Heat dissipation device of high-voltage box and energy storage system

Abstract

The application discloses a heat dissipation device of a high-voltage box and an energy storage system. The device comprises a box body, a heat dissipation piece and a heat conduction piece. The box body is suitable for mounting electrical elements. At least one heat dissipation opening is formed in the bottom of the box body, and the heat dissipation opening is arranged opposite to the electrical elements. The heat dissipation piece is mounted on the bottom of the box body and located outside the box body. The heat dissipation piece covers at least the heat dissipation opening. The heat conduction piece is filled in the heat dissipation opening and connected with the electrical elements and the heat dissipation piece. The application provides a heat dissipation effect of the high-voltage box.

Description

Technical Field

[0001] This application relates to the field of energy storage equipment technology, and in particular to a heat dissipation device and energy storage system for a high-voltage box. Background Technology

[0002] In applications such as energy storage systems, high-voltage boxes integrate various electrical components, including contactors, fuses, and power modules. These components generate a large amount of heat during operation. If this heat cannot be dissipated in time, the temperature inside the box will become too high, affecting the performance, reliability, and even the lifespan of the electrical components. In severe cases, it may even lead to safety accidents.

[0003] In related technologies, the main methods for heat dissipation in high-voltage boxes are as follows: First, natural heat dissipation, which relies primarily on natural air convection for heat exchange. However, its heat dissipation efficiency is extremely low, only suitable for applications with very low power density, and cannot meet the heat dissipation requirements of current high-integration, high-power-density energy storage systems. Second, forced air cooling, which introduces external cold air to forcibly cool the heat-generating components by installing fans and vents on the box. While this method improves heat dissipation efficiency, it requires vents on the box, which significantly reduces the box's protection rating (IP rating). In harsh outdoor or industrial environments such as dust and salt spray, the vent filters are prone to clogging, leading to a sharp decline in heat dissipation performance and requiring frequent maintenance. Third, liquid cooling, which integrates liquid cooling plates within the box and uses circulating coolant to remove heat. This method has high heat dissipation efficiency, but requires additional liquid cooling plates, piping, water pumps, and other components, resulting in a complex system structure, high cost, and the risk of coolant leakage, placing high demands on the system's sealing and subsequent maintenance. Summary of the Invention

[0004] This application provides a heat dissipation device and energy storage system for a high-voltage box, so as to at least partially solve the above-mentioned technical problems.

[0005] To achieve the above objectives, according to the first aspect of this application, a heat dissipation device for a high-voltage box is provided, comprising: a box body adapted to install electrical components, at least one heat dissipation vent being opened at the bottom of the box body, the heat dissipation vent being disposed opposite to the electrical components; a heat dissipation component installed at the bottom of the box body, located outside the box body, the heat dissipation component at least covering the heat dissipation vent; and a heat-conducting component filling the heat dissipation vent and connecting the electrical components and the heat dissipation component.

[0006] Optionally, the heat dissipation device of the high-voltage box also includes a support member installed at the bottom of the box body, located outside the box body. The distance between the support member and the bottom of the box body is greater than or equal to the distance between the heat dissipation component and the bottom of the box body. This provides ventilation space for the heat dissipation component and prevents direct contact between the heat dissipation component and the ground, which could cause damage or a decrease in heat dissipation performance.

[0007] Optionally, the support includes two support rods, respectively positioned on both sides of the heat sink. This provides greater stability to the enclosure while preventing obstruction of airflow around the heat sink.

[0008] Optionally, the heat sink includes a base plate and multiple heat dissipation fins. The base plate is connected to the bottom of the enclosure body, and the multiple heat dissipation fins are disposed on the side of the base plate away from the enclosure body, forming heat dissipation channels between adjacent heat dissipation fins. This increases the contact area between the heat sink and the air, thereby improving the heat sink's ability to dissipate heat to the external environment.

[0009] Optionally, the heat sink also includes a fan, mounted on the bottom of the base plate or the chassis body, with the fan outlet facing the inlets of multiple heat dissipation channels. This allows airflow to be guided into the heat dissipation channels and flow along the surface of the heat dissipation fins, thereby significantly improving heat dissipation efficiency.

[0010] Optionally, the fan includes an air inlet and an air outlet, with the air inlet positioned opposite the bottom of the enclosure and the air outlet positioned opposite the inlet of the heat dissipation channel. This creates a clear air intake and exhaust path, thereby improving airflow utilization efficiency and reducing airflow short-circuiting.

[0011] Alternatively, the heat sink fins are arranged circumferentially around the fan. This results in a compact structure and saves space.

[0012] Optionally, a fan is located at one end of the heat dissipation channel. The fan includes an air inlet and an air outlet, both of which are positioned opposite the entrance to the heat dissipation channel, with the air outlet closer to the channel than the air inlet. This allows airflow to follow the direction of the heat dissipation channel, thereby enhancing airflow coverage and improving overall heat dissipation.

[0013] Optionally, the side of the fan furthest from the chassis is located in the same plane as the side of the heatsink fins furthest from the chassis. This makes the overall height of the heatsink assembly more compact, thereby reducing the need for additional installation space.

[0014] Optionally, when projecting along the height of the enclosure body, the projected area of ​​the electrical components is larger than the area of ​​the corresponding heat dissipation vents, and / or, the projected area of ​​the heat dissipation components is larger than the projected area of ​​the electrical components. This ensures the structural strength of the enclosure and allows heat to be more evenly distributed on the heat dissipation components, thereby improving the overall heat dissipation efficiency.

[0015] Optionally, the thermally conductive component includes one or more combinations of thermally conductive silicone grease, thermally conductive pads, thermally conductive gel, or thermally conductive epoxy potting compound. This ensures that the heat dissipation port achieves efficient heat conduction while maintaining a reliable seal, thus balancing heat dissipation and protection performance.

[0016] Secondly, this application also provides an energy storage system, including: electrical components; and a heat dissipation device for a high-voltage box as described in any of the preceding claims, wherein the electrical components are installed inside the box body.

[0017] The high-voltage box heat dissipation device and energy storage system of this application embodiment have heat dissipation vents at the bottom of the box body opposite the internal electrical components. Heat sinks are installed on the outside of the box body, and thermally conductive materials are filled into the heat dissipation vents to connect the electrical components and the heat sinks. This structure directly and efficiently conducts the heat generated by the electrical components to the heat sinks on the outside of the box body through the thermally conductive materials. The heat sinks then dissipates the heat to the surrounding environment. The structure is simple and compact, with low manufacturing and installation costs, improving heat dissipation efficiency while maintaining the high protection level of the high-voltage box.

[0018] Other features and advantages of this application will be described in detail in the following detailed description section. Attached Figure Description

[0019] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0020] To gain a more complete understanding of this application and its beneficial effects, the following description will be provided in conjunction with the accompanying drawings, wherein the same reference numerals in the following description denote the same parts.

[0021] Figure 1 This is a schematic diagram of the overall structure of the heat dissipation device provided in an exemplary embodiment of this disclosure; Figure 2 This is an exploded view of the heat dissipation device provided in an exemplary embodiment of this disclosure; Figure 3 This is a schematic diagram of the first airflow mode of the heat dissipation device provided in an exemplary embodiment of this disclosure; Figure 4 This is a schematic diagram of the second airflow mode of the heat dissipation device provided in an exemplary embodiment of this disclosure; Figure 5 This is a partial cross-sectional schematic diagram of the heat dissipation device provided in an exemplary embodiment of this disclosure; Figure 6 yes Figure 4 This is a schematic diagram of the structure of the heat sink component in the heat dissipation device provided in an exemplary embodiment of this disclosure.

[0022] Explanation of reference numerals in the attached figures: 10. Energy storage system; 100. Heat dissipation device; 110. Case body; 111. Vent for heat dissipation; 120. Heat sink; 121. Base plate; 122. Heat sink fins; 123. Heat dissipation channel; 124. Fan; 125. Air inlet; 126. Air outlet; 130. Thermal conductive components; 140. Support component; 141. Support rod; 200. Electrical components. Detailed Implementation

[0023] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the protection scope of this application.

[0024] Before providing a further detailed description of the embodiments of this application, some of the nouns and terms involved in the embodiments of this application will be explained. The nouns and terms involved in the embodiments of this application are subject to the following interpretations.

[0025] The heat dissipation device 100 of the high-voltage box refers to a device used to dissipate heat from a high-voltage box on which electrical components 200 are installed. Its core feature is that the heat dissipation device 120 set outside the box and the heat-conducting device 130 filled in the heat dissipation port 111 of the box can efficiently conduct heat from inside the box to the outside and dissipate it, while maintaining the airtightness of the box.

[0026] Electrical component 200: refers to electronic or electrical components installed inside the enclosure 110 that generate heat during operation, such as, but not limited to, contactors, fuses, copper busbars, power modules, or controllers.

[0027] Heat sink 120: refers to a component installed on the outside of the housing body 110 to increase the heat dissipation surface area and accelerate heat dissipation. In some embodiments of this application, the heat sink 120 may specifically be a heat sink with heat dissipation fins 122.

[0028] Thermal conductive component 130: refers to the material filled inside the heat dissipation vent 111 of the housing body 110, used to establish an efficient thermal conduction path between the electrical component 200 and the heat dissipation component 120, and at the same time to seal the heat dissipation vent 111. Examples include thermal grease, thermal pads, thermal gel, or thermal epoxy resin potting compound.

[0029] Support member 140: refers to a structure installed at the bottom of the enclosure body 110 to elevate the enclosure body 110 and protect the heat sink 120 installed at the bottom from ground impact or water accumulation. In some embodiments of this application, the support member 140 may specifically be a mounting beam or support rod 141.

[0030] Please see Figures 1 to 6 This application aims to provide a heat dissipation device 100 and an energy storage system 10 for a high-voltage box. Its core objective is to resolve the contradiction between high heat dissipation efficiency and high protection level in related technologies. This application achieves good heat dissipation while ensuring the box's airtightness by directly and efficiently transferring heat from key heat-generating components inside the box to the outside, and then enhancing heat dissipation externally.

[0031] Please see Figure 2 and Figure 5 This application provides a heat dissipation device 100 for a high-voltage box, which includes a box body 110, a heat sink 120, and a heat-conducting component 130. The box body 110 is used to house and protect the internal electrical components 200. The box body 110 has a cubic structure. At least one heat dissipation vent 111 is provided at the bottom of the box body 110. The heat dissipation vent 111 is disposed opposite to the electrical components 200. The heat dissipation vent 111 is disposed opposite to the heat source inside the box body 110, ensuring the shortest heat transfer path and the lowest thermal resistance. By establishing the heat dissipation channel 123 directly at the heat source, the large-scale diffusion and accumulation of heat inside the box is avoided, effectively improving the heat dissipation efficiency of the electrical components 200.

[0032] A heat sink 120 is installed on the bottom exterior of the enclosure body 110. The function of the heat sink 120 is to dissipate heat conducted from the interior of the enclosure body 110 to the surrounding environment. Its installation position at least covers the heat dissipation vent 111, ensuring that the heat transferred from the heat dissipation vent 111 can be completely absorbed by it. Placing the heat sink 120 on the exterior of the enclosure body 110 can achieve both heat dissipation and protection. The heat dissipation function is mainly completed externally. The heat dissipation vent 111 on the enclosure body 110 is filled with a thermally conductive element 130 and then sealed by the heat sink 120, thereby ensuring a high degree of airtightness inside the enclosure body 110, effectively resisting adverse environmental factors such as dust, moisture, and salt spray, and improving the reliability and environmental adaptability of the entire high-voltage enclosure.

[0033] To seamlessly transfer the heat generated by the electrical component 200 to the external heat sink 120, a thermally conductive element 130 is filled within the heat sink 111. The thermally conductive element 130 physically connects the electrical component 200 and the heat sink 120, forming an efficient heat conduction path. Simultaneously, another key function of the thermally conductive element 130 is to completely fill and seal the heat sink 111, serving both as a heat conduction path and a physical seal. By employing materials with excellent thermal conductivity and sealing properties, such as thermally conductive gel or thermally conductive pads, this solution solves the heat conduction problem while ensuring that the overall protection rating of the enclosure 110, such as IP65 or higher, is unaffected by the opening, thus balancing heat dissipation efficiency and protection performance.

[0034] In some embodiments, please refer to Figure 1 The heat dissipation device 100 also includes a support member 140. The support member 140 is installed at the bottom of the enclosure body 110, located outside the enclosure body 110. Its design height ensures that the distance between the support member 140 and the bottom of the enclosure body 110 is greater than or equal to the distance between the heat dissipation component 120 and the bottom of the enclosure body 110. When the high-voltage box is placed on the ground or a mounting platform, the support member 140 is the first to contact the supporting surface, thereby elevating the entire enclosure along with the heat dissipation component 120 at its bottom. This structure effectively prevents physical damage and wear to the heat dissipation component 120 caused by direct contact with the ground, or corrosion from immersion in humid or waterlogged environments, or any impact on the heat dissipation performance of the heat dissipation component 120, ensuring the long-term stability and reliability of the heat dissipation system, while also providing necessary ventilation space around the heat dissipation component 120.

[0035] In some embodiments, please refer to Figure 1 The support component 140 includes two support rods 141, which can be respectively installed on both sides of the heat sink 120. This symmetrical layout not only provides stable and balanced support, ensuring the stable placement of the enclosure, but also ensures unobstructed airflow in the front-to-back direction of the heat sink 120, without hindering natural convection or forced ventilation. This structure is simple, reliable, easy to implement, and well-compatible with the layout requirements for subsequent additions of active cooling modules such as the fan 124.

[0036] In some embodiments, the bottom of the support member 140 may be provided with a shock-absorbing pad or an anti-slip pad, such as a rubber pad or an elastic buffer pad. The shock-absorbing structure can reduce the impact of vibrations generated during transportation or operation on the heat sink 120 and the fan 124, improving the overall structural stability. At the same time, the anti-slip structure can enhance the friction between the equipment and the mounting platform, preventing the equipment from shifting in a vibrating environment and improving the safety of system operation.

[0037] In some embodiments. See Figure 1 and Figure 5The heat sink 120 may include a base plate 121 and multiple heat dissipation fins 122. The base plate 121 is connected to the bottom of the housing body 110 and can receive heat transferred from the heat-conducting component 130. The base plate 121 may be made of a high thermal conductivity material, such as aluminum alloy or copper-aluminum alloy. On the side of the base plate 121 away from the housing body 110, multiple heat dissipation fins 122 are provided. The arrangement of these heat dissipation fins 122 greatly increases the surface area of ​​the heat sink 120 in contact with the outside air. Heat dissipation channels 123 are naturally formed between adjacent heat dissipation fins 122. The total heat dissipation area of ​​the heat sink 120 can be multiplied, thereby greatly improving its ability to dissipate heat to the surrounding environment. Whether through natural convection or forced air cooling, its efficiency is far higher than that of a simple flat plate. The heat dissipation fins 122 may be rectangular fins, arc-shaped fins, or corrugated fin structures.

[0038] In some embodiments, please refer to Figure 2 , Figure 3 , Figure 4 , Figure 5 and Figure 6 The heat sink 120 includes a fan 124. For example... Figure 3 , Figure 6 and Figure 4 As shown, the fan 124 can be mounted on the bottom of the base plate 121 or the bottom of the housing 110. The air outlet 126 of the fan 124 is positioned opposite to the inlets of multiple heat dissipation channels 123. This allows the airflow generated by the fan 124 to be precisely and efficiently guided into the heat dissipation channels 123, with the air flowing at high speed over the surface of the heat dissipation fins 122. Compared to natural air convection, forced air cooling can increase the heat transfer coefficient by several times or even tens of times, thereby removing more heat under the same temperature difference. This greatly enhances the ultimate heat dissipation power of the heat dissipation device 100, enabling it to meet the heat dissipation needs of higher power density electrical components 200.

[0039] In some examples, the heat sink 120 includes multiple fans 124 spaced apart along the length of the heat sink fins 122, with each fan 124 corresponding to a portion of the heat dissipation channel 123. By having multiple fans 124 work together, a uniform airflow coverage can be formed in different areas of the heat sink 120. This airflow distribution ensures that all heat sink fins 122 are adequately cooled, thereby improving the overall heat dissipation capacity and making it suitable for the heat dissipation needs of electrical components 200 with higher power density.

[0040] In some embodiments, please participate Figure 3 , Figure 4 and Figure 6The fan 124 includes an air inlet 125 and an air outlet 126. The air inlet 125 is positioned opposite the bottom of the enclosure 110, meaning the fan 124 draws in cool air from the outside of the bottom of the enclosure. The air outlet 126 is positioned opposite the inlet of the heat dissipation channel 123, blowing the drawn-in cool air towards the heat dissipation fins 122. This bottom-in, side-out airflow organization creates a clear and efficient ventilation path, ensuring that cool air can fully wash the surface of the heat dissipation fins 122, avoiding airflow short circuits or dead zones, thereby improving the utilization efficiency of the fan 124. This fan 124 can be a centrifugal fan, capable of providing high static pressure within a small installation space, allowing airflow to stably pass through the narrow gaps of the heat dissipation channel 123, thus improving heat exchange efficiency.

[0041] In some embodiments, please refer to Figure 6 The heat sink fins 122 can be arranged around the circumference of the fan 124. The fan 124 is biased towards one end of the heat dissipation channel 123. The heat sink 120 has a more compact structure and higher space utilization.

[0042] In some embodiments, please refer to Figure 3 and Figure 4 The arrangement of the fan 124 can vary. For example, the fan 124 can be located at one end of the heat dissipation channel 123, with its air inlet 125 and air outlet 126 both positioned opposite the inlet of the heat dissipation channel 123, and the air outlet 126 being closer to the heat dissipation channel 123 than the air inlet 125. Alternatively, the fan 124 can be an axial fan, propelling air forward along the longer heat dissipation channel 123. This achieves good airflow coverage from one end to the other, effectively cooling the entire heat sink.

[0043] In some embodiments, please refer to Figure 3 and Figure 4 The side of the fan 124 away from the housing body 110 can be in the same plane as the side of the heat sink 122 away from the housing body 110. The ends of the fan 124 and the heat sink 122 are flush. The total height of the entire heat sink 120 is determined by the greater of the height of the heat sink 122 or the thickness of the fan 124, and the installation height will not be increased due to the protrusion of the fan 124.

[0044] In some embodiments, please refer to Figure 5Projecting along the height of the enclosure body 110, the projected area of ​​the electrical component 200 can be larger than the area of ​​the corresponding heat dissipation vent 111, and / or the projected area of ​​the heat sink 120 can be larger than the projected area of ​​the electrical component 200. The purpose of having an area of ​​electrical component 200 greater than the area of ​​heat dissipation vent 111 is to ensure the structural strength of the enclosure base plate 121 and the installation of the electrical component 200, avoiding weakening its load-bearing capacity and rigidity due to excessively large openings. The design of having an area of ​​heat sink 120 greater than the area of ​​electrical component 200 is based on the principle of heat diffusion. Heat is conducted from the smaller electrical component 200 to the larger heat sink 120 on the base plate 121, effectively reducing heat flux density and allowing heat to be more evenly distributed on each heat dissipation fin 122, thereby improving overall heat dissipation efficiency and avoiding the problem of heat concentration in the middle of the heat sink 120 leading to low utilization of the edge areas.

[0045] In another preferred embodiment, various options are available for the material selection of the thermally conductive component 130. The thermally conductive component 130 may include one or more combinations of thermally conductive silicone grease, thermally conductive pads, thermally conductive gel, or thermally conductive epoxy potting compound. The selection can be made according to specific application requirements. For example, thermally conductive pads have a fixed thickness and shape, are easy to install, and are suitable for contact surfaces with good flatness; thermally conductive gels have better deformation capabilities, can fill irregular gaps, and achieve lower contact thermal resistance; while thermally conductive epoxy potting compound provides good thermal conductivity and sealing while also serving as a structural bond and fixation agent. This diverse selection provides flexibility for application scenarios with different cost, performance, and process requirements.

[0046] Please see Figures 1 to 6 This application also provides an energy storage system 10. The energy storage system 10 includes core electrical components 200 and a heat dissipation device 100 for the high-voltage box in any of the aforementioned embodiments. In this energy storage system 10, the electrical components 200, such as inverters and controllers, are installed inside the box body 110 of the heat dissipation device 100. By employing the heat dissipation device 100 proposed in this application, the energy storage system 10 can maintain the cleanliness and high protection level inside the box while operating at high power density and generating a large amount of heat. This effectively copes with harsh operating conditions such as outdoor environments, high dust levels, and high salt spray, significantly improving the long-term operational reliability, safety, and environmental adaptability of the energy storage system 10, while reducing maintenance costs caused by heat dissipation system failures or maintenance such as cleaning filters.

[0047] The workflow of this embodiment is as follows: When the energy storage system 10 is working, the electrical components 200 generate a large amount of heat. The heat is rapidly conducted to the base plate 121 of the external heat sink 120 through the heat conductor 130. The heat diffuses on the base plate 121 and is further conducted to the heat sink fins 122. At the same time, the fan 124 is activated, drawing in cool ambient air and then blowing the pressurized air out circumferentially, flowing at high speed through each heat dissipation channel 123, efficiently dissipating the heat on the heat sink fins 122 into the environment. Throughout the entire process, the interior of the housing 110 remains sealed and isolated from the outside world.

[0048] The technical advantage of this embodiment is that it provides a mode of heat dissipation through the enclosure wall to the outside. Compared with the traditional solution of placing the fan 124 inside the enclosure or opening vents in the enclosure wall for ventilation, the core advantage of this solution is that the heat-conducting component 130, while transferring heat, also acts as a seal to completely block the heat dissipation vent 111. This allows the enclosure body 110 to achieve a completely sealed internal space, thereby achieving a high protection level such as IP65 or IP67, effectively isolating external dust, moisture, salt spray, etc., and greatly improving the operational reliability and lifespan of the internal electrical components 200. At the same time, this solution has a simple structure, low cost, and requires no maintenance, making it particularly suitable for applications with extremely high reliability requirements but less stringent heat dissipation power requirements.

[0049] In the description of this application, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more features. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0050] In the above embodiments, the descriptions of each embodiment have different focuses. For parts not described in detail in a certain embodiment, please refer to the relevant descriptions in other embodiments.

[0051] The embodiments, implementation methods, and related technical features of this application can be combined and substituted for each other without conflict.

[0052] The above are merely preferred embodiments of this application and are not intended to limit this application in any way. Any simple modifications, equivalent changes, and alterations made to the above embodiments based on the technical essence of this application without departing from the scope of the technical solution of this application shall still fall within the scope of the technical solution of this application.

Claims

1. A heat dissipation device (100) for a high-pressure box, characterized in that, include: The enclosure body (110) is adapted to install electrical components (200), and at least one heat dissipation vent (111) is provided at the bottom of the enclosure body (110), and the heat dissipation vent (111) is arranged opposite to the electrical components (200); A heat sink (120) is installed at the bottom of the housing body (110) and located outside the housing body (110). The heat sink (120) at least covers the heat dissipation vent (111). A heat-conducting component (130) is filled in the heat dissipation port (111) and connects the electrical component (200) and the heat dissipation component (120).

2. The heat dissipation device (100) for the high-pressure box according to claim 1, characterized in that, It also includes a support member (140) installed at the bottom of the box body (110) and located outside the box body (110). The distance between the support member (140) and the bottom of the box body (110) is greater than or equal to the distance between the heat sink (120) and the bottom of the box body (110).

3. The heat dissipation device (100) for the high-pressure box according to claim 2, characterized in that, The support member (140) includes two support rods (141), which are respectively disposed on both sides of the heat sink (120).

4. The heat dissipation device (100) for the high-pressure box according to claim 2, characterized in that, The heat sink (120) includes a base plate (121) and a plurality of heat sink fins (122). The base plate (121) is connected to the bottom of the housing body (110). The plurality of heat sink fins (122) are disposed on the side of the base plate (121) away from the housing body (110), and a heat dissipation channel (123) is formed between adjacent heat sink fins (122).

5. The heat dissipation device (100) for the high-pressure box according to claim 4, characterized in that, The heat sink (120) also includes a fan (124), which is installed on the bottom of the base plate (121) or the bottom of the box body (110). The air outlet (126) of the fan (124) is arranged opposite to the inlet of the plurality of heat dissipation channels (123).

6. The heat dissipation device (100) for the high-pressure box according to claim 5, characterized in that, The fan (124) includes an air inlet (125) and an air outlet (126). The air inlet (125) is positioned opposite to the bottom of the housing body (110), and the air outlet (126) is positioned opposite to the inlet of the heat dissipation channel (123).

7. The heat dissipation device (100) for the high-pressure box according to claim 6, characterized in that, The heat dissipation fins (122) are arranged circumferentially around the fan (124).

8. The heat dissipation device (100) for the high-pressure box according to claim 5, characterized in that, The fan (124) is located at one end of the heat dissipation channel (123). The fan (124) includes an air inlet (125) and an air outlet (126). The air inlet (125) and the air outlet (126) are both arranged opposite to the entrance of the heat dissipation channel (123), and the air outlet (126) is closer to the heat dissipation channel (123) than the air inlet (125).

9. The heat dissipation device (100) for the high-pressure box according to claim 5, characterized in that, The side of the fan (124) away from the housing body (110) and the side of the heat dissipation fins (122) away from the housing body (110) are located in the same plane.

10. The heat dissipation device (100) for the high-pressure box according to any one of claims 1 to 9, characterized in that, Projecting along the height direction of the housing body (110), the projected area of ​​the electrical component (200) is greater than the area of ​​the corresponding opening, and / or the projected area of ​​the heat sink (120) is greater than the projected area of ​​the electrical component (200).

11. The heat dissipation device (100) for the high-pressure box according to any one of claims 1 to 9, characterized in that, The thermally conductive component (130) includes one or more combinations of thermally conductive silicone grease, thermally conductive pads, thermally conductive gel, or thermally conductive epoxy potting compound.

12. An energy storage system (10), characterized in that, include: Electrical components (200); The heat dissipation device (100) of the high-voltage box as described in any one of claims 1 to 11, wherein the electrical component (200) is installed inside the box body (110).

Images