Display device, display device detection method, and electronic device

Abstract

The application discloses a display device, a display device detection method and an electronic device. The display device comprises a display panel, a first pin provided on a binding area of the display panel, a circuit board, a first signal line, a chip, a first pad portion and a second pad portion provided on a third surface of the chip in a direction parallel to the third surface, and a first measurement point and a second measurement point. The first pad portion and the second pad portion are electrically connected to the first signal line, one of the first pad portion and the second pad portion is electrically connected to the first measurement point, the first signal line is electrically connected to the second measurement point, and the first measurement point and the second measurement point are used for measuring any one of impedance, voltage and current. The abnormality of the first measurement point, the second measurement point, and one of the first pad portion and the second pad portion electrically connected to the first measurement point is measured by a detection element such as a multimeter, so that the accurate detection of an abnormal position is realized, the detection efficiency is improved, and maintenance or replacement is facilitated.

Description

Technical Field

[0001] This application belongs to the field of display technology, and in particular relates to a display device, a display device testing method, and an electronic device. Background Technology

[0002] Organic light-emitting diodes (OLEDs) and flat panel displays based on light-emitting diodes (LEDs) are widely used in various consumer electronics products such as mobile phones, televisions, laptops, and desktop computers due to their advantages such as high image quality, energy saving, thin body, and wide range of applications, becoming the mainstream of display panels.

[0003] In the existing technology, due to the limitations of the display device structure and detection methods, it is impossible to accurately determine the location where the display device malfunctions. Summary of the Invention

[0004] This application provides a display device, a display device detection method, and an electronic device. By using a detection element such as a multimeter to measure whether one of the first and second pad portions electrically connected to the first and second test points is abnormal, the abnormal location can be accurately detected, improving detection efficiency and facilitating repair or replacement.

[0005] One embodiment of this application provides a display device, comprising: a display panel, the display panel including a display area and a non-display area adjacent to the display area, the non-display area including a bonding area, and a first pin provided in the bonding area; a circuit board, bonded to the first pin, the circuit board including a first signal line, the circuit board including a first surface and a second surface opposite to each other; a chip disposed on the first surface of the circuit board, the chip including a third surface and a fourth surface opposite to each other, the third surface being disposed close to the first surface relative to the fourth surface, the third surface of the chip having a first pad portion and a second pad portion disposed at intervals along a direction parallel to the third surface, the first pad portion and the second pad portion being electrically connected to the first signal line respectively, one of the first pad portion and the second pad portion being electrically connected to a first measuring point, the first signal line and the second measuring point being electrically connected, the first measuring point and the second measuring point being used to measure any one of impedance, voltage and current.

[0006] According to one aspect of this application, the first pad portion is electrically connected to the first test point via a first connection portion, the first connection portion extending in a direction away from the chip; the first signal line is electrically connected to the first test point via a second connection portion, the second connection portion extending in a direction closer to the first test point.

[0007] According to one aspect of this application, along a direction parallel to the third surface, the chip includes opposing first and second sides, wherein the first measuring point and the second measuring point are both located on the side of the second side away from the first side.

[0008] According to one aspect of this application, the extending direction of the first connecting portion intersects with the extending direction of the second connecting portion.

[0009] According to one aspect of this application, the chip includes a touch chip.

[0010] According to one aspect of this application, the circuit board includes a main body and an extension connected to the main body and extending outward relative to the main body. The main body includes a first portion and a second portion divided by a centerline extending along a first direction. The extension and the second portion are connected. The first signal line is at least partially disposed in the extension. The chip is disposed on the surface of the second portion.

[0011] According to one aspect of this application, both the first measuring point and the second measuring point include conductive protrusions.

[0012] Another aspect of this application provides a display device testing method, comprising the following steps: providing a display device to be tested, wherein the display device is the display device described in any of the above embodiments; using a detection element connected to a first measuring point and a second measuring point to measure whether any one of the impedance, voltage, and current between the first measuring point and the second measuring point is within a predetermined range; if it is within the predetermined range, then one of the first pad portion and the second pad portion electrically connected to the first measuring point is abnormal; if it is not within the predetermined range, then an abnormality occurs inside the chip.

[0013] According to one aspect of this application, the step of connecting a detection element to a first test point and a second test point to measure whether any one of the impedance, voltage, or current between the first test point and the second test point is within a predetermined range, and if it is within the predetermined range, then one of the first pad portion and the second pad portion electrically connected to the first test point is abnormal; if it is not within the predetermined range, then an internal abnormality occurs in the chip, includes: connecting a multimeter to the first test point and the second test point to measure whether any one of the impedance, voltage, or current between the first test point and the second test point is within a predetermined range; if it is within the predetermined range, then one of the first pad portion and the second pad portion electrically connected to the first test point is abnormal; if it is not within the predetermined range, then an internal abnormality occurs in the chip.

[0014] Another aspect of this application provides an electronic device, including the display device in any of the above embodiments.

[0015] Compared with the prior art, the display device provided in this embodiment of the invention includes a display panel, a circuit board, and a chip. The display panels are connected via a first pin to achieve signal control of the display panel. The chip in this embodiment includes two pads, a first pad and a second pad, which are electrically connected to a first signal line. One of the first pad and the second pad can be electrically connected to a first measuring point to measure performance parameters such as impedance, voltage, and current. The other of the first pad and the second pad can transmit signals normally, ensuring the normal operation of the chip. At the same time, the first signal line and the second measuring point are electrically connected, and a detection element such as a multimeter can be used to measure these parameters. The system measures whether an abnormality occurs in one of the first and second pads electrically connected to the first test point, or in the first and second pads. Specifically, after determining that an abnormality has occurred within the chip area, the system measures whether any one of the impedance, voltage, or current between the first and second test points is within a predetermined range. If it is not within the predetermined range, the system determines that an abnormality has occurred in one of the first and second pads electrically connected to the first test point. If it is within the predetermined range, the system determines that one of the first and second pads electrically connected to the first test point is normal, indicating that an abnormality has occurred inside the chip. This allows for accurate detection of the abnormal location, improves detection efficiency, and facilitates repair or replacement. Attached Figure Description

[0016] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the embodiments of this application will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 This is a schematic diagram of the structure of a display device provided in one embodiment of the present invention;

[0018] Figure 2 This is provided by one embodiment of the present invention. Figure 1 Membrane structure diagram at the middle BB region;

[0019] Figure 3 This is provided by one embodiment of the present invention. Figure 1 Diagram of the film structure at the C-C region;

[0020] Figure 4 This is a flowchart of a display device detection method provided in one embodiment of the present invention;

[0021] Figure 5 This is a schematic diagram of the structure obtained during the detection process of the display device detection method provided in the embodiment of the present invention.

[0022] In the attached image:

[0023] 1-Display panel; 2-Circuit board; 21-Main body; 211-First part; 212-Second part; 22-Extension; 3-Chip; C1-First pad part; C2-Second pad part; J1-First measuring point; J2-Second measuring point; T1-First connection part; T2-Second connection part; F1-First surface; F2-Second surface; F3-Third surface; F4-Fourth surface; L-First signal line; AA-Display area; NA-Non-display area; BA-Bonding area; X-First direction. Detailed Implementation

[0024] The features and exemplary embodiments of various aspects of this application will now be described in detail. To make the objectives, technical solutions, and advantages of this application clearer, the application will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only configured to explain this application and are not configured to limit this application. For those skilled in the art, this application can be implemented without some of these specific details. The following description of the embodiments is merely to provide a better understanding of this application by illustrating examples of this application.

[0025] It should be noted that, in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising..." does not exclude the presence of additional identical elements in the process, method, article, or apparatus that includes said element.

[0026] It should be understood that when describing the structure of a component, when referring to a layer or region as being "above" or "on top of" another layer or region, it can mean that it is directly above the other layer or region, or that it contains other layers or regions between it and the other layer or region. Furthermore, if the component is flipped over, that layer or region will be located "below" or "under" the other layer or region.

[0027] Various modifications and variations can be made to this application without departing from its spirit or scope, which will be apparent to those skilled in the art. Therefore, this application is intended to cover modifications and variations falling within the scope of the corresponding claims (the claimed technical solutions) and their equivalents. It should be noted that the embodiments provided in this application can be combined with each other without contradiction.

[0028] This application provides a display device, a display device detection method, and an electronic device, which will be described below in conjunction with the accompanying drawings. Figures 1 to 5 Various embodiments of the display device, the display device testing method, and the electronic device will be described.

[0029] Please see Figures 1 to 3 , Figure 1 This is a schematic diagram of the structure of a display device provided in one embodiment of the present invention; Figure 2 This is provided by one embodiment of the present invention. Figure 1 Membrane structure diagram at the middle BB region; Figure 3 This is provided by one embodiment of the present invention. Figure 1 Diagram of the membrane structure at the C-C junction.

[0030] This application provides a display device, including: a display panel 1, which includes a display area AA and a non-display area NA adjacent to the display area AA, the non-display area NA including a bonding area BA, and a first pin provided in the bonding area BA; a circuit board 2, which is bonded to the first pin, the circuit board 2 including a first signal line L, and the circuit board 2 including a first surface F1 and a second surface F2 opposite to each other; and a chip 3, which is disposed on the first surface F1 of the circuit board 2, the chip 3 including a third surface F3 and a fourth surface F4 opposite to each other, the third surface F3 being disposed close to the first surface F1 relative to the fourth surface F4, the third surface F3 of the chip 3 having a first pad portion C1 and a second pad portion C2 disposed at intervals along a direction parallel to the third surface F3, the first pad portion C1 and the second pad portion C2 being electrically connected to the first signal line L respectively, one of the first pad portion C1 and the second pad portion C2 being electrically connected to a first measuring point J1, the first signal line L being electrically connected to the second measuring point J2, and the first measuring point J1 and the second measuring point J2 being used to measure any one of impedance, voltage, and current.

[0031] The display device provided in this embodiment of the invention includes a display panel 1, a circuit board 2, and a chip 3. The display panel 1 and the display panel 2 are connected by a first pin to realize signal control of the display panel 1. The chip 3 in this embodiment includes two pads, a first pad C1 and a second pad C2, which are electrically connected to a first signal line L. One of the first pad C1 and the second pad C2 can be electrically connected to a first measuring point J1 to realize the measurement of performance parameters such as impedance, voltage, and current. The other of the first pad C1 and the second pad C2 can transmit signals normally to ensure the normal operation of the chip 3. At the same time, the first signal line L and the second measuring point J2 are electrically connected, and the first signal line L can be measured by a detection element such as a multimeter. The system checks whether one of the first pad portion C1 and the second pad portion C2, which are electrically connected to the first pad portion J1, is abnormal. Specifically, after determining that an abnormality has occurred within the area of ​​chip 3, the impedance, voltage, and current between the first pad portion J1 and the second pad portion J2 can be measured to see if they are within a predetermined range. If they are not within the predetermined range, it is determined that one of the first pad portion C1 and the second pad portion C2, which are electrically connected to the first pad portion J1, is abnormal. If they are within the predetermined range, it is determined that one of the first pad portion C1 and the second pad portion C2, which are electrically connected to the first pad portion J1, is normal, that is, an abnormality has occurred inside chip 3. This achieves accurate detection of the abnormal location, improves detection efficiency, and facilitates repair or replacement.

[0032] In existing technology, touch signals enter the touch chip 3 via the traces on circuit board 2 and the pads on the touch chip 3. When detecting touch signals, it can only determine that the abnormality is within the area of ​​touch chip 3, but cannot accurately locate the abnormality inside touch chip 3 or at the pad connection location below touch chip 3. During the touch defect analysis process, there is a situation where the defective location cannot be accurately located, affecting the analysis efficiency and accuracy.

[0033] To address the aforementioned issues, this embodiment of the invention adds a pad below the chip 3, resulting in the chip 3 comprising two pads: a first pad portion C1 and a second pad portion C2, both electrically connected to the first signal line L. One of the first pad portion C1 and the second pad portion C2 can be electrically connected to the first test point J1, and the first signal line L can be electrically connected to the second test point J2. An inspection element, such as a multimeter, can be used to measure whether any abnormality occurs between the first test point J1 and the second test point J2, or between the first pad portion C1 and the second pad portion C2 electrically connected to the first test point J1. This enables accurate detection of abnormal locations, improves detection efficiency, and facilitates repair or replacement.

[0034] The display panel 1 provided in the embodiments of the present invention can be an organic light-emitting diode (OLED) display panel 1, a quantum dot light-emitting diode (QLED) display panel 1, or a micro flat panel display panel 1 (Micro-OLED or Micro-LED), etc.

[0035] Specifically, circuit board 2 can be an FPC circuit board 2. An FPC circuit board 2 (Flexible Printed Circuit) is a printed circuit board 2 with polyimide or polyester film as the substrate. It can also be called a flexible circuit board 2, flexographic circuit board 2, or soft board. It features high reliability and excellent flexibility. The characteristics of FPC circuit board 2 include light weight, thinness, high wiring density, and good bending performance, capable of withstanding millions of dynamic bends without damaging the conductors.

[0036] Alternatively, the circuit board 2 can also be COF (Chip On Film), which is a chip-on-film packaging technology that fixes integrated circuits (ICs) on a flexible circuit board. The flexible additional circuit board 2 is used as a carrier for packaging chip 3 to combine chip 3 with flexible substrate circuit.

[0037] It should be noted that chip 3 can be used to transmit voltage signals related to display to display panel 1, or other signals, such as touch signals. Optionally, chip 3 includes a touch chip for transmitting touch signals to display panel 1 to realize the touch function of display panel 1.

[0038] Please see Figure 1 In some optional embodiments, the first pad portion C1 is electrically connected to the first test point J1 through the first connection portion T1, and the first connection portion T1 extends in a direction away from the chip 3; the first signal line L is electrically connected to the first test point J1 through the second connection portion T2, and the second connection portion T2 extends in a direction closer to the first test point J1.

[0039] It is understandable that, since the first measuring point J1 and the second measuring point J2 need to be connected to external detection elements, in order to avoid interference with the chip 3, the first connecting part T1 can be used to move the first measuring point J1 a certain distance away from the chip 3 to avoid affecting the chip 3. At the same time, since it is necessary to measure the impedance, voltage and current between the first measuring point J1 and the second measuring point J2, the second connecting part T2 can be used to make the second measuring point J2 closer to the first measuring point J1 for easier measurement. The first connecting part T1 and the second connecting part T2 can be in the form of wires, silver paste, etc., without any special limitations.

[0040] In some alternative embodiments, along a direction parallel to the third surface F3, the chip 3 includes opposing first and second sides, with the first measuring point J1 and the second measuring point J2 both located on the side of the second side away from the first side.

[0041] It is understood that in this embodiment, the first measuring point J1 and the second measuring point J2 are both located on the same side of the chip 3 to reduce the distance between them. This facilitates the simultaneous connection of the detection element to both the first measuring point J1 and the second measuring point J2, making it easier to detect parameters such as impedance, voltage, and current between them, thus reducing detection difficulty and improving detection efficiency. As shown in the figure, the first side and the second side can specifically be the left and right sides of the chip 3. The first measuring point J1 and the second measuring point J2 are both located on the side of the second side away from the first side, close to the edge of the circuit board 2, to facilitate connection with external detection elements.

[0042] Please see Figure 1 In some optional embodiments, the extension direction of the first connecting part T1 intersects the extension direction of the second connecting part T2, so that the second connecting part T2 can extend towards the first measuring point J1, ensuring that the distance between the first measuring point J1 and the second measuring point J2 is small enough.

[0043] Please see Figure 1 In some optional embodiments, the circuit board 2 includes a main body 21 and an extension 22 connected to the main body 21 and extending outward relative to the main body 21. The main body 21 includes a first portion 211 and a second portion 212 divided by a centerline extending along a first direction X. The extension 22 and the second portion 212 are connected. A first signal line L is at least partially disposed on the extension 22. The chip 3 is disposed on the surface of the second portion 212.

[0044] It should be noted that in this embodiment, the first part 211 and the second part 212 are a connected whole. Dividing the main body 21 into the first part 211 and the second part 212 by a midline extending along the first direction X is only for the convenience of explaining the position of the extension part 22 and the chip 3 later, and does not mean that the main body 21 is cut apart. Optionally, the main body 21 has a rectangular structure, and the first part 211 and the second part 212 correspond to the left and right regions of the main body 21, respectively. In this embodiment, the first signal line L is at least partially provided in the extension part 22, that is, the first signal line L can extend from the extension part 22 to be electrically connected to the chip 3.

[0045] Optionally, the extension direction of the first signal line L is the same as the extension direction of the extension portion 22, so as to facilitate the layout of the first signal line L.

[0046] In this embodiment, the first signal line L and the chip 3 are both disposed corresponding to the second part 212 of the main body 21, that is, the first signal line L and the chip 3 are both disposed close to the edge of the second part 212, so as to facilitate connection with external detection elements.

[0047] In some optional embodiments, both the first measuring point J1 and the second measuring point J2 include conductive protrusions, which may include metals such as copper and silver. The first measuring point J1 and the second measuring point J2 may adopt a structure similar to solder joints or pins, or the first measuring point J1 and the second measuring point J2 may adopt the form of conductive holes. As long as it is convenient to connect to external detection elements and facilitates detection, there are no special limitations.

[0048] Please see Figure 4 The present invention also provides a display device detection method, comprising the following steps:

[0049] S110: Provide a display device to be tested, wherein the display device is any of the display devices described in the above embodiments. Please refer to [link to relevant documentation]. Figures 1 to 3 .

[0050] S120: A detection element is connected to the first test point J1 and the second test point J2 to measure whether any one of the impedance, voltage, or current between the first test point J1 and the second test point J2 is within a predetermined range. If it is within the predetermined range, an abnormality occurs in either the first pad portion C1 or the second pad portion C2, which is electrically connected to the first test point J1. If it is not within the predetermined range, an abnormality occurs inside the chip 3. Figure 5 As shown.

[0051] In the display device testing method provided in this embodiment of the invention, the chip 3 includes two pads, a first pad C1 and a second pad C2, which are electrically connected to the first signal line L. One of the first pads C1 and the second pad C2 can be electrically connected to a first measuring point J1 to measure performance parameters such as impedance, voltage, and current. The other pad can transmit signals normally, ensuring the normal operation of the chip 3. Simultaneously, the first signal line L and the second measuring point J2 are electrically connected, and the first pad connected to the first measuring point J1 can be measured using a testing element such as a multimeter. To determine whether one of the pad C1 and the second pad C2 is abnormal, specifically, after determining that an abnormality has occurred within the area of ​​chip 3, the impedance, voltage, and current between the first test point J1 and the second test point J2 can be measured to see if any one of them is within a predetermined range. If it is not within the predetermined range, it is determined that one of the first pad C1 and the second pad C2 electrically connected to the first test point J1 is abnormal. If it is within the predetermined range, it is determined that one of the first pad C1 and the second pad C2 electrically connected to the first test point J1 is normal, that is, an abnormality has occurred inside chip 3. This achieves accurate detection of the abnormal location, improves detection efficiency, and facilitates repair or replacement.

[0052] In step S110, the display device to be detected may refer to a display device that has been determined by signal detection to be within the area of ​​the touch chip 3, but whose abnormal position cannot yet be accurately located inside the chip 3 or at the pad connection position below the chip 3. Specifically, the display device includes: a display panel 1, which includes a display area AA and a non-display area NA adjacent to the display area AA. The non-display area NA includes a bonding area BA, and a first pin is provided in the bonding area BA; a circuit board 2, which is bonded to the first pin, and includes a first signal line L. The circuit board 2 includes a first surface F1 and a second surface F2 opposite to each other; and a chip 3, which is disposed on the first surface F1 of the circuit board 2. The chip 3 includes a third surface F3 and a fourth surface F4 opposite to each other. The third surface F3 is disposed close to the first surface F1 relative to the fourth surface F4. The third surface F3 of the chip 3 has a first pad portion C1 and a second pad portion C2 disposed at intervals along a direction parallel to the third surface F3. The first pad portion C1 and the second pad portion C2 are electrically connected to the first signal line L, and one of the first pad portion C1 and the second pad portion C2 is electrically connected to a first measuring point J1. The first signal line L and the second measuring point J2 are electrically connected. The first measuring point J1 and the second measuring point J2 are used to measure any one of impedance, voltage, and current.

[0053] To address the aforementioned issues, this embodiment of the invention adds a pad below the chip 3, resulting in the chip 3 comprising two pads: a first pad portion C1 and a second pad portion C2, both electrically connected to the first signal line L. One of the first pad portion C1 and the second pad portion C2 can be electrically connected to the first test point J1, and the first signal line L can be electrically connected to the second test point J2. This facilitates subsequent measurement using a detection element such as a multimeter to determine whether any abnormality occurs between the first test point J1 and the second test point J2, or between the first pad portion C1 and the second pad portion C2 electrically connected to the first test point J1. This enables accurate detection of abnormal locations, improves detection efficiency, and facilitates repair or replacement.

[0054] The circuit board 2 can specifically be an FPC circuit board 2. An FPC circuit board 2 (Flexible Printed Circuit) is a printed circuit board 2 with polyimide or polyester film as the substrate. It can also be called a flexible circuit board 2, a flexible circuit board 2, a soft board, etc.

[0055] In step S120, a detection element can be connected to the first measuring point J1 and the second measuring point J2 to measure any one of the impedance, voltage, or current between the first measuring point J1 and the second measuring point J2. For example, when the impedance is detected by the detection element, if the detected impedance is too small or too large, it means that the detected impedance is not within the predetermined range, and one of the first pad portion C1 and the second pad portion C2 electrically connected to the first measuring point J1 is abnormal.

[0056] It should be noted that chip 3 can be used to transmit voltage signals related to display to display panel 1, or other signals, such as touch signals. Optionally, chip 3 includes touch chip 3 for transmitting touch signals to display panel 1 to realize the touch function of display panel 1.

[0057] In some optional embodiments, the first pad portion C1 is electrically connected to the first test point J1 through the first connection portion T1, and the first connection portion T1 extends in a direction away from the chip 3; the first signal line L is electrically connected to the first test point J1 through the second connection portion T2, and the second connection portion T2 extends in a direction closer to the first test point J1.

[0058] It is understandable that, since the first measuring point J1 and the second measuring point J2 need to be connected to external detection elements, in order to avoid interference with the chip 3, the first connecting part T1 can be used to move the first measuring point J1 a certain distance away from the chip 3 to avoid affecting the chip 3. At the same time, since it is necessary to measure the impedance, voltage and current between the first measuring point J1 and the second measuring point J2, the second connecting part T2 can be used to make the second measuring point J2 closer to the first measuring point J1 for easier measurement. The first connecting part T1 and the second connecting part T2 can be in the form of wires, silver paste, etc., without any special limitations.

[0059] In some alternative embodiments, the circuit board 2 includes a main body 21 and an extension 22 connected to the main body 21 and extending outward relative to the main body 21. The main body 21 includes a first portion 211 and a second portion 212 divided by a centerline extending along a first direction X. The extension 22 and the second portion 212 are connected. A first signal line L is at least partially disposed in the extension 22. The chip 3 is disposed on the surface of the second portion 212.

[0060] It should be noted that in this embodiment, the first part 211 and the second part 212 are a connected whole. Dividing the main body 21 into the first part 211 and the second part 212 by a midline extending along the first direction X is only for the convenience of explaining the position of the extension part 22 and the chip 3 later, and does not mean that the main body 21 is cut apart. Optionally, the main body 21 has a rectangular structure, and the first part 211 and the second part 212 correspond to the left and right regions of the main body 21, respectively. In this embodiment, the first signal line L is at least partially provided in the extension part 22, that is, the first signal line L can extend from the extension part 22 to be electrically connected to the chip 3.

[0061] Optionally, the extension direction of the first signal line L is the same as the extension direction of the extension portion 22, so as to facilitate the layout of the first signal line L.

[0062] In this embodiment, the first signal line L and the chip 3 are both disposed corresponding to the second part 212 of the main body 21, that is, the first signal line L and the chip 3 are both disposed close to the edge of the second part 212, so as to facilitate connection with external detection elements.

[0063] In some optional embodiments, the step of using a detection element connected to the first measurement point J1 and the second measurement point J2 to measure whether any one of the impedance, voltage, or current between the first measurement point J1 and the second measurement point J2 is within a predetermined range, and if it is within the predetermined range, then one of the first pad portion C1 and the second pad portion C2 electrically connected to the first measurement point J1 is abnormal; if it is not within the predetermined range, then an abnormality occurs inside the chip 3, includes:

[0064] A multimeter is connected to the first test point J1 and the second test point J2 to measure whether any of the impedance, voltage, or current between the first test point J1 and the second test point J2 is within a predetermined range. If it is within the predetermined range, then one of the first pad portion C1 and the second pad portion C2, which is electrically connected to the first test point J1, is abnormal. If it is not within the predetermined range, then an abnormality occurs inside the chip 3.

[0065] It should be noted that a multimeter (also known as a multi-purpose meter, multi-meter, or three-way meter) is an indispensable measuring tool in the field of power electronics. Its core functions include measuring DC / AC voltage, current, and resistance. Some models can also detect capacitance, inductance, semiconductor parameters (such as β value), and audio levels. Its name "multi-purpose" reflects its multifunctional nature, integrating the functions of a voltmeter, ammeter, and ohmmeter. Therefore, in this embodiment, a multimeter can be used to accurately measure any one of the impedance, voltage, or current between the first measuring point J1 and the second measuring point J2.

[0066] Of course, in addition to a multimeter, other tools that can measure impedance, voltage, and current can also be used. For example, a resistance tester can be used to measure the impedance between the first measuring point J1 and the second measuring point J2. Resistance testers are instruments specifically used to measure resistance, and there are many types, including grounding resistance testers, insulation resistance testers, and DC resistance testers.

[0067] This invention also provides an electronic device, including the display device in any of the above embodiments.

[0068] Optionally, the display device provided in the embodiments of the present invention may include a substrate, a light-emitting functional layer, and other film layers.

[0069] Optionally, the substrate may include a substrate and an array layer, the array layer including a driving circuit. For example, the array layer may include a first conductive layer, a second conductive layer, and a third conductive layer disposed on one side of the substrate and stacked thereon. An insulating layer is disposed between adjacent conductive film layers. Exemplarily, the pixel driving circuit disposed on the array layer includes a transistor and a storage capacitor. The transistor includes an active layer, a gate, a source, and a drain. The materials of the source and gate may include one or more combinations of molybdenum, titanium, aluminum, copper, etc. The gate of the transistor is typically used to receive a control signal, causing the transistor to turn on or off under the control of the control signal. One of the source and drain of the thin-film transistor is connected to the light-emitting unit to control the normal light emission of the light-emitting unit.

[0070] The substrate can be a rigid substrate, such as a glass substrate, or a flexible substrate, made of materials such as polyimide, polystyrene, polyethylene terephthalate, poly(p-xylene), polyethersulfone, or polyethylene naphthalate. The substrate is mainly used to support the devices mounted on it.

[0071] The storage capacitor includes a first plate and a second plate. As an example, the gate and the first plate may be located on a first conductive layer, the second plate may be located on a second conductive layer, and the source and drain may be located on a third conductive layer.

[0072] Optionally, the display panel may also include a light-emitting functional layer and an encapsulation layer disposed on the side of the array layer away from the substrate, wherein at least one film layer in the light-emitting functional layer and the encapsulation layer may be formed using IJP (Inkjet printing) technology.

[0073] Inkjet printing is a non-contact, micron-level printing process that can be achieved by directly jetting nanoscale solutions onto flexible or rigid substrates. Specifically, inkjet printing involves dissolving OLED materials in a solvent to form a solution, which is then ejected from a printhead in extremely small volumes (picoliters). Each tiny ink droplet is precisely printed onto the pixel electrode, and after drying, it forms the film layer of the device.

[0074] Optionally, the light-emitting functional layer includes a first electrode layer, a light-emitting layer, and a second electrode layer stacked along the direction away from the substrate.

[0075] Optionally, the light-emitting layer includes one or more of the following: an electron injection layer, an electron transport layer, a light-emitting material layer, a hole blocking layer, an electron blocking layer, a hole transport layer, and a hole injection layer. The specific selection depends on the type of light-emitting layer and is not particularly limited. The electron injection layer, electron transport layer, and hole blocking layer can be disposed between the second electrode layer and the light-emitting material layer. The electron blocking layer, hole transport layer, and hole injection layer can be disposed between the first electrode layer and the light-emitting material layer.

[0076] The material of the first electrode layer is generally a material with a high work function to improve hole injection efficiency. It can be gold (Au), platinum (Pt), titanium (Ti), silver (Ag), indium tin oxide (ITO), zinc tin oxide (IZO), or a transparent conductive polymer (such as polyaniline). For example, the first electrode layer can be made of an ITO-Ag-ITO composite material, without any particular limitation.

[0077] The material of the second electrode layer can be one of the following metals: silver (Ag), aluminum (Al), lithium (Li), magnesium (Mg), ytterbium (Yb), calcium (Ca), or indium (In). It can also be an alloy of the aforementioned metals, such as magnesium-silver alloy (Mg / Ag) or lithium-aluminum alloy (Li / Al). This embodiment does not limit the material in this regard.

[0078] Optionally, the encapsulation layer includes a first encapsulation layer, the material of which includes an inorganic material. Specifically, the inorganic material can be silicon nitride, silicon oxide, or silicon oxynitride, and can be formed using a CVD (Chemical Vapor Deposition) process.

[0079] Chemical vapor deposition (CVD) refers to the process of introducing vapors of gaseous or liquid reactants containing elements constituting the thin film, along with other gases required for the reaction, into a reaction chamber to generate a thin film through a chemical reaction on the substrate surface.

[0080] The films formed by chemical vapor deposition are dense and uniform, with strong adhesion between the film and the substrate. The film composition is easy to control, the deposition rate is fast, and the film quality is very stable.

[0081] Optionally, the encapsulation layer also includes a second encapsulation layer located on the side of the first encapsulation layer opposite to the substrate. The material of the second encapsulation layer includes an organic material. The organic material can be made of resin or polymeric organic material, and can be formed using IJP (Inkjet printing) technology.

[0082] Optionally, the encapsulation layer may also include a third encapsulation layer located on the side of the second encapsulation layer away from the substrate. The material of the third encapsulation layer includes inorganic materials. Adding an inorganic encapsulation layer outside the organic encapsulation layer can further improve the encapsulation effect of the encapsulation layer. In this embodiment, the material of the third encapsulation layer may be the same as or different from the material of the first encapsulation layer, and there is no special limitation.

[0083] Optionally, the materials of the first encapsulation layer and the third encapsulation layer are the same, so that the first encapsulation layer and the third encapsulation layer can be manufactured using the same equipment, which can simplify the manufacturing process of the display panel.

[0084] Optionally, the display panel further includes a pixel definition layer disposed on one side of the substrate, the pixel definition layer having pixel openings; the first electrode layer is at least partially disposed within the pixel openings.

[0085] In this embodiment, a pixel definition layer is disposed on the substrate including a pixel opening, and a light-emitting functional layer can be disposed within the pixel opening to realize the light-emitting display of the display panel.

[0086] Optionally, multiple pixel openings are spaced apart, and each pixel opening contains a light-emitting functional layer.

[0087] Optionally, a planarization layer may be included between the substrate and the pixel definition layer. The planarization layer may be made of hexamethyl dimethyl ether, epoxy resin, or polyimide, or other materials. This embodiment does not limit the application of this material.

[0088] Optionally, the display panel may also include a polarizer, a transparent adhesive layer, or other film layers disposed on the side of the array layer away from the substrate.

[0089] A polarizer, also known as a beam polarizer, is a key component that controls the polarization direction of a specific light beam. Polarizers are made of various composite materials, primarily including PVA film, TAC film, protective film, release film, and pressure-sensitive adhesive. Among these, the PVA film is the core material, responsible for polarization. It achieves its polarization function by forming ordered arrangements of iodine molecules through stretching and dyeing processes. The TAC film accounts for the highest cost, approximately 50%, while the PVA film accounts for about 12%.

[0090] The transparent adhesive layer can be made of OCA (Optically Clear Adhesive). OCA adhesive uses optical acrylic glue as a base material, and then a release film is laminated on the top and bottom layers to obtain a double-sided adhesive tape without a substrate. OCA adhesive layers have uniform thickness, high flatness, high adhesion, and strong bonding strength after lamination. Of course, other materials can also be used for the transparent adhesive layer, such as double-sided tape.

[0091] The electronic devices in this application include mobile phones, personal digital assistants (PDAs), tablet computers, e-book readers, televisions, access control systems, smart landline phones, control consoles, and other devices with display functions.

[0092] The above are merely specific embodiments of this application. Those skilled in the art will clearly understand that, for the sake of convenience and brevity, the specific working processes of the systems, modules, and units described above can be referred to the corresponding processes in the foregoing method embodiments, and will not be repeated here. It should be understood that the protection scope of this application is not limited thereto. Any person skilled in the art can easily conceive of various equivalent modifications or substitutions within the technical scope disclosed in this application, and these modifications or substitutions should all be covered within the protection scope of this application.

[0093] It should also be noted that the exemplary embodiments mentioned in this application describe methods or systems based on a series of steps or apparatus. However, this application is not limited to the order of the above steps; that is, the steps can be performed in the order mentioned in the embodiments, or in a different order, or several steps can be performed simultaneously.

Claims

1. A display device, characterized in that, include: The display panel includes a display area and a non-display area adjacent to the display area. The non-display area includes a bonding area, and a first pin is provided in the bonding area. A circuit board, which is bonded to the first pin, the circuit board includes a first signal line, and the circuit board includes opposing first and second surfaces; A chip is disposed on the first surface of the circuit board. The chip includes a third surface and a fourth surface opposite to each other. The third surface is disposed close to the first surface relative to the fourth surface. The third surface of the chip has a first pad portion and a second pad portion disposed at intervals along a direction parallel to the third surface. The first pad portion and the second pad portion are respectively electrically connected to a first signal line. One of the first pad portion and the second pad portion is electrically connected to a first measurement point. The first signal line and the second measurement point are electrically connected. The first measurement point and the second measurement point are used to measure any one of impedance, voltage, and current.

2. The display device according to claim 1, characterized in that, The first pad portion is electrically connected to the first test point via a first connecting portion, and the first connecting portion extends in a direction away from the chip; The first signal line is electrically connected to the first measuring point through the second connecting part, and the second connecting part extends in a direction closer to the first measuring point.

3. The display device according to claim 1, characterized in that, Along a direction parallel to the third surface, the chip includes a first side and a second side opposite to each other, with the first measuring point and the second measuring point both located on the side of the second side away from the first side.

4. The display device according to claim 2, characterized in that, The extending direction of the first connecting part intersects with the extending direction of the second connecting part.

5. The display device according to claim 1, characterized in that, The chip includes a touch chip.

6. The display device according to claim 1, characterized in that, The circuit board includes a main body and an extension connected to the main body and extending outward relative to the main body. The main body includes a first portion and a second portion divided by a center line extending along a first direction. The extension and the second portion are connected. The first signal line is at least partially disposed in the extension. The chip is disposed on the surface of the second part.

7. The display device according to claim 1, characterized in that, Both the first measuring point and the second measuring point include conductive protrusions.

8. A method for detecting a display device, characterized in that, Includes the following steps: A display device to be tested is provided, wherein the display device is the display device according to any one of claims 1 to 6; The detection element is connected to the first and second test points to measure whether any one of the impedance, voltage, or current between the first and second test points is within a predetermined range. If it is within the predetermined range, an abnormality occurs in either the first pad portion or the second pad portion electrically connected to the first test point. If it is not within the predetermined range, an abnormality occurs inside the chip.

9. The display device detection method according to claim 8, characterized in that, The step of using a detection element connected to a first and second measuring point to measure whether any one of the impedance, voltage, or current between the first and second measuring points is within a predetermined range, and if it is within the predetermined range, then one of the first and second pad portions electrically connected to the first measuring point is abnormal; if it is not within the predetermined range, then an internal abnormality of the chip is detected, includes: A multimeter is connected to the first and second test points to measure whether any one of the impedance, voltage, or current between the first and second test points is within a predetermined range. If it is within the predetermined range, then one of the first and second pads electrically connected to the first test point is abnormal. If it is not within the predetermined range, then an abnormality has occurred inside the chip.

10. An electronic device, characterized in that, Includes the display device according to any one of claims 1 to 7.

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