A method, device and system for determining photoresist allowance

Abstract

The application provides a photoresist residual amount determination method, a determination device and a determination system, which are applied to a photoresist spraying device, the photoresist spraying device has a photoresist container and a buffer container, the photoresist container is communicated with a booster pipeline and the buffer container, and the method comprises the following steps: in the process of spraying photoresist on a substrate surface by using the photoresist spraying device, photoresist residual amount reference parameters of the photoresist spraying device at a target time are obtained; based on the photoresist residual amount reference parameters of the photoresist spraying device at the target time, photoresist residual amount of the buffer container at the target time is determined; wherein the photoresist residual amount reference parameters comprise gravity parameters of the photoresist container, air pressure parameters of the booster pipeline, hydraulic parameters of the buffer container and photoresist flow parameters between the photoresist container and the buffer container. Further, it can be ensured that the process will not be interrupted due to the replacement of the photoresist container, and the stability and continuity of the process can be maintained.

Description

Technical Field

[0001] This application relates to the field of semiconductor device manufacturing technology, and in particular to a method, apparatus and system for determining photoresist margin. Background Technology

[0002] In semiconductor device manufacturing processes, when the photoresist material in the photoresist pipeline is depleted, the corresponding photoresist spraying equipment will issue an alarm to prompt the relevant technicians to replace the photoresist container. During the replacement of the photoresist container, the ongoing process will be forced to pause because there is no photoresist material in the photoresist pipeline. Summary of the Invention

[0003] A first aspect of this application provides a method for determining photoresist margin, applied to a photoresist spraying device. The photoresist spraying device has a photoresist container and a buffer container, the photoresist container being connected to a pressurization pipeline and the buffer container respectively. The method includes: during the process of spraying photoresist onto a substrate surface using the photoresist spraying device, obtaining a reference parameter of the photoresist margin of the photoresist spraying device at a target time; and determining the photoresist margin of the buffer container at the target time based on the reference parameter of the photoresist margin of the photoresist spraying device at the target time. The reference parameter of the photoresist margin includes the gravity parameter of the photoresist container, the air pressure parameter of the pressurization pipeline, the hydraulic parameter of the buffer container, and the photoresist flow rate parameter between the photoresist container and the buffer container.

[0004] A second aspect of this application provides a device for determining photoresist margin, applied to a photoresist spraying equipment. The photoresist spraying equipment includes a pressurization pipeline, a photoresist container, and a buffer container. The photoresist container is connected to both the pressurization pipeline and the buffer container. The device includes: an acquisition module, used to acquire reference parameters of the photoresist margin of the photoresist spraying equipment at a target time during the process of spraying photoresist onto a substrate surface using the photoresist spraying equipment; and a determination module, used to determine the photoresist margin of the buffer container at a target time based on the reference parameters of the photoresist margin of the photoresist spraying equipment at the target time. The photoresist margin reference parameters include the gravity parameters of the photoresist container, the air pressure parameters of the pressurization pipeline, the hydraulic parameters of the buffer container, and the photoresist flow rate parameters between the photoresist container and the buffer container.

[0005] A third aspect of this application provides a system for determining photoresist margin, comprising: a photoresist spraying device having a photoresist container and a buffer container, the photoresist container being connected to a pressurization pipeline and the buffer container respectively; a sensing component disposed on the photoresist container and the buffer container; and a photoresist margin determination device electrically connected to the sensing component, wherein the photoresist margin determination device is the photoresist margin determination device shown in the embodiment of this application. Attached Figure Description

[0006] The accompanying drawings, which are included to provide a further understanding of this application and form part of this application, illustrate exemplary embodiments and are used to explain this application, but do not constitute an undue limitation of this application. In the drawings:

[0007] Figure 1 This is a schematic diagram of the structure of an optical resistive transmission system provided in an embodiment of this application;

[0008] Figure 2 This is a schematic diagram of another optical resistive transmission system provided in an embodiment of this application;

[0009] Figure 3 A schematic diagram of the structure of a photoresist margin prediction model provided in an embodiment of this application;

[0010] Figure 4 A schematic diagram illustrating the change of photoresist margin over time, provided as an embodiment of this application;

[0011] Figure 5 A schematic diagram illustrating the comparison of regularization term optimization errors provided in an embodiment of this application.

[0012] Figure 6 A flowchart illustrating a method for determining photoresist margin provided in an embodiment of this application;

[0013] Figure 7 A schematic flowchart of a device for determining optical resist margin provided in an embodiment of this application;

[0014] Figure 8 This is a schematic diagram of a system for determining photoresist margin provided in an embodiment of this application. Detailed Implementation

[0015] The embodiments of this application will now be described with reference to the accompanying drawings. However, it should be understood that these descriptions are merely exemplary and not intended to limit the scope of this application. Furthermore, descriptions of well-known structures and technologies are omitted in the following description to avoid unnecessarily obscuring the concepts of this application.

[0016] The accompanying drawings illustrate various structural schematics according to embodiments of this application. These drawings are not to scale, and some details have been enlarged for clarity, and some details may have been omitted. The shapes of the various regions and layers shown in the drawings, as well as their relative sizes and positional relationships, are merely exemplary and may deviate from reality due to manufacturing tolerances or technical limitations. Furthermore, those skilled in the art can design regions / layers with different shapes, sizes, and relative positions as needed.

[0017] In the context of this application, when a layer / element is referred to as being "on top of" another layer / element, the layer / element can be directly on top of the other layer / element, or there can be an intermediate layer / element between them. Furthermore, if a layer / element is "on top of" another layer / element in one orientation, then when the orientation is reversed, the layer / element can be "below" the other layer / element. To make the technical problems, technical solutions, and beneficial effects to be solved by this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of this application and are not intended to limit this application.

[0018] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise expressly specified. "Several" means one or more, unless otherwise expressly specified.

[0019] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0020] In semiconductor device manufacturing processes, when the photoresist material in a photoresist circuit is depleted, the photoresist system issues an alarm to prompt technicians to manually replace the photoresist container currently connected to the photoresist circuit, thus restoring the ongoing process to normal operation. However, during the replacement of the photoresist container, the process is forced to stop due to the lack of photoresist material in the photoresist circuit. Furthermore, because the required amount of photoresist is large, the photoresist container needs to be replaced continuously. Therefore, in the aforementioned process, each time technicians replace the photoresist container, the ongoing process is forced to terminate, leading to a significant decrease in the overall efficiency of the production line.

[0021] Figure 1 This is a schematic diagram of the structure of an optical resistive transmission system provided in an embodiment of this application. Figure 1As shown, the photoresist transmission system 100 includes a photoresist conduit 101, a photoresist container 102, and a pressure valve 103. The photoresist conduit 101 includes a flow valve 104, a buffer container 105, a filter 106, a collection tank 107, an Advanced Chemical Regeneration and Distribution Pump (ACRD Pump) 108, a vacuum system (VAC) 109, a solenoid valve (EV) 1010, an advanced liquid monitoring and control valve (AMC valve) 1011, and a spray head 1012. Here, the gas output end of the pressure valve 103 can be located inside the photoresist container 102, and the outlet of the photoresist container 102 can be connected to the inlet of the photoresist conduit 101. Thus, pressurized gas can be used to pressurize the inside of the photoresist container 102 through the pressure valve 103. It should be understood that the gas output end of the pressure valve 103 can be set above the photoresist material inside the photoresist container 102. Thus, by pressurizing the photoresist container 102, the photoresist material can be squeezed and flow into the photoresist container 102. The pressurizing gas can be nitrogen.

[0022] like Figure 1 As shown, pressurized gas can be introduced into the photoresist container 102 through the pressure valve 103 to pressurize the photoresist container 102, causing the photoresist material in the photoresist container 102 to flow into the buffer container 105; then the photoresist material flowing into the buffer container 105 will flow into the buffer container 105 under the control of the flow valve 104; subsequently, the photoresist material in the buffer container 105 can flow into the filter 106 for filtration, and the filtered photoresist material can flow into the collection tank 107; further, the photoresist material in the collection tank 107 can flow into the ACRDPump 108, which will transport it to the AMCvalve 1011, and finally through the AMCvalve 1011 to the spray head 1012, thereby coating photoresist on the substrate surface.

[0023] The spray head 1012 can be sealed inside the reaction chamber to perform processing operations on the substrate surface. Simultaneously, VAC 109 evacuates the air from the reaction chamber, creating a vacuum environment. It should be understood that VAC 109 performs the evacuation operation via a conduit connected to the spray head 1012, while EV 1010 is used to regulate the flow rate of the photoresist material.

[0024] This application provides a method, apparatus, and system for determining photoresist margin. It allows for real-time acquisition of photoresist margin reference parameters during photoresist spraying, enabling technicians to monitor photoresist usage. Simultaneously, the photoresist margin of the buffer container can be determined based on the reference parameters. Therefore, if the buffer container's photoresist margin is less than or equal to a preset threshold, the system prompts technicians to replace the currently used photoresist container. During this process, since a certain amount of photoresist material remains in the buffer container, the process can continue normally while technicians are replacing the container. This ensures that the process is not interrupted by photoresist container replacement, maintaining process stability and continuity.

[0025] Figure 2 This is a schematic diagram of another optical resistive transmission system provided in an embodiment of this application. Figure 2 As shown, a gravity sensor 2011 can be installed at the bottom of the photoresist container 201, and a hydraulic sensor 2021 can be installed on the side wall of the buffer container 202. The gravity parameters corresponding to the photoresist container 201 can be obtained through the gravity sensor 2011, the air pressure parameters can be obtained through the pressure valve 2031 of the pressurization pipeline 203, the hydraulic parameters corresponding to the buffer container 202 in the photoresist pipeline can be obtained through the hydraulic sensor 2021, and the photoresist flow parameters in the photoresist container 201 can be obtained through the flow valve 204 between the photoresist container 201 and the buffer container 202.

[0026] Meanwhile, the gravity sensor 2011, hydraulic sensor 2021, flow valve 204 and pressure valve 2031 can communicate with the display device 205, and thus the gravity parameters, air pressure parameters, hydraulic parameters and optical flow parameters of the photoresist transmission system 200 at different times can be directly displayed on the display interface of the display device 205.

[0027] In some embodiments, the gravity parameters, air pressure parameters, hydraulic parameters, and photoresist flow rate parameters corresponding to the photoresist transmission system 200 at the target time can be input into the photoresist margin prediction model to obtain the photoresist margin in the buffer container 202 at the target time. Furthermore, the photoresist margin can also be displayed in the display interface corresponding to the display device 205, so that the usage of photoresist in the photoresist container 201 at different times and the photoresist margin corresponding to the photoresist container 201 and the buffer container 202 can be obtained directly from the display device 205. Then, by combining the photoresist margins corresponding to the photoresist container 201 and the buffer container 202, the replacement of the photoresist container 201 can be completed without affecting the process, thereby stabilizing the supply of photoresist material, ensuring that the entire process is uninterrupted, and thus facilitating efficient mass production.

[0028] In some embodiments, gravity parameters, air pressure parameters, hydraulic parameters, and photoresist flow rate parameters corresponding to different photoresist containers at different times can be obtained. At the same time, the actual photoresist margin corresponding to the corresponding buffer container can also be obtained. Then, a sample set can be constructed based on the gravity parameters, air pressure parameters, hydraulic parameters, photoresist flow rate parameters, and actual photoresist margin corresponding to different times. Then, a certain number of data can be randomly selected from the sample set to construct a training set, a validation set, and a test set respectively.

[0029] like Figure 2 As shown, any unused photoresist container 201 can be connected to the buffer container 202 via the flow valve 204. The process can then be carried out based on the unused photoresist container 201. During this process, the hydraulic parameters and actual photoresist margin of the buffer container 202, the photoresist flow parameters of the flow valve 204, the gravity parameters of the photoresist container 201, and the air pressure parameters of the pressurization pipeline 203 can be recorded at certain intervals.

[0030] For example, data can be recorded every half hour, for a total of 15 sets. After the photoresist material in the photoresist container is completely used up, the photoresist container is replaced, and recording continues. A total of 60 photoresist containers can be replaced. Thus, a dataset can be constructed based on the 15 sets of data corresponding to each of the 60 photoresist containers. The 15 sets of data corresponding to 48 photoresist containers are used as the training set, the 15 sets of data corresponding to 6 photoresist containers are used as the validation set, and the 15 sets of data corresponding to 6 photoresist containers are used as the test set. It should be understood that the specific number of photoresist containers and the specific amount of data in the training, validation, and test sets can be set according to actual circumstances.

[0031] In some embodiments, one or more key hidden parameters can be constructed based on the relationship between the gravity parameters, air pressure parameters, hydraulic parameters, and photoresist flow rate parameters of the photoresist container at different times. These key hidden parameters are located in the hidden layer and serve as intermediate variables in the network's data processing. They are obtained by performing complex nonlinear transformations on the input air pressure parameters, photoresist flow rate parameters, gravity parameters, and hydraulic parameters. For example, during the neural network's computation, the air pressure parameters, photoresist flow rate parameters, gravity parameters, and hydraulic parameters can be multiplied by their corresponding weights, then summed and subjected to activation function operations to finally obtain the value of the hidden parameter, which is the predicted photoresist margin in the buffer container.

[0032] Figure 3 This is a schematic diagram of the structure of a photoresist margin prediction model provided in an embodiment of this application. Figure 3As shown, for the photoresist margin prediction model 300, the input layer may include air pressure parameter k, photoresist flow rate parameter v, gravity parameter b and hydraulic parameter c, the hidden layer may include the first key hidden parameter a1 and the second key hidden parameter a2, and the output layer may include photoresist margin z.

[0033] As mentioned above, a1 = g(k*w 1.1 +v*w 1.2 +bw 1.3 +c*w 1.4 );

[0034] a2=g(k*w 2.1 +v*w 2.2 +b*w 2.3 +c*w 2.4 );

[0035] z = g(a1*w1 + a2*w2).

[0036] Where g() is the activation function, w 1.1 w is the first weight corresponding to k. 1.2 w is the first weight corresponding to v. 1.3 w is the first weight corresponding to b. 1.4 w is the first weight corresponding to c. 2.1 w is the second weight corresponding to k. 2.2 w is the second weight corresponding to v. 2.3 w is the second weight corresponding to b. 2.4 w1 is the second weight corresponding to c, w2 is the weight corresponding to a1, and w2 is the weight corresponding to a2.

[0037] In some embodiments, the loss function corresponding to the optical obscuration margin prediction model can be the mean square error, and the corresponding formula can be:

[0038]

[0039] Among them, z i This represents the actual photoresist margin of the photoresist container with serial number i at a certain moment. This represents the photoresist margin predicted by the neural network model for the photoresist container with serial number i at a certain moment, where n is the number of the training set and i is the serial number of the photoresist container, i = 1, 2, ..., k.

[0040] It should be understood that a loss function is a function used to measure the difference between the model's predicted results and the true labels. It quantifies the error of the neural network model during training, providing a clear objective for optimizing the model. Therefore, by measuring the error of the neural network model using the loss function, calculating the gradient using backpropagation, and adjusting the weights of different parameters based on the gradient, effective learning and accurate prediction of data can be achieved.

[0041] In some embodiments, the neural network model used in this application can be a back-propagation neural network model. However, the back-propagation neural network model may suffer from overfitting during the fitting process. Specifically, this means that while the back-propagation neural network model performs well on the training set, it exhibits poor generalization ability on the unknown test set, resulting in low prediction accuracy. To address this issue, this application can introduce a regularization term during processing, that is, add a penalty to the coefficients in the loss function. Where W is the parameter vector of the backpropagation neural network model, which is the vector composed of the weights in the formulas corresponding to the first key hidden parameter a1 and the second key hidden parameter a2; ω i Let be the i-th element in the parameter vector W. k is the dimension of the parameter vector W, i.e., the number of weights; j is the index of the weight, j = 1, 2, ..., k.

[0042] In some embodiments, when the photoresist spraying equipment is performing the process normally, there are two situations: situation one is that both the photoresist container and the buffer container have photoresist material, and situation two is that the photoresist container is empty and the buffer container has photoresist material.

[0043] Figure 4 This is a schematic diagram illustrating the change of photoresist margin over time, as provided in an embodiment of this application. Figure 4 As shown, for case one, MATLAB software can be used to fit the data in the dataset, including the curve 400 showing the change of photoresist margin over time obtained from the neural network model without regularization, the curve showing the change of photoresist margin over time obtained from the neural network model with regularization, and the curve showing the change of actual photoresist margin over time. Figure 4It can be seen that the curve of the photoresist margin changing with time obtained by the neural network model without adding a regularization term basically matches the curve of the actual photoresist margin changing with time, with a fitting degree of 97.26%. However, the curve of the photoresist margin changing with time obtained by the neural network model with adding a regularization term matches the curve of the actual photoresist margin changing with time even better, reaching 98.86%. This shows that the error between the photoresist margin obtained by the neural network model with adding a regularization term and the actual photoresist is very small.

[0044] Figure 5 This is a schematic diagram illustrating a comparison of regularization term optimization errors provided in an embodiment of this application. For example... Figure 5 As shown, by calculating the root mean square error, it can be found that the root mean square error between the photoresist margin obtained by the neural network model with added regularization term and the actual photoresist quantity is only 0.01. For details, please refer to the comparison chart of regularization term optimization error 500.

[0045] In some embodiments, the curve of the photoresist margin changing with time obtained from the neural network model with added regularization terms can be used to further obtain the functional relationship between the photoresist margin y and the air pressure parameter k, the photoresist flow rate parameter v, the gravity parameter b, and the hydraulic parameter c, specifically:

[0046]

[0047] Where z is the mass of the photoresist container when it is empty, p is the density of the photoresist material, g is the acceleration due to gravity, s1 is the contact area between the gravity sensor and the photoresist container, s2 is the area of ​​the bottom of the buffer container, h1 is the relative pressure coefficient corresponding to the air pressure parameter, and h2 is the relative coefficient corresponding to the photoresist flow rate parameter. Here, h1 and h2 are both 0 when the process is running normally.

[0048] For scenario two, based on scenario one, when the photoresist container is empty, When this term is 0, the functional relationship between the optical resist margin y and the air pressure parameter k, the optical resist flow rate parameter v, the gravity parameter b, and the hydraulic parameter c is as follows:

[0049]

[0050] In some embodiments, the hydraulic sensor can be located at the geometric center of the buffer container. This allows the hydraulic sensor to detect when the liquid level corresponding to the photoresist material in the buffer container is lower than or equal to the geometric center of the container, triggering an alarm. The alarm may include audible alarms, visual alarms, and message alarms to prompt relevant technicians to replace the photoresist container in a timely manner. This ensures that the process is not interrupted due to the replacement of the photoresist container, maintaining the stability and continuity of the process.

[0051] Therefore, this embodiment of the application can acquire photoresist margin reference parameters in real time during the photoresist spraying process, enabling relevant technicians to understand the usage of the photoresist promptly. Simultaneously, the photoresist margin of the buffer container can be determined based on the photoresist margin reference parameters. Thus, if the photoresist margin of the buffer container is less than or equal to a preset threshold, the relevant technicians can be prompted to replace the currently used photoresist container. During this process, since a certain amount of photoresist material remains in the buffer container, the process can continue normally while the relevant technicians are replacing the photoresist container. This ensures that the process is not interrupted due to photoresist container replacement, maintaining the stability and continuity of the process.

[0052] In some embodiments, this application also provides a method for determining photoresist margin, applied to a photoresist spraying equipment, the photoresist spraying equipment having a photoresist container and a buffer container, the photoresist container being connected to a pressurization pipeline and the buffer container respectively.

[0053] Figure 6 This is a flowchart illustrating a method for determining photoresist margin according to an embodiment of this application. Figure 6 As shown, the method 600 for determining the optical resist margin specifically includes the following steps:

[0054] In step 601, during the process of spraying photoresist onto the substrate surface using a photoresist spraying device, a reference parameter for the photoresist margin of the photoresist spraying device at the target time is obtained.

[0055] In step 602, the photoresist margin of the buffer container at the target time is determined based on the photoresist margin reference parameters of the photoresist spraying equipment at the target time.

[0056] Among them, the photoresist margin reference parameters include the photoresist container (such as...) Figure 2 The gravity parameters of the photoresist container 201 shown (e.g.) Figure 2 The gravity parameters obtained by the gravity sensor 2011 installed at the bottom of the photoresist container 201 are shown), and the pressurization pipeline (such as...) Figure 2 The air pressure parameters of the booster line 203 shown (e.g.) Figure 2 The pressure parameters obtained by the pressure valve 2031 of the booster line 203 shown), and the buffer container (such as...) Figure 2 The hydraulic parameters of the buffer container 202 shown and the photoresist flow rate parameters between the photoresist container and the buffer container (the photoresist flow rate parameters in the photoresist container 201 are obtained through the flow valve 204 between the photoresist container 201 and the buffer container 202).

[0057] In some embodiments, determining the photoresist margin of the buffer container at a target time based on the photoresist margin reference parameter of the photoresist spraying equipment at the target time includes: inputting the photoresist margin reference parameter of the photoresist spraying equipment at the target time into the photoresist margin prediction model to obtain the photoresist margin of the buffer container at the target time.

[0058] In some embodiments, the method further includes: determining a photoresist margin prediction model using photoresist margin reference parameters of the photoresist spraying equipment at multiple training times and the photoresist margin corresponding to the buffer container, wherein the photoresist margin corresponding to the buffer container is different at multiple training times.

[0059] In some embodiments, a photoresist margin prediction model is determined using photoresist margin reference parameters of the photoresist spraying equipment at multiple training times and the photoresist margin corresponding to the buffer container. This includes: inputting the photoresist margin reference parameters of the photoresist spraying equipment at multiple training times into the model to be trained to obtain the predicted photoresist margin of the buffer container at multiple training times; determining whether the model to be trained has converged based on the predicted photoresist margin of the buffer container at multiple training times and the corresponding photoresist margin of the buffer container at multiple training times; when the model to be trained converges, determining that the model to be trained is a photoresist margin prediction model, or when the model to be trained has not converged, updating the model parameters of the model to be trained based on the predicted photoresist margin of the buffer container at multiple training times and the corresponding photoresist margin of the buffer container at multiple training times.

[0060] In some embodiments, when photoresist is present in the photoresist container, the model parameters of the photoresist margin prediction model are determined by the photoresist residual quantum model of the photoresist container, the photoresist residual quantum model of the buffer container, the pressurizing gas influence model, and the hydraulic influence model of the buffer container; when the photoresist container is empty, the model parameters of the photoresist margin prediction model are determined by the photoresist residual quantum model of the buffer container, the pressurizing gas influence model, and the hydraulic influence model of the buffer container.

[0061] In some embodiments, the method further includes: performing data fitting on the photoresist margin reference parameters of the photoresist spraying equipment at multiple training times and the photoresist margin corresponding to the buffer container to obtain model parameters of the photoresist margin prediction model, wherein the model parameters include the air pressure influence factor of the pressurization pipeline (which is the pressure relative coefficient h1 corresponding to the air pressure parameter) and the flow rate influence factor of the buffer container (which is the relative coefficient h1 corresponding to the photoresist flow rate parameter); determining the pressurization gas influence model based on the air pressure influence factor of the pressurization pipeline, and determining the hydraulic pressure influence model of the buffer container based on the flow rate influence factor of the buffer container.

[0062] In some embodiments, a gravity sensor (e.g., gravity sensor) is provided at the bottom of the photoresist container. Figure 2 The gravity sensor shown is 2011, and the side wall of the buffer container is equipped with a hydraulic sensor (such as...). Figure 2The hydraulic sensor 2021 shown has a photoresist co-quantum model for the photoresist container, which is determined by the gravity parameters of the photoresist container, the photoresist physical parameters inside the photoresist container (the density p of the photoresist material), the physical parameters of the photoresist container (the mass z when the photoresist container is empty), and the contact parameters of the gravity sensor (the contact area s1 between the gravity sensor and the photoresist container); the photoresist co-quantum model for the buffer container is determined by the hydraulic parameters inside the buffer container, the photoresist physical parameters, and the size parameters of the hydraulic sensor (the area s2 at the bottom of the buffer container).

[0063] In some embodiments, after determining the photoresist margin of the buffer container at the target time, the method further includes: after determining the photoresist margin of the buffer container at the target time, when the photoresist margin of the buffer container at the target time is less than or equal to a preset threshold, prompting a photoresist container replacement instruction.

[0064] Therefore, this embodiment of the application can acquire photoresist margin reference parameters in real time during the photoresist spraying process, enabling relevant technicians to understand the usage of the photoresist promptly. Simultaneously, the photoresist margin of the buffer container can be determined based on the photoresist margin reference parameters. Thus, if the photoresist margin of the buffer container is less than or equal to a preset threshold, the relevant technicians can be prompted to replace the currently used photoresist container. During this process, since a certain amount of photoresist material remains in the buffer container, the process can continue normally while the relevant technicians are replacing the photoresist container. This ensures that the process is not interrupted due to photoresist container replacement, maintaining the stability and continuity of the process.

[0065] Figure 7 This is a schematic flowchart of a device for determining photoresist margin provided in an embodiment of this application. Figure 7 As shown, the device 700 for determining the optical resist margin specifically includes:

[0066] The acquisition module 701 is used to acquire the photoresist margin reference parameters of the photoresist spraying equipment at the target time during the process of spraying photoresist on the substrate surface using the photoresist spraying equipment.

[0067] The determination module 702 is used to determine the photoresist margin of the buffer container at the target time based on the photoresist margin reference parameters of the photoresist spraying equipment at the target time.

[0068] Among them, the reference parameters for photoresist margin include the gravity parameters of the photoresist container, the air pressure parameters of the pressurization pipeline, the hydraulic parameters of the buffer container, and the photoresist flow rate parameters between the photoresist container and the buffer container.

[0069] Therefore, this embodiment of the application can acquire photoresist margin reference parameters in real time during the photoresist spraying process, enabling relevant technicians to understand the usage of the photoresist promptly. Simultaneously, the photoresist margin of the buffer container can be determined based on the photoresist margin reference parameters. Thus, if the photoresist margin of the buffer container is less than or equal to a preset threshold, the relevant technicians can be prompted to replace the currently used photoresist container. During this process, since a certain amount of photoresist material remains in the buffer container, the process can continue normally while the relevant technicians are replacing the photoresist container. This ensures that the process is not interrupted due to photoresist container replacement, maintaining the stability and continuity of the process.

[0070] Figure 8 This is a schematic diagram of a system for determining photoresist margin provided in an embodiment of this application. Figure 8 As shown, the optical resist margin determination system 800 specifically includes:

[0071] With photoresist container 8011 (e.g.) Figure 2 The photoresist container 201 and the buffer container 8012 shown are shown. Figure 2 The photoresist spraying equipment 801 (shown as buffer container 202) has photoresist container 8011 connected to pressurization pipeline 802 (e.g., buffer container 202). Figure 2 The pressurization line 203 shown is connected to the buffer container 8012;

[0072] A sensing component 804 is disposed on the photoresist container 8011 and the buffer container 8012;

[0073] A photoresist margin determination device 803 electrically connected to the sensing component 804, wherein the photoresist margin determination device 803 is a photoresist margin determination device provided in the embodiments of this application.

[0074] In some embodiments, the sensing component 804 includes a gravity sensor (such as...) Figure 2 The gravity sensor 2011 shown and the hydraulic sensor (such as) Figure 2 The hydraulic sensor shown is 2021. The gravity sensor is located at the bottom of the photoresist container, and the hydraulic sensor is located on the side wall of the buffer container.

[0075] In some embodiments, the photoresist margin determination system 800 further includes a display device (such as a photoresist margin determination device and a sensing component) electrically connected to the photoresist margin determination device and the sensing component. Figure 2 The display device 205 shown.

[0076] In some embodiments, the optical resist margin determination system 800 further includes a flow valve (such as...) Figure 2The flow valve 204 shown is located inside the photoresist container 8011, the outlet of the photoresist container 8011 is connected to the inlet of the flow valve, and the outlet of the flow valve is connected to the inlet of the buffer container 8012.

[0077] Therefore, this embodiment of the application can acquire photoresist margin reference parameters in real time during the photoresist spraying process, enabling relevant technicians to understand the usage of the photoresist promptly. Simultaneously, the photoresist margin of the buffer container can be determined based on the photoresist margin reference parameters. Thus, if the photoresist margin of the buffer container is less than or equal to a preset threshold, the relevant technicians can be prompted to replace the currently used photoresist container. During this process, since a certain amount of photoresist material remains in the buffer container, the process can continue normally while the relevant technicians are replacing the photoresist container. This ensures that the process is not interrupted due to photoresist container replacement, maintaining the stability and continuity of the process.

[0078] The embodiments of this application have been described above. However, these embodiments are merely illustrative and not intended to limit the scope of this application. The scope of this application is defined by the appended claims and their equivalents. Various substitutions and modifications can be made by those skilled in the art without departing from the scope of this application, and all such substitutions and modifications should fall within the scope of this application.

Claims

1. A method for determining photoresist margin, characterized in that, A method for use in a photoresist spraying equipment, the photoresist spraying equipment having a photoresist container and a buffer container, the photoresist container being connected to a pressurization pipeline and the buffer container respectively, the method comprising: During the process of spraying photoresist onto the substrate surface using the photoresist spraying equipment, the photoresist margin reference parameter of the photoresist spraying equipment at the target time is obtained. Based on the photoresist margin reference parameters of the photoresist spraying equipment at the target time, the photoresist margin of the buffer container at the target time is determined; The photoresist margin reference parameters include the gravity parameters of the photoresist container, the air pressure parameters of the pressurization pipeline, the hydraulic parameters of the buffer container, and the photoresist flow rate parameters between the photoresist container and the buffer container.

2. The method according to claim 1, characterized in that, The step of determining the photoresist margin of the buffer container at the target time based on the photoresist margin reference parameter of the photoresist spraying equipment at the target time further includes: The photoresist margin reference parameter of the photoresist spraying equipment at the target time is input into the photoresist margin prediction model to obtain the photoresist margin of the buffer container at the target time.

3. The method according to claim 2, characterized in that, The method further includes: The photoresist margin prediction model is determined by using the photoresist margin reference parameters of the photoresist spraying equipment at multiple training times and the photoresist margin corresponding to the buffer container, wherein the photoresist margin corresponding to the buffer container is different at multiple training times.

4. The method according to claim 3, characterized in that, Using the photoresist margin reference parameters of the photoresist spraying equipment at multiple training moments and the photoresist margin corresponding to the buffer container, a photoresist margin prediction model is determined, further including: The photoresist margin reference parameters of the photoresist spraying equipment at multiple training times are input into the model to be trained to obtain the predicted photoresist margin of the buffer container at multiple training times. Based on the predicted photoresist margin of the buffer container at multiple training times and the corresponding photoresist margin of the buffer container at multiple training times, it is determined whether the model to be trained has converged. When the model to be trained converges, the model to be trained is determined to be the photoresist margin prediction model; or when the model to be trained fails to converge, the model parameters of the model to be trained are updated based on the predicted photoresist margin of the buffer container at multiple training times and the photoresist margin of the buffer container at multiple training times.

5. The method according to claim 2, characterized in that, When photoresist exists within the photoresist container, the model parameters of the photoresist margin prediction model are determined by the photoresist residual quantum model of the photoresist container, the photoresist residual quantum model of the buffer container, the pressurized gas influence model, and the hydraulic influence model of the buffer container. When the photoresist container is idle, the model parameters of the photoresist margin prediction model are determined by the photoresist margin model of the buffer container, the pressurized gas influence model, and the hydraulic influence model of the buffer container.

6. The method according to claim 5, characterized in that, The method further includes: Data fitting is performed on the photoresist margin reference parameters of the photoresist spraying equipment at multiple training times and the photoresist margin corresponding to the buffer container to obtain the model parameters of the photoresist margin prediction model, wherein the model parameters include the air pressure influence factor of the pressurization pipeline and the flow rate influence factor of the buffer container. Based on the gas pressure influence factor of the pressurization pipeline, the influence model of the pressurization gas is determined, and based on the flow rate influence factor of the buffer container, the hydraulic pressure influence model of the buffer container is determined.

7. The method according to claim 5, characterized in that, A gravity sensor is installed at the bottom of the photoresist container, and a hydraulic sensor is installed on the side wall of the buffer container. The photoresist coquantum model of the photoresist container is determined by the gravity parameters of the photoresist container, the photoresist physical parameters inside the photoresist container, the physical parameters of the photoresist container, and the contact parameters of the gravity sensor. The photoresist coquantum model of the buffer container is determined by the hydraulic parameters, photoresist physical parameters, and size parameters of the hydraulic sensor within the buffer container.

8. The method according to claim 1, characterized in that, After determining the photoresist margin of the buffer container at the target time, the method further includes: When the photoresist margin is less than or equal to a preset threshold, a photoresist container replacement indicator is displayed.

9. A device for determining optical resist margin, characterized in that, An apparatus for use in photoresist spraying equipment, the photoresist spraying equipment comprising a pressurization pipeline, a photoresist container, and a buffer container, wherein the photoresist container is connected to both the pressurization pipeline and the buffer container, the apparatus comprising: The acquisition module is used to acquire the photoresist margin reference parameters of the photoresist spraying equipment at the target time during the process of spraying photoresist on the substrate surface using the photoresist spraying equipment. The determining module is used to determine the photoresist margin of the buffer container at the target time based on the photoresist margin reference parameter of the photoresist spraying equipment at the target time; The photoresist margin reference parameters include the gravity parameters of the photoresist container, the air pressure parameters of the pressurization pipeline, the hydraulic parameters of the buffer container, and the photoresist flow rate parameters between the photoresist container and the buffer container.

10. A system for determining photoresist margin, characterized in that, include: A photoresist spraying device having a photoresist container and a buffer container, wherein the photoresist container is connected to a pressurization pipeline and the buffer container respectively; Sensing components disposed on the photoresist container and the buffer container; A device for determining the photoresist margin that is electrically connected to the sensing component, wherein the photoresist margin determination device is the photoresist margin determination device as described in claim 9.

11. The system according to claim 10, characterized in that, The sensing components include a gravity sensor and a hydraulic sensor. The gravity sensor is located at the bottom of the photoresist container, and the hydraulic sensor is located on the side wall of the buffer container.

12. The system according to claim 10, characterized in that, The system for determining the photoresist margin also includes a display device electrically connected to the photoresist margin determination device and the sensing component.

13. The system according to claim 10, characterized in that, The system for determining the optical resist margin also includes a flow valve; The gas outlet of the pressurization pipeline is located inside the photoresist container, the outlet of the photoresist container is connected to the inlet of the flow valve, and the outlet of the flow valve is connected to the inlet of the buffer container.

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