Display module and display device
Patent Information
- Application Number
- CN202510530078.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-04-25
- Publication Date
- 2026-10-27
AI Technical Summary
[0003]但目前的OLED显示产品的使用性能有待提升
[0022]根据本申请实施例的显示面模组,显示模组包括显示面板、第一支撑膜、第二支撑膜、导电胶层和屏蔽保护层。设置第一支撑膜和第二支撑膜,可以使第一屏体和第二屏体得到平整膜层的支撑,提高屏体结构的稳定性。通过导电胶层连接第一支撑膜和第二支撑膜,并与屏蔽保护层电连接,连接至第一屏体背面,形成低阻抗静电泄放路径,可以有效传导显示面板第一屏体和第二屏体的电荷,避免电荷在屏体背沟道大量累积,可实现屏体背沟道静电的快速释放,从而降低电荷侵入显示面板背沟道导致薄膜晶体管阈值电压正偏导致屏体发绿的风险,提高显示模组的使用性能和可靠性。
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Figure CN122991015A_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of displays, specifically to a display module and a display device. Background Technology
[0002] Organic light-emitting diodes (OLEDs) and flat panel displays based on light-emitting diodes (LEDs) are widely used in various consumer electronics products such as mobile phones, televisions, laptops, and desktop computers due to their advantages such as high image quality, energy saving, thin body, and wide range of applications, becoming the mainstream of display devices.
[0003] However, the performance of current OLED display products needs to be improved. Summary of the Invention
[0004] This application provides a display module and a display device, which aim to improve the performance of OLED display products.
[0005] A first aspect of this application provides a display module having a bent area and a non-bent area located on one side of the bent area. The display module further includes a display panel, a first support film, a second support film, a conductive adhesive layer, and a shielding protective layer. The display panel includes a first screen body, a bent portion, and a second screen body. The first and second screen bodies are located in the non-bent area, and the bent portion is located in the bent area. The first and second screen bodies are disposed opposite to each other in a first direction. At least a portion of the bent portion is bent and connected between the first and second screen bodies. The first support film is located on the side of the first screen body facing the second screen body and extends along a second direction, where the first and second directions intersect. The second support film is disposed opposite to the first support film and is located on the side of the second screen body facing the first screen body. At least a portion of the conductive adhesive layer is located between the first and second support films, and both the first and second support films are connected to the conductive adhesive layer. The shielding protective layer is located on the side of the second screen body away from the first screen body, and the conductive adhesive layer is electrically connected to the shielding protective layer.
[0006] According to an embodiment of the first aspect of this application, the display module further includes a flexible circuit board assembly connected between the conductive adhesive layer and the shielding protective layer.
[0007] According to any of the foregoing embodiments of the first aspect of this application, the flexible circuit board assembly is connected to the side of the second screen body away from the first screen body, and the flexible circuit board assembly extends along the second direction.
[0008] According to any of the foregoing embodiments of the first aspect of this application, the display module further includes a driver chip, which is located between the second screen and the shielding protective layer, and the flexible circuit board assembly provides electrical signals to the display panel through the driver chip.
[0009] According to any of the foregoing embodiments of the first aspect of this application, the flexible circuit board assembly has a first copper leakage window structure electrically connected to the conductive adhesive layer on the side facing the first screen.
[0010] According to any of the foregoing embodiments of the first aspect of this application, the conductive adhesive layer includes a main body portion and a protrusion portion connected to each other. The protrusion portion protrudes from the main body portion in a direction away from the first screen body, and the protrusion portion is electrically connected to the flexible circuit board assembly through a first copper-leaking window structure.
[0011] According to any of the foregoing embodiments of the first aspect of this application, the projection of the protrusion along the first direction is located within the projection of the first copper-leaking window structure along the first direction.
[0012] According to any of the foregoing embodiments of the first aspect of this application, the display module further includes a composite film layer located on the side of the first support film away from the first screen body. The composite film layer includes a buffer layer and a metal heat dissipation layer stacked along the side away from the first support film layer. The flexible circuit board assembly is provided with a second copper leakage window structure electrically connected to the metal heat dissipation layer on the side facing the first screen body.
[0013] According to any of the foregoing embodiments of the first aspect of this application, the composite film layer further includes an adhesive layer located between the first support film and the buffer layer.
[0014] According to any of the foregoing embodiments of the first aspect of this application, at least a portion of the conductive adhesive layer is located on the side of the composite film layer facing the bending region.
[0015] According to any of the foregoing embodiments of the first aspect of this application, a conductive adhesive layer is disposed around the periphery of the composite film layer.
[0016] According to any of the foregoing embodiments of the first aspect of this application, the shielding protection layer includes a conductive composite layer, which covers the side of the flexible circuit board assembly away from the first screen body, and extends along the second direction and covers the side of the metal heat dissipation layer away from the buffer layer.
[0017] According to any of the foregoing embodiments of the first aspect of this application, the shielding protective layer includes a conductive composite layer, and the flexible circuit board assembly has a third copper leakage window structure electrically connected to the conductive composite layer on the side opposite to the first screen body.
[0018] According to any of the foregoing embodiments of the first aspect of this application, the conductive composite layer includes a conductive adhesive and / or a shielding metal layer.
[0019] According to any of the foregoing embodiments of the first aspect of this application, the display module further includes a cover plate disposed on the side of the first screen body away from the second screen body.
[0020] According to any of the foregoing embodiments of the first aspect of this application, a polarizer and an optically transparent adhesive are further provided between the cover plate and the first screen body, with the optically transparent adhesive located between the polarizer and the cover plate.
[0021] An embodiment of the second aspect of this application provides a display device that includes a display panel of any of the above embodiments.
[0022] According to the embodiment of this application, the display module includes a display panel, a first support film, a second support film, a conductive adhesive layer, and a shielding protective layer. The first and second support films provide support for the first and second screen bodies with a flat film layer, improving the stability of the screen structure. The conductive adhesive layer connects the first and second support films and electrically connects them to the shielding protective layer, connecting to the back of the first screen body to form a low-impedance electrostatic discharge path. This effectively conducts the charge on the first and second screen bodies of the display panel, preventing a large accumulation of charge in the back channel of the screen body. This allows for rapid release of static electricity from the back channel, reducing the risk of charge intrusion into the back channel of the display panel causing forward bias of the thin-film transistor threshold voltage, leading to a green tint on the screen, and improving the performance and reliability of the display module. Attached Figure Description
[0023] Other features, objects, and advantages of this application will become more apparent from the following detailed description of non-limiting embodiments with reference to the accompanying drawings, in which the same or similar reference numerals denote the same or similar features, and the drawings are not drawn to scale.
[0024] Figure 1 This is one of the partial cross-sectional structural schematic diagrams of a display panel provided in the embodiments of this application;
[0025] Figure 2 This is a second partial cross-sectional structural schematic diagram of a display panel provided in an embodiment of this application;
[0026] Figure 3 This is one of the top view structural schematic diagrams of a display panel provided in the embodiments of this application;
[0027] Figure 4 This is a second top view structural diagram of a display panel provided in an embodiment of this application.
[0028] Explanation of reference numerals in the attached figures:
[0029] AA, non-bending area; aa, bending area;
[0030] 1. Display panel; 11. First screen; 12. Second screen; 13. Bending section;
[0031] 21. First supporting membrane; 22. Second supporting membrane;
[0032] 3. Conductive adhesive layer; 31. Main body; 32. Protrusion;
[0033] 4. Shielding protective layer; 40. Conductive composite layer;
[0034] 5. Flexible circuit board assembly; 51. First copper-exposed window structure; 52. Second copper-exposed window structure; 53. Third copper-exposed window structure;
[0035] 6. Composite film layer; 61. Metal heat dissipation layer; 62. Buffer layer; 63. Adhesive layer;
[0036] 7. Driver chip;
[0037] 81. Cover plate; 82. Optical transparent adhesive; 83. Polarizing film;
[0038] X, the first direction; Y, the second direction. Detailed Implementation
[0039] The features and exemplary embodiments of various aspects of this application will now be described in detail. To make the objectives, technical solutions, and advantages of this application clearer, the application will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only configured to explain this application and are not configured to limit this application. For those skilled in the art, this application can be implemented without some of these specific details. The following description of the embodiments is merely to provide a better understanding of this application by illustrating examples of this application.
[0040] It should be noted that, in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising..." does not exclude the presence of additional identical elements in the process, method, article, or apparatus that includes the element.
[0041] It should be understood that when describing the structure of a component, when referring to a layer or region as being "above" or "on top of" another layer or region, it can mean that it is directly above the other layer or region, or that it contains other layers or regions between it and the other layer or region. Furthermore, if the component is flipped over, that layer or region will be located "below" or "under" the other layer or region.
[0042] Flexible organic light-emitting diode (OLED) displays, characterized by active light emission, wide viewing angles, broad color gamut, high brightness, fast response time, and low power consumption, are gradually becoming the mainstream in the market. Furthermore, due to their flexible and foldable structure, they can be used to fabricate various forms of electronic devices, such as foldable screen phones, where folding allows for the storage of a large screen area, thus meeting users' demands for both large screens and portability. To achieve a narrow bezel effect, the non-display area of the flexible screen is typically bent to the back of the display panel.
[0043] The characteristics of thin-film transistors (TFTs) in a display screen are easily affected by factors such as light, temperature, and static electricity, causing their characteristics to shift and thus reducing the display effect. One such factor is the copper rod friction test, conducted to assess the impact of static electricity generated by prolonged user finger contact with the display screen on the display effect. During the friction test on the cover plate, negative charges are generated on the cover plate surface. These negative charges repel each other and move, causing charge conduction and diffusion to the back channel of the display panel. This results in a forward bias of the Vth (Threshold voltage) of the TFTs within the display panel, producing a green screen phenomenon.
[0044] Related technologies employ methods such as coating the edges of the screen and camera aperture with conductive liquid or conductive silver paste to conduct away static electricity, thereby reducing the risk of green screen. However, conductive liquid and conductive silver paste are prone to corroding the screen in high-temperature and high-humidity environments, causing damage and problems such as black spots. Furthermore, the liquid coating process itself is unstable, which can easily lead to a decrease in yield.
[0045] To address the aforementioned problems, this application provides a display module and a display device. The embodiments of the display module and display device will be described below with reference to the accompanying drawings. The display module may be an Organic Light Emitting Diode (OLED) display module.
[0046] Please see Figure 1 and Figure 2 , Figure 1 This illustration shows one of the partial cross-sectional structural diagrams of a display panel according to an embodiment of this application; Figure 2This is a second schematic diagram of a partial cross-sectional structure of a display panel provided in an embodiment of this application.
[0047] like Figure 1 and Figure 2 As shown, a first aspect of this application provides a display module having a bending area aa and a non-bending area AA located on one side of the bending area aa. The display module further includes a display panel 1, a first support film 21, a second support film 22, a conductive adhesive layer 3, and a shielding protective layer 4. The display panel 1 includes a first screen body 11, a bending portion 13, and a second screen body 12. The first screen body 11 and the second screen body 12 are located in the non-bending area AA, and the bending portion 13 is located in the bending area aa. The first screen body 11 and the second screen body 12 are disposed opposite to each other in a first direction X. At least a portion of the bending portion 13 is bent and connected to the first screen body 1. 1. Between the first screen 11 and the second screen 12; the first support film 21 is located on the side of the first screen 11 facing the second screen 12 and extends along the second direction Y, where the first direction X and the second direction Y intersect; the second support film 22 is disposed opposite to the first support film 21 and is located on the side of the second screen 12 facing the first screen 11; the conductive adhesive layer 3 is at least partially located between the first support film 21 and the second support film 22, and both the first support film 21 and the second support film 22 are connected to the conductive adhesive layer 3; the shielding protection layer 4 is located on the side of the second screen 12 away from the first screen 11, and the conductive adhesive layer 3 is electrically connected to the shielding protection layer 4.
[0048] Optionally, the first screen 11 is the display side of the display module, and the second screen 12 is the bonding side of the display module. The second screen 12 is bent to the back of the first screen 11 via a bending portion 13 to achieve a narrow bezel design for the display module. The driver chip 7 (IC) and the flexible circuit board assembly 5 can both be bonded to the second screen 12 to provide electrical signals to the display panel 1. Optionally, the display module also includes a cover plate 81, which covers the side of the first screen 11 opposite to the second screen 12.
[0049] Optionally, the shielding protective layer 4 can be IC Cover tape (IC: Integrated Circuit; Cover tape, shielding film). The functions of IC Cover tape include protecting the IC, electrostatic shielding, heat dissipation, and waterproofing.
[0050] According to the embodiment of this application, the display module includes a display panel 1, a first support film 21, a second support film 22, a conductive adhesive layer 3, and a shielding protective layer 4. The first support film 21 and the second support film 22 provide support for the first screen body 11 and the second screen body 12 with a flat film layer, improving the stability of the screen structure. The conductive adhesive layer 3 connects the first support film 21 and the second support film 22 and is electrically connected to the shielding protective layer 4, connecting to the back of the first screen body 11 to form a low-impedance electrostatic discharge path. This effectively conducts the charge on the first screen body 11 and the second screen body 12 of the display panel 1, preventing a large accumulation of charge in the back channel of the screen body. This allows for rapid release of static electricity from the back channel, reducing the risk of charge intrusion into the back channel of the display panel 1 causing forward bias of the thin-film transistor threshold voltage and resulting in a green tint to the screen, thus improving the performance and reliability of the display module.
[0051] Compared to solutions using conductive liquids or conductive silver pastes, the present application embodiment has two advantages. First, the structure is more stable under high temperature and high humidity conditions. The conductive adhesive layer 3 is a solid conductive structure, which does not require spraying liquid chemical conductive liquids, will not corrode the screen, and has a simple and stable process, better reliability, and improved yield of the display module. Second, the conductive adhesive layer 3 is in conductive contact with the first support film 21 and the second support film 22 respectively, and is electrically connected to the shielding protection layer 4, so that the display module of the present application has the advantages of large conductive contact area, multiple conductive paths, large electrostatic load, and better antistatic effect.
[0052] In some optional embodiments, the display module further includes a flexible circuit board assembly 5, which is connected between the conductive adhesive layer 3 and the shielding protective layer 4. The conductive adhesive layer 3 is electrically connected to the shielding protective layer 4 through the flexible circuit board assembly 5, which can effectively conduct the charge of the first screen 11 and the second screen 12 of the display panel 1, reduce the risk of charge intrusion into the back channel of the display panel 1 causing the screen to turn green, and improve the performance and reliability of the display module.
[0053] The conductive adhesive layer 3 can be directly electrically connected to the shielding protective layer 4, or indirectly electrically connected to the shielding protective layer 4 through the flexible circuit board assembly 5. Both methods can realize the conduction and release of the screen's charge, thereby improving the performance and reliability of the display module.
[0054] Optionally, Flexible Printed Circuit Assembly (FPCA) refers to a flexible printed circuit (FPC) component that has been soldered or assembled.
[0055] Optionally, the flexible circuit board assembly 5 is connected to the side of the second screen 12 opposite to the first screen 11, and the flexible circuit board assembly 5 extends along the second direction Y. Optionally, the second screen 12 is the bonding side of the display module, and the flexible circuit board assembly 5 is connected to the side of the second screen 12 opposite to the first screen 11. This can be understood as: the flexible circuit board assembly 5 is bonded to the connection terminals provided on the second screen 12, thereby providing electrical signals to the display panel 1.
[0056] In these embodiments, the flexible circuit board assembly 5 extends along the second direction Y. The flexible circuit board assembly 5 can extend from the connection with the second screen 12 to the back of the first screen 11. The flexible circuit board assembly 5 is set beyond the second screen 12 so that the flexible circuit board assembly 5 can be electrically connected to the conductive adhesive layer 3, thereby realizing the conduction and release of charge. The extension of the flexible circuit board assembly 5 along the second direction Y further optimizes the spatial layout, making the display module structure more compact.
[0057] Optionally, the display module also includes a driver chip 7, located between the second screen 12 and the shielding layer 4. The flexible circuit board assembly 5 provides electrical signals to the display panel 1 through the driver chip 7. The flexible circuit board assembly 5 can provide electrical signals to the display panel 1 through the driver chip 7, thereby ensuring the normal operation of the display panel 1. The use of a solid conductive adhesive layer 3 avoids the problem of conductive liquid corroding the screen, improving yield. The integration of the driver chip 7 is based on the existing stable structure, without increasing process complexity, maintaining the simplicity and reliability of the process. The connection between the conductive adhesive layer 3 and the first support film 21, the second support film 22, and the shielding layer 4 results in a large conductive contact area and multiple conductive paths in the display module, providing good anti-static performance. The driver chip 7 can operate normally in the overall anti-static environment, while also benefiting from good electrostatic protection itself. The shielding layer 4 (ICCover tape) provides multiple functions such as IC protection, electrostatic shielding, heat dissipation, and waterproofing. The driver chip 7, located under its cover, receives more comprehensive protection, ensuring stable operation of the driver chip 7, thereby ensuring the normal transmission of electrical signals to the display panel 1 and improving the overall performance and reliability of the display module.
[0058] In some optional embodiments, the flexible circuit board assembly 5 has a first copper-exposed window structure 51 electrically connected to the conductive adhesive layer 3 on the side facing the first screen body 11. The cooperation between the first copper-exposed window structure 51, the conductive adhesive layer 3, and the shielding protection layer 4 significantly increases the conductive contact area and conductive paths of the display module, strengthens its ability to withstand electrostatic loads, and greatly improves its antistatic effect, thus better protecting the various components within the display module.
[0059] The first copper-exposed window structure 51 refers to one or more window areas formed on the surface of the flexible circuit board assembly 5 by an etching process. These areas expose the internal copper layer, allowing the conductive adhesive layer 3 to directly contact the copper layer, thereby achieving electrical connection. The first copper-exposed window structure 51 can be formed by laser cutting, chemical etching, or mechanical processing, and its shape can be circular, rectangular, or other suitable shapes to ensure sufficient contact with the conductive adhesive layer 3.
[0060] Optionally, the size and position of the first copper-exposed window structure 51 can be optimized according to the distribution of the conductive adhesive layer 3 and the layout of the flexible circuit board assembly 5 to improve the reliability and stability of the electrical connection.
[0061] In these embodiments, the flexible circuit board assembly 5 can achieve direct electrical connection with the conductive adhesive layer 3 through the first copper-exposed window structure 51, avoiding problems such as poor contact that may occur in traditional connection methods. This simplifies the electrical connection structure, reduces the complexity of the assembly process, and improves the reliability and stability of the connection. The first copper-exposed window structure 51 not only effectively conducts charge but also adapts to the bending deformation of the flexible circuit board assembly 5 in the bending area aa, ensuring the normal operation of the display module in a bent state.
[0062] In some optional embodiments, the conductive adhesive layer 3 includes a main body portion 31 and a protrusion portion 32 connected to each other. The protrusion portion 32 protrudes from the main body portion 31 in a direction away from the first screen body 11. The protrusion portion 32 is electrically connected to the flexible circuit board assembly 5 through the first copper leakage window structure 51.
[0063] Through the first copper-exposed window structure 51, the flexible circuit board assembly 5 can achieve direct electrical connection with the conductive adhesive layer 3, avoiding the problems of poor contact or signal attenuation that may occur in traditional connection methods. This simplifies the electrical connection structure, reduces the complexity of the assembly process, and improves the reliability and stability of the connection. The first copper-exposed window structure 51 can not only effectively conduct electrical signals, but also adapt to the bending deformation of the flexible circuit board assembly 5 in the bending area aa, ensuring the normal operation of the display module in the bending state.
[0064] Optionally, the projection of the protrusion 32 along the first direction X is located within the projection of the first copper-exposed window structure 51 along the first direction X. This arrangement can improve the accuracy and reliability of the electrical connection, avoid poor connection caused by positional deviation, and improve the reliability and accuracy of the electrical connection between the two.
[0065] Reference Figure 1In some optional embodiments, the display module further includes a composite film layer 6, which is located on the side of the first support film 21 away from the first screen body 11. The composite film layer 6 includes a buffer layer 62 and a metal heat dissipation layer 61 stacked along the side away from the first support film 21. The flexible circuit board assembly 5 is provided with a second copper leakage window structure 52 electrically connected to the metal heat dissipation layer 61 on the side facing the first screen body 11.
[0066] Reference Figure 2 Optionally, the composite membrane layer 6 further includes an adhesive layer 63, which is located between the first support membrane 21 and the buffer layer 62. The adhesive layer 63 enhances the bonding strength between the composite membrane layer 6 and the first support membrane 21, further improving the stability of the overall structure.
[0067] The composite film layer 6 can be an SCF composite film (Super Clean Foam). The composite film layer 6 includes an adhesive layer 63, a buffer layer 62, and a metal heat dissipation layer 61, sequentially stacked along the first direction X. The adhesive layer 63 is used to bond the buffer layer 62 and the first support film 21. The first support film 21 provides support for the first screen body 11, while the buffer layer 62 in the composite film layer 6 is located on the side of the first support film 21 away from the first screen body 11, further buffering external impact forces, reducing the risk of damage to the first screen body 11 due to external forces, enhancing the structural stability of the entire display module, and improving the impact resistance of the display module. The metal heat dissipation layer 61 has good thermal conductivity, enabling rapid conduction of heat generated inside the display module. As a conductor, the metal heat dissipation layer 61, after being electrically connected to the second copper-exposed window structure 52 of the flexible circuit board assembly 5, can further expand the electrostatic discharge path of the display module. When the display module generates static electricity, the static electricity can be quickly conducted to the flexible circuit board assembly 5 through the metal heat dissipation layer 61 and the second copper leakage window structure 52, and further released into the external environment, reducing the risk of static electricity damage to the internal components of the display module and improving the module's anti-static capability.
[0068] The composite film layer 6 integrates the buffer layer 62 and the metal heat dissipation layer 61, achieving the integration of multiple functions within a limited space. This integrated design not only saves internal space in the display module but also simplifies the module assembly process and reduces production costs. Simultaneously, the electrical connection between the flexible circuit board assembly 5 and the metal heat dissipation layer 61 makes the electrical signal transmission and heat dissipation functions of the display module more coordinated and efficient.
[0069] The buffer layer 62 is made of a material that is elastic, lightweight, flexible, and ultra-thin, such as foam. The metal heat dissipation layer 61 can be made of a metal with excellent thermal conductivity, such as copper, aluminum, or silver. Its high thermal conductivity allows for rapid conduction of heat generated by the display module during operation to the external environment, improving heat dissipation performance. For example, the metal heat dissipation layer 61 can be made of a metal with good ductility, such as copper foil or aluminum foil.
[0070] In these embodiments, the stacked structure of the buffer layer 62 and the metal heat dissipation layer 61 enhances the structural stability of the display module between the bending region aa and the non-bending region AA, while the metal heat dissipation layer 61 effectively improves heat dissipation performance. The flexible circuit board assembly 5 is electrically connected to the metal heat dissipation layer 61 through the second copper-drained window structure 52, further increasing the electrostatic discharge path of the display module and enabling rapid release of static electricity from the back channel of the screen, thereby improving the electrostatic greening problem of the OLED display module.
[0071] Figure 3 This is a top view of one of the display panel structures provided in an embodiment of this application.
[0072] Combined with reference Figures 1 to 3 In some optional embodiments, at least a portion of the conductive adhesive layer 3 is located on the side of the composite film layer 6 facing the bending region aa. By setting the conductive adhesive layer 3 on the side of the composite film layer 6 facing the bending region aa, the conductive adhesive layer 3 can simultaneously bond the first support film 21 and the second support film 22, improving the structural stability of the display panel 1 after bending, and also facilitating the conductive adhesive layer 3 to simultaneously conduct the charges generated by the first screen body 11 and the second screen body 12.
[0073] In these embodiments, when at least a portion of the conductive adhesive layer 3 is located on the side of the composite film layer 6 facing the bending area aa, it can simultaneously bond the first support film 21 and the second support film 22. After the display panel 1 is bent, this bonding effect can enhance the connection strength between the first screen body 11 and the second screen body 12, reduce the impact of stress generated by bending on the screen structure, thereby improving the structural stability of the display panel 1 after bending and reducing the risk of screen deformation, cracking, and other problems. Since the conductive adhesive layer 3 is located on the side of the composite film layer 6 facing the bending area aa and can simultaneously bond the first support film 21 and the second support film 22, it can simultaneously conduct the charge generated by the first screen body 11 and the second screen body 12. This design can form a more efficient electrostatic discharge path, allowing the charge to be conducted to the external environment more quickly, reducing the probability of the screen turning green or being damaged due to electrostatic accumulation, and improving the antistatic capability and reliability of the display module.
[0074] Figure 4 This is a second top view of a display panel provided in an embodiment of this application.
[0075] Reference Figure 4 Optionally, the conductive adhesive layer 3 is arranged around the periphery of the composite film layer 6. Since electrostatic charges often enter the screen body from the weak points around the cover plate 81, this structure enables rapid charge transfer around the perimeter of the screen, resulting in better anti-green screen performance in extreme electrostatic environments. This further ensures the conductivity uniformity and structural stability of the entire display module. This arrangement not only optimizes the function of the conductive adhesive layer 3 but also improves the overall performance and reliability of the display module. A stable structure and excellent charge conduction performance contribute to improved overall display module performance. With structural stability after bending, the display panel 1 remains flat, resulting in a clearer and more stable display. Good charge conduction performance reduces electrostatic interference to the display module, avoiding display abnormalities and other problems, thus improving the performance of the display module.
[0076] In some optional embodiments, the shielding layer 4 includes a conductive composite layer 40 that covers the side of the flexible circuit board assembly 5 away from the first screen 11, and the conductive composite layer 40 extends along the second direction Y and covers the side of the metal heat dissipation layer 61 away from the buffer layer 62.
[0077] The conductive composite layer 40 covers the side of the flexible circuit board assembly 5 opposite to the first screen 11, and extends along the second direction Y and covers the side of the metal heat dissipation layer 61 opposite to the buffer layer 62, thus expanding the path and contact area for electrostatic discharge. When the display module generates static electricity, the static electricity can be quickly conducted to other areas and released into the external environment through the conductive composite layer 40, effectively reducing the impact of static electricity on the threshold voltage of the thin-film transistor and improving the anti-static capability of the display module.
[0078] The conductivity of the conductive composite layer 40 enables it to shield against external electromagnetic interference. By covering key areas such as the flexible circuit board assembly 5 and the metal heat dissipation layer 61, a continuous electromagnetic shielding layer is formed, preventing external electromagnetic signals from interfering with the internal circuitry of the display module, ensuring stable transmission of display signals, and improving the display quality and reliability of the display module.
[0079] The conductive composite layer 40 covers the flexible circuit board assembly 5 and the metal heat dissipation layer 61, effectively forming an additional connection and support structure between them. This helps to enhance the connection strength between these components, reduce the risk of component loosening or damage caused by external forces such as vibration and impact, and improve the overall structural stability of the display module.
[0080] In these embodiments, the conductive composite layer 40 extends along the second direction Y for a length greater than at least a portion of the flexible circuit board assembly 5, enabling the conductive composite layer 40 to simultaneously cover the flexible circuit board assembly 5 and the metal heat dissipation layer 61. This allows the conductive composite layer 40 to conduct the charges of the flexible circuit board assembly 5 and the metal heat dissipation layer 61 respectively, thereby further increasing the electrostatic discharge path of the display module. This enables rapid release of static electricity from the back channel of the screen and improves the problem of electrostatic greening in OLED display modules.
[0081] Optionally, the conductive composite layer 40 includes a conductive adhesive and / or a shielding metal layer. The conductive composite layer 40 can be implemented using either a conductive adhesive or a shielding metal layer. A conductive adhesive is a conductive adhesive that enables electrical connections through its internal conductive particles. The shielding metal layer can be made of metals such as copper, aluminum, or silver, utilizing the conductivity of the metal to conduct static electricity. Optionally, the conductive composite layer 40 can simultaneously include both a conductive adhesive and a shielding metal layer to further enhance conductivity and shielding effectiveness.
[0082] For example, the conductive adhesive can be formed by doping conductive particles into the adhesive body, such as silver paste, copper paste, or other colloidal materials with good conductivity. The shielding metal layer can be copper foil, aluminum foil, or other metal materials with good conductivity and shielding effect. The conductive adhesive containing conductive particles (silver / nickel / carbon) can bond to the surface of the driver chip 7, and at the same time, the conductive particles achieve electrical connection with the chip ground pad (GND Pad).
[0083] In some optional embodiments, the flexible circuit board assembly 5 has a third copper-exposed window structure 53 on the side opposite to the first screen body 11, which is electrically connected to the conductive composite layer 40. The third copper-exposed window structure 53 refers to a window area provided on the flexible circuit board assembly 5, which directly contacts the conductive composite layer 40 by exposing the copper layer, thereby achieving electrical connection.
[0084] The conductive composite layer 40 is conductive, enabling rapid conduction and dispersion of static electricity. The electrical connection between the third copper-drained window structure 53 and the conductive composite layer 40 provides a more direct and efficient discharge path for static electricity within the display module. When static electricity is generated in the display module, it can be rapidly conducted to the conductive composite layer 40 through the third copper-drained window structure 53 and further released into the external environment, effectively reducing the risk of damage to the flexible circuit board assembly 5 and other internal components, and improving the anti-static capability of the display module.
[0085] In these embodiments, by providing the conductive composite layer 40 and the third copper-leaking window structure 53, the electrical connection problem between the flexible circuit board assembly 5 and the shielding protective layer 4 can be effectively solved. The conductive composite layer 40 can quickly conduct away static electricity, preventing static electricity from accumulating in the display panel 1, thereby preventing the Vth of the thin-film transistor from being forward biased and avoiding the green screen phenomenon.
[0086] In this embodiment, the electrostatic charge of the display module can be interconnected through multiple paths, such as the cover plate 81, the first screen 11 / second screen 12, the conductive adhesive layer 3, the flexible circuit board assembly 5, the composite film layer 6 / shielding protection layer 4, and the shielding protection layer 4, to achieve rapid transfer of charge to the metal layer of the display module, release electrostatic charge, and improve the anti-static effect. This is especially suitable for display products used in special operations (such as high electrostatic environments).
[0087] In some alternative embodiments, the display module further includes a cover plate 81 disposed on the side of the first screen 11 opposite to the second screen 12.
[0088] Optionally, a polarizer 83 and an optically transparent adhesive 82 are also provided between the cover plate 81 and the first screen 11, with the optically transparent adhesive 82 located between the polarizer 83 and the cover plate 81. The polarizer 83 can control the polarization direction of light, allowing only light with a specific polarization direction to pass through and reach the human eye, thereby reducing the interference of ambient light on the displayed image and improving the contrast and color saturation of the image. For example, in a strong light environment, the polarizer 83 can effectively reduce the intensity of reflected light, making the displayed image clearer and more visible. The optically transparent adhesive 82 has good optical and adhesive properties, which can tightly bond the cover plate 81 and the polarizer 83 together, ensuring that light can pass smoothly between the two without significant light loss or distortion due to the presence of adhesive. At the same time, its high transparency ensures that the color and brightness of the displayed image are not affected, resulting in a good user visual experience.
[0089] Optionally, the cover plate 81 is adhered to the side of the polarizer 83 facing away from the display panel 1. The cover plate 81 provides protection for components such as the polarizer 83 and the display panel 1, improving the lifespan of the display module. The cover plate 81 can be a flat cover plate 81, covering the first screen body 11. Alternatively, the cover plate 81 can include a flat portion and a curved portion, with the flat portion covering the screen body and the curved portion covering at least part of the bent portion 13. The cover plate 81 is disposed on the side of the first screen body 11 facing away from the second screen body 12, serving as the first line of defense and effectively preventing damage to the first screen body 11 from external physical impacts, scratches, wear, etc. For example, in daily use, the cover plate 81 of the mobile phone screen can prevent hard objects such as keys and coins from directly contacting and scratching the first screen body 11, extending the lifespan of the display module.
[0090] The cover plate 81 can be made of materials such as tempered glass, sapphire glass, or polycarbonate to provide sufficient hardness and wear resistance, protecting the first screen 11 from external physical damage. The polarizer 83 can be composed of polyvinyl alcohol (PVA) and iodides, manufactured through specific stretching and dyeing processes, effectively reducing the reflection of external light and improving display contrast. The optically transparent adhesive 82 can be made of acrylic or silicone materials, possessing high transparency and good adhesion properties, ensuring good adhesion and optical transparency between layers.
[0091] In these embodiments, by providing a cover plate 81 on the side of the first screen 11 of the display module facing away from the second screen 12, the surface protection of the first screen 11 is enhanced, preventing external physical damage and environmental influences. Simultaneously, the polarizer 83 and optically transparent adhesive 82 disposed between the cover plate 81 and the first screen 11 optimize the optical performance of the display module, improving display effects and visual experience. The polarizer 83 reduces the reflection of external light, improving display contrast, while the optically transparent adhesive 82 ensures good adhesion and optical transparency between layers, further enhancing display quality.
[0092] The second aspect of this application also provides a display device, including the display module of any of the above embodiments. Since the display device provided in the second aspect of this application includes the display module of any of the above embodiments, it possesses the beneficial effects of the display module of any of the above embodiments, which will not be elaborated further here. Optionally, the display device provided in this application has better anti-green screen performance in extreme electrostatic environments and is more suitable for products in high electrostatic environments.
[0093] The display devices in this application include, but are not limited to, mobile phones, personal digital assistants (PDAs), tablet computers, e-books, televisions, access control systems, smart landline phones, control consoles, and other devices with display functions.
[0094] The embodiments described above are not exhaustive, nor do they limit the invention to the specific embodiments described. Clearly, many modifications and variations can be made based on the above description. These embodiments are selected and specifically described in this specification to better explain the principles and practical applications of this application, thereby enabling those skilled in the art to effectively utilize this application and its modifications. This application is limited only by the claims and their full scope and equivalents.
Claims
1. A display module, characterized in that, The display module has a bent area and a non-bent area located on one side of the bent area, and the display module further includes: The display panel includes a first screen body, a bent portion, and a second screen body. The first screen body and the second screen body are located in the non-bent area, and the bent portion is located in the bent area. The first screen body and the second screen body are arranged opposite to each other in a first direction. At least a portion of the bent portion is bent and connected between the first screen body and the second screen body. A first support membrane is located on the side of the first screen body facing the second screen body and extends along a second direction, wherein the first direction and the second direction intersect. The second support film is disposed opposite to the first support film, and the second support film is located on the side of the second screen body facing the first screen body; A conductive adhesive layer is at least partially located between the first support film and the second support film, and both the first support film and the second support film are connected to the conductive adhesive layer. A shielding protective layer is located on the side of the second screen body opposite to the first screen body, and the conductive adhesive layer is electrically connected to the shielding protective layer.
2. The display module according to claim 1, characterized in that, The display module further includes a flexible circuit board assembly, which is connected between the conductive adhesive layer and the shielding protective layer; Preferably, the flexible circuit board assembly is connected to the side of the second screen body opposite to the first screen body, and the flexible circuit board assembly extends along the second direction; Preferably, the display module further includes a driver chip, which is located between the second screen and the shielding layer, and the flexible circuit board assembly provides electrical signals to the display panel through the driver chip.
3. The display module according to claim 2, characterized in that, The flexible circuit board assembly has a first copper-leaking window structure on the side facing the first screen body, which is electrically connected to the conductive adhesive layer.
4. The display module according to claim 3, characterized in that, The conductive adhesive layer includes a main body and a protruding part that are connected to each other. The protruding part protrudes from the main body in a direction away from the first screen body. The protruding part is electrically connected to the flexible circuit board assembly through the first copper leakage window structure. Preferably, the projection of the protrusion along the first direction is located within the projection of the first copper-leaking window structure along the first direction.
5. The display module according to claim 2, characterized in that, The display module further includes a composite film layer, which is located on the side of the first support film away from the first screen body. The composite film layer includes a buffer layer and a metal heat dissipation layer stacked along the distance from the first support film layer. The flexible circuit board assembly has a second copper-leaking window structure on the side facing the first screen body, which is electrically connected to the metal heat dissipation layer. Preferably, the composite film layer further includes an adhesive layer located between the first support film and the buffer layer.
6. The display module according to claim 5, characterized in that, At least a portion of the conductive adhesive layer is located on the side of the composite film layer facing the bending region; Preferably, the conductive adhesive layer is disposed around the periphery of the composite film layer.
7. The display module according to claim 5, characterized in that, The shielding protection layer includes a conductive composite layer that covers the side of the flexible circuit board assembly away from the first screen body, and the conductive composite layer extends along the second direction and covers the side of the metal heat dissipation layer away from the buffer layer.
8. The display module according to claim 2, characterized in that, The shielding protection layer includes a conductive composite layer, and the flexible circuit board assembly has a third copper leakage window structure that is electrically connected to the conductive composite layer on the side opposite to the first screen body. Preferably, the conductive composite layer includes a conductive adhesive and / or a shielding metal layer.
9. The display module according to claim 1, characterized in that, The display module also includes a cover plate, which is disposed on the side of the first screen body away from the second screen body; Preferably, a polarizer and an optically transparent adhesive are further provided between the cover plate and the first screen body, with the optically transparent adhesive located between the polarizer and the cover plate.
10. A display device, characterized in that, Includes the display module as described in any one of claims 1 to 9.