Multilayer capacitor

Abstract

The application provides a laminated capacitor, which comprises a shell, a laminated element and a sealing cover. The shell is cuboid, has a containing space and is provided with an opening communicating with the containing space; the laminated element comprises a cathode substrate and an anode substrate which are arranged in layers; the anode substrate is rectangular and at least one corner is smooth and free curve; the laminated element is arranged in the containing space; and the sealing cover covers the opening. Therefore, the technical scheme of the application improves the reliability of the laminated capacitor.

Description

Technical Field

[0001] This application relates to the field of capacitors, specifically to a stacked capacitor. Background Technology

[0002] With the development of intelligent industries, new requirements have emerged for multilayer capacitors. For example, for AI servers, the computing power demand varies throughout the day, potentially leading to surges in demand and voltage spikes. The increased size of AI servers and their increased computing power demands also necessitate higher capacitance and voltage withstand capabilities for multilayer capacitors. Under high voltage, multilayer capacitors are prone to discharge, causing breakdown between the substrates and damaging the capacitors, thus compromising their reliability. Summary of the Invention

[0003] The purpose of this application is to improve the reliability of multilayer capacitors.

[0004] To address the aforementioned problems, this application provides a multilayer capacitor, comprising a housing, multilayer elements, and a sealing cap; the housing is rectangular in shape, forming an accommodating space, and has an opening communicating with the accommodating space; the multilayer element comprises a cathode substrate and an anode substrate stacked together; the anode substrate is rectangular, and at least one corner is a smooth free curve; the multilayer element is disposed within the accommodating space; and the sealing cap covers the opening.

[0005] Based on the above technical solution, the corners of the anode substrate are smooth free curves, thus eliminating bends and sharp points. This prevents charge accumulation, which could lead to excessively high local electric field strength and cause tip discharge. Furthermore, when the anode substrate is oxidized, the oxide layer can be formed uniformly, preventing weak points at the bends and ensuring that the oxide layer does not break down at the corners, thereby improving the reliability of the multilayer capacitor. Attached Figure Description

[0006] To more clearly illustrate the technical solutions in this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are merely some embodiments of this application. Those skilled in the art can obtain other drawings based on these drawings without any creative effort.

[0007] Figure 1 This is a schematic diagram of the anode substrate of a first embodiment of a capacitor cell provided in this application. Figure 2 This is a schematic diagram of the cathode substrate structure of a first embodiment of a capacitor cell provided in this application. Figure 3This is a schematic diagram of the structure of a first embodiment of a capacitor cell provided in this application. Figure 4 A schematic diagram of the structure of the stacked element formed in the second embodiment of the capacitor cell provided in this application; Figure 5 This is an exploded structural diagram of a first embodiment of the stacked capacitor provided in this application. Figure 6 For this application Figure 5 A top view of the first embodiment of the stacked capacitor; Figure 7 For this application Figure 5 The first embodiment of the stacked capacitor in Figure 6 Schematic diagram of the cross-sectional structure in the AA direction; Figure 8 A first-view perspective structural diagram of the first embodiment of the housing provided in this application; Figure 9 A second-view perspective structural diagram of the first embodiment of the housing provided in this application; Figure 10 A top-view structural diagram of the first embodiment of the housing provided in this application; Figure 11 The first embodiment of the housing provided for the embodiments of this application is in Figure 10 Schematic diagram of the cross-sectional structure in the DD direction; Figure 12 The first embodiment of the housing provided for the embodiments of this application is in Figure 11 A magnified structural diagram of section E in the middle; Figure 13 A top-view structural diagram of the second embodiment of the housing provided in this application; Figure 14 This is a schematic diagram of the anode substrate of a third embodiment of a capacitor cell provided in this application. Figure 15 This is a schematic diagram of the anode substrate of the fourth embodiment of the capacitor cell provided in this application. Figure 16 A schematic diagram of the anode substrate of the fifth embodiment of the capacitor cell provided in this application; Figure 17 A schematic diagram of the cathode substrate of the sixth embodiment of the capacitor cell provided in this application; Figure 18 This is a schematic diagram of the assembly structure of a second embodiment of the stacked capacitor provided in this application. Figure 19A three-dimensional structural diagram of the first embodiment of the sealing cap provided in this application; Figure 20 A top view structural diagram of the first embodiment of the sealing cap provided in this application; Figure 21 The first embodiment of the sealing cap provided in this application is in Figure 20 Schematic diagram of the cross-sectional structure in the GG direction; Figure 22 The second embodiment of the sealing cap provided in this application is in Figure 20 Schematic diagram of the cross-sectional structure in the GG direction; Figure 23 The second embodiment of the sealing cap provided in this application is in Figure 22 A magnified structural diagram of section H in the middle; Figure 24 This is an exploded structural diagram of the first embodiment of the sealing cap provided in this application. Figure 25 The first embodiment of the multilayer capacitor provided in this application is in Figure 7 A magnified structural diagram of section C; Figure 26 The third embodiment of the multilayer capacitor provided in this application is in Figure 6 Schematic diagram of the cross-sectional structure in the AA direction; Figure 27 The third embodiment of the multilayer capacitor provided in this application is in Figure 26 A magnified structural diagram of section I; Figure 28 The fourth embodiment of the stacked capacitor provided in this application is in Figure 6 Schematic diagram of the cross-sectional structure in the AA direction; Figure 29 The fourth embodiment of the capacitor provided in this application is in Figure 28 A magnified structural diagram of section J in the middle; Figure 30 This is a schematic diagram of the structure of a first embodiment of the wound capacitor provided in this application. Figure 31 A top view structural diagram of the third embodiment of the sealing cap provided in this application; Figure 32 A top-view structural schematic diagram of the fifth embodiment of the stacked capacitor provided in this application; Figure 33 The fifth embodiment of the multilayer capacitor provided in this application is in Figure 32 A schematic diagram of the cross-sectional structure along the N-axis; Figure 34The fourth embodiment of the sealing cap provided in this application is in Figure 20 Schematic diagram of the cross-sectional structure in the GG direction; Figure 35 The fifth embodiment of the sealing cap provided in this application is in Figure 20 Schematic diagram of the cross-sectional structure in the GG direction; Figure 36 The fifth embodiment of the sealing cap provided in this application is in Figure 35 A magnified structural diagram of the R section in the middle; Figure 37 The sixth embodiment of the sealing cap provided in this application is in Figure 35 A magnified structural diagram of the R section in the middle; Figure 38 The seventh embodiment of the sealing cap provided in this application is in Figure 35 A magnified structural diagram of the R section in the middle; Figure 39 The eighth embodiment of the sealing cap provided in this application is in Figure 35 A magnified structural diagram of the R section in the middle; Figure 40 The ninth embodiment of the sealing cap provided in this application is in Figure 35 A magnified structural diagram of the R section in the middle; Figure 41 This is a schematic diagram of the structure of the injection-molded part of the first embodiment of the sealing cap provided in this application. Figure 42 The tenth embodiment of the sealing cap provided in this application is in Figure 31 Schematic diagram of the cross-sectional structure in the KK direction; Figure 43 A stereoscopic structural diagram of a first embodiment of the stacked elements provided in this application; Figure 44 A schematic diagram of the frontal view structure of the first embodiment of the stacked elements provided in this application; Figure 45 A top-view structural diagram of a second embodiment of the stacked elements provided in this application; Figure 46 The second embodiment of the stacked elements provided in this application is in Figure 45 Schematic diagram of the cross-sectional structure in the TT direction; Figure 47 The third embodiment of the stacked elements provided in this application is in Figure 45 Schematic diagram of the cross-sectional structure in the TT direction; Figure 48 The fourth embodiment of the stacked elements provided in this application is in Figure 45Schematic diagram of the cross-sectional structure in the TT direction; Figure 49 The fifth embodiment of the stacked elements provided in this application is in Figure 45 Schematic diagram of the cross-sectional structure in the TT direction; Figure 50 The sixth embodiment of the stacked elements provided in this application Figure 45 Schematic diagram of the cross-sectional structure in the TT direction; Figure 51 A top-view structural diagram of the seventh embodiment of the stacked elements provided in this application; Figure 52 A schematic diagram of the tab structure of the eighth embodiment of the stacked elements provided in this application; Figure 53 The sixth embodiment of the stacked capacitor provided in this application Figure 6 Schematic diagram of the cross-sectional structure in the AA direction; Figure 54 The sixth embodiment of the stacked capacitor provided in this application Figure 53 A magnified structural diagram of the U-shaped section; Figure 55 The seventh embodiment of the stacked capacitor provided in this application Figure 32 Schematic diagram of the cross-sectional structure in the OO direction; Figure 56 A frontal view structural schematic diagram of the cathode substrate, spacer film, and anode substrate of the eighth embodiment of the stacked capacitor provided in this application; Figure 57 This is a three-dimensional structural diagram of the first embodiment of the capacitor assembly provided in this application. Figure 58 This is a schematic diagram of the left-side view structure of the first embodiment of the capacitor assembly provided in this application. Figure 59 A schematic diagram of the structure of the capacitor assembly provided in the first embodiment of this application from a bottom view. Figure 60 This is a schematic diagram of the right-side view of the structure of the capacitor assembly provided in the second embodiment of this application. Figure 61 A schematic diagram of the exploded structure of the ninth embodiment of the stacked elements provided in this application; Figure 62 A schematic diagram of the substrate and tabs of the ninth embodiment of the stacked elements provided in this application; Figure 63 A top-view structural diagram of the tenth embodiment of the stacked elements provided in this application; Figure 64 A top-view structural diagram of the eleventh embodiment of the stacked elements provided in this application; Figure 65 A top-view structural diagram of the twelfth embodiment of the stacked elements provided in this application; Figure 66 A schematic diagram of the exploded structure of the tabs of the thirteenth embodiment of the stacked elements provided in this application; Figure 67 A three-dimensional structural diagram of the fourteenth embodiment of the stacked elements provided in this application; Figure 68 A top-view structural diagram of the fourteenth embodiment of the stacked elements provided in this application; Figure 69 The fourteenth embodiment of the stacked elements provided in this application is in Figure 68 Schematic diagram of the cross-sectional structure in the ZZ direction; Figure 70 The fourteenth embodiment of the stacked elements provided in this application is in Figure 69 A magnified structural diagram of section AA in the middle; Figure 71 The fourteenth embodiment of the stacked elements provided in this application is in Figure 69 Enlarged structural diagram of the BB section; Figure 72 This is an exploded structural diagram of the ninth embodiment of the stacked capacitor provided in this application. Detailed Implementation

[0008] The following will refer to the appendices in this application. Figure 1 To be continued Figure 72 The technical solutions in this application are clearly and completely described in conjunction with the embodiments. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the protection scope of this application.

[0009] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0010] The technical solution of this application is applicable to electrolytic capacitors, such as aluminum electrolytic capacitors. Among them, aluminum electrolytic capacitors are widely used in precision electronic equipment such as AI servers due to their characteristics of self-healing, large specific capacitance, aging resistance, and high cost performance.

[0011] In the context of multilayer capacitors, "multilayer" is a concept relative to "winding" in wound capacitors. Specifically, it refers to the shape of the capacitor's core (or stem). Wound capacitors have a coiled core, with the cathode and anode foils wound into a cylindrical shape; typically, only one cathode and anode foil are used. In contrast, multilayer capacitors have a cathode substrate (in sheet form) and an anode substrate stacked together, usually with multiple cathode and anode substrates. It should be noted that in this application, "multilayer" is used to describe the shape of the capacitor's core and does not limit the type of capacitor; the core can be solid, semi-solid, or liquid, etc.

[0012] It should be noted that the shape of a multilayer capacitor can be either cuboid or flat plate. The shape of the multilayer capacitor is determined by the number of positive and negative substrates stacked. When the number of stacks is small, the shape is flat plate, resulting in a blade-type multilayer capacitor. When the number of stacks is large, the shape is square, resulting in a cuboid multilayer capacitor. The flatness of the shape can be adapted to the application scenario, allowing multilayer capacitors to meet different application needs.

[0013] Among them, multilayer capacitors are favored by technicians in the field of precision electronic equipment due to their smaller ESR (Equivalent Series Resistance) and ESL (Equivalent Series Inductance).

[0014] In applications with severe temperature shocks, it is necessary to improve the reliability of laminated capacitors.

[0015] To solve the above problems, firstly, please refer to... Figure 8 and Figure 9 This application provides a housing 30 for use in a multilayer capacitor, and is rectangular in shape. The housing includes two opposing first sidewalls 33, two opposing second sidewalls 34, and two opposing third sidewalls 35. A first reinforcing rib 331 is provided on the sidewall with the largest surface area. The surface areas of both the first and second sidewalls are larger than the surface area of ​​the third sidewall. The first, second, and third sidewalls enclose and form an accommodating space 31 (see reference). Figure 7 ); the accommodating space is used to hold stacked elements.

[0016] The shell is rectangular, meaning that the enclosing surface of the shell is basically rectangular. The shell itself is shell-shaped, so it has a first side wall, a second side wall, and a third side wall. These three are connected walls to form the whole shell. Since a cuboid has six walls, there are three pairs of opposite walls. The two first walls are a pair of opposite walls, the two second walls are also a pair of opposite walls, and the two third walls are also a pair of opposite walls.

[0017] It should be noted that the sidewalls may not be complete. For an example, please refer to [reference needed]. Figure 5 As can be seen, opening 32 completely covers a third sidewall, so it is equivalent to the third sidewall actually having only one side. At this time, the two opposing third sidewalls can be considered as one side being a virtual body, because even if one side of the third sidewall is not set, it does not affect the shape of the envelope surface of the shell.

[0018] The reinforcing ribs in this application (including the first reinforcing rib and the second reinforcing rib hereinafter) are all convex ribs that protrude from the surface of the sidewall along the surface normal direction. They can protrude into the accommodating space. In one example, please refer to Figure 10 As can be seen, the first and second reinforcing ribs 341 protrude into the accommodating space; in another example, please refer to Figure 13 It can be seen that the first and second reinforcing ribs protrude outward from the accommodating space.

[0019] When the outer casing is made of metal, reinforcing ribs can be formed using an embedding / rib forming process. For an example, please refer to [reference needed]. Figure 10 , Figure 11 and Figure 12 As can be seen in the cross-section, the stiffener is equivalent to "translating" a portion of the sidewall material along the normal direction of the sidewall surface; please note. Figure 12 In the diagram, the first reinforcing rib is marked in two locations: one on the cross-section and the other from a viewpoint of the cross-section but not on the cross-section itself. This comparison demonstrates the aforementioned "translation" phenomenon, which is equivalent to causing shear deformation of the outer shell to form the reinforcing rib. In other embodiments, additional components can also be welded or bonded to the metal outer shell to form the reinforcing rib.

[0020] In some examples, the surface areas of the first sidewall and the second sidewall can be equal, in which case the first reinforcing rib can be provided on both the first and second sidewalls; in other examples, the surface area of ​​the first sidewall is larger than that of the second sidewall, in which case the first reinforcing rib can be provided only on the first sidewall, but a reinforcing rib can also be provided on the second sidewall as well, for example... Figure 9 The second reinforcing rib is shown in the image.

[0021] In addition, in some cases, stiffeners can also be provided on the third sidewall. When providing stiffeners, they can be configured according to the surface area of ​​the sidewall, so that the sidewall with the larger surface area will have the greatest increase in bending strength under the action of the stiffeners, thus making the bending strength of each sidewall more uniform.

[0022] In summary, the technical solution of this application enables the sidewalls of the casing to deform evenly when subjected to repeated thermal expansion and contraction, making it less likely for one sidewall to suffer excessive deformation and fatigue damage, thereby improving the reliability of the capacitor.

[0023] It should be noted that the first reinforcing rib is disposed on the one with the largest surface area between the first sidewall and the second sidewall. However, in some embodiments, the first sidewall and the second sidewall may have the same surface area, in which case the first reinforcing rib may be disposed on both the first sidewall and the second sidewall. Therefore, in one example, please refer to... Figure 10 , Figure 10 The surface areas of the first and second sidewalls are equal, therefore Figure 10 The second reinforcing rib can also be considered as the first reinforcing rib, but it is labeled as the second reinforcing rib for the convenience of explaining other embodiments.

[0024] Please refer to Figure 5 Optionally, a second reinforcing rib is provided on the second sidewall; the first and second reinforcing ribs are at least partially protruding into the inner side of the outer shell to abut against the stacked elements.

[0025] The first and second reinforcing ribs are at least partially protruding into the inner side of the outer shell, meaning that at least part of the first and second reinforcing ribs protrudes into the accommodating space. In this way, the reinforcing ribs can increase the strength of the outer shell while improving the ability to fix the stacked elements, thereby improving the stability of the capacitor operation.

[0026] When subjected to high voltage, laminated capacitors are prone to discharge, which can cause breakdown between the substrates. Therefore, it is necessary to improve the reliability of laminated capacitors.

[0027] To solve the above problems, please refer to... Figure 1 , Figure 2 and Figure 3 This application provides a capacitor cell 101, which includes a cathode substrate 112 and an anode substrate 111 stacked together; the anode substrate is rectangular and at least one corner is a smooth free curve.

[0028] Both the cathode and anode substrates are plate-shaped elements, and are rectangular in shape. Their sides, i.e., their edges, are shown in the reference diagram. Figure 1 The edge 1112 of the anode substrate is marked; please refer to... Figure 2 The edge 1122 of the cathode substrate is marked. The intersection of two adjacent edges forms an angle; Figure 1The corner 1111 of the anode substrate is also marked in the text. Figure 2 The angle 1121 of the cathode substrate is also marked in the image. Figure 3 In the middle, it refers to the state in which the cathode substrate and the anode substrate are stacked.

[0029] It can be seen that in Figure 1 and Figure 2 In the described embodiment, both the angles of the anode substrate and the cathode substrate are R-angles. Figure 14 In the embodiment shown, the largest x-axis and y-axis coordinate among the four corners of the figure is an irregular, smooth, free curve.

[0030] A smooth free curve is a curve without any sharp angles (or, in other words, a curve without any points where the curvature changes abruptly on either side). When determining whether the corner of the anode substrate is a smooth free curve, a reference surface can be set up, with the surface normal direction of the reference surface being the same as that of the anode substrate. The anode substrate is then projected onto this reference surface, and the outline of the projection is examined. If the outline corresponding to the corner of the anode substrate is a smooth free curve, then the corner is a free curve.

[0031] Because the corners of the anode substrate are free-form curves, there are no sharp angles even at the corners, thus avoiding surface structures with extremely small radii of curvature. This prevents tip discharge. Furthermore, when the anode substrate is used in electrolytic capacitors, an oxide film needs to be oxidized on the surface as a dielectric. The free-form curve shape also allows the oxide film to form uniformly at the corners, preventing the oxide film from being too thin at the corners and avoiding breakdown and discharge at the edges. Therefore, the technical solution of this application avoids anode substrate discharge and improves the reliability of capacitor operation.

[0032] Please refer to Figure 1 and Figure 15 Optionally, an anode tab 131 is provided on one side of the anode substrate, and the two corners of the side of the anode substrate where the anode tab is provided are both smooth free curves. The two corners of the sides of the anode substrate opposite to the anode tab are both folded.

[0033] The anode tab is the channel through which current enters the anode substrate; it is evident that the voltage is highest near the anode tab. Please refer to [reference needed]. Figure 15 As can be seen, the voltage gradually decreases with increasing distance from the anode tab, i.e., along the negative y-axis in the figure, due to the resistance of the anode substrate. Therefore, the closer an angle is to the anode tab, the more important it is to prevent tip discharge.

[0034] For angles far from the anode tab, right angles can be used. For rectangular anode substrates, setting the bends to right angles increases the surface area of ​​the anode substrate, thereby increasing the capacitance that a single capacitor can generate.

[0035] It is evident that the above embodiments can balance the reliability and capacity of the capacitor, ensuring reliable operation while providing higher capacity.

[0036] Please refer to Figure 16 Optionally, the four corners of the anode substrate are all smooth free curves.

[0037] This configuration minimizes the risk of tip discharge at the bend, thereby further improving the reliability of the capacitor.

[0038] Please refer to Figure 16 Optionally, the anode substrate has a smooth, free-curved angle called the R angle.

[0039] The radius of curvature (R-angle) is also a type of smooth free curve, characterized by a relatively uniform radius of curvature throughout the curve. In reality, the probability of a point discharge is greatly influenced by the radius of curvature. Generally speaking, the larger the radius of curvature, the lower the probability of a point discharge; conversely, the smaller the radius of curvature (for example, at a mathematically ideal bend, the radius of curvature is infinitesimal), the higher the probability of a point discharge.

[0040] As can be seen, since the radius of curvature at each point on the R-angle is basically the same (basically or completely circular), there will be no position with small curvature (even if the radius of curvature of the free curve part is large, since the side that the free curve needs to connect is unchanged, there will still be parts with small curvature), thus avoiding weak points that are prone to tip discharge.

[0041] Please refer to Figure 16 Optionally, an anode tab is provided on one side of the anode substrate; the radius of curvature is smaller at angles farther from the anode substrate than at angles farther from the anode tab.

[0042] exist Figure 16 In the example shown, D1, D2, D3, and D4 are used to identify the distances from the anode tabs to the four corners. It can be seen that D1 < D2 < D3 < D4. At the same time, if R1, R2, R3, and R4 are used to represent the radii of curvature of the corners corresponding to D1, D2, D3, and D4, then R1 > R2 > R3 > R4.

[0043] As mentioned above, the farther the angle is from the anode tab, the lower the voltage it withstands due to the resistance of the anode substrate; a smaller radius of curvature also helps to increase the surface area of ​​the anode substrate, thereby increasing the capacitance. Therefore, making the radius of curvature smaller for the angle of the anode substrate farther from the anode tab can balance the reliability and capacitance of the capacitor, ensuring reliable operation while having higher capacitance.

[0044] It should be noted that there may be two angles that are exactly the same distance from the anode tab. In this case, the radii of curvature of the two angles can be equal.

[0045] Please refer to Figure 2 Optionally, the angle corresponding to the R-angle between the cathode substrate and the anode substrate is also the R-angle.

[0046] When applied to ceramic capacitors and film capacitors, the charge is also stored in the cathode substrate. In this case, setting the corners of the cathode substrate to R-angle can also prevent tip discharge. It should be noted that the setting method can refer to the setting method of R-angle of the anode substrate described above.

[0047] When applied to aluminum or tantalum electrolytic capacitors, the cathode substrate is not used for storing the capacitor, but it can guide the electric field distribution. This can guide the electric field intensity at the R-corner of the anode substrate to be evenly distributed, avoiding excessive local field strength that could cause discharge.

[0048] Please refer to Figure 17 Optionally, all four corners of the cathode substrate are folded.

[0049] When applied to aluminum or tantalum electrolytic capacitors, capacitance is formed only in the portion of the anode substrate whose projection onto the cathode substrate lies within the cathode substrate; the portion exposed to the cathode substrate produces virtually no capacitance. Therefore, the four corners of the cathode substrate are angled to increase its area, allowing it to cover the anode substrate as much as possible and thus maximizing capacitance.

[0050] Please refer to Figure 1 Optionally, an anode tab is provided on one side of the anode substrate; the anode tab is plate-shaped, and the side of the anode tab is connected to the side of the anode substrate; the side of the anode substrate and the side of the anode tab are connected by an R-angle.

[0051] Figure 1 In the diagram, the R-angle used for connection is marked by Z. It can be seen that the R-angle setting avoids the connection between the anode tab and the anode substrate by bending, thus avoiding stress concentration and preventing the connection position between the anode tab and the anode substrate from cracking. This also avoids discharge caused by cracking (although no sharp point is generated, the oxide film will still crack, causing discharge).

[0052] Please refer to Figure 2 Optionally, a cathode tab 132 is provided on one side of the cathode substrate; the cathode tab is plate-shaped, and the side of the cathode tab is connected to the side of the cathode substrate; the side of the cathode substrate and the side of the cathode tab are connected by an R-angle.

[0053] Figure 2In the diagram, the R-angle used for connection is marked by Z. It can be seen that the R-angle setting avoids the connection between the cathode tab and the cathode substrate by bending, thus avoiding stress concentration and cracking at the connection position between the cathode tab and the cathode substrate. This also avoids discharge caused by cracking (for embodiments where the cathode substrate stores charge) or capacity reduction caused by abnormal electric field distribution (for embodiments where the cathode substrate guides the electric field distribution).

[0054] Please refer to Figure 1 and Figure 2 Optionally, the radius of curvature of the R-angle between the anode substrate and the anode tab is greater than the radius of curvature of the R-angle of the anode substrate.

[0055] The radius (R) between the anode substrate and the anode tab is the R-angle mentioned above, designed to prevent stress concentration and cracking. The radius (R) of the anode substrate refers to the radius (R) at the four corners of the anode substrate. The radius (R) at the four corners of the anode substrate needs to take into account the area of ​​the anode substrate. The radius (R) between the anode substrate and the anode tab does not affect the surface area of ​​the anode substrate, so it can be set as large as possible.

[0056] It is evident that by making the radius of curvature of the R-angle between the anode substrate and the anode tab greater than the radius of curvature of the R-angle of the anode substrate, both reliability and capacity can be balanced, thus avoiding cracking and improving capacity.

[0057] Please refer to Figure 5 and Figure 18 This application provides a stacked capacitor 102, which includes the above-described capacitor cell.

[0058] Please refer to Figure 5 A multilayer capacitor can have the structure shown in the figure: The stacked capacitor may include a housing 30, which has an opening 32 that connects to an accommodating space inside the housing, into which the stacked element 10 can be placed. The opening may be closed by a sealing cap 20.

[0059] Due to the stringent compactness requirements of electronic devices, multilayer capacitors also need to be more compact.

[0060] To solve the above problems, please refer to Figure 19 , Figure 20 and Figure 21 In a first aspect, this application provides a sealing cap 20 for use in a capacitor, and includes a support layer 21 and an inner film layer 22. The inner film layer is attached to one side of the support layer; the inner film layer is used for anode insulation of the capacitor elements.

[0061] A sealing cap is a component used to seal the opening in the capacitor's casing. For an example, please refer to... Figure 5 , Figure 32 and Figure 33The capacitor 100 has an opening 32 on its outer casing 30. Please refer to the reference. Figure 6 and Figure 7 It is evident that the opening connects to the accommodating space 31 formed within the outer casing, and the elements of the capacitor (e.g.) Figure 5 The stacked elements 10 and shown in the figure Figure 30 The wound element 50 shown can enter the accommodating space through the opening, and the sealing cap is then placed on the opening to encapsulate the element inside the outer shell, thus sealing the accommodating space.

[0062] The support layer is a layered component that provides support. For an example, please refer to... Figure 24 As can be seen, the sealing cap is cap-shaped, so the support layer includes a layer body 211 and a flange 212. The layer body is flat, and the flange protrudes from the layer body along the surface normal direction and is annular, encircling the perimeter of the layer body; that is, the support layer is also cap-shaped. In another example, please refer to... Figure 26 As can be seen, the sealing cap is flat, and the support layer is also flat. In summary, the support layer is the supporting element of the sealing cap, and can be considered as the main body of the sealing cap.

[0063] The inner membrane layer is a component attached to one side of the support layer. Attachment can be understood as a connection formed through processes such as spraying, injection molding, dip coating, electrophoresis, and pressing. The inner membrane layer can be made of plastics such as PFA, PTFE, or PET, thus providing insulation properties. In some embodiments, the inner membrane layer can also be used for sealing (see below), thereby utilizing its moisture-blocking properties.

[0064] The inner membrane layer is used to insulate the anode of the element, meaning that the inner membrane layer separates the anode portion of the element from the support layer.

[0065] The anode portion of a prime varies depending on the prime type. For stacked primes, the anode portion often consists of an anode substrate and an anode lead-out foil. The anode substrate is a plate-shaped element stacked with the cathode substrate (and the spacer film), and the anode lead-out foil is an intermediate component electrically connected to each anode substrate to connect the anode substrate to the outside world. For wound primes, the anode portion often consists of the anode foil and anode lead-out foil mentioned above. Unlike stacked primes, the anode lead-out foil of wound primes is connected to the anode foil.

[0066] The inner membrane layer does not need to be directly positioned between the support layer and the anode portion of the element. Instead, it only needs to ensure that the anode portion of the element does not contact the support layer after the element is encapsulated within the outer casing. Therefore, in one example, the anode portion of the element closest to the support layer is often the anode lead-out foil. It is sufficient to ensure that the anode lead-out foil is at least partially positioned opposite the inner membrane layer along its surface normal. This way, even if the element presses against the support layer, the anode lead-out foil will still abut against the inner membrane layer, thus preventing the element from moving further towards the support layer and avoiding contact between the anode portion of the element and the support layer.

[0067] In one example, please refer to Figure 5 As can be seen, the support layer and the inner membrane layer have essentially the same shape, meaning the inner membrane layer covers one side of the support layer. Therefore, the anode portion of the element (in the embodiment shown, mainly the anode lead-out foil 141) cannot contact the support layer. It should be noted that in other embodiments, the inner membrane layer may only cover a portion of the support layer. For one example, please refer to... Figure 5 The cathode lead-out foil 142 can abut against the support layer, so the part covered by the orthogonal projection of the cathode lead-out foil onto the support layer does not need to be provided with an inner film layer.

[0068] As can be seen, due to the design of the inner film layer, the material selection for the support layer does not need to consider insulation, and therefore materials with higher strength can be selected, such as carbon fiber, iron and iron-based alloys, copper and copper-based alloys, aluminum and aluminum-based alloys, titanium and titanium-based alloys, and tantalum and tantalum-based alloys. In particular, when applied to aluminum electrolytic capacitors, pure aluminum can be used, and when applied to tantalum electrolytic capacitors, pure tantalum can be used.

[0069] In this way, the total thickness of the support layer and the inner membrane layer can be much smaller than that of the traditional sealing cap with butyl rubber as the plate body. The thickness space saved by the sealing cap can be used to set the element, so that the same size shell can be fitted with a larger element after using the sealing cap provided by the technical solution of this application, thereby increasing the specific capacitance of the capacitor and thus improving the compactness of the capacitor (i.e., a larger capacitor can be provided in a smaller volume).

[0070] It should be noted that using an attachment method to connect the inner film layer and the support layer can also reduce the thickness of the inner film layer. This is because simple wrapping or sleeve-like connection methods cannot form a tight bond, easily creating air gaps between the inner film layer and the support layer. These air gaps are prone to breakdown under high voltage, leading to insulation failure. Therefore, the inner film layer needs to be made thicker to ensure insulation. The attachment method, on the other hand, allows the inner film layer and the support layer to fit tightly together, avoiding the existence of air gaps, and insulation can be guaranteed with a smaller thickness.

[0071] Please refer to Figure 20 and Figure 21Optionally, the sealing cap may also include an outer film layer 23, which is attached to the side of the support layer facing away from the inner film layer; the outer film layer is an insulating layer.

[0072] The outer membrane layer is a component attached to the support layer on the side facing away from the inner membrane layer. Attachment can be understood as a connection formed through processes such as spraying, injection molding, dip coating, electrophoresis, and pressing. The outer membrane layer can be made of plastics such as PFA, PTFE, or PET, thus providing insulation properties. In some embodiments, the outer membrane layer can also be used for sealing (see below), thereby utilizing its moisture-blocking properties.

[0073] Capacitors also need to be insulated from the outside. Compared to the solution of wrapping the capacitor with insulating plastic, attaching the insulating layer directly to the outside of the support layer is the same principle as the attachment of the inner film layer mentioned above. Since it can avoid air gaps between the outer film layer and the support layer, the outer film layer can be made thinner, thereby preventing the capacitor from encroaching on the external space and improving the compactness of the capacitor (when considering the compactness of the external components as a whole).

[0074] Please refer to Figure 22 Optionally, both the outer and inner membrane layers are sealing layers; the sealing cap also includes an anode lead-out terminal 24 and a cathode lead-out terminal 25, both of which are disposed in the support layer; the outer membrane layer is at least partially distributed in the gap between the anode lead-out terminal and the support layer.

[0075] The anode lead is used to electrically connect to the anode portion of the capacitor element, so as to connect the anode portion of the element to an external circuit; the cathode lead is used to electrically connect to the cathode portion of the capacitor element, so as to connect the cathode portion of the capacitor element to an external circuit.

[0076] The cathode portion of a prime is similar to the anode portion described above, but varies depending on the prime type. For stacked primes, the cathode portion often consists of a cathode substrate and cathode lead-out foils. The cathode substrate is a plate-shaped element stacked with the anode substrate (and spacer film), and the cathode lead-out foils are electrically connected to each cathode substrate, serving as an intermediary connecting the cathode substrate to the outside world. For wound primes, the cathode portion often consists of the cathode foil and cathode lead-out foils mentioned above. Unlike stacked primes, the cathode lead-out foils of wound primes are connected to the cathode foil.

[0077] Because the anode and cathode leads need to pass through the support layer, with one end exposed in the containment space and the other end exposed to the outside world to connect with the external circuit and the capacitor, gaps will be generated between the anode and cathode leads and the support layer. If the seal is not tight, external dirt may enter the capacitor. For electrolytic capacitors, it may also cause electrolyte loss (evaporation loss), causing the capacitor to malfunction.

[0078] Typically, thicker sealing sleeves are required on the cathode and anode leads to seal the gaps between them and the support layer. For some embodiments of this application, please refer to... Figure 22 and Figure 23 As can be seen, part of the outer film layer is distributed in the gap between the anode lead-out terminal and the support layer, which can seal the gap between the anode lead-out terminal and the support layer. As mentioned above, the outer film layer can have a smaller thickness, so it can occupy less space compared to conventional sealing solutions, thereby improving the compactness of the capacitor.

[0079] Please refer to Figure 22 and Figure 23 Optionally, the outer film layer is at least partially distributed in the gap between the cathode lead-out terminal and the support layer.

[0080] Please refer to some embodiments of this application. Figure 22 and Figure 23 As can be seen, part of the outer film layer is distributed in the gap between the cathode lead-out terminal and the support layer, which can seal the gap between the cathode lead-out terminal and the support layer. As mentioned above, the outer film layer can have a smaller thickness, so it can occupy less space compared to conventional sealing schemes, thereby improving the compactness of the capacitor.

[0081] Please refer to Figure 22 and Figure 23 Optionally, the inner membrane layer is at least partially distributed in the gap between the anode lead-out terminal and the support layer.

[0082] Please refer to some embodiments of this application. Figure 22 and Figure 23 As can be seen, part of the inner film layer is distributed in the gap between the anode lead-out terminal and the support layer, which can seal the gap between the anode lead-out terminal and the support layer. As mentioned above, the inner film layer can have a smaller thickness, so it can occupy less space compared to conventional sealing solutions, thereby improving the compactness of the capacitor.

[0083] Please refer to Figure 22 and Figure 23 Optionally, the inner film layer is at least partially distributed in the gap between the cathode lead-out terminal and the support layer.

[0084] Please refer to some embodiments of this application. Figure 22 and Figure 23 As can be seen, part of the inner film layer is distributed in the gap between the cathode lead-out terminal and the support layer, which can seal the gap between the cathode lead-out terminal and the support layer. As mentioned above, the inner film layer can have a smaller thickness, so it can occupy less space compared to conventional sealing schemes, thereby improving the compactness of the capacitor.

[0085] It should be noted that the inner and outer film layers can be used to seal the cathode and anode leads only on one side of the sealing cap, i.e., only one of the inner or outer film layers is used for sealing. This can further reduce the increase in thickness caused by sealing and improve compactness.

[0086] It should be noted that the inner and outer film layers can seal only one of the cathode and anode leads, i.e., only the cathode or anode lead is sealed. For an example, please refer to... Figure 21 It can be seen that an injection molded part 26 is provided, which is filled between the anode lead-out terminal and the support layer to seal the anode lead-out terminal and the support layer.

[0087] Using injection-molded parts to seal the anode leads can specifically enhance the sealing of the anode leads, while also providing insulation to prevent breakdown due to potential differences between the anode leads and the support layer. The injection-molded parts can be made of the same material as the inner and / or outer film layers, and can be directly injection-molded onto the support layer. During the injection molding process, the injection-molded parts are integrated with the outer and / or inner film layers, improving sealing performance.

[0088] It should be noted that the outer and inner film layers may not extend into the periphery of the cathode lead-out terminals, allowing the cathode lead-out terminals to directly contact the support layer. For an example, please refer to... Figure 23 It can be seen that the outer and inner film layers enter the periphery of the anode lead-out terminal, thus preventing the anode lead-out terminal from directly contacting the support layer, which serves both a sealing and insulation function; however, the outer and inner film layers do not enter the periphery of the cathode lead-out terminal, and the cathode lead-out terminal directly abuts against the support layer.

[0089] When the cathode lead-out terminal abuts against the support layer, the support layer can be made of a conductor (such as aluminum and tantalum mentioned above). This allows the support layer to connect to a low potential (cathode), forming a good electromagnetic shielding effect and ensuring stable operation of the capacitor.

[0090] Please refer to Figure 24 Optionally, the inner membrane layer is distributed on one side of the support layer, and the outer membrane layer is distributed on the side of the support layer opposite to the inner membrane layer.

[0091] exist Figure 24In the illustrated embodiment, the inner and outer film layers are substantially the same shape as the support layer, which is an embodiment where the inner and outer film layers are distributed across one side of the support layer. The inner and outer film layers being distributed across both sides of the support layer simplifies the overall forming of the inner, outer, and support layers. It is understood that before cutting (or using punching or other processes) the support layer from the solid sheet material, film layers can be attached to both sides of the sheet material. After the support layer is cut along with the sheet material and holes are made for the anode and cathode leads, the outer and inner film layers are naturally formed, simplifying manufacturing.

[0092] Even if the inner and outer membrane layers are produced after the support layer is made, since the inner and outer membrane layers are distributed on one side of the support layer, there is no need to consider the precise control setting range, thus reducing the precision required for manufacturing.

[0093] In addition, the extensive inner and outer membrane layers provide more comprehensive insulation and sealing performance.

[0094] Please refer to Figure 5 This application also provides a capacitor, including the aforementioned sealing cap.

[0095] exist Figure 5 The image exemplifies possible components that may be used in a multilayer capacitor, wherein the fixing tape 15 can be used to fix the multilayer elements and prevent them from spreading out. Of course, in other embodiments, the multilayer elements can be fixed by the housing alone. The elastic member 40 can be used to abut against the sealing cap and the multilayer elements, thereby pressing the multilayer elements tightly inside the housing and preventing them from shaking.

[0096] Figure 30 The example demonstrates the way the winding element of a wound capacitor is fitted with the sealing cap. It should be noted that... Figure 30 The display shows the assembly formed by the wound element and the sealing cap, before it is assembled into the housing. Once assembled into the housing, the sealing cap and the wound element are coaxially positioned.

[0097] It can be seen that when the sealing cap is applied to different types of capacitors, it can have different shapes.

[0098] Please refer to Figure 5 , Figure 6 , Figure 7 and Figure 25 Optionally, the capacitor also includes a housing, an accommodating space is formed inside the housing, an opening communicating with the accommodating space is formed on the surface of the housing, and a sealing cap is placed on the opening to close the accommodating space; the inner film layer is at least partially distributed between the support layer and the housing.

[0099] Figure 25As can be seen, the inner membrane layer is distributed between the outer shell and the support layer, thus playing a sealing role. As mentioned above, the thickness of the sealing layer can be relatively thin. By using the inner membrane layer to seal between the support layer and the outer shell, the required thickness for sealing can be reduced. Since the sealing material is a flexible material, if the thickness of the sealing material between the support layer and the outer shell along the radial direction of the sealing cap is too large, the sealing cap is prone to loosening. Therefore, the technical solution of this application reduces the thickness of the sealing material between the support layer and the outer shell, thereby improving the stability of the sealing cap.

[0100] Please refer to Figure 26 , Figure 27 , Figure 28 and Figure 29 Optionally, the capacitor also includes a housing, an accommodating space is formed inside the housing, and an opening communicating with the accommodating space is formed on the surface of the housing. A sealing cap is placed on the opening to close the accommodating space. The sealing cap also includes a cathode lead terminal, which passes through the support layer to be electrically connected to the support layer. Both the support layer and the housing are conductors. The edge 215 of the support layer is electrically connected to the housing.

[0101] The cathode lead-out terminal can be electrically connected by direct contact with the support layer, or it can be electrically connected by integral molding with the support layer through welding or other methods.

[0102] As can be seen, both the support layer and the outer shell are electrically connected to the cathode lead-out terminal. When the capacitor is working, the outer shell and the support layer form a conductor cavity with a low potential, which can provide better electromagnetic shielding for the capacitor.

[0103] Please refer to Figure 26 and Figure 27 Optionally, the support layer is flat and its edges are exposed to the inner membrane layer. The support layer enters the housing at least partially through an opening, and the edges of the support layer directly abut against the housing for electrical connection.

[0104] When the edge of the support layer is exposed to the inner film layer, it can directly contact the outer shell to form an electrical connection when the sealing cap is at least partially inserted into the outer shell. That is, the sealing cap only needs to be pressed into the outer shell to achieve electrical connection, without the need for secondary processes to form an electrical connection relationship, which makes the manufacturing of capacitors simpler and cheaper.

[0105] Please refer to Figure 24 and Figure 25 Optionally, the support layer includes a connected layer body and a flange, the layer body being plate-shaped; the flange is disposed around the periphery of the layer body and distributed toward one side of the layer body; the inner membrane layer is at least partially distributed in the gap between the flange and the outer shell, and at least a portion of the flange directly abuts against the outer shell.

[0106] The layer body is the main part of the support layer, and the flanges are set on the periphery of the layer body. The flanges can be integrally formed with the layer body, for example, the flanges can be stamped out on the periphery of the layer body using a stamping process. The flanges can also be welded to the layer body.

[0107] The flange design increases the available contact area between the support layer and the outer shell, thereby improving the stability between the cap and the outer shell. Furthermore, if a film layer is attached to the flange, for example... Figure 25 As shown, the radially outer side of the flange is covered with an inner film layer, which improves the seal between the cap and the outer shell because the electrolyte needs to travel a longer sealed path to dissipate to the outside. If the flange is not covered with a film layer (or only slightly covered), the contact resistance between the support layer and the outer shell can be reduced, thus preventing overheating.

[0108] Please refer to Figure 28 and Figure 29 Optionally, the edges of the support layer are electrically connected to the outer casing by welding and / or bonding with conductive adhesive.

[0109] Figure 29 The image shows a solder block 60, which is an auxiliary element for welding. The solder block can be attached to the edge of the support layer on one side (for...). Figure 29 In the embodiment shown, the edge of the support layer is welded on the flange, and the other side is welded to the outer shell, thereby connecting the support layer and the outer shell by welding.

[0110] In other embodiments, the support layer and the outer shell can be directly welded without the aid of auxiliary components. In this case, the presence of the inner or outer film layer is not required, and the film layer can be directly destroyed to complete the welding at the welding temperature of the metal.

[0111] In other embodiments, conductive adhesive can be used to bond the edges of the support layer and the outer shell, thereby completing the bonding under low-temperature conditions; it should be noted that the conductive adhesive can be applied in the same way as... Figure 29 The welding blocks are arranged as shown in the figure.

[0112] Of course, welding and conductive adhesive bonding can be used simultaneously at different locations to meet the connection needs of different locations.

[0113] Whether by welding or conductive adhesive bonding, a stable electrical connection can be provided, ensuring a good electrical connection and avoiding loose connections. Welding and conductive adhesive bonding can also strengthen the seal and improve the connection strength between the cap and the outer shell.

[0114] As electronic devices place higher demands on the shielding performance of electronic components, capacitors also need to have better shielding performance.

[0115] To solve the above problems, please refer to Figure 19 , Figure 20 and Figure 34 In one aspect, this application provides a sealing cap 20 for use in a capacitor, and includes a support layer 21 and a cathode lead-out terminal 25. The support layer is a conductor; the cathode lead-out terminal passes through the support layer and is directly electrically connected to the support layer.

[0116] Direct electrical connection between the cathode lead and the support layer means that the electrical connection between the two is not achieved through any intermediate component. This means the cathode lead and the support layer can be connected via direct contact, welding, or adhesive bonding. For an example, please refer to [reference needed]. Figure 34 As can be seen, the cathode connector directly abuts against the support layer, thereby achieving electrical connection.

[0117] The more enclosed the conductive shell, the better the electromagnetic shielding effect. Therefore, making the support layer a conductor can improve the shielding performance of the capacitor. However, it should be noted that this shielding is against external electromagnetic radiation, meaning it improves the ability to resist external electromagnetic radiation from entering the containment space; electromagnetic radiation generated by atoms can still easily escape from the containment space. Connecting the support layer to the cathode is equivalent to connecting the support layer to a low potential in the circuit, acting similarly to a grounded conductor shell, thereby further preventing electromagnetic radiation generated by atoms from dissipating outside the containment space, thus comprehensively improving the electromagnetic radiation shielding performance of the capacitor.

[0118] Due to the stringent compactness requirements of electronic devices, capacitors also need to be highly compact. Maintaining compactness while simultaneously withstanding higher voltages is often a difficult balance to achieve.

[0119] To solve the above problems, please refer to Figure 19 , Figure 20 and Figure 35 In one aspect, this application provides a sealing cap 20 for use in a capacitor, and includes a support layer 21, an anode lead-out terminal 24, and an injection-molded part 26. Please refer to the references. Figure 31 The support layer has an anode hole 213; the anode lead-out terminal is inserted through the anode hole and spaced apart from the support layer; the injection molded part is filled between the support layer and the anode lead-out terminal to seal the anode hole.

[0120] An anode hole is a through-hole formed in the support layer, allowing the anode lead-out terminal to pass through it. The anode lead-out terminal is a component used to connect the anode to external circuitry; it passes through the anode hole in the support layer, with one end exposed inside the housing and the other end exposed to the outside. Please refer to [reference needed]. Figure 5 In some embodiments, an anode lead-out foil 141 may also be provided to connect the anode of the element and the anode lead-out terminal.

[0121] Injection molded parts are components formed by injection molding and can be made of plastics such as PFA, PTFE, or PET, thus possessing insulating properties. Because the support layer and the anode lead are spaced apart, the injection molded part can enter the gap between the support layer and the anode lead, at least filling the space between the anode lead and the wall of the anode hole to seal the anode hole.

[0122] Because injection molded parts are formed using injection molding, they can be molded using insert injection molding, where the injection molded part is directly injected onto the support layer (the support layer acts as an insert in the injection molding process); or the anode lead terminal and the injection molded part can be molded together using insert injection molding (in this case, the anode lead terminal acts as an insert); or the support layer, anode lead terminal, and injection molded part can be molded together using insert injection molding.

[0123] Insert injection molding allows the material of the injection molded part to bond with the insert, forming a tight connection. This differs from conventional nesting or bonding connections.

[0124] If an insulating component is installed over the anode lead-out terminal to achieve insulation, a tiny air gap can easily form at the interface between the two components because the installation does not involve bonding but only contact. This air gap is easily broken down under high voltage, leading to insulation failure. Therefore, the anode lead-out terminal needs to be further away from the support layer to ensure insulation. This increases the volume of the insulating component, making it impossible to maintain a compact structure while withstanding high voltage.

[0125] If an insulating component is bonded to the anode lead-out terminal to achieve insulation, the adhesive material is also similar to an air gap and is easily broken down. Therefore, the insulating component also needs to be larger to withstand high voltage, making it impossible to maintain a compact structure while withstanding high voltage.

[0126] Using injection molded parts can at least avoid air gaps between the anode lead-out terminals and the injection molded parts, as well as air gaps between the injection molded parts and the support layer. This allows for high pressure resistance without a large volume, ensuring a compact structure while withstanding high pressure.

[0127] Please refer to Figure 35 and Figure 31 Optionally, the support layer is a conductor and also has a cathode hole 214; the sealing cover also includes a cathode lead-out terminal 25, which passes through the cathode hole and directly abuts against the support layer.

[0128] A cathode hole is a through-hole formed in the support layer, and a cathode lead-out terminal is a component used to electrically connect the cathode of an external circuit to the cathode of the element. For an example, please refer to... Figure 5It can be seen that a cathode lead-out foil 142 is provided. The cathode lead-out foil is used to connect the cathode of the element and one end of the cathode lead-out terminal exposed inside the housing. The cathode lead-out terminal is inserted through the cathode hole, so the other end is exposed to the outside. This exposed end can be used for electrical connection with the external circuit.

[0129] Thanks to the good insulation between the anode lead and the support layer, the cathode lead can be directly electrically connected to the support layer, that is, electrically connected by direct contact without causing a short circuit. Of course, direct contact does not preclude welding or bonding at the contact interface, nor does it preclude welding at other locations.

[0130] A conductor-based support layer means that its material can be a metallic conductive material such as iron and iron-based alloys, copper and copper-based alloys, aluminum and aluminum-based alloys, titanium and titanium-based alloys, and tantalum and tantalum-based alloys, or a non-metallic conductive material such as carbon conductive fiber. The function of a conductor-based support layer is to enable the support layer to achieve the electromagnetic shielding performance of a conductor.

[0131] Please refer to Figure 31 and Figure 42 Optionally, the diameter of the cathode hole is smaller than the diameter of the anode hole.

[0132] Since the wall of the cathode aperture can be used to abut against the cathode lead-out terminal, thereby electrically connecting the cathode lead-out terminal to the support layer, the diameter of the cathode aperture is basically equivalent to the diameter of the portion of the cathode lead-out terminal that mates with the cathode aperture. The diameters of the cathode lead-out terminal and the anode lead-out terminal determine their current-carrying capacity; generally, the larger the diameter, the stronger the current-carrying capacity.

[0133] It is evident that the diameter of the anode hole is larger than that of the cathode hole. This ensures that even if the diameter of the part of the anode lead terminal that mates with the anode hole is the same as the diameter of the part of the cathode lead terminal that mates with the cathode hole, meaning that their current carrying capacities are essentially the same, the anode lead terminal can still maintain a gap with the hole wall of the anode hole. This ensures that the injection molded part can enter the gap and achieve insulation.

[0134] This ensures that the overall current-carrying capacity of the capacitor is maintained while also ensuring that the injection-molded part is insulated.

[0135] In one example, please refer to Figure 42 Where R1 is the diameter of the anode hole and R2 is the diameter of the cathode hole.

[0136] Please refer to Figure 35 and Figure 31 Optionally, the anode lead-out terminal is coaxially arranged with the anode hole.

[0137] In one example, please refer to Figure 35In the diagram, X2 indicates the common axis of the anode lead-out terminal and the anode hole, i.e. Figure 35 In the embodiment shown, the anode lead-out terminal and the cathode lead-out terminal are coaxially arranged.

[0138] By coaxially aligning the anode leads with the anode holes, the minimum distance between the anode leads and the support layer is ensured to be approximately the same at different locations on the anode lead surface. This results in a more consistent withstand voltage across the anode leads, preventing localized low withstand voltage values ​​and thus avoiding localized breakdown that could damage the capacitor.

[0139] Please refer to Figure 19 , Figure 41 and Figure 31 Optionally, the injection molded part includes a fixing part 261 and an annular insulating part 262; the anode lead-out terminal is disposed on the radial inner side of the insulating part, and the radial outer side of the insulating part abuts against the support layer; the fixing part is connected to the radial outer side of the insulating part; the support layer is provided with fixing grooves 216 distributed radially outward along the insulating part, and the fixing part cooperates with the fixing grooves.

[0140] The anode leads are located radially inside the insulation portion, meaning they pass through the insulation portion and are therefore distributed on both sides of the insulation portion along its axial direction. The radially outer side of the insulation portion abuts against the support layer, that is, at least a portion of the wall of the anode hole.

[0141] The fixing part can be integrally formed with the insulating part, or the fixing part can be connected to the insulating part later by means of hot melt welding or bonding. If the fixing part is located on the radially outer side of the insulating part, and the fixing grooves on the support layer are distributed radially outward along the insulating part, then the fixing part can at least partially enter the fixing groove to mate with the fixing groove.

[0142] The fixing groove can be either a through groove or a blind groove. When the fixing groove is a through groove, it penetrates the support layer along the surface normal direction; when the fixing groove is a blind groove, the groove opening is exposed on one side of the support layer. Figure 31 In the embodiment shown, the fixing groove is a through groove.

[0143] As can be seen, the cooperation between the fixing part and the fixing groove can prevent the injection molded part from rotating around the axis of the insulating part. This can resist part of the shear force between the injection molded part and the support layer, specifically the shear force along the circumference of the insulating part, thereby preventing the injection molded part from shaking relative to the support layer. In embodiments where the injection molded part and the support layer are bonded, debonding can also be avoided, thus ensuring stable insulation performance.

[0144] Please refer to Figure 37 and Figure 40 Optionally, a portion of the support layer is embedded radially within the injection molded part along the anode hole.

[0145] That is, part of the support layer is embedded in the injection molded part radially inward along the anode hole. It should be noted that the support layer can be embedded in the insulating part or the fixing part.

[0146] exist Figure 37 and Figure 40 The embodiments shown illustrate two embedding methods. Figure 37 The embodiment shown has a protrusion on the support layer, and the protrusion is embedded in the injection molded part; Figure 40 In the illustrated embodiment, the edge of the support member is formed with a curved surface that protrudes radially inward along the injection molded part, and the curved surface is embedded in the injection molded part.

[0147] Other methods can also be used to embed the support layer into the injection molded part; once embedded, the support layer prevents the injection molded part from moving relative to the support layer along its own axis. For an example, please refer to... Figure 35 This means that the injection molded part is prevented from moving relative to the support layer along the length direction of the X2 axis in the figure.

[0148] By embedding the support layer partially into the injection-molded part, it can resist some of the shear force between the injection-molded part and the support layer, specifically the shear force along the axial direction of the injection-molded part, thereby preventing the injection-molded part from wobbling relative to the support layer. In embodiments where the injection-molded part and the support layer are bonded, debonding can also be avoided, thus ensuring stable insulation performance.

[0149] Please refer to Figure 38 and Figure 39 Optionally, a portion of the injection molded part may be embedded in the support layer along the radial direction of the anode hole.

[0150] That is, part of the injection molded part is embedded in the support layer along the radial direction of the anode hole. It should be noted that either the insulating part or the fixing part can be embedded in the support layer.

[0151] exist Figure 38 and Figure 39 The embodiments shown illustrate two embedding methods. Figure 37 The embodiment shown has a protrusion on the injection molded part, and the protrusion is embedded in the support layer; Figure 40 In the embodiment shown, the injection molded part still has a protrusion, but the protrusion is exposed on one side of the support layer surface.

[0152] Other methods can also be used to embed the injection molded part into the support layer; once embedded, the part is prevented from moving relative to the support layer along its own axis. For an example, please refer to... Figure 35 This means that the injection molded part is prevented from moving relative to the support layer along the length direction of the X2 axis in the figure.

[0153] By embedding the injection-molded part into the support layer, some of the shear force between the injection-molded part and the support layer can be resisted, specifically the shear force along the axial direction of the injection-molded part, thereby preventing the injection-molded part from wobbling relative to the support layer. In embodiments where the injection-molded part and the support layer are bonded, debonding can also be avoided, thus ensuring stable insulation performance.

[0154] Please refer to Figure 35 Optionally, the sealing cap also includes an outer film layer 23, which is attached to the outer surface of the support layer and integrally formed with the injection molded part.

[0155] The outer side of the support layer refers to the side facing away from the internal space of the outer shell after the sealing cap is installed on the outer shell. The outer film layer can be made of the same material as the injection molded part, thus being integrally formed with the injection molded part. Alternatively, the outer film layer can be formed first on the surface of the support layer, and then fused together with the injection molded part when it is molded at the anode hole; or the injection molded part can be molded first at the anode hole, and then the outer film layer can be applied.

[0156] Adhesion can be understood as the connection formed through processes such as spraying, injection molding, dip coating, dip coating, electrophoresis, and pressing.

[0157] The outer film layer improves the stability of the connection between the molded part and the support layer, thus preventing part movement. Furthermore, the outer film layer also improves sealing performance; please refer to [reference needed]. Figure 36 It is evident that the outer film layer and the injection molded part together block the anode hole. Thus, if material exchange is to occur through the gap between the anode hole and the injection molded part, a longer sealing path is required (i.e., it is necessary to first break through the gap between the outer film layer and the support layer, and then break through the gap between the injection molded part and the support layer, rather than only breaking through the gap between the injection molded part and the support layer).

[0158] The outer film layer also serves to insulate against external factors, preventing external charged components from affecting the capacitor's operation.

[0159] Please refer to Figure 35 Optionally, the sealing cap may also include an inner film layer 22, which is attached to the inner side of the support layer and integrally formed with the injection molded part.

[0160] The inner side of the support layer refers to the side facing the internal space of the outer shell after the sealing cap is installed on it. The inner film layer can be made of the same material as the injection molded part, thus being integrally formed with the injection molded part. Alternatively, the inner film layer can be formed first on the surface of the support layer, and then fused with the injection molded part when it is molded at the anode hole; or the injection molded part can be molded at the anode hole first, and then the inner film layer can be applied.

[0161] Adhesion can be understood as the connection formed through processes such as spraying, injection molding, dip coating, dip coating, electrophoresis, and pressing.

[0162] The inner film layer improves the stability of the connection between the injection molded part and the support layer, thus preventing part movement. Furthermore, the inner film layer also improves sealing performance; please refer to [reference needed]. Figure 36 It is evident that the inner film layer and the injection molded part together seal the anode hole. Thus, if material exchange is to occur through the gap between the anode hole and the injection molded part, a longer sealing path is required (i.e., it is necessary to first break through the gap between the inner film layer and the support layer, and then break through the gap between the injection molded part and the support layer, rather than only breaking through the gap between the injection molded part and the support layer).

[0163] The inner membrane layer can also insulate the anode portion of the element, such as the anode foil, anode substrate, and anode lead-out foil mentioned above, to prevent these components from contacting the support layer and to avoid short circuits.

[0164] It should be noted that the outer and inner film layers can be installed simultaneously to further serve the functions of insulation, sealing, and fixing of the injection molded parts.

[0165] Please refer to Figure 36 Optionally, the extension height of the self-supporting layer surface of the injection molded part is greater than or equal to 0.1 mm.

[0166] This extension height refers to both sides of the injection molded part along its axial direction; that is, the extension height from the surface of the support layer on both sides of the injection molded part along its axial direction is greater than or equal to 0.1 mm. Figure 36 In the illustrated embodiment, T6 is used to indicate the extension height of the injection molded part on the inner side of the self-supporting layer. T6 is greater than or equal to 0.1 mm. Correspondingly, the extension height of the injection molded part on the outer side of the self-supporting layer is also greater than or equal to 0.1 mm.

[0167] This is equivalent to ensuring that the portion of the anode terminal exposed on the injection molded part is at least 0.1mm away from the support layer in the axial direction of the anode hole. This ensures that there is sufficient distance between the anode lead-out terminal and the support layer, preventing discharge between the anode lead-out terminal and the support layer.

[0168] Please refer to Figure 36 Optionally, on the cross-section of the axis of the anode lead-out terminal, the contact surface between the anode lead-out terminal and the injection molded part is a broken line and / or a curve.

[0169] Figure 36 The cross-section shown is the cross-section of the axis of the anode lead-out terminal. It should be noted that the axis of the anode lead-out terminal should be based on the portion passing through the injection molded part, not the exposed portion. Therefore, the axis of the anode lead-out terminal can also be replaced by the axis of the hole in the injection molded part through which the anode lead-out terminal passes; for embodiments where the anode lead-out terminal and the anode hole are coaxial, the axis of the anode hole can also be used instead.

[0170] exist Figure 36In the example shown, the interface (i.e., the contact surface) between the anode lead and the injection molded part can be seen to be a zigzag shape in cross-section. In other examples, it can also be curved or other zigzag shapes.

[0171] If the contact surface between the anode lead and the injection molded part is in a straight line on the above cross section, then when material exchange occurs, it is only necessary to break through this straight path to carry out material exchange, causing external contaminants to enter the capacitor, or causing the working substance inside the capacitor to escape (for electrolytic capacitors, this means electrolyte escape).

[0172] Therefore, making the contact surface between the anode lead and the injection molded part zigzag and / or curved can extend the path length required for material exchange, thereby improving sealing. Furthermore, it can prevent the anode lead from moving relative to the injection molded part along its own axial direction, ensuring the anode lead is fixed and stable.

[0173] Please refer to Figure 5 This application provides a capacitor including the aforementioned sealing cap.

[0174] It should be noted that, Figure 5 The above-described capacitor is merely an example of a capacitor that can be applied to the sealing cap, and is not an exhaustive embodiment of the capacitors provided in this application.

[0175] exist Figure 5 In addition, an elastic element 40 is provided, which simultaneously abuts against the stacked element and the sealing cap, thereby stably pressing the stacked element into the outer shell.

[0176] The specific capacitance (capacitance per unit volume) of multilayer capacitors needs further improvement. Traditional multilayer capacitors typically have lead foils directly nailed or soldered to the substrate surface. When the substrates are stacked, the lead foils encroach on the space between adjacent substrates (the space along the normal direction of the substrate surface), preventing the substrates from being tightly stacked. This reduces the number of substrates that can be stacked in the same space, thus decreasing the capacitance and resulting in a decrease in specific capacitance.

[0177] To solve the above problems, please refer to Figure 43 , Figure 44 and Figure 4 In one aspect, this application provides a stacked element 10, including alternately stacked spacer films 12 and substrates 11; each substrate has a tab 13 connected to its side; please refer to the reference. Figure 45 and Figure 46The electrode tab includes a root portion 133 and an extension portion 134; the root portion and the substrate are integrally formed; the root portion is plate-shaped, and its edge is connected to the edge of the substrate and is arranged parallel to the substrate; the extension portion is strip-shaped, one end of the extension portion is connected to one side of the root portion, and the other end is at least partially distributed in the direction of the electrode tab of the adjacent substrate, so as to electrically connect with the electrode tab of the adjacent substrate; please refer to the reference. Figure 52 A receiving groove 1331 is provided on the root, and the extension enters the receiving groove to connect with the root; the bottom of the receiving groove exposes the core material of the root.

[0178] visible Figure 43 and Figure 44 The image shown represents a single capacitor cell. Stacking individual capacitor cells together forms a stacked element. Please refer to [reference needed]. Figure 4 That is, to adopt Figure 43 and Figure 44 The stacked elements are formed by stacking individual capacitor cells in the capacitor.

[0179] Please refer to Figure 44 A spacer membrane, typically electrolytic paper, is placed between the cathode substrate and the anode substrate. This spacer membrane can absorb the electrolyte. In this case, the cathode substrate guides the distribution of the electric field. The actual capacitor is formed between the anode substrate and the electrolyte. That is, the dielectric of the capacitor is the oxide layer on the surface of the anode substrate. Positive charges accumulate on the side of the oxide layer closer to the core material of the anode substrate, and negative charges accumulate on the side closer to the electrolyte.

[0180] A tab is a component that connects to a substrate and is used to connect the substrate to an external circuit. Therefore, a cathode substrate has a cathode tab, and an anode substrate has an anode tab. The cathode tabs of different cathode substrates are connected to each other, thereby electrically connecting the cathode substrates to each other; the anode tabs of different anode substrates are connected to each other, thereby electrically connecting the anode substrates to each other.

[0181] Please refer to Figure 44 In this application, the substrate refers to the cathode substrate 112 and the anode substrate 111, and the tab refers to the cathode tab 132 and the anode tab 131. The extension of each tab is electrically connected to the extension of the adjacent tab, meaning that the extensions of the cathode tabs are electrically connected to each other, and the extensions of the anode tabs are electrically connected to each other. However, the extensions of the cathode tabs and the extensions of the anode tabs are not connected; that is, the anode substrate and the cathode substrate cannot be electrically connected, otherwise a short circuit would occur.

[0182] Therefore, the fact that at least one end of the extension is distributed in the direction of the tab on the adjacent substrate for electrical connection with the tab on the adjacent substrate also refers to the relationship between tabs of the same polarity. Taking a cathode tab as an example, the extension of the cathode tab is distributed in the direction of the cathode tab on the adjacent cathode substrate. In this application, unless otherwise specified, descriptions of the relationship between tabs, the relationship between substrates, and the relationship between a tab and a substrate refer to the relationship between components of the same polarity (anode or cathode). Furthermore, for ease of expression, Figure 46 , Figure 47 , Figure 48 , Figure 49 , Figure 50 and Figure 51 The examples all use the cathode as an example; the anode can be set up similarly.

[0183] The substrate is a plate-shaped component, with its sides being its edges. Connecting tabs to the sides of the substrate means that the tabs are not connected to the surface of the substrate, but rather to the side of the substrate. The connection can be achieved through soldering or bonding (using conductive adhesive), etc. Since the tabs do not penetrate the surface of the substrate, they do not occupy space between the substrates.

[0184] "The extension is distributed in the direction of the tab on the adjacent substrate" means that the extension of the tab connected to one substrate extends at least partially from the plane of that substrate to the plane of the adjacent substrate. For an example, please refer to... Figure 46 and Figure 47 , Figure 46 The diagram shows two cathode substrates, each connected to a cathode tab. The extensions of the cathode tabs are connected to protrusions 135, which extend along the surface normal of the cathode substrates, i.e., along the positive x-axis direction in the diagram. Figure 47 In the example shown, the extension is bent so that it extends along the surface normal of the cathode substrate, and in both examples, adjacent extensions are connected.

[0185] As can be seen, the distribution of the extension towards the tabs of the adjacent substrate includes two possible scenarios: one is that the extension itself is distributed towards the tabs of the adjacent substrate, and the other is that the extension is connected to other components (such as the protrusions mentioned above) which are distributed towards the tabs of the adjacent substrate.

[0186] Of course, the extension can extend in the direction of the adjacent tab as follows: Figure 46 As shown, it can extend only to the adjacent tab on one side, or it can extend to both tabs on both sides.

[0187] It is evident that for electrodes that are simply strip-shaped and not distributed in the direction of adjacent electrodes, in order for the electrodes to come into contact with each other, the electrodes need to be bent at a large angle so that the ends of the electrodes away from the substrate can approach and contact each other, thus connecting the various electrodes.

[0188] Thus, the end of a simple strip-shaped tab near the substrate will compress the spacer membrane, causing it to crack. Therefore, the tabs must be made very long to reduce the bending angle required for them to come into close contact with each other, thus preventing the tabs from crushing the spacer membrane. However, the substrate is what generates capacitance; the tabs generate virtually no capacitance. The large space occupied by the tabs leads to a decrease in the specific capacitance (capacitance generated per unit volume).

[0189] In the technical solution of this application, since the tabs are distributed in the direction of the tabs on the adjacent substrate, even if the tabs are short, the end of the tab closest to the substrate can remain unbent or be bent at a small angle, so that the tabs will not break the spacer membrane and will not occupy too much space.

[0190] In one example, please refer to Figure 45 and Figure 46 It can be seen that in Figure 46 In this embodiment, the root 133 and the extension 134 of the tab are both distributed along the y-axis direction and do not bend towards the x-axis direction, which is an embodiment that does not compress the septum membrane at all.

[0191] It is evident that the technical solution of this application allows the tab to occupy less space without compressing the spacer, thereby increasing the specific capacitance of the capacitor.

[0192] The substrate and the root are integrally molded parts. That is, when the substrate is manufactured using processes such as shearing or punching, a portion of the structure protruding from the edge of the substrate is retained as the root. Since the substrate is plate-shaped and the root is also plate-shaped, there is no need to form the root a second time, and the edge of the root naturally connects with the edge of the substrate.

[0193] "One end of the extension connects to one side of the root" means that the extension connects to the side of the root. For an example, please refer to [reference needed]. Figure 46 It can be seen that the extension is connected to the side of the root. It should be noted that "one end of the extension" is interpreted in a broad sense here, that is, the part of the extension whose orthogonal projection onto the root is inside the root is one end of the extension; while the part of the extension whose orthogonal projection onto the root is outside the root is the other end of the extension.

[0194] It is evident that the tab is divided into at least two parts: the root and the extension. The root is integrally formed with the substrate, which is equivalent to having a protrusion on the substrate for connecting the extension. This way, the extension does not need to be connected to the substrate surface, thus not affecting the stacking thickness between substrates. If the extension were connected to the substrate surface, it can be understood that in the stacking direction (for...), Figure 46The thickness shown in the embodiment (i.e., in the x-axis direction) varies at different positions along the tangent direction of the substrate; that is, the thickness is greater at the position where the extension is provided and less at the position where the extension is not provided.

[0195] This is equivalent to the extension encroaching on the substrate's mounting space, which will reduce the capacitor's specific capacitance.

[0196] In the embodiments of this application, since the extension can be connected to the root without entering between the substrates to connect with the substrate surface, the thickness in the stacking direction can be consistent at different positions, thereby not encroaching on the substrate's installation space and improving the specific capacitance of the capacitor.

[0197] Furthermore, the extension is distributed in the direction of the tabs of the adjacent substrate. Since the extension does not have to be integrally formed with the substrate, the shape of the extension is easier to configure (if it is integrally formed with the substrate, only a plate shape is easier to configure). This simplifies the manufacturing process of the stacked elements.

[0198] Looking further, a receiving groove is also provided at the root. This groove allows for a tight connection between the extension and the root, as the bottom of the groove exposes the core material of the substrate. For an example, please refer to... Figure 52 As can be seen, since the root and the substrate are integrally formed, an oxide film 1371, which serves as a dielectric, will be formed on the surface of the root. The core material 1372 of the substrate refers to the material covered under the oxide layer.

[0199] The oxide film has insulating properties; direct connection would result in high contact resistance. Exposing the core material via the receiving groove allows the extension to connect directly to the core, significantly reducing contact resistance. This provides a basis for connecting the extension to the side of the root; otherwise, the extension might need to connect to the side of the root, where the oxide film might not be covering the root. However, even with a side connection avoiding the oxide film, the small contact area makes it difficult to achieve low contact resistance. Furthermore, the small contact area makes connection extremely difficult; traditional nailing is almost impossible, and welding rarely produces high-quality welds.

[0200] Therefore, the design of the receiving slot allows the stacked elements to have a high specific capacitance while having a low equivalent resistance.

[0201] Please refer to Figure 47 Optionally, the extension is bent, and the bending direction is towards the tab of the adjacent substrate, so as to overlap with the tab of the adjacent substrate.

[0202] Bending the connecting part is different from pulling the end of the tab away from the substrate to force the tab to bend. Because the way the tab is pulled to force it to bend is uncontrollable, the entire tab, or even part of the substrate, will bend under the pulling action.

[0203] The bending and overlapping of the extensions actually allows the root to bend less or not at all compared to a forced bending method. Essentially, the extensions take on most of the bending task, thus reducing the degree of bending required at the root.

[0204] In one example, please refer to Figure 47 It can be seen that the extension is bent on the side away from the substrate, so that the rest of the extension is not bent, thereby avoiding pressure on the spacer membrane.

[0205] It is evident that the simple structure of bending the extension achieves the effect of avoiding pressure on the spacer membrane, which helps to reduce the manufacturing cost of the stacked elements.

[0206] It should be noted that conductive adhesive can be applied to the overlapping positions of the extensions, or the parts can be welded together to provide a stable electrical connection.

[0207] It should be noted that there are multiple ways to bend; please refer to one example. Figure 47 and Figure 48 As you can see, the bending angles are different, but all achieve overlap; for another example, please refer to... Figure 49 and Figure 50 ,visible Figure 49 The middle extension is coiled and bent. Figure 50 The middle extension bends repeatedly, and all of them are overlapped.

[0208] Please refer to Figure 48 Optionally, the extension is also plate-shaped; the extension is twisted about an axis parallel to its own length direction to be distributed in the direction of the tabs of the adjacent substrate.

[0209] The axis of torsion around which the extension rests has its length direction along the tangent direction of the substrate, and it is positioned along the direction in which the tab protrudes from the substrate. For one example, please refer to... Figure 48 , Figure 48 The torsional axes of the two extensions in the figure are marked with X4.

[0210] It should be noted that, in other embodiments, the torsion axis is not limited to being located at the middle position of the extension (i.e., Figure 51 (As shown in the figure), the torsion axis can be set at the edge of the extension or even outside the extension.

[0211] The extensions twist towards each other and are distributed in the direction of the tabs on adjacent substrates, so that they can approach each other and overlap. The overlap can be formed by bonding with conductive adhesive or by welding, thereby forming a conductive connection. It should be noted that in embodiments where the twisted extensions can cause the root to twist, but because the extensions are close to each other, the twist angle of the tabs relative to the substrate does not need to increase with the increase of the number of substrate layers.

[0212] As can be seen, the twisting of the extension can keep the pressure of the tab on the spacer within a limited range, preventing the spacer from being broken. This also ensures that it does not occupy too much space on the substrate, thus ensuring a larger specific capacitance. At the same time, the twisting process is relatively simple, which can reduce the production cost of the capacitor.

[0213] Please refer to Figure 46 Optionally, the tab also includes a bump that is connected to the end of the extension away from the root and protrudes from the extension toward the tab of the adjacent substrate.

[0214] A bump is a block-shaped component. It can be integrally molded with the extension, or it can be molded separately and then connected to the extension by welding or bonding. Bumps offer high overall integrity, and connecting adjacent tabs with bumps improves the overall connection strength.

[0215] Furthermore, it should be noted that for a single polarity of a stacked element, only a portion of the tab's extension may be distributed in the direction of the tab on the adjacent substrate. This is because having only a portion of the tabs satisfying this requirement may be sufficient to ensure that there is no point in the entire stacked element that exerts significant pressure on the spacer membrane. Alternatively, all the tab extensions may be distributed in the direction of the tab on the adjacent substrate.

[0216] Please refer to Figure 6 , Figure 53 and Figure 54 Optionally, at least some of the substrate bumps are flush with each other on the side opposite to the tab, and the flushing direction is along the length direction of the extension; the flush bumps are bonded and / or welded together to form a receiving surface 136.

[0217] The flush direction, along the length of the extension, refers to the direction along which the extension extends beyond the substrate, and this direction is also along the tangent direction of the substrate surface. Flush means that the sides of the different bumps facing away from the tabs are on a plane perpendicular to the flush direction. For an example, please refer to... Figure 54 In this embodiment, the flush direction is the x-axis direction in the figure. It can be seen that the side of the bump facing away from the substrate is on the same plane, and this plane is perpendicular to the x-axis. Therefore, this plane... Figure 54 The cross-section shown is presented as a straight line parallel to the y-axis (that is, the bearing surface is a straight line parallel to the y-axis).

[0218] The receiving surface is the flat surface of the bump facing away from the tab. The formation of the receiving surface also means that multiple bumps are connected to each other as a whole. This allows the bumps to be connected to form a solid receiving platform. When pressure is applied to the platform, the platform can distribute the pressure relatively evenly to different substrates, thereby avoiding local deformation when under stress.

[0219] The force that the bonding surface can withstand may come from multiple sources. In one possible example, it could come from the lead-out terminal. For a clearer illustration of this possibility, please refer to [reference needed]. Figure 5 , Figure 5 A stacked capacitor is provided as an embodiment of this application.

[0220] Figure 5 The image exemplifies the components that a multilayer capacitor may include, wherein an opening 32 is provided on the housing 30, through which multilayer elements can be inserted into the housing. Please refer to the reference. Figure 53 The stacked elements are visible within the containment space 31 formed inside the outer casing. A sealing cap 20 is used to seal the opening on the outer casing, thus closing it. The sealing cap includes an anode lead-out terminal 24, a cathode lead-out terminal 25, and a support layer 21. The support layer forms the body of the sealing cap. Both the anode and cathode lead-out terminals pass through the support layer, with one end located within the containment space electrically connected to the stacked elements, and the other end located outside the containment space electrically connected to the outside environment, thereby connecting the stacked elements to an external circuit.

[0221] The lead-out terminals (anode lead-out terminals or cathode lead-out terminals) can abut against the receiving surface to compress the stacked elements and ensure that the stacked elements do not move within the housing. Therefore, the receiving surface can withstand the pressure from the lead-out terminals.

[0222] In yet another example, please refer to Figure 5 It can be seen that the stacked element can also be provided with an elastic element 40. The elastic element can simultaneously abut against the sealing cap and the stacked element to press the stacked element into the shell and prevent the stacked element from shaking. The elastic element can also abut against the receiving surface.

[0223] In another example, please refer to Figure 5 The anode lead-out terminal can be connected to the anode of the stacked element through the anode lead-out foil 141, and the cathode lead-out terminal can be connected to the cathode of the stacked element through the cathode lead-out foil 142. The receiving surface can also receive the anode lead-out foil and the cathode lead-out foil.

[0224] It is evident that the design of the bearing surface allows the stacked elements to better withstand external forces and avoid deformation.

[0225] Please refer to Figure 5 and Figure 54Optionally, the stacked element also includes a lead-out foil 14, one end of which is connected to the receiving surface, and the other end of which is used to connect to the lead-out terminals of the stacked capacitor.

[0226] Lead-out foils refer to anode lead-out foils and cathode lead-out foils, while lead-out terminals refer to anode lead-out terminals and cathode lead-out terminals. It should be noted that the connection of one end of the lead-out foil to the receiving surface and the other end to the lead-out terminal means that the anode lead-out foil is connected to the corresponding receiving surface of the anode substrate and to the anode lead-out terminal, and the cathode lead-out foil is connected to the corresponding receiving surface of the cathode substrate and to the cathode lead-out terminal.

[0227] Since the receiving surface is formed by multiple protrusions, it has a large surface area. Connecting the lead-out foil strip to the receiving surface helps to increase the contact area, thereby reducing the contact resistance.

[0228] Please refer to Figure 46 Optional, the bump abuts against the root.

[0229] Since the bump protrudes from the extension towards the tab of the adjacent substrate, and the direction of the adjacent tab is also the thickness direction of the substrate, it can be seen that the size of the bump in the thickness direction of the substrate is larger than that of the substrate, and is generally larger than the size of the extension in the thickness direction of the substrate.

[0230] Meanwhile, the bump is also located at the end of the extension that is far from the root. Therefore, the contact between the bump and the root makes the distance between the bump and the substrate as small as possible. This can prevent the root of the electrode from bending due to the weight of the bump, and can also reduce the space occupied by the bump outside the substrate, thereby increasing the specific capacitance of the capacitor.

[0231] Please refer to Figure 44 Optionally, the root protrudes from the edge of the substrate by a height greater than or equal to 2 mm and less than or equal to 30 mm.

[0232] Figure 44 Taking the root of the anode tab as an example, T9 is used to indicate the height at which the root protrudes from the substrate.

[0233] The direction in which the root protrudes from the edge of the substrate can be along the tangent direction of the substrate surface, or it can be perpendicular to the extension direction of the side of the substrate where the root is located. The extension direction of the side of the substrate where the root is located refers to the tangent direction at the point where the side of the substrate connects to the root. When the tangent direction is difficult to determine, the extension direction can be determined by the line connecting the two points at the point where the root connects to the substrate, where the maximum size of the root is determined. In some embodiments, the substrate is rectangular, and the extension direction is the conventional extension direction of the side of the substrate where the root is located (e.g., Figure 44 As shown, the substrate is rectangular.

[0234] The root is the component that connects to the extension. If the root protrusion is too small, the contact area between the root and the extension will be too small, and the contact resistance will be relatively large. If the root protrusion is too large, it will occupy too much space outside the substrate, making it difficult to improve the specific capacitance. When the root protrusion is greater than or equal to 2mm and less than or equal to 30mm, it can have a sufficient contact area with the extension without occupying too much space, thus ensuring that the specific capacitance is improved.

[0235] Please refer to Figure 44 and 65 Optionally, the orthogonal projection of the septum onto the root is at least partially within the root.

[0236] exist Figure 46 In the example shown, the orthographic projection of the septum onto the root is the projection along the x-direction. It can be seen that the orthographic projection of the septum onto the root is partially within the root, meaning the septum and the root at least partially overlap. It should be noted that the projection relationship refers to the relationship between the septum and the adjacent root.

[0237] The proposed technical solution allows the tabs to operate with minimal pressure on the spacer, enabling the spacer to partially overlap with the tabs. Otherwise, the spacer might need to be flush with the edge of the substrate, and at most adjacent to the portion of the tab protruding from the substrate. The spacer prevents contact between the cathode and anode substrates, thus avoiding short circuits. Therefore, extending the spacer beyond the substrate along the surface normal on the side with the root, so that it is at least partially projected into the root, improves capacitor reliability.

[0238] Please refer to Figure 5 This application also provides a stacked capacitor 102, including the stacked elements described above.

[0239] For some types of precision electronic devices, such as AI servers, prolonged operation generates a significant amount of heat, leading to the adoption of immersion liquid cooling solutions for heat dissipation. Traditional capacitors struggle to maintain stable operation in high-temperature environments.

[0240] To solve the above problems, please refer to Figure 18 and Figure 5 This application provides a capacitor 100, including a housing 30, a component 104, a sealing cap 20, and an elastic member 40. The housing is cylindrical and has an internal accommodating space 31; one end wall of the housing is completely covered by an opening 32, which connects the accommodating space to the outside; the component is disposed within the accommodating space; the sealing cap is disposed on the opening to close the accommodating space; the elastic member is disposed between the sealing cap and the component and is interference-fitted with the component and the sealing cap.

[0241] The term "shell is cylindrical" means that the envelope of the shell is basically cylindrical, and the shell itself is shell-shaped. For example, the shell can be cuboid or cylindrical, both of which are cylindrical. In addition, in some embodiments, the shell can also be cube-shaped, which is still considered a case where the shell is cylindrical.

[0242] The end wall of the outer shell is the side wall that forms the end face of the column. For embodiments where the outer shell is cylindrical or cuboid, the end wall is relatively easy to determine. For embodiments with special column shapes such as cubes, any one side wall can be chosen as the end wall.

[0243] When one end wall of the outer shell is completely covered by an opening, it means that one end wall is removed to create an opening that connects the internal space of the shell to the outside. It should be noted that removing one side wall does not affect the shape of the outer shell's envelope, so the shell remains cylindrical.

[0244] The element can be a cascaded capacitor element, i.e., a cascaded element; in some implementations, it can also be a wound element. For one example, please refer to... Figure 56 , Figure 56 The diagram shows an anode substrate 111, a cathode substrate 112, and a spacer film 12, which can be considered as a single capacitor cell of stacked elements.

[0245] A spacer membrane, typically electrolytic paper, is placed between the cathode substrate and the anode substrate. This spacer membrane can absorb the electrolyte. In this case, the cathode substrate guides the distribution of the electric field. The actual capacitor is formed between the anode substrate and the electrolyte. That is, the dielectric of the capacitor is the oxide layer on the surface of the anode substrate. Positive charges accumulate on the side of the oxide layer closer to the core material of the anode substrate, and negative charges accumulate on the side closer to the electrolyte.

[0246] A single capacitor cell refers to the smallest unit in a capacitor that can produce capacitance. A single capacitor cell is formed by stacking a cathode substrate and an anode substrate opposite each other (with sufficient spacing to prevent short circuits). When capacitor cells are stacked, they form a stacked capacitor cell. For an example, please refer to [reference needed]. Figure 5 and Figure 55 The elements shown in the two figures are stacked elements 10 formed by stacking capacitor cells together.

[0247] Elastic components can be made of elastic materials, such as rubber, silicone, or plastic, or they can be elastic elements such as springs or leaf springs.

[0248] An interference fit between the elastic element and the cap / sealant means that the elastic element simultaneously abuts against both the cap / sealant and the cap / sealant, and the elastic element is under compression, causing the cap / sealant and the cap / sealant to tend to move away from each other. For an example, please refer to [reference needed]. Figure 33It can be seen that the elastic element abuts against the sealing cap at the first abutment position D1 and against the element (spacer membrane) at the second abutment position D2. The arrangement direction of the first and second abutment positions is exactly along the arrangement direction of the sealing cap and the element. Figure 33 In the embodiment shown, the elastic element is made of elastic material. When the cap and the element simultaneously compress the elastic element, the elastic element will cause the cap and the element to move away from each other.

[0249] Because the elastic element is interference-fitted with the capacitor and the sealing cap, the elastic element can push the capacitor to move away from the sealing cap. Since the capacitor is encapsulated inside the casing, the end of the capacitor facing away from the sealing cap will eventually come into contact with the casing. The elastic element ensures a stable contact relationship between the capacitor and the casing, allowing the capacitor to continuously transfer heat to the casing, thereby dissipating heat through the casing, ensuring heat dissipation capacity, and thus improving the capacitor's heat resistance.

[0250] It should be noted that the elastic element can also ensure that the element does not wobble, thus improving the stability of the capacitor's operation.

[0251] For today's more demanding operating conditions, the reliability of capacitors is difficult to meet expectations.

[0252] To solve the above problems, please refer to Figure 57 This application provides a capacitor assembly 1000, including a capacitor 100 and a fixing member 200. The fixing member includes a connecting part 201 and a fixing part 202 connected to each other; the connecting part is sleeved on the outer periphery of the capacitor; the fixing part is used for fixing to the outside world; wherein, the fixing direction of the fixing part to the outside world is the same as the electrical connection direction of the capacitor.

[0253] Capacitors can be the wound capacitors or multilayer capacitors mentioned above, or they can be solid capacitors, etc. A capacitor assembly is an assembly consisting of a capacitor and a fixing device used to fix the capacitor.

[0254] The connecting part of the fastener is used to connect to the capacitor, and the connection method can be, but is not limited to, bonding, welding or interference fit.

[0255] The connecting part is a fastener used to connect the capacitor. The connecting part is sleeved on the outside of the capacitor and can be connected to the capacitor by means of bonding, welding or interference fit.

[0256] The fixing part is the section of the fastener used for fixed connection to the external environment. Because the fixing part connects to the connecting part, the capacitor can be fixed to the external component after the fixing part is connected. The external component is typically a circuit board, etc. The fixing part can be connected to the external component through interlocking, connecting part fitting, bonding, or soldering.

[0257] The fixed direction refers to the direction in which the force applied to the capacitor is continuously maintained after the fixed part is connected to an external component. For an example, please refer to... Figure 58 and Figure 59 ,visible Figure 58 and Figure 59 In the illustrated embodiment, a fixing hole 2021 is used to achieve the fixing effect. The fixing hole is a hole through which a connector can pass. The connector can be a screw or rivet, etc. For such components, it is obvious that when tightened, a force along the axial direction of the fixing hole can be applied to the capacitor. Figure 58 In the state shown, a force can be provided along the negative y-axis in the figure, so the fixed direction is along the negative y-axis.

[0258] Electrical connection direction refers to the direction in which a capacitor should be close to an external component when they need to be electrically connected; or it can be understood as the arrangement of the electrical connection points between the capacitor and the external component. For an example, please refer to... Figure 58 ,visible Figure 58 The leads shown are straight pins. If soldering is required to the pads on the circuit board, the pads must be below the capacitor. That is, the capacitor needs to be moved in the negative y-axis direction in the diagram to bring the leads into contact with the pads for soldering. Therefore, for... Figure 58 In the embodiment shown, the electrical connection direction is along the negative y-axis direction in the figure.

[0259] In yet another example, please refer to Figure 60 ,visible Figure 60 The terminals shown in the embodiment are bent pins. If soldering is required with pads on the circuit board, the pads must be located to the side of the capacitor. That is, the capacitor needs to be moved in the negative y-axis direction in the figure to bring the terminals into contact with the pads for soldering. Figure 58 In the embodiment shown, the electrical connection direction is along the negative y-axis direction in the figure.

[0260] As can be seen, if the electrical connection direction and the fixing direction are the same, the fixing component can continuously maintain the capacitor's tendency to move in the electrical connection direction. Even if the electrical connection structure (such as the welding structure between the lead-out terminal and the pad) ages and breaks, the capacitor will always be pressed against the electrical connection structure of the external component due to the action of the fixing component, and will not be disconnected, thus improving the reliability of the capacitor.

[0261] The specific capacitance (capacitance per unit volume) of multilayer capacitors needs to be further improved. In traditional multilayer capacitors, the elements with tabs protruding from the substrate need to be relatively long, thus encroaching on the substrate's mounting space and causing a decrease in specific capacitance.

[0262] To solve the above problems, please refer to Figure 61 and Figure 62In a first aspect, this application provides a stacked element 10, including spacer films 12 and substrates 11 stacked alternately; each substrate has a tab 13 connected to its side; the tab includes a root portion 133 and an extension portion 134; the root portion is plate-shaped, and the side of the root portion is connected to the side of the substrate; in the plane of the substrate, the direction in which the root portion protrudes from the substrate is a first direction, and the direction perpendicular to the first direction is a second direction; the extension portion is strip-shaped, one end of the extension portion is connected to one side of the root portion, and the other end protrudes from the root portion along the second direction; the ends of the extension portions of different substrates that protrude from the root portion are connected to each other.

[0263] visible Figure 61 The image shown represents a single capacitor cell. Stacking individual capacitor cells together forms a stacked element. Please refer to [reference needed]. Figure 67 That is, to adopt Figure 61 The stacked elements are formed by stacking individual capacitor cells in the capacitor.

[0264] Please refer to Figure 61 A spacer membrane, typically electrolytic paper, is placed between the cathode substrate and the anode substrate. This spacer membrane can absorb the electrolyte. In this case, the cathode substrate guides the distribution of the electric field. The actual capacitor is formed between the anode substrate and the electrolyte. That is, the dielectric of the capacitor is the oxide layer on the surface of the anode substrate. Positive charges accumulate on the side of the oxide layer closer to the core material of the anode substrate, and negative charges accumulate on the side closer to the electrolyte.

[0265] A tab is a component that connects to a substrate and is used to connect the substrate to an external circuit. Therefore, a cathode substrate has a cathode tab, and an anode substrate has an anode tab. The cathode tabs of different cathode substrates are connected to each other, thereby electrically connecting the cathode substrates to each other; the anode tabs of different anode substrates are connected to each other, thereby electrically connecting the anode substrates to each other.

[0266] Please refer to Figure 61 In this application, the substrate refers to the cathode substrate 112 and the anode substrate 111, and the tab refers to the cathode tab 132 and the anode tab 131. The extensions of the different substrates protruding from the root end are connected to each other, which means that the extensions of the cathode tab are electrically connected to each other, and the extensions of the anode tab are electrically connected to each other. However, the extensions of the cathode tab and the extensions of the anode tab are not connected, that is, the anode substrate and the cathode substrate cannot be electrically connected, otherwise a short circuit will occur.

[0267] Therefore, the fact that at least one end of the extension is distributed in the direction of the tab on the adjacent substrate to be electrically connected to the tab on the adjacent substrate also refers to the relationship between tabs of the same polarity. Taking a cathode tab as an example, the extension of the cathode tab is distributed in the direction of the cathode tab on the adjacent cathode substrate. In this application, unless otherwise specified, when describing the relationship between tabs, the relationship between substrates, and the relationship between tabs and substrates, it refers to the relationship between any two elements of the same polarity (anode or cathode).

[0268] The entire electrode can be connected to an external circuit via lead-out terminals. For an example, please refer to [reference needed]. Figure 72 As can be seen, the sealing cover 20 of the stacked capacitor is provided with two lead terminals 27. The sealing cover is placed on the opening of the outer shell 30 to enclose the stacked element together with the outer shell, providing a stable working environment for the stacked element. The lead terminals are inserted through the sealing cover (in other embodiments, they can also be inserted through the outer shell), with one end inside the outer shell and electrically connected to the tab, and the other end outside the outer shell and electrically connected to the outside, so that the stacked element can be connected to the external circuit.

[0269] The base of the tab is plate-shaped, and the side of the tab is connected to the side of the substrate. Understandably, this means that the base is not connected to the surface of the substrate, and there is no tab to block the substrate and the spacer film. They can be tightly stacked, which improves the specific capacity.

[0270] The root can be connected to the substrate by welding and / or bonding with conductive adhesive, as will be seen below, or the root can be integrally formed with the substrate.

[0271] The extension is a component of the electrode lug used to connect to other electrode lugs. The extension is strip-shaped because it has one end inside the root and another end protruding from the root. The end of the extension inside the root refers to the portion of the extension projected orthographically onto the root that lies within the root; the end of the extension outside the root refers to the portion of the extension projected orthographically onto the root that lies outside the root. Therefore, the strip shape of the extension does not have to be a strip in the conventional sense; it only needs to have the aforementioned two ends.

[0272] The root is connected to the edge of the substrate and is plate-shaped. Therefore, the direction in which the root protrudes from the substrate is also within the plane of the substrate. The direction in which the root protrudes from the substrate is the first direction. For an example, please refer to [reference needed]. Figure 62 , Figure 62 The y-axis direction (regardless of positive or negative) is the first direction. Within the plane of the substrate, the direction perpendicular to the first direction is the second direction. For an example, please refer to... Figure 62 , Figure 62 The x-axis direction (regardless of whether it is positive or negative) is the second direction.

[0273] As described above, the two ends of the extension are as follows: the end where the orthographic projection of the extension onto the root is located inside the root can be directly connected to the root. It should be noted that this end may not contact the surface of the substrate, avoiding a gap between the substrate and the spacer film, allowing the substrate and spacer film to be tightly stacked and improving specific capacity. The end where the orthographic projection of the extension onto the root is located outside the root is equivalent to protruding from the root, and its protrusion direction is along the second direction, meaning it does not substantially encroach on the space in the first direction.

[0274] Please refer to Figure 68 and Figure 69 In one example, the space occupied by the electrode can be calculated as follows: Figure 68 In the middle, the product of the dimensions of the stacked elements along the x-axis and y-axis (i.e., Figure 68 (area occupied by intermediate-layer primes), then multiplied by Figure 69 The pole lug along the y-axis ( Figure 69 The diagram shows the height of the cathode extension and cathode root (i.e., the cathode tab) protruding from the substrate. The product of these three parameters is the total space occupied by the tab. It can be seen that reducing the height of the tab protruding from the substrate can reduce the space occupied by the tab, thereby increasing the specific capacitance of the multilayer capacitor.

[0275] It is evident that by making the extension protrude beyond the root in the second direction, the space in the first direction can be avoided. In the example above, this is equivalent to reducing the height of the tab protruding from the substrate, which can improve the specific capacitance of the capacitor.

[0276] It should be noted that while a solution that directly presses the roots together to connect them without providing extensions might seem to eliminate the need for any change in the height of the tabs protruding from the substrate in the first direction, in reality, such a solution requires the roots to protrude from the substrate by a considerable amount. This is because if the protrusion is too low, the tabs will compress the spacer when they approach each other, potentially damaging it and causing a short circuit between the cathode and anode substrates. Therefore, the roots need to be extremely long, with the ends furthest from the substrate connecting to each other, so that the ends closer to the substrate do not damage the spacer.

[0277] Please refer to Figure 62 Optionally, the extension also protrudes from the root along the first direction and toward the direction away from the substrate; the portion of the extension protruding from the root in the first direction is used for welding connection with an adjacent extension.

[0278] Because the root needs to be connected to the substrate, the surface structure is restricted. For example, when the root is integrally formed with the substrate, the surface structure of the root and the substrate are completely consistent, that is, the surface may have a thicker oxide layer (especially for anode substrates); or the root may need to have the same thickness as the substrate, but in order to ensure that the specific capacitance of the capacitor is sufficient, the substrate may make the root thinner and the strength lower.

[0279] The extension, which is a component that connects to the root later, is not subject to the above constraints. Its surface may have a thin oxide film or no oxide film, making it easy to solder. Therefore, the portion protruding from the root along the first direction and away from the substrate can be used for soldering. In one example, please refer to... Figure 62 As can be seen, along the positive y-axis, the extension is higher than the root, that is, the extension protrudes from the root along the first direction. It can be understood that this part of the extension can be easily welded to each other.

[0280] It should be noted that this welding only serves as an auxiliary connection and does not require tight welding. Therefore, the tabs do not need to be tightly abutted against each other, thus avoiding damage to the spacer membrane. The portion of the extension that protrudes from the root in the first direction does not necessarily cause a significant increase in the height of the tabs, thereby avoiding excessive encroachment on the substrate's mounting space.

[0281] The welding of the portion of the extension that protrudes from the root in the first direction away from the substrate primarily serves a load-bearing function. For an example, please refer to... Figure 72 To secure the stacked element within the housing and prevent it from shifting along the first direction, the lead-out terminal can directly press against the tab along the first direction, pressing the stacked element firmly against the inner wall of the housing to prevent it from shifting. This welding method improves the tab's load-bearing capacity on the lead-out terminal, allowing the lead-out terminal to secure the stacked element with a stronger force.

[0282] Please refer to Figure 63 Optionally, adjacent extensions protrude from one end of the root along the second direction and abut against each other.

[0283] In this embodiment, adjacent extensions directly abut against each other, without relying on intermediate parts for indirect contact. For one example, please refer to... Figure 63 With the positive y-axis direction in the diagram as top and the negative y-axis direction as bottom, the upper extension deforms downward and the lower extension deforms upward, thus directly contacting the middle extension at the same time.

[0284] The directly abutting extensions can also be directly welded to each other. Welding is a convenient and stable connection method that increases the connection strength between the extensions and reduces resistance. Furthermore, in Figure 63 As can be seen in the illustrated embodiment, since the extension bears the deformation role, the root can remain basically undeformed, thereby avoiding damage to the septum by the root.

[0285] Please refer to Figure 64Optionally, the electrode tab also includes a protrusion 138, which is disposed on one end of the extension that protrudes from the root in a second direction; the protrusion protrudes from the extension to the adjacent extension to abut against the adjacent extension.

[0286] The bump is located on one end of the extension that protrudes from the root in the second direction. This means that at least a portion of the bump's orthogonal projection onto the root also protrudes from the root in the second direction, and the portion protruding from the root is connected to the root. The bump is a conductor, so when the bump abuts against the extension of another tab, the two tabs form an electrical connection.

[0287] The term "protrusion from the extension to the adjacent extension" means that, for a given tab, the protrusion belonging to that tab protrudes from the extension of the tab adjacent to it in the direction of the extension of that tab. For an example, please refer to... Figure 64 With the positive y-axis direction as top and the negative y-axis direction as bottom in the figure, the upper bump belongs to the uppermost extension, and it can be seen that it protrudes from the uppermost extension towards the middle extension; the lower bump belongs to the lowermost extension, and it can be seen that it protrudes from the lowermost extension towards the middle extension.

[0288] Figure 64 The embodiment shown can also be understood as follows: both protrusions in the figure belong to the middle extension. It can be seen that the protrusions protrude along the positive and negative directions of the y-axis and the directions of the upper and lower extensions adjacent to the middle extension.

[0289] It is evident that the protrusion of the bump can fill the gap between the extensions, allowing the extensions themselves to remain essentially undeformed, thereby preventing the extensions from causing deformation of the root and further preventing the root from damaging the septum.

[0290] It should be noted that the protrusion can be integrally formed with the extension or welded to the extension.

[0291] Please refer to Figure 65 Optionally, the electrode also includes a pad 139, which is disposed between adjacent roots and connected to at least one adjacent root.

[0292] The pads are placed between adjacent roots to fill the gaps between them and provide mutual support. This can prevent the roots from tilting to the adjacent roots and damaging the spacer membrane, and can also improve the overall load-bearing capacity of the tab (such as the pressure from the lead-out terminals mentioned above).

[0293] The spacer can be a metal component or welded to the root or extension to improve integrity. The spacer can also be an insulator, bonded or interference-fitted between adjacent roots. It should be noted that the spacer may not directly contact the root, as an extension is provided on one side of the root, allowing the spacer to contact the extension to support the root.

[0294] It should be noted that the above-mentioned embodiments of direct contact between extensions, protrusions between extensions, and pads between roots can be combined with each other for two reasons: First, the protrusions and pads are positioned differently, so both can be provided or only one of them can be provided; second, a stacked element often has multiple tabs of the same polarity, so the extensions of some tabs can directly contact each other, while the extensions of some tabs can contact each other through protrusions.

[0295] Please refer to Figure 62 Optionally, the root and the substrate are integrally molded.

[0296] The substrate and the root are integrally molded parts. That is, when the substrate is manufactured using processes such as shearing or punching, a portion of the structure protruding from the substrate edge is retained as the root. Since both the substrate and the root are plate-shaped, there is no need for secondary molding of the root, and the edge of the root naturally connects to the edge of the substrate. This clearly improves manufacturing efficiency.

[0297] Please refer to Figure 66 Optionally, a receiving groove 1331 is provided on the root, and the extension enters the receiving groove to connect with the root; the bottom of the receiving groove exposes the core material of the root.

[0298] If the core material at the root is exposed in the receiving groove, the extension can be directly connected to the core material at the root, which can avoid the influence of the oxide layer on the root surface and reduce the resistance.

[0299] In one example, please refer to Figure 66 , Figure 66 The structure shown is a cross-section, which can be understood as a section that is parallel to both the surface normal direction of the substrate and the first direction. It can be seen that on the cross-section, the core material 1372 of the substrate is exposed to the bottom of the receiving groove, which is equivalent to removing the oxide film 1371.

[0300] Please refer to Figure 67 , Figure 68 and Figure 69 Optionally, the stacked element also includes a fixing tape 15; the fixing tape is wound around the outer side of the substrate and the spacer in the length direction along the axis of the first direction; along the first direction, the side of the fixing tape facing away from the tab is flush with the spacer, and the side of the fixing tape near the tab is also flush with the spacer; the fixing tape covers the spacer along the first direction.

[0301] The fixing tape is wrapped around the outer side of the substrate and spacer to secure them together, preventing them from coming apart and facilitating the insertion of the laminated elements into the casing of the laminated capacitor. The axis of the fixing tape is typically along the first direction, passing through the geometric center of the spacer and substrate.

[0302] Please refer to Figure 69 , Figure 70 and Figure 71 In all three graphs, the y-axis direction is the first direction, indicating that along the y-axis direction... Figure 70 In the middle, the highest points of the fixing tape and the spacer membrane in the y-axis direction (the positive y-axis direction is the height direction) are the same. Figure 71 In this case, the lowest points of the fixing tape and the septum are the same in the y-axis direction, which is the case where "the side of the fixing tape facing away from the tab is flush with the septum along the first direction, and the side of the fixing tape near the tab is also flush with the septum".

[0303] The above-mentioned flush situation can also be understood as making the spacer membrane project onto the fixing tape. Along the first direction, the above-mentioned projection of the spacer membrane does not exceed the fixing tape, and the edge of the spacer membrane in the first direction overlaps with the edge of the fixing tape in the first direction.

[0304] The term "fixing tape covering the spacer along the first direction" means that the spacer is projected orthographically onto the fixing tape, and the orthographic projection of the fixing tape does not exceed the spacer. It should be noted that the above explanation of the projection relationship applies to both the spacer as a whole and the fixing tape as a whole. This is because a single stacked element can have multiple spacers (if the stacked element is set in the form of a capacitor unit, there may only be one spacer), and a single stacked element can also have multiple fixing tapes.

[0305] It should be noted that since the fixing tape is wrapped around the entire outer side of the substrate and the element, it is cylindrical in shape and has sides with different surface normal directions. The above projection relationship can be the projection relationship of any side, or it can be true for all sides.

[0306] As can be seen, the fixing tape covering the spacer membrane and being flush with both sides of the spacer membrane along the first direction can provide a larger range of fixation for the spacer membrane and the substrate, thereby improving the overall strength of the stacked elements.

[0307] It should be noted that the fact that the fixing tape is flush with the spacer film does not mean that the fixing tape is also flush with the substrate. For an example, please refer to... Figure 71As can be seen, the lowest point of the anode substrate along the y-axis is above the lowest point of the fixing tape along the y-axis; while the lowest point of the cathode substrate along the y-axis is below the lowest point of the fixing tape along the y-axis. In this way, the anode substrate can be isolated by the fixing tape, avoiding short circuits caused by contact between the anode substrate and the casing or other structures, while the cathode substrate can be exposed, thus directly contacting the casing for heat dissipation.

[0308] Please refer to Figure 68 , Figure 69 and Figure 70 Optionally, the substrate includes a cathode substrate and an anode substrate, and the tabs include a cathode tab and an anode tab. The cathode tab includes a cathode root 1321 and a cathode extension 1322, and the anode tab includes an anode root 1311 and an anode extension 1312. The cathode substrate, the spacer film, and the anode substrate are stacked alternately in sequence. The cathode root is connected to the cathode substrate, and the anode root is connected to the anode tab. The entire anode tab and the entire cathode tab are arranged along a first direction. The anode extension is connected to the anode root and protrudes from the anode root in the first direction away from the cathode tab. The cathode extension is connected to the cathode root and protrudes from the cathode root in the first direction away from the anode tab.

[0309] In one example, please refer to Figure 68 As can be seen, the cathode extension protrudes from the cathode root along the negative x-axis in the figure, and the anode extension protrudes from the anode root along the positive x-axis in the figure. This is the case in the above embodiment where the anode extension protrudes from the anode root along the first direction away from the cathode tab, and the cathode extension protrudes from the cathode root along the first direction away from the anode tab.

[0310] It is understandable that the interconnection between the extensions may generate high heat (e.g., by welding), or may require the use of conductive materials such as conductive adhesive. Improper operation may damage the substrate or spacer. The above embodiment can keep the interconnection positions of the anode extensions and the interconnection positions of the cathode extensions as far apart as possible. On the one hand, it provides sufficient connection space for the two, and on the other hand, it avoids mutual interference during the connection process, which may cause the heat of the connection process (which may burn the spacer or substrate) or the adhesive (which may conduct electricity between the positive and negative substrates, causing a short circuit) to damage the substrate or spacer.

[0311] It should be noted that the anode extension and the cathode extension can respectively adopt the embodiments described above for the extension; the anode root and the cathode root can respectively adopt the embodiments described above for the root.

[0312] Please refer to Figure 72 This application provides a stacked capacitor 102, including the stacked elements described above.

[0313] It should be noted that features not described in detail in the various embodiments of this application can be found in the descriptions of other embodiments. Without conflict, the various embodiments can be combined arbitrarily, and the combined solutions are also within the protection scope of the embodiments of this application.

[0314] It should be noted that the term "multiple" in this application generally refers to two or more. Furthermore, directional terms used in the embodiments of this application, such as "up," "down," "front," "back," "left," "right," "inner," "outer," and "side," are only for reference to the accompanying drawings. Therefore, the directional terms used are for illustrating and understanding the embodiments of this application, and not for limiting the embodiments of this application. The term "connection" in this application generally refers to a direct connection between two components or an indirect connection achieved through other components. In the various figures, structurally similar units are represented by the same reference numerals. For clarity, the various parts in the figures are not drawn to scale. Additionally, some related parts may not be shown in the figures.

[0315] It should be understood that in the description of this application, terms such as "first" and "second" are used only to distinguish similar objects and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated.

[0316] It is understood that those skilled in the art can combine various implementation methods in the above embodiments under the guidance of the above examples to obtain technical solutions with multiple implementation methods. The above descriptions are merely preferred embodiments of this application and are not intended to limit this application. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the protection scope of this application.

[0317] The various embodiments provided in this application have been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of this application. The descriptions of the embodiments above are only for the purpose of helping to understand this application. Furthermore, those skilled in the art will recognize that, based on the ideas of this application, there will be changes in the specific implementation methods and application scope. Therefore, the content of this specification should not be construed as a limitation of this application.

Claims

1. A multilayer capacitor, characterized in that, include: The outer shell is rectangular in shape, forming an accommodating space and having an opening communicating with the accommodating space; the outer shell includes two opposing first sidewalls, two opposing second sidewalls, and two opposing third sidewalls; a first reinforcing rib is provided on the sidewall with the largest surface area among the first and second sidewalls; the surface areas of the first and second sidewalls are both greater than the surface area of ​​the third sidewall; the first, second, and third sidewalls enclose and form the accommodating space; A second reinforcing rib is provided on the second sidewall; the first reinforcing rib and the second reinforcing rib at least partially protrude into the inner side of the outer shell to abut against the stacked elements; A stacked element includes a cathode substrate and an anode substrate stacked together; the anode substrate is rectangular, and at least one corner is a smooth free curve; the stacked element is disposed within the accommodating space; an anode tab is disposed on one side of the anode substrate; the anode tab is plate-shaped, and the side of the anode tab is connected to the side of the anode substrate; and / or A cathode tab is provided on one side of the cathode substrate; the cathode tab is plate-shaped and the side of the cathode tab is connected to the side of the cathode substrate. A sealing cap is disposed on the opening; the sealing cap includes a support layer, an inner membrane layer, and an outer membrane layer; the inner membrane layer is attached to one side of the support layer for anode insulation of the stacked elements; the outer membrane layer is attached to the side of the support layer opposite to the inner membrane layer, and the outer membrane layer is an insulating layer; wherein, the inner membrane layer is distributed throughout one side of the support layer, and the outer membrane layer is distributed throughout the side of the support layer opposite to the inner membrane layer.

2. The multilayer capacitor according to claim 1, characterized in that, The four corners of the anode substrate are all smooth free curves, and the corners of the anode substrate that are smooth free curves are R-angles.

3. The multilayer capacitor according to claim 2, characterized in that, The four corners of the cathode substrate are all rounded (R-angle).

4. The stacked capacitor according to claim 3, characterized in that, The side of the anode substrate is connected to the side of the anode tab by an R-angle; and / or The side of the cathode substrate is connected to the side of the cathode tab by an R-angle.

5. The multilayer capacitor according to claim 1, characterized in that, The sealing cap also includes a cathode lead-out terminal; the cathode lead-out terminal passes through the support layer and is directly electrically connected to the support layer.

6. The multilayer capacitor according to claim 1, characterized in that, The support layer has an anode hole; the sealing cap also includes an anode lead-out terminal and an injection molded part; the anode lead-out terminal passes through the anode hole and is spaced apart from the support layer; the injection molded part fills the space between the support layer and the anode lead-out terminal to seal the anode hole.

7. The multilayer capacitor according to claim 1, characterized in that, It includes a spacer film and a substrate; the substrate includes the anode substrate and the cathode substrate; the anode substrate, the spacer film and the cathode substrate are alternately stacked; Each of the substrates has a tab connected to its side; The electrode tab includes a root and an extension; the root is plate-shaped, and the side of the root is connected to the side of the substrate; in the plane of the substrate, the direction in which the root protrudes from the substrate is a first direction, and the direction perpendicular to the first direction is a second direction; The extension is strip-shaped, with one end connected to one side of the root and the other end protruding from the root along the second direction; the protruding ends of the extensions of different substrates are connected to each other.

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