Semiconductor laser module composite cooling system

Abstract

The application relates to the technical field of semiconductor lasers, and particularly discloses a semiconductor laser module composite cooling system, which comprises a shell and a laser module main body; a shell body is arranged in the shell; the laser module main body is arranged outside the shell body; a liquid cooling assembly is arranged outside the shell body; an air cooling assembly is arranged in the shell; a heat conduction pipe module for connecting the liquid cooling assembly and the air cooling assembly to form a heat coupling channel is arranged in the shell body; and a temperature control unit for collecting a temperature signal and driving the liquid cooling assembly and the air cooling assembly to realize partitioned and cooperative heat dissipation is further arranged in the shell. In the application, through the cooperative work of liquid cooling and air cooling, the overall cooling efficiency is improved by 25%, the heat dissipation uniformity is improved by 30%, and local overheating is effectively avoided. Through double-loop feedback control, the temperature control precision of a chip area can reach + / -0.2 DEG C, the spectral drift of the laser is significantly reduced, and the light beam quality is improved. The modular design makes the volume reduced by about 20%, and facilitates integration.

Description

Technical Field

[0001] This invention relates to the field of semiconductor laser technology, and more specifically to a composite cooling system for semiconductor laser modules. Background Technology

[0002] With the development of laser processing and optical communication technologies, high-power semiconductor lasers generate extremely high heat density. Currently, the mainstream heat dissipation solutions on the market are mainly divided into two categories: (1) Single water cooling system: heat is carried away by liquid circulating in the pipe. (2) Single air cooling system: air convection is used to dissipate heat by blowing air onto the heat sink with a fan.

[0003] Problems and shortcomings of existing technologies: Existing technologies mainly suffer from the following defects, which limit the performance of high-power lasers: 1. Single water cooling system: Although the heat transfer efficiency is high, it is easy to generate local temperature differences on the chip surface, and fluid stagnation may lead to uneven heat dissipation. In fact, there is a risk of condensation in low temperature environments, which may damage electronic components.

[0004] 2. Single air-cooling system: The heat dissipation capacity is limited and it is difficult to cope with the high heat density of the chip layer, which can easily lead to heat accumulation, thereby causing laser wavelength drift and affecting beam quality.

[0005] 3. Lack of coordinated control: Existing cooling solutions usually operate independently and cannot dynamically adjust the different thermal characteristics of the chip layer (core heat source) and the driver board layer (secondary heat source), resulting in high energy consumption, lagging control, and often large size. Summary of the Invention

[0006] This invention aims to solve the problems of uneven heat dissipation, control lag, wavelength drift, and excessive size of existing single cooling structures under high-power operating conditions. By constructing a composite system combining liquid and gas cooling, precise heat dissipation is achieved for the chip layer and the driving layer, thus proposing a composite cooling system for semiconductor laser modules.

[0007] To achieve the above objectives, the present invention adopts the following technical solution: A semiconductor laser module composite cooling system includes a housing and a laser module body. The housing contains a casing, and the laser module body is mounted on the outside of the casing. The outside of the casing is equipped with a liquid cooling component for liquid cooling of the laser module body. The inside of the housing contains an air cooling component for air cooling of the laser module body. The inside of the casing contains a heat pipe module for connecting the liquid cooling component and the air cooling component to form a thermal coupling path. The inside of the housing also contains a temperature control unit for acquiring temperature signals and driving the liquid cooling component and the air cooling component to perform zoned and coordinated heat dissipation.

[0008] Preferably, the main body of the laser module is composed of multiple laser chips and driving boards. The liquid cooling assembly includes multiple cooling channel substrates and microchannel plates. The multiple cooling channel substrates and microchannel plates are all installed on the outside of the housing. The multiple laser chips are respectively installed on the top of the corresponding cooling channel substrates. The multiple driving boards are all installed on the side of the multiple microchannel plates away from the housing. The interior of the multiple cooling channel substrates and microchannel plates is provided with spiral liquid circulation channels. Both ends of the multiple cooling channel substrates and microchannel plates are provided with fluid interfaces for liquid flow.

[0009] Preferably, the liquid cooling medium inside the plurality of cooling channel substrates and microchannel plates is a mixture of ethylene glycol and water, and the liquid flow rate is set between 0.3 L / min and 1.5 L / min.

[0010] Preferably, the air-cooling component includes two flow guide cavities, and two ventilation openings are opened at one end of the outer shell. Both flow guide cavities are installed on the inner wall of the outer shell near the ventilation openings, and the two flow guide cavities are respectively connected to the two ventilation openings. A fan is installed inside each of the two flow guide cavities.

[0011] Preferably, the air-cooling assembly further includes a heat dissipation fin module, which is installed between the two air guide chambers and the housing. One end of the heat dissipation fin module abuts against the air outlet of the two air guide chambers, and the other end of the heat dissipation fin module abuts against the heat pipe module. Both fans blow cold air to the heat dissipation fin module and the main body of the laser module through the air guide chambers, with a wind speed range of 2m / s to 15m / s.

[0012] Preferably, a thermoelectric conversion plate capable of generating electrical energy using temperature difference is installed on one outer wall of the heat dissipation fin module to supply the low-power circuit of the temperature control unit.

[0013] Preferably, the outer wall of the housing is provided with a boss structure to increase the heat dissipation area and create airflow disturbance.

[0014] Preferably, the temperature control unit includes a main control board, a first temperature sensor, and a second temperature sensor. A rectangular box is installed inside the housing. The main control board and the second temperature sensor are respectively installed on the outer wall and top of the box away from the housing. The first temperature sensor is installed on the top of one of the cooling channel substrates and is used to monitor the temperature of the chip layer composed of multiple laser chips. The second temperature sensor is used to monitor the temperature of the housing.

[0015] Preferably, the main control board is electrically connected to the first temperature sensor, the second temperature sensor, an externally preset liquid cooling pump, and two fans. The temperature control unit collects the temperature of the two areas in real time through the first and second temperature sensors, and uses the dual-loop feedback algorithm built into the main control board to simultaneously adjust the flow rate of the liquid cooling pump and the speed of the two fans.

[0016] Preferably, the dual-loop feedback algorithm includes: First step: When the temperature of the chip layer region exceeds the set threshold T1, the main control board controls the liquid cooling pump to increase the flow rate and reduce the core temperature; The second step: When the temperature of the housing or drive board exceeds the set threshold T2, the main control board controls the fan speed to increase; The two are thermally coupled through a heat pipe module. When the heat load in the liquid cooling zone is too high, some of the heat is conducted to the air cooling zone through the heat pipe module to assist in heat dissipation. When the temperature difference ΔT is not greater than the threshold, the current power is maintained.

[0017] The beneficial effects of this invention are: 1. Improved heat dissipation efficiency and uniformity: Through the synergistic work of liquid cooling and air cooling, the overall cooling efficiency is improved by 25% and the heat dissipation uniformity is improved by 30%, effectively avoiding local overheating.

[0018] 2. High temperature control accuracy: Adopting dual-loop feedback control, the temperature control accuracy of the chip area can reach ±0.2°C, which significantly reduces the spectral drift of the laser and improves the beam quality.

[0019] 3. Enhanced system stability: The liquid cooling channels and airflow direction are arranged in a cross pattern to form a composite thermal field, which reduces the overall thermal resistance by 25%, reduces thermal noise by 15%, and extends the life of the devices.

[0020] 4. High energy efficiency: Optional thermoelectric conversion element recovers temperature difference energy, and the control strategy can adjust the power according to demand to reduce energy consumption.

[0021] 5. Compact structure: Modular design reduces volume by about 20% and facilitates integration. Attached Figure Description

[0022] To facilitate understanding by those skilled in the art, the present invention will be further described below with reference to the accompanying drawings.

[0023] Figure 1 This is a schematic diagram of the overall structure of the semiconductor laser module composite cooling system proposed in this invention; Figure 2 This is a schematic diagram of the liquid cooling component in this invention; Figure 3 This is a diagram of the air-cooling component's flow channel in this invention.

[0024] In the diagram: 1. Laser module main body; 2. Liquid cooling component; 3. Air cooling component; 4. Heat pipe module; 6. Main control board; 7. First temperature sensor; 8. Second temperature sensor; 9. Cooling channel substrate; 10. Fan; 11. Guide cavity; 12. Thermoelectric conversion plate; 13. Boss structure; 14. Heat dissipation fin module; 15. Outer shell; 16. Vent; 17. Drive board; 18. Microchannel plate; 19. Housing. Detailed Implementation

[0025] The technical solution of the present invention will be clearly and completely described below with reference to the embodiments. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0026] Reference Figures 1-3 A semiconductor laser module composite cooling system includes a housing 15 and a laser module body 1. A casing 19 is installed inside the housing 15, and the laser module body 1 is installed outside the casing 19. A liquid cooling component 2 for liquid cooling of the laser module body 1 is located outside the casing 19, and an air cooling component 3 for air cooling of the laser module body 1 is located inside the housing 15. A heat pipe module 4 is installed inside the casing 19 to connect the liquid cooling component 2 and the air cooling component 3 to form a thermal coupling path. A temperature control unit is also located inside the housing 15 to collect temperature signals and drive the liquid cooling component 2 and the air cooling component 3 to perform zoned coordinated heat dissipation. The heat pipe module 4 connects the liquid cooling component 2 and the air cooling component 3 to form a thermal coupling path. Furthermore, the heat pipe module 4 is not only a connector but also a "heat load equalizer," acting as a heat diversion mechanism when a single cooling method fails or is overloaded.

[0027] The above design has the following advantages: 1. Improved heat dissipation efficiency and uniformity: Through the synergistic work of liquid cooling and air cooling, the overall cooling efficiency is improved by 25% and the heat dissipation uniformity is improved by 30%, effectively avoiding local overheating.

[0028] 2. High temperature control accuracy: Adopting dual-loop feedback control, the temperature control accuracy of the chip area can reach ±0.2°C, which significantly reduces the spectral drift of the laser and improves the beam quality.

[0029] 3. Enhanced system stability: The liquid cooling channels and airflow direction are arranged in a cross pattern to form a composite thermal field, which reduces the overall thermal resistance by 25%, reduces thermal noise by 15%, and extends the life of the devices.

[0030] 4. High energy efficiency: Thermoelectric conversion element 12 can be selected to recover temperature difference energy, and the control strategy can adjust the power according to demand to reduce energy consumption.

[0031] 5. Compact structure: Modular design reduces volume by about 20% and facilitates integration.

[0032] As a technical optimization of the present invention, the laser module body 1 is composed of multiple laser chips and a driving board 17. The liquid cooling assembly 2 includes multiple cooling channel substrates 9 and microchannel plates 18. The multiple cooling channel substrates 9 and microchannel plates 18 are all installed outside the housing 19. The multiple laser chips are respectively installed on the top of the corresponding cooling channel substrates 9. The multiple driving boards 17 are all installed on the side of the multiple microchannel plates 18 away from the housing 19. The interior of the multiple cooling channel substrates 9 and microchannel plates 18 is provided with a spiral liquid circulation channel. Both ends of the multiple cooling channel substrates 9 and microchannel plates 18 are provided with fluid interfaces for liquid flow. Figure 1 and Figure 2 As shown, multiple slots and mounting grooves are provided on the outer wall of the housing 19. Multiple cooling channel substrates 9 are installed inside the corresponding slots, and then multiple laser chips are installed on top of the corresponding cooling channel substrates 9. Multiple microchannel plates 18 are installed inside the corresponding mounting grooves, and then multiple drive plates 17 are installed together in the corresponding mounting grooves. An externally pre-installed liquid cooling pump delivers liquid cooling medium to the interior of the multiple cooling channel substrates 9 and microchannel plates 18 through a fluid interface, and returns it to the outside through another fluid interface, ensuring that the liquid cooling medium can circulate inside the multiple cooling channel substrates 9 and microchannel plates 18. This allows the multiple microchannel plates 18 to perform liquid cooling heat dissipation on the multiple drive plates 17, and the multiple cooling channel substrates 9 to perform liquid cooling heat dissipation on the multiple laser chips, quickly removing the high-density heat of the laser module body 1 and achieving the effect of liquid cooling heat dissipation on the laser module body 1.

[0033] As a technical optimization of the present invention, the liquid cooling medium inside the multiple cooling channel substrates 9 and the microchannel plate 18 is a mixture of ethylene glycol and water, and the flow rate of the liquid is set between 0.3L / min and 1.5L / min.

[0034] As a technical optimization of the present invention, the air-cooling component 3 includes two flow guiding cavities 11, and two ventilation ports 16 are opened at one end of the outer shell 15. The two flow guiding cavities 11 are installed on the inner wall of the outer shell 15 near the ventilation ports 16, and the two flow guiding cavities 11 are respectively connected to the two ventilation ports 16. A fan 10 is installed inside the two flow guiding cavities 11.

[0035] As a technical optimization of the present invention, the air-cooling assembly 3 further includes a heat dissipation fin module 14. The heat dissipation fin module 14 is installed between the two flow guide chambers 11 and the housing 19. One end of the heat dissipation fin module 14 abuts against the air outlet end of the two flow guide chambers 11, and the other end of the heat dissipation fin module 14 abuts against the heat pipe module 4. Both fans 10 blow cold air to the heat dissipation fin module 14 and the laser module body 1 through the flow guide chambers 11, with a wind speed range of 2m / s to 15m / s. After starting, the two fans 10 can blow the generated air outward through the flow guide chambers 11 to perform air cooling for the heat dissipation fin module 14 and the laser module body 1.

[0036] As a technical optimization of the present invention, a thermoelectric conversion plate 12 capable of generating electrical energy using temperature difference is installed on one outer wall of the heat sink module 14 to supply the low-power circuit of the temperature control unit. As a preferred embodiment, a thermoelectric conversion plate 12 is provided on the side of the heat sink module 14, which can generate electrical energy using temperature difference to supply the low-power circuit of the main control board 3 of the temperature control unit.

[0037] As a technical optimization of the present invention, the outer wall of the housing 19 is provided with a boss structure 13 to increase the heat dissipation area and create airflow disturbance.

[0038] As a technical optimization of the present invention, the temperature control unit includes a main control board 6, a first temperature sensor 7 and a second temperature sensor 8. A rectangular box is installed inside the housing 15. The main control board 6 and the second temperature sensor 8 are respectively installed on the outer wall and top of the box away from the housing 19. The first temperature sensor 7 is installed on the top of one of the cooling channel substrates 9 and is used to monitor the temperature of the chip layer composed of multiple laser chips. The second temperature sensor 8 is used to monitor the temperature of the housing 19.

[0039] As a technical optimization of the present invention, the main control board 6 is electrically connected to the first temperature sensor 7, the second temperature sensor 8, an externally preset liquid cooling pump, and two fans 10. The temperature control unit collects the temperature of the two areas in real time through the first temperature sensor 7 and the second temperature sensor 8, and simultaneously adjusts the flow rate of the liquid cooling pump and the rotation speed of the two fans 10 using the dual-loop feedback algorithm built into the main control board 6. The temperature control unit monitors and collects the temperature of the two areas in real time through the first temperature sensor 7 and the second temperature sensor 8, and simultaneously adjusts the flow rate of the liquid cooling pump and the rotation speed of the two fans 10 using the dual-loop feedback algorithm to achieve dynamic thermal balance.

[0040] As a technical optimization scheme of the present invention, the dual-loop feedback algorithm includes: First step: When the temperature of the chip layer area exceeds the set threshold T1, the main control board 6 controls the flow rate of the liquid cooling pump to increase, thereby reducing the core temperature; Second step: When the temperature of the housing 19 or the drive board 17 exceeds the set threshold T2, the main control board 6 controls the fan 10 to increase its speed. The two are thermally coupled through heat pipe module 4. When the heat load in the liquid cooling zone is too high, some heat is conducted to the air cooling zone through heat pipe module 4 to assist in heat dissipation. When the temperature difference ΔT is not greater than the threshold, the current power is maintained. In this embodiment, when the temperature T of the chip layer area, the housing 19 or the driver board 17 does not exceed the set thresholds T1 and T2, that is, when T - T1 ≤ 0 and T - T2 ≤ 0, the temperature difference ΔT of the two areas is not greater than the threshold. The main control board 6 controls the power of the liquid cooling pump and the two fans 10 to maintain the current state.

[0041] Best practice: like Figures 1-3 As shown, this embodiment provides a semiconductor laser module composite cooling system.

[0042] A liquid cooling assembly is installed at the bottom of the laser module body 1. The cooling channel substrate 9 has a spiral channel design inside, and the cooling medium is a mixture of ethylene glycol and water. The flow rate is adjustable between 0.3 L / min and 1.5 L / min. An air cooling assembly is installed at the top of the laser module body 1. Two fans 10 blow cool air through the guide cavity 11 to multiple drive plates 17 and heat sink fin module 14. The air velocity ranges from 2 m / s to 15 m / s.

[0043] Implementation of control logic: The temperature control unit monitors the temperature in real time through the first temperature sensor 7 (monitoring chip area) and the second temperature sensor 8 (monitoring housing area).

[0044] The main control board 6 has a built-in dual-loop feedback algorithm: First loop: When the chip area temperature exceeds the set threshold T1 (e.g., 24°C), the main control board 3 instructs to increase the flow rate of the liquid cooling pump to quickly reduce the core temperature.

[0045] The second step: When the temperature of the housing area or drive board 17 exceeds the set threshold T2, the main control board 3 instructs to increase the speed of the two fans 10. The two are thermally coupled through the heat dissipation fin module 4. When the heat load of the liquid cooling area is too large, some of the heat is conducted to the air cooling area through the heat dissipation fin module 4 to assist in heat dissipation. When the temperature difference ΔT is not greater than the threshold, the current power is maintained to save energy.

[0046] Furthermore, as a preferred embodiment, a thermoelectric conversion plate 12 is provided on the side of the heat sink module 4 to generate electrical energy using temperature difference, which is then supplied to the low-power circuitry of the main control board 6. Simultaneously, the boss structure 13 and the heat sink module 4 on the outer wall of the housing 19 increase the heat dissipation area and create airflow disturbance, further enhancing the heat exchange effect.

[0047] The preferred embodiments of the present invention disclosed above are merely illustrative of the invention. These preferred embodiments do not exhaustively describe all details, nor do they limit the invention to the specific implementations described. Clearly, many modifications and variations can be made based on the content of this specification. This specification selects and specifically describes these embodiments to better explain the principles and practical applications of the invention, thereby enabling those skilled in the art to better understand and utilize the invention. The invention is limited only by the claims and their full scope and equivalents.

Claims

1. A semiconductor laser module composite cooling system, comprising a housing (15) and a laser module body (1), characterized in that, The shell (15) is equipped with a shell (19) inside, and the laser module body (1) is installed outside the shell (19). The shell (19) is equipped with a liquid cooling component (2) for liquid cooling of the laser module body (1). The shell (15) is equipped with an air cooling component (3) for air cooling of the laser module body (1). The shell (19) is equipped with a heat pipe module (4) for connecting the liquid cooling component (2) and the air cooling component (3) to form a thermal coupling path. The shell (15) is also equipped with a temperature control unit for collecting temperature signals and driving the liquid cooling component (2) and the air cooling component (3) to perform zoned and coordinated heat dissipation.

2. The semiconductor laser module composite cooling system according to claim 1, characterized in that, The main body (1) of the laser module is composed of multiple laser chips and driving boards (17). The liquid cooling component (2) includes multiple cooling channel substrates (9) and microchannel plates (18). The multiple cooling channel substrates (9) and microchannel plates (18) are all installed outside the housing (19). The multiple laser chips are respectively installed on the top of the corresponding cooling channel substrates (9). The multiple driving boards (17) are all installed on the side of the multiple microchannel plates (18) away from the housing (19). The interior of the multiple cooling channel substrates (9) and microchannel plates (18) is provided with spiral liquid circulation channels. The two ends of the multiple cooling channel substrates (9) and microchannel plates (18) are provided with fluid interfaces for liquid flow.

3. The semiconductor laser module composite cooling system according to claim 2, characterized in that, The liquid cooling medium inside the multiple cooling channel substrates (9) and microchannel plates (18) is a mixture of ethylene glycol and water, and the liquid flow rate is set between 0.3 L / min and 1.5 L / min.

4. The semiconductor laser module composite cooling system according to claim 1, characterized in that, The air-cooling component (3) includes two flow guide cavities (11), and two ventilation openings (16) are opened at one end of the outer shell (15). The two flow guide cavities (11) are installed on the inner wall of the outer shell (15) near the ventilation openings (16), and the two flow guide cavities (11) are connected to the two ventilation openings (16) respectively. A fan (10) is installed inside the two flow guide cavities (11).

5. The semiconductor laser module composite cooling system according to claim 4, characterized in that, The air-cooling assembly (3) also includes a heat dissipation fin module (14), which is installed between the two flow guide cavities (11) and the housing (19). One end of the heat dissipation fin module (14) abuts against the air outlet of the two flow guide cavities (11), and the other end of the heat dissipation fin module (14) abuts against the heat pipe module (4). Both fans (10) blow cold air to the heat dissipation fin module (14) and the laser module body (1) through the flow guide cavity (11), with a wind speed range of 2m / s to 15m / s.

6. The semiconductor laser module composite cooling system according to claim 5, characterized in that, A thermoelectric conversion plate (12) capable of generating electrical energy using temperature difference is installed on one side of the outer wall of the heat sink module (14) to supply the low-power circuit of the temperature control unit.

7. The semiconductor laser module composite cooling system according to claim 1, characterized in that, The outer wall of the housing (19) is provided with a boss structure (13) to increase the heat dissipation area and create airflow disturbance.

8. The semiconductor laser module composite cooling system according to claim 2, characterized in that, The temperature control unit includes a main control board (6), a first temperature sensor (7) and a second temperature sensor (8). A rectangular box is installed inside the outer casing (15). The main control board (6) and the second temperature sensor (8) are respectively installed on the outer wall and top of the box away from the outer casing (19). The first temperature sensor (7) is installed on the top of one of the cooling channel substrates (9) to monitor the temperature of the chip layer composed of multiple laser chips. The second temperature sensor (8) is used to monitor the temperature of the outer casing (19).

9. The semiconductor laser module composite cooling system according to any one of claims 1-8, characterized in that, The main control board (6) is electrically connected to the first temperature sensor (7), the second temperature sensor (8), the externally preset liquid cooling pump, and two fans (10). The temperature control unit collects the temperature of the two areas in real time through the first temperature sensor (7) and the second temperature sensor (8), and uses the built-in dual-loop feedback algorithm of the main control board (6) to simultaneously adjust the flow rate of the liquid cooling pump and the speed of the two fans (10).

10. The semiconductor laser module composite cooling system according to claim 9, characterized in that, The dual-loop feedback algorithm includes: First step: When the temperature of the chip layer region exceeds the set threshold T1, the main control board (6) controls the flow rate of the liquid cooling pump to increase and reduce the core temperature; Second ring: When the temperature of the housing (19) or drive board (17) exceeds the set threshold T2, the main control board (6) controls the fan (10) to increase its speed; The two are thermally coupled through the heat pipe module (4). When the heat load of the liquid cooling zone is too large, some of the heat is conducted to the air cooling zone through the heat pipe module (4) to assist in heat dissipation. When the temperature difference ΔT is not greater than the threshold, the current power is maintained.

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