Closure cap and capacitor

Abstract

The application provides a sealing cover and a capacitor. The sealing cover is applied to the capacitor and comprises a support layer and an inner film layer. The inner film layer is attached to one side of the support layer, and is used for insulating an anode of a die of the capacitor. Therefore, the sealing cover improves the compactness of the capacitor.

Description

Technical Field

[0001] This application relates to the field of capacitors, specifically to a sealing cap and a capacitor. Background Technology

[0002] With the development of intelligent industries, new requirements have emerged for capacitors. For example, AI servers need to accommodate as many processors as possible within a limited space. If the processors are too sparsely distributed, it will cause difficulties in information transmission between them. Therefore, the components surrounding the processors also need to be highly compact; otherwise, they will encroach on the installation space, forcing the processors to be placed far away. Existing capacitors are insufficient for such applications requiring high space utilization. Summary of the Invention

[0003] The purpose of this application is to improve the compactness of capacitors.

[0004] To address the aforementioned problems, in a first aspect, this application provides a sealing cap for use in a capacitor, comprising a support layer and an inner film layer. The inner film layer is attached to one side of the support layer; the inner film layer serves to provide anode insulation for the capacitor elements.

[0005] Optionally, the sealing cap further includes an outer film layer, which is attached to the side of the support layer opposite to the inner film layer; the outer film layer is an insulating layer.

[0006] Optionally, both the outer membrane layer and the inner membrane layer are sealing layers; the sealing cap further includes an anode lead-out terminal and a cathode lead-out terminal, both of which pass through the support layer; the outer membrane layer is at least partially distributed in the gap between the anode lead-out terminal and the support layer; and / or The outer film layer is at least partially distributed in the gap between the cathode lead-out terminal and the support layer; and / or The inner membrane layer is at least partially distributed in the gap between the anode lead-out terminal and the support layer; and / or The inner membrane layer is at least partially distributed in the gap between the cathode lead-out terminal and the support layer.

[0007] Optionally, the inner membrane layer is distributed across one side of the support layer, and the outer membrane layer is distributed across the side of the support layer opposite to the inner membrane layer.

[0008] Secondly, this application also provides a capacitor, including the aforementioned sealing cap.

[0009] Optionally, the capacitor further includes a housing, an accommodating space is formed inside the housing, an opening communicating with the accommodating space is formed on the surface of the housing, and a sealing cap is disposed on the opening to close the accommodating space; the inner film layer is at least partially distributed between the support layer and the housing.

[0010] Optionally, the capacitor further includes a housing, an accommodating space is formed inside the housing, an opening communicating with the accommodating space is formed on the surface of the housing, and a sealing cap is provided on the opening to close the accommodating space; The sealing cap also includes a cathode lead-out terminal, which passes through the support layer to be electrically connected to the support layer; Both the support layer and the outer shell are conductors; the edge of the support layer is electrically connected to the outer shell.

[0011] Optionally, the support layer is flat and its edges are exposed to the inner membrane layer. The support layer enters the housing at least partially through the opening, and the edges of the support layer directly abut against the housing for electrical connection.

[0012] Optionally, the support layer includes a connected layer body and a flange, the layer body being plate-shaped; the flange is disposed around the periphery of the layer body and distributed toward one side of the layer body; the inner membrane layer is at least partially distributed in the gap between the flange and the outer shell, and at least a portion of the flange directly abuts against the outer shell.

[0013] Optionally, the edge of the support layer is electrically connected to the outer shell by welding and / or bonding with conductive adhesive.

[0014] Existing capacitor caps serve both insulating and supporting functions. The cap must fit snugly against the capacitor casing to withstand pressure from the casing or capacitor elements, while simultaneously insulating the elements to prevent leakage. Because insulating materials often have low specific strength, the cap thickness is extremely large. In this application's solution, a support layer providing support and an inner film layer providing insulation are incorporated. This separates the supporting and insulating functions into different layers. The support layer can have higher specific strength, thus reducing the overall thickness of both the support and inner film layers compared to existing caps. This reduced cap thickness allows for more space for the capacitor elements. Since the capacitor's capacitance is primarily provided by the elements, the greater space occupied by the elements within the same volume increases the capacitor's specific capacitance, allowing for a smaller footprint and improved compactness. Attached Figure Description

[0015] To more clearly illustrate the technical solutions in this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are merely some embodiments of this application. Those skilled in the art can obtain other drawings based on these drawings without any creative effort.

[0016] Figure 1 A three-dimensional structural diagram of the first embodiment of the sealing cap provided in this application; Figure 2 A top view structural diagram of the first embodiment of the sealing cap provided in this application; Figure 3 The first embodiment of the sealing cap provided in this application is in Figure 2 Schematic diagram of the cross-sectional structure in the AA direction; Figure 4 The second embodiment of the sealing cap provided in this application is in Figure 2 Schematic diagram of the cross-sectional structure in the AA direction; Figure 5 The second embodiment of the sealing cap provided in this application is in Figure 4 A magnified structural diagram of part B in the middle section; Figure 6 This is an exploded structural diagram of the first embodiment of the sealing cap provided in this application. Figure 7 This is an exploded structural diagram of a first embodiment of the capacitor provided in this application. Figure 8 A top-view structural diagram of the first embodiment of the capacitor provided in this application; Figure 9 The first embodiment of the capacitor provided in this application is in Figure 8 Schematic diagram of the cross-sectional structure in the CC direction; Figure 10 The first embodiment of the capacitor provided in this application is in Figure 9 A magnified structural diagram of section D; Figure 11 A second embodiment of the capacitor provided in this application is in Figure 8 Schematic diagram of the cross-sectional structure in the CC direction; Figure 12 A second embodiment of the capacitor provided in this application is in Figure 11 A magnified structural diagram of section E in the middle; Figure 13 A third embodiment of the capacitor provided in this application is in Figure 8 Schematic diagram of the cross-sectional structure in the CC direction; Figure 14 A second embodiment of the capacitor provided in this application is in Figure 13 A magnified structural diagram of section F in the middle; Figure 15 This is a schematic diagram of the structure of a second embodiment of the capacitor provided in this application.

[0017] The reference numerals in the attached figures are as follows: Capacitor 100; 10. Stacked elements; 16. Anode lead-out foil; 17. Cathode lead-out foil; 18. Fixing tape; 20. Sealing cap; 21. Support layer; 211. Layer body; 212. Flanged edge; 215. Edge of support layer; 22. Inner film layer; 23. Outer film layer; 24. Anode lead-out terminal; 25. Cathode lead-out terminal; 26. Injection molded part; 30; housing space 31; opening 32; Elastic element 40; Winding element 50; 60 welding blocks. Detailed Implementation

[0018] The following will refer to the appendices in this application. Figure 1 To be continued Figure 15 The technical solutions in this application are clearly and completely described in conjunction with the embodiments. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the protection scope of this application.

[0019] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0020] The technical solution of this application is applicable to electrolytic capacitors, such as aluminum electrolytic capacitors. Among them, aluminum electrolytic capacitors are widely used in precision electronic equipment such as AI servers due to their characteristics of self-healing, large specific capacitance, aging resistance and high cost performance.

[0021] The term "layered" in multilayer capacitors is a concept relative to "winding" in wound capacitors. Specifically, it refers to the shape of the capacitor's core (or stem). Wound capacitors have a coiled core, with the cathode and anode foils wound into a cylindrical shape; typically, only one cathode and anode foil are used. In contrast, multilayer capacitors have a cathode substrate (sheet-like) and an anode substrate stacked together, usually with multiple cathode and anode substrates. The technical solution of this application applies to both multilayer and wound capacitors. It should be noted that in this application, "layered" is used to describe the shape of the capacitor's core and does not limit the type of capacitor; the capacitor can be solid, semi-solid, or liquid, etc.

[0022] Among them, multilayer capacitors are favored by engineers in the field of precision electronic equipment due to their lower ESR (Equivalent Series Resistance) and ESL (Equivalent Series Inductance). Wound capacitors also have broad application prospects due to their fast manufacturing speed and low production cost. However, due to the stringent compactness requirements of electronic equipment, capacitors also need to be more compact.

[0023] To solve the above problems, please refer to Figure 1 , Figure 2 and Figure 3 In a first aspect, this application provides a sealing cap 20 for use in a capacitor, and includes a support layer 21 and an inner film layer 22. The inner film layer is attached to one side of the support layer; the inner film layer is used for anode insulation of the capacitor elements.

[0024] A sealing cap is a component used to seal openings in the casing of a capacitor. For an example, please refer to... Figure 7 The capacitor 100 has an opening 32 on its outer casing 30. Please refer to the reference. Figure 8 and Figure 9 It is evident that the opening connects to the accommodating space 31 formed within the outer casing, and the elements of the capacitor (e.g.) Figure 7 The stacked elements 10 and shown in the figure Figure 15 The wound element 50 shown can enter the accommodating space through the opening, and the sealing cap is then placed on the opening to encapsulate the element inside the outer shell, thus sealing the accommodating space.

[0025] The support layer is a layered component that provides support. For an example, please refer to... Figure 6 As can be seen, the sealing cap is cap-shaped, so the support layer includes a layer body 211 and a flange 212. The layer body is flat, and the flange protrudes from the layer body along the surface normal direction and is annular, encircling the perimeter of the layer body; that is, the support layer is also cap-shaped. In another example, please refer to... Figure 11 As can be seen, the sealing cap is flat, and the support layer is also flat. In summary, the support layer is the supporting element of the sealing cap, and can be considered as the main body of the sealing cap.

[0026] The inner membrane layer is a component attached to one side of the support layer. Attachment can be understood as a connection formed through processes such as spraying, injection molding, dip coating, electrophoresis, pressing, and sintering. The inner membrane layer can be made of plastics such as PFA, PTFE, or PET, thus providing insulating properties. In some embodiments, the inner membrane layer can also be used for sealing (see below), thereby utilizing its moisture-blocking properties.

[0027] The inner membrane layer is used to insulate the anode of the element, meaning that the inner membrane layer separates the anode portion of the element from the support layer.

[0028] The anode portion of a prime varies depending on the prime type. For stacked primes, the anode portion often consists of an anode substrate and an anode lead-out foil. The anode substrate is a plate-shaped element stacked with the cathode substrate (and the spacer film), and the anode lead-out foil is an intermediate component electrically connected to each anode substrate to connect the anode substrate to the outside world. For wound primes, the anode portion often consists of the anode foil and anode lead-out foil mentioned above. Unlike stacked primes, the anode lead-out foil of wound primes is connected to the anode foil.

[0029] The inner membrane layer does not need to be directly positioned between the support layer and the anode portion of the element. Instead, it only needs to ensure that the anode portion of the element does not contact the support layer after the element is encapsulated within the outer casing. Therefore, in one example, the anode portion of the element closest to the support layer is often the anode lead-out foil. It is sufficient to ensure that the anode lead-out foil is at least partially positioned opposite the inner membrane layer along its surface normal. This way, even if the element presses against the support layer, the anode lead-out foil will still abut against the inner membrane layer, thus preventing the element from moving further towards the support layer and avoiding contact between the anode portion of the element and the support layer.

[0030] In one example, please refer to Figure 7 As can be seen, the support layer and the inner membrane layer have essentially the same shape, meaning the inner membrane layer covers one side of the support layer. Therefore, the anode portion of the element (in the embodiment shown, mainly the anode lead-out foil 16) cannot contact the support layer. It should be noted that in other embodiments, the inner membrane layer may only cover a portion of the support layer. For one example, please refer to... Figure 7 The cathode lead-out foil 17 can abut against the support layer, so the part covered by the orthogonal projection of the cathode lead-out foil onto the support layer does not need to be provided with an inner film layer.

[0031] As can be seen, due to the design of the inner film layer, the material selection for the support layer does not need to consider insulation, and therefore materials with higher strength can be selected, such as carbon fiber, iron and iron-based alloys, copper and copper-based alloys, aluminum and aluminum-based alloys, titanium and titanium-based alloys, and tantalum and tantalum-based alloys. In particular, when used in aluminum electrolytic capacitors, pure aluminum can be used, and when used in tantalum electrolytic capacitors, pure tantalum can be used.

[0032] In this way, the total thickness of the support layer and the inner film layer can be much smaller than that of the traditional sealing cap with butyl rubber as the plate body. The thickness space saved by the sealing cap can be used to set the element, so that the same size shell can be fitted with a larger element after using the sealing cap provided by the technical solution of this application, thereby increasing the specific capacitance of the capacitor and thus improving the compactness of the capacitor (i.e., providing a larger capacitance in a smaller volume).

[0033] It should be noted that using an attachment method to connect the inner film layer and the support layer can also reduce the thickness of the inner film layer. This is because simple wrapping or sleeve-like connection methods cannot form a tight bond, easily creating air gaps between the inner film layer and the support layer. These air gaps are prone to breakdown under high voltage, leading to insulation failure. Therefore, the inner film layer needs to be made thicker to ensure insulation. The attachment method, on the other hand, allows the inner film layer and the support layer to fit tightly together, avoiding the existence of air gaps, and insulation can be guaranteed with a smaller thickness.

[0034] Please refer to Figure 2 and Figure 3 Optionally, the sealing cap may also include an outer membrane layer 23, which is attached to the side of the support layer facing away from the inner membrane layer; the outer membrane layer is an insulating layer.

[0035] The outer membrane layer is a component attached to the support layer on the side facing away from the inner membrane layer. Attachment can be understood as a connection formed through processes such as spraying, injection molding, dip coating, electrophoresis, pressing, and sintering. The outer membrane layer can be made of plastics such as PFA, PTFE, or PET, thus providing insulating properties. In some embodiments, the outer membrane layer can also be used for sealing (see below), thereby utilizing its moisture-blocking properties.

[0036] Capacitors also need to be insulated from the outside. Compared to the solution of wrapping the capacitor with insulating plastic, attaching the insulating layer directly to the outside of the support layer is the same principle as the attachment of the inner film layer mentioned above. Since it can avoid air gaps between the outer film layer and the support layer, the outer film layer can be made thinner, thereby avoiding the capacitor from encroaching on the external space and improving the compactness of the capacitor (when considering the compactness of the capacitor with the external components as a whole).

[0037] Please refer to Figure 4 Optionally, both the outer and inner membrane layers are sealing layers; the sealing cap also includes an anode lead-out terminal 24 and a cathode lead-out terminal 25, both of which are disposed in the support layer; the outer membrane layer is at least partially distributed in the gap between the anode lead-out terminal and the support layer.

[0038] The anode lead is used to electrically connect to the anode portion of the capacitor element, so as to connect the anode portion of the element to an external circuit; the cathode lead is used to electrically connect to the cathode portion of the capacitor element, so as to connect the cathode portion of the capacitor element to an external circuit.

[0039] The cathode portion of a prime is similar to the anode portion described above, but varies depending on the prime type. For stacked primes, the cathode portion often consists of a cathode substrate and cathode lead-out foils. The cathode substrate is a plate-shaped element stacked with the anode substrate (and spacer film), and the cathode lead-out foils are electrically connected to each cathode substrate, serving as an intermediary connecting the cathode substrate to the outside world. For wound primes, the cathode portion often consists of the cathode foil and cathode lead-out foils mentioned above. Unlike stacked primes, the cathode lead-out foils of wound primes are connected to the cathode foil.

[0040] Because the anode and cathode leads need to pass through the support layer, with one end exposed in the housing space and the other end exposed to the outside world to connect with the external circuit and the capacitor, gaps will be generated between the anode and cathode leads and the support layer. If the seal is not tight, external contaminants may enter the capacitor. For electrolytic capacitors, this may also cause electrolyte loss (evaporation loss), resulting in the capacitor not working properly.

[0041] Typically, thicker sealing sleeves are required on the cathode and anode leads to seal the gaps between them and the support layer. For some embodiments of this application, please refer to... Figure 4 and Figure 5 As can be seen, part of the outer film layer is distributed in the gap between the anode lead and the support layer, which can seal the gap between the anode lead and the support layer. As mentioned above, the outer film layer can have a smaller thickness, so it can occupy less space compared to conventional sealing solutions, thereby improving the compactness of the capacitor.

[0042] Please refer to Figure 4 and Figure 5 Optionally, the outer film layer is at least partially distributed in the gap between the cathode lead-out terminal and the support layer.

[0043] Please refer to some embodiments of this application. Figure 4 and Figure 5 As can be seen, part of the outer film layer is distributed in the gap between the cathode lead-out terminal and the support layer, which can seal the gap between the cathode lead-out terminal and the support layer. As mentioned above, the outer film layer can have a smaller thickness, so it can occupy less space compared to conventional sealing schemes, thereby improving the compactness of the capacitor.

[0044] Please refer to Figure 4 and Figure 5 Optionally, the inner membrane layer is at least partially distributed in the gap between the anode lead-out terminal and the support layer.

[0045] Please refer to some embodiments of this application. Figure 4 and Figure 5As can be seen, part of the inner film layer is distributed in the gap between the anode lead and the support layer, which can seal the gap between the anode lead and the support layer. As mentioned above, the inner film layer can have a smaller thickness, so it can occupy less space compared to conventional sealing solutions, thereby improving the compactness of the capacitor.

[0046] Please refer to Figure 4 and Figure 5 Optionally, the inner film layer is at least partially distributed in the gap between the cathode lead-out terminal and the support layer.

[0047] Please refer to some embodiments of this application. Figure 4 and Figure 5 As can be seen, part of the inner film layer is distributed in the gap between the cathode lead-out terminal and the support layer, which can seal the gap between the cathode lead-out terminal and the support layer. As mentioned above, the inner film layer can have a smaller thickness, so it can occupy less space compared to conventional sealing solutions, thereby improving the compactness of the capacitor.

[0048] It should be noted that the inner and outer film layers can be used to seal the cathode and anode leads only on one side of the sealing cap, i.e., only one of the inner or outer film layers is used for sealing. This can further reduce the increase in thickness caused by sealing and improve compactness.

[0049] It should be noted that the inner and outer film layers can seal only one of the cathode and anode leads, i.e., only the cathode or anode lead is sealed. For an example, please refer to... Figure 3 It can be seen that an injection molded part 26 is provided, which is filled between the anode lead-out terminal and the support layer to seal the anode lead-out terminal and the support layer.

[0050] Using injection-molded parts to seal the anode leads can specifically enhance the sealing of the anode leads, while also providing insulation to prevent breakdown due to potential difference between the anode and the sealing cap. The injection-molded parts can be made of the same material as the inner and / or outer film layers, and can be directly injection-molded onto the support layer. During the injection molding process, the injection-molded parts are integrated with the outer and / or inner film layers, improving sealing performance.

[0051] It should be noted that the outer and inner film layers may not extend into the periphery of the cathode lead-out terminals, allowing the cathode lead-out terminals to directly contact the support layer. For an example, please refer to... Figure 5It can be seen that the outer and inner film layers enter the periphery of the anode lead-out terminal, thus preventing the anode lead-out terminal from directly contacting the support layer, which serves both a sealing and insulation function; however, the outer and inner film layers do not enter the periphery of the cathode lead-out terminal, and the cathode lead-out terminal directly abuts against the support layer.

[0052] When the cathode lead-out terminal abuts against the support layer, the support layer can be made of a conductor (such as aluminum and tantalum mentioned above). This allows the support layer to connect to a low potential (cathode), forming a good electromagnetic shielding effect and ensuring stable operation of the capacitor.

[0053] Please refer to Figure 6 Optionally, the inner membrane layer is distributed on one side of the support layer, and the outer membrane layer is distributed on the side of the support layer opposite to the inner membrane layer.

[0054] exist Figure 6 In the illustrated embodiment, the inner and outer film layers are substantially the same shape as the support layer, which is an embodiment where the inner and outer film layers are distributed across one side of the support layer. The inner and outer film layers being distributed across both sides of the support layer simplifies the overall forming of the inner, outer, and support layers. It is understood that before cutting (or using punching or other processes) the support layer from the solid sheet material, film layers can be attached to both sides of the sheet material. After the support layer is cut along with the sheet material and holes are made for the anode and cathode leads, the outer and inner film layers are naturally formed, simplifying manufacturing.

[0055] Even if the inner and outer membrane layers are produced after the support layer is made, since the inner and outer membrane layers are distributed on one side of the support layer, there is no need to consider the precise control setting range, thus reducing the precision required for manufacturing.

[0056] In addition, the extensive inner and outer membrane layers provide more comprehensive insulation and sealing performance.

[0057] Please refer to Figure 7 Secondly, this application also provides a capacitor, including the aforementioned sealing cap.

[0058] exist Figure 7 The image exemplifies the components that may be used in a multilayer capacitor. The retaining tape 18 can be used to secure the multilayer elements and prevent them from unraveling. Of course, in other embodiments, the multilayer elements can be secured solely by the housing. The elastic element 40 can be used to abut against the sealing cap and the multilayer elements, thereby pressing the multilayer elements firmly within the housing and preventing them from shifting.

[0059] Figure 15 The example demonstrates the way the winding element of a wound capacitor mates with the sealing cap. It should be noted that... Figure 15The display shows the assembly formed by the wound element and the sealing cap, before it is assembled into the housing. Once assembled into the housing, the sealing cap and the wound element are coaxially positioned.

[0060] It is evident that when sealing caps are applied to different types of capacitors, they can have different shapes.

[0061] Please refer to Figure 7 , Figure 8 , Figure 9 and Figure 10 Optionally, the capacitor also includes a housing, an accommodating space formed inside the housing, an opening communicating with the accommodating space formed on the surface of the housing, and a sealing cap covering the opening to close the accommodating space; the inner film layer is at least partially distributed between the support layer and the housing.

[0062] Figure 10 As can be seen, the inner membrane layer is distributed between the outer shell and the support layer, thus playing a sealing role. As mentioned above, the thickness of the sealing layer can be relatively thin. By using the inner membrane layer to seal between the support layer and the outer shell, the required thickness for sealing can be reduced. Since the sealing material is a flexible material, if the thickness of the sealing material between the support layer and the outer shell along the radial direction of the sealing cap is too large, the sealing cap is prone to loosening. Therefore, the technical solution of this application reduces the thickness of the sealing material between the support layer and the outer shell, thereby improving the stability of the sealing cap.

[0063] Please refer to Figure 11 , Figure 12 , Figure 13 and Figure 14 Optionally, the capacitor also includes a housing, an accommodating space is formed inside the housing, and an opening communicating with the accommodating space is formed on the surface of the housing. A sealing cap is placed on the opening to close the accommodating space. The sealing cap also includes a cathode lead terminal, which passes through the support layer to be electrically connected to the support layer. Both the support layer and the housing are conductors. The edge 215 of the support layer is electrically connected to the housing.

[0064] The cathode lead-out terminal can be electrically connected by direct contact with the support layer, or it can be electrically connected by integral molding with the support layer through welding or other methods.

[0065] As can be seen, both the support layer and the outer shell are electrically connected to the cathode lead-out terminal. When the capacitor is working, the outer shell and the support layer form a conductor cavity with a low potential, which can provide better electromagnetic shielding for the capacitor.

[0066] Please refer to Figure 11 and Figure 12 Optionally, the support layer is flat and its edges are exposed to the inner membrane layer. The support layer enters the housing at least partially through an opening, and the edges of the support layer directly abut against the housing for electrical connection.

[0067] When the edge of the support layer is exposed to the inner film layer, it can directly contact the outer shell to form an electrical connection when the sealing cap is at least partially inserted into the outer shell. That is, the sealing cap only needs to be pressed into the outer shell to achieve electrical connection, without the need for secondary processes to form an electrical connection relationship, which makes the manufacturing of capacitors simpler and cheaper.

[0068] Please refer to Figure 6 and Figure 10 Optionally, the support layer includes a connected layer body and a flange, the layer body being plate-shaped; the flange is disposed around the periphery of the layer body and distributed toward one side of the layer body; the inner membrane layer is at least partially distributed in the gap between the flange and the outer shell, and at least a portion of the flange directly abuts against the outer shell.

[0069] The layer body is the main part of the support layer, and the flanges are set on the periphery of the layer body. The flanges can be integrally formed with the layer body, for example, the flanges can be stamped out on the periphery of the layer body using a stamping process. The flanges can also be welded to the layer body.

[0070] The flange design increases the available contact area between the support layer and the outer shell, thereby improving the stability between the cap and the outer shell. Furthermore, if a film layer is attached to the flange, for example... Figure 10 As shown, the radially outer side of the flange is covered with an inner film layer, which improves the seal between the cap and the outer shell because the electrolyte needs to travel a longer sealed path to dissipate to the outside. If the flange is not covered with a film layer (or only slightly covered), the contact resistance between the support layer and the outer shell can be reduced, thus preventing overheating.

[0071] Please refer to Figure 13 and Figure 14 Optionally, the edges of the support layer are electrically connected to the outer casing by welding and / or bonding with conductive adhesive.

[0072] Figure 14 The image shows a solder block 60, which is an auxiliary element for welding. The solder block can be attached to the edge of the support layer on one side (for...). Figure 14 In the embodiment shown, the edge of the support layer is welded on the flange, and the other side is welded to the outer shell, thereby connecting the support layer and the outer shell by welding.

[0073] In other embodiments, the support layer and the outer shell can be directly welded without the aid of auxiliary components. In this case, the presence of the inner or outer film layer is not a concern, and the film layer can be directly destroyed to complete the welding at the welding temperature of the metal.

[0074] In other embodiments, conductive adhesive can be used to bond the edges of the support layer and the outer shell, thereby completing the bonding under low-temperature conditions; it should be noted that the conductive adhesive can be applied in the same way as... Figure 14 The welding blocks are arranged as shown in the figure.

[0075] Of course, welding and conductive adhesive bonding can be used simultaneously at different locations to meet the connection needs of different locations.

[0076] Whether by welding or conductive adhesive bonding, a stable electrical connection can be provided, ensuring a good electrical connection and avoiding loose connections. Welding and conductive adhesive bonding can also strengthen the seal and improve the connection strength between the cap and the outer shell.

[0077] It should be noted that the sealing cap and capacitor in the embodiments of this application are different subjects under the same inventive concept. Features not described in detail in each embodiment can be referred to in the description of other embodiments. Under the premise of no conflict, the various embodiments can be combined arbitrarily, and the combined solution is also within the protection scope of the embodiments of this application.

[0078] It should be noted that the term "multiple" in this application generally refers to two or more. Furthermore, directional terms used in the embodiments of this application, such as "up," "down," "front," "back," "left," "right," "inner," "outer," and "side," are only for reference to the accompanying drawings. Therefore, the directional terms used are for illustrating and understanding the embodiments of this application, and not for limiting the embodiments of this application. The term "connection" in this application generally refers to a direct connection between two components or an indirect connection achieved through other components. In the various figures, structurally similar units are represented by the same reference numerals. For clarity, the various parts in the figures are not drawn to scale. Additionally, some related parts may not be shown in the figures.

[0079] It should be understood that in the description of this application, terms such as "first" and "second" are used only to distinguish similar objects and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated.

[0080] It is understood that those skilled in the art can combine various implementation methods in the above embodiments under the guidance of the above examples to obtain technical solutions with multiple implementation methods. The above descriptions are merely preferred embodiments of this application and are not intended to limit this application. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the protection scope of this application.

[0081] The sealing cap and capacitor provided in this application have been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of this application. The descriptions of the embodiments above are only for the purpose of helping to understand this application. Furthermore, those skilled in the art will recognize that, based on the ideas of this application, there will be changes in the specific implementation methods and application scope. Therefore, the content of this specification should not be construed as a limitation of this application.

Claims

1. A sealing cap, characterized in that, Applied to capacitors, the sealing cap includes: Support layer; An inner membrane layer is attached to one side of the support layer; the inner membrane layer is used for anode insulation of the capacitor elements.

2. The sealing cap according to claim 1, characterized in that, The sealing cap also includes an outer film layer, which is attached to the side of the support layer opposite to the inner film layer; the outer film layer is an insulating layer.

3. The sealing cap according to claim 2, characterized in that, Both the outer membrane layer and the inner membrane layer are sealing layers; the sealing cap further includes an anode lead-out terminal and a cathode lead-out terminal, both of which pass through the support layer; the outer membrane layer is at least partially distributed in the gap between the anode lead-out terminal and the support layer; and / or The outer film layer is at least partially distributed in the gap between the cathode lead-out terminal and the support layer; and / or The inner membrane layer is at least partially distributed in the gap between the anode lead-out terminal and the support layer; and / or The inner membrane layer is at least partially distributed in the gap between the cathode lead-out terminal and the support layer.

4. The sealing cap according to claim 2, characterized in that, The inner membrane layer is distributed along one side of the support layer, and the outer membrane layer is distributed along the side of the support layer opposite to the inner membrane layer.

5. A capacitor, characterized in that, Including the sealing cap as described in any one of claims 1-4.

6. The capacitor according to claim 5, characterized in that, The capacitor also includes a housing, an accommodating space is formed inside the housing, an opening communicating with the accommodating space is formed on the surface of the housing, and a sealing cap is provided on the opening to close the accommodating space; The inner membrane layer is at least partially distributed between the support layer and the outer shell.

7. The capacitor according to claim 5, characterized in that, The capacitor also includes a housing, an accommodating space is formed inside the housing, an opening communicating with the accommodating space is formed on the surface of the housing, and a sealing cap is provided on the opening to close the accommodating space; The sealing cap also includes a cathode lead-out terminal, which passes through the support layer to be electrically connected to the support layer; Both the support layer and the outer shell are conductors; the edge of the support layer is electrically connected to the outer shell.

8. The capacitor according to claim 7, characterized in that, The support layer is flat and its edges are exposed to the inner membrane layer. The support layer enters the outer shell at least partially through the opening, and the edges of the support layer at least partially abut against the outer shell for electrical connection with the outer shell.

9. The capacitor according to claim 7, characterized in that, The support layer includes a connected layer body and a flange, the layer body being plate-shaped; the flange is disposed around the periphery of the layer body and distributed toward one side of the layer body; the inner membrane layer is at least partially distributed in the gap between the flange and the outer shell, and at least a portion of the flange directly abuts against the outer shell.

10. The capacitor according to claim 7, characterized in that, The edge of the support layer is electrically connected to the outer shell by welding and / or bonding with conductive adhesive.

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