0029] Based on the first aspect, in one optional implementation, the optical device is a reflector, the acute angle is greater than the maximum deflection angle, the maximum deflection angle is the maximum angle of deflection of the reflector, and the maximum deflection angle is the angle between the reflector and the surface of the optical chip.

[0030] In this implementation, to reduce crosstalk, it is necessary to ensure that the incident light incident on the reflector through the optical window is not parallel to the reflected light. When the acute angle between the extension line of the light-transmitting structure and the surface of the optical chip is greater than the maximum deflection angle, the transmission direction of the reflected light reflected by the reflector is forcibly shifted by the light-transmitting structure of the optical window, ensuring that the reflected light is always in a non-parallel state to the incident light, thus reducing crosstalk.

[0031] Based on the first aspect, in one optional implementation, the light window has a partially spherical structure.

[0032] In this implementation, the optical window has a partially spherical structure. For example, the optical window has a 1 / 2 sphere structure, or a 1 / 4 sphere structure, etc. When the optical window has a partially spherical structure, the optical path of the reflected light and the optical path of the incident light can be adjusted to achieve collimation, focusing, and improved effective field of view.

[0033] Based on the first aspect, in one optional implementation, the surface of the optical chip further includes K light absorption modules, the positions of the light absorption modules are separated from the positions of the optical devices, and the light absorption modules are located within the accommodating space, where K is any integer greater than or equal to 1, and the light absorption modules are used to absorb optical signals.

[0034] In this implementation, the main function of the optical absorption module is to enhance the absorption of incident light and suppress the reflection of incident light. Thus, the optical absorption module can effectively suppress stray light generated in the non-mirror area and reduce crosstalk. When the optical component is a MEMS, it can achieve crosstalk suppression during port optical path switching.

[0035] Secondly, this application provides an optical switching network, including a first port, at least one optical component, and a second port. The optical component is as described in any of the first aspects above. The first port is used to transmit incident light to the optical component. The optical component deflects the transmission direction of the incident light to transmit reflected light to the second port. The second port is used to output the reflected light. For an explanation of the beneficial effects, please refer to the first aspect, which will not be repeated here.

[0036] Thirdly, this application provides an optical device, including a processor and an optical component, wherein the optical component is as described in any of the first aspects; the processor is configured to output a first electrical signal, and the optical component is configured to output a first optical signal, wherein the first optical signal is an optical signal obtained by electro-optical conversion of the first electrical signal; or, the optical component receives a second optical signal, and the processor is configured to receive the second electrical signal, wherein the second electrical signal is an electrical signal obtained by photoelectric conversion of the second optical signal.

[0037] Fourthly, this application provides an optical display device, including an optical component and a light source. The optical component is as described in any of the first aspects above. The optical component receives a first optical signal from the light source. The optical component is used to deflect the transmission direction of the first optical signal to obtain a second optical signal. The second optical signal is used for imaging.

[0038] Fifthly, this application provides a lidar, including an optical component, a processor, and a detector. The optical component is as described in any of the first aspects above. The optical component is used to emit detection light, which is transmitted to a target object. The target object is used to reflect echo light back to the detector based on the detection light. The detector is used to convert the echo light into an electrical signal and transmit the electrical signal to the processor. The processor obtains relevant information about the target object based on the electrical signal. Attached Figure Description

[0039] Figure 1 A structural example diagram of the optical switching network provided in this application;

[0040] Figure 2 This is a structural example diagram of a first embodiment of the optical component provided in this application;

[0041] Figure 3 Example diagram showing the setting of optical windows on a wafer;

[0042] Figure 4a This is a structural example diagram of the first embodiment of the light window;

[0043] Figure 4b This is a structural example diagram of a second embodiment of the light window;

[0044] Figure 4c This is a structural example diagram of a third embodiment of the light window;

[0045] Figure 5a This is an example diagram illustrating the overall structure of one embodiment of an optical component;

[0046] Figure 5b for Figure 5a Example side view of the optical component shown;

[0047] Figure 6 for Figure 5a The diagram shows a top view of the optical component.

[0048] Figure 7 A flowchart illustrating one embodiment of the preparation method provided in this application;

[0049] Figure 8 This is a structural example diagram of one embodiment of the optical device provided in this application;

[0050] Figure 9 An example structural diagram of one embodiment of the display device provided in this application;

[0051] Figure 10 A structural example diagram of one embodiment of the lidar provided in this application;

[0052] Figure 11 An example structural diagram of one embodiment of the vehicle provided in this application. Detailed Implementation

[0053] The following specific embodiments illustrate the implementation of this application. Those skilled in the art can easily understand other advantages and effects of this application from the content disclosed in this specification. Although the description of this application will be presented in conjunction with some embodiments, this does not mean that the features of this application are limited to this embodiment. On the contrary, the purpose of describing the application in conjunction with embodiments is to cover other options or modifications that may be derived based on the claims of this application. To provide a thorough understanding of this application, many specific details will be included in the following description. This application may also be implemented without using these details. Furthermore, to avoid confusion or obscuring the focus of this application, some specific details will be omitted in the description. It should be noted that, unless otherwise specified, the embodiments and features in the embodiments of this application can be combined with each other.

[0054] It should be noted that in this specification, similar reference numerals and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0055] In the description of this application, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0056] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or a link; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal communication between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0057] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0058] Figure 1 This is a structural example diagram of an optical switching network provided in this application. Taking an optical cross-connect (OXC) application as an example, the optical switching network 100 includes one or more optical components. This example uses two optical components, namely a first optical component 101 and a second optical component 102. The optical switching network 100 also includes a first port array 111 and a second port array 112. Both the first optical component 101 and the second optical component 102 are MEMS. The first port array 111 includes multiple first ports, and the second port array 112 includes multiple second ports. For example, each first port in the first port array 111 can be an optical fiber, making the first port array 111 an optical fiber array. Similarly, each second port in the second port array 112 can be an optical fiber, making the second port array 112 an optical fiber array. The various optical components included in the optical switching network 100 are used for optical signal crossing between the first port array 111 and the second port array 112. This example does not limit the optical components included in the optical switching network or the number of ports included in each port array. For example, the first port 121 of the first port array 111 receives an optical signal and transmits the optical signal 131 to the first optical component 101 (the first port 121 can be any port included in the first port array 111). The optical signal 131 is transmitted to the first optical component 101, and the first optical component 101 can change the transmission direction of the optical signal 131 to reflect the optical signal 132 to the second optical component 102. The second optical component 102 changes the transmission direction of the optical signal 132 to reflect the optical signal 133 to the second port 122 of the second port array 112 (the second port 122 can be any port included in the second port array 112). It can be understood that... Figure 1The optical switching network shown enables optical signals to be quickly switched from any first port (e.g., the first port 121 shown above) to any second port (e.g., the second port 122 shown above), thereby improving the reliability of optical signal transmission direction crossing. Compared to traditional electrical switching, OXC has advantages such as low latency, low power consumption, and full optical transparency, which can adapt to the needs of rate upgrades, achieve a smooth transition of multiple rate upgrades, and reduce operating costs. MEMS, as optical components, also provide a unique combination of low loss, low crosstalk, and low polarization sensitivity, suitable for large-scale port numbers, and can switch on a millisecond timescale.

[0059] Figure 1 The example shown uses MEMS applications in OXC, but is not limited to specific applications. For instance, when MEMS is used as part of an optical network or an optical node, it can achieve port-level and wavelength-level optical switching. Application scenarios include data centers, automated laboratories and production lines, flexible uplink and downlink wavelength selective switches (ADWSS) in metropolitan area networks, optical switches including MEMS, high-performance computing (HPC), optical circuit switches (OCS), artificial intelligence (AI), and light detection and ranging (LiDAR), etc., without further limitations.

[0060] based on Figure 1 As shown, the following is combined Figure 2 This application describes the structure of the optical component provided in its embodiments. Wherein, Figure 2 This is a structural example diagram of a first embodiment of the optical component provided in this application. This embodiment provides an optical component, which is a MEMS, specifically including an optical chip 200, N optical devices, and an optical window 230, where N is any integer greater than 1. In the case of a MEMS optical component, each optical device is a reflector. The N reflectors are located on the surface of the optical chip 200. This embodiment does not limit the number of reflectors; the N reflectors can be arranged in a regular array or an irregular array. Each reflector is deflected based on electrostatic drive. Figure 2The illustration uses N=2 as an example. Specifically, the N mirrors include mirror 221 and mirror 222. Those skilled in the art can easily extend this to form a mirror array consisting of two or more electrostatically driven mirrors, based on the accompanying drawings. A mirror can also be called a micromirror, galvanometer, MEMS micromirror, MEMS reflector, MEMS galvanometer, etc., without limitation. A mirror is a tiny, drivable reflective element. Its main function is to achieve flexible scheduling of the direction of optical signal transmission by precisely controlling the movement of the mirror surface. This embodiment does not limit the method of forming the mirror on the surface of the optical chip 200. For example, the mirror can be formed on the surface of the optical chip 200 through etching processes (e.g., dry etching or wet etching).

[0061] The periphery of the optical window 230 shown in this embodiment is connected to the surface of the optical chip 200, and a receiving space 231 is formed between the optical window 230 and the optical chip 200. N reflectors are located inside the receiving space 231 between the optical window 230 and the optical chip 200. The optical window 230 shown in this embodiment is used to isolate the N reflectors inside the receiving space 231 to achieve physical protection for the N reflectors. For example, it prevents dust, moisture or other contaminants from directly contacting the mirror surface of the reflectors, avoiding damage to the mirror surface. Moreover, the optical window 230 can isolate the N reflectors from external vibration or impact, improving the reliability and lifespan of the MEMS.

[0062] See also Figure 3 As shown, Figure 3 This is an example diagram of setting an optical window on a wafer. Multiple mirrors are etched onto wafer 300, and then the optical window is attached to the wafer surface. For example, if a MEMS includes four mirrors, then the space formed between the optical window and wafer 300 will contain four mirrors. Figure 3The space between the light window 310 and the wafer 300 includes four mirrors (i.e., mirror 301, mirror 302, mirror 303, and mirror 304). Similarly, the space between the wafer 300 and the light window 320 includes four mirrors, the space between the wafer 300 and the light window 330 includes four mirrors, the space between the wafer 300 and the light window 340 includes four mirrors, the space between the wafer 300 and the light window 350 includes four mirrors, and the space between the wafer 300 and the light window 360 includes four mirrors. To obtain a standalone MEMS comprising mirrors 301, 302, 303, and 304, a wafer 300 is diced along a dicing line 305, thereby cutting the MEMS off the wafer 300. This MEMS includes a portion of the wafer, an optical window 310 connected to the surface of that portion of the wafer, and mirrors 301, 302, 303, and 304 located within a receiving space between the wafer and the optical window 310. Because the mirrors remain within the receiving space between the optical window and the wafer during wafer dicing, it effectively prevents particles from falling onto or around the mirrors during dicing, thus avoiding yield loss and reduced reliability. Furthermore, during subsequent processes such as wafer sorting, packaging, and testing, the mirrors remain within the receiving space between the optical window and the wafer, effectively preventing particles from falling onto or around the mirrors, thus avoiding yield loss and reduced reliability.

[0063] This embodiment does not limit the method by which the optical window 230 is connected to the surface of the optical chip 200. For example, the optical window 230 can be bonded to the surface of the optical chip 200 with adhesive, or the optical window 230 can be soldered to the surface of the optical chip 200 with eutectic solder. The eutectic solder can be gold-tin eutectic solder (AuSn), gold-indium eutectic solder (AuIn), gold-germanium eutectic solder (AuGe), aluminum-germanium eutectic solder (AlGe), gold-silicon eutectic solder (AuSi), gold-silicon-germanium solder (AuSiGe), etc. For example, the optical window 230 can be connected to the surface of the optical chip 200 via transient liquid phase bonding (TLP). The TLP may include copper-tin TLP bonding (CuSn), silver-tin TLP bonding (AgSn), silver-indium TLP bonding (AgIn), gold-tin TLP bonding (AuSn), nickel-tin TLP bonding (NiSn), and gold-indium TLP bonding (AuIn). For example, the optical window 230 can be connected to the surface of the optical chip 200 via thermocompression bonding, which may include gold-gold thermocompression bonding (Au-Au), copper-copper thermocompression bonding (Cu-Cu), etc. Alternatively, the optical window 230 can be connected to the surface of the optical chip 200 via soft solder, which may include tin-silver on copper (SnAg), tin-lead on copper (SnPb), or tin-bismuth on copper (SnBi).For example, the optical window 230 can be connected to the surface of the optical chip 200 via ultra-thin metal bonding, such as silicon dioxide / titanium / silicon bonding (SiO2 / Ti / Si). Alternatively, the optical window 230 can be connected to the surface of the optical chip 200 via reactive bonding, which can include nickel / aluminum reactive multilayer system (Ni / Al RMS), tin / gold reactive multilayer system (Sn / Au RMS), and aluminum / palladium reactive multilayer system (Al / Pd RMS), etc.

[0064] This embodiment does not limit the material of the optical window 230, as long as the optical window 230 has high transmittance to reduce the loss during the deflection of the optical signal transmission direction by the MEMS, and the optical window 230 has mechanical strength and environmental resistance, thereby improving the isolation and impact resistance of the N reflectors and enhancing reliability. Optionally, the coefficient of thermal expansion of the optical window 230 matches that of the optical chip 200 to avoid thermal stress causing cracking or detachment of the optical window 230 and the optical chip 200. For example, the optical window 230 shown in this embodiment can be made of borosilicate glass, quartz, sapphire, silicon, a combination of glass and silicon, or a combination of glass and metal.

[0065] See also Figure 2As shown, the optical chip includes multiple driving structures for driving the deflection of each reflector. Specifically, each driving structure is a pair of comb teeth. Specifically, to achieve the deflection of the reflector 221, the multiple driving structures include a first pair of comb teeth 211, a second pair of comb teeth 212, a third pair of comb teeth 213, and a fourth pair of comb teeth 214. Taking the first pair of comb teeth 211 as an example, the first pair of comb teeth 211 includes movable comb teeth 231 and fixed comb teeth 232 arranged along a direction perpendicular to the surface of the optical chip. The movable comb teeth 231 are connected to the reflector 221 through a first movable structure. The movable comb teeth 231 include multiple first comb teeth arranged sequentially parallel to the surface of the optical chip, with a gap between any two adjacent first comb teeth along a direction parallel to the surface of the optical chip. The fixed comb teeth 232 include multiple second comb teeth arranged sequentially parallel to the surface of the optical chip, with a gap between any two adjacent second comb teeth along a direction parallel to the surface of the optical chip. In this embodiment, the multiple first comb teeth and multiple second comb teeth are arranged in an alternating pattern. Specifically, this alternating arrangement means that one of the first comb teeth and one of the second comb teeth corresponds to a direction perpendicular to the surface of the optical chip. Furthermore, the orthographic projection of a first comb tooth onto the surface of the optical chip is located between the orthographic projections of two adjacent second comb teeth onto the surface of the optical chip. For a description of the structures of the second pair of comb teeth 212, the third pair of comb teeth 213, and the fourth pair of comb teeth 214, please refer to the description of the structure of the first pair of comb teeth 211; details will not be repeated here. The second pair of comb teeth 212, the third pair of comb teeth 213, and the fourth pair of comb teeth 214 are connected to the reflector 221 via a second movable structure, a third movable structure, and a fourth movable structure, respectively. For a detailed explanation, please refer to the description of the connection between the first pair of comb teeth 211 and the reflector 221 via a first movable structure; details will not be repeated here.

[0066] The first pair of comb teeth 211 drives the reflector 221 to deflect clockwise around the first direction X via a first movable structure (hereinafter referred to as +X). The second pair of comb teeth 212 drives the reflector 221 to deflect counterclockwise around the first direction X via a second movable structure (hereinafter referred to as -X). The third pair of comb teeth 213 drives the reflector 221 to deflect clockwise around the second direction Y via a third movable structure (hereinafter referred to as +Y). The fourth pair of comb teeth 214 drives the reflector 221 to deflect counterclockwise around the second direction Y via a fourth movable structure (hereinafter referred to as -Y). The surface of the optical chip 200 includes the intersecting first direction X and second direction Y. In this embodiment, the first direction X is perpendicular to the second direction Y. Taking the first pair of comb teeth 211 as an example, the process of the first pair of comb teeth 211 driving the reflector 221 to deflect in the +X direction via electrostatic comb teeth is described as follows:

[0067] In this embodiment, the movable comb teeth 231 of the first pair of comb tooth structures 211 are connected to the reflector 221 via a first movable structure, such as a torsion beam. The movable comb teeth 231 and the fixed comb teeth 232 of the first pair of comb tooth structures 211 are staggered and have gaps, thus forming a variable capacitance between the movable comb teeth 231 and the fixed comb teeth 232. The optical chip applies a first driving voltage between the movable comb teeth 231 and the fixed comb teeth 232. Under the action of the first driving voltage, an electric field is formed between the movable comb teeth 231 and the fixed comb teeth 232, generating an electrostatic attraction. This electrostatic attraction generates a net torque along the +X direction, which drives the torsion beam to rotate, thereby driving the reflector 221 connected to the torsion beam to deflect along the +X direction. This embodiment demonstrates that driving the reflector 221 to deflect via electrostatic comb teeth reduces driving power consumption and improves driving efficiency. For an explanation of how the second pair of comb tooth structures 212 drives the reflector 221 to deflect in the -X direction, how the third pair of comb tooth structures 213 drives the reflector 221 to deflect in the +Y direction, and how the fourth pair of comb tooth structures 214 drives the reflector 221 to deflect in the -Y direction, please refer to the explanation of how the first pair of comb tooth structures 211 drives the reflector 221 to deflect in the +X direction. Specific details will not be repeated here.

[0068] The MEMS described in this embodiment, because the optical chip includes multiple pairs of comb structures, allows N mirrors to be separated from these comb structures along a direction perpendicular to the optical chip surface. This means the N mirrors are located on top of the comb structures, effectively increasing the fill ratio of the N mirrors on the optical chip surface. This allows for a higher number of mirrors per unit area on the optical chip surface, enabling the MEMS provided in this embodiment to be compatible with optical switching networks requiring a greater number of ports. The MEMS provided in this embodiment can increase the size of a single mirror, and the deflection angle of the mirror is not limited by the position of the comb structures, effectively improving the deflection angle. This embodiment does not limit the shape of the mirrors; the shape and size of the mirrors are not restricted by the position of the comb structures, increasing the flexibility of mirror shape and size design.

[0069] Because N mirrors are located on multiple pairs of comb teeth, the integration density of the MEMS is effectively improved. The number of first and second comb teeth is not limited by the position of the mirrors, thus increasing the number of parallel first and second comb teeth, significantly increasing the torque and improving the efficiency of driving the mirror deflection. Moreover, with N mirrors located on multiple pairs of comb teeth, the length of the torsion beam can be effectively reduced, and the cross-sectional area of ​​the torsion beam parallel to the surface of the optical chip can be increased, effectively improving the stiffness of the torsion beam, suppressing undesirable vibrations, and improving the accuracy of mirror deflection control. In this embodiment, the center of mass of the movable part of the MEMS (i.e., the mirrors and the first comb teeth) is aligned with the axis of rotation of the torsion beam to achieve center of mass balance, effectively avoiding deflection errors introduced by inertial forces, improving the accuracy of mirror deflection control, and reducing stress concentration in the torsion beam caused by centrifugal force, thus improving the reliability of the torsion beam.

[0070] In this embodiment, each pair of comb teeth includes an embedded oxide layer for electrical isolation between the movable comb teeth and the fixed comb teeth. For example, an embedded oxide layer 215 for electrical isolation is included between the movable comb teeth 231 and the fixed comb teeth 232. The embedded oxide layer 215 achieves electrical isolation between the movable comb teeth 231 and the fixed comb teeth 232 to avoid crosstalk of the driving voltage. It can be understood that because the embedded oxide layer 215 is included between the movable comb teeth 213 and the fixed comb teeth 214, the voltage applied to the movable comb teeth 213 and the voltage applied to the fixed comb teeth 214 can be controlled independently. That is, the voltage applied to the movable comb teeth 213 will not affect the voltage applied to the fixed comb teeth 214, and similarly, the voltage applied to the fixed comb teeth 214 will not affect the voltage applied to the movable comb teeth 213. If it is necessary to deflect the reflector to the target deflection angle, the voltage applied to the movable comb tooth 213 and the voltage applied to the fixed comb tooth 214 can be calibrated independently, which reduces the difficulty of voltage calibration and improves the accuracy and efficiency of deflecting the reflector to the target deflection angle.

[0071] Continue to combine Figure 2As shown, along a direction perpendicular to the surface of the optical chip, the MEMS includes multiple pairs of comb-like structures and a substrate 201 arranged sequentially. The surface of the substrate 201 facing the reflector is recessed to form deflection spaces. Specifically, the surfaces of the substrate 201 facing N reflectors are recessed to form N deflection spaces. It can be understood that each of the N deflection spaces is positioned opposite a reflector along a direction perpendicular to the surface of the optical chip. For example, the substrate 201 includes deflection spaces 202 and 203. Deflection space 202 is formed by the recess of the substrate 201 facing the reflector 221. Therefore, the orthographic projection of the reflector 221 onto the surface of the optical chip lies within the orthographic projection of the deflection space 202 onto the surface of the optical chip. Deflection space 203 is formed by the recess of the substrate 201 facing the reflector 222. Therefore, the orthographic projection of the reflector 222 onto the surface of the optical chip lies within the orthographic projection of the deflection space 203 onto the surface of the optical chip. Taking the deflection space 202 as an example, the function of each deflection space is explained. When the movable comb 231 and the reflector 221 rotate around the torsion beam under electrostatic drive, the fixed comb 232 and the substrate 201 may hinder the movement of the movable comb 231 and the reflector 221. This may cause the movable comb 231 and the reflector 221 to collide with each other, or the movable comb 231 and the fixed comb 232 to collide with each other, which will reduce the reliability of MEMS, or the movable comb 231 and the reflector 221 may get stuck and be unable to drive the reflector 221 to deflect. The existence of the deflection space 202 shown in this embodiment provides space for the movable comb 231 and the reflector 221 to move in the direction perpendicular to the surface of the optical chip. During the deflection of the reflector 221, sufficient space is provided for the deflection of the reflector 221 to prevent collision or jamming, thereby improving the reliability of MEMS. For example, if the MEMS is subjected to external forces causing the reflector to vibrate at high frequency or vibrate at an excessive angle, or if the driving voltage applied to each pair of comb teeth is too large, causing the reflector to deflect out of control and resulting in an excessively large deflection angle, the torsion beam may break or the reflector may be damaged. This can lead to the reflector failing and being unable to deflect the direction of optical signal transmission. In this embodiment, the depth of the deflection space 202 is limited along a direction perpendicular to the surface of the optical chip. This is so that when the MEMS is subjected to external forces or the driving voltage applied to each pair of comb teeth is too large, the depth of the deflection space 202 can limit the deflection angle of the reflector, preventing the reflector from failing due to an excessively large deflection angle.Optionally, the deflection space 202 may include a stop structure. For example, the stop structure may be a slope structure, a protrusion structure, or a stop block structure included in the deflection space 202. The stop structure may be made of a hard material or an elastic material, without limitation, as long as the stop structure in the deflection space 202 can limit the deflection angle of the reflector when the MEMS is subjected to external force or when the driving voltage applied to each pair of comb teeth is too large.

[0072] like Figure 2As shown, the surface of the optical chip also includes K light-absorbing modules, where K is any integer greater than or equal to 1. Each light-absorbing module is separated from each reflector on the optical chip surface, and each light-absorbing module is located within the receiving space 231 formed between the optical chip surface and the light window 230. For example, the optical chip surface includes light-absorbing modules 223 and 224, with a reflector 221 located between them. The optical chip surface also includes light-absorbing modules 225 and 226, with a reflector 222 located between them. It can be understood that the light-absorbing modules on the optical chip surface are non-mirror areas without reflectors. Ideally, non-mirror areas do not participate in the deflection of the optical signal transmission direction. However, when the incident light spot passing through the optical window 230 passes through the non-mirror area, the non-mirror area reflects the incident light to form stray light, causing crosstalk. In this embodiment, a light absorption module is set in the non-mirror area. The main function of the light absorption module is to enhance the absorption of the incident light and suppress the reflection of the incident light. Therefore, the light absorption module can effectively suppress the stray light generated by the non-mirror area and reduce the crosstalk of the MEMS. This embodiment does not limit the specific structure of the light absorption module, as long as the light absorption module can enhance the absorption of incident light and reduce the reflection of incident light. For example, taking light absorption module 224 as an example, light absorption module 224 includes multiple layers of anti-reflection coating (ARC) stacked along a direction perpendicular to the surface of the optical chip. The multiple ARCs utilize the interference effect (constructive / destructive interference) of light at the thin film interface to absorb reflected light. Optionally, the refractive indices of different layers of ARC in the multiple ARCs are different. For example, the multiple ARCs are made of silicon dioxide (SiO2) and silicon nitride (Si3N4) materials respectively. Light absorption module 224 can also adopt a structure in which ARCs and metals are stacked alternately along a direction perpendicular to the surface of the optical chip. For example, light absorption module 224 can stack chromium (Cr) and SiO2 in sequence. As another example, light absorption module 224 can stack titanium (Ti) and SiO2 in sequence. For example, the light absorption module 224 may consist of stacked tungsten (W) and SiO2. Furthermore, the characteristic dimensions (such as height and spacing) of the micro / nanostructures on the surface of the light absorption module 224 may be smaller than the wavelength of the incident light, thereby suppressing the reflection of the incident light. For instance, the micro / nanostructures on the surface of the light absorption module 224 can be achieved through periodic structures, such as gratings or nanopillar arrays. Alternatively, the micro / nanostructures on the surface of the light absorption module 224 can be achieved through non-periodic structures, such as conical or pyramidal arrays.

[0073] The structure of the light window 230 shown in this embodiment can be found in [reference]. Figure 4a As shown, where, Figure 4a This is a structural example diagram of the first embodiment of the optical window. The accommodating space between the optical chip 400 and the optical window 401 includes N reflectors. For details, please refer to the above diagram, which will not be repeated here. In this embodiment, to ensure that the optical window 401 can achieve the function of isolating and protecting the N reflectors, the orthographic projection of the N reflectors on the surface of the optical chip 400 is located within the orthographic projection of the light-transmitting structure 402 of the optical window 401 on the surface of the optical chip 400. It can be understood that, along the direction perpendicular to the surface of the optical chip 400, each reflector is located between the light-transmitting structure 402 and the optical chip 400. Incident light from outside the MEMS passes through the light-transmitting structure 402 to be transmitted to one of the N reflectors. The reflector deflects the transmission direction of the incident light to emit reflected light. The reflected light emitted from the reflector passes through the light-transmitting structure 402 to exit from the MEMS. In this example, the light-transmitting structure 402 is parallel to the surface of the optical chip 400. It can be understood that the light-transmitting structure 402, N reflectors, and the light chip 400 are arranged in sequence along a direction perpendicular to the surface of the light chip 400.

[0074] The structure of the light-transmitting structure 402 can also be found in [reference 1]. Figure 2 As shown, Figure 2 In the example shown, the angle between the extension line of the light-transmitting structure 402 and the surface of the optical chip 200 is an acute angle. This means that the light-transmitting structure 402 is tilted relative to the direction perpendicular to the surface of the optical chip 200. When the light-transmitting structure 402 is tilted relative to the direction perpendicular to the surface of the optical chip 200, crosstalk between different optical signals is effectively reduced. For example, aliasing between optical signals incident from different positions on the light-transmitting structure 402 is avoided, thereby reducing crosstalk between optical signals. Furthermore, when the light-transmitting structure of the light window is parallel to the surface of the optical chip, optical signals (incident or exiting from the reflector) may undergo multiple reflections between the two surfaces (inner and outer surfaces) of the light-transmitting structure, forming stray light and causing crosstalk problems. The tilted light-transmitting structure 402 in this example can reduce unnecessary reflections of optical signals, effectively suppressing the formation of stray light and reducing crosstalk.

[0075] To reduce crosstalk in MEMS, it is necessary to ensure that the incident light entering the reflector through the optical window is not parallel to the reflected light. When the reflected light is parallel to the incident light, it is difficult to eliminate the crosstalk through spatial filtering or optical isolation. Therefore, in this embodiment, the acute angle α between the extension line of the light-transmitting structure 402 and the surface of the optical chip 200 is greater than the maximum deflection angle θ_max. The driving voltage provided by the optical chip drives the reflector to deflect relative to the surface of the optical chip. The maximum deflection angle is the maximum angle of deflection under the driving voltage of the optical chip, where the maximum deflection angle is the angle between the reflector and the surface of the optical chip. It can be understood that when α > θ_max, the transmission direction of the reflected light is forcibly offset by the light-transmitting structure 402 of the optical window, ensuring that the reflected light is always non-parallel to the incident light, thus reducing crosstalk.

[0076] Figure 4b This is a structural example diagram of a second embodiment of the optical window. The space between the optical chip 400 and the optical window 401 includes N reflectors. For details, please refer to the above description, which will not be repeated here. In this embodiment, the optical window 401 has a partially spherical structure. For example, the optical window 401 has a 1 / 2 sphere structure, or a 1 / 4 sphere structure, etc. In the case of the partially spherical structure of the optical window 401 shown in this embodiment, the optical path of the reflected light and the optical path of the incident light can be adjusted. For example, the optical window 401 can collimate the reflected light to output collimated reflected light, thereby reducing the transmission loss of the reflected light. For example, the optical window 401 can focus the incident light onto the reflector, improving the accuracy of the transmission direction of the incident light and reducing the optical power loss during the adjustment process. This embodiment does not limit the specific optical path adjustment function of the optical window 401. For example, the optical window 401 can also focus the reflected light, etc. For example, the optical window 401 can effectively increase the effective field of view (FOV) of the reflected light, thus enabling the mirror to effectively receive and reflect light signals even when deflected to its maximum deflection angle (θ_max). This prevents the incident light and the edge rays of the reflected light from being blocked by the optical window, reducing the loss of optical power during the deflection of the incident light's transmission direction to the reflected light's transmission direction. Moreover, the partially spherical structure of the optical window 401 can effectively suppress the parallelism between the reflected light and the incident light, effectively reducing crosstalk. Figure 4b The example shown uses a light window with a uniform thickness along a direction perpendicular to the surface of the optical chip. See also... Figure 4c As shown, where, Figure 4cThis is a structural example diagram of a third embodiment of the optical window. The space between the optical chip 400 and the optical window 401 includes N reflectors. For details, please refer to the above description, which will not be repeated here. In this embodiment, the optical window includes a periphery 411 and a central region 412 located within the periphery 411. The periphery 411 is connected to the surface of the optical chip, and along a direction perpendicular to the surface of the optical chip, the thickness of the periphery 411 is greater than the thickness of the central region 412. Using the structure of the optical window shown in this example, the optical window can function as a convex lens, allowing incident light to be uniformly incident on the reflectors. It should be noted that this embodiment does not limit the variation in the thickness of the optical window along the direction perpendicular to the surface of the optical chip. For example, along a direction perpendicular to the surface of the optical chip, the thickness of the periphery 411 is less than the thickness of the central region 412, so that the optical window can function as a concave lens, allowing the optical window to focus the reflected light and output the focused reflected light.

[0077] The optical chip surface shown in this embodiment also includes a top electrode, which is connected to the movable comb teeth included in the MEMS. For example... Figure 2As shown, the surface of the optical chip includes a top electrode 241, which is connected to movable comb teeth. The top electrode 241 can be connected to the movable comb teeth via metal wires on the surface of the optical chip. In this embodiment, the top electrode 241 is a ground electrode; therefore, its potential is typically 0V or a reference ground, forming a potential difference with the driving voltage applied to the fixed comb teeth. This potential difference can generate an electrostatic force to drive the deflection of the reflector. This embodiment illustrates that one top electrode can be connected to multiple movable comb teeth. This embodiment does not limit the number of top electrodes included in the MEMS or the number of movable comb teeth connected to each top electrode. This embodiment uses the top electrode located on the surface of the optical chip as an example; in other examples, the top electrode can be located at any position within the MEMS, and no specific limitation is made. As shown above, for the reflector 221 in the MEMS to achieve deflection along the +X, -X, +Y, and -Y directions, a first driving voltage needs to be applied to the first pair of comb teeth, a second driving voltage to the second pair of comb teeth, a third driving voltage to the third pair of comb teeth, and a fourth driving voltage to the fourth pair of comb teeth. The movable comb teeth of the first, second, third, and fourth pairs of comb teeth are all connected to the top surface electrode to be grounded. Therefore, the voltage applied to the fixed comb teeth of the first pair of comb teeth is the first driving voltage, the voltage applied to the fixed comb teeth of the second pair of comb teeth is the second driving voltage, the voltage applied to the fixed comb teeth of the third pair of comb teeth is the third driving voltage, and the voltage applied to the fixed comb teeth of the fourth pair of comb teeth is the fourth driving voltage. Taking mirror 221 as an example, to achieve two-dimensional (along the X and Y directions) deflection, mirror 221 requires four independent driving voltages for the fixed comb teeth corresponding to mirror 221. As the number of ports supported by the optical cross-connect network increases, the number of mirrors included in the MEMS will also increase. For example, if the MEMS includes 512 mirrors, it needs to support 2048 independent circuit paths to provide 2048 independent driving voltages to the fixed comb teeth corresponding to the 512 mirrors. To ensure that the substrate provided in this embodiment can support a high number of circuit paths, the substrate 201 of the MEMS shown in this embodiment also includes a redistribution layer (RDL) 250, which can be formed in the substrate 201 using complementary metal oxide semiconductor (CMOS) technology or photolithography.This embodiment does not limit the method of connecting the optical chip to the RDL250. For example, the optical chip can be connected to the RDL through eutectic solder, transient liquid phase bonding, thermo-press bonding, soft solder, ultra-thin metal solder, or reactive bonding. For the description of eutectic solder, transient liquid phase bonding, thermo-press bonding, soft solder, ultra-thin metal solder, and reactive bonding, please refer to the description of the connection of the optical window 230 to the surface of the optical chip 200 above, which will not be repeated here.

[0078] The RDL specifically includes M metal layers stacked along a direction perpendicular to the surface of the optical chip, where M is any integer greater than or equal to 1. This embodiment uses an example where M is greater than 1 for illustrative purposes. The RDL shown in this embodiment includes M metal layers stacked along a direction perpendicular to the surface of the optical chip. Different metal layers can be insulated from each other by dielectric layers to effectively avoid crosstalk. To achieve two-dimensional deflection of the reflector 211, the fixed teeth of the first pair of comb structures 211 are connected to the first circuit trace of the RDL so that the fixed teeth of the first pair of comb structures 211 receive the first driving voltage through the first circuit trace. Similarly, the fixed teeth of the second pair of comb structures 212 are connected to the second circuit trace of the RDL so that the fixed teeth of the second pair of comb structures 212 receive the second driving voltage through the second circuit trace. Specifically, in conjunction with... Figure 5a , Figure 5b as well as Figure 6 As shown, where, Figure 5a This is an example diagram illustrating the overall structure of one embodiment of an optical component. Figure 5b for Figure 5a The diagram shows an example of the side view structure of the optical component. Figure 6 for Figure 5a The diagram shows a top view of the optical component. The optical component includes a substrate 500, on which substrate 500 includes a substrate 521 and a substrate 522. The surface of substrate 521 includes an optical chip 501, and the surface of substrate 522 includes an optical chip 502. The space formed between optical chip 501 and optical window 503 includes N reflectors, and the space formed between optical chip 502 and optical window 504 also includes N reflectors. For detailed explanation, please refer to the above description of the optical component structure; further details are omitted here. This embodiment does not limit the number of substrates or optical chips on substrate 500. In this embodiment, the surface of substrate 500 also includes one or more driving modules; the number of driving modules is not limited in this embodiment. Figure 6 The light window on the surface of the optical component shown is omitted. For an explanation of the light window, please refer to the above description; details will not be repeated here. Taking substrate 521 as an example, the edge of the surface of substrate 521 includes multiple pads. For example, the edge of the surface of substrate 521 includes a first pad 531, a second pad 532, a third pad 533, a fourth pad 534, and so on.

[0079] Taking the driving module 511 on the surface of substrate 500 as an example, the driving module 511 is connected to the first pad 531, the second pad 532, the third pad 533, and the fourth pad 534. The driving module 511 can then apply a first driving voltage, a second driving voltage, a third driving voltage, and a fourth driving voltage to the first pad 531, the second pad 532, the third pad 533, and the fourth pad 534, respectively. The structure of the fixed comb teeth of the first pair of comb teeth structure 211 connected to the first pad 531 via the first circuit trace of the RDL is illustrated. Specifically, taking an RDL comprising three metal layers as an example, i.e., an RDL comprising a top metal layer M3, a middle metal layer M2, and a bottom metal layer M1, wherein the top metal layer M3, the middle metal layer M2, and the bottom metal layer M1 are arranged sequentially between the N mirrors and the substrate. It should be noted that this embodiment uses an RDL comprising three metal layers as an example and is not limited to this. The first circuit trace connected to the fixed comb teeth of the first pair of comb tooth structures 211 is first connected to the top metal layer M3 to reduce parasitic resistance and capacitance. To allow the first circuit trace to fan out to the first pad 531 located at the substrate edge, the first circuit trace can be connected to the intermediate metal layer M2 via a via, and horizontal wiring is implemented in the intermediate metal layer M2 to accommodate high-density wiring. The first circuit trace extends to the substrate edge and can return to the top metal layer M3 via a via. An opening is etched in the top metal layer M3 to expose the first pad 531 connected to the first circuit trace. Since the first pad 531 is connected to the fixed comb teeth of the first pair of comb tooth structures 211 via the first circuit trace, the driving module 511 applies a first driving voltage to the first circuit trace through the first pad 531. This first driving voltage is applied to the fixed comb teeth of the first pair of comb tooth structures 211 via the first circuit trace to drive the reflector to deflect along the +X direction.

[0080] For example, consider a structure where the fixed teeth of the second pair of comb teeth 212 are connected to the second pad 532 via the second circuit traces of the RDL. Continuing with the example of the RDL comprising three metal layers, the second circuit traces connected to the fixed teeth of the second pair of comb teeth 212 are first connected to the top metal layer M3 to reduce parasitic resistance and capacitance. To enable the second circuit traces to fan out to the second pad 532 located at the substrate edge, the second circuit traces can be connected to the intermediate metal layer M2 via a Via connection, and horizontal wiring is implemented in the intermediate metal layer M2 to accommodate high-density wiring. Then, they can be connected to the bottom metal layer M1 via a Via connection, and horizontal wiring is implemented in the bottom metal layer M1. The second circuit traces extend to the substrate edge and can return to the intermediate metal layer M2 via a Via connection, and then return to the top metal layer M3 via a Via connection. An opening is etched in the top metal layer M3 to expose the second pad 532 connected to the second circuit traces. Since the second pad 532 is connected to the fixed teeth of the second pair of comb structures 212 through the second circuit trace, the drive module 511 applies a second drive voltage to the second circuit trace through the second pad 532. The second drive voltage is applied to the fixed teeth of the second pair of comb structures 212 through the second circuit trace to drive the reflector to deflect along the -X direction.

[0081] To avoid short circuits or crosstalk, the first and second circuit traces described above are insulated from each other. Therefore, the first and second circuit traces are insulated from each other at their locations on different metal layers of the RDL. For example, the portion of the first circuit trace extending horizontally in the intermediate metal layer M2 is insulated from the portion of the second circuit trace extending horizontally in the bottom metal layer M1. When the first and second circuit traces are located on the same metal layer of the RDL, insulation treatment is required. For example, a certain distance can be maintained between the portion of the first circuit trace in the intermediate metal layer M2 and the portion of the second circuit trace in the intermediate metal layer M2, and this distance can be filled with dielectric material to ensure electrical isolation. Alternatively, insulating grooves (filled with oxide) can be etched between the portion of the first circuit trace in the intermediate metal layer M2 and the portion of the second circuit trace in the intermediate metal layer M2.

[0082] The third pad 533 is connected to the fixed teeth of the third pair of comb teeth structure 213 through the third circuit trace. Then, the drive module 511 applies a third drive voltage to the third circuit trace through the third pad 533. The third drive voltage is applied to the fixed teeth of the third pair of comb teeth structure 213 through the third circuit trace to drive the reflector to deflect in the +Y direction. The fourth pad 534 is connected to the fixed teeth of the fourth pair of comb teeth structure 214 through the fourth circuit trace. Then, the drive module 511 applies a fourth drive voltage to the fourth circuit trace through the fourth pad 534. The fourth drive voltage is applied to the fixed teeth of the fourth pair of comb teeth structure 214 through the fourth circuit trace to drive the reflector to deflect in the -Y direction. For an explanation of the third and fourth circuit traces, please refer to the explanation of the first and second circuit traces. Specific details will not be repeated here.

[0083] This embodiment does not limit the type of each driving module. For example, the driving module can be a high-voltage digital to analog converter (HVDAC). The substrate 500 can be connected to an external circuit board or connected to an external circuit board through connector 512, and there is no specific limitation. It can be understood that integrating the driving module within the MEMS reduces the number of externally connected devices and reduces manufacturing complexity.

[0084] For example, in this embodiment, the pads on the substrate can be connected to the driving module via wire bonding. This disperses stress across the RDL layers in the substrate and the wires used for wire bonding, preventing stress concentration, improving the reliability of the MEMS, and avoiding mismatch. Furthermore, the metal layers in the RDL fan out to the pads on the substrate surface to connect to the driving module effectively shorten the length of the metal wiring connecting the pads and the driving module, effectively reducing parasitic resistance and inductance, and avoiding signal delay and attenuation. The metal layers in the RDL can support higher voltages, improving driving efficiency. The RDL stacks multiple metal layers, enabling ultra-high density interconnection within a limited area. It is understood that as the number of mirrors included in a MEMS increases, the driving module needs to independently apply multiple driving voltages to each mirror to drive its deflection. The MEMS shown in this embodiment, through the RDL structure, can achieve high-density interconnection between the driving module and the fixed comb teeth, matching the development requirements of MEMS for a high number of mirrors. This saves on the size of optical components while supporting a large number of circuit paths. This embodiment takes the pad connected to each metal layer as being located at the edge of the substrate surface as an example. It is not limited, as long as the position of the pad can shorten the path length of the electrical connection between the pad and the drive module.

[0085] Optionally, the driving module shown in this embodiment can also perform differential driving on each pair of comb tooth structures. Taking the first pair of comb tooth structures as an example, the driving module applies a first voltage to the movable comb tooth of the first pair of comb tooth structures and applies a second voltage to the fixed comb tooth of the first pair of comb tooth structures. The first voltage and the second voltage drive the reflector based on differential driving. In this way, the differential voltage can greatly improve the electrostatic driving force and enhance noise suppression.

[0086] The MEMS shown in this embodiment can achieve known-good-die (KGD) testing before packaging. Specifically, the various pads shown above are fabricated directly on the wafer (i.e., the substrate shown above). Before the MEMS is cut from the wafer, test voltages can be applied to each pad to test whether it is a defective die that needs to be discarded, thus reducing packaging costs and complexity.

[0087] This application also provides a method for fabricating a MEMS, see details below. Figure 7 As shown, where, Figure 7 This is a flowchart illustrating one embodiment of the preparation method provided in this application.

[0088] First, a first silicon wafer 700 is provided, and the first silicon wafer 700 is subjected to two deep reactive etching (DRIE) processes to obtain a first wafer 701. Specifically, the first DRIE etches a preliminary structure of the mirror (such as a square or circular outline) on the top silicon layer of the first silicon wafer 700 to form a mirror layer. The second DRIE etches a silicon substrate on the back side of the first silicon wafer 700 to form a cavity, allowing the mirror layer to be freely deflected. As an example, the first silicon wafer 700 can be a first single-device-layer silicon-on-insulator (SOI) wafer.

[0089] Movable comb teeth 711 are etched onto the surface of the second SOI silicon wafer 710. For a description of the structure of the movable comb teeth 711, please refer to the above embodiment; specific details will not be repeated here. Based on silicon dioxide fusion bonding (SiO2-SiO2 fusion bonding), the second SOI 710 and the third SOI 712 are bonded to obtain the second wafer 720.

[0090] Then, the second wafer 720 is etched to obtain fixed comb teeth 721, and the first wafer 701 and the second wafer 720 are bonded together by silicon-silicon fusion bonding to form the third wafer 730. The third wafer 730 is bonded to the substrate 731 by eutectic bonding to form the fourth wafer 740.

[0091] Then, a light absorption module, a reflector, and electrodes are formed on the surface of the fourth wafer 740 to form the fifth wafer 750. For a description of the light absorption module, the reflector, and the electrodes, please refer to the above embodiment, which will not be repeated here.

[0092] Finally, an optical window 761 is connected to the surface of the fifth wafer 750 to obtain the MEMS 760. For a description of the MEMS structure and the optical window 761, please refer to the above embodiment, which will not be repeated here.

[0093] It is understandable that during the wafer dicing process, the reflector is always located in the space between the optical window and the wafer, which effectively prevents particles from falling onto or around the reflector during wafer dicing, thus avoiding yield loss and reduced reliability. Furthermore, during subsequent processes such as wafer sorting, packaging, and testing, the reflector remains in the space between the optical window and the wafer, effectively preventing particles from falling onto or around the reflector, thus avoiding yield loss and reduced reliability.

[0094] The above embodiment uses MEMS as an example of an optical component. This embodiment does not limit the type of optical component. Specifically, the optical component includes an optical chip, an optical window, and N optical devices. The N optical devices are located on the surface of the optical chip. The periphery of the optical window is connected to the surface of the optical chip, and a receiving space is formed between the surface of the optical chip and the optical window. The N optical devices are located within the receiving space. The optical chip includes multiple driving structures, each of which is connected to one of the optical devices. The driving structure is used to drive the optical device to work. For a description of the positions of the optical chip, optical window, and optical devices, as well as a detailed description of the optical chip and optical window, please refer to the above description. Specific details will not be repeated here. For example, the optical device can be a laser. In this case, the receiving space accommodates N lasers, and the driving structure within the optical chip is a circuit for providing driving voltage to the lasers. The lasers emit light under the action of the driving voltage. Alternatively, the optical device can accommodate N modulators within the receiving space. The driving structure within the optical chip is a circuit for providing driving voltage to the modulators. The modulators modulate the optical signal under the action of the driving voltage to output a modulated optical signal. For example, an optical device may house N detectors within a accommodating space. The driving structure within the optical chip is a circuit used to provide driving voltage to the detectors. Under the action of the driving voltage, the detectors convert the received optical signals into corresponding electrical signals. Alternatively, the N optical devices may include a laser and a modulator, or a detector and a modulator, or a laser and a detector, or a laser, a modulator, and a detector. Or, the N optical devices may include a MEMS and at least one of a laser, a detector, and a modulator, etc., without specific limitations.

[0095] This application provides an optical switching network. For a description of the structure of this optical switching network, please refer to [link to relevant documentation]. Figure 1 The corresponding explanations will not be elaborated upon here.

[0096] Figure 8 This is a structural example diagram of one embodiment of the optical device provided in this application. This application provides an optical device 800. This embodiment does not limit the specific type of the optical device 800; for example, the optical device 800 can be an optical communication device, an optical sensing device, a storage device, etc. Specifically, the optical device 800 includes a processor 801, a photoelectric conversion module 802, and an optical component 803. Figure 8The example shown uses optical component 803 as a MEMS. For a description of the structure of optical component 803, please refer to the above embodiment; specific details will not be repeated here. Processor 801 may include one or more chips, or one or more integrated circuits. For example, processor 801 may include one or more of the following: neural processing unit (NPU), optical digital signal processor (oDSP), field-programmable gate array (FPGA), application-specific integrated circuit (ASIC), system-on-chip (SoC), central processing unit (CPU), network processor (NP), microcontroller unit (MCU), programmable logic device (PLD), network interface card chip, storage interface chip, or other integrated chips; specific details will not be repeated here. For example, the photoelectric conversion module 802 shown in this embodiment is used to realize electro-optic conversion. Specifically, the photoelectric conversion module 802 may include a laser and a modulator. The laser may be a direct modulation laser (DML), an electro-absorption modulated laser (EML), a vertical cavity surface emitting laser (VCSEL), a distributed bragg reflector (DBR), a fabric-pérot laser, a distributed feedback laser, a modulated grating y-branch (MG-Y) laser, a multi-channel interference (MCI) laser, a V-cavity laser, and a chirped sampled grating-distributed reflector laser (CSG-DR) laser, etc.The modulator can be a Mach-Zehnder modulator (MZM) or a micro-ring modulator (MRM), etc. The processor 801 transmits a first electrical signal to the photoelectric conversion module 802, the photoelectric conversion module 802 converts the first electrical signal into a first optical signal, and transmits the first optical signal to the optical component 803. The optical component 803 deflects the transmission direction of the first optical signal to output the deflected first optical signal.

[0097] For example, the photoelectric conversion module 802 includes a detector, which can be a photodiode (positive intrinsic-negative diode, PIN diode) or an avalanche photodiode (APD), etc. Then, the optical component 803 receives the second optical signal and deflects its transmission direction to transmit the deflected second optical signal to the photoelectric conversion module 802. The photoelectric conversion module 802 converts the second optical signal into a second electrical signal and transmits the second electrical signal to the processor 801. This embodiment does not limit the purpose achieved by the optical component 803 in deflecting the transmission direction of the optical signal, as long as the optical component 803 can achieve precise scheduling and control of the optical signal. For example, the optical component 803 can function as an optical switch to enable or disable the connection between the photoelectric conversion module 802 and the optical fiber; this is not limited. Alternatively, the optical component 803 can function as an attenuator, a tunable filter, a wavelength division multiplexer, etc.; specific applications are not limited.

[0098] Figure 8 The example shown uses a MEMS (Mechanical, Electronic, and Semiconductor) as an example of an optical device, without limitation. For instance, an optical device may include a processor and an optical component. The optical device may include a laser as its optical element. The optical device may also include a modulator connected to the optical component. Alternatively, the optical component may include a modulator as its optical element, and the optical device may also include a laser connected to the optical component. Or, the optical component may include both a laser and a modulator. In this case, the processor sends a first electrical signal to the modulator, the laser sends an optical signal to the modulator, and the modulator modulates the first electrical signal onto the optical signal to output a first optical signal.

[0099] Figure 8 The example shown uses a MEMS optical component within an optical device, but this is not a limitation. For instance, the optical device may include a processor and an optical component. The optical component may include a detector. The detector receives a second optical signal, performs photoelectric conversion on the second optical signal to obtain a second electrical signal, and sends the second electrical signal to the processor. The processor receives the second electrical signal.

[0100] Figure 9 This is a structural example diagram of an embodiment of the display device provided in this application. The display device 900 shown in this embodiment includes a light source 901 and an optical component 902. The optical component 902 shown in this embodiment is a MEMS. For a description of the optical component 902, please refer to the above embodiment; specific details will not be repeated here. This embodiment does not limit the type of the light source 901. For example, the light source 901 can be an incandescent lamp (e.g., a halogen tungsten lamp), a gas discharge lamp (e.g., a high-pressure mercury lamp and a xenon lamp), a metal halide lamp, a fluorescent lamp, a laser array, or an emitter based on a light-emitting diode (LED), a laser, etc. For example, the display device can be a projection device, and the display device may also include a lens. Specifically, the light source 901 transmits a first light signal to the optical component 902, and the optical component 902 modulates the first light signal to emit a second light signal. Each of the plurality of reflectors included in the optical component 902 corresponds to a display area of ​​the image to be displayed, and the display area may include one or more pixels. If the display area corresponding to the reflector is in a projection state, the reflector deflects the transmission direction of the first light signal to transmit the second light signal to the lens. If the display area corresponding to the reflector is in a non-projection state, the reflector deflects the transmission direction of the first light signal to prevent the second light signal from being transmitted to the lens. The lens receives the second light signal from the light component 902 and images the second light signal. The lens includes one or more lenses. The lens forms a magnified real image of the second light signal. The lens can be a convex lens or a concave lens. Optionally, the display device shown in this embodiment may also include a projection screen, in which case the real image corresponding to the imaging beam emitted from the lens can be displayed on the projection screen.

[0101] The display device shown in this embodiment can also be a head-up display (HUD) system. For example, a HUD system projects vehicle-related information into the driver's field of vision. This vehicle-related information can be instrument information (such as vehicle speed) or navigation information. Thus, the driver sees the vehicle-related information in front of their field of vision without having to look down at the instrument panel or central control display below the steering wheel, thereby improving braking reaction time in emergency situations and enhancing driving safety.

[0102] The light source 901 shown in this embodiment can modulate vehicle-related information onto the optical signal to obtain a first optical signal. The optical component 902 can deflect the transmission direction of the first optical signal to emit a second optical signal, which forms a magnified virtual image in front of the vehicle. For example, the optical component 902 transmits the second optical signal to the windshield of the vehicle. The windshield reflects the second optical signal to the driver's eyes for imaging. That is, the backward extension of the image formed in the driver's eyes forms a virtual image in front of the vehicle. This embodiment uses the application of a HUD system to a vehicle as an example. In other examples, the HUD system can also be applied to driving tools that require a driver, such as ships, airplanes, and helicopters.

[0103] Figure 9 The display device shown can also be smart glasses. In this embodiment, the smart glasses can be augmented reality (AR) glasses or virtual reality (VR) glasses. Smart glasses are a technology that cleverly integrates virtual information with the real world. They widely utilize various technologies such as multimedia, 3D modeling, real-time tracking and registration, intelligent interaction, and sensing. They simulate and apply computer-generated text, images, 3D models, music, videos, and other virtual information to the real world, with the two types of information complementing each other, thus achieving "enhancement" of the real world. With the increasing variety of smart products, they are becoming more and more convenient for users. The smart glasses include a frame, lenses, an optical component 902, and a light source 901. The lenses, optical component 902, and light source 901 are fixed to the frame. The optical component 902 modulates a first light signal from the light source 901 to obtain a second light signal. The optical component 902 projects the second light signal onto the lens facing the wearer's eyes, using the lens's reflective function to reflect the second light signal into the wearer's eyes.

[0104] This embodiment also provides a vehicle. The vehicle includes... Figure 9 The HUD system and windshield are shown. Of course, the vehicle may also include other components, such as a steering wheel, processor, memory, wireless communication device, and sensors, etc., but this embodiment does not limit the specific components.

[0105] Figure 10 This is a structural example diagram of one embodiment of the lidar provided in this application. LiDAR is a target detection technology. LiDAR emits detection light, which is diffusely reflected upon encountering a target object. The lidar determines the target object's distance, azimuth, height, speed, attitude, shape, and other characteristics by analyzing the reflected light signal. LiDAR is applied in fields such as intelligent driving vehicles, intelligent aircraft, 3D printing, VR, AR, and service robots. The intelligent driving in this embodiment can be autonomous driving, automatic driving, or assisted driving.

[0106] The lidar 1000 shown in this embodiment includes a light source 1001, an optical component 1002, a detector 1003, and a processor 1004. The optical component 1002 shown in this embodiment is a MEMS. For a description of the optical component 1002, please refer to the above embodiment; specific details will not be repeated here. The light source 1001 transmits detection light to the optical component 1002. The optical component 1002 deflects the transmission direction of the detection light through a included mirror to emit the deflected detection light, thereby achieving scanning of a specific area. When the deflected detection light is transmitted to a target object, the target object returns echo light to the detector 1003 based on the deflected detection light. The detector 1003 is connected to the processor 1004. The detector 1003 receives the echo light and converts it into an electrical signal. The detector 1003 transmits this electrical signal to the processor 1004, and the processor 1004 obtains relevant information about the target object based on this electrical signal. Specifically, the processor 1004 can determine the location information of the target object by calculating the time delay between the emission time of the probe light and the return time of the echo light. This embodiment uses the optical component 1002 as a MEMS as an example. In other examples, the lidar may not include a light source; instead, the probe light may be emitted by a laser included in the optical component. Furthermore, the detector may be located within the optical component, etc., and the specific design is not limited.

[0107] The above embodiment illustrates the application of optical components to lidar in transportation vehicles. In other examples, optical components can also be applied to fixed radar (e.g., radar fixed on highways, surveillance radar, radar in industrial settings, etc.). Optical components can also be applied to radar in unmanned transport vehicles in logistics warehouses or radar in smart home appliances (e.g., automatic cleaning robots), etc., without specific limitations.

[0108] This embodiment also provides a means of transportation; for a detailed description of its structure, please refer to [link / reference needed]. Figure 11 As shown, where, Figure 11 This is a structural example diagram of one embodiment of the vehicle provided in this application. The vehicle shown in this example may be a car, truck, motorcycle, public vehicle, lawnmower, recreational vehicle, amusement park vehicle, tram, golf cart, train, handcart, or drone, etc. This embodiment configures the vehicle 1100 in a fully or partially automated driving mode. The vehicle shown in this embodiment includes a vehicle body, which is used to fix a sensor system 1120, an advanced driving assistance system (ADAS) 1110, peripheral devices 1130, and a computer system 1140.

[0109] Sensing system 1120 includes one or more sensors that sense environmental information about the vicinity of vehicle 1100. For example, sensing system 1120 may include a positioning system, such as a Global Positioning System (GPS) or BeiDou Navigation Satellite System. Sensing system 1120 also includes an inertial measurement unit (IMU), a lidar sensor, and a camera. For a description of lidar, please refer to [link to lidar documentation]. Figure 10 The specific embodiments are not limited. The sensing system 1120 may also include sensors for monitoring the internal systems of the vehicle 1100 (e.g., an in-vehicle air quality monitor, fuel gauge, oil temperature gauge, etc.). Sensor data from one or more of these sensors can be used to detect objects and their corresponding characteristics (position, shape, orientation, speed, etc.). A positioning system can be used to estimate the geographical location of the vehicle 1100. An IMU is used to sense changes in the position and orientation of the vehicle 1100 based on inertial acceleration. The IMU may be a combination of an accelerometer and a gyroscope. A lidar can use radio signals to detect target objects in the surrounding environment of the vehicle 1100, such as pedestrians, vehicles, or buildings.

[0110] ADAS1110 continuously senses the surrounding environment during vehicle operation, collects data, identifies, detects, and tracks static and dynamic objects, and combines this data with navigation map data for system calculations and analysis. This allows the driver to anticipate potential hazards, effectively increasing driving comfort and safety. For example, ADAS1110 can control the vehicle using data acquired by sensor system 1120. Furthermore, ADAS1110 can control the vehicle using vehicle driving-related information, such as key data displayed on the vehicle's dashboard (fuel consumption, engine speed, temperature, etc.), vehicle speed, steering wheel angle information, or vehicle attitude data.

[0111] Vehicle 1100 interacts with external sensors, other vehicles, other computer systems, or users via peripheral device 1130. Peripheral device 1130 may include a wireless communication system, an onboard computer, a microphone, and / or a speaker. For example, the onboard computer may provide information to the user of vehicle 1100. The user interface may also operate the onboard computer to receive user input. The onboard computer may be operated via a touchscreen. In other cases, peripheral device 1130 may provide a means for vehicle 1100 to communicate with other devices located within the vehicle. For example, a microphone may receive audio (e.g., voice commands or other audio input) from the user of vehicle 1100. A speaker may output audio to the user of vehicle 1100. The wireless communication system may communicate wirelessly with one or more devices directly or via a communication network.

[0112] Some or all of the functions of vehicle 1100 are controlled by computer system 1140. Computer system 1140 can control the functions of vehicle 1100 based on input received from various systems (e.g., sensor system 1120, ADAS 1110, peripheral devices 1130) and from user interface. Computer system 1140 may include at least one processor that executes instructions stored in memory.

[0113] Those skilled in the art will clearly understand that, for the sake of convenience and brevity, the specific working processes of the systems, devices, and units described above can be referred to the corresponding processes in the foregoing method embodiments, and will not be repeated here.

[0114] The above-described embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application.

Claims

1. An optical component, characterized in that, The device includes an optical chip, an optical window, and N optical devices, where N is any integer greater than 1. The N optical devices are located on the surface of the optical chip. The periphery of the optical window is connected to the surface of the optical chip, and a receiving space is formed between the surface of the optical chip and the optical window. The N optical devices are located within the receiving space. The optical chip includes multiple driving structures, each of which is connected to one of the optical devices. The driving structures are used to drive the optical devices to work.

2. The optical component according to claim 1, characterized in that, The optical device is a reflector, and the plurality of driving structures include multiple pairs of comb tooth structures. Each pair of comb tooth structures includes movable comb teeth and fixed comb teeth arranged in a direction perpendicular to the surface of the optical chip. The movable comb teeth are connected to one of the reflectors, and each pair of comb tooth structures is used to drive one of the reflectors to deflect.

3. The optical component according to claim 2, characterized in that, The movable comb teeth and the fixed comb teeth include an oxygen-buried layer for electrical isolation.

4. The optical component according to claim 2 or 3, characterized in that, The optical component also includes a substrate, the surface of which facing the reflector is recessed to form a deflection space, and the orthographic projection of the reflector onto the surface of the optical chip is located within one of the orthographic projections of the deflection space onto the surface of the optical chip.

5. The optical component according to any one of claims 2 to 4, characterized in that, The movable comb teeth include a plurality of first comb teeth arranged sequentially along the surface of the optical chip, and the fixed comb teeth include a plurality of second comb teeth arranged sequentially along the surface of the optical chip. The orthographic projection of the first comb teeth on the surface of the optical chip is located between the orthographic projections of two adjacent second comb teeth on the surface of the optical chip.

6. The optical component according to claim 1, characterized in that, The N optical devices include at least one of the following: Lasers, modulators, detectors.

7. The optical component according to any one of claims 1 to 6, characterized in that, The optical component further includes a substrate, and the optical chip is located on the surface of the substrate. The substrate includes a redistribution layer RDL and multiple pads. The RDL includes M metal layers, where M is any integer greater than or equal to 1. The driving structure is connected to one of the pads through the M metal layers. The multiple pads are used to apply multiple driving voltages to the multiple driving structures through the M metal layers. The multiple driving voltages are used to drive the N optical devices to work.

8. The optical component according to claim 7, characterized in that, The optical component further includes a substrate, the surface of which includes the substrate and a driving module. The driving module is connected to the plurality of pads and is used to apply the multi-channel driving voltage to the plurality of pads.

9. The optical component according to any one of claims 1 to 8, characterized in that, The optical device is a reflector. The plurality of driving structures, including a first pair of comb teeth, a second pair of comb teeth, a third pair of comb teeth, and a fourth pair of comb teeth, are connected to the same reflector. The first pair of comb teeth is used to drive the reflector to deflect clockwise around a first direction X. The second pair of comb teeth is used to drive the reflector to deflect counterclockwise around the first direction X. The third pair of comb teeth is used to drive the reflector to deflect clockwise around a second direction Y. The fourth pair of comb teeth is used to drive the reflector to deflect counterclockwise around the second direction Y. The surface of the optical chip includes intersecting first direction X and second direction Y.

10. The optical component according to any one of claims 1 to 9, characterized in that, The top surface of the light window has a light-transmitting structure, which is used to transmit optical signals between itself and the optical device. The light-transmitting structure is parallel to the surface of the optical chip.

11. The optical component according to any one of claims 1 to 9, characterized in that, The top surface of the light window has a light-transmitting structure, which is used to transmit optical signals between itself and the optical device. The angle between the extension line of the light-transmitting structure and the surface of the optical chip is an acute angle.

12. The optical component according to claim 11, characterized in that, The optical device is a reflector, the acute angle is greater than the maximum deflection angle, the maximum deflection angle is the maximum angle of deflection of the reflector, and the maximum deflection angle is the angle between the reflector and the surface of the optical chip.

13. The optical component according to any one of claims 1 to 9, characterized in that, The light window has a partially spherical structure.

14. The optical component according to any one of claims 1 to 13, characterized in that, The surface of the optical chip also includes K light absorption modules. The positions of the light absorption modules are separated from the positions of the optical devices and are located within the accommodating space. K is any integer greater than or equal to 1. The light absorption modules are used to absorb optical signals.

15. An optical switching network, characterized in that, The device includes a first port, at least one optical component, and a second port, wherein the optical component is as described in any one of claims 1 to 14, the first port is used to transmit incident light into the optical component, the optical component deflects the transmission direction of the incident light to transmit reflected light into the second port, and the second port is used to output the reflected light.

16. An optical device, characterized in that, Includes a processor and an optical component, said optical component as described in any one of claims 1 to 14; The processor is used to output a first electrical signal, and the optical component is used to output a first optical signal, wherein the first optical signal is an optical signal obtained by electro-optical conversion of the first electrical signal; or, The optical component receives a second optical signal, and the processor receives a second electrical signal, which is an electrical signal obtained by photoelectric conversion of the second optical signal.

17. An optical display device, characterized in that, The device includes an optical component and a light source, the optical component being as described in any one of claims 1 to 14, the optical component receiving a first optical signal from the light source, the optical component being used to deflect the transmission direction of the first optical signal to obtain a second optical signal, the second optical signal being used for imaging.

18. A lidar, characterized in that, The device includes an optical component, a processor, and a detector. The optical component is as described in any one of claims 1 to 14. The optical component is used to emit detection light, which is transmitted to a target object. The target object is used to reflect echo light back to the detector based on the detection light. The detector is used to convert the echo light into an electrical signal and transmit the electrical signal to the processor. The processor obtains relevant information about the target object based on the electrical signal.

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