Modulation signal adaptive control method, device, optical module and optical communication equipment

Abstract

This invention discloses an adaptive control method, apparatus, optical module, and optical communication device for an optical module modulation signal. The optical module includes a transmission interface for receiving electrical signals, a modulation driver, and an optoelectronic modulator. The modulation driver is connected between the transmission interface and the optoelectronic modulator, and converts the electrical signal input from the transmission interface into a modulation signal and transmits it to the optoelectronic modulator. The optoelectronic modulator modulates the modulation signal to output an optical signal. The method includes: real-time detection of the amplitude S of the modulation signal output by the modulation driver. out ; Calculate the amplitude control parameter S reg =A×tanh(B×(S out -E))+C, where A, B, C, and E are preset adjustment parameters; the amplitude control parameter S reg The modulation signal amplitude control register in the modulation driver is written to provide feedback for adjusting the amplitude of the modulation signal. This invention allows for rapid adjustment of the modulation signal amplitude control parameters with more precise and accurate control.

Description

Technical Field

[0001] This invention relates to the field of optical modules, and more particularly to adaptive control of modulation signals in optical modules. Background Technology

[0002] With the explosive growth of artificial intelligence, high-performance computing, and data center traffic, the demand for interconnect bandwidth between computing chips (such as GPUs / TPUs / NPUs) and switch chips has surged, with single-channel rates evolving towards 224Gbps and above. Traditional pluggable optical modules are typically mounted on the device panel and connected to the core chip via printed circuit board (PCB) traces several inches or even longer. At such high speeds, long PCB traces introduce severe dielectric loss, reflection, and crosstalk, resulting in significant deterioration of the signal eye diagram. To compensate for channel impairments, high-power digital signal processor (DSP) chips must be integrated inside the optical module, which not only increases module power consumption and latency but also drives up system costs and heat dissipation challenges.

[0003] Linear-drive pluggable optics (LPO) completely removes the DSP chip inside the optical module, replacing it with a linear drive circuit, significantly reducing module cost and power consumption, and adopting mature standard pluggable packaging forms (such as QSFP-DD, OSFP, etc.). However, LPO modules are essentially still panel-type pluggable devices, and they still have long PCB traces between themselves and computing chips or switch chips. Moreover, without the powerful compensation of DSP, the high-frequency insertion loss caused by long-distance traces will directly erode the link budget, making LPO extremely sensitive to channel quality, with insufficient signal eye diagram margin, and limited performance in high-speed, high-density scenarios. Because the DSP chip is removed, there is no "digital correction" capability of DSP, and the driver must ensure the accuracy and linearity of the output amplitude itself. At the same time, the operating point of the optoelectronic modulator must be precisely locked; otherwise, amplitude distortion will be directly transmitted to the optical domain. Therefore, the requirements for amplitude control precision are even higher.

[0004] To fundamentally shorten the interconnection distance of electrical signals, Near Package Optics (NPO) technology has been proposed. NPO places the optical engine directly on the package substrate of the computing chip or switch chip, or installs it in the vicinity of the core chip via an extremely short physical connection, shortening the electrical signal path to the centimeter or even millimeter level, forming a near package optical module. This near package optical module virtually eliminates the high-frequency losses caused by long PCB traces, significantly reduces signal conditioning complexity, and can even eliminate some equalization circuitry, achieving excellent signal integrity and energy efficiency.

[0005] However, in this near-packaged optical module, because the core chip and the optical engine are closer together, the loss during information transmission is lower. When affected by external factors, although the signal fluctuation amplitude is smaller than that of the previous packaged optical module, the signal fluctuation is also faster and more frequent. The existing adaptive control method for modulation signal is too coarse and cannot effectively control the modulation signal of this near-packaged optical module.

[0006] Therefore, there is an urgent need for an adaptive control method and device for modulation signals that is more responsive and provides more precise control. Summary of the Invention

[0007] The purpose of this invention is to provide an adaptive control method, device, optical module, and optical communication equipment for optical module modulation signals, which can quickly adjust the amplitude control parameters of the modulation signal in the optical module and make the adjustment more precise and accurate.

[0008] To achieve the above objectives, the present invention provides an adaptive control method for modulation signals in an optical module. The optical module includes a transmission interface for receiving electrical signals, a modulation driver, and an optoelectronic modulator. The modulation driver is connected to both the transmission interface and the optoelectronic modulator, converting the electrical signal input to the transmission interface into a modulation signal and transmitting it to the optoelectronic modulator. The optoelectronic modulator modulates the modulation signal into an optical signal output. The adaptive control method for modulation signals in the optical module includes: real-time detection of the amplitude S of the modulation signal output by the modulation driver. out ; Calculate the amplitude control parameter S reg , among which, S reg =A×tanh(B×(S out -E))+C, where A, B, C, and E are preset adjustment parameters; the amplitude control parameter S reg Write to the modulation signal amplitude control register in the modulation driver to provide feedback and adjust the amplitude of the modulation signal.

[0009] Preferably, the adjustment parameters are multiple sets and correspond to the architecture of the optical communication packaging structure; in calculating the amplitude control parameter S reg Previously, the adjustment parameters corresponding to the architecture of the optical communication packaging structure were obtained, and the adjustment parameters were initialized.

[0010] Specifically, the optical communication packaging structure includes a core chip and a connector that is plugged into and connected to the transmission interface of the optical module. The core chip and the connector are electrically connected through the circuit motherboard 12, and the distance between the core chip and the connector is less than or equal to 5 cm.

[0011] More specifically, the optical communication packaging structure includes a first architecture and a second architecture. In the first architecture, the core chip is mounted on a packaging substrate, and the packaging substrate and the connector are mounted on a circuit board. The distance between the core chip and the connector is greater than 1 cm and less than 5 cm. The adjustment parameters corresponding to the first architecture are A = 129.59, B = -2.40, C = 127.50, and E = 3.0. In the second architecture, the core chip and the connector are directly electrically connected through a packaging substrate, and the distance between the core chip and the connector is less than or equal to 1 cm. The adjustment parameters corresponding to the second architecture are A = 127.51, B = -3.46, C = 127.50, and E = 2.8.

[0012] The present invention also provides an adaptive control device for optical module modulation signals, including a processor, a memory, and operation instructions. The operation instructions are stored in the memory, and the processor is connected to the memory and the modulation driver of the optical module respectively, and executes the operation instructions to realize the adaptive control method for optical module modulation signals as described above.

[0013] The present invention also provides an optical module, including an optical module housing, a transmission interface and an optical communication interface mounted on the optical module housing, and a modulation driver and an optoelectronic modulator mounted inside the optical module housing. The modulation driver is connected to the transmission interface and the optoelectronic modulator, converts the electrical signal input from the transmission interface into a modulation signal and transmits it to the optoelectronic modulator. The optoelectronic modulator modulates the modulation signal into an optical signal and outputs the optical signal through the optical communication interface. The optical module further includes a microcontroller mounted inside the optical module housing, the microcontroller being connected to the modulation driver, and real-time detecting the amplitude S of the modulation signal output by the modulation driver. out Calculate the amplitude control parameter S reg , among which, S reg =A×tanh(B×(S out -E))+C, A, B, C, and E are preset adjustment parameters, and the microcontroller will control the amplitude parameter S. reg The modulation signal amplitude control register in the modulation driver is written to provide feedback to adjust the amplitude of the modulation signal, where A, B, C, and E are preset adjustment parameters.

[0014] The present invention also provides an optical communication device, characterized in that: it includes a device housing, an optical communication packaging structure, and an optical module, wherein the optical communication packaging structure and the optical module are installed inside the device housing, the optical communication packaging structure includes a circuit board, a core chip, and a connector, the core chip and the connector are installed on the circuit board and electrically connected through the circuit board, the optical module is the optical module described above, and the transmission interface of the optical module is plugged into the connector.

[0015] Preferably, the distance between the core chip and the connector is less than or equal to 5 cm.

[0016] Specifically, the core chip is mounted on a packaging substrate, and the packaging substrate and the connector are mounted on a circuit board. The distance between the core chip and the connector is greater than 1 cm and less than 5 cm. Among the adjustment parameters, A=129.59, B= -2.40, C= 127.50, and E=3.0.

[0017] Specifically, the core chip and the connector are directly electrically connected through a packaging substrate and the distance between the core chip and the connector is less than or equal to 1 cm. Among the adjustment parameters, A = 127.51, B = -3.46, C = 127.50, and E = 2.8.

[0018] Compared with the prior art, the present invention adjusts the amplitude control parameters in the modulation signal amplitude register in real time by using the modulation signal output by the modulation driver. The adjustment speed is fast, and during the adjustment, the amplitude control parameters are adjusted according to the hyperbolic tangent function, so that the amplitude control parameters can be finely adjusted around the adjustment point corresponding to the reference parameter E. The adjustment is accurate and can be applied to short-range optical communication packaging structures where the core chip and optical module are relatively close. Attached Figure Description

[0019] Figure 1 This is a structural diagram of an optical module.

[0020] Figure 2 This is a flowchart of the adaptive control method for the modulation signal of the optical module according to the present invention.

[0021] Figure 3 This is a structural diagram of the optical communication device of the present invention in Embodiment 1.

[0022] Figure 4 This is a diagram showing the correspondence between the amplitude control parameters and the amplitude of the modulation signal in the adaptive control method for the optical module modulation signal of the present invention in Example 1.

[0023] Figure 5 This is a structural diagram of the optical communication device of the present invention in Embodiment 2.

[0024] Figure 6 This is a diagram showing the correspondence between the amplitude control parameters and the amplitude of the modulation signal in the adaptive control method for the optical module modulation signal of the present invention in Example 2. Detailed Implementation

[0025] To illustrate the technical content, structural features, objectives, and effects of the present invention in detail, the following description is provided in conjunction with the embodiments and accompanying drawings.

[0026] refer to Figure 1 and Figure 2 This invention discloses an adaptive control method for optical module modulation signals.

[0027] refer to Figure 1 The optical module 200 includes a transmission interface 21 for receiving electrical signals, a modulation driver 22, an opto-modulator 23, and an optical communication interface 24. The modulation driver 22 is connected to the transmission interface 21 and the opto-modulator 23, and converts the electrical signal input to the transmission interface 21 into a modulation signal and transmits it to the opto-modulator 23. The opto-modulator 23 modulates the modulation signal into an optical signal, and then outputs the optical signal through the optical communication interface 24. The optical module 200 also includes a microcontroller 25 connected to the modulation driver 22.

[0028] refer to Figure 2 The operation instructions of the optical module modulation signal adaptive control method are built into the microcontroller 25 and include steps S1 to S4.

[0029] Step S1: Initialize adjustment parameters A, B, C, and E. Specifically, preset values ​​for A, B, C, and E are retrieved from the memory of the microcontroller 25 to initialize the adjustment parameters A, B, C, and E.

[0030] Step S2: Real-time detection of the amplitude S of the modulation signal output by the modulation driver 22. out Specifically, the modulation signal output by the modulation driver 22 is received, and the amplitude S of the modulation signal is extracted. out .

[0031] Step S3, calculate the amplitude control parameter S reg , among which, S reg =A×tanh(B×(S out -E))+C. tanh is the hyperbolic tangent function.

[0032] Step S4, set the amplitude control parameter S reg The modulation signal amplitude control register is written into the modulation driver 22, and the modulation driver 22 uses the current amplitude control parameter S stored in the modulation signal amplitude control register. regDuring the modulation signal conversion, the amplitude of the modulation signal is adjusted by feedback.

[0033] In step S3, the present invention uses the hyperbolic tangent function to determine the amplitude S of the feedback modulation signal. out Convert to amplitude control parameter S reg When the modulation driver 22 converts the electrical signal into a modulation signal, the amplitude control parameter S reg As a parameter used during modulation signal conversion, it is used to adjust the amplitude S of the modulation signal in the next cycle. out .

[0034] In a preferred embodiment, the adjustment parameters are multiple sets and correspond to the architecture of the optical communication packaging structure.

[0035] In this preferred embodiment, in step S1, the adjustment parameters corresponding to the architecture of the optical communication packaging structure are obtained and the adjustment parameters are initialized.

[0036] Specifically, in this preferred embodiment, the optical module 200 includes a memory that pre-stores multiple sets of adjustment parameters corresponding to the architecture of the optical communication packaging structure. In step S1, the microcontroller 25 of the optical module 200 acquires the architecture information of the optical communication packaging structure connected to the optical module, retrieves the adjustment parameters corresponding to the architecture of the optical communication packaging structure from the memory, and initializes the adjustment parameters.

[0037] The optical module 200 is electrically connected to the connector 30 in the optical communication packaging structure, thereby communicating with the optical communication packaging structure. The optical module 200 obtains the code corresponding to the architecture of the optical communication packaging structure by communicating with the connector 30, identifies the architecture of the optical communication packaging structure by the code, and then retrieves the adjustment parameters corresponding to the architecture of the optical communication packaging structure from the memory and performs initialization according to the adjustment parameters.

[0038] The adjustment parameters A, B, C, and E corresponding to the architecture of each optical communication package are obtained by staff through adjustment tests based on actual products and / or simulation tests using professional tools.

[0039] refer to Figure 3 The optical communication packaging structure includes a core chip 32 and a connector 30 that is pluggably connected to the transmission interface 21 of the optical module 200. The core chip 32 and the connector 30 are electrically connected through the circuit motherboard 12, and the distance between the core chip 32 and the connector 30 is less than or equal to 5 cm.

[0040] The optical communication packaging structure includes a first architecture (such as...). Figure 3 (as shown) and second architecture (as shown) Figure 5 (As shown).

[0041] refer to Figure 3 and Figure 4 In the first architecture, the core chip 32 is mounted on the packaging substrate 11, and the packaging substrate 11 and the connector 30 are mounted on the circuit board 12. The distance between the core chip 32 and the connector 30 is greater than 1 cm and less than 5 cm. Among the adjustment parameters corresponding to the first architecture, A = 129.59, B = -2.40, C = 127.50, and E = 3.0.

[0042] refer to Figure 5 and Figure 6 In the second architecture, the core chip 32 and the connector 30 are directly electrically connected through a packaging substrate 11 and the distance between the core chip 32 and the connector 30 is less than or equal to 1 cm. Among the adjustment parameters corresponding to the second architecture, A = 127.51, B = -3.46, C = 127.50, and E = 2.8.

[0043] The microcontroller 25 includes a processor, a memory, and operation instructions. The operation instructions are stored in the memory. The processor is connected to both the memory and the modulation driver 22, and executes the operation instructions to implement the optical module modulation signal adaptive control method as described above.

[0044] Specifically, the microcontroller 25 acquires the modulation signal output by the modulation driver 22 to obtain the amplitude S of the modulation signal. out The amplitude control parameter S is sent to the modulation driver 22. reg It is then stored in the modulation signal amplitude control register of the modulation driver 22.

[0045] The optical module 200 includes an optical module housing 201. A transmission interface 21 and an optical communication interface 24 are mounted on the optical module housing 201, while a modulation driver 22, an opto-modulator 23, and a microcontroller 25 are mounted inside the optical module housing 201. The optical module 200 also includes a circuit board, on which the transmission interface 21, optical communication interface 24, modulation driver 22, opto-modulator 23, and microcontroller 25 are all mounted. Preset adjustment parameters A, B, C, and E are stored in the memory of the microcontroller 25.

[0046] refer to Figure 3 The present invention also discloses an optical communication device 300, including a device housing 301, an optical communication packaging structure and an optical module 200, wherein the optical communication packaging structure and the optical module 200 are installed inside the device housing 301.

[0047] refer to Figure 3The optical communication packaging structure includes a circuit board 12, a core chip 32, and a connector 30. The core chip 32 and the connector 30 are mounted on the circuit board 12 and electrically connected through the circuit board 12 to form the first-architecture optical communication packaging structure. The transmission interface 21 of the optical module 200 is plugged into the connector 30.

[0048] refer to Figure 3 In one embodiment, the core chip 32 is mounted on the packaging substrate 11, and the packaging substrate 11 and connector 30 are mounted on the circuit board 12. The distance between the core chip 32 and connector 30 is greater than 1 cm and less than 5 cm. (Reference) Figure 4 Adjust parameters A = 129.59, B = -2.40, C = 127.50, E = 3.0.

[0049] refer to Figure 5 Unlike the previous embodiment, in another embodiment, the core chip 32 and the connector 30 are directly electrically connected via a packaging substrate 11 to form a second-architecture optical communication packaging structure. The core chip 32 and the connector 30 are mounted on the packaging substrate 11, which is mounted on the circuit board 12. The distance between the core chip 32 and the connector 30 is less than or equal to 1 cm. Figure 6 Adjust parameters A = 127.51, B = -3.46, C = 127.50, E = 2.8.

[0050] Wherein, if the core chip 32 is a computing chip, the optical communication device 300 is a computing server. If the core chip 32 is a switch chip, the optical communication device 300 is a switch.

[0051] Compared with the prior art, the present invention adjusts the amplitude control parameter S in the modulation signal amplitude register in real time by means of the modulation signal output by the modulation driver 22. reg This allows the amplitude of the modulation signal output by the modulation driver 22 to be adjusted in real time, resulting in fast adjustment speed. The microprocessor 25 adjusts the amplitude control parameter S according to the hyperbolic tangent function. reg This makes the amplitude control parameter S reg It can be finely adjusted around the reference center point (parameter E) and the adjustment is accurate. It is suitable for short-range optical communication packaging structures where the core chip 32 and the optical module 200 are relatively close.

[0052] The above-disclosed embodiments are merely preferred embodiments of the present invention and should not be construed as limiting the scope of the present invention. Therefore, any equivalent variations made in accordance with the scope of the present invention are still within the scope of the present invention.

Claims

1. An adaptive control method for modulation signals in an optical module, the optical module comprising a transmission interface for receiving electrical signals, a modulation driver, and an optoelectronic modulator, wherein the modulation driver is connected to the transmission interface and the optoelectronic modulator respectively, converts the electrical signal input to the transmission interface into a modulation signal, and transmits it to the optoelectronic modulator, and the optoelectronic modulator modulates the modulation signal to output an optical signal, characterized in that: The adaptive control method for the optical module modulation signal includes: Real-time detection of the amplitude S of the modulation signal output by the modulation driver out ; Calculate the amplitude control parameter S reg , among which, S reg =A×tanh(B×(S out -E))+C, where A, B, C, and E are preset adjustment parameters; The amplitude control parameter S reg Write to the modulation signal amplitude control register of the modulation driver to provide feedback and adjust the amplitude of the modulation signal.

2. The adaptive control method for optical module modulation signals as described in claim 1, characterized in that: There are multiple sets of adjustment parameters, which correspond to the architecture of the optical communication packaging structure. Calculate the amplitude control parameter S reg Previously, adjustment parameters A, B, C, and E corresponding to the architecture of the optical communication packaging structure were obtained, and the adjustment parameters were initialized.

3. The adaptive control method for optical module modulation signals as described in claim 2, characterized in that: The optical communication packaging structure includes a core chip and a connector that is pluggable to the transmission interface of the optical module. The core chip and the connector are electrically connected through a circuit board, and the distance between the core chip and the connector is less than or equal to 5 cm.

4. The adaptive control method for optical module modulation signals as described in claim 3, characterized in that: The optical communication packaging structure includes a first architecture and a second architecture; In the first architecture, the core chip is mounted on the packaging substrate, and the packaging substrate and the connector are mounted on the circuit board. The distance between the core chip and the connector is greater than 1 cm and less than 5 cm. Among the adjustment parameters corresponding to the first architecture, A = 129.59, B = -2.40, C = 127.50, and E = 3.

0. In the second architecture, the core chip and the connector are directly electrically connected through a packaging substrate and the distance between the core chip and the connector is less than or equal to 1 cm. Among the adjustment parameters corresponding to the second architecture, A = 127.51, B = -3.46, C = 127.50, and E = 2.

8.

5. An adaptive control device for optical module modulation signals, characterized in that: The system includes a processor, a memory, and operation instructions. The operation instructions are stored in the memory. The processor is connected to both the memory and the modulation driver of the optical module. The processor executes the operation instructions to implement the optical module modulation signal adaptive control method as described in any one of claims 1-4.

6. An optical module, comprising an optical module housing, a transmission interface and an optical communication interface mounted on the optical module housing, and a modulation driver and an optoelectronic modulator mounted inside the optical module housing, wherein the modulation driver is connected to the transmission interface and the optoelectronic modulator, converts an electrical signal input from the transmission interface into a modulation signal and transmits it to the optoelectronic modulator, and the optoelectronic modulator modulates the modulation signal into an optical signal and outputs the optical signal through the optical communication interface, characterized in that: It also includes a microcontroller installed inside the housing of the optical module. The microcontroller includes a processor, a memory, and operating instructions. The operating instructions are stored in the memory. The processor is connected to the memory and the modulation driver respectively, and executes the operating instructions to implement the optical module modulation signal adaptive control method as described in any one of claims 1-4.

7. An optical module, comprising an optical module housing, a transmission interface and an optical communication interface mounted on the optical module housing, and a modulation driver and an optoelectronic modulator mounted inside the optical module housing, wherein the modulation driver is connected to the transmission interface and the optoelectronic modulator respectively, converts an electrical signal input from the transmission interface into a modulation signal and transmits it to the optoelectronic modulator, and the optoelectronic modulator modulates the modulation signal into an optical signal and outputs the optical signal through the optical communication interface, characterized in that: It also includes a microcontroller installed inside the optical module housing, the microcontroller being connected to the modulation driver and detecting the amplitude S of the modulation signal output by the modulation driver in real time. out Calculate the amplitude control parameter S reg , among which, S reg =A×tanh(B×(S out -E))+C, A, B, C, and E are preset adjustment parameters, and the microcontroller will control the amplitude parameter S. reg The modulation signal amplitude control register in the modulation driver is written to provide feedback to adjust the amplitude of the modulation signal, where A, B, C, and E are preset adjustment parameters.

8. An optical communication device, characterized in that: The device includes a housing, an optical communication packaging structure, and an optical module. The optical communication packaging structure and the optical module are installed inside the housing. The optical communication packaging structure includes a circuit board, a core chip, and a connector. The core chip and the connector are installed on the circuit board and electrically connected through the circuit board's lines. The optical module is the optical module as described in claim 7, and the optical module's transmission interface is plugged into the connector.

9. The optical communication device as described in claim 8, characterized in that: The distance between the core chip and the connector is less than or equal to 5cm.

10. The optical communication device as described in claim 9, characterized in that: The core chip is mounted on a packaging substrate, and the packaging substrate and the connector are mounted on a circuit board. The distance between the core chip and the connector is greater than 1 cm and less than 5 cm. In the adjustment parameters, A = 129.59, B = -2.40, C = 127.50, and E = 3.0; or, The core chip and the connector are directly electrically connected via a packaging substrate. The distance between the core chip and the connector is less than or equal to 1 cm. Among the adjustment parameters, A = 127.51, B = -3.46, C = 127.50, and E = 2.8.

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