Display panel, preparation method thereof and display device

Abstract

The application provides a display panel, a preparation method thereof and a display device. The display panel comprises a substrate, a screen body, a conductive layer and a chip on film. The substrate is provided with an opening; the screen body is arranged on one side of the substrate, and the opening exposes at least part of the screen body. The conductive layer is arranged in the opening, and the screen body is electrically connected with the conductive layer. The chip on film is arranged on the side of the substrate away from the screen body, and the conductive layer is electrically connected with the chip on film. The conductive layer is arranged in the opening on the back of the screen body, and the conductive layer has a very small height difference when electrically connecting the chip on film and the screen body, thereby reducing the risk of fracture and improving the electrical connection reliability of the display panel.

Description

Technical Field

[0001] This invention relates to the field of display technology, and in particular to a display panel, its manufacturing method, and a display device. Background Technology

[0002] As the demand for display products such as mobile phones and wearable devices continues to grow in daily life, users are increasingly demanding higher performance from display devices. Among them, narrow-bezel display panels are gaining more and more market favor due to their high screen-to-body ratio and excellent visual effects.

[0003] To achieve a narrow bezel design for display panels, existing technologies often use a combination of opening holes on the back of the screen and silver paste connection to achieve electrical interconnection between the flip-chip film and the screen. However, the reliability of such display panels needs to be improved. Summary of the Invention

[0004] The purpose of this invention is to provide a display panel and its manufacturing method, as well as a display device, which improves the connection reliability of the display panel while achieving a narrow bezel.

[0005] To achieve the above objectives, the present invention provides a display panel, the display panel comprising:

[0006] Substrate, wherein the substrate is provided with openings; A screen body is disposed on one side of the substrate; the opening exposes at least a portion of the screen body; A conductive layer is disposed within the opening, and the screen body is electrically connected to the conductive layer; A flip-chip film is disposed on the side of the substrate opposite to the screen body, and the conductive layer is electrically connected to the flip-chip film.

[0007] In one embodiment, the flip-chip film includes a first portion, the orthographic projection of the first portion on the substrate at least partially overlapping the orthographic projection of the conductive layer on the substrate; a first pad is provided on the side surface of the first portion that overlaps with the conductive layer in a direction perpendicular to the substrate, near the substrate.

[0008] In one embodiment, the conductive layer includes a first conductive layer, which includes a plurality of spaced-apart first conductive units; the screen is electrically connected to the plurality of first conductive units, and the plurality of first conductive units are electrically connected to the first pad.

[0009] In one embodiment, the material of the first conductive layer includes conductive adhesive.

[0010] In one embodiment, the thickness of the first conductive layer in the direction perpendicular to the substrate is 1.6 micrometers to 3.3 micrometers.

[0011] In one embodiment, the conductive layer includes a second conductive layer and a third conductive layer, the third conductive layer being disposed on the side of the second conductive layer opposite to the screen body; the second conductive layer includes a plurality of spaced-apart second conductive units, and the third conductive layer includes a plurality of spaced-apart third conductive units; wherein the screen body is electrically connected to the plurality of second conductive units, the plurality of second conductive units are electrically connected to the plurality of third conductive units in a one-to-one correspondence, and the plurality of third conductive units are electrically connected to the first pad.

[0012] In one embodiment, the material of the second conductive layer includes conductive adhesive, and the material of the third conductive layer includes metal paste.

[0013] In one embodiment, the projected area of ​​the first portion on the screen is larger than the projected area of ​​the conductive layer on the screen. A portion of the first portion extends to the side of the substrate opposite to the screen body, and a portion of the first portion is attached to the surface of the substrate opposite to the screen body.

[0014] In one embodiment, the flip-chip film further includes a second portion located on the side of the first portion away from the conductive adhesive in a direction parallel to the substrate, and the surface of the second portion near the substrate is provided with a second pad.

[0015] In one embodiment, the display panel further includes: A driver chip is disposed on the side of the second part close to the substrate, and the driver chip is electrically connected to the second part; A flexible circuit board is disposed on the side of the second portion near the substrate, the flexible circuit board including a third pad, the third pad being electrically connected to the second pad.

[0016] In one embodiment, the flip-chip film further includes a third portion, which connects the first portion and the second portion.

[0017] In one embodiment, the display panel further includes: A protective film is disposed on the side of the substrate opposite to the screen body; A buffer layer is disposed on the side of the protective film opposite to the substrate; The second part is located on the side of the buffer layer opposite to the substrate.

[0018] In one embodiment, the third portion has a first gap with the protective film.

[0019] In one embodiment, the third portion has a second gap with the buffer layer.

[0020] Secondly, the present invention also provides a method for manufacturing a display panel, the method comprising: Provide a substrate; A screen is fabricated on one side of the substrate; An opening is made in the substrate so that at least a portion of the screen is exposed; A conductive layer is prepared inside the opening, so that the screen body is electrically connected to the conductive layer; A flip-chip film is prepared on the side of the substrate opposite to the screen body, so that the conductive layer is electrically connected to the flip-chip film.

[0021] In one embodiment, the fabrication of the conductive layer within the opening includes: A first conductive material is coated inside the opening, and after curing, a first conductive layer is formed. The first conductive layer is patterned to make the screen body electrically connected to the first conductive layer.

[0022] In one embodiment, the fabrication of the conductive layer within the opening includes: A second conductive material is coated inside the opening, and after curing, a second conductive layer is formed. The second conductive layer is patterned to make the screen body electrically connected to the second conductive layer.

[0023] In one embodiment, after fabricating the flip-chip thin film on the side of the substrate opposite to the screen, the method further includes: A third conductive layer is prepared on the side of the second conductive layer away from the screen body, so that the second conductive layer is electrically connected to the third conductive layer, and the third conductive layer is electrically connected to the flip-chip film.

[0024] In one embodiment, both the first conductive material and the second conductive material comprise conductive adhesive, and the material of the third conductive layer comprises metal paste.

[0025] The present invention also provides a display device, the display device comprising the display panel as described above.

[0026] This invention proposes a display panel in which a conductive layer is filled into openings on the back of the screen, and its upper and lower surfaces are electrically connected to the screen and the flip-chip film, respectively. The conductive layer achieves electrical connection between the flip-chip film and the screen while exhibiting minimal discontinuity, thereby reducing the risk of conductive layer breakage due to discontinuity and improving the electrical connection reliability of the display panel. Attached Figure Description

[0027] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0028] Figure 1 A schematic diagram of the structure of a display panel provided in the prior art; Figure 2 A schematic diagram of the structure of a display panel provided by the present invention; Figure 3 This is a schematic diagram of the structure of a display panel in one embodiment of the present invention; Figure 4 for Figure 3 The illustrated embodiment is shown as a cross-sectional view at AA'. Figure 5 This is a schematic diagram of the display panel structure in another embodiment of the present invention; Figure 6 for Figure 5 The illustrated embodiment is shown as a cross-sectional view at AA'. Figure 7 This is a schematic diagram of the display panel structure in another embodiment of the present invention; Figure 8 This is a schematic diagram of the electrical connections of the display panel in one embodiment of the present invention; Figure 9 A flowchart illustrating a method for manufacturing a display panel provided by the present invention; Figure 10 This is a schematic diagram of the structure of a display device provided by the present invention.

[0029] Reference numerals: 10-substrate, 11-aperture, 20-screen body, 30a-silver paste, 30-conductive layer, 31-first conductive layer, 311-first conductive unit, 312-insulating adhesive, 32-second conductive layer, 321-second conductive unit, 33-third conductive layer, 331-third conductive unit, 40-crystal-on-chip film, 41-first part, 411-first pad, 42-second part, 421-second pad, 43-third part, 50-adhesive layer, 60-driver chip, 70-flexible circuit board, 71-third pad, 80-protective film, 80a-first gap, 90-buffer layer, 90a-first gap, 200-display panel, 300-display device. Detailed Implementation

[0030] To enable those skilled in the art to better understand the technical solutions in the embodiments of this application, the technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art should fall within the protection scope of the embodiments of this application.

[0031] The terminology used in the embodiments of this application is for the purpose of describing particular embodiments only and is not intended to be limiting of this application. The singular forms “a,” “the,” and “the” used in the embodiments of this application and the appended claims are also intended to include the plural forms unless the context clearly indicates otherwise. It should also be understood that the term “and / or” as used in the embodiments of this application refers to and includes any or all possible combinations of one or more associated listed items.

[0032] It should be understood that in the description of the embodiments of this application, the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings. They are only for the convenience of describing the scheme of the embodiments of this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application.

[0033] Furthermore, when an element or layer is referred to as being "on" another element or layer, "connected to," or "bonded to" another element or layer, the element or layer may be directly on the other element or layer, directly connected to, or directly bonded to the other element or layer, or there may be intermediate elements or layers. However, when an element or layer is referred to as being "directly on" another element or layer, "directly connected to," or "directly bonded to" another element or layer, there are no intermediate elements or layers.

[0034] The terms First, Second, etc., are used to describe various elements, components, regions, layers, and / or parts, but these elements, components, regions, layers, and / or parts should not be limited by these terms. These terms are used to distinguish one element, component, region, layer, and / or part from another element, component, region, layer, and / or part.

[0035] Unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0036] To achieve a narrow bezel design for display panels, current technologies often involve creating openings on the back of the screen to allow the crystal-coated film to electrically connect to the screen body. Please refer to [reference needed]. Figure 1 , Figure 1 This is a schematic diagram of a display panel structure provided by the prior art. The display panel includes a substrate 10, a screen body 20, a flip-chip film 40, and silver paste 30a. The screen body 20 is disposed above the substrate 10; the substrate 10 includes a display area AA and a non-display area NAA. The flip-chip film 40 is attached below the substrate 10 for bonding a driver chip 60 and a flexible circuit board 70. To achieve electrical connection between the flip-chip film 40 and the screen body 20, an opening is made in the substrate 10 located in the non-display area, and then silver paste 30a is applied, with one end of the silver paste 30a overlapping with the PIN terminal (i.e., screen body wiring terminal) of the screen body 20 within the opening, and the other end extending to the pad (i.e., PIN) of the flip-chip film 40. The silver paste 30a is then cured. Since the flip-chip film 40 is located below the substrate 10 and the screen body 20 is located above the substrate 10, there is a height difference (i.e., discontinuity) between them. Therefore, the silver paste 30a connecting the screen body 20 and the flip-chip film 40 also forms a certain discontinuity (e.g., ...). Figure 1 The height H shown is indicated. This discontinuous silver paste 30a is highly susceptible to breakage during manufacturing or use. Furthermore, as a liquid paste, silver paste 30a has poor adhesion and cannot adhere firmly to the pin terminals of the screen 20 and the pads of the flip-chip film 40 like glue, easily detaching from the interface. Simultaneously, the curing process of silver paste 30a is sensitive to environmental conditions and is difficult to fully cure; incomplete curing can lead to unstable or even interrupted conductive paths. All these issues affect the reliability of the electrical connection between the flip-chip film 40 and the screen 20, reducing the lifespan of the display panel.

[0037] To address the above problems, the present invention provides a display panel. Please refer to... Figure 2 , Figure 2 This is a schematic diagram of the structure of a display panel according to an embodiment of the present invention. Exemplarily, the display panel includes a substrate 10, a screen 20, a conductive layer 30, and a flip-chip thin film 40.

[0038] The substrate 10 is a support substrate for the display panel, and its material can be selected from polyimide (PI), polyethylene terephthalate (PET) or other rigid or flexible materials suitable for the manufacture of display panels.

[0039] The screen 20 is disposed on one side of the substrate 10, with the display surface of the screen 20 located away from the substrate 10 (i.e., the display surface facing upwards). The screen 20 includes a display area AA and a non-display area NAA. The display area is used to set up a pixel array to realize image display, while the non-display area is usually located around the periphery of the display area and is used to arrange signal traces, drive circuits, or make external connections. The screen 20 has metal traces with pin terminals for electrical connection between the screen 20 and other structures.

[0040] A hole 11 is provided on the substrate 10, which penetrates the substrate 10 along its thickness direction, thereby exposing at least a portion of the screen 20 above the substrate 10. The shape of the hole 11 can be circular, elliptical, rectangular, etc., and this embodiment does not impose any limitations. In this embodiment, the hole can be located in the display area or in the non-display area, as long as the hole can expose the wiring pin terminals in the screen for subsequent electrical connections.

[0041] The conductive layer 30 fills the opening 11 and is electrically connected to the exposed screen 20 (i.e., the metal traces on the screen 20). In this embodiment, the upper surface of the conductive layer 30 is in direct contact with the PIN terminal of the screen 20, forming an ohmic contact; the lower surface of the conductive layer 30 is flush with or slightly protrudes from the bottom of the substrate 10 to facilitate electrical connection with the subsequent chip-on-film 40. The conductive layer 30 has high conductivity and adhesion within the opening 11. The chip-on-film 40 (COF) is disposed on the side of the substrate 10 opposite to the screen 20, and the conductive layer 30 is electrically connected to the COF, thereby achieving electrical connection between the COF and the screen 20.

[0042] In this embodiment of the invention, a conductive layer 30 is filled into the opening 11 on the back of the screen body 20, and its upper and lower surfaces are respectively connected to the screen body 20 and the flip-chip film 40. Compared with the prior art structure in which the silver paste 30a needs to extend from inside the opening 11 to the outside of the opening 11 to overlap the flip-chip film 40, the conductive layer 30 in this embodiment has a very small breakage while realizing the electrical connection between the flip-chip film 40 and the screen body 20, thereby reducing the risk of the conductive layer 30 breaking due to the breakage and improving the electrical connection reliability of the display panel.

[0043] Please refer to Figure 3-4 , Figure 3 This is a schematic diagram of the display panel structure in one embodiment of the present invention. Figure 4 for Figure 3The cross-sectional view at AA' in the illustrated embodiment. In one embodiment of the present invention, the flip-chip film 40 includes a first portion 41. The orthographic projection of the first portion 41 onto the substrate 10 at least partially overlaps with the orthographic projection of the conductive layer 30 onto the substrate 10. That is, when viewed in a direction perpendicular to the substrate 10 and pointing from the substrate 10 towards the screen 20, a portion of the first portion 41 of the flip-chip film 40 covers the lower surface of the conductive layer 30. A first pad 411 is provided on the side surface of the first portion 41 that overlaps with the conductive layer 30 in the direction perpendicular to the substrate 10, near the substrate 10 (i.e., the side facing the screen 20). The first pad 411 is used to achieve electrical and mechanical connection with the upper conductive layer 30. The position, number, and spacing of the first pad 411 must match the layout of the conductive layer 30 to ensure one-to-one correspondence and conduction. In this embodiment, the conductive layer 30 is a patterned conductive structure. Specifically, the conductive layer 30 is not a solid block filling the entire area of ​​the opening 11, but includes multiple independent conductive units (e.g., multiple conductive pillars, conductive strips, or conductive blocks) patterned according to the distribution of the PIN terminals of the screen body 20. The upper surface of each conductive unit in the direction perpendicular to the substrate 10 directly overlaps with the corresponding PIN terminal on the screen body 20 to form an ohmic contact; the lower surface of each conductive unit is connected one-to-one with the corresponding first pad 411 on the flip-chip film 40.

[0044] In this embodiment, by setting a patterned conductive layer 30 and setting a corresponding first pad 411 on the flip-chip film 40, direct alignment and one-to-one connection between the flip-chip film 40 and the screen 20 in the direction perpendicular to the substrate 10 are achieved. This reduces the gaps and avoids signal crosstalk, thereby improving the reliability of the electrical connection and the process yield.

[0045] In some embodiments, the conductive layer 30 can be a single-layer conductive structure or a multi-layer conductive structure. Please refer to [link / reference needed]. Figure 3-4 In one specific embodiment, the conductive layer 30 includes a first conductive layer 31, which in turn includes a plurality of spaced-apart first conductive units 311. In this embodiment, the screen 20 is electrically connected to the plurality of first conductive units 311, and the plurality of first conductive units 311 are electrically connected to the first pads 411 on the flip-chip film 40. Through this one-to-one correspondence unitized structure, vertical conduction between the pin terminals of the screen 20 and the pads of the flip-chip film 40 is achieved, while avoiding the risk of short circuits between different signal lines.

[0046] In this embodiment, the material of the first conductive layer 31 can be conductive adhesive. Conductive adhesive is a composite material that combines conductivity and adhesion, and is usually composed of an epoxy resin matrix and conductive fillers (such as silver powder, copper powder, or silver-plated copper powder). Compared with traditional silver paste 30a, conductive adhesive has stronger adhesion and can firmly adhere to the PIN terminal of the screen body 20 and the first pad 411 of the flip-chip film 40, making it less prone to falling off; secondly, the curing conditions of conductive adhesive are relatively mild (usually hot-press curing at 100-150°C), the curing speed is fast and the curing completeness is high, and it is less likely to cause the problem of interruption of the conductive path due to incomplete curing.

[0047] In some embodiments, a first conductive layer 31 with multiple first conductive units 311 can be formed by applying conductive adhesive, curing it, and then patterning it. For example, conductive adhesive is first applied to the opening 11 by inkjet printing, dispensing, or screen printing, so that the conductive adhesive fills the entire area of ​​the opening 11 and its upper surface contacts the exposed PIN terminal of the screen body 20. Then, the conductive adhesive is cured by heating or ultraviolet irradiation to form a whole conductive body. Next, a laser patterning process is used to cut the whole conductive body into multiple spaced first conductive units 311 along the insulating gap between adjacent PIN terminals, with each first conductive unit 311 corresponding to a PIN terminal of the screen body 20.

[0048] In some embodiments, an insulating adhesive 312 is also provided between adjacent first conductive units 311. The insulating adhesive 312 not only maintains electrical isolation between each first conductive unit 311, preventing short circuits between adjacent units from affecting the accuracy of signal transmission; on the other hand, the insulating adhesive 312 fills the remaining space between the first conductive units 311 in the opening, forming a dense sealing structure, which can effectively prevent external moisture from entering the screen body 20 along the edge of the opening or the gaps between conductive units, thereby preventing moisture from corroding or degrading the device layer of the screen body 20 and even the entire display panel 200, effectively improving the long-term reliability and service life of the display panel 200.

[0049] In some embodiments, the cross-sectional shape of the first conductive unit 311 in the direction parallel to the plane of the substrate can be designed in various ways. For example, the cross-sectional shape of the first conductive unit 311 can be rectangular; the cross-sectional shape of the first conductive unit 311 can also be designed as an "I" shape or a funnel shape. Different cross-sectional shapes can adjust the contact area and bonding strength between the conductive unit and the surrounding insulating adhesive 312 to a certain extent, thereby optimizing the overall structural stability of the conductive layer.

[0050] Furthermore, to further stabilize and ensure a more reliable contact connection between the first conductive unit 311 and the first pad 411 on the flip-chip film 40, the first conductive unit 311 and the first pad 411 can be configured with compatible cross-sectional dimensions. For example, the cross-sectional area of ​​the first conductive unit 311 in the direction parallel to the plane of the substrate 10 can be designed to be slightly larger than the cross-sectional area of ​​the pad 411. Thus, when the flip-chip film 40 is pressed towards the substrate 10, the first pad 411 can be embedded in the lower surface region of the first conductive unit 311, forming an interference fit and tight contact. This not only increases the effective contact area and reduces contact resistance but also enhances the stability of the connection to a certain extent by utilizing the mechanical locking effect generated by the size difference, thereby further improving the reliability of the electrical connection.

[0051] In this embodiment, the thickness of the first conductive layer 31 in the direction perpendicular to the substrate 10 can be adjusted according to the actual thickness of the substrate 10. Preferably, the thickness of the first conductive layer 31 is substantially flush with the thickness of the substrate 10, or slightly higher than the lower surface of the substrate 10, to ensure that the first pad 411 of the flip-chip film 40 can make good contact with the lower surface of the first conductive unit 311. As an optional implementation, the thickness of the first conductive layer 31 in the direction perpendicular to the substrate 10 is 1.6 micrometers to 3.3 micrometers. For example, the thickness of the first conductive layer 31 in the direction perpendicular to the substrate 10 can be... , , , , .

[0052] By using conductive adhesive to form a single-layer first conductive layer 31, and combining this with patterning to form multiple independent first conductive units 311, this embodiment achieves small-discontinuity electrical connections in a narrow-bezel display panel while also obtaining good bonding reliability and a simple manufacturing process. Compared with the prior art using silver paste 30a for printing, the conductive adhesive has better adhesion and is less prone to open circuits due to residual liquid after curing, thus improving the connection reliability of the display panel.

[0053] Please refer to Figure 5-6 In another specific embodiment, the conductive layer 30 is a double-layer conductive structure, that is, the conductive layer 30 includes a second conductive layer 32 and a third conductive layer 33. The third conductive layer 33 is disposed on the side of the second conductive layer 32 away from the screen body 20, that is, along the direction from the screen body 20 to the substrate 10, and the second conductive layer 32 and the third conductive layer 33 are sequentially disposed in the opening 11.

[0054] In this embodiment, the second conductive layer 32 includes a plurality of spaced-apart second conductive units 321, and the third conductive layer 33 includes a plurality of spaced-apart third conductive units 331. The plurality of second conductive units 321 and the plurality of third conductive units 331 are in a one-to-one correspondence in position. Specifically, the screen body 20 is electrically connected to the plurality of second conductive units 321, and the plurality of second conductive units 321 are in turn electrically connected to the plurality of third conductive units 331 in a one-to-one correspondence. The plurality of third conductive units 331 are electrically connected to the first pad 411 on the flip-chip film 40. Through this double-layer conductive structure, vertical conductivity between the PIN terminals of the screen body 20 and the pads of the flip-chip film 40 is ensured, while the complementary characteristics of the two layers of materials are utilized to optimize the connection performance.

[0055] In this embodiment, the material of the second conductive layer 32 includes conductive adhesive, and the formation method of the second conductive layer 32 and the second conductive unit 321 is the same as that of the second conductive layer 32 and the second conductive unit 321. Figure 4 In the illustrated embodiment, the first conductive layer 31 and the first conductive unit 311 are identical. Specifically, conductive adhesive is first applied to and cured within the opening 11, and then laser patterning is used to divide it into multiple isolated second conductive units 321. The conductive adhesive provides good adhesion, mild curing conditions, and reliable conductivity.

[0056] In actual manufacturing processes, if the second conductive layer 32 (conductive adhesive layer) formed through the above process is too thin, its lower surface may not be able to fully contact the first pad 411 of the subsequently attached flip-chip film 40, thus affecting the reliability of the electrical connection. Therefore, in this embodiment, a third conductive layer 33 is further added below the second conductive layer 32 to compensate for insufficient thickness and ensure sufficient contact.

[0057] In this embodiment, the material of the third conductive layer 33 includes a metal paste, such as silver paste. The third conductive unit 331 is formed as follows: after the second conductive layer 32 is fabricated and the flip-chip film 40 is attached, silver paste is applied below each second conductive unit 321 in the opening 11; during application, the amount and position of the silver paste are controlled so that each silver paste dot is aligned with the second conductive unit 321 above it; then it is cured to form multiple mutually isolated third conductive units 331. The lower surface of each third conductive unit 331 is in contact with the first pad 411 on the flip-chip film 40, and the upper surface is in contact with its corresponding second conductive unit 321.

[0058] In this embodiment, insulating adhesive 312 is also provided between adjacent second conductive units 321 and adjacent third conductive units 331. The function of insulating adhesive 312 is the same as described above and will not be repeated here. In addition, the cross-sectional shapes of the second conductive unit 321 and the third conductive unit 331 can be designed in various ways, and in order to achieve a stable electrical connection, the area of ​​the cross-sectional shapes of the second conductive unit 321 and the third conductive unit 331, as well as the area of ​​the cross-sectional shape of the third conductive unit 331 and the first pad 411, can also be designed as needed, as described above and will not be repeated here.

[0059] Through the aforementioned double-layer conductive structure, even if the thickness of the second conductive layer 32 is insufficient to directly contact the flip-chip film 40, the third conductive layer 33 can still serve as a high-compensation and conductive bridge. Simultaneously, the conductive adhesive (second conductive layer 32) provides strong adhesion, and the metal paste (third conductive layer 33) provides low resistivity; together, they synergistically improve the reliability and electrical performance of the electrical connection. Compared to existing technologies that simply use silver paste, this avoids the risk of silver paste breakage under large displacements and enhances the overall structural stability through the adhesive properties of the conductive adhesive.

[0060] Optionally, the thickness of the second conductive layer 32 in the direction perpendicular to the substrate 10 is 1 micrometer to 2.5 micrometers, and the thickness of the third conductive layer 33 in the direction perpendicular to the substrate 10 is 0.6 micrometers to 1 micrometer. The total thickness of the two layers is substantially flush with or slightly exceeds the thickness of the substrate 10, so as to ensure reliable contact with the first pad 411 of the flip-chip film 40.

[0061] It should be noted that this embodiment of the invention does not employ the method of directly coating the entire opening 11 with silver paste to form a single-layer conductive silver paste layer (i.e., only filling the opening 11 with silver paste, so that its upper surface contacts the screen body 20 PIN and its lower surface contacts the first pad 411 of the flip-chip film 40). Silver paste, as a liquid paste composed of metal particles and an organic carrier, has high conductivity after curing, but its adhesion is poor. That is, the adhesion strength of the silver paste to the screen body 20 PIN (usually a metal such as molybdenum, titanium, or ITO) and the first pad 411 of the flip-chip film 40 (usually copper-based gold-plated or tin-plated) is limited, and peeling easily occurs at the interface after curing. Especially when the display panel may undergo thermal cycling, mechanical bending, or vibration impact during subsequent use, the adhesive layer between the silver paste and the upper and lower contact interfaces is prone to detachment, leading to increased contact resistance or open circuits. Secondly, the conductor formed after silver paste curing is usually brittle, has a high elastic modulus, and lacks sufficient stress buffering capacity. When the display panel is bent or subjected to localized impact, the silver paste column completely filled in the opening 11 is prone to cracks due to stress concentration inside or at the interface. After the cracks expand, they can cause partial or complete interruption of the conductive path.

[0062] In summary, although a single-layer silver paste structure can theoretically achieve electrical conductivity between the screen 20 and the flip-chip film 40, the silver paste has shortcomings in adhesion, curing controllability, and resistance to mechanical stress, making it difficult to simultaneously meet the requirements of high reliability, long-term stability, and process compatibility. Therefore, this embodiment adopts a two-layer structure of conductive adhesive (second conductive layer 32) and metal paste (third conductive layer 33). This allows the conductive adhesive layer to provide strong adhesion, easy curing, and stress buffering functions, while the thinner metal paste layer only needs to ensure electrical connection.

[0063] Please refer to Figure 3 and Figure 5 In one embodiment of the present invention, the projected area of ​​the first portion 41 of the flip-chip film 40 on the screen 20 is larger than the projected area of ​​the conductive layer 30 on the screen 20. Specifically, a portion of the first portion 41 extends from the edge that contacts and connects with the conductive layer 30 to the side of the substrate 10 away from the screen 20, and the extended first portion 41 is attached to the surface of the substrate 10 away from the screen 20.

[0064] In this embodiment, a portion of the first portion 41 is used for contact and connection with the conductive layer 30, while another portion of the first portion 41 extends towards the bottom of the substrate to provide mechanical bonding and fixation for the entire flip-chip film 40. For example, the extended first portion 41 is attached to the back side of the substrate 10 via an adhesive layer 50. Various materials can be used for the adhesive layer 50, such as OCA adhesive or double-sided tape; this embodiment does not impose any limitations.

[0065] By extending the first portion 41 of the flip-chip film 40 to the back side of the substrate 10 and bonding it thereto, the bonding area between the flip-chip film 40 and the substrate 10 is increased, improving the peel resistance of the flip-chip film 40 during long-term use or mechanical bending. Furthermore, the flat surface of the substrate 10 makes it easier to ensure bonding quality, preventing edge warping of the flip-chip film 40 or solder joint breakage due to localized stress concentration. In addition, placing a portion of the flip-chip film 40 below the substrate 10 does not occupy additional area, which is beneficial for further narrowing the bezel and achieving a higher screen-to-body ratio.

[0066] Please refer to Figure 7 In one embodiment of the present invention, the flip-chip film 40 further includes a second portion 42. The second portion 42 is located on the side of the first portion 41 away from the conductive adhesive 30 in a direction parallel to the substrate 10, and a second pad 421 is provided on the surface of the second portion 42 near the substrate 10.

[0067] In this embodiment, the end of the flip-chip film 40 away from the first portion 41 further includes a second portion 42, which is used for subsequent bonding of the flexible circuit board 70 and the driver chip 60. A second pad 421 is located on the upper surface of the second portion 42 and is used for electrical interconnection with external components. In some embodiments, the second portion 42 can be located in the display area, thus eliminating the need to reserve sufficient space in the non-display area, which is beneficial for achieving a narrow bezel; in other embodiments, the second portion 42 can also be located in the non-display area. The specific location is set according to the actual situation, and this application does not impose any limitations.

[0068] Please continue to refer to this. Figure 7 The display panel also includes a flexible circuit board 70. The flexible circuit board 70 is disposed on the side of the second part 42 near the substrate 10 (i.e., above the second part 42, located between the second part 42 and the substrate 10), and the edge of the flexible circuit board 70 is provided with a third pad 71, which is electrically connected to the second pad 421.

[0069] In this embodiment, the flexible circuit board 70 is used to connect the display panel to an external motherboard (such as a mobile phone motherboard or control board) and transmit signals from the motherboard to the flip-chip film 40, and then to the driver chip 60 through the internal wiring of the flip-chip film 40. Since the second pad 421 of the flip-chip film 40 is located on the upper surface of the second part 42, the flexible circuit board 70 is positioned on the side of the second part 42 closer to the substrate 10 (i.e., above), so that the third pad 71 on the flexible circuit board 70 is aligned face-to-face with the second pad 421 of the flip-chip film 40. Next, anisotropic conductive adhesive (ACF) or non-conductive adhesive (NCP) is placed between them, and a certain temperature and pressure are applied by a hot press head, so that the conductive particles in the ACF conduct in the vertical direction between the second pad 421 and the third pad 71, thereby achieving electrical connection.

[0070] Please continue to refer to this. Figure 7 The display panel also includes a driver chip 60. The driver chip 60 is disposed on the side of the second portion 42 near the substrate 10 (i.e., above the second portion 42, on the same side as the flexible circuit board 70), and the driver chip 60 is electrically connected to the second portion 42.

[0071] In this embodiment, the driver chip 60 receives display signals from the flexible circuit board 70. After processing such as timing control and source driving, the signals are transmitted to the data lines or scan lines of the screen 20 through the traces and conductive layer 30 inside the flip-chip film 40, thereby driving the display panel to display images. To bond the driver chip 60 to the COF, gold bumps or solder bumps can be pre-prepared on the I / O pads of the driver chip 60, and then inner lead pads are set at corresponding positions on the second part 42 of the flip-chip film 40. Using a high-precision flip-chip bonding machine, the gold bumps of the driver chip 60 are aligned with the inner lead pads on the flip-chip film 40. Then, using thermo-compression bonding or thermo-sonic bonding, appropriate temperature and pressure are applied to form a solid-state diffusion connection between the gold bumps and the gold-plated pads, thereby achieving electrical interconnection and mechanical fixation between the driver chip 60 and the flip-chip film 40.

[0072] In this embodiment of the invention, by setting a second part 42 of the flip-chip film 40 and connecting a flexible circuit board 70 and a driver chip 60 to its upper surface, the flexible circuit board 70 and the driver chip 60 are both located on the back side of the substrate 10, which achieves both a narrow bezel and complete electrical functions.

[0073] Please continue to refer to this. Figure 7 In one embodiment of the present invention, the flip-chip film 40 further includes a third portion 43. The third portion 43 connects the first portion 41 and the second portion 42. In this embodiment of the present invention, the flip-chip film 40 may be composed of multiple portions, for example, the flip-chip film 40 includes a first portion 41, a third portion 43, and a second portion 42 connected in sequence. The first portion 41 is used for electrical connection with the conductive layer 30 and provides attachment support for the entire flip-chip film 40; the second portion 42 is used for bonding the driver chip 60 and connecting the flexible circuit board 70; and the third portion 43 is used to connect the first portion 41 and the second portion 42, so that the flip-chip film 40 can be bent from below the conductive layer 30 (i.e., at the opening 11) to below the substrate 10. With this structure, the flip-chip film 40 has a "Z"-shaped bending shape, thereby making full use of the space on the back side of the substrate 10 while avoiding the risk of trace breakage due to an excessively small bending radius.

[0074] Please continue to refer to this. Figure 7In one embodiment of the present invention, the display panel further includes a protective film 80 and a buffer layer 90. The protective film 80 (BPF) is disposed on the side of the substrate 10 away from the screen 20, and is used to cover and protect the back of the substrate 10, providing functions such as scratch prevention, moisture protection, chemical contamination prevention, and preventing stress concentration at the edges of the openings 11. The buffer layer 90 (SCF) is disposed on the side of the protective film 80 away from the substrate 10. The buffer layer 90 can be a composite material of foam and copper foil, wherein the foam provides buffering and energy absorption, and the copper foil is used to increase structural strength, achieve electromagnetic shielding, and assist in heat dissipation. Based on this, the second portion 42 of the flip-chip film 40 is located on the side of the buffer layer 90 away from the substrate 10, that is, along the direction perpendicular to the substrate 10 downwards, the substrate 10, the protective film 80, the buffer layer 90, and the second portion 42 of the flip-chip film 40 are sequentially stacked.

[0075] In this embodiment, the third portion 43 of the flip-chip film 40 is bent along a direction perpendicular to the second portion 42 (or at least at an angle to the second portion 42), allowing the first portion 41 to adhere to the underside of the substrate 10. Due to this bending path, a first gap 80a exists between the third portion 43 and the protective film 80. The protective film 80 has a certain adhesion tolerance during the attachment process. If the third portion 43 is in direct contact with the protective film 80, the protective film 80 may squeeze or push the third portion 43 during attachment, causing misalignment or stress concentration. Furthermore, direct contact between the protective film 80 and the third portion 43 may cause wear on the insulating layer or traces of the flip-chip film 40 due to friction or vibration during long-term use. Therefore, the first gap 80a provides tolerance space for the adhesion tolerance and avoids the influence of the protective film 80 on the third portion 43.

[0076] Similarly, a second gap 90a exists between the third part 43 and the buffer layer 90. The buffer layer 90 also has adhesion tolerances during attachment, and the foam layer in the buffer layer 90 has a certain degree of compression resilience. If it directly contacts the third part 43, it may exert unstable pressure on the third part 43 during thermal cycling or mechanical impact, affecting the reliability of the electrical connection. By setting the second gap 90a, the edge of the buffer layer 90 can be prevented from directly abutting the third part 43, ensuring that the third part 43 and even the entire flip-chip film 40 maintain a stable shape.

[0077] In some embodiments, since the third portion 43 of the flip-chip film 40 is bent at least at an angle to the second portion 42, the gaps between the third portion 43 and the protective film 80 and / or the buffer layer 90 may be distributed at different locations. For example, when the third portion 43 is bent in a direction perpendicular to the second portion 42, there is a gap (first gap 80a and / or second gap 90) between the third portion 43 and the sidewalls of the protective film 80 and / or the buffer layer 90. As another example, when the third portion 43 is bent at an obtuse angle to the second portion 42, there is a gap not only between the third portion 43 and the sidewalls of the protective film 80 and / or the buffer layer 90, but also between the third portion 43 and a portion of the lower surface of the buffer layer 90. The existence of gaps is considered from the perspective of film tolerance and film reliability, so the location and size of the gap distribution can be determined according to the actual design, and this application does not impose specific limitations.

[0078] Please refer to Figure 8 , Figure 8 This is a schematic diagram of the electrical connection structure of a display panel according to an embodiment of the present invention. This application will use... Figure 8 The electrical connection structure of the display panel is illustrated using an example. Specifically, the PIN terminals of the screen body 20 are directly contacted and electrically connected through the conductive layer 30 filled in the opening 11; the side of the conductive layer 30 facing away from the screen body 20 is electrically connected to the first pad 411 on the first part 41 of the flip-chip film 40; the internal wiring of the flip-chip film 40 leads the signals to the driver chip 60 and the second pad 421 of the second part 42 respectively; the second pad 421 is electrically connected to the third pad 71 on the flexible circuit board 70, thereby realizing signal communication with the external motherboard; the driver chip 60 is bound to the second part 42 of the flip-chip film 40 to complete signal reception and drive output. Thus, a complete electrical connection from the screen body 20 to the external circuit is formed.

[0079] Based on the same inventive concept, the present invention also provides a method for manufacturing a display panel. Please refer to [link / reference]. Figure 9 , Figure 9 This is a flowchart illustrating a method for manufacturing a display panel according to an embodiment of the present invention. Exemplarily, the manufacturing method includes: S100, providing a substrate 10; S200, Prepare a screen 20 on one side of the substrate 10; S300: An opening 11 is made in the substrate 10, so that the opening 11 exposes at least a portion of the screen body 20; S400. A conductive layer 30 is prepared in the opening 11 so that the screen 20 is electrically connected to the conductive layer 30. S500: A flip-chip thin film 40 is prepared on the side of the substrate 10 away from the screen 20, so that the conductive layer 30 is electrically connected to the flip-chip thin film 40.

[0080] In this embodiment, a substrate 10 is used as the support substrate for the display panel. The material of the substrate can be selected from polyimide (PI), polyethylene terephthalate (PET), or other rigid or flexible materials suitable for the manufacture of display panels.

[0081] A screen 20 is fabricated on one side of the substrate 10, with the display surface of the screen 20 located away from the substrate 10 (i.e., the display surface facing upwards). The screen 20 includes a display area AA and a non-display area NAA. The display area is used to set up a pixel array to achieve image display, while the non-display area is typically located around the periphery of the display area and is used to arrange signal traces, drive circuits, or make external connections. The screen 20 has metal traces with pin terminals for electrical connection between the screen 20 and other structures.

[0082] An opening 11 is formed on the substrate 10, and the opening 11 penetrates the substrate 10 along the thickness direction of the substrate 10, thereby exposing at least a portion of the screen body 20 above the substrate 10. The shape of the opening 11 can be circular, elliptical, rectangular, etc., and the embodiments of this application are not limited thereto.

[0083] A conductive layer 30 is fabricated within the opening 11, and the conductive layer 30 is electrically connected to the screen body 20 (i.e., the metal traces on the screen body 20) exposed by the opening 11. In this embodiment, the upper surface of the conductive layer 30 is in direct contact with the PIN terminal of the screen body 20, forming an ohmic contact; the lower surface of the conductive layer 30 is flush with or slightly protrudes from the bottom of the substrate 10, so as to achieve electrical connection with the subsequent flip-chip film 40. The conductive layer 30 has high conductivity and adhesion within the opening 11. A flip-chip film 40 is fabricated on the side of the substrate 10 opposite to the screen body 20, and the flip-chip film 40 is electrically connected to the conductive layer 30, thereby achieving electrical connection between the flip-chip film 40 and the screen body 20.

[0084] In this embodiment of the invention, an opening 11 is formed on the back of the screen 20, and a conductive layer 30 is prepared and filled within the opening 11, so that the upper and lower surfaces of the conductive layer 30 are connected to the screen 20 and the flip-chip film 40, respectively. The conductive layer 30 achieves electrical connection between the flip-chip film 40 and the screen 20 while having a very small breakage, thereby reducing the risk of breakage of the conductive layer 30 due to the breakage and improving the electrical connection reliability of the display panel.

[0085] In one specific embodiment, the conductive layer 30 can be a single-layer conductive structure. That is, fabricating the conductive layer 30 within the opening 11 includes: A first conductive material is coated inside the opening 11, and after curing, a first conductive layer 31 is formed. The first conductive layer 31 is patterned so that the screen 20 is electrically connected to the first conductive layer 31.

[0086] In this embodiment, the first conductive material can be conductive adhesive, which is a composite material that combines conductivity and adhesion. By coating the conductive adhesive inside the opening 11, curing it, and then patterning it, a first conductive layer 31 with multiple first conductive units 311 can be formed. Specifically, conductive adhesive is first coated inside the opening 11 by inkjet printing, dispensing, or screen printing, so that the conductive adhesive fills the entire area of ​​the opening 11 and its upper surface contacts the exposed PIN terminal of the screen 20. Then, the conductive adhesive is cured by heating or ultraviolet irradiation to form a whole conductive body. Next, using a laser patterning process, the whole conductive body is cut into multiple spaced first conductive units 311 along the insulating gap between adjacent PIN terminals, with each first conductive unit 311 corresponding to one PIN terminal of the screen 20. The thickness of the first conductive layer 31 in the direction perpendicular to the substrate 10 is the same as described above and will not be repeated here.

[0087] A single-layer first conductive layer 31 is formed using conductive adhesive, and it is patterned to form multiple independent first conductive units 311. In this embodiment, while achieving small-discontinuity electrical connection of the narrow-bezel display panel, good bonding reliability is also obtained. The simple process improves the connection reliability of the display panel.

[0088] In another specific embodiment, the conductive layer 30 can also be a double-layer conductive structure. That is, fabricating the conductive layer 30 within the opening 11 includes: A second conductive material is coated inside the opening 11, and after curing, a second conductive layer 32 is formed. The second conductive layer 32 is patterned so that the screen 20 is electrically connected to the second conductive layer 32.

[0089] In this process, the preparation process of the second conductive material and the second conductive layer 32 is the same as that of the preparation process of the first conductive material and the first conductive layer 31, and will not be repeated here.

[0090] Furthermore, if the second conductive layer 32 (conductive adhesive layer) formed through the above process is too thin, its lower surface may not be able to fully contact the first pad 411 of the subsequently attached flip-chip film 40, thus affecting the reliability of the electrical connection. Therefore, a third conductive layer 33 needs to be prepared below the second conductive layer 32 to compensate for insufficient thickness and ensure sufficient contact. That is, after preparing the flip-chip film 40 on the side of the substrate 10 away from the screen 20, the process further includes: A third conductive layer 33 is prepared on the side of the second conductive layer 32 away from the screen body 20, so that the second conductive layer 32 and the third conductive layer 33 are electrically connected, and the third conductive layer 33 is electrically connected to the flip-chip film 40.

[0091] In the above embodiment of the double-layer conductive structure, the material of the third conductive layer 33 includes a metal paste, such as silver paste. After the second conductive layer 32 is fabricated and the flip-chip film 40 is attached, silver paste is applied below each second conductive unit 321 in the opening 11. During application, the amount and position of the silver paste are controlled so that each silver paste dot is aligned with the second conductive unit 321 above it. Then, it is cured to form multiple mutually isolated third conductive units 331. The lower surface of each third conductive unit 331 in the third conductive layer 33 is in contact with the first pad 411 on the flip-chip film 40, and the upper surface is in contact with the second conductive unit 321 in the second conductive layer 32.

[0092] By fabricating a double-layer conductive structure, even if the thickness of the second conductive layer 32 is insufficient to directly contact the flip-chip film 40, the third conductive layer 33 can still act as a high-compensation and conductive bridge. Simultaneously, the conductive adhesive (second conductive layer 32) provides strong adhesion, and the metal paste (third conductive layer 33) provides low resistivity; together, they synergistically improve the reliability and electrical performance of the electrical connection. The thicknesses of the second conductive layer 32 and the third conductive layer 33 in the direction perpendicular to the substrate 10 are as described above and will not be repeated here.

[0093] Based on the same inventive concept, the present invention also provides a display device. Please refer to... Figure 10 The display device 300 includes the display panel 200 as described above. The display device can be any device with display function, such as a mobile phone, tablet computer, laptop computer, handheld computer, in-vehicle electronic device, wearable device, ultra-mobile personal computer (UMPC), netbook, or personal digital assistant (PDA), etc. It can also be a non-mobile device such as a personal computer (PC), television (TV), ATM, or self-service machine.

[0094] While the invention has been described herein with reference to specific embodiments, it should be understood that these embodiments are merely examples of the principles and applications of the invention. Therefore, it should be understood that many modifications can be made to the exemplary embodiments, and other arrangements can be designed without departing from the spirit and scope of the invention as defined by the appended claims. It should be understood that different dependent claims and features described herein can be combined in ways different from those described in the original claims. It is also understood that features described in conjunction with individual embodiments can be used in other described embodiments.

Claims

1. A display panel, characterized in that, include: Substrate, wherein the substrate has openings; A screen body is disposed on one side of the substrate; The opening exposes at least a portion of the screen body; A conductive layer is disposed within the opening, and the screen body is electrically connected to the conductive layer; A flip-chip film is disposed on the side of the substrate opposite to the screen body, and the conductive layer is electrically connected to the flip-chip film.

2. The display panel according to claim 1, characterized in that: The flip-chip film includes a first portion, the orthographic projection of the first portion on the substrate at least partially overlapping the orthographic projection of the conductive layer on the substrate; The first portion, which overlaps with the conductive layer in a direction perpendicular to the substrate, has a first pad on the side surface near the substrate.

3. The display panel according to claim 2, characterized in that: The conductive layer includes a first conductive layer, which includes a plurality of spaced first conductive units; the screen is electrically connected to the plurality of first conductive units, and the plurality of first conductive units are electrically connected to the first pad. Preferably, the material of the first conductive layer includes conductive adhesive; Preferably, the thickness of the first conductive layer in the direction perpendicular to the substrate is 1.6 micrometers to 3.3 micrometers.

4. The display panel according to claim 2, characterized in that: The conductive layer includes a second conductive layer and a third conductive layer, the third conductive layer being disposed on the side of the second conductive layer opposite to the screen body; the second conductive layer includes a plurality of spaced second conductive units, and the third conductive layer includes a plurality of spaced third conductive units; The screen is electrically connected to a plurality of second conductive units, the plurality of second conductive units are electrically connected to a plurality of third conductive units in a one-to-one correspondence, and the plurality of third conductive units are electrically connected to the first pad. Preferably, the material of the second conductive layer includes conductive adhesive, and the material of the third conductive layer includes metal paste.

5. The display panel according to claim 3 or 4, characterized in that: The projected area of ​​the first part on the screen is larger than the projected area of ​​the conductive layer on the screen; A portion of the first portion extends to the side of the substrate opposite to the screen body, and a portion of the first portion is attached to the surface of the substrate opposite to the screen body.

6. The display panel according to claim 5, characterized in that: The flip-chip film further includes a second portion, which is located on the side of the first portion away from the conductive adhesive in a direction parallel to the substrate, and the surface of the second portion near the substrate is provided with a second pad. Preferably, the display panel further includes: A driver chip is disposed on the side of the second part close to the substrate, and the driver chip is electrically connected to the second part; A flexible circuit board is disposed on the side of the second portion near the substrate, the flexible circuit board including a third pad, the third pad being electrically connected to the second pad.

7. The display panel according to claim 6, characterized in that, The flip-chip film further includes a third portion, which connects the first portion and the second portion; Preferably, the display panel further includes: A protective film is disposed on the side of the substrate opposite to the screen body; A buffer layer is disposed on the side of the protective film opposite to the substrate; The second portion is located on the side of the buffer layer that faces away from the substrate; Preferably, a first gap exists between the third portion and the protective film; Preferably, the third part has a second gap with the buffer layer.

8. A method for manufacturing a display panel, characterized in that, include: Provide a substrate; A screen is fabricated on one side of the substrate; An opening is made in the substrate so that at least a portion of the screen is exposed; A conductive layer is prepared inside the opening, so that the screen body is electrically connected to the conductive layer; A flip-chip film is prepared on the side of the substrate opposite to the screen body, so that the conductive layer is electrically connected to the flip-chip film.

9. The display panel according to claim 8, characterized in that: The preparation of the conductive layer within the opening includes: A first conductive material is coated inside the opening, and after curing, a first conductive layer is formed. The first conductive layer is patterned so that the screen body is electrically connected to the first conductive layer; Preferably, the process of preparing a conductive layer within the opening includes: A second conductive material is coated inside the opening, and after curing, a second conductive layer is formed. The second conductive layer is patterned to make the screen body electrically connected to the second conductive layer; Preferably, after preparing the flip-chip thin film on the side of the substrate opposite to the screen, the method further includes: A third conductive layer is prepared on the side of the second conductive layer away from the screen body, so that the second conductive layer is electrically connected to the third conductive layer, and the third conductive layer is electrically connected to the flip-chip film; Preferably, both the first conductive material and the second conductive material include conductive adhesive, and the material of the third conductive layer includes metal paste.

10. A display device, characterized in that, It includes the display panel as described in any one of claims 1-7, or the display panel prepared by the method described in any one of claims 8-9.

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