Vehicle device health management method, apparatus, and vehicle

CN122984643APending Publication Date: 2026-10-27DEEPAL AUTOMOBILE TECH CO LTD
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Patent Information

Application Number
CN202610929823.5
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2026-06-25
Publication Date
2026-10-27

AI Technical Summary

Technical Problem

[0004]本申请提供了一种车辆器件健康管理方法、装置及车辆,旨在解决现有技术中车载控制器关键器件健康状态监测依赖事后诊断或阈值比较、无法实现多应力融合的在线定量寿命预测的技术问题

Benefits of technology

[0007]在一种可能的实现方式中,基于关键器件在第一采样周期内对应的不同应力类型的损伤值对关键器件进行健康管理,包括:基于关键器件在第一采样周期内对应的不同应力类型的损伤值,确定不同应力类型对应的累积损伤值;累计损伤值用于指示关键器件在对应应力类型下已消耗的寿命额度比例;基于应力类型对应的累积损伤值,确定关键器件的总累积损伤;总累积损伤用于指示在所有应力类型下已累积消耗的总寿命额度比例;基于总累积损伤对关键器件进行健康管理。

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Abstract

The application relates to the technical field of vehicles, in particular to a vehicle device health management method and device and a vehicle, which aims to perform online health evaluation, cumulative damage calculation, residual life prediction and grading early warning on at least one key device in a vehicle controller, so as to improve the functional safety and maintainability of the vehicle controller, and comprises the following steps: in response to a health management starting instruction or a trigger signal of a fixed sampling period, obtaining stress parameters of at least one key device in the vehicle controller within a first sampling period; the stress parameters at least include temperature parameters and voltage parameters; based on the stress parameters within the first sampling period, determining damage values of different stress types corresponding to the key device within the first sampling period; the stress type is used for characterizing different failure modes causing life consumption of the key device; and based on the damage values of different stress types corresponding to the key device within the first sampling period, performing health management on the key device.
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Description

Technical Field

[0001] This application relates to the field of vehicle technology, and more particularly to the field of vehicle health management technology, specifically to a vehicle component health management method, device, and vehicle. Background Technology

[0002] With the rapid development of vehicle electrification, intelligence, and connectivity, the number of on-board electronic controllers is increasing daily, and their functional safety and reliability have become core elements of overall vehicle performance. On-board controllers integrate key components such as microcontrollers, power management chips, power MOSFETs, and connectors. These components are subjected to multiple stresses such as temperature, voltage, and vibration during the vehicle's service life, and their performance will gradually degrade until they fail.

[0003] Currently, the health management of vehicle electronic controllers is mainly based on fault code detection by the vehicle diagnostic system. Alarms can only be triggered after a hard fault occurs in the device, which is a post-event diagnosis and cannot provide early warning. Alternatively, planned maintenance based on fixed mileage or time may lead to premature replacement of devices that still have a health margin, resulting in waste of resources. Summary of the Invention

[0004] This application provides a vehicle component health management method, device, and vehicle, aiming to solve the technical problem in the prior art that the health status monitoring of key components of vehicle controllers relies on post-diagnosis or threshold comparison and cannot achieve online quantitative life prediction through multi-stress fusion.

[0005] To achieve the above objectives, the technical solution adopted in this application is as follows: In a first aspect, this application provides a vehicle component health management method, comprising: in response to a health management start command or a trigger signal of a fixed sampling period, acquiring stress parameters of at least one critical component in a vehicle controller within a first sampling period; the stress parameters include at least temperature parameters and voltage parameters; the first sampling period is the sampling period corresponding to the health management start command or the trigger signal of the fixed sampling period; based on the stress parameters within the first sampling period, determining damage values ​​of different stress types corresponding to the critical component within the first sampling period; the stress type is used to characterize different failure modes that cause life consumption of the critical component; the failure modes include: continuous thermal aging, alternating thermal fatigue, and voltage-induced stress damage; the damage value is used to indicate the accumulated life consumption of the critical component under the stress type within the first sampling period; and performing health management on the critical component based on the damage values ​​of different stress types corresponding to the critical component within the first sampling period.

[0006] Based on the aforementioned technical means, this application can acquire the temperature and voltage stress parameters of key components online in real time, quantify the lifespan consumption ratios of continuous thermal aging, alternating thermal fatigue, and voltage-induced stress damage, and achieve a health assessment integrating multiple failure modes. This method transforms traditional qualitative alarms into quantitative cumulative damage monitoring, providing accurate basis for predictive maintenance and effectively improving the reliability and safety of vehicle controllers.

[0007] In one possible implementation, health management of the critical component is performed based on the damage values ​​of the critical component corresponding to different stress types within the first sampling period. This includes: determining the cumulative damage value corresponding to different stress types based on the damage values ​​of the critical component corresponding to different stress types within the first sampling period; the cumulative damage value is used to indicate the proportion of the critical component's lifespan that has been consumed under the corresponding stress type; determining the total cumulative damage of the critical component based on the cumulative damage value corresponding to the stress type; the total cumulative damage is used to indicate the proportion of the total lifespan that has been consumed under all stress types; and performing health management of the critical component based on the total cumulative damage.

[0008] Based on the aforementioned technical means, this application obtains the cumulative damage of each failure mode by accumulating the stress damage values ​​of each sampling period, and then obtains the total cumulative damage through weighted fusion, thus achieving a unified quantification of the total lifetime consumption ratio under multi-stress coupling. This method can comprehensively reflect the superimposed impact of different failure mechanisms on device lifetime, significantly improving the comprehensiveness and accuracy of health assessment.

[0009] In one possible implementation, based on the damage values ​​of different stress types corresponding to the key components within the first sampling period, the cumulative damage value corresponding to different stress types is determined, including: summing the damage values ​​of different stress types corresponding to each sampling period to obtain the cumulative damage value corresponding to different stress types.

[0010] Based on the aforementioned technical methods, by successively accumulating the damage values ​​from each sampling period, the cumulative lifespan consumption of each stress type can be tracked in real time using discrete integration at low cost and low computational power. This method simplifies the complex calculations of continuous integration, is suitable for automotive embedded environments, ensures the long-term stable online operation of the health management system, and enables continuous dynamic tracking of the device degradation process.

[0011] In one possible implementation, the total cumulative damage of a key component is determined based on the cumulative damage value corresponding to the stress type, including: determining the weight corresponding to the stress type; and weighting and summing the weight corresponding to the stress type and the cumulative damage value corresponding to the stress type to obtain the total cumulative damage.

[0012] Based on the aforementioned technical methods, a differentiated fusion assessment of the total cumulative damage of key components is achieved by assigning weights to different stress types and performing weighted summation. This approach can flexibly adjust the contribution ratio of each stress type to the total damage according to the failure physics characteristics of the components, making the life prediction more consistent with the actual degradation mechanism and significantly improving the pertinence and accuracy of health assessment.

[0013] In one possible implementation, health management of critical components is performed based on total cumulative damage, including: determining a cumulative damage warning level based on total cumulative damage and a preset damage threshold; determining the remaining lifetime percentage of the critical components based on total cumulative damage; determining the expected remaining lifetime based on the remaining lifetime percentage and the rated total lifetime of the critical components; and reporting health status based on the cumulative damage warning level and the expected remaining lifetime.

[0014] Based on the aforementioned technical means, this application can automatically determine the graded early warning level based on the total cumulative damage, and simultaneously calculate the remaining lifespan ratio and expected remaining lifespan, thereby achieving quantitative reporting of health status. This method transforms abstract cumulative damage into intuitive early warning levels and remaining time, providing a clear and operable basis for maintenance decisions, functional degradation, and cloud monitoring, significantly improving the practicality of the health management system.

[0015] In one possible implementation, health management of the critical device is based on the damage values ​​of the critical device corresponding to different stress types within the first sampling period, and also includes: reading the historical accumulated damage value as the initial value, where the historical accumulated damage value is the damage value accumulated by the critical device at the end of the previous sampling period.

[0016] Based on the aforementioned technical means, this application achieves interrupted recovery and continuous accumulation of health management by reading historical cumulative damage values ​​as initial values. Even if the monitoring system stops midway due to vehicle hibernation, power failure, or restart, it can continue to accumulate damage from the last termination point after restarting, ensuring the accuracy and continuity of the total cumulative damage calculation and improving the system's engineering applicability in the vehicle environment.

[0017] In one possible implementation, the stress type includes at least two of thermal stress, temperature cyclic stress, and electrical stress. Based on the stress parameters within the first sampling period, the damage values ​​of the key device corresponding to different stress types within the first sampling period are determined, including: when the stress type includes thermal stress, inputting the temperature parameter into the thermal damage model and outputting the thermal damage increment within the first sampling period; when the stress type includes electrical stress, inputting the voltage parameter into the electrical stress damage model and outputting the electrical damage increment within the first sampling period; when the stress type includes temperature cyclic stress, inputting the temperature parameter into the temperature cyclic damage model and outputting the cyclic damage increment within the first sampling period.

[0018] Based on the aforementioned technical means, this application independently calculates the damage increment using corresponding damage models for thermal stress, electrical stress, and temperature cycling stress, achieving decoupled quantification of multi-physics stress. Each model has clearly defined input parameters and a clear physical meaning, accurately reflecting the differentiated impact of different failure mechanisms on device lifetime. This provides reliable feature inputs for subsequent cumulative fusion and health assessment, significantly improving the precision and reliability of lifetime prediction.

[0019] In one possible implementation, the key component is at least one of a microcontroller, a power chip, a power MOSFET, or a connector.

[0020] Based on the aforementioned technical means, this application clarifies that the health management method is applicable to core devices such as microcontrollers, power chips, power MOSFETs, and connectors, enabling targeted stress monitoring and model adaptation for the failure characteristics of different devices. This approach expands the method's versatility and coverage, systematically improving the health management capabilities of various key devices within the vehicle controller.

[0021] Secondly, this application provides a vehicle component health management device, comprising: Thirdly, this application provides a vehicle, including a controller, which performs vehicle component health management using the vehicle component health management method of the first aspect.

[0022] Fourthly, this application provides an electronic device, including: a processor and a memory, wherein the memory stores at least one computer program, and the at least one computer program is loaded and executed by the processor to implement the method described in the first aspect and any possible implementation thereof.

[0023] Fifthly, this application provides a computer-readable storage medium that, when the instructions in the computer-readable storage medium are executed by a processor of an electronic device, enables the electronic device to perform the methods described in the first aspect and any possible implementation thereof.

[0024] In a sixth aspect, this application provides a computer program product comprising computer instructions that, when executed on an electronic device, cause the electronic device to perform the method described in the first aspect and any of its possible implementations.

[0025] It should be noted that the technical effects of any of the implementation methods in aspects two through six can be found in the technical effects of the corresponding implementation methods in aspect one, and will not be repeated here.

[0026] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and do not limit this application. Attached Figure Description

[0027] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application, and do not constitute an undue limitation of this application.

[0028] Figure 1 This is a schematic diagram of the structure of a vehicle shown in an embodiment of this application; Figure 2 This is a flowchart illustrating a vehicle component health management method according to an embodiment of this application; Figure 3 This is a flowchart illustrating another vehicle component health management method according to an embodiment of this application; Figure 4 This is a flowchart illustrating another vehicle component health management method according to an embodiment of this application; Figure 5 This is a block diagram illustrating yet another vehicle device health management device according to an embodiment of this application; Figure 6 This is a block diagram illustrating an electronic device according to an embodiment of this application. Detailed Implementation

[0029] To enable those skilled in the art to better understand the technical solutions of this application, the technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings.

[0030] It should be noted that the terms "first," "second," etc., used in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of this application described herein can be implemented in orders other than those illustrated or described herein. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this application. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this application as detailed in the appended claims.

[0031] In the embodiments of this application, the words "exemplary," "for example," or "for instance" are used to indicate that something is an example, illustration, or description. Any embodiment or design described as "exemplary," "for example," or "for instance" in the embodiments of this application should not be construed as being more preferred or advantageous than other embodiments or designs. Specifically, the use of the words "exemplary," "for example," or "for instance" is intended to present the relevant concepts in a specific manner.

[0032] The technical solutions of the embodiments of this application will be described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments.

[0033] The vehicle component health management device provided in this application embodiment is used to execute a vehicle component health management method to perform online health assessment, cumulative damage calculation, remaining life prediction, and graded early warning for at least one key component in the vehicle controller, thereby improving the functional safety and maintainability of the vehicle controller. The vehicle can also be referred to as a vehicle, mobile carrier, electric vehicle (EV), hybrid electric vehicle (HEV), plug-in hybrid electric vehicle (PHEV), fuel cell vehicle (FCV), autonomous vehicle, intelligent and connected vehicle (ICV), driverless vehicle, etc.

[0034] In this application embodiment, the vehicle can be a sedan, bus, sport utility vehicle (SUV), truck, special vehicle, driverless taxi, intelligent connected bus, autonomous logistics vehicle, electric truck, etc. In addition, the method is also applicable to other mobile vehicles equipped with vehicle communication terminals, such as tricycles, two-wheeled vehicles, trains and other transportation devices that carry people or goods, or other types of vehicles powered by power batteries, etc. This application does not impose specific limitations on these.

[0035] Figure 1 This is a schematic diagram of the structure of a vehicle as shown in an embodiment of this application. Figure 1 As shown, the vehicle 100 includes a controller 110, a sensor group 120 and a memory 130 connected to the controller 110.

[0036] Among them, the sensor group 120 is used to collect the temperature and voltage parameters of key components, and the memory 130 is used to store historical cumulative damage values, preset thresholds, weighting coefficients, and rated total lifespan.

[0037] The controller 110 integrates a health management unit, which is used to perform vehicle component health management methods to conduct online health assessments and life predictions of at least one of the key components, such as microcontrollers, power chips, power MOSFETs, or connectors, inside the vehicle 100.

[0038] Specifically, controller 110 can be a body controller, powertrain controller, chassis controller, or intelligent driving domain controller. Controller 110 also includes a main function microcontroller, which performs basic vehicle control functions. The health management unit is independent of the main function microcontroller, and its power supply and clock are isolated from those of the main function microcontroller to ensure normal operation even if the main function microcontroller fails.

[0039] Optionally, the health management unit is an independent microcontroller that integrates a high-precision analog-to-digital converter, a floating-point arithmetic unit, and an independent watchdog timer for performing data acquisition with a fixed sampling period, damage model calculation, and cumulative damage accumulation.

[0040] In its implementation, the health management unit responds to a health management start command or a trigger signal with a fixed sampling period by acquiring temperature and voltage parameters of key components through sensor group 120; determines the damage value corresponding to different stress types based on the acquired stress parameters; accumulates the damage values ​​of each sampling period to obtain the cumulative damage value of each stress type; fuses the weighted cumulative damage values ​​to obtain the total cumulative damage; determines the warning level, remaining lifespan ratio, and expected remaining lifespan based on the total cumulative damage, and reports the health information to the vehicle controller or cloud platform.

[0041] This application does not limit the specific physical form of the vehicle component health management device 101, as long as it can perform the vehicle component health management method provided in the embodiments of this application.

[0042] The aforementioned sensor group 120 is used to collect real-time stress parameters of at least one key component inside the vehicle 100. The sensor group 120 includes a temperature sensor and a voltage sensor.

[0043] The aforementioned sensor group 120 includes: a negative temperature coefficient thermistor or semiconductor temperature sensor arranged at the junction temperature measurement point of the critical device for acquiring the real-time junction temperature of the critical device; and a high-precision analog-to-digital conversion circuit connected to the power supply pin of the critical device for acquiring the real-time operating voltage of the critical device.

[0044] Optionally, the sensor group 120 also includes a current sensor for acquiring the on-state current of the power MOSFET to assist in calculating switching losses; the sensor group 120 also includes a miniature resistance measurement circuit arranged near the connector pins for monitoring the contact resistance of the connector.

[0045] The aforementioned memory 130 is used to store data that needs to be persistently retained during the operation of the health management unit. Memory 130 includes non-volatile memory.

[0046] The aforementioned memory 130 includes a flash memory or an electrically erasable programmable read-only memory for storing historical cumulative damage values, preset damage thresholds, weighting coefficients for each stress type, and the rated total lifespan of each critical component. The historical cumulative damage values ​​are used as initial values ​​when the health management unit restarts to ensure the continuity of cumulative damage.

[0047] Optionally, the memory 130 is also used to store the unique identifier of the critical device, the timestamp of the last health management execution, and the historical records of graded warnings to support the traceability and data analysis of health management.

[0048] It should be noted that the structure illustrated in the embodiments of this application does not constitute a limitation on the vehicle device health management device 101. It may include more or fewer components than illustrated, or combine some components, or split some components, or have different component arrangements. The illustrated components may be implemented in hardware, software, or a combination of software and hardware.

[0049] The architecture of the embodiments of this application has been described above. The vehicle component health management method of this application will be described below with reference to specific embodiments.

[0050] This application provides a vehicle component health management method that acquires the temperature and voltage parameters of key components in response to a trigger signal with a fixed sampling period. The method calculates the damage increments corresponding to thermal stress, temperature cycle stress, and electrical stress, respectively, and accumulates them to obtain the cumulative damage value corresponding to each stress type. The total cumulative damage is then determined by weighted fusion. This method enables online quantitative prediction of the remaining lifespan of key components in an in-vehicle embedded environment and provides a quantitative basis for graded early warning and health reporting.

[0051] For ease of understanding, the vehicle component health management method provided in this application will be described in detail below with reference to the accompanying drawings.

[0052] Figure 2 This is a flowchart illustrating a vehicle component health management method according to an embodiment of this application, with reference to... Figure 2 The vehicle component health management method includes: S201. In response to a health management start command or a trigger signal with a fixed sampling period, acquire the stress parameters of at least one key component in the vehicle controller during the first sampling period.

[0053] Among them, the stress parameters include at least the temperature parameters and the voltage parameters.

[0054] Optionally, the stress parameters may also include at least one of current parameters, vibration parameters, or humidity parameters to help assess the degree of degradation of a particular type of device.

[0055] For example, for power MOSFETs, the on-current parameter can be increased to more accurately calculate switching losses; for connectors, the indirect measurement of contact resistance can be increased.

[0056] The aforementioned key components are at least one of a microcontroller, power chip, power MOSFET, or connector. Different key components can be selected based on their failure physical characteristics, allowing for the selection of corresponding stress parameter combinations.

[0057] The first sampling period mentioned above is the sampling period corresponding to the health management start command or the trigger signal of the fixed sampling period.

[0058] The aforementioned health management start command is an initialization command automatically generated by the controller when the vehicle is powered on, or a start command sent by external diagnostic equipment through the vehicle network.

[0059] In addition, the health management start command can also be triggered by the low-voltage power management module when the vehicle wakes up from hibernation to ensure that monitoring can restart or continue to accumulate with each driving cycle.

[0060] In one possible implementation, the sensor array triggers sampling at fixed time intervals (e.g., 1 second), and the health management unit reads the temperature and voltage values ​​for the current cycle.

[0061] S202. Based on the stress parameters within the first sampling period, determine the damage values ​​of key components corresponding to different stress types within the first sampling period.

[0062] The stress types mentioned above are used to characterize different failure modes that cause lifespan loss in critical components.

[0063] The failure modes mentioned above include: continuous thermal aging, alternating thermal fatigue, and voltage-induced stress damage.

[0064] Specifically, continuous thermal aging corresponds to the degradation of material properties of devices under long-term high-temperature environments, alternating thermal fatigue corresponds to mechanical fatigue caused by repeated temperature rise and fall cycles, and voltage-induced stress damage corresponds to the accumulation of insulation layer defects caused by long-term voltage bias or instantaneous voltage overshoot.

[0065] In one possible implementation, the increments of thermal damage, temperature cycling damage, and electrical damage are calculated using the Arrhenius model, the Coffin-Manson model, and the inverse power law model, respectively.

[0066] The aforementioned damage value is used to indicate the accumulated lifetime of a critical component under this stress type within the first sampling period, that is, the proportion of lifetime consumed by this stress within this period to the rated total lifetime.

[0067] The damage values ​​mentioned above are used to indicate the accumulated lifespan of critical components under the stress type within the first sampling period.

[0068] S203. Perform health management on key components based on the damage values ​​of different stress types corresponding to the key components within the first sampling period.

[0069] In one possible implementation, the cumulative damage for each stress type is obtained by summing the damage values ​​of each cycle, and the total cumulative damage is obtained by weighted fusion. Then, the remaining lifetime ratio and expected remaining time are output, and a graded warning is triggered according to a preset threshold.

[0070] Figure 3 This is a flowchart illustrating another vehicle component health management method according to an embodiment of this application, referred to... Figure 3 The vehicle component health management method includes: S301. In response to a health management start command or a trigger signal with a fixed sampling period, acquire the stress parameters of at least one key component in the vehicle controller during the first sampling period.

[0071] For details, please refer to S201; further details will not be provided here.

[0072] S302. Based on the stress parameters within the first sampling period, determine the damage values ​​of key components corresponding to different stress types within the first sampling period.

[0073] For details, please refer to S202; further details will not be provided here.

[0074] S303. Based on the damage values ​​of different stress types corresponding to the key components in the first sampling period, determine the cumulative damage value corresponding to different stress types.

[0075] The aforementioned cumulative damage value is used to indicate the proportion of the lifespan that a critical component has consumed under the corresponding stress type.

[0076] One possible implementation involves summing the damage values ​​for different stress types corresponding to each sampling period to obtain the cumulative damage value for each stress type.

[0077] Optionally, for newly commissioned critical devices, the cumulative damage value for each stress type is initialized to 0; for devices that have been used for a period of time, the previously saved historical cumulative damage value is read from the memory as the initial cumulative value upon first startup.

[0078] In another possible implementation, the cumulative damage value can also be updated using an exponentially weighted moving average to reduce the impact of instantaneous disturbances on long-term accumulation.

[0079] S304. Determine the total cumulative damage of key components based on the cumulative damage value corresponding to the stress type.

[0080] The total cumulative damage mentioned above is used to indicate the percentage of total lifespan that has been consumed under all stress types.

[0081] Specifically, the total cumulative damage is equal to the weighted sum of the cumulative damage values ​​of each stress type, and the weighting coefficients are determined based on the failure physical characteristics of key components and bench calibration experiments.

[0082] In one possible implementation, the weight corresponding to the stress type is determined, and the weight corresponding to the stress type and the cumulative damage value corresponding to the stress type are weighted and summed to obtain the total cumulative damage.

[0083] The weights corresponding to the stress types mentioned above are non-negative real numbers, and the sum of all weights can be greater than 1 or less than 1, depending on the contribution of each stress type to device failure.

[0084] For example, for a microcontroller using a ball grid array package, the weight of temperature cycling stress can be set to 0.5, the weight of thermal stress to 0.3, and the weight of electrical stress to 0.2; for a power supply chip, the weights of thermal stress and electrical stress can each be set to 0.5, and the weight of temperature cycling stress can be 0.

[0085] S305. Perform health management on critical components based on total cumulative damage.

[0086] In one possible implementation, health management includes early warning level determination, remaining life expectancy calculation, and information reporting.

[0087] In one embodiment, the above-mentioned S305, which performs health management on critical devices based on total cumulative damage, includes: S3051. Determine the cumulative damage warning level based on the total cumulative damage and the preset damage threshold.

[0088] The aforementioned preset damage thresholds are one or more pre-stored values ​​used to classify different warning levels.

[0089] For example, set the first threshold TH1=0.6, the second threshold TH2=0.8, and the third threshold TH3=0.95.

[0090] The aforementioned cumulative damage warning levels are determined based on the threshold range into which the total cumulative damage falls, including "Caution", "Warning", and "Severe".

[0091] In one possible implementation, no warning is triggered when the total cumulative damage is less than TH1; a "attention" level warning is triggered when the total cumulative damage is greater than or equal to TH1 and less than TH2; a "warning" level warning is triggered when the total cumulative damage is greater than or equal to TH2 and less than TH3; and a "serious" level warning is triggered when the total cumulative damage is greater than or equal to TH3.

[0092] S3052. Based on the total cumulative damage, determine the remaining lifetime percentage of critical components.

[0093] The remaining lifespan ratio mentioned above is 1 minus the total cumulative damage, with a value ranging from 0 to 1.

[0094] In one possible implementation, the remaining lifetime ratio = 1 - total cumulative damage. If the total cumulative damage exceeds 1 due to model error or data anomalies, the remaining lifetime ratio is forcibly set to 0, triggering a critical warning.

[0095] It should be noted that although thermal damage, cyclic damage, and electrical damage originate from different physical failure mechanisms and have different original physical dimensions (thermal damage is based on temperature-time integral, cyclic damage is based on the number of cycles, and electrical damage is based on voltage-time accumulation), this application normalizes each type of damage to "the proportion of consumed lifetime to the rated total lifetime," so that each damage value has a unified, dimensionless basis for accumulation in mathematics, allowing damages with different physical dimensions to be compared and accumulated on the same scale.

[0096] Furthermore, this approach follows the classic Miner linear cumulative damage rule in reliability engineering, which assumes that the damage generated under independent stresses can be linearly superimposed, and the device fails when the total damage reaches 1. Although this rule ignores the interaction and nonlinear effects between stresses, it has proven to have sufficient engineering accuracy in predicting the engineering life of automotive controllers, and its calculation is simple, making it suitable for embedded real-time implementation.

[0097] Furthermore, in practical engineering applications, the weighting coefficients of each damage model can be calibrated through bench accelerated life tests. The normalized cumulative damage value for each stress type is then fitted with the experimentally observed actual failure time, ensuring that the moment when the total cumulative damage reaches 1 is essentially consistent with the actual failure time of the device. Through this experimental calibration method, even if the physical mechanisms of each stress type are different, the total cumulative damage after weighted fusion still has clear engineering physical significance.

[0098] S3053. Determine the expected remaining lifetime based on the remaining lifetime percentage and the rated total lifetime of key components.

[0099] The above-mentioned rated total lifespan is the design lifespan of the key device under reference conditions (such as rated voltage, rated junction temperature, and ambient temperature), in hours or years, and is pre-stored in non-volatile memory.

[0100] The above-mentioned expected remaining life is the percentage of remaining life multiplied by the rated total life, that is, expected remaining life = percentage of remaining life × rated total life.

[0101] In one possible implementation, if historical monitoring data indicates that the device's recent aging rate has accelerated, the rated total lifetime can be dynamically corrected, for example, by re-estimating the remaining time using the average aging rate within a sliding window.

[0102] Optionally, the expected remaining life can also be output by multiplying the remaining life percentage by the factory-specified life for reference by drivers or maintenance personnel.

[0103] It should be understood that the expected remaining life is a dynamic estimate, and the actual remaining time is affected by future operating conditions. The present application provides the optimal estimate based on current and historical stresses.

[0104] S3054. Health reporting based on cumulative damage warning level and expected remaining lifespan.

[0105] In one possible implementation, the health management unit reports health information to at least one receiver in the vehicle controller, dashboard, or cloud platform via the in-vehicle network.

[0106] The in-vehicle network includes at least one of Controller Area Network (CAN), CAN Flexible Data Rate (CAN), or In-vehicle Ethernet.

[0107] The reporting methods include two modes: periodic reporting and event-triggered reporting.

[0108] The aforementioned health information includes at least one of the following: identifier of critical components, cumulative damage warning level, total cumulative damage value, remaining lifetime percentage, and expected remaining lifetime.

[0109] In one possible implementation, health status summary information is sent periodically according to a preset reporting cycle (e.g., every 100 kilometers driven or every 24 hours).

[0110] Specifically, when the reporting cycle arrives, the health management unit encapsulates the current health information of each key component into a standardized message and sends it to the vehicle controller via the vehicle network. After receiving the message, the vehicle controller stores the information in its local log and retrieves it from diagnostic equipment during regular vehicle maintenance.

[0111] In one possible implementation, event-triggered reporting immediately sends detailed health information when the cumulative damage warning level changes. Specifically, when the total cumulative damage of a critical component changes from below a first threshold to reaching or exceeding the first threshold, a "Note" level warning is triggered and reported immediately; when the warning level changes from "Note" to "Warning" level, it is reported again immediately.

[0112] The information reported during event-triggered reporting is more detailed than that reported periodically. In addition to basic health information, it also includes the cumulative damage value of each stress type, the timestamp of the warning level change, and the current operating parameters.

[0113] In one possible implementation, after receiving a reporting request instruction from the vehicle controller or cloud platform, the health management unit responds by packaging and reporting the current health information to support remote diagnosis and on-demand querying.

[0114] The aforementioned health information is used by the vehicle controller to implement function degradation strategies, display maintenance reminders on the dashboard, or perform remote diagnostics and predictive maintenance scheduling on the cloud platform.

[0115] For example, when the warning level is "Caution", the instrument panel can display "It is recommended to check a certain component recently"; when the warning level is "Warning", the instrument panel can display "A certain component is about to reach the end of its lifespan, please repair it as soon as possible"; when the warning level is "Severe", the vehicle controller can limit the vehicle's maximum speed or prompt the driver to stop immediately.

[0116] In one possible implementation, health reporting also involves uploading health information to a cloud server via a wireless communication network. The cloud server stores the health data reported by each vehicle and uses big data analysis to identify common degradation patterns of similar devices, which can be used to optimize device selection for subsequent batches or update the weighting coefficients of the damage model.

[0117] In addition, the cloud server can also push personalized maintenance reminders or repair suggestions to user terminals based on the expected remaining life information reported by each vehicle, realizing the transformation from passive maintenance to proactive service.

[0118] Optionally, the health reporting information may also include the vehicle identification number, model and batch information of key components, and the current total mileage of the vehicle, to support fault tracing and batch quality analysis.

[0119] Figure 4 This is a flowchart illustrating another vehicle component health management method according to an embodiment of this application, referred to... Figure 4 The vehicle component health management method includes: S401. In response to a health management start command or a trigger signal with a fixed sampling period, acquire the stress parameters of at least one key component in the vehicle controller during the first sampling period.

[0120] For details, please refer to S201; further details will not be provided here.

[0121] S402. Determine the damage values ​​of key components for different stress types within the first sampling period.

[0122] The stress types mentioned above include at least two of the following: thermal stress, temperature cyclic stress, and electrical stress.

[0123] Ⅰ: When the stress type includes thermal stress, input the temperature parameter into the thermal damage model and output the thermal damage increment within the first sampling period.

[0124] The above thermal damage model is based on the Arrhenius relation. The Arrhenius model is a classic model used in reliability engineering to describe temperature-accelerated effects. It is applicable to thermally activated failure mechanisms such as electromigration, oxidation, and solder joint fatigue. Its acceleration factor is calculated using the following formula:

[0125] in, For activation energy, Boltzmann's constant, For operating temperature, To accelerate the testing temperature.

[0126] In one possible implementation, the health management unit acquires the real-time junction temperature of key components at a fixed sampling period. and compare it with the reference temperature Substituting into the Arrhenius relation, we obtain the temperature acceleration factor for the current sampling period:

[0127] in, The activation energy corresponding to the failure mechanism, Boltzmann's constant, This is the rated junction temperature or the reference temperature for life testing. For the first Real-time junction temperature for each sampling period.

[0128] Furthermore, based on the acceleration factor and the reference damage rate per unit time under the reference conditions, the thermal damage increment can be calculated:

[0129] in, The base damage rate per unit time at the reference temperature. This is the duration of the sampling period.

[0130] Optionally, a lookup table corresponding to temperature ranges and damage rates can be pre-established. The damage rate can be obtained by querying the current temperature and multiplied by the sampling period to obtain the thermal damage increment, so as to avoid real-time exponential calculation.

[0131] II: When the stress type includes electrical stress, input the voltage parameters into the electrical stress damage model and output the electrical damage increment within the first sampling period.

[0132] The above-mentioned electrical stress damage model is based on the inverse power law model, which is used to describe the accelerated effect of electrical stress and is applicable to failure mechanisms such as dielectric breakdown and electromigration. Its core relationship is that the lifetime is inversely proportional to the voltage as a power function.

[0133] In one possible implementation, the health management unit acquires the real-time operating voltage. and with rated voltage Substituting the inverse power law relation, we obtain the voltage acceleration factor:

[0134] in, It is the voltage acceleration constant, which is determined by the device process and failure mechanism.

[0135] Furthermore, based on the acceleration factor and the reference electrical damage rate per unit time under the reference conditions, the steady-state electrical damage increment is calculated:

[0136] in, This represents the baseline electrical damage rate per unit time under rated voltage.

[0137] Optionally, electrical stress also includes voltage ripple or transient overshoot. When ripple or transient overshoot exceeds a preset threshold, a transient pulse damage model can be established based on Arrhenius or inverse power law to calculate the damage of a single transient event and add it to the total electrical stress damage.

[0138] Ⅲ: When the stress type includes temperature cyclic stress, input the temperature parameter into the temperature cyclic damage model and output the cyclic damage increment within the first sampling period.

[0139] The temperature cycling damage model described above is based on the Coffin-Manson relationship. This model is used to describe low-cycle fatigue life and is applicable to failure scenarios such as solder joint fatigue and package thermomechanical fatigue. Its mechanism is the accumulation of plastic strain caused by thermal expansion and contraction.

[0140] In one possible implementation, the health management unit continuously records the junction temperature time series and maintains a temperature buffer containing the most recent N sampling periods within the current sampling period. When the data meets the conditions, the temperature series is cyclically identified using a rainflow counting method.

[0141] Rainfall counting method identifies local peaks and troughs, extracts complete "peak-trough-peak" or "trough-peak-trough" cycles from the sequence, and records the temperature difference amplitude for each cycle. and average temperature .

[0142] For each complete cycle, the damage is:

[0143] in, As the reference temperature difference, The Coffin-Manson index (typically 3 to 5).

[0144] The incremental cyclic damage within the current sampling period is:

[0145] in, This increment represents all complete temperature cycles that have ended within the current sampling period; if there are no complete cycles, the increment is 0.

[0146] In one alternative implementation, the effect of average temperature can also be introduced to correct for cyclic damage:

[0147] in, The activation energy of cyclic damage, Using the reference temperature, this correction term is used to characterize the effect of creep-fatigue interaction on damage acceleration.

[0148] S403. Perform health management on key components based on the damage values ​​of different stress types corresponding to the key components in the first sampling period.

[0149] For details, please refer to S203; further details will not be provided here.

[0150] Figure 5 This is a block diagram illustrating another vehicle component health management device according to an embodiment of this application, with reference to... Figure 5 The vehicle device health management device includes: an acquisition module 501, a processing module 502, and a management module 503.

[0151] The aforementioned acquisition module 501 is used to acquire stress parameters of at least one key component in the vehicle controller within a first sampling period in response to a health management start command or a trigger signal with a fixed sampling period; the stress parameters include at least temperature parameters and voltage parameters; the first sampling period is the sampling period corresponding to the health management start command or the trigger signal with a fixed sampling period. The aforementioned processing module 502 is used to determine the damage value of the key component corresponding to different stress types within the first sampling period based on the stress parameters within the first sampling period; the stress type is used to characterize different failure modes that cause the key component to lose its lifespan; the failure modes include: continuous thermal aging, alternating thermal fatigue and voltage-induced stress damage; the damage value is used to indicate the accumulated lifespan of the key component under the stress type within the first sampling period. The aforementioned management module 503 is used to perform health management on key components based on the damage values ​​of different stress types corresponding to the key components within the first sampling period.

[0152] The aforementioned management module 503 is further configured to determine the cumulative damage value corresponding to different stress types based on the damage value of the key component within the first sampling period for different stress types; the cumulative damage value is used to indicate the proportion of the lifespan that the key component has consumed under the corresponding stress type; the total cumulative damage of the key component is determined based on the cumulative damage value corresponding to the stress type; the total cumulative damage is used to indicate the proportion of the total lifespan that has been consumed under all stress types; and health management of the key component is performed based on the total cumulative damage.

[0153] The aforementioned management module 503 is also used to accumulate the damage values ​​of different stress types corresponding to each sampling period to obtain the cumulative damage value corresponding to different stress types.

[0154] The aforementioned management module 503 is also used to determine the weight corresponding to the stress type; and to obtain the total cumulative damage by weighted summing of the weight corresponding to the stress type and the cumulative damage value corresponding to the stress type.

[0155] The aforementioned management module 503 is also used to determine the cumulative damage warning level based on the total cumulative damage and the preset damage threshold; determine the remaining lifespan ratio of key components based on the total cumulative damage; determine the expected remaining lifespan based on the remaining lifespan ratio and the rated total lifespan of key components; and perform health reporting based on the cumulative damage warning level and the expected remaining lifespan.

[0156] The aforementioned management module 503 is also used to read the historical accumulated damage value as the initial value. The historical accumulated damage value is the damage value that the key device has accumulated at the end of the previous sampling period.

[0157] The stress types mentioned above include at least two of thermal stress, temperature cyclic stress, and electrical stress. The processing module is further configured to, when the stress type includes thermal stress, input temperature parameters into the thermal damage model and output the thermal damage increment within the first sampling period; when the stress type includes electrical stress, input voltage parameters into the electrical stress damage model and output the electrical damage increment within the first sampling period; and when the stress type includes temperature cyclic stress, input temperature parameters into the temperature cyclic damage model and output the cyclic damage increment within the first sampling period.

[0158] The aforementioned key components are at least one of a microcontroller, a power chip, a power MOSFET, or a connector.

[0159] Regarding the apparatus in the above embodiments, the specific manner in which each module performs its operation has been described in detail in the embodiments of the vehicle device health management method, and will not be elaborated upon here.

[0160] Figure 6 This is a block diagram illustrating an electronic device according to an embodiment of this application. Figure 6 As shown, the electronic device includes, but is not limited to, a processor 601 and a memory 602.

[0161] The memory 602 described above is used to store the executable instructions of the processor 601. It is understood that the processor 601 is configured to execute instructions to implement the vehicle device health management method in the above embodiments.

[0162] It should be noted that those skilled in the art will understand that Figure 6 The electronic device structure shown does not constitute a limitation on the electronic device; the electronic device may include, but is not limited to, other electronic devices. Figure 6 This may indicate more or fewer components, or combinations of certain components, or different component arrangements.

[0163] Processor 601 is the control center of the electronic device. It connects various parts of the electronic device via various interfaces and lines. By running or executing software programs and / or modules stored in memory 602, and by calling data stored in memory 602, it performs various functions and processes data, thereby providing overall monitoring of the electronic device. Processor 601 may include one or more processing units. Processor 601 may integrate an application processor and a modem processor. The application processor mainly handles the operating system, user interface, and applications, while the modem processor mainly handles wireless communication. It is understood that the modem processor may not be integrated into processor 601.

[0164] The memory 602 can be used to store software programs and various data. The memory 602 may primarily include a program storage area and a data storage area. The program storage area may store the operating system, application programs required by at least one functional module (such as deterministic components, integrated components, etc.), etc. Furthermore, the memory 602 may include high-speed random access memory, and may also include non-volatile memory, such as at least one disk storage device, flash memory device, or other volatile solid-state storage device.

[0165] In an exemplary embodiment, a computer-readable storage medium including instructions is also provided, such as a memory 602 including instructions, which can be executed by a processor 601 of an electronic device to implement the methods in the above embodiments.

[0166] In actual implementation, Figure 6 The functions of the acquisition module 501, processing module 502, and management module 503 can all be provided by... Figure 6 The processor 601 calls the computer program stored in the memory 602 to implement the process. The specific execution process can be found in the description of the method section in the previous embodiment, and will not be repeated here.

[0167] Optionally, the computer-readable storage medium may be a non-transitory computer-readable storage medium, such as a read-only memory (ROM), random access memory (RAM), compact disc read-only memory (CD-ROM), magnetic tape, floppy disk, and optical data storage device. In an exemplary embodiment, this application also provides a computer program product including one or more instructions, which can be executed by the processor 601 of an electronic device to perform the methods in the above embodiments.

[0168] It should be noted that when one or more instructions in the computer-readable storage medium or computer program product are executed by the processor of the electronic device, they implement the various processes of the above method embodiments and achieve the same technical effect as the above method. To avoid repetition, they will not be described again here.

[0169] Through the above description of the embodiments, those skilled in the art can clearly understand that, for the sake of convenience and brevity, only the division of the above functional modules is used as an example. In actual applications, the above functions can be assigned to different functional modules as needed, that is, the internal structure of the device can be divided into different functional modules to complete all or part of the functions described above.

[0170] In the several embodiments provided in this application, it should be understood that the disclosed apparatus and methods can be implemented in other ways. For example, the apparatus embodiments described above are merely illustrative; for instance, the division of modules or units is only a logical functional division, and in actual implementation, there may be other division methods. For example, multiple units or components may be combined or integrated into another apparatus, or some features may be ignored or not executed. Furthermore, the mutual coupling or direct coupling or communication connection shown or discussed may be through some interfaces; the indirect coupling or communication connection between apparatuses or units may be electrical, mechanical, or other forms.

[0171] The units described as separate components may or may not be physically separate. A component shown as a unit can be one or more physical units; that is, it can be located in one place or distributed in multiple different locations. Some or all of the units can be selected to achieve the purpose of this embodiment according to actual needs.

[0172] Furthermore, the functional units in the various embodiments of this application can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit. The integrated unit can be implemented in hardware or as a software functional unit.

[0173] If the integrated unit is implemented as a software functional unit and sold or used as an independent product, it can be stored in a readable storage medium. Based on this understanding, the technical solutions of the embodiments of this application, essentially, or the parts that contribute to the prior art, or all or part of the technical solutions, can be embodied in the form of a software product. This software product is stored in a storage medium and includes several instructions to cause a device (which may be a microcontroller, chip, etc.) or processor to execute all or part of the steps of the methods of the various embodiments of this application. The aforementioned storage medium includes various media capable of storing program code, such as USB flash drives, portable hard drives, ROM, RAM, magnetic disks, or optical disks.

[0174] This application provides a computer program product containing instructions that, when run on a computer, cause the computer to perform the methods described in the above method embodiments.

[0175] This application also provides a computer-readable storage medium storing instructions that, when executed on a computer, cause the computer to perform the method in the method flow shown in the above method embodiments.

[0176] The computer-readable storage medium can be, for example, but not limited to, an electrical, magnetic, optical, electromagnetic, infrared, or semiconductor system, apparatus, or device, or any combination thereof. More specific examples of computer-readable storage media (a non-exhaustive list) include: an electrical connection having one or more wires, a portable computer disk, a hard disk, a random access memory, a read-only memory, an erasable programmable read-only memory, a register, a hard disk, an optical fiber, a portable compact disk read-only memory, an optical storage device, a magnetic storage device, or any suitable combination thereof, or any other form of computer-readable storage medium known in the art. An exemplary storage medium is coupled to a processor, enabling the processor to read information from and write information to the storage medium. Of course, the storage medium can also be a component of the processor. The processor and the storage medium can reside in an application-specific integrated circuit (ASIC). In embodiments of this application, the computer-readable storage medium can be any tangible medium containing or storing a program that can be used by or in conjunction with an instruction execution system, apparatus, or device.

[0177] Since the vehicle device health management device, computer-readable storage medium, and computer program product in the embodiments of this application can be applied to the above method, the technical effects that can be obtained can also be referred to the above method embodiments. The embodiments of this application will not be repeated here.

[0178] The above are merely specific embodiments of this application, but the scope of protection of this application is not limited thereto. Any changes or substitutions within the technical scope disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A method for health management of vehicle components, characterized in that, The vehicle component health management method includes: In response to a health management start command or a trigger signal with a fixed sampling period, stress parameters of at least one key component in the vehicle controller are acquired within a first sampling period; the stress parameters include at least temperature parameters and voltage parameters; the first sampling period is the sampling period corresponding to the health management start command or the trigger signal with the fixed sampling period. Based on the stress parameters within the first sampling period, the damage values ​​of the key device corresponding to different stress types within the first sampling period are determined; the stress type is used to characterize different failure modes that cause the key device to lose its lifespan; the failure modes include: continuous thermal aging, alternating thermal fatigue, and voltage-induced stress damage; the damage value is used to indicate the accumulated lifespan of the key device under the stress type within the first sampling period. Health management of the key components is performed based on the damage values ​​of the key components corresponding to different stress types within the first sampling period.

2. The vehicle component health management method according to claim 1, characterized in that, The health management of the key components based on the damage values ​​of different stress types corresponding to the key components within the first sampling period includes: Based on the damage values ​​of the key components under different stress types within the first sampling period, the cumulative damage values ​​corresponding to the different stress types are determined; the cumulative damage values ​​are used to indicate the proportion of the lifespan that the key components have consumed under the corresponding stress type. Based on the cumulative damage value corresponding to the stress type, the total cumulative damage of the critical device is determined; the total cumulative damage is used to indicate the proportion of the total lifespan that has been consumed under all stress types. Health management of the critical components is performed based on the total cumulative damage.

3. The vehicle component health management method according to claim 2, characterized in that, The method of determining the cumulative damage value corresponding to different stress types based on the damage values ​​of the key component within the first sampling period includes... The damage values ​​corresponding to different stress types in each sampling period are summed to obtain the cumulative damage value corresponding to the different stress types.

4. The vehicle component health management method according to claim 2, characterized in that, The determination of the total cumulative damage of the key component based on the cumulative damage value corresponding to the stress type includes: Determine the weight corresponding to the stress type; The total cumulative damage is obtained by weighting and summing the weights corresponding to the stress types and the cumulative damage values ​​corresponding to the stress types.

5. The vehicle component health management method according to claim 1, characterized in that, The health management of the critical device based on the total cumulative damage includes: The cumulative damage warning level is determined based on the total cumulative damage and the preset damage threshold; Based on the total cumulative damage, determine the remaining lifetime percentage of the critical components; Based on the remaining lifetime percentage and the rated total lifetime of the key components, the expected remaining lifetime is determined; Health reporting is performed based on the cumulative damage warning level and the expected remaining lifespan.

6. The vehicle component health management method according to any one of claims 1-5, characterized in that, The health management of the key component based on the damage values ​​of different stress types corresponding to the key component within the first sampling period also includes: The historical cumulative damage value is read as the initial value, which is the damage value accumulated by the critical device at the end of the previous sampling period.

7. The vehicle component health management method according to claim 1, characterized in that, The stress type includes at least two of thermal stress, temperature cycling stress, and electrical stress; determining the damage value of the key component for different stress types within the first sampling period based on the stress parameters within the first sampling period includes: When the stress type includes thermal stress, the temperature parameter is input into the thermal damage model, and the thermal damage increment within the first sampling period is output. When the stress type includes electrical stress, the voltage parameter is input into the electrical stress damage model, and the electrical damage increment within the first sampling period is output. When the stress type includes temperature cyclic stress, the temperature parameter is input into the temperature cyclic damage model, and the cyclic damage increment within the first sampling period is output.

8. The vehicle component health management method according to claim 1, characterized in that, The key component is at least one of a microcontroller, a power chip, a power MOSFET, or a connector.

9. A vehicle component health management device, characterized in that, The vehicle component health management device includes: The acquisition module is used to acquire stress parameters of at least one key component in the vehicle controller within a first sampling period in response to a health management start command or a trigger signal of a fixed sampling period; the stress parameters include at least temperature parameters and voltage parameters; the first sampling period is the sampling period corresponding to the health management start command or the trigger signal of the fixed sampling period. The processing module is used to determine the damage value of the key device for different stress types within the first sampling period based on the stress parameters within the first sampling period; the stress type is used to characterize different failure modes that cause the key device to lose its lifespan; the failure modes include: continuous thermal aging, alternating thermal fatigue, and voltage-induced stress damage; the damage value is used to indicate the accumulated lifespan of the key device under the stress type within the first sampling period. The management module is used to perform health management on the key components based on the damage values ​​of the key components corresponding to different stress types within the first sampling period.

10. A vehicle, characterized in that, The vehicle includes a controller, which performs vehicle component health management using the vehicle component health management method as described in any one of claims 1-8.