A power module, motor controller, electric drive assembly, and vehicle

Abstract

The embodiment of the application discloses a power module, a motor controller, an electric drive assembly and a vehicle. The power module comprises a direct current transmission structure and at least two sub-power modules, and the direct current transmission structure is electrically connected with the at least two sub-power modules. The technical scheme provided by the embodiment is that the at least two sub-power modules are electrically connected with the direct current transmission structure, so that the at least two sub-power modules can share one direct current transmission structure, thereby increasing the area of the direct current transmission structure corresponding to each sub-power module, improving the electric signal transmission capacity of the direct current transmission structure corresponding to each sub-power module, reducing the parasitic inductance of the power module, improving the switching efficiency of the power module, reducing the switching loss of the power module, and improving the heat dissipation effect of electric signal transmission.

Description

[0001] Cross-references and priority statements

[0002] This patent application claims priority to application No. 2025105210057, filed on April 23, 2025, entitled "A power module, a motor controller, an electric drive assembly and a vehicle", the entire contents of which are incorporated herein by reference. Technical Field

[0003] The present invention relates to the field of power device technology, and in particular to a power module, a motor controller, an electric drive assembly, and a vehicle. Background Technology

[0004] With the development of chip technology, the requirements for power modules are becoming increasingly stringent. Current power modules for motor inverter circuits are generally in HPD or plastic packages, with each HPD or plastic-packaged module having a parasitic inductance between 4nH and 10nH. Existing power modules suffer from high parasitic inductance, poor heat dissipation, and consequently, high switching losses. Summary of the Invention

[0005] This invention provides a power module, a motor controller, an electric drive assembly, and a vehicle to solve the problems of high parasitic inductance, poor heat dissipation, and high switching losses in existing power modules.

[0006] To address the aforementioned technical problems, the present invention adopts the following technical solution:

[0007] This invention provides a power module, comprising:

[0008] A DC transmission structure;

[0009] At least two sub-power modules, which are electrically connected to the DC transmission structure.

[0010] Optionally, the number of the at least two sub-power modules is three, and all three sub-power modules are electrically connected to the DC transmission structure.

[0011] Optionally, the power module includes:

[0012] A second conductive layer, at least a portion of which forms the first transmission structure of the DC transmission structure, wherein the at least two sub-power modules are electrically connected to the first transmission structure.

[0013] Optionally, the power module further includes:

[0014] The fifth conductive layer is provided in layers with the second conductive layer and the fifth conductive layer.

[0015] At least a portion of the fifth conductive layer forms the second transmission structure of the DC transmission structure, and the at least two sub-power modules are electrically connected to the second transmission structure.

[0016] Optionally, the second conductive layer and the fifth conductive layer are located on both sides of the sub-power module.

[0017] Optionally, the power module further includes:

[0018] A seventh conductive layer is provided between the seventh conductive layer and the second conductive layer, and at least a portion of the seventh conductive layer and the fifth conductive layer together form the second transmission structure of the DC transmission structure.

[0019] Optionally, the power module further includes:

[0020] A first conductive layer is located on the side of the second conductive layer away from the sub-power module;

[0021] At least one capacitor, wherein the at least one capacitor is electrically connected to the first conductive layer.

[0022] Optionally, the power module further includes:

[0023] A sixth thermal conductive layer is disposed on the side of the fifth conductive layer away from the sub-power module, and the sixth thermal conductive layer is used to connect the heat dissipation module.

[0024] Optionally, the power module includes:

[0025] A third conductive layer and a fourth conductive layer are disposed between the second conductive layer and the fifth conductive layer;

[0026] The third conductive layer includes a first through-hole disposed along a third direction, and the fourth conductive layer includes a second through-hole disposed along a third direction. The first through-hole and the second through-hole are at least partially disposed opposite each other, and at least a portion of at least one of the sub-power modules is disposed in the space between the first through-hole and the second through-hole.

[0027] Optionally, the power module includes an AC transmission structure, which is electrically connected to the output terminal of the sub-power module.

[0028] Optionally, the AC transmission structure includes a first AC transmission structure and a second AC transmission structure, at least a portion of the second conductive layer forms the first AC transmission structure, at least a portion of the fifth conductive layer forms the second AC transmission structure, and both the first AC transmission structure and the second AC transmission structure are electrically connected to the output terminal of the sub-power module.

[0029] Optionally, the projection of the sub-power module onto the second conductive layer along a third direction at least partially coincides with the first AC transmission structure; and / or, the projection of the sub-power module onto the fifth conductive layer along a third direction at least partially coincides with the second AC transmission structure.

[0030] According to another aspect of the present invention, this embodiment provides a motor controller, including the power module described in any of the first aspects.

[0031] According to another aspect of the present invention, this embodiment provides an electric drive assembly, including the power module described in any of the first aspects and / or the motor controller described in any of the second aspects.

[0032] According to another aspect of the present invention, this embodiment provides a vehicle including the power module described in any of the first aspects and / or the motor controller described in any of the second aspects and / or the electric drive assembly described in any of the third aspects.

[0033] The power module provided in this embodiment of the invention includes a DC transmission structure and at least two sub-power modules, with the DC transmission structure electrically connected to the at least two sub-power modules. By setting one DC transmission structure electrically connected to the at least two sub-power modules, the at least two sub-power modules can reuse the same DC transmission structure. Since the upper and lower bridge modules of the three-phase sub-power modules of the power module are alternately turned on, when one DC transmission structure is electrically connected to the at least two sub-power modules, the at least two sub-power modules can reuse each other's DC transmission structure to transmit DC current signals when they are turned on. This increases the area of ​​the DC transmission structure of the at least two sub-power modules sharing the same DC transmission structure, increases the flow area of ​​the DC current signal, effectively reduces the parasitic inductance of the power module, improves the switching efficiency of the power module, and reduces the switching losses of the power module. In addition, since the DC transmission structure generates heat when transmitting DC current signals, by setting at least two sub-power modules to reuse one DC transmission structure, the heat dissipation area of ​​the DC transmission structure can be increased, optimizing the heat dissipation of the sub-power modules, and thus optimizing the heat dissipation of the power module. Attached Figure Description

[0034] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments of the present invention will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the content of the embodiments of the present invention and these drawings without creative effort.

[0035] Figure 1 This is a schematic diagram of the structure of a power module provided in an embodiment of the present invention;

[0036] Figure 2 This is a circuit schematic diagram of a power module provided in an embodiment of the present invention;

[0037] Figure 3 This is a cross-sectional schematic diagram of a power module provided in an embodiment of the present invention;

[0038] Figure 4 This is a schematic diagram of the structure of the fifth conductive layer of a power module provided in an embodiment of the present invention;

[0039] Figure 5 This is a schematic diagram of the structure of the second conductive layer of a power module provided in an embodiment of the present invention;

[0040] Figure 6 This is a schematic diagram of the structure of the third conductive layer of a power module provided in an embodiment of the present invention;

[0041] Figure 7 This is a schematic diagram of the structure of the fourth conductive layer of a power module provided in an embodiment of the present invention;

[0042] Figure 8 This is a cross-sectional schematic diagram of another power module provided in an embodiment of the present invention;

[0043] Figure 9 This is a schematic diagram of the structure of the seventh conductive layer of a power module provided in an embodiment of the present invention;

[0044] Figure 10 This is a schematic diagram of the structure of the sixth heat-conducting layer of a power module provided in an embodiment of the present invention. Detailed Implementation

[0045] To enable those skilled in the art to better understand the present invention, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the scope of protection of the present invention.

[0046] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this invention are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of the invention described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover a non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0047] Based on the above-mentioned technical problems, this embodiment proposes the following solutions:

[0048] Figure 1 This is a schematic diagram of the structure of a power module provided in an embodiment of the present invention. Figure 2 This is a circuit schematic diagram of a power module provided in an embodiment of the present invention. Figure 3 This is a cross-sectional schematic diagram of a power module provided in an embodiment of the present invention. Combined with... Figures 1 to 3 The power module 100 provided in this embodiment of the invention includes a DC transmission structure 1 and at least two sub-power modules 2, wherein the at least two sub-power modules 2 are electrically connected to the DC transmission structure 1.

[0049] Specifically, the power module 100 implements AC / DC conversion and voltage boosting / pull-down functions through internal circuitry. For example, the IGBT module achieves efficient switching characteristics through gate control. The power module 100 can amplify the input signal and output large current or high voltage to drive high-power devices. The power module 100 can incorporate overcurrent, overtemperature, and short-circuit protection circuits, significantly improving the system reliability of the power module 100. The power module 100 includes at least two sub-power modules 2. The sub-power modules 2 may include power devices.

[0050] DC transmission structure 1 is the power trace for sub-power module 2. The material of DC transmission structure 1 may include conductive materials, such as copper. Power traces refer to the wire paths designed in the power module to carry large currents. DC transmission structure 1 is used to connect to the positive and / or negative terminals of the battery. DC transmission structure 1 can be used to transmit DC current signals.

[0051] At least two sub-power modules 2 are electrically connected to a DC transmission structure 1, and at least two sub-power modules 2 multiplex a DC transmission structure 1. Power module 100 may include two sub-power modules 2 or three sub-power modules 2.

[0052] For example, the power module 100 of the drive motor may include a U-phase sub-power module 2, a V-phase sub-power module 2, and a W-phase sub-power module 2. Each sub-power module 2 is a half-bridge circuit. The U-phase sub-power module 2, V-phase sub-power module 2, and W-phase sub-power module 2 together constitute a full-bridge circuit.

[0053] It is possible to configure any two or three of the U-phase sub-power modules 2, V-phase sub-power modules 2, and W-phase sub-power modules 2 to multiplex a single DC transmission structure 1. With this configuration, since the upper and lower bridge modules of the U-phase, V-phase, and W-phase sub-power modules 2 are alternately turned on, when at least two of the U-phase, V-phase, and W-phase sub-power modules 2 multiplex a single DC transmission structure 1, these at least two sub-power modules 2 can multiplex each other's DC transmission structures 1 to transmit DC current signals when they are on. The area of ​​the DC transmission structure 1 of the at least two sub-power modules 2 electrically connected to a single DC transmission structure 1 is increased. This increases the flow area of ​​the DC current signal from the at least two sub-power modules 2 electrically connected to a single DC transmission structure 1. This configuration effectively reduces the parasitic inductance of the at least two sub-power modules 2 connected to a single DC transmission structure 1.

[0054] Furthermore, since the DC current signal transmitted by the DC transmission structure 1 generates heat, by setting at least two of the U-phase sub-power modules 2, V-phase sub-power modules 2, and W-phase sub-power modules 2 to multiplex one DC transmission structure 1, the heat dissipation area of ​​the DC transmission structure 1 can be increased, thus optimizing the heat dissipation of the two sub-power modules 2 that are electrically connected to one DC transmission structure 1.

[0055] It should be noted that any two of the three sub-power modules 2 (U-phase, V-phase, and W-phase) are electrically connected to a DC transmission structure 1. Alternatively, all three sub-power modules 2 may be electrically connected to a DC transmission structure 1. The DC transmission structure 1 can be used to electrically connect to the positive terminal of the battery, or it can be used to electrically connect to both the positive and negative terminals of the battery; no limitations are imposed here.

[0056] The power module 100 provided in this embodiment includes a DC transmission structure 1 and at least two sub-power modules 2, with the DC transmission structure 1 electrically connected to the at least two sub-power modules 2. By electrically connecting the DC transmission structure 1 to the at least two sub-power modules 2, the at least two sub-power modules 2 can reuse the DC transmission structure 1. Since the upper and lower bridge modules of the three-phase sub-power modules 2 of the power module 100 are alternately turned on, when the DC transmission structure 1 is electrically connected to the at least two sub-power modules 2, the at least two sub-power modules 2 can reuse each other's DC transmission structure 1 to transmit DC current signals when they are turned on. This increases the area of ​​the DC transmission structure 1 of the at least two sub-power modules 2 sharing the same DC transmission structure 1, increases the flow area of ​​the DC current signal, effectively reduces the parasitic inductance of the power module, improves the switching efficiency of the power module 100, and reduces the switching losses of the power module 100. Furthermore, since the DC transmission structure 1 generates heat when transmitting DC current signals, by setting at least two sub-power modules 2 to reuse one DC transmission structure 1, the heat dissipation area of ​​the DC transmission structure 1 can be increased, the heat dissipation of the sub-power modules 2 can be optimized, and thus the heat dissipation of the power module 100 can be optimized.

[0057] For example, the parasitic inductance of the power module 100 provided in this embodiment is less than 1nH, which is significantly lower than the parasitic inductance of the existing power module 100.

[0058] Optionally, based on the above embodiments, further combinations can be made... Figures 1 to 3 The number of the at least two sub-power modules 2 is three, and all three sub-power modules 2 are electrically connected to the DC transmission structure 1.

[0059] Specifically, the number of at least two sub-power modules 2 is three, meaning the power module can include three sub-power modules 2. For example, the power module can include a U-phase sub-power module 2, a V-phase sub-power module 2, and a W-phase sub-power module 2. These three sub-power modules 2 are electrically connected to a DC transmission structure 1. With this configuration, the upper and lower bridge modules of the U-phase, V-phase, and W-phase sub-power modules 2 are alternately turned on. The U-phase, V-phase, and W-phase sub-power modules 2 reuse a single DC transmission structure 1. When the three sub-power modules 2 are on, they can reuse each other's DC transmission structure 1 to transmit DC current signals, thereby further increasing the area of ​​the DC transmission structure 1 of each sub-power module 2. Furthermore, the flow area of ​​the DC current signal in the power module is further increased, effectively reducing the parasitic inductance of the power module.

[0060] Furthermore, since the DC transmission structure 1 generates heat when transmitting DC current signals, by setting the U-phase sub-power module 2, V-phase sub-power module 2, and W-phase sub-power module 2 to reuse one DC transmission structure 1, the heat dissipation area of ​​the DC transmission structure 1 can be further increased, and the heat dissipation of the power module can be further optimized.

[0061] Optional, Figure 4 This is a schematic diagram of the structure of the fifth conductive layer of a power module provided in an embodiment of the present invention. Figure 5 This is a schematic diagram of the structure of the second conductive layer of a power module according to an embodiment of the present invention. Based on the above embodiments, and combined with… Figures 1 to 5 The power module 100 may include: a second conductive layer M2, at least a portion of which forms the first transmission structure 12 of the DC transmission structure 1, and the at least two sub-power modules 2 are electrically connected to the first transmission structure 12.

[0062] Specifically, the DC transmission structure 1 includes a first transmission structure 12. At least two of the sub-power modules 2 are electrically connected to the first transmission structure 12. For example, the first transmission structure 12 can be a DC transmission structure 1 electrically connected to the negative terminal (T-) of the battery. The first transmission structure 12 can transmit a first DC current signal, such as the current signal returning from the T- terminal of the battery. For example, the first transmission structure 12 can be a DC transmission structure 1 electrically connected to the positive terminal (T+) of the battery. The first transmission structure 12 can transmit a second DC current signal, such as the current signal output from the T+ terminal of the battery.

[0063] At least two sub-power modules 2 are electrically connected to the first transmission structure 12, such that when at least two sub-power modules 2 electrically connected to the same first transmission structure 12 are turned on, they can multiplex each other's first transmission structure 12 to transmit DC current signals. This increases the area of ​​the first transmission structure 12 corresponding to the at least two sub-power modules 2 that multiplex the first transmission structure 12. Furthermore, the increased flow area of ​​the DC current signal in the first transmission structure 12 effectively reduces the parasitic inductance of the sub-power modules 2. This configuration further improves the switching efficiency of the power module 100 and further reduces its switching losses.

[0064] On the other hand, since the first transmission structure 12 also generates heat when transmitting DC current signals, by setting at least two sub-power modules 2 to reuse the first transmission structure 12, the heat dissipation area of ​​the first transmission structure 12 can be increased, thereby further optimizing the heat dissipation of the power module 100.

[0065] The power module may include multiple conductive layers, for example, the power module includes a second conductive layer M2. At least a portion of the second conductive layer M2 of the power module forms a first transmission structure 12 of the DC transmission structure 1, so that the first transmission structure 12 can be arranged in the circuit board of the power module for convenient and reasonable wiring.

[0066] Optionally, based on the above embodiments, combined with Figures 1 to 5 The power module may further include: a fifth conductive layer M5, wherein the second conductive layer M2 and the fifth conductive layer M5 are disposed in layers; at least a portion of the fifth conductive layer M5 forms the second transmission structure 11 of the DC transmission structure 1, and the second transmission structure 11 is electrically connected to the at least two sub-power modules 2.

[0067] Specifically, the DC transmission structure 1 includes a second transmission structure 11. At least two of the sub-power modules 2 are electrically connected to the same second transmission structure 11. For example, the second transmission structure 11 can be a DC transmission structure 1 connected to the T+ terminal (positive terminal) of the battery. The second transmission structure 11 can transmit a second DC current signal, such as the current signal output from the T+ terminal of the battery. For example, the second transmission structure 11 can be a DC transmission structure 1 electrically connected to the T- terminal (negative terminal) of the battery. The second transmission structure 11 can transmit a first DC current signal, such as the current signal returning from the T- terminal of the battery.

[0068] It should be noted that the signals transmitted by the first transmission structure 12 and the second transmission structure 11 are different. Figures 3 to 5 As exemplarily shown, the first transmission structure 12 is used to transmit a first DC current signal, i.e., the current signal returning from the T- terminal of the battery. The second transmission structure 11 is used to transmit a second DC current signal, i.e., the current signal output from the T+ terminal of the battery, and is not limited herein.

[0069] At least two sub-power modules 2 are electrically connected to the same second transmission structure 11. When the at least two sub-power modules 2 are electrically connected to the same second transmission structure 11, they can multiplex each other's corresponding second transmission structures 11 to transmit electrical signals. This increases the area of ​​the second transmission structure 11 corresponding to the at least two sub-power modules 2 that multiplex the second transmission structure 11, thereby increasing the DC current signal flow area of ​​the second transmission structure 11. This effectively reduces the parasitic inductance of the power module, improves the switching efficiency of the power module 100, and thus reduces the switching losses of the power module 100.

[0070] On the other hand, since the second transmission structure 11 generates heat when transmitting DC current signals, by setting at least two sub-power modules 2 electrically connected to the same second transmission structure 11, the heat dissipation area of ​​the second transmission structure 11 corresponding to the at least two sub-power modules 2 electrically connected to the same second transmission structure 11 can be increased, thus optimizing the heat dissipation of the power module and thereby optimizing the heat dissipation of the power module 100.

[0071] The power module may include multiple conductive layers, for example, the power module includes a fifth conductive layer M5. At least a portion of the fifth conductive layer M5 of the power module forms the second transmission structure 11 of the DC transmission structure 1, so that the second transmission structure 11 can be arranged in the circuit board of the power module for convenient and reasonable wiring.

[0072] The second conductive layer M2 and the fifth conductive layer M5 are arranged in layers. At least a portion of the second conductive layer M2 forms the first transmission structure 12 of the DC transmission structure 1, and at least a portion of the fifth conductive layer M5 forms the second transmission structure 11 of the DC transmission structure 1. The first transmission structure 12 can be configured to transmit a first DC current signal, i.e., the current signal returning from the T- terminal of the battery; the second transmission structure 11 can be configured to transmit a second DC current signal, i.e., the current signal output from the T+ terminal of the battery. Alternatively, the first transmission structure 12 can be configured to transmit the second DC current signal, i.e., the current signal returning from the T+ terminal of the battery; and the second transmission structure 11 can be configured to transmit the first DC current signal, i.e., the current signal output from the T- terminal of the battery. The layered arrangement of the second conductive layer M2 and the fifth conductive layer M5 ensures that the first transmission structure 12 and the second transmission structure 11 are mutually insulated, facilitating the stacking of the second conductive layer M2 and the fifth conductive layer M5, thereby reducing the interference between the first transmission structure 12 and the second transmission structure 11.

[0073] An alternative implementation, based on the above embodiments, continues to refer to... Figures 1 to 5 The power module 100 includes three sub-power modules 2 extending along a first direction X. A second transmission structure 11 is connected to the first input terminals of the three sub-power modules 2, and the three sub-power modules 2 are connected to the same second transmission structure 11; and / or, a first transmission structure 12 is connected to the second input terminals of the three sub-power modules 2, and the three sub-power modules 2 are connected to the same first transmission structure 12.

[0074] Example 1: Three sub-power modules 2 are electrically connected to the same second transmission structure 11. When the three sub-power modules 2 are turned on, they can reuse their corresponding second transmission structures 11 to transmit DC current signals, thereby further increasing the area of ​​the second transmission structure 11 of the power module and the flow area of ​​the DC current signal, effectively reducing the parasitic inductance of the power module. Furthermore, since the second transmission structure 11 of the DC transmission structure 1 generates heat when transmitting DC current signals, by reusing the same second transmission structure 11 among the three sub-power modules 2, such as the U-phase sub-power module 2, V-phase sub-power module 2, and W-phase sub-power module 2, the heat dissipation area of ​​the second transmission structure 11 of the DC transmission structure 1 can be further increased, further optimizing the heat dissipation capability of the power module 2.

[0075] Example 2: Three sub-power modules 2 are electrically connected to the same first transmission structure 12. When the three sub-power modules 2 are turned on, they can reuse their corresponding first transmission structures 12 to transmit DC current signals, thereby further increasing the area of ​​the first transmission structure 12 of the power module and the flow area of ​​the DC current signal, effectively reducing the parasitic inductance of the power module. Furthermore, since the first transmission structure 12 of the DC transmission structure 1 generates heat when transmitting DC current signals, by having the three sub-power modules 2, such as the U-phase sub-power module 2, V-phase sub-power module 2, and W-phase sub-power module 2, reuse the same second transmission structure 11, the heat dissipation area of ​​the second transmission structure 11 of the DC transmission structure 1 can be further increased, further optimizing the heat dissipation capability of the power module 2.

[0076] Example 3: Three sub-power modules 2 are electrically connected to the same first transmission structure 12 and the same second transmission structure 11. This results in a larger area for both the first transmission structure 12 and the second transmission structure 11 of the power module, further increasing the flow area for DC current signals and reducing the parasitic inductance of the power module. This configuration also allows for a larger heat dissipation area for both the first transmission structure 12 and the second transmission structure 11 of the DC transmission structure 1, further improving the heat dissipation capability of the power module 2.

[0077] Optionally, based on the above embodiments, see also... Figure 3 The second conductive layer M2 and the fifth conductive layer M5 are located on both sides of the sub-power module 2.

[0078] Specifically, this arrangement allows the sub-power module 2 to be embedded between the second conductive layer M2 and the fifth conductive layer M5 of the power module's circuit board, facilitating the electrical connection of the second conductive layer M2 and the fifth conductive layer M5 with the sub-power module 2, and simplifying wiring and miniaturization design of the power module.

[0079] Another alternative implementation, based on the above embodiments, continues to refer to... Figures 1 to 5 The power module 100 may include: a first conductive layer M1; a second conductive layer M2 disposed on one side of the first conductive layer M1; a third conductive layer M3 disposed on the side of the second conductive layer M2 away from the first conductive layer M1; a fourth conductive layer M4 disposed on the side of the third conductive layer M3 away from the first conductive layer M1; a fifth conductive layer M5 disposed on the side of the fourth conductive layer M4 away from the first conductive layer M1; a second transmission structure 11 located on the fifth conductive layer M5; and a first transmission structure 12 located on the second conductive layer M2.

[0080] Specifically, each sub-power module 2 may include an upper bridge module and a lower bridge module. Each upper bridge module may include at least one power device Q. Each lower bridge module may include at least one power device Q. It should be noted that... Figure 2 As exemplarily shown, the power module includes three sub-power modules 2: a first sub-power module U, a second sub-power module V, and a third sub-power module W. The first sub-power module U has an upper bridge module Hu and a lower bridge module Lu, each comprising a power device Q1 and Q2, respectively. The second sub-power module V has an upper bridge module Hv and a lower bridge module Lv, each comprising a power device Q3 and Q4, respectively. The third sub-power module W has an upper bridge module Hw and a lower bridge module Lw, each comprising a power device Q5 and Q6, respectively. Figure 4 and Figure 5 An exemplary illustration shows a case where the upper bridge module of each sub-power module 2 includes six power devices Q connected in parallel, and the lower bridge module of each sub-power module 2 includes six power devices Q connected in parallel; no limitation is made herein.

[0081] Optional, Figure 6 This is a schematic diagram of the structure of the third conductive layer of a power module provided in an embodiment of the present invention. Figure 7 This is a schematic diagram of the structure of the fourth conductive layer of a power module provided in an embodiment of the present invention. Figure 8 This is a cross-sectional schematic diagram of another power module provided in an embodiment of the present invention. Based on the above embodiments, and in conjunction with... Figures 1 to 8 The power module includes a third conductive layer M3 and a fourth conductive layer M4, which are disposed between the second conductive layer M2 and the fifth conductive layer M5. The third conductive layer M3 includes a first through-hole K1 disposed along the third direction Z, and the fourth conductive layer M4 includes a second through-hole K2 disposed along the third direction Z. The first through-hole K1 and the second through-hole K2 are at least partially disposed opposite to each other, and at least a portion of the sub-power module 2 is disposed in the space between the first through-hole K1 and the second through-hole K2.

[0082] Specifically, at least a portion of at least one of the sub-power modules 2 is disposed in the space between the first through-hole K1 and the second through-hole K2. This arrangement facilitates embedding the sub-power module 2 into the circuit board of the power module, reducing the size of the power module. A third conductive layer M3 and a fourth conductive layer M4 are disposed between the second conductive layer M2 and the fifth conductive layer M5, such that the second conductive layer M2, which at least partially forms the first transmission structure 12, and the fifth conductive layer M5, which at least partially forms the second transmission structure 11, are located on opposite sides of the sub-power module 2. This arrangement facilitates the at least partial overlap of the projections of the second transmission structure 11 and the first transmission structure 12 along the third direction Z onto the third conductive layer M3. Since the direction of the current flowing through the second transmission structure 11 is opposite to the direction of the current flowing through the first transmission structure 12, the magnetic field generated by the current flowing through the second transmission structure 11 is opposite to the direction of the magnetic field generated by the current flowing through the first transmission structure 12. Thus, the parasitic inductance generated by the second transmission structure 11 and the parasitic inductance generated by the first transmission structure 12 are effectively canceled out, thereby reducing the parasitic inductance of the power module, improving the switching efficiency of the power module 100, and thus reducing the switching loss of the power module 100.

[0083] Another optional implementation method, based on the above embodiments, continues to combine... Figures 1 to 8 Each of the sub-power modules 2 includes an upper bridge module and a lower bridge module. The first end of the upper bridge module serves as the first input end of the sub-power module 2 and is connected to the second transmission structure 11. The second end of the upper bridge module and the first end of the lower bridge module are connected to the first node, serving as the output end of the sub-power module 2. The second end of the lower bridge module serves as the second input end of the sub-power module 2 and is connected to the first transmission structure 12.

[0084] For example, the upper bridge module can be disposed in the first intermediate region 101 between the third conductive layer M3 and the fourth conductive layer M4; the lower bridge module can be disposed in the second intermediate region 102 between the third conductive layer M3 and the fourth conductive layer M4. The second intermediate region 102 and the first intermediate region 101 refer to the middle positions of the circuit board of the sub-power module 2, not the edge positions. The second intermediate region 102 and the first intermediate region 101 extend sequentially along the second direction Y. The first direction intersects the second direction; preferably, the first direction and the second direction are perpendicular to each other.

[0085] It should be noted that, Figure 3As exemplarily shown, the first terminal, such as the drain (D), of the power device Q1 in the upper bridge module Hu of the first sub-power module U is connected to the second transmission structure 11 as the first input terminal of the first sub-power module U. The second terminal, such as the source, of the power device Q1 in the upper bridge module Hu of the first sub-power module U is connected to the first terminal, such as the drain, of the power device Q6 in the lower bridge module Hw of the third sub-power module W, serving as the output terminal of the sub-power module 2 and connected to the AC transmission structure 3. The second terminal, such as the source, of the power device Q6 in the lower bridge module Hw of the third sub-power module W serves as the second input terminal of the third sub-power module W and is connected to the first transmission structure 12. (Combined...) Figure 3 and Figure 4 The power device Q1 of the upper bridge module Hu of the first sub-power module U is disposed in the first intermediate region 101 between the third conductive layer M3 and the fourth conductive layer M4, for example, located in... Figure 4 The lower half of the first sub-power module 2U. The lower bridge module Lw of the third sub-power module W is located in the second intermediate region 102 between the third conductive layer M3 and the fourth conductive layer M4, for example, located in... Figure 4 The upper half of the third sub-power module W. The figure is merely an illustrative example and is not intended to be limiting.

[0086] Another optional implementation method, based on the above embodiments, continues to combine... Figures 1 to 5 The projection of the upper bridge module of each sub-power module 2 along the third direction Z onto the second conductive layer M2 does not overlap with the projection of the first transmission structure 12 along the third direction Z onto the second conductive layer M2. The projection of the lower bridge module of each sub-power module 2 along the third direction Z onto the second conductive layer M2 falls within the region of the projection of the first transmission structure 12 along the third direction Z onto the second conductive layer M2.

[0087] For details, see Figure 5 This design allows for a sufficiently large area of ​​the second conductive layer M2 while also providing ample wiring space for the AC transmission structure 3 connected to the upper bridge module. It should be noted that... Figure 5 As exemplarily shown, a portion of the second conductive layer M2 forms the first transmission structure 12. The first sub-power module 2U, the second sub-power module 2V, and the third sub-power module 2W are all electrically connected to the first transmission structure 12, but this is not a limitation.

[0088] Another optional implementation method, based on the above embodiments, continues to combine... Figures 1 to 5The projection of the upper bridge module along the third direction Z onto the fifth conductive layer M5 falls within the region of the projection of the second transmission structure 11 along the third direction Z onto the fifth conductive layer M5. The projection of the lower bridge module along the third direction Z onto the fifth conductive layer M5 does not overlap with the projection of the second transmission structure 11 along the third direction Z onto the fifth conductive layer M5.

[0089] For details, please refer to [link / reference]. Figure 4 This design allows for a sufficiently large area of ​​the first conductive layer M1 while also providing ample wiring space for the AC transmission structure 3 connected to the lower bridge module. It should be noted that... Figure 4 An exemplary illustration shows a second transmission structure 11 formed by the fifth conductive layer M5, in which the first sub-power module 2U, the second sub-power module 2V, and the third sub-power module 2W are all electrically connected to the second transmission structure 11. No limitation is made here.

[0090] Optionally, based on the above embodiments, see also... Figure 2 , Figure 4 and Figure 5 The power module includes an AC transmission structure 3, which is electrically connected to the output terminal of the sub-power module 2.

[0091] Specifically, the power module includes an AC transmission structure 3. The AC transmission structure 3 is connected between the output of the sub-power module 2 and the load. The load may include, for example, a motor. The AC transmission structure 3 facilitates the connection between the power module and the load, allowing the load to be driven by controlling the on / off state of the power module.

[0092] Optionally, based on the above embodiments, see also... Figure 4 and Figure 5 The AC transmission structure 3 may include a first AC transmission structure 32 and a second AC transmission structure 31. At least a portion of the second conductive layer M2 forms the first AC transmission structure 32, and at least a portion of the fifth conductive layer M5 forms the second AC transmission structure 31. Both the first AC transmission structure 32 and the second AC transmission structure 31 are electrically connected to the output terminal of the sub-power module 2.

[0093] Specifically, at least a portion of the second conductive layer M2 forms the first AC transmission structure 32, facilitating the extraction of the AC current signal from the output terminal of the sub-power module 2 through the second conductive layer M2. At least a portion of the fifth conductive layer M5 forms the second AC transmission structure 31, facilitating the extraction of the AC current signal from the output terminal of the sub-power module 2 through the fifth conductive layer M5. This arrangement saves wiring space and promotes miniaturization of the power module circuit board.

[0094] Optionally, the projection of the sub-power module 2 along the third direction Z onto the second conductive layer M2 at least partially coincides with the first AC transmission structure 32; and / or, the projection of the sub-power module 2 along the third direction Z onto the fifth conductive layer M5 at least partially coincides with the second AC transmission structure 31.

[0095] Specifically, the projection of the sub-power module 2 along the third direction Z onto the second conductive layer M2 is at least partially overlapped with the first AC transmission structure 32. This facilitates the electrical connection of the first AC transmission structure 32, which is connected to the output terminal of the sub-power module 2, to the corresponding sub-power module 2 nearby, shortening the trace length on the power module's circuit board and saving space. Similarly, the projection of the sub-power module 2 along the third direction Z onto the fifth conductive layer M5 is at least partially overlapped with the second AC transmission structure 31. This facilitates the electrical connection of the second AC transmission structure 31, which is connected to the output terminal of the sub-power module 2, to the corresponding sub-power module 2 nearby, further shortening the trace length on the power module's circuit board and further saving space.

[0096] Another alternative implementation method, based on the above embodiments, continues to refer to... Figure 2 , Figure 4 and Figure 5 The power module includes a phase copper block. A first AC transmission structure 32 is connected between the upper bridge module Hu of the first sub-power module U and the phase copper block. A second AC transmission structure 31 is connected between the phase copper block and the lower bridge module Lw of the second sub-power module W. The projection of the second AC transmission structure 31 along the third direction Z onto the fifth conductive layer M5 does not overlap with the projection of the second transmission structure 11 along the third direction Z onto the fifth conductive layer M5. The projection of the first AC transmission structure 32 along the third direction Z onto the second conductive layer M2 does not overlap with the projection of the first transmission structure 12 along the third direction Z onto the second conductive layer M2.

[0097] For details, see Figure 4 In the fifth conductive layer M5, the first sub-power module U, the second sub-power module V, and the third sub-power module W are respectively connected to the first AC transmission structure 321, which is independently configured to facilitate the output of AC current signals from each upper bridge module of the first sub-power module U, the second sub-power module V, and the third sub-power module W to the phase copper block through the corresponding first AC transmission structure 321. The load is electrically connected to the phase copper block, and the AC current signal is transmitted to the load through the phase copper block.

[0098] See Figure 5In the second conductive layer M2, the first sub-power module U, the second sub-power module V, and the third sub-power module W are respectively connected to the second AC transmission structure 312, which is independently configured. This configuration facilitates the transmission of the AC current signal returning from the load to the phase copper block to the respective lower bridge modules of the first sub-power module U, the second sub-power module V, and the third sub-power module W. The AC current signal is then transmitted to the first transmission structure 12 of the DC transmission structure 1 through the corresponding first sub-power module U, second sub-power module V, and third sub-power module W.

[0099] Optional, Figure 9 This is a schematic diagram of the structure of the seventh conductive layer of a power module according to an embodiment of the present invention. Based on the above embodiments, and in conjunction with... Figure 8 and Figure 9 The power module further includes a seventh conductive layer M7, an insulating layer between the seventh conductive layer M7 and the second conductive layer M2, and at least a portion of the seventh conductive layer M7 and the fifth conductive layer M5 together form the second transmission structure 11 of the DC transmission structure 1.

[0100] Specifically, at least a portion of the seventh conductive layer M7 and the fifth conductive layer M5 together form the second transmission structure 11 of the DC transmission structure 1, further increasing the area of ​​the second transmission structure 11, reducing the parasitic inductance of the power module, further improving the switching efficiency of the power module 100, and further optimizing the heat dissipation of the second transmission structure 11.

[0101] The seventh conductive layer M7 can be disposed on the side of the second conductive layer M2 away from the fifth conductive layer M5, such that the second conductive layer M2 is located between the fifth conductive layer M5 and the seventh conductive layer M7. Since at least a portion of the fifth conductive layer M5 and the seventh conductive layer M7 together form the second transmission structure 11, the direction of the current flowing through the second transmission structure 11 is opposite to the direction of the current flowing through the first transmission structure 12. On one hand, the overlap area of ​​the projection of the second transmission structure 11 formed by the fifth conductive layer M5 along the third direction Z onto the second conductive layer M2 and the first transmission structure 12 formed by at least a portion of the second conductive layer M2 is increased. On the other hand, the overlap area of ​​the projection of the second transmission structure 11 formed by the seventh conductive layer M7 along the third direction Z onto the second conductive layer M2 and the first transmission structure 12 formed by at least a portion of the second conductive layer M2 is significantly increased. This configuration ensures that the magnetic field generated by the DC current signal flowing through the second transmission structure 11 is opposite in direction to the magnetic field generated by the DC current signal flowing through the first transmission structure 12. This effectively cancels out the parasitic inductance generated by the second transmission structure 11 and the parasitic inductance generated by the first transmission structure 12, thereby effectively reducing the parasitic inductance of the sub-power module 2 and further reducing the switching losses of the power module 100.

[0102] In another optional implementation, based on the above embodiments and continuing to refer to 8, at least a portion of the seventh conductive layer M7 and the fifth conductive layer M5 together form the second transmission structure 11 of the DC transmission structure 1; the second transmission structure 11 is connected to the first input terminal of at least two phases of the sub-power module 2, and the at least two phases of the sub-power module 2 reuse the second transmission structure 11 connected to the first input terminal of the sub-power module 2.

[0103] Specifically, this configuration increases the overlap area between the second transmission structure 11 and the first transmission structure 12. On one hand, it further increases the area of ​​the second transmission structure 11, reduces the parasitic inductance of the sub-power module 2, further improves the switching efficiency of the power module 100, and further optimizes the heat dissipation of the second transmission structure 11. On the other hand, the direction of the current flowing through the second transmission structure 11 is opposite to the direction of the current flowing through the first transmission structure 12. The overlap area of ​​the projections of the second transmission structure 11 and the first transmission structure 12 in the horizontal direction is significantly increased, so that the magnetic field generated by the current flowing through the second transmission structure 11 is opposite to the direction of the magnetic field generated by the current flowing through the first transmission structure 12. This effectively cancels out the parasitic inductance generated by the second transmission structure 11 and the first transmission structure 12, further reducing the parasitic inductance of the sub-power module 2, and thus reducing the switching losses of the power module 100.

[0104] Another alternative implementation method, based on the above embodiments, continues to refer to... Figure 4 and Figure 5 The power module 2 further includes: a connection terminal 4, which is connected to the DC transmission structure 1; at least two sub-power modules 2 electrically connected to a DC transmission structure 1 share the connection terminal 4.

[0105] Specifically, connection terminal 4 refers to the connection terminal on the power module 100 used to connect the positive and negative terminals of the battery. At least two sub-power modules 2 electrically connected to the same DC transmission structure 1 share connection terminal 4, allowing each sub-power module 2 to transmit its corresponding DC current signal via connection terminal 4. This configuration widens the current flow cross-sectional area of ​​connection terminal 4, further reduces the parasitic inductance of connection terminal 4, and further optimizes the heat dissipation of the power module 100.

[0106] Another alternative implementation method, based on the above embodiments, continues to refer to... Figure 4 and Figure 5The connection terminal 4 includes at least one T-connection terminal 42 and at least one T+connection terminal 41; the T-connection terminal 42 is connected to the first transmission structure 12, and the T+connection terminal 41 is connected to the second transmission structure 11; at least two sub-power modules 2 electrically connected to the same second transmission structure 11 reuse the T+connection terminal 41; at least two sub-power modules 2 electrically connected to the same first transmission structure 12 reuse the T-connection terminal 42.

[0107] Specifically, this configuration widens the current flow cross-sectional area of ​​the T+ connection terminal 41, further reducing the parasitic inductance of the T+ connection terminal 41 and further optimizing the heat dissipation of the power module 100. By configuring at least two sub-power modules 2 electrically connected to the same first transmission structure 12 to reuse the T- connection terminal 42, the current flow cross-sectional area of ​​the T- connection terminal 42 is widened, further reducing the parasitic inductance of the T- connection terminal 42 and further optimizing the heat dissipation of the power module 100.

[0108] It should be noted that, please continue to refer to Figure 8 TK1 is the first via, used to connect to connection terminal 4, for example, to connection terminal 41 (T+). TK2 is the second via, used to connect to connection terminal 4, for example, to connection terminal 42 (T-). DK2 is the third via, used to connect to the copper block. DK1 is the fourth via, and a conductive block, such as a copper block, can be placed inside DK1 to electrically connect the second transmission structure 11 of the DC transmission structure 1 formed by the fifth conductive layer M5 and the second transmission structure 11 of the DC transmission structure 1 formed by the seventh conductive layer M7, thereby jointly forming the second transmission structure 11.

[0109] Optionally, based on the above embodiments, see also... Figure 3 The power module may further include: a first conductive layer M1, which is located on the side of the second conductive layer M2 away from the sub-power module 2; and at least one capacitor C, which is electrically connected to the first conductive layer M1.

[0110] Specifically, the capacitor C electrically connected to the first conductive layer M1 of the power module 100 is an absorption capacitor C. The capacitor C can be connected to the power device Q of the sub-power module 2 through a laser aperture. This configuration further reduces the parasitic inductance of the power module 100. For example, the parasitic inductance of the power module 100 provided in this embodiment is less than or equal to 1nH when the capacitor C is not provided. When the capacitor C is provided, the parasitic capacitance C of the power module 100 provided in this embodiment is less than or equal to 0.5nH.

[0111] Optional, Figure 10This is a schematic diagram of the sixth heat-conducting layer of a power module according to an embodiment of the present invention. Based on the above embodiments, see... Figure 10 The power module may further include a sixth thermal conductive layer M6, which is disposed on the side of the fifth conductive layer M5 away from the sub-power module 2, and is used to connect the heat dissipation module.

[0112] Specifically, the sixth thermal conductive layer M6 is a single layer of copper. The sixth thermal conductive layer M6 can be connected to the heat dissipation module by soldering or sintering.

[0113] In another optional implementation, based on the above embodiments, the power module may further include: an interlayer insulating layer disposed between adjacent conductive layers, the interlayer insulating layer serving an insulating function.

[0114] Specifically, the interlayer insulating layer between the first conductive layer M1 and the fifth conductive layer M5 is made of resin. The interlayer insulating layer between the fifth conductive layer M5 and the sixth thermally conductive layer M6 can be made of insulating material.

[0115] This embodiment provides a motor controller, including the power module proposed in any of the above embodiments, and has the beneficial effects of the power module proposed in any of the above embodiments, which will not be repeated here.

[0116] This embodiment provides an electric drive assembly, including the power module proposed in any of the above embodiments and / or the motor controller provided in any of the above embodiments, which has the beneficial effects of the power module proposed in any of the above embodiments, and will not be repeated here.

[0117] This embodiment provides a vehicle including the power module proposed in any of the above embodiments and / or the motor controller and / or the electric drive assembly provided in any of the above embodiments, which has the beneficial effects of the power module proposed in any of the above embodiments, and will not be repeated here.

[0118] The following are the previously applied proposals:

[0119] This invention provides a power module, comprising:

[0120] At least two electrode layers;

[0121] At least two-phase power units, wherein the power units are connected to the electrode layer;

[0122] At least two of the power units share at least one electrode layer.

[0123] Optionally, the electrode layer includes at least one first electrode layer;

[0124] The first electrode layer is connected to the first input terminal of at least two phase power units.

[0125] Optionally, the electrode layer includes at least one second electrode layer;

[0126] The second electrode layer is connected to the second input terminal of at least two phases of the power unit.

[0127] Optionally, the power module includes a three-phase power unit extending along a first direction;

[0128] The first electrode layer is connected to the first input terminal of the three-phase power unit, and the three-phase power units share the first electrode layer.

[0129] And / or, the second electrode layer is connected to the second input terminal of the three-phase power unit, and the three-phase power units share the second electrode layer.

[0130] Optionally, the power module includes:

[0131] First conductive layer;

[0132] A second conductive layer is disposed on one side of the first conductive layer;

[0133] A third conductive layer is disposed on the side of the second conductive layer away from the first conductive layer;

[0134] A fourth conductive layer is disposed on the side of the third conductive layer away from the first conductive layer;

[0135] The fifth conductive layer is disposed on the side of the fourth conductive layer away from the first conductive layer;

[0136] The first electrode layer is located on the fifth conductive layer, and the second electrode layer is located on the second conductive layer.

[0137] Optionally, each phase of the power unit includes:

[0138] First bridge arm and second bridge arm, the first end of the first bridge arm is connected to the first electrode layer as the first input terminal of the power unit;

[0139] The second end of the first bridge arm is connected to the first end of the second bridge arm at the first node, serving as the output end of the power unit;

[0140] The second end of the second bridge arm is connected to the second electrode layer as the second input terminal of the power unit;

[0141] The first bridge arm is disposed in a first intermediate region between the third conductive layer and the fourth conductive layer; the second bridge arm is disposed in a second intermediate region between the third conductive layer and the fourth conductive layer.

[0142] Optionally, the orthographic projection of the first bridge arm onto the second conductive layer does not overlap with the orthographic projection of the second electrode layer onto the second conductive layer; the orthographic projection of the second bridge arm onto the second conductive layer falls within the region of the orthographic projection of the second electrode layer onto the second conductive layer.

[0143] The orthographic projection of the first bridge arm on the fifth conductive layer falls within the region of the orthographic projection of the first electrode layer on the fifth conductive layer; the orthographic projection of the second bridge arm on the fifth conductive layer does not overlap with the orthographic projection of the first electrode layer on the fifth conductive layer.

[0144] Optionally, the first arm of each power unit includes at least one first power device, and the second arm of each power unit includes at least one second power device;

[0145] When the first bridge arm of each power unit includes at least two first power devices, the first power devices of each power unit are connected in parallel.

[0146] When the second bridge arm of each power unit includes at least two second power devices, each of the second power devices in each power unit is connected in parallel.

[0147] Optionally, each power unit further includes a phase trace, which is disposed on the second conductive layer and the fifth conductive layer respectively;

[0148] The power module also includes a phase copper block, the phase trace is connected to the phase copper block at the first node, and the phase copper block is disposed on the third conductive layer and the fourth conductive layer.

[0149] Optionally, the phase trace includes a first phase trace and a second phase trace, wherein the first phase trace is located in the fifth conductive layer and the second phase trace is located in the second conductive layer;

[0150] The first phase trace is connected between the first bridge arm and the phase copper block, and the second phase trace is connected between the phase copper block and the second bridge arm;

[0151] The orthogonal projection of the first phase trace on the fifth conductive layer does not overlap with the orthogonal projection of the first electrode layer on the fifth conductive layer;

[0152] The orthographic projection of the second phase trace onto the second conductive layer does not overlap with the orthographic projection of the second electrode layer onto the second conductive layer.

[0153] Optionally, the electrode layer includes two layers of the first electrode layer;

[0154] At least one of the two first electrode layers is connected to the first input terminal of at least two phases of the power unit, and the at least two phases of the power unit share the first electrode layer connected to the first input terminal of the power unit.

[0155] Optionally, each of the power units further includes:

[0156] The connection end is connected to the electrode layer;

[0157] The two-phase power units that share at least one electrode layer share the connection terminal.

[0158] Optionally, the connection end includes:

[0159] At least one T-connector and at least one T+connector;

[0160] The T- connection terminal is connected to the second electrode layer, and the T+ connection terminal is connected to the first electrode layer;

[0161] At least two phase power units sharing the first electrode layer share the T+ connection terminal;

[0162] At least two phase power units sharing the second electrode layer share the T-connection terminal.

[0163] Optionally, the power module further includes:

[0164] A seventh conductive layer is located between the first conductive layer and the second conductive layer;

[0165] The two first electrode layers include a first first electrode layer and a second first electrode layer;

[0166] The first first electrode layer is located in the seventh conductive layer; the second first electrode layer is located in the fifth conductive layer.

[0167] Optionally, the power module includes:

[0168] First power unit, second power unit, and third power unit;

[0169] The first electrode layer of the first power unit is reused in the same layer as the first electrode of the second power unit and the first electrode of the third power unit.

[0170] The second electrode layer of the first power unit is reused in the same layer as the second electrode of the second power unit and the second electrode of the third power unit;

[0171] The T+ connection terminal of the first power unit is multiplexed with the T+ connection terminal of the second power unit and the T+ connection terminal of the third power unit;

[0172] The T-connection terminal of the first power unit is multiplexed with the T-connection terminal of the second power unit and the T-connection terminal of the third power unit.

[0173] Optionally, each power unit further includes at least one capacitor located in the first conductive layer, the capacitor being connected in parallel with the power element of the power unit through a laser aperture.

[0174] Optionally, the power module further includes:

[0175] A sixth conductive layer is disposed on the side of the fifth conductive layer away from the first conductive layer, and the sixth conductive layer is used to connect an external heat dissipation module.

[0176] Optionally, the power module further includes:

[0177] An interlayer insulating layer is disposed between adjacent conductive layers on both sides, and the interlayer insulating layer serves an insulating function.

[0178] According to another aspect of the present invention, this embodiment provides a motor controller, including the power module proposed in any of the above embodiments.

[0179] According to another aspect of the present invention, this embodiment provides an electric drive assembly including the power module proposed in any of the above embodiments.

[0180] According to another aspect of the present invention, this embodiment provides a vehicle including the power module proposed in any of the above embodiments.

[0181] Note: The terminology correspondence between later and earlier applications is as follows: the sub-power module in the later application corresponds to the power unit in the earlier application. The DC transmission structure in the later application corresponds to the electrode layer in the earlier application. The AC transmission structure in the later application corresponds to the phase trace in the earlier application. The sixth thermal conductive layer in the later application corresponds to the sixth conductive layer in the earlier application.

[0182] Note that the above description is merely a preferred embodiment of the present invention and the technical principles employed. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described herein, and various obvious changes, readjustments, and substitutions can be made without departing from the scope of protection of the present invention. Therefore, although the present invention has been described in detail through the above embodiments, the present invention is not limited to the above embodiments, and may include many other equivalent embodiments without departing from the concept of the present invention, the scope of which is determined by the scope of the appended claims.

Claims

1. A power module, characterized in that, include: A DC transmission structure; At least two sub-power modules, which are electrically connected to the DC transmission structure.

2. The power module according to claim 1, characterized in that, The number of the at least two sub-power modules is three, and all three sub-power modules are electrically connected to the DC transmission structure.

3. The power module according to any one of claims 1 or 2, characterized in that, The power module includes: A second conductive layer, at least a portion of which forms the first transmission structure of the DC transmission structure, wherein the at least two sub-power modules are electrically connected to the first transmission structure.

4. The power module according to claim 3, characterized in that, The power module also includes: The fifth conductive layer is provided in layers with the second conductive layer and the fifth conductive layer. At least a portion of the fifth conductive layer forms the second transmission structure of the DC transmission structure, and the at least two sub-power modules are electrically connected to the second transmission structure.

5. The power module according to claim 4, characterized in that, The second conductive layer and the fifth conductive layer are located on both sides of the sub-power module.

6. The power module according to claim 4 or 5, characterized in that, The power module also includes: A seventh conductive layer is provided between the seventh conductive layer and the second conductive layer, and at least a portion of the seventh conductive layer and the fifth conductive layer together form the second transmission structure of the DC transmission structure.

7. The power module according to any one of claims 4-6, characterized in that, The power module also includes: A first conductive layer is located on the side of the second conductive layer away from the sub-power module; At least one capacitor, wherein the at least one capacitor is electrically connected to the first conductive layer.

8. The power module according to any one of claims 4-7, characterized in that, The power module also includes: A sixth thermal conductive layer is disposed on the side of the fifth conductive layer away from the sub-power module, and the sixth thermal conductive layer is used to connect the heat dissipation module.

9. The power module according to any one of claims 4-8, characterized in that, The power module includes: A third conductive layer and a fourth conductive layer are disposed between the second conductive layer and the fifth conductive layer; The third conductive layer includes a first through-hole disposed along a third direction, and the fourth conductive layer includes a second through-hole disposed along a third direction. The first through-hole and the second through-hole are at least partially disposed opposite each other, and at least a portion of at least one of the sub-power modules is disposed in the space between the first through-hole and the second through-hole.

10. The power module according to any one of claims 4-9, characterized in that, The power module includes an AC transmission structure, which is electrically connected to the output terminal of the sub-power module.

11. The power module according to claim 10, characterized in that, The AC transmission structure includes a first AC transmission structure and a second AC transmission structure. At least a portion of the second conductive layer forms the first AC transmission structure, and at least a portion of the fifth conductive layer forms the second AC transmission structure. Both the first AC transmission structure and the second AC transmission structure are electrically connected to the output terminal of the sub-power module.

12. The power module according to claim 11, characterized in that, The projection of the sub-power module onto the second conductive layer along a third direction at least partially coincides with the first AC transmission structure; and / or, the projection of the sub-power module onto the fifth conductive layer along a third direction at least partially coincides with the second AC transmission structure.

13. A motor controller, characterized in that, Includes the power module as described in any one of claims 1 to 12.

14. An electric drive assembly, characterized in that, Includes the power module as described in any one of claims 1 to 12 and / or the motor controller as described in claim 13.

15. A vehicle, characterized in that, Includes the power module according to any one of claims 1 to 12 and / or the motor controller according to claim 13 and / or the electric drive assembly according to claim 14.

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