Crystal oscillator packaging structure, process and device

Abstract

The application relates to the technical field of electronic component packaging, and discloses a crystal oscillator packaging structure, a process and equipment, which comprise a bottom plate, the bottom plate is provided with a first recess, further comprise a crystal oscillator chip arranged in the first recess, the size and shape of the first recess and the crystal oscillator chip are matched; further comprise a dispensing layer, the dispensing layer is located between the bottom plate and the crystal oscillator chip, and the dispensing layer is used for providing good wire performance for the crystal oscillator chip; further comprise an upper plate, the upper plate is provided with a second recess, and the second recess is matched with the first recess. The manual intervention is reduced, the production efficiency is remarkably improved, the labor cost is reduced, and the stability of the packaging quality is ensured.

Description

Technical Field

[0001] This invention relates to the field of electronic component packaging technology, specifically to a crystal oscillator packaging structure, process, and equipment. Background Technology

[0002] Crystal oscillators are core timing reference components in high-precision electronic systems, widely used in the manufacturing of various electronic measurement instruments such as digital television test instruments and communication and network test instruments. Precision measurement equipment for digital television testing, network signal analysis, and communication parameter detection has extremely high requirements for clock frequency stability, phase noise, and timing synchronization accuracy, and relies on highly reliable and stable crystal oscillators to provide a precise frequency reference.

[0003] In today's industry trend of increasingly miniaturized and integrated electronic devices, crystal oscillators, as key frequency control components, play a crucial role in the performance, reliability, and cost control of electronic products through their packaging technology. However, the packaging process of the widely used 32.768kHz crystal oscillators still has many limitations that urgently need improvement. Traditional 32.768kHz crystal oscillator packaging mainly targets crystal chips with dimensions ranging from 4.0 to 4.8 mm in length, 0.8 to 1.2 mm in width, and 0.23 to 0.38 mm in thickness, and generally adopts a dual in-line package (DIP) method. Specifically, the crystal chip is first fixed to a metal bracket through a soldering process, then a top cover is inserted, and the packaging is completed using vacuum pressing technology. This packaging form is common in 3×8 and 2×6 size products. In actual customer applications, the packaged crystal oscillator product leads need to be inserted into the vias of the application circuit board. After the soldering process, a series of subsequent processing operations, such as trimming and shaping of the protruding leads, are also required. The entire process is not only inefficient, failing to meet the demands of modern electronics manufacturing for high-efficiency, automated production, but also incurs enormous labor costs. With rising labor costs, this undoubtedly further burdens enterprises. More importantly, frequent manual operations can easily introduce soldering defects, such as incomplete soldering and short circuits, and may also damage the crystal oscillator chip due to thermal shock during the soldering process. This severely affects the performance stability and reliability of the crystal oscillator, consequently impacting the normal operation of the entire electronic device. Summary of the Invention

[0004] This invention proposes a crystal oscillator packaging structure, process, and equipment that reduces manual intervention, significantly improves production efficiency, lowers labor costs, and ensures the stability of packaging quality.

[0005] The technical solution of the present invention is as follows: A crystal oscillator packaging structure includes a base plate having a first groove, and a crystal oscillator chip for being disposed in the first groove, wherein the size and shape of the first groove and the crystal oscillator chip are adapted to each other. It also includes a dispensing layer, which is located between the base plate and the crystal oscillator chip, and the dispensing layer is used to provide good wire performance for the crystal oscillator chip; It also includes an upper plate having a second groove that matches the first groove.

[0006] A crystal oscillator packaging process includes the following steps: S1. Base plate processing: A high-temperature resistant substrate is selected as the base plate, and the first groove matching the crystal oscillator chip is processed on the base plate according to the size of the crystal oscillator chip. S2. Dispensing and mounting: The adhesive used for dispensing is high-temperature resistant silver paste. After curing, the silver paste has a certain elasticity, which can provide good conductivity and a certain vibration buffer for the crystal oscillator chip, which is beneficial to the vibration of the crystal oscillator chip, while ensuring the conductivity of the crystal oscillator chip and the conductivity of the base plate electrodes.

[0007] S3. Chip Placement: Accurately place the crystal oscillator chip in the first groove of the base plate to ensure the conduction between the crystal oscillator chip and the base plate electrodes, thereby realizing the electrical connection between the crystal oscillator chip and the base plate.

[0008] S4. Upper plate processing: Process the second groove of the upper plate. The material of the upper plate can be FR-1, FR-2, FR-4, CEM-1 / CEM-3, BT resin, etc. The size and shape of the second groove match the first groove to achieve a tight fit between the upper and lower plates.

[0009] S5. Adhesive Packaging: Align the processed upper plate with the lower plate, adhere the upper and lower plates together with high-temperature resistant epoxy resin, and then perform vacuum sealing to ensure that the upper and lower plates are tightly fitted to form a sealed packaging structure, thus completing the crystal oscillator packaging process.

[0010] As a further technical solution, the crystal oscillator chip has a length of 4.0-4.8mm, a width of 0.8-1.2mm, and a thickness of 0.23-0.38mm.

[0011] As a further technical solution, the adhesive is applied to the upper plate using a roller coating method, which can ensure the uniformity and consistency of the adhesive application and improve the packaging quality.

[0012] A crystal oscillator packaging device includes a frame and an X-direction moving assembly movably disposed on the frame, and a first support plate disposed on the X-direction moving assembly. The first support plate has a first mounting groove, and a first mounting plate is disposed in the first mounting groove. A plurality of second mounting grooves are arranged at intervals on the first mounting plate, and the second mounting grooves are used to place the bottom plate or the top plate. It also includes a grooving assembly and a dispensing assembly disposed on the frame, the grooving assembly being used to groove the base plate and the top plate, and the dispensing assembly being used to dispense adhesive between the base plate and the crystal oscillator chip; It also includes an adhesive application assembly mounted on the frame for applying adhesive to the upper plate.

[0013] As a further technical solution, the X-direction moving component includes a first slide rail disposed on the frame, a first slide groove on the first support plate, the first support plate being slidably disposed on the first slide rail through the first slide groove, and a first lead screw threaded through the first support plate and rotatably disposed on the frame. After the first lead screw rotates, it is used to drive the first support plate to move in the X direction. The frame is also provided with a first drive unit for driving the first lead screw to rotate. The adhesive application assembly includes a second slide rail disposed on the frame along the Z-axis direction, and a first mounting seat slidably disposed on the second slide rail. An adhesive application roller and an abutment roller are rotatably disposed on the first mounting seat. A placement gap is formed between the abutment roller and the adhesive application roller. The placement gap is used to place liquid adhesive. The abutment roller is a heating roller. The assembly also includes a telescopic rod disposed on the frame. After the telescopic rod extends and retracts, it is used to drive the first mounting seat to slide on the second slide rail. After the first mounting base slides on the second slide rail, it is used to abut against the upper plate or the bottom plate. After the first support plate slides on the first slide rail, the glue roller is used to apply glue to the bottom plate and the upper plate.

[0014] As a further technical solution, the grooving assembly includes a third slide rail arranged along the Y-axis on the frame, a second mounting seat slidably disposed on the third slide rail, and a second lead screw threaded through the second mounting seat and rotatably disposed on the frame. After the second lead screw rotates, it is used to drive the second mounting seat to move along the Y direction. The frame is also provided with a second drive unit for driving the second lead screw to rotate. The second mounting base is provided with a fourth slide rail arranged on the frame along the Z-axis direction, and also includes a third mounting base slidably arranged on the fourth slide rail, and a third lead screw threaded through the third mounting base and rotatably arranged on the second mounting base. After the third lead screw rotates, it is used to drive the third mounting base to slide on the fourth slide rail. A T-slot milling cutter and a third drive unit for driving the T-slot milling cutter are rotatably arranged on the third mounting base, and a fourth drive unit for driving the third lead screw to rotate is also included.

[0015] As a further technical solution, the dispensing assembly includes a fifth slide rail arranged along the Y-axis on the frame, a fourth mounting seat slidably disposed on the fifth slide rail, and a fourth lead screw threaded through the fourth mounting seat and rotatably disposed on the third mounting seat. After the fourth lead screw rotates, it drives the fourth mounting seat to move along the Y direction. The frame is also provided with a fifth drive unit for driving the fourth lead screw to rotate. A dispensing gun is disposed on the fourth mounting seat. After the fourth mounting seat slides on the fifth slide rail, the lowest point of the dispensing gun along the Z-axis is lower than or higher than the bottom of the T-slot milling cutter.

[0016] As a further technical solution, a second support plate is provided on the first support plate, and an elastic element is provided between the first support plate and the second support plate. The elastic element is used to provide a force that moves the second support plate away from the first support plate.

[0017] As a further technical solution, the second support plate is provided with intermediate parts at intervals, and also includes two hinge plates respectively hinged to both sides of the intermediate parts. The first mounting plate and the first mounting groove are mounted on the hinge plates through the second support plate. After the two hinge plates swing on the intermediate parts, the two hinge plates abut against each other.

[0018] As a further technical solution, a sliding gap is formed between the intermediate component and the second support plate, and a plurality of hydraulic rods are arranged in the sliding gap. The hydraulic rods are also provided at their telescopic ends and slidably disposed in the sliding gap. After the hydraulic rods are extended or retracted, they are used to push the toothed plate to slide in the sliding gap. It also includes two gears that mesh with both sides of the gear plate respectively. The gears are provided with connecting rods. The bottom end of each hinge plate is provided with a sliding groove. A sliding block is slidably disposed in the sliding groove. The side of the connecting rod away from the gear is respectively hinged to the two sliding blocks. After the gear rotates, it is used to drive the sliding block to slide in the sliding groove. After the sliding block slides in the sliding groove, the two hinge plates move closer to each other.

[0019] As a further technical solution, powerful electromagnets are provided on both sides of the hinge plate. When the two hinge plates are brought close to each other, the powerful electromagnets are energized, and the two hinge plates are put into contact with each other.

[0020] The working principle and beneficial effects of this invention are as follows: In this invention, a high-temperature resistant FR-4 material is used as the base plate. Based on the specific dimensions of the crystal oscillator chip, a first groove is precisely machined to fit the chip. High-temperature resistant silver paste is then applied to ensure the crystal oscillator chip is securely placed within the groove and reliably connected to the base plate electrodes. Next, an upper plate of the same material is used, and a second groove matching the base plate groove is machined. The upper and lower plates are then tightly bonded together using high-temperature resistant epoxy resin, and vacuum sealing technology is employed to complete the encapsulation, forming a sealed and stable package structure. This encapsulation method not only improves packaging accuracy and consistency but also enhances the stability of the package structure under high-temperature environments. The use of high-temperature resistant silver paste provides the crystal oscillator chip with excellent conductivity and vibration damping, which is beneficial for the chip's normal operation. The entire packaging process is highly automated, reducing manual intervention, significantly improving production efficiency, lowering labor costs, and ensuring stable packaging quality. Furthermore, this packaging solution has good scalability, flexibly adapting to crystal oscillator chips of different sizes and shapes to meet diverse market demands, demonstrating high practicality and economy. Attached Figure Description

[0021] The present invention will now be described in further detail with reference to the accompanying drawings and specific embodiments.

[0022] Figure 1 This is a schematic diagram of the first structure of the crystal packaging structure of the present invention; Figure 2 This is a schematic diagram of the second structure of the crystal packaging structure of the present invention; Figure 3 This is a schematic diagram of the third structure of the crystal packaging structure of the present invention; Figure 4 This is a first-view axial view structural schematic diagram of the packaging device of the present invention; Figure 5 for Figure 4 A magnified schematic diagram of the structure at point A; Figure 6 This is a schematic diagram of the second-view axial view structure of the packaging device of the present invention; Figure 7 This is a schematic diagram of the third-view axial structure of the packaging device of the present invention; Figure 8 for Figure 7 A magnified schematic diagram of the structure at point B; Figure 9 This is a schematic diagram of the first-view structure at the hinge plate. Figure 10 This is a schematic diagram of the second-view structure at the hinge plate.

[0023] In the diagram: 1. Base plate, 2. First groove, 3. Crystal oscillator chip, 4. Dispensing layer, 5. Top plate, 6. Second groove, 7. Frame, 8. X-direction moving assembly, 9. First support plate, 10. First mounting slot, 11. First mounting plate, 12. Second mounting slot, 13. Slotting assembly, 14. Dispensing assembly, 15. Glue application assembly, 16. First slide rail, 17. First slide groove, 18. First lead screw, 19. First drive unit, 20. Second slide rail, 21. First mounting base, 22. Glue application roller, 23. Abutment roller, 24. Placement gap, 25. Telescopic rod, 26. Third slide rail, 27. 28. Second mounting base, 29. Second lead screw, 30. Second drive unit, 31. Fourth slide rail, 32. Third mounting base, 33. Third lead screw, 34. T-slot milling cutter, 35. Third drive unit, 36. Fifth slide rail, 37. Fourth mounting base, 38. Fourth lead screw, 39. Fifth drive unit, 40. Dispensing gun, 41. Second support plate, 42. Elastic element, 43. Hinge plate, 44. Sliding clearance, 45. Hydraulic rod, 46. Tooth plate, 47. Gear, 48. Connecting rod, 49. Sliding groove, 50. Sliding block, 51. High-power electromagnet, 52. Intermediate component. Detailed Implementation

[0024] The technical solutions of the present invention will be clearly and completely described below with reference to the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.

[0025] Example like Figure 1-10 As shown, a crystal oscillator packaging structure includes a base plate 1 with a first groove 2, and a crystal oscillator chip 3 for being disposed in the first groove 2. The size and shape of the first groove 2 and the crystal oscillator chip 3 are adapted to each other. It also includes a dispensing layer 4, which is located between the base plate 1 and the crystal oscillator chip 3. The dispensing layer 4 is used to provide good wire performance for the crystal oscillator chip 3. It also includes an upper plate 5, which has a second groove 6 that matches the first groove 2.

[0026] A crystal oscillator packaging process includes the following steps: S1. Processing of base plate 1: Select a high-temperature resistant substrate as base plate 1, and process a first groove 2 on base plate 1 that matches the size of crystal oscillator chip 3 according to the size of crystal oscillator chip 3. S2. Dispensing and mounting: The adhesive used for dispensing is high-temperature resistant silver paste. After curing, the silver paste has a certain elasticity, which can provide good conductivity and a certain vibration buffer for the crystal oscillator chip 3, which is beneficial to the vibration of the crystal oscillator chip 3, while ensuring the conductivity of the crystal oscillator chip 3 and the conductivity of the electrodes of the base plate 1.

[0027] S3. Chip Placement: Accurately place the crystal oscillator chip 3 in the first groove 2 of the base plate 1 to ensure the conduction between the crystal oscillator chip 3 and the electrodes of the base plate 1, and realize the electrical connection between the crystal oscillator chip 3 and the base plate 1.

[0028] S4. Upper plate 5 processing: Process the second groove 6 of the upper plate 5. The material of the upper plate 5 can be FR-1, FR-2, FR-4, CEM-1 / CEM-3, BT resin, etc. The size and shape of the second groove 6 match the first groove 2 to achieve a tight fit between the upper and lower plates.

[0029] S5. Adhesive Packaging: Align the processed upper plate 5 with the bottom plate 1, and glue the upper and lower plates together with high-temperature resistant epoxy resin. Then, perform vacuum sealing to ensure that the upper and lower plates fit tightly together, forming a sealed packaging structure and completing the crystal oscillator packaging process.

[0030] This embodiment designs a crystal oscillator packaging structure and packaging process, aiming to improve packaging efficiency and quality, enhance stability under high-temperature environments, save planar space, and reduce costs. The packaging structure mainly includes a base plate 1, a crystal oscillator chip 3, an adhesive layer 4, and an upper plate 5. The base plate 1 is made of high-temperature resistant FR-4 material, and has a first groove 2 that matches the crystal oscillator chip 3, ensuring that the crystal oscillator chip 3 can be stably placed within it. The crystal oscillator chip 3 is precisely placed in the first groove 2 via a slot, and the electrical connection between it and the electrodes of the base plate 1 is achieved through the adhesive layer 4. The adhesive layer 4 uses high-temperature resistant silver paste, which not only has good conductivity but also provides a certain elastic support for the crystal oscillator chip 3 after curing, which is beneficial to the chip's vibration. The upper plate 5 is also made of FR-4 material, and has a second groove 6 that matches the first groove 2 of the base plate 1. The upper plate 5 is bonded to the base plate 1 with high-temperature resistant epoxy resin and then vacuum-sealed to form a sealed packaging structure. This packaging structure not only improves packaging efficiency and quality, but also enhances the stability and reliability of the crystal oscillator in high-temperature environments, while reducing production costs, making it suitable for mass production.

[0031] Furthermore, the dimensions of the crystal oscillator chip 3 are 4.0 - 4.8 mm in length, 0.8 - 1.2 mm in width, and 0.23 - 0.38 mm in thickness.

[0032] In this embodiment, the dimensions of the crystal oscillator chip 3 are carefully designed to be 4.0-4.8mm in length, 0.8-1.2mm in width, and 0.23-0.38mm in thickness. This size range is the result of comprehensive consideration of several key factors. First, from the perspective of market demand, the chip sizes of most widely used 32.768kHz crystal oscillator products on the market are concentrated within this range. This allows our packaging structure to seamlessly integrate with existing electronic device designs, ensuring compatibility and meeting the diverse needs of different customers for crystal oscillator sizes. Second, from the perspective of packaging process feasibility, this size range ensures both the stability and reliability of the crystal oscillator chip 3 during the packaging process and also takes into account packaging efficiency. For example, if the chip size is too small, it may lead to problems in controlling the precision during dispensing and chip placement, thus affecting the packaging quality; while if the size is too large, it will increase the amount of packaging material used, increase costs, and also make the packaged crystal oscillator too large, making it inconvenient to install in compact electronic devices. Furthermore, considering the performance of the crystal oscillator chip 3 itself, this size range ensures stable oscillation of the crystal oscillator at its operating frequency, thereby guaranteeing its timing accuracy and frequency stability. Therefore, selecting a crystal oscillator chip 3 within this size range not only meets mainstream market demands but also optimizes the packaging process, improves packaging efficiency, and ensures the performance of the crystal oscillator chip 3. It is the optimal choice after considering multiple factors.

[0033] Furthermore, the adhesive application on the upper board 5 is done by roller coating, which ensures the uniformity and consistency of the adhesive application and improves the packaging quality.

[0034] In this embodiment, to further improve the quality and reliability of the crystal oscillator packaging, a roller coating method is used to apply adhesive to the upper plate 5. The core of this coating method lies in the use of a specially designed roller coating device equipped with a coating roller 22 that evenly distributes the adhesive. During actual operation, the upper plate 5 is placed at the designated position on the coating device, and the coating roller 22 rolls smoothly across the surface of the upper plate 5, evenly applying the adhesive to the second groove 6 of the upper plate 5 and the area in contact with the base plate 1. Because the roller coating method ensures that the adhesive forms a uniform and consistent thickness layer on the surface of the upper plate 5, it not only effectively avoids the problems of air bubbles caused by uneven adhesive distribution or excessive adhesive thickness affecting packaging accuracy, but also enhances the bonding strength between the upper plate 5 and the base plate 1, resulting in a more robust and airtight structure after packaging. Furthermore, the roller coating method has a high degree of automation, enabling fast and stable adhesive application, greatly improving production efficiency and reducing errors caused by manual operation, thus ensuring packaging quality while meeting the needs of large-scale production.

[0035] A crystal oscillator packaging device includes a frame 7 and an X-direction moving component 8 movably disposed on the frame 7. It also includes a first support plate 9 disposed on the X-direction moving component 8. The first support plate 9 has a first mounting groove 10. A first mounting plate 11 is disposed in the first mounting groove 10. A plurality of second mounting grooves 12 are arranged at intervals on the first mounting plate 11. The second mounting grooves 12 are used to place a base plate 1 or an upper plate 5. It also includes a grooving assembly 13 and a dispensing assembly 14 disposed on the rack 7. The grooving assembly 13 is used to groove the base plate 1 and the upper plate 5, and the dispensing assembly 14 is used to dispense adhesive between the base plate 1 and the crystal oscillator chip 3. It also includes an adhesive applicator 15 mounted on the frame 7 for applying adhesive to the upper plate 5.

[0036] In this embodiment, the device mainly includes a frame 7, an X-direction moving assembly 8, a first support plate 9, a grooving assembly 13, a dispensing assembly 14, and an adhesive application assembly 15. The frame 7, serving as the basic framework of the device, is made of high-strength aluminum alloy to ensure the stability and durability of the overall structure. The X-direction moving assembly 8 is mounted on the frame 7 and, through a high-precision guide rail and motor drive system, can precisely control the position of the first support plate 9 in the X-direction. The first support plate 9 has a first mounting groove 10, in which a first mounting plate 11 is installed, and multiple second mounting grooves 12 arranged at intervals on it for placing the base plate 1 or the upper plate 5. The grooving assembly 13 is equipped with a high-precision milling cutter and a CNC system, capable of machining precise grooves on the base plate 1 and the upper plate 5 according to preset parameters. The dispensing assembly 14, through a dispensing gun 40 and an automatic control system, precisely performs dispensing operations between the base plate 1 and the crystal oscillator chip 3, ensuring uniform adhesive distribution. The adhesive application assembly 15 employs a roller coating method, using the adhesive application roller 22 to evenly apply adhesive to the grooves in the upper plate 5 and the area in contact with the base plate 1, further ensuring the uniformity and consistency of the adhesive application. This equipment not only improves the automation level and production efficiency of crystal oscillator packaging, but also significantly enhances packaging quality and reduces production costs through high-precision processing and uniform adhesive application, making it particularly suitable for large-scale production environments.

[0037] Furthermore, the X-direction moving assembly 8 includes a first slide rail 16 disposed on the frame 7, a first support plate 9 having a first slide groove 17, the first support plate 9 being slidably disposed on the first slide rail 16 via the first slide groove 17, and also includes a first lead screw 18 threaded through the first support plate 9 and rotatably disposed on the frame 7, the first lead screw 18 being rotated to drive the first support plate 9 to move in the X direction, and a first drive unit 19 for driving the first lead screw 18 to rotate is also disposed on the frame 7; The glue application assembly 15 includes a second slide rail 20 arranged on the frame 7 along the Z-axis direction, and a first mounting base 21 slidably arranged on the second slide rail 20. A glue application roller 22 and a contact roller 23 are rotatably arranged on the first mounting base 21. A placement gap 24 is formed between the contact roller 23 and the glue application roller 22. The placement gap 24 is used to place liquid glue. The contact roller 23 is a heating roller. The assembly also includes a telescopic rod 25 arranged on the frame 7. After the telescopic rod 25 is extended and retracted, it is used to drive the first mounting base 21 to slide on the second slide rail 20. After the first mounting base 21 slides on the second slide rail 20, it is used to abut against the upper plate 5 or the bottom plate 1. After the first support plate 9 slides on the first slide rail 16, the glue roller 22 is used to apply glue to the bottom plate 1 and the upper plate 5.

[0038] In this embodiment, the X-direction moving component 8, through the cooperation of the first slide rail 16 on the frame 7 and the first slide groove 17 on the first support plate 9, enables the first support plate 9 to slide smoothly in the X direction. Simultaneously, the first lead screw 18, threaded through the first support plate 9 and rotatably mounted on the frame 7, is controlled by the first drive unit 19, thereby precisely driving the first support plate 9 to move in the X direction, ensuring accurate positioning of the base plate 1 and the upper plate 5 during processing. The glue application component 15 is mounted on the second slide rail 20 on the frame 7 along the Z-axis direction. The first mounting base 21 is slidably mounted on the second slide rail 20 and moves along the Z-axis direction through the extension and retraction of the telescopic rod 25. A glue application roller 22 and an abutment roller 23 are rotatably mounted on the first mounting base 21, with a gap 24 between them to accommodate liquid glue. The abutment roller 23 is a heating roller, which helps in the uniform distribution and rapid curing of the glue. When the first mounting base 21 slides on the second slide rail 20, it can abut against the upper plate 5 or the bottom plate 1, while the sliding of the first support plate 9 on the first slide rail 16 allows the glue-applying roller 22 to accurately apply glue to the bottom plate 1 and the upper plate 5. This design not only improves the uniformity and consistency of glue application, but also enhances the automation level of the equipment, reduces manual operation, and improves production efficiency and packaging quality.

[0039] Furthermore, the grooving assembly 13 includes a third slide rail 26 arranged along the Y-axis on the frame 7, a second mounting seat 27 slidably disposed on the third slide rail 26, and a second lead screw 28 threaded through the second mounting seat 27 and rotatably disposed on the frame 7. After the second lead screw 28 rotates, it is used to drive the second mounting seat 27 to move along the Y direction. The frame 7 is also provided with a second drive unit 29 for driving the second lead screw 28 to rotate. The second mounting base 27 is provided with a fourth slide rail 30 arranged along the Z-axis direction on the frame 7, and also includes a third mounting base 31 slidably arranged on the fourth slide rail 30, and a third lead screw 32 threaded through the third mounting base 31 and rotatably arranged on the second mounting base 27. After the third lead screw 32 rotates, it is used to drive the third mounting base 31 to slide on the fourth slide rail 30. A T-slot milling cutter 33 and a third drive unit 34 for driving the T-slot milling cutter 33 are rotatably arranged on the third mounting base 31, and also include a fourth drive unit 35 for driving the third lead screw 32 to rotate.

[0040] In this embodiment, the slotting assembly 13 of the crystal oscillator packaging equipment is designed to achieve a high degree of automation and precise control. The slotting assembly 13 is arranged along the Y-axis on a third slide rail 26 on the frame 7, and a second mounting seat 27 is slidably mounted on the third slide rail 26. The second mounting seat 27 is connected to a second lead screw 28 by a thread. The second lead screw 28 is rotatably mounted on the frame 7, and its rotation is controlled by a second drive unit 29, thereby driving the second mounting seat 27 to move along the Y direction. A fourth slide rail 30 along the Z-axis is also provided on the second mounting seat 27, and a third mounting seat 31 is slidably mounted on the fourth slide rail 30. The third mounting seat 31 is connected to a third lead screw 32 by a thread. The third lead screw 32 is rotatably mounted on the second mounting seat 27, and its rotation is controlled by a third drive unit 34, driving the third mounting seat 31 to slide on the fourth slide rail 30. A T-slot milling cutter 33 is rotatably mounted on the third mounting seat 31 for machining T-slots on the base plate 1 and the upper plate 5. In addition, a fourth drive unit 35 is provided to read the rotation status of the third lead screw 32 and achieve precise control. This design enables the slotting assembly 13 to move precisely in the Y and Z axis directions, ensuring that the T-slot milling cutter 33 can accurately machine the required grooves on the base plate 1 and the upper plate 5, improving the accuracy and efficiency of slotting, and providing a high-quality base plate 1 and upper plate 5 for subsequent crystal oscillator packaging, thereby improving the quality and reliability of the entire packaging process.

[0041] Furthermore, the dispensing assembly 14 includes a fifth slide rail 36 arranged along the Y-axis on the frame 7, a fourth mounting seat 37 slidably disposed on the fifth slide rail 36, and a fourth lead screw 38 threaded through the fourth mounting seat 37 and rotatably disposed on the third mounting seat 31. After the fourth lead screw 38 rotates, it is used to drive the fourth mounting seat 37 to move along the Y direction. The frame 7 is also provided with a fifth drive unit 39 for driving the fourth lead screw 38 to rotate. A dispensing gun 40 is disposed on the fourth mounting seat 37. After the fourth mounting seat 37 slides on the fifth slide rail 36, the lowest point of the dispensing gun 40 along the Z-axis is lower than or higher than the bottom of the T-slot milling cutter 33.

[0042] In this embodiment, the dispensing assembly 14 is arranged along the Y-axis on the fifth slide rail 36 on the frame 7, and a fourth mounting base 37 is slidably disposed on the fifth slide rail 36. The fourth mounting base 37 is connected to a fourth lead screw 38 by threads. The fourth lead screw 38 is rotatably disposed on a third mounting base 31, and its rotation is controlled by a fifth drive unit 39, thereby driving the fourth mounting base 37 to move along the Y direction. A dispensing gun 40 is disposed on the fourth mounting base 37. The Z-axis position of the dispensing gun 40 can be adjusted as needed, so that its lowest point is lower than or higher than the bottom of the T-slot milling cutter 33. This design allows the dispensing gun 40 to perform dispensing operations at different Z-axis positions, ensuring that the glue can be accurately applied between the base plate 1 and the crystal oscillator chip 3, while avoiding interference with the T-slot milling cutter 33. By precisely controlling the Y-axis movement of the fourth mounting base 37 and the Z-axis position of the dispensing gun 40, the dispensing assembly 14 can achieve high-precision dispensing operations, providing a uniform and stable glue layer for crystal oscillator packaging, thereby further improving the quality and reliability of the entire packaging process.

[0043] Furthermore, a second support plate 41 is provided on the first support plate 9, and an elastic element 42 is provided between the first support plate 9 and the second support plate 41. The elastic element 42 is used to provide a force for the second support plate 41 to move away from the first support plate 9.

[0044] In this embodiment, a second support plate 41 is added to the first support plate 9 of the crystal oscillator packaging equipment, and an elastic element 42 is cleverly configured between the two. The ingenuity of this design lies in the fact that the elastic element 42 can apply a force to the second support plate 41 away from the first support plate 9. When the base plate 1 or the upper plate 5 is placed on the second support plate 41, the force provided by the elastic element 42 can ensure that these parts to be processed and the processing components (such as the grooving component 13, the dispensing component 14, etc.) achieve precise and stable contact. For example, during the grooving process, the second support plate 41 can be tightly fitted to the processing surface of the grooving component 13 under the action of the elastic element 42, thereby ensuring the accuracy and quality of the grooving. Similarly, in the dispensing stage, the action of the elastic element 42 can keep the base plate 1 and the dispensing gun 40 at an appropriate distance, ensuring that the glue can be applied evenly and accurately to the predetermined position. This flexible support structure not only improves the equipment's adaptability to base plates 1 and top plates 5 of different thicknesses, but also enhances the stability and reliability of the entire packaging process, effectively reducing processing errors caused by poor component contact or uneven pressure, and providing a strong guarantee for achieving high-quality crystal oscillator packaging.

[0045] As a further technical solution, the second support plate 41 is provided with intermediate parts 52 at intervals, and also includes two hinge plates 43 respectively hinged on both sides of the intermediate parts 52. The first mounting plate 11 and the first mounting groove 10 are mounted on the hinge plates 43 through the second support plate 41. After the two hinge plates 43 swing on the intermediate parts 52, the two hinge plates 43 abut against each other.

[0046] As a further technical solution, a sliding gap 44 is formed between the intermediate component 52 and the second support plate 41, and a plurality of hydraulic rods 45 arranged in the sliding gap 44 are also included. The toothed plate 46 is disposed at the telescopic end of the hydraulic rod 45 and slidably disposed in the sliding gap 44. After the hydraulic rod 45 is extended or retracted, it is used to push the toothed plate 46 to slide in the sliding gap 44. It also includes two gears 47 that mesh with both sides of the toothed plate 46 respectively. A connecting rod 48 is provided on the gear 47. A sliding groove 49 is provided at the bottom of each hinge plate 43. A sliding block 50 is slidably disposed in the sliding groove 49. The side of the connecting rod 48 away from the gear 47 is respectively hinged to the two sliding blocks 50. After the gear 47 rotates, it drives the sliding block 50 to slide in the sliding groove 49. After the sliding block 50 slides in the sliding groove 49, the two hinge plates 43 move closer to each other.

[0047] This embodiment provides a clamping device for a crystal oscillator packaging equipment, the structure of which is as follows: a second support plate 41 is disposed on a first support plate 9 to support a bottom plate 1 and an upper plate 5; an intermediate member 52 is disposed at intervals on the second support plate 41; two hinge plates 43 are respectively hinged to both sides of the intermediate member 52; a first mounting plate 11 and a first mounting groove 10 are disposed on the hinge plate 43 through the second support plate 41; a sliding gap 44 is formed between the intermediate member 52 and the second support plate 41; a plurality of hydraulic rods 45 are arranged in the sliding gap 44; a toothed plate 46 is disposed at the telescopic end of the hydraulic rods 45 and is slidably disposed in the sliding gap 44; two gears 47 are respectively meshed with both sides of the toothed plate 46; a connecting rod 48 is disposed on the gear 47; a sliding groove 49 is provided at the bottom end of each hinge plate 43; a sliding block 50 is slidably disposed in the sliding groove 49; and the side of the connecting rod 48 away from the gear 47 is respectively hinged to the two sliding blocks 50. Its working principle is as follows: The base plate 1 or upper plate 5 is placed on the first mounting plate 11. The hydraulic rod 45 extends and retracts, pushing the toothed plate 46 to slide within the sliding gap 44. The toothed plate 46 drives the gear 47 to rotate, and the gear 47, through the connecting rod 48, drives the sliding block 50 to slide within the sliding groove 49, thereby bringing the two hinged plates 43 closer together and clamping the base plate 1 and upper plate 5. Its advantages are: strong adaptability, able to adapt to base plates 1 and upper plates 5 of different sizes; stable clamping, the transmission structure of the gear 47 and sliding block 50 ensures the smoothness and reliability of the clamping action; high degree of automation, the entire clamping process is controlled by the extension and retraction of the hydraulic rod 45, enabling automated operation; improved packaging quality, the precise control of the clamping device ensures the stability and consistency of the base plate 1 and upper plate 5 during processing, thereby improving the overall quality of crystal oscillator packaging. This clamping device design not only improves the automation level and production efficiency of crystal oscillator packaging equipment, but also significantly improves packaging quality and reduces production costs through precise clamping control, making it particularly suitable for large-scale production environments.

[0048] As a further technical solution, powerful electromagnets 51 are provided on both sides of the hinge plate 43. When the two hinge plates 43 are brought close to each other, the powerful electromagnets 51 are energized, and the two hinge plates 43 are in contact with each other.

[0049] In this embodiment, powerful electromagnets 51 are provided on both sides of the hinge plate 43. When the two hinge plates 43 approach each other, the powerful electromagnets 51 are energized, causing the two hinge plates 43 to fit together, thereby providing a stable clamping force and a tight fit for vacuum sealing of the upper plate 5 and the bottom plate 1, ensuring the smooth progress of the vacuum sealing process. Powerful electromagnets 51 are installed on both sides of the hinge plate 43, and these electromagnets are symmetrically arranged on both sides of the hinge plate 43 to ensure that the two hinge plates 43 can be evenly stressed when they approach each other. When the hydraulic rod 45 extends and retracts, it pushes the toothed plate 46 to slide, thereby driving the gear 47 to rotate, causing the sliding block 50 to slide in the sliding groove 49. Finally, after the two hinge plates 43 approach each other and clamp the upper plate 5 and the bottom plate 1, the powerful electromagnets 51 are energized. When the powerful electromagnet 51 is energized, it generates a strong magnetic force, causing the two hinge plates 43 to adhere to each other under the action of the magnetic force. This further enhances the stability of the clamping and ensures that the upper plate 5 and the bottom plate 1 are tightly fitted together during the vacuum sealing process, without loosening or displacement. During the vacuum sealing process, due to the magnetic force of the powerful electromagnet 51, the upper plate 5 and the bottom plate 1 are firmly clamped between the two hinge plates 43, forming a sealed encapsulation structure. At this time, the encapsulation structure is vacuumed by an external vacuum sealing device, and a certain pressure is applied to ensure that the adhesive between the upper plate 5 and the bottom plate 1 can be evenly distributed and cured, forming a solid encapsulation. After the vacuum sealing is completed, the power supply to the powerful electromagnet 51 is cut off, and the magnetic force disappears. At this time, the reverse extension and retraction of the hydraulic rod 45 causes the toothed plate 46 to slide in the reverse direction, driving the gear 47 to rotate in the reverse direction. This causes the sliding block 50 to slide in the reverse direction within the sliding groove 49, ultimately causing the two hinge plates 43 to move away from each other, releasing the upper plate 5 and the bottom plate 1, completing one encapsulation cycle. By installing powerful electromagnets 51 on both sides of the hinge plate 43, and energizing the two hinge plates 43 to make them fit together when they are close together, this improvement not only enhances the stability of clamping, but also provides a tight fit between the upper plate 5 and the bottom plate 1 for vacuum sealing, ensuring the smooth progress of the vacuum sealing process. This design effectively avoids the loosening or displacement of the upper plate 5 and the bottom plate 1 due to insecure clamping during the vacuum sealing process, thereby further improving the quality and reliability of crystal oscillator packaging, and also providing a strong guarantee for achieving more efficient and stable automated production.

[0050] The above are merely preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A crystal oscillator packaging structure, characterized in that, Includes a base plate (1) having a first groove (2) and a crystal oscillator chip (3) for being disposed in the first groove (2), wherein the size and shape of the first groove (2) and the crystal oscillator chip (3) are adapted to each other; It also includes a dispensing layer (4), which is located between the base plate (1) and the crystal oscillator chip (3), and the dispensing layer (4) is used to provide good wire performance for the crystal oscillator chip (3); It also includes an upper plate (5) having a second groove (6) that matches the first groove (2).

2. A crystal oscillator packaging process, using the crystal oscillator packaging structure described in claim 1, characterized in that, Includes the following steps: S1. Processing of base plate (1): Select a high temperature resistant substrate as the base plate (1), and process the first groove (2) on the base plate (1) that matches the crystal oscillator chip (3) according to the size of the crystal oscillator chip (3). S2, dispensing and mounting: The adhesive used for dispensing is high-temperature resistant silver paste. After curing, the silver paste has a certain elasticity, which can provide good conductivity and a certain vibration buffer for the crystal oscillator chip (3), which is beneficial to the vibration of the crystal oscillator chip (3), while ensuring that the crystal oscillator chip (3) conducts the dispensing and the electrodes of the base plate (1) are connected. S3. Chip placement: Insert the crystal oscillator chip (3) into the first groove (2) of the base plate (1) to ensure the conduction between the crystal oscillator chip (3) and the electrodes of the base plate (1) and realize the electrical connection between the crystal oscillator chip (3) and the base plate (1); S4. Upper plate (5) processing: Process the second groove (6) of the upper plate (5). The material of the upper plate (5) can be FR-1, FR-2, FR-4, CEM-1 / CEM-3, BT resin. The size and shape of the second groove (6) match the first groove (2) to achieve a tight fit between the upper and lower plates. S5. Adhesive Packaging: Align the processed upper plate (5) with the bottom plate (1), adhere the upper and lower plates together with high-temperature resistant epoxy resin, and then perform vacuum sealing to make the upper and lower plates fit tightly together, forming a sealed packaging structure and completing the crystal oscillator packaging process.

3. The crystal oscillator packaging process according to claim 2, characterized in that, The adhesive coating on the upper plate (5) is applied by roller coating, which can ensure the uniformity and consistency of the adhesive coating and improve the packaging quality.

4. A crystal oscillator packaging device, characterized in that, The crystal oscillator packaging structure according to claim 1 and the packaging process according to claim 2 include a frame (7) and an X-direction moving component (8) movably disposed on the frame (7), and also include a first support plate (9) disposed on the X-direction moving component (8), the first support plate (9) having a first mounting groove (10), a first mounting plate (11) disposed in the first mounting groove (10), and a plurality of second mounting grooves (12) spaced apart on the first mounting plate (11), the second mounting grooves (12) being used to place the bottom plate (1) or the top plate (5); It also includes a grooving assembly (13) and a dispensing assembly (14) disposed on the frame (7), the grooving assembly (13) being used to groove the base plate (1) and the upper plate (5), and the dispensing assembly (14) being used to dispense adhesive between the base plate (1) and the crystal oscillator chip (3); It also includes an adhesive applicator (15) disposed on the frame (7) for applying adhesive to the upper plate (5).

5. A crystal oscillator packaging device according to claim 4, characterized in that, The X-direction moving component (8) includes a first slide rail (16) disposed on the frame (7), a first slide groove (17) on the first support plate (9), the first support plate (9) being slidably disposed on the first slide rail (16) through the first slide groove (17), and a first lead screw (18) threaded through the first support plate (9) and rotatably disposed on the frame (7). After the first lead screw (18) rotates, it is used to drive the first support plate (9) to move in the X direction. The frame (7) is also provided with a first drive unit (19) for driving the first lead screw (18) to rotate. The glue application assembly (15) includes a second slide rail (20) arranged along the Z-axis on the frame (7), and a first mounting seat (21) slidably arranged on the second slide rail (20). A glue application roller (22) and a contact roller (23) are rotatably arranged on the first mounting seat (21). A placement gap (24) is formed between the contact roller (23) and the glue application roller (22). The placement gap (24) is used to place liquid glue. The contact roller (23) is a heating roller. The assembly also includes a telescopic rod (25) arranged on the frame (7). After the telescopic rod (25) extends and retracts, it is used to drive the first mounting seat (21) to slide on the second slide rail (20). After the first mounting base (21) slides on the second slide rail (20), it is used to abut against the upper plate (5) or the bottom plate (1). After the first support plate (9) slides on the first slide rail (16), the glue roller (22) is used to apply glue to the bottom plate (1) and the upper plate (5).

6. A crystal oscillator packaging device according to claim 5, characterized in that, The slotting assembly (13) includes a third slide rail (26) arranged along the Y-axis on the frame (7), a second mounting seat (27) is slidably disposed on the third slide rail (26), and a second lead screw (28) threaded through the second mounting seat (27) and rotatably disposed on the frame (7). After the second lead screw (28) rotates, it is used to drive the second mounting seat (27) to move along the Y direction. The frame (7) is also provided with a second drive unit (29) for driving the second lead screw (28) to rotate. The second mounting base (27) is provided with a fourth slide rail (30) arranged along the Z-axis on the frame (7), and also includes a third mounting base (31) slidably arranged on the fourth slide rail (30), and a third lead screw (32) threaded through the third mounting base (31) and rotatably arranged on the second mounting base (27). After the third lead screw (32) rotates, it is used to drive the third mounting base (31) to slide on the fourth slide rail (30). The third mounting base (31) is rotatably provided with a T-slot cutter (33) and a third drive unit (34) for driving the T-slot cutter (33), and also includes a fourth drive unit (35) for driving the third lead screw (32) to rotate.

7. A crystal oscillator packaging device according to claim 6, characterized in that, The dispensing assembly (14) includes a fifth slide rail (36) arranged along the Y-axis on the frame (7), a fourth mounting seat (37) slidably disposed on the fifth slide rail (36), and a fourth lead screw (38) threaded through the fourth mounting seat (37) and rotatably disposed on the third mounting seat (31). After the fourth lead screw (38) rotates, it is used to drive the fourth mounting seat (37) to move along the Y direction. The frame (7) is also provided with a fifth drive unit (39) for driving the fourth lead screw (38) to rotate. A dispensing gun (40) is disposed on the fourth mounting seat (37). After the fourth mounting seat (37) slides on the fifth slide rail (36), the lowest point of the dispensing gun (40) along the Z-axis is lower than or higher than the bottom of the T-slot milling cutter (33). A second support plate (41) is provided on the first support plate (9), and an elastic element (42) is provided between the first support plate (9) and the second support plate (41). The elastic element (42) is used to provide a force for the second support plate (41) to move away from the first support plate (9).

8. A crystal oscillator packaging device according to claim 7, characterized in that, The second support plate (41) is provided with intermediate parts (52) at intervals, and also includes two hinge plates (43) respectively hinged on both sides of the intermediate parts (52). The first mounting plate (11) and the first mounting groove (10) are mounted on the hinge plates (43) through the second support plate (41). After the two hinge plates (43) swing on the intermediate parts (52), the two hinge plates (43) abut against each other.

9. A crystal oscillator packaging device according to claim 8, characterized in that, A sliding gap (44) is formed between the intermediate component (52) and the second support plate (41), and a plurality of hydraulic rods (45) are arranged in the sliding gap (44), and a toothed plate (46) is provided at the telescopic end of the hydraulic rod (45) and slidably disposed in the sliding gap (44). After the hydraulic rod (45) is extended or retracted, it is used to push the toothed plate (46) to slide in the sliding gap (44); It also includes two gears (47) that mesh with both sides of the toothed plate (46) respectively. A connecting rod (48) is provided on the gear (47). A sliding groove (49) is provided at the bottom of each of the hinge plates (43). A sliding block (50) is slidably disposed in the sliding groove (49). The side of the connecting rod (48) away from the gear (47) is respectively hinged to the two sliding blocks (50). After the gear (47) rotates, it is used to drive the sliding block (50) to slide in the sliding groove (49). After the sliding block (50) slides in the sliding groove (49), the two hinge plates (43) move closer to each other.

10. A crystal oscillator packaging device according to claim 9, characterized in that, A powerful electromagnet (51) is provided on both sides of the hinge plate (43). When the two hinge plates (43) are close to each other, the powerful electromagnet (51) is energized and the two hinge plates (43) are in contact with each other.

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