Highly integrated inverter brick base and inverter brick assembly

Abstract

The application relates to the technical field of vehicle power systems, and discloses a high-integration inverter brick base and an inverter brick assembly, which comprise a power module metal heat dissipation water channel, an injection molding seat body, a negative copper bar, a first positive copper bar, a second positive copper bar and a filter magnetic ring; the power module metal heat dissipation water channel, the negative copper bar, the first positive copper bar and the second positive copper bar are fixedly connected through injection molding of an injection molding die and a matching injection molding seat body, and form the high-integration inverter brick base; the high-integration inverter brick base comprises a direct-current high-voltage interface, a heat dissipation water inlet, a fuse mounting interface, a direct-current high-voltage output interface, a driving plate mounting stud, a bus capacitor copper bar mounting hole, a power module mounting cavity and a heat dissipation water outlet; the filter magnetic ring is sleeved and fixed on the two copper bars of the direct-current high-voltage interface; the inverter brick base is made of die-casting aluminum and injection molding composite structure; the integration degree is significantly improved, the overall size of the inverter brick assembly is reduced, the amount of die-casting material is smaller, and the cost is lower.

Description

Technical Field

[0001] This invention relates to the field of vehicle powertrain technology, and in particular to a highly integrated inverter brick base and inverter brick assembly. Background Technology

[0002] As competition in the new energy vehicle market intensifies, the demands for miniaturization, lightweighting, and low cost in electric drive assemblies are increasing. Integrated component design is an effective way to achieve these requirements. At the electric drive assembly level, the electronic control system can be designed as an inverter brick, with its housing integrated with the housings of the motor and reducer, saving space and material usage in the assembly housing. In this case, the base of the inverter brick bears the responsibility of installing and supporting devices such as power modules, capacitors, circuit boards, and filters. Furthermore, the internal circuit structure of the inverter brick needs to be designed reasonably to complete the transmission path of electrical energy from the battery to the power module.

[0003] The design of inverter brick bases involves two types of materials: die-cast aluminum alloys are the most commonly used metal materials, while injection-molded materials such as PPS (polyphenylene sulfide) and PA66 (nylon 66) are commonly used non-metal materials. Comparing the two types of materials, aluminum alloys have higher strength and rigidity, and can achieve high dimensional accuracy through machining. After tapping, they can be used to form nuts and screws to install other components. Injection-molded materials have good fluidity and can be processed through injection molding. Utilizing their insulating properties, they can be used to make injection-molded busbars, bus capacitors, and filter housings. However, injection-molded materials have lower strength, and the dimensional accuracy after injection molding is not as good as that of machined materials. In addition, there are tiny voids inside the material, which pose a risk of insufficient sealing and coolant leakage when sealing with power modules.

[0004] Chinese patent application publication number CN121711972A discloses a motor controller, a drive assembly, and a vehicle, including a cooling component, a capacitor, a first power module, and a second power module. The cooling component has an accommodating space, the capacitor is disposed within the accommodating space, the first power module is disposed on one side of the cooling component along a first direction, and the second power module is disposed on the other side of the cooling component along the first direction. The cooling component has a first flow channel and a second flow channel for transporting coolant. The first flow channel is located between the first power module and the capacitor, and the second flow channel is located between the second power module and the capacitor. Both the first and second flow channels extend along a second direction, which is perpendicular to the first direction. The inverter base in this application is made entirely of metal, resulting in heavy weight and high cost.

[0005] Chinese patent application publication number CN121566882A discloses a dual-motor controller inverter assembly, an electric drive assembly, and a vehicle, comprising: an electric drive housing with a groove having an upper opening; a heat dissipation module, which is a plate-like structure placed within the groove, and has two transversely spaced receiving slots; a heat dissipation plate at the bottom of each receiving slot; a capacitor module located below the heat dissipation module and tightly fitted to the lower end face of the heat dissipation plate; two sets of power modules, each set consisting of multiple power modules arranged in parallel along the longitudinal direction, and electrically connected to the capacitor module; and a circuit board fixed to the power modules, the circuit board covering the groove opening. The base of this application is made entirely of injection-molded material, which has weak rigidity and thermal conductivity.

[0006] Therefore, using any one of the aforementioned materials alone cannot effectively achieve an integrated, lightweight, and low-cost inverter brick base. Summary of the Invention

[0007] To address the aforementioned issues, this invention provides a highly integrated inverter brick base and inverter brick assembly. The inverter brick base is manufactured using a composite structure of die-cast aluminum and injection molding. Compared to traditional pure aluminum alloy bases, this inverter brick base eliminates the need for separate capacitor, filter, and injection-molded copper busbar structures, significantly improving integration and reducing the overall size of the inverter brick assembly. Furthermore, it requires less die-casting material, resulting in lower costs. The one-time injection molding structure also saves on the original assembly process, reducing assembly costs.

[0008] This invention provides a highly integrated inverter brick base, including a power module metal heat dissipation channel, an injection molded base, a negative copper busbar, a first positive copper busbar, a second positive copper busbar, and a filter magnetic ring;

[0009] The power module's metal heat dissipation channel, negative copper busbar, first positive copper busbar, and second positive copper busbar are fixedly connected to the matching injection molded base through injection molding, forming a highly integrated inverter brick base.

[0010] The highly integrated inverter brick base includes a DC high-voltage interface, a heat dissipation water inlet, a fuse mounting interface, a DC high-voltage output interface, driver board mounting studs, bus capacitor copper bus mounting holes, a power module mounting cavity, and a heat dissipation water outlet. The filter magnetic ring is sleeved and fixed on the two copper busbars of the DC high-voltage interface. The inverter brick base integrates the mounting structure of components such as the power module and driver board, the bus capacitor shell, the filter shell, the positive and negative copper busbars, and the heat dissipation channels. Compared with the traditional pure aluminum alloy base, the integration is significantly improved, the overall size of the inverter brick assembly is reduced, and the amount of die-casting material used is smaller, resulting in lower costs. The one-time injection molding structure also saves the original assembly steps and reduces assembly costs.

[0011] The power module metal cooling channel is a hollow rectangular cavity structure. The upper end face of the cavity has a first power module fitting port and a second power module fitting port, forming two power module mounting cavities longitudinally. The left and right side walls of the hollow rectangular cavity structure are integrally connected to a cooling water outlet and a cooling water inlet, respectively. The cooling water outlet, the cooling water inlet, and the hollow rectangular cavity structure together form the cooling channel. The first power module and the second power module are respectively fitted and sealed at the first power module fitting port and the second power module fitting port. Coolant is introduced through the cooling water inlet, flows through the power module metal cooling channel cavity around the second power module, flows to the power module metal cooling channel cavity where the first power module is housed, and finally flows out through the cooling water outlet, completing the cooling of the first power module and the second power module.

[0012] The inner bottom wall of the power module metal cooling channel has a recessed rectangular groove with a two-stage stepped structure corresponding to the area adjacent to the first and second power module fitting ports. Each side wall of the upper rectangular groove of the two-stage stepped structure is a sloping surface that slopes from the outside to the inside. The purpose of this recessed rectangular groove with a two-stage stepped structure is to slow down the flow rate of the coolant between the first and second power modules, so as to make the heat exchange between the coolant and the second power module more complete. The inner bottom wall of the power module metal cooling channel has a left-end water outlet recessed groove near the left side wall and a right-end water inlet recessed groove near the right side wall. The heat dissipation water outlet and heat dissipation water inlet are respectively aligned and connected to the left-end water outlet recessed groove and the right-end water inlet recessed groove, further slowing down the flow rate of the coolant in the hollow rectangular cavity structure of the power module metal cooling channel and increasing the heat exchange time between the coolant and the first and second power modules.

[0013] The inner pipe walls of both the heat dissipation outlet and the heat dissipation inlet are two-stage stepped inner pipe wall structures with a larger inner diameter at the outer end and a smaller inner diameter at the inner end. This design of the inner pipe wall structure of the heat dissipation outlet and the heat dissipation inlet can increase the flow velocity at the pipe opening, enhance the heat dissipation effect, generate local throttling, build up pressure, prevent cavitation / air blockage, adapt to interface size, and reduce the risk of leakage.

[0014] The upper end face of the metal heat dissipation channel of the power module at the outer edge of the first power module fitting port and the second power module fitting port is respectively provided with annular connecting protrusions. Each annular connecting protrusion has a sealing ring groove circumferentially provided on the upper end face of its upper end face. The first power module and the second power module are aligned and matched and placed into the first power module fitting port and the second power module fitting port and accommodated in the cavity of the metal heat dissipation channel of the power module. The first power module and the second power module are aligned, limited and fixed at the upper end face of the annular connecting protrusion of the first power module fitting port and the annular connecting protrusion of the second power module fitting port, and are sealed and fixed by the sealing ring and the aligned sealing ring groove.

[0015] The power module's metal heat dissipation channel has horizontally extending injection molding connecting edges on both sides of its upper end face. The power module's metal heat dissipation channel is matched and set at the corresponding position of the injection molding base, and is fixedly connected to the injection molding base by injection molding through the injection molding connecting edges on both sides.

[0016] The lower end face of the power module metal heat dissipation channel has a rectangular heat dissipation groove on the outer edge of the bottom surface of the recessed rectangular groove corresponding to the two-stage stepped structure. The bottom of the rectangular heat dissipation groove is provided with a grid-like heat dissipation reinforcing rib. The left and right sides of the upper end face of the power module metal heat dissipation channel are also provided with the first mounting studs of the drive board. The left side of the upper end face of the power module metal heat dissipation channel is provided with the inverter brick positioning pin. The outer wall of the heat dissipation water inlet on the right side of the upper end face of the power module metal heat dissipation channel is horizontally extended with the inverter brick fixing point. Designing the positioning pin on the metal heat dissipation channel is beneficial to utilizing the dimensional accuracy after metal processing to ensure the installation accuracy of the inverter brick. The drive board and the inverter brick fixing point are distributed on the aluminum alloy heat dissipation channel and the injection molded base according to the projection position of the aluminum alloy heat dissipation channel and the injection molded base, and jointly undertake the installation and fixing task of the inverter brick and the drive board. The grid-like heat dissipation reinforcing rib is designed on the back of the power module metal heat dissipation channel. The power module metal heat dissipation channel and the injection molded base are not covered with plastic during injection molding, which can provide heat dissipation for the bus capacitor.

[0017] The injection-molded housing includes a mounting panel for the module and drive board, a bus capacitor housing, a filter housing, and positive and negative copper busbar mounting areas. The bus capacitor housing is located on the lower end face of the mounting panel for the module and drive board. The filter housing is located on the lower end face of the mounting panel for the module and drive board, adjacent to the right side wall of the bus capacitor housing. The positive and negative copper busbar mounting areas are located on the right side of the upper end face of the mounting panel for the module and drive board. The negative copper busbar, the first positive copper busbar, and the second positive copper busbar are matched and fixed in the positive and negative copper busbar mounting areas. The upper end face of the power module metal heat dissipation channel is injection-molded and embedded in the upper end face of the mounting panel for the module and drive board. The rectangular cavity structure at the lower part of the power module metal heat dissipation channel is housed within the bus capacitor housing. The end of the heat dissipation outlet pipe at the left end of the power module metal heat dissipation channel is exposed on the bus capacitor housing. On the left side wall of the line capacitor casing, the outer circumferential outer wall of the heat dissipation inlet of the power module metal heat dissipation channel is sandwiched between the aligned filter casing and the positive and negative copper busbar mounting area. The right end of the heat dissipation inlet is exposed on the right side wall of the bus capacitor casing. The lower end of the heat dissipation inlet has a protruding internally threaded cylinder corresponding to the position of the filter casing. The internally threaded cylinder is housed in the filter casing. The filter PCB board is tightened onto the internally threaded cylinder with bolts to form a ground connection. The injection-molded base is the basic part that fixes the aluminum alloy heat dissipation channel and other base sub-components (nuts, bushings, copper busbars) into a whole. Before injection molding, other components are pre-installed in the mold. After injection molding, the filter magnetic ring is then assembled and glued to fix it, thus completing the manufacturing process of the base.

[0018] The upper surface of the mounting panel of the module and the driver board is provided with a second mounting stud of the driver board along its circumferential edge. The first mounting stud of the driver board and the second mounting stud of the driver board together constitute the mounting stud of the driver board. The upper surface of the mounting panel of the module and the driver board is provided with a bus capacitor copper bus mounting hole. The overall housing of the bus capacitor is a rectangular cylindrical structure. The inner side wall of the bus capacitor housing, the lower surface of the mounting panel of the module and the driver board, and the lower surface of the metal heat dissipation channel of the power module together constitute the potting groove of the bus capacitor. The negative copper bus, the first positive copper bus, and the second positive copper bus are respectively limited and fixed in the positive and negative copper bus mounting areas. The positive and negative copper bus mounting areas are respectively injection molded to form a DC high voltage interface, a fuse mounting interface, and a DC high voltage output interface.

[0019] An inverter brick assembly includes a filter capacitor assembly, a bus capacitor, a first power module, a second power module, and a fuse. It also includes a highly integrated inverter brick base. The lower end of the injection-molded base has a filter magnetic ring mounting groove corresponding to the DC high-voltage interface position. The filter magnetic ring is housed in the groove and aligned with the copper pins of the negative copper busbar and the first positive copper busbar corresponding to the DC high-voltage interface. The PCB board of the filter capacitor assembly is bolted to the filter housing and connected to the internally threaded cylindrical heat sink of the power module via bolts to form a ground connection. The PCB board of the filter capacitor assembly is welded to the aligned copper pins of the negative and first positive copper busbars to complete the positive and negative connection. The components are in PCB board form. XY capacitors (safety capacitors) are soldered and fixed on the PCB board. Filter capacitors with different capacitance values ​​and functions are soldered on the PCB board, which can be adjusted and matched according to electromagnetic compatibility requirements in actual use. The bus capacitor is housed in a bus capacitor potting groove and encapsulated with polyurethane (PU) potting compound. The copper busbars of the bus capacitors are exposed outside the mounting holes. The first power module and the second power module are respectively matched and embedded in the first power module fitting port and the second power module fitting port, and are sealed and fixed by bolts and aligned annular connecting convex rings. The fuse is electrically connected to the fuse mounting interface. Then, subsequent circuit board assembly and testing processes can be carried out.

[0020] Beneficial effects

[0021] This invention uses a composite structure of die-cast aluminum and injection molding to make the inverter brick base. Compared with the traditional pure aluminum alloy base, this inverter brick base does not require the design of separate capacitors, filters, and injection-molded copper busbar structures, which significantly improves the integration and reduces the overall size of the inverter brick assembly. In addition, the amount of die-casting material used is smaller, resulting in lower cost. The one-time injection molding structure also saves the original assembly process and reduces assembly costs. Attached Figure Description

[0022] Figure 1 This is a schematic diagram of the overall front structure of the highly integrated inverter brick base of the present invention.

[0023] Figure 2 This is an exploded structural diagram of the highly integrated inverter brick base of the present invention.

[0024] Figure 3 This is a schematic diagram of the overall reverse structure of the highly integrated inverter brick base of the present invention.

[0025] Figure 4 This is a three-dimensional structural diagram of the front of the metal heat dissipation channel of the power module of the present invention.

[0026] Figure 5 This is a three-dimensional structural diagram of the reverse side of the metal heat dissipation channel of the power module of the present invention.

[0027] Figure 6 This is a partial cross-sectional view of the front of the metal heat dissipation channel of the power module of the present invention.

[0028] Figure 7 This is a top-view structural diagram of the highly integrated inverter brick base of the present invention.

[0029] Figure 8 This is a schematic diagram of the three-dimensional structure of the injection molded base of the present invention.

[0030] Figure 9 This is a partial cross-sectional view of the side of the metal heat dissipation channel of the power module of the present invention.

[0031] Figure 10 This is a partially enlarged structural diagram of the positive and negative copper busbar installation area of ​​the present invention.

[0032] Figure 11 yes Figure 3 A schematic diagram of a partial cross-sectional structure.

[0033] Figure 12 This is a schematic diagram of the overall assembly structure of the inverter brick assembly of the present invention.

[0034] In the picture:

[0035] 1. Metal heat dissipation channels for power modules;

[0036] 1.1, First power module mating port);

[0037] 1.2, Second power module mating port;

[0038] 1.3, Cooling water outlet;

[0039] 1.4. Cooling water inlet pipe;

[0040] 1.5. A recessed rectangular groove with a two-stage stepped structure;

[0041] 1.5.1 Sloping surface;

[0042] 1.6. Left end water outlet sinking tank;

[0043] 1.7. Right-end water inlet sinkhole;

[0044] 1.8 Annular connecting convex ring;

[0045] 1.9 Sealing ring groove;

[0046] 1.10 Injection molding joint edge;

[0047] 1.11 Rectangular heat dissipation groove;

[0048] 1.12. Mesh-shaped heat dissipation reinforcing ribs;

[0049] 1.13, First mounting stud of the drive board;

[0050] 1.14. Inverter brick positioning pin;

[0051] 1.15. Inverter brick fixing point;

[0052] 1.16. Cylinder with internal thread;

[0053] 2. Injection molded base;

[0054] 2.1 Mounting panel for modules and driver boards;

[0055] 2.1.1 Second mounting stud of the drive board;

[0056] 2.1.2 Busbar capacitor copper busbar mounting holes;

[0057] 2.2 Bus capacitor casing;

[0058] 2.2.1 Busbar capacitor potting tank;

[0059] 2.3 Filter housing;

[0060] 2.4 Positive and negative copper busbar installation area;

[0061] 2.4.1 DC high-voltage interface;

[0062] 2.4.2 Fuse installation interface;

[0063] 2.4.3 DC high voltage output interface;

[0064] 2.5 Filter magnetic ring mounting slot;

[0065] 3. Negative electrode copper busbar;

[0066] 4. First positive electrode copper busbar;

[0067] 5. Second positive electrode copper busbar;

[0068] 6. Filter magnetic ring;

[0069] 7. Filter capacitor assembly;

[0070] 8. Bus capacitor;

[0071] 9. First power module;

[0072] 10. Second power module;

[0073] 11. Fuse. Detailed Implementation

[0074] To make the technical problems solved by the present invention, the technical solutions adopted, and the technical effects achieved clearer, the technical solutions of the present invention will be further described below in conjunction with the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are merely for explaining the present invention and are not intended to limit the present invention. Furthermore, it should be noted that, for ease of description, only the parts related to the present invention are shown in the accompanying drawings, not all of them.

[0075] In the description of this invention, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing the invention and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. The terms "first position" and "second position" refer to two different positions.

[0076] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to fixed connections or detachable connections; mechanical connections or electrical connections; direct connections or indirect connections through an intermediate medium; and internal connections between two components. Those skilled in the art can understand the specific meaning of these terms in this invention based on the specific circumstances.

[0077] Example 1

[0078] See Figures 1-11 As shown, a highly integrated inverter brick base includes a power module metal heat dissipation channel 1, an injection molded base body 2, a negative copper busbar 3, a first positive copper busbar 4, a second positive copper busbar 5, and a filter magnetic ring 6.

[0079] The power module metal heat dissipation channel 1, negative copper busbar 3, first positive copper busbar 4 and second positive copper busbar 5 are respectively fixedly connected to the matching injection molded base 2 through injection molding through injection mold, forming a high-integration inverter brick base.

[0080] The highly integrated inverter brick base includes a DC high-voltage interface, a heat dissipation water inlet, a fuse mounting interface, a DC high-voltage output interface, driver board mounting studs, bus capacitor copper bus mounting holes, a power module mounting cavity, and a heat dissipation water outlet. The filter magnetic ring 6 is sleeved and fixed on the two copper busbars of the DC high-voltage interface. The inverter brick base integrates the mounting structure of components such as the power module and driver board, the bus capacitor shell, the filter shell, the positive and negative copper busbars, and the heat dissipation channels. Compared with the traditional pure aluminum alloy base, the integration is significantly improved, the overall size of the inverter brick assembly is reduced, and the amount of die-casting material used is smaller, resulting in lower costs. The one-time injection molding structure also saves the original assembly steps and reduces assembly costs.

[0081] The power module metal cooling channel 1 is a hollow rectangular cavity structure made of aluminum alloy. Its upper surface has a first power module fitting port 1.1 and a second power module fitting port 1.2, forming two power module mounting cavities longitudinally. The left and right side walls of the hollow rectangular cavity structure are integrally connected to a cooling outlet 1.3 and a cooling inlet 1.4, respectively. The cooling outlet 1.3, cooling inlet 1.4, and the hollow rectangular cavity structure together form the cooling channel. The first power module and the second power module are respectively fitted and sealed at the first power module fitting port 1.1 and the second power module fitting port 1.2. Coolant is introduced through the cooling inlet 1.4, flows through the power module metal cooling channel 1 cavity surrounding the second power module, flows to the power module metal cooling channel 1 cavity at the first power module's housing, and finally flows out through the cooling outlet 1.3, completing the cooling of the first and second power modules.

[0082] The inner bottom wall of the metal heat dissipation channel 1 of the power module is provided with a recessed rectangular groove 1.5 with a two-stage stepped structure in the area adjacent to the first power module mating port 1.1 and the second power module mating port 1.2. Each side wall of the upper rectangular groove of the recessed rectangular groove 1.5 with the two-stage stepped structure is a sloping surface 1.5.1 that slopes from the outside to the inside. The purpose of this recessed rectangular groove 1.5 with the two-stage stepped structure is to slow down the flow rate of the coolant between the first power module and the second power module, so as to make the heat exchange between the coolant and the second power module more complete. The inner bottom wall of the power module metal heat dissipation channel 1 is provided with a left-end water outlet sink 1.6 near the left side wall, and the inner bottom wall of the power module metal heat dissipation channel 1 is provided with a right-end water inlet sink 1.7 near the right side wall. The heat dissipation water outlet 1.3 and the heat dissipation water inlet 1.4 are respectively aligned and connected to the left-end water outlet sink 1.6 and the right-end water inlet sink 1.7, further slowing down the flow speed of the coolant in the hollow rectangular cavity structure of the power module metal heat dissipation channel 1, and increasing the heat exchange time between the coolant and the first power module and the second power module.

[0083] The inner pipe walls of the heat dissipation outlet 1.3 and the heat dissipation inlet 1.4 are both two-stage stepped inner pipe wall structures with a larger inner pipe diameter at the outer end and a smaller inner pipe diameter at the inner end. The inner pipe wall structure design of the heat dissipation outlet 1.3 and the heat dissipation inlet 1.4 can increase the water flow velocity at the pipe opening, enhance the heat dissipation effect, generate local throttling, build up pressure, prevent cavitation / air blockage, adapt to interface size, and reduce the risk of leakage.

[0084] The upper end faces of the power module metal heat dissipation channel 1 at the outer edge of the openings of the first power module fitting port 1.1 and the second power module fitting port 1.2 are respectively provided with annular connecting protrusions 1.8. Each annular connecting protrusion 1.8 has a sealing ring groove 1.9 circumferentially provided on the upper end face of its upper end face. The first power module and the second power module are aligned and matched and placed into the first power module fitting port 1.1 and the second power module fitting port 1.2 and housed in the cavity of the power module metal heat dissipation channel 1. The first power module and the second power module are aligned, limited and fixed at the upper end faces of the annular connecting protrusions 1.8 of the first power module fitting port 1.1 and the annular connecting protrusions 1.8 of the second power module fitting port 1.2, and are sealed and fixed by the sealing rings and the aligned sealing ring grooves 1.9.

[0085] The power module metal heat dissipation channel 1 has horizontally extended injection molding connecting edges 1.10 on the left and right sides of its upper end face. The power module metal heat dissipation channel 1 is matched and set at the corresponding position of the injection molding base 2 and is fixedly connected to the injection molding base 2 by injection molding through the injection molding connecting edges 1.10 on both sides.

[0086] The lower end face of the power module metal heat dissipation channel 1 corresponds to the outer edge of the bottom surface of the recessed rectangular groove 1.5 of the two-stage stepped structure, and a rectangular heat dissipation groove 1.11 is provided. The bottom of the rectangular heat dissipation groove 1.11 is provided with a grid-like heat dissipation reinforcing rib 1.12. The upper end face of the power module metal heat dissipation channel 1 is provided with the first mounting studs 1.13 of the drive board on both the left and right sides. The upper end face of the power module metal heat dissipation channel 1 is provided with the inverter brick positioning pin 1.14 on the left side. The outer wall of the heat dissipation water inlet 1.4 on the right side of the upper end face of the power module metal heat dissipation channel 1 is provided with an inverter brick. The brick fixing point 1.15, with the positioning pin designed on the metal heat dissipation channel, is conducive to utilizing the dimensional accuracy after metal processing to ensure the installation accuracy of the inverter brick; the fixing points of the drive board and inverter brick are distributed on the aluminum alloy heat dissipation channel and injection molded base according to the projection position of the aluminum alloy heat dissipation channel and injection molded base, and jointly undertake the installation and fixing task of the inverter brick and drive board; the grid-shaped heat dissipation reinforcing rib 1.12 is designed on the back of the power module metal heat dissipation channel 1. The power module metal heat dissipation channel 1 and injection molded base 2 are not covered with plastic during injection molding, which can provide heat dissipation for the bus capacitor.

[0087] The injection-molded base 2 includes a mounting panel 2.1 for the module and drive board, a bus capacitor housing 2.2, a filter housing 2.3, and a positive and negative copper busbar mounting area 2.4. The bus capacitor housing 2.2 is located on the lower end face of the mounting panel 2.1. The filter housing 2.3 is located on the lower end face of the mounting panel 2.1, adjacent to the right side wall of the bus capacitor housing 2.2. The positive and negative copper busbar mounting area 2.4 is located on the right side of the upper end face of the mounting panel 2.1. The negative copper busbar 3, the first positive copper busbar 4, and the second positive copper busbar 5 are matched and fixed in the positive and negative copper busbar mounting area 2.4. The upper end face of the power module metal heat dissipation channel 1 is injection-molded and embedded in the upper end face of the mounting panel 2.1. The rectangular cavity structure at the lower part of the power module metal heat dissipation channel 1 is housed within the bus capacitor housing 2.2. The left end of the power module metal heat dissipation channel 1... The hot water outlet 1.3 is exposed on the left side wall of the bus capacitor housing 2.2. The heat dissipation water inlet 1.4 at the right end of the power module metal heat dissipation channel 1 is sandwiched between the aligned filter housing 2.3 and the positive and negative copper busbar mounting area 2.4, and the right end of the heat dissipation water inlet 1.4 is exposed on the right side wall of the bus capacitor housing 2.2. The lower end of the heat dissipation water inlet 1.4 has a protruding internally threaded cylinder 1.16 corresponding to the position of the filter housing 2.3. The internally threaded cylinder 1.16 is housed in the filter housing 2.3. The filter PCB board is bolted to the internally threaded cylinder 1.16 to form a ground connection. The injection-molded base 2 is the basic part that fixes the aluminum alloy heat dissipation channel and other base sub-components (nuts, bushings, copper busbars) into a whole. Before injection molding, other components are pre-installed in the mold. After one injection molding, the base completes the most important manufacturing process.

[0088] The upper edge of the mounting panel 2.1 of the module and drive board is provided with a second mounting stud 2.1.1 of the drive board. The first mounting stud 1.13 and the second mounting stud 2.1.1 of the drive board together constitute the drive board mounting stud. The upper front end of the mounting panel 2.1 of the module and drive board is provided with a busbar capacitor copper busbar mounting hole 2.1.2. The overall structure of the busbar capacitor shell 2.2 is a rectangular cylindrical structure. The inner side wall of the busbar capacitor shell 2.2, the lower end of the mounting panel 2.1 of the module and drive board, and the lower end of the power module metal heat dissipation channel 1 together constitute the busbar capacitor potting groove 2.2.1. The negative copper busbar 3, the first positive copper busbar 4, and the second positive copper busbar 5 are respectively limited and fixed in the positive and negative copper busbar mounting area 2.4. The positive and negative copper busbar mounting area 2.4 is respectively injection molded to form a DC high voltage interface 2.4.1, a fuse mounting interface 2.4.2, and a DC high voltage output interface 2.4.3.

[0089] Example 2

[0090] See Figures 1-12As shown, an inverter brick assembly includes a filter capacitor assembly 7, a bus capacitor 8, a first power module 9, a second power module 10, and a fuse 11. It also includes the aforementioned highly integrated inverter brick base. The lower end of the injection-molded base 2 has a filter magnetic ring mounting groove 2.5 corresponding to the DC high-voltage interface 2.4.1. A filter magnetic ring 6 is housed within this groove 2.5 and is aligned and sleeved onto the copper pins of the negative copper busbar 3 and the first positive copper busbar 4 corresponding to the DC high-voltage interface 2.4.1. The PCB board of the filter capacitor assembly 7 is bolted to the filter housing 2.3 and bolted to the internally threaded cylinder 1.16 of the power module's metal heat dissipation channel 1 to form a ground connection. The PCB board of the filter capacitor assembly 7 is welded to the aligned copper pins of the negative copper busbar 3 and the first positive copper busbar 4 to complete the positive and negative connection. The filter capacitor assembly 7 adopts a PCB board form. The XY capacitors are soldered and fixed on the PCB board. Filter capacitors with different capacitance values ​​and functions are soldered on the PCB board, which can be adjusted and matched according to electromagnetic compatibility level requirements in actual use. The bus capacitor 8 is housed in the bus capacitor potting groove 2.2.1 and is potted with polyurethane (PU) potting compound in the bus capacitor potting groove 2.2.1. The copper busbar of the bus capacitor 8 is exposed outside the copper busbar mounting hole 2.1.2. The first power module 9 and the second power module 10 are respectively matched and embedded in the first power module mating port 1.1 and the second power module mating port 1.2 and are sealed and fixed by bolts to the aligned annular connecting protrusion 1.8. The fuse 11 is electrically connected to the fuse mounting interface 2.4.2. Then, the subsequent circuit board assembly and testing processes can be carried out.

[0091] Although the invention has been specifically shown and described in conjunction with preferred embodiments, those skilled in the art should understand that various changes in form and detail may be made to the invention without departing from the spirit and scope of the invention as defined in the appended claims, all of which shall be within the scope of protection of the invention.

Claims

1. A highly integrated inverter brick base, characterized in that: It includes a power module metal heat dissipation channel (1), an injection molded base (2), a negative copper busbar (3), a first positive copper busbar (4), a second positive copper busbar (5), and a filter magnetic ring (6); The power module metal heat dissipation channel (1), negative copper busbar (3), first positive copper busbar (4) and second positive copper busbar (5) are respectively fixedly connected by injection molding with the matching injection base (2) through injection mold to form a high-integration inverter brick base; The highly integrated inverter brick base includes a DC high voltage interface, a heat dissipation water inlet, a fuse mounting interface, a DC high voltage output interface, a drive board mounting stud, a bus capacitor copper bus mounting hole, a power module mounting cavity, and a heat dissipation water outlet; the filter magnetic ring (6) is sleeved and fixed on the two copper busbars of the DC high voltage interface.

2. The highly integrated inverter brick base according to claim 1, characterized in that: The power module metal heat dissipation channel (1) is a hollow rectangular cavity structure. The upper end face is provided with a first power module fitting port (1.1) and a second power module fitting port (1.2), which form two power module mounting cavities in the longitudinal direction. The left and right side walls of the hollow rectangular cavity structure are integrally connected with heat dissipation outlet (1.3) and heat dissipation inlet (1.4). The heat dissipation outlet (1.3), heat dissipation inlet (1.4) and the hollow rectangular cavity structure together form the heat dissipation channel.

3. The highly integrated inverter brick base according to claim 2, characterized in that: The inner bottom wall of the power module metal heat dissipation channel (1) is provided with a recessed rectangular groove (1.5) with a two-stage stepped structure in the adjacent area of ​​the first power module fitting port (1.1) and the second power module fitting port (1.2). Each side wall of the upper rectangular groove of the recessed rectangular groove (1.5) with the two-stage stepped structure is a sloping surface that slopes from the outside to the inside. 1.5.1) The inner bottom wall of the power module metal heat dissipation channel (1) is provided with a left end water outlet sink (1.6) near the left side wall, and the inner bottom wall of the power module metal heat dissipation channel (1) is provided with a right end water inlet sink (1.7) near the right side wall. The heat dissipation water outlet (1.3) and the heat dissipation water inlet (1.4) are respectively aligned and connected to the left end water outlet sink (1.6) and the right end water inlet sink (1.7).

4. The highly integrated inverter brick base according to claim 3, characterized in that: The inner walls of the heat dissipation outlet (1.3) and the heat dissipation inlet (1.4) are both two-stage stepped inner wall structures with a larger inner diameter at the outer end and a smaller inner diameter at the inner end.

5. A highly integrated inverter brick base according to claim 4, characterized in that: The upper end face of the metal heat dissipation channel (1) of the power module at the outer edge of the opening of the first power module fitting port (1.1) and the second power module fitting port (1.2) is respectively matched with annular connecting protrusions (1.8), and each annular connecting protrusion (1.8) is provided with a sealing ring groove (1.9) circumferentially on the upper end face of the upper end face.

6. A highly integrated inverter brick base according to claim 5, characterized in that: The power module metal heat dissipation channel (1) has horizontally extended injection molding connecting edges (1.10) on the left and right sides of the upper end face. The power module metal heat dissipation channel (1) is matched and set at the corresponding position of the injection molding base (2) and is fixedly connected to the injection molding base (2) by injection molding through the injection molding connecting edges (1.10) on both sides.

7. A highly integrated inverter brick base according to claim 6, characterized in that: The lower end of the power module metal heat dissipation channel (1) is provided with a rectangular heat dissipation groove (1.11) on the outer edge of the bottom surface of the recessed rectangular groove (1.5) of the two-stage stepped structure. The bottom of the rectangular heat dissipation groove (1.11) is provided with a grid-like heat dissipation reinforcing rib (1.12). The upper end of the power module metal heat dissipation channel (1) is also provided with a first mounting stud (1.13) of the drive board on the left and right sides. The upper end of the power module metal heat dissipation channel (1) is provided with an inverter brick positioning pin (1.14) on the left side. The outer wall of the heat dissipation water inlet (1.4) on the right side of the upper end of the power module metal heat dissipation channel (1) is provided with an inverter brick fixing point (1.15) extending horizontally.

8. A highly integrated inverter brick base according to claim 7, characterized in that: The injection-molded base (2) includes a mounting panel (2.1) for the module and drive board, a bus capacitor housing (2.2), a filter housing (2.3), and a positive and negative copper busbar mounting area (2.4). The bus capacitor housing (2.2) is located on the lower end face of the mounting panel (2.1) for the module and drive board. The filter housing (2.3) is located on the lower end face of the mounting panel (2.1) for the module and drive board, adjacent to the right side wall of the bus capacitor housing (2.2). The positive and negative copper busbar mounting area (2.4) is located on the right side of the upper end face of the mounting panel (2.1) for the module and drive board. The negative copper busbar (3), the first positive copper busbar (4), and the second positive copper busbar (5) are matched and fixed in the positive and negative copper busbar mounting area (2.4). The upper end face of the power module metal heat dissipation channel (1) is matched and injection-molded into the mounting panel (2.4) for the module and drive board. The upper end of the mounting panel (2.1) and the rectangular cavity structure of the lower part of the power module metal heat dissipation channel (1) are housed in the bus capacitor shell (2.2). The end of the heat dissipation outlet (1.3) of the power module metal heat dissipation channel (1) is exposed outside the left side wall of the bus capacitor shell (2.2). The outer circumferential wall of the heat dissipation inlet (1.4) of the power module metal heat dissipation channel (1) is sandwiched between the aligned filter shell (2.3) and the positive and negative copper busbar mounting area (2.4). The right end of the heat dissipation inlet (1.4) is exposed outside the right side wall of the bus capacitor shell (2.2). The lower end of the heat dissipation inlet (1.4) is provided with a threaded cylinder (1.16) corresponding to the position of the filter shell (2.3). The threaded cylinder (1.16) is housed in the filter shell (2.3).

9. A highly integrated inverter brick base according to claim 8, characterized in that: The upper circumferential edge of the mounting panel (2.1) of the module and the driver board is provided with a second mounting stud for the driver board. 2.1.1), the first mounting stud (1.13) of the drive board and the second mounting stud of the drive board ( 2.1.1) Together they form the drive board mounting studs. The upper front end of the mounting panel (2.1) of the module and the drive board is provided with a bus capacitor copper bus mounting hole (2.1.2). The bus capacitor shell (2.2) is a rectangular cylindrical structure. The inner side wall of the bus capacitor shell (2.2), the lower end of the mounting panel (2.1) of the module and the drive board, and the lower end of the power module metal heat dissipation channel (1) together form the bus capacitor potting groove (2.2.1). The negative copper bus (3), the first positive copper bus (4) and the second positive copper bus (5) are respectively limited and fixed in the positive and negative copper bus mounting area (2.4). The positive and negative copper bus mounting area (2.4) is respectively injection molded to form a DC high voltage interface (2.4.1), a fuse mounting interface (2.4.2) and a DC high voltage output interface (2.4.3).

10. An inverter brick assembly, characterized in that: The system includes a filter capacitor assembly (7), a bus capacitor (8), a first power module (9), a second power module (10), and a fuse (11). It also includes a highly integrated inverter base as described in any one of claims 1-9. The lower end of the injection-molded base (2) is provided with a filter magnetic ring mounting groove (2.5) corresponding to the DC high-voltage interface (2.4.1). The filter magnetic ring (6) is housed within this groove (2.5), and is aligned and sleeved onto the copper pins of the negative copper busbar (3) and the first positive copper busbar (4) corresponding to the DC high-voltage interface (2.4.1). The PCB board of the filter capacitor assembly (7) is bolted to the filter housing (2.3) and connected to the power module metal heat sink via bolts. The internally threaded cylinder (1.16) of the water channel (1) is screwed together to form a ground connection. The PCB board of the filter capacitor assembly (7) is welded to the copper pin of the corresponding negative copper busbar (3) and the copper pin of the first positive copper busbar (4) to complete the positive and negative connection. The bus capacitor (8) is housed in the bus capacitor potting groove (2.2.1). The bus capacitor copper busbar of the bus capacitor (8) is exposed outside the bus capacitor copper busbar mounting hole (2.1.2). The first power module (9) and the second power module (10) are respectively matched and embedded in the first power module fitting port (1.1) and the second power module fitting port (1.2) and are sealed and fixed by bolts and screwed together with the corresponding annular connecting protrusion (1.8). The fuse (11) is electrically connected to the fuse mounting interface (2.4.2).

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