AR glasses and active heat dissipation method

Abstract

The application discloses an AR (Augmented Reality) glasses and an active heat dissipation method, and relates to the technical field of heat dissipation of intelligent wearable devices. The AR glasses comprise a glasses panel assembly, a left glasses leg assembly, a right glasses leg assembly and a circuit board assembly. The left glasses leg assembly and the right glasses leg assembly are connected to the glasses panel assembly respectively. The left glasses leg assembly comprises a left glasses leg shell and a fan arranged in the left glasses leg shell. The circuit board assembly comprises a circuit board and a vapor chamber. A semiconductor device is arranged in the left glasses leg assembly and is in heat conduction connection with the vapor chamber. The fan is electrically connected with the circuit board. The left glasses leg shell is provided with an air inlet hole and a heat dissipation small hole. An air inlet of the fan is in communication with the air inlet hole. The vapor chamber is provided with a channel. An air outlet of the fan is in communication with an inlet of the channel. An outlet of the channel is in communication with the heat dissipation small hole. The AR glasses can improve the technical problem that the heat inside the glasses leg of the AR glasses is discharged to the outside world at a low efficiency.

Description

Technical Field

[0001] This invention relates to the field of heat dissipation technology for smart wearable devices, and particularly to an AR glasses and an active heat dissipation method. Background Technology

[0002] Advances in real-world technology have enabled AR glasses to integrate display, computing, and communication functions. Processors and power devices are typically located inside the temples, and the devices generate heat during continuous operation.

[0003] Existing AR glasses typically use heat spreaders, graphene heat sinks, and copper heat sinks to diffuse local heat to the temple housing, and then rely on the temple housing to exchange heat naturally with the outside air.

[0004] Due to limitations in the internal space of the temples and the ability for natural convection, existing structures are less efficient at dissipating heat from inside the temples to the outside.

[0005] Therefore, how to improve the efficiency of heat dissipation from the temples of AR glasses to the outside is a technical problem that needs to be solved by those skilled in the art. Summary of the Invention

[0006] The purpose of this invention is to provide AR glasses and an active heat dissipation method to improve the technical problem of low efficiency in dissipating heat from the temples of AR glasses to the outside.

[0007] To achieve the above objectives, the present invention provides AR glasses, including a glasses panel assembly, a left temple assembly, a right temple assembly, and a circuit board assembly. The left temple assembly and the right temple assembly are respectively connected to the glasses panel assembly. The left temple assembly includes a left temple shell and a fan disposed within the left temple shell. The circuit board assembly includes a circuit board and a heat spreader. A semiconductor device is disposed within the left temple assembly. The semiconductor device is thermally connected to the heat spreader, and the fan is electrically connected to the circuit board. The left temple shell has an air inlet and a heat dissipation hole. The air inlet of the fan communicates with the air inlet. The heat spreader has a channel. The air outlet of the fan communicates with the inlet of the channel, and the outlet of the channel communicates with the heat dissipation hole.

[0008] In one possible implementation, the left temple housing includes an outer shell and an inner shell connected to each other. The outer shell is located on the side of the inner shell opposite to the right temple assembly. An air inlet is located on the side of the outer shell opposite to the inner shell, and a heat dissipation hole is located on the side of the outer shell opposite to the eyeglass panel assembly.

[0009] In one possible implementation, the fan is fixed to the inner surface of the housing, with the fan inlet facing the air inlet hole and the fan outlet facing the inlet of the heat spreader.

[0010] In one possible implementation, an adhesive layer is provided between the fan and the housing, and the fan is fixed to the housing by the adhesive layer.

[0011] In one possible implementation, the channel extends along the length of the heat spreader, with the inlet of the channel located at the end of the heat spreader near the fan and the outlet of the channel located at the end of the heat spreader near the heat dissipation holes.

[0012] In one possible implementation, the circuit board assembly further includes a flexible circuit board, with the circuit board and the fan electrically connected to the flexible circuit board, such that the fan is electrically connected to the circuit board via the flexible circuit board.

[0013] In one possible implementation, the circuit board is provided with a controller, a temperature detection circuit, and a fan drive circuit. The temperature detection circuit and the fan drive circuit are electrically connected to the controller, and the fan is electrically connected to the fan drive circuit.

[0014] In one possible implementation, the left temple assembly is provided with a graphene heat sink and a copper heat sink, and the semiconductor device is also thermally connected to at least one of the graphene heat sink and the copper heat sink. The temperature detection terminal of the temperature detection circuit is thermally connected to the semiconductor device.

[0015] Based on the above, this application also provides an active heat dissipation method, applied to the AR glasses provided in the above embodiments. The active heat dissipation method includes: Obtain the temperature of semiconductor devices; Compare the temperature of the semiconductor device with a preset threshold. When the temperature of the semiconductor device reaches a preset threshold, a start signal is output to the fan through the circuit board to start the fan. After the fan starts, outside air enters the fan's air inlet through the air inlet hole and enters the heat dissipation plate's channel through the fan's air outlet. After flowing through the channel, it is discharged through the heat dissipation holes.

[0016] In one possible implementation, when the temperature of the semiconductor device reaches a preset threshold, the fan is activated, and the operating frequency of the semiconductor device is kept constant until the temperature reaches the preset threshold.

[0017] Compared with the prior art, the technical solution provided by the present invention has at least the following beneficial effects: The AR glasses have a fan electrically connected to the circuit board installed inside the left temple shell, and a continuous airflow path is formed through the air inlet on the left temple shell, the air inlet and outlet of the fan, the channels on the heat dissipation plate, and the heat dissipation holes on the left temple shell; when the fan is running, outside air enters the fan through the air inlet and is delivered by the fan to the channels of the heat dissipation plate. As the airflow flows through the channels, it carries away the heat transferred from the semiconductor device to the heat dissipation plate, and then exits the left temple shell through the heat dissipation holes. Thus, the forced airflow accelerates the heat exchange between the heat dissipation plate and the outside air, improves the efficiency of heat dissipation from the inside of the left temple to the outside, and reduces the accumulation of heat inside the left temple. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the provided drawings without creative effort.

[0019] Figure 1 This is a schematic diagram of the structure of the AR glasses provided in an embodiment of the present invention; Figure 2 This is a cross-sectional view of the AR glasses provided in an embodiment of the present invention; Figure 3 for Figure 2 A magnified view of a portion of location A in the middle; Figure 4 This is a front view of the AR glasses provided in an embodiment of the present invention; Figure 5 A bottom view of the AR glasses provided in an embodiment of the present invention; Figure 6 This is a top view of the AR glasses provided in an embodiment of the present invention; Figure 7 This is a right view of the AR glasses provided in an embodiment of the present invention; Figure 8 This is a left view of the AR glasses provided in an embodiment of the present invention; Figure 9 This is a rear view of the AR glasses provided in an embodiment of the present invention; Figure 10 This is a flowchart of an active heat dissipation method provided in an embodiment of the present invention.

[0020] in: 100 - Eyeglasses panel assembly; 200-Left temple assembly, 210-Left temple housing, 211-Air inlet, 212-Heat dissipation hole, 213-Outer housing, 214-Inner housing, 220-Fan; 300 - Right temple assembly; 400 - Circuit board assembly, 410 - Heat sink. Detailed Implementation

[0021] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0022] To enable those skilled in the art to better understand the present invention, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0023] In the description of this invention, it should be understood that the terms "upper", "lower", "front", "rear", "left" and "right" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the position or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations of this invention.

[0024] The purpose of this invention is to provide AR glasses and an active heat dissipation method to improve the technical problem of low efficiency in dissipating heat from the temples of AR glasses to the outside.

[0025] Please see Figures 1 to 9 To achieve the above objectives, the present invention provides AR glasses, including a glasses panel assembly 100, a left temple assembly 200, a right temple assembly 300, and a circuit board assembly 400. The left temple assembly 200 and the right temple assembly 300 are respectively connected to the glasses panel assembly 100. The left temple assembly 200 includes a left temple shell 210 and a fan 220 disposed within the left temple shell 210. The circuit board assembly 400 includes a circuit board and a heat dissipation plate 410. A semiconductor device is disposed within the left temple assembly 200, and the semiconductor device is thermally connected to the heat dissipation plate 410. The fan 220 is electrically connected to the circuit board. The left temple shell 210 is provided with an air inlet 211 and heat dissipation holes 212. The air inlet of the fan 220 communicates with the air inlet 211. The heat dissipation plate 410 is provided with channels, and the air outlet of the fan 220 communicates with the inlet of the channels and the outlet of the channels communicates with the heat dissipation holes 212. The number of heat dissipation holes 212 can be multiple.

[0026] Specifically, the AR glasses have a fan 220 electrically connected to the circuit board inside the left temple housing 210. A continuous airflow path is formed through the air inlet 211 on the left temple housing 210, the air inlet and outlet of the fan 220, the channels on the heat spreader 410, and the heat dissipation holes 212 on the left temple housing 210. When the fan 220 is running, outside air enters the fan 220 through the air inlet 211 and is transported by the fan 220 to the channels of the heat spreader 410. As the airflow flows through the channels, it carries away the heat transferred from the semiconductor device to the heat spreader 410. Then, it is discharged from the left temple housing 210 through the heat dissipation holes 212. This forced airflow accelerates the heat exchange between the heat spreader 410 and the outside air, improves the efficiency of heat dissipation from the inside of the left temple to the outside, and reduces the accumulation of heat inside the left temple.

[0027] In this embodiment, the eyeglass panel assembly 100 is located at the front of the AR glasses, and the left temple assembly 200 and the right temple assembly 300 are respectively connected to both sides of the eyeglass panel assembly 100. The circuit board assembly 400 is arranged inside the left temple assembly 200, and the fan 220 is located inside the left temple housing 210 and close to the heat dissipation plate 410. The air inlet 211 on the left temple housing 210 is directly connected to the air inlet of the fan 220, the air outlet of the fan 220 is directly connected to the inlet of the channel on the heat dissipation plate 410, and the outlet of the channel is directly connected to the heat dissipation hole 212, forming an airflow path that enters from the outside of the left temple and returns to the outside of the left temple. When assembling the AR glasses, the fan 220 is first fixed inside the left temple housing 210 and connected to the circuit board assembly 400, then the left temple assembly 200 is assembled, and then the left temple assembly 200 and the right temple assembly 300 are connected to the eyeglass panel assembly 100.

[0028] In one possible implementation, the left temple housing 210 includes an outer shell 213 and an inner shell 214 connected to each other. The outer shell 213 is located on the side of the inner shell 214 opposite to the right temple assembly 300. An air inlet 211 is located on the side of the outer shell 213 opposite to the inner shell 214, and a heat dissipation hole 212 is located on the side of the outer shell 213 opposite to the spectacle panel assembly 100. In the wearing state, the outer shell 213 is located on the side of the left temple away from the wearer's head, and the inner shell 214 is located on the side of the left temple close to the wearer's head. The outer shell 213 and the inner shell 214 are connected to form the left temple housing 210. The air inlet 211 penetrates the outer side wall of the outer shell 213, and the heat dissipation hole 212 penetrates the end side wall of the left temple away from the spectacle panel assembly 100. Airflow enters from the outside of the left temple and exits from the rear end of the left temple.

[0029] In one possible implementation, the fan 220 is fixed to the inner surface of the housing 213. The air inlet of the fan 220 faces the air inlet hole 211, and the air outlet of the fan 220 faces the inlet of the heat spreader 410. The fan 220 is mounted on the inner surface of the housing 213, and there is no structure obstructing airflow between the air inlet and the air inlet hole 211. The air outlet of the fan 220 is opposite to the inlet of the heat spreader 410. When the fan 220 starts, a negative pressure is created at the air inlet, causing outside air to enter the fan 220 through the air inlet hole 211. After the fan 220 pressurizes the air, the air enters the heat spreader 410 through the air outlet.

[0030] In one possible implementation, an adhesive layer is provided between the fan 220 and the housing 213. The adhesive layer can be formed using UV adhesive, and the fan 220 is fixed to the housing 213 by the adhesive layer. The fan 220 can be a semiconductor fan. During installation, UV adhesive is applied to the mounting surface of the fan 220 or the corresponding mounting area of ​​the housing 213. The position of the fan 220 is adjusted so that the air inlet and air outlet are aligned with the air inlet hole 211 and the channel inlet, respectively. Then, the UV adhesive is cured. After the adhesive layer has cured, the fan 220 is fixed to the inner surface of the housing 213.

[0031] In one possible implementation, the channel extends along the length of the heat spreader 410, with the inlet located at the end of the heat spreader 410 near the fan 220 and the outlet located at the end of the heat spreader 410 near the heat dissipation hole 212. The heat spreader 410 is arranged along the length of the left temple, and the channel extends or penetrates along the length of the heat spreader 410. The inlet of the channel is near the air outlet of the fan 220, and the outlet of the channel is near the heat dissipation hole 212. The airflow output from the fan 220 enters the channel and flows along the heat spreader 410, exchanging heat with the heat spreader 410 during the flow, and then enters the heat dissipation hole 212 from the outlet of the channel and is discharged. The channel is used to limit the airflow direction and prevent the airflow from flowing back near the air outlet of the fan 220.

[0032] In one possible implementation, the circuit board assembly 400 further includes a flexible circuit board, to which both the circuit board and the fan 220 are electrically connected, such that the fan 220 is electrically connected to the circuit board via the flexible circuit board. One end of the flexible circuit board is connected to the circuit board, and the other end is connected to the fan 220. Conductive lines in the flexible circuit board provide operating power to the fan 220 and transmit the fan 220 start signal output by the controller. The flexible circuit board can be bent to fit within the internal space of the left temple, reducing the wiring footprint between the circuit board and the fan 220.

[0033] In one possible implementation, the circuit board includes a controller, a temperature detection circuit, and a fan drive circuit. The temperature detection circuit and the fan drive circuit are electrically connected to the controller, and the fan 220 is electrically connected to the fan drive circuit. The controller reads the temperature detection signal output by the temperature detection circuit and compares the temperature determined by the temperature detection signal with a preset threshold. When the temperature does not reach the preset threshold, the fan drive circuit does not output starting power to the fan 220; when the temperature reaches the preset threshold, the controller outputs a start control signal to the fan drive circuit, and the fan drive circuit supplies power to the fan 220, causing the fan 220 to start.

[0034] In one possible implementation, the left temple assembly 200 includes a graphene heat sink and a copper heat sink. The semiconductor device is also thermally connected to at least one of the graphene heat sink and the copper heat sink. The temperature sensing terminal of the temperature sensing circuit is thermally connected to the semiconductor device. The semiconductor device can be a processor or a power management device. The heat generated by the semiconductor device diffuses into the left temple assembly 200 through at least one of the graphene heat sink and the copper heat sink, or through the heat spreader 410. When the heat spreader 410, the graphene heat sink, and the copper heat sink are simultaneously provided, they can be thermally connected to the semiconductor device individually, or one of them can sequentially transfer heat to the other heat sinks. The temperature sensing terminal is positioned close to the semiconductor device to reduce the deviation between the detected temperature and the actual temperature of the semiconductor device.

[0035] Please see Figure 10 Based on the above, this application also provides an active heat dissipation method, applied to the AR glasses provided in the above embodiments. The active heat dissipation method includes steps S100 to S300.

[0036] Step S100: Obtain the temperature of the semiconductor device; Step S200: Compare the temperature of the semiconductor device with a preset threshold; Step S300: When the temperature of the semiconductor device reaches the preset threshold, a start signal is output to the fan 220 through the circuit board to start the fan 220; after the fan 220 is started, the outside air enters the air inlet of the fan 220 through the air inlet 211, and enters the channel of the heat dissipation plate 410 through the air outlet of the fan 220, and is discharged through the heat dissipation hole 212 after flowing through the channel.

[0037] When the active cooling method is implemented, the temperature detection circuit continuously or periodically acquires the temperature of the semiconductor device, and the controller compares the acquired temperature with a preset threshold. After the temperature reaches the preset threshold, the controller outputs a start signal to the fan 220 through the fan drive circuit and the flexible circuit board. After the fan 220 starts, outside air enters the air inlet of the fan 220 through the air inlet 211, is pressurized by the fan 220, and enters the channel of the heat spreader 410 through the air outlet. The airflow carries away the heat transferred by the heat spreader 410 along the channel and is finally discharged through the heat dissipation holes 212.

[0038] In one possible implementation, when the temperature of the semiconductor device reaches a preset threshold, the fan 220 is activated, and the operating frequency of the semiconductor device remains unchanged until the temperature reaches the preset threshold.

[0039] The semiconductor device continues to operate at the current operating frequency, and the airflow generated by the fan 220 forces heat exchange on the heat exchange plate 410, thereby dissipating heat without actively reducing the operating frequency of the semiconductor device.

[0040] During use, the heat spreader 410, graphene heat sink, and copper heat sink maintain thermal conductivity for the semiconductor device. A temperature detection circuit acquires the semiconductor device temperature; when the temperature reaches a preset threshold, the controller activates the fan 220 via the fan drive circuit and flexible circuit board. The fan 220 draws in outside air through the air inlet 211 and directs the airflow into the channels of the heat spreader 410. The airflow then flows along the channels and exits through the heat dissipation holes 212, thereby carrying the heat inside the left temple assembly 200 to the outside. This active cooling process can be implemented while the semiconductor device maintains its current operating frequency and reduces localized heat accumulation on the left temple, thus alleviating the burning sensation of the temple or ear during wear.

[0041] It should be noted that in this specification, relational terms such as first and second are used only to distinguish one entity from several other entities, and do not necessarily require or imply any such actual relationship or order between these entities.

[0042] The various embodiments in this specification are described in a progressive manner, with each embodiment focusing on the differences from other embodiments. The same or similar parts between the various embodiments can be referred to each other.

[0043] This article uses specific examples to illustrate the principles and implementation methods of the present invention. The descriptions of the above embodiments are only for the purpose of helping to understand the core ideas of the present invention. It should be noted that those skilled in the art can make improvements and modifications to the present invention without departing from the principles of the present invention, and these improvements and modifications also fall within the protection scope of the present invention.

Claims

1. An AR glasses assembly, comprising a glasses panel assembly (100), a left temple assembly (200), a right temple assembly (300), and a circuit board assembly (400), wherein the left temple assembly (200) and the right temple assembly (300) are respectively connected to the glasses panel assembly (100), characterized in that, The left temple assembly (200) includes a left temple housing (210) and a fan (220) disposed within the left temple housing (210). The circuit board assembly (400) includes a circuit board and a heat spreader (410). A semiconductor device is disposed within the left temple assembly (200). The semiconductor device is thermally connected to the heat spreader (410). The fan (220) is electrically connected to the circuit board. The left temple housing (210) is provided with an air inlet (211) and a heat dissipation hole (212). The air inlet of the fan (220) is connected to the air inlet (211). The heat spreader (410) is provided with a channel. The air outlet of the fan (220) is connected to the inlet of the channel. The outlet of the channel is connected to the heat dissipation hole (212).

2. The AR glasses according to claim 1, characterized in that, The left temple housing (210) includes an outer shell (213) and an inner shell (214) connected to each other. The outer shell (213) is located on the side of the inner shell (214) away from the right temple assembly (300). The air inlet (211) is located on the side of the outer shell (213) away from the inner shell (214). The heat dissipation hole (212) is located on the side of the outer shell (213) away from the eyeglass panel assembly (100).

3. The AR glasses according to claim 2, characterized in that, The fan (220) is fixed to the inner surface of the outer casing (213). The air inlet of the fan (220) is set towards the air inlet hole (211), and the air outlet of the fan (220) is set towards the inlet of the heat spreader plate (410).

4. The AR glasses according to claim 3, characterized in that, An adhesive layer is provided between the fan (220) and the outer casing (213), and the fan (220) is fixed to the outer casing (213) by the adhesive layer.

5. The AR glasses according to claim 1, characterized in that, The channel extends along the length of the heat spreader (410), with the entrance of the channel located at one end of the heat spreader (410) near the fan (220) and the outlet of the channel located at one end of the heat spreader (410) near the heat dissipation hole (212).

6. The AR glasses according to claim 1, characterized in that, The circuit board assembly (400) further includes a flexible circuit board, and the circuit board and the fan (220) are electrically connected to the flexible circuit board, so that the fan (220) is electrically connected to the circuit board via the flexible circuit board.

7. The AR glasses according to claim 1, characterized in that, The circuit board is equipped with a controller, a temperature detection circuit and a fan drive circuit. The temperature detection circuit and the fan drive circuit are electrically connected to the controller, and the fan (220) is electrically connected to the fan drive circuit.

8. The AR glasses according to claim 7, characterized in that, The left temple assembly (200) is provided with a graphene heat sink and a copper heat sink. The semiconductor device is also thermally connected to at least one of the graphene heat sink and the copper heat sink. The temperature detection terminal of the temperature detection circuit is thermally connected to the semiconductor device.

9. An active heat dissipation method, applied to AR glasses according to any one of claims 1 to 8, characterized in that, The active heat dissipation method includes: Obtain the temperature of the semiconductor device; The temperature of the semiconductor device is compared with a preset threshold. When the temperature of the semiconductor device reaches the preset threshold, the circuit board outputs a start signal to the fan (220) to start the fan (220); after the fan (220) is started, outside air enters the air inlet of the fan (220) through the air inlet hole (211) and enters the channel of the heat spreader (410) through the air outlet of the fan (220), flows through the channel and is discharged through the heat dissipation hole (212).

10. The active heat dissipation method according to claim 9, characterized in that, When the temperature of the semiconductor device reaches the preset threshold, the fan (220) is started, and the operating frequency of the semiconductor device remains unchanged before the temperature reaches the preset threshold.

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