A radio frequency communication circuit, chip and communication device

Abstract

Embodiments of the present application provide a radio frequency communication circuit, a chip and a communication device, and relate to the technical field of communication, which can reduce the area occupied by the circuit single board, and is beneficial to improve the miniaturization of the device. In the radio frequency communication circuit, the first baseband circuit and the second baseband circuit are connected with the first radio frequency channel; the first radio frequency channel is connected with the first front-end channel and the second front-end channel; the first front-end channel and the second front-end channel are connected with the switch, and the switch is used for connecting the first radiator; the first baseband circuit is communicated with the first radiator through the first radio frequency channel and the first front-end channel in the first time period; the second baseband circuit is communicated with the first radiator through the first radio frequency channel and the second front-end channel in the second time period; the first baseband circuit and the first front-end channel support different communication standards from the second baseband circuit and the second front-end channel.

Description

Technical Field

[0001] This application relates to the field of communication technology, and in particular to a radio frequency communication circuit, chip, and communication device. Background Technology

[0002] As people's lives and work become increasingly diverse, their reliance on smart terminals, such as wearable devices, smartphones, and tablets, is growing, leading to a greater demand for mobile communication products. Currently, wearable devices, smartphones, and other electronic devices support a wider range of communication standards, including cellular communication, Wi-Fi, Bluetooth, GPS, and satellite communication, and can seamlessly switch between these standards based on user needs and scenarios. As these devices offer more communication functions, their circuitry becomes increasingly complex, impacting the required circuit board area and product size. This increased area also presents challenges for future performance improvements. Summary of the Invention

[0003] The embodiments of this application provide a radio frequency communication circuit, chip, and communication device that can reduce the area occupied by the circuit board and facilitate the miniaturization of the device.

[0004] In a first aspect, a radio frequency (RF) communication circuit is provided. The RF communication circuit includes: a first baseband circuit, a second baseband circuit, a first RF channel, and a front-end circuit; the front-end circuit includes a first front-end channel, a second front-end channel, and a switch. The first baseband circuit and the second baseband circuit are connected to the first RF channel; the first RF channel is connected to the first front-end channel and the second front-end channel; the first front-end channel and the second front-end channel are connected to the switch, which is used to connect to a first radiator; the first baseband circuit is configured to be connected to a first antenna through the first RF channel and the first front-end channel during a first time period; the second baseband circuit is configured to be connected to the first antenna through the first RF channel and the second front-end channel during a second time period; the first baseband circuit and the first front-end channel support a first communication standard, and the second baseband circuit and the second front-end channel support a second communication standard. In this embodiment, since the first and second communication standards are different standards, and the first and second time periods are different time periods (i.e., they do not overlap in time), the first baseband circuit and the second baseband circuit use the first radio frequency channel to connect with their respective front-end channels in a time-division manner, and then connect to the first radiator through a switch. Because the shared first radio frequency channel is reused, the area occupied by the circuit board can be reduced, which is beneficial for improving the miniaturization of the device. Furthermore, compared to using a single antenna radiator for each communication standard, in this embodiment, two communication standards reuse a single radiator. Therefore, when integrating this radio frequency communication circuit into a communication device, using a single radiator provides more design space than using multiple radiators. Thus, the radio frequency communication circuit provided by this embodiment can be designed with a radiator that has better communication performance.

[0005] In one possible implementation, the system further includes: a third baseband circuit; the front-end circuit also includes a third front-end channel; the third baseband circuit is connected to a first radio frequency (RF) channel; the first RF channel is also connected to the third front-end channel; the third front-end channel is connected to a first radiator via a switch; the third baseband circuit is configured to communicate with the first radiator via the first RF channel and the third front-end channel during a third time period; the third baseband circuit and the third front-end channel support a third communication standard. In this possible implementation, the first, second, and third communication standards can be different standards, and the first, second, and third time periods are different time periods, meaning they do not overlap in time. Specifically, the first, second, and third baseband circuits use the first RF channel to communicate with their respective front-end channels in a time-division manner, and then communicate with the first radiator via a switch. Because the shared first RF channel is reused, this reduces the area occupied by the circuit board, which is beneficial for miniaturizing the device.

[0006] In one possible implementation, the circuit further includes: a third baseband circuit and a second radio frequency (RF) channel; the front-end circuit also includes a third front-end channel; the third baseband circuit is connected to the second RF channel; the second RF channel is also connected to the third front-end channel; the third front-end channel is connected to the first radiator via a switch; the third baseband circuit is configured to communicate with the first radiator through the second RF channel and the third front-end channel during a third time period; the third baseband circuit and the third front-end channel support a third communication standard. This solution can support more communication standards, and when a first RF channel cannot be compatible with multiple baseband circuits, the RF communication circuit can be implemented by adding a second RF channel.

[0007] In one possible implementation, the system further includes: a third baseband circuit and a second radio frequency (RF) channel; the third baseband circuit is connected to the second RF channel; the second RF channel is connected to the second radiator; the third baseband circuit is configured to communicate with the second radiator via the second RF channel in a fourth time period; the third baseband circuit supports a third communication standard. In this scheme, the fourth time period may overlap with the first or second time period. By adding the second radiator and the second RF channel, the third baseband circuit can communicate via the second RF channel and the second radiator, thus enabling the third communication standard to coexist with the first or second communication standard at the same time. For example, BT communication often coexists with cellular communication or Wi-Fi communication. In some examples, the first communication standard is cellular communication, the second is Wi-Fi communication, and the third is BT communication. Thus, while the first or second baseband circuit is connected to the first radiator via the first RF channel and its respective front-end channel, the third baseband circuit can still communicate with the second radiator via the second RF channel to achieve BT communication.

[0008] In one possible implementation, the first radio frequency (RF) channel includes a first RF transmitting channel, a first RF receiving channel, and a first RF feedback channel; the first front-end channel includes a first front-end transmitting channel and a first front-end receiving channel; the second RF channel includes a second RF transmitting channel and a second RF receiving channel; the first RF transmitting channel is configured to communicate with the first radiator through the first front-end transmitting channel; the first RF receiving channel is configured to communicate with the first radiator through the first front-end receiving channel; the second RF transmitting channel and the second RF receiving channel are configured to communicate with the second radiator; the first RF feedback channel is connected to the path between the front-end circuit and the first radiator; the first RF feedback channel is also connected to the second RF receiving channel. In this scheme, the first RF feedback channel is also connected to the second RF receiving channel, so that the transmitted signal of the first radiator coupled to the second radiator can be canceled in the analog domain based on the feedback signal of the first RF feedback channel, thereby avoiding interference to the received signal of the third baseband circuit through the second radiator when the first baseband circuit or the second baseband circuit outputs an RF signal through the first radiator, and realizing the RF analog cancellation function.

[0009] In one possible implementation, the first RF feedback channel includes a splitter, with its common terminal and first branch terminal connected to the first RF feedback channel; the second RF receiving channel includes a combiner, with its first input terminal and output terminal connected to the second RF receiving channel; at least one of the following is further provided between the second branch port of the splitter and the second input port of the combiner: a filter, a delay unit, a phase shifter, and an attenuator. In this scheme, to achieve interference cancellation of the received signal on the second RF receiving channel by the feedback signal on the first RF feedback channel, one or more of the following processing methods are required for the signal in the path between the two: filtering, delay, phase adjustment, and attenuation. Specifically, this can be achieved by setting a splitter on the first RF feedback channel, a combiner on the second RF receiving channel, and one or more of the following: a filter, a delay unit, a phase shifter, and an attenuator, between the splitter and the combiner.

[0010] In one possible implementation, the first or second communication standard is any one of cellular communication, short-range communication, and satellite communication, wherein the first and second communication standards are different. Short-range communication includes, but is not limited to, BitTorrent communication and Wi-Fi communication.

[0011] In one possible implementation, the third communication standard is Bluetooth BT communication.

[0012] In one possible implementation, the first baseband circuit and the second baseband circuit are integrated on the first chip. This circuit fusion, achieved by integrating multiple baseband circuits with the same function onto the same chip, reduces the area occupied by the circuit board.

[0013] In one possible implementation, the first RF channel and the second RF channel are integrated into a second chip. This circuit fusion, achieved by integrating multiple RF channels with the same function onto a single chip, reduces the area occupied by the circuit board.

[0014] In one possible implementation, the front-end circuitry is integrated into a third chip.

[0015] In one possible implementation, the first baseband circuit, the second baseband circuit, and the first radio frequency channel are integrated into a first chip. This circuit fusion, achieved by integrating baseband circuits and radio frequency channels with different functions onto the same chip, can reduce the area occupied by the circuit board.

[0016] In one possible implementation, the first baseband circuit, the second baseband circuit, and the first radio frequency channel are integrated on the same die or different dies within the first chip. For example, based on the manufacturing processes used for the baseband circuit and the radio frequency channel, when both use the same fabrication process, they can be integrated on the same die within the same chip; if they use different fabrication processes, they can also be integrated on different dies.

[0017] In one possible implementation, the front-end circuitry and the first RF channel are integrated into a second chip. This circuit fusion, by integrating front-end circuitry and RF channels with different functions into the same chip, can reduce the area occupied by the circuit board.

[0018] In one possible implementation, the front-end circuitry and the first RF channel are integrated into the same die or different dies within the second chip. For example, based on the manufacturing processes used for the front-end circuitry and the RF channel, if both use the same fabrication process, they can be integrated onto the same die within the same chip; if they use different fabrication processes, they can also be integrated onto different dies.

[0019] In one possible implementation, the first baseband circuit, the second baseband circuit, the first radio frequency channel, and the front-end circuit are integrated into a first chip. This circuit fusion, achieved by integrating baseband circuits, front-end circuits, and radio frequency channels with different functions onto a single chip, can reduce the area occupied by the circuit board.

[0020] In one possible implementation, the first baseband circuit, the second baseband circuit, the first RF channel, and the front-end circuit are integrated on the same die or different dies within the first chip. For example, based on the manufacturing processes used for the baseband circuit, the front-end circuit, and the RF channel, when all three use the same fabrication process, they can be integrated on the same die within the same chip; if they use different fabrication processes, they can also be integrated on different dies.

[0021] In a second aspect, a communication method is provided, applied to a radio frequency (RF) communication circuit. The RF communication circuit includes a first baseband circuit, a second baseband circuit, a first RF channel, and a front-end circuit. The front-end circuit includes a first front-end channel, a second front-end channel, and a switch. The first baseband circuit and the second baseband circuit are connected to the first RF channel. The first RF channel is connected to the first front-end channel and the second front-end channel. The first front-end channel and the second front-end channel are connected to the switch, which is used to connect to a first radiator. The communication method includes: connecting the first baseband circuit to the first radiator through the first RF channel and the first front-end channel during a first time period; and connecting the second baseband circuit to the first radiator through the first RF channel and the second front-end channel during a second time period. The first baseband circuit and the first front-end channel support a first communication standard, and the second baseband circuit and the second front-end channel support a second communication standard.

[0022] In one possible implementation, the radio frequency communication circuit further includes: a third baseband circuit, and the front-end circuit further includes a third front-end channel; the third baseband circuit is connected to a first radio frequency channel; the first radio frequency channel is also connected to the third front-end channel; the third front-end channel is connected to a first radiator via a switch; the communication method further includes: connecting the third baseband circuit to the first radiator via the first radio frequency channel and the third front-end channel during a third time period; the third baseband circuit and the third front-end channel support a third communication standard.

[0023] In one possible implementation, the radio frequency communication circuit includes a third baseband circuit and a second radio frequency channel; the front-end circuit also includes a third front-end channel; the third baseband circuit is connected to the second radio frequency channel; the second radio frequency channel is also connected to the third front-end channel; the third front-end channel is connected to the first radiator via a switch; the communication method further includes: connecting the third baseband circuit to the first radiator via the second radio frequency channel and the third front-end channel during a third time period; the third baseband circuit and the third front-end channel support a third communication standard.

[0024] In one possible implementation, the radio frequency communication circuit further includes: a third baseband circuit and a second radio frequency channel; the third baseband circuit is connected to the second radio frequency channel; the second radio frequency channel is connected to the second radiator; the third baseband circuit is connected to the second radiator through the second radio frequency channel during a fourth time period; the third baseband circuit supports a third communication standard.

[0025] In one possible implementation, a first performance parameter is determined when the third baseband circuit communicates through the first radiator, and a second performance parameter is determined when the third baseband circuit communicates through the second radiator; user habits are determined based on the first and second performance parameters; and a third or fourth time period is determined based on the user habits.

[0026] Thirdly, a chip is provided, including a substrate and a radio frequency communication circuit packaged on the substrate as described in the first aspect or any possible implementation thereof.

[0027] Fourthly, a chip is provided, including a substrate and a front-end circuit packaged on the substrate; the front-end circuit includes: a first front-end channel, a second front-end channel, and a switch; the first front-end channel and the second front-end channel are connected to the switch, and the switch is used to connect to a first antenna; the first front-end channel and the second front-end channel are also used to connect to a radio frequency channel.

[0028] Fifthly, a chip is provided, including a substrate and at least two radio frequency channels packaged on the substrate; the radio frequency channels are used to connect baseband circuits and front-end circuits.

[0029] A sixth aspect is a communication device comprising a radio frequency communication circuit and at least one radiator, the at least one radiator being connected to the radio frequency communication circuit; the radio frequency communication circuit comprising the radio frequency communication circuit described in the first aspect or any possible implementation thereof.

[0030] The technical problems solved and the technical effects achieved by the technical solutions provided by the second to sixth aspects and their possible implementations can be referred to the specific descriptions in the first aspect and its possible implementations, and will not be repeated here. Attached Figure Description

[0031] Figure 1 A schematic diagram of the structure of a communication device provided for an embodiment of this application;

[0032] Figure 2 A schematic diagram of a radio frequency communication circuit provided for an embodiment of this application;

[0033] Figure 3 A schematic diagram of a radio frequency communication circuit is provided for another embodiment of this application;

[0034] Figure 4 A schematic diagram of an RFIC structure provided for an embodiment of this application;

[0035] Figure 5 A schematic diagram of the structure of a cellular radio frequency front-end module provided for an embodiment of this application;

[0036] Figure 6 A schematic diagram of a short-range radio frequency front-end module provided for an embodiment of this application;

[0037] Figure 7 A schematic diagram of the structure of a satellite radio frequency front-end module provided for an embodiment of this application;

[0038] Figure 8 A schematic diagram of the structure of a satellite radio frequency front-end module is provided for another embodiment of this application;

[0039] Figure 9 A schematic diagram of a radio frequency communication circuit is provided for another embodiment of this application;

[0040] Figure 10 A schematic diagram of a radio frequency communication circuit provided in another embodiment of this application;

[0041] Figure 11 A schematic diagram of a radio frequency communication circuit provided in another embodiment of this application;

[0042] Figure 12 A schematic diagram of a radio frequency communication circuit is provided for another embodiment of this application;

[0043] Figure 13 A schematic diagram of a radio frequency communication circuit provided in another embodiment of this application;

[0044] Figure 14 A schematic diagram of a radio frequency communication circuit provided in another embodiment of this application;

[0045] Figure 15 A schematic diagram of a radio frequency communication circuit is provided for another embodiment of this application;

[0046] Figure 16 A schematic diagram of a radio frequency communication circuit provided in another embodiment of this application;

[0047] Figure 17 A schematic diagram of a radio frequency communication circuit provided in another embodiment of this application;

[0048] Figure 18 A schematic diagram of a radio frequency communication circuit is provided for another embodiment of this application;

[0049] Figure 19 A schematic diagram of a radio frequency communication circuit provided in another embodiment of this application;

[0050] Figure 20 A schematic diagram of a radio frequency communication circuit provided in another embodiment of this application;

[0051] Figure 21 A partial structural schematic diagram of a radio frequency communication circuit provided for an embodiment of this application;

[0052] Figure 22 This is a flowchart illustrating a communication method provided for embodiments of this application. Detailed Implementation

[0053] The technical solutions of the embodiments of this application will be described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments.

[0054] Hereinafter, the terms "second," "first," etc., are used for descriptive convenience only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined with "second," "first," etc., may explicitly or implicitly include one or more of that feature. In the description of this application, unless otherwise stated, "a plurality of" means two or more.

[0055] In the embodiments of this application, directional terms such as "up," "down," "left," and "right" may be defined relative to the orientation of the components shown in the accompanying drawings. It should be understood that these directional terms can be relative concepts, used for relative description and clarification, and can change accordingly depending on the orientation of the components in the accompanying drawings.

[0056] In the embodiments of this application, unless otherwise explicitly specified and limited, the term "connection" should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral part; it can be a direct connection or an indirect connection through an intermediate medium. Furthermore, the term "coupled connection" can be a direct electrical connection or an indirect electrical connection through an intermediate medium. The term "contact" can be direct contact or indirect contact through an intermediate medium. In the embodiments of this application, "and / or" describes the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, or B existing alone, where A and B can be singular or plural. The character " / " generally indicates that the preceding and following related objects have an "or" relationship.

[0057] As people's lives and work become increasingly diverse, their reliance on communication devices, such as smart wearables (watches), smartphones, and tablets, is growing, leading to a greater demand for mobile communication products. Currently, smart wearables, smartphones, and other electronic devices support a wider range of communication standards, including cellular communication, Wi-Fi, Bluetooth, GPS, and satellite communication, and can seamlessly switch between these standards based on user needs and scenarios. As these devices offer more communication functions, their communication circuitry becomes increasingly complex, impacting the required circuit board area and product size. This increased circuit board area also presents challenges for future improvements in communication performance.

[0058] To meet the evolving needs of current communication functions and performance, and to provide users with a better product appearance, longer standby time, and more functional value, there is a need for an optimized radio frequency communication circuit that can significantly reduce the circuit board area required for different communication standards. In the embodiments of this application, different communication standards are supported by the same hardware circuit or hardware channel to reduce the communication layout area and improve communication performance.

[0059] Embodiments of this application include, but are not limited to, radio frequency communication circuits, chips, and communication devices. The technical solutions of this application can be applied to various communication devices. These devices can be deployed on land, including indoors or outdoors, handheld or vehicle-mounted. They can also be deployed on water (such as ships). Furthermore, they can be deployed in the air (e.g., on airplanes, balloons, and satellites). For example, the communication device can be a terminal or a base station. For example, the terminal includes, but is not limited to: mobile phones, tablets, laptops, PDAs, mobile internet devices (MIDs), wearable devices (such as smartwatches, smart bracelets, pedometers, etc.), in-vehicle devices (such as cars, bicycles, electric vehicles, airplanes, ships, trains, high-speed trains, etc.), virtual reality (VR) devices, augmented reality (AR) devices, wireless terminals in industrial control, smart home devices (such as refrigerators, televisions, air conditioners, electricity meters, etc.), smart robots, workshop equipment, wireless terminals in self-driving, wireless terminals in remote medical surgery, wireless terminals in smart grids, wireless terminals in transportation safety, wireless terminals in smart cities, or wireless terminals in smart homes, and flying equipment (such as smart robots, hot air balloons, drones, airplanes), etc. This application does not limit the type and form of the communication device.

[0060] like Figure 1As shown, the communication device 10 may include a processor 110, an external memory interface 120, an internal memory 121, a universal serial bus (USB) interface 130, a charging management module 140, a power management module 141, a battery 142, an antenna 1, an antenna 2, a mobile communication module 150, a wireless communication module 160, an audio module 170, a speaker 170A, a receiver 170B, a microphone 170C, a headphone jack 170D, a sensor module 180, buttons 190, a motor 191, an indicator 192, a camera 193, a display screen 194, and a subscriber identification module (SIM) card interface 195, etc. The sensor module 180 may include a pressure sensor 180A, a gyroscope sensor 180B, a barometric pressure sensor 180C, a magnetic sensor 180D, an accelerometer sensor 180E, a distance sensor 180F, a proximity sensor 180G, a fingerprint sensor 180H, a temperature sensor 180J, a touch sensor 180K, an ambient light sensor 180L, a bone conduction sensor 180M, etc.

[0061] Typically, the processor 110 is the control center of the communication device 10, connecting various parts of the device through various interfaces and lines. It executes software programs and / or software modules stored in memory, and calls data stored in memory to perform various functions and process data, thereby providing overall monitoring of the communication device 10. Optionally, the processor 110 may include one or more processing units. For example, the processor 110 may include a central processing unit (CPU), application processor (AP), modem processor, graphics processing unit (GPU), image signal processor (ISP), controller, video codec, digital signal processor (DSP), baseband processor and / or neural network processing unit (NPU), embedded controller (EC), system on chip (SOC), power management circuit (PMU), etc. Different processing units can be independent devices or integrated into one or more processors. The processor 110 may also include memory for storing instructions and data. In some embodiments, processor 110 may include one or more interfaces.

[0062] The charging management module 140 is used to receive charging input from the charger. The power management module 141 is used to connect the battery 142, and the charging management module 140 is connected to the processor 110.

[0063] The wireless communication function of the communication device 10 can be implemented through antenna 1, antenna 2, mobile communication module 150, wireless communication module 160, modem processor, and baseband circuit (or baseband processor). Antenna 1 and antenna 2 are used to transmit and receive electromagnetic wave signals. Each antenna in the communication device 10 can be used to cover one or more communication frequency bands; different antennas can also be reused to improve antenna utilization. In the embodiments of this application, the antenna may include the radiator provided in the embodiments of this application, wherein the radiator alone or together with other components such as a matching network constitutes the antenna.

[0064] The mobile communication module 150 can provide solutions for cellular wireless communication, including 2G / 3G / 4G / 5G / future communication systems, applied to the communication device 10. The modem processor can include a modulator and a demodulator. The modulator modulates the low-frequency baseband signal to be transmitted into a mid-to-high frequency signal. The demodulator demodulates the received electromagnetic wave signal into a low-frequency baseband signal. The demodulator then transmits the demodulated low-frequency baseband signal to the baseband circuit for processing. After processing by the baseband circuit, the low-frequency baseband signal is transmitted to the application processor. The application processor outputs sound signals through audio devices (not limited to speaker 170A, receiver 170B, etc.) or displays images or videos through the display screen 194. In some embodiments, the modem processor can be a separate device. In other embodiments, the modem processor can be independent of the processor 110 and can be housed in the same device as the mobile communication module 150 or other functional modules.

[0065] The wireless communication module 160 can provide solutions for wireless communication applications on the communication device 10, including wireless local area networks (WLANs) (such as wireless fidelity (Wi-Fi) networks), Bluetooth (BT), global navigation satellite system (GNSS), frequency modulation (FM), near field communication (NFC), and infrared (IR) technologies. The wireless communication module 160 can be one or more devices integrating at least one communication processing module. The wireless communication module 160 receives electromagnetic waves via antenna 2, performs frequency modulation and filtering of the electromagnetic wave signals, and sends the processed signal to processor 110. The wireless communication module 160 can also receive signals to be transmitted from processor 110, perform frequency modulation and amplification, and convert them into electromagnetic waves for radiation via antenna 2.

[0066] In some embodiments, antenna 1 of communication device 10 is coupled to mobile communication module 150, and antenna 2 is coupled to wireless communication module 160, enabling communication device 10 to communicate with networks and other devices via wireless communication technology. The wireless communication technology may include Global System for Mobile Communications (GSM), General Packet Radio Service (GPRS), Code Division Multiple Access (CDMA), Wideband Code Division Multiple Access (WCDMA), Time Division Code Division Multiple Access (TD-SCDMA), Long Term Evolution (LTE), BT, GNSS, WLAN, NFC, FM, and / or IR technologies, etc. The GNSS may include the Global Positioning System (GPS), the Global Navigation Satellite System (GLONASS), the BeiDou Navigation Satellite System (BDS), the Quasi-Zenith Satellite System (QZSS), and / or satellite-based augmentation systems (SBAS). In the embodiments of this application, different wireless communication technologies are also referred to as different communication standards.

[0067] Furthermore, the communication device 10 implements display functions through a GPU, a display screen 194, and an application processor; the communication device 10 implements shooting functions through an ISP, a camera 193, a video codec, a GPU, a display screen 194, and an application processor. The external memory interface 120 can be used to connect an external memory card, such as a Micro SD card, to expand the storage capacity of the communication device 10. The internal memory 121 can be used to store computer executable program code, which includes instructions.

[0068] The communication device 10 can implement audio functions through an audio module 170, a speaker 170A, a receiver 170B, a microphone 170C, a headphone jack 170D, and an application processor. Buttons 190 include a power button and volume buttons. A motor 191 can generate vibration feedback. An indicator 192 can be an indicator light, used to indicate charging status, battery level changes, messages, missed calls, notifications, etc. A SIM card interface 195 is used to connect a SIM card.

[0069] The structures illustrated in the embodiments of this application do not constitute a specific limitation on the communication device 10. In other embodiments of this application, the communication device 10 may include more or fewer components than illustrated, or combine some components, or split some components, or have different component arrangements. The illustrated components may be implemented in hardware, software, or a combination of software and hardware.

[0070] Specifically, refer to Figure 2 In some embodiments, a structural diagram of a radio frequency communication circuit 20 is shown.

[0071] The SOC200 is a system-on-a-chip, integrating a cellular communication baseband circuit 2002 and a processor 2001. A crucial communication module within the SOC200 is the cellular communication baseband circuit 2002, which, along with the cellular radio frequency chip 201, the cellular radio frequency front-end module 202, and the radiator 1, enables cellular communication. The short-range integrated chip 203, along with the short-range radio frequency front-end module 204 and the radiator 2, enables short-range communication. The satellite integrated chip 205, along with the satellite radio frequency front-end module 206 and the radiator 3, enables satellite communication. Of course, this example only uses cellular communication, short-range communication (such as Wi-Fi and BitTorrent), and satellite communication as examples; typically, it may also include circuitry to implement other communication standards.

[0072] Reference Figure 3 As shown, in some embodiments, a structural diagram of a radio frequency communication circuit 20 is illustrated. Figure 3 The main features shown in the text are as follows: Figure 2 The specific composition of each chip or circuit unit in the radio frequency communication circuit 20.

[0073] For each communication standard, such as cellular communication, short-range communication, and satellite communication, the radio frequency communication circuit 20 mainly consists of four parts. The first part is the baseband (BB) circuit, such as... Figure 3The SOC 200 contains the cellular communication baseband circuit 2002, the short-range communication baseband circuit 2031 in the short-range integrated chip 203, and the satellite communication baseband circuit 2051 in the satellite integrated chip 205. Part 2 is the radio frequency channel, mainly consisting of converters that implement digital-to-analog and analog-to-digital conversions during communication, as well as the radio frequency small signal processing section, such as... Figure 3 The cellular radio frequency integrated circuit (RFIC) 2011 in the cellular radio frequency chip 201, the short-range communication RFIC 2032 in the short-range integrated chip 203, and the satellite communication RFIC 2052 in the satellite integrated chip 205 are all included. Part 3 is the communication front-end circuit (or radio frequency front-end module, FEM), mainly including amplifiers for amplifying radio frequency signals, filters for filtering radio frequency signals, and frequency band selection switches; such as... Figure 3 The cellular RF front-end module 202 includes an amplifier 2021, a filter 2022, and a switch 2023; the short-range RF front-end module 204 includes a filter 2042 and a switch 2043, wherein the amplifier PA2033 is integrated into the short-range integrated chip 203, and in some examples, the amplifier PA2033 can also be integrated into the short-range RF front-end module 204; the satellite RF front-end module 206 includes an amplifier 2061, a filter 2062, and a switch 2063. Part 4 is the antenna section, such as... Figure 3 The circuit consists of radiator 1, radiator 2, and radiator 3. These four functional circuits together constitute a system that can meet the requirements of cellular communication, short-range communication, and satellite communication.

[0074] Typically, baseband circuitry is a unit that performs a series of digital processing functions, such as encoding, modulation, and channel mapping, according to the protocols of cellular communication, short-range communication, and satellite communication standards. The main function of an RFIC is as a converter, which performs the conversion between digital signals and analog signals. An RFIC includes an RF transmit channel, an RF receive channel, and an RF feedback correction channel. (Refer to...) Figure 4 As shown, taking the RFIC2011 for cellular communication as an example, the key circuits of the RF IC2011's radio frequency transmission channel include digital-to-analog converters (DACs) connected in sequence.

[0075] The circuit consists of 201101, amplifier 201102 (e.g., a variable gain amplifier (VGA)), mixer 201103, and amplifier 201104 (also a VGA), and an oscillator 201105 connected to mixer 201103. The analog-to-digital converter 201101 performs analog-to-digital conversion on the signal output from the baseband circuit to generate an analog-domain radio frequency (RF) signal. Amplifier 201102 amplifies the RF signal. Mixer 201103 mixes the amplified RF signal with the intermediate frequency (IF) signal generated by oscillator 201105 to achieve up-conversion of the RF signal. Amplifier 201104 further amplifies the mixed RF signal. The key circuit for the RF receiving channel is amplifier 201109 (which can be a low-noise amplifier) ​​connected in sequence. The system includes an amplifier (LNA), a mixer (MIXER) 201108, an amplifier 201107 (which can be a VGA), an analog-to-digital converter (DAC) 201106, and an oscillator 201110 connected to the mixer 201108. The amplifier 201109 amplifies the radio frequency signal received from the cellular radio frequency front-end module 202. The mixer 201108 mixes the amplified radio frequency signal with the local oscillator generated by the oscillator 201110. The oscillator (LO) signal is mixed to achieve down-conversion of the RF signal. Amplifier 201107 is used to amplify the mixed RF signal again, and analog-to-digital converter 201106 is used to convert the mixed RF signal from analog to digital. The RF feedback correction channel is similar to the RF receiving channel. The key circuits are amplifier 201114 (which can be an LNA), mixer 201113, amplifier 201112 (which can be a VGA), analog-to-digital converter 201111, and oscillator 201115 connected to mixer 201113 in sequence. The functions of each part of the circuit in the RF feedback correction channel are similar to those in the RF receiving channel, and will not be described in detail here. Figure 4 The specific devices shown in the RF transmit channel, RF receive channel and RF feedback correction channel are only examples. In some examples, amplifier 201107 in the RF receive channel and amplifier 201112 in the RF feedback correction channel can be removed. Of course, other devices can be added to the RF transmit channel, RF receive channel and RF feedback correction channel if needed.

[0076] The radio frequency front-end module (cellular radio frequency front-end module 202, short-range radio frequency front-end module 204, and satellite radio frequency front-end module 206, and in some examples the radio frequency front-end module is also referred to as front-end circuit) is generally composed of amplifiers (e.g., PA), filters (or duplexers) and switches. Based on the hardware in the above radio frequency front-end module, the front-end channel (amplification, filtering) required for each communication standard and the front-end channel selection function are provided.

[0077] Among them, reference Figure 5 As shown, the cellular RF front-end module 202 includes a front-end transmitting channel composed of an amplifier 20211 and a filter 20221 connected in sequence, and a front-end receiving channel composed of an amplifier 20212 and a filter 20222 connected in sequence. The front-end transmitting channel and the front-end receiving channel are respectively connected to the two selection terminals of a switch 2023. The common terminal of the switch 2023 is connected to the radiator 1. Thus, the switch 2023 can selectively connect either the front-end receiving channel or the front-end transmitting channel to the radiator 1. Furthermore, Figure 5 The diagram also shows a coupler 2024 connected to the common terminal of switch 2023. This coupler 2024 can be replaced by a power divider, bridge, or other devices. Its main function is to couple a feedback signal from the input or output RF signal of the cellular RF front-end module 202 to the RF feedback correction channel of RFIC 2011. The baseband circuit can then use this feedback signal to correct the output RF signal, thus achieving feedback detection. Of course, Figure 5 Only some of the components of the cellular RF front-end module 202 are shown, and the complete composition of the entire cellular RF front-end module is not fully represented. For example, it may include channels for high frequency band (low band, LB), intermediate frequency band (medium band, MB), and high frequency band (high band, HB). Thus, the PA includes PAs for each frequency band (LB, MB, and HB) of cellular communication, and the filters (or duplexers) also include filters (or duplexers) for each frequency band required for cellular communication, such as filters (or duplexers) for LB B8 / B28, MB, HB, etc.

[0078] Among them, reference Figure 6As shown, the short-range RF front-end module 204 includes amplifiers 20411 and 20412, a switch 2043, and a filter 2042. Amplifiers 20411 and 20412 are respectively connected to the two selection terminals of switch 2043. The common terminal of switch 2043 is connected to the radiator 2 through filter 2042. Thus, switch 2043 can selectively connect either amplifier 20411 or amplifier 20412. This allows amplifier 20411 and filter 2042 to form a front-end receiving channel connected to the radiator 2, or amplifier 20412 and filter 2042 to form a front-end receiving channel connected to the radiator 2. Furthermore, Figure 6 The diagram also shows a coupler 2044 connected to the common terminal of switch 2043. This coupler 2044 can also be replaced by a power divider, bridge, or other devices. It is mainly used to couple a feedback signal from the input or output RF signal of the short-range RF front-end module 204 to the RF feedback correction channel of RFIC 2032. Of course, Figure 6 Only some of the components of the short-range RF front-end module 204 are shown; the entire composition of the short-range RF front-end module is not fully represented.

[0079] Among them, reference Figure 7 and Figure 8 As shown, the satellite radio frequency front-end module 206 includes a front-end transmitting channel composed of an amplifier 20611 and a filter 20621 connected in sequence, and a front-end receiving channel composed of an amplifier 20612 and a filter 20622 connected in sequence. The front-end transmitting channel and the front-end receiving channel are respectively connected to the two selection terminals of a switch 2063. The common terminal of the switch 2063 is connected to the radiator 1. Thus, the switch 2063 can selectively switch between connecting the front-end receiving channel or the front-end transmitting channel to the radiator 1. Furthermore, Figure 7 The image also shows a coupler 2064 connected to the common terminal of switch 2063. Figure 8 The diagram also shows a coupler 2064 connected between filter 20621 and a selection terminal of switch 2063. This coupler 2064 can also be replaced by a power divider, bridge, or other devices, and is mainly used to couple a feedback signal from the input or output RF signal of the cellular RF front-end module 206 to the RF feedback correction channel of RFIC 2052. Of course, Figure 7 and Figure 8 Only some of the components of the satellite radio frequency front-end module 206 are shown; the entire composition of the satellite radio frequency front-end module is not represented. Furthermore... Figure 7 and Figure 8 The position of the coupler 2064 can also be set in other locations, such as between the amplifier 20611 and the filter 20621. In other words, the location for generating the feedback signal can be selected according to the requirements of the entire system for the design of the feedback signal.

[0080] Among them, the above Figures 5 to 8 The provided cellular RF front-end module 202, short-range RF front-end module 204, and satellite RF front-end module 206 do not constitute limitations on each other. In some examples, when the selection of internal components allows, the architecture of one type of communication front-end module can be used as the architecture of the other two types of communication front-end modules.

[0081] In the above scheme, based on Figures 2 to 8 As shown, different communication standards use their own baseband circuits, RFICs, and front-end circuits (RF front-end modules). The baseband circuits for different communication standards are set in independent chips. For example, the baseband circuit 2002 for cellular communication is set in SOC200, the baseband circuit 2031 for short-range communication is distributed in short-range integrated chip 203, and the baseband circuit 2051 for satellite communication is distributed in satellite integrated chip 205. In addition, the RFICs for different communication standards are also integrated in independent chips, and the RF front-end modules for different communication standards are also integrated in independent chips. The reason for this is that the chips for the RF communication circuits of different standards are manufactured by different manufacturers, resulting in low integration. When assembling them into RF communication circuits with multiple communication standards, there is usually a problem of low integration and large board layout area, which ultimately affects the size of the product.

[0082] Furthermore, in the above scheme, if coordination is required for cellular communication, short-range communication, and satellite communication, an additional chip is needed to independently carry the arbitration module, which will increase the layout area of ​​the circuit board and increase costs. In addition, since each channel of cellular communication, short-range communication, and satellite communication uses its own radiator as an antenna, firstly, the area occupied by the three radiators is large, which is not conducive to optimal design; secondly, if the three communication standards want to achieve optimal antenna performance, a switch needs to be added between the respective RF front-end module and the three radiators, so that different communication standards can select any of the three radiators as an antenna, so as to select the radiator with the best antenna performance for RF signal transmission and reception under different operating conditions. This addition of a switch will also increase the transmission loss of the transmission path and increase the layout area of ​​the circuit board.

[0083] To solve the above problems, refer to Figure 9 As shown, a radio frequency communication circuit 30 is provided, which includes: a first baseband circuit 3011, a second baseband circuit 3012, a first radio frequency channel 3021, and a front-end circuit 303; the front-end circuit 303 includes a first front-end channel 3031, a second front-end channel 3032, and a switch 3033.

[0084] The first baseband circuit 3011 and the second baseband circuit 3012 are connected to the first radio frequency channel 3021; ​​the first radio frequency channel 3021 is connected to the first front-end channel 3031 and the second front-end channel 3032; the first front-end channel 3031 and the second front-end channel 3032 are connected to the switch 3033, which is used to connect to the radiator 1.

[0085] based on Figure 9 In terms of the connection structure, the first baseband circuit 3011 is configured to be connected to the radiator 1 through the first radio frequency channel 3021 and the first front-end channel 3031 during the first time period; the second baseband circuit 3012 is configured to be connected to the radiator 1 through the first radio frequency channel 3021 and the second front-end channel 3032 during the second time period; the first baseband circuit 3011 and the first front-end channel 3031 support the first communication standard, and the second baseband circuit 3012 and the second front-end channel 3032 support the second communication standard.

[0086] in Figure 9 The internal structure of the baseband circuit, RF channel, front-end circuit, and front-end channel shown can be referred to the foregoing. Figures 2-8 The description in the example shown will not be repeated here; wherein, the first communication standard or the second communication standard is any one of cellular communication, short-range communication and satellite communication, and the first communication standard is different from the second communication standard.

[0087] The first time period and the second time period are different time periods, that is, they do not overlap in time. The first baseband circuit and the second baseband circuit use the first radio frequency channel to connect with their respective front-end channels in a time-division manner, and then connect with the radiator 1 through a switch. Since the shared first radio frequency channel is reused, the area occupied by the circuit board can be reduced, which is conducive to improving the miniaturization of the device.

[0088] Furthermore, unlike the use of a single radiator for each communication standard, the embodiments of this application reuse a single radiator for two communication standards. Therefore, when integrating the RF communication circuit 30 into a communication device, using a single radiator provides greater design flexibility compared to using multiple radiators. Thus, the RF communication circuit 30 provided by the embodiments of this application can be designed to have a radiator with better communication performance. For example, the RF communication circuit provided by this solution allows the radiator of an antenna to operate in different polarization states, and flexible switching between different polarization states can be achieved by switching between different communication standards. For instance, satellite communication radiators operate in circular polarization, while cellular communication, Wi-Fi communication, and BT communication operate in linear polarization.

[0089] Combination Figure 9As shown, the first baseband circuit 3011 and the second baseband circuit 3012 can be integrated on the same chip 1, the first RF channel 3021 can be integrated on chip 2, and the front-end circuit 303 can be integrated on chip 3. In some examples, the first baseband circuit 3011, the second baseband circuit 3012, and the first RF channel 3021 can also be integrated on the same die or different dies of the same chip; for example, based on the manufacturing process used for the baseband circuit and the RF channel, when both use the same manufacturing process, they can be integrated on the same die of the same chip; if they use different manufacturing processes, they can also be integrated on different dies. Similarly, the front-end circuit and the first RF channel 3021 can be integrated on the same chip, specifically, the front-end circuit and the first RF channel 3021 can be integrated on the same die or different dies of the same chip. Similarly, the first baseband circuit 3011, the second baseband circuit 3012, the first RF channel 3021, and the front-end circuit 303 can be integrated into the same chip; specifically, this can be the same bare die or different bare dies integrated into the same chip. The chip typically includes a substrate for packaging and the aforementioned circuits packaged on the substrate, while the bare die typically contains these circuits. By integrating multiple circuits with the same or different functions into the same chip, circuit fusion can reduce the area occupied by the circuit board.

[0090] Reference Figure 10 As shown, in another example, the radio frequency communication circuit 30 further includes a third baseband circuit 3013, and the front-end circuit 303 further includes a third front-end channel 3034; the third baseband circuit 3013 is connected to the first radio frequency channel 3021; ​​the first radio frequency channel 3021 is also connected to the third front-end channel 3034; the third front-end channel 3034 is connected to the radiator 1 through a switch 3033.

[0091] based on Figure 10 In the connection structure, the third baseband circuit 3013 is functionally configured to connect with the radiator 1 through the first radio frequency channel 3021 and the third front-end channel 3034 during the third time period; the third baseband circuit 3013 and the third front-end channel 3034 support a third communication standard. The first, second, and third communication standards are any one of cellular communication, short-range communication, and satellite communication, and the first, second, and third communication standards are different.

[0092] and Figure 9 The difference is that, Figure 10The circuit shown includes an additional set of baseband circuits and front-end channels. The first, second, and third time periods are different time periods, meaning they do not overlap in time. Specifically, the first, second, and third baseband circuits use the first RF channel to connect to their respective front-end channels in a time-division manner, and then connect to radiator 1 via switches. This reuse of the shared first RF channel reduces the area occupied by the circuit board, thus improving device miniaturization. For example, the third baseband circuit 3013 can be integrated with other baseband circuits on chip 1, the second RF channel 3022 can be integrated with other RF channels on chip 2, and the third front-end channel 3034 can be integrated with other front-end channels on chip 3. Of course, based on… Figure 9 There are other integration methods, which will not be elaborated here.

[0093] Reference Figure 11 As shown, in yet another example, in order to support more communication standards, compared to Figure 9 In the example shown, the RF communication circuit 30 further includes: a third baseband circuit 3013 and a second RF channel 3022; the front-end circuit 303 further includes a third front-end channel 3034; the third baseband circuit 3013 is connected to the second RF channel 3022; the second RF channel 3022 is also connected to the third front-end channel 3034; the third front-end channel 3034 is connected to the radiator 1 via a switch 3033; the third baseband circuit 3013 is configured to communicate with the radiator 1 through the second RF channel 3022 and the third front-end channel 3034 during a third time period; the third baseband circuit 3013 and the third front-end channel 3034 support a third communication standard. The first, second, and third communication standards are any one of cellular communication, short-range communication, and satellite communication, and the first, second, and third communication standards are different. This solution can support more communication standards, and when one RF channel cannot be compatible with multiple baseband circuits, the RF communication circuit 30 can be implemented by adding another RF channel. For example, the third baseband circuit 3013 can be integrated with other baseband circuits in chip 1, and the second RF channel 3022 can be integrated with other RF channels in chip 2, and the third front-end channel 3034 can be integrated with other front-end channels in chip 3. Of course, based on... Figure 9 There are other integration methods, which will not be elaborated here.

[0094] Reference Figure 12As shown, in another example, the RF communication circuit 30 further includes: a third baseband circuit 3013 and a second RF channel 3022; the third baseband circuit 3013 is connected to the second RF channel 3022; the second RF channel 3022 is connected to the radiator 2; the third baseband circuit 3013 is configured to communicate with the radiator 2 through the second RF channel 3022 in a fourth time period; the third baseband circuit supports a third communication standard. For example, the third baseband circuit 3013 can be integrated with other baseband circuits in chip 1, and the second RF channel 3022 can be integrated with other RF channels in chip 2, of course, based on... Figure 9 Other integration methods are also described, but will not be elaborated here. The first, second, and third communication standards are any one of cellular communication, short-range communication, and satellite communication, and the first, second, and third communication standards are different. In some examples, BT communication often coexists with cellular communication or Wi-Fi communication. Therefore, in some examples, the first communication standard can be cellular communication, the second communication standard can be Wi-Fi communication, and the third communication standard can be BT communication. In this way, when the first baseband circuit 3011 or the second baseband circuit 3012 is connected to the radiator 1 through the first radio frequency channel 3021 and their respective front-end channels, the third baseband circuit 3012 can still be connected to the radiator 2 through the second radio frequency channel 3022 to achieve BT communication. In this scheme, the fourth time period can overlap with the first or second time period.

[0095] Reference Figure 13 As shown, it can also be Figure 12 and Figure 11 The illustrated scheme combines the following: in this scheme, the second RF channel 3022 is connected to radiator 1 via a third front-end channel 3034 and a switch 3033, and the second RF channel 3022 is also connected to radiator 2. Thus, the third baseband circuit 3012 can selectively connect to radiator 1 or radiator 2 based on its communication performance via different radiators 1 or radiator 2.

[0096] Reference Figure 14As shown, in another example, in this radio frequency communication circuit 30, the first radio frequency channel 3021 includes a first radio frequency transmitting channel, a first radio frequency receiving channel, and a first radio frequency feedback channel; the first front-end channel 3031 includes a first front-end transmitting channel and a first front-end receiving channel; the second radio frequency channel 3022 includes a second radio frequency transmitting channel and a second radio frequency receiving channel; the first radio frequency transmitting channel is configured to communicate with radiator 1 through the first front-end transmitting channel; the first radio frequency receiving channel is configured to communicate with radiator 1 through the first front-end receiving channel; the second radio frequency transmitting channel and the second radio frequency receiving channel are configured to communicate with radiator 2; the first radio frequency feedback channel is connected in the path between the front-end circuit 303 and radiator 1; see reference. Figure 14 The diagram also shows a coupler 304 connected to the common terminal of switch 3033. This coupler 304 can also be replaced by a power divider, bridge, or other devices. Its main function is to couple a feedback signal from the input or output radio frequency signal to radiator 1 to a first radio frequency feedback channel (or first radio frequency feedback correction channel). One function of this first radio frequency feedback channel is... Figure 5 Similar to the RF feedback correction channel shown, it implements feedback detection functionality. In embodiments of this application, the first RF feedback channel is also connected to the second RF receiving channel. This allows for the cancellation of the transmitted signal from the radiator 1 coupled to the radiator 2 in the analog domain based on the feedback signal from the first RF feedback channel. This avoids interference from the first or second baseband circuit outputting RF signals through the radiator 1 to the received signal from the third baseband circuit through the radiator 2, thus achieving RF analog cancellation functionality. In some examples, this coupler 304 can also be integrated into the front-end circuit.

[0097] based on Figures 9-14 The provided radio frequency communication circuit also includes a corresponding communication method, for example: based on Figure 9 The architecture shown includes the following communication method:

[0098] S101, In the first time period, the first baseband circuit is connected to the first antenna through the first radio frequency channel and the first front-end channel.

[0099] S102, in the second time period, the second baseband circuit is connected to the first antenna through the first radio frequency channel and the second front-end channel.

[0100] The first baseband circuit and the first front-end channel support the first communication standard, and the second baseband circuit and the second front-end channel support the second communication standard.

[0101] based on Figure 9 The architecture shown includes the following communication method:

[0102] S101, In the first time period, the first baseband circuit is connected to the first radiator through the first radio frequency channel and the first front-end channel.

[0103] S102, in the second time period, the second baseband circuit is connected to the first radiator through the first radio frequency channel and the second front-end channel.

[0104] The first baseband circuit and the first front-end channel support the first communication standard, and the second baseband circuit and the second front-end channel support the second communication standard.

[0105] based on Figure 10 The architecture shown includes the following communication method:

[0106] S101, In the first time period, the first baseband circuit is connected to the first radiator through the first radio frequency channel and the first front-end channel.

[0107] S102, in the second time period, the second baseband circuit is connected to the first radiator through the first radio frequency channel and the second front-end channel.

[0108] S103. In the third time period, the third baseband circuit is connected to the first radiator through the first radio frequency channel and the third front-end channel.

[0109] The first baseband circuit and the first front-end channel support the first communication standard, the second baseband circuit and the second front-end channel support the second communication standard, and the third baseband circuit and the third front-end channel support the third communication standard.

[0110] based on Figure 11 The architecture shown includes the following communication method:

[0111] S101, In the first time period, the first baseband circuit is connected to the first radiator through the first radio frequency channel and the first front-end channel.

[0112] S102, in the second time period, the second baseband circuit is connected to the first radiator through the first radio frequency channel and the second front-end channel.

[0113] S103. In the third time period, the third baseband circuit is connected to the first radiator through the second radio frequency channel and the third front-end channel.

[0114] The first baseband circuit and the first front-end channel support the first communication standard, the second baseband circuit and the second front-end channel support the second communication standard, and the third baseband circuit and the third front-end channel support the third communication standard.

[0115] based on Figure 12 The architecture shown includes the following communication method:

[0116] S101, In the first time period, the first baseband circuit is connected to the first radiator through the first radio frequency channel and the first front-end channel.

[0117] S102, in the second time period, the second baseband circuit is connected to the first radiator through the first radio frequency channel and the second front-end channel.

[0118] S103. In the fourth time period, the third baseband circuit is connected to the second radiator through the second radio frequency channel.

[0119] The first baseband circuit and the first front-end channel support the first communication standard, the second baseband circuit and the second front-end channel support the second communication standard, and the third baseband circuit and the third front-end channel support the third communication standard.

[0120] In addition, Figure 12 Based on this, the first performance parameters of the third baseband circuit when communicating through the first radiator and the second performance parameters of the third baseband circuit when communicating through the second radiator can also be determined; user habits can be determined based on the first and second performance parameters; and a third or fourth time period can be determined based on the user habits.

[0121] The specific technical problems solved and the technical effects achieved by this communication method can be found in the hardware architecture example above, and will not be repeated here.

[0122] Specifically, taking the integration of three communication standards—cellular communication, satellite communication, and short-range communication—as an example, in a radio frequency communication circuit 40, referring to... Figure 15 As shown, it includes chip 1, chip 2, and chip 3. For each communication standard, such as cellular communication, short-range communication, and satellite communication, a system that supports cellular communication, short-range communication, and satellite communication mainly consists of four parts. The first part is the baseband (BB) circuit, such as... Figure 15 As shown, the baseband circuit 2002 for cellular communication, the baseband circuit 2031 for short-range communication, and the baseband circuit 2051 for satellite communication are integrated on chip 1. The second part is the radio frequency (RF) channel, mainly consisting of converters that implement digital-to-analog and analog-to-digital conversions during communication, as well as RF small signal processing components, such as... Figure 15 The RFIC 2011 for cellular communication, the RFIC 2032 for short-range communication, and the RFIC 2052 for satellite communication are integrated into chip 2. Part 3 is the communication front-end circuit (or RF front-end module), mainly including amplifiers for amplifying RF signals, filters for filtering RF signals, and frequency band selection switches; such as... Figure 15The RF front-end module for cellular communication includes amplifier 2021 and filter 2022; the RF front-end module for short-range communication includes PA2033 and filter 2042; the RF front-end module for satellite communication includes amplifier 2061 and filter 2062; and switches 2022 / 2043 / 2063 shared by the three standards are integrated into chip 3. Part 4 is the antenna section, such as... Figure 15 The radiator 1 in the middle. The above four functional circuits can constitute a system that meets the requirements of cellular communication, short-range communication, and satellite communication. Figure 15 In the example shown, the baseband circuits, RF channels, and front-end circuits of various standards are integrated into a single chip. Each circuit section functions according to its respective communication standard, as described in the preceding example. Specifically, switches 2022 / 2043 / 2063 can multiplex the three communication standards for one radiator for time-sharing communication, or they can connect the circuits for each of the three communication standards to an independent radiator.

[0123] Reference Figure 16 As shown, in a radio frequency communication circuit 50, after integrating the three types of radio frequency channels (RFICs) into a single chip 2, the RFIC 2011 for cellular communication, the RFIC 2032 for short-range communication, and the RFIC 2052 for satellite communication can be further multiplexed into a single RFIC 2011 / 2032 / 2052 (or refer to the above). Figure 10 (Example shown). Similarly, the three switches (switch 2022, switch 2043 and switch 2063) in the front-end circuit of the three standards can be multiplexed into a single switch 2022 / 2043 / 2063.

[0124] Reference Figure 17 As shown, in a radio frequency communication circuit 60, a cellular communication baseband circuit 2002, a short-range communication baseband circuit 2031, and a satellite communication baseband circuit 2051, as well as RFICs 2011 / 2032 / 2052, can also be integrated on chip 1; see reference. Figure 18 As shown, in a radio frequency communication circuit 70, a front-end circuit supporting three communication standards and RFIC2011 / 2032 / 2052 can also be integrated into chip 3; see reference Figure 19 As shown, in a radio frequency communication circuit 80, the baseband circuit 2002 for cellular communication, the baseband circuit 2031 for short-range communication, and the baseband circuit 2051 for satellite communication, RFIC 2011 / 2032 / 2052, and the front-end circuit supporting the three communication standards are integrated on chip 1; in this way, the interconnection between the various functional circuits is also implemented inside the chip, which makes it simpler and improves the performance of interconnection.

[0125] This explanation will be based on a smartwatch that integrates five communication standards: cellular, satellite, Wi-Fi, BitTorrent, and GNSS. (Refer to...) Figure 20 As shown, a radio frequency communication circuit is provided, relative to Figure 14 In that Figure 20 The diagram illustrates the specific structures of the first RF channel 3031 and the second RF channel 3032. Chip 1 primarily includes baseband circuits (BB) for four communication standards: cellular, satellite, Wi-Fi, and BitTorrent. Chip 2 primarily includes the first RF channel 3031 and the second RF channel 3032. Chip 3 primarily includes front-end circuits for the four communication standards: cellular, satellite, Wi-Fi, and BitTorrent, such as amplifiers and filters for each standard. The front-end circuits for the four communication standards are connected to radiator 1 via a multiplexed switch. Chip 2 also integrates a module for GNSS communication. Specifically, the two RF channels in chip 2 are designed as 2T2R (two RF receive channels and two RF transmit channels) + 1MRX (one RF feedback channel). The 1TRX in the first RF channel 3031 supports cellular, satellite, Wi-Fi, and BitTorrent services. The circuit architecture of the first RF channel 3031 adopts a zero-IF architecture (see details). Figure 4 (As shown); Additionally, the second RF channel 3032's 1TRX supports BT communication and GNSS services, using either a digital transmitter architecture or a zero-IF architecture. In this example, the RF transmission channel of the second RF channel 3032 adopts a digital transmitter architecture, while the RF receiving channel adopts a zero-IF architecture. In this example, the analog port TX0 of the RF transmission channel of the first RF channel 3031 is connected to the front-end circuit, the analog port RX0 of the RF receiving channel of the first RF channel 3031 is connected to the front-end circuit, the analog port MRX0 of the RF feedback channel of the first RF channel 3031 is connected between the front-end circuit and radiator 1, and the RF transmission and receiving channels of the second RF channel 3032 are connected to radiator 2 via analog port TRX1. The GNSS module is also connected to radiator 2. Filters can also be provided between analog port TRX1 and radiator 2, and between the GNSS module and radiator 2. Furthermore, there is a hardware connection between the RF feedback channel of the first RF channel 3021 and the RF receiving channel of the second RF channel 3022 to implement feedback detection and RF analog cancellation functions; for example, refer to... Figure 21As shown, in order to achieve the interference cancellation effect of the feedback signal on the RF feedback channel of the first RF channel 3021 on the received signal on the RF receiving channel of the second RF channel 3022, it is necessary to perform one or more of the following processing on the signal in the path between the two: filtering, delay, phase adjustment, and attenuation. Specifically, this can be achieved by setting a splitter on the RF feedback channel of the first RF channel 3021, setting a combiner on the RF receiving channel of the second RF channel 3022, and setting one or more of the following between the splitter and the combiner: filter, delayer, phase shifter, and attenuator. Specifically, the first RF channel 3021 includes a splitter on its RF feedback channel, with the common terminal and first branch terminal of the splitter connected to the RF feedback channel of the first RF channel 3021; ​​the second RF channel 3022 includes a combiner on its RF receiving channel, with the first input terminal and output terminal of the combiner connected to the RF receiving channel of the second RF channel 3022; at least one of the following is further provided between the second branch port of the splitter and the second input port of the combiner: a filter, a delay unit, a phase shifter, and an attenuator. For example, in... Figure 21 In this example, both the splitter and combiner are placed between the analog-to-digital converter and the mixer, and only the filter, delayer, and phase shifter between the combiner and the splitter are shown. Of course, in other examples, the splitter and combiner can be placed in other locations within the same channel.

[0126] Furthermore, the analog port TX0 of the RF transmitting channel of the first RF channel 3031, the RF transmitting channel of the second RF channel 3032, and the RF receiving channel are interconnected via a switch through the analog port TRX1. Similarly, the analog port RX0 of the RF receiving channel of the first RF channel 3031, the RF transmitting channel of the second RF channel 3032, and the RF receiving channel are interconnected via a switch through the analog port TRX1. This allows for the selection of either radiator 1 or radiator 2 for the BT communication system. For example, the BB of the BT communication system can connect to radiator 1 and transmit / receive BT communication signals via the second RF channel 3022 and analog ports RX0 and TX0 through the RF front-end module. Alternatively, the BB of the BT communication system can transmit / receive BT communication signals via the second RF channel 3022 and radiator 2.

[0127] Between chip 1 and chip 2, there is also a pair of differential traces (or other high-speed traces, such as SERDES, etc., but in this embodiment, analog differential traces are mainly used for illustration), which are connected between the baseband circuit BB of cellular communication, satellite communication, and Wi-Fi communication and the first radio frequency channel 3031, and are used for receiving RX and transmitting TX digital signals; between chip 1 and chip 2, there is also another pair of BT differential traces, which are connected between the baseband circuit BB of BT communication and the second radio frequency channel 3032, and are used for receiving RX and transmitting TX digital signals. Figure 20 The diagram also shows control lines and a clk signal line, which are used to transmit control signals and clock signals between chips. The control signals can be control signals for active devices in the RF channel or control signals for switching between RF channels.

[0128] In addition, a coexistence arbitration circuit is also integrated in chip 1. It is mainly used to select one of cellular communication, satellite communication and Wi-Fi communication to complete the corresponding communication under the first radio frequency channel 3031. Compared with setting an additional coexistence arbitration circuit, the coexistence arbitration circuit is directly integrated into chip 1 in this solution, which can also save the circuit board layout area. In addition, an interference cancellation function is designed in chip 1 to realize the interference cancellation of cellular communication, satellite communication and Wi-Fi communication to BT communication in the digital domain.

[0129] Combination Figure 22 As shown, based on Figure 20 The illustrated radio frequency communication circuit hardware architecture, when applied to a watch, also provides a communication method based on the watch, specifically including the following steps:

[0130] S201. Check if eSIM is activated on the watch.

[0131] When the mobile phone has an embedded subscriber identification module (SIM) enabled, it means that the mobile phone supports cellular communication. If the mobile phone has an eSIM enabled, then proceed to step S202. If it has not been enabled, it means that the mobile phone does not support cellular communication. Then proceed to step S401 based on the confirmation result.

[0132] S202. Determine whether the watch is to be used alone.

[0133] Typically, a watch, as a wearable device, can be used in conjunction with mobile terminal devices such as mobile phones and PDAs. For example, when a watch is used with a mobile phone, in order to save power, its own cellular communication function can be turned off, and the watch can share the mobile phone's cellular communication function by establishing a short-range communication connection with the mobile phone. Therefore, the watch only uses its own cellular communication function when it is used alone. So when the watch is used alone, continue to execute step S203; otherwise, execute step S401.

[0134] S203, the watch's cellular communication uses TRX0 and radiator 1.

[0135] based on Figure 20 The architecture of the radio frequency communication circuit shown is such that when the watch is used alone, it uses its own cellular communication function. At this time, the cellular communication BB needs to occupy the first radio frequency channel 3031 and connect to the radiator 1 through the analog port TRX0 and the front-end circuit to carry out cellular communication data transmission.

[0136] S204. The watch determines whether the cellular communication is in uplink, downlink, or idle state.

[0137] S205. If cellular communication is in both uplink and downlink, then cellular communication uses TRX0 and radiator 1.

[0138] S206. If the cellular communication is in an idle state, determine the watch's RRC status.

[0139] The idle RRC states include RRC-inactive and RRC-CONNECTED.

[0140] S207. Based on the watch's RRC status, during the gap time, BT communication uses TRX0 and radiator 1.

[0141] S301, Wi-Fi communication on the phone is turned off by default.

[0142] S302. Confirm whether Wi-Fi communication is manually enabled.

[0143] If Wi-Fi communication is manually enabled, proceed to step S303; otherwise, proceed to step S301.

[0144] S303, Wi-Fi communication uses TRX0 and radiator 1.

[0145] In this scheme, the order of steps S201-S207 and steps S301-S304 is not limited. Therefore, in this case, Wi-Fi communication and cellular communication may share the use of TRX0 and radiator 1. In this scheme, Wi-Fi communication and cellular communication use TRX0 and radiator 1 through time-division sharing. The connected time-division sharing can be coordinated and controlled by a coexistence arbitration circuit.

[0146] S304. If there is no continuous Wi-Fi communication or the watch screen is off, proceed to step S301; otherwise, continue to step S303.

[0147] S401 and BT communication use TRX0 and radiator 1.

[0148] S402, The mobile phone determines that the BT communication quality is ≤80dBm.

[0149] If the mobile phone determines that the BT communication quality is ≤80dBm, then step S403 is executed; otherwise, the current state is maintained.

[0150] S403, Initiate the diversity retransmission merging mechanism.

[0151] In addition, it should be noted that, due to Figure 20 The illustrated radio frequency communication circuit provides a separate radio frequency channel and radiator 2 for BT communication. Therefore, the above process can be considered to provide a scheme for BT communication to multiplex TRX0 and radiator 1. Since the radiator 1 provided by cellular communication is designed to have better performance than the radiator 2 used by BT communication alone, BT communication can be switched to TRX0 and radiator 1 during Wi-Fi communication and cellular communication when TRX0 and radiator 1 are not used, so as to improve the communication performance of BT communication, which is equivalent to increasing the time diversity and spatial diversity of BT communication.

[0152] Since BT communication can utilize radiator 1 or radiator 2 in a spatial diversity and temporal diversity manner, embodiments of this application also provide an adjustment mechanism for radiator 1 or radiator 2, specifically including the following steps:

[0153] S501, The watch performs statistics on the communication performance of radiators 1 and radiators 2.

[0154] For example, a watch can monitor the performance of communication through radiator 1 and radiator 2 over a long period of time or at regular intervals, and determine the first performance parameter of the BT communication baseband circuit when communicating through radiator 1, and the second performance parameter of the BT communication baseband circuit when communicating through radiator 2.

[0155] S502, train users' usage habits.

[0156] Specifically, user habits are determined by training using machine learning methods such as neural networks based on the first and second performance parameters.

[0157] S503, Adjust the radiator used for BT communication.

[0158] Based on user habits, determine the radiator used by BT communication at different times, and switch between radiator 1 and radiator 2 according to the corresponding time period.

[0159] In steps S501-S503, the performance of Bluetooth communication is trained and used as a criterion for adjusting the preferred radiator to achieve the default optimal performance during Bluetooth communication.

[0160] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any changes or substitutions within the technical scope disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A radio frequency communication circuit, characterized in that, include: The circuit includes a first baseband circuit, a second baseband circuit, a first radio frequency channel, and a front-end circuit. The front-end circuit includes a first front-end channel, a second front-end channel, and a switch; The first baseband circuit and the second baseband circuit are connected to the first radio frequency channel; The first radio frequency channel is connected to the first front-end channel and the second front-end channel; The first front-end channel and the second front-end channel are connected to the switch, and the switch is used to connect to the first radiator; The first baseband circuit is configured to be connected to the first radiator through the first radio frequency channel and the first front-end channel during a first time period; the second baseband circuit is configured to be connected to the first radiator through the first radio frequency channel and the second front-end channel during a second time period. The first baseband circuit and the first front-end channel support a first communication standard, and the second baseband circuit and the second front-end channel support a second communication standard.

2. The radio frequency communication circuit according to claim 1, characterized in that, It also includes: a third baseband circuit, and the front-end circuit further includes a third front-end channel; The third baseband circuit is connected to the first radio frequency channel; The first radio frequency channel is also connected to the third front-end channel; The third front-end channel is connected to the first radiator via the switch; The third baseband circuit is configured to communicate with the first radiator through the first radio frequency channel and the third front-end channel during a third time period; The third baseband circuit and the third front-end channel support a third communication standard.

3. The radio frequency communication circuit according to claim 1, characterized in that, It also includes: a third baseband circuit and a second radio frequency channel; the front-end circuit also includes a third front-end channel; The third baseband circuit is connected to the second radio frequency channel; The second radio frequency channel is also connected to the third front-end channel; The third front-end channel is connected to the first radiator via the switch; The third baseband circuit is configured to communicate with the first radiator through the second radio frequency channel and the third front-end channel during the third time period; The third baseband circuit and the third front-end channel support a third communication standard.

4. The radio frequency communication circuit according to claim 1 or 3, characterized in that, It also includes: a third baseband circuit and a second radio frequency channel; The third baseband circuit is connected to the second radio frequency channel; The second radio frequency channel is connected to the second radiator; The third baseband circuit is configured to communicate with the second radiator through the second radio frequency channel during the fourth time period; The third baseband circuit supports a third communication standard.

5. The radio frequency communication circuit according to claim 3 or 4, characterized in that, The first radio frequency channel includes a first radio frequency transmitting channel, a first radio frequency receiving channel, and a first radio frequency feedback channel; the first front-end channel includes a first front-end transmitting channel and a first front-end receiving channel. The second radio frequency channel includes a second radio frequency transmitting channel and a second radio frequency receiving channel; The first radio frequency transmission channel is configured to communicate with the first radiator through the first front-end transmission channel; The first radio frequency receiving channel is configured to communicate with the first radiator through the first front-end receiving channel; The second radio frequency transmitting channel and the second radio frequency receiving channel are configured to be in communication with the second radiator; The first radio frequency feedback channel is connected to the path between the front-end circuit and the first radiator; The first radio frequency feedback channel is also connected to the second radio frequency receiving channel.

6. The radio frequency communication circuit according to claim 5, characterized in that, The first radio frequency feedback channel includes a splitter, and the common terminal and the first branch terminal of the splitter are connected to the first radio frequency feedback channel; A combiner is provided on the second radio frequency receiving channel, and the first input terminal and the output terminal of the combiner are connected to the second radio frequency receiving channel; At least one of the following is also provided between the second branch port of the splitter and the second input port of the combiner: a filter, a delay unit, a phase shifter, and an attenuator.

7. The radio frequency communication circuit according to any one of claims 1-6, characterized in that, The first communication standard or the second communication standard is any one of cellular communication, short-range communication and satellite communication, and the first communication standard is different from the second communication standard.

8. The radio frequency communication circuit according to any one of claims 2-6, characterized in that, The third communication standard is Bluetooth BT communication.

9. The radio frequency communication circuit according to any one of claims 1-8, characterized in that, The first baseband circuit and the second baseband circuit are integrated into the first chip.

10. The radio frequency communication circuit according to any one of claims 2-6, characterized in that, The first radio frequency channel and the second radio frequency channel are integrated into the second chip.

11. The radio frequency communication circuit according to any one of claims 1-10, characterized in that, The front-end circuitry is integrated into a third chip.

12. The radio frequency communication circuit according to any one of claims 1-11, characterized in that, The first baseband circuit, the second baseband circuit, and the first radio frequency channel are integrated into the first chip.

13. The radio frequency communication circuit according to claim 12, characterized in that, The first baseband circuit, the second baseband circuit, and the first radio frequency channel are integrated into the same bare die or different bare dies in the first chip.

14. The radio frequency communication circuit according to any one of claims 1-13, characterized in that, The front-end circuit and the first radio frequency channel are integrated into the second chip.

15. The radio frequency communication circuit according to claim 14, characterized in that, The front-end circuit and the first radio frequency channel are integrated into the same bare die or different bare dies in the second chip.

16. The radio frequency communication circuit according to any one of claims 1-15, characterized in that, The first baseband circuit, the second baseband circuit, the first radio frequency channel, and the front-end circuit are integrated into the first chip.

17. The radio frequency communication circuit according to claim 16, characterized in that, The first baseband circuit, the second baseband circuit, the first radio frequency channel, and the front-end circuit are integrated into the same bare die or different bare dies in the first chip.

18. A chip, characterized in that, It includes a substrate and a radio frequency communication circuit as described in any one of claims 1-8 packaged on the substrate.

19. A chip, characterized in that, Includes a substrate and front-end circuitry packaged on the substrate; The front-end circuit includes: a first front-end channel, a second front-end channel, and a switch; The first front-end channel and the second front-end channel are connected to the switch, and the switch is used to connect to the first antenna; The first front-end channel and the second front-end channel are also used to connect to the radio frequency channel.

20. A chip, characterized in that, Includes a substrate and at least two radio frequency channels packaged on the substrate; The radio frequency channel is used to connect the baseband circuit and the front-end circuit.

21. A communication device, characterized in that, It includes a radio frequency communication circuit and at least one radiator, wherein the at least one radiator is connected to the radio frequency communication circuit; the radio frequency communication circuit includes the radio frequency communication circuit according to any one of claims 1-17.

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