Circuit layer production file generation method, production control method, and related devices

Abstract

The application discloses a circuit layer production file generation method, a production control method and related devices, and relates to the technical field of circuit board manufacturing. The application determines an initial line contour based on an original graphic file, and determines an initial line contour with a width greater than a first preset threshold and a distance from an adjacent line contour greater than a second preset threshold as a target line contour. A die-cut line graphic file is constructed based on each target line contour, and a laser line graphic file is constructed based on the initial line contour excluding the target line contour. When the die-cut line graphic file and the laser line graphic file of the application are used for production, the lines in the die-cut line graphic file have sufficient width and distance, which can reduce production costs while meeting accuracy requirements, and the entire process does not use etching with chemical solution, so that pollution to copper foil during manufacturing can be reduced.

Description

Technical Field

[0001] This application relates to the field of circuit board manufacturing technology, and in particular to a method for generating circuit layer production documents, a production control method, and related apparatus. Background Technology

[0002] In the circuit board manufacturing process, it is necessary to form shapes identical to the pre-defined circuit patterns on copper foil. Currently, the industry typically uses chemical etching, die-cutting, or laser forming to form circuits on copper foil. However, chemical etching easily contaminates the copper foil, die-cutting cannot meet the requirements for forming fine circuits, and laser forming is costly. Therefore, there is an urgent need for a method that can manufacture fine circuits with less contamination and lower costs. Summary of the Invention

[0003] This application aims to address at least one of the technical problems existing in the prior art. To this end, this application proposes a method for generating circuit layer production files, a production control method, and related apparatus, which can automatically generate die-cut circuit graphic files and laser-cut circuit graphic files to instruct production equipment to perform die-cutting and laser-cutting processes on copper foil. This can reduce production costs and minimize contamination of the copper foil while meeting accuracy requirements.

[0004] The method for generating circuit layer production files according to a first aspect embodiment of this application includes: Obtain the original graphic file of the copper foil circuit to be processed; The original graphic file is vectorized and parsed to obtain a line vector graphic file; The initial line contour is extracted from the line vector graphics file to obtain multiple initial line contours; wherein each initial line contour corresponds to a continuous line segment. Calculate the width of each initial line profile, and determine candidate line profiles with a width greater than a first preset threshold from each initial line profile; A target line contour is determined from each of the candidate line contours; wherein the distance between the target line contour and any adjacent initial line contour is greater than a second preset threshold. Based on the outlines of each target line, a die-cut line graphic file is constructed; A laser path graphic file is constructed based on the initial path outline other than the target path outline.

[0005] The method for generating circuit layer production files according to embodiments of this application has at least the following beneficial effects: By acquiring the original graphic file of the copper foil circuit to be processed and performing vectorization analysis, a circuit vector graphic file is obtained. Then, multiple initial circuit contours are extracted from the circuit vector graphic file, each initial circuit contour corresponding to a continuous circuit segment. Based on this, the width of each initial circuit contour is calculated. Candidate circuit contours with widths greater than a first preset threshold are first determined from each initial circuit contour. Then, the spacing between the candidate circuit contour and any adjacent initial circuit contour is combined with whether it is greater than a second preset threshold for filtering. Initial circuit contours with widths greater than the first preset threshold and spacing with adjacent circuit contours greater than the second preset threshold are determined as target circuit contours. Die-cutting circuit graphic files are constructed based on each target circuit contour, and laser-cutting circuit graphic files are constructed based on the initial circuit contours other than the target circuit contours. This achieves automatic differentiation between copper foil circuits suitable for die-cutting processes and copper foil circuits suitable for laser-cutting processes based on circuit width and spacing between adjacent circuits. When using the die-cut circuit pattern file and laser circuit pattern file of this application for production, the lines in the die-cut circuit pattern file have sufficient width and spacing, which can avoid problems such as burrs, breakage, and peeling during the die-cutting process due to excessively thin lines or insufficient spacing. At the same time, the fine lines are processed by laser technology, which fully utilizes the precision advantage of laser technology and reduces the problems of low efficiency and high cost caused by using laser technology for wide lines. In this way, the production cost can be reduced while meeting the precision requirements. Moreover, no etching solution is used in the whole process, so the contamination of copper foil can be reduced.

[0006] According to some embodiments of this application, the calculation steps for the width of the initial line profile include: Extract the center trajectory line of the initial line profile; Multiple sampling points are determined on the central trajectory line according to a preset sampling interval; Draw the normal to the center trajectory line along the sampling point, and determine the two intersection points of the normal and the boundary of the initial line contour. The distance between the two intersection points is used as the candidate width corresponding to the sampling point. The candidate width corresponding to each sampling point is determined to be the smallest value as the target width, and the target width is used as the width of the initial line contour.

[0007] According to some embodiments of this application, determining the target route profile from the candidate route profiles includes: For each of the candidate line contours, a judgment processing step is performed sequentially; The judgment and processing steps include: Using the second preset threshold as the expansion radius, the current candidate line contour is expanded to obtain the expanded contour. If the expansion contour does not intersect with any reference contour, the current candidate line contour is determined as the target line contour; wherein, the reference contour is the initial line contour other than the current candidate line contour.

[0008] The second aspect of this application provides a production control method for a circuit layer, applied to a production equipment. The production equipment includes a die-cutting module, a first waste removal module, a laser module, and a second waste removal module. The die-cutting module includes an upper mold, which is disposed above a carrier film. The first waste removal module, the laser module, and the second waste removal module are sequentially disposed above the carrier film along the moving direction of the carrier film. include: The upper mold is controlled to perform die-cutting on the copper foil located on the carrier film to obtain the first circuit layer; wherein, the shape of the upper mold is set based on the die-cutting circuit graphic file; the die-cutting circuit graphic file is obtained by the method for generating circuit layer production files according to any one of claims 1 to 3; The first waste removal module is controlled to remove waste from the first circuit layer to obtain the second circuit layer; The laser module is controlled to perform laser processing on the second circuit layer based on the laser path pattern file to obtain the third circuit layer; wherein, the laser path pattern file is obtained by the method for generating circuit layer production files according to any one of claims 1 to 3; The second waste removal module is controlled to perform waste removal processing on the third circuit layer to obtain the target circuit layer.

[0009] According to some embodiments of this application, the first waste removal module includes a first driving component, an adhesive waste removal component, a first vacuum waste removal component, and a second driving component; the adhesive waste removal component and the first vacuum waste removal component are spaced apart along the moving direction of the carrier film; Controlling the first waste removal module to perform waste removal processing on the first circuit layer to obtain the second circuit layer includes: The first driving component is controlled to drive the adhesive waste removal component to adhesively remove waste from the first circuit layer; The second driving component is controlled to drive the first vacuum waste removal component to adsorb and remove waste on the first circuit layer after the waste removal process, thereby obtaining the second circuit layer.

[0010] According to some embodiments of this application, the adhesive tape removal assembly includes a take-up drive, a take-up shaft, an unwind shaft, and a pressure roller. The unwind shaft is used to release the adhesive tape, and the take-up shaft is used to wind up the adhesive tape. The unwind shaft is located below one side of the take-up shaft, and the pressure roller is located between the unwind shaft and the take-up shaft. The pressure roller is connected to the first drive assembly. The control of the first driving component to drive the pasting and waste removal component to paste and remove waste from the first circuit layer includes: The first drive assembly is controlled to drive the pressure roller to descend until the adhesive tape contacts the first circuit layer, and then the first drive assembly is controlled to drive the pressure roller to perform linear reciprocating motion along the length of the adhesive tape; The first drive assembly is controlled to drive the pressure roller to rise away from the adhesive tape, and the take-up drive is controlled to drive the take-up shaft to rotate.

[0011] According to some embodiments of this application, the first vacuum waste removal component includes a vacuum adsorption unit and a brush unit; the second driving component includes a vacuum driving unit and a brush driving unit, wherein the vacuum adsorption unit is connected to the vacuum driving unit and the brush driving unit is connected to the brush unit. The control of the second driving component to drive the first vacuum waste removal component to adsorb and remove waste on the first circuit layer after the waste removal process, thereby obtaining the second circuit layer, includes: The brush driving unit is controlled to drive the brush unit to sweep the first circuit layer on the carrier film. The vacuum driving unit is controlled to drive the vacuum adsorption unit to perform vacuum adsorption on the first circuit layer to obtain the second circuit layer.

[0012] A third aspect of this application provides an apparatus for generating circuit layer production documents, comprising: The acquisition unit is used to acquire the original graphic file of the copper foil circuit to be processed; The parsing unit is used to perform vectorization parsing on the original graphic file to obtain a line vector graphic file; An extraction unit is used to extract initial line contours from the line vector graphics file to obtain multiple initial line contours; wherein each initial line contour corresponds to a continuous line segment. The first determining unit is used to calculate the width of each of the initial line contours and determine candidate line contours whose width is greater than a first preset threshold from each of the initial line contours. The second determining unit is used to determine a target line contour from each of the candidate line contours; wherein the distance between the target line contour and any adjacent initial line contour is greater than a second preset threshold. The first construction unit is used to construct a die-cut circuit graphic file based on each of the target circuit outlines; The second construction unit is used to construct a laser path graphic file based on the initial path contour other than the target path contour.

[0013] A fourth aspect of this application provides an electronic device, including a memory and a processor. The memory stores a computer program, and the processor executes the computer program to implement the method for generating circuit layer production files as described in any of the first aspect embodiments, or the method for controlling the production of circuit layers as described in any of the second aspect embodiments.

[0014] A fifth aspect of this application provides a computer-readable storage medium storing a computer program that, when executed by a processor, implements the method for generating circuit layer production files as described in any of the first aspect embodiments, or the method for controlling the production of circuit layers as described in any of the second aspect embodiments.

[0015] Additional aspects and advantages of this application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of this application. Attached Figure Description

[0016] The present application will be further described below with reference to the accompanying drawings and embodiments, wherein: Figure 1 This is a flowchart illustrating the steps of a method for producing circuit layer production files according to an embodiment of this application. Figure 2 This is a schematic flowchart of the production control method for the circuit layer according to an embodiment of this application; Figure 3 This is a schematic diagram showing the module location distribution of the production equipment according to an embodiment of this application; Figure 4 This is a simplified structural diagram of the adhesive waste removal component according to an embodiment of this application; Figure 5 This is a simplified structural diagram of the first vacuum waste removal component according to an embodiment of this application; Figure 6 This is a schematic diagram of the structure of the circuit layer production file generation apparatus according to an embodiment of this application; Figure 7 This is a schematic diagram of the structure of an electronic device according to an embodiment of this application.

[0017] Reference numerals: carrier film 100; die-cutting module 200; first waste removal module 300; take-up shaft 310; unwind shaft 320; pressure roller 330; adhesive tape 340; brush drive unit 350; brush unit 360; vacuum drive unit 370; vacuum adsorption unit 380; laser module 400; second waste removal module 500. Detailed Implementation

[0018] The embodiments of this application are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application.

[0019] In the description of this application, it should be understood that the orientation descriptions, such as up, down, front, back, left, right, etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0020] In the description of this application, "several" means one or more, "multiple" means two or more, "greater than," "less than," and "exceeding" are understood to exclude the stated number, while "above," "below," and "within" are understood to include the stated number. The use of "first" and "second" in the description is merely for distinguishing technical features and should not be construed as indicating or implying relative importance, or implicitly indicating the number of indicated technical features, or implicitly indicating the order of the indicated technical features.

[0021] In the description of this application, unless otherwise expressly defined, terms such as "setup," "installation," and "connection" should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in this application in conjunction with the specific content of the technical solution.

[0022] In the description of this application, the terms "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0023] The first aspect of this application provides a method for generating circuit layer production files. This method can be deployed and executed on a terminal, on a server, or as software running on either the terminal or the server. In some embodiments, the terminal can be a smartphone, tablet, laptop, desktop computer, etc.; the server can be configured as an independent physical server, a server cluster or distributed system composed of multiple physical servers, or a cloud server providing basic cloud computing services such as cloud services, cloud databases, cloud computing, cloud functions, cloud storage, network services, cloud communication, middleware services, domain name services, security services, CDN, and big data and artificial intelligence platforms; the software can be an application implementing the method for generating circuit layer production files, but is not limited to the above forms.

[0024] This application can be used in a wide variety of general-purpose or special-purpose computer system environments or configurations. Examples include: personal computers, server computers, handheld or portable devices, tablet devices, multiprocessor systems, microprocessor-based systems, set-top boxes, programmable consumer electronics, network PCs, minicomputers, mainframe computers, and distributed computing environments including any of the above systems or devices. This application can be described in the general context of computer-executable instructions executed by a computer, such as program modules. Generally, program modules include routines, programs, objects, components, data structures, etc., that perform specific tasks or implement specific abstract data types. This application can also be practiced in distributed computing environments where tasks are performed by remote processing devices connected via a communication network. In distributed computing environments, program modules can reside in local and remote computer storage media, including storage devices.

[0025] Reference Figure 1 , Figure 1 This is a flowchart illustrating the steps of a method for producing circuit layer production files according to an embodiment of this application. Figure 1 The illustrated process steps include, but are not limited to, steps S110 to S170.

[0026] Step S110: Obtain the original graphic file of the copper foil circuit to be processed; It is worth noting that the method for producing circuit layer production files in this application embodiment can be applied to the host computer of the production equipment, and the host computer stores preset original graphic files of copper foil circuits. The original graphic files are used to describe the shape, position and size of the circuits. For example, the original graphic files can be Gerber format circuit design files; the original graphic files can also be bitmaps.

[0027] Step S120: Perform vectorization analysis on the original graphic file to obtain a line vector graphic file; It is worth noting that a line vector graphics file refers to a file containing copper foil line vector graphics data obtained after vectorization and parsing. The original graphic file is converted into a line vector graphics file in vector format. For example, if the original graphic file is a non-vector format such as a bitmap, a vectorization algorithm is used to convert pixel information into vector lines or outlines, thereby obtaining the line vector graphics file. It should be noted that this application does not describe the vectorization algorithm; those skilled in the art can select a vectorization algorithm from the existing technology based on the actual situation.

[0028] Step S130: Extract the initial line contour from the line vector graphic file to obtain multiple initial line contours; where each initial line contour corresponds to a continuous line segment. It is worth noting that those skilled in the art can use existing contour extraction methods to extract contours from line vector graphics files, thereby obtaining multiple initial line contours.

[0029] Step S140: Calculate the width of each initial line contour, and determine candidate line contours whose width is greater than the first preset threshold from each initial line contour. Step S150: Determine the target line contour from each candidate line contour; wherein the distance between the target line contour and any adjacent initial line contour is greater than a second preset threshold. It should be noted that the embodiments of this application do not specifically limit the first preset threshold and the second preset threshold. Those skilled in the art can set the first preset threshold and the second preset threshold according to actual needs. For example, the first preset threshold is 0.3 mm and the second preset threshold is 0.3 mm.

[0030] It is worth noting that in steps S140 and S150, during the calculation of the width or spacing, it is necessary to first calculate the pixel spacing in the graphic, and then multiply the pixel spacing by a preset conversion ratio to obtain the width or spacing. The preset conversion ratio is based on the original graphic file, and this application does not limit it. For example, if the resolution of the original graphic file is 1000 DPI, then 1 pixel is approximately equal to 25.4 / 1000 = 0.0254 mm, and the preset conversion ratio is 0.0254.

[0031] Step S160: Based on the contours of each target line, construct the die-cut line graphic file; It is worth noting that the die-cut circuit graphic file includes the outlines of each target circuit.

[0032] Step S170: Based on the initial line contour other than the target line contour, construct the laser line graphic file.

[0033] It is worth noting that the laser path drawing file includes all initial path contours except for the target path contour.

[0034] This embodiment of the application, through steps S110 to S170, obtains the original graphic file of the copper foil circuit to be processed and performs vectorization analysis to obtain a circuit vector graphic file. Then, multiple initial circuit contours are extracted from the circuit vector graphic file, each initial circuit contour corresponding to a continuous circuit segment. Based on this, the width of each initial circuit contour is calculated. Candidate circuit contours with widths greater than a first preset threshold are first determined from the initial circuit contours. Then, the spacing between the candidate circuit contour and any adjacent initial circuit contour is considered to be greater than a second preset threshold for further filtering. Initial circuit contours with widths greater than the first preset threshold and spacing between any adjacent circuit contour and the second preset threshold are determined as target circuit contours. A die-cutting circuit graphic file is constructed based on each target circuit contour, and a laser-etched circuit graphic file is constructed based on the initial circuit contours other than the target circuit contours. This achieves automatic differentiation between copper foil circuits suitable for die-cutting and copper foil circuits suitable for laser etching based on circuit width and spacing between adjacent circuits. When using the die-cut circuit pattern file and laser circuit pattern file of this application for production, the lines in the die-cut circuit pattern file have sufficient width and spacing to avoid problems such as burrs, breakage, and peeling during the die-cutting process due to excessively thin lines or insufficient spacing. At the same time, the fine lines are processed by laser technology, giving full play to the precision advantages of laser technology and reducing the problems of low efficiency and high cost caused by using laser technology for wide lines. In this way, the production cost can be reduced while meeting the precision requirements. Moreover, no etching solution is used in the entire process, thus reducing the contamination of copper foil.

[0035] It is worth noting that the die-cutting circuit pattern file is used to instruct the production equipment to die-cut the copper foil, while the laser-cutting circuit pattern file is used to instruct the production equipment to laser-cut the copper foil, so that the production equipment can produce the copper foil by both die-cutting and laser-cutting, forming conductive lines on the copper foil that are the same as those in the original pattern file, thus obtaining the circuit layer.

[0036] It is understood that in step S140, the width calculation step includes steps S141 to S144.

[0037] Step S141: Extract the center trajectory line of the initial line profile; It is worth noting that the center trajectory line is a virtual line located in the middle of the two boundaries of the line along the direction of the line's extension, used to represent the direction of that section of the line.

[0038] Step S142: Determine multiple sampling points on the center trajectory line according to the preset sampling interval; It is worth noting that multiple sampling points are determined along the central trajectory line according to sampling intervals. For example, a point is taken as a sampling point at regular arc lengths or straight-line distances. The purpose of the sampling points is to discretize and represent different positions on the central trajectory line so that the local width of the line can be calculated at these positions respectively.

[0039] Step S143: Draw the normal line of the center trajectory line along the sampling point, and determine the two intersection points of the normal line and the boundary of the initial line contour. The distance between the two intersection points is used as the candidate width corresponding to the sampling point. It is worth noting that for each sampling point, a normal to the center trajectory line is drawn at that point. This normal extends to both sides, intersecting the two boundaries of the initial line contour, resulting in two intersection points. The straight-line distance between these two intersection points represents the local width of the line at the sampling point, denoted as the candidate width. Since the normal direction is perpendicular to the line's extension direction, this distance accurately reflects the line's thickness at that location. A normal is a straight line passing through a point on the center trajectory line and perpendicular to the tangent at that point.

[0040] It should be noted that the candidate width refers to the value converted to physical width, for example, the unit of the candidate width is millimeters.

[0041] Step S144: Determine the smallest value among the candidate widths corresponding to each sampling point as the target width, and use the target width as the width of the initial line contour.

[0042] It is worth noting that steps S141 to S144 need to be executed separately for each initial line contour to calculate the width of each initial line contour. In this embodiment, steps S141 to S144 extract the center trajectory line of the initial line contour and calculate local candidate widths along the normal at multiple sampling points. The minimum candidate width is used as the width of the initial line contour, accurately reflecting the actual thickness of the initial line contour. Subsequent steps compare the minimum candidate width with a first preset threshold, preventing incorrectly including lines with narrow points or unsuitable for die-cutting in the die-cutting line graphic file, thus improving the reliability of the separation between die-cutting and laser processes.

[0043] It is understood that in step S150, determining the target route profile from the candidate route profiles includes: For each candidate route profile, the judgment and processing steps are performed sequentially.

[0044] The judgment and processing steps include steps S151 to S152.

[0045] Step S151: Use the second preset threshold as the expansion radius to expand the current candidate line contour to obtain the expanded contour. It is worth noting that, based on the current candidate line contour, it is expanded outward by a distance equal to the second preset threshold, forming a closed region larger than the original contour, i.e., an expanded contour. The expansion process can be understood as the new contour obtained by shifting the contour boundary outward by the second preset threshold.

[0046] Step S152: If the expansion contour does not intersect with any reference contour, the current candidate line contour is determined as the target line contour; wherein, the reference contour is the initial line contour other than the current candidate line contour.

[0047] It is worth noting that if the expansion contour does not intersect with any reference contour, it means that the actual distance between each reference contour and the current candidate line contour is greater than the second preset threshold.

[0048] In this embodiment, steps S151 to S152 eliminate the need to calculate the minimum distance between the current candidate line contour and each adjacent initial line contour one by one. Only one expansion operation and intersection detection are required to complete the judgment. When there are many lines and the graphics are complex, the calculation process is significantly simplified and the processing efficiency is improved. It can quickly determine whether the current candidate line contour is determined to be the target line contour.

[0049] A second aspect of this application provides a method for production control of a circuit layer. (Refer to...) Figure 2 , Figure 2 This is a schematic flowchart of a circuit layer production control method according to an embodiment of this application. The circuit layer production control method of this application is applied to production equipment. (Refer to...) Figure 3 , Figure 3 This is a schematic diagram showing the module layout of the production equipment according to an embodiment of this application. The production equipment includes a die-cutting module 200, a first waste removal module 300, a laser module 400, and a second waste removal module 500. The die-cutting module 200 includes an upper mold (not shown in the figure), which is positioned above the carrier film 100. The first waste removal module 300, the laser module 400, and the second waste removal module 500 are sequentially positioned above the carrier film 100 along the moving direction of the carrier film 100. The die-cutting module 200 also includes a lower mold (not shown in the figure), whose shape matches that of the upper mold. During die-cutting, the copper foil is located between the upper mold and the lower mold. The shape used for forming in the upper mold is set based on the die-cutting circuit pattern file. For example, the shape of the side of the upper mold facing the lower mold is complementary to the shape represented in the die-cutting circuit pattern file. Therefore, when the copper foil on the carrier film 100 is die-cut using the upper mold and the lower mold, a line with the same shape as represented in the die-cutting circuit pattern file can be formed on the copper foil.

[0050] Figure 2 The illustrated process steps include, but are not limited to, steps S210 to S240.

[0051] Step S210: Control the upper mold to perform die-cutting on the copper foil located on the carrier film 100 to obtain the first circuit layer; wherein, the shape of the upper mold is set based on the die-cutting circuit graphic file; the die-cutting circuit graphic file is obtained by the method for generating circuit layer production files of any one of the first aspect embodiments; Step S220: Control the first waste removal module 300 to perform waste removal processing on the first circuit layer to obtain the second circuit layer; Step S230: Based on the laser path pattern file, control the laser module 400 to perform laser processing on the second circuit layer to obtain the third circuit layer; wherein, the laser path pattern file is obtained by the method for generating circuit layer production files according to any one of the first aspect embodiments; It is worth noting that this application does not specifically limit the laser module 400, and those skilled in the art can select the laser module 400 from the prior art according to the actual situation. The laser module 400 is used to perform laser processing on the second circuit layer to form a circuit on the second circuit layer that is complementary to the pattern represented by the laser circuit pattern file.

[0052] Step S240: Control the second waste removal module 500 to perform waste removal processing on the third circuit layer to obtain the target circuit layer.

[0053] This embodiment of the application achieves continuous collaborative processing of die-cutting and laser engraving on the same production line through steps S210 to S240. During processing, the upper mold is first controlled to die-cut the copper foil on the carrier film 100 according to the die-cutting circuit pattern file to obtain the first circuit layer. Then, the first waste removal module 300 is controlled to remove waste to obtain the second circuit layer. Next, based on the laser circuit pattern file, the laser module 400 is controlled to laser-process the second circuit layer to obtain the third circuit layer. Finally, the second waste removal module 500 is controlled to remove waste to obtain the target circuit layer. This method allows for efficient processing of wider, sufficiently spaced circuits using die-cutting, while finer, more densely spaced circuits are processed with high precision using laser engraving. The two processes are sequential and do not interfere with each other. Compared to production methods that solely use die-cutting or solely use laser engraving, this embodiment of the application combines die-cutting and laser engraving processes, avoiding the efficiency reduction and cost increase caused by using laser engraving for wide circuits, and avoiding problems such as burrs, breakage, and dimensional deviations caused by die-cutting for finer circuits. This improves the overall production efficiency and yield of circuit layers and reduces production costs. It can meet the accuracy requirements while reducing production costs and minimizing contamination of the copper foil.

[0054] It should be noted that the die-cutting module 200 may also include a structure for driving the upper mold to move. This application does not limit this, and the structure in the prior art can be directly adopted.

[0055] It is understood that the first waste removal module 300 includes a first driving component, an adhesive waste removal component, a first vacuum waste removal component, and a second driving component; the adhesive waste removal component and the first vacuum waste removal component are spaced apart along the moving direction of the carrier film 100; Step S220 may include steps S221 and S222.

[0056] Step S221: Control the first driving component to drive the pasting and waste removal component to paste and remove waste from the first circuit layer; Step S222: Control the second driving component to drive the first vacuum waste removal component to adsorb and remove waste on the first circuit layer after the waste removal is pasted, and obtain the second circuit layer.

[0057] It is worth noting that since the graphics in the die-cut circuit graphic file are composed of multiple independent target circuit outlines, the waste generated after die-cutting may not be continuous, making waste removal difficult. Therefore, in this embodiment, the waste removal of the first circuit layer is achieved by pasting the first circuit layer in step S221 and then adsorbing the first circuit layer in step S222. This achieves two waste removals of the first circuit layer. First, the waste removal of larger areas is achieved by pasting the waste layer, and then the waste removal of smaller areas is achieved by adsorbing the waste layer, which can improve the waste removal effect.

[0058] Understandably, referring to Figure 4 , Figure 4 This is a simplified structural diagram of the adhesive tape removal assembly according to an embodiment of this application. The adhesive tape removal assembly includes a take-up drive, a take-up shaft 310, an unwind shaft 320, and a pressure roller 330. The unwind shaft 320 is used to release the adhesive tape 340, and the take-up shaft 310 is used to wind up the adhesive tape 340. The unwind shaft 320 is located below one side of the take-up shaft 310, and the pressure roller 330 is located between the unwind shaft 320 and the take-up shaft 310. The pressure roller 330 is connected to the first drive assembly.

[0059] It is worth noting that the collecting drive is a rotary motor, which can drive the take-up shaft 310 to rotate, so that the take-up shaft 310 can take up the adhesive tape 340. The first drive assembly can be a robotic arm in the prior art that can drive the pressure roller 330 to move in multiple directions. This application does not limit the specific structure of the first drive assembly, and a robotic arm in the prior art can be used. In some embodiments, the unwind shaft 320 is also connected to an unwind drive motor, which is used to drive the unwind shaft 320 to rotate, so as to release the adhesive tape 340 wound on the unwind shaft 320.

[0060] Step S221 may include steps S310 and S320.

[0061] Step S310: Control the first drive assembly to drive the pressure roller 330 to descend until the adhesive tape 340 contacts the first circuit layer, and then control the first drive assembly to drive the pressure roller 330 to perform linear reciprocating motion along the length of the adhesive tape 340. In step S320, the first drive assembly is controlled to drive the pressure roller 330 to rise away from the adhesive tape 340, and the winding drive is controlled to drive the winding shaft 310 to rotate.

[0062] In this embodiment, through steps S310 to S320, since the take-up shaft 310 and the unwind shaft 320 are spaced apart above the carrier film 100, the adhesive tape 340 is positioned directly above the carrier film 100. The first drive assembly drives the pressure roller 330 to descend until the adhesive tape 340 contacts the first circuit layer. Then, the first drive assembly drives the pressure roller 330 to reciprocate linearly along the length of the adhesive tape 340, so that the adhesive tape 340 can fully contact the copper foil on the carrier film 100, thereby adhering waste material from the copper foil. After adhering, the first drive assembly drives the pressure roller 330 to rise away from the adhesive tape 340, and the take-up drive unit drives the take-up shaft 310 to rotate, so as to rewind the used adhesive tape 340.

[0063] Understandably, referring to Figure 5 , Figure 5 This is a simplified structural diagram of the first vacuum waste removal component according to an embodiment of this application.

[0064] The first vacuum waste removal assembly includes a vacuum adsorption unit 380 and a brush unit 360; the second driving assembly includes a vacuum driving unit 370 and a brush driving unit 350, with the vacuum adsorption unit 380 connected to the vacuum driving unit 370 and the brush driving unit 350 connected to the brush unit 360; the vacuum driving unit 370 and the brush driving unit 350 can be robotic arms as used in the prior art, used to drive the vacuum driving unit 370 and the brush driving unit 350 to move in multiple directions respectively. The vacuum adsorption unit 380 can be a vacuum nozzle.

[0065] Step S222 may include steps S410 and S420.

[0066] Step S410: Control the brush drive unit 350 to drive the brush unit 360 to sweep the first circuit layer on the carrier film 100. In step S420, the vacuum drive unit 370 is controlled to drive the vacuum adsorption unit 380 to perform vacuum adsorption on the first circuit layer to obtain the second circuit layer.

[0067] In this embodiment, through steps S410 to S420, the brush driving unit 350 first drives the brush unit 360 to sweep the first circuit layer on the carrier film 100. The mechanical brushing action loosens or removes small waste materials and debris still attached to the copper foil surface or circuit edges after the waste removal process. Then, the vacuum driving unit 370 drives the vacuum adsorption unit 380 to perform vacuum adsorption on the first circuit layer, reliably removing the loosened waste materials. The sequential combination of brush sweeping and vacuum adsorption effectively removes stubborn residues that are difficult to remove by vacuum adsorption alone, improving the cleanliness of the waste removal process.

[0068] In some embodiments, the production equipment further includes a second vacuum waste removal component and a third drive component. The second vacuum waste removal component has the same structure as the first vacuum waste removal component, and the third drive component has the same structure as the second drive component. The third drive component and the second vacuum waste removal component are used to perform the waste removal process in step S240.

[0069] A third aspect of this application provides an apparatus for generating circuit layer production files. (Refer to...) Figure 6 , Figure 6 This is a schematic diagram of the structure of a circuit layer production file generation apparatus according to an embodiment of this application. The generation apparatus includes: The acquisition unit 610 is used to acquire the original graphic file of the copper foil circuit to be processed; The parsing unit 620 is used to perform vectorization parsing on the original graphic file to obtain a line vector graphic file; Extraction unit 630 is used to extract initial line contours from line vector graphics files to obtain multiple initial line contours; wherein each initial line contour corresponds to a continuous line segment. The first determining unit 640 is used to calculate the width of each initial line contour and determine candidate line contours with a width greater than a first preset threshold from each initial line contour. The second determining unit 650 is used to determine the target line contour from each candidate line contour; wherein the distance between the target line contour and any adjacent initial line contour is greater than a second preset threshold. The first building unit 660 is used to build a die-cut circuit graphic file based on the outlines of each target circuit. The second building unit 670 is used to build a laser path graphic file based on the initial path outline other than the target path outline.

[0070] The circuit layer production file generation apparatus of this application embodiment is used to execute the circuit layer production file generation method of the first aspect embodiment. When executing the method, the original graphic file of the copper foil circuit to be processed is acquired and vectorized to obtain a circuit vector graphic file. Multiple initial circuit contours are then extracted from the circuit vector graphic file, each initial circuit contour corresponding to a continuous circuit segment. Based on this, the width of each initial circuit contour is calculated. Candidate circuit contours with widths greater than a first preset threshold are first determined from the initial circuit contours. Then, the spacing between the candidate circuit contours and any adjacent initial circuit contour is considered to be greater than a second preset threshold for filtering. Initial circuit contours with widths greater than the first preset threshold and spacing between adjacent circuit contours greater than the second preset threshold are determined as target circuit contours. Die-cutting circuit graphic files are constructed based on each target circuit contour, and laser-etched circuit graphic files are constructed based on the initial circuit contours other than the target circuit contours. This achieves automatic differentiation between copper foil circuits suitable for die-cutting and copper foil circuits suitable for laser etching based on circuit width and spacing between adjacent circuits. When using the die-cut circuit pattern file and laser circuit pattern file of this application for production, the lines in the die-cut circuit pattern file have sufficient width and spacing to avoid problems such as burrs, breakage, and peeling during the die-cutting process due to excessively thin lines or insufficient spacing. At the same time, the fine lines are processed by laser technology, giving full play to the precision advantages of laser technology and reducing the problems of low efficiency and high cost caused by using laser technology for wide lines. In this way, the production cost can be reduced while meeting the precision requirements. Moreover, no etching solution is used in the entire process, thus reducing the contamination of copper foil.

[0071] It should be noted that the specific implementation of the circuit layer production document generation apparatus is basically the same as the specific embodiment of the circuit layer production document generation method described above, and will not be repeated here. Provided that the requirements of the embodiments of this application are met, the circuit layer production document generation apparatus may also be provided with other functional units to implement the circuit layer production document generation method in the above embodiments.

[0072] A fourth aspect of this application provides an electronic device, which includes a memory and a processor. The memory stores a computer program, and the processor executes the computer program to implement the method for generating circuit layer production files according to any one of the first aspects of the embodiment, or the circuit layer production control method according to the second aspect of the embodiment. This electronic device can be any smart terminal, including tablet computers, in-vehicle computers, etc.

[0073] Reference Figure 7 , Figure 7 This is a schematic diagram of the structure of an electronic device according to one embodiment. The electronic device includes: The processor 4001 can be implemented using a general-purpose CPU (Central Processing Unit), microprocessor, application-specific integrated circuit (ASIC), or one or more integrated circuits, and is used to execute relevant programs to implement the technical solutions provided in the embodiments of this application. The memory 4002 can be implemented as a read-only memory (ROM), static storage device, dynamic storage device, or random access memory (RAM). The memory 4002 can store the operating system and other application programs. When the technical solutions provided in the embodiments of this specification are implemented through software or firmware, the relevant program code is stored in the memory 4002, and the processor 4001 calls and executes the circuit layer production file generation method or the circuit layer production control method of the embodiments of this application. The 4003 input / output interface is used to implement information input and output. The communication interface 4004 is used to enable communication and interaction between this device and other devices. Communication can be achieved through wired means (such as USB, Ethernet cable, etc.) or wireless means (such as mobile network, WIFI, Bluetooth, etc.). Bus 4005 transmits information between various components of the device (e.g., processor 4001, memory 4002, input / output interface 4003, and communication interface 4004); The processor 4001, memory 4002, input / output interface 4003 and communication interface 4004 are connected to each other within the device via bus 4005.

[0074] According to a fifth aspect of this application, a computer-readable storage medium stores a computer program that, when executed by a processor, implements the method for generating circuit layer production files according to any one of the first aspect embodiments, or the method for controlling the production of circuit layers according to the second aspect embodiment.

[0075] Memory, as a non-transitory computer-readable storage medium, can be used to store non-transitory software programs and non-transitory computer-executable programs. Furthermore, memory may include high-speed random access memory, and may also include non-transitory memory, such as at least one disk storage device, flash memory device, or other non-transitory solid-state storage device. In some embodiments, memory may optionally include memory remotely located relative to the processor, and these remote memories can be connected to the processor via a network. Examples of such networks include, but are not limited to, the Internet, intranets, local area networks, mobile communication networks, and combinations thereof.

[0076] The embodiments described in this application are for the purpose of more clearly illustrating the technical solutions of the embodiments of this application, and do not constitute a limitation on the technical solutions provided by the embodiments of this application. As those skilled in the art will know, with the evolution of technology and the emergence of new application scenarios, the technical solutions provided by the embodiments of this application are also applicable to similar technical problems.

[0077] Those skilled in the art will understand that the technical solutions shown in the figures do not constitute a limitation on the embodiments of this application, and may include more or fewer steps than shown, or combine certain steps, or different steps.

[0078] The device embodiments described above are merely illustrative. The units described as separate components may or may not be physically separate; that is, they may be located in one place or distributed across multiple network units. Some or all of the modules can be selected to achieve the purpose of this embodiment according to actual needs.

[0079] Those skilled in the art will understand that all or some of the steps in the methods disclosed above, as well as the functional modules / units in the systems and devices, can be implemented as software, firmware, hardware, or suitable combinations thereof.

[0080] The terms “first,” “second,” “third,” “fourth,” etc. (if present) in the specification and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of this application described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms “comprising” and “having,” and any variations thereof, are intended to cover non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0081] It should be understood that in this application, "at least one (item)" means one or more, and "more than one" means two or more. "And / or" is used to describe the mapping relationship between the mapped objects, indicating that three relationships can exist. For example, "A and / or B" can represent three cases: only A exists, only B exists, and both A and B exist simultaneously, where A and B can be singular or plural. The character " / " generally indicates that the preceding and following mapped objects are in an "or" relationship. "At least one (item) of the following" or similar expressions refer to any combination of these items, including any combination of single or plural items. For example, at least one (item) of a, b, or c can represent: a, b, c, "a and b", "a and c", "b and c", or "a and b and c", where a, b, and c can be single or multiple.

[0082] In the embodiments provided in this application, it should be understood that the disclosed systems and methods can be implemented in other ways. For example, the system embodiments described above are merely illustrative; for instance, the division of the units described above is only a logical functional division, and in actual implementation, there may be other division methods. For example, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed. Furthermore, the coupling or direct coupling or communication connection shown or discussed may be an indirect coupling or communication connection through some interfaces, devices, or units, and may be electrical, mechanical, or other forms.

[0083] The units described above as separate components may or may not be physically separate. The components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the units can be selected to achieve the purpose of this embodiment according to actual needs.

[0084] Furthermore, the functional units in the various embodiments of this application can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit. The integrated unit can be implemented in hardware or as a software functional unit.

[0085] If the integrated unit is implemented as a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of this application, in essence, or the part that contributes to the prior art, or all or part of the technical solution, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes multiple instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) to execute all or part of the steps of the methods of the various embodiments of this application. The aforementioned storage medium includes various media capable of storing programs, such as USB flash drives, portable hard drives, read-only memory (ROM), random access memory (RAM), magnetic disks, or optical disks.

[0086] The preferred embodiments of the present application have been described above with reference to the accompanying drawings, but this does not limit the scope of the claims of the present application. Any modifications, equivalent substitutions, and improvements made by those skilled in the art without departing from the scope and substance of the embodiments of the present application shall be within the scope of the claims of the present application.

Claims

1. A method for generating circuit layer production files, characterized in that, include: Obtain the original graphic file of the copper foil circuit to be processed; The original graphic file is vectorized and parsed to obtain a line vector graphic file; The initial line contour is extracted from the line vector graphics file to obtain multiple initial line contours; wherein each initial line contour corresponds to a continuous line segment. Calculate the width of each initial line profile, and determine candidate line profiles with a width greater than a first preset threshold from each initial line profile; A target line contour is determined from each of the candidate line contours; wherein the distance between the target line contour and any adjacent initial line contour is greater than a second preset threshold. Based on the outlines of each target line, a die-cut line graphic file is constructed; A laser path graphic file is constructed based on the initial path outline other than the target path outline.

2. The method for generating circuit layer production files according to claim 1, characterized in that, The steps for calculating the width of the initial line profile include: Extract the center trajectory line of the initial line profile; Multiple sampling points are determined on the central trajectory line according to a preset sampling interval; Draw the normal to the center trajectory line along the sampling point, and determine the two intersection points of the normal and the boundary of the initial line contour. The distance between the two intersection points is used as the candidate width corresponding to the sampling point. The candidate width corresponding to each sampling point is determined to be the smallest value as the target width, and the target width is used as the width of the initial line contour.

3. The method for generating circuit layer production files according to claim 1, characterized in that, Determining the target route profile from each of the candidate route profiles includes: For each of the candidate line contours, a judgment processing step is performed sequentially; The judgment and processing steps include: Using the second preset threshold as the expansion radius, the current candidate line contour is expanded to obtain the expanded contour. If the expansion contour does not intersect with any reference contour, the current candidate line contour is determined as the target line contour; wherein, the reference contour is the initial line contour other than the current candidate line contour.

4. A production control method for a circuit layer, characterized in that, It is applied to production equipment, which includes a die-cutting module, a first waste removal module, a laser module, and a second waste removal module. The die-cutting module includes an upper mold, which is located above the carrier film. The first waste removal module, the laser module, and the second waste removal module are sequentially arranged above the carrier film along the moving direction of the carrier film. include: The upper mold is controlled to perform die-cutting on the copper foil located on the carrier film to obtain the first circuit layer; wherein, the shape of the upper mold is set based on the die-cutting circuit graphic file; the die-cutting circuit graphic file is obtained by the method for generating circuit layer production files according to any one of claims 1 to 3; The first waste removal module is controlled to remove waste from the first circuit layer to obtain the second circuit layer; The laser module is controlled to perform laser processing on the second circuit layer based on the laser path pattern file to obtain the third circuit layer; wherein, the laser path pattern file is obtained by the method for generating circuit layer production files according to any one of claims 1 to 3; The second waste removal module is controlled to perform waste removal processing on the third circuit layer to obtain the target circuit layer.

5. The production control method for circuit layers according to claim 4, characterized in that, The first waste removal module includes a first driving component, an adhesive waste removal component, a first vacuum waste removal component, and a second driving component; the adhesive waste removal component and the first vacuum waste removal component are spaced apart along the moving direction of the carrier film; Controlling the first waste removal module to perform waste removal processing on the first circuit layer to obtain the second circuit layer includes: The first driving component is controlled to drive the adhesive waste removal component to adhesively remove waste from the first circuit layer; The second driving component is controlled to drive the first vacuum waste removal component to adsorb and remove waste on the first circuit layer after the waste removal process, thereby obtaining the second circuit layer.

6. The production control method for circuit layers according to claim 5, characterized in that, The adhesive tape removal assembly includes a take-up drive, a take-up shaft, an unwind shaft, and a pressure roller. The unwind shaft is used to release the adhesive tape, and the take-up shaft is used to wind up the adhesive tape. The unwind shaft is located below one side of the take-up shaft, and the pressure roller is located between the unwind shaft and the take-up shaft. The pressure roller is connected to the first drive assembly. The control of the first driving component to drive the pasting and waste removal component to paste and remove waste from the first circuit layer includes: The first drive assembly is controlled to drive the pressure roller to descend until the adhesive tape contacts the first circuit layer, and then the first drive assembly is controlled to drive the pressure roller to perform linear reciprocating motion along the length of the adhesive tape; The first drive assembly is controlled to drive the pressure roller to rise away from the adhesive tape, and the take-up drive is controlled to drive the take-up shaft to rotate.

7. The production control method for circuit layers according to claim 5, characterized in that, The first vacuum waste removal component includes a vacuum adsorption unit and a brush unit; the second driving component includes a vacuum driving unit and a brush driving unit, wherein the vacuum adsorption unit is connected to the vacuum driving unit and the brush driving unit is connected to the brush unit. The control of the second driving component to drive the first vacuum waste removal component to adsorb and remove waste on the first circuit layer after the waste removal process, thereby obtaining the second circuit layer, includes: The brush driving unit is controlled to drive the brush unit to sweep the first circuit layer on the carrier film. The vacuum driving unit is controlled to drive the vacuum adsorption unit to perform vacuum adsorption on the first circuit layer to obtain the second circuit layer.

8. A device for generating circuit layer production documents, characterized in that, include: The acquisition unit is used to acquire the original graphic file of the copper foil circuit to be processed; The parsing unit is used to perform vectorization parsing on the original graphic file to obtain a line vector graphic file; An extraction unit is used to extract initial line contours from the line vector graphics file to obtain multiple initial line contours; wherein each initial line contour corresponds to a continuous line segment. The first determining unit is used to calculate the width of each of the initial line contours and determine candidate line contours whose width is greater than a first preset threshold from each of the initial line contours. The second determining unit is used to determine a target line contour from each of the candidate line contours; wherein the distance between the target line contour and any adjacent initial line contour is greater than a second preset threshold. The first construction unit is used to construct a die-cut circuit graphic file based on each of the target circuit outlines; The second construction unit is used to construct a laser path graphic file based on the initial path contour other than the target path contour.

9. An electronic device, characterized in that, It includes a memory and a processor, the memory storing a computer program, and the processor executing the computer program to implement the method for generating circuit layer production files according to any one of claims 1 to 3, or the method for controlling the production of circuit layers according to any one of claims 4 to 7.

10. A computer-readable storage medium storing a computer program, characterized in that, When the computer program is executed by the processor, it implements the method for generating circuit layer production files according to any one of claims 1 to 3, or the method for controlling the production of circuit layers according to any one of claims 4 to 7.

Images