An overlapping and interlaced vertical power supply busbar and its power supply method

Abstract

This application discloses an overlapping and interlocking vertical power supply busbar and its power supply method. The busbar includes multiple layers of conductive busbars stacked vertically, each layer corresponding to a power supply voltage standard. An insulating layer is provided between adjacent conductive busbar layers. Each conductive busbar layer has conductive posts protruding upwards and downwards in the vertical direction for electrical connection with the corresponding power supply board and server motherboard. Each conductive busbar layer has clearance through holes that allow conductive posts from other conductive busbar layers to pass through, with the inner diameter of the clearance through holes being larger than the outer diameter of the passing conductive posts. It also includes a cooling plate disposed between adjacent conductive busbar layers, with clearance holes for the conductive posts. The power supply method based on this vertical power supply busbar can significantly shorten the power transmission distance, reduce power loss, and achieve integrated power supply of multiple voltage standards and high current within a limited vertical space, improving space utilization and power supply efficiency.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of laminated conductive power supply units, and in particular to an overlapping and penetrating type vertical power supply busbar and a power supply method thereof. BACKGROUND

[0002] With the continuous rise of cloud computing and artificial intelligence technology, the amount of Internet traffic continues to increase, and higher requirements are placed on the data processing capacity and storage capacity of data center server rooms. As the basic data processing unit of a data center, servers have an increasingly heavy workload, especially the central processor chips and graphics processor components inside the server, whose working load current has risen sharply, with a single central processor chip working current of 300A to 600A. At present, the power consumption of a single GPU has climbed to the kilowatt level, and the supply voltage is only a few volts, corresponding to a current of up to thousands of amperes, which poses an unprecedented challenge to the server power supply system.

[0003] In the existing server power supply architecture, a power supply unit usually outputs 12V DC to a power distribution mainboard, which then distributes power to various power-consuming components such as central processor chips, memories, and graphics processors. The power supply unit and the power distribution mainboard are usually electrically connected through a gold finger and a connector plug. Taking a typical rack server as an example, the server unit (such as a computing node) and the power supply module are usually connected by cables to provide power to each server unit.

[0004] However, the above-mentioned traditional power supply scheme has exposed the following prominent problems in response to the increasing power consumption demand of AI servers:

[0005] (1) The excessively long power supply path leads to a dramatic increase in line loss. In the existing power supply system, the main power supply circuit from the power supply to the GPU or CPU usually adopts cable power supply or copper bus power supply, and the power supply link is long. As the current increases, the longer the power supply link, the greater the line loss. At the same time, the longer the line, the greater the line impedance, resulting in a sharp increase in heat generation. If a larger cross-sectional area cable or copper bus is used to reduce impedance, its volume, weight, and cost will be immeasurable, and the efficiency will be low.

[0006] (2) There is a flow bottleneck at the interconnection between the power supply and the mainboard. The traditional power supply unit usually only has one layer of gold finger, which is connected to the power distribution mainboard through a single connector. As the power consumption of the entire machine increases, the current flowing through this interconnection position continues to increase, and the single-layer gold finger structure has a problem of insufficient flow capacity.

[0007] (3) The PCB copper foil current-carrying capacity of the power distribution mainboard is limited. Since the CPU public system interface bus signals, high-speed serial computer expansion bus standard signals, etc. occupy most of the space of the power distribution mainboard, the PCB copper foil space left for current flow is very limited. If the number of layers is increased to improve the current-carrying capacity, it will bring a substantial increase in the cost of the power distribution mainboard and adjustment of the chassis structure.

[0008] (4) The cable layout inside the rack is messy and the space utilization rate is low. The use of cables to connect each server unit and the power supply module will inevitably provide additional space inside the rack for placing cables and space for moving the cables with the box when the server unit is extracted, resulting in poor space configuration and utilization efficiency inside the rack. As the number of server units increases, the number of cables also increases, which can easily hinder user operation due to cable clutter.

[0009] In view of the above problems, some related technologies have proposed improvement schemes. For example, Chinese invention patent CN102999139A discloses a power supply device which uses a first conductive plate, an insulating layer and a second conductive plate stacked in sequence to form a power supply module, and inserts power supply terminals and output pins on the conductive plate. The power supply is realized by connecting the output pins to the electrode pairs on the server unit. Although this scheme saves some cables and improves the space utilization rate inside the rack, the power supply module is still arranged along the longitudinal axis of the rack on the surface of the base, the power supply direction is horizontal, and the power supply path is still relatively long. Moreover, the conductive plate structure only has two layers, which cannot meet the demand for independent power supply of multiple voltage systems (such as 5V, 3.3V, 1V, 0.5V, etc.).

[0010] For another example, Chinese invention patent CN116820216A discloses a layer-stacked conduction type power supply unit which increases the current-carrying capacity by arranging a layer-stacked power supply motherboard and power supply daughter card in the power supply unit housing and setting the gold finger as a layer-stacked current conduction structure. However, this scheme is essentially still an improvement on the interface of the power supply unit itself, and the power supply motherboard and the power supply daughter card still need to be electrically connected through the positive bus bar and the negative bus bar, so the overall power supply path is still relatively long. At the same time, this scheme fails to solve the problem of insufficient PCB copper foil current-carrying capacity in the power supply path from the power distribution mainboard to each power-consuming component.

[0011] In summary, how to substantially shorten the power supply path, reduce line loss, improve current-carrying capacity and meet the demand for power supply of multiple voltage systems while maintaining the existing server chassis structure basically unchanged, and further simplify the space layout of the power supply system, has become a technical problem to be solved in the field of AI server power supply technology. SUMMARY

[0012] The application provides an overlapping and interpenetrating vertical power supply busbar and a power supply method thereof, to solve the problems of large power supply line loss, low power supply efficiency and difficulty in meeting the integrated power supply demand of multiple voltage systems in the existing server power supply system.

[0013] In order to achieve the above-mentioned purpose, the application provides the following technical solutions:

[0014] In one aspect, the application provides an overlapping and interpenetrating vertical power supply busbar, comprising a plurality of layers of conductive busbar layers, each layer of the conductive busbar layers being stacked along the vertical direction, and each layer of the conductive busbar layers corresponding to one power supply voltage system; an insulating layer is arranged between any two adjacent layers of the conductive busbar layers.

[0015] A plurality of conductive columns protruding along the vertical direction are arranged on each layer of the conductive busbar layers, the plurality of conductive columns comprising one or more upper protruding conductive columns and one or more lower protruding conductive columns, the lower protruding conductive columns on each layer of the conductive busbar layers being used for electrical connection with the power supply terminals on the corresponding power supply board, and the upper protruding conductive columns on each layer of the conductive busbar layers being used for electrical connection with the power receiving terminals on the corresponding server mainboard.

[0016] An avoidance through-hole is formed on each layer of the conductive busbar layers, the avoidance through-hole allowing the conductive columns on the remaining conductive busbar layers to pass through, and the inner diameter of the avoidance through-hole being greater than the outer diameter of the conductive column passing through, so that the conductive columns of each layer of the conductive busbar layers pass through the remaining layers of the conductive busbar layers without contacting each other.

[0017] Further in the above technical solution, one or more cooling plates are arranged between any two adjacent layers of the conductive busbar layers, and the insulating layer is arranged between the cooling plate and the conductive busbar layer; and a position corresponding to each of the conductive columns on the cooling plate is provided with a gap hole for the conductive column to pass through.

[0018] Further, a through hole is formed on the insulating layer at a position corresponding to each of the conductive columns and the avoidance through-hole, for the conductive column to pass through.

[0019] Further, the projection area of each layer of the conductive busbar layers along the vertical direction matches the area of the server mainboard and the power supply board.

[0020] Further, an insulating gap is provided between the inner wall of the avoidance through-hole and the outer wall of the conductive column passing through, and the insulating gap is filled with an insulating medium or an air gap.

[0021] Further, the cooling plate is a wind-cooled heat dissipation plate or a liquid-cooled heat dissipation plate, and a uniform flow grid is arranged inside the cooling plate to allow the cooling medium to flow.

[0022] Further, the plurality of conductive columns on each layer of the conductive busbar layer are arranged in an array, and the number and distribution of the conductive columns on each layer of the conductive busbar layer are determined by the power and power supply position requirements of the corresponding power supply voltage system.

[0023] Further, the conductive column and the conductive busbar layer are an integral structure or a split connection structure.

[0024] In another aspect, the application provides a power supply method based on the above-mentioned overlapping and penetrating vertical power supply busbar, comprising:

[0025] The power supply panel is arranged directly below the server mainboard, and the power supply end of the power supply panel and the power receiving end of the server mainboard are opposite in the vertical direction.

[0026] The overlapping and penetrating vertical power supply busbar is provided, which comprises a plurality of layers of conductive busbar layers, each layer of the conductive busbar layer corresponds to a different power supply voltage system, an insulating layer is arranged between adjacent two layers of the conductive busbar layer, each layer of the conductive busbar layer is respectively provided with an upper protruding conductive column and a lower protruding conductive column protruding in the vertical direction, and each layer of the conductive busbar layer is provided with an avoidance through hole for the conductive columns of the remaining layers of the conductive busbar layer to pass through.

[0027] The overlapping and penetrating vertical power supply busbar is arranged between the power supply panel and the server mainboard, so that the conductive columns of each layer of the conductive busbar layer pass through the avoidance through hole of the corresponding layer, and the electric energy of the corresponding power supply voltage system of each layer of the conductive busbar layer is transmitted to the corresponding power receiving end on the server mainboard.

[0028] In the above technical solution, further, the power supply panel and the server mainboard are arranged back to back, the overlapping and penetrating vertical power supply busbar is arranged between the power supply panel and the server mainboard, and the conductive columns of each layer of the conductive busbar layer are connected to the corresponding power supply end and power receiving end in the vertical direction, so as to form a vertical power supply path.

[0029] Further, a cooling plate is arranged between adjacent two layers of the conductive busbar layer or at the outermost side of the conductive busbar layer, and the conductive busbar layer is cooled by the cooling plate.

[0030] Compared with the prior art, the application has at least the following beneficial effects:

[0031] 1、The application sets multiple layers of conductive busbar layers stacked in the vertical direction, so that each layer of conductive busbar layers corresponds to one power supply voltage system, and an insulating layer is arranged between any two adjacent layers of conductive busbar layers to achieve electrical isolation, thereby enabling the simultaneous transmission of multiple different voltage systems in the same vertical space, avoiding the space waste and line complexity problems caused by setting separate power supply lines for each voltage system. The upper and lower protruding conductive columns protruding in the vertical direction are arranged on each layer of conductive busbar layers, so that the lower protruding conductive columns are electrically connected to the power supply terminals on the power supply board below, and the upper protruding conductive columns are electrically connected to the power receiving terminals on the server mainboard above, thereby establishing a vertical direct power supply path between the power supply board and the server mainboard, greatly shortening the power transmission distance and effectively reducing the line impedance and power loss caused by the excessive length of the power supply path. At the same time, by opening an avoidance through hole on each layer of conductive busbar layers that allows the conductive columns on the remaining conductive busbar layers to pass through, and the inner diameter of the avoidance through hole is greater than the outer diameter of the conductive column passing through, the conductive columns of each layer of conductive busbar layers can pass through the remaining layers of conductive busbar layers without contacting each other, achieving the close overlapping arrangement of multiple busbars in the vertical direction to save space, and ensuring the electrical independence and safety between each voltage system power supply loop, thereby realizing low-loss and high-efficiency power supply of multiple voltage systems in a limited space.

[0032] 2、The application sets one or more cooling plates between any two adjacent layers of conductive busbar layers, and an insulating layer between the cooling plate and the conductive busbar layer, and opens a hole for the conductive column to pass through on the cooling plate corresponding to the position of each conductive column, so that the cooling plate can be embedded inside the busbar stack structure without affecting the electrical connection and insulation performance of each layer of conductive busbar layers. Since the conductive busbar layers generate significant heat when transmitting large currents, and heat accumulation can cause the temperature of the busbar to rise, thereby increasing the resistivity of the busbar material and increasing the conductive resistance, by directly setting the cooling plate between adjacent conductive busbar layers, the heat source can be cooled efficiently at close range, and the heat generated during the operation of the busbar layer can be removed in time, reducing the resistivity of the busbar material, further reducing the conductive resistance and power loss, and improving the power supply efficiency, while preventing the busbar from overheating and affecting the structural stability and service life.

[0033] 3、The application sets a through hole for the conductive column to pass through on the insulating layer corresponding to the position of each conductive column and avoidance through hole, so that the conductive columns of each layer of conductive busbar layers can pass through the insulating layer without obstacles, ensuring reliable electrical isolation between adjacent conductive busbar layers through the insulating layer, avoiding the obstruction of the insulating layer to the conductive column insertion path, ensuring the smooth assembly of the multi-layer busbar overlapping insertion structure and the accurate alignment connection of the conductive column and the corresponding power supply terminal / power receiving terminal, improving the assembly efficiency and connection reliability.

[0034] 4、The projection area of each layer of conductive busbar layer in the vertical direction is set to match the area of the server mainboard and the power supply board, so that the overall vertical power busbar occupies no more than the area of the server mainboard and the power supply board in the horizontal plane, without additional horizontal space in the server case.

[0035] 5、The insulating gap is set between the inner wall of the avoidance through hole and the outer wall of the conductive column passing through, and the insulating gap is filled with insulating medium or kept as an air gap, so that the conductive column passing through the avoidance through hole is completely electrically isolated from the conductive busbar layer. Since air and insulating medium have high insulation resistance, the insulating gap can effectively prevent the conductive column of different voltage systems from leaking or short-circuiting with the conductive busbar layer passed through, ensuring the electrical safety and stability of each layer of conductive busbar layer during simultaneous transmission of multiple voltage systems, and avoiding circuit failure caused by accidental contact of the conductive column with the conductive busbar layer.

[0036] 6、The cooling plate in the application is a wind-cooled heat sink or a liquid-cooled heat sink, and the cooling plate is provided with a flow-distributing grid inside to allow the cooling medium to flow, so that the cooling medium (air or cooling liquid) can be uniformly distributed when flowing through the cooling plate by the guidance of the flow-distributing grid, avoiding the problem of heat dissipation dead angle or local overheating caused by uneven local flow rate of the cooling medium. The flow-distributing grid ensures that the cooling medium can fully exchange heat with each area of the cooling plate, thereby uniformly and efficiently removing the heat generated by each layer of conductive busbar layer, further improving the overall heat dissipation effect of the busbar stack structure, and ensuring that each layer of busbar can maintain a low working temperature under various load conditions.

[0037] 7、The application sets a plurality of conductive columns on each layer of conductive busbar layer in an array distribution, and the number and distribution position of the conductive columns of each layer of conductive busbar layer are determined by the power and power supply position requirement of the corresponding power voltage system, so that the configuration of the conductive columns can accurately match the actual load power of each voltage system - the more power required, the more conductive columns are configured to realize multi-parallel shunt, thereby reducing the bearing current and contact resistance of each conductive column, reducing contact heat and voltage drop; the voltage system with less power requirement is configured with a corresponding smaller number of conductive columns to avoid resource waste.

[0038] 8、The conductive column and the conductive busbar layer are integrally formed or separately connected, the integrally formed structure can eliminate the contact interface between the conductive column and the busbar layer, fundamentally eliminating the contact resistance and contact heat, improving the conductive reliability and large current carrying capacity; the separately connected structure is convenient for individual replacement and maintenance.

[0039] 9、The application sets the power supply board directly below the server mainboard, so that the power supply end of the power supply board and the power receiving end of the server mainboard are opposite in the vertical direction, and an overlapping and interpenetrating vertical power supply busbar is provided between the two, so that the conductive columns of each layer of conductive busbar layer respectively pass through the avoidance through holes of the corresponding layer and then transmit the electric energy of each layer of corresponding power supply voltage mode to the corresponding power receiving end on the server mainboard, thereby establishing a plurality of vertical power supply paths between the power supply board and the server mainboard, which are independent of each other and have extremely short paths. Since the length of the power supply path directly determines the size of the line impedance, the shorter the path, the smaller the impedance. This vertical direct connection structure fundamentally shortens the electric energy transmission distance of each voltage mode, effectively reduces the voltage drop and heat loss caused by line impedance, and at the same time, the overlapping and interpenetrating structure of the multi-layer conductive busbar layer allows the transmission of large current electric energy of multiple different voltage modes in the same vertical space, realizing the integration and high efficiency of multi-voltage mode power supply.

[0040] 10、The application sets the power supply board and the server mainboard back to back, and sandwiches the overlapping and interpenetrating vertical power supply busbar between the two, so that the conductive columns of each layer of conductive busbar layer are connected to the corresponding power supply end and power receiving end in the vertical direction to form a vertical power supply path. Since the straight-line distance between the power supply end and the power receiving end is the shortest path for electric energy transmission, the physical length of this vertical power supply path is basically equal to the gap distance between the power supply board and the server mainboard, almost eliminating the extra path length caused by horizontal wiring of cables or copper bars in traditional solutions, thereby reducing the line impedance and electric energy loss to the theoretical minimum value. At the same time, the back-to-back arrangement makes the power supply board and the server mainboard support each other in mechanical structure, improving the overall structural strength and shock resistance. BRIEF DESCRIPTION OF DRAWINGS

[0041] In order to more clearly illustrate the technical solutions in the embodiments of the application, the drawings needed in the embodiments will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the application, and those skilled in the art can obtain other drawings based on these drawings without creating any creative labor. It should be understood that the specific shapes, structures shown in the drawings should not be regarded as limiting conditions for realizing the application; for example, based on the technical concepts and exemplary drawings disclosed in the application, those skilled in the art can easily make routine adjustments or further optimization of the increase / decrease / attribute division, specific shape, positional relationship, connection mode, size ratio relationship, etc. of certain units (components).

[0042] Figure 1 The overlapping and interpenetrating vertical power supply busbar provided by the application in an embodiment and the layer structure schematic diagram of the server mainboard and the power supply board in the assembled state;

[0043] Figure 2 Fig. 1 is a schematic diagram of a planar structure of a first conductive busbar layer constituting a vertical power supply busbar of an embodiment of the present application;

[0044] Figure 3 Fig. 2 is a schematic diagram of a planar structure of a second conductive busbar layer constituting a vertical power supply busbar of an embodiment of the present application;

[0045] Figure 4 Fig. 3 is a schematic diagram of a planar structure of a third conductive busbar layer constituting a vertical power supply busbar of an embodiment of the present application;

[0046] Figure 5 Fig. 4 is a schematic diagram of a planar structure of a cooling plate of an embodiment of the present application; Figures 2 to 4 Fig. 5 is a schematic diagram of a planar structure of three conductive busbar layers in a vertical stacked state;

[0047] Figure 6 Fig. 6 is a schematic diagram of a front view structure of a single conductive busbar layer of an embodiment of the present application;

[0048] Figure 7 Fig. 7 is a schematic diagram of a top view structure of a single conductive busbar layer of an embodiment of the present application; Figure 6 Fig. 8 is a schematic diagram of a bottom view structure of a single conductive busbar layer of an embodiment of the present application;

[0049] Figure 8 Fig. 4 is a schematic diagram of a planar structure of a cooling plate of an embodiment of the present application;

[0050] BRIEF DESCRIPTION OF THE DRAWINGS

[0051] 1. First conductive busbar layer; 11. First upper protruding conductive column; 12. First lower protruding conductive column; 13. First avoiding through hole;

[0052] 2. Second conductive busbar layer; 21. Second upper protruding conductive column; 22. Second lower protruding conductive column; 23. Second avoiding through hole;

[0053] 3. Third conductive busbar layer; 31. Third upper protruding conductive column; 32. Third lower protruding conductive column; 33. Third avoiding through hole;

[0054] 4. Insulating layer;

[0055] 5. Cooling plate; 51. Avoiding hole; 52. Current equalizing grid; 53. Cooling medium pipeline joint;

[0056] 6. Server mainboard;

[0057] 7. Power supply board;

[0058] 8. Soldering point;

[0059] 9. Component. DETAILED DESCRIPTION

[0060] The application will be further described in detail below with reference to the accompanying drawings.

[0061] In the description of the present application: unless otherwise specified, the meaning of "multi-layer" or "multiple" is two / layers or more than two / layers. The terms "first", "second", etc. in the present application are intended to distinguish the objects referred to, and do not have a special meaning in the technical connotation aspect (for example, it should not be understood as an emphasis on importance or order, etc.). The expressions "include", "contain", "have" and the like also mean "not limited to" (certain units, components, materials, steps, etc.).

[0062] The terms such as "upper", "lower", "left", "right", "intermediate" and the like referred to in the present application are generally intended to facilitate intuitive understanding with reference to the drawings, and are not an absolute limitation on the positional relationship in the actual product. Changes in these relative positional relationships, without departing from the technical concept disclosed in the present application, are also considered within the scope of the present application.

[0063] The existing server power supply system usually adopts an external cabinet or an independent power supply PSU module. This power supply scheme has been used for many years. The main power supply circuit of the power supply to the GPU or CPU adopts line power supply or copper bar power supply. With the advent of AI servers and the increasing consumption of electric energy by AI server GPUs or CPUs, the power consumption of a single GPU has reached the kilowatt level, and the power supply voltage is only a few volts and the current is thousands of amperes. The biggest difficulty brought by this is that the longer the power supply link is, the greater the line loss is. The total power of a single cabinet of multiple AI servers has reached the megawatt level. In the traditional power supply mode, the greater the current is, the greater the line loss is. Under the same current, the longer the line is, the greater the line impedance is, resulting in greater heat generation. If a cable or copper bar with a large cross-sectional area is used, the volume / weight / cost is immeasurable, and the efficiency is not high. In order to solve the problems existing in the prior art, the present application provides an overlapping and penetrating type vertical power supply busbar and a power supply method thereof. The present scheme will be described in detail below with reference to specific embodiments.

[0064] Embodiment one

[0065] The present embodiment provides an overlapping and penetrating type vertical power supply busbar, as shown in Figure 1 The server mainboard 6 is regarded as a load end, and the server computing function thereof is continued to be retained. Only a new form of power supply link and power supply form is proposed. The server mainboard 6 is placed in the upper space, the power receiving end corresponding thereto is set in a through hole form, the power supply board 7 is designed to be the same size or similar to the mainboard, and the power supply end thereof is set in a through hole form. The server mainboard 6 and the power supply board 7 are connected through the corresponding conductive columns to complete power supply. The purpose is to reduce power supply loss and cost, and it is suitable for electric energy transmission between the power supply board 7 and the server mainboard 6 in an AI server.

[0066] The overlapping and interleaved vertical power supply busbar provided by the embodiment comprises a plurality of layers of conductive busbar layers, and each layer of conductive busbar layer is arranged in a vertical direction. In the embodiment, three layers of conductive busbar layers are taken as an example for illustration, i.e., a first conductive busbar layer 1, a second conductive busbar layer 2 and a third conductive busbar layer 3, but the present application is not limited thereto, and the number N of layers of conductive busbar layers satisfies N≥2, and the specific number of layers can be determined according to the number of power supply voltage systems required by the server mainboard 6.

[0067] Each layer of conductive busbar layer corresponds to one power supply voltage system. For example, the first conductive busbar layer 1 corresponds to a 5V power supply voltage system, the second conductive busbar layer 2 corresponds to a 3.3V power supply voltage system, and the third conductive busbar layer 3 corresponds to the negative poles of the remaining two voltage systems. The projection area of each layer of conductive busbar layer in the vertical direction matches the area of the server mainboard 6 and the power supply board 7, so that the floor area of the entire vertical power supply busbar in the horizontal plane does not exceed the area of the server mainboard 6 and the power supply board 7, without the need for additional horizontal space in the server case.

[0068] An insulating layer 4 is arranged between any two adjacent layers of conductive busbar layer. Specifically, the first conductive busbar layer 1 and the second conductive busbar layer 2 are provided with an insulating layer 4, and the second conductive busbar layer 2 and the third conductive busbar layer 3 are provided with an insulating layer 4. The insulating layer 4 is used to achieve electrical isolation between the two adjacent layers of conductive busbar layer. By arranging the insulating layer 4 between the adjacent conductive busbar layers, short circuit or electric leakage between the conductive busbar layers of different voltage systems can be effectively prevented, and the electrical safety during simultaneous power supply of multiple voltage systems can be ensured. The thickness and material of the insulating layer 4 can be selected according to the voltage difference between the layers of conductive busbar layer and the required insulation withstand voltage level.

[0069] A plurality of conductive columns protruding in the vertical direction are arranged on each layer of conductive busbar layer. The plurality of conductive columns comprise one or more upper protruding conductive columns and one or more lower protruding conductive columns. Specifically, the lower protruding conductive columns on each layer of conductive busbar layer are used to be electrically connected with the power supply ends on the power supply board 7 below, and the upper protruding conductive columns on each layer of conductive busbar layer are used to be electrically connected with the power receiving ends on the server mainboard 6 above.

[0070] Taking the first conductive busbar layer 1 as an example, the lower surface thereof is provided with a first lower protruding conductive column 12 protruding downward, and the upper surface thereof is provided with a first upper protruding conductive column 11 protruding upward, as shown in Figure 6 , 7 Similarly, the second conductive busbar layer 2 is provided with a second lower protruding conductive column 22 and a second upper protruding conductive column 21, and the third conductive busbar layer 3 is provided with a third lower protruding conductive column 32 and a third upper protruding conductive column 31, as shown in Figure 1The material of the conductive column is preferably copper or copper alloy because of its excellent electrical conductivity and good mechanical strength. The conductive column and the conductive busbar layer can be an integral structure or a split connection structure.

[0071] Each conductive busbar layer is provided with an avoidance through hole allowing the conductive column on the remaining conductive busbar layer to pass through. The inner diameter of the avoidance through hole is larger than the outer diameter of the conductive column passing through, so that the conductive columns of each conductive busbar layer pass through the remaining conductive busbar layer without contacting each other. Specifically, as shown in the drawings, Figures 2 to 4 , the first conductive busbar layer 1 is provided with a plurality of first avoidance through holes 13, the second conductive busbar layer 2 is provided with a plurality of second avoidance through holes 23, and the third conductive busbar layer 3 is provided with a plurality of third avoidance through holes 33.

[0072] The inner wall of the avoidance through hole and the outer wall of the conductive column passing through have an insulating gap, which can be filled with an insulating medium (such as insulating glue, insulating sleeve, etc.) or can remain as an air gap. The insulating gap can effectively prevent the conductive column of different voltage systems from causing leakage or short circuit with the conductive busbar layer passing through, ensuring the electrical safety and stability of each conductive busbar layer when multiple voltage systems are transmitted at the same time.

[0073] In this embodiment, the insulating layer 4 is provided with a through hole corresponding to the position of each conductive column and avoidance through hole. This allows the conductive columns of each conductive busbar layer to pass through the insulating layer 4 without obstacles, ensuring reliable electrical isolation between adjacent conductive busbar layers through the insulating layer 4, avoiding the obstruction of the insulating layer 4 to the insertion path of the conductive column, ensuring the smooth assembly of the multi-layer busbar overlapping insertion structure and the accurate alignment connection of the conductive column and the corresponding power supply end / power receiving end, improving the assembly efficiency and connection reliability.

[0074] The plurality of conductive columns on each conductive busbar layer are arranged in an array. The number and distribution position of the conductive columns of each conductive busbar layer are determined by the power and power supply position requirements of the corresponding power supply voltage system. The higher the power requirement of the voltage system, the more conductive columns are provided on the corresponding conductive busbar layer to achieve multi-path parallel shunt, reduce the current and contact resistance on each conductive column, and reduce the contact heat and voltage drop. The voltage system with smaller power requirement is configured with a smaller number of conductive columns to avoid resource waste.

[0075] The cross-sectional areas of the plurality of conductive columns on each conductive busbar layer can be the same or different, mainly depending on the specific power supply requirements of the server. In actual production and application, the size, distribution position, material, shape, length, etc. of the plurality of conductive columns on each conductive busbar layer are designed according to the actual power supply requirements.

[0076] The overlapping and interpenetrating vertical power supply busbar provided by the embodiment establishes multiple vertical power supply paths with extremely short paths between the power supply panel 7 and the server mainboard 6, greatly shortens the power transmission distance, and reduces the line impedance and power loss. At the same time, the multiple layers of conductive busbar layers are overlapped and interpenetrated in the vertical direction, realizing the integrated layout of multi-voltage system large-current power supply in limited vertical space, improving the space utilization, and simplifying the structural complexity of the power supply system.

[0077] Embodiment two

[0078] The overlapping and interpenetrating vertical power supply busbar provided by the embodiment establishes multiple vertical power supply paths with extremely short paths between the power supply panel 7 and the server mainboard 6, greatly shortens the power transmission distance, and reduces the line impedance and power loss. At the same time, the multiple layers of conductive busbar layers are overlapped and interpenetrated in the vertical direction, realizing the integrated layout of multi-voltage system large-current power supply in limited vertical space, improving the space utilization, and simplifying the structural complexity of the power supply system.

[0079] Specifically, the overlapping and interpenetrating vertical power supply busbar includes a first conductive busbar layer 1, a second conductive busbar layer 2 and a third conductive busbar layer 3 arranged in sequence from bottom to top. Among them, the cooling plate 5 is arranged between the first conductive busbar layer 1 and the second conductive busbar layer 2, such as Figure 1 An insulating layer 4 is arranged between the cooling plate 5 and the conductive busbar layer to ensure electrical isolation between the cooling plate 5 and the conductive busbar layer.

[0080] The cooling plate 5 is provided with a clearance hole 51 corresponding to the position of each conductive column for the conductive column to pass through. The inner diameter of the clearance hole 51 is greater than the outer diameter of the conductive column passing through, so that the conductive column can pass through the cooling plate 5 without obstacles. The material of the cooling plate 5 is preferably a metal material with good heat conduction performance, such as aluminum or copper, to improve the heat conduction efficiency.

[0081] The cooling plate 5 can be a air-cooled heat sink or a liquid-cooled heat sink. The cooling plate 5 is provided with a flow uniformity grid 52 allowing the cooling medium (liquid / gas) to flow, and the cooling medium flows in the channel formed by the flow uniformity grid 52 to take away heat, such as Figure 8 The flow uniformity grid 52 ensures that the cooling medium can fully exchange heat with each area of the cooling plate 5, thereby uniformly and efficiently taking away the heat generated by each layer of conductive busbar layer. In specific applications, the specific shape and direction of the flow uniformity grid 52 provided on the cooling plate 5 can be designed according to the application requirements, and the design goal is to avoid the problem of heat dissipation dead angle or local overheating caused by uneven local flow rate of the cooling medium as much as possible.

[0082] The cooling plate 5 is arranged between the conductive busbar layers in the embodiment, which can dissipate heat from the heat source at close range and high efficiency, timely take away the heat generated by the busbar layer during work, and effectively suppress the temperature rise of the busbar. Since the conductive busbar layer will generate significant heat when transmitting large current, the accumulation of heat will cause the temperature of the busbar to rise, and then the resistivity of the busbar material will increase, and the conductive resistance will increase. Therefore, by effectively suppressing the temperature rise of the busbar, the resistivity of the busbar material can be reduced, the conductive resistance and power loss can be further reduced, and the power supply efficiency can be improved. At the same time, timely heat dissipation can also prevent the busbar from overheating and affecting the structural stability and service life.

[0083] Embodiment three

[0084] The embodiment provides a power supply method realized by the overlapped and inserted vertical power supply busbar of the embodiment one or the embodiment two, comprising:

[0085] The power supply panel 7 is arranged directly below the server mainboard 6, so that the power supply end of the power supply panel 7 is opposite to the power receiving end of the server mainboard 6 in the vertical direction. The power supply panel 7 and the server mainboard 6 are arranged back to back, that is, the power supply end of the power supply panel 7 is arranged upward, and the power receiving end of the server mainboard 6 is arranged downward, and a mounting gap is formed between the two. The power receiving end corresponding to each power supply voltage system on the server mainboard 6 is a through hole structure, so that the conductive column is inserted and spot welded to realize electrical connection.

[0086] The assembled overlapped and inserted vertical power supply busbar is arranged in the mounting gap between the power supply panel 7 and the server mainboard 6, and the conductive columns of each layer of the conductive busbar layer pass through the corresponding layer of the avoiding through hole. The electrical energy of the corresponding power supply voltage system of each layer of the conductive busbar layer is transmitted to the corresponding power receiving end on the server mainboard 6 through the respective conductive column. The power supply panel 7 and the server mainboard 6 are arranged back to back, and the overlapped and inserted vertical power supply busbar is arranged between the two, and the conductive columns of each layer of the conductive busbar layer are connected to the corresponding power supply end and power receiving end in the vertical direction, thereby forming a vertical power supply path.

[0087] Since the straight-line distance between the power supply end and the power receiving end is the shortest path of electrical energy transmission, the physical length of the vertical power supply path is basically equal to the gap distance between the power supply panel 7 and the server mainboard 6, so that the line impedance and power loss are reduced to the theoretical minimum value, and the power supply loss and cost are reduced. At the same time, the back-to-back arrangement makes the power supply panel 7 and the server mainboard 6 support each other in the mechanical structure, thereby improving the overall structural strength and shock resistance.

[0088] In practical applications, the server motherboard 6 usually needs multiple different power supply voltage systems, such as 5V, 3.3V, 2.5V, 1V, 0.5V, etc. The number of conductive busbar layers of the overlapped and interpenetrated vertical power supply busbar provided in the present application can be flexibly set according to the number of power supply voltage systems actually required. The number and distribution position of the conductive columns of each conductive busbar layer are determined by the power and power supply position requirements of the power supply voltage system corresponding to the conductive busbar layer. Through the above setting, the overlapped and interpenetrated vertical power supply busbar of the present application can flexibly adapt to the diversified power supply requirements of different server motherboards 6, and realize the integration and high-efficiency power supply of multiple voltage systems with large current in limited vertical space.

[0089] The technical features of the above embodiments can be combined in any manner (as long as the combination of the technical features does not contradict). In order to make the description concise, not all possible combinations of the technical features in the above embodiments are described. The embodiments not explicitly described are also considered to be within the scope of the present disclosure.

[0090] The present application is described in detail above through general description and specific embodiments. It should be understood that, based on the technical concept of the present application, some conventional adjustments or further innovations can be made to these specific embodiments; however, as long as these conventional adjustments or further innovations do not deviate from the technical concept of the present application, the technical solutions obtained by these conventional adjustments or further innovations also fall within the protection scope of the claims of the present application.

Claims

1. An overlapping and interlocking vertical power supply busbar, characterized in that, It includes multiple conductive busbar layers, each of which is stacked vertically and corresponds to a power supply voltage system; an insulating layer is provided between any two adjacent conductive busbar layers. Each conductive busbar layer is provided with a plurality of conductive posts protruding in the vertical direction. The plurality of conductive posts include one or more upper protruding conductive posts and one or more lower protruding conductive posts. The lower protruding conductive posts on each conductive busbar layer are used to electrically connect with the power supply terminal on the corresponding power supply board, and the upper protruding conductive posts on each conductive busbar layer are used to electrically connect with the power receiving terminal on the corresponding server motherboard. Each of the conductive busbar layers has a clearance through hole that allows conductive posts from other conductive busbar layers to pass through. The inner diameter of the clearance through hole is larger than the outer diameter of the conductive post that passes through, so that the conductive posts of each conductive busbar layer can pass through the other conductive busbar layers without contacting each other.

2. The overlapping and interlaced vertical power supply busbar according to claim 1, characterized in that, It also includes one or more cooling plates, the cooling plates being disposed between any two adjacent conductive busbar layers, and the insulating layer being disposed between the cooling plates and the conductive busbar layers; the cooling plates are provided with clearance holes at the positions corresponding to each of the conductive posts for the conductive posts to pass through.

3. The overlapping and interlacing vertical power supply busbar according to claim 2, characterized in that, The insulating layer has through holes at positions corresponding to each of the conductive pillars and the clearance through holes, allowing the conductive pillars to pass through.

4. The overlapping and interlaced vertical power supply busbar according to claim 1, characterized in that, The projected area of ​​each conductive busbar layer along the vertical direction matches the area of ​​the server motherboard and the power supply board.

5. The overlapping and interlacing vertical power supply busbar according to claim 1, characterized in that, There is an insulating gap between the inner wall of the bypass through hole and the outer wall of the conductive post through which it passes, and the insulating gap is filled with an insulating medium or is an air gap.

6. The overlapping and interlacing vertical power supply busbar according to claim 2, characterized in that, The cooling plate is either an air-cooled heat sink or a liquid-cooled heat sink, and the cooling plate is provided with a flow equalization grid that allows the cooling medium to flow.

7. The overlapping and interlaced vertical power supply busbar according to claim 1, characterized in that, The conductive posts on each conductive busbar layer are arranged in an array. The number and distribution of the conductive posts on each conductive busbar layer are determined by the power and power supply location requirements of the corresponding power supply voltage system. The conductive pillar and the conductive busbar layer are either integrally formed or separately connected.

8. A power supply method based on the overlapping and interlacing vertical power supply busbar as described in any one of claims 1 to 7, characterized in that, include: The power supply board is positioned directly below the server motherboard, with the power supply terminal of the power supply board and the power receiving terminal of the server motherboard facing each other in the vertical direction. The overlapping and interlaced vertical power supply busbar is provided, which includes multiple layers of the conductive busbar layers. Each layer of the conductive busbar layer corresponds to a different power supply voltage system. An insulating layer is provided between two adjacent conductive busbar layers. Each layer of the conductive busbar layer is provided with an upper protruding conductive post and a lower protruding conductive post protruding in the vertical direction. Each layer of the conductive busbar layer is provided with a clearance through hole for the conductive posts of the other layers of the conductive busbar layer to pass through. The overlapping and interlocking vertical power supply busbar is arranged between the power supply board and the server motherboard, so that the conductive posts of each layer of the conductive busbar pass through the clearance through holes of the corresponding layer, and the power supply voltage system of each layer of the conductive busbar is transmitted to the corresponding power receiving terminal on the server motherboard.

9. The power supply method according to claim 8, characterized in that, The power supply board and the server motherboard are arranged back to back. The overlapping and interlocking vertical power supply busbars are sandwiched between the power supply board and the server motherboard. The conductive posts of each layer of the conductive busbars are connected to the corresponding power supply end and the power receiving end in the vertical direction to form a vertical power supply path.

10. The power supply method according to claim 8, characterized in that, It also includes providing a cooling plate between two adjacent conductive busbar layers or on the outermost side of the conductive busbar layer, through which the conductive busbar layer dissipates heat.

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