A headset and intercom

Abstract

A headset seat and intercom, the headset seat comprises a seat body which can be mounted on a circuit board, characterized in that: the seat body is provided with a first jack and a second jack which are arranged transversely and spaced apart, the bottom of the seat body is provided with a fitting surface for fitting the surface of the circuit board and a first sunken part and a second sunken part which protrude downward from the fitting surface and correspond to the first jack and the second jack, the edge of the circuit board is formed with a first notch and a second notch which are adapted to the first sunken part and the second sunken part, the above scheme sets the first jack and the second jack in the same seat body, which can ensure the stability of the relative position of the first jack and the second jack, and the first sunken part and the second sunken part which can sink into the circuit board can reduce the overall thickness of the product after the headset seat is mounted on the circuit board, and when applied to the intercom, the thickness of the intercom can be reduced.

Description

Technical Field

[0001] This invention relates to an earphone holder and a walkie-talkie. Background Technology

[0002] The two headphone jacks on a walkie-talkie are typically a combination of 3.5mm and 2.5mm jacks, known as the Kenwood Type connector. First adopted by Kenwood Corporation of Japan, it later became the de facto industry standard and is currently the most widely used universal specification for walkie-talkie accessories. It's not simply a matter of separating the left and right channels; rather, it's an independent signal system designed for the two core functions of a walkie-talkie: "listening" and "speaking." The 3.5mm jack primarily handles the audio input, while the 2.5mm jack primarily handles the microphone input and PTT (Push-to-Talk) function. In the transmission, the existing two headphone jacks are configured in two independent headphone sockets. The two headphone sockets are independently mounted on the circuit board of the walkie-talkie. The headphone sockets adopt a DIP plug-in pin structure. The headphone sockets are stacked on the circuit board, and the pins are inserted into the sockets of the circuit board and soldered conductively. Because the two sockets are different in size, under the extreme compression of the headphone socket volume, the center lines of the two sockets cannot be configured to be on the same plane parallel to the circuit board. That is, the center of the two sockets has a height difference. The headphone sockets are directly stacked on the circuit board, which also increases the thickness of the product. When applied to walkie-talkies, it will limit the overall thickness of the device, making it difficult to make the equipment thinner. Summary of the Invention

[0003] The purpose of this invention is to address the shortcomings of existing technologies by providing a headphone holder with a stable and reliable structure that can be recessed into a circuit board to reduce product thickness.

[0004] Another object of the present invention is to provide a walkie-talkie employing the above-described headphone jack.

[0005] The objective of this invention is achieved through the following technical solution: An earphone holder includes a base that can be mounted on a circuit board, characterized in that: the base is provided with a first socket and a second socket arranged horizontally at intervals, the bottom of the base is provided with a mating surface for mating the surface of the circuit board and a first recessed portion and a second recessed portion protruding downward from the mating surface and corresponding to the first socket and the second socket, and the edge of the circuit board is formed with a first notch and a second notch adapted to the first recessed portion and the second recessed portion.

[0006] The above solution places the first and second sockets in the same housing, which can ensure the stability of the relative positions of the first and second sockets. The first and second recessed parts that can be sunk into the circuit board can reduce the overall thickness of the product after the earphone socket is installed on the circuit board. When applied to walkie-talkies, this can reduce the thickness of the walkie-talkie.

[0007] Both the first and second sockets include a socket structure and a contact terminal extending into the socket structure. The base includes a base and a cover plate. The top surface of the base has a groove for forming the socket structure and a slot for installing the contact terminal. The bottom of the base has a first recessed portion, a second recessed portion, and the mating surface. The cover plate is disposed on the top surface of the base to cover the groove and the slot. During assembly, the contact terminal is inserted into the corresponding slot from the top of the base, and then the cover plate is closed to complete the product assembly. Assembly is convenient and quick.

[0008] The contact terminal has pins that penetrate the mating surface. The base has clearance holes for the pins to pass through. The circuit board has insertion holes for the pins to be inserted. The pins are used for conductive soldering to the circuit board, i.e., DIP plug-in soldering is adopted. The pins are soldered through the circuit board, which has excellent vibration resistance, plugging and unplugging resistance, and drop resistance.

[0009] The front side of the base has a first annular positioning portion surrounding the first socket inlet and a second annular positioning portion surrounding the second socket inlet, with the first and second annular positioning portions protruding from the edge of the circuit board.

[0010] The base has two opposing protruding edges on its top surface, and the cover plate is located between the two protruding edges. The side edge of the cover plate has a protruding snap-fit ​​part, and the protruding edge has a snap-fit ​​groove for the snap-fit ​​part to be inserted. The cover plate is snapped to the base through the snap-fit ​​part and the snap-fit ​​groove, which facilitates product assembly and reduces costs.

[0011] The bonding surface has a protruding positioning part, and the circuit board has a positioning hole for the positioning part to be inserted. The positioning part and the positioning hole cooperate to achieve accurate positioning of the relative position between the headphone socket and the circuit board, and prevent the headphone socket from shaking, shifting or even falling off during plugging and unplugging.

[0012] The first socket is a 3.5mm socket, and the second socket is a 2.5mm socket. The first socket and the second socket together form a K-type connector.

[0013] Both the first and second recessed portions have flat bottom surfaces. The thickness of the first and second recessed portions is greater than or equal to the thickness of the circuit board. This structure ensures that the first and second recessed portions can be hidden in the circuit board with maximum volume, so that after the earphone holder is installed on the circuit board, the thickness of the product is equal to or slightly greater than the thickness of the holder.

[0014] The center lines of the first and second sockets are parallel to each other and lie in the same plane parallel to the mating surface. Compared with the prior art where the two sockets have a height difference, this structure can further reduce the thickness of the product. When applied to walkie-talkies, the walkie-talkies can be made thinner.

[0015] A walkie-talkie, characterized in that it includes the aforementioned earphone holder. Attached Figure Description

[0016] Figure 1 This is a 3D view of the headphone jack and circuit board assembly.

[0017] Figure 2 This is a three-dimensional view of the headphone jack and circuit board assembly from another perspective.

[0018] Figure 3 This is an exploded view of the headphone jack and circuit board components.

[0019] Figure 4 This is an exploded view of the headphone jack and circuit board from another perspective.

[0020] Figure 5 For walkie-talkies that adopt the earphone socket of this application.

[0021] Figure 6 This is a 3D view of the headphone jack, with the cover removed.

[0022] Figure 7 This is an exploded view of the headphone jack components.

[0023] Figure 8 An exploded view of the headphone jack from another perspective. Detailed Implementation

[0024] Reference Figures 1 to 8 As shown, a walkie-talkie includes a circuit board 1 and an earphone holder 2. The earphone holder 2 includes a base body with first sockets 211 and second sockets 212 arranged horizontally at intervals. The bottom of the base body has a mating surface 21c for mating the surface of the circuit board 1 and a first recessed portion 21a and a second recessed portion 21b protruding downward from the mating surface 21c and corresponding to the first sockets 211 and the second sockets 212. The first recessed portion 21a and the second recessed portion 21b have flat bottom surfaces on the same plane, that is, the structure of the first sockets 211 and the second sockets 212 is formed on the bottom surfaces of the first recessed portion 21a and the second recessed portion 21b. The edge of the circuit board 11 has a first notch 14 and a second notch 13 adapted to the first recessed portion 21a and the second recessed portion 21b. The thickness of the first recessed portion 21a and the second recessed portion 21b is greater than the thickness of the circuit board 1. After installation, the bottom surfaces of the first recessed portion 21a and the second recessed portion 21b are lower than the bottom surface of the circuit board 11.

[0025] The base includes a base 21 and a cover 22. The base 21 is integrally molded from a polymer, specifically made of plastic. Similarly, the cover 22 is also made of plastic. Both the first socket 211 and the second socket 212 include a socket structure and contact terminals 23 extending partially into the socket structure. The first socket 211 is a 3.5mm socket, and the second socket 212 is a 2.5mm socket. The jack is a Kenwood K-type headphone jack. The jack structure and the structure of the contact terminal 23 are known prior art and will not be described in detail here. The top surface of the base 21 has a groove 215 for forming the jack structure and a slot 214 for installing the contact terminal 23. The bottom of the base 21 has a first recessed portion 21a, a second recessed portion 21b and a mating surface 21c. The cover plate 22 is provided on the top surface of the base 21 to cover the groove 215 and the slot 214. The top surface of the base 21 has two oppositely arranged protruding edges 213. The cover plate 22 is located between the two protruding edges 213. The side edge of the cover plate 22 has a protruding snap-fit ​​portion 221. The protruding edge 213 has a snap-fit ​​groove 2131 for the snap-fit ​​portion 221 to be inserted. The cover plate 22 is snap-fitted to the base 21 through the snap-fit ​​portion 221 and the snap-fit ​​groove 2131, which can facilitate product assembly and reduce costs.

[0026] The front side of the base 21 has a first annular positioning part 2111 surrounding the entrance of the first socket 211 and a second annular positioning part 2121 surrounding the entrance of the second socket 212. The first annular positioning part 2111 and the second annular positioning part 2121 protrude from the edge of the circuit board 1. The center lines of the first socket 211 and the second socket 212 are parallel to each other and are in the same plane parallel to the mating surface 21c. Compared with the prior art where the two sockets have a height difference, this structure can further reduce the thickness of the product. The thickness can be reduced by 2mm compared with the prior art. When applied to walkie-talkies, the walkie-talkies can be made thinner. Usually, the outer diameter of the second annular positioning part 2121 is slightly larger than the distance from the top surface of the base to the bottom surface of the first recessed part 21a and the second recessed part 21b. That is, the outer diameter of the second annular positioning part 2121 is slightly larger than the thickness of the base. This structure is to maximize the compression of the base thickness while ensuring the structure of the first socket 211 and the second socket 212.

[0027] The contact terminal 23 has a pin 231 that penetrates the mating surface 21c. The base 21 has a clearance hole 215 for the pin 231 to pass through. The circuit board 1 has a socket 11 for the pin 231 to be inserted. The pin 231 is electrically soldered to the circuit board 1, that is, the DIP plug-in pin soldering method is adopted. The pin 231 is soldered through the circuit board 1, which has excellent vibration resistance, plugging and unplugging resistance and drop resistance.

[0028] The mating surface 21c has two protruding positioning parts 216, and the circuit board 1 has two positioning holes 12 for the positioning parts 216 to be inserted. The positioning parts 216 and the positioning holes 12 cooperate to achieve accurate positioning of the relative position of the headphone socket and the circuit board 1, and prevent the headphone socket from shaking, shifting or even falling off during plugging and unplugging. Specifically, the positioning holes 12 are set on the circuit board 1 between the first notch 14 and the second notch 13.

[0029] The above solution places the first socket 211 and the second socket 212 in the same base, which can ensure the stability of the relative position of the first socket 211 and the second socket 212. The first recessed part 21a and the second recessed part 21b that can be sunk into the circuit board 1 can reduce the overall thickness of the product after the earphone socket is installed on the circuit board 1. When applied to walkie-talkies, the thickness of the walkie-talkie can be reduced.

[0030] The above description is merely a preferred embodiment of the present invention and should not be construed as limiting the scope of the present invention. All equivalent changes and modifications made in accordance with the scope of the patent application and the contents of the specification of the present invention should still fall within the scope of the patent of the present invention.

Claims

1. An earphone holder, comprising a base that can be mounted on a circuit board, characterized in that: The base is provided with a first socket and a second socket arranged horizontally at intervals. The bottom of the base is provided with a bonding surface for bonding to the surface of the circuit board and a first recessed portion and a second recessed portion protruding downward from the bonding surface and corresponding to the first socket and the second socket. The edge of the circuit board is formed with a first notch and a second notch that are adapted to the first recessed portion and the second recessed portion.

2. The earphone holder according to claim 1, characterized in that: Both the first and second sockets include a socket structure and a contact terminal extending into the socket structure. The base includes a base and a cover plate. The top surface of the base has a groove for forming the socket structure and a slot for installing the contact terminal. The bottom of the base has a first recessed portion, a second recessed portion, and the mating surface. The cover plate is disposed on the top surface of the base to cover the groove and the slot.

3. The earphone holder according to claim 2, characterized in that: The contact terminal has pins that penetrate the mating surface, the base has clearance holes for the pins to pass through, and the circuit board has insertion holes for the pins to be inserted. The pins are used for conductive soldering to the circuit board.

4. The earphone holder according to claim 2, characterized in that: The front side of the base has a first annular positioning portion surrounding the first socket inlet and a second annular positioning portion surrounding the second socket inlet, with the first and second annular positioning portions protruding from the edge of the circuit board.

5. An earphone holder according to claim 2, characterized in that: The base has two opposing protruding edges on its top surface, and the cover plate is located between the two protruding edges. The side edge of the cover plate has a protruding snap-fit ​​part, and the protruding edge has a snap-fit ​​groove for the snap-fit ​​part to be inserted.

6. An earphone holder according to any one of claims 1 to 5, characterized in that: The bonding surface has a protruding positioning part, and the circuit board has a positioning hole for the positioning part to be inserted.

7. An earphone holder according to any one of claims 1 to 5, characterized in that: The first socket is a 3.5mm socket, and the second socket is a 2.5mm socket. The first socket and the second socket together form a K-type connector.

8. An earphone holder according to any one of claims 1 to 5, characterized in that: Both the first and second recessed portions have flat bottom surfaces, and the thickness of the first and second recessed portions is greater than or equal to the thickness of the circuit board.

9. An earphone holder according to any one of claims 1 to 5, characterized in that: The center lines of the first and second sockets are parallel to each other and lie in the same plane parallel to the mating surface.

10. A walkie-talkie, characterized in that: Includes a circuit board and an earphone holder as described in any one of claims 1 to 9.

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