Ultra-small aperture high-strength microchannel plate and method for manufacturing the same

Abstract

The present application relates to the technical field of microchannel plate, and discloses a super-small-aperture high-strength microchannel plate, which comprises: an effective working area, which has a microchannel array structure with millions of microchannel apertures, each of which is micron-level; and a solid edge, which is surrounded outside the effective working area and is combined with the outer edge of the effective working area to form an integrated structure; wherein the solid edge part is thicker than the effective working area and has higher strength. The super-small-aperture high-strength microchannel plate provided by the present application significantly reduces the deformation coefficient of the microchannel plate, improves the strength, and meets the environmental adaptability requirements of super-small-aperture and ultra-thin microchannel plate devices in impact vibration and the like.

Description

Technical Field

[0001] This invention relates to the field of microchannel plate technology, and more specifically to an ultra-small aperture high-strength microchannel plate and its preparation method. Background Technology

[0002] A microchannel plate (MCP) is a two-dimensional electron multiplier array consisting of millions to tens of millions of through channels with apertures ranging from several micrometers to tens of micrometers. It has high spatial and temporal resolution and can directly detect various particles such as electrons, ions, and neutral atoms, as well as various signals such as ultraviolet rays and X-rays.

[0003] In the field of electron multiplication, microchannel plates are a type of vacuum electron multiplier device, others including channel electron multipliers and darad electron multipliers. Besides vacuum electron multipliers, there are also solid-state electron multiplier devices, including semiconductors. Vacuum electron multiplier devices have a significant advantage in noise reduction, and microchannel plates, in particular, offer excellent time and spatial resolution, making them irreplaceable in applications requiring high time and spatial resolution.

[0004] With the continuous development of microchannel plate applications, the spatial and temporal resolution performance of microchannel plates is becoming increasingly demanding. The most crucial determining parameters for spatial resolution are aperture and aperture spacing; smaller apertures result in higher spatial resolution. Temporal resolution is directly related to the total path length for electron multiplication; therefore, shorter channels lead to higher temporal resolution. To achieve sufficient gain, the aspect ratio of the channels is typically controlled within a certain range, such as 40:1-60:1. Thus, the development trends for temporal and spatial resolution are consistent. Therefore, a key development direction for high-performance microchannel plates is small-aperture, ultra-thin microchannel plates. As the thickness of microchannel plates decreases, when the aperture reaches 4 micrometers or less, the plate thickness must be less than 0.25 mm, leading to increasingly poor mechanical properties that cannot meet the environmental adaptability requirements such as shock and vibration in the devices used.

[0005] While reducing the aperture, the plate thickness is kept the same to ensure sufficient mechanical strength. However, this results in a larger aspect ratio, requiring a higher operating voltage to achieve the desired gain. The higher operating voltage also leads to greater noise. At the same time, the electron multiplication path is longer, and the transit time dispersion increases, which is detrimental to the improvement of time performance.

[0006] Replacing the glass material with one that has stronger structural strength, such as using a quartz glass substrate to prepare MCP, can alleviate this problem to some extent, but it cannot completely solve it; it only shifts the critical point slightly towards a thinner direction. Summary of the Invention

[0007] In view of the defects and deficiencies in the mechanical properties and strength of existing microchannel plates under the requirements of ultra-low aperture size and low wall thickness, this invention aims to propose an ultra-small aperture high-strength microchannel plate that significantly reduces the deformation coefficient of the microchannel plate, improves its strength, and meets the environmental adaptability requirements of ultra-small aperture and ultra-thin microchannel plate devices under impact and vibration.

[0008] According to a first aspect of the present invention, a high-strength microchannel plate with ultra-small aperture is provided, comprising: The effective working area features a microchannel array structure with millions of channels, each with a micrometer-scale aperture; and A solid edge surrounds the outside of the effective working area and combines with the outer edge of the effective working area to form an integral structure; The solid edge portion is thicker than the effective working area and has higher strength.

[0009] As an optional implementation, the channel aperture of the effective working area is less than 4 μm, the plate thickness of the effective working area is 0.05 to 0.25 mm, and the bevel angle is 4 to 12°.

[0010] As an optional implementation, the solid edge is composed of a base of equal thickness that is directly connected to the effective working area, and a reinforcing ring superimposed on and combined with the base, wherein the base and the reinforcing ring are made of the same glass material.

[0011] As an optional implementation, the thickness of the reinforcing ring is 0.2mm-2mm, the outer circle and inner circle of the reinforcing ring are concentric, and the radial width of the reinforcing ring is in the range of 2mm-5mm.

[0012] As an optional implementation, the inner circular side of the reinforcing ring is an inclined surface with an inclination angle of 30°-60°.

[0013] As an optional implementation, the inclined surface of the reinforcing ring is configured such that the inner diameter of the side closer to the effective working area is smaller, and the inner diameter of the side farther from the effective working area is larger.

[0014] As an optional implementation, the reinforcing ring is made of the same glass material as the base of the solid edge, which is cold-processed and polished into a sheet of the required thickness, and then laser-cut into a ring that fits the shape of the base. The tilt angle of the inner ring is controlled by controlling the angle of the laser beam.

[0015] In a second aspect of the present invention, a method for preparing an ultra-small aperture, high-strength microchannel plate is also provided, comprising the following steps: Using core glass rods and skin glass tubes for microchannel plates as raw materials, an MCP blank is prepared according to the MCP preparation process, which includes an effective working area and a solid edge substrate with the same thickness that is combined with the effective working area. Polish the MCP blank to the preset plate thickness of 0.05mm-0.25mm; Using the same glass material as the solid edge substrate of the MCP blank, the sheet is cold-worked and polished into a thin sheet of the required thickness, and then laser-cut into a ring that fits the shape of the substrate to obtain a reinforcing ring with a thickness of 0.2mm-2mm. The reinforcing ring is superimposed onto the surface of the solid edge base and combined to form an integral structure; The combined integrated structure is then subjected to subsequent etching, pore-forming, and coating processes to be processed into a finished microchannel plate.

[0016] As an optional implementation, laser welding is used to combine the reinforcing ring with the solid edge substrate into a single structure.

[0017] As an optional implementation, a bonding process is used to combine the reinforcing ring with the solid edge substrate into a single structure.

[0018] It should be understood that all combinations of the foregoing concepts and the additional concepts described in more detail below may be considered part of the inventive subject matter of this disclosure, provided that such concepts do not contradict each other. Furthermore, all combinations of the claimed subject matter are considered part of the inventive subject matter of this disclosure.

[0019] The foregoing and other aspects, embodiments, and features of the teachings of the present invention will be more fully understood from the following description in conjunction with the accompanying drawings. Other additional aspects of the invention, such as features and / or beneficial effects of exemplary embodiments, will become apparent from the following description or may be learned through practice of specific embodiments according to the teachings of the present invention. Attached Figure Description

[0020] The accompanying drawings are not intended to be drawn to scale. In the drawings, each identical or nearly identical component shown in the various figures may be denoted by the same reference numeral. For clarity, not every component is labeled in each figure. Embodiments of various aspects of the invention will now be described by way of example and with reference to the accompanying drawings.

[0021] Figure 1 This is a schematic diagram of the surface and cross-section of a conventional microchannel plate structure in the control group of an exemplary embodiment of the present invention.

[0022] Figure 2 This is a schematic diagram of the surface and cross-section of a high-strength microchannel plate with ultra-small aperture according to an exemplary embodiment of the present invention.

[0023] Figure 3This is a schematic diagram of the processing steps of an exemplary embodiment of the present invention.

[0024] Figure 4 This is a schematic diagram of the reinforcing ring in an exemplary embodiment of the present invention.

[0025] Figure 5 This is a schematic diagram of the structure of the laser welding processing apparatus in an exemplary embodiment of the present invention.

[0026] Explanation of reference numerals in the attached figures: 1- Solid edge portion of a conventional microchannel plate; 2- Effective area portion of a conventional microchannel plate; 3- Cross-section of a conventional microchannel plate; 4- Reinforcing ring of a high-strength microchannel plate solid edge; 5- Original solid edge of an ultra-small aperture microchannel plate; 6- Effective area of ​​a small aperture high-strength microchannel plate; 7- Schematic diagram of the cross-sectional structure of a solid edge reinforced microchannel plate; 8- Polished microchannel plate blank; 9- Welding / bonding of the microchannel plate and reinforcing ring; 10- Microchannel plate after etching and hydrogen reduction; 11- Microchannel plate after input / output surface coating; 12- Inclination angle of the inner boundary of the reinforcing ring; 13- Laser welding head; 14- Junction between the reinforcing ring and the solid edge of the microchannel plate blank; 15- Rotation shaft. Detailed Implementation

[0027] To better understand the technical content of the present invention, specific embodiments are described below in conjunction with the accompanying drawings.

[0028] Various aspects of the invention are described in this disclosure with reference to the accompanying drawings, which illustrate numerous illustrative embodiments. The embodiments of this disclosure are not necessarily intended to encompass all aspects of the invention. It should be understood that the various concepts and embodiments described above, as well as those described in more detail below, can be implemented in any of many ways, because the concepts and embodiments disclosed herein are not limited to any particular implementation. Furthermore, some aspects of the invention disclosed may be used alone or in any suitable combination with other aspects of the invention disclosed.

[0029] {Example 1} Combined with appendix Figure 2-5 As shown, the ultra-small aperture high-strength microchannel plate according to an embodiment of the present invention includes a solid edge and an effective working area. The solid edge portion is thicker than the effective working area and has higher strength.

[0030] The effective working area 6 has a microchannel array structure with millions of channels, each with a micrometer-level aperture. The channel aperture of the effective working area is less than 4μm, the plate thickness of the effective working area is 0.05 to 0.25 mm, and the bevel angle is 4 to 12°.

[0031] The solid edge surrounds the outside of the effective working area and combines with the outer edge of the effective working area to form an integral structure.

[0032] As an optional implementation, the solid edge consists of a substrate 5 of equal thickness directly connected to the effective working area, and a reinforcing ring 4 superimposed and bonded to the substrate. The substrate 5 and the reinforcing ring 4 are made of the same glass material. In various embodiments of the present invention, the substrate 5 is the original solid edge of the microchannel plate, that is, the solid edge portion in the MCP blank prepared according to the conventional MCP preparation process.

[0033] Combination Figure 2-4 As an optional implementation, the thickness of the reinforcing ring 5 is 0.2mm-2mm, the outer circle and the inner circle of the reinforcing ring are concentric, and the radial width of the reinforcing ring is 2mm-5mm.

[0034] The inner circle of the reinforcing ring is an inclined surface with an inclination angle of 30°-60°. The inclined surface of the reinforcing ring is designed such that the inner diameter of the side closer to the effective working area is smaller, and the inner diameter of the side farther away from the effective working area is larger.

[0035] As an optional implementation, the reinforcing ring 5 is made of the same glass material as the substrate of the solid edge, which is cold-processed and polished into a sheet of the required thickness and then laser-cut into a ring that fits the shape of the substrate. The tilt angle of the inner ring is controlled by controlling the angle of the laser beam.

[0036] According to embodiments of the present invention, a method for preparing the aforementioned ultra-small aperture high-strength microchannel plate is also provided, comprising the following steps: Using core glass rods and skin glass tubes for microchannel plates as raw materials, an MCP blank is prepared according to the MCP preparation process, which includes the effective working area and a solid edge substrate with the same thickness that is combined with the effective working area. Polish the MCP blank to the preset plate thickness of 0.05mm-0.25mm; Using the same glass material as the solid edge substrate of the MCP blank, the sheet is cold-worked and polished into a thin sheet of the required thickness, and then laser-cut into a ring that fits the shape of the substrate to obtain a reinforcing ring with a thickness of 0.2mm-2mm. The reinforcing ring is superimposed onto the surface of the solid edge base and combined to form an integral structure; The combined integrated structure is then subjected to subsequent etching, pore-forming, and coating processes to be processed into a finished microchannel plate.

[0037] As an optional implementation, laser welding is used to combine the reinforcing ring with the solid edge substrate into a single structure.

[0038] As an optional implementation, a bonding process is used to combine the reinforcing ring with the solid edge substrate into a single structure.

[0039] {Example 2} In this embodiment, we will elaborate on the preparation of the aforementioned ultra-small aperture high-strength microchannel plate in more detail with specific embodiments.

[0040] In this embodiment, using existing typical glass-containing materials (core material and rod material) as examples, MCP screen segments are prepared through existing traditional MCP preparation processes, such as wire drawing, screen assembly, and screen pressing, with apertures less than or equal to 4μm. A certain thickness of MCP blank is then prepared through cold cutting, with the blank thickness ranging from 0.05mm to 0.25mm. The MCP blank has an effective working area and a solid edge base 4 of the same thickness that is combined with the effective working area. The MCP blank is then polished, using double-sided and / or single-sided polishing to the required thickness, for example, 0.20mm-0.25mm.

[0041] Using the same glass material as the solid edge substrate, the glass is cold-processed and polished into a sheet of the required thickness, and then laser-cut into a ring that fits the shape of the substrate, resulting in a reinforcing ring 5 with a thickness of 0.2mm-2mm.

[0042] Then, the MCP blank is combined with the designed and processed reinforcing ring by laser welding or bonding. The reinforcing ring forms a whole to enhance the strength of the MCP blank. Subsequent processes such as etching, hydrogen reduction, ALD film preparation, and electrode plating are then carried out to form an ultra-thin, high-strength microchannel plate with ultra-small aperture.

[0043] Step 1: Fabrication of MCP blanks. This can be achieved in two ways in this invention. The first method involves preparing MCP screen segments according to conventional MCP manufacturing processes, including wire drawing, screen assembly, and screen pressing, with apertures of 4μm or less. The MCP blanks are then cold-cut to a certain thickness, including the effective working area and a solid edge base of the same thickness as the effective working area, with a bevel angle of 4-12° and a thickness of 0.05mm-0.25mm. The polishing process can be divided into two steps: first, conventional double-sided polishing is used to process the blank to a thickness of 0.25mm, followed by single-sided polishing. During single-sided polishing, vacuum adsorption is used for fixation, which is highly efficient and removes wax, glue, and other difficult-to-remove substances. The vacuum adsorption fixture holes are 10μm-20μm in diameter, with an opening area ratio of 50%.

[0044] It should be understood that in traditional microchannel plate fabrication processes, Pb-containing glass materials are used as the core and sheet materials (with different material compositions). The process involves two stages of wire drawing (monofilament and multifilament), wire assembly and bar stacking, high-temperature melting and pressing, cold processing, slicing and polishing (MCP blank), etching, hydrogen reduction, coating (functional film layer and metal electrode), and cleaning and inspection. In the various embodiments of this invention, the glass substrate used is an MCP blank that has undergone a hydrogen reduction process.

[0045] The outer glass is typically made of lead silicate glass (containing PbO and Bi2O3), which is resistant to acid and alkali corrosion and possesses volume electrical resistance and secondary electron emission capability after hydrogen reduction, making it suitable for manufacturing high-precision hollow glass tubes. The core glass can be made of borosilicate soluble glass, whose coefficient of thermal expansion matches that of the outer glass, and can be completely corroded and removed by strong acids, making it suitable for manufacturing solid glass rods.

[0046] As an example, a solid core rod is coaxially inserted into a glass tube to form a concentric tube-rod composite. Then, monofilaments are drawn in a high-temperature drawing furnace, with the furnace temperature controlled within the glass softening range. An outer layer of corrosion-resistant glass wraps around the inner soluble core glass, resulting in a core-shell composite monofilament. This is cooled, wound, and cut into monofilaments of a fixed length. A second drawing process is then performed, where a large number of monofilaments are neatly arranged in a tight hexagonal pattern and bundled into cylindrical rods. These rods are then fed into the drawing furnace for a second softening and stretching, resulting in a multifilament with a hexagonal cross-section. The multifilament contains hundreds of micro-monofilaments, which are fused and isolated from each other by the glass tube. After cooling, the multifilament is cut into short segments of the same height as the fusion mold. Then, the screen is assembled. Hexagonal multifilament segments are arranged tightly in hexagonal layers in a graphite mold, and frame glass material is placed around them. The mold is filled to form a complete square / circular blank. After the mold is put into the furnace, it is vacuum melted and pressed, heated to the glass softening point, and kept at the temperature to soften the surface of the multifilaments. At the same time, axial pressure is applied evenly, and all multifilaments and frames are fused together to form a whole dense glass blank rod.

[0047] After the glass preform cools, it is cold-processed and sliced ​​into thin sheets of the target thickness. Then, through grinding, polishing and other processes, solid, non-porous MCP preform sheets are obtained.

[0048] The second method involves preparing MCP blanks using femtosecond laser-induced chemical etching technology, controlling the hole spacing to be 5μm or less. First, laser modification is performed on a glass sheet of a certain thickness, and then the same two-step polishing process as traditional MCP blanks is used to thin it to the required thickness.

[0049] Step 2: Fabrication of the reinforcing ring. The reinforcing ring is made of the same material as the solid edge substrate of the MCP blank. The glass material of the solid edge is cold-worked and polished into a thin sheet of the required thickness, ranging from 0.2mm to 2mm. The sheet is then laser-cut into a ring. The outer and inner circles of the reinforcing ring are concentric. The outer diameter of the reinforcing ring is the same as the outer diameter of the MCP blank. The radial width of the reinforcing ring ranges from 2mm to 5mm. The tilt angle of the inner circle is controlled by adjusting the angle of the laser beam, ranging from 30° to 60°. The inner diameter is smaller on the side closer to the effective working area and larger on the side farther from the effective area. Electrodes plated on this tilted surface enable effective and reliable electrical connection between the surface electrode and the solid edge electrode.

[0050] Step 3: Joining the MCP blank with the reinforcing ring. This is done using laser welding or bonding to form a single integrated structure.

[0051] When using laser welding, during the processing of a circular MCP, the MCP rotates around its circumference, and the laser head moves left and right along the diameter of the MCP within the width of the reinforcing ring to achieve full-area welding within the entire reinforcing ring.

[0052] When using bonding to combine components, the solid edges can be bonded by heating. It should be understood that for the design of MCP, the solid edges will soften more quickly during the heating process to achieve bonding without affecting the effective working area (which has a higher softening temperature). Step 4: The combination of the MCP blank and the reinforcing ring is processed into a finished microchannel plate. Arrays formed by traditional wire drawing are further processed into finished microchannel plates through etching, hydrogen reduction, ALD film preparation, and electrode plating. Arrays modified by pulsed laser require further processing through etching, ALD film preparation, and electrode plating to become finished microchannel plates.

[0053] As an optional example, the etching process involves chemical core melting, in which individual MCP blank sheets or groups thereof are immersed in a high-temperature mixed strong acid etching solution. This process dissolves only the soluble core glass, while the outer lead-resistant glass layer remains completely intact, forming a micron-scale parallel microchannel array. The etching process can be further enhanced with ultrasonic assistance. Alternatively, a secondary mild etching process using a weak acid can be selected to fine-tune the channel aperture, remove corrosion burrs from the inner wall of the channels, improve the smoothness of the inner wall, and reduce dark noise.

[0054] Further, the etched glass substrate sheet (containing millions of micrometer-level channels internally and surrounded by an unetched solid edge) is placed in a sealed quartz tube furnace. High-vacuum evacuation removes moisture and impurities, and high-purity hydrogen is introduced. Isothermal hydrogen reduction is then performed, generating an ultrathin lead metal conductive layer on the inner wall of the channels and simultaneously forming a high secondary electron emission interface. Then, a coating is applied, for example, functional abrasives (such as magnesium oxide, aluminum oxide, and silicon oxide) are deposited on the inner wall and end faces of the channels using ALD deposition. Metal electrodes (Ni, Cr, and Al alloy films) are evaporated onto the input and output surfaces at both ends. This yields the MCP finished product, which is then cleaned, tested for performance, and sorted for storage.

[0055] This process produces ultra-thin, high-strength microchannel plates with ultra-small apertures, exhibiting superior performance in terms of high spatial resolution and fast time response. These plates can be applied to various vacuum photoelectric detection devices such as low-light image intensifiers, microchannel plate photomultiplier tubes, streak image inverters, and framing cameras.

[0056] {Example 3} Step 1: Make the MCP blank.

[0057] Taking existing typical glass materials (core material and rod material) as examples, as raw materials, MCP screen segments are prepared through processes such as wire drawing, screen arrangement, and screen pressing using the traditional MCP preparation process, with an aperture of 4μm. MCP blanks are prepared by cold working, with an outer diameter of 24.8mm, including the effective working area and a solid edge base of the same thickness as the effective working area, a bevel angle of 6°, and a plate thickness of 0.15mm. The polishing process can be divided into two steps: the conventional double-sided polishing process is used to process to a thickness of 0.25mm, and then single-sided polishing is performed. During single-sided polishing, vacuum adsorption is used for fixation, which is highly efficient and eliminates impurities such as wax and glue that are difficult to remove. The clamping holes of the vacuum adsorption are 20μm, with an opening area ratio of 50%.

[0058] Step 2: Make the reinforcing ring.

[0059] The reinforcing ring is made of the same material as the solid edge of the MCP blank. The glass material of the solid edge is cold-worked and polished into a thin sheet of the required thickness, which is 0.5 mm thick. The thin sheet is laser-cut into a ring. The outer circle and inner circle of the reinforcing ring are concentric. The outer diameter of the reinforcing ring is the same as that of the MCP blank, which is 24.8 mm. The radial width of the reinforcing ring is 2.5 mm. The tilt angle of the inner circle is controlled by controlling the angle of the laser beam. The tilt angle is 45°. The inner diameter is smaller on the side closer to the effective working area and larger on the side farther away from the effective area. The electrode plated on this tilted surface enables effective and reliable electrical connection between the surface electrode and the solid edge electrode.

[0060] Step 3: The MCP blank is combined with the reinforcing ring.

[0061] The components are assembled using laser welding to form a single, integrated structure. Figure 5 When using laser welding, during the processing of a circular MCP, the MCP rotates around its circumference, and the laser head moves left and right along the diameter of the MCP within the width of the reinforcing ring to achieve full-area welding within the entire reinforcing ring.

[0062] Step 4: The combination of the MCP blank and the reinforcing ring is further processed into a finished microchannel plate through processes such as etching, hydrogen reduction, ALD film preparation, and electrode plating. This can be done using existing technologies.

[0063] Comparative example: MCP blanks are fabricated. Following the conventional MCP manufacturing process, MCP screen segments are prepared through processes such as wire drawing, screen arrangement, and screen pressing, with an aperture of 4μm. The MCP blanks are then cold-worked to form the effective working area and a solid edge of the same thickness as the effective working area, with a 6° bevel angle and a thickness of 0.15mm. The polishing process can be divided into two steps: conventional double-sided polishing is used to process the blank to a thickness of 0.25mm, followed by single-sided polishing. During single-sided polishing, vacuum adsorption is used for fixation, which is highly efficient and eliminates difficult-to-remove wax, glue, and other substances. The fixture holes for vacuum adsorption are 20μm, with an opening area ratio of 50%. The blanks are then further processed through etching, hydrogen reduction, ALD film preparation, and electrode plating to form the finished microchannel plate.

[0064] The strength between the test examples and the comparative examples is characterized by the MCP deformation coefficient: pressure is applied to the center of the MCP, and the longitudinal deformation of the MCP is tested. The deformation / pressure is the deformation coefficient that characterizes the strength of the MCP. The smaller the deformation coefficient, the higher the strength.

[0065] The test results show that by adding a solid edge reinforcing ring in the embodiment, the deformation coefficient is only 1 / 8 of that of the embodiment without a reinforcing ring, which has a very significant effect.

[0066] Embodiments of the present invention 150 Comparative Example 1200 While the present invention has been disclosed above with reference to preferred embodiments, it is not intended to limit the invention. Those skilled in the art can make various modifications and refinements without departing from the spirit and scope of the invention. Therefore, the scope of protection of the present invention shall be determined by the claims.

Claims

1. A high-strength microchannel plate with ultra-small pore size, characterized in that, include: The effective working area has a microchannel array structure with millions of channels, each with a micrometer-scale aperture; as well as A solid edge surrounds the outside of the effective working area and combines with the outer edge of the effective working area to form an integral structure; The solid edge portion is thicker than the effective working area and has higher strength.

2. The ultra-small aperture high-strength microchannel plate according to claim 1, characterized in that, The channel aperture of the effective working area is less than 4μm, the plate thickness of the effective working area is 0.05~0.25mm, and the bevel angle is 4~12°.

3. The ultra-small aperture high-strength microchannel plate according to claim 1, characterized in that, The solid edge consists of a base of equal thickness that is directly connected to the effective working area, and a reinforcing ring superimposed on and bonded to the base. The base and the reinforcing ring are made of the same glass material.

4. The ultra-small aperture high-strength microchannel plate according to claim 3, characterized in that, The thickness of the reinforcing ring is 0.2mm-2mm, the outer circle and inner circle of the reinforcing ring are concentric, and the radial width of the reinforcing ring is 2mm-5mm.

5. The ultra-small aperture high-strength microchannel plate according to claim 4, characterized in that, The inner circular side of the reinforcing ring is an inclined surface with an inclination angle of 30°-60°.

6. The ultra-small aperture high-strength microchannel plate according to claim 4, characterized in that, The inclined surface of the reinforcing ring is configured such that the inner diameter of the side closer to the effective working area is smaller, and the inner diameter of the side farther away from the effective working area is larger.

7. The ultra-small aperture high-strength microchannel plate according to claim 4, characterized in that, The reinforcing ring is made of the same glass material as the base of the solid edge. It is cold-processed and polished into a thin sheet of the required thickness and then laser-cut into a ring that fits the shape of the base. The tilt angle of the inner ring is controlled by controlling the angle of the laser beam.

8. A method for preparing an ultra-small aperture, high-strength microchannel plate, characterized in that, Includes the following steps: Using core glass rods and skin glass tubes for microchannel plates as raw materials, an MCP blank is prepared according to the MCP preparation process, which includes an effective working area and a solid edge substrate with the same thickness that is combined with the effective working area. Polish the MCP blank to the preset plate thickness of 0.05mm-0.25mm; Using the same glass material as the solid edge substrate of the MCP blank, the sheet is cold-worked and polished into a thin sheet of the required thickness, and then laser-cut into a ring that fits the shape of the substrate to obtain a reinforcing ring with a thickness of 0.2mm-2mm. The reinforcing ring is superimposed onto the surface of the solid edge base and combined to form an integral structure; The combined integrated structure is then subjected to subsequent etching, pore-forming, and coating processes to be processed into a finished microchannel plate.

9. The method for preparing the ultra-small aperture high-strength microchannel plate according to claim 8, characterized in that, Laser welding is used to combine the reinforcing ring with the solid edge base into a single structure.

10. The method for preparing the ultra-small aperture high-strength microchannel plate according to claim 8, characterized in that, The reinforcing ring is bonded to the solid edge substrate using a bonding process to form an integral structure.

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