A customized test device and test method for DIMM products under high and low temperature environments

Abstract

The application discloses a kind of high-low temperature environment under the customization test equipment and test method of DIMM product, belong to memory test technical field, including bottom plate, bottom plate is slidably connected in test cabinet by one side rail, bottom top is equipped with equipment box, bottom plate top array is equipped in multiple test slots, further include: overturning heat dissipation part, by positioning mechanism rotation is connected in equipment box one side rotating groove, the position of overturning heat dissipation part top corresponding test slot is equipped with heat dissipation groove, the front end of positioning mechanism is used to limit the moving stroke after the rotation of overturning heat dissipation part, and heat dissipation fan is installed in heat dissipation groove front end.In the application, by fitting driving mechanism drive multiple groups of heat dissipation plate directly closely fit in the outside of DIMM product, contact heat exchange greatly improves heat conduction efficiency, realizes to DIMM product working temperature instant pull high or rapid cooling, enhances the immediacy of temperature regulation.

Description

Technical Field

[0001] This invention belongs to the field of memory testing technology, and in particular relates to a customized testing device and testing method for DIMM products under high and low temperature environments. Background Technology

[0002] As a core storage component in modern computer and server systems, the stability and reliability of dual in-line memory modules (DIMMs) in extreme working environments (especially alternating high and low temperature environments) are directly related to the operational safety of the entire system. Before DIMM products leave the factory, they must undergo rigorous customized high and low temperature environment testing.

[0003] Existing high and low temperature testing equipment for DIMM products mainly relies on the overall temperature control of the internal space of the constant temperature test cabinet, or on adjusting the air temperature in the test environment through traditional blower equipment. In practical applications, the overall environmental heating and cooling method relying on air convection has low heat conduction efficiency, resulting in long ramp-up and cooling times for the test environment to reach the target set temperature. This cannot meet the customized testing needs with stringent requirements for temperature change rate. Modern high-performance DIMM memory devices are usually equipped with metal heat dissipation armor. Traditional external hot and cold air direct blowing methods cannot directly penetrate the armor to accurately intervene in the temperature of the internal storage chips, resulting in weak control over the device's own heat dissipation efficiency. Test data often contains lag errors, indicating room for improvement. Summary of the Invention

[0004] The purpose of this invention is to address the problem of weak control over the heat dissipation efficiency of the equipment itself and the frequent existence of lag errors in test data, and to propose a customized testing device and testing method for DIMM products under high and low temperature environments.

[0005] To achieve the above objectives, the present invention adopts the following technical solution:

[0006] A customized testing device for DIMM products under high and low temperature environments includes a base plate, which is slidably connected to a testing cabinet via a side rail. An equipment box is located on the top of the base plate, and multiple testing slots are arrayed on the top of the base plate. The device also includes:

[0007] The flip-up heat dissipation unit is rotatably connected to a rotating slot on one side of the equipment box via a positioning mechanism. A heat dissipation slot is provided on the top of the flip-up heat dissipation unit corresponding to the position of the test slot. The positioning mechanism is used to limit the movement of the flip-up heat dissipation unit after rotation. A cooling fan is installed at the front end of the heat dissipation slot.

[0008] The heat dissipation mechanism consists of multiple heat dissipation mechanisms located in corresponding heat dissipation slots. The temperature of the test environment is regulated by the contact between the heat dissipation mechanism and the component under test in the test slot.

[0009] The bonding drive mechanism includes multiple guide blocks, which are located at both ends of adjacent heat dissipation mechanisms. The contact between the heat dissipation mechanism and the component under test is controlled by the guide blocks.

[0010] A guiding mechanism is located on one side of the fitting drive mechanism. The guiding mechanism controls the guide blocks on both sides to drive the heat dissipation mechanism synchronously.

[0011] As a further description of the above technical solution:

[0012] The heat dissipation mechanism includes:

[0013] Multiple heat sinks are respectively located on both sides of the corresponding test slots, and multiple guide blocks are located between the corresponding test slots on both sides. The heat sinks are in contact with the heat sinks through the guide blocks so that the heat sinks can fully contact the component under test.

[0014] Heat-conducting fins, multiple heat-conducting fin arrays are arranged on both sides of the top of the heat sink, and heat dissipation gaps are formed between adjacent heat-conducting fins;

[0015] Heat exchange fins, with multiple heat exchange fins inserted into the heat dissipation gaps between multiple heat-conducting fins;

[0016] A guide frame is connected to the top of the flip-up heat dissipation unit. The guide frame has a sliding groove. Slider blocks are connected to both sides of the heat dissipation plate at positions corresponding to the sliding groove. The sliders are slidably connected to the sliding groove to limit the movement and offset of the heat dissipation plate.

[0017] As a further description of the above technical solution:

[0018] The bonding drive mechanism further includes:

[0019] A control block is integrally connected to one side of the guide block. A connecting plate connects multiple control blocks. A fixing plate is connected to one side of the connecting plate. A telescopic control part is connected to one side of the fixing plate. The telescopic control part is connected to the internal groove of the flip-up heat dissipation part.

[0020] The extension rod extends through a slot in the heat dissipation cavity to the side of another connecting plate, and controls the movement of the adjacent control block through the telescopic control unit.

[0021] As a further description of the above technical solution:

[0022] The guide block has a conical cross-sectional shape, and the heat dissipation plate at the corresponding position is pressed by the inclined surfaces on both sides of the guide block.

[0023] As a further description of the above technical solution:

[0024] The guiding mechanism includes:

[0025] A guide rack and a drive rack, wherein the guide rack and the drive rack are respectively connected to one side of a connecting plate at corresponding positions;

[0026] The driven gear meshes between the adjacent guide rack and drive rack. The top of the driven gear is connected to the bottom of the guide frame via a mounting plate. The drive rack of the driven gear pulls the control block on the opposite side to move by the movement of the drive gear on one side.

[0027] As a further description of the above technical solution:

[0028] The positioning mechanism includes:

[0029] Positioning slots, two positioning slots are connected to the corresponding rotating slots of the equipment box;

[0030] The bushing is slidably connected in the positioning groove, and a shaft is rotatably connected inside the bushing, with the shaft connected to one side of the hinge.

[0031] A guide rod is connected to the top of the bushing and is slidably connected to the guide hole opened in the inner cavity of the positioning groove. A first spring is sleeved on the outside of the guide rod, and the two ends of the first spring are respectively connected to the bushing and the corresponding position on one side of the inner cavity of the positioning groove.

[0032] As a further description of the above technical solution:

[0033] Also includes:

[0034] Positioning sleeves, two positioning sleeves are respectively connected to both sides of the equipment box;

[0035] Positioning posts, two positioning posts are connected to the top two sides of the base plate. After the heat dissipation part is flipped, the positioning sleeve is inserted into the positioning post so that the heat dissipation mechanism fully fits the component to be tested.

[0036] As a further description of the above technical solution:

[0037] The positioning sleeve has an L-shaped cross-section, and the positioning post has a slot into which the positioning sleeve slides.

[0038] As a further description of the above technical solution:

[0039] It also includes a guide rail, which is connected to one side of the base plate and can be slid into an external cabinet with slide rails.

[0040] As a further description of the above technical solution:

[0041] A customized testing method for DIMM products under high and low temperature environments, specifically including the following steps:

[0042] S1: Insertion of the component under test and installation of the equipment in the cabinet. Insert multiple DIMM components under test into the test slots arrayed on the top of the base plate in groups. Slide the base plate containing the components under test into the test cabinet via the bottom rail. Blindly connect the high-density interface strip on the back of the equipment box with the communication and power supply interface inside the cabinet to establish the test communication link and power supply circuit.

[0043] S2: Flip-close and anti-interference vertical drop. The operation flips the heat dissipation unit downward with the positioning mechanism in the rotating slot of the equipment box as the axis. At the end of the flip stroke, the shafts on both sides of the flip heat dissipation unit drive the bushings to slide vertically downward in the positioning slot against the elastic force of the first spring. Using this vertical drop stroke, multiple sets of heat dissipation plates in the heat dissipation slot are vertically sleeved on the outside of the component to be tested, avoiding the scratching interference of the flip arc trajectory on the top of the component to be tested. The positioning sleeves on both sides of the equipment box are locked into the positioning post on the top of the base plate to complete the rigid locking of the test space.

[0044] S3: Lateral synchronous drive and contact clamping. Activate the telescopic control unit inside the equipment box to extend its movable end and push the fixed plate and connecting plate to move linearly. During the movement, the drive rack on one side of the connecting plate drives the driven gear to rotate. The driven gear moves the guide rack on the opposite side, realizing the synchronous reverse translation of the control blocks and conical guide blocks on both sides. The guide blocks moving on both sides synchronously press the adjacent heat sink through their inclined surfaces, causing the heat sink to slide inward along the groove in the guide frame until it is completely and evenly attached to both sides of the corresponding DIMM component to be tested, forming a direct contact heat conduction path.

[0045] S4: Customized control and performance testing in high and low temperature environments. The high-frequency test motherboard in the equipment box sends test commands to the component under test through the test slot and reads the running data. At the same time, the data acquisition and processing gateway obtains the surface temperature of the component under test and the ambient temperature in real time.

[0046] When performing rapid low-temperature or constant-temperature tests, the ambient temperature control microprocessor controls the cooling fan at the front of the flip-up heat sink to operate at high frequency. The heat emitted by the component under test is conducted to the heat conduction fins and heat exchange fins through the tightly fitted heat sink plate, and then quickly carried away by the cold air introduced by the cooling fan to prevent heat accumulation.

[0047] During rapid high-temperature testing, the ambient temperature control microprocessor activates the heating wire located at the front of the air intake and works with the cooling fan to blow high-temperature airflow into the heat exchange fins. The heat is then conducted in reverse through the heat sink to the component under test, achieving rapid heating of the DIMM's working environment.

[0048] S5: Flexible and rapid separation and environmental reset. When a single test is completed or the natural heating characteristics of the component need to be tested without intervention, the telescopic control part retracts and resets. At this time, the inclined extrusion pressure of the guide block is removed, and the elastic flexible part connected between the two heat sinks uses its own elastic restoring force to quickly pull the two heat sinks back to their original positions, so that the heat sinks are physically separated from the component under test, and the cooling fan and heating wire are cut off. The component under test can then be tested in an independent environment for the next stage of testing or be prepared for removal.

[0049] In summary, due to the adoption of the above technical solution, the beneficial effects of the present invention are:

[0050] 1. In this invention, multiple heat sinks are driven to be directly and tightly attached to the outside of the DIMM product by a bonding drive mechanism. The contact heat exchange greatly improves the heat conduction efficiency, realizes the instantaneous increase or rapid cooling of the DIMM product's operating temperature, and enhances the immediacy of temperature regulation.

[0051] 2. In this invention, by setting up a driving mechanism and a bonding driving mechanism, the linear motion is smoothly converted into the lateral clamping motion of the heat sink by utilizing the inclined extrusion action of the conical guide block. This ensures that the forces on both sides of the same group or even multiple groups of DIMMs are uniform and tightly bonded, thus guaranteeing the stability and high consistency of batch test data.

[0052] 3. In this invention, the positioning mechanism is designed with a bushing sliding in the positioning groove and a spring. When the heat dissipation part is closed by flipping, the component is allowed to rotate and generate a vertical downward displacement. This avoids the scraping interference between the heat dissipation component and the top of the DIMM that may be caused by direct flipping, and ensures the precise fit of vertical assembly.

[0053] 4. In this invention, the bottom layer of the equipment is designed with slide rails and a base plate, which can be directly slid into the test cabinet, and the test slots are arranged in a grouped array to simulate the high-density insertion effect in a real server environment, thereby improving the efficiency of large-scale industrial testing. Attached Figure Description

[0054] Figure 1 This is a schematic diagram of the overall structure of a customized testing device for DIMM products under high and low temperature environments proposed in this invention.

[0055] Figure 2 The present invention proposes Figure 1 Enlarged structural diagram of part A in the middle;

[0056] Figure 3 This is a schematic diagram of the overall structure of a customized testing device for DIMM products under high and low temperature environments proposed in this invention, in its unfolded state.

[0057] Figure 4This is a top view of a customized testing device for DIMM products under high and low temperature environments proposed in this invention.

[0058] Figure 5 This is a partially disassembled structural diagram of a customized testing device for DIMM products under high and low temperature environments proposed in this invention.

[0059] Figure 6 This is a schematic diagram of the assembly structure of the guide mechanism of a customized testing equipment for DIMM products under high and low temperature environments proposed in this invention.

[0060] Figure 7 This is a top view of the guiding mechanism of a customized testing device for DIMM products under high and low temperature environments proposed in this invention.

[0061] Figure 8 The present invention proposes Figure 7 Enlarged structural diagram of section B;

[0062] Figure 9 This is a schematic diagram of the heat sink structure of a customized testing device for DIMM products under high and low temperature environments proposed in this invention.

[0063] Figure 10 This is a schematic diagram of the heat exchange fin structure of a customized testing device for DIMM products under high and low temperature environments proposed in this invention.

[0064] Legend:

[0065] 1. Base plate; 2. Equipment box; 3. Flip-top heat dissipation unit;

[0066] 4. Positioning mechanism; 401. Positioning groove; 402. Guide rod; 403. First spring; 404. Bushing; 405. Hinge;

[0067] 5. Fitting drive mechanism; 501. Control block; 502. Guide block; 503. Connecting plate; 504. Fixing plate;

[0068] 6. Heat dissipation mechanism; 601. Heat sink; 602. Heat conduction fins; 603. Heat exchange fins; 604. Guide frame;

[0069] 7. Guiding mechanism; 701. Guiding rack; 702. Driven gear; 703. Drive rack; 704. Extension rod;

[0070] 8. Telescopic control unit;

[0071] 9. Protective shell; 10. Cooling fan; 11. Positioning sleeve; 12. Positioning post; 13. Guide rail; 14. Test slot. Detailed Implementation

[0072] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0073] Please see Figures 1-10 This invention provides a technical solution: a customized testing device for DIMM products under high and low temperature environments, including a base plate 1, which is slidably connected to a testing cabinet via a track on one side. An equipment box 2 is located on the top of the base plate 1, and multiple testing slots 14 are arrayed on the top of the base plate 1. The device also includes:

[0074] The flip-up heat dissipation part 3 is rotatably connected to the rotating groove on one side of the equipment box 2 via the positioning mechanism 4. A heat dissipation groove is provided on the top of the flip-up heat dissipation part 3 corresponding to the position of the test slot 14. The positioning mechanism 4 is used to limit the movement stroke of the flip-up heat dissipation part 3 after rotation. A cooling fan 10 is installed at the front end of the heat dissipation groove.

[0075] In another embodiment, the top of the base plate 1 has pressure strips connected to both sides of the multiple test slots 14 via bolts. The test slots 14 can be replaced by opening the pressure strips, and the bottom terminals of the test slots 14 are in contact with the terminals embedded in the base plate 1 via the pressure strips.

[0076] Among them, the top of the flip-up heat dissipation part 3 is provided with a protective shell 9 corresponding to the heat dissipation groove, and the front side of the protective shell 9 has an air inlet.

[0077] Heat dissipation mechanism 6, multiple heat dissipation mechanisms 6 are set in heat dissipation slots at corresponding positions, and the test environment temperature is regulated by the contact between the heat dissipation mechanism 6 and the component under test in the test slot 14.

[0078] The bonding drive mechanism 5 includes multiple guide blocks 502, which are located at both ends of adjacent heat dissipation mechanisms 6. The contact between the heat dissipation mechanism 6 and the component under test is controlled by the guide blocks 502.

[0079] The guide mechanism 7 is located on one side of the drive mechanism 5. The guide mechanism 7 controls the guide blocks 502 on both sides to drive the heat dissipation mechanism 6 synchronously.

[0080] It should be noted that the equipment box 2 is equipped with existing conventional test components for supporting the operation and communication of DIMM products. Specifically, these components may include a high-frequency test motherboard, a programmable power supply module, a data acquisition and communication gateway, and a temperature control microprocessor. These components are existing technologies known in the art and are mainly used to provide an electrical communication basis for the test slot 14 on the base plate 1, and to provide basic power and control signals for the heat dissipation mechanism 6 and the bonding drive mechanism 5. Their specific internal circuits and control programs are not the core innovative protected object of this invention, so they will not be described in detail here.

[0081] In one embodiment, multiple test slots 14 are grouped and arranged on the top of the base plate 1, such as a test group with eight test slots 14 arranged in the middle of the figure, and a test group with four slots arranged on each side. The combination of test slots 14 simulates the device combination insertion effect.

[0082] Please see Figure 5 and Figures 9-10 The heat dissipation mechanism 6 includes:

[0083] Heat sink 601, multiple heat sinks 601 are respectively disposed on both sides of the corresponding test slot 14, and multiple guide blocks 502 are disposed between the corresponding test slots 14 on both sides. The guide blocks 502 contact the heat sink 601 so that the heat sink 601 fully contacts the component under test.

[0084] Heat-conducting fins 602, an array of multiple heat-conducting fins 602 are arranged on both sides of the top of the heat sink 601, and heat dissipation gaps are formed between adjacent heat-conducting fins 602.

[0085] Heat exchange fins 603, multiple heat exchange fins 603 are disposed in the heat dissipation gap between multiple heat conduction fins 602;

[0086] The guide frame 604 is connected to the top of the flip-up heat dissipation part 3. The guide frame 604 has a sliding groove. Sliders are connected to both sides of the heat dissipation plate 601 at the positions corresponding to the sliding groove. The sliders are slidably connected to the sliding groove to limit the movement and offset of the heat dissipation plate 601.

[0087] Specifically: Through the designed heat dissipation mechanism 6, the heat dissipation plate 601 can maintain a stable and close fit to the component under test after contacting it. After absorbing heat, it can conduct heat to the top heat-conducting fins 602 through the heat dissipation plate 601. The heat-conducting fins 602 can introduce heat into the heat exchange fins 603. The array arrangement of the heat-conducting fins 602 and the heat exchange fins 603 increases the contact range with the heat dissipation air introduced by the cooling fan 10, which is beneficial to improving the heat dissipation effect.

[0088] Meanwhile, the adjacent nested heat-conducting fins 602 and heat-exchange fins 603 can form a lateral limiting gap to prevent the heat sink 601 from shifting when it moves partially, thus improving assembly stability.

[0089] In another embodiment, if high temperature testing is required, a corresponding heating wire can be installed on the front side of the air intake of the heat sink corresponding to the heat sink fan 10, so as to quickly heat up the test environment and adjust the customized test stability and adaptability under high and low temperature environments.

[0090] Please see Figures 7-8 The bonding drive mechanism 5 also includes:

[0091] Control block 501 is integrally connected to one side of guide block 502. A connecting plate 503 is connected between multiple control blocks 501. A fixing plate 504 is connected to one side of the connecting plate 503. A telescopic control part 8 is connected to one side of the fixing plate 504. The telescopic control part 8 is connected to the internal groove of the flip heat dissipation part 3.

[0092] The extension rod 704 extends through the through slot opened in the heat dissipation groove to the side of another connecting plate 503, and controls the movement of the adjacent control block 501 through the telescopic control unit 8.

[0093] Among them, the guide block 502 located at the edge position can be a half-side guide block 502, so as to achieve contact between the inclined surface and the heat sink 601 at the edge position;

[0094] The cross-sectional shape of the guide block 502 is conical, and the heat sink 601 at the corresponding position is pressed by the inclined surfaces on both sides of the guide block 502;

[0095] Specifically: Through the designed fitting mechanism, when the movable end of the telescopic control part 8 extends, it can push the fixed plate 504 to drive the connecting plate 503 to move. The movement of the connecting plate 503 can drive the control block 501 to move synchronously through multiple guide blocks 502. The movement of the control block 501 can squeeze the adjacent heat sink 601 through the inclined surface. After the adjacent heat sinks 601 on both sides move, they can fully fit the component under test. At this time, the cooling fan 10 at the end of the flipping heat sink 3 can increase air convection to quickly dissipate the heat generated by the component under test, which is beneficial to maintaining test stability.

[0096] Furthermore, through the designed extension rod 704, the control blocks 501 of multiple adjacent corresponding heat dissipation mechanisms 6 can be extended synchronously at the movable end of the telescopic control section 8 to maintain the synchronous control effect.

[0097] In one embodiment, an elastic flexible part is also included, which is connected between the heat sinks 601 on both sides of the corresponding guide block 502;

[0098] Specifically: When it is necessary to control the test environment temperature, the guide block 502 can be reset by controlling the movable end of the telescopic control part 8 to reset. At this time, the flexible part located between the adjacent heat sink 601 can pull the heat sink 601 to reset and separate it from the component under test. After the cooling fan 10 stops working, the ambient temperature of the component under test can rise. Thus, the temperature of the component under test can be quickly regulated by the controllable heat sink 601. Compared with traditional air cooling, contact heat exchange can provide faster temperature control efficiency and improve the test effect of the control environment.

[0099] Please see Figure 7 The guiding organizations 7 include:

[0100] Guide rack 701 and drive rack 703 are respectively connected to one side of the connecting plate 503 at the corresponding position;

[0101] Driven gear 702 meshes between adjacent guide rack 701 and drive rack 703. The top of driven gear 702 is connected to the bottom of guide frame 604 through mounting plate. The drive rack 703 driven by driven gear 702 pulls the control block 501 on the opposite side to move by moving the drive gear on one side.

[0102] Specifically: Through the designed guide mechanism 7, when the connecting plate 503 moves, it can drive the driven gear 702 through the drive rack 703. The driven gear 702 can drive the guide rack 701 on the other side. The guide rack 701 can drive the guide block 502 on the other side through the connecting plate 503 to push the heat sink 601 on the opposite side, which is beneficial to improve the synchronous drive control effect of the multiple heat sinks 601 in the array.

[0103] Please see Figures 1-2 The positioning mechanism 4 includes:

[0104] Positioning slots 401, two positioning slots 401 are connected to the corresponding rotating slots of the equipment box 2;

[0105] The bushing 404 is slidably connected in the positioning groove 401, and a shaft is rotatably connected inside the bushing 404, which is connected to one side of the hinge part 405.

[0106] The guide rod 402 is connected to the top of the bushing 404. The guide rod 402 is slidably connected to the guide hole opened in the inner cavity of the positioning groove 401. A first spring 403 is sleeved on the outside of the guide rod 402. The two ends of the first spring 403 are respectively connected to the bushing 404 and the corresponding position on one side of the inner cavity of the positioning groove 401.

[0107] Specifically: After the rotating heat dissipation part 3 is rotated by the positioning mechanism 4, it can slide in the positioning groove 401 through the bushing 404. After the bushing 404 rotates, it can descend vertically in the positioning groove 401. After descending, the rotating heat dissipation part 3 can vertically downward to contact and exchange heat with the component under test, avoiding direct rotation that would cause the heat dissipation mechanism 6 to interfere with the component under test.

[0108] The bushing 404 can slide in the positioning groove 401 via the guide rod 402. The bushing 404 can pull the external first spring 403. The first spring 403 can absorb the offset sway with its own elasticity, which is conducive to maintaining the vertical assembly fit effect.

[0109] Also includes:

[0110] Positioning sleeve 11, two positioning sleeves 11 are respectively connected to both sides of the equipment box 2;

[0111] Positioning posts 12, two positioning posts 12 are connected to the top two sides of the base plate 1. After the heat dissipation part 3 is flipped, the positioning sleeve 11 is inserted into the positioning post 12 so that the heat dissipation mechanism 6 fully fits the component to be tested.

[0112] Specifically: Through the designed positioning sleeve 11 and positioning post 12, the flip heat dissipation part 3 can be stably engaged with the positioning post 12 by the front positioning sleeve 11, so as to maintain the heat dissipation mechanism 6 and the component under test in full fit.

[0113] It also includes a guide rail 13, which is connected to one side of the base plate 1. The guide rail 13 can slide into the corresponding cabinet to realize large-scale control of the test and control the corresponding heat dissipation environment through the external heat dissipation of the cabinet.

[0114] In another embodiment, a customized testing method for DIMM products under high and low temperature environments is also included, specifically comprising the following steps:

[0115] S1: Inserting the component under test and putting the equipment into the cabinet, inserting multiple DIMM components under test into the test slots 14 of the top array of the base plate 1 in groups, sliding the base plate 1 loaded with the components under test into the test cabinet via the bottom rail, and blindly connecting the high-density interface strip on the back of the equipment box 2 with the communication and power supply interface inside the cabinet to establish a test communication link and power supply circuit.

[0116] S2: Flip-close and anti-interference vertical drop. The operation of the flip-down heat dissipation part 3 is to flip downward with the positioning mechanism 4 in the rotating groove of the equipment box 2 as the axis. At the end of the flip stroke, the shafts on both sides of the flip-down heat dissipation part 3 drive the bushing 404 to slide vertically downward in the positioning groove 401 against the elastic force of the first spring 403. Using this vertical drop stroke, the multiple sets of heat dissipation plates 601 in the heat dissipation groove are vertically sleeved on the outside of the component to be tested, avoiding the scratching interference of the flip arc trajectory on the top of the component to be tested. The positioning sleeves 11 on both sides of the equipment box 2 are inserted into the positioning post 12 on the top of the base plate 1 to complete the rigid locking of the test space.

[0117] S3: Lateral synchronous drive and contact clamping, activate the telescopic control unit 8 in the equipment box 2, extend its movable end to push the fixed plate 504 and the connecting plate 503 to move linearly. During the movement, the drive rack 703 on one side of the connecting plate 503 drives the driven gear 702 to rotate. The driven gear 702 moves the guide rack 701 on the opposite side, realizing the synchronous reverse translation of the control blocks 501 and the conical guide block 502 on both sides. The guide blocks 502 on both sides move synchronously press the adjacent heat sink 601 through their inclined surfaces, so that the heat sink 601 slides inward along the groove in the guide frame 604 until it is completely and evenly attached to the two sides of the corresponding DIMM test component, forming a direct contact heat conduction path.

[0118] S4: Customized control and performance testing in high and low temperature environments. The high-frequency test motherboard in the equipment box 2 sends test commands to the component under test and reads the running data through the test slot 14. At the same time, the data acquisition and processing gateway obtains the surface temperature of the component under test and the ambient temperature in real time.

[0119] When performing rapid low-temperature or constant-temperature tests, the ambient temperature control microprocessor controls the cooling fan 10 at the front end of the flip-down heat dissipation section 3 to operate at high frequency. The heat emitted by the component under test is conducted through the tightly attached heat dissipation plate 601 to the heat conduction fins 602 and heat exchange fins 603, and then quickly carried away by the cold air introduced by the cooling fan 10 to prevent heat accumulation.

[0120] During rapid high-temperature testing, the ambient temperature control microprocessor activates the heating wire located at the front of the air intake and works with the cooling fan 10 to blow high-temperature airflow into the heat exchange fins 603. The heat is then conducted in reverse through the heat sink 601 to the component under test, achieving rapid heating of the DIMM working environment.

[0121] S5: Flexible rapid separation and environmental reset. When a single-round test ends or the natural heating characteristics of the component need to be tested without intervention, the telescopic control part 8 retracts and resets. At this time, the inclined extrusion pressure of the guide block 502 is removed, and the elastic flexible part connected between the two heat sinks 601 uses its own elastic restoring force to quickly pull the two heat sinks 601 back to their original positions, so that the heat sink 601 is physically separated from the component under test, and the cooling fan 10 and the heating wire are cut off. The component under test can then be tested in an independent environment for the next stage of testing or be prepared for removal.

[0122] In this invention, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance; the term "multiple" refers to two or more unless otherwise explicitly defined. The terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; "linking" can be a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0123] The above description is only a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technical solution and inventive concept of the present invention, should be covered within the scope of protection of the present invention.

Claims

1. A customized testing device for DIMM products under high and low temperature environments, comprising a base plate (1), the base plate (1) being slidably connected to a testing cabinet via a track on one side, an equipment box (2) being provided on the top of the base plate (1), and multiple testing slots (14) being arrayed on the top of the base plate (1), characterized in that, Also includes: The flip-up heat dissipation part (3) is rotatably connected to the rotating groove on one side of the equipment box (2) through the positioning mechanism (4). The top of the flip-up heat dissipation part (3) is provided with a heat dissipation groove corresponding to the position of the test slot (14). The positioning mechanism (4) is used to limit the movement stroke of the flip-up heat dissipation part (3) after rotation. A heat dissipation fan (10) is installed at the front end of the heat dissipation groove. Heat dissipation mechanism (6), multiple heat dissipation mechanisms (6) are set in the heat dissipation slots at corresponding positions, and the test environment temperature is adjusted by the contact between the heat dissipation mechanism (6) and the component under test in the test slot (14); The bonding drive mechanism (5) includes multiple guide blocks (502), which are located at both ends of adjacent heat dissipation mechanisms (6). The contact between the heat dissipation mechanism (6) and the component to be tested is controlled by the guide blocks (502). The guide mechanism (7) is located on one side of the bonding drive mechanism (5). The guide mechanism (7) controls the guide blocks (502) on both sides to drive the heat dissipation mechanism (6) synchronously.

2. The customized testing equipment for DIMM products under high and low temperature environments according to claim 1, characterized in that, The heat dissipation mechanism (6) includes: Heat sink (601), multiple heat sinks (601) are respectively located on both sides of the corresponding test slot (14), and multiple guide blocks (502) are located between the corresponding test slots (14) on both sides. The heat sink (601) is in contact with the heat sink (601) through the guide blocks (502) so that the heat sink (601) can fully contact the component under test. Heat-conducting fins (602) are arranged in an array on both sides of the top of the heat sink (601), and heat dissipation gaps are formed between adjacent heat-conducting fins (602). Heat exchange fins (603), multiple heat exchange fins (603) are inserted into the heat dissipation gap between multiple heat-conducting fins (602); The guide frame (604) is connected to the top of the flip-up heat dissipation part (3). The guide frame (604) has a groove. The heat dissipation plate (601) is connected to sliders on both sides of the groove. The sliders are connected to the groove to limit the movement and offset of the heat dissipation plate (601).

3. The customized testing equipment for DIMM products under high and low temperature environments according to claim 1, characterized in that, The bonding drive mechanism (5) further includes: A control block (501) is integrally connected to one side of the guide block (502). A connecting plate (503) is connected between multiple control blocks (501). A fixing plate (504) is connected to one side of the connecting plate (503). A telescopic control part (8) is connected to one side of the fixing plate (504). The telescopic control part (8) is connected to the inner groove of the flip heat dissipation part (3). The extension rod (704) extends through the through slot opened in the heat dissipation groove to the side of another connecting plate (503), and controls the movement of the adjacent control block (501) through the telescopic control unit (8).

4. The customized testing equipment for DIMM products under high and low temperature environments according to claim 1, characterized in that, The guide block (502) has a conical cross-sectional shape, and the heat sink (601) at the corresponding position is pressed by the inclined surfaces on both sides of the guide block (502).

5. The customized testing equipment for DIMM products under high and low temperature environments according to claim 1, characterized in that, The guiding mechanism (7) includes: Guide rack (701) and drive rack (703), the guide rack (701) and drive rack (703) are respectively connected to one side of the connecting plate (503) at the corresponding position; Driven gear (702) meshes between adjacent guide rack (701) and drive rack (703). The top of driven gear (702) is connected to the bottom of guide frame (604) via mounting plate. The drive rack (703) driven by driven gear (702) moves by moving the drive gear on one side, causing the control block (501) on the opposite side to move.

6. The customized testing equipment for DIMM products under high and low temperature environments according to claim 1, characterized in that, The positioning mechanism (4) includes: Positioning slots (401), two positioning slots (401) are connected to the corresponding rotating slots of the equipment box (2); The bushing (404) is slidably connected in the positioning groove (401), and the bushing (404) is rotatably connected to the shaft body, which is connected to one side of the hinge (405). A guide rod (402) is connected to the top of the bushing (404). The guide rod (402) is slidably connected to the guide hole opened in the inner cavity of the positioning groove (401). A first spring (403) is sleeved on the outside of the guide rod (402). The two ends of the first spring (403) are respectively connected to the bushing (404) and the corresponding position of the inner cavity of the positioning groove (401).

7. The customized testing equipment for DIMM products under high and low temperature environments according to claim 1, characterized in that, Also includes: Positioning sleeves (11), two positioning sleeves (11) are respectively connected to both sides of the equipment box (2); Positioning posts (12) are connected to the top two sides of the base plate (1). After the heat dissipation part (3) is flipped, the positioning sleeve (11) is inserted into the positioning post (12) so that the heat dissipation mechanism (6) fully fits the component to be tested.

8. The customized testing equipment for DIMM products under high and low temperature environments according to claim 1, characterized in that, The positioning sleeve (11) has an L-shaped cross-section, and the positioning post (12) has a slot into which the positioning sleeve (11) slides.

9. A customized testing device for DIMM products under high and low temperature environments according to claim 1, characterized in that, It also includes a guide rail (13), which is connected to one side of the base plate (1) and can slide into an external cabinet with a slide rail.

10. A customized testing method for DIMM products under high and low temperature environments, applied to the customized testing equipment for DIMM products under high and low temperature environments as described in any one of claims 1-9, characterized in that, Specifically, the following steps are included: S1: Insert the component under test and put the equipment into the cabinet. Insert multiple DIMM components under test into the test slots (14) of the top array of the base plate (1) in groups. Push the base plate (1) loaded with the component under test into the test cabinet through the bottom rail. Make the high-density interface strip on the back of the equipment box (2) blindly connect with the communication and power supply interface inside the cabinet to establish the test communication link and power supply circuit. S2: Flip-close and anti-interference vertical drop, operate the flip-down heat dissipation part (3) to flip down with the positioning mechanism (4) in the rotating groove of the equipment box (2) as the axis. At the end of the flip stroke, the shafts on both sides of the flip-down heat dissipation part (3) drive the bushing (404) to slide vertically downward in the positioning groove (401) against the elastic force of the first spring (403). Using this vertical drop stroke, the multiple heat dissipation plates (601) in the heat dissipation groove are vertically sleeved on the outside of the component to be tested, avoiding the scratching interference of the flip arc trajectory on the top of the component to be tested. The positioning sleeves (11) on both sides of the equipment box (2) are inserted into the positioning post (12) on the top of the bottom plate (1) to complete the rigid locking of the test space. S3: Lateral synchronous drive and contact clamping, start the telescopic control part (8) in the equipment box (2) to extend its movable end to push the fixed plate (504) and the connecting plate (503) to move linearly. During the movement, the drive rack (703) on one side of the connecting plate (503) drives the driven gear (702) to rotate. The driven gear (702) pushes the guide rack (701) on the opposite side to realize the synchronous reverse translation of the control blocks (501) and the conical guide block (502) on both sides. The guide blocks (502) on both sides move synchronously squeeze the adjacent heat sink (601) through their inclined surfaces, so that the heat sink (601) slides inward along the groove in the guide frame (604) until it is completely and evenly attached to the two sides of the corresponding DIMM test component, forming a direct contact heat conduction path. S4: Customized control and performance testing of high and low temperature environments. The high frequency test motherboard in the equipment box (2) sends test instructions to the component under test and reads the running data through the test slot (14). At the same time, the data acquisition and processing gateway obtains the surface temperature and ambient temperature of the component under test in real time. When performing rapid low temperature or constant temperature tests, the ambient temperature control microprocessor controls the cooling fan (10) at the front end of the flip heat dissipation unit (3) to operate at high frequency. The heat emitted by the component under test is conducted through the tightly attached heat dissipation plate (601) to the heat conduction fins (602) and heat exchange fins (603), and then quickly carried away by the cold air introduced by the cooling fan (10) to prevent heat accumulation. When performing rapid high-temperature testing, the ambient temperature control microprocessor activates the heating wire located on the front side of the air intake and works with the heat sink (10) to blow high-temperature airflow into the heat exchange fins (603). The heat is conducted in reverse through the heat sink (601) to the component under test, thereby achieving rapid heating of the DIMM working environment. S5: Flexible rapid separation and environmental reset. When the single-round test ends or the natural heating characteristics of the component need to be tested in an uninterrupted state, the telescopic control part (8) is retracted and reset. At this time, the inclined extrusion force of the guide block (502) is removed. The elastic flexible part connected between the two heat sinks (601) uses its own elastic recovery force to quickly pull the two heat sinks (601) back to their original positions, so that the heat sink (601) is physically separated from the component under test, and the heat sink fan (10) and the heating wire are cut off. The component under test can then be tested in an independent environment for the next stage of testing or be prepared for removal.

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