Color film substrate, preparation method thereof and display device

Abstract

A color film substrate, a preparation method thereof and a display device. The color film substrate comprises a substrate, a conductive layer, a color film layer and a plurality of spacers. The substrate comprises a first surface and a second surface which are opposite to each other. The conductive layer is arranged on the first surface of the substrate. The color film layer is arranged on the second surface of the substrate. The spacers are arranged on the side of the color film layer which is away from the substrate. The plurality of spacers are arranged on a surface which is parallel to the second surface. The scheme solves the problem of poor uniformity of the spacers in the existing liquid crystal display panel.

Description

Technical Field

[0001] This article relates to, but is not limited to, the field of display technology, and in particular to a color filter substrate, its preparation method, and a display device. Background Technology

[0002] Liquid crystal displays (LCDs) have seen rapid development due to their small size, low power consumption, and lack of radiation. An LCD panel consists of a thin-film transistor array (TFT) substrate (cells) and a color filter (CF) substrate. Liquid crystal (LC) molecules are disposed between the display substrate and the color filter substrate. By controlling the common electrode and pixel electrode, an electric field is formed to drive the liquid crystal deflection, achieving grayscale display.

[0003] Existing LCD panels suffer from problems such as poor uniformity of spacer columns. Summary of the Invention

[0004] The following is an overview of the subject matter described in detail herein. This overview is not intended to limit the scope of the claims.

[0005] The technical problem to be solved by this disclosure is to provide a color filter substrate and its preparation method, as well as a display device, to solve the problem of poor uniformity of spacer pillars in existing liquid crystal display panels.

[0006] This disclosure provides a color filter substrate, including a substrate, a conductive layer, a color filter layer, and a plurality of spacer pillars. The substrate includes a first surface and a second surface that are opposite to each other. The conductive layer is disposed on the first surface of the substrate, the color filter layer is disposed on the second surface of the substrate, and the spacer pillars are disposed on the side of the color filter layer away from the substrate. The plurality of spacer pillars are disposed on a surface parallel to the second surface.

[0007] In an exemplary embodiment, the conductive layer is a first black matrix, and the material of the first black matrix includes a metallic material.

[0008] In an exemplary embodiment, the color filter layer includes at least a plurality of support structures, the surfaces of the plurality of support structures on the side away from the substrate are located in the same plane and the plane is parallel to the second surface, and the septum post is disposed on the surface of the support structure on the side away from the substrate.

[0009] In an exemplary embodiment, the color filter layer is provided with a plurality of receiving spaces, the support structure is disposed within the receiving spaces, and the support structure is disposed on the second surface of the substrate.

[0010] In an exemplary embodiment, the color filter layer further includes a first filter layer, a second filter layer, and a third filter layer, wherein the orthographic projection of the first filter layer on the substrate at least partially overlaps with the orthographic projection of the second filter layer on the substrate, the orthographic projection of the first filter layer on the substrate at least partially overlaps with the orthographic projection of the third filter layer on the substrate, and the orthographic projection of the second filter layer on the substrate at least partially overlaps with the orthographic projection of the third filter layer on the substrate.

[0011] In an exemplary embodiment, a first groove is provided on the side of the first filter layer near the second filter layer, and a second groove is provided on the side of the second filter layer near the first filter layer. The first groove and the second groove form the accommodating space.

[0012] In an exemplary embodiment, a first groove is provided on the side of the first filter layer near the third filter layer, and a third groove is provided on the side of the third filter layer near the first filter layer. The first groove and the third groove form the accommodating space.

[0013] In an exemplary embodiment, the support structure and the third filter layer within the accommodating space formed by the first groove and the third groove are an integral structure that is interconnected.

[0014] In an exemplary embodiment, a second groove is provided on the side of the second filter layer near the third filter layer, and a third groove is provided on the side of the third filter layer near the second filter layer. The second groove and the third groove form the receiving space.

[0015] In an exemplary embodiment, the support structure and the third filter layer within the accommodating space formed by the second groove and the third groove are an integral structure connected to each other.

[0016] In an exemplary embodiment, the conductive layer is a transparent conductive layer.

[0017] In an exemplary embodiment, the color filter substrate further includes a second black matrix disposed on the side of the color filter layer away from the substrate. The surface of the second black matrix on the side away from the substrate is located in the same plane, and the plane is parallel to the second surface. The spacer pillar is disposed on the surface of the second black matrix on the side away from the substrate.

[0018] In an exemplary embodiment, the color filter substrate further includes a planarization layer disposed on the surface of the color filter layer away from the substrate. The surface of the planarization layer away from the substrate is located in the same plane and the plane is parallel to the second surface. The second black matrix is ​​disposed on the surface of the planarization layer away from the substrate.

[0019] This disclosure also provides a display device, including an array substrate, the aforementioned color filter substrate, and a liquid crystal layer disposed between the array substrate and the color filter substrate.

[0020] This disclosure also provides a method for fabricating a color filter substrate, the color filter substrate comprising a substrate, a conductive layer, a color filter layer, and a plurality of spacer pillars, the substrate comprising a first surface and a second surface that are opposite to each other; the fabrication method comprising: The conductive layer is formed on the first surface of the substrate; The color filter layer is formed on the second surface of the substrate; The septum pillars are formed on the side of the color filter layer away from the substrate, and a plurality of the septum pillars are disposed on a surface parallel to the second surface.

[0021] This exemplary embodiment discloses a color filter substrate and its preparation method, as well as a display device. By placing the spacer pillars on a surface parallel to the second surface of the substrate, the uniformity of the spacer pillars (PS) is effectively improved, effectively solving the problems of poor uniformity of spacer pillars in existing liquid crystal display panels.

[0022] After reading and understanding the accompanying diagrams and detailed descriptions, the other aspects can be understood. Attached Figure Description

[0023] The accompanying drawings are provided to further illustrate the technical solutions of this disclosure and form part of the specification. They are used together with the embodiments of this disclosure to explain the technical solutions of this disclosure and do not constitute a limitation on the technical solutions of this disclosure. The shapes and sizes of the components in the drawings do not reflect actual proportions and are only intended to illustrate the content of this disclosure.

[0024] Figure 1 This is a schematic diagram of the structure of a display device; Figure 2 This is a schematic diagram of the planar structure of a display device; Figure 3 This is a schematic cross-sectional view of a display device; Figure 4A This is a schematic diagram of the structure of a color filter substrate, which is an exemplary embodiment of the present disclosure. Figure 4B for Figure 4A Schematic diagram of the cross-sectional structure along the AA direction; Figure 5A for Figure 4A The diagram shown is a schematic diagram of the color filter substrate after the first black matrix pattern has been formed; Figure 5B for Figure 5A Schematic diagram of the cross-sectional structure along the CC direction; Figure 6A for Figure 4A A schematic diagram of the planar structure of the color filter substrate after the first filter layer pattern is formed in the embodiment shown; Figure 6B for Figure 6A Schematic diagram of the cross-sectional structure along the AA direction; Figure 6C for Figure 6A Schematic diagram of the cross-sectional structure along the CC direction; Figure 7A for Figure 4A The schematic diagram of the planar structure of the color filter substrate after the second filter layer pattern is formed in the embodiment shown; Figure 7B for Figure 7A Schematic diagram of the cross-sectional structure along the AA direction; Figure 7C for Figure 7A Schematic diagram of the cross-sectional structure along the CC direction; Figure 8A for Figure 4A The diagram shows a planar structure of the color filter substrate after the third filter layer pattern is formed in the embodiment shown. Figure 8B for Figure 8A Schematic diagram of the cross-sectional structure along the AA direction; Figure 8C for Figure 8A Schematic diagram of the cross-sectional structure along the CC direction; Figure 9A This is a schematic diagram of the structure of another color filter substrate as an exemplary embodiment of the present disclosure; Figure 9B for Figure 9A Schematic diagram of the cross-sectional structure along the DD direction; Figure 10 for Figure 9A The diagram shown is a schematic diagram of the color filter substrate after the transparent conductive layer pattern has been formed. Figure 11A for Figure 9A A schematic diagram of the planar structure of the color filter substrate after the first filter layer pattern is formed in the embodiment shown; Figure 11B for Figure 11A Schematic diagram of the cross-sectional structure along the DD direction; Figure 12A for Figure 9A The schematic diagram of the planar structure of the color filter substrate after the second filter layer pattern is formed in the embodiment shown; Figure 12B for Figure 12A Schematic diagram of the cross-sectional structure along the DD direction; Figure 13A for Figure 9A The diagram shows a planar structure of the color filter substrate after the third filter layer pattern is formed in the embodiment shown. Figure 13B for Figure 13A Schematic diagram of the cross-sectional structure along the DD direction; Figure 14 for Figure 9A The diagram shown is a schematic diagram of the color filter substrate after the planarization layer pattern has been formed; Figure 15 for Figure 9A The illustrated embodiment is a schematic diagram of the halftone mask used to form the second black matrix and spacer column pattern.

[0025] Explanation of reference numerals in the attached figures: 10 - Substrate; 11 - First surface; 12 - Second surface; 21-First black matrix; 211-First structural part; 212-Second structural part; 22-Second Black Matrix; 221-Third Structural Part; 222-Fourth Structural Part; 23 - Transmitting area; 31 - First filter layer; 32 - Second filter layer; 33 - Third filter layer; 34 - Support structure; 41 - Spacing column; 411 - Main septum post; 412 - Secondary septum post; 50 - Transparent conductive layer; 60 - Planarization layer; 100 - First substrate; 101 - First base layer; 102 - First structural layer; 200 - Second substrate; 201 - Second base; 202 - Second structural layer; 300 - Liquid crystal layer. Detailed Implementation

[0026] To make the objectives, technical solutions, and advantages of this disclosure clearer, embodiments of this disclosure will be described in detail below with reference to the accompanying drawings. Note that the implementation methods can be carried out in many different forms. Those skilled in the art will readily understand that the methods and content can be varied in various forms without departing from the spirit and scope of this disclosure. Therefore, this disclosure should not be construed as limited to the content described in the following embodiments. Without conflict, the embodiments and features in the embodiments of this disclosure can be arbitrarily combined with each other.

[0027] The scale of the figures in this disclosure can be used as a reference in actual manufacturing processes, but is not limited thereto. For example, the aspect ratio of the channel, the thickness and spacing of each film layer, and the width and spacing of each signal line can be adjusted according to actual needs. The number of pixels in the display substrate and the number of sub-pixels in each pixel are not limited to the quantities shown in the figures. The figures described in this disclosure are only schematic diagrams of the structure, and one aspect of this disclosure is not limited to the shapes or values ​​shown in the figures.

[0028] The ordinal numbers “first,” “second,” and “third” used in this specification are used to avoid confusion among the constituent elements, not to limit their quantity.

[0029] In this specification, for convenience, terms such as "middle," "upper," "lower," "front," "rear," "vertical," "horizontal," "top," "bottom," "inner," and "outer" are used to indicate orientation or positional relationships in conjunction with the accompanying drawings. This is solely for the purpose of facilitating the description and simplification, and does not imply that the device or component referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation of this disclosure. The positional relationships of the constituent elements may be appropriately varied depending on the orientation of each constituent element being described. Therefore, the use of terms not limited to those described in the specification may be appropriately replaced as needed.

[0030] In this specification, unless otherwise expressly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they may refer to a fixed connection, a detachable connection, or an integral connection; a mechanical connection or an electrical connection; a direct connection, an indirect connection via an intermediate component, or a connection within two components. Those skilled in the art will understand the specific meaning of these terms in this disclosure based on the specific circumstances.

[0031] In this specification, a transistor is a device that includes at least three terminals: a gate electrode, a drain electrode, and a source electrode. A transistor has a channel region between the drain electrode (drain electrode terminal, drain region, or drain electrode) and the source electrode (source electrode terminal, source region, or source electrode), and current can flow through the drain electrode, the channel region, and the source electrode. Note that in this specification, the channel region refers to the area through which current primarily flows.

[0032] In this specification, the first electrode can be the drain electrode and the second electrode can be the source electrode, or vice versa. In cases where transistors with opposite polarities are used or the current direction changes during circuit operation, the functions of the "source electrode" and "drain electrode" may sometimes be interchanged. Therefore, in this specification, the "source electrode" and "drain electrode" can be interchanged, and the "source terminal" and "drain terminal" can be interchanged.

[0033] In this specification, "electrical connection" includes the situation where components are connected together by elements that have a certain electrical function. There are no particular limitations on what constitutes an "electrical function," as long as it allows for the transmission and reception of electrical signals between the connected components. Examples of "electrical functions" include not only electrodes and wiring, but also switching elements such as transistors, resistors, inductors, capacitors, and other elements with various functions.

[0034] In this specification, "parallel" refers to two straight lines forming an angle of -10° or more and less than 10°, and therefore also includes angles of -5° or more and less than 5°. Similarly, "perpendicular" refers to two straight lines forming an angle of 80° or more and less than 100°, and therefore also includes angles of 85° or more and less than 95°.

[0035] In this specification, the terms "film" and "layer" may be interchanged. For example, "conductive layer" may sometimes be replaced with "conductive film." Similarly, "insulating film" may sometimes be replaced with "insulating layer."

[0036] In this specification, triangles, rectangles, trapezoids, pentagons, or hexagons are not strictly defined; they can be approximate triangles, rectangles, trapezoids, pentagons, or hexagons, and may have minor deformations due to tolerances, and may include chamfers, curved edges, and other variations. The term "approximately" in this disclosure means that the limits are not strictly defined, and the values ​​are within the allowable range of process and measurement errors.

[0037] Figure 1 This is a schematic diagram of the structure of a display device. Figure 1As shown, the display device may include a display area and a border area. The display area may include multiple scan signal lines (S1 to Sm), multiple data signal lines (D1 to Dn), multiple common electrode lines (E1 to Eo), and a pixel array, where m, n, and o can be positive integers. The multiple scan signal lines may extend along a first direction X and be sequentially arranged in a second direction Y, the multiple data signal lines may extend along the second direction Y and be sequentially arranged in the first direction X, and the multiple common electrode lines may extend along the first direction X and be sequentially arranged in the second direction Y. The first direction X and the second direction Y may intersect, and the intersecting multiple scan signal lines and multiple data signal lines define multiple regularly arranged sub-pixels Pxij, where i and j can be positive integers. At least one sub-pixel Pxij may include a transistor, a pixel electrode, and a common electrode. The multiple scan signal lines and multiple data signal lines are respectively connected to the transistors in the multiple sub-pixels, the multiple common electrode lines are respectively connected to the common electrodes in the multiple sub-pixels, and the transistor in each sub-pixel is connected to the pixel electrode of the sub-pixel. Multiple scan signal lines can be led out to the bezel area and connected to the scan driver. Multiple data signal lines can be led out to the bezel area and connected to the data driver. At least a portion of the scan driver and the data driver can be formed on the bezel area of ​​the display substrate. An external control device (such as a timing controller) can provide grayscale values ​​and control signals of specifications suitable for the data driver to the data driver. The data driver can use the received grayscale values ​​and control signals to generate data voltages to be provided to the data signal lines D1, D2, D3, ..., Dn. The external control device can provide clock signals, scan start signals, etc., of specifications suitable for the scan driver to the scan driver. The scan driver can use the clock signals, scan start signals, etc., to generate scan signals to be provided to the scan signal lines S1, S2, S3, ..., Sm.

[0038] Figure 2 This is a schematic diagram of a planar structure of a display device. Figure 2As shown, the display device may include a plurality of pixel units P arranged in a matrix. At least one of the plurality of pixel units P includes a first sub-pixel P1 emitting a first color light, a second sub-pixel P2 emitting a second color light, and a third sub-pixel P3 emitting a third color light. Each of the three sub-pixels may include a thin-film transistor, a pixel electrode, and a common electrode. In an exemplary embodiment, the first sub-pixel P1 may be a red sub-pixel emitting red (R) light, the second sub-pixel P2 may be a green sub-pixel emitting green (G) light, and the third sub-pixel P3 may be a blue sub-pixel emitting blue (B) light. The shape of the sub-pixels in the pixel unit may be rectangular, rhomboid, pentagonal, or hexagonal, etc. The sub-pixels in the pixel unit may be arranged horizontally side by side, vertically side by side, or in a triangular arrangement, which is not limited herein. In an exemplary embodiment, the pixel unit may include four sub-pixels, which is not limited herein.

[0039] Figure 3 This is a schematic cross-sectional view of a display device. Figure 3 As shown, the display device may include a first substrate 100 and a second substrate 200 disposed opposite to each other, and a liquid crystal layer 300 disposed between the first substrate 100 and the second substrate 200. The first substrate 100 may include a first structural layer 102 disposed on the side of the first substrate 101 facing the second substrate 200, and the second substrate 200 may include a second structural layer 202 disposed on the side of the second substrate 201 facing the first substrate 100. LCDs can be classified according to display mode into Twisted Nematic (TN) display mode, In Plane Switching (IPS) display mode, Fringe Field Switching (FFS) display mode, and Advanced Super Dimension Switching (ADS) display mode, etc. For the ADS display mode, in an exemplary embodiment, the first structural layer 102 may include scan signal lines, data signal lines, thin film transistors, pixel electrodes, and common electrodes, and the second structural layer 202 may include a black matrix and a filter unit. The first substrate 100 may be referred to as an array substrate, and the second substrate 200 may be referred to as a color filter substrate.

[0040] This disclosure provides a color filter substrate, including a substrate, a conductive layer, a color filter layer, and a plurality of spacer pillars. The substrate includes a first surface and a second surface that are opposite to each other. The conductive layer is disposed on the first surface of the substrate, the color filter layer is disposed on the second surface of the substrate, and the spacer pillars are disposed on the side of the color filter layer away from the substrate. The plurality of spacer pillars are disposed on a surface parallel to the second surface.

[0041] The color filter substrate of this disclosure will be illustrated by some exemplary embodiments below.

[0042] Figure 4A and Figure 4B This is a schematic diagram of the structure of a color filter substrate according to an exemplary embodiment of the present disclosure. Figure 4B for Figure 4A A cross-sectional view along the AA direction. (e.g., 4A and...) Figure 4B As shown, the color filter substrate may include at least a substrate 10, a conductive layer, a color filter layer, and a plurality of spacer pillars 41. The substrate 10 may include a flush first surface 11 and a second surface 12, which are opposite to each other and may be parallel to each other. The conductive layer may be a first black matrix 21, which may be disposed on the first surface 11 of the substrate 10. The color filter layer may be disposed on the second surface 12 of the substrate 10. The plurality of spacer pillars 41 may be disposed on the side of the color filter layer away from the substrate.

[0043] In an exemplary embodiment, the first black matrix 21 may be made of any one or more of the following metallic materials: silver (Ag), copper (Cu), aluminum (Al), titanium (Ti) and molybdenum (Mo), or alloys of the above metals, such as aluminum-neodymium alloy (AlNd) or molybdenum-niobium alloy (MoNb). It may be a single-layer structure or a multi-layer composite structure, such as Mo / Al / Mo.

[0044] In an exemplary embodiment, the color filter layer may include a first filter layer 31, a second filter layer 32, a third filter layer 33, and a plurality of support structures 34. The surfaces of the plurality of support structures 34 on the side away from the substrate are located in the same plane, and the plane is parallel to the second surface 12. Spacing posts 41 are disposed on the surface of the support structures 34 on the side away from the substrate.

[0045] In an exemplary embodiment, a first filter layer 31 may be disposed on a first sub-pixel P1 and configured to filter light so that the first sub-pixel P1 emits light of a first color. A second filter layer 32 may be disposed on a second sub-pixel P2 and configured to filter light so that the second sub-pixel P2 emits light of a second color. A third filter layer 33 may be disposed on a third sub-pixel P3 and configured to filter light so that the third sub-pixel P3 emits light of a third color. The orthographic projections of the first filter layer 31 and the second filter layer 32 on the substrate at least partially overlap, and the orthographic projections of the first filter layer 31 and the third filter layer 33 on the substrate at least partially overlap.

[0046] In an exemplary embodiment, at least one first groove K1 may be provided on the first filter layer 31, at least one second groove K2 may be provided on the second filter layer 32, and at least one third groove K3 may be provided on the third filter layer 33. The first, second, and third grooves all expose the second surface of the substrate 10. The second groove on the second filter layer 32 near the first filter layer 31 and the first groove on the first filter layer 31 near the second filter layer 32 can form a closed receiving space K0; the third groove on the third filter layer 33 near the first filter layer 31 and the first groove on the first filter layer 31 near the third filter layer 33 can form a closed receiving space K0; the third groove on the third filter layer 33 near the second filter layer 32 and the second groove on the second filter layer 32 near the third filter layer 33 can form a closed receiving space K0.

[0047] In an exemplary embodiment, the support structure 34 may be disposed on the second surface of the base 10 exposed within the receiving space K0. Since the second surface of the base is a flush surface, the surfaces of the multiple support structures away from the base may lie in the same plane, and this plane is parallel to the second surface, thereby the multiple spacer pillars are disposed on a surface parallel to the second surface.

[0048] In an exemplary embodiment, the support structure 34 and the third filter layer 33 within the accommodating space K0 formed by the first and third grooves can be an integral structure connected to each other, and the support structure 34 and the third filter layer 33 within the accommodating space K0 formed by the second and third grooves can be an integral structure connected to each other.

[0049] The following is an illustrative description of the fabrication process of a color filter substrate. The "patterning process" described in this disclosure, for metallic, inorganic, or transparent conductive materials, includes processes such as depositing a film layer, coating the film layer with photoresist, mask exposure, development, etching, and photoresist stripping; for organic materials, it includes processes such as coating the organic material, mask exposure, and development. Deposition can be performed using any one or more of sputtering, evaporation, and chemical vapor deposition; coating can be performed using any one or more of spraying, spin coating, and inkjet printing; etching can be performed using any one or more of dry etching and wet etching. This disclosure does not limit the methods used. A "thin film" refers to a thin film made of a certain material on a substrate using deposition, coating, or other processes. If the "thin film" does not require a patterning process during the entire fabrication process, it can also be called a "layer." If the "thin film" requires a patterning process during the entire fabrication process, it is called a "thin film" before the patterning process and a "layer" after the patterning process. The "layer" after the patterning process contains at least one "pattern." The phrase "A and B are arranged in the same layer" in this disclosure means that A and B are formed simultaneously through the same patterning process, and the "thickness" of the film layer is the dimension of the film layer in the direction perpendicular to the color filter substrate. In the exemplary embodiments of this disclosure, "the orthographic projection of A includes the orthographic projection of B" or "the orthographic projection of B is within the range of the orthographic projection of A" means that the boundary of the orthographic projection of B falls within the boundary range of the orthographic projection of A, or the boundary of the orthographic projection of A overlaps with the boundary of the orthographic projection of B.

[0050] In an exemplary embodiment, the fabrication process of the color filter substrate in this embodiment may include the following operations.

[0051] (1) Forming a first black matrix pattern. In an exemplary embodiment, forming the first black matrix pattern may include: depositing a first black matrix film on the first surface 11 of the substrate 10, and patterning the first black matrix film using a patterning process to form a first black matrix 21 pattern disposed on the first surface 11 of the substrate 10, such as... Figure 5A and Figure 5B As shown, Figure 5B for Figure 5A Cross-sectional view along the CC direction. Figure 5B The view is flipped to show the preparation process.

[0052] In an exemplary embodiment, the substrate 10 may include a first surface 11 and a second surface 12 that are flush with each other, and the first surface 11 and the second surface 12 may be opposite to each other and parallel to each other. The first surface 11 of the substrate 10 may be the surface of the substrate 10 away from the liquid crystal layer, and the second surface 12 may be the surface of the substrate 10 close to the liquid crystal layer.

[0053] In an exemplary embodiment, the first black matrix 21 pattern can be grid-like in shape and may include a plurality of first structural portions 211 and a plurality of second structural portions 212. The shape of the first structural portion 211 can be a straight line or a broken line extending along the pixel row direction, and the plurality of first structural portions 211 can be arranged at intervals along the pixel column direction. The shape of the second structural portion 212 can be a straight line or a broken line extending along the pixel column direction, and the plurality of second structural portions 212 can be arranged at intervals along the pixel row direction. The plurality of first structural portions 211 and the plurality of second structural portions 212 are interconnected to form a grid, and the locations where the plurality of first structural portions 211 and the plurality of second structural portions 212 are interconnected can form a plurality of first connection nodes R1. Two adjacent first structural portions 211 and two adjacent second structural portions 212 enclose a light-transmitting area 23.

[0054] In an exemplary embodiment, the first black matrix 21 may be made of any one or more of the following metallic materials: silver (Ag), copper (Cu), aluminum (Al), titanium (Ti) and molybdenum (Mo), or alloys of the above metals, such as aluminum-neodymium alloy (AlNd) or molybdenum-niobium alloy (MoNb). It may be a single-layer structure or a multi-layer composite structure, such as Mo / Al / Mo.

[0055] In an exemplary embodiment, the first black matrix layer 21 of this embodiment is configured on the one hand to block the scan signal lines and data signal lines on the array substrate, and on the other hand to discharge static electricity and prevent electrostatic damage.

[0056] In an exemplary embodiment, the substrate 10 may be a glass substrate, such as... Figure 5A and Figure 5B As shown, depositing a first black matrix thin film and patterning the first black matrix thin film through a patterning process can include: (A1) Cleaning before coating: Clean the glass substrate before coating to remove contaminants such as particles and oil on the surface of the glass substrate, and ensure that the glass substrate is in a clean and dry state. (A2) Vacuum coating: Conductive material is deposited on the entire surface of the first surface 11 of the glass substrate 10 by magnetron sputtering in a vacuum environment to form a uniform conductive film. (A3) Photoresist coating: A layer of photosensitive photoresist is uniformly coated on the surface of the conductive film; (A4) Exposure: Using a mask, ultraviolet light is selectively used to irradiate the photoresist, causing a chemical change in the photoresist at the position where the first black matrix 21 pattern (BM pattern, i.e., the opaque grid area) needs to be retained; (A5) Development: Use developer to remove the photoresist in the unexposed or exposed areas (depending on the type of photoresist), leaving a protective layer that is completely consistent with the BM pattern; (A6) Etching: The conductive film not covered by photoresist is removed by an acidic etching solution, while the conductive film in the protected BM pattern area is retained; (A7) Stripping: Remove the remaining photoresist (i.e., remove the photoresist in the first black matrix pattern area) to accurately replicate the first black matrix 21 pattern (BM Pattern) on the first surface 11 of the glass substrate 10.

[0057] (2) Forming a first filter layer pattern. In an exemplary embodiment, forming the first filter layer pattern may include: forming the first filter layer pattern on the second surface 12 of the substrate 10, such as... Figure 6A , Figure 6B and Figure 6C As shown, Figure 6B for Figure 6A Cross-sectional view along the AA direction. Figure 6C for Figure 6A Cross-sectional view along the CC direction.

[0058] In an exemplary embodiment, the first filter layer 31 may be disposed on the first sub-pixel P1 and configured to cause the first sub-pixel P1 to emit first color light through filtering.

[0059] In an exemplary embodiment, the orthographic projection of the first filter layer 31 onto the substrate may include the light-transmitting region 23 in the first sub-pixel P1. Figure 6A The location of the light-transmitting area 23 is not shown in the diagram, but its location can be referenced. Figure 5A The orthographic projection of the image onto the substrate.

[0060] In an exemplary embodiment, at least one first groove K1 may be provided on the first filter layer 31, and the first groove K1 exposes the second surface of the substrate 10. The shape of the first groove K1 may be block-shaped (such as rectangular), and it may be provided on the edges on both sides of the pixel row direction of the first filter layer 31.

[0061] In an exemplary embodiment, at least a portion of the orthographic projection of the first groove K1 on the substrate overlaps with the orthographic projection of the first black matrix 21 on the substrate.

[0062] In some possible implementations, the position of the first groove K1 may correspond to the position of the first connecting node R1 on the first black matrix 21.

[0063] In an exemplary embodiment, the first filter layer 31 may be made of a color photosensitive resin composition material, such as a pigment-dispersed photoresist, a dye-type photoresist, or a mixed photoresist of pigments and dyes.

[0064] In an exemplary embodiment, the first filter layer 31 may be a red (R) filter layer; the process of preparing the pattern of the first filter layer may include: (B1) Glass substrate cleaning: Remove particles, oil and organic residues from the second surface 12 of the glass substrate 10 using cleaning equipment to ensure that the second surface 12 of the glass substrate 10 is clean and dry, so as to provide good adhesion for subsequent coating.

[0065] (B2) Photoresist Coating: A red photoresist material is uniformly coated on one side of the second surface 12 of the cleaned glass substrate 10. The photoresist can be a photosensitive resin containing a red pigment. The coating method can be spin coating or slot coating to control the uniformity of film thickness.

[0066] (B3) Reduced pressure drying: The glass substrate coated with red photoresist is placed in a reduced pressure environment. The low pressure accelerates the evaporation of the solvent in the photoresist, initially forming a solid film, preventing bubbles or uneven film surface during subsequent high-temperature baking.

[0067] (B4) Pre-baking: The glass substrate after vacuum drying is pre-baked on a hot plate to further remove residual solvent, so that the photoresist film layer is cured and its thickness is stabilized, while enhancing the adhesion between the photoresist and the substrate to form a red photoresist layer.

[0068] (B5) Exposure: The aforementioned red photoresist layer is selectively exposed using a photomask. The photomask is designed with a light-transmitting pattern of the first sub-pixel (red sub-pixel). Ultraviolet light passes through the photomask and irradiates the photoresist, causing a photochemical reaction in the exposed area (for positive photoresist, the exposed area becomes soluble; for negative photoresist, the exposed area cross-links and solidifies).

[0069] (B6) Development: Immerse the exposed glass substrate in the developer to remove the photoresist in the soluble areas, leaving the unexposed (or exposed, depending on the type of photoresist) photoresist to form the first filter layer pattern.

[0070] (B7) Curing: The first filter layer pattern after development is finally cured by baking at high temperature to make it fully cross-linked and hardened, thereby improving its heat resistance, chemical resistance and mechanical strength, and ensuring its stability in subsequent processes.

[0071] (3) Forming a second filter layer pattern. In an exemplary embodiment, forming the second filter layer pattern may include: forming the second filter layer pattern on the second surface 12 of the substrate 10 on the substrate on which the aforementioned pattern is formed, such as... Figure 7A , Figure 7B and Figure 7C As shown, Figure 7B for Figure 7A Cross-sectional view along the AA direction. Figure 7C for Figure 7A Cross-sectional view along the CC direction.

[0072] In an exemplary embodiment, the second filter layer 32 may be disposed on the second sub-pixel P2 and configured to cause the second sub-pixel P2 to emit second color light through filtering.

[0073] In an exemplary embodiment, the orthogonal projection of the second filter layer 32 onto the substrate may include the light-transmitting region 23 in the second sub-pixel P2. Figure 7A The location of the light-transmitting area 23 is not shown in the diagram, but its location can be referenced. Figure 5A The orthographic projection of the image onto the substrate.

[0074] In an exemplary embodiment, the orthographic projection of the second filter layer 32 on the substrate and the orthographic projection of the first filter layer 31 on the substrate may at least partially overlap, that is, the edge region of the second filter layer 32 and the edge region of the first filter layer 31 may overlap.

[0075] In other embodiments, the orthographic projection of the second filter layer 32 on the substrate and the orthographic projection of the first filter layer 31 on the substrate may not overlap, and the edge regions of the second filter layer 32 and the edge regions of the first filter layer 31 may be as close as possible (just close or with a small gap), which is not limited in this disclosure.

[0076] In an exemplary embodiment, at least one second groove K2 may be provided on the second filter layer 32, and the second groove K2 exposes the second surface of the substrate 10. The shape of the second groove K2 may be block-shaped (such as rectangular), and it may be provided on the edges on both sides of the second filter layer 32 in the pixel row direction.

[0077] In an exemplary embodiment, the second groove K2 on the second filter layer 32 near the first filter layer 31 and the first groove K1 on the first filter layer 31 near the second filter layer 32 can form a closed receiving space K0, which can be configured to accommodate a subsequently formed support structure.

[0078] In an exemplary embodiment, the orthographic projection of the second groove K2 on the substrate at least partially overlaps with the orthographic projection of the first black matrix 21 on the substrate.

[0079] In some possible implementations, the position of the second groove K2 may correspond to the position of the first connecting node R1 on the first black matrix 21.

[0080] In an exemplary embodiment, the second filter layer 32 may be made of a color photosensitive resin composition material, such as a pigment-dispersed photoresist, a dye-type photoresist, or a mixed photoresist of pigments and dyes.

[0081] In an exemplary embodiment, the second filter layer 32 may be a green (G) filter layer; the preparation process of the second filter layer pattern may be substantially the same as the above steps (B2) to (B7), and will not be repeated here.

[0082] (4) Forming a third filter layer and a support structure pattern. In an exemplary embodiment, forming the third filter layer and the support structure pattern may include: forming the third filter layer and the support structure pattern on the second surface 12 of the substrate 10 on the substrate on which the aforementioned pattern is formed, such as... Figure 8A , Figure 8B and Figure 8C As shown, Figure 8B for Figure 8A Cross-sectional view along the AA direction. Figure 8C for Figure 8A Cross-sectional view along the CC direction.

[0083] In an exemplary embodiment, the third filter layer 33 may be disposed on the third sub-pixel P3 and configured to cause the third sub-pixel P3 to emit third color light through filtering.

[0084] In an exemplary embodiment, the orthogonal projection of the third filter layer 33 onto the substrate may include the light-transmitting region 23 in the third sub-pixel P3. Figure 8A The location of the light-transmitting area 23 is not shown in the diagram, but its location can be referenced. Figure 5A The orthographic projection of the image onto the substrate.

[0085] In an exemplary embodiment, the orthographic projection of the third filter layer 33 onto the substrate and the orthographic projection of the first filter layer 31 onto the substrate can at least partially overlap, that is, the edge regions of the third filter layer 33 and the first filter layer 31 can overlap. In another exemplary embodiment, the orthographic projection of the third filter layer 33 onto the substrate and the orthographic projection of the second filter layer 32 onto the substrate can at least partially overlap, that is, the edge regions of the third filter layer 33 and the second filter layer 32 can overlap. Because the edge regions of the first filter layer 31, the second filter layer 32, and the third filter layer 33 overlap, the overlapping areas form a physical barrier, effectively blocking light leakage and reducing the dependence on the accuracy of the black matrix, thereby improving display contrast while maintaining a high aperture ratio.

[0086] In other embodiments, the orthographic projection of the third filter layer 33 on the substrate and the orthographic projection of the first filter layer 31 on the substrate may not overlap, and the edge regions of the third filter layer 33 and the edge regions of the first filter layer 31 are as close as possible to each other; the orthographic projection of the third filter layer 33 on the substrate and the orthographic projection of the second filter layer 32 on the substrate may also not overlap, and the edge regions of the third filter layer 33 and the edge regions of the second filter layer 32 are as close as possible to each other; this disclosure does not limit this.

[0087] In an exemplary embodiment, at least one third groove K3 may be provided on the third filter layer 33, and the third groove K3 exposes the second surface of the substrate 10. The shape of the third groove K3 may be block-shaped (such as rectangular), and it may be provided on the edges on both sides of the pixel row direction of the third filter layer 33.

[0088] In an exemplary embodiment, the third groove K3 on the third filter layer 33 near the side of the first filter layer 31 and the first groove K1 on the first filter layer 31 near the side of the third filter layer 33 can form a closed receiving space K0, which can be configured to accommodate the support structure 34.

[0089] In an exemplary embodiment, the third groove K3 on the third filter layer 33 near the side of the second filter layer 32 and the second groove K2 on the second filter layer 32 near the side of the third filter layer 33 can form a closed receiving space K0, which can be configured to accommodate the support structure 34.

[0090] In an exemplary embodiment, the orthographic projection of the third groove K3 on the substrate at least partially overlaps with the orthographic projection of the first black matrix 21 on the substrate.

[0091] In some possible implementations, the position of the third groove K3 may correspond to the position of the first connecting node R1 on the first black matrix 21.

[0092] In an exemplary embodiment, the support structure 34 may be disposed on the second surface of the exposed base 10 within the receiving space K0, and the plurality of support structures 34 have the same thickness. Since the second surface 12 of the base 10 is a flush surface, the surfaces of the plurality of support structures 34 on the side away from the base are located in the same plane, and this plane is parallel to the second surface 12.

[0093] In an exemplary embodiment, at least part of the support structure 34 and the adjacent third filter layer 33 can be an integral structure interconnected. In some possible embodiments, the support structure 34 and the third filter layer 33 within the receiving space K0 formed by the first groove K1 and the third groove K3, and within the receiving space K0 formed by the second groove K2 and the third groove K3, can be an integral structure interconnected.

[0094] In an exemplary embodiment, the orthographic projection of the support structure 34 onto the substrate at least partially overlaps with the orthographic projection of the first black matrix 21 onto the substrate.

[0095] In some possible implementations, the position of the support structure 34 may correspond to the position of the first connecting node R1 on the first black matrix 21.

[0096] In an exemplary embodiment, the third filter layer 33 may be made of a color photosensitive resin composition material, such as a pigment-dispersed photoresist, a dye-type photoresist, or a mixed photoresist of pigments and dyes.

[0097] In the exemplary embodiment, the aforementioned preparation process is described only with the first filter layer 31 being a red (R) filter layer, the second filter layer 32 being a green (G) filter layer, and the third filter layer 33 being a blue (B) filter layer, respectively, but it is not limited thereto. For example, the first filter layer 31 can be a green (G) filter layer, the second filter layer 32 can be a red (R) filter layer, and the third filter layer 33 can be a blue (B) filter layer. As another example, the first filter layer 31 can be a blue (B) filter layer, the second filter layer 32 can be a red (R) filter layer, and the third filter layer 33 can be a green (G) filter layer. Yet another example, the first filter layer 31 can be a blue (B) filter layer, the second filter layer 32 can be a green (G) filter layer, and the third filter layer 33 can be a red (R) filter layer.

[0098] In some possible implementations, the support structure may be fabricated simultaneously with the first filter layer and be an integral structure interconnected with it, or the support structure may be fabricated simultaneously with the second filter layer and be an integral structure interconnected with it, which is not limited herein.

[0099] (5) Forming a septum pillar layer pattern. In an exemplary embodiment, forming a septum pillar layer pattern may include: depositing a septum pillar film on a substrate on which the aforementioned pattern is formed, and patterning the septum pillar film using a patterning process to form a septum pillar layer pattern disposed on the color filter layer, such as... Figure 4A and Figure 4B As shown, Figure 4B for Figure 4A Cross-sectional view along the AA direction.

[0100] In an exemplary embodiment, the septum column layer pattern may include a plurality of septum columns 41, the positions of the plurality of septum columns 41 may correspond one-to-one with the positions of the plurality of support structures 34, and the septum columns 41 are disposed on the surface of the support structure 34 away from the substrate.

[0101] In an exemplary embodiment, the orthographic projection of the septum post 41 onto the substrate may be within the range of the orthographic projection of the support structure 34 onto the substrate.

[0102] In an exemplary embodiment, the septum pillar layer may be made of a photosensitive organic resin material, such as any one or more of polyimide (PI), polymethyl methacrylate (PMMA), or epoxy resin-based photoresist.

[0103] Existing liquid crystal display panels suffer from problems such as poor uniformity. The inventors of this application have discovered that this problem primarily stems from the fact that in existing color filter layer designs, the black matrix is ​​fabricated before the color filter layer, with the color filter layer located on the side of the black matrix furthest from the substrate. This creates a step difference in the overlapping area between the color filter layer and the black matrix pattern, leading to inconsistent heights of the subsequently formed spacer pillars. This severely affects the uniformity of the spacer pillar layer, further exacerbating dark not uniformity (DNU) and reducing product yield.

[0104] An exemplary embodiment of this disclosure provides a color filter substrate in which a support structure is provided and spacer pillars are disposed on a flat surface of the support structure away from the substrate. This avoids the inconsistency in the height of the spacer pillars caused by the film layer difference, effectively improves the uniformity of the spacer pillars, and effectively solves the problem of poor uniformity of spacer pillars in existing liquid crystal display panels. In this way, it can improve the unevenness of dark states and improve the product yield.

[0105] In this embodiment, the color filter substrate utilizes a support structure to achieve uniformity of the spacer pillars, thus eliminating the need for an overcoat (OC) layer, reducing the number of film layers, and effectively lowering production costs.

[0106] In this embodiment, the color filter substrate has a black matrix disposed on the side of the substrate away from the color filter layer. Since the black matrix is ​​made of metal, there is no need to set a transparent conductive layer. While effectively ensuring the antistatic performance of the color filter substrate, the number of film layers can be reduced, which can effectively reduce production costs.

[0107] In some possible implementations, the color filter substrate of this embodiment may not have a support structure, and the spacer pillars may be directly placed on the second surface within the accommodating space. This disclosure does not limit the scope of the invention.

[0108] Figure 9A , Figure 9B This is a schematic diagram of the structure of another color filter substrate according to an exemplary embodiment of the present disclosure. Figure 9B for Figure 9A A cross-sectional view along the DD direction. (See attached image.) Figure 9A , Figure 9BAs shown, the color filter substrate may include at least a substrate 10, a conductive layer, a color filter layer, a planarization layer 60, a second black matrix 22, and a plurality of spacer pillars 41. The substrate 10 may include a flush first surface 11 and a second surface 12, which are opposite to each other and may be parallel to each other. The conductive layer may be a transparent conductive layer 50, which may be disposed on the first surface 11 of the substrate 10. The color filter layer may be disposed on the second surface 12 of the substrate 10. The planarization layer 60 may be disposed on the surface of the color filter layer away from the substrate 10. The second black matrix 22 may be disposed on the surface of the planarization layer 60 away from the substrate 10. The plurality of spacer pillars 41 may be disposed on the surface of the second black matrix 22 away from the substrate 10.

[0109] In an exemplary embodiment, the color filter layer may include a first filter layer 31, a second filter layer 32, and a third filter layer 33. The first filter layer 31 may be disposed on a first sub-pixel P1 and configured to filter light so that the first sub-pixel P1 emits first color light. The second filter layer 32 may be disposed on a second sub-pixel P2 and configured to filter light so that the second sub-pixel P2 emits second color light. The third filter layer 33 may be disposed on a third sub-pixel P3 and configured to filter light so that the third sub-pixel P3 emits third color light. The orthographic projections of the first filter layer 31 and the second filter layer 32 on the substrate at least partially overlap, and the orthographic projections of the first filter layer 31 and the third filter layer 33 on the substrate at least partially overlap.

[0110] In an exemplary embodiment, the surface of the planarization layer 60 away from the substrate lies in the same plane, and this plane is parallel to the second surface 12. The second black matrix 22 is disposed on the surface of the planarization layer 60 away from the substrate. The planarization layer 60 can smooth out the height difference caused by the overlap or inconsistent film thickness between different filter layers in the color filter layer, so that the surface of the planarization layer 60 away from the substrate is a flush surface parallel to the second surface, and the second black matrix 22 is located on this flush surface.

[0111] In an exemplary embodiment, the surface of the second black matrix 22 on the side away from the substrate lies in the same plane, and this plane is parallel to the second surface 12. A plurality of spacer pillars 41 are disposed on the surface of the second black matrix 22 on the side away from the substrate. Since the second black matrix 22 is disposed on a flush surface of the planarization layer 60 on the side away from the substrate 10, the surface of the second black matrix 22 on the side away from the substrate can lie in the same plane, and this plane is parallel to the second surface. Therefore, a plurality of spacer pillars are disposed on a surface parallel to the second surface.

[0112] In an exemplary embodiment, the second black matrix 22 and the spacer post 41 can be an integral structure that is interconnected, and the second black matrix 22 and the spacer post 41 can be made of an opaque photosensitive organic resin material.

[0113] In an exemplary embodiment, the fabrication process of the color filter substrate in this embodiment may include the following operations.

[0114] (21) Forming a transparent conductive layer. In an exemplary embodiment, forming a transparent conductive layer may include: depositing a transparent conductive film on the first surface 11 of the substrate 10 to form a pattern of transparent conductive layer 50 disposed on the first surface 11 of the substrate 10, such as... Figure 10 As shown, Figure 10 The view is flipped to show the preparation process.

[0115] In an exemplary embodiment, the substrate 10 may include a first surface 11 and a second surface 12 that are flush with each other, and the first surface 11 and the second surface 12 may be opposite to each other and parallel to each other. The first surface 11 of the substrate 10 may be the surface of the substrate 10 away from the liquid crystal layer, and the second surface 12 may be the surface of the substrate 10 close to the liquid crystal layer.

[0116] In an exemplary embodiment, the transparent conductive layer 50 may be made of indium tin oxide (ITO), indium zinc oxide (IZO), or zinc aluminum oxide, and the transparent conductive layer 50 is configured to release static electricity and prevent electrostatic discharge.

[0117] In an exemplary embodiment, the substrate 10 may be a glass substrate, and forming a transparent conductive layer may include: (C1) Cleaning before coating to remove particles, oil and other contaminants from the surface of the glass substrate, ensuring that the glass substrate is clean and dry; (C2) In the vacuum coating stage, conductive material is deposited on the entire surface of the first surface 11 of the glass substrate 10 by magnetron sputtering in a vacuum environment to form a uniform conductive film. (C3) Cleaning after coating to remove surface dust, particles or slight oxides that may be generated during the coating process; (C4) Sintering: In a protective atmosphere or vacuum environment, the substrate is heated to a set temperature to make the conductive film crystallize more completely, reduce the resistivity of the film layer, enhance the bonding strength between the transparent conductive layer and the glass substrate, and eliminate residual internal stress.

[0118] (22) Forming a first filter layer pattern. In an exemplary embodiment, forming the first filter layer pattern may include: forming the first filter layer pattern on the second surface 12 of the substrate 10, such as... Figure 11A and Figure 11B As shown, Figure 11B for Figure 11A Cross-sectional view along the DD direction.

[0119] In an exemplary embodiment, the formation process of the first filter layer and the resulting structure are similar to... Figure 4A and Figure 4B The embodiments shown can be substantially the same, except that the first groove K1 is not provided on the first filter layer 31.

[0120] (23) Forming a second filter layer pattern. In an exemplary embodiment, forming the second filter layer pattern may include: forming the second filter layer pattern on the second surface 12 of the substrate 10 on the substrate on which the aforementioned pattern is formed, such as... Figure 12A and Figure 12B As shown, Figure 12B for Figure 12A Cross-sectional view along the DD direction.

[0121] In an exemplary embodiment, the formation process and the resulting structure of the second filter layer are similar to those described above. Figure 4A and Figure 4B The embodiments shown can be substantially the same, except that the second groove K2 is not provided on the second filter layer 32.

[0122] (24) Forming a third filter layer pattern. In an exemplary embodiment, forming the third filter layer pattern may include: forming the third filter layer pattern on the second surface 12 of the substrate 10 on the substrate on which the aforementioned pattern is formed, such as... Figure 13A and Figure 13B As shown, Figure 13B for Figure 13A Cross-sectional view along the DD direction.

[0123] In an exemplary embodiment, the formation process and the resulting structure of the third filter layer are similar to those described above. Figure 4A and Figure 4B The embodiments shown can be substantially the same, except that the third filter layer 33 does not have a third groove K3 and does not include a support structure 34.

[0124] In an exemplary embodiment, the first filter layer 31, the second filter layer 32, and the third filter layer 33 may be a red (R) filter layer, a green (G) filter layer, and a blue (B) filter layer, respectively, but are not limited thereto. For example, the first filter layer 31 may be a green (G) filter layer, the second filter layer 32 may be a red (R) filter layer, and the third filter layer 33 may be a blue (B) filter layer, or the first filter layer 31 may be a blue (B) filter layer, the second filter layer 32 may be a red (R) filter layer, and the third filter layer 33 may be a green (G) filter layer, or the first filter layer 31 may be a blue (B) filter layer, the second filter layer 32 may be a green (G) filter layer, and the third filter layer 33 may be a red (R) filter layer.

[0125] (25) Forming a planarization layer pattern. In an exemplary embodiment, forming a planarization layer may include: coating a planarization film on a substrate on which the aforementioned pattern is formed to form a planarization layer 60 pattern disposed on the first filter layer, the second filter layer, and the third filter layer, such as... Figure 14 As shown.

[0126] In an exemplary embodiment, the planarization layer 60 may be made of organic materials, such as polyimide, acrylic, or polyethylene terephthalate.

[0127] In an exemplary embodiment, the surface of the planarization layer 60 away from the substrate lies in the same plane, and this plane is parallel to the second surface 12. The planarization layer 60 can smooth out the height difference caused by the overlap or inconsistent film thickness between different filter layers in the color filter layer, so that the surface of the planarization layer 60 away from the substrate is a flush surface parallel to the second surface, and the subsequently formed second black matrix 22 is located on this flush surface.

[0128] In an exemplary embodiment, forming a planarization layer 60 disposed on the color filter layer may include: (D1) Glass cleaning: Thoroughly clean the surface of the color film layer to remove residual particles, organic matter and impurities from the previous process, ensuring good adhesion between the planarization layer material and the color film layer; (D2) Photoresist coating, for example, spin coating or slot coating can be used to uniformly coat an organic photoresist material with high light transmittance and leveling properties on the surface of the color filter layer away from the substrate 10. (D3) Reduced pressure drying, for example, the coated substrate can be gently dried in a reduced pressure (vacuum) environment to quickly remove most of the solvent in the photoresist, prevent uneven film thickness caused by airflow disturbance, and suppress edge buildup effect. (D4) Pre-baking, for example, the substrate can be pre-baked on a heating plate or in a hot air circulating oven to further evaporate residual solvents, improve the mechanical strength and uniformity of the photoresist layer, and perform structural stabilization treatment for subsequent curing; finally, curing can be carried out, for example, by oven or heating platform, so that the photoresist material can be fully cross-linked or hardened to form a dense, flat, and heat- and chemical-resistant flat layer 60.

[0129] (26) Forming a second black matrix and spacer pillar pattern. In an exemplary embodiment, forming the second black matrix and spacer pillar pattern may include: depositing a second black matrix film on a substrate on which the aforementioned pattern is formed, patterning the second black matrix film by a patterning process to form a second black matrix 22 pattern disposed on the planarization layer 60, and a spacer pillar 41 pattern disposed on the side of the second black matrix 22 away from the substrate, such as... Figure 9A and Figure 9B As shown.

[0130] In an exemplary embodiment, the second black matrix pattern can be grid-like in shape and may include multiple third structural portions 221 and multiple fourth structural portions 222. The shape of the third structural portion 221 can be a straight line or a broken line extending along the pixel row direction, and the multiple third structural portions 221 can be arranged at intervals along the pixel column direction. The shape of the fourth structural portion 222 can be a straight line or a broken line extending along the pixel column direction, and the multiple fourth structural portions 222 can be arranged at intervals along the pixel row direction. The multiple third structural portions 221 and the multiple fourth structural portions 222 are interconnected to form a grid, and the locations where the multiple third structural portions 221 and the multiple fourth structural portions 222 are interconnected can form multiple first connection nodes R1 (not shown in the figure). Two adjacent third structural portions 221 and two adjacent fourth structural portions 222 enclose a light-transmitting area 23 (not shown in the figure).

[0131] In an exemplary embodiment, a plurality of light-transmitting areas 23 may correspond one-to-one with the first filter layer 31, the second filter layer 32 and the third filter layer 33 in the color filter layer pattern, and the orthographic projection of the light-transmitting area 23 on the substrate may be within the range of the orthographic projection of the corresponding filter layer on the substrate 10.

[0132] In an exemplary embodiment, the surface of the second black matrix 22 on the side away from the substrate is located in the same plane, and this plane is parallel to the second surface 12. Since the second black matrix 22 is disposed on the flush surface of the planarization layer 60 on the side away from the substrate 10, the surface of the second black matrix 22 on the side away from the substrate can be located in the same plane, and this plane is parallel to the second surface, thereby the plurality of spacer pillars are disposed on a surface parallel to the second surface.

[0133] In an exemplary embodiment, the pattern of the septum post 41 may include a main septum post (Main PS) 411 and a sub septum post (Sub PS) 412.

[0134] In an exemplary embodiment, the orthogonal projection of the septum post 41 onto the substrate may be within the range of the orthogonal projection of the second black matrix 22 onto the substrate.

[0135] In an exemplary embodiment, the main septum column may have a first height d1, the auxiliary septum column may have a second height d2, and the second black matrix 22 may have a black matrix thickness d3. The first height d1 may be 2.6 μm - 4.0 μm, the second height d2 may be 2.5 μm - 3.2 μm, and the black matrix thickness d3 may be 2.5 μm - 4.0 μm.

[0136] In an exemplary embodiment, the first height d1 can be greater than the second height d2, and the second height d2 can be greater than the thickness d3 of the black matrix.

[0137] In an exemplary embodiment, the second black matrix 22 and the spacer pillar 41 can be made of the same material and formed synchronously through the same patterning process, that is, the second black matrix 22 and the spacer pillar 41 can be an integral structure that is interconnected.

[0138] In an exemplary embodiment, the second black matrix 22 and the spacer pillars 41 can be made of an opaque photosensitive organic resin material. For example, the opaque photosensitive organic resin material can be formed by adding an opaque pigment to an organic resin matrix.

[0139] In an exemplary embodiment, the following can be employed: Figure 15 The halftone mask shown forms a second black matrix and septum column pattern disposed on the planarization layer 60. (As shown...) Figure 15 As shown, a halftone mask may include a fully transparent area W1, an opaque area W2, a first partially transparent area W3, and a second partially transparent area W4. The transmittance of the first partially transparent area W3 is greater than that of the second partially transparent area W4; for example, the transmittance of the first partially transparent area W3 may be 30%, and the transmittance of the second partially transparent area W4 may be 10%.

[0140] In an exemplary embodiment, the following is employed: Figure 15The halftone mask pattern shown can be formed by applying a layer of photoresist to the thin film material on the planarization layer 60. The halftone mask with slits is then illuminated by a light source. Light passes through the fully transparent area W1, making it a fully exposed area. After development, the photoresist in the fully exposed area is completely retained, forming the main spacers. Light cannot pass through the opaque area W2, making it an unexposed area. After development, the photoresist in the unexposed area is completely removed, forming a transparent area. Since the first partially transparent area W3 is a semi-transparent area with slits, when light passes through it, due to the diffraction and interference effects of the slits, only a small portion of the photoresist in this area is exposed, becoming the first partially exposed area. After development, a small portion of the photoresist in the first partially exposed area is removed, forming the auxiliary spacers. Similarly, when light passes through the second partially transparent area W4, it becomes the second partially exposed area. After development, most of the photoresist in the second partially exposed area is removed, forming the second black matrix pattern. Figure 9A and 9B As shown.

[0141] The color filter substrate provided in this embodiment has a planarization layer, a black matrix on the side of the planarization layer away from the color filter layer, and spacer pillars on the flat surface of the black matrix away from the substrate. This avoids the inconsistency in the height of the spacer pillars caused by the film layer step difference, effectively improves the uniformity of the spacer pillars, and effectively solves the problem of poor uniformity of spacer pillars in existing liquid crystal display panels. In this way, it can improve the unevenness of dark states and improve the product yield.

[0142] The color filter substrate provided in this embodiment forms a black matrix and spacer pillar pattern through a single patterning process, which effectively reduces the number of photomasks and can effectively save production costs.

[0143] In some possible implementations, where there is no overlap in the edge regions of the first filter layer, the second filter layer, and the third filter layer of the color filter layer, the color filter substrate of this embodiment may not have a planarization layer and the second black matrix may be directly disposed on the color filter layer. This disclosure does not limit this.

[0144] This disclosure also provides a method for fabricating a color filter substrate. In an exemplary embodiment, the color filter substrate includes a substrate, a conductive layer, a color filter layer, and a plurality of spacer pillars. The substrate includes a first surface and a second surface that are opposite to each other. The fabrication method may include: S1. The conductive layer is formed on the first surface of the substrate; S2. The color filter layer is formed on the second surface of the substrate; S3. The septum pillars are formed on the side of the color filter layer away from the substrate, and a plurality of the septum pillars are disposed on a surface parallel to the second surface.

[0145] This disclosure provides a method for preparing a color filter substrate. By placing the spacer pillars on a surface parallel to the second surface of the substrate, the uniformity of the spacer pillars (PS) can be improved, dark state non-uniformity defects can be reduced, and product yield can be increased.

[0146] This disclosure also provides a display device, which includes an array substrate, the aforementioned color filter substrate, and a liquid crystal layer disposed between the array substrate and the color filter substrate. The display device can be any product or component with display function, such as a mobile phone, tablet computer, television, monitor, laptop computer, digital photo frame, or navigator; the embodiments of this invention are not limited thereto.

[0147] While the embodiments disclosed herein are as described above, it should be noted that these embodiments are merely exemplary and not restrictive. Therefore, this disclosure is not limited to the specific content shown and described herein. Various modifications, substitutions, or omissions can be made to the form and details of the embodiments without departing from the scope of this disclosure.

Claims

1. A color filter substrate, characterized in that, The device includes a substrate, a conductive layer, a color filter layer, and a plurality of septum pillars. The substrate includes a first surface and a second surface that are opposite to each other. The conductive layer is disposed on the first surface of the substrate, the color filter layer is disposed on the second surface of the substrate, and the septum pillars are disposed on the side of the color filter layer away from the substrate. The plurality of septum pillars are disposed on a surface parallel to the second surface.

2. The color filter substrate according to claim 1, characterized in that, The conductive layer is a first black matrix, and the material of the first black matrix includes metallic materials.

3. The color filter substrate according to claim 1, characterized in that, The color filter layer includes at least a plurality of support structures, the surfaces of the plurality of support structures on the side away from the substrate are located in the same plane and the plane is parallel to the second surface, and the septum post is disposed on the surface of the support structure on the side away from the substrate.

4. The color filter substrate according to claim 3, characterized in that, The color filter layer has multiple receiving spaces, the support structure is disposed within the receiving spaces, and the support structure is disposed on the second surface of the substrate.

5. The color filter substrate according to claim 4, characterized in that, The color filter layer further includes a first filter layer, a second filter layer, and a third filter layer. The orthographic projection of the first filter layer on the substrate at least partially overlaps with the orthographic projection of the second filter layer on the substrate. The orthographic projection of the first filter layer on the substrate at least partially overlaps with the orthographic projection of the third filter layer on the substrate.

6. The color filter substrate according to claim 5, characterized in that, The first filter layer has a first groove on the side near the second filter layer, and the second filter layer has a second groove on the side near the first filter layer. The first groove and the second groove form the receiving space.

7. The color filter substrate according to claim 5, characterized in that, The first filter layer has a first groove on the side near the third filter layer, and the third filter layer has a third groove on the side near the first filter layer. The first groove and the third groove form the receiving space.

8. The color filter substrate according to claim 7, characterized in that, The support structure and the third filter layer within the accommodating space formed by the first groove and the third groove are an integral structure that is interconnected.

9. The color filter substrate according to claim 5, characterized in that, The second filter layer has a second groove on the side near the third filter layer, and the third filter layer has a third groove on the side near the second filter layer. The second groove and the third groove form the receiving space.

10. The color filter substrate according to claim 9, characterized in that, The support structure and the third filter layer within the accommodating space formed by the second groove and the third groove are an integral structure that is interconnected.

11. The color filter substrate according to claim 1, characterized in that, The conductive layer is a transparent conductive layer.

12. The color filter substrate according to claim 11, characterized in that, The color filter substrate further includes a second black matrix, which is disposed on the side of the color filter layer away from the substrate. The surface of the second black matrix on the side away from the substrate is located in the same plane and the plane is parallel to the second surface. The spacer pillar is disposed on the surface of the second black matrix on the side away from the substrate.

13. The color filter substrate according to claim 12, characterized in that, The color filter substrate further includes a planarization layer disposed on the surface of the color filter layer away from the substrate. The surface of the planarization layer away from the substrate is located in the same plane and the plane is parallel to the second surface. The second black matrix is ​​disposed on the surface of the planarization layer away from the substrate.

14. A display device, characterized in that, It includes an array substrate, a color filter substrate as described in any one of claims 1 to 13, and a liquid crystal layer disposed between the array substrate and the color filter substrate.

15. A method for preparing a color filter substrate, characterized in that, The color filter substrate includes a substrate, a conductive layer, a color filter layer, and multiple spacer pillars; the substrate includes a first surface and a second surface that are opposite to each other; the fabrication method includes: The conductive layer is formed on the first surface of the substrate; The color filter layer is formed on the second surface of the substrate; The septum pillars are formed on the side of the color filter layer away from the substrate, and a plurality of the septum pillars are disposed on a surface parallel to the second surface.

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