Optical transmitter module, optical assembly, optical module and optical network system

Abstract

Embodiments of the present application provide a light emitting module, a light assembly, a light module and a light network system. Specifically, the light emitting module comprises a base, a substrate and a laser chip. The base is provided with a first radio frequency pin and a second radio frequency pin. The substrate is arranged on the base, and the surface of the substrate is provided with a first radio frequency transmission part and a second radio frequency transmission part. The first radio frequency transmission part is electrically connected with the first radio frequency pin, and the second radio frequency transmission part is electrically connected with the second radio frequency pin. The first pole of the laser chip is electrically connected with the first radio frequency transmission part through at least two first metal wires, and the second pole of the laser chip is arranged on the surface of the second radio frequency transmission part and is electrically connected with the second radio frequency transmission part. The plurality of first metal wires are arranged in parallel, so that the total inductance is reduced, thereby facilitating the improvement of the system bandwidth. Higher bandwidth allows higher frequency signals to pass through, which can reduce the loss of high frequency signals in the transmission process, thereby supporting high-speed data transmission.

Description

Technical Field

[0001] This application relates to the field of optical fiber communication technology, and in particular to an optical transmitting module, optical component, optical module and optical network system. Background Technology

[0002] In the field of optical fiber communication technology, optical transmitter modules are an indispensable and crucial component of photoelectric conversion modules, used to convert electrical signals into optical signals. Current optical transmitter modules can meet daily needs in 25G PON optical networks, but for bandwidth-intensive applications, such as large data centers and high-definition video processing, higher bandwidth is required to achieve high-speed data transmission. Therefore, with the continuous surge in network throughput, improving the bandwidth of optical transmitter modules has become the mainstream development trend. Summary of the Invention

[0003] This application provides an optical transmitting module, optical component, optical module, and optical network system for improving the bandwidth of the optical transmitting module and increasing the data transmission rate.

[0004] In a first aspect, this application provides an optical emitting module. The optical emitting module includes a base, a substrate, and a laser chip. The base is provided with a first radio frequency (RF) pin and a second RF pin. The substrate is fixed to the base. In one optional arrangement, the substrate can be perpendicular to the surface of the base. Alternatively, the substrate can be vertically arranged on the surface of the base. In another optional arrangement, the substrate can be horizontally arranged on the surface of the base. The substrate has a first surface, on which a first RF transmission section and a second RF transmission section are provided. The first RF transmission section is electrically connected to the first RF pin, and the second RF transmission section is electrically connected to the second RF pin. The laser chip is fixed to the first surface of the substrate. The laser chip has a first electrode and a second electrode. The first electrode and the first RF transmission section are electrically connected via at least two first metal wires, and the second electrode is electrically connected to the second RF transmission section. Optionally, the first electrode is positive, and the second electrode is negative. During operation, the first RF transmission section and the second RF transmission section differentially drive the laser chip to emit signal light.

[0005] This application does not specify the number of first metal wires. For example, the number of first metal wires can be two, three, four, or other numbers, which will not be listed here. The aforementioned multiple first metal wires are connected in parallel between the first RF transmission section and the laser chip, which reduces the total inductance and thus improves the system bandwidth. Higher bandwidth allows higher frequency signals to pass through, reducing high-frequency signal loss during transmission and supporting high-speed data transmission. Furthermore, the parallel connection of multiple first metal wires also reduces the resistance of the current path, lowering power consumption and temperature rise, indirectly improving high-frequency performance. Moreover, in this application, by arranging two RF transmission sections on the substrate and driving the laser chip to emit signal light in a differential manner, the anti-interference capability of the optical emission module is improved, high-frequency signal loss during transmission is reduced, and high-frequency signal integrity is improved, thereby achieving high-speed data transmission.

[0006] In summary, this application improves the bandwidth and high-frequency performance of the optical emission module by optimizing the packaging process of the laser chip, thereby achieving high-speed data transmission. This reduces the production cost of the optical emission module, enhances its market competitiveness, and facilitates commercial applications.

[0007] In one possible technical solution, the first RF transmission unit is electrically connected to the first RF pin via at least two second metal wires, and the second RF transmission unit is electrically connected to the second RF pin via at least two third metal wires. Optionally, the number of second and third metal wires can be two, three, four, or other quantities. The multiple second metal wires connected in parallel between the first RF transmission unit and the first RF pin reduce the total inductance of the second metal wires, thereby improving system bandwidth, reducing high-frequency signal loss during transmission, and supporting high-speed data transmission. The function of the third metal wires is similar to that of the second metal wires, and will not be elaborated here.

[0008] In one possible technical solution, the first radio frequency transmission unit and the second radio frequency transmission unit are arranged at a distance along a first direction. The distance between the first radio frequency transmission unit and the second radio frequency transmission unit can be a set value or it can vary.

[0009] In one possible technical solution, the first radio frequency transmission unit includes a first sub-unit, a second sub-unit, and a third sub-unit connected in sequence. The first sub-unit is electrically connected to a first electrode via at least two first metal wires, the third sub-unit is electrically connected to a first radio frequency pin, and the second sub-unit is located between the first sub-unit and the third sub-unit.

[0010] When specifically setting the first sub-part, the width of the first sub-part along the first direction is different from the width of the second sub-part along the first direction, and the area of ​​the first sub-part is greater than or equal to 0.02mm. 2Optionally, the area of ​​the first sub-part can be 0.025 mm². 2 0.03mm 2 0.035mm 2 0.04mm 2 Or other values, which will not be listed here. By ensuring that the area of ​​the first sub-part is not less than 0.02 mm... 2 On the one hand, a larger number of first metal wires can be used, thereby reducing the inductance of the first metal wires, increasing the bandwidth, and thus reducing the loss of high-frequency signals during transmission and increasing the signal transmission rate. On the other hand, the capacitance of the first sub-section can be increased, thereby improving the photoelectric gain.

[0011] When specifically designing the second sub-section, it can be a strip-shaped structure. The second sub-section can extend along a straight line, a broken line, or even a curve.

[0012] When specifically setting the third sub-part, the width of the third sub-part along the first direction is different from the width of the second sub-part along the first direction, and the area of ​​the third sub-part is greater than or equal to 0.015mm. 2 Optionally, the area of ​​the third sub-part can be 0.016 mm². 2 0.017mm 2 0.018mm 2 0.019mm 2 0.020mm 2 Or other values, which will not be listed here. By ensuring that the area of ​​the third sub-part is not less than 0.015 mm². 2 A larger number of second metal wires can be set, thereby reducing the inductance of the second metal wires, increasing the bandwidth, and thus reducing the loss of high-frequency signals during transmission and increasing the signal transmission rate.

[0013] As an example, the width of the first sub-section along the first direction is greater than the width of the second sub-section along the first direction, and the width of the third sub-section along the first direction is also greater than the width of the second sub-section along the first direction. In other words, the first radio frequency transmission section has the characteristic of being thin in the middle and thick at both ends.

[0014] In one possible technical solution, the second radio frequency transmission section includes a fourth subsection, a fifth subsection, and a sixth subsection connected in sequence. The second electrode of the laser chip is located on the surface of the fourth subsection and is electrically connected to it. The sixth subsection is electrically connected to a second radio frequency pin; optionally, the sixth subsection is electrically connected to the second radio frequency pin via at least two third metal wires.

[0015] When specifically configuring the fourth sub-part, the width of the fourth sub-part along the first direction can be greater than, or less than or equal to, the width of the fifth sub-part along the first direction. To improve the connection effect between the fourth sub-part and the laser chip, the orthographic projection of the laser chip on the substrate surface can be made to lie entirely within the fourth sub-part, thereby increasing the contact area between the laser chip and the fourth sub-part and improving the welding effect.

[0016] When specifically designing the fifth sub-section, it can be a strip-shaped structure. The fifth sub-section can extend along a straight line, a broken line, or even a curve.

[0017] When specifically setting the sixth sub-part, the width of the sixth sub-part along the first direction is different from the width of the fifth sub-part along the first direction, and the area of ​​the sixth sub-part is greater than or equal to 0.015mm. 2 Optionally, the area of ​​the sixth sub-section can be 0.016 mm². 2 0.017mm 2 0.018mm 2 0.019mm 2 0.020mm 2 Or other values, which will not be listed here. By ensuring that the area of ​​the sixth sub-part is not less than 0.015 mm... 2 At this time, a larger number of third metal wires can be set, thereby reducing the inductance of the third metal wire 800, reducing the loss of high-frequency signals, and increasing bandwidth.

[0018] As an example, the width of the fourth sub-section along the first direction is greater than the width of the fifth sub-section along the first direction, and the width of the sixth sub-section along the first direction is also greater than the width of the fifth sub-section along the first direction. In other words, the second radio frequency transmission section has the characteristic of being thin in the middle and thick at both ends.

[0019] Besides being thinner in the middle and thicker at both ends, in another possible technical solution, the first and second radio frequency transmission sections can also be strip structures of equal width. The widths of the first and second radio frequency transmission sections can be equal or unequal.

[0020] In setting the spacing between the first RF pin and the second RF pin, one possible technical solution is that the distance between the center of the orthographic projection of the first RF pin on the base surface and the center of the orthographic projection of the second RF pin on the base surface is less than or equal to 2.0 mm, thereby improving the high-frequency characteristics of the signal and supporting high-speed signal transmission.

[0021] In the specific configuration of the first and second RF pins, one possible technical solution is that the first RF pin includes a first main body and a first connecting portion. The first connecting portion is located at the end of the first main body near the substrate, and is electrically connected to the first RF transmission portion. Furthermore, the cross-sectional area of ​​the first connecting portion is larger than that of the first main body. By increasing the cross-sectional area of ​​the first connecting portion, a larger space can be provided for the second metal wires. Alternatively, a larger number of second metal wires can be arranged between the first connecting portion and the first RF transmission portion.

[0022] The second RF pin includes a second body portion and a second connecting portion. The second connecting portion is located at the end of the second body portion near the substrate. The second connecting portion and the second RF transmission portion are electrically connected, and the cross-sectional area of ​​the second connecting portion is larger than the cross-sectional area of ​​the second body portion. By increasing the cross-sectional area of ​​the second connecting portion, a larger placement space can be provided for the third metal wire. Alternatively, a larger number of third metal wires can be placed between the second connecting portion and the second RF transmission portion.

[0023] In one possible technical solution, the first RF pin has a first sidewall, and the first sidewall is planar. The first sidewall and the substrate are located on the same side of the base, or in other words, the first sidewall protrudes from the side of the base where the substrate is located, and the first sidewall and the first RF transmission part on the surface of the substrate are electrically connected. Optionally, the first sidewall can be electrically connected to the first RF transmission part via a metal wire. Since the first sidewall is planar, the connection effect of the metal wire can be enhanced, and the connection reliability can be improved.

[0024] The second RF pin has a second sidewall, and the second sidewall is planar. The second sidewall and the substrate are located on the same side of the base, or in other words, the second sidewall protrudes from the side of the base where the substrate is located, and the second sidewall is electrically connected to the second RF transmission section on the surface of the substrate. Optionally, the second sidewall can be electrically connected to the second RF transmission section via a metal wire. Because the second sidewall is planar, the connection effect of the metal wire can be enhanced, and the connection reliability can be improved.

[0025] In one possible technical solution, the light emitting module further includes a cooler located on the side of the substrate away from the laser chip, and the cooler and substrate are thermally connected. The cooler is used to dissipate heat from electronic components mounted on the first surface of the substrate, ensuring the normal operation of the electronic components. In specific installation, the cooler can be vertically or horizontally mounted on the surface of the base.

[0026] Secondly, this application also provides an optical component. The optical component includes a package shell and a light emitting module according to any one of the first aspects, wherein the package shell and the base in the light emitting module are connected and form a receiving cavity; the substrate and laser chip in the light emitting module are located within the receiving cavity.

[0027] The aforementioned optical component can be an optical emitting component or an optical emitting / receiving component. In the optical emitting module included in the aforementioned optical component, the first electrode of the laser chip is electrically connected to a first radio frequency transmission unit via multiple first metal wires. The multiple first metal wires are arranged in parallel, which reduces the total inductance, thereby improving system bandwidth. Higher bandwidth allows higher frequency signals to pass through, reducing the loss of high-frequency signals during transmission and thus supporting high-speed data transmission.

[0028] Thirdly, this application also provides an optical module. The optical module includes a housing, a circuit board, and the optical component described in the second aspect above, wherein the circuit board and the optical component are located within the housing and are electrically connected. Specifically, the first radio frequency (RF) pin and the second RF pin in the optical emitting module included in the circuit board and the optical component are electrically connected.

[0029] In one possible embodiment, the optical component is a light emitting component. Furthermore, the optical module also includes a light receiving component, which is also electrically connected to the circuit board. The light emitting component and the light receiving component are respectively encapsulated within a housing, wherein the light emitting component is used to convert electrical signals into optical signals, and the light receiving component is used to convert optical signals into electrical signals.

[0030] In another possible embodiment, the optical component is an optical transmitting / receiving component. That is, the optical component integrates both optical transmitting and optical receiving functions.

[0031] In the optical component described above, the first electrode of the laser chip is electrically connected to the first radio frequency transmission unit via multiple first metal wires. The multiple first metal wires are connected in parallel, which reduces the total inductance and thus improves the system bandwidth. Higher bandwidth allows higher frequency signals to pass through, reducing the loss of high-frequency signals during transmission and supporting high-speed data transmission.

[0032] Fourthly, this application also provides an optical network system. The optical network system includes a first terminal device, a second terminal device, at least one optical fiber, and a plurality of optical modules as described in the third aspect. The plurality of optical modules includes a first optical module and a second optical module, wherein the first optical module is electrically connected to the first terminal device, the second optical module is electrically connected to the second terminal device, and the first optical module and the second optical module are connected via at least one optical fiber.

[0033] In the optical module's optical emitting module, the first electrode of the laser chip is electrically connected to the first radio frequency transmission unit via multiple first metal wires. The parallel arrangement of these first metal wires reduces the total inductance, thereby improving system bandwidth. Higher bandwidth allows higher frequency signals to pass through, reducing signal loss during transmission and supporting high-speed data transmission. Attached Figure Description

[0034] Figure 1 This is a schematic diagram of the structure of an optical network system provided in an embodiment of this application;

[0035] Figure 2 This is a schematic diagram of the structure of an optical module provided in an embodiment of this application;

[0036] Figure 3 This is a schematic diagram of the structure of an optical component provided in an embodiment of this application;

[0037] Figure 4 This is a schematic diagram of the structure of an optical emitting module provided in an embodiment of this application;

[0038] Figure 5 This is a schematic diagram of the structure of the light emitting module provided in the embodiments of this application from a first-view perspective;

[0039] Figure 6 This is a schematic diagram of the structure of the light emitting module provided in the embodiment of this application from a second perspective;

[0040] Figure 7 A schematic diagram showing the connection of the radio frequency transmission unit, the laser chip, and the radio frequency pins provided in an embodiment of this application;

[0041] Figure 8 Another connection diagram of the radio frequency transmission unit, laser chip, and radio frequency pins provided for embodiments of this application;

[0042] Figure 9 Another connection diagram of the radio frequency transmission unit, laser chip, and radio frequency pins provided for embodiments of this application;

[0043] Figure 10 Another connection diagram of the radio frequency transmission unit, laser chip, and radio frequency pins provided for embodiments of this application;

[0044] Figure 11 This is a schematic diagram of a first radio frequency pin and a second radio frequency pin provided in an embodiment of this application.

[0045] Figure label:

[0046] 01-Terminal device; 011-First terminal device; 012-Second terminal device;

[0047] 02-Optical module; 02a-First optical module; 02b-Second optical module;

[0048] 03-Fiber optic cable; 03a-Backbone fiber optic cable; 03b-Branch fiber optic cable;

[0049] 04-Optical splitter;

[0050] 1-Housing; 11-Housing optical port; 12-Electrical port;

[0051] 2-Optical component; 3-Circuit board; 4-Optical receiver component;

[0052] 10 - Package housing; 20 - Optical emission module; 100 - Laser chip;

[0053] 200 - Substrate; 201 - First surface; 300 - Radio frequency transmission section;

[0054] 300a - First radio frequency transmission unit; 300b - Second radio frequency transmission unit; 301 - First sub-unit;

[0055] 302 - Second sub-section; 303 - Third sub-section; 304 - Fourth sub-section;

[0056] 305 - Fifth sub-section; 306 - Sixth sub-section; 400 - Base;

[0057] 500 - RF pin; 500a - First RF pin; 500b - Second RF pin;

[0058] 501 - First main body section; 502 - First connecting section; 503 - Second main body section;

[0059] 504 - Second connecting part; 505 - First sidewall; 506 - Second sidewall;

[0060] 600 - First metal wire; 700 - Second metal wire; 800 - Third metal wire;

[0061] 900 - Refrigerator. Detailed Implementation

[0062] To make the objectives, technical solutions, and advantages of this application clearer, the application will be further described in detail below with reference to the accompanying drawings. However, the exemplary embodiments can be implemented in many forms and should not be construed as limited to the embodiments set forth herein. The same reference numerals in the figures denote the same or similar structures, and therefore repeated descriptions of them will be omitted. The terms expressing position and direction described in the embodiments of this application are illustrative based on the accompanying drawings, but changes can be made as needed, and all such changes are included within the scope of protection of this application. The accompanying drawings of the embodiments of this application are for illustrating relative positional relationships only and do not represent actual scale.

[0063] It should be noted that specific details are set forth in the following description to facilitate understanding of this application. However, this application can be implemented in many ways other than those described herein, and those skilled in the art can make similar extensions without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0064] To facilitate understanding of the technical solution provided in this application, the application scenario is first introduced below. This application is applied to the field of optical fiber communication technology. Simply put, optical fiber communication is a communication method that uses light waves as the information carrier and optical fibers as the transmission medium. The principle of optical fiber communication is as follows: at the transmitting end, the transmitted information (such as voice) is converted into an electrical signal, which is then modulated onto a laser beam emitted by a laser, causing the light intensity to change with the amplitude (frequency) of the electrical signal, and thus propagating the light along the optical fiber. At the receiving end, the optical signal is converted back into an electrical signal, and the original information is recovered after demodulation. It is evident that the mutual conversion between optical and electrical signals is a crucial aspect of optical fiber communication.

[0065] Figure 1 This is a schematic diagram of the structure of an optical network system provided in an embodiment of this application, such as... Figure 1 As shown, in one embodiment, the optical network system includes a terminal device 01, an optical module 02, and an optical fiber 03. One end of the optical module 02 is connected to the terminal device 01, and the other end of the optical module 02 is connected to the optical fiber 03. The optical module 02 is used to perform photoelectric conversion between the terminal device 01 and the optical fiber 03.

[0066] Please continue to refer to this. Figure 1 The optical network system includes multiple terminal devices 01, among which a first terminal device 011 and a second terminal device 012 are included. Furthermore, the optical network system includes at least one optical fiber 03 and multiple optical modules 02. Specifically, the multiple optical modules 02 include a first optical module 02a and a second optical module 02b. The first optical module 02a is electrically connected to the first terminal device 011, and the second optical module 02b is electrically connected to the second terminal device 012. The first optical module 02a and the second optical module 02b are connected via at least one optical fiber 03.

[0067] In one specific embodiment, the first terminal device 011 is an optical line terminal (OLT), and the second terminal device 012 is an optical network terminal (ONT). The first optical module 02a converts the electrical signal emitted by the first terminal device 011 into an optical signal, which is then transmitted along the optical fiber 03 to the second optical module 02b. The second optical module 02b converts the optical signal back into an electrical signal and transmits it to the second terminal device 012. Conversely, the electrical signal emitted by the second terminal device 012 can be transmitted to the first terminal device 011 via the second optical module 02b, the optical fiber 03, and the first optical module 02a; further details are omitted here.

[0068] In the above embodiments, the number of second terminal devices 012 can be multiple. Furthermore, the optical network system includes at least one optical fiber 03 comprising a trunk fiber 03a and multiple branch fibers 03b, which are connected via a splitter 04. The trunk fiber 03a is connected to the first terminal device 011 via a first optical module 02a, and the branch fibers 03b are connected to the second terminal device 012 via a second optical module 02b. After the first optical module 02a converts the electrical signal emitted by the first terminal device 011 into an optical signal, the optical signal is transmitted along the trunk fiber 03a. The splitter 04 can distribute the optical signal in the trunk fiber 03a to multiple branch fibers 03b, which then transmit the optical signal to the corresponding second optical module 02b. The second optical module 02b then converts the optical signal into an electrical signal and transmits it to the second terminal device 012.

[0069] Figure 2 and Figure 3 These are schematic diagrams illustrating two structural designs of the optical module provided in embodiments of this application, as follows: Figure 2 and Figure 3 As shown, in some embodiments, the optical module 02 includes a housing 1, an optical component 2, and a circuit board 3. The optical component 2 and the circuit board 3 are located within the housing 1 and are electrically connected. The housing 1 has an optical port 11 and an electrical port 12. The optical port 11 faces the optical component 2 and is used to connect an optical fiber. The electrical port 12 faces the circuit board 3 and is used to connect a terminal device. Optionally, the terminal device can be an optical line terminal 011 or an optical network terminal 012.

[0070] When specifically configuring optical component 2, it can be either an optical emitting component or an optical emitting / receiving component. For example... Figure 2 As shown, in one embodiment, the optical component 2 is an optical emitting component. Furthermore, the optical module 02 also includes an optical receiving component 4, which is also electrically connected to the circuit board 3. The optical emitting component (optical component 2) and the optical receiving component 4 are respectively encapsulated within the housing 1. The optical emitting component (optical component 2) is used to convert electrical signals into optical signals, and the optical receiving component 4 is used to convert optical signals into electrical signals. During use, two optical fibers can be inserted into the optical port 11. One optical fiber is connected to the optical emitting component (optical component 2) to transmit the optical signals emitted by the optical emitting component (optical component 2). The other optical fiber is connected to the optical receiving component 4 to transmit the optical signals from a distant location to the optical receiving component. In other words, during use, the optical module 02 can have the optical emitting component (optical component 2) and the optical receiving component 4 connected to different optical fibers, thereby separating the light transmission path and the light reception path.

[0071] like Figure 3As shown, in another embodiment, the optical component 2 is an optical transmitter / receiver component. That is, the optical component 2 integrates both optical transmission and optical reception functions. During use, an optical fiber can be inserted into the optical port 11, and both the transmission path and the reception path of the light are located within this optical fiber.

[0072] Figure 4 This is a schematic diagram of a structure of an optical component provided in an embodiment of this application, such as... Figure 4 As shown, in one embodiment, the optical component 2 includes a housing 10 and a light emitting module 20. The light emitting module 20 is used to convert electrical signals into optical signals and emit them outward. The housing 10 is disposed outside the light emitting module 20 and has a light window for light transmission, through which the optical signals generated by the light emitting module 20 can be emitted outward.

[0073] Figure 5 and Figure 6 The following are schematic diagrams of the structure of the light emitting module provided in the embodiments of this application from different viewing angles, such as... Figure 5 and Figure 6 As shown, in some embodiments, the light emitting module 20 includes a base 400, a substrate 200, and a laser chip 100. Specifically, the base 400 is fixedly connected to the encapsulation shell 10 in the optical component 2, forming a receiving cavity, within which the substrate 200 and the laser chip 100 are located. The substrate 200 is fixedly connected to the base 400, and the substrate 200 serves as a carrier plate for electronic components such as the laser chip 100. The substrate 200 has a first surface 201, to which the laser chip 100 is fixed. During fabrication, the laser chip 100 can be mounted on the first surface 201 of the substrate 200 using a surface mount process. The laser chip 100 can be a directly modulated laser (DML) chip, which modulates the intensity of the light signal by directly changing the driving current of the laser, and features simple structure, low power consumption, and low cost. In addition to the laser chip 100, the first surface 201 can also be provided with electronic components such as thermistors and photodetectors, which are not listed in this application.

[0074] When specifically selecting the material of the substrate 200, the substrate 200 can be a ceramic substrate. Ceramic substrates have good thermal conductivity, which can improve the heat dissipation effect of electronic components such as the laser chip 100. When the substrate 200 is arranged on the surface of the base 400, the substrate 200 can have several arrangement forms relative to the base 400. In one optional arrangement, the substrate 200 can be perpendicular to the surface of the base 400. Alternatively, the substrate 200 can be arranged vertically on the surface of the base 400. In another optional arrangement, the substrate 200 can also be arranged horizontally on the surface of the base 400. Alternatively, the substrate 200 can be arranged horizontally on the surface of the base 400.

[0075] To dissipate heat from the electronic components located on the surface of the substrate 200, the light emitting module 20 also includes a cooler 900. The cooler 900 is located on the side of the substrate 200 opposite to the laser chip 100, and the cooler 900 and the substrate 200 are thermally connected. More specifically, the cooler 900 and the side of the substrate 200 opposite to the first surface 201 are thermally connected. The cooler 900 is used to dissipate heat from the electronic components disposed on the first surface 201 of the substrate 200, ensuring the normal operation of the electronic components. When installing the cooler 900, it can be vertically or horizontally disposed on the surface of the base 400.

[0076] In one specific embodiment, both the substrate 200 and the cooler 900 are perpendicular to the surface of the base 400, and the substrate 200 and the cooler 900 are thermally connected. During installation, the surface of the base 400 has a column, the cooler 900 is fixedly connected to the column, and the substrate 200 is located on the side of the cooler 900 facing away from the column. Optionally, the column can be an integral structure with the base 400, thereby reducing costs. The column can also be welded to the surface of the base 400, or fixed to the surface of the base 400 in other ways.

[0077] Please continue to refer to this. Figure 5 and Figure 6 The first surface 201 of the substrate 200 is provided with two radio frequency (RF) transmission sections 300, and the base 400 is provided with two RF pins 500. The two RF transmission sections 300 and the two RF pins 500 correspond one-to-one. For each RF transmission section 300, one end is electrically connected to the laser chip 100, and the other end is electrically connected to the corresponding RF pin 500. The RF pin 500 passes through the base 400 and is electrically connected to the circuit board in the optical module.

[0078] During operation, the two radio frequency transmission units 300 drive the laser chip 100 to emit signal light in a differential manner. By using a differential method to drive the laser chip 100 to emit signal light, the anti-interference capability of the optical emission module 20 can be improved, the integrity of high-frequency signals can be enhanced, and the signal quality can be improved.

[0079] Figure 7 A schematic diagram illustrating the connection of the radio frequency transmission unit, the laser chip, and the radio frequency pins provided in an embodiment of this application is shown below. Figure 7As shown, in one embodiment, the two radio frequency transmission units 300 are distinguished by a first radio frequency transmission unit 300a and a second radio frequency transmission unit 300b. The first radio frequency transmission unit 300a and the second radio frequency transmission unit 300b are electrically connected to the laser chip 100, respectively. More specifically, the laser chip 100 has a first electrode and a second electrode. The first electrode of the laser chip 100 is electrically connected to the first radio frequency transmission unit 300a, and the second electrode of the laser chip 100 is electrically connected to the second radio frequency transmission unit 300b.

[0080] In implementing the aforementioned electrical connection, the first electrode of the laser chip 100 and the first radio frequency transmission section 300a are spaced apart, and at least two first metal wires 600 are provided between the first electrode of the laser chip 100 and the first radio frequency transmission section 300a. The first electrode of the laser chip 100 is electrically connected to the first radio frequency transmission section 300a through the aforementioned at least two first metal wires 600. The second electrode of the laser chip 100 is located on the surface of the second radio frequency transmission section 300b, and the second electrode of the laser chip 100 is electrically connected to the second radio frequency transmission section 300b. Optionally, the second electrode of the laser chip 100 is directly soldered to the surface of the second radio frequency transmission section 300b. The first electrode and the second electrode have opposite polarities, with the first electrode located on the side of the laser chip 100 facing away from the second radio frequency transmission section 300b, and the second electrode located on the side of the laser chip 100 facing the second radio frequency transmission section 300b. Optionally, the first electrode is positive, and the second electrode is negative.

[0081] This application does not specifically limit the number of first metal wires 600. For example, the number of first metal wires 600 can be two, three, four, or other numbers, which are not listed here. Optionally, the lengths of the multiple first metal wires 600 can be equal. This application also does not limit the material of the first metal wires 600. For example, the first metal wires 600 can be gold wire, aluminum wire, or copper wire. In specific fabrication, the first metal wires 600 can be formed between the first radio frequency transmission section 300a and the first electrode of the laser chip 100 by wire bonding, thereby achieving a reliable electrical connection.

[0082] In this application, the aforementioned multiple first metal wires 600 are connected in parallel between the first radio frequency transmission section 300a and the laser chip 100, thereby reducing the total inductance and improving system bandwidth. Higher bandwidth allows higher frequency signals to pass through, reducing signal loss during transmission and supporting high-speed data transmission. Furthermore, the parallel connection of multiple first metal wires 600 also reduces the resistance of the current path, lowering power consumption and temperature rise, indirectly improving high-frequency performance. Moreover, in this application, by arranging two radio frequency transmission sections on the substrate and driving the laser chip 100 to emit signal light differentially, the anti-interference capability of the optical emission module 20 is improved, high-frequency signal loss during transmission is reduced, and high-frequency signal integrity is improved, thereby achieving high-speed data transmission.

[0083] In summary, this application improves the bandwidth of the optical emission module 20 and enhances its high-frequency performance by optimizing the packaging process of the laser chip, thereby achieving high-speed data transmission. This reduces the production cost of the optical emission module 20, improves its market competitiveness, and facilitates its commercial application.

[0084] Please continue to refer to this. Figure 7 The two RF pins 500 are distinguished by a first RF pin 500a and a second RF pin 500b. The first RF transmission section 300a is electrically connected to the first RF pin 500a, and the second RF transmission section 300b is electrically connected to the second RF pin 500b. In one embodiment, the first RF transmission section 300a can be electrically connected to the first RF pin 500a via at least two second metal wires 700. Optionally, the number of second metal wires 700 can be two, three, four, or other numbers. Furthermore, the lengths of the multiple second metal wires 700 can be equal or unequal. The multiple second metal wires 700 connected in parallel between the first RF transmission section 300a and the first RF pin 500a reduce the total inductance of the second metal wires 700, thereby improving system bandwidth, reducing high-frequency signal loss during transmission, and supporting high-speed data transmission.

[0085] The material of the second metal wire 700 can be chosen from various options; for example, the second metal wire 700 can be gold wire, aluminum wire, or copper wire. In the fabrication of the second metal wire 700, it can be formed between the first RF transmission section 300a and the first RF pin 500a via wire bonding. The second metal wire 700 can achieve a reliable electrical connection between the first RF transmission section 300a and the first RF pin 500a, and the fabrication process of the second metal wire 700 is relatively simple and low-cost.

[0086] When specifically arranging the aforementioned multiple second metal wires 700, the end of each of the multiple second metal wires 700 electrically connected to the first RF pin 500a can be arranged in a row, multiple rows, or randomly on the end face of the first RF pin 500a. Similarly, the end of each of the aforementioned multiple second metal wires 700 electrically connected to the first RF transmission section 300a can be arranged in a row, multiple rows, or randomly on the surface of the first RF transmission section 300a.

[0087] In addition to using a second metal wire 700 to achieve an electrical connection between the first radio frequency transmission section 300a and the first radio frequency pin 500a, in other embodiments, eutectic bonding can also be used to electrically connect the first radio frequency transmission section 300a and the first radio frequency pin 500a.

[0088] In one embodiment, when the second RF transmission unit 300b and the second RF pin 500b are electrically connected, the second RF transmission unit 300b can be electrically connected to the second RF pin 500b via at least two third metal wires 800. Similar to the second metal wire 700, the parallel arrangement of the multiple third metal wires 800 reduces the total inductance of the third metal wires 800, thereby improving bandwidth, reducing high-frequency signal loss during transmission, and supporting high-speed data transmission. Furthermore, the material, manufacturing process, and arrangement of the third metal wires 800 can be the same as those of the second metal wire 700, and will not be elaborated upon in this application.

[0089] The above describes the method of electrically connecting the RF transmission unit 300 with the laser chip 100 and the RF pin 500. The following will describe in detail the arrangement and structure of the RF transmission unit 300.

[0090] like Figure 7 As shown, from an overall perspective, the first radio frequency transmission unit 300a and the second radio frequency transmission unit 300b are arranged at intervals along a first direction X. Optionally, the first direction X can be the extension direction of one side of the substrate 200. When the substrate 200 is disposed perpendicular to the base 400, the aforementioned first direction X can be parallel to the surface of the base 400.

[0091] In one embodiment, the spacing between the first radio frequency transmission unit 300a and the second radio frequency transmission unit 300b can be a set value. Specifically, the first radio frequency transmission unit 300a has a first edge on the side facing the second radio frequency transmission unit 300b, and the second radio frequency transmission unit 300b has a second edge on the side facing the first radio frequency transmission unit 300a. The first edge and the second edge are parallel. The spacing between the first edge and the second edge is fixed, and this spacing is the spacing between the first radio frequency transmission unit 300a and the second radio frequency transmission unit 300b.

[0092] In another embodiment, the spacing between the first radio frequency transmission unit 300a and the second radio frequency transmission unit 300b can be varied. For example, in a first position, the spacing between the first radio frequency transmission unit 300a and the second radio frequency transmission unit 300b is a first value. In a second position, the spacing between the first radio frequency transmission unit 300a and the second radio frequency transmission unit 300b is a second value, and the first value and the second value are not equal.

[0093] The first radio frequency transmission unit 300a and the second radio frequency transmission unit 300b have various structural forms. The possible structures of the first radio frequency transmission unit 300a and the second radio frequency transmission unit 300b will be introduced below.

[0094] When specifically configuring the first radio frequency transmission unit 300a, such as Figure 7 As shown, in one embodiment, the first radio frequency transmission unit 300a includes a first sub-unit 301, a second sub-unit 302, and a third sub-unit 303 connected sequentially. The first sub-unit 301 is electrically connected to a first electrode of the laser chip 100, the third sub-unit 303 is electrically connected to a first radio frequency pin 500a, and the second sub-unit 302 is located between the first sub-unit 301 and the third sub-unit 303. Compared to the second sub-unit 302, the width of the first sub-unit 301 along the first direction X is different from the width of the second sub-unit 302 along the first direction X. Optionally, the width of the first sub-unit 301 along the first direction X can be greater than or less than the width of the second sub-unit 302 along the first direction X.

[0095] When specifically configuring the first sub-part 301, the area of ​​the first sub-part 301 can be greater than or equal to 0.02 mm. 2 Optionally, the area of ​​the first sub-part 301 can be 0.025 mm². 2 0.03mm 2 0.035mm 2 0.04mm 2 Or other values, which will not be listed here. The area of ​​the first sub-part 301 is made not less than 0.02 mm². 2 On the one hand, a larger number of first metal wires 600 can be set, thereby reducing the inductance of the first metal wires 600, increasing the bandwidth, and thus reducing the loss of high-frequency signals during transmission and increasing the signal transmission rate. On the other hand, the capacitance of the first sub-section 301 can also be increased, thereby improving the photoelectric gain.

[0096] The shape of the first sub-part 301 is not limited in this application. For example, the shape of the first sub-part 301 can be rectangular, circular, elliptical, or other shapes. Figure 7As shown, in one embodiment, the first sub-part 301 is rectangular in shape. The first sub-part 301 has a first side and a second side that are perpendicular to each other, wherein the first side extends along a first direction X. The length of the first side can be greater than or equal to 0.2 mm, and the length of the second side can be greater than or equal to 0.1 mm.

[0097] When specifically configuring the second sub-part 302, the second sub-part 302 can be a strip-shaped structure. The second sub-part 302 can extend along a straight line or a broken line. Alternatively, the second sub-part 302 can extend along a curve. The second sub-part 302 can be a structure of uniform width, that is, along the extension direction of the second sub-part 302, at any two positions, the width of the second sub-part 302 is equal. In other words, the second sub-part 302 can be understood as a structure of uniform thickness. The second sub-part 302 can also be a structure of unequal width, or in other words, a structure of uneven thickness.

[0098] When specifically configuring the third sub-part 303, the width of the third sub-part 303 along the first direction X can be equal to, or greater than, or less than, the width of the second sub-part 302 along the first direction X. In one embodiment, the width of the third sub-part 303 along the first direction X is different from the width of the second sub-part 302 along the first direction X, and the area of ​​the third sub-part 303 can be greater than or equal to 0.015 mm. 2 Optionally, the area of ​​the third sub-part 303 can be 0.016 mm². 2 0.017mm 2 0.018mm 2 0.019mm 2 0.020mm 2 Or other values, which will not be listed here. By ensuring that the area of ​​the third sub-part 303 is not less than 0.015 mm². 2 A larger number of second metal wires 700 can be set, thereby reducing the inductance of the second metal wires 700, increasing the bandwidth, and thus reducing the loss of high-frequency signals during transmission and increasing the signal transmission rate.

[0099] The shape of the third sub-part 303 is not limited in this application. For example, the shape of the third sub-part 303 can be rectangular, circular, elliptical, or other shapes. Figure 7 As shown, in one embodiment, the third sub-part 303 is rectangular in shape. The third sub-part 303 has a third side and a fourth side that are perpendicular to each other, wherein the third side extends along a first direction X. The length of the third side may be greater than or equal to 0.15 mm, and the length of the fourth side may be greater than or equal to 0.1 mm.

[0100] In one specific embodiment, the width of the first sub-part 301 along the first direction X is greater than the width of the second sub-part 302 along the first direction X, and the width of the second sub-part 302 along the first direction X is equal to the width of the third sub-part 303 along the first direction X.

[0101] In another specific embodiment, the width of the first sub-part 301 along the first direction X is equal to the width of the second sub-part 302 along the first direction X, and the width of the third sub-part 303 along the first direction X is greater than the width of the second sub-part 302 along the first direction X.

[0102] In another specific embodiment, the width of the first sub-part 301 along the first direction X is greater than the width of the second sub-part 302 along the first direction X, and the width of the third sub-part 303 along the first direction X is also greater than the width of the second sub-part 302 along the first direction X. That is to say, the first radio frequency transmission part 300a has the characteristic of being thin in the middle and thick at both ends.

[0103] In the aforementioned first radio frequency transmission unit 300a, the first sub-unit 301 can be electrically connected to the first electrode of the laser chip 100 via at least two first metal wires 600, and the third sub-unit 303 can be electrically connected to the first radio frequency pin 500a via at least two second metal wires 700. Compared to the second sub-unit 302, by making the widths of the first sub-unit 301 and the third sub-unit 303 larger than the width of the second sub-unit 302, it is beneficial to increase the area of ​​the first sub-unit 301 and the third sub-unit 303, thereby providing a larger installation space for the first metal wires 600 and the second metal wires 700.

[0104] In addition to the above-mentioned structural form, the first radio frequency transmission unit 300a can also be in other structural forms. Figure 8 and Figure 9 Two other connection diagrams of the radio frequency transmission unit, laser chip, and radio frequency pins provided for embodiments of this application are shown below. Figure 8 and Figure 9 As shown, in some embodiments, the first radio frequency transmission section 300a can be a strip structure of uniform width. That is, along the extending direction of the first radio frequency transmission section 300a, the width of the first radio frequency transmission section 300a is equal at any two positions. In other words, the first radio frequency transmission section 300a can be understood as a strip structure of uniform thickness.

[0105] To accommodate a larger number of second metal wires 700, the width of the first radio frequency transmission section 300a along the first direction X can be greater than or equal to 0.2 mm. Furthermore, when arranging the second metal wires 700, as... Figure 8 As shown, the end of the second metal wire 700 connected to the first radio frequency transmission section 300a can be arranged in a row on the surface of the first radio frequency transmission section 300a. Alternatively, as... Figure 9As shown, the end of the second metal wire 700 connected to the first radio frequency transmission section 300a can also be arranged in multiple rows on the surface of the first radio frequency transmission section 300a.

[0106] Figure 8 and Figure 9 The first radio frequency transmission unit 300a shown is... Figure 7 Compared to the first radio frequency transmission unit 300a shown, in terms of shape, Figure 8 and Figure 9 The first radio frequency transmission section 300a shown is of equal width, or in other words, of uniform thickness. Structurally, the first radio frequency transmission section 300a may also include a first sub-section 301, a second sub-section 302, and a third sub-section 303, and the widths of the first sub-section 301, the second sub-section 302, and the third sub-section 303 along the first direction X are equal.

[0107] When specifically configuring the second radio frequency transmission unit 300b, such as Figure 7 As shown, in one embodiment, the second radio frequency transmission unit 300b includes a fourth sub-unit 304, a fifth sub-unit 305, and a sixth sub-unit 306 connected in sequence. The fourth sub-unit 304 is electrically connected to the second electrode of the laser chip, the sixth sub-unit 306 is electrically connected to the second radio frequency pin, and the fifth sub-unit 305 is located between the fourth sub-unit 304 and the sixth sub-unit 306.

[0108] Compared to the fifth sub-part 305, the width of the fourth sub-part 304 along the first direction X can be the same as or different from the width of the fifth sub-part 305 along the first direction X. The width of the sixth sub-part 306 along the first direction X can also be the same as or different from the width of the fifth sub-part 305 along the first direction X.

[0109] When specifically configuring the fourth sub-part 304, the orthographic projection of the laser chip 100 on the surface of the substrate 200 can be completely located within the fourth sub-part 304, thereby increasing the contact area between the laser chip 100 and the fourth sub-part 304 and improving the welding effect. The shape of the fourth sub-part 304 includes various options; for example, the fourth sub-part 304 can be rectangular, circular, elliptical, or other shapes, which will not be listed in this application.

[0110] When specifically configuring the fifth sub-part 305, the fifth sub-part 305 can be a strip-shaped structure. The fifth sub-part 305 can extend along a straight line or a broken line. Alternatively, the fifth sub-part 305 can also extend along a curve. The fifth sub-part 305 can be a structure of uniform width, that is, along the extension direction of the fifth sub-part 305, at any two positions, the width of the fifth sub-part 305 is equal. In other words, the aforementioned fifth sub-part 305 can be understood as a structure of uniform thickness. The fifth sub-part 305 can also be a structure of unequal width, or in other words, a structure of uneven thickness.

[0111] When specifically configuring the sixth sub-part 306, the width of the sixth sub-part 306 along the first direction X is different from the width of the fifth sub-part 305 along the first direction X, and the area of ​​the sixth sub-part 306 can be greater than or equal to 0.015mm². 2 Optionally, the area of ​​the sixth sub-part 306 can be 0.016 mm². 2 0.017mm 2 0.018mm 2 0.019mm 2 0.020mm 2 Or other values, which will not be listed here. By ensuring that the area of ​​the sixth sub-part 306 is not less than 0.015 mm². 2 At this time, a larger number of third metal wires 800 can be set, thereby reducing the inductance of the third metal wires 800, reducing the loss of high-frequency signals, and increasing bandwidth.

[0112] This application does not limit the shape of the sixth sub-part 306. For example, the shape of the sixth sub-part 306 can be rectangular, circular, elliptical, or other shapes. Figure 7 As shown, in one embodiment, the sixth sub-part 306 is rectangular in shape. The sixth sub-part 306 has a fifth side and a sixth side that are perpendicular to each other, wherein the fifth side extends along a first direction X. The length of the fifth side may be greater than or equal to 0.15 mm, and the length of the sixth side may be greater than or equal to 0.1 mm.

[0113] In one specific embodiment, the width of the fourth sub-part 304 along the first direction X is equal to the width of the fifth sub-part 305 along the first direction X, and the width of the sixth sub-part 306 along the first direction X is greater than the width of the fifth sub-part 305 along the first direction X.

[0114] In another specific embodiment, the width of the fourth sub-part 304 along the first direction X is greater than the width of the sixth sub-part 306 along the first direction X. Furthermore, the width of the sixth sub-part 306 along the first direction X is also greater than the width of the fifth sub-part 305 along the first direction X. Overall, the second RF transmission section 300b has a shape that is thinner in the middle and wider at both ends. In the aforementioned second RF transmission section 300b, the fourth sub-part 304 can carry the second electrode electrical connection of the laser chip 100, and the sixth sub-part 306 can be electrically connected to the second RF pin 500b via at least two third metal wires 800. Compared to the fifth sub-part 305, by making the widths of the fourth sub-part 304 and the sixth sub-part 306 larger than the width of the fifth sub-part 305, it is beneficial to increase the area of ​​the fourth sub-part 304 and the sixth sub-part 306, thereby enhancing the connection reliability between the fourth sub-part 304 and the laser chip 100, and allowing the sixth sub-part 306 to provide a larger installation space for the third metal wires 800.

[0115] In addition to the above-described structural form, the second radio frequency transmission unit 300b can also have other structural forms. For example... Figure 8 and Figure 9 In the two other connection diagrams of the RF transmission section, laser chip and RF pin shown, the second RF transmission section 300b can be a strip structure of equal width, or in other words, the second RF transmission section 300b can be understood as a strip structure of uniform thickness.

[0116] To accommodate a larger number of third metal wires 800, the width of the second radio frequency transmission section 300b along the first direction X can be greater than or equal to 0.2 mm. Furthermore, when arranging the third metal wires, as... Figure 8 As shown, the end of the third metal wire 800 connected to the second radio frequency transmission section 300b can be arranged in a row on the surface of the second radio frequency transmission section 300b. Or, as... Figure 9 As shown, the end of the third metal wire 800 connected to the second radio frequency transmission section 300b can also be arranged in multiple rows on the surface of the second radio frequency transmission section 300b.

[0117] Figure 8 and Figure 9 The second radio frequency transmission section 300b shown is... Figure 7 Compared to the second radio frequency transmission unit 300b shown, in terms of shape, Figure 8 and Figure 9 The second radio frequency transmission section 300b shown is of equal width, or in other words, of uniform thickness. Structurally, the second radio frequency transmission section 300b may also include a fourth subsection 304, a fifth subsection 305, and a sixth subsection 306, and the widths of the fourth subsection 304, the fifth subsection 305, and the sixth subsection 306 along the first direction X are equal.

[0118] Considering both the first radio frequency transmission unit 300a and the second radio frequency transmission unit 300b, in Figure 7 In the illustrated embodiment, the first radio frequency transmission unit 300a and the second radio frequency transmission unit 300b have similar shapes, both exhibiting a form that is thinner in the middle and wider at both ends. Specifically, regarding the first sub-part 301 in the first radio frequency transmission unit 300a and the fourth sub-part 304 in the second radio frequency transmission unit 300b, the shape and area of ​​the first sub-part 301 may be the same as or different from the shape and area of ​​the fourth sub-part 304. Regarding the third sub-part 303 in the first radio frequency transmission unit 300a and the sixth sub-part 306 in the second radio frequency transmission unit 300b, the shape and area of ​​the third sub-part 303 may be the same as or different from the shape and area of ​​the sixth sub-part 306.

[0119] Regarding the second sub-section 302 in the first radio frequency transmission unit 300a and the fifth sub-section 305 in the second radio frequency transmission unit 300b, both the second sub-section 302 and the fifth sub-section 305 are strip-shaped structures, and they include various combinations. In one optional combination, the second sub-section 302 and the fifth sub-section 305 can be arranged in parallel. In another optional combination, the second sub-section 302 and the fifth sub-section 305 can have equal lengths. In yet another optional combination, the second sub-section 302 and the fifth sub-section 305 are both strip-shaped structures of equal width, and their widths are equal.

[0120] exist Figure 8 and Figure 9 In the illustrated embodiment, the first radio frequency transmission section 300a and the second radio frequency transmission section 300b also have similar shapes, both being strip structures of equal width. Furthermore, the width of the first radio frequency transmission section 300a and the width of the second radio frequency transmission section 300b can be equal or unequal.

[0121] In practical applications, Figure 7 The first RF transmission unit 300a and the second RF transmission unit 300b shown can be applied to scenarios with a characteristic impedance of 100 ohms. Figure 8 and Figure 9 The first radio frequency transmission unit 300a and the second radio frequency transmission unit 300b shown can be applied to scenarios with a characteristic impedance of 50 ohms.

[0122] Please continue to refer to this. Figure 7 In one embodiment, the substrate 200 is disposed perpendicular to the base 400. The first radio frequency transmission section 300a includes a first sub-section 301, a second sub-section 302, and a third sub-section 303 connected in sequence. The first sub-section 301 is electrically connected to the first electrode of the laser chip 100 via at least two first metal wires 600. The third sub-section 303 is electrically connected to the first radio frequency pin 500a, and the third sub-section 303 is located on the side of the first sub-section 301 closer to the base 400. That is, the distance from the center of the third sub-section 303 to the base 400 is less than the distance from the center of the first sub-section 301 to the base 400. Thus, relative to the first sub-section 301, the third sub-section 303 is closer to the surface of the base 400, thereby reducing the distance between the third sub-section 303 and the first radio frequency pin 500a and shortening the length of the second metal wire 700.

[0123] The second radio frequency transmission unit 300b includes a fourth sub-unit 304, a fifth sub-unit 305, and a sixth sub-unit 306 connected in sequence. The second electrode of the laser chip 100 is located on the surface of the fourth sub-unit 304 and is electrically connected to the fourth sub-unit 304. The sixth sub-unit 306 is electrically connected to the second radio frequency pin 500b, and the sixth sub-unit 306 is located on the side of the fourth sub-unit 304 closer to the base 400. That is, the distance from the center of the sixth sub-unit 306 to the base 400 is less than the distance from the center of the fourth sub-unit 304 to the base 400. Thus, relative to the fourth sub-unit 304, the sixth sub-unit 306 is closer to the surface of the base 400, thereby reducing the distance between the sixth sub-unit 306 and the second radio frequency pin 500b, and shortening the length of the third metal wire 800.

[0124] Please refer to the above. Figure 7 , Figure 8 and Figure 9 In the specific configuration of the RF pin 500, the RF pin 500 penetrates the base 400. Specifically, the base 400 includes a bearing surface and a bottom surface disposed opposite to each other, with the bottom surface located on the side of the bearing surface opposite to the substrate 200. One end of the RF pin 500 can extend from the bearing surface, and the other end can extend from the bottom surface. The periphery of the RF pin 500 is wrapped with an insulator, which serves as insulation between the RF pin 500 and the base 400. Optionally, the insulator is glass.

[0125] The RF pin 500 can be a columnar structure of uniform thickness, or it can be other structures. Figure 10 Another connection diagram of the radio frequency transmission unit, laser chip, and radio frequency pins provided in the embodiments of this application is shown below. Figure 10 As shown, in one embodiment, the first RF pin 500a includes a first main body 501 and a first connecting portion 502, with the first connecting portion 502 located at one end of the first main body 501 near the substrate 200. The first connecting portion 502 is electrically connected to the first RF transmission portion 300a, and the cross-sectional area of ​​the first connecting portion 502 is larger than the cross-sectional area of ​​the first main body 501. The first main body 501 extends through the base 400, and its periphery is wrapped with insulating material to insulate the first main body 501 from the base 400. The first connecting portion 502 protrudes from the surface of the base 400, and the shape of the cross-section of the first connecting portion 502 may be the same as or different from the shape of the cross-section of the first main body 501. For example, the cross-sections of the first connecting portion 502 and the first main body 501 may both be circular or polygonal. Another example is that the cross-section of the first connecting portion 502 is polygonal, and the cross-section of the first main body 501 is circular.

[0126] In the above embodiments, by increasing the cross-sectional area of ​​the first connecting portion 502, a larger installation space can be provided for the second metal wire 700. Alternatively, a larger number of second metal wires 700 can be installed between the first connecting portion 502 and the first radio frequency transmission portion 300a.

[0127] Please continue to refer to this. Figure 10 The structure of the second RF pin 500b is similar to that of the first RF pin 500a. Specifically, the second RF pin 500b includes a second main body portion 503 and a second connecting portion 504, with the second connecting portion 504 located at the end of the second main body portion 503 near the substrate 200. The second connecting portion 504 is electrically connected to the second RF transmission portion 300b, and the cross-sectional area of ​​the second connecting portion 504 is larger than that of the second main body portion 503. When specifically configuring the second main body portion 503 and the second connecting portion 504, refer to the relevant content of the first main body portion 501 and the first connecting portion 502 described above; further details are omitted here.

[0128] It is worth noting that, for the second RF pin 500b, by increasing the cross-sectional area of ​​the second connection portion 504, a larger installation space can be provided for the third metal wire 800. In other words, a larger number of third metal wires 800 can be installed between the second connection portion 504 and the second RF transmission portion 300b.

[0129] The first RF pin 500a and the second RF pin 500b can, in addition to being able to Figure 10 Besides the structure shown, other structures are also possible. Figure 11 A schematic diagram of the structure of the first RF pin and the second RF pin provided in the embodiments of this application is shown below. Figure 11 As shown, in one embodiment, the first RF pin 500a has a first sidewall 505, and the first sidewall 505 is planar. The first sidewall 505 and the substrate 200 are located on the same side of the base 400, or in other words, the first sidewall 505 is exposed from the side of the base 400 where the substrate 200 is located, and the first sidewall 505 is electrically connected to the first RF transmission portion 300a on the surface of the substrate 200. Optionally, the first sidewall 505 can be electrically connected to the first RF transmission portion 300a via a metal wire. Since the first sidewall 505 is planar, the connection effect of the metal wire can be enhanced, and the connection reliability can be improved.

[0130] The first RF pin 500a may have one first sidewall 505 or multiple first sidewalls 505. Each first sidewall 505 may be electrically connected to the first RF transmission section 300a via a single metal wire or via multiple metal wires. As an example, the first RF pin 500a has a first sidewall 505 on the side facing the substrate 200, and this first sidewall 505 is electrically connected to the first RF transmission section 300a via at least one metal wire.

[0131] In one specific embodiment, the first RF pin 500a has a cylindrical structure, and the first sidewall 505 is located on the side of the first RF pin 500a. In another specific embodiment, the end of the first RF pin 500a has a cuboid structure, and the first sidewall 505 is located on the side of the cuboid structure.

[0132] In addition, when specifically connecting the first RF pin 500a and the first RF transmission section 300a, in addition to connecting the first sidewall 505 to the first RF transmission section 300a via a metal wire, the end face of the first RF pin 500a away from the base 400 can also be connected to the first RF transmission section 300a via a metal wire.

[0133] Please continue to refer to this. Figure 11 The second RF pin 500b has a similar structure to the first RF pin 500a. Specifically, the second RF pin 500b has a second sidewall 506, and the second sidewall 506 is planar. The second sidewall 506 and the substrate 200 are located on the same side of the base 400, or in other words, the second sidewall 506 is exposed from the side of the base 400 where the substrate 200 is located, and the second sidewall 506 is electrically connected to the second RF transmission portion 300b on the surface of the substrate 200. Optionally, the second sidewall 506 can be electrically connected to the second RF transmission portion 300b via a metal wire.

[0134] Referring to the description of the first RF pin 500a above, the second RF pin 500b may have one second sidewall 506 or multiple second sidewalls 506. Each second sidewall 506 may be electrically connected to the second RF transmission section 300b via a single metal wire, or multiple metal wires may be electrically connected to the second RF transmission section 300b. As an example, the second RF pin 500b has a second sidewall 506 on the side facing the substrate 200, and this second sidewall 506 is electrically connected to the second RF transmission section 300b via at least one metal wire.

[0135] In one specific embodiment, the second RF pin 500b has a cylindrical structure, and the second sidewall 506 is located on the side of the second RF pin 500b. In another specific embodiment, the end of the second RF pin 500b has a cuboid structure, and the second sidewall 506 is located on the side of the cuboid structure.

[0136] When specifically connecting the second RF pin 500b and the second RF transmission section 300b, in addition to connecting the second sidewall 506 to the second RF transmission section 300b via a metal wire, the end face of the second RF pin 500b away from the base can also be connected to the second RF transmission section 300b via a metal wire.

[0137] In one embodiment, the distance between the center of the orthographic projection of the first RF pin 500a onto the surface of the base 400 and the center of the orthographic projection of the second RF pin 500b onto the surface of the base 400 is less than or equal to 2.0 mm, thereby improving the high-frequency characteristics of the signal and supporting high-speed signal transmission. Optionally, the above distance can be 1.0 mm, 1.2 mm, 1.4 mm, 1.6 mm, 1.8 mm, or other values, which are not listed in this application.

[0138] It is understood that, in addition to the first RF pin 500a and the second RF pin 500b, the base 400 is also provided with other pins, which can be electrically connected to other electronic components on the surface of the substrate 200 other than the laser chip 100. For example, the base 400 is also provided with a thermistor pin, which is electrically connected to a thermistor disposed on the substrate 200.

[0139] In one specific embodiment, the first electrode of the laser chip 100 and the first sub-part 301 of the first radio frequency transmission section 300a are electrically connected by at least two first metal wires 600, and the area of ​​the first sub-part 301 of the first radio frequency transmission section 300a is greater than or equal to 0.02 mm². 2 The second electrode of the laser chip 100 is located on the surface of the fourth sub-part 304 of the second radio frequency transmission section 300b and is welded to the fourth sub-part 304.

[0140] The third sub-section 303 of the first radio frequency transmission section 300a is electrically connected to the first radio frequency pin 500a via at least two second metal wires 700. Furthermore, the surface area of ​​the third sub-section 303 is greater than or equal to 0.015 mm. 2 The sixth sub-section 306 of the second RF transmission section 300b is electrically connected to the second RF pin 500b via at least two third metal wires 800. Furthermore, the surface area of ​​the sixth sub-section 306 is greater than or equal to 0.015 mm. 2 .

[0141] In addition, the distance between the center of the orthographic projection of the first RF pin 500a on the surface of the base 400 and the center of the orthographic projection of the second RF pin 500b on the surface of the base 400 is less than or equal to 2.0 mm.

[0142] In the above embodiments, by optimizing aspects such as the connection between the first RF transmission unit 300a and the laser chip 100, the connection between the first RF transmission unit 300a and the first RF pin 500a, the connection between the second RF transmission unit 300b and the second RF pin 500b, and the spacing between the first RF pin 500a and the second RF pin 500b, bandwidth can be increased, thereby reducing high-frequency signal loss, improving high-frequency signal integrity, and achieving high-speed signal transmission. Furthermore, this application improves the bandwidth of the optical emission module 20 by optimizing the laser chip packaging process, reducing the production cost of the optical emission module 20, which is beneficial for commercial application.

[0143] Obviously, those skilled in the art can make various modifications and variations to this application without departing from the scope of this application. Therefore, if such modifications and variations fall within the scope of the claims of this application and their equivalents, this application is also intended to include such modifications and variations.

Claims

1. A light emitting module, characterized in that, Includes base, substrate and laser chip; The base is provided with a first radio frequency pin and a second radio frequency pin; The substrate is fixed to the base, and the substrate has a first surface. The first surface is provided with a first radio frequency transmission part and a second radio frequency transmission part. The first radio frequency transmission part is electrically connected to the first radio frequency pin, and the second radio frequency transmission part is electrically connected to the second radio frequency pin. The laser chip is fixed to the first surface. The laser chip has a first electrode and a second electrode. The first electrode and the first radio frequency transmission part are electrically connected by at least two first metal wires. The second electrode and the second radio frequency transmission part are electrically connected.

2. The light emitting module as described in claim 1, characterized in that, The first radio frequency transmission unit and the second radio frequency transmission unit are arranged at intervals along a first direction; The first radio frequency transmission section includes a first subsection, a second subsection, and a third subsection connected in sequence. The first subsection is electrically connected to the first electrode through the at least two first metal wires, and the third subsection is electrically connected to the first radio frequency pin. The width of the first sub-part along the first direction is different from the width of the second sub-part along the first direction, and the area of ​​the first sub-part is greater than or equal to 0.02 mm. 2 .

3. The light emitting module as described in claim 1 or 2, characterized in that, The first radio frequency transmission unit and the second radio frequency transmission unit are arranged at intervals along a first direction; The first radio frequency transmission section includes a first subsection, a second subsection, and a third subsection connected in sequence. The first subsection is electrically connected to the first electrode through the at least two first metal wires, and the third subsection is electrically connected to the first radio frequency pin. The width of the third sub-part along the first direction is different from the width of the second sub-part along the first direction, and the area of ​​the third sub-part is greater than or equal to 0.015 mm. 2 .

4. The light emitting module as described in claim 2 or 3, characterized in that, The width of the first sub-part along the first direction is greater than the width of the second sub-part along the first direction, and the width of the third sub-part along the first direction is greater than the width of the second sub-part along the first direction.

5. The light emitting module as described in any one of claims 1 to 4, characterized in that, The first radio frequency transmission unit is electrically connected to the first radio frequency pin via at least two second metal wires; The second radio frequency transmission unit is electrically connected to the second radio frequency pin via at least two third metal wires.

6. The light emitting module according to any one of claims 1 to 5, characterized in that, The first radio frequency transmission unit and the second radio frequency transmission unit are arranged at intervals along a first direction; The second radio frequency transmission section includes a fourth subsection, a fifth subsection, and a sixth subsection connected in sequence; the second electrode is located on the surface of the fourth subsection and is electrically connected to the fourth subsection; the sixth subsection is electrically connected to the second radio frequency pin. The width of the sixth sub-part along the first direction is different from the width of the fifth sub-part along the first direction, and the area of ​​the sixth sub-part is greater than or equal to 0.015 mm. 2 .

7. The light emitting module as described in claim 6, characterized in that, The width of the fourth sub-part along the first direction is greater than the width of the fifth sub-part along the first direction, and the width of the sixth sub-part along the first direction is greater than the width of the fifth sub-part along the first direction.

8. The light emitting module as described in claim 1, characterized in that, The first radio frequency transmission section is a strip structure of equal width, and the second radio frequency transmission section is a strip structure of equal width.

9. The light emitting module according to any one of claims 1 to 8, characterized in that, The distance between the center of the orthographic projection of the first RF pin on the base surface and the center of the orthographic projection of the second RF pin on the base surface is less than or equal to 2.0 mm.

10. The light emitting module according to any one of claims 1 to 9, characterized in that, The first radio frequency pin includes a first body portion and a first connection portion. The first connection portion is located at one end of the first body portion near the substrate. The first connection portion is electrically connected to the first radio frequency transmission portion, and the cross-sectional area of ​​the first connection portion is larger than the cross-sectional area of ​​the first body portion. The second RF pin includes a second body portion and a second connection portion. The second connection portion is located at one end of the second body portion near the substrate. The second connection portion and the second RF transmission portion are electrically connected, and the cross-sectional area of ​​the second connection portion is larger than the cross-sectional area of ​​the second body portion.

11. The light emitting module according to any one of claims 1 to 10, characterized in that, The first radio frequency pin has a first sidewall, which is a plane; the first sidewall and the substrate are located on the same side of the base, and the first sidewall is electrically connected to the first radio frequency transmission part; The second RF pin has a second sidewall, which is a plane; the second sidewall and the substrate are located on the same side of the base, and the second sidewall and the second RF transmission part are electrically connected.

12. The light emitting module according to any one of claims 1 to 11, characterized in that, The light emitting module also includes a cooler, which is located on the side of the substrate away from the laser chip, and the cooler and the substrate are thermally connected.

13. An optical component, characterized in that, It includes a package shell and a light emitting module as described in any one of claims 1 to 12; the package shell and the base are connected and form a receiving cavity; the substrate and the laser chip are located within the receiving cavity.

14. An optical module, characterized in that, It includes a housing, a circuit board, and an optical component as described in claim 13; the circuit board and the optical component are located within the housing, and the first radio frequency pin and the second radio frequency pin in the circuit board and the optical emitting module are electrically connected.

15. An optical network system, characterized in that, The device includes a first terminal device, a second terminal device, at least one optical fiber, and a plurality of optical modules as described in claim 14; the plurality of optical modules include a first optical module and a second optical module, the first optical module and the first terminal device are electrically connected, the second optical module and the second terminal device are electrically connected, and the first optical module and the second optical module are connected through the at least one optical fiber.

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