A control method and device of a wafer sorting equipment, equipment and medium

Abstract

The present disclosure provides a control method, device, equipment and medium of a wafer sorting device. The control method comprises: configuring a plurality of unloading ports of the wafer sorting device as at least one fixed type port and at least one dynamic type port; obtaining category attribute information of a wafer to be sorted; when the wafer to be sorted belongs to a preset category, controlling the wafer to be sorted to be transmitted to the fixed type port; when the wafer to be sorted belongs to a category other than the preset category, based on a preset sorting condition, changing a target category of the dynamic type port to a category to which the wafer to be sorted belongs, and controlling the wafer to be sorted to be transmitted to the dynamic type port.

Description

Technical Field

[0001] This disclosure relates to the field of semiconductor manufacturing technology, and in particular to a control method, apparatus, equipment and medium for wafer sorting equipment. Background Technology

[0002] In semiconductor manufacturing processes, wafer sorting is a key step in improving production line efficiency and yield management. As process nodes continue to evolve, after wafers complete chemical mechanical polishing (CMP), photolithography, or metrology processes, they need to be accurately classified based on their surface defects, haze, or flatness data.

[0003] Traditional wafer sorting schemes typically employ static port configurations. Before the sorting operation begins, the Manufacturing Execution System (MES) requires manual pre-setting of the wafer category corresponding to each unload port. For example, Port 1 is fixed to receive defective wafers, and Port 2 to receive qualified wafers.

[0004] However, this model has the following problems: when the category distribution of batches to be sorted on the production line fluctuates, some ports may be idle and waiting due to a very small number of wafers of the corresponding category, while other ports may be fully loaded, causing the entire machine to stop. In addition, frequent manual binding and configuration changes not only consume a lot of manpower, but also increase the risk of mixing materials due to human error.

[0005] Therefore, how to achieve dynamic adjustment of the sorting port has become a technical problem that needs to be solved in the field of semiconductor automated manufacturing. Summary of the Invention

[0006] This disclosure provides a control method, apparatus, equipment, and medium for wafer sorting equipment to solve the technical problems of cumbersome manual maintenance and low sorting efficiency caused by fixed port type configuration in the prior art.

[0007] The technical solution disclosed herein is implemented as follows: In a first aspect, this disclosure provides a control method for a wafer sorting device, including: The wafer sorting equipment has multiple unloading ports configured as at least one fixed type port and at least one dynamic type port; wherein, the fixed type port is configured to receive only wafers of a preset type, and the dynamic type port is configured to be able to change the target type of the received wafers; Obtain the category attribute information of the wafers to be sorted; When the wafer to be sorted belongs to a preset category, control the wafer to be sorted to be transmitted to a fixed type port; When the wafer to be sorted belongs to a category other than the preset category, the target category of the dynamic type port is changed to the category to which the wafer to be sorted belongs based on the preset sorting conditions, and the wafer to be sorted is controlled to be transmitted to the dynamic type port.

[0008] Secondly, this disclosure provides a control device for a wafer sorting equipment, comprising: Memory, used to store computer programs; A processor for executing the computer program to implement the control method for the wafer sorting equipment as described in the first aspect.

[0009] Thirdly, this disclosure provides a wafer sorting device, including: Multiple offload ports; Wafer transport robot; The control device is configured to execute the control method of the wafer sorting equipment as described in the first aspect to control the wafer transfer robot to sort the wafers to be sorted to the unloading port.

[0010] Fourthly, this disclosure provides a computer-readable storage medium having a computer program stored thereon, which, when executed by a processor, implements the control method for the wafer sorting equipment as described in the first aspect.

[0011] This disclosure provides a control method, apparatus, device, and medium for wafer sorting equipment. By constructing a hybrid architecture with both fixed-type ports and dynamic-type ports, and giving the dynamic-type ports the ability to change the target category as needed, the wafer sorting equipment can adapt to the changing wafer category distribution without manual changes to the port configuration. This solves the problem of high manual maintenance costs in the traditional fixed configuration mode and improves the sorting efficiency of the wafer sorting equipment. Attached Figure Description

[0012] Figure 1 This is a schematic diagram of the wafer sorting equipment provided in this disclosure.

[0013] Figure 2 This is a schematic flowchart of a control method for a wafer sorting device provided in an embodiment of the present disclosure.

[0014] Figure 3 This is a schematic diagram illustrating the port type configuration mapping relationship provided in the embodiments of this disclosure.

[0015] Figure 4 A detailed logic flowchart for dynamic type port category change provided in the embodiments of this disclosure.

[0016] Figure 5This is a schematic diagram illustrating the batch identifier status transition provided in an embodiment of this disclosure.

[0017] Figure 6 This is a hardware structure block diagram of a wafer sorting control device provided in an embodiment of the present disclosure. Detailed Implementation

[0018] The technical solutions in this disclosure will now be clearly and completely described with reference to the accompanying drawings.

[0019] Please refer to Figure 1, which shows a schematic diagram of the structure of a wafer sorting device provided in an embodiment of the present invention. In this disclosure, the wafer sorting device 100 adopts a standardized Equipment Front End Module (EFEM) architecture, including a Load Port 10, an Unload Port 20, a wafer transfer robot 30, and a control device 40.

[0020] Specifically, loading port 10 is designed as a carrier platform compliant with SEMI E47.1 standards to receive and store carriers for sorting wafers. This carrier can be a front-opening unified pod (FOUP) with a standard mechanical interface. The FOUP has 25 slots, each holding a 300mm (12-inch) wafer via support ribs. Loading port 10 is equipped with a carrier sensor to monitor the FOUP's position in real time and uses an RFID reader to read the carrier's identification tag to obtain the process context information for that batch of wafers.

[0021] In this disclosure, the unloading port 20 is the output terminal after wafer sorting. Physically, the unloading port 20 has the same mechanical structure as the loading port 10, both supporting FOUPs that accommodate 300mm (12-inch) wafers. In this disclosure, the wafer sorting device 100 is configured with at least three unloading ports, labeled Port3, Port4, and Port5. These three unloading ports are logically divided into at least one fixed-type port 21 (such as Port 3 and Port 4) and at least one dynamic-type port 22 (such as Port 5).

[0022] Specifically, the fixed-type port 21 is configured to receive only wafers of a preset type during system initialization or a specific process task cycle. Its physical corresponding carrier is typically used to collect frequently occurring wafers of a specific type to maintain the stability of the production line flow.

[0023] Dynamic Type Port 22 does not have a fixed receive category; instead, it functions as a general-purpose physical container. The receive target of Dynamic Type Port 22 changes dynamically based on the real-time attributes of the wafer to be sorted. This improves port utilization and avoids wasting hardware resources.

[0024] In this disclosure, a wafer transfer robot 30 is positioned between the loading port 10 and the unloading port 20. For example, the wafer transfer robot 30 may be a selective compliance assembly robot arm (SCARA) type four-axis robot located within the clean microenvironment of the EFEM. The end effector of this wafer transfer robot 30 employs vacuum suction or edge gripping.

[0025] To ensure the wafer operates at 2000mm / s 2 To reduce the risk of slippage under acceleration, the vacuum adsorption pressure is typically controlled between -50 kPa and -80 kPa. The end effector integrates a laser alignment device to perform a height scan of the wafer within the FOUP before gripping it, ensuring gripping accuracy within ±0.1 mm and preventing scratches on the back of the wafer.

[0026] In this disclosure, the control device 40 maintains high-speed communication with the Manufacturing Execution System (MES) and the Real-Time Dispatch System (RTD) via the SECS / GEM protocol. Based on the category attribute information obtained from the MES, the control device 40 executes the control method of the wafer sorting equipment described in this disclosure, thereby driving the robot 30 to sort the wafers to the unloading port.

[0027] Figure 2 This is a schematic flowchart of a control method for a wafer sorting device provided in this disclosure. The control method is executed by a control device 40.

[0028] See Figure 2 In step S201, the multiple unloading ports of the wafer sorting equipment are configured as at least one fixed type port and at least one dynamic type port.

[0029] In this disclosure, before performing wafer sorting, the control device 40 can first define and classify the logical roles of the unloading port 20.

[0030] Specifically, the control device 40 divides the unloading port 20 into a fixed type port and a dynamic type port. Fixed-type ports are configured to accept only wafers of a preset category, such as... Figure 1Port 3 and Port 4 are configured to receive only wafers classified as Defect and Haze, respectively.

[0031] The dynamic type port is configured to change the target category of the received wafer. In this disclosure, the target category can be any of the wafer categories other than Defect and Haze, such as Heavily Doped (HDO), Resistivity (RES), and Polycrystalline (EPD).

[0032] by Figure 1 Taking the offloading port 20 as an example, Figure 3 A schematic diagram illustrating the mapping relationship between fixed-type ports, dynamic-type ports, and wafer categories is shown. Figure 3 In the diagram, Port 3 and Port 4 correspond to wafers classified as Defect and Haze, respectively, as shown by the solid arrows. Port 5 corresponds to any of HDO, RES, and EPD, as shown by the dashed arrows.

[0033] In this disclosure, the preset category is determined based on the wafer category ranked by quantity percentage in historical sorting data within a preset time period. Specifically, the control device 40 can record a sorting task log for each task, and the log fields may include timestamps, wafer identifiers, category tags, and offloading port identifiers. The control device 40 can set a preset time period, such as the past 24 hours or the past 7 days. The control device 40 can analyze the sorting task logs within this preset time period to calculate the frequency and total quantity of each wafer category. Subsequently, the control device 40 ranks the wafer categories by quantity percentage and determines the top-ranked wafer categories as the preset categories. For example, when the number of fixed-type ports is 2, the top two wafer categories by quantity percentage are determined as the preset categories.

[0034] See Figure 2 In step S202, the category attribute information of the wafers to be sorted is obtained.

[0035] Specifically, after the loading port 10 completes the loading and opening of the FOUP, the control device 40 executes the above-mentioned data acquisition steps.

[0036] In detail, the control device 40 can establish a session with the Manufacturing Execution System (MES) via the SECS-II protocol (SEMI Equipment Communications Standard) to request context data of all wafers in the current carrier. The context data for each wafer includes wafer category attribute information, including but not limited to defect type, haze level, flatness value, or edge contour anomaly identifiers. Based on this category attribute information, the control device 40 can determine the category to which the wafer belongs, such as Defect, Haze, HDO, RES, or EPD.

[0037] See Figure 2 In step S203, when the wafer to be sorted belongs to a preset category, the wafer to be sorted is controlled to be transferred to a fixed type port.

[0038] Specifically, the control device 40 determines the category of the wafer to be sorted based on its category attribute information, and then iterates through the preset categories corresponding to fixed type ports according to that category, such as... Figure 3 The mapping relationship is shown.

[0039] When the category of the wafer to be sorted matches a preset category corresponding to a fixed type port, such as Port 3, the control device 40 will send a motion command to the wafer transfer robot 30. In response to the motion command, the wafer transfer robot 30 uses a vacuum suction cup to grab the wafer to be sorted and places it into the carrier of Port 3.

[0040] See Figure 2 In step S204, when the wafer to be sorted belongs to a category other than the preset category, the target category of the dynamic type port is changed to the category to which the wafer to be sorted belongs based on the preset sorting conditions, and the wafer to be sorted is controlled to be transmitted to the dynamic type port.

[0041] Specifically, when the wafer to be sorted belongs to a category other than the preset category, the control device 40 does not blindly wait for manual intervention, but triggers the attribute change of the dynamic type port based on the preset sorting conditions.

[0042] For example, the control device 40 first calculates the number and waiting time of each other type of wafer in the sorting queue. If the triggering condition is met, a configuration command is issued to change the target category of the dynamic type port, such as Port 5, to the category to which the wafer to be sorted belongs. After the change is completed, the control device 40 sends a motion command to the robot 30, so that the robot 30 transfers the wafer to be sorted to the dynamic type port, such as Port 5.

[0043] for Figure 2 The technical method shown constructs a hybrid architecture with both fixed-type and dynamic-type ports, and empowers the dynamic-type ports to change target categories as needed. This enables the wafer sorting equipment to adapt to varying wafer category distributions without requiring manual changes to port configurations, thus solving the problem of high manual maintenance costs in the traditional fixed-configuration mode and improving the sorting efficiency of the wafer sorting equipment.

[0044] In some embodiments, to avoid system oscillation caused by frequent switching of the target category of dynamic type ports, this disclosure provides a logical flow for changing the target category of dynamic type ports based on preset sorting conditions, namely... Figure 2 The implementation process of step S204 in the process. Figure 4 This is a flowchart illustrating the process of a control device changing the target category of a dynamic type port. In this disclosure, the preset sorting conditions include priority conditions, quantity conditions, and idling time conditions. Figure 4 The process shown may include: S401: Determine the candidate category with the highest current priority.

[0045] Specifically, in the queue of wafers to be sorted, there may be multiple wafers that are not of the preset category. The control device 40 will determine the candidate category with the highest priority based on the category to which the wafer to be sorted belongs, according to preset priority conditions.

[0046] In some embodiments, priorities can be set based on the urgency of the order or the urgency of subsequent processes. For example, critically defective parts require immediate failure analysis and have a priority of 1; while parts with minor defects only need to be downgraded and have a priority of 3.

[0047] S402: Determine whether the number of wafers to be sorted belonging to this candidate category has reached the first quantity threshold.

[0048] In this disclosure, the first quantity threshold is typically set to a value that enables a vehicle to achieve an economical transport density, for example, 20 wafers. The control device 40 counts whether the number of wafers belonging to the candidate category in the current vehicle and subsequent queued vehicles reaches the first quantity threshold.

[0049] If the quantity reaches the first quantity threshold, execute S403 to change the target category of the dynamic type port to the candidate category and transfer the wafers to be sorted to the dynamic type port. This ensures that once the wafers of the candidate category enter the dynamic type port, the carrier can be quickly filled, improving logistics and handling efficiency.

[0050] If the quantity does not reach the first quantity threshold, for example, if there are only 2 wafers in the current carrier, then execute S404 to continue to determine whether the waiting time of the wafers belonging to the candidate category at the loading port exceeds the first idling time threshold.

[0051] Specifically, the first idling time threshold can be set between 120s and 600s depending on the production line rhythm. For example, on a high-speed production line, this value can be set to 180s.

[0052] In detail, once the waiting time exceeds the first idling time threshold, it indicates that although the number of wafers of this category is small, it has affected the release of the loading port carrier. In order to prevent the slot from being occupied indefinitely and causing the carrier to be unable to return, the control device 40 forcibly executes S403, that is, changes the dynamic type port to the candidate category and transmits the wafer to be sorted to the dynamic type port to prioritize emptying the wafer to be sorted.

[0053] In step S405, if the number of wafers belonging to the highest priority candidate category has not reached the first quantity threshold and the waiting time of wafers belonging to that candidate category has not reached the first idling time threshold, then the control device 40 will search for the next priority candidate category and return to S402 to repeat the above judgment process.

[0054] based on Figure 4 The process shown in this disclosure, through multi-dimensional judgment criteria of priority, quantity and time, can achieve a balance between equipment throughput and flexibility.

[0055] In some embodiments, in order to ensure the traceability of the sorting process and prevent batch confusion caused by dynamic port switching, this embodiment also introduces a state machine management mechanism based on batch identifiers. Figure 5 This is a schematic diagram illustrating the batch identifier status transition provided in this disclosure.

[0056] Specifically, once the target category of the dynamic type port is changed, the control device 40 will generate a batch ID corresponding to the current sorting task. This ID is associated with the set of wafers belonging to that category stored in the carrier of the dynamic type port within that specific time period.

[0057] Next, the control unit 40 updates the lifecycle of the batch task by maintaining a status flag. Specifically, during the initialization phase, when a Batch ID is created, the control unit 40 initializes the status flag to "Null". At this time, the dynamic type port is in a ready state.

[0058] When the first wafer corresponding to the Batch ID is loaded into loading port 10, and robot 30 picks up the first wafer and starts the sorting task, control device 40 updates the status flag to the first state (Status, S). The first state indicates that the dynamic type port is in the sorting task period, and in this state, the port configuration is not modified in response to the target category change instruction.

[0059] Once the last box of wafers in the batch has been sorted and the carrier at the dynamic type port has been unloaded, the control device 40 updates the status flag to the second state (Yielded, Y). This second state ensures that the dynamic type port can only receive the next sorting task for wafers of a different category after the physical carrier has been removed, thereby reducing the risk of mixing due to physical isolation.

[0060] When the control device 40 determines that the current sorting task has ended, that is, the status changes to Y and is reset to empty, it immediately modifies the target category of the dynamic type port to the next wafer category waiting for dispatch.

[0061] Through the continuous switching mechanism provided in this embodiment, the wafer sorting equipment has near-continuous production efficiency when handling multi-variety, small-batch (High-Mix, Low-Volume) tasks.

[0062] In some embodiments, in addition to controlling dynamic type ports, this disclosure also manages fixed type ports. In this disclosure, the control device 40 monitors the number of wafers and waiting time within the carrier of the fixed type port in real time.

[0063] When the number of wafers reaches the second quantity threshold, which is usually the full load of the carrier, such as 25 wafers, a carrier removal command is triggered to remove the carrier from the fixed type port.

[0064] In addition, to reduce the risk of natural oxidation or environmental contamination of the wafer surface, if the waiting time after the first wafer is placed in the carrier exceeds the second idling time threshold, such as 2 hours, the control device 40 will still trigger the carrier removal command even if the carrier is not full.

[0065] Specifically, if the wafer sorting equipment itself has PLC counting and timing functions, the wafer sorting equipment will automatically generate carrier removal commands; if the wafer sorting equipment does not have PLC counting and timing functions, the host computer, such as MES, will remotely initiate carrier removal commands through telemetry data.

[0066] In some embodiments, an exemplary scenario may occur where the FOUP carrier contains a very small number of surplus wafers that do not belong to a preset category or meet sorting criteria. For these surplus wafers, the control device 40 controls them to remain in the original carrier. Subsequently, the control device 40 searches for a batch identifier with a null status flag and performs a return to sender / storage operation on the carrier containing the surplus wafers according to the sequence number of the batch identifier.

[0067] This embodiment allows wafer sorting equipment to process a large number of sortable wafers first, leaving a very small number of wafers that are difficult to sort in their original boxes for later processing by manual or offline equipment. This avoids deadlocks caused by a very small number of wafers and improves the efficiency of carrier turnover.

[0068] Figure 6 This is a schematic diagram illustrating the composition of the control device 40 of the wafer sorting equipment provided in this disclosure. In some examples, the control device 40 has communication capabilities, enabling it to access wired or wireless networks, and it can receive data based on the accessed wired or wireless network. It is understood that the control device 40 undertakes the calculation and processing work of the technical solution of this disclosure, and this disclosure does not limit it in this regard.

[0069] like Figure 6 As shown, the control device 40 in this disclosure may include one or more components such as a processor 610 and a memory 620.

[0070] Optionally, the processor 610 connects various parts within the computing device using various interfaces and lines, and performs various functions and processes data by running or executing instructions, programs, code sets, or instruction sets stored in the memory 620, and by calling data stored in the memory 620. Optionally, the processor 610 can be implemented using at least one hardware form of Digital Signal Processor (DSP), Field-Programmable Gate Array (FPGA), or Programmable Logic Array (PLA). The processor 610 can integrate one or a combination of several of the following: Central Processing Unit (CPU), Graphics Processing Unit (GPU), Neural-network Processing Unit (NPU), and baseband chip. Specifically, the CPU primarily handles the operating system, user interface, and applications; the GPU is responsible for rendering and drawing the content required to be displayed on the touch screen; the NPU is used to implement Artificial Intelligence (AI) functions; and the baseband chip is used to handle wireless communication. It is understandable that the aforementioned baseband chip may not be integrated into the processor 610, but may be implemented using a separate chip.

[0071] The memory 620 may include random access memory (RAM) or read-only memory (ROM). Optionally, the memory 620 may include a non-transitory computer-readable storage medium. The memory 620 may be used to store instructions, programs, code, code sets, or instruction sets. The memory 620 may include a program storage area and a data storage area, wherein the program storage area may store instructions for implementing an operating system, instructions for at least one function (such as touch function, sound playback function, image playback function, etc.), instructions for implementing the various method embodiments described above, etc.; the data storage area may store data created according to the use of the computing device, etc.

[0072] In addition, those skilled in the art will understand that the structure of the control device 40 shown in the above figures does not constitute a limitation on the control device 40. The control device 40 may include more or fewer components than shown, or combine certain components, or have different component arrangements. For example, the control device 40 may also include a display screen, camera assembly, microphone, speaker, radio frequency circuit, input unit, sensors (such as accelerometer, angular velocity sensor, light sensor, etc.), audio circuit, WiFi module, power supply, Bluetooth module, etc., which will not be described in detail here.

[0073] This disclosure also provides a computer-readable storage medium storing at least one instruction that is executed by a processor to implement the control method for the wafer sorting equipment as described in the above embodiments.

[0074] This disclosure also provides a computer program product including computer instructions stored in a computer-readable storage medium; a processor of a computing device reads the computer instructions from the computer-readable storage medium and executes the computer instructions, causing the control device 40 to perform the control method for the wafer sorting equipment described in the above embodiments.

[0075] Those skilled in the art will recognize that the functions described in this disclosure in one or more of the foregoing examples can be implemented using hardware, software, firmware, or any combination thereof. When implemented in software, these functions can be stored in a computer-readable medium or transmitted as one or more instructions or code on a computer-readable medium. Computer-readable media include computer storage media and communication media, wherein communication media include any medium that facilitates the transfer of a computer program from one place to another. Storage media can be any available medium accessible to a general-purpose or special-purpose computer.

[0076] It should be noted that the technical solutions described in this disclosure can be combined arbitrarily as long as they do not conflict.

[0077] The above description is merely a specific embodiment of this disclosure, but the scope of protection of this disclosure is not limited thereto. Any changes or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this disclosure should be included within the scope of protection of this disclosure.

Claims

1. A control method for a wafer sorting device, characterized in that, The control method includes: The wafer sorting equipment has multiple unloading ports configured as at least one fixed type port and at least one dynamic type port; wherein the fixed type port is configured to receive only wafers of a preset type, and the dynamic type port is configured to be able to change the target type of the received wafers; Obtain the category attribute information of the wafers to be sorted; When the wafer to be sorted belongs to the preset category, the wafer to be sorted is controlled to be transmitted to the fixed type port; When the wafer to be sorted belongs to a category other than the preset category, based on the preset sorting conditions, the target category of the dynamic type port is changed to the category to which the wafer to be sorted belongs, and the wafer to be sorted is controlled to be transmitted to the dynamic type port.

2. The method according to claim 1, characterized in that, The step of changing the target category of the dynamic type port to the category of the wafer to be sorted based on preset sorting conditions includes: According to preset priority conditions, the candidate category with the highest priority is determined based on the category to which the wafer to be sorted belongs; When the number of wafers to be sorted belonging to the candidate category does not reach a preset first quantity threshold, it is determined whether the waiting time of the wafers to be sorted belonging to the candidate category exceeds a preset first idling time threshold. When the waiting time exceeds the first idling time threshold, the target category of the dynamic type port is changed to the candidate category.

3. The control method according to claim 2, characterized in that, The method further includes: When the number of wafers to be sorted belonging to the candidate category does not reach the first quantity threshold and the waiting time does not exceed the first idling time threshold, the candidate category of the next priority is determined according to the priority condition to see if it meets the preset sorting condition.

4. The control method according to claim 1, characterized in that, For the fixed-type port, the method further includes: Monitor the number of wafers in the current carrier and the wafer waiting time at the fixed type port; When the number of wafers reaches a preset second quantity threshold, or when the wafer waiting time exceeds a second idling time threshold, a carrier removal command is triggered for the fixed type port.

5. The control method according to claim 4, characterized in that, The triggering of the vehicle removal command for the fixed type port includes: If the wafer sorting equipment has counting and timing functions, then the wafer sorting equipment initiates the carrier removal command; If the wafer sorting equipment does not have counting and timing functions, the host computer system will initiate the carrier removal command.

6. The control method according to claim 1, characterized in that, The method further includes: Once the target category of the dynamic type port is changed, a batch identifier corresponding to the current sorting task is generated; Update the status flag bit corresponding to the batch identifier based on the status of the first wafer starting sorting and the last wafer completing sorting; When the status flag indicates that sorting is complete, the current sorting task is considered finished.

7. The control method according to claim 6, characterized in that, The method further includes: After the current sorting task is completed, the target category of the dynamic type port is modified to the next wafer category waiting for dispatch.

8. The control method according to claim 6, characterized in that, Updating the status flag corresponding to the batch identifier includes: When the batch identifier is created, the status flag is initialized to an empty value; When the first box of wafers corresponding to the batch identifier is loaded into the loading port of the wafer sorting equipment, and the corresponding sorting task becomes start, the status flag is updated to the first status. Once the last box of wafers corresponding to the batch identifier has been sorted and the dynamic type port has been unloaded, the status flag will be updated to the second status.

9. The control method according to claim 8, characterized in that, The method further includes: When the carrier containing the wafer to be sorted contains remaining wafers belonging to other categories, and the remaining wafers do not meet the preset sorting conditions, the remaining wafers are controlled to remain in the carrier. Find the batch identifier where the status flag bit is empty; According to the sequence number of the batch identifier, the carriers that retain the remaining wafers are returned for rework.

10. The control method according to claim 1, characterized in that, The preset category is determined based on the wafer category ranked by quantity percentage in historical sorting data within a preset time period.

11. The control method according to claim 1, characterized in that, The preset categories include at least one of defect type and haze type.

12. A control device for a wafer sorting equipment, characterized in that, include: Memory, used to store computer programs; A processor for executing the computer program to implement the control method for the wafer sorting equipment as described in any one of claims 1 to 11.

13. A wafer sorting device, characterized in that, include: Multiple offload ports; Wafer transport robot; The control device is configured to perform a control method for the wafer sorting equipment as described in any one of claims 1 to 11 to control the wafer transfer robot to sort the wafers to be sorted to the unloading port.

14. A computer-readable storage medium having a computer program stored thereon, characterized in that, When the computer program is executed by the processor, it implements the control method for the wafer sorting equipment as described in any one of claims 1 to 11.

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