Splicing apparatus and splicing method

Abstract

The embodiment of the application discloses a splicing device and a splicing method, and relates to the field of nanoimprint technology. The splicing device comprises a bearing platform, a suction platform, an alignment module and a displacement control module. The suction platform is installed on the bearing platform. The suction platform has a suction surface, and the suction platform is configured to adsorb and fix a plurality of sub-boards on the suction surface. The alignment module is configured to obtain position information of each sub-board. The displacement control module is installed on the suction platform and is configured to splice the plurality of sub-boards based on the position information of each sub-board before at least part of the sub-boards are adsorbed and fixed on the suction surface. The suction platform, the alignment module and the displacement control module can construct a dynamic splicing reference, control the size of the joint between different sub-boards, form a cross-shaped joint between the plurality of sub-boards, and improve the splicing precision of the nano-level pattern.

Description

Technical Field

[0001] This application relates to the field of nanoimprint technology, and in particular to a splicing device, splicing method, computer equipment, and computer-readable storage medium. Background Technology

[0002] Nano-imprint lithography (NIL) has become an ideal method for the mass production of micro- and nano-optical components due to its ability to provide rapid, high-volume transfer of nanoscale patterns and its low sensitivity to feature size, shape, and complexity. The principle of nano-imprint lithography is as follows: under heat or ultraviolet irradiation, a nanoimprint master plate with a pre-fabricated nanoscale pattern is pressed onto an imprinting adhesive. Then, through processes such as demolding and etching of excess imprinting adhesive, a pattern complementary to the nanoimprint master plate is formed.

[0003] Currently, nanoimprint lithography (NIM) master substrates are typically fabricated using photolithography techniques, such as electron beam lithography (EBL). This limits the size of the NIM master substrates; for example, they are generally smaller than 12 inches. NIM master substrates larger than 12 inches usually require splicing together.

[0004] However, splicing technology has problems such as large seam sizes and low splicing accuracy of nanoscale patterns. Summary of the Invention

[0005] This application provides a splicing device, splicing method, computer equipment, and computer-readable storage medium to reduce the splicing seam size and improve the splicing accuracy of nanoscale patterns.

[0006] To achieve the above objectives, the embodiments of this application adopt the following technical solutions:

[0007] In a first aspect, a splicing device is provided, for example, for splicing multiple sub-plates for nanoimprinting. The splicing device includes: a support platform, an adsorption platform, an alignment module, and a displacement control module. The adsorption platform is mounted on the support platform. The adsorption platform has an adsorption surface. The adsorption platform is configured to adsorb and fix multiple sub-plates onto the adsorption surface. The alignment module is configured to acquire positional information of each sub-plate among the multiple sub-plates. The displacement control module is mounted on the support platform and is configured to splice the multiple sub-plates based on the positional information of each sub-plate before adsorbing and fixing at least some of the sub-plates onto the adsorption surface.

[0008] The splicing equipment provided in some embodiments of this application, by installing an adsorption platform, an alignment module, and a displacement control module on a support platform, can construct a dynamic splicing benchmark using the alignment module and the displacement control module, and control the splice seam size. That is, the alignment module and the displacement control module cooperate with each other; the displacement control module can move some of the sub-boards based on the position information of each sub-board acquired in real time by the alignment module, until the splice seam size between two adjacent sub-boards is within a controllable range, and at least two splices extending in the same direction between the multiple sub-boards are flush, thus achieving a "cross" shaped splice, thereby obtaining a mother board spliced ​​from these multiple sub-boards. This not only enables control over the splice seam size between two adjacent sub-boards and the precision control of the "cross" shaped splice, but also effectively reduces the size of each splice seam in the mother board, improving the splicing precision of nanoscale patterns between two adjacent sub-boards. Moreover, the above-mentioned splicing equipment can eliminate the precision loss caused by dimensional and positional errors during the preparation process of multiple sub-boards during splicing.

[0009] Furthermore, based on the aforementioned dynamic splicing benchmark, the alignment mark setting can be omitted in the sub-boards, increasing the area ratio or effective area ratio of nanoscale patterns in each sub-board, and increasing the area ratio of nanoscale patterns in the motherboard. When the motherboard is applied to the display field, it facilitates the realization of full-area display.

[0010] In a possible implementation of the first aspect, the displacement control module is specifically configured to assemble the sub-board to be assembled and the reference sub-board based on the position information of the sub-board to be assembled placed on the adsorption surface after at least one sub-board has been adsorbed and fixed on the adsorption surface, and the position information of the reference sub-board corresponding to the sub-board to be assembled. The reference sub-board is one of the at least one sub-boards that has been adsorbed and fixed on the adsorption surface. The adsorption platform is specifically configured to adsorb and fix the sub-board to be assembled on the adsorption surface after the sub-board to be assembled and the reference sub-board have been successfully assembled.

[0011] In other words, the aforementioned multiple sub-plates are sequentially spliced ​​and fixed onto the adsorption surface of the adsorption platform. Furthermore, each sub-plate to be spliced ​​can use a reference sub-plate already adsorbed and fixed on the adsorption surface as an alignment reference to adjust the splicing state between the splicing sub-plate and the reference sub-plate, ensuring that the splicing sub-plate and the reference sub-plate meet the splicing requirements. Compared to using other alignment references (including but not limited to alignment marks), this eliminates alignment errors and precision errors introduced during the alignment process, effectively reducing the seam size and ensuring the splicing accuracy of the nanoscale patterns between the splicing sub-plate and the reference sub-plate. Moreover, it can effectively increase the area ratio of nanoscale patterns in each sub-plate.

[0012] In a possible implementation of the first aspect, the displacement control module includes at least a first displacement control module and a second displacement control module. The first displacement control module is used to move the sub-board to be spliced ​​in a first direction, and the second displacement control module is used to move the sub-board to be spliced ​​in a second direction. The first direction is the arrangement direction of the sub-board to be spliced ​​and the reference sub-board, and the second direction intersects with the first direction.

[0013] By setting up a first displacement control module and a second displacement control module, the corresponding sub-boards to be spliced ​​can be moved independently using the first displacement control module and the second displacement control module, and each sub-board to be spliced ​​can be moved in different directions. While controlling the splicing size between two adjacent sub-boards (i.e., the sub-board to be spliced ​​and the reference sub-board), the alignment of the nanoscale patterns between two adjacent sub-boards can also be achieved.

[0014] In a possible implementation of the first aspect, a first displacement control module is configured to move the sub-board to be spliced ​​in a first direction based on a first splicing distance between the sub-board to be spliced ​​and the reference sub-board in a first direction, such that the sub-board to be spliced ​​contacts the reference sub-board in the first direction. Here, the first splicing distance between the sub-board to be spliced ​​and the reference sub-board in the first direction is determined based on the position information of the sub-board to be spliced ​​and the position information of the reference sub-board. A second displacement control module is configured to move the sub-board to be spliced ​​in a second direction based on a second splicing distance between the sub-board to be spliced ​​and the reference sub-board in a second direction, such that the sub-board to be spliced ​​and the reference sub-board satisfy the constraint condition of edge collinearity in the second direction. The second splicing distance between the sub-board to be spliced ​​and the reference sub-board in the second direction is determined based on the position information of the sub-board to be spliced ​​and the position information of the reference sub-board.

[0015] The aforementioned first and second displacement control modules can both cooperate with the alignment module. Based on the position information of the sub-board to be spliced ​​and the reference sub-board obtained by the alignment module, they directly cause the sub-board to be spliced ​​to move by a first splicing distance and a second splicing distance, thereby achieving the splicing of the sub-board to be spliced ​​and the reference sub-board. This helps to improve the splicing accuracy and efficiency of the sub-board to be spliced ​​and the reference sub-board.

[0016] In a possible implementation of the first aspect, the displacement control module includes a control body and a roller assembly. The roller assembly is slidably connected to the control body and can slide relative to the control body toward the adsorption platform. The roller assembly includes multiple rollers spaced apart, the arrangement direction of which intersects the sliding direction of the roller assembly, and each roller has a degree of rolling freedom.

[0017] In this way, on the one hand, the control body can accurately control the sliding of the roller assembly over minute distances, thereby achieving accurate control over the movement of the sub-panel to be spliced ​​over minute distances (e.g., micrometer or submicrometer level). On the other hand, during the movement of the sub-panel to be spliced ​​by the second displacement control module along the second direction, the rollers of the first displacement control module can rotate along with the movement of the sub-panel to be spliced, avoiding dry friction between the sub-panel to be spliced ​​and the first displacement control module, which would affect the movement of the sub-panel to be spliced ​​in the second direction.

[0018] In a possible implementation of the first aspect, the outer circumferential surface of the roller is covered with an elastic material. In this way, on the one hand, a buffer can be formed between the roller and the sub-plate to avoid damage to the sub-plate; on the other hand, the straightness of the side of the sub-plate that contacts the roller can be adaptively adjusted, which can also be called the cutting edge; and furthermore, the requirement for initial edge parallelism can be reduced.

[0019] In a possible implementation of the first aspect, the alignment module is further configured to acquire the deformation of the elastic material. The displacement control module includes a first displacement control module; the first displacement control module is further configured to stop moving the sub-plate to be spliced ​​when the deformation reaches a threshold.

[0020] This avoids excessive compression between the sub-board to be spliced ​​and the reference sub-board, which could damage them. It also improves the structural stability of the sub-board to be spliced ​​and the reference sub-board while ensuring close contact between them.

[0021] In a possible implementation of the first aspect, the splicing device further includes: an annular frame and multiple support members. The annular frame is arranged around the adsorption platform. The multiple support members are connected between the support platform and the annular frame. The displacement control module is connected to the annular frame and is located on the side of the annular frame closer to the support platform.

[0022] By setting up an annular frame and multiple support components, the integration and positioning of multiple displacement control modules can be achieved, improving the integration level of the splicing equipment. By connecting multiple displacement control modules on the side of the annular frame closer to the support platform, interference between the displacement control modules and the alignment modules, as well as interference between the placement of the displacement control modules and the sub-boards, can be avoided.

[0023] In a possible implementation of the first aspect, the annular frame has multiple connecting holes. The splicing device also includes multiple connectors, which pass through the multiple connecting holes and connect to the multiple support members. At least two of the multiple connecting holes are precision holes. By setting at least two of the multiple connecting holes to precision holes, the positioning accuracy between the support members and the annular frame can be improved, thereby improving the positioning accuracy between the displacement control module connected to the annular frame and the adsorption platform.

[0024] In a possible implementation of the first aspect, the adsorption platform has multiple adsorption zones arranged in an array, each zone being configured to independently adsorb and fix a sub-plate located within it. Displacement control modules are respectively provided on both adjacent sides of at least one adsorption zone.

[0025] By setting multiple independent adsorption zones within the adsorption platform, multiple sub-plates can be adsorbed and fixed one by one. This ensures that the sub-plate to be spliced ​​can move relative to the reference sub-plate during the splicing process, thus achieving splicing between the sub-plate to be spliced ​​and the reference sub-plate. Furthermore, this approach helps reduce energy consumption. By setting displacement control modules on both sides of at least one adsorption zone, the adsorption zone and the displacement control module can cooperate with each other. After the displacement control module moves the sub-plate to be spliced ​​until the sub-plate to be spliced ​​and the reference sub-plate are successfully spliced, the sub-plate to be spliced ​​is adsorbed and fixed, achieving control over the splicing seam size and splicing accuracy between the sub-plate to be spliced ​​and the reference sub-plate.

[0026] In a possible implementation of the first aspect, a plurality of annular cavities are provided in the adsorption region, the plurality of annular cavities including at least a first annular cavity and a second annular cavity, the second annular cavity being arranged around the first annular cavity.

[0027] By setting multiple annular cavities in the adsorption zone, the adsorption area between the adsorption surface and each sub-plate can be increased, resulting in a larger adsorption force between the adsorption surface and each sub-plate. This avoids insufficient adsorption force between the sub-plate and the adsorption surface due to the large area of ​​the sub-plate, thus preventing interference with the splicing of multiple sub-plates.

[0028] In a possible implementation of the first aspect, the adsorption platform has multiple apex corners. The splicing device also includes a reference positioning structure, which is detachably mounted at one of the multiple apex corners and spaced apart from the adsorption surface.

[0029] By setting a reference positioning structure, the positioning of the first sub-board can be simplified, and the splicing efficiency of multiple sub-boards can be improved. By setting the reference positioning structure and the adsorption surface at intervals, a portion of the first sub-board can extend out of the second substrate of the adsorption platform, which facilitates the subsequent bonding and fixing of the first sub-board to the adsorption platform.

[0030] In a possible implementation of the first aspect, the splicing device further includes a plurality of auxiliary positioning structures, which are detachably installed at the remaining vertices of a plurality of vertices and are all spaced apart from the adsorption surface.

[0031] The auxiliary positioning structure simplifies the positioning of other sub-boards and improves the splicing efficiency of multiple sub-boards. By spacing the auxiliary positioning structure and the adsorption surface, a portion of other sub-boards can extend beyond the second substrate of the adsorption platform, facilitating subsequent bonding and fixing of other sub-boards to the adsorption platform.

[0032] In a possible implementation of the first aspect, the alignment module includes: an image acquisition unit, a first-axis moving mechanism, and a second-axis moving mechanism. The first-axis moving mechanism is connected to the image acquisition unit. The first-axis moving mechanism is configured to move the image acquisition unit along the seam extension direction between two adjacent sub-boards in a plurality of sub-boards. The second-axis moving mechanism is connected to the first-axis moving mechanism. The second-axis moving mechanism is configured to move the first-axis moving mechanism to move the image acquisition unit along the arrangement direction of the two adjacent sub-boards.

[0033] By using the above-mentioned setup, the displacement of the image acquisition unit in different directions can be adjusted using the first axis moving mechanism and the second axis moving mechanism, thereby enabling the acquisition of position information of different sub-boards among multiple sub-boards, detection of the splicing size and uniformity between any two adjacent sub-boards, and detection of splicing deviation between multiple sub-boards.

[0034] In a possible implementation of the first aspect, the alignment module further includes a focusing assembly and a third-axis moving mechanism. The focusing assembly is coupled to an image acquisition unit. The third-axis moving mechanism is connected to a first-axis moving mechanism and the focusing assembly. The third-axis moving mechanism is configured to drive the focusing assembly to move along the stacking direction of the support platform and the adsorption platform.

[0035] By adopting the above settings, the clarity of the image information acquired by the image acquisition device can be improved, thereby improving the accuracy of the position information of each sub-board obtained based on the image information, and improving the splicing accuracy and efficiency between multiple sub-boards.

[0036] In a possible implementation of the first aspect, the adsorption platform is detachably mounted on the support platform.

[0037] In this way, the adsorption platform can not only provide a fixed reference for multiple sub-boards, but also be disassembled from the carrier platform together with the mother board fixed on its adsorption surface, and transferred together to the imprinting equipment for imprinting, so as to avoid the loss of splicing accuracy of the sub-boards during the transfer of the mother board.

[0038] In a possible implementation of the first aspect, the edge of the mother plate extends out of the adsorption platform, and the mother plate is obtained by splicing together the aforementioned multiple sub-plates.

[0039] This facilitates fixing each sub-plate in the motherboard to the adsorption platform, thereby ensuring the splicing accuracy of each sub-plate in the motherboard during the joint transfer of the motherboard and the adsorption platform.

[0040] In a possible implementation of the first aspect, the splicing device further includes a curing module mounted on a support platform and positioned around the adsorption platform. The curing module is configured to bond the portion of the mother plate extending beyond the adsorption platform and the adsorption platform after multiple sub-plates have been adsorbed and fixed onto the adsorption surface. The mother plate is obtained by splicing multiple sub-plates.

[0041] In this way, during the process of transferring the adsorption platform and the master plate for imprinting, the relative positions between each sub-plate in the master plate and the adsorption platform can be kept unchanged, ensuring that the splicing accuracy between multiple sub-plates is not lost.

[0042] In a possible implementation of the first aspect, the curing module includes: a plurality of limiting tracks and a plurality of dispensing assemblies. The plurality of limiting tracks are mounted on a support platform and are respectively located on each side of the adsorption platform. The plurality of dispensing assemblies are slidably connected to the plurality of limiting tracks. The dispensing assemblies are configured to bond portions of the mother plate extending beyond the adsorption platform and the adsorption platform.

[0043] This allows for automated dispensing, improving the bonding efficiency between the motherboard and the adsorption platform.

[0044] In a possible implementation of the first aspect, the dispensing assembly includes a glue gun and an ejection guide shaft, the glue gun and the ejection guide shaft being slidably connected. The curing module further includes a first plunger connected to the dispensing assembly. A plurality of blind holes are formed on the surface of the limiting track away from the support platform, the plurality of blind holes being spaced apart along the extension direction of the limiting track; the first plunger matches the blind holes for positioning the dispensing assembly.

[0045] By using the above configuration, the applied adhesive can be arranged in a spaced-out dot pattern. This helps reduce the amount of adhesive used and lowers the cost of splicing multiple sub-boards. Furthermore, the curing module has a relatively simple structure and is easy to implement.

[0046] In a possible implementation of the first aspect, the curing module further includes a quick-change structure and a dispensing curing structure. The quick-change structure is configured to detachably connect the dispensing assembly and the limiting rail, or to detachably connect the dispensing curing structure and the limiting rail. The dispensing curing structure is configured to cure the adhesive applied by the glue gun.

[0047] This not only enables the curing of the adhesive applied to the dispensing assembly, but also allows for rapid installation and disassembly between the dispensing assembly and the cured structure, improving the splicing efficiency of multiple sub-boards.

[0048] In a possible implementation of the first aspect, the support platform includes an air-bearing vibration isolation platform. This allows for effective vibration isolation, effectively stopping vibrations on the ground or tabletop and preventing their transmission to the adsorption platform. This, in turn, avoids affecting the splicing of multiple sub-plates, ensuring high splicing accuracy and small seam sizes between the sub-plates.

[0049] Secondly, a splicing method is provided, which is applied to the splicing device described in any embodiment of the first aspect. The splicing method includes: acquiring position information of each sub-board among a plurality of sub-boards through an alignment module; splicing the plurality of sub-boards through a displacement control module based on the position information of each sub-board among the plurality of sub-boards; and adsorbing and fixing the plurality of sub-boards onto the adsorption surface of the adsorption platform through an adsorption platform.

[0050] In a possible implementation of the second aspect, based on the position information of each sub-board among the plurality of sub-boards, a portion of the sub-boards among the plurality of sub-boards is moved by a displacement control module, including: based on the position information of the sub-board to be spliced ​​placed on the adsorption surface after at least one sub-board has been adsorbed and fixed on the adsorption surface, and the position information of the reference sub-board corresponding to the sub-board to be spliced, the displacement control module splices the sub-board to be spliced ​​and the reference sub-board; the reference sub-board is one of the sub-boards that has been adsorbed and fixed on the adsorption surface.

[0051] In a possible implementation of the second aspect, multiple sub-boards are adsorbed and fixed on the adsorption surface by an adsorption platform, including: after the sub-board to be spliced ​​and the reference sub-board are successfully spliced, the sub-board to be spliced ​​is adsorbed and fixed on the adsorption surface by an adsorption platform.

[0052] In a possible implementation of the second aspect, the displacement control module includes at least a first displacement control module and a second displacement control module. The first displacement control module is used to move the sub-plate to be spliced ​​in a first direction, and the second displacement control module is used to move the sub-plate to be spliced ​​in a second direction. The first direction is the arrangement direction of the sub-plate to be spliced ​​and the reference sub-plate, and the second direction intersects the first direction. Based on the position information of the sub-plate to be spliced ​​placed on the adsorption surface after at least one sub-plate has been adsorbed and fixed on the adsorption surface, and the position information of the reference sub-plate corresponding to the sub-plate to be spliced, the displacement control module splices the sub-plate to be spliced ​​and the reference sub-plate, including: based on a first splicing distance between the sub-plate to be spliced ​​and the reference sub-plate in the first direction, the first displacement control module moves the sub-plate to be spliced ​​in the first direction so that the sub-plate to be spliced ​​contacts the reference sub-plate in the first direction; wherein, the first splicing distance between the sub-plate to be spliced ​​and the reference sub-plate in the first direction is determined according to the position information of the sub-plate to be spliced ​​and the position information of the reference sub-plate. Based on the second splicing distance between the sub-board to be spliced ​​and the reference sub-board in the second direction, the sub-board to be spliced ​​is moved in the second direction by the second displacement control module so that the sub-board to be spliced ​​and the reference sub-board satisfy the constraint condition of edge collinearity in the second direction; the second splicing distance between the sub-board to be spliced ​​and the reference sub-board in the second direction is determined according to the position information of the sub-board to be spliced ​​and the position information of the reference sub-board.

[0053] In a possible implementation of the second aspect, the edge of the mother plate obtained by splicing multiple sub-plates extends out of the adsorption platform. The splicing method further includes: when multiple sub-plates are all adsorbed and fixed on the adsorption surface, bonding the portion of the mother plate extending out of the adsorption platform and the adsorption platform together by a curing module.

[0054] The solution provided in the second aspect above can be applied to the splicing device provided in any embodiment of the first aspect above. Therefore, it can achieve the same beneficial effects as any embodiment of the first aspect, and will not be described in detail here.

[0055] Thirdly, a computer device is provided, comprising a memory and a processor, the memory being coupled to the processor. The memory stores a computer program, which includes computer instructions. When the computer instructions are executed by the processor, the computer device implements the splicing method as described in any embodiment of the second aspect.

[0056] Fourthly, a computer-readable storage medium is provided, on which a computer program is stored, which, when run on a computer device, causes the computer device to perform the splicing method as described in any embodiment of the second aspect.

[0057] Fifthly, a computer program product is provided that, when run on a computer device, causes the computer device to perform the splicing method as described in any embodiment of the second aspect.

[0058] The solutions provided in the third to fifth aspects above are used to implement the splicing method provided in any of the embodiments of the second aspect above. Therefore, they can achieve the same beneficial effects as any of the embodiments of the second aspect, and will not be described in detail here.

[0059] Among these, various possible implementation methods of any of the above aspects can be combined, provided that the solutions do not contradict each other. Attached Figure Description

[0060] Figure 1 A perspective view of a splicing device provided in an embodiment of this application;

[0061] Figure 2a for Figure 1 A front view of the splicing equipment shown;

[0062] Figure 2b for Figure 1 A right view of the splicing device shown;

[0063] Figure 2c for Figure 1 A rear view of the splicing equipment shown;

[0064] Figure 3 A partial structural diagram of a splicing device provided in an embodiment of this application;

[0065] Figure 4 for Figure 3 A front view of a partial structure of the splicing device shown;

[0066] Figure 5 A perspective view of a displacement control module provided in an embodiment of this application;

[0067] Figure 6a for Figure 5 A front view of the displacement control module shown;

[0068] Figure 6b for Figure 5 A top view of the displacement control module shown;

[0069] Figure 7 A partial structural diagram of another splicing device provided in an embodiment of this application;

[0070] Figure 8 for Figure 7 A right view of a partial structure of the splicing device shown;

[0071] Figure 9 A perspective view of a curing module provided in an embodiment of this application;

[0072] Figure 10 for Figure 9 A front view of the curing module shown;

[0073] Figure 11 A partial structural diagram of another splicing device provided in the embodiments of this application;

[0074] Figure 12a for Figure 11 A front view of a partial structure of the splicing device shown;

[0075] Figure 12b for Figure 11 A top view of a partial structure of the splicing equipment shown;

[0076] Figures 13-24 This is a top view structural diagram of each step in a splicing method provided in an embodiment of this application. Detailed Implementation

[0077] The technical solutions of the embodiments of this application will now be described with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments provided in this application are within the scope of protection of this application.

[0078] In the description of the embodiments of this application, unless otherwise stated, "multiple" means two or more. "At least one" or similar expressions refer to any combination of these items, including any combination of a single item or a plurality of items. For example, at least one of a, b, and c can represent: a, b, c, ab, ac, bc, or abc, where a, b, and c can be single or multiple. "a and / or b" includes the following three combinations: only a, only b, and a combination of a and b.

[0079] Furthermore, to facilitate a clear description of the technical solutions in the embodiments of this application, the terms "first" and "second" are used in the embodiments of this application to distinguish identical or similar items with substantially the same function and effect. Those skilled in the art will understand that the terms "first" and "second" do not limit the quantity or execution order, and that "first" and "second" are not necessarily different. Meanwhile, in the embodiments of this application, the terms "exemplary" or "for example" are used to indicate that something is being used as an example, illustration, or description. Any embodiment or design scheme described as "exemplary" or "for example" in the embodiments of this application should not be construed as being more preferred or advantageous than other embodiments or design schemes. Specifically, the use of terms such as "exemplary" or "for example" is intended to present related concepts in a concrete manner for ease of understanding.

[0080] In describing some embodiments, the term "connection" and its derived expressions are used. The term "connection" should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral part; it can be a direct connection or an indirect connection through an intermediate medium. Unless otherwise explicitly specified and limited, the term "electrical connection" should be interpreted broadly. For example, "electrical connection" can be a direct electrical connection, such as physical contact and electrical conduction between two components; it can also be understood as an electrical connection between different components in a circuit structure through physical lines that can transmit electrical signals, such as copper foil or wires on a printed circuit board (PCB), to transmit electrical signals; or, "electrical connection" can be an indirect electrical connection between two components through an intermediate medium; or, "electrical connection" can be an electrical connection between two components in a non-contact manner, such as an electrical connection between two components using capacitive coupling to transmit electrical signals.

[0081] In addition, the use of “based on” implies openness and inclusivity, because processes, steps, calculations or other actions “based on” one or more of the stated conditions or values ​​may in practice be based on additional conditions or values ​​beyond those stated.

[0082] As used herein, “parallel,” “perpendicular,” and “equal” include the described situation and situations that are similar to the described situation, within an acceptable range of deviation, which is determined by those skilled in the art taking into account the measurement under discussion and the error associated with the measurement of a particular quantity (i.e., the limitations of the measurement system). For example, “parallel” includes absolute parallelism and approximate parallelism, where an acceptable range of deviation for approximate parallelism may be, for example, within 5°; “perpendicular” includes absolute perpendicularity and approximate perpendicularity, where an acceptable range of deviation for approximate perpendicularity may also be, for example, within 5°; “equal” includes absolute equality and approximate equality, where an acceptable range of deviation for approximate equality may be, for example, a difference between the two equals being less than or equal to 5% of either one.

[0083] In this application embodiment, the terms "upper," "lower," "left," and "right" are not limited to the orientation of the components schematically placed in the accompanying drawings. It should be understood that these directional terms can be relative concepts used for description and clarification, and can vary accordingly depending on the orientation of the components in the accompanying drawings. In the drawings, for clarity, the thickness of layers and regions is exaggerated, and the dimensional proportions between the parts in the illustrations do not reflect actual dimensional proportions. Therefore, variations in shape relative to the drawings due to, for example, manufacturing techniques and / or tolerances are conceivable. Therefore, exemplary embodiments should not be construed as being limited to the shapes of the areas shown in this application, but rather include shape deviations due to, for example, manufacturing. For example, an etched area shown as rectangular would typically have a curved feature. Therefore, the areas shown in the drawings are schematic in nature, and their shapes are not intended to show the actual shapes of the areas of the device, nor are they intended to limit the scope of the exemplary embodiments.

[0084] Furthermore, the architecture and scenarios described in the embodiments of this application are for the purpose of more clearly illustrating the technical solutions of the embodiments of this application, and do not constitute a limitation on the technical solutions provided in the embodiments of this application. As those skilled in the art will know, with the evolution of architecture and the emergence of new scenarios, the technical solutions provided in the embodiments of this application are also applicable to similar technical problems.

[0085] Nanoimprint lithography has become an ideal method for the mass production of micro- and nano-optical components due to its ability to provide rapid, high-volume transfer of nanoscale patterns and its low sensitivity to feature size, shape, and complexity. Currently, nanoimprint lithography master sheets are typically fabricated using techniques such as photolithography. However, for larger nanoimprint lithography master sheets, such as those larger than 12 inches, splicing is usually required.

[0086] In splicing technology, alignment marks are usually used to align the splicing sub-boards and the carrier substrate to achieve the splicing of multiple splicing sub-boards; or, alignment pins, marking points, grooves, etc. are used to splice multiple splicing sub-boards and adjust the position of the splicing sub-boards.

[0087] However, the aforementioned splicing technologies typically suffer from problems such as large seam sizes and low splicing accuracy of nanoscale patterns. Furthermore, when using alignment marks for splicing, these marks occupy a certain area, resulting in invalid areas in the resulting spliced ​​motherboard. For example, using nanoimprint technology to fabricate a display substrate can lead to a significant non-display area in the final product.

[0088] Based on this, some embodiments of this application provide a splicing device and a splicing method, which are used, for example, to splice multiple sub-boards to form a master board. The multiple sub-boards include, but are not limited to, nanoimprinted sub-boards, and correspondingly, the master board includes, but is not limited to, a nanoimprinted master board. Taking multiple sub-boards as nanoimprinted sub-boards as an example, each sub-board has a nanoscale pattern (or nanoscale microstructure). After splicing multiple sub-boards, the nanoscale patterns on the multiple sub-boards can be combined to form a complete pattern (or structure). The splicing device and splicing method provided in the embodiments of this application can effectively reduce the seam size between two adjacent sub-boards and improve the splicing accuracy of the nanoscale patterns between two adjacent sub-boards; moreover, it can eliminate the need for alignment marks and increase the area ratio of the nanoscale patterns in each sub-board and the master board.

[0089] The assembled motherboard can be used in the fabrication of various electronic devices. Optionally, these various electronic devices include, but are not limited to, display substrates (or display panels), radio frequency antennas, and optical functional devices used in information and communication technology (ICT). The assembled motherboard can also be used to fabricate structures such as gratings, optical waveguides in augmented reality (AR) devices, and thin films in semiconductor devices.

[0090] The splicing device and splicing method provided in the embodiments of this application will now be described schematically with reference to the accompanying drawings. In the reference numerals of the drawings, "A / B" indicates that the corresponding structure can be either A or B, for example, Figure 3 The “4 / 4a” in the text can be either displacement control module 4 or the first displacement control module 4a.

[0091] In some embodiments, combined with Figure 1 , Figure 2a , Figure 2b and Figure 2cThe splicing equipment 100 may include: a support platform 1, an adsorption platform 2, an alignment module 3, and a displacement control module 4.

[0092] The aforementioned support platform 1 has high rigidity. The support platform 1 is configured to support structures mounted on it, such as the adsorption platform 2, the alignment module 3, and the displacement control module 4. The aforementioned support platform 1 has a bearing surface, on which the adsorption platform 2, the alignment module 3, and the displacement control module 4 can be mounted.

[0093] The aforementioned adsorption platform 2 includes, but is not limited to, a vacuum adsorption fixture. The adsorption platform 2 has an adsorption surface; for example, after the adsorption platform 2 is mounted on the support surface of the support platform 1, the adsorption surface of the adsorption platform 2 is located on the side of the adsorption platform 2 away from the support platform 1. The adsorption surface is used to support multiple sub-plates. The adsorption platform 2 is configured to adsorb and fix the multiple sub-plates onto the adsorption surface. For example, the adsorption platform 2 does not adsorb and fix the multiple sub-plates simultaneously, but rather adsorbs and fixes them one by one.

[0094] For example, in combination Figure 13 (c) and Figure 14 During the assembly of multiple sub-plates 200, the sub-plates 200 can be placed one by one on the adsorption surface S2. For example, after placing one sub-plate 200 on the adsorption surface S2 and determining its position, the adsorption platform 2 adsorbs and fixes it; then, another sub-plate 200 is placed on the adsorption surface S2, and after determining its position, the adsorption platform 2 adsorbs and fixes it. In this way, multiple sub-plates 200 are sequentially adsorbed and fixed on the adsorption surface S2.

[0095] The number of the aforementioned sub-boards 200 can be three, four, or even more. These sub-boards 200 can be arranged sequentially in a line or in an array. The accompanying drawings illustrate four sub-boards 200 arranged in two rows and two columns. Of course, the arrangement of the structures included in the splicing device 100 can also be applied to other numbers of sub-boards 200, by adjusting the installation position according to the arrangement of those other numbers of sub-boards 200. This application does not limit this aspect.

[0096] Continue reading Figure 1 , Figure 2a , Figure 2b and Figure 2cFor example, the alignment module 3 is suspended above the adsorption platform 2. That is, the alignment module 3 is located on the side of the adsorption platform 2 away from the support platform 1, and the alignment module 3 and the adsorption platform 2 are spaced apart. Optionally, the alignment module 3 can be suspended above the adsorption platform 2.

[0097] The alignment module 3 is configured to acquire position information of each sub-board 200 among the plurality of sub-boards 200. Optionally, the alignment module 3 can acquire the position information of each sub-board 200 by acquiring image information of the plurality of sub-boards 200. For example, the alignment module 3 can acquire the position information between two adjacent sub-boards 200. By processing the position information between two adjacent sub-boards 200, the seam size and whether the edges of the two adjacent sub-boards 200 are collinear can be determined. For example, in Figure 14 In the process, one of two adjacent sub-plates 200 has a first side L1 and the other sub-plate 200 has a second side L2. The first side L1 and the second side L2 are located on the same side of the two adjacent sub-plates 200 and both extend along the arrangement direction of the two adjacent sub-plates 200. When the first side L1 and the second side L2 are flush, the edges of the two adjacent sub-plates 200 are collinear.

[0098] The number of the aforementioned displacement control module 4 is, for example, one. For instance, this displacement control module 4 is configured to, before adsorbing and fixing at least a portion of the multiple sub-plates 200 onto the adsorption surface S2, splice the multiple sub-plates 200 together based on the position information of each sub-plate 200. Or, as... Figure 1 , Figure 2a , Figure 2b and Figure 2c As shown, the number of the aforementioned displacement control modules 4 is, for example, multiple, and these multiple displacement control modules 4 are spaced apart around the adsorption platform 2. Furthermore, these multiple displacement control modules 4 can cooperate with each other to splice multiple sub-boards 200 based on the position information of each sub-board 200 in the multiple sub-boards 200.

[0099] The phrase "before at least some of the sub-boards 200 are adsorbed and fixed onto the adsorption surface S2" refers, for example, to the point before all the sub-boards 200 to be spliced ​​are adsorbed and fixed onto the adsorption surface S2; at this point, one or more sub-boards 200 may already be adsorbed and fixed onto the adsorption surface S2. The phrase "based on the position information of each sub-board 200" refers, for example, to the displacement control module 4 being able to base its work on the position information of two adjacent sub-boards 200. By processing the aforementioned "position information," the splicing size between two adjacent sub-boards 200 and whether their edges are collinear can be determined. The phrase "sponging multiple sub-boards 200" refers, for example, to the displacement control module 4 being able to move the sub-boards 200 and achieve the splicing of multiple sub-boards 200 by moving the sub-boards 200.

[0100] Specifically, the displacement control module 4 is configured to assemble the sub-plate 200b to be spliced ​​and the reference sub-plate 200a based on the position information of the sub-plate 200b to be spliced ​​and placed on the adsorption surface S2 after at least one sub-plate 200 has been adsorbed and fixed on the adsorption surface S2, and the position information of the reference sub-plate 200a corresponding to the sub-plate 200b to be spliced. The reference sub-plate 200a is one of the at least one sub-plate 200 that has been adsorbed and fixed on the adsorption surface S2.

[0101] For example, the adsorption platform 2 can directly adsorb and fix the first sub-plate 200 placed on the adsorption surface S2. The phrase "at least one sub-plate 200 already adsorbed and fixed on the adsorption surface S2" can refer, for example, to the first sub-plate 200 placed on the adsorption surface S2; or it can refer to the first sub-plate 200 placed on the adsorption surface S2, and at least one subsequent sub-plate 200 adsorbed and fixed on the adsorption surface S2. The aforementioned reference sub-plate 200a can refer to the first sub-plate 200 placed on the adsorption surface S2, or it can refer to a subsequent sub-plate 200 adsorbed and fixed on the adsorption surface S2.

[0102] The aforementioned sub-board 200b to be spliced ​​and the reference sub-board 200a are, for example, arranged adjacent to each other. Specifically, the displacement control module 4 can, for example, move the sub-board 200b to be spliced. The displacement control module 4 can move the sub-board 200b to be spliced ​​based on the position information between the sub-board 200b to be spliced ​​and the reference sub-board 200a adjacent to the sub-board 200b, so that the sub-board 200b to be spliced ​​and the reference sub-board 200a adjacent to the sub-board 200b can be spliced ​​together.

[0103] In this case, the adsorption platform 2 is specifically configured to adsorb and fix the sub-board 200b to be spliced ​​onto the adsorption surface S2 after the sub-board 200b to be spliced ​​and the reference sub-board 200a are successfully spliced. If other sub-boards 200b to be spliced ​​need to be spliced ​​after the sub-board 200b has been adsorbed and fixed, the adsorbed and fixed sub-board 200b can serve as a reference sub-board 200a for subsequent sub-boards 200b to be spliced.

[0104] For example, during the process of the displacement control module 4 splicing some of the sub-boards 200, the alignment module 3 can acquire the position information of each sub-board 200 in real time. Specifically, during the process of the displacement control module 4 moving the sub-board 200b to be spliced, the alignment module 3 can acquire the position information of the sub-board 200b to be spliced ​​and the reference sub-board 200a adjacent to the sub-board 200b in real time, so as to determine the splicing seam size and whether the edges are collinear between the sub-board 200b to be spliced ​​and the reference sub-board 200a adjacent to the sub-board 200b. Based on the position information obtained by the alignment module 3, if the seam size between the sub-board 200b to be spliced ​​and the reference sub-board 200a adjacent to the sub-board 200b meets the requirements and their edges are collinear, the sub-board 200b to be spliced ​​and the reference sub-board 200a adjacent to the sub-board 200b are successfully spliced, and the displacement control module 4 stops moving the sub-board 200b to be spliced. Here, this embodiment does not limit the specific value of the seam size, and it can be selected and set according to actual design needs. Optionally, the seam size range is in the micrometer range. Further, the seam size is reduced to, for example, 2μm or less.

[0105] After multiple sub-boards 200 are successfully spliced ​​together, a motherboard 2000 can be formed. In this motherboard 2000, multiple adjacent sub-boards 200 (e.g., ...) Figure 21 The four adjacent sub-boards 200 shown have multiple seams between them. The size of each seam is within a controllable range, and these multiple seams form a "cross" shaped seam. The accuracy of the "cross" shaped seam is also within a controllable range. At this time, the nanoscale patterns of any two adjacent sub-boards 200 are basically aligned, which makes the splicing accuracy of the nanoscale patterns of any two adjacent sub-boards 200 high.

[0106] It is understandable that the dimensions of the aforementioned adsorption platform 2 can be adjusted according to the dimensions of the sub-plate 200 and the mother plate 2000. Optionally, such as Figure 13 As shown in (a), the size of each sub-plate 200 can be 8 inches (120mm × 120mm). In this case, the size of the matching adsorption platform 2 is smaller; or, as shown in (a), the size of each sub-plate 200 can be 8 inches (120mm × 120mm). Figure 13As shown in (b), each sub-board 200 can be 12 inches (185mm × 235mm), in which case the matching adsorption platform 2 is larger. This allows for rapid changeover of the adsorption platform 2, making it compatible with sub-boards 200 and motherboards 2000 of different sizes. For example, the adsorption platform 2 can accommodate the splicing of large-area sub-boards 200 with a large size range (e.g., 14 inches to 19 inches).

[0107] Therefore, the splicing device 100 provided in some embodiments of this application, by installing an adsorption platform 2, an alignment module 3, and a displacement control module 4 on the support platform 1, can utilize the alignment module 3 and the displacement control module 4 to construct a dynamic splicing reference and control the splice size. That is, the alignment module 3 and the displacement control module 4 cooperate with each other. The displacement control module 4 can move some of the sub-boards 200 based on the position information of each sub-board 200 obtained in real time by the alignment module 3, so that the splice size between two adjacent sub-boards 200 is within a controllable range, and at least two splices extending in the same direction between the multiple sub-boards 200 are aligned to achieve a "cross" type splice, thereby forming a mother board 2000. This not only enables control over the splice size between two adjacent sub-boards 200 and the precision control of the "cross" type splice, but also effectively reduces the splice size of each splice in the mother board 2000 and improves the splicing accuracy of nanoscale patterns between two adjacent sub-boards 200. Moreover, the splicing equipment 100 described above can eliminate the loss of precision caused by dimensional and positional errors in the manufacturing process of multiple sub-boards 200 during the splicing of these multiple sub-boards 200.

[0108] Furthermore, based on the aforementioned dynamic splicing benchmark, the alignment mark setting can be omitted in the sub-board 200, increasing the area ratio or effective region ratio of nanoscale patterns in each sub-board 200, and increasing the area ratio of nanoscale patterns in the motherboard 2000. When the motherboard 2000 is applied in the display field, it facilitates the realization of full-area display.

[0109] In some embodiments, the adsorption platform 2 is detachably installed with the support platform 1. In this case, the adsorption platform 2 can not only provide a fixed reference for multiple sub-plates 200, but also be detached from the support platform 1 together with the mother plate 2000 fixed on its adsorption surface S2, and transferred together to the imprinting equipment for imprinting, so as to avoid loss of splicing accuracy of the sub-plates 200 during the transfer of the mother plate 2000.

[0110] Understandably, the splicing device 100 is usually placed on the ground or a table. In this case, vibrations on the ground or table may be transmitted to the adsorption platform 2 through the support platform 1, affecting the splicing of multiple sub-boards 200.

[0111] In this case, in some embodiments, the aforementioned support platform 1 includes an air-bearing vibration isolation platform.

[0112] This allows for effective vibration isolation using the air-floating vibration isolation platform, effectively stopping vibrations on the ground or tabletop and preventing them from being transmitted to the adsorption platform 2. This, in turn, avoids affecting the splicing between multiple sub-plates 200, ensuring high splicing accuracy and small seam size between the multiple sub-plates 200.

[0113] The displacement control module 4 described above can be configured in various ways, and the appropriate configuration can be selected based on actual design needs. The following sections, in conjunction with the accompanying drawings, will provide a schematic explanation of the configuration methods for the displacement control module 4. Of course, the configuration methods for the displacement control module 4 are not limited to those illustrated in the following description and the accompanying drawings.

[0114] In some embodiments, such as Figure 3 As shown, the displacement control module 4 includes at least a first displacement control module 4a and a second displacement control module 4b. The number of first displacement control modules 4a can be one, such as... Figure 4 As shown, there can be multiple second displacement control modules 4b; the number of second displacement control modules 4b can be one or more. For example, one sub-board 200b to be spliced ​​can be associated with one first displacement control module 4a and one second displacement control module 4b. Of course, there can be other correspondences between the sub-board 200b to be spliced ​​and the displacement control modules 4. For example, for the last sub-board 200 to be spliced ​​among multiple sub-boards 200, such as... Figure 20b As shown, two first displacement control modules 4a can be configured, or one first displacement control module 4a and one second displacement control module 4b can be configured, or, as shown... Figure 20a As shown, a first displacement control module 4a can be set accordingly.

[0115] The first displacement control module 4a is used to move the sub-board 200b to be spliced ​​in a first direction, and the second displacement control module 4b is used to move the sub-board 200b to be spliced ​​in a second direction. The first direction is, for example, the arrangement direction of the sub-board 200b to be spliced ​​and the reference sub-board 200a, and the second direction intersects with the first direction, for example, perpendicular to it.

[0116] Correspondingly, the first displacement control module 4a can adjust the splicing gap size between the sub-plate 200b to be spliced ​​and the reference sub-plate 200a, and the second displacement control module 4b can adjust whether the edges of the sub-plate 200b to be spliced ​​and the reference sub-plate 200a are collinear, that is, adjust the alignment of the nanoscale patterns between the sub-plate 200b to be spliced ​​and the reference sub-plate 200a.

[0117] By setting up a first displacement control module 4a and a second displacement control module 4b, the corresponding sub-boards 200b to be spliced ​​can be moved independently using the first displacement control module 4a and the second displacement control module 4b, and each sub-board 200b to be spliced ​​can be moved in different directions. While controlling the splicing size between two adjacent sub-boards 200 (i.e., the sub-board 200b to be spliced ​​and the reference sub-board 200a), the alignment of nanoscale patterns between two adjacent sub-boards 200 can also be achieved.

[0118] For example, the first displacement control module 4a and the second displacement control module 4b, used to move the same sub-board 200b to be spliced, are arranged adjacently and located on adjacent sides of the adsorption platform 2. This simplifies the process of moving the sub-board 200b to be spliced ​​by the first displacement control module 4a and the second displacement control module 4b.

[0119] Understandably, if the arrangement orientation of the sub-board 200b to be spliced ​​and the reference sub-board 200a changes, the first direction and the second direction will also change accordingly. For example, in Figure 15 and Figure 16 In this case, the sub-board 200b to be spliced ​​and the reference sub-board 200a are arranged along direction X. Here, the first direction is, for example, direction X, and the second direction is, for example, direction Y. For example, in... Figure 17 and Figure 18 In the process, the sub-board 200b to be spliced ​​and the reference sub-board 200a are arranged along the Y direction. At this time, the first direction is, for example, the Y direction, and the second direction is, for example, the X direction.

[0120] Furthermore, in some examples, combining Figure 3 , Figure 14 and Figure 15 The first displacement control module 4a is configured to move the sub-board 200b to be spliced ​​200b in a first direction based on a first splicing distance D1 between the sub-board 200b to be spliced ​​and the reference sub-board 200a in a first direction, so that the sub-board 200b to be spliced ​​contacts the reference sub-board 200a in the first direction. The first splicing distance D1 between the sub-board 200b to be spliced ​​and the reference sub-board 200a in the first direction is determined based on the position information of the sub-board 200b to be spliced ​​and the position information of the reference sub-board 200a.

[0121] In other words, the alignment module 3 can simultaneously acquire the position information of the sub-board 200b to be spliced ​​and the reference sub-board 200a. By processing the position information of the sub-board 200b to be spliced ​​and the reference sub-board 200a, the spacing between the sub-board 200b to be spliced ​​and the reference sub-board 200a in the first direction can be obtained. This spacing can also be called the first splicing distance D1. The first displacement control module 4a can move the sub-board 200b to be spliced ​​based on the first splicing distance D1, so that the sub-board 200b to be spliced ​​moves along the first direction and along the direction from the sub-board 200b to the reference sub-board 200a, moving the first splicing distance D1 or approximately moving the first splicing distance D1, so that the sub-board 200b to be spliced ​​comes into contact with the reference sub-board 200a.

[0122] This allows for the splicing of the sub-board 200b to be spliced ​​and the reference sub-board 200a in the first direction, as well as the control of the splicing seam size between the sub-board 200b to be spliced ​​and the reference sub-board 200a.

[0123] Combination Figure 3 , Figure 14 and Figure 16 The second displacement control module 4b is configured to move the sub-board 200b to be spliced ​​200b in the second direction based on the second splicing distance D2 between the sub-board 200b to be spliced ​​and the reference sub-board 200a in the second direction, so that the sub-board 200b to be spliced ​​and the reference sub-board 200a satisfy the constraint condition of edge collinearity in the second direction. The second splicing distance D2 between the sub-board 200b to be spliced ​​and the reference sub-board 200a in the second direction is determined based on the position information of the sub-board 200b to be spliced ​​and the position information of the reference sub-board 200a.

[0124] In other words, after acquiring the position information of the sub-board 200b to be spliced ​​and the reference sub-board 200a, the alignment module 3 can further process the position information of the sub-board 200b to be spliced ​​and the reference sub-board 200a to obtain the spacing between the second side L2 of the sub-board 200b to be spliced ​​and the first side L1 of the reference sub-board 200a in the second direction. This spacing can also be called the second splicing distance D2. The second displacement control module 4b can move the sub-board 200b to be spliced ​​based on this second splicing distance D2, such that the sub-board 200b to be spliced ​​moves along the second direction with the second side L2 pointing to the first side L1, moving the second splicing distance D2 or approximately moving the second splicing distance D2, so that the second side L2 and the first side L1 are collinear, that is, so that the sub-board 200b to be spliced ​​and the reference sub-board 200a satisfy the constraint condition of edge collinearity in the second direction.

[0125] This allows for splicing of the sub-board 200b and the reference sub-board 200a in the second direction, while ensuring the alignment accuracy of the nanoscale patterns in the sub-board 200b and the reference sub-board 200a.

[0126] The aforementioned first displacement control module 4a and second displacement control module 4b can both cooperate with the alignment module 3. Based on the position information of the sub-board 200b to be spliced ​​and the reference sub-board 200a obtained by the alignment module 3, they directly cause the sub-board 200b to be spliced ​​to move a first splicing distance D1 and a second splicing distance D2, thereby achieving the splicing of the sub-board 200b and the reference sub-board 200a. This helps to improve the splicing accuracy and efficiency of the sub-board 200b and the reference sub-board 200a.

[0127] The structure of the displacement control module 4 mentioned above includes various types, which can be selected and set according to actual design needs. It is sufficient to be able to move the sub-board 200b to be spliced.

[0128] In some embodiments, such as Figure 5 , Figure 6a and Figure 6b As shown, each displacement control module 4 may include a control body 41 and a roller assembly 42. The roller assembly 42 is slidably connected to the control body 41, and the roller assembly 42 can slide relative to the control body 41 toward the adsorption platform 2.

[0129] For example, a slide rail is connected to the control body 41, and a slider is connected to the rolling assembly 42. The slider is located inside the slide rail and is slidably connected to the slide rail. Accordingly, the rolling assembly 42 achieves a slidable connection with the control body 41 through the slider and the slide rail.

[0130] Optionally, the control body 41 can also be called a micro-motion displacement stage. The control body 41 is used to convert rotational motion into linear displacement. Through the rotation of its internal structure, the slider slides relative to the slide rail, thereby driving the roller assembly 42 to move relative to the control body 41 towards the adsorption platform 2. This facilitates accurate control of the sliding of the roller assembly 42 over a small distance, thereby achieving accurate control of the movement of the sub-board 200b to be spliced ​​over a small distance. For example, the displacement control module 4 can achieve displacement control with micron or sub-micron precision.

[0131] Continue reading Figure 5 , Figure 6a and Figure 6bThe roller assembly 42 includes a plurality of rollers 421 spaced apart. Optionally, the number of rollers 421 can be two, three, or even more. The arrangement direction of the plurality of rollers 421 in the roller assembly 42 intersects the sliding direction of the roller assembly 42; for example, the arrangement direction of the plurality of rollers 421 is perpendicular to the sliding direction of the roller assembly 42. When the displacement control module 4 moves the sub-plate 200b to be spliced, the plurality of rollers 421, for example, all come into contact with the sub-plate 200, and the sub-plate 200b to be spliced ​​is moved by the sliding of the roller assembly 42.

[0132] In this roller assembly 42, each of the multiple rollers 421 has a rolling degree of freedom. That is, each roller 421 can rotate or roll. In this case, the roller assembly 42 can also be referred to as a roller assembly with rolling pairs.

[0133] by Figure 15 and Figure 16 Taking the structure shown as an example, in the first displacement control module 4a, the roller assembly 42 moves the sub-plate 200b to be spliced ​​in the first direction so that after the sub-plate 200b to be spliced ​​comes into contact with the reference sub-plate 200a, the multiple rollers 421 in the roller assembly 42 still abut against the sub-plate 200b to be spliced, so as to avoid affecting the splicing size during the process of the second displacement control module 4b moving the sub-plate 200b to be spliced ​​in the second direction.

[0134] During the process of the second displacement control module 4b moving the sub-plate 200b to be spliced ​​in the second direction, the roller 421 of the first displacement control module 4a can rotate with the movement of the sub-plate 200b to be spliced, so as to avoid dry friction between the sub-plate 200b to be spliced ​​and the first displacement control module 4a, which would affect the movement of the sub-plate 200b to be spliced ​​in the second direction.

[0135] Additionally, the reference sub-plate 200a may have a certain tilt angle. During the process of the second displacement control module 4b moving the sub-plate 200b to be spliced ​​in the second direction, the rollers 421 in each displacement control module 4 that abut against the reference sub-plate 200a can also roll to adjust the angle of the reference sub-plate 200a and improve the uniformity of the splice seam between the sub-plate 200b to be spliced ​​and the reference sub-plate 200a.

[0136] In some examples, the outer circumference of each roller 421 is covered with an elastic material. This elastic material can undergo elastic deformation. The contact between each roller 421 and the sub-plate 200 can be an elastic contact.

[0137] In this way, on the one hand, a buffer can be formed between the roller 421 and the sub-plate 200 to avoid damage to the sub-plate 200; on the other hand, the straightness of the side of the sub-plate 200 that is in contact with the roller 421 can be adaptively adjusted, which can also be called the cutting edge; and on the other hand, the requirement for initial edge parallelism can be reduced.

[0138] For example, when the outer surface of each roller 421 is covered with an elastic material, the alignment module 3 is also configured to acquire the deformation of the elastic material. Furthermore, the first displacement control module 4a is also configured to stop moving the sub-plate 200b to be spliced ​​when the deformation reaches a threshold.

[0139] Understandably, when the elastic material covering the roller 421 in the first displacement control module 4a undergoes elastic deformation, the sub-plate 200b to be spliced ​​and the reference sub-plate 200a come into contact, and there is a certain contact force between them. When the deformation of the elastic material reaches a threshold, the movement of the sub-plate 200b to be spliced ​​is stopped, thus controlling the contact force between the sub-plate 200b to be spliced ​​and the reference sub-plate 200a.

[0140] By adopting the above-mentioned arrangement, it is possible to avoid large compression between the sub-plate 200b to be spliced ​​and the reference sub-plate 200a, which would damage the sub-plate 200b to be spliced ​​and the reference sub-plate 200a. On the basis of achieving close contact between the sub-plate 200b to be spliced ​​and the reference sub-plate 200a, the structural stability of the sub-plate 200b to be spliced ​​and the reference sub-plate 200a is improved.

[0141] The splicing device 100 described above may also include other structures. In some embodiments, combined with Figure 1 , Figure 3 and Figure 4 The splicing device 100 may also include: a ring frame 5 and multiple support members 6.

[0142] The annular frame 5 is arranged around the adsorption platform 2. Optionally, the shape of the annular frame 5 matches the shape of the adsorption platform 2. For example, as... Figure 3 As shown, the adsorption platform 2 is rectangular in shape, and the annular frame 5 is also rectangular in shape. There is a gap between the orthographic projection of the annular frame 5 on the bearing surface and the orthographic projection of the adsorption platform 2 on the bearing surface, or the orthographic projections of the annular frame 5 on the bearing surface and the orthographic projections of the adsorption platform 2 on the bearing surface partially overlap.

[0143] The aforementioned multiple support members 6 are connected between the support platform 1 and the annular frame 5, with the annular frame 5 and the support platform 1 spaced apart. These multiple support members 6 can be used to position and support the annular frame 5. For example, the distance between the annular frame 5 and the support surface is greater than the distance between the adsorption surface S2 of the adsorption platform 2 and the support surface. The annular frame 5 is higher than the adsorption platform 2 relative to the support platform 1.

[0144] Optionally, the number of the aforementioned support members 6 can be three, four, or even more, as long as they are sufficient to stably support the annular frame 5. For example, in Figure 3 In the middle, there are four support members 6, and the four support members 6 are located at the four top corners of the annular frame 5.

[0145] Further reading Figure 3 and Figure 4 The displacement control module 4 in the splicing device 100 is connected to the annular frame 5 and is located on the side of the annular frame 5 closer to the support platform 1. That is, the displacement control module 4 is located between the support platform 1 and the annular frame 5. Each displacement control module 4 can be connected to the annular frame 5 via a control body 41, and the relative position between the control body 41 and the annular frame 5 is fixed. The roller assembly 42 of the displacement control module 4 is located on the side of the control body 41 away from the annular frame 5 and can move relative to the annular frame 5. For example, in Figure 3 In the middle, the control body 41 of each displacement control module 4 can be connected to the ring frame 5 through four connectors.

[0146] By setting up the annular frame 5 and multiple support members 6, the integration and positioning of multiple displacement control modules 4 can be achieved, improving the integration level of the splicing equipment 100. By connecting multiple displacement control modules 4 on the side of the annular frame 5 near the bearing platform 1, interference between the displacement control modules 4 and the alignment module 3 can be avoided, as can interference between the placement of the displacement control modules 4 and the sub-board 200.

[0147] In some examples, such as Figure 3 As shown, the annular frame 5 has multiple connecting holes H1, and these multiple connecting holes H1 and multiple support members 6 are arranged in a one-to-one correspondence. The orthographic projection of each connecting hole H1 on the bearing surface is located within the orthographic projection range of the corresponding support member 6 on the bearing surface.

[0148] Continue reading Figure 3 The splicing device 100 may further include multiple connectors 7, which are arranged in a one-to-one correspondence with multiple connection holes H1. Each connector 7 passes through a connection hole H1 and connects to a support member 6. That is, each connector 7 can pass through a corresponding connection hole H1 and connect to the support member 6 corresponding to that connection hole H1. This enables the connection between the support member 6 and the annular frame 5.

[0149] Furthermore, at least two of the aforementioned plurality of connecting holes H1 are precision holes. Here, "precision hole" refers, for example, to a through hole with high machining accuracy. Other connecting holes H1 besides the precision holes may be auxiliary guide holes, the machining accuracy of which is, for example, lower than that of the precision holes. Figure 3 The diagram shows four connecting holes H1. For example, two connecting holes H1 at one diagonal of the annular frame 5 are precision holes, and two connecting holes at another diagonal are auxiliary guide holes.

[0150] By setting at least two of the above-mentioned multiple connection holes H1 as precision holes, the positioning accuracy between the support 6 and the annular frame 5 can be improved, thereby improving the positioning accuracy between the displacement control module 4 connected to the annular frame 5 and the adsorption platform 2.

[0151] The connection between the aforementioned support member 6 and the annular frame 5 is a detachable connection, and correspondingly, the positioning support between the support member 6 and the annular frame 5 is reconfigurable.

[0152] For example, such as Figure 3 As shown, the support member 6 is generally cylindrical, and at one end of the support member 6 near the bearing platform 1, for example, two oppositely arranged grooves are formed. The support member 6 is connected to the bearing platform 1 by, for example, a fastener penetrating the sidewall of the groove and a protrusion located on the end face of the support member 6 near the bearing platform 1.

[0153] Next, the structure of the adsorption platform 2 will be schematically described with reference to the accompanying drawings. Of course, the arrangement of the adsorption platform 2 is not limited to the following description and the schematic diagram in the accompanying drawings.

[0154] In some embodiments, such as Figure 3 and Figure 7 As shown, the adsorption platform 2 has multiple adsorption zones Q arranged in an array. Optionally, the number of adsorption zones Q is four, arranged in two rows and two columns. Each adsorption zone Q can independently absorb and release vacuum, and the absorption or release of vacuum in a single adsorption zone Q does not interfere with each other. For example, the multiple adsorption zones Q are arranged in a one-to-one correspondence with the multiple sub-plates 200 mentioned above. Each adsorption zone Q can be configured to independently adsorb and fix the sub-plates 200 located within that adsorption zone Q.

[0155] Furthermore, such as Figure 3 As shown, at least one displacement control module 4 is provided on each of the adjacent sides of the adsorption region Q. For example, in Figure 3wherein the adsorption platform 2 has four adsorption zones Q1, Q2, Q3 and Q4, and displacement control modules 4 are arranged on both adjacent sides of each of the adsorption zones Q2 and Q3; displacement control modules 4 are arranged on both adjacent sides of the adsorption zone Q4, or one displacement control module 4 is arranged at the top corner position of the adsorption zone Q4.

[0156] By providing a plurality of mutually independent adsorption zones Q in the adsorption platform 2, the sequential adsorption and fixation of a plurality of sub-plates 200 can be realized, which ensures that in the process of splicing the plurality of sub-plates 200, the to-be-spliced sub-plate 200b can move relative to the reference sub-plate 200a, so as to realize the splicing between the to-be-spliced sub-plate 200b and the reference sub-plate 200a; moreover, it is beneficial to reducing energy consumption. By arranging the displacement control modules 4 on the two adjacent sides of at least one adsorption zone Q respectively, the adsorption zone Q can cooperate with the displacement control modules 4. After the displacement control modules 4 move the to-be-spliced sub-plate 200b until the to-be-spliced sub-plate 200b is successfully spliced with the reference sub-plate 200a, the to-be-spliced sub-plate 200b is adsorbed and fixed, so as to realize the control of the splicing seam size and splicing precision between the to-be-spliced sub-plate 200b and the reference sub-plate 200a.

[0157] In some examples, as shown in Figure 7 , a plurality of annular cavities C are arranged in the adsorption zone Q, and the shapes of the plurality of annular cavities C may be the same or different. For example, the plurality of annular cavities C have the same shape, and are all square annular or all circular annular. Further, the sizes of the plurality of annular cavities C are different. For example, the plurality of annular cavities C are all square annular, and in this case, the diagonal lengths of the respective annular cavities C are different; for another example, the plurality of annular cavities C are all circular annular, and in this case, the diameters of the respective annular cavities C are different.

[0158] Exemplarily, as shown in Figure 7 , the plurality of annular cavities described above at least include a first annular cavity C1 and a second annular cavity C2. The size of the second annular cavity C2 is, for example, larger than the size of the first annular cavity C1, and the second annular cavity C2 is arranged around the first annular cavity C1. The first annular cavity C1 and the second annular cavity C2 form a "concentric square" structure. Further, as shown in Figure 7 , the plurality of annular cavities C described above may further include a third annular cavity C3. The size of the third annular cavity C3 is larger than the size of the second annular cavity C2, and the third annular cavity C3 is arranged around the second annular cavity C2.

[0159] Optionally, the plurality of annular cavities C described above are arranged concentrically. Further, the plurality of annular cavities C are, for example, arranged independently of each other.

[0160] By setting multiple annular cavities C in the adsorption zone Q, the adsorption area between the adsorption surface S2 and each sub-plate 200 can be increased, forming a larger adsorption force between the adsorption surface S2 and each sub-plate 200. This avoids the situation where the adsorption force between the sub-plate 200 and the adsorption surface S2 is insufficient due to the large area of ​​the sub-plate 200, thus avoiding affecting the splicing between multiple sub-plates 200.

[0161] In some examples, such as Figure 7 and Figure 8 As shown, the adsorption platform 2 may include a first substrate 21 and a second substrate 22 stacked together, with the first substrate 21 located between the support platform 1 and the second substrate 22. The first substrate 21 forms multiple annular cavities C within each adsorption region Q, and the second substrate 22 has multiple adsorption holes within each adsorption region Q. These multiple adsorption holes within the same adsorption region Q connect the annular cavity C to the outside. Thus, the adsorption platform 2 can sequentially adsorb and fix the sub-plate 200 placed on the adsorption surface S2 through the multiple annular cavities C and the adsorption holes.

[0162] In some examples, such as Figure 7 As shown, the adsorption platform 2 has multiple apex corners, for example, four apex corners. The splicing device 100 also includes a reference positioning structure 8, which is detachably installed at one of the multiple apex corners and spaced apart from the adsorption surface S2.

[0163] Specifically, such as Figure 7 As shown, in the case where the adsorption platform 2 includes a first substrate 21 and a second substrate 22, the first substrate 21 has a first protrusion protruding from the second substrate 22 at one of its apex corners. The reference positioning structure 8 can be detachably mounted on the first protrusion, for example, through a pin hole, and has a gap between it and the second substrate 22.

[0164] For example, the reference positioning structure 8 is L-shaped and covers its apex corner. The reference positioning structure 8 provides a positioning reference for the first sub-plate 200 placed on the adsorption platform 2. For instance, after the first sub-plate 200 is placed on the adsorption platform 2, the first sub-plate 200 contacts the inner wall of the reference positioning structure 8. After the first sub-plate 200 is placed, vacuum adsorption of the adsorption area Q where the first sub-plate 200 is located can be initiated to achieve adsorption and fixation of the first sub-plate 200. At this time, a portion of the first sub-plate 200 extends out of the second substrate 22 and is suspended in mid-air. Figure 7 and Figure 13 (c) in the middle Figure 13 The three black dots shown in (c) correspond to the reference positioning structure 8; Figures 14-24 Mid position and Figure 13The three black dots corresponding to (c) in the diagram also correspond to the reference positioning structure 8. Figures 14-24 Mid position and Figure 13 The dotted dashed box corresponding to (c) in the figure also corresponds to adsorption platform 2. Figures 13-21 The dotted dashed boxes in the text correspond to the adsorption platform 2, and further, correspond to the second substrate 22 or adsorption surface S2 of the adsorption platform 2. Figures 13-24 The diagonal fill pattern in the sub-plate 200 corresponds to the part of the sub-plate 200 (e.g., the first sub-plate 200) used for adsorption and fixation on the adsorption platform 2, and the white L-shaped pattern in the sub-plate 200 connected to the diagonal fill pattern corresponds to the part of the sub-plate 200 that is suspended.

[0165] Optionally, after the splicing of multiple sub-boards 200 is completed, the reference positioning structure 8 can be removed to facilitate subsequent imprinting.

[0166] By setting the reference positioning structure 8, the positioning of the first sub-board 200 can be simplified, and the splicing efficiency of multiple sub-boards 200 can be improved. By setting the reference positioning structure 8 and the adsorption surface S2 at intervals, a part of the first sub-board 200 can extend out of the second substrate 22, which facilitates the subsequent bonding and fixing of the first sub-board 200 to the adsorption platform 2.

[0167] Furthermore, in some examples, such as Figure 7 As shown, the splicing device 100 may also include a plurality of auxiliary positioning structures 9, which can be detachably installed at the remaining vertices A of the plurality of vertices A, and are all spaced apart from the adsorption surface S2.

[0168] Specifically, such as Figure 7 As shown, when the adsorption platform 2 includes a first substrate 21 and a second substrate 22, the other apex A of the first substrate 21 has a plurality of second protrusions protruding from the second substrate 22. The plurality of auxiliary positioning structures 9 can be detachably mounted on the plurality of second protrusions through pin holes, and have gaps between them and the second substrate 22.

[0169] For example, each auxiliary positioning structure 9 is L-shaped and covers the apex A of its location. The auxiliary positioning structure 9 is used to narrow the initial alignment range of the other sub-boards 200 except for the first sub-board 200, thereby reducing the distance that the displacement control module 4 moves the corresponding sub-board 200. For example, after the splicing of the other sub-boards 200 is completed, a portion of the other sub-boards extends out of the second substrate 22 and is suspended in the air.

[0170] The auxiliary positioning structure 9 simplifies the positioning of other sub-boards 200 and improves the splicing efficiency of multiple sub-boards 200. By spaced the auxiliary positioning structure 9 and the adsorption surface S2, a portion of the other sub-boards 200 can extend beyond the second substrate 22, facilitating subsequent bonding and fixing of the other sub-boards 200 to the adsorption platform 2. Figure 7 and Figures 14-24 , Figures 14-24 The black dots in the diagram, apart from the three black dots corresponding to the reference positioning structure 8, correspond to the aforementioned auxiliary positioning structure 9.

[0171] Optionally, after the splicing of multiple sub-boards 200 is completed, the auxiliary positioning structure 9 can be removed to facilitate subsequent imprinting.

[0172] Next, the structure of alignment module 3 will be schematically explained with reference to the accompanying drawings. Of course, the arrangement of alignment module 3 is not limited to the following description and the illustrations in the accompanying drawings.

[0173] In some embodiments, such as Figure 1 As shown, the alignment module 3 may include an image acquisition unit 31, a first axis moving mechanism 32, and a second axis moving mechanism 33.

[0174] The image acquisition device 31 mentioned above includes, but is not limited to, a camera, such as a 2D camera. The image acquisition device 31 is used to acquire image information of each of the multiple sub-boards 200, so as to obtain the position information of each sub-board 200 through the image information.

[0175] The aforementioned first-axis moving mechanism 32 is connected to the image acquisition unit 31. For example, the first-axis moving mechanism 32 and the image acquisition unit 31 are slidably connected via a slide rail or similar means. The first-axis moving mechanism 32 can be configured to drive the image acquisition unit 31 to move along the seam extension direction between two adjacent sub-plates 200 of the plurality of sub-plates 200. For example, these two adjacent sub-plates 200 refer to... Figure 14 The two sub-boards 200 shown in the diagram are used in this case. The first axis moving mechanism 32 can be called the Y-axis moving mechanism, which drives the image acquisition unit 31 to move along the Y direction. Accordingly, the Y-axis moving mechanism can drive the image acquisition unit 31 to acquire the position information of multiple sub-boards 200 in the Y direction.

[0176] The second-axis moving mechanism 33 is connected to the first-axis moving mechanism 32. For example, the second-axis moving mechanism 33 and the first-axis moving mechanism 32 are slidably connected by a slide rail or the like. The second-axis moving mechanism 33 is configured to drive the first-axis moving mechanism 32 to move the image acquisition unit 31 along the arrangement direction of the two adjacent sub-plates 200. For example, these two adjacent sub-plates 200 refer to... Figure 14In the two sub-boards 200 shown, the second axis moving mechanism 33, which can be called the X-axis moving mechanism, is used to drive the first axis moving mechanism 32 to move along the X direction, thereby driving the image acquisition unit 31 to move along the X direction. Accordingly, the X-axis moving mechanism can drive the image acquisition unit 31 to acquire the position information of multiple sub-boards 200 in the X direction.

[0177] The structure of the first axis moving mechanism 32 and the second moving mechanism 33 can be selected and set according to actual needs, as long as they can achieve the corresponding functions.

[0178] By using the above configuration, the first axis moving mechanism 32 and the second axis moving mechanism 33 can be used to adjust the displacement of the image acquisition unit 31 in different directions, thereby acquiring the position information of different sub-boards 200 among multiple sub-boards 200, detecting the splicing size and uniformity between any two adjacent sub-boards 200, and detecting the splicing deviation between multiple sub-boards 200.

[0179] Continue reading Figure 1 The splicing device 100 may also include a gantry structure 10, which may be located on opposite sides of the first axis moving mechanism 32. Each gantry structure 10 may include two legs and a crossbeam. The bottom ends of the two legs are connected to the bearing surface of the bearing platform 1, and the crossbeam is connected to the top ends of the two legs. The two ends of the second axis moving mechanism 33 may be connected to the crossbeams of the two gantry structures 10 respectively. That is, the gantry structure 10 can support and suspend the alignment module 3, realize the installation between the alignment module 3 and the bearing platform 1, and the spacing between the alignment module 3 and the adsorption platform 2.

[0180] Furthermore, in some examples, such as Figure 2b and Figure 2c As shown, the alignment module 3 may also include a focusing assembly 34 and a third-axis moving mechanism 35.

[0181] The focusing component 34 is coupled to the image acquisition unit 31. The focusing component 34 can adjust the focal length of the image acquisition unit 31, enabling the image acquisition unit 31 to focus more accurately on the sub-board 200, obtain clearer image information, and thus obtain more accurate position information.

[0182] The aforementioned third-axis moving mechanism 35 is connected to the first-axis moving mechanism 32 and the focusing assembly 34. The third-axis moving mechanism 35 can be configured to drive the focusing assembly 34 to move along the stacking direction of the support platform 1 and the adsorption platform 2. For example, the third-axis moving mechanism 35 can be called a Z-axis moving mechanism, driving the focusing assembly 34 to move along the Z direction to adjust the focal length of the image acquisition unit 31.

[0183] By adopting the above configuration method, the clarity of the image information acquired by the image acquisition unit 31 can be improved, thereby improving the accuracy of the position information of each sub-board 200 obtained based on the image information, and improving the splicing accuracy and splicing efficiency between multiple sub-boards 200.

[0184] The splicing device 100 described above may also include other structures, which are illustrated below with reference to the accompanying drawings.

[0185] In some embodiments, such as Figure 21 As shown, the edge of the mother plate 2000, which is formed by splicing multiple sub-plates 200, extends out of the adsorption platform 2. That is, the orthographic projection of the adsorption surface of the adsorption platform 2 onto the mother plate 2000 is contained within the mother plate 2000. The edge of the mother plate 2000 surrounds the outer boundary of the orthographic projection of the adsorption surface onto the mother plate 2000, and there is a certain distance between the edge of the mother plate 2000 and the outer boundary of the orthographic projection of the adsorption surface onto the mother plate 2000.

[0186] This facilitates fixing each sub-plate 200 in the mother plate 2000 together with the adsorption platform 2, thereby ensuring the splicing accuracy of each sub-plate 200 in the mother plate 2000 during the joint transfer of the mother plate 2000 and the adsorption platform 2.

[0187] In some embodiments, combined with Figure 1 , Figure 9 and Figure 10 The splicing device 100 may further include a curing module 11, which is mounted on the support platform 1 and disposed around the adsorption platform 2. The curing module 11 may be configured to bond the portion of the mother plate 2000 extending beyond the adsorption platform 2 and the adsorption platform 2 after multiple sub-plates 200 have been adsorbed and fixed onto the adsorption surface S2 of the adsorption platform 2.

[0188] For example, in Figure 21 and Figure 22 In the process of successfully splicing multiple sub-plates 200 and adsorbing and fixing them onto the adsorption surface S2, the portion of each sub-plate 200 located at the edge of the adsorption platform 1 will extend beyond the adsorption platform 2. At this time, the curing module 11 can bond the back side of the portion of each sub-plate 200 extending beyond the adsorption platform 2 to the edge of the adsorption platform 2, thus fixing the multiple sub-plates 200 and the adsorption platform 2 together.

[0189] In other words, in Figure 22 In the process, after the mother plate 2000 is formed, all four edges of the mother plate 2000 extend beyond the adsorption platform 2. The curing module can bond the back of the four edges of the mother plate 2000 to the edges of the adsorption platform 2, fixing the mother plate 2000 and the adsorption platform 2 together.

[0190] The aforementioned "back side" refers to the side surface of the sub-plate 200 or the mother plate 2000 that is in contact with the adsorption platform 2.

[0191] In this way, during the process of transferring the adsorption platform 2 and multiple sub-plates 200 for imprinting, the relative positions between each sub-plate 200 and the adsorption platform 2 can be kept unchanged, ensuring that the splicing accuracy between multiple sub-plates 200 is not lost.

[0192] In some examples, combined Figure 1 , Figure 9 and Figure 10 The curing module 11 may include: multiple limiting tracks 111 and multiple dispensing components 112.

[0193] The aforementioned multiple limiting tracks 111 are installed on the support platform 1 and are located on each side of the adsorption platform 2. For example, in Figure 1 In this configuration, the adsorption platform 2 is rectangular in shape. There can be four limiting tracks 111, each located on one side of the adsorption platform 2. The limiting tracks 111 are strip-shaped, and their extension direction is, for example, the same as the extension direction of the side adjacent to the limiting track 111 in the adsorption platform 2. The length of the limiting track 111 is, for example, the same as, or slightly greater than, the length of the side adjacent to the limiting track 111 in the adsorption platform 2.

[0194] The aforementioned multiple dispensing assemblies 112 and multiple limiting tracks 111 are arranged in a one-to-one correspondence, for example. Each dispensing assembly 112 is slidably connected to its corresponding limiting track 111, and the dispensing assembly 112 can slide along the extending direction of its corresponding limiting track 111. For example, each dispensing assembly 112 is configured to bond the portion of each sub-plate 200 extending out of the adsorption platform 2 and the adsorption platform 2.

[0195] Specifically, the dispensing assembly 112 can be directed to the portion of each sub-board 200 extending from the adsorption platform 2 and the contact position with the adsorption platform 2, and dispensing adhesive at that contact position, such as... Figure 22 The dots around the diagonal fill pattern are shown. As each dispensing assembly 112 slides along its connected limiting track 111, adhesion is achieved between the back of the four edges of the motherboard 2000 and the adsorption platform 2.

[0196] By adopting the above setup, the dispensing process can be automated, thereby improving the bonding efficiency between the motherboard 2000 and the adsorption platform 2.

[0197] Here, during the process of bonding the back of the four edges of the mother plate 2000 to the adsorption platform 2, an alternating dispensing method can be used. This can balance the curing stress at different positions of the mother plate 2000, prevent changes in the relative position of the daughter plate 200, and thus avoid affecting the splicing accuracy of the seam size and the nanoscale pattern.

[0198] For example, combining Figure 22 The aforementioned "alternating dispensing method" can be as follows: first, dispensing adhesive on the back of the upper edge of the first sub-board 200 and the second spliced ​​sub-board 200 at the contact position with the adsorption platform 2; then, dispensing adhesive on the back of the lower edge of the last spliced ​​sub-board 200 and the third spliced ​​sub-board 200 at the contact position with the adsorption platform 2; then, dispensing adhesive on the back of the left edge of the first sub-board 200 and the third spliced ​​sub-board 200 at the contact position with the adsorption platform 2; and finally, dispensing adhesive on the back of the right edge of the second spliced ​​sub-board 200 and the last spliced ​​sub-board 200 at the contact position with the adsorption platform 2.

[0199] Of course, the above-mentioned "alternating dispensing method" is not limited to this; as long as the curing stress can be balanced, it is acceptable.

[0200] In some examples, such as Figure 9 As shown, the limiting track 111 has multiple positioning holes H3, which are used to position the limiting track 111 on the support platform 1. The positioning holes H3 are strip-shaped, and the extending direction of the positioning holes H3 is perpendicular to the extending direction of the limiting track 111.

[0201] This allows the positioning hole H3 to be used to adjust the relative position between the limiting track 111 and the support platform 1, that is, to adjust the relative position between the curing module 11 and the support platform 1, so as to be compatible with the curing of adsorption platforms 2 of different sizes and sub-plates 200 of different sizes.

[0202] In some examples, such as Figure 9 As shown, the dispensing assembly 112 may include a glue gun 1121, which is used to apply glue to the back of the four edges of the motherboard 2000 and the contact position of the adsorption platform 2.

[0203] Furthermore, combined Figure 10 , Figure 11 , Figure 12a and Figure 12bThe curing module 11 may further include a slider 113 and an angle adjustment shaft 115. The slider 113 is engaged with the limiting rail 111 and can slide relative to the limiting rail 111. The angle adjustment shaft 115 is rotatably connected to the slider 113, for example, and the glue gun 1121 is fixedly connected to the angle adjustment shaft 115, for example. By rotating the angle adjustment shaft 115, the glue gun 1121 can be rotated so that the tilt angle of the glue gun 1121 is in a suitable working position. The slider 113 can move the glue gun 1121 relative to the limiting rail 111.

[0204] During the dispensing process of the aforementioned dispensing assembly 112, the adhesive can be in a continuous linear structure or in an intermittent dotted structure. Among these, combined with... Figure 9 In the case where the adhesive is in a dotted structure with intervals, the dispensing assembly 112 may also include an ejector guide shaft 1122, the curing module 11 may also include a first plunger 114, and a plurality of blind holes H2 may be provided on the side surface of the limiting track 111 away from the bearing platform 1, the plurality of blind holes H2 being spaced apart along the extension direction of the limiting track 111.

[0205] The glue gun 1121 and the ejection guide shaft 1122 are slidably connected, and the glue gun 1121 can move along the ejection guide shaft 1122 toward the adsorption platform 2 or away from the adsorption platform 2.

[0206] The first plunger 114 mentioned above is, for example, an elastic plunger. The first plunger 114 is connected to the dispensing assembly 112. The first plunger 114 matches the blind hole H2, that is, a part of the first plunger 114 can extend into the blind hole H2, and the first plunger 114 and the blind hole H2 can cooperate to position the dispensing assembly 112.

[0207] In other words, a portion of the first plunger 114 can extend into a blind hole H2 to position the dispensing assembly 112; then, the glue gun 1121 can first move along the ejection guide shaft 1122 towards the adsorption platform 2, applying dotted glue to the back edge of the mother plate 2000 and the contact position with the adsorption platform 2, and then move along the ejection guide shaft 1122 away from the adsorption platform 2; afterwards, the dispensing assembly 112 can be moved along the extension direction of the limiting track 111, and a portion of the first plunger 114 can be inserted into another blind hole H2 to position the dispensing assembly 112. By repeating the above process, the application of glue in a spaced dotted structure can be achieved.

[0208] By adopting the above configuration, the amount of glue used can be reduced, thus lowering the splicing cost of multiple sub-boards 200. Moreover, the structure of the curing module 11 is relatively simple and easy to implement.

[0209] The adhesive applied by the above-mentioned dispensing component 112 may include various types, and different types of adhesives may have different properties.

[0210] For example, the adhesive applied by the dispensing assembly 112 can cure naturally. In this case, it is not necessary to cure the adhesive.

[0211] For example, the adhesive applied by the dispensing assembly 112 needs to be cured. In this case, the curing module 11 may also include other structures.

[0212] For example, in combination Figure 1 and Figure 9 The curing module 11 may also include a quick-change structure 116 and a dispensing curing structure 117. The dispensing curing structure 117 includes, but is not limited to, a curing lamp. The quick-change structure 116 includes, but is not limited to, a quick-release plunger and a magnetic structure; the quick-release plunger supports the dispensing and has virtually no impact on the amount of adhesive dispensed.

[0213] The quick-change structure 116 is configured to detachably connect the dispensing assembly 112 and the limiting rail 111, or to detachably connect the dispensing curing structure 117 and the limiting rail 111. The dispensing curing structure 117 is configured to cure the adhesive applied by the glue gun 1121.

[0214] This not only enables the curing of the adhesive applied by the dispensing assembly 112, but also allows for the rapid installation and disassembly of the dispensing assembly 112 and the curing structure 117, improving the splicing efficiency of multiple sub-boards 200.

[0215] It is understood that the splicing equipment 100 may also include auxiliary tooling, industrial control computers, etc. Among them, auxiliary tooling includes, but is not limited to, structures such as wiring and equipment housing, and industrial control computers include, but are not limited to, personal computers (PCs).

[0216] The various structures included in the splicing equipment 100, such as the bearing platform 1, the adsorption platform 2, the alignment module 3, the displacement control module 4, the ring frame 5, the support component 6, and the reference positioning structure 8, can all be disassembled (or split) and assembled. This not only facilitates the transportation of the splicing equipment 100, but also reduces the maintenance cost of the splicing equipment 100.

[0217] Some embodiments of this application also provide a splicing method, for example, for splicing multiple sub-boards used for imprinting. Exemplarily, this splicing method can be applied to the splicing device 100 described in any of the above embodiments. In some examples, the splicing method includes steps S100-S300.

[0218] S100 obtains the position information of each sub-board among multiple sub-boards through the alignment module.

[0219] S200, based on the position information of each sub-board in the above-mentioned multiple sub-boards, splices multiple sub-boards through a displacement control module.

[0220] S300 uses an adsorption platform to adsorb and fix the aforementioned sub-plates onto the adsorption surface of the adsorption platform.

[0221] For example, the steps shown in S100, S200, and S300 above are not exclusive, and other steps may be performed before, after, or between any of the above steps. Furthermore, some of the steps may be performed simultaneously, or they may be performed in a different order than described above.

[0222] For example, the steps shown in S100, S200, and S300 above can be repeated for each sub-board to be assembled until multiple sub-boards are assembled.

[0223] Some of the splicing methods provided in this application can achieve the same beneficial effects as the splicing device 100 described in any of the above embodiments when executed by the splicing device 100 described in any of the above embodiments, and will not be described again here.

[0224] The following diagram, with reference to the accompanying drawings, illustrates each step of the above splicing method.

[0225] In some embodiments, such as Figure 13 As shown in (c), before the above S100, the first sub-plate 200 can be adsorbed and fixed on the adsorption surface S2 of the adsorption platform 2.

[0226] Specifically, the first sub-plate 200 can be located within an adsorption zone, and its two sides can contact the reference positioning structure 8 connected to the adsorption platform 2. The first sub-plate 200 and the reference positioning structure 8 cooperate to obtain a static reference for the first sub-plate 200, facilitating the splicing of subsequent sub-plates 200. After the first sub-plate 200 is placed, a vacuum can be drawn into the adsorption zone where the first sub-plate 200 is located, adsorbing and fixing the first sub-plate 200 onto the adsorption surface of the adsorption platform 2, thus locking the position of the first sub-plate 200.

[0227] After this, the above-mentioned S100 can be executed to obtain image information of the top corner area of ​​the first sub-board 200 by aligning the module, and then obtain the position information of the first sub-board 200.

[0228] In some embodiments, such as Figure 14 , Figure 15 and Figure 16As shown, in the above S200, based on the position information of each of the multiple sub-plates 200, the multiple sub-plates 200 are spliced ​​by the displacement control module 4. This includes: based on the position information of the sub-plate 200b to be spliced ​​placed on the adsorption surface after at least one sub-plate 200 has been adsorbed and fixed on the adsorption surface, and the position information of the reference sub-plate 200a corresponding to the sub-plate 200b to be spliced, the displacement control module 4 splices the sub-plate 200b to be spliced ​​and the reference sub-plate 200a. The reference sub-plate 200a is one of the at least one sub-plate 200 that has been adsorbed and fixed on the adsorption surface.

[0229] Combination Figure 13 (c) and Figure 14 The number of sub-plates 200 that have been adsorbed and fixed on the adsorption surface is one, and this is the first sub-plate 200. At this time, the reference sub-plate 200a is the first sub-plate 200, and the splicing reception sub-plate 200b is the second spliced ​​sub-plate 200. Figure 17 In this process, there are two sub-plates 200 that have been adsorbed and fixed on the adsorption surface, including a first sub-plate 200 and a second spliced ​​sub-plate 200. At this time, the reference sub-plate 200a can be the second spliced ​​sub-plate 200, or, as... Figure 17 As shown, reference sub-board 200a can be the first sub-board 200, and splicing reception sub-board 200b is the third splicing sub-board 200.

[0230] In other words, the sub-plate 200b to be spliced ​​can use the reference sub-plate 200a, which has been adsorbed and fixed on the adsorption surface, as an alignment reference to adjust the splicing state between the splicing sub-plate 200b and the reference sub-plate 200a, so that the splicing sub-plate 200b and the reference sub-plate 200a meet the splicing requirements. Compared with using other alignment references (including but not limited to alignment marks), this can eliminate alignment errors and alignment accuracy errors introduced during the alignment process, effectively reduce the splicing seam size, and ensure the splicing accuracy of the nanoscale patterns between the splicing sub-plate 200b and the reference sub-plate 200a. Furthermore, it can effectively increase the area ratio of nanoscale patterns in each sub-plate 200.

[0231] In some examples, the displacement control module 4 described above includes at least a first displacement control module 4a and a second displacement control module 4b. The first displacement control module 4a is used to move the sub-plate 200 in a first direction, and the second displacement control module 4b is used to move the sub-plate 200 in a second direction. For details regarding the first and second directions, please refer to the relevant descriptions above; they will not be repeated here.

[0232] Specifically, the above-mentioned position information of the sub-plate 200b to be spliced ​​placed on the adsorption surface after at least one sub-plate 200 has been adsorbed and fixed on the adsorption surface, and the position information of the reference sub-plate 200a corresponding to the sub-plate 200b to be spliced, are used to splice the sub-plate 200b and the reference sub-plate 200a through the displacement control module 4, including: S210-S220.

[0233] S210, such as Figure 14 and Figure 15 As shown, based on the first splicing distance D1 between the sub-board 200b to be spliced ​​and the reference sub-board 200a in the first direction, the first displacement control module 4a moves the sub-board 200b to be spliced ​​in the first direction so that the sub-board 200b to be spliced ​​contacts the reference sub-board 200a in the first direction. The first splicing distance D1 between the sub-board 200b to be spliced ​​and the reference sub-board 200a in the first direction is determined based on the position information of the sub-board 200b to be spliced ​​and the position information of the reference sub-board 200a.

[0234] S220, such as Figure 14 and Figure 16 As shown, based on the second splicing distance D2 between the sub-board 200b to be spliced ​​and the reference sub-board 200a in the second direction, the second displacement control module 4b moves the sub-board 200b to be spliced ​​in the second direction so that the sub-board 200b to be spliced ​​and the reference sub-board 200a satisfy the constraint condition of edge collinearity in the second direction. The second splicing distance D2 between the sub-board 200b to be spliced ​​and the reference sub-board 200a in the second direction is determined based on the position information of the sub-board 200b to be spliced ​​and the position information of the reference sub-board 200a.

[0235] Here, taking reference sub-board 200a as the first sub-board 200 and sub-board 200b to be spliced ​​as the second sub-board 200 to be spliced ​​as an example, the above S210 and S220 are illustrated.

[0236] For example, before S210 above, such as Figure 14 As shown, the sub-plate 200b to be spliced ​​can be placed on the adsorption surface of the adsorption platform 2. The sub-plate 200b to be spliced ​​is in contact with the auxiliary positioning structure 9, for example, and has a free gap with the reference sub-plate 200a. The auxiliary positioning structure 9 can serve as a positioning constraint for the sub-plate 200b to be spliced, reducing the initial alignment range between the sub-plate 200b to be spliced ​​and the reference sub-plate 200a.

[0237] Next, S210 is executed. The first displacement control module 4a moves the sub-plate 200b to be spliced, causing it to move along the first direction and approach the reference sub-plate 200a. The reference sub-plate 200a moves a first splicing distance D1, so that the sub-plate 200b and the reference sub-plate 200a are in close contact, thereby controlling the splicing seam between them. After the sub-plate 200b and the reference sub-plate 200a are in close contact, the first displacement control module 4a remains against the sub-plate 200b to be spliced, thus controlling the contact force between the sub-plate 200b and the reference sub-plate 200a.

[0238] After executing S210 and before executing S220, as follows Figure 15 As shown, the seam can be verified using an alignment module. For example, the alignment module can acquire the position information of the sub-board 200b to be spliced ​​and the reference sub-board 200a, and obtain the seam information based on this position information.

[0239] If the seam has high uniformity and the seam size is within a controllable range, then S230 can be executed. The second displacement control module 4b cooperates with the alignment module to move the sub-plate 200b to be spliced ​​along the second direction until the sub-plate 200b to be spliced ​​and the reference sub-plate 200a satisfy the constraint condition of edge collinearity in the second direction.

[0240] After executing S220 above, as Figure 16 As shown, the alignment module can be used to verify whether the edges of the sub-board 200b to be spliced ​​and the reference sub-board 200a are collinear in the second direction. For example, the alignment module can obtain the position information of the sub-board 200b to be spliced ​​and the reference sub-board 200a, and obtain information on whether the edges are collinear based on the position information.

[0241] If the sub-board 200b to be spliced ​​and the reference sub-board 200a satisfy the constraint condition of collinear edges in the second direction, then the above-described S300 is executed. Specifically, in the above-described S300, the multiple sub-boards 200 are adsorbed and fixed onto the adsorption surface one by one by the adsorption platform 2, including: after the sub-board 200b to be spliced ​​and the reference sub-board 200a are successfully spliced, the sub-board 200b to be spliced ​​is adsorbed and fixed onto the adsorption surface by the adsorption platform 2.

[0242] For example, a vacuum can be drawn in the adsorption area where the sub-board 200b to be spliced ​​is located, and the sub-board 200b to be spliced ​​can be adsorbed and fixed on the adsorption surface of the adsorption platform 2, thereby locking the position of the sub-board 200b to be spliced.

[0243] Next, the third sub-board 200 can be assembled. Taking reference sub-board 200a as the first sub-board 200 and the third sub-board 200 to be assembled as the sub-board 200b, as an example... Figure 17 , Figure 18 and Figure 19 As shown, the splicing process of the third sub-board 200 is the same as that of the second sub-board 200. Therefore, the splicing process of the second sub-board 200 can be repeated to achieve the splicing between the third sub-board 200 and the first sub-board 200. For details, please refer to the relevant explanation above, which will not be repeated here.

[0244] After the third sub-board 200 is assembled, the fourth sub-board 200 can be assembled. The assembly process of the fourth sub-board 200 will now be illustrated with reference to the accompanying drawings. At this point, the fourth sub-board 200 can be considered as the sub-board 200b to be assembled, while the second and third sub-boards 200 can both be considered as reference sub-boards 200a.

[0245] like Figure 20a and Figure 20b As shown, the fourth spliced ​​sub-plate 200 is placed on the adsorption surface of the adsorption platform 2. The fourth spliced ​​sub-plate 200 is in contact with the auxiliary positioning structure 9, for example, and has free gaps with the second and third spliced ​​sub-plates 200.

[0246] Taking the fourth spliced ​​sub-board 200 with a first displacement control module 4a set on each of its adjacent sides as an example, such as Figure 20b As shown, the two first displacement control modules 4a respectively move the fourth spliced ​​sub-plate 200 so that the fourth spliced ​​sub-plate 200 approaches the second spliced ​​sub-plate 200 and the third spliced ​​sub-plate 200 respectively, and makes close contact with the second spliced ​​sub-plate 200 and the third spliced ​​sub-plate 200, thereby realizing the adjustment of the splice seam between the fourth spliced ​​sub-plate 200 and the second spliced ​​sub-plate 200, and the adjustment of the splice seam between the fourth spliced ​​sub-plate 200 and the third spliced ​​sub-plate 200; and realize the control of the contact force between the fourth spliced ​​sub-plate 200 and the second spliced ​​sub-plate 200, and the contact force between the fourth spliced ​​sub-plate 200 and the third spliced ​​sub-plate 200 by the two first displacement control modules 4a.

[0247] Next, as Figure 21As shown, the alignment module can be used to verify the seams and the center "cross". For example, the alignment module can acquire the position information of the fourth and second spliced ​​sub-boards 200, and based on this position information, acquire the seam information between the fourth and second spliced ​​sub-boards 200; acquire the position information of the fourth and third spliced ​​sub-boards 200, and based on this position information, acquire the seam information between the fourth and third spliced ​​sub-boards 200. The alignment module can acquire the position information of the first, second, third, and fourth spliced ​​sub-boards 200, and based on this position information, acquire the center "cross" information of the four sub-boards 200.

[0248] With the seams and the central "cross" within a controllable range, the adsorption area where the fourth spliced ​​sub-plate 200 is located can be vacuumed to adsorb and fix the fourth spliced ​​sub-plate 200 onto the adsorption surface of the adsorption platform 2, thereby locking the position of the fourth spliced ​​sub-plate 200 and splicing multiple sub-plates 200.

[0249] Next, as Figure 22 As shown, the splicing method provided in this application embodiment further includes: when multiple sub-boards 200 are all adsorbed and fixed on the adsorption surface, the portion of the mother board 2000 extending from the adsorption platform 2 and the adsorption platform 2 are bonded together by the curing module 11.

[0250] For example, such as Figure 23 As shown, after the splicing of multiple sub-plates 200 (or mother plate 2000) is completed, and before bonding each sub-plate 200 in the mother plate 2000 and the adsorption platform 2, the splicing seams and central "cross" between the multiple sub-plates 200 can be checked again while maintaining the edge constraints and vacuum adsorption of the multiple sub-plates 200, so as to avoid other operations that may degrade the splicing seam size and splicing accuracy.

[0251] After the second verification is completed, as follows Figure 24 As shown, the edge constraints of each sub-plate 200 can be released, that is, the roller assembly 42 in each displacement control module 4 moves away from the adsorption platform 2. This removes the stress along the Z direction formed between two adjacent sub-plates 200, and between the roller assembly 42 and the corresponding sub-plate 200, or the stress along the Z direction caused by other reasons. Then, the joints and the central "cross" between the multiple sub-plates 200 are checked again to ensure that the joints and the central "cross" are within a controllable range.

[0252] During the bonding process of the sub-boards 200 and the adsorption platform 2, an alternating dispensing method can be used. This can balance the curing stress at different positions of the sub-boards 200, prevent changes in the relative positions of the sub-boards 200, and thus avoid affecting the splicing accuracy of the seam size and the nanoscale pattern.

[0253] For information on alternating dispensing methods, please refer to the relevant explanations above; they will not be repeated here.

[0254] After gluing each sub-board 200 and the adsorption platform 2 together, the alignment module 3 can be used to check the seams and the central "cross" between the multiple sub-boards 200 again to ensure that the seam and splicing accuracy are still within a controllable range during the curing process of each sub-board 200 and the adsorption platform 2.

[0255] Then, the reference positioning structure 8 and auxiliary positioning structure 9 connected to the adsorption platform 2 can be removed, and the vacuum can be broken to disconnect the vacuum adsorption between the adsorption platform 2 and each sub-plate 200. The adsorption platform 2 with the mother plate 2000 fixed on it can be taken out from the splicing equipment 100 and transferred to the rolling equipment for pressing (or transfer). The fixing method between the mother plate 2000 and the adsorption platform 2 can effectively reduce the seam extension along the rolling direction in the subsequent rolling equipment, ensuring the transfer quality.

[0256] Some embodiments of this application also provide a computer device, which may be a server. This computer device includes, for example, a processor, memory, and a network interface connected via a system bus. The processor of the computer device provides computing and control capabilities. The memory of the computer device includes a non-volatile storage medium and internal memory. The non-volatile storage medium stores an operating system, computer programs, and a database. The internal memory provides an environment for the operation of the operating system and computer programs in the non-volatile storage medium. The database of the computer device is used to store data. The network interface of the computer device is used to communicate with external terminals via a network connection. When the computer program is executed by the processor, it implements the splicing method provided in some of the above embodiments.

[0257] In some embodiments, a computer device is provided, the computer device including a memory and a processor, the memory being coupled to the processor. The memory stores a computer program, the computer program including computer instructions, which, when executed by the processor, enable the computer device to implement the splicing method as described in any of the above embodiments.

[0258] Some embodiments of this application also provide a computer program product, which may be a software or program product containing instructions capable of running on a computer device or stored on any usable medium. When the computer program product is run on a computer device, it causes the computer device to perform the above-described splicing method.

[0259] Some embodiments of this application also provide a computer-readable storage medium. This computer-readable storage medium can be any available medium capable of being stored by a computer device, or a data storage device such as a data center containing one or more available media. The available medium can be a magnetic medium (e.g., floppy disk, hard disk, magnetic tape), an optical medium (e.g., DVD), or a semiconductor medium (e.g., solid-state drive). The computer-readable storage medium includes a computer program that, when executed on a computer device, causes the computer device to perform the splicing method as described in any of the above embodiments.

[0260] In the above embodiments, implementation can be achieved entirely or partially through software, hardware, firmware, or any combination thereof. When implemented using software, it can be implemented entirely or partially in the form of a computer program product. The computer program product includes one or more computer programs or instructions. When the computer program or instructions are loaded and executed on a computer, the processes or functions described in the embodiments of this application are performed entirely or partially. The computer device can be a general-purpose computer, a special-purpose computer, a computer network, a network device, a user equipment, or other programmable device. The computer program or instructions can be stored in a computer-readable storage medium or transferred from one computer-readable storage medium to another. For example, the computer program or instructions can be transferred from one website, computer, server, or data center to another website, computer, server, or data center via wired or wireless means. The computer-readable storage medium can be any available medium that a computer can access or a data storage device such as a server or data center that integrates one or more available media. The available medium can be a magnetic medium, such as a floppy disk, hard disk, or magnetic tape; it can also be an optical medium, such as a digital video disc (DVD); or it can be a semiconductor medium, such as a solid-state drive (SSD).

[0261] In the description of this specification, specific features, structures, materials, or characteristics may be combined in any suitable manner in one or more embodiments or examples.

[0262] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions conceived by those skilled in the art within the scope of the technology disclosed herein should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A splicing device, characterized in that, The splicing equipment includes: Platform; An adsorption platform is mounted on the support platform; the adsorption platform has an adsorption surface; the adsorption platform is configured to adsorb and fix multiple sub-plates on the adsorption surface. The alignment module is configured to acquire the position information of each of the plurality of sub-boards; A displacement control module is installed on the support platform; the displacement control module is configured to splice the multiple sub-boards based on the position information of each sub-board before adsorbing and fixing at least some of the sub-boards on the adsorption surface.

2. The splicing equipment according to claim 1, characterized in that, The displacement control module is specifically configured to splice the sub-board to be spliced ​​and the reference sub-board based on the position information of the sub-board to be spliced ​​placed on the adsorption surface after at least one sub-board has been adsorbed and fixed on the adsorption surface, and the position information of the reference sub-board corresponding to the sub-board to be spliced; the reference sub-board is one of the at least one sub-board that has been adsorbed and fixed on the adsorption surface. The adsorption platform is specifically configured to adsorb and fix the sub-board to be spliced ​​onto the adsorption surface after the sub-board to be spliced ​​and the reference sub-board are successfully spliced.

3. The splicing equipment according to claim 2, characterized in that, The displacement control module includes at least a first displacement control module and a second displacement control module. The first displacement control module is used to move the sub-board to be spliced ​​in a first direction, and the second displacement control module is used to move the sub-board to be spliced ​​in a second direction. The first direction is the arrangement direction of the sub-board to be spliced ​​and the reference sub-board, and the second direction intersects with the first direction.

4. The splicing equipment according to claim 3, characterized in that, The first displacement control module is configured to move the sub-board to be spliced ​​in the first direction based on a first splicing distance between the sub-board to be spliced ​​and the reference sub-board in the first direction, so that the sub-board to be spliced ​​contacts the reference sub-board in the first direction; wherein, the first splicing distance between the sub-board to be spliced ​​and the reference sub-board in the first direction is determined based on the position information of the sub-board to be spliced ​​and the position information of the reference sub-board; The second displacement control module is configured to move the sub-board to be spliced ​​in the second direction based on the second splicing distance between the sub-board to be spliced ​​and the reference sub-board in the second direction, so that the sub-board to be spliced ​​and the reference sub-board satisfy the constraint condition of edge collinearity in the second direction; the second splicing distance between the sub-board to be spliced ​​and the reference sub-board in the second direction is determined according to the position information of the sub-board to be spliced ​​and the position information of the reference sub-board.

5. The splicing equipment according to any one of claims 1-4, characterized in that, The displacement control module includes a control body and a roller assembly, wherein the roller assembly is slidably connected to the control body; the roller assembly can slide relative to the control body toward the adsorption platform. The roller assembly includes a plurality of rollers spaced apart, the arrangement direction of the plurality of rollers intersects the sliding direction of the roller assembly, and each of the plurality of rollers has a degree of rolling freedom.

6. The splicing device according to claim 5, characterized in that, The outer circumference of the roller is covered with an elastic material.

7. The splicing device according to claim 6, characterized in that, The alignment module is also configured to acquire the deformation of the elastic material; The displacement control module includes a first displacement control module; the first displacement control module is further configured to stop moving the sub-board to be spliced ​​when the deformation reaches a threshold.

8. The splicing equipment according to any one of claims 1-7, characterized in that, The splicing equipment also includes: An annular frame is arranged around the adsorption platform; Multiple support members are connected between the support platform and the annular frame; The displacement control module is connected to the annular frame and is located on the side of the annular frame closer to the support platform.

9. The splicing equipment according to claim 8, characterized in that, The annular frame has multiple connection holes; The splicing device also includes multiple connectors, which are respectively connected to multiple support members through multiple connection holes; Among them, at least two of the plurality of connecting holes are precision holes.

10. The splicing equipment according to any one of claims 1-9, characterized in that, The adsorption platform has multiple adsorption zones arranged in an array, and the adsorption zones are configured to independently adsorb and fix the sub-plates located within the adsorption zones. At least one displacement control module is provided on each of the adjacent sides of the adsorption region.

11. The splicing device according to claim 10, characterized in that, The adsorption region is provided with multiple annular cavities, including at least a first annular cavity and a second annular cavity, with the second annular cavity surrounding the first annular cavity.

12. The splicing equipment according to any one of claims 1-11, characterized in that, The adsorption platform has multiple apex corners; The splicing device also includes a reference positioning structure, which is detachably installed at one of the plurality of apex corners and spaced apart from the adsorption surface.

13. The splicing device according to claim 12, characterized in that, The splicing device also includes multiple auxiliary positioning structures, which are detachably installed at the remaining vertices of the multiple vertices and are all spaced apart from the adsorption surface.

14. The splicing equipment according to any one of claims 1-13, characterized in that, The alignment module includes: Image acquisition device; A first axis moving mechanism is connected to the image acquisition device; the first axis moving mechanism is configured to drive the image acquisition device to move along the seam extension direction between two adjacent sub-boards in the plurality of sub-boards; The second axis moving mechanism is connected to the first axis moving mechanism; the second axis moving mechanism is configured to drive the first axis moving mechanism to move the image acquisition unit along the arrangement direction of the two adjacent sub-plates.

15. The splicing device according to claim 14, characterized in that, The alignment module also includes: The focusing component is coupled to the image acquisition unit; The third axis moving mechanism is connected to the first axis moving mechanism and the focusing assembly; the third axis moving mechanism is configured to drive the focusing assembly to move along the stacking direction of the carrying platform and the adsorption platform.

16. The splicing equipment according to any one of claims 1-15, characterized in that, The adsorption platform is detachably mounted on the support platform.

17. The splicing equipment according to any one of claims 1-16, characterized in that, The edge of the mother plate extends beyond the adsorption platform; The mother board is obtained by splicing together the multiple sub-boards.

18. The splicing device according to claim 16 or 17, characterized in that, The splicing equipment also includes a curing module, which is installed on the support platform and arranged around the adsorption platform; The curing module is configured to, after adsorbing and fixing the plurality of sub-plates onto the adsorption surface, bond the portion of the mother plate extending out of the adsorption platform and the adsorption platform. The mother board is obtained by splicing together the multiple sub-boards.

19. The splicing device according to claim 18, characterized in that, The curing module includes: Multiple limiting tracks are installed on the support platform and are located on each side of the adsorption platform; Multiple dispensing assemblies are slidably connected to the multiple limiting tracks, respectively; the dispensing assemblies are configured to bond the portion of the mother plate extending from the adsorption platform and the adsorption platform.

20. The splicing device according to claim 19, characterized in that, The dispensing assembly includes a glue gun and an ejection guide shaft, the glue gun and the ejection guide shaft being slidably connected; The curing module further includes a first plunger, which is connected to the dispensing assembly; Multiple blind holes are provided on the side surface of the limiting track away from the bearing platform, and the multiple blind holes are spaced apart along the extension direction of the limiting track; the first plunger matches the blind holes and is used to position the dispensing assembly.

21. The splicing device according to claim 19 or 20, characterized in that, The curing module also includes: a quick-change structure and a dispensing curing structure; The quick-change structure is configured to detachably connect the dispensing assembly and the limiting track, or to detachably connect the dispensing curing structure and the limiting track; the dispensing curing structure is configured to cure the adhesive applied by the glue gun.

22. The splicing equipment according to any one of claims 1-21, characterized in that, The supporting platform includes an air-bearing vibration isolation platform.

23. A splicing method, characterized in that, The splicing method, applied to the splicing equipment as described in any one of claims 1-22, comprises: The position information of each sub-board in multiple sub-boards is obtained by aligning the module; Based on the position information of each sub-board in the plurality of sub-boards, the plurality of sub-boards are spliced ​​together by a displacement control module; The multiple sub-plates are adsorbed and fixed on the adsorption surface of the adsorption platform by the adsorption platform.

24. The splicing method according to claim 23, characterized in that, The step of splicing the multiple sub-boards using a displacement control module based on the position information of each sub-board includes: Based on the position information of the sub-board to be spliced ​​placed on the adsorption surface after at least one sub-board has been adsorbed and fixed on the adsorption surface, and the position information of the reference sub-board corresponding to the sub-board to be spliced, the sub-board to be spliced ​​and the reference sub-board are spliced ​​by the displacement control module; the reference sub-board is one of the at least one sub-board that has been adsorbed and fixed on the adsorption surface.

25. The splicing method according to claim 24, characterized in that, The process of adsorbing and fixing multiple sub-plates onto the adsorption surface via an adsorption platform includes: After the sub-board to be spliced ​​is successfully spliced ​​with the reference sub-board, the sub-board to be spliced ​​is adsorbed and fixed on the adsorption surface by an adsorption platform.

26. The splicing method according to claim 24, characterized in that, The displacement control module includes at least a first displacement control module and a second displacement control module. The first displacement control module is used to move the sub-board to be spliced ​​in a first direction, and the second displacement control module is used to move the sub-board to be spliced ​​in a second direction. The first direction is the arrangement direction of the sub-board to be spliced ​​and the reference sub-board, and the second direction intersects with the first direction. The method of splicing the sub-board to be spliced ​​and the reference sub-board through a displacement control module, based on the position information of the sub-board to be spliced ​​placed on the adsorption surface after at least one sub-board has been adsorbed and fixed on the adsorption surface, and the position information of the reference sub-board corresponding to the sub-board to be spliced, includes: Based on the first splicing distance between the sub-board to be spliced ​​and the reference sub-board in the first direction, the first displacement control module moves the sub-board to be spliced ​​in the first direction so that the sub-board to be spliced ​​contacts the reference sub-board in the first direction; wherein, the first splicing distance between the sub-board to be spliced ​​and the reference sub-board in the first direction is determined according to the position information of the sub-board to be spliced ​​and the position information of the reference sub-board; Based on the second splicing distance between the sub-board to be spliced ​​and the reference sub-board in the second direction, the second displacement control module moves the sub-board to be spliced ​​in the second direction so that the sub-board to be spliced ​​and the reference sub-board satisfy the constraint condition of edge collinearity in the second direction; the second splicing distance between the sub-board to be spliced ​​and the reference sub-board in the second direction is determined according to the position information of the sub-board to be spliced ​​and the position information of the reference sub-board.

27. The splicing method according to any one of claims 23-26, characterized in that, The edge of the mother plate obtained by splicing the multiple sub-plates extends out of the adsorption platform; The splicing method also includes: With all the sub-plates adsorbed and fixed on the adsorption surface, the portion of the mother plate extending out of the adsorption platform and the adsorption platform are bonded together by a curing module.

28. A computer device, characterized in that, The computer device includes a memory and a processor, the memory being coupled to the processor; wherein the memory stores a computer program, the computer program including computer instructions, and when the computer instructions are executed by the processor, the computer device implements the splicing method as described in any one of claims 23-27.

29. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores a computer program that, when run on a computer device, causes the computer device to perform the splicing method as described in any one of claims 23-27.

30. A computer program product, characterized in that, When the computer program product is run on a computer device, the computer device performs the splicing method as described in any one of claims 23-27.

Images