Electronic device

Abstract

The application discloses an electronic device, and belongs to the technical field of electronic devices. The electronic device comprises a mainboard, a camera module and a conductive connecting assembly. The mainboard is provided with a mounting gap, and the mounting gap is arranged on one side of the mainboard facing a battery compartment. The camera module is arranged in the mounting gap. The mainboard comprises a first section and a second section arranged along a first direction. Along the first direction, the first section and the second section are respectively located on both sides of the mounting gap. The conductive connecting assembly is used for electrically connecting the first section and the second section.

Description

Technical Field

[0001] This application belongs to the field of electronic equipment technology, and specifically relates to an electronic device. Background Technology

[0002] The electronic device contains a motherboard, a camera module, and a battery compartment. The motherboard and battery compartment are arranged along the length of the electronic device. Along the width of the electronic device, the camera module divides the motherboard into two parts: one part is used to install the Central Processing Unit (CPU), and the other part is used to install various electronic components. To achieve conductive connection between the two parts of the motherboard, a connecting plate structure is usually set on the side of the camera module along the length of the electronic device. However, the connecting plate structure increases the size of the motherboard along the length of the electronic device, compresses the available space in the battery area, and is not conducive to increasing the battery capacity of the electronic device. Summary of the Invention

[0003] The purpose of this application is to provide an electronic device that can achieve conductivity between motherboard partitions by relying on conductive connection components, without the need to add a connecting board structure on the side of the camera module. This can reduce the size occupied by the motherboard along the length of the electronic device, expand the available space of the battery area, and thus help improve the battery capacity of the electronic device.

[0004] In a first aspect, embodiments of this application provide an electronic device, including: a motherboard, a camera module, and a conductive connection component; the motherboard has a mounting notch located on the side of the motherboard facing the battery compartment; the camera module is disposed within the mounting notch; the motherboard includes a first segment and a second segment arranged along a first direction, the first segment and the second segment being located on opposite sides of the mounting notch along the first direction; the orthographic projection of the conductive connection component onto the plane of the motherboard at least partially overlaps with the orthographic projection of the camera module onto the plane of the motherboard, and the conductive connection component is used to electrically connect the first segment and the second segment.

[0005] In this embodiment, the electronic device includes a motherboard, a camera module, and a conductive connection component. The motherboard and battery compartment are arranged along the length of the electronic device. A mounting notch is provided on the motherboard, and the camera module is disposed within the mounting notch. Along a first direction, the mounting notch divides the motherboard into a first section and a second section, located on either side of the mounting notch. Electronic devices can be arranged in the first and second sections respectively. The orthographic projection of the conductive connection component onto the plane of the motherboard and the orthographic projection of the camera module onto the plane of the motherboard at least partially overlap, allowing the conductive connection component to be placed in the corresponding projection area of ​​the camera module, thereby reducing the space occupied by the camera module along the length of the electronic device. The conductive connection component can establish a conductive path between the first and second sections, thus eliminating the need for an additional connecting plate structure on the side of the camera module to achieve electrical conduction between the first and second sections. This helps reduce the size occupied by the motherboard along the length of the electronic device, expands the usable space of the battery area, and ultimately improves the battery capacity of the electronic device. Attached Figure Description

[0006] Figure 1 This is one of the schematic structural diagrams of the electronic device provided in the embodiments of this application;

[0007] Figure 2 This is a second schematic structural diagram of the electronic device provided in the embodiments of this application;

[0008] Figure 3 This is the third schematic structural diagram of the electronic device provided in the embodiments of this application;

[0009] Figure 4 This is the fourth schematic structural diagram of the electronic device provided in the embodiments of this application;

[0010] Figure 5 This is the fifth schematic structural diagram of the electronic device provided in the embodiments of this application;

[0011] Figure 6 This is the sixth schematic structural diagram of the electronic device provided in the embodiments of this application;

[0012] Figure 7 This is the seventh schematic structural diagram of the electronic device provided in the embodiments of this application;

[0013] Figure 8 This is a schematic structural diagram of the protrusion structure provided in the embodiments of this application.

[0014] Reference numerals: 10, electronic device; 1001, battery compartment; 100, frame; 101, wire channel; 102, limiting groove; 110, metal layer; 120, insulating layer; 200, motherboard; 201, mounting notch; 210, first section; 220, second section; 211, first electrical connection area; 221, second electrical connection area; 300, camera module; 400, conductive connection assembly; 401, first end; 4011, first laser-engraved surface; 4012, first gold-plated metal sheet; 402, second end; 4021, second laser-engraved surface; 4022, second gold-plated metal sheet; 403, protruding structure; 410, conductive wire; 420, insulating component; 430, circuit board; 440, adhesive component; 500, conductive connector. Detailed Implementation

[0015] The technical solutions of the embodiments of this application will be clearly described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application are within the scope of protection of this application.

[0016] The terms "first," "second," etc., used in the specification and claims of this application are used to distinguish similar objects and not to describe a specific order or sequence. It should be understood that such use of data can be interchanged where appropriate so that embodiments of this application can be implemented in orders other than those illustrated or described herein, and the objects distinguished by "first," "second," etc., are generally of the same class and the number of objects is not limited; for example, a first object can be one or more. Furthermore, in the specification and claims, "and / or" indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.

[0017] The electronic device provided in the embodiments of this application will be described in detail below with reference to the accompanying drawings and through specific embodiments and application scenarios.

[0018] like Figure 1 , Figure 2 , Figure 3 and Figure 4As shown, this application embodiment provides an electronic device 10, including: a motherboard 200, a camera module 300, and a conductive connection component 400; the motherboard 200 has a mounting notch 201, which is located on the side of the motherboard 200 facing the battery compartment 1001; the camera module 300 is disposed within the mounting notch; the motherboard 200 includes a first segment 210 and a second segment 220 arranged along a first direction, and along the first direction, the first segment 210 and the second segment 220 are respectively located on both sides of the mounting notch 201; the orthographic projection of the conductive connection component 400 on the plane where the motherboard 200 is located at least partially overlaps with the orthographic projection of the camera module 300 on the plane where the motherboard 200 is located, and the conductive connection component 400 is used to electrically connect the first segment 210 and the second segment 220.

[0019] In this embodiment, the electronic device 10 includes a motherboard 200, a camera module 300, and a conductive connection assembly 400. The motherboard 200 and the battery compartment 1001 are arranged along the length of the electronic device 10. A mounting notch 201 is provided on the motherboard 200, located on the side of the motherboard 200 facing the battery compartment 1001. The camera module 300 is disposed within the mounting notch 201. Along a first direction, the mounting notch 201 divides the motherboard 200 into a first section 210 and a second section 220, respectively located on both sides of the mounting notch 201. Electronic devices can be arranged in the first section 210 and the second section 220 respectively. The conductive connection assembly 400 is projected onto the plane of the motherboard 200. The orthographic projections of the image and camera module 300 on the plane of the motherboard 200 at least partially overlap, enabling the conductive connection component 400 to be placed in the projection area corresponding to the image module 300, thereby reducing the space occupied by the image module 300 along the length of the electronic device 10. The conductive connection component 400 can establish a conductive path between the first section 210 and the second section 220, thus eliminating the need to add a connecting plate structure to the side of the image module 300 to achieve electrical conduction between the first section 210 and the second section 220. This helps to reduce the size occupied by the motherboard 200 along the length of the electronic device 10, expand the available space in the battery area, and thus help to increase the battery capacity of the electronic device 10.

[0020] Figure 1 The middle arrow A is used to indicate the first direction.

[0021] For example, the first direction is the width direction of the electronic device 10.

[0022] It should be noted that as imaging capabilities continue to upgrade, the camera module occupies an increasingly larger portion of the internal space of electronic devices, limiting battery placement space and making it difficult to achieve optimal stacking of internal components. In related technologies, electronic devices generally employ a three-section stacking structure, divided into a motherboard area, a battery area, and a sub-board area. The length of the motherboard area is constrained by the arrangement of the camera module and various components. To increase battery capacity, the length of the motherboard area needs to be reduced. The motherboard uses a high-density interconnect multilayer printed circuit board, relying on microvia and buried / blind via technology to achieve high-density component routing. The frame is used to fix and support the motherboard, camera module, and other internal components of the electronic device. When the camera module is centrally located, the motherboard area is divided into two parts: a large area for the processor and a smaller area for various functional modules. Therefore, a motherboard interconnect structure is reserved on the side of the camera module for wiring. This interconnect structure increases the motherboard's footprint along the length of the electronic device, compressing the available space in the battery area. This application arranges the conductive connection component 400 and the camera module 300 in a way that at least partially overlaps in projection, so that the first end 401 of the conductive connection component 400 is electrically connected to the first section 210 and the second end 402 is electrically connected to the second section 220. The conductive connection component 400 directly establishes a conductive path between the two sections, eliminating the need to set up a motherboard 200 connecting board on the side of the camera module 300, reducing the size occupied by the motherboard 200 along the length of the electronic device 10, expanding the available space in the battery area, and increasing the battery capacity of the electronic device 10.

[0023] like Figure 4 As shown, in some embodiments of this application, the electronic device 10 further includes a frame 100;

[0024] The motherboard 200 is disposed on the frame 100, and the conductive connection component 400 is disposed on the side of the frame 100 facing the motherboard 200. The conductive connection component 400 has a first end 401 and a second end 402. The first end 401 is electrically connected to the first section 210, and the second end 402 is electrically connected to the second section 220. Along the first direction, the first end 401 and the second end 402 are respectively located on both sides of the camera module 300.

[0025] In the above embodiment, the frame 100 provides a mounting base for the motherboard 200 and the conductive connection assembly 400. The conductive connection assembly 400 is mounted on the side of the frame 100 facing the motherboard 200. The conductive connection assembly 400 contacts the first segment 210 and the second segment 220 respectively through its first end 401 and second end 402, forming a conductive structure spanning between the first segment 210 and the second segment 220, thereby achieving electrical conduction between the first segment 210 and the second segment 220. The first end 401 and the second end 402 are positioned on both sides of the camera module 300 along the first direction, avoiding obstruction by the camera module 300, thus ensuring the stability of the electrical connection between the first end 401, the second end 402 and the first segment 210 and the second segment 220.

[0026] like Figure 3 , Figure 4 and Figure 5 As shown, in some embodiments of this application, the conductive connection component 400 includes a conductive wire 410;

[0027] The frame 100 has a wire groove 101, and the conductive wire 410 is disposed in the wire groove 101. The conductive wire 410 and the wire groove 101 both extend in the direction from the first section 210 toward the second section 220. The two ends of the conductive wire 410 respectively form the first end 401 and the second end 402.

[0028] In the above embodiment, the wire groove 101 is formed in the frame 100 to store and limit the conductive wire 410, preventing the conductive wire 410 from shifting or warping. The conductive wire 410 and the wire groove 101 extend along the direction from the first section 210 to the second section 220, which can ensure that the conductive wire 410 directly connects the first section 210 and the second section 220. The two ends of the conductive wire 410 directly form the first end 401 and the second end 402, which simplifies the overall structure of the conductive connection component 400, reduces the number of parts, and makes the assembly process simpler. At the same time, the conductive wire 410 is stored inside the frame 100 and will not occupy additional planar space of the motherboard 200, further ensuring the arrangement space of the battery area.

[0029] For example, the conductive wire 410 is made of copper wire. The conductive wire 410 is completely embedded in the wire groove 101. The two ends of the conductive wire 410 extend out of the wire groove 101 and respectively contact the first section 210 and the second section 220, thus directly establishing a conductive path.

[0030] like Figure 4 As shown, in some embodiments of this application, the conductive connection assembly 400 further includes an insulating element 420;

[0031] The insulating element 420 fills the wire groove 101 and wraps the conductive wire 410, with both ends of the conductive wire 410 extending out of the insulating element 420.

[0032] In the above embodiment, the insulating member 420 filled inside the wire groove 101 can completely wrap the conductive wire 410, isolate the conductive wire 410 from the conductive contact between the conductive wire 410 and the frame 100 and the main board 200, prevent short circuits and leakage problems, and ensure the stable operation of the conductive path. The insulating member 420 filling the wire groove 101 can also fix the conductive wire 410, further improving the installation firmness of the conductive wire 410. Only leaving the two ends of the conductive wire 410 protruding from the insulating member 420 will not affect the electrical connection between the first end 401 and the second end 402 and the first section 210 and the second section 220 respectively, thus taking into account both insulation protection and conduction functions.

[0033] For example, the wire groove 101 includes a first cavity and a second cavity, with the second cavity located at both ends of the first cavity, and the cross-sectional area of ​​the second cavity being larger than that of the first cavity. The second cavity is used to accommodate the conductive connector 500, allowing the conductive connector 500 to be housed inside the wire groove 101, thus avoiding the conductive connector 500 being externally mounted and occupying stacking space.

[0034] For example, the insulating component 420 is made of plastic injection molding layer, which completely wraps the main body of the conductive wire 410 after injection molding, leaving only the two ends of the conductive wire 410 exposed as conductive contacts.

[0035] like Figure 3 and Figure 5 As shown, in some embodiments of this application, the frame 100 is provided with a plurality of wire grooves 101, and each wire groove 101 is provided with at least one conductive wire 410.

[0036] In the above embodiment, multiple wire slots 101 can independently arrange multiple sets of conductive wires 410. Multiple sets of conductive wires 410 can transmit different signals or share the transmission current, thereby improving the conductivity transmission capability. When a single conductive wire 410 fails, the remaining conductive wires 410 can still maintain conductivity, thereby improving the reliability of the conductive path. All sets of conductive wires 410 are housed inside the frame 100, without increasing the length of the motherboard 200, thus continuously ensuring the available space in the battery area.

[0037] For example, the frame 100 has two parallel wire slots 101, and each wire slot 101 has a metal conductive wire 410 arranged inside it. The two sets of conductive wires 410 transmit power signals and data signals respectively.

[0038] In some embodiments of this application, the conductive wire 410, the insulating element 420 and the frame 100 are an integral structure.

[0039] In the above embodiments, the conductive wire 410, the insulating component 420, and the frame 100 are integrally formed without the need for separate assembly of the conductive wire 410 and the insulating component 420, which simplifies the assembly process of the electronic device 10, reduces assembly tolerance, and ensures that the three are tightly joined without gaps, providing stable insulation protection. The overall thickness of the integrated structure is controllable, which will not increase the overall thickness of the device or compress the battery placement space.

[0040] For example, a pre-embedded injection molding process is used to pre-place the conductive wire 410 inside the mold, and the injection-molded insulating part 420 and the frame 100 are integrally formed. After the three are formed, they are tightly combined into an integral part.

[0041] like Figure 3 As shown, in some embodiments of this application, the frame 100 includes a metal layer 110 and an insulating layer 120; the insulating layer 120 is located between the metal layer 110 and the motherboard 200, and the wire groove 101 is formed in the metal layer 110.

[0042] In the above embodiments, the metal layer 110 has a wire groove 101 which can stably accommodate the conductive wire 410 by relying on the structural strength of the metal layer 110. The insulating layer 120 is arranged between the metal layer 110 and the motherboard 200 to isolate the metal layer 110 and the motherboard 200 from static electricity and short circuit interference. The metal layer 110 can improve the overall structural rigidity of the frame 100 and reduce the deformation of the whole machine. The insulating layer 120 isolates the metal layer 110 and the motherboard 200 separately.

[0043] For example, the metal layer 110 is an aluminum alloy substrate, and the insulating layer 120 is a plastic film adhered to the side of the metal layer 110 facing the motherboard 200.

[0044] For example, the metal layer 110 of the frame 100 is made of aluminum alloy. The metal layer 110 of the frame 100 is integrally machined using Computer Numerical Control (CNC) milling technology to form the cable groove 101 and the conductive wire 410. The conductive wire 410 is formed by machining the metal layer 110 body. Insulating material is injection molded inside the cable groove 101 to form an insulating component 420, which wraps around the conductive wire 410. After injection molding, the conductive wire 410, the insulating component 420, and the aluminum alloy metal layer of the frame 100 form an integral structure. This integrated molding structure simplifies the assembly process. The insulating component 420 separates the conductive wire 410 from the remaining areas of the metal layer 110 of the frame 100, ensuring stable electrical conduction between the first and second ends of the conductive connection assembly 400 and the first and second sections 210 and 220 of the main board 200.

[0045] In some embodiments of this application, the frame 100 includes a metal layer 110; the conductive connection assembly 400 also includes an insulating element 420;

[0046] The conductive wire 410 is formed by milling the metal layer 110; the insulating part 420 wraps the conductive wire 410, and the two ends of the conductive wire 410 extend out of the insulating part 420 respectively.

[0047] In the above embodiments, the conductive wire 410 can be directly formed by milling the metal layer 110 into a single piece, eliminating the need for separate fabrication and assembly of independent wires, simplifying the parts processing flow and reducing the assembly steps of scattered components. The conductive wire 410 and the metal layer 110 are of the same origin and integral structure, and are made of the same material. When the temperature changes, the thermal expansion and contraction of the conductive wire 410 and the metal layer 110 remain consistent, avoiding the problems of end pulling and loose contact caused by the difference in deformation of different materials. The insulating component 420 completely covers the conductive wire 410, isolating the conductive wire 410 from the surrounding metal structure and ensuring circuit insulation. The two ends of the conductive wire 410 protrude from the insulating component 420, leaving a conductive area for docking with the motherboard 200, achieving stable electrical docking with the first section 210 and the second section 220. The overall wiring of the conductive connection component 400 can overlap with the position of the camera module 300, without occupying additional space along the first direction of the motherboard, reserving more usable space for the battery compartment 1001.

[0048] For example, milling can process multiple independent conductive lines 410 on the metal layer 110 at one time, adapting to the need for simultaneous deployment of multiple lines and improving overall processing efficiency.

[0049] For example, the insulating component 420 can be integrally molded and wrapped around the outside of the conductive wire 410 by injection molding. After molding, the insulating component 420 and the conductive wire 410 are tightly attached, and gaps and delamination are not likely to occur.

[0050] For example, the insulating element 420 is part of the frame 100; the wire groove 101 is formed in the insulating element 420.

[0051] For example, the first end 401 of the conductive wire 410 is provided with a first laser-etched surface 4011 for removing the oxide layer and / or the first end 401 is provided with a first gold-plated metal sheet 4012; the second end 402 of the conductive wire 410 is provided with a second laser-etched surface 4021 for removing the oxide layer and / or the second end 402 is provided with a second gold-plated metal sheet 4022.

[0052] like Figure 6 and Figure 7 As shown, in some embodiments of this application, the conductive connection assembly 400 includes a circuit board 430;

[0053] The circuit board 430 is located on the side of the frame 100 facing the main board 200. The circuit board 430 extends along the first section 210 toward the second section 220. The two ends of the circuit board 430 respectively form the first end 401 and the second end 402.

[0054] In the above embodiment, the circuit board 430 extends along the first section 210 toward the second section 220 and can directly connect the two sections of the motherboard 200. The two ends of the circuit board 430 can directly serve as the conduction structure of the first end 401 and the second end 402. The circuit board 430 can integrate multiple lines to transmit multiple signals synchronously. The circuit board 430 is arranged on the side of the frame 100 facing the motherboard 200 and is located in the overlapping area of ​​the projection of the camera module 300. It does not need to occupy the side length space of the motherboard 200, which is conducive to reducing the size of the motherboard 200.

[0055] For example, the circuit board 430 achieves electrical conduction by abutting the motherboard 200 with exposed conductive contacts.

[0056] For example, circuit board 430 is soldered with one of a male connector and a female connector, and the first segment 210 and the second segment 220 are soldered with the other of a male connector and a female connector. Circuit board 430 and motherboard 200 are connected through the insertion of male and female connectors.

[0057] For example, the circuit board 430 is a thin rigid board that is flatly attached to the surface of the frame 100. The exposed metal pads at both ends of the circuit board 430 form an electrical connection with the first section 210 and the second section 220, respectively.

[0058] like Figure 7 As shown, in some embodiments of this application, the conductive connection assembly 400 further includes an adhesive 440;

[0059] The circuit board 430 is a flexible circuit board, and the circuit board 430 is attached and fixed to the frame 100 by the adhesive 440.

[0060] In the above embodiments, the flexible circuit board 430 can adapt to the concave and convex contours of the frame 100, with a higher degree of fit. The adhesive 440 fixes the flexible circuit board 430 flatly on the surface of the frame 100, preventing the flexible circuit board 430 from warping or shifting. The flexible circuit board 430 is thin and light, and will not increase the overall stacking height.

[0061] For example, the adhesive 440 uses double-sided adhesive, and the flexible circuit board 430 is completely attached to the surface of the frame 100 by the double-sided adhesive. The metal contacts at both ends of the flexible circuit board 430 are respectively connected to the first section 210 and the second section 220.

[0062] For example, recessed platforms are provided at both ends of the circuit board 430. The recessed platforms are used to accommodate the conductive connector 500. The conductive connector 500 can be housed inside the recessed platforms to prevent the conductive connector 500 from protruding and occupying vertical stacking space and increasing the overall thickness. The sidewalls of the recessed platforms can form a limiting constraint on the conductive connector 500 to prevent the conductive connector 500 from sliding and falling off, and to ensure that the conductive connector 500 is stably aligned with the first electrical connection area 211 and the second electrical connection area 221.

[0063] like Figure 6 As shown, in some embodiments of this application, the frame 100 has a limiting groove 102 on its surface, and the circuit board 430 is limited and installed in the limiting groove 102.

[0064] In the above embodiments, the limiting groove 102 can limit the circuit board 430 in the horizontal and vertical directions, quickly position the circuit board 430 during assembly, reduce the difficulty of assembly alignment, and the limiting groove 102 can contain the circuit board 430 to prevent the circuit board 430 from tilting, improve the stability of conductive contact, and the circuit board 430 is completely stored inside the limiting groove 102, which can also reduce the occupation of vertical stacking space.

[0065] For example, the limiting groove 102 is formed by stamping, and the groove outline matches the shape of the circuit board 430, with the circuit board 430 completely embedded inside the limiting groove 102.

[0066] like Figure 7 and Figure 8 As shown, in some embodiments of this application, the conductive connection assembly 400 has at least two protruding structures 403 on the side facing the motherboard 200;

[0067] The first section 210 is provided with a first electrical connection area 211, and the second section 220 is provided with a second electrical connection area 221;

[0068] At least two protruding structures 403 respectively abut against the first electrical connection area 211 and the second electrical connection area 221 and are electrically connected.

[0069] In the above embodiments, the conductive connection component 400 is respectively attached to the first electrical connection area 211 and the second electrical connection area 221 through the protrusion structure 403. The protrusion structure 403 directly forms the conductive contact point between the first segment 210 and the second segment 220. The conductive path between the first segment 210 and the second segment 220 is established by the contact between the protrusion structure 403 and the electrical connection area, and the electrical connection between the first segment 210 and the second segment 220 is stably completed.

[0070] Understandably, when the motherboard 200 is fixedly installed on the frame 100, the first section 210 and the second section 220 of the motherboard 200 will be pressed and adhered to the corresponding protrusion 403 of the conductive connection component 400, which can ensure the stability of the electrical connection between the protrusion 403 and the first section 210 and the second section 220.

[0071] For example, when the conductive connection component 400 adopts the conductive wire 410 scheme, the protrusion structure 403 is integrally formed on the end of the conductive wire 410, and extends outward from the body of the conductive wire 410 to form a conductive protrusion, which directly contacts and conducts with the electrical connection area of ​​the motherboard 200.

[0072] For example, when the conductive connection component 400 adopts the circuit board 430 solution, the protruding structure 403 is arranged on both end faces of the circuit board 430 to form conductive contacts processed on the surface of the circuit board 430, so as to achieve stable connection between the circuit board 430 and the motherboard 200 section.

[0073] It is understandable that both the first electrical connection area 211 and the second electrical connection area 221 are formed from the exposed copper layer on the surface of the motherboard 200.

[0074] For example, the conductive connection assembly 400 may simultaneously include a conductive wire 410 and a circuit board 430. The conductive wire 410 is housed in a wire groove 101 inside the frame 100. The conductive wire 410 and the wire groove 101 extend along the direction from the first section 210 toward the second section 220. The two ends of the conductive wire 410 form a first end 401 and a second end 402. The wire groove 101 can limit the placement of the conductive wire 410, preventing the conductive wire 410 from shifting or warping. The conductive wire 410 is entirely embedded inside the frame 100 and does not occupy the side space of the motherboard 200. The circuit board 430 is mounted in the limiting groove 102 on the side of the frame 100 facing the main board 200. The circuit board 430 also extends along the first section 210 towards the second section 220, and the two ends of the circuit board 430 form another set of first end 401 and second end 402. The limiting groove 102 provides multi-directional limiting for the circuit board 430, preventing the circuit board 430 from tilting or shifting. The circuit board 430 can integrate multiple lines to transmit multiple signals simultaneously. The conductive line 410 is embedded, and the circuit board 430 is externally mounted. The two are assembled in separate sections without interfering with each other's space, jointly establishing a conductive path between the first section 210 and the second section 220. There is no need to set up a connecting plate structure on the side of the camera module 300, which can reduce the size occupied by the main board 200 along the length of the electronic device 10 and expand the usable space of the battery area.

[0075] For example, the conductive connection component 400 may be configured with only the conductive wire 410, relying on the conductive wire 410 to build a conductive path between the two sections; or it may be configured with only the circuit board 430, relying on the circuit board 430 to build a conductive path between the two sections. Neither of the two single implementations requires a connecting plate structure to be set on the side of the camera module 300, which can reduce the size occupied by the motherboard 200 along the length of the electronic device 10 and expand the available space in the battery area.

[0076] like Figure 3 , Figure 4 , Figure 6 and Figure 7 As shown, in some embodiments of this application, the electronic device 10 further includes a conductive connector 500;

[0077] The first end 401 is electrically connected to the first section 210 through a conductive connector 500, and the second end 402 is electrically connected to the second section 220 through a conductive connector 500.

[0078] In the above embodiments, the conductive connector 500 fills the gap between the first end 401 and the first section 210, and the conductive connector 500 fills the gap between the second end 402 and the second section 220, eliminating the contact problems caused by the assembly gap, improving the conductivity stability of the conductive path, and the conductive connector 500 can adapt to different assembly tolerances, reducing the requirements for processing and assembly accuracy.

[0079] like Figure 5 As shown, in some embodiments of this application, the conductive connection component 400 includes a conductive wire 410, and the first end 401 of the conductive connection component 400 is provided with a first laser-etched surface 4011 for removing the oxide layer and / or the first end 401 is provided with a first gold-plated metal sheet 4012.

[0080] The second end 402 of the conductive connection component 400 is provided with a second laser-etched surface 4021 for removing the oxide layer and / or the second end 402 is provided with a second gold-plated metal sheet 4022.

[0081] In the above embodiments, the first laser-etched surface 4011 can destroy the dense oxide layer on the surface of the first end 401, eliminating the insulation barrier caused by the oxide layer; the first gold-plated metal sheet 4012 has excellent conductivity, which can improve the conductivity of the surface layer of the first end 401. The second laser-etched surface 4021 can destroy the dense oxide layer on the surface of the second end 402, eliminating the insulation barrier caused by the oxide layer; the second gold-plated metal sheet 4022 has excellent conductivity, which can improve the conductivity of the surface layer of the second end 402. The conductive connector 500 presses and adheres to the first end 401 and the second end 402 to complete the conductive connection. The laser-etched surface removes the oxide layer and the gold-plated metal sheet optimizes the surface conductivity. Both types of structures can reduce the resistance at the contact point, avoid contact breakage and unstable conductivity caused by oxidation, improve the reliability of the contact between the conductive connector 500 and the end of the conductive connection component 400, and ensure that the entire wiring path has stable and excellent conductivity.

[0082] In some embodiments of this application, the conductive connector 500 is any one of metal foam, elastic conductive element, conductive adhesive and solder.

[0083] In the above embodiments, the metal foam relies on its internal metal fiber structure to provide elasticity, continuously exerting a pressing force on the contact surface after assembly. This allows it to adapt to fluctuations in assembly gaps and maintain stable contact over a long period. The elastic conductive component is made of an elastic substrate composite conductive material, providing greater deformation allowance and adapting to a wider range of assembly tolerances. The conductive adhesive forms a continuous conductive path after curing, making it suitable for low-temperature bonding assembly processes. The solder, after melting and cooling, fuses with the metal contact surface, resulting in lower contact resistance and suitability for welding assembly processes.

[0084] For example, the elastic conductive component is a spring sheet, which is soldered to the first electrical connection area 211 and the second electrical connection area 221 of the motherboard 200 using surface mount technology (SMT). The spring sheet and other components of the motherboard 200 are processed synchronously using the same SMT process, and the assembly process is unified. The motherboard 200 is locked to the frame 100 by peripheral screws. After locking, the spring sheet stably presses against the end of the conductive connection component 400 to ensure continuous electrical contact. A surface treatment process can be added to the contact area between the spring sheet and the conductive connection component 400 to optimize the contact effect and improve the conductivity.

[0085] For example, the raised structure 403 can be used to directly press the exposed copper areas of the first electrical connection area 211 and the second electrical connection area 221 of the motherboard 200 to achieve conductivity, or metal foam can be used as a conductive connector 500 to flexibly press the end of the conductive connection assembly 400, relying on deformation to adapt to large assembly tolerances.

[0086] For example, the mating contact surface between the spring and the conductive connection component 400 can be optimized. For instance, laser engraving can be used to remove the dense oxide layer on the aluminum alloy surface, reducing contact resistance caused by the oxide layer. Alternatively, a gold-plated metal sheet can be laser-welded at the contact point to enhance conductivity through the gold plating. Both methods can reduce contact resistance and improve contact stability and overall circuit continuity.

[0087] For example, the structure disclosed in this application can be adapted to various electronic devices 10 with segmented motherboards 200, including mobile phones, tablets, e-readers, smartwatches, MP3 (MPEG-1 Audio Layer 3, third generation Moving Picture Experts Group audio layer) and other portable electronic devices.

[0088] It should be noted that, in this document, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element. Furthermore, it should be noted that the scope of the methods and apparatuses in the embodiments of this application is not limited to performing functions in the order shown or discussed, but may also include performing functions substantially simultaneously or in the reverse order, depending on the functions involved. For example, the described methods may be performed in a different order than described, and various steps may be added, omitted, or combined. Additionally, features described with reference to certain examples may be combined in other examples.

[0089] The embodiments of this application have been described above with reference to the accompanying drawings. However, this application is not limited to the specific embodiments described above. The specific embodiments described above are merely illustrative and not restrictive. Those skilled in the art can make many other forms under the guidance of this application without departing from the spirit and scope of the claims, and all of these forms are within the scope of protection of this application.

Claims

1. An electronic device, characterized in that, include: Motherboard, camera module, and conductive connection components; The motherboard has a mounting notch located on the side of the motherboard facing the battery compartment. The camera module is located within the mounting notch; The motherboard includes a first section and a second section arranged along a first direction, wherein the first section and the second section are respectively located on both sides of the mounting notch along the first direction; The orthographic projection of the conductive connection component on the plane of the motherboard at least partially overlaps with the orthographic projection of the camera module on the plane of the motherboard, and the conductive connection component is used to electrically connect the first segment and the second segment.

2. The electronic device according to claim 1, characterized in that, The electronic device also includes a frame; The motherboard is disposed on the frame, and the conductive connection assembly is disposed on the side of the frame facing the motherboard; The conductive connection component has a first end and a second end, the first end being electrically connected to the first segment, and the second end being electrically connected to the second segment. Along the first direction, the first end and the second end are located on both sides of the camera module.

3. The electronic device according to claim 2, characterized in that, The conductive connection component includes conductive wires; The frame has a wire groove, and the conductive wire is disposed in the wire groove. Both the conductive wire and the wire groove extend along the first direction, and the two ends of the conductive wire respectively form the first end and the second end.

4. The electronic device according to claim 3, characterized in that, The conductive connection assembly also includes an insulating component; The insulating element fills the groove and wraps the conductive wire, with both ends of the conductive wire extending out of the insulating element.

5. The electronic device according to claim 3, characterized in that, The frame includes a metal layer; the conductive connection assembly also includes an insulating component; the conductive wire is formed by milling the metal layer; the insulating component wraps the conductive wire, and the two ends of the conductive wire extend out of the insulating component.

6. The electronic device according to claim 2, characterized in that, The conductive connection assembly includes a circuit board; The circuit board is disposed on the side of the frame facing the motherboard, and the circuit board extends along the first section toward the second section, with the two ends of the circuit board forming the first end and the second end, respectively.

7. The electronic device according to claim 6, characterized in that, The frame surface is provided with a limiting groove, and the circuit board is fixedly installed in the limiting groove.

8. The electronic device according to any one of claims 1 to 7, characterized in that, The conductive connection assembly has at least two protruding structures on the side facing the motherboard; The first section is provided with a first electrical connection area, and the second section is provided with a second electrical connection area; At least two of the protruding structures respectively abut against the first electrical connection area and the second electrical connection area and are electrically connected.

9. The electronic device according to any one of claims 2 to 7, characterized in that, It also includes conductive connectors; The first end and the first segment are electrically connected through the conductive connector, and the second end and the second segment are electrically connected through the conductive connector.

10. The electronic device according to claim 9, characterized in that, The conductive connection component includes a conductive wire, and the first end of the conductive connection component is provided with a first laser-etched surface for removing the oxide layer and / or the first end is provided with a first gold-plated metal sheet. The second end of the conductive connection component is provided with a second laser-engraved surface for removing the oxide layer and / or the second end is provided with a second gold-plated metal sheet.

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