An ultra-wideband wave beam package antenna based on HTCC

Abstract

The application discloses a kind of based on HTCC's ultra-wide bandwidth beam package antenna, by multilayer Al2_O3_ceramic substrate stack connection, including the radiation patch opened with double slit, H type defective ground structure, annular metallized copper column via structure and Γ type probe feed module.This antenna adopts Γ type probe feed, and radiation patch is opened with double slit, and radiation angle can be effectively widened.Collaborate H type defective ground structure design, break the electric field constraint through the gap structure of defective ground, improve the propagation of dielectric surface wave, supplement large-angle radiation component.Metallic via around feed effectively suppresses energy leakage, significantly reduces transmission loss, and through the synergistic effect of defective ground structure and patch slit, avoid beam shrinkage, ensure wide beam characteristics.The application relies on HTCC process, with high temperature stability, high density integration and small size advantage, both ensure wideband transmission performance, and avoid beam being excessively constrained through structure synergy compensation, realize the dual needs of wide beam and high transmission efficiency, adapt to V waveband package antenna engineering application scene.

Description

Technical Field

[0001] This invention belongs to the field of millimeter-wave short-range detection technology and relates to antenna packaging technology, specifically an ultra-wideband beam packaged antenna based on HTCC. Background Technology

[0002] In modern millimeter-wave short-range detection applications, detection systems face stringent requirements for ranging accuracy, anti-interference capability, airspace coverage, and adaptability to extreme environments. The V-band, with its short wavelength and significant atmospheric absorption characteristics, helps limit the effective range of electromagnetic waves and reduce long-range background interference. During high-speed target encounters, the encounter angle changes rapidly, and the effective detection time is short; therefore, a wide beam is needed to cover a large encounter angle range. Simultaneously, broadband operation improves range resolution and target echo characteristic acquisition capabilities, enhances the ability to distinguish short-range targets from background clutter in complex backgrounds, provides frequency resources for broadband frequency hopping, and improves the system's anti-interference capability. With increasing miniaturization requirements, packaged antenna technology significantly reduces losses and size through high-density integration of chips and antennas. However, ballistic applications involve extremely high overloads, making HTCC materials, with their extremely high mechanical strength, excellent thermal conductivity, and hermeticity, a better choice for solving high-reliability RF packaging in harsh environments.

[0003] Over the past few years, researchers have been constantly innovating to maintain a large bandwidth and beamwidth for antennas.

[0004] Reference 1 (W. Liu, ZN Chen and X. Qing, "60-GHz Thin Broadband High-Gain LTCC Metamaterial-Mushroom Antenna Array," in IEEE Transactions on Antennas and Propagation, vol. 62, no. 9, pp. 4592-4601, Sept. 2014.) developed an LTCC mushroom-shaped metamaterial-encapsulated antenna array for the 60 GHz band, achieving high reliability and high gain while using ceramic dielectric. However, its impedance bandwidth is narrow, measured only at 56.3-65.7 GHz, and at the high-frequency point of 64 GHz, its half-power beamwidth in both the E-plane and H-plane is less than 57°. This narrow-band and narrow-beam characteristic limits its use in complex scenarios and makes it difficult to meet the requirements of large frequency hopping bandwidth and large intersection angle coverage for missile-borne short-range detection. Reference 2 (M. Adnan, MY Park, J. Park, Y. Yang, K.-Y. Lee and KC Hwang, "Differential-FedBroadband High-Gain Narrow Beam 60 GHz AiP Magnetoelectric Dipole Antenna," in IEEE Antennas and Wireless Propagation Letters, vol. 24, no. 8, pp. 2662-2666, Aug. 2025.) proposes a differentially fed broadband magnetoelectric dipole antenna for 60 GHz packaged antenna applications, achieving a wide impedance bandwidth of 25.2% (54.2-69.8 GHz). However, this broadband design, in pursuit of high-frequency performance, results in severe beam contraction, with the half-power beamwidth of its E-plane and H-plane sharply reduced to an ultra-narrow beam of less than 40°, which also fails to meet the wide beam requirement for short-range, large intersection angle detection. Summary of the Invention

[0005] To address the challenge of existing technologies in simultaneously achieving high distance resolution, interference resistance, and wide field-of-view dynamic coverage while maintaining high reliability in extreme environments, this invention proposes an ultra-wideband beam-encapsulated antenna based on HTCC.

[0006] The technical solution to achieve the objective of this invention is: an ultra-widebandwidth beam-packaged antenna based on HTCC, comprising:

[0007] A dielectric substrate consisting of several layers stacked together;

[0008] A radiating patch is disposed on the upper surface of the topmost HTCC dielectric substrate, and the radiating patch has two slits.

[0009] A Γ-shaped probe feeding module consists of a vertical feeding section and a horizontal coupling section. The vertical feeding section penetrates through the second and third layers of the HTCC dielectric substrate and connects to the waveport excitation. The horizontal coupling section is located below the radiating patch and is electromagnetically coupled to the radiating patch. An intermediate ground layer is disposed between the second and third layers of the HTCC dielectric substrate and has a through-hole for the vertical feeding section to pass through. A coplanar waveguide layer is disposed on the lower surface of the bottommost HTCC dielectric substrate. The coplanar waveguide layer includes a metallic ground structure and an H-shaped defect ground structure disposed between the metallic ground structure and the rectangular ground layer. The H-shaped defect ground structure works in conjunction with the rectangular ground layer to jointly regulate the spatial electric field and current distribution.

[0010] And a metallized copper pillar via shielding structure, including multiple metallized copper pillars distributed around the vertical feed section and penetrating the HTCC dielectric substrate.

[0011] Compared with existing technologies, the significant advantages of this invention are as follows: This invention is adapted to V-band high-frequency operating conditions, simultaneously achieving ultra-wideband transmission and wide beam radiation characteristics. It ensures the high resolution required for short-range detection while effectively expanding the detection coverage, significantly improving the operational stability and environmental adaptability of the detection system. The Γ-shaped probe coupled with a top-layer slit radiating patch, combined with a four-layer Al2_O3_ceramic substrate, effectively controls antenna size and achieves miniaturized packaging while possessing superior electromagnetic interference resistance and temperature stability, maintaining stable electrical performance in complex and harsh detection environments. The coplanar waveguide feed layer, coupled with a symmetrically arranged copper pillar shielding structure, effectively suppresses high-frequency electromagnetic leakage, isolates external stray electromagnetic interference, and ensures the integrity and reliability of excitation signal transmission. The rectangular slit design of the top-layer radiating patch optimizes the radiation pattern, suppresses sidelobes and backradiation, and, in conjunction with a multi-layer grounding structure and defect ground design, further optimizes antenna impedance matching characteristics, effectively broadening the operating bandwidth and solving the technical pain points of traditional high-frequency packaged antennas, such as narrow bandwidth, limited beam coverage, and weak anti-interference capability.

[0012] The present invention will now be described in further detail with reference to the accompanying drawings. Attached Figure Description

[0013] Figure 1 This is a three-dimensional structural schematic diagram of an embodiment of an ultra-wideband beam-packaged antenna based on HTCC according to the present invention.

[0014] Figure 2This is a top view (perspective view) of an embodiment of an ultra-wideband beam-packaged antenna based on HTCC according to the present invention.

[0015] Figure 3 This is a side view (perspective view) of an embodiment of an ultra-wideband beam-packaged antenna based on HTCC according to the present invention.

[0016] Figure 4 This is a rear view (perspective view) of an embodiment of an ultra-wideband beam-packaged antenna based on HTCC according to the present invention.

[0017] Figure 5 This is a schematic diagram of the radiating patch layer at the top of an ultra-wideband beam packaged antenna based on HTCC according to the present invention.

[0018] Figure 6 This is a schematic diagram of the monopole antenna layer inside an ultra-wideband beam-packaged antenna based on HTCC according to the present invention.

[0019] Figure 7 This is a schematic diagram of the internal grounding layer on an ultra-wideband beam-packaged antenna based on HTCC according to the present invention.

[0020] Figure 8 This is a schematic diagram of a copper pillar shielding layer for an ultra-wideband beam-encapsulated antenna based on HTCC according to the present invention.

[0021] Figure 9 This is a schematic diagram of a coplanar waveguide layer for an ultra-widebandwidth beam-encapsulated antenna based on HTCC according to the present invention.

[0022] Figure 10 This is a schematic diagram of the return loss of an ultra-wideband beam-packaged antenna based on HTCC according to the present invention.

[0023] Figure 11 This is the radiation pattern of the E-plane antenna of an ultra-wideband beam-packaged antenna based on HTCC according to the present invention.

[0024] Figure 12 This is the radiation pattern of an H-plane antenna based on HTCC (High-Width Coil Capacitor) according to the present invention. Detailed Implementation

[0025] The specific embodiments of the present invention will be further described in detail below with reference to the accompanying drawings.

[0026] The following detailed embodiments and accompanying drawings are merely exemplary descriptions of the technical solutions of the present invention.

[0027] like Figures 1-4As shown, an ultra-widebandwidth beam-encapsulated antenna based on HTCC effectively controls energy leakage and reduces losses by including a radiating patch with double slits, an H-shaped defect ground structure, and a ring-shaped metallized copper pillar via structure, thus well balancing the antenna's ultra-wideband and wide beam requirements. Specifically, it includes:

[0028] A dielectric substrate consisting of several layers stacked together;

[0029] A radiating patch is disposed on the upper surface of the topmost HTCC dielectric substrate, and the radiating patch has two slits.

[0030] A Γ-shaped probe feeding module consists of a vertical feeding section and a horizontal coupling section. The vertical feeding section penetrates the second and third layers of the HTCC dielectric substrate, and the horizontal coupling section is located below the radiating patch and electromagnetically coupled to the radiating patch. An intermediate ground layer is disposed between the second and third layers of the HTCC dielectric substrate and has a through-hole for the vertical feeding section to pass through. A coplanar waveguide layer is disposed on the lower surface of the bottommost HTCC dielectric substrate. The coplanar waveguide layer includes a metallic ground structure and an H-shaped defect ground structure disposed between the metallic ground structure and the ground structure. The H-shaped defect ground structure works in conjunction with the rectangular ground layer to jointly regulate the spatial electric field and current distribution. The H-shaped defect ground structure improves the electric field distribution between the antenna and the ground through a specific sized ground slot etching design, while also helping to widen the antenna's operating impedance bandwidth and improve radiation efficiency.

[0031] The system also includes a metallized copper pillar via shielding structure, comprising multiple metallized copper pillars distributed around the vertical feed section and penetrating the HTCC dielectric substrate. This metallized copper pillar via shielding structure suppresses surface wave leakage from the V-band multilayer dielectric substrate, reduces stray electromagnetic interference, optimizes near-field distribution, and adapts to the process and structural reinforcement requirements of ceramic packaging.

[0032] The Γ-shaped probe feeding module, as the sole feeding structure, achieves excellent impedance matching with the radiating patch and H-shaped defect ground structure through its own structural optimization, significantly reducing high-frequency signal reflection loss and ensuring efficient signal transmission. The top of the Γ-shaped probe is coupled to the radiating patch with double slits, which can precisely excite the antenna to generate an ultra-wideband beam radiation signal. The double slit structure on the radiating patch can effectively break the concentrated distribution of the electric field and widen the beamwidth.

[0033] In a further embodiment, the dielectric substrate is made of Al2_O3_ceramic substrate material with a relative permittivity of 9.8. Al2_O3_ceramic substrate material has high mechanical strength and excellent electrical insulation properties. Its permittivity is stable at around 9.8, which can effectively reduce signal transmission loss and ensure the stability of antenna radiation performance in V-band high-frequency application scenarios.

[0034] In a further embodiment, the dielectric substrate has four layers, with the vertical feeding section of the Γ-shaped probe feeding module penetrating through the second and third dielectric substrates; the intermediate ground layer is located between the second and third dielectric substrates. After a high-frequency excitation signal is input, it is fed vertically through the second and third dielectric substrates via the Γ-shaped probe feeding module. This feeding link, in conjunction with the grounding structure, achieves excellent impedance matching over a wide frequency range, ensuring efficient transmission of high-frequency signals. The Γ-shaped probe feeding module forms an electromagnetic coupling with the top radiating patch, thereby exciting the antenna to generate ultra-wideband and wide-beam radiation characteristics. Simultaneously, the two rectangular slits on the top radiating patch can reconstruct the surface current flow, optimize resonance characteristics, and further expand the antenna's operating bandwidth and beamwidth. Regarding spatial electric field modulation and surface wave suppression, the antenna adopts a layered grounding design. By setting a rectangular grounding layer between the second and third dielectric substrates and deploying an H-shaped defect ground structure at the bottom layer, the two work together to optimize the spatial electric field distribution, effectively suppressing surface wave propagation in the high-dielectric-constant substrate and significantly improving radiation efficiency. Four copper pillars are arranged around the vertical section of the Γ-shaped probe feed module. This not only tightly confines the electromagnetic field internally to suppress lateral energy leakage to the dielectric substrate, but also utilizes distributed capacitance to offset the probe's parasitic inductance, achieving precise impedance matching. This significantly reduces the transmission and reflection losses of high-frequency signals, enabling low-loss vertical interconnection. The overall structure is adapted to the application requirements of V-band process detection.

[0035] The antenna is fed by a Γ-type probe. The Γ-type probe consists of a coaxial probe 8 and a radiating monopole 2.

[0036] The antenna dielectric substrate is composed of four layers of alumina material with a relative permittivity of 9.8, and the dielectric substrates are stacked and connected to each other.

[0037] The antenna copper pillar shielding structure 3 has a ring of copper pillars evenly distributed around its perimeter.

[0038] The radiating patches 1 on the upper surface of the antenna are symmetrically distributed above the Γ-shaped probe structure. By adjusting the length and width of the parasitic patches and their distance from the Γ-shaped probe, the radiation mode of the antenna can be changed, while the bandwidth can be increased to improve the frequency response range of the antenna.

[0039] This invention can effectively confine the electromagnetic field inside the medium, improve radiation efficiency, and ensure the impedance characteristics and operational stability of the antenna under high-frequency conditions.

[0040] The present invention will be further described in detail below with reference to specific embodiments.

[0041] Example 1

[0042] This embodiment presents an ultra-widebandwidth beam-packaged antenna based on HTCC, which consists of four layers of alumina substrate stacked together.

[0043] The dielectric substrate is an alumina plate with a relative permittivity of 9.8, and its height is H1=0.25mm, H2=0.15mm, H3=0.25mm, H4=0.15mm, length is L=2.4mm, and width is W=2.4mm; Figure 5 As shown, the length of the radiating patch on the top layer of the antenna is L1=0.53mm, the width is W1=0.42mm, and the distance from the nearest boundary is W2=0.99mm, L2=0.72mm; Figure 6 As shown, the length of the radiating monopole 2 is L3 = 0.26 mm, and the width is W3 = 0.08 mm; Figure 7 As shown, the internal grounding layer has a coaxial conduit hole 5 with a diameter of d1 = 0.28 mm around the coaxial probe; as Figure 8 As shown, the copper pillar shielding layer 3 consists of four copper pillars with a diameter of d2 = 0.03 mm placed around the probe; as... Figure 3 As shown, the coplanar waveguide layer includes an H-shaped defect ground structure 4 and a surrounding metallic ground structure 7. In the H-shaped defect ground structure, the width of the two arms is W4=0.12mm, the arm length is L6=0.43mm, the width in the middle is W5=0.05mm, the distance between the inner sides of the two arms is L4=0.61mm, and the shortest distance from the center of the H-shape to the wide side of the dielectric substrate is L5=0.27mm.

[0044] The antenna was simulated and optimized using Ansys-HFSS software, and the resulting antenna reflection coefficient S11 curve is shown below. Figure 10 The radiation pattern of plane E is as follows Figure 11 The radiation pattern of the H-plane is as follows Figure 12 .

[0045] like Figure 10 As shown, the antenna's resonant point is at 64 GHz, and the reflection coefficient at the resonant point is -42.2501 dB. The reflection coefficient in the frequency range of 51.7 GHz to 77.8 GHz is less than -10 dB.

[0046] like Figure 11 The image shows the radiation pattern of the antenna's E-plane. The operating frequency is 64 GHz, the antenna gain is 1.82 dBi, and the 3 dB beamwidth is 165°.

[0047] like Figure 12 The image shows the radiation pattern of the antenna's H-plane, with a 3dB beamwidth of 143°.

Claims

1. An ultra-widebandwidth beam-packaged antenna based on HTCC, characterized in that, include: Four layers of dielectric substrate stacked together; A radiating patch is disposed on the upper surface of the topmost HTCC dielectric substrate, and the radiating patch has two slits. A Γ-shaped probe feeding module consists of a vertical feeding section and a horizontal coupling section. The vertical feeding section penetrates through the second and third layers of the HTCC dielectric substrate and connects to the waveport excitation. The horizontal coupling section is located below the radiating patch and is electromagnetically coupled to the radiating patch. An intermediate ground layer is disposed between the second and third layers of the HTCC dielectric substrate and has a through-hole for the vertical feeding section to pass through. A coplanar waveguide layer is disposed on the lower surface of the bottommost HTCC dielectric substrate. The coplanar waveguide layer includes a metallic ground structure and an H-shaped defect ground structure disposed between the metallic ground structure and the rectangular ground layer. The H-shaped defect ground structure works in conjunction with the rectangular ground layer to jointly regulate the spatial electric field and current distribution. And a metallized copper pillar via shielding structure, including multiple metallized copper pillars distributed around the vertical feed section and penetrating the HTCC dielectric substrate.

2. The ultra-widebandwidth beam-packaged antenna based on HTCC according to claim 1, characterized in that, Two slits are symmetrically distributed along the center line of the radiating patch, and the length direction of the slits is consistent with the length direction of the radiating patch. The operating bandwidth and beamwidth of the antenna can be adjusted by changing the length, width and spacing of the slits.

3. The ultra-widebandwidth beam-packaged antenna based on HTCC according to claim 1, characterized in that, The vertical feeding section of the Γ-shaped probe feeding module is a coaxial probe, and the vertical feeding section and the horizontal coupling section are integrally formed into a Γ-shaped probe feeding module.

4. The ultra-widebandwidth beam-packaged antenna based on HTCC according to claim 1, characterized in that, Several layers of dielectric substrates are formed by stacking and connecting alumina ceramic materials through a high-temperature co-firing process.

5. The ultra-widebandwidth beam-packaged antenna based on HTCC according to claim 1, characterized in that, The metallized copper pillar via shielding structure includes four metallized copper pillars, which are arranged symmetrically around the vertical feed section.

6. The ultra-widebandwidth beam-packaged antenna based on HTCC according to claim 1, characterized in that, The length and width of the dielectric substrate are both 2.4 mm, and the thickness of each layer from top to bottom is 0.25 mm, 0.15 mm, 0.25 mm and 0.15 mm respectively.

7. The ultra-widebandwidth beam-encapsulated antenna based on HTCC according to claim 1, characterized in that, The radiation patch has a length of 0.53 mm and a width of 0.42 mm.

8. The ultra-widebandwidth beam-packaged antenna based on HTCC according to claim 1, characterized in that, The diameter of the through hole through which the vertical feed section passes is 0.28 mm.

9. The ultra-widebandwidth beam-encapsulated antenna based on HTCC according to claim 1, characterized in that, The diameter of the metallized copper pillar is 0.03 mm.

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