A transmissive continuous phase reconfigurable intelligent surface structure based on double-layer interconnection network

Abstract

The present application relates to a kind of based on double-layer interconnection network transmission type continuous phase reconfigurable intelligent surface structure, comprising: first layer radiation unit array, it is configured to receive incident electromagnetic wave from free space;Second layer radiation unit array, it is configured to re-radiate electromagnetic signal after phase adjustment is completed by double-layer interconnection network to free space, to form the transmission beam of desired direction and wave front form;The first layer radiation unit array and second layer radiation unit array are sequentially arranged along electromagnetic wave propagation direction;Double-layer interconnection network, it is configured to enable any radiation unit in the first layer radiation unit array to establish adjustable radio frequency connection with multiple radiation units in the second layer radiation unit array;And centralized bias control network, it is configured to uniformly output bias control voltage.The present application realizes non-diagonal transmission matrix reconstruction, and greatly improves system degree of freedom.

Description

Technical Field

[0001] This invention relates to the fields of wireless communication, electromagnetic metamaterials and reconfigurable intelligent surface (RIS) technology, and to a transmissive continuous phase reconfigurable intelligent surface structure based on a two-layer interconnect network. Background Technology

[0002] With the development of reconfigurable smart surface (RIS) technology, the traditional method mainly controls the direction of electromagnetic wave reflection by adjusting the reflection coefficient of the unit. However, in indoor coverage, transparent base stations, vehicle-to-everything (V2X) communication, and future all-space wireless communication scenarios, relying solely on reflective RIS is insufficient to meet the requirements for flexible control of transmitted electromagnetic waves.

[0003] Therefore, transmissive RIS (T-RIS) has gradually become a research hotspot. Transmissive RIS allows electromagnetic waves to pass through metasurface structures, while simultaneously modulating the phase and amplitude of the transmitted waves, thereby achieving transmitted beamforming and spatial coverage enhancement. Most existing transmissive RIS structures adopt a single-layer transmissive unit design, and their transmission response mainly relies on the resonant characteristics of the unit itself for adjustment. This type of structure has the following problems: First, there is a lack of energy exchange mechanism between units, resulting in limited system degrees of freedom; second, the transmission matrix is ​​usually a diagonal structure, making it difficult to achieve complex spatial mapping functions; third, traditional transmissive RIS struggles to achieve coordinated control between units; fourth, the continuous phase adjustment range is limited, making it difficult to achieve high-precision beam control; fifth, there is a contradiction between control capability and implementation complexity in large-scale arrays. Summary of the Invention

[0004] This invention aims to address the problems of insufficient degrees of freedom, limited transmission matrix control capability, weak continuous phase adjustment capability, and low precision in existing transmissive RIS structures. This invention provides a transmissive continuous phase reconfigurable smart surface structure based on a two-layer interconnect network. This structure adopts a two-layer radiating unit architecture and constructs a reconfigurable radio frequency interconnect network between the two radiating units, enabling electromagnetic energy to be transmitted and distributed between different layers according to a preset path. This overcomes the limitation of traditional transmissive RIS structures that rely solely on the transmission response of the unit itself for control, achieving high-degree-of-freedom transmission matrix reconstruction, and enabling inter-layer energy exchange, continuous phase control, and high-degree-of-freedom transmission matrix reconstruction.

[0005] This invention provides a transmissive, continuous-phase reconfigurable smart surface structure based on a two-layer interconnect network, comprising: The first layer of radiating unit array is configured to receive incident electromagnetic waves from free space. The second-layer radiation unit array is configured to re-radiate the electromagnetic signal, after phase adjustment through the double-layer interconnection network, into free space to form a transmission beam with the desired direction and wavefront shape; the first-layer radiation unit array and the second-layer radiation unit array are arranged sequentially along the electromagnetic wave propagation direction. An interconnection network is configured to enable any radiating element in the first-layer radiating element array to establish an tunable radio frequency connection with multiple radiating elements in the second-layer radiating element array, thereby redistributing interlayer electromagnetic energy and constructing a non-diagonal transmission matrix. The interconnection network is located between the first-layer and second-layer radiating element arrays, forming a two-layer interconnection network, through which the arrays of the first-layer radiating elements and the second-layer radiating element arrays establish electromagnetic coupling. A centralized bias control network is configured to output a uniform bias control voltage.

[0006] Furthermore, the interconnection network includes: Several continuously phase-tunable interconnect links are configured to enable any radiating element in the first layer radiating element array to establish a phase-tunable radio frequency connection with multiple radiating elements in the second layer radiating element array via the continuously phase-tunable interconnect links.

[0007] Furthermore, each of the aforementioned continuously phase-tunable interconnect links is configured with: Microstrip transmission lines, configured for cross-layer radio frequency signal transmission; and A continuous phase adjustment module is located on the microstrip transmission line.

[0008] Furthermore, the continuous phase adjustment module includes: A variable reactance device is configured to receive an external bias voltage and continuously change its own equivalent reactance according to the bias voltage to adjust the equivalent electrical length of the interconnect link and realize continuous adjustment of the radio frequency transmission phase. An RF blocking inductor is configured to provide a conduction path for the DC bias voltage while presenting a high impedance to RF signals, preventing RF signals from leaking into the centralized bias control network; and A DC isolation capacitor is configured to allow radio frequency signals to be transmitted normally on the interconnect link while blocking DC bias voltage from being introduced into the microstrip transmission line.

[0009] Furthermore, each of the interconnecting links can achieve continuous phase adjustment within the range of 0° to 360°. By independently controlling the phase state of each interconnecting link, a continuously programmable transmission matrix can be constructed to achieve dynamic control of the transmission beam direction, beamwidth, wavefront shape, and spatial energy distribution.

[0010] Furthermore, the centralized bias control network is located in the edge or central region of the array surface formed by the radiating element array, and the centralized bias control network includes: The controller is configured to generate corresponding digital control commands based on a preset beam direction or real-time channel state information. A digital-to-analog converter module is configured to receive the digital control command and convert and output the corresponding analog bias control voltage. The main bias bus is configured to output the corresponding bias control voltage to the continuous phase adjustment module. The main bias bus in the centralized bias control network provides control voltage to multiple variable reactance devices via a unified bias supply node, and effectively isolates the DC bias from the RF signal through the RF blocking inductor and DC isolation capacitor. This structure significantly reduces the parasitic effects caused by the large number of bias traces in traditional distributed bias networks, improving system integration and circuit stability.

[0011] Furthermore, the variable reactance device includes at least one of a varactor diode, a BST (Barium-Strontium Titanate) tunable dielectric device, or a MEMS (Micro-Electro-Mechanical Systems) tunable capacitor. The variable reactance device is preferably implemented using a varactor diode. By adjusting the bias voltage applied across the varactor diode, its junction capacitance changes continuously, thereby altering the equivalent electrical length and propagation constant of the link, and achieving continuous adjustment of the RF signal propagation phase.

[0012] Furthermore, the topology of the two-layer interconnection network includes at least one of the following: partially connected structure, fully connected structure, tree topology, ring topology, or star topology. The partially connected structure refers to a two-layer interconnection network that does not physically implement all theoretically feasible interconnection paths between the first-layer and second-layer radiating units, but only deploys a portion of continuously phase-adjustable interconnection links, reducing hardware scale and implementation complexity under certain controllability.

[0013] Furthermore, one or more layers of radiation unit arrays are added, with interconnection networks configured between adjacent radiation unit arrays to form a hierarchical transmission network, which is used to achieve higher-dimensional transmission wavefront modulation.

[0014] Furthermore, the radiating elements in the first layer radiating element array, the second layer radiating element array, and the added one or more layers of radiating element array are implemented using microstrip patches, slot antennas, dipole antennas, or electromagnetic resonant structures suitable for millimeter wave and terahertz frequency bands.

[0015] This invention introduces a dual-layer radiation structure (a first-layer radiation element array and a second-layer radiation element array) and an interlayer reconfigurable interconnection network, enabling a controllable electromagnetic coupling channel between the incident and exit layers, thus achieving a redistribution of transmitted energy among different elements. Simultaneously, varactor diodes are used to construct a continuous phase adjustment unit, allowing for continuous phase variation of the interconnection links by adjusting the bias voltage, thereby building a reconfigurable transmission matrix and achieving high-precision dynamic control of the transmitted wavefront.

[0016] The present invention relates to a transmissive continuous phase reconfigurable smart surface structure, which achieves dynamic control of electromagnetic wave transmission characteristics by constructing an adjustable interconnection network between the incident and exit layers, and realizes continuous phase control within the range of 0° to 360° by using continuously adjustable impedance devices. It can be applied to fields such as 6G communication, millimeter-wave communication, terahertz communication, wireless coverage enhancement, beamforming, and intelligent electromagnetic environment construction.

[0017] The present invention has at least the following beneficial effects: 1) The present invention breaks through the limitation of independent operation of traditional transmission RIS units, and establishes a controllable energy exchange mechanism between the incident layer and the output layer through a two-layer interconnection network, realizing off-diagonal transmission matrix reconstruction and greatly improving the system's degree of freedom; 2) By introducing continuous phase adjustment links, continuous phase control within the range of 0° to 360° can be achieved, which has higher adjustment accuracy and beam control capability compared with discrete phase structures; 3) Since the transmission energy can be redistributed between layers, the system can achieve more flexible spatial beamforming and wavefront reconstruction; 4) The two-layer structure is naturally suitable for transmission-type application scenarios, and can realize efficient transmission and control of electromagnetic waves from the incident side to the output side; 5) Through a centralized bias control network, a large number of continuous phase adjustment links can be controlled simultaneously, improving system integration and reducing control complexity; 6) The two-layer interconnected transmission architecture proposed in this invention can be extended to large-scale array systems, and has good engineering implementation value and application prospects. Attached Figure Description

[0018] To further illustrate the above and other advantages and features of the various embodiments of the present invention, a more specific description of the embodiments of the invention will be presented with reference to the accompanying drawings. It is to be understood that these drawings depict only typical embodiments of the invention and are therefore not intended to limit its scope. In the drawings, identical or corresponding parts will be indicated by identical or similar reference numerals for clarity.

[0019] Figure 1 This shows an overall schematic diagram of a transmissive continuous phase reconfigurable smart surface structure based on a dual-layer interconnect network in some embodiments of the present invention; Figure 2 This diagram illustrates the structure of a continuous phase adjustment module for a single continuously adjustable interconnect link in a two-layer interconnect network in some embodiments of the present invention. Figure 3 A schematic diagram of a two-layer interconnection network topology (taking a 4×4 array as an example) is shown in some embodiments of the present invention. Figure 4 A schematic diagram of a centralized bias control network structure for a two-layer interconnect network in some embodiments of the present invention is shown. Detailed Implementation

[0020] It should be noted that the components in the accompanying drawings may be shown exaggerated for illustrative purposes and may not be to scale.

[0021] In this invention, the various embodiments are merely intended to illustrate the solutions of the invention and should not be construed as limiting.

[0022] In this invention, unless otherwise specified, the quantifiers “a” and “one” do not exclude scenarios involving multiple elements.

[0023] It should also be noted that, in the embodiments of the present invention, only a portion of the parts or components may be shown for clarity and simplicity. However, those skilled in the art will understand that, under the teachings of the present invention, the required parts or components can be added as needed for specific scenarios.

[0024] It should also be noted that within the scope of this invention, the terms "same", "equal", and "equal to" do not mean that the two values ​​are absolutely equal, but allow for a certain reasonable error. In other words, the terms also cover "substantially the same", "substantially equal", and "substantially equal to".

[0025] It should also be noted that in the description of this invention, the terms "center," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing the invention and for simplifying the description, and do not explicitly or implicitly suggest that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0026] Furthermore, the embodiments of the present invention describe the process steps in a specific order. However, this is only for the convenience of distinguishing each step, and is not a limitation on the order of each step. In different embodiments of the present invention, the order of each step can be adjusted according to the process.

[0027] The following embodiment provides a transmissive continuous phase reconfigurable smart surface structure based on a two-layer interconnect network, including: The first layer of radiating unit array serves as the incident layer and is configured to receive incident electromagnetic waves from free space. The second-layer radiating element array, serving as the output layer, is configured to re-radiate the modulated transmitted electromagnetic wave. It re-radiates the phase-adjusted electromagnetic signal, after passing through a two-layer interconnect network, into free space to form a transmitted beam with the desired direction and wavefront shape. The first and second-layer radiating element arrays are arranged from top to bottom, with the first layer on top and the second layer on the bottom. The first and second-layer radiating element arrays are arranged sequentially along the electromagnetic wave propagation direction. Both the first and second-layer arrays consist of multiple radiating elements, each of which can be implemented using a microstrip patch, slot antenna, dipole antenna, or an electromagnetic resonant structure suitable for millimeter-wave and terahertz frequency bands. The two layers of radiating elements are isolated by a dielectric substrate and maintain a predetermined interlayer distance to ensure good electromagnetic coupling and mechanical stability. An interconnection network is configured to enable any radiating element in the first-layer radiating element array to establish tunable radio frequency connections with multiple radiating elements in the second-layer radiating element array, thereby redistributing interlayer electromagnetic energy and constructing a non-diagonal transmission matrix. The interconnection network is positioned between the first-layer and second-layer radiating element arrays, forming a two-layer interconnection network. Electromagnetic coupling between the arrays of the first-layer radiating elements and the second-layer radiating element arrays is established through this two-layer interconnection network. A centralized bias control network is configured to output a unified bias control voltage. Unlike the one-to-one correspondence between incident and output units in traditional transmissive RIS, the dual-layer interconnect network in this invention allows adjustable radio frequency connections to be established between any radiating unit in the first-layer radiating unit array and multiple radiating units in the second-layer radiating unit array. Through this off-diagonal connection method, the energy incident on a radiating unit is no longer limited to transmission from the corresponding unit, but can be redistributed within the dual-layer network and output from multiple radiating units at different locations, thus forming a transmission matrix with higher degrees of freedom.

[0028] Figure 1 This diagram illustrates an overall schematic of a transmissive, continuously phase-reconfigurable smart surface structure based on a two-layer interconnect network. The first layer, an array of radiating elements, is the incident layer, consisting of M×N radiating elements, used to receive incident electromagnetic waves E in free space. inc The second layer of radiating element array is the output layer, also composed of M×N radiating elements, used to radiate the phase-adjusted electromagnetic signal into free space, forming a transmitted wave E. transThe dual-layer interconnect network contains a large number of RF interconnects and continuous phase adjustment modules configured on the RF interconnects. The continuous phase adjustment modules have built-in varactor diodes, RF blocking inductors, and DC isolation capacitors. In the figure, solid lines represent RF interconnects and dashed lines represent DC bias traces. The centralized bias control network provides DC bias voltage to each continuous phase adjustment module through the DC bias traces. By adjusting the bias voltage, the equivalent reactance of the varactor diode is changed, thereby achieving continuous phase modulation of the RF signals transmitted on each RF interconnect. The radiating elements of the first-layer radiating element array can establish phase-adjustable RF connections with multiple radiating elements of the second-layer radiating element array through the dual-layer interconnect network, thereby flexibly controlling the wavefront shape and propagation direction of the transmitted beam.

[0029] Two-layer interconnect networks include: Several continuously phase-tunable interconnect links are configured to enable any radiating element in the first-layer radiating element array to establish a phase-tunable radio frequency (RF) connection with multiple radiating elements in the second-layer radiating element array via these interconnect links. Each interconnect link connects one radiating element in the first-layer radiating element array and one radiating element in the second-layer radiating element array, thus forming a cross-layer RF transmission channel. Unlike traditional transmission RIS (Radiating Resonance System) which relies solely on near-field coupling for transmission, this invention utilizes an explicitly constructed RF interconnect network to achieve inter-layer energy transfer, thus enabling active control of the transmission path. Each continuously phase-tunable interconnect link is configured with: a microstrip transmission line configured for cross-layer RF signal transmission; and a continuously phase adjustment module located on the microstrip transmission line. The continuously phase adjustment module includes: A variable reactance device is configured to receive an external bias voltage and continuously change its equivalent reactance according to the bias voltage to adjust the equivalent electrical length of the interconnect link, thereby achieving continuous adjustment of the RF transmission phase. The variable reactance device includes varactor diodes, BST tunable dielectric devices, MEMS tunable capacitors, or other adjustable impedance devices. The variable reactance device is preferably implemented using a varactor diode. By adjusting the bias voltage applied across the varactor diode, its junction capacitance changes continuously, thereby changing the equivalent electrical length and propagation constant of the link, achieving continuous adjustment of the RF signal propagation phase. The varactor diode is connected in series or parallel in the interconnect link, and its capacitance value changes continuously with the bias voltage. When the bias voltage changes from low to high, the junction capacitance of the varactor diode gradually decreases, and the corresponding equivalent phase delay of the link changes continuously. By rationally designing the transmission line length and impedance matching network, continuous phase adjustment capability covering a range of 0° to 360° can be achieved. An RF blocking inductor is configured to provide a conduction path for the DC bias voltage while presenting high impedance to RF signals, preventing RF signals from leaking into the centralized bias control network; and DC isolation capacitors are configured to allow radio frequency signals to be transmitted normally on interconnect links while blocking DC bias voltage from entering microstrip transmission lines.

[0030] Figure 2 This diagram illustrates the structure of a continuous phase adjustment module for a single continuously phase-tunable interconnect link in a two-layer interconnect network. This link connects to the first-layer radiating unit E. i With the second layer of radiating unit F j The link comprises two microstrip lines, i.e., microstrip transmission lines, and a continuous phase adjustment unit (shown in the red dashed box) positioned between the two microstrip lines. The continuous phase adjustment unit includes an RF choke inductor (RF blocking inductor), a varactor diode, and a DC isolation capacitor. The RF signal originates from the first-layer radiating unit E. i The output is fed into the continuous phase adjustment unit via the left microstrip line segment, with the RF choke inductor providing the DC bias voltage V. bias The DC isolation capacitor provides a conduction path while blocking RF signal leakage to the bias circuit. It allows the RF signal to pass through and blocks DC bias from entering the RF path. This is achieved by adjusting the DC bias voltage V. bias Changing the equivalent capacitance C(V) of the varactor diode bias This allows for continuous phase adjustment of the transmitted radio frequency signal from 0° to 360°. After phase adjustment, the radio frequency signal is transmitted to the second-layer radiating unit F via the right-side microstrip line segment. j Radiating outwards.

[0031] To ensure RF performance and bias stability during continuous phase modulation, this embodiment employs a centralized bias control network. The centralized bias control network is located at the edge or center of the array formed by the radiating element array, and includes: The controller is configured to generate corresponding digital control commands based on a preset beam direction or real-time channel state information. The digital-to-analog converter module is configured to receive digital control commands and convert the corresponding analog bias control voltages to each varactor diode. The main bias bus is configured to output the corresponding bias control voltage to the continuous phase adjustment module. The main bias bus in the centralized bias control network provides control voltage to multiple variable reactance devices via a unified bias supply node, and effectively isolates the DC bias from the RF signal through an RF blocking inductor and a DC isolation capacitor. This structure significantly reduces the parasitic effects caused by the large number of bias traces in traditional distributed bias networks, improving system integration and circuit stability. Due to the centralized control method, the entire array requires only a few main bias channels to control a large-scale phase adjustment network, significantly reducing wiring complexity and the impact of parasitic parameters. Figure 4This diagram illustrates a centralized bias control network structure with a two-layer interconnect network. The upper-level controller, i.e., the MCU, acts as the controller, sending digital control commands to the bias control chip via an SPI or I²C communication interface. The bias control chip drives a multi-channel digital-to-analog converter (DAC) to generate multiple analog voltage signals. Each analog voltage signal is then low-pass filtered before outputting its corresponding DC bias voltage V. bias,1 ~ Vbias,K The DC bias voltage is delivered to the continuous phase adjustment unit on each RF interconnect line via the DC bias line shown by the dashed line in the figure, providing bias for the varactor diode inside the unit. The solid line in the figure is the RF interconnect line. The RF choke inductor and DC isolation capacitor realize the electrical isolation between the DC bias path and the RF signal path. By independently adjusting the DC bias voltage of each path, the phase tuning amount of each continuous phase adjustment unit can be controlled separately, realizing independent continuous phase control of multiple RF signals in the double-layer interconnect network.

[0032] The topology of a two-layer interconnection network includes at least one of the following: partially connected, fully connected, tree, ring, or star topologies. A partially connected structure means that the two-layer interconnection network does not physically implement all theoretically feasible interconnection paths between the first and second layer radiating units; it only deploys a portion of continuously phase-tunable interconnection links, reducing hardware scale and implementation complexity while maintaining a certain level of controllability. For example, in one improved embodiment, the two-layer interconnection network can adopt a partially connected structure, retaining only a portion of the inter-layer links to reduce hardware complexity. In another embodiment, a fully connected structure can be used, allowing any incident layer unit to establish continuously adjustable connections with any exit layer unit to obtain the maximum degree of freedom in the transmission matrix. In yet another embodiment, tree, ring, star, or hybrid topologies can be used to construct the inter-layer network to adapt to different application scenarios. Figure 3 The diagram illustrates a two-layer interconnection network topology (using a 4×4 array as an example). The left side of the diagram shows the first-layer radiating element array, which serves as the incident layer and receives incident spatial waves. The right side shows the second-layer radiating element array, which serves as the exit layer and re-radiates transmitted waves. The yellow box in the middle represents the two-layer interconnection network, which consists of multiple radio frequency (RF) interconnects. Each RF interconnect is equipped with a continuous phase adjustment unit composed of varactor diodes. Each radiating element of the first-layer radiating element array can be connected to multiple radiating elements of the second-layer radiating element array via RF interconnects, forming a cross-interconnection topology. The phase adjustment of the RF signal is independently achieved by each continuous phase adjustment unit, enabling phase-adjustable RF connections between any radiating element in the first layer and multiple radiating elements in the second layer. This allows for flexible control of the beam characteristics of the output transmitted wave.

[0033] When beam deflection is required, the controller calculates the phase distribution needed for each interconnecting link based on the target direction and adjusts the bias voltage of the corresponding strain gauge diodes. Different links generate different phase delays, resulting in a predetermined spatial phase gradient in the electromagnetic signals transmitted to the second-layer radiating element. Ultimately, the electromagnetic waves radiated by each emitting element coherently superimpose in free space, forming a transmitted beam pointing towards the target direction.

[0034] When multi-beam transmission, beam scanning, or dynamic spatial multiplexing is required, the transmission matrix can be dynamically reconstructed by updating the offset state of each link in real time. Because this invention employs a continuous phase adjustment mechanism, compared to traditional 1-bit, 2-bit, or 3-bit discrete phase RIS, it achieves higher beamforming accuracy, lower quantization error, and better sidelobe suppression performance.

[0035] Furthermore, the dual-layer interconnection network structure proposed in this invention can be extended to large-scale array systems. For example, it can construct 8×8, 16×16, or even larger-scale dual-layer transmission arrays, and can be further extended into multi-layer cascaded structures to achieve more complex spatial wavefront manipulation functions. Therefore, this invention is not only applicable to the construction of future 6G intelligent wireless environments, but also to various application scenarios such as millimeter-wave radar, satellite communication, terahertz imaging, and wireless sensing, possessing good engineering application value and industrialization prospects.

[0036] Through the above structural design, the present invention realizes continuous and adjustable energy coupling and transmission matrix reconstruction between the two-layer radiation units, enabling the transmission-type RIS to not only adjust the phase of the transmitted wave, but also to realize the dynamic routing and redistribution of electromagnetic energy in space, thereby obtaining a control freedom and system performance far higher than that of traditional transmission-type RIS.

[0037] In some embodiments, one or more layers of radiating element arrays are added, with interconnecting networks configured between adjacent radiating element arrays to form a hierarchical transmission network for achieving higher-dimensional transmission wavefront manipulation. The radiating elements in the added one or more radiating element arrays are implemented using microstrip patches, slot antennas, dipole antennas, or electromagnetic resonant structures suitable for millimeter-wave and terahertz frequency bands. This expands the two-layer structure into a three-layer or multi-layer structure, forming a hierarchical transmission network and achieving higher-dimensional wavefront control capabilities.

[0038] In a preferred embodiment, each interconnect link can achieve continuous phase adjustment within the range of 0° to 360°. By independently controlling the phase state of each interconnect link, a continuously programmable transmission matrix can be constructed to achieve dynamic control of the transmission beam direction, beamwidth, wavefront shape, and spatial energy distribution.

[0039] In one specific embodiment, after an incident layer radiating element (first layer radiating element array) receives an electromagnetic wave, the induced radio frequency signal first enters the two-layer interconnect network. Subsequently, this signal is transmitted to the target radiating element in the exit layer (second layer radiating element array) via a continuous phase-adjustment link. During transmission, the varactor diodes in the link change their capacitance values ​​according to the external bias voltage, causing a corresponding phase delay in the link. By precisely controlling the bias voltage of each link, different propagation paths can obtain different phase compensations, thereby achieving accurate reconstruction of the transmitted wavefront.

[0040] While some embodiments of the present invention have been described in this application, those skilled in the art will understand that these embodiments are merely illustrative. Numerous variations, alternatives, and improvements will arise in those skilled in the art under the teachings of this invention without departing from its scope. The appended claims are intended to define the scope of the invention and thereby cover methods and structures within the scope of the claims themselves and their equivalents.

Claims

1. A transmissive continuous-phase reconfigurable smart surface structure based on a two-layer interconnect network, characterized in that, include: The first layer of radiating unit array is configured to receive incident electromagnetic waves from free space. The second layer of radiating unit array is configured to re-radiate the electromagnetic signal, which has undergone phase adjustment through the double-layer interconnection network, into free space to form a transmission beam with the desired direction and wavefront shape. The first layer of radiating element array and the second layer of radiating element array are arranged sequentially along the direction of electromagnetic wave propagation. An interconnection network is configured to enable any radiating element in the first layer radiating element array to establish an adjustable radio frequency connection with multiple radiating elements in the second layer radiating element array; the interconnection network is disposed between the first layer radiating element array and the second layer radiating element array to form a two-layer interconnection network. as well as A centralized bias control network is configured to output a uniform bias control voltage.

2. The transmissive continuous-phase reconfigurable smart surface structure based on a dual-layer interconnect network according to claim 1, characterized in that, The interconnection network includes: Several continuously phase-tunable interconnect links are configured to enable any radiating element in the first layer radiating element array to establish a phase-tunable radio frequency connection with multiple radiating elements in the second layer radiating element array via the continuously phase-tunable interconnect links.

3. The transmissive continuous phase reconfigurable smart surface structure based on a dual-layer interconnect network according to claim 2, characterized in that, Each of the aforementioned continuously phase-adjustable interconnect links is configured with: Microstrip transmission lines, configured for cross-layer radio frequency signal transmission; and A continuous phase adjustment module is located on the microstrip transmission line.

4. The transmissive continuous-phase reconfigurable smart surface structure based on a dual-layer interconnect network according to claim 3, characterized in that, The continuous phase adjustment module includes: A variable reactance device is configured to receive an external bias voltage and continuously change its own equivalent reactance according to the bias voltage to adjust the equivalent electrical length of the interconnect link and realize continuous adjustment of the radio frequency transmission phase. An RF blocking inductor, configured to provide a conduction path for the DC bias voltage while preventing RF signals from leaking into the centralized bias control network; and A DC isolation capacitor is configured to allow radio frequency signals to be transmitted normally on the interconnect link while blocking DC bias voltage from being introduced into the microstrip transmission line.

5. The transmissive continuous-phase reconfigurable smart surface structure based on a dual-layer interconnect network according to claim 4, characterized in that, Each of the aforementioned interconnect links can achieve continuous phase adjustment within the range of 0° to 360°.

6. The transmissive continuous phase reconfigurable smart surface structure based on a dual-layer interconnect network according to claim 4, characterized in that, The centralized bias control network is located in the edge or central region of the array formed by the radiating element array, and the centralized bias control network includes: The controller is configured to generate corresponding digital control commands based on a preset beam direction or real-time channel state information. A digital-to-analog converter module is configured to receive the digital control command and convert and output the corresponding analog bias control voltage. The main bias bus is configured to output a corresponding bias control voltage to the continuous phase adjustment module; the main bias bus in the centralized bias control network provides control voltage to multiple variable reactance devices via a unified bias supply node, and the DC bias and radio frequency signal are effectively isolated by the radio frequency blocking inductor and the DC isolation capacitor.

7. The transmissive continuous phase reconfigurable smart surface structure based on a dual-layer interconnect network according to claim 4, characterized in that, The variable reactance device includes at least one of a varactor diode, a BST adjustable dielectric device, or a MEMS adjustable capacitor.

8. The transmissive continuous phase reconfigurable smart surface structure based on a dual-layer interconnect network according to claim 1, characterized in that, The topology of the two-layer interconnection network includes at least one of the following: partially connected structure, fully connected structure, tree topology, ring topology, or star topology.

9. The transmissive continuous-phase reconfigurable smart surface structure based on a dual-layer interconnect network according to claim 1, characterized in that, It also includes one or more layers of radiating unit arrays, with interconnection networks configured between adjacent radiating unit arrays to form a hierarchical transmission network.

10. The transmissive continuous-phase reconfigurable smart surface structure based on a dual-layer interconnect network according to claim 9, characterized in that, The radiating elements in the first layer radiating element array, the second layer radiating element array, and the added one or more layers of radiating element array are implemented using microstrip patches, slot antennas, dipole antennas, or electromagnetic resonant structures suitable for millimeter wave and terahertz frequency bands.

Images