A primary and secondary fusion ring network box, a state monitoring system and a state monitoring method

Abstract

The application relates to the technical field of power equipment, in particular to a primary-secondary fusion ring network box, a state monitoring system and a state monitoring method, which comprise a processing assembly and a sensor group, the sensor group comprises a vibration sensor, an ultrasonic sensor, an air pressure sensor and a humidity sensor; the vibration sensor is attached to the surface of an external rigid stress shell of a mechanical operating mechanism; the ultrasonic sensor is clamped on the outside of a grounding shielding layer of a high-voltage cable terminal through a clamp or a magnetic suction base; the air pressure sensor and the humidity sensor are both suspended and arranged in the interior of the box body; and the processing assembly is accommodated in a secondary instrument low-pressure cabin on the side or the top of the box body. The application has the effect of improving the power supply reliability of the ring network box.

Description

Technical Field

[0001] This application relates to the field of power equipment technology, and in particular to a primary and secondary integrated ring main unit, a condition monitoring system, and a condition monitoring method. Background Technology

[0002] The integrated primary and secondary ring main unit (IMU) is a power distribution device that deeply integrates primary equipment (such as load switches, circuit breakers, and current transformers) with secondary equipment (such as protection and control devices and communication modules). It is widely used in ring network power supply systems of urban power distribution networks. Compared with traditional split-type ring main units, the integrated IMU has advantages such as small size, simple wiring, and convenient installation.

[0003] In existing technologies, the operating mechanisms of primary switchgear within ring main units (such as opening and closing springs and transmission linkages) undergo mechanical fatigue, wear, or corrosion after thousands of opening and closing operations, leading to unreliable opening and closing actions, or even failure to operate or malfunctions. Simultaneously, cable joints within the unit may experience partial discharge due to poor contact or insulation aging during long-term operation, ultimately resulting in insulation breakdown and short-circuit accidents. These potential defects often lack obvious signs before failures occur, making them difficult to detect through routine periodic inspections. They can only be addressed through reactive maintenance, leading to decreased power supply reliability and economic losses.

[0004] Therefore, how to solve the problem of declining power supply reliability of ring main units has become an urgent problem to be solved in this field. Summary of the Invention

[0005] To address the issue of decreased power supply reliability in ring main units, this application provides a primary and secondary integrated ring main unit, a condition monitoring system, and a condition monitoring method.

[0006] Firstly, this application provides a primary and secondary integrated ring network box, which adopts the following technical solution: A primary and secondary fusion ring network box with status monitoring function includes a box body. A primary switchgear and a secondary fusion terminal are installed inside the box body. The primary switchgear includes a mechanical operating mechanism for opening and closing the circuit and a high-voltage cable terminal for connecting external incoming and outgoing cables. The box body is characterized by the following features: a processing component and a sensor group are physically suspended or embedded inside the box body. The sensor group includes a vibration sensor, an ultrasonic sensor, a barometric pressure sensor, and a humidity sensor. The vibration sensor is attached to the surface of the rigid external housing of the mechanical operating mechanism. The ultrasonic sensor is clamped to the outside of the grounding shield layer of the high-voltage cable terminal via a clamp or magnetic base. The barometric pressure sensor and the humidity sensor are both suspended inside the box body. The processing component is housed in a low-pressure compartment of the secondary instrumentation on the side or top of the box body.

[0007] By adopting the above technical solution, multi-source heterogeneous sensors are scientifically distributed at specific physical locations in the primary equipment. Without compromising the original insulation performance and mechanical strength of the primary equipment, early latent mechanical fatigue and electrical micro-discharge characteristics are captured in a targeted manner. The processing component is isolated in a low-pressure chamber. The processing component processes the parameters of each sensor. When the primary equipment experiences fatigue, wear, or corrosion during long-term operation, or when cable joints age or experience poor contact, the parameters received by the sensor group will also change. After processing these parameters, the processing component can send alarm information to the personnel, indicating a defect in the primary equipment. This prevents delays in addressing the issue until an accident occurs, effectively improving the reliability of the ring main unit's power supply. Preferably, the vibration sensor is disposed in the structural rigid area of ​​the operating mechanism housing, and the physical spatial distance between the installation center coordinates of the vibration sensor and the main drive axis of the mechanical operating mechanism is limited to a preset distance radius.

[0008] By adopting the above technical solution, the vibration sensor is set in the rigid area of ​​the structure and installed away from the thin-walled and easily deformable area. This can eliminate the interference of the resonant frequency of the housing itself. Locking around the main drive shaft can ensure that the high-frequency effective mechanical waves such as the spring impact force and cam impact force during the opening and closing of the brake reach the probe with the minimum attenuation rate, which greatly improves the signal-to-noise ratio of mechanical condition monitoring.

[0009] Preferably, a thermoelectric cooler is disposed inside the housing, with the cold end of the thermoelectric cooler facing the inside of the housing and the hot end facing away from the inside of the housing; the cold end of the thermoelectric cooler is provided with condensation guide fins; a heat equalization plate is pressed against the hot end of the thermoelectric cooler, and a heat conduction pipe is connected to the heat equalization plate. The heat conduction pipe penetrates the housing and is tightly bound to the housing wall by a gasket. The end of the high heat conductivity pipe assembly extending to the outside of the housing has a heat dissipation fin; a guide pipe is disposed below the condensation guide fins, and a one-way drain valve is connected to the end of the guide pipe. The outlet end of the one-way drain valve is connected to an outlet pipe extending to the outside of the housing.

[0010] By adopting the above technical solution, the cold end of the semiconductor cooling chip actively condenses the moisture inside the box into liquid water, which is then discharged to the outside of the box through a one-way drain valve and an outlet pipe connected to the one-way drain valve. The hot end of the semiconductor cooling chip conducts heat to the outside of the box through a heat pipe, and heat dissipation is accelerated by a heat sink. In addition, a gasket is installed on the heat pipe to fit tightly with the box. While ensuring the box is sealed, heat is dissipated from the box, eliminating condensation inside the box caused by environmental changes and cutting off the external factors that cause surface discharge of high-voltage cable terminals.

[0011] Preferably, an auxiliary maintenance lighting strip is adhered to the inner wall of the maintenance door of the enclosure, and the auxiliary maintenance lighting strip is controlled to be switched on and off by a door status switch; the mechanical operating mechanism and the surface of the high-voltage cable terminal are both affixed with identification patches containing a unique equipment ledger and anti-counterfeiting three-dimensional data identification, and the identification patches are passive QR code labels or radio frequency identification patches.

[0012] By adopting the above technical solutions, the light strip that lights up as soon as the door is opened provides a safe visibility distance for emergency repairs at night or in dim environments; the digital identity tag provides an IoT anchor point for the digital inspection of equipment, and maintenance personnel can bind the physical entity on site to the cloud digital twin status and historical fault waveforms by scanning the QR code label or RFID patch, thereby improving operation and maintenance efficiency.

[0013] Secondly, this application provides a condition monitoring system, which adopts the following technical solution: A condition monitoring system includes a sensor module group, a signal conditioning module, and an edge computing module. The sensor group includes a vibration sensing module, an ultrasonic sensing module, a barometric pressure sensing module, and a humidity sensing module. The signal conditioning module is electrically connected to the signal output terminals of the vibration sensing module and the ultrasonic sensing module, respectively, and is used to perform filtering, primary amplification, and analog-to-digital conversion conditioning on the captured raw analog electrical signals. The edge computing module is electrically coupled to the output terminal of the signal conditioning module, the high and low level output terminals of the barometric pressure sensing module, and the output terminal of the humidity sensing module, respectively. The edge computing module has a built-in condition assessment algorithm for receiving the conditioned data and calculating and outputting device health status signals and early warning control signals.

[0014] By adopting the above technical solution, the signal conditioning module preprocesses the signals received by the vibration sensing module and the ultrasonic sensing module, and the edge computing module calculates the signals output by the signal conditioning module, the barometric pressure sensing module, and the humidity sensing module. The original high-frequency weak signals are no longer transmitted over long distances, but are instead subjected to hardware-level waveform trimming and digitization by the signal conditioning module locally, while the edge computing module performs complex matrix operations and graph analysis locally. This effectively reduces communication bandwidth pressure and achieves microsecond-level circuit breaker failure prediction and early warning.

[0015] Preferably, the signal conditioning module internally includes a vibration signal conditioning branch and an ultrasonic signal conditioning branch; the vibration signal conditioning branch includes an instrument preamplifier circuit, a wideband filter circuit, and a high-speed analog-to-digital converter chip connected in sequence; the ultrasonic signal conditioning branch includes a bandpass filter frequency band selection circuit, an envelope detector and rectifier circuit, and a voltage comparator connected in series, and the reference voltage pin of the voltage comparator is closed-loop electrically connected to the digital-to-analog converter output terminal of the edge computing module to achieve adaptive bias of the comparison threshold.

[0016] By adopting the above technical solution, different feature extraction circuits are designed for signals of different properties. In particular, for ultrasonic signals, bandpass filtering and envelope detection are performed on the acquired ultrasonic signals to extract partial discharge pulses. Combined with the comparison threshold of the edge computing module, the complex electromagnetic white noise interference on site can be effectively eliminated and the real partial discharge pulses can be accurately identified.

[0017] Preferably, it also includes an environmental drive execution circuit, wherein the control enable terminal of the environmental drive execution circuit is electrically connected to the pulse width modulation pin of the edge computing module, and its high power output side has a DC power supply terminal pair for driving external semiconductor devices and light-emitting devices.

[0018] By adopting the above technical solutions, the edge computing module is not only a data analysis hub, but also the core of closed-loop environmental control. Through PWM pulse width modulation technology, it can smoothly adjust the working power of the anti-condensation cooling chip in a low-loss manner, realizing the self-sensing, self-decision-making and self-execution of the micro-environment, without the need for additional expensive external industrial PLCs.

[0019] Thirdly, this application also provides a status monitoring method.

[0020] A status monitoring method includes the following steps: S1. Collect real-time signals through the sensor module group respectively, and extract the required parameters; S2. Calculate or draw a graph based on the extracted parameters; S3. Compare the calculated results or drawn graphs with the standard to determine the status of the enclosure and trigger an alarm.

[0021] By adopting the above technical solution, a complete software execution logic flow from perception and feature stripping to pattern recognition is provided, which transforms disordered physical observations into standardized numerical arrays and visualization maps, and realizes the normalization processing of multi-dimensional parameters.

[0022] Preferably, in step S2, the vibration sensing module needs to calculate the Mahalanobis distance between the current characteristic parameter and the reference characteristic parameter; the air pressure sensing module needs to calculate the pressure difference between the inside and outside of the box and the leakage index.

[0023] By adopting the above technical solutions, mechanical vibration signals involve multiple interrelated parameters such as peak width, energy, and frequency band. Traditional Euclidean distance cannot solve the covariance problem of multidimensional variables. Introducing the Mahalanobis distance algorithm can eliminate dimensional interference between multidimensional features and significantly improve the recognition rate of jamming and obstruction. The differential pressure leakage index algorithm can detect the aging and cracking failure of the cabinet sealing strip in advance through extremely weak natural breathing pressure difference without water injection or pressurization.

[0024] Preferably, in step S2, the ultrasonic sensing module needs to record the phase position and amplitude of each partial discharge pulse to construct a phase distribution statistical diagram.

[0025] By adopting the above technical solution and utilizing partial discharge phase-resolved mapping technology, a synchronous time mapping is established between the disordered and scattered acoustic partial discharge pulses and the 50Hz sinusoidal half-wave of the power frequency AC current. Different types of insulation defects are displayed differently on the map. Based on this phase sequence map, the system can not only alarm and inform of the occurrence of discharge, but also diagnose the specific type of discharge, thereby effectively guiding maintenance strategies.

[0026] In summary, this application includes at least one of the following beneficial technical effects: 1. By setting different sensors at specific locations inside the enclosure, the parameters of the primary equipment inside the enclosure are detected by the sensors. When the primary equipment ages or has defects, an alarm is triggered in time, making the aging of the components measurable and effectively improving the power supply reliability of the ring main unit. 2. A semiconductor cooling chip is installed inside the enclosure. The cold end of the semiconductor cooling chip condenses the moisture inside the enclosure into liquid water and drains it out. A one-way valve is used for drainage to prevent air from entering the enclosure. The hot end of the semiconductor cooling chip conducts heat out of the enclosure through a heat pipe. A gasket is installed outside the heat pipe to seal the gap between the heat pipe and the enclosure, ensuring a high level of protection for the enclosure. Attached Figure Description

[0027] Figure 1 This is a schematic diagram of the internal structure of a primary and secondary fusion ring network box according to this application; Figure 2 This is a schematic diagram of the semiconductor cooling chip section in the ring network box; Figure 3 This is a block diagram of a condition monitoring system according to this application; Figure 4 This is a flowchart of a state monitoring method according to this application.

[0028] Explanation of reference numerals in the attached figures: 1. Box body; 2. Primary switchgear; 21. Mechanical operating mechanism; 22. High-voltage cable termination; 3. Processing components; 4. Sensor group; 41. Vibration sensor; 42. Ultrasonic sensor; 43. Barometric pressure sensor; 44. Humidity sensor; 5. Semiconductor cooling chip; 6. Condensation guide fins; 7. Heat spreader plate; 8. Heat pipe; 9. Heat sink; 10. Guide pipe; 11. One-way drain valve; 12. Liquid outlet pipe; 13. Maintenance auxiliary lighting strip; 14. Identification patch. Detailed Implementation

[0029] The following is in conjunction with the appendix Figure 1-4 This application will be described in further detail. Example 1

[0030] This embodiment discloses a primary and secondary integrated ring network box.

[0031] Reference Figure 1 A primary and secondary integrated ring main unit includes a housing 1. The interior of the housing 1 is divided into a primary high-voltage chamber and a secondary low-voltage control chamber by a metal partition. The low-voltage control chamber is a separate, sealed compartment located above the housing 1. The primary high-voltage chamber is equipped with a mechanical operating mechanism 21 for opening and closing the circuit breaker and a high-voltage cable terminal 22 for connecting external incoming and outgoing cables. In this embodiment, the secondary low-voltage control chamber is located at the top of the housing 1, above the primary high-voltage chamber.

[0032] The vibration sensor 41 is fastened to the structural rigid area of ​​the outer housing of the operating mechanism, and the straight distance between the vibration sensor 41 and the internal main camshaft is about 50mm, and the housing should not be deformed by thin plates.

[0033] The ultrasonic sensor 42 is equipped with a neodymium iron boron strong magnet base at the bottom and is coated with acoustic coupling agent, and is directly magnetically adsorbed onto the surface of the black conductive rubber grounding shield layer on the outside of the high voltage cable terminal 22.

[0034] The barometric pressure sensor 43 and the humidity sensor 44 are suspended in the internal space of the enclosure 1, away from the heating busbar, using an insulating nylon bracket, for monitoring environmental base parameters.

[0035] All high-voltage interference sensitive components, such as the mainboard of processing component 3, are placed in the upper secondary low-pressure chamber, and the two are connected by shielded multi-core cables passing through a sealed granite head.

[0036] Reference Figure 2 The housing 1 is also equipped with a semiconductor cooling chip 5. The semiconductor cooling chip 5 is connected to the housing 1 through a heat exchange plate 7. The hot end of the semiconductor cooling chip 5 is connected to the heat exchange plate 7. Several heat conduction pipes 8 are connected to the heat exchange plate 7. The heat conduction pipes 8 pass through the housing 1 and are connected to the heat sink 9 outside the housing 1 to remove the heat from the hot end of the semiconductor cooling chip 5 and dissipate it through the heat sink 9. Thermal grease is coated between the semiconductor cooling chip 5 and the heat exchange plate 7.

[0037] A rubber gasket (not shown in the figure) is provided on the housing 1 where the heat pipe 8 penetrates, to seal the gap between the heat pipe 8 and the housing 1, ensuring a high protection level for the housing 1; the axial length of the rubber gasket is greater than or equal to the thickness of the housing 1, the outer diameter of the rubber gasket is slightly larger than the diameter of the opening on the housing 1, and the inner diameter of the rubber gasket is slightly smaller than the outer diameter of the heat pipe 8, so that the rubber gasket is firmly fitted on the outside of the heat pipe 8 and seals the gap between the heat pipe 8 and the housing 1.

[0038] The hot end of the semiconductor cooling chip 5 is provided with a condensation guide fin 6, which can be made of hydrophilic aluminum foil; a guide pipe 10 is provided below the condensation guide fin 6, and a one-way drain valve 11 is connected to the end of the guide pipe 10. The liquid outlet end of the one-way drain valve 11 is connected to a liquid outlet pipe 12 extending to the outside of the housing 1.

[0039] In this embodiment, a gasket is also provided at the position where the guide pipe 10 exits the housing 1. The gasket used here is different in size from the gasket fitted on the heat pipe 8, but the two have the same function, which is to seal the gap between the pipe and the housing 1. In other embodiments of this application, the discharged condensate can be used for water cooling of the heat sink 9, which effectively saves resources and conforms to the green concept.

[0040] In other embodiments of this application, a closed water storage tank can be set at the end of the guide pipe 10, without the need to open a hole in the tank body 1 or a one-way drain valve 11. The water storage tank can be taken out and the condensate collected inside can be poured out at fixed intervals.

[0041] Reference Figure 2 The top of the enclosure 1 is equipped with a maintenance auxiliary lighting strip 13, which is controlled by a door status switch. When the door of the enclosure 1 is opened, the maintenance auxiliary lighting strip 13 is turned on and illuminated to provide auxiliary lighting during maintenance. When the door of the enclosure 1 is closed, the maintenance auxiliary lighting strip 13 is turned off and no longer illuminates, saving energy.

[0042] In this embodiment, identification patches are also attached to the surface of the mechanical operating structure and the high-voltage cable terminal 22. The identification patches can be passive QR code labels or radio frequency identification patches 14, which are identified by scanning or NFC sensing. The identification patches serve as digital identity tags for the equipment, including equipment wiring diagrams, historical alarm records, and maintenance guidance videos, which facilitate maintenance personnel in maintenance and reduce the risk of misoperation. The labels are made of high-temperature resistant materials, and high-temperature resistant adhesives are selected to prevent the phenomenon of high-temperature delamination.

[0043] The implementation principle of Example 1 is as follows: When the high-voltage switch is activated, the spring release generates a high-frequency impact mechanical wave. The beam travels along the rigid metal medium with minimal attenuation and reaches the vibration sensor 41 directly, avoiding waveform distortion caused by thin-wall resonance. When an insulation gap breakdown occurs inside the high-voltage cable terminal 22, ultrasonic waves are excited and radiated outward. Because the ultrasonic probe is in close contact with the medium, it captures the weak discharge oscillation wave to the maximum extent. The cold end of the semiconductor cooling chip 5 is used to condense and precipitate the wave, which is then extracted outdoors to maintain a dry state inside the enclosure 1 and disrupt the humid environment conducive to the growth of electrical tree branches. Example 2

[0044] This embodiment discloses a status monitoring system.

[0045] Reference Figure 3 The core of this system's status monitoring and processing utilizes STMicroelectronics' STM32H743IIT6 microcontroller, specifically the edge computing module. The vibration sensing module employs the ADXL1002 MEMS accelerometer from AnalogDevices, featuring an ultra-wide linear bandwidth. Its extremely weak analog voltage signal outputs a shielded twisted-pair cable connected to the instrumentation preamplifier in the conditioning circuit. This preamplifier is an AD8628 auto-zeroing operational amplifier with a 10x amplification factor. The signal then flows into a second-order active Butterworth wideband filter constructed from an OPA4322 chip. This filter removes 50Hz power frequency fluctuations at low frequencies and cuts off at 10kHz at high frequencies. The clean vibration analog signal is then input to an independent high-speed ADC (Analog-to-Digital Converter) chip, the AD7606, and after digitization, is sent to the edge computing module via the SPI bus.

[0046] The ultrasonic sensing module uses Murata's MA40S4S ultrasonic generator terminal, with a center resonant frequency set at 150kHz. The signal is first input to a bandpass filter frequency selection circuit to select the ultrasonic echo signal of the target frequency band, while filtering out external noise and interference. Since the 150kHz high-frequency AC signal places extremely high demands on ADC sampling and requires redundant processing, this implementation uses an envelope detection and rectification circuit to extract the energy envelope of the ultrasonic discharge pulse, converting it into a slowly undulating low-frequency waveform. This envelope detection and rectification circuit consists of a Schottky diode (BAT54S) and an RC low-pass filter network with a 10μs time constant. This low-frequency wave is then fed to the positive pin of a voltage comparator, model LM393. The STM32H7 main controller outputs an adaptive reference voltage to the negative pin of the LM393 via its on-chip DAC pin. When the discharge pulse energy exceeds the reference voltage, the comparator reverses, triggering an external interrupt on the STM32H7. The main controller then synchronously captures the pulse amplitude using its built-in high-speed ADC.

[0047] In terms of environmental control, the STM32 main control pin outputs a 2kHz PWM signal, which is connected to an optocoupler to drive a high-power MOSFET, thereby connecting a 24V DC power supply to drive the high-power thermoelectric cooler. In this embodiment, the optocoupler is a TLP250, and the MOSFET is an IRF3205.

[0048] In this embodiment, both the air pressure sensing module and the humidity sensing module are electrically connected to the microcontroller, and the parameter information is directly transmitted to the microcontroller.

[0049] The implementation principle of Example 2 is as follows: the force change curve of the high-frequency mechanical impact is extracted by constant envelope group time delay filtering; the high-frequency oscillation envelope is extracted and restored into an energy bulge by the envelope detection and rectification circuit; the microprocessor DAC continuously calibrates its noise floor voltage according to the background white noise of the quiet time on site; when partial discharge causes the ultrasonic energy bulge to exceed the limit, the acquisition interruption is triggered immediately. Example 3

[0050] This embodiment discloses a condition monitoring method, referring to... Figure 4 .

[0051] A condition monitoring method includes the following steps: S1. Collect real-time signals through the sensor module group respectively, and extract the required parameters; S2. Calculate or draw a graph based on the extracted parameters; S3. Compare the calculated results or drawn graphs with the standard to determine the status of the enclosure and trigger an alarm.

[0052] In step S2, the vibration sensing module needs to calculate the Mahalanobis distance between the current characteristic parameters and the reference characteristic parameters; the pressure sensing module needs to calculate the pressure difference between the inside and outside of the box and the leakage index. In step S2, the ultrasonic sensing module needs to record the phase position and amplitude of each partial discharge pulse and construct a phase distribution statistical chart.

[0053] Specifically, regarding vibration and mechanical state analysis, the system drives the vibration ADC channel to record the time-series vibration waveform matrix from -50ms to +500ms the instant it receives the closing / opening command from the dispatch terminal. After filtering out the 50Hz DC offset, the system software calculates the waveform feature set vector within the full-wave time series. Where Am represents the peak transient acceleration indicating spring force, RMS represents the waveform effective energy, Tp is the mechanism contact time, C is the peak factor, and Ef represents the high-frequency spectrum energy contained in the signal.

[0054] Because multiple physical parameters exhibit nonlinearity and mutual entanglement, using multivariate Euclidean distance can lead to serious false alarms. Therefore, the Mahalanobis distance formula is used: Where X is the current measurement sample set, It is the inverse of the historical benchmark covariance matrix when there are no faults at the factory.

[0055] When the Marsh offset distance is greater than 3, it is determined to be a slight jamming and increased resistance, and an attention alarm is issued. When the offset distance is greater than 5, it is determined to be an extreme jamming or a part falling off and causing transmission idle, and a red blocking action signal is issued.

[0056] For ultrasonic partial discharge assessment, a 50Hz sinusoidal AC reference voltage is extracted using a system voltage transformer, and its cycle is divided into 360-degree electrical angle intervals. When the ultrasonic high-frequency capture arrives, the voltage phase angle position at the moment of interruption is recorded, and the discharge amplitude of the ADC's capture envelope at that moment, i.e., the magnitude of the discharge, is read. After accumulating 100,000 pulses through continuous operation for 5 minutes, a three-dimensional projection model, i.e., a power frequency phase-resolved partial discharge map (PRPD map), is established internally.

[0057] Based on spectrum recognition, if more than 70% of the ultrasonic breakdown pulses are densely clustered and symmetrically occur in the steep climbing regions where the sinusoidal voltage crosses the first and third quadrants, the algorithm can determine that a typical internal surface breakdown discharge has occurred at the high-voltage cable terminal. If the pulses are scattered and have no correlation with any power frequency period, they are identified as external mechanical white noise.

[0058] For predicting the airtightness of the microenvironment, a 10-hour long-sequence time-sliding window observation method is adopted. Sensors extract the air pressure inside the cabinet (P_inner) and the atmospheric pressure of the external environment (P_outer). During normal weather with alternating hot and cold temperatures, the air pressure inside P_inner fluctuates slowly in sync with that outside P_outer. The system continuously calculates the coefficient of variation of the pressure difference between the inside and outside. When the rubber sealing ring of the cabinet is intact, even if there is a strong wind outside, the breathing air pressure inside the cabinet has a certain lag time, exhibiting low-pass filtering characteristics. Once the system detects that the pressure difference inside the cabinet begins to show high-frequency, zero-delay fluctuations following the transient changes in external wind pressure, and the leakage index, i.e., the instantaneous differential coefficient of air pressure tracking, increases sharply beyond the set lower sealing threshold, it is determined that the silicone sealant of the cabinet has cracked or that the physical watertightness has failed. The edge computing module immediately activates the semiconductor cooling chip in the anti-condensation control subsystem to increase power and expel the water mist that has seeped in from the outside.

[0059] The implementation principle of Example 3 is as follows: By extracting vibration parameters, ultrasonic parameters, pressure parameters, and humidity parameters respectively, different digital profiles are constructed; the vibration parameters are calculated to obtain the Mahalanobis offset distance, avoiding the original difference of individual equipment and ensuring the accuracy of vibration early warning; the ultrasonic parameters are accumulated to draw a discharge assessment spectrum, and the position of the ultrasonic breakdown pulse in the spectrum is used to determine whether it is white noise or partial discharge; by calculating the coefficient of variation of the pressure difference between the inside and outside of the box, it is determined whether the box has cracked, etc.

[0060] The above are all preferred embodiments of this application, and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.

Claims

1. A primary and secondary integrated ring main unit, comprising a housing (1), wherein a primary switchgear (2) is installed inside the housing (1), the primary switchgear (2) comprising a mechanical operating mechanism (21) for opening and closing operations and a high-voltage cable terminal (22) for connecting external incoming and outgoing cables, characterized in that: The housing (1) contains a processing component (3) and a sensor group (4) which are physically suspended or embedded inside. The sensor group (4) includes a vibration sensor (41), an ultrasonic sensor (42), a barometric pressure sensor (43), and a humidity sensor (44). The vibration sensor (41) is attached to the surface of the external rigid housing of the mechanical operating mechanism (21); The ultrasonic sensor (42) is attached to the outside of the grounding shield layer of the high-voltage cable terminal (22) by means of a clamp or magnetic base; The air pressure sensor (43) and the humidity sensor (44) are both suspended inside the housing (1); The processing component (3) is housed in the secondary instrument low-pressure chamber on the side or top of the housing (1).

2. The primary and secondary integrated ring network box according to claim 1, characterized in that: The vibration sensor (41) is installed in the structural rigid area of ​​the operating mechanism housing, and the physical spatial distance between the installation center coordinates of the vibration sensor (41) and the main drive axis of the mechanical operating mechanism (21) is limited to a preset distance radius.

3. The primary and secondary integrated ring network box according to claim 1, characterized in that: A semiconductor cooling chip (5) is provided inside the housing (1). The cold end of the semiconductor cooling chip (5) faces the inside of the housing (1), and the hot end of the semiconductor cooling chip (5) faces away from the inside of the housing. The cold end of the semiconductor cooling chip (5) is provided with condensation guide fins (6). The hot end of the semiconductor cooling chip (5) is pressed with a heat-equalizing plate (7), and a heat-conducting pipe (8) is connected to the heat-equalizing plate (7). The heat-conducting pipe (8) penetrates the box body (1) and is held tightly to the wall of the box body (1) by a gasket. The end of the high heat conductivity pipe (8) assembly extending to the outside of the box body (1) is extended with a heat sink (9). A flow guide pipe (10) is provided below the condensation guide fin (6), and a one-way drain valve (11) is connected to the end of the flow guide pipe (10). The outlet end of the one-way drain valve (11) is connected to an outlet pipe (12) extending to the outside of the box body (1).

4. The primary and secondary integrated ring network box according to claim 1, characterized in that: The maintenance auxiliary lighting strip (13) is attached to the inner wall of the top of the box (1), and the maintenance auxiliary lighting strip (13) is controlled to be turned on and off by a door status switch. The mechanical operating mechanism (21) and the high-voltage cable terminal (22) are both affixed with identification patches (14) containing unique equipment ledgers and anti-counterfeiting three-dimensional data identifiers. The identification patches (14) are passive QR code labels or radio frequency identification patches (14).

5. A status monitoring system, applied to the primary and secondary integrated ring network box as described in any one of claims 1-4, characterized in that: It includes a sensor module group, a signal conditioning module, and an edge computing module; The sensing module group includes a vibration sensing module, an ultrasonic sensing module, a barometric pressure sensing module, and a humidity sensing module. The signal conditioning module is electrically connected to the signal output terminals of the vibration sensing module and the ultrasonic sensing module, respectively, and is used to perform filtering, primary amplification and analog-to-digital conversion conditioning on the captured raw analog electrical signal. The edge computing module is electrically coupled to the output terminal of the signal conditioning module, the high and low level output terminals of the air pressure sensing module, and the output terminal of the humidity sensing module. The edge computing module has a state evaluation algorithm embedded in it, which is used to receive the conditioned data and calculate and output the device health status signal and the early warning control signal.

6. A condition monitoring system according to claim 5, characterized in that: The signal conditioning module internally includes a vibration signal conditioning branch and an ultrasonic signal conditioning branch. The vibration signal conditioning branch includes an instrument preamplifier circuit, a wideband filter circuit, and a high-speed analog-to-digital converter chip that are connected in sequence. The ultrasonic signal conditioning branch includes a bandpass filter frequency band selection circuit, an envelope detection and rectification circuit, and a voltage comparator connected in series. The reference voltage pin of the voltage comparator is connected in a closed loop to the digital-to-analog conversion output of the edge computing module to achieve adaptive biasing of the comparison threshold.

7. A condition monitoring system according to claim 5, characterized in that: It also includes an environment-driven execution circuit, the control enable terminal of which is electrically connected to the pulse width modulation pin of the edge computing module, and its high-power output side has a DC power supply terminal pair for driving external semiconductor devices and light-emitting devices.

8. The state monitoring method of a state monitoring system according to claim 5, characterized in that, Includes the following steps: S1. Collect real-time signals through the sensor module group respectively, and extract the required parameters; S2. Calculate or draw a graph based on the extracted parameters; S3. Compare the calculated results or drawn graphs with the standard to determine the status of the enclosure and trigger an alarm.

9. The condition monitoring method according to claim 8, characterized in that: In step S2, the vibration sensing module needs to calculate the Mahalanobis distance between the current characteristic parameter and the reference characteristic parameter; the air pressure sensing module needs to calculate the pressure difference between the inside and outside of the box and the leakage index.

10. The condition monitoring method according to claim 8, characterized in that: In step S2, the ultrasonic sensing module needs to record the phase position and amplitude of each partial discharge pulse and construct a phase distribution statistical chart.

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