A processing method, system, device, apparatus and medium of an optical imaging module
Patent Information
- Application Number
- CN202611174657.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2026-08-04
- Publication Date
- 2026-10-27
AI Technical Summary
此时检测发现不良品,整个光学成像模组只能报废,带来了极高的滞后报废成本
[0010]本公开实施例的技术方案,所述光学成像模组包括镜头以及图像传感器;在第一光源照射下采集测试图卡对应的校准图像;基于所述校准图像确定所述镜头与所述图像传感器之间的相对位姿信息,并获取主动对准阶段的解像参数检测结果;按照所述相对位姿信息调整所述镜头以及所述图像传感器,切换至第二光源并进行光学性能指标检测,获得光学性能检测结果;其中,所述第一光源与所述第二光源为不同类型的照明光源;基于主动对准阶段的解像参数检测结果与所述光学性能检测结果对所述光学成像模组进行分流处理。本公开实施例,通过可切换光源,可实现所述镜头与所述图像传感器之间相对位姿的调整以及光学性能指标检测,无需搬运工位,能够在同一工位实现主动对准和光学性能指标检测,简化了产线布局,并基于光学性能指标检测的检测结果对所述光学成像模组进行分流处理的方式,可以避免点胶后报废,降低了物料浪费,提升了光学成像模组的生产效率。
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Figure CN122994484A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of automation technology, and in particular to a processing method, system, device, equipment, and medium for an optical imaging module. Background Technology
[0002] Optical imaging modules are core imaging components in terminal devices such as mobile phones, automotive devices, and security systems. In mass production, the Active Alignment (AA) process determines the true optical performance of the optical imaging module under standard lighting conditions. At the optimal position determined by AA, the optical imaging module is cured with adhesive; this step is irreversible, and once completed, the optical imaging module is permanently locked. The cured optical imaging module is then transported to a separate testing device for optical inspection. If a defective product is found during this inspection, the entire optical imaging module must be scrapped, resulting in extremely high delayed scrap costs. Summary of the Invention
[0003] This application provides a method, system, device, equipment, and medium for processing optical imaging modules, which can avoid scrapping after dispensing, reduce material waste, and improve the production efficiency of optical imaging modules.
[0004] In a first aspect, this embodiment provides a processing method for an optical imaging module, comprising: the optical imaging module including a lens and an image sensor; acquiring a calibration image corresponding to a test chart under illumination by a first light source; determining the relative pose information between the lens and the image sensor based on the calibration image, and obtaining the resolution parameter detection result of the active alignment stage; adjusting the lens and the image sensor according to the relative pose information, switching to a second light source and performing optical performance index detection, and obtaining the detection result; wherein the first light source and the second light source are different types of illumination sources; and performing split processing on the optical imaging module based on the resolution parameter detection result of the active alignment stage and the optical performance detection result.
[0005] Secondly, this embodiment provides a processing system for an optical imaging module, characterized in that it is used to execute the processing method described in the above embodiment. The system includes: a switchable light source module, a test pattern card, a motion platform, and an optical imaging module; the spatial arrangement order along the optical path from top to bottom is: a first light source unit in the switchable light source module, the test pattern card, a second light source unit in the switchable light source module, and the motion platform, with the optical imaging module disposed on the motion platform; the optical imaging module includes an image sensor and a lens; the first light source unit is fixedly disposed on the top of the test pattern card, and the second light source unit is movably disposed between the test pattern card and the motion platform; the motion platform includes an active gripper and a support platform; the active gripper is used to grip the lens, and the support platform is used to support the image sensor; the switchable light source module... The system includes a switchable light source module for controlling the second light source unit to move out of the optical path during the active alignment phase to switch to the first light source; an image sensor for acquiring a calibration image corresponding to the test chart under the illumination of the first light source; an image sensor for determining the relative pose information between the lens and the image sensor based on the calibration image; a motion platform for adjusting the lens and the image sensor according to the relative pose information; a switchable light source module for controlling the second light source unit to move into the corresponding detection position during the optical performance detection phase to switch to the second light source; and an image sensor for performing optical performance index detection to obtain optical performance detection results. The first light source and the second light source are different types of illumination sources. The optical imaging module is subjected to split processing based on the resolution parameter detection results from the active alignment phase and the optical performance detection results.
[0006] Thirdly, this embodiment provides a processing device for an optical imaging module, comprising: the optical imaging module including a lens and an image sensor; an acquisition module for acquiring a calibration image corresponding to a test chart under illumination by a first light source; a relative pose information determination module for determining the relative pose information between the lens and the image sensor based on the calibration image, and obtaining the resolution parameter detection result during the active alignment stage; a detection module for adjusting the lens and the image sensor according to the relative pose information, switching to a second light source and performing optical performance index detection, and obtaining the optical performance detection result; wherein the first light source and the second light source are different types of illumination sources; and a diversion processing module for performing diversion processing on the optical imaging module based on the resolution parameter detection result during the active alignment stage and the optical performance detection result.
[0007] Fourthly, this embodiment provides an electronic device, including: At least one processor; and A memory communicatively connected to the at least one processor; wherein, The memory stores a computer program that can be executed by the at least one processor, the computer program being executed by the at least one processor to enable the at least one processor to perform the processing of the optical imaging module according to any embodiment of the present invention.
[0008] Fifthly, this embodiment provides a computer-readable storage medium storing computer instructions that cause a processor to execute and implement the processing of the optical imaging module as described in any embodiment of the present invention.
[0009] Sixthly, embodiments of this application also provide a computer program product, the computer program product including a computer program, which, when executed by a processor, implements the processing of the optical imaging module as described in any embodiment of the present invention.
[0010] The technical solution of this disclosure embodiment includes an optical imaging module comprising a lens and an image sensor; acquiring a calibration image corresponding to a test chart under illumination by a first light source; determining the relative pose information between the lens and the image sensor based on the calibration image, and obtaining the resolution parameter detection result of the active alignment stage; adjusting the lens and the image sensor according to the relative pose information, switching to a second light source and performing optical performance index detection to obtain optical performance detection results; wherein the first light source and the second light source are different types of illumination sources; and performing a split processing on the optical imaging module based on the resolution parameter detection result of the active alignment stage and the optical performance detection result. This disclosure embodiment, through a switchable light source, enables the adjustment of the relative pose between the lens and the image sensor and the detection of optical performance indicators, eliminating the need for a material handling station and allowing active alignment and optical performance index detection to be performed at the same station, simplifying the production line layout. Furthermore, the method of splitting the optical imaging module based on the detection results of the optical performance index detection avoids scrapping after dispensing, reduces material waste, and improves the production efficiency of the optical imaging module.
[0011] It should be understood that the description in this section is not intended to identify key or essential features of the embodiments of the present invention, nor is it intended to limit the scope of the invention. Other features of the invention will become readily apparent from the following description. Attached Figure Description
[0012] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0013] Figure 1 This is a schematic diagram of the processing system architecture of an optical imaging module provided in an embodiment of this application; Figure 2 This is a schematic flowchart of a processing method for an optical imaging module provided in an embodiment of this application; Figure 3 This is a schematic flowchart of a processing method for an optical imaging module provided in an embodiment of this application; Figure 4 A schematic diagram of the structure of a processing device for an optical imaging module provided in an embodiment of this application; Figure 5 This is a schematic diagram of the structure of an electronic device provided in an embodiment of this application. Detailed Implementation
[0014] To enable those skilled in the art to better understand the present invention, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the scope of protection of the present invention.
[0015] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this invention are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of the invention described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover a non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.
[0016] Figure 1 This is a schematic diagram of a processing system architecture for an optical imaging module provided in an embodiment of this application. This disclosure is applicable to situations involving the processing of optical imaging modules. The system can execute processing methods for optical imaging modules.
[0017] The system includes: a switchable light source module, a test pattern card, a motion platform, and an optical imaging module. The spatial arrangement along the optical path from top to bottom is: a first light source unit in the switchable light source module, the test pattern card, a second light source unit in the switchable light source module, and the motion platform. The optical imaging module is mounted on the motion platform and includes an image sensor and a lens. The first light source unit is fixedly mounted on the top of the test pattern card, and the second light source unit is movably mounted between the test pattern card and the motion platform. The motion platform includes an active gripper and a support platform. The active gripper is used to hold the lens, and the support platform is used to support the image sensor. The switchable light source module is used to control the second light source unit to move out of the optical path during the active alignment phase to switch to the first light source. An image sensor is used to acquire a calibration image corresponding to the test chart under illumination by a first light source. The image sensor is also used to determine the relative pose information between the lens and the image sensor based on the calibration image. A motion platform is used to adjust the lens and the image sensor according to the relative pose information. A switchable light source module is also used to control the second light source unit to move to the corresponding detection position during the optical performance testing phase, thereby switching to the second light source. The image sensor is also used to perform optical performance index testing to obtain optical performance test results. The optical imaging module undergoes split processing based on the resolution parameter detection results from the active alignment phase and the optical performance test results.
[0018] The first light source and the second light source are different types of lighting sources.
[0019] In this embodiment, during active alignment, the switchable light source module controls the second light source unit to move out of the optical path, allowing the light emitted from the fixed first light source unit to directly illuminate the test pattern card downwards. The light then passes through the test pattern card and enters the lens downwards. During optical performance testing, the switchable light source module controls the second light source unit to move into the optical path area (located between the test pattern card and the lens). In this case, the second light source unit blocks the test pattern card from above and provides a uniform light field (or white background).
[0020] It should be noted that the optical imaging module processing system provided in this application embodiment is an integrated system that integrates active alignment and optical performance detection in the same physical station. By reciprocating the second light source unit in the switchable light source module under the test chart, the mode switching between "transmission chart imaging (AA stage)" and "uniform light field imaging (detection stage)" is realized. There is no need to transfer between multiple stations, which supports the integrated production mode of "alignment as testing" from the hardware level.
[0021] The system integrates a switchable light source module, comprising a first light source unit fixedly mounted on the top frame and a second light source unit suspended or supported below the test chart via a drive mechanism. The drive mechanism (such as a high-precision linear module or a rotation mechanism) drives the second light source unit to rapidly and repeatedly move into or out of the optical path with high positioning accuracy. The first light source unit provides a first light source, which can be a dedicated light source for Spatial Frequency Response (SFR) testing and is always kept lit or ready. The second light source unit provides a uniform light field or a standard white background; its light source type is not limited, for example, it can be a D50 standard light source, a standard A light source, or other light sources with different color temperatures, used to simulate a uniform background under standard lighting conditions.
[0022] For example, the second light source is a D50 standard light source, and the second light source unit can be a D50 standard light source board.
[0023] In this embodiment, the switchable light source module achieves test scene switching by driving the second light source unit to move into / out of the optical path: when moving out, high-precision alignment is performed using the upper transmission chart; when moving in, optical performance is detected using its own uniform light field. This effectively avoids mutual interference between the two types of test conditions, ensuring the highest accuracy and reliability of active alignment and optical test data. Active alignment and optical performance index detection are completed in a single clamping and positioning of the optical imaging module. By automatically switching light sources, processes that were traditionally scattered across two independent workstations are seamlessly integrated, greatly shortening the production cycle.
[0024] The test pattern refers to a composite functional transmissive optical target that integrates two functional areas: a beveled reference pattern area and a uniform illumination background area. The pattern layout has been optimized through optical simulation to avoid crosstalk between them. The beveled reference pattern area is printed with a high-precision SFR test bevel, which is used to calculate the offset and tilt angle between the center plane of the lens and the image sensor during the active alignment stage; the uniform illumination background area is used to adapt to the optical performance index testing under the D50 light source.
[0025] The motion platform can be a high-precision six-degree-of-freedom motion platform. The active gripper is used to hold the lens and has six degrees of freedom micro-motion capability, including X / Y / Z translation, θx / θy tilt, and θz rotation. It is the execution end for adjusting the relative pose information. The carrier platform is a precision platform used to fix and support the image sensor. It keeps the image sensor in a stable position during the alignment process and works with the active gripper to adjust the relative pose information between the lens and the image sensor.
[0026] In this embodiment, the spatial arrangement order along the light path from top to bottom is as follows: the first light source unit (fixed at the top) in the switchable light source module, the test pattern card (located in the middle layer), the second light source unit (movably disposed between the test pattern card and the motion platform) in the switchable light source module, and the motion platform (located at the bottom).
[0027] In this embodiment, the vertical spatial layout of the system strictly follows the direction of light propagation: the first light source unit is located at the top, the test chart is located directly below it, the second light source unit is located below the test chart and can move horizontally, and the motion platform and optical imaging module are located at the bottom. Active alignment mode: the second light source unit moves out, and the light path is: first light source -> test chart -> lens. Detection mode: the second light source unit moves in, and the light path is: second light source unit (uniform light field) -> lens (at this time, the test chart is obscured or out of focus and does not participate in imaging).
[0028] The image sensor includes components such as an image acquisition unit and an image processing unit. The image processing unit can be a workstation controller, which can integrate a high-speed image acquisition card and powerful image processing software to perform active alignment and optical performance index detection in real time. The lens and the image sensor are coaxially set, with the main optical axis of the lens perpendicular to the photosensitive surface of the image sensor. The two can be adjusted relative to each other to eliminate planar offset and tilt deviation.
[0029] In this embodiment, the lens to be processed and the image sensor are mounted on the motion platform: the active gripper holds the lens, the image sensor is fixed on the support platform, the system initialization is completed, and the active alignment process begins.
[0030] In this embodiment, the switchable light source module controls the second light source unit to move out of the optical path area. At this time, the first light source emitted by the fixed first light source unit illuminates the oblique reference pattern area of the test chart downward. The oblique reference pattern is projected onto the photosensitive surface of the image sensor through the lens. The image acquisition unit acquires the calibration image corresponding to the test chart. The calibration image is a calibration image used for active alignment.
[0031] In this embodiment, the image processing unit runs an active alignment algorithm. Based on the calibration image, it calculates the planar offset between the lens and the image sensor, and simultaneously calculates the tilt angle between the lens and the image sensor. After integrating the planar offset and tilt angle to obtain relative pose information, it sends adjustment commands to the motion platform based on the relative pose information. The active gripper of the motion platform drives the lens to perform six-degree-of-freedom fine adjustments, while the support platform keeps the image sensor fixed. The two work together to complete pose correction. The processing system of the optical imaging module iteratively executes the process of "acquiring calibration image - determining planar offset and tilt angle - determining relative pose information - adjusting pose" until the planar offset and tilt angle both meet the corresponding preset thresholds.
[0032] In this embodiment, after active alignment to obtain the optimal alignment position where both the planar offset and tilt angle meet the corresponding preset thresholds, the motion platform is locked to maintain the assembly posture of the lens and image sensor. The switchable light source module controls the second light source unit to move into the optical path area. At this time, the second light source unit is located directly above the lens, providing a uniform light field (or white background). The image acquisition unit directly acquires the white image corresponding to this uniform light field. The image processing unit performs optical performance index detection on the test image and generates detection results. Based on the detection results, the module is processed in a tiered manner: if all index detection results are qualified, the optical imaging module is transferred to the dispensing and curing station to complete subsequent assembly. If any of the detection results are unqualified, the module can be removed from the production line for scrapping or the optical imaging module can be repaired.
[0033] In this embodiment, the active alignment station and the optical performance indicator detection station are combined into one, reusing the same motion platform, image sensor, and test chart. This reduces hardware investment, shortens the production line length, and lowers production costs. In this embodiment, the optical imaging module completes the entire process in a single clamping. After active alignment is achieved, the motion platform is locked for optical performance indicator detection, eliminating the need for transfer and relocation. This avoids alignment misalignment caused by vibration and collision during traditional production line transfers, improving production efficiency and reducing rework costs.
[0034] The technical solution of this disclosure embodiment includes an optical imaging module comprising a lens and an image sensor; acquiring a calibration image under the downward illumination of a test chart by a first light source fixed at the top; determining the relative pose information between the lens and the image sensor based on the calibration image; adjusting the lens and the image sensor according to the relative pose information; controlling a movable second light source unit to move above the lens to provide a uniform light field (white background); acquiring a white image for optical performance index detection; and obtaining optical performance detection results; wherein the first light source and the second light source are different types of illumination sources; and performing split processing on the optical imaging module based on the resolution parameter detection results of the active alignment stage and the optical performance detection results. In this embodiment, by combining a top-mounted fixed first light source (with a pattern card) with a bottom-mounted movable second light source (providing a whiteboard background), the relative pose between the lens and the image sensor, as well as the detection of optical performance indicators, can be achieved. This eliminates the need for a material handling station and enables active alignment and optical performance indicator detection at the same station, simplifying the production line layout. Furthermore, the method of sorting optical imaging modules based on the detection results of optical performance indicators avoids scrapping after dispensing, reduces material waste, and improves the production efficiency of optical imaging modules.
[0035] Figure 2This is a schematic flowchart illustrating a processing method for an optical imaging module provided in an embodiment of this application. This disclosure applies to situations involving the processing of optical imaging modules. The method can be executed by a processing device for the optical imaging module, which can be implemented in software and / or hardware, optionally through an electronic device such as a mobile terminal, PC, or server. Figure 2 As shown, the method includes: S201. Acquire the calibration image corresponding to the test chart under the illumination of the first light source.
[0036] The optical imaging module includes a lens and an image sensor.
[0037] S202. Determine the relative pose information between the lens and the image sensor based on the calibration image, and obtain the resolution parameter detection results during the active alignment stage.
[0038] Optionally, determining the relative pose information between the lens and the image sensor based on the calibration image includes: extracting the imaging coordinates corresponding to the hypotenuse reference pattern in the calibration image, and combining them with the reference center coordinates of the photosensitive area of the image sensor to determine the planar offset between the lens and the image sensor; extracting the sharpness gradient features of the calibration image, and determining the tilt angle between the lens and the image sensor based on the sharpness gradient features; and determining the relative pose information between the lens and the image sensor based on the planar offset and the tilt angle.
[0039] In this embodiment, the inclined reference pattern refers to the high-precision inclined target on the test chart, which is the geometric reference for active alignment. Imaging coordinates refer to the pixel position coordinates of the inclined reference pattern in the calibration image. The reference center coordinates of the photosensitive area of the image sensor refer to the pixel coordinates corresponding to the physical center of the photosensitive surface of the image sensor. Planar offset refers to the lateral and longitudinal physical offset between the lens optical center and the photosensitive center of the image sensor in the XY plane. Sharpness gradient characteristics refer to the gradient characteristics of the spatial frequency response value of each image region as the scanning position changes during scanning along the optical axis (Z-axis direction). This characteristic allows for the precise location of the peak focal point of each region and further determination of the axial offset of the peak focal point of different regions. This axial offset characterizes the degree of tilt between the lens and the image sensor. The tilt angle refers to the angle between the lens principal optical axis and the normal to the sensor photosensitive surface. Relative pose information refers to the six-degree-of-freedom pose parameters determined based on the planar offset and tilt angle, which can serve as the basis for adjustment commands of the motion platform.
[0040] In this embodiment, the imaging contour of the inclined reference pattern is identified from the calibration image, and the pixel coordinates of its geometric center are extracted. Then, the difference between these pixel coordinates and the pre-calibrated reference center coordinates of the image sensor is calculated to obtain the pixel-level offset. Combined with the physical size of a single pixel in the image sensor (e.g., 1.4 μm / pixel), the actual physical plane offset is calculated. In this embodiment, the process of determining the tilt angle is as follows: First, under a set object distance, the lens is controlled to perform axial scanning along the optical axis within a preset scanning range, and images of the test chart are acquired at each scanning position. Second, the spatial frequency response values of the central region and at least four corner regions of the image are calculated at each scanning position. For each region, its precise peak focus position is located using the sharpness gradient feature. Third, the axial offset between the peak focus position of each corner region and the peak focus position of the central region is calculated. Finally, based on the axial offset of each corner region, the tilt angle between the lens and the image sensor is determined through a preset geometric mapping relationship.
[0041] In this embodiment, the planar offset (XY axis translation parameters) and tilt angle (θx / θy axis rotation parameters) can be integrated into complete six-degree-of-freedom relative pose information and output to the motion platform as adjustment commands.
[0042] In this embodiment, the relative pose information between the lens and the image sensor is determined by the planar offset and tilt angle. This method can quickly and accurately determine the relative pose information and ensure the consistency of optical performance after active alignment.
[0043] S203. Adjust the lens and image sensor according to the relative pose information, switch to the second light source and perform optical performance index detection to obtain the optical performance detection results.
[0044] The first light source and the second light source are different types of lighting sources.
[0045] Optionally, after adjusting the lens and image sensor according to the relative pose information, the process further includes: performing the following iterative process: if the planar offset is greater than or equal to a preset offset error threshold and / or the tilt angle is greater than or equal to a preset tilt angle threshold, then a new calibration image corresponding to the test chart is re-acquired under the illumination of the first light source; based on the new calibration image, a new planar offset and a new tilt angle are determined between the lens and the image sensor, and new relative pose information is determined based on the new planar offset and the new tilt angle; the lens and image sensor are adjusted according to the new relative pose information; the iterative process is repeated using the new planar offset as the planar offset and the new tilt angle as the tilt angle; if the planar offset is less than a preset offset error threshold and the tilt angle is less than a preset tilt angle threshold, then the iterative process is exited.
[0046] In this embodiment, there are no restrictions on the preset offset error threshold and the preset tilt angle threshold. For example, the preset offset error threshold can be 1 μm and the preset tilt angle threshold can be 0.05°.
[0047] For example, the preset offset error threshold is 1 μm, and the preset tilt angle threshold is 0.05°. The motion platform completes the first adjustment of the lens and image sensor pose based on the relative pose information. After the first adjustment, the plane offset is 1.2 μm and the tilt angle is 0.03°. The plane offset is greater than the preset offset error threshold, so it proceeds to iteration. After the second fine-tuning, the new plane offset is 0.7 μm and the new tilt angle is 0.06°. The new tilt angle is greater than the preset tilt angle threshold, so it continues to iterate. After the third fine-tuning, the new plane offset is 0.6 μm and the new tilt angle is 0.04°. Both meet the criteria, so it exits the iteration and locks the motion platform.
[0048] In this embodiment, the planar offset error and tilt angle error are gradually converged through multiple rounds of iteration, eliminating the mechanical and imaging errors of a single adjustment, and stably achieving high-precision alignment standards at the micron and millimeter levels, significantly reducing the alignment failure rate and lowering hardware costs.
[0049] Optionally, the lens and image sensor are adjusted according to the relative pose information, the system is switched to a second light source, and optical performance indicators are detected to obtain optical performance detection results. This includes: controlling a movable second light source unit to move into the optical path area, with the second light source unit providing a uniform light field; acquiring a test image corresponding to the uniform light field under the illumination of the second light source; extracting at least one optical detection parameter from the image uniformity parameter and imaging defect parameter in the test image; and comparing each optical detection parameter with its corresponding preset parameter threshold to generate detection results corresponding to each optical detection parameter.
[0050] Among them, the image uniformity parameter refers to the parameter calculated based on the uniform light field image, which is used to characterize the brightness and color consistency of the module in different areas. For example, it may include brightness uniformity, color uniformity, relative illuminance, etc.
[0051] Among them, imaging defect parameters refer to inherent defect parameters of the lens or sensor that can be identified against a uniform background, such as bad pixels (DPC), blemishes (LCB), fixed pattern noise (FPN), etc.
[0052] In this embodiment, the preset parameter thresholds corresponding to each optical detection parameter are not limited, and can be determined according to the actual situation, empirical values, or target prediction models.
[0053] In this embodiment, the second light source unit is moved between the lens and the test chart, blocking the test chart from above and directly emitting uniform light downwards (or providing a diffuse white background). The image sensor acquires the image corresponding to this uniform light field to obtain a complete test image. This embodiment does not limit the extraction algorithm used for optical detection parameters; for example, it can be an image block grayscale mean and chromaticity statistics algorithm for extracting uniform parameters of the image, or an adaptive threshold segmentation and connected component detection algorithm for extracting imaging defect parameters.
[0054] In this embodiment, the active alignment process of the optical imaging module and the optical performance index testing process share the same motion platform, image sensor, and testing station. The active alignment stage utilizes a first light source and test chart to acquire SFR / MTF data for high-precision alignment; the optical performance testing stage utilizes a uniform light field provided by a second light source to acquire uniformity and defect data for quality judgment. This method eliminates the need for a transfer module and re-clamping, avoiding secondary alignment misalignment caused by transfer and reloading, thus achieving high testing accuracy and improving production line yield and cycle time.
[0055] S204. Based on the resolution parameter detection results of the active alignment stage and the optical performance detection results, the optical imaging module is subjected to split processing.
[0056] Optionally, the optical imaging module is processed by splitting the resolution parameter detection results from the active alignment stage and the optical performance detection results, including: if the resolution parameter detection results from the active alignment stage and the detection results corresponding to each optical detection parameter in the detection results are all qualified, the optical imaging module is transferred to the dispensing station for dispensing and curing; the optical imaging module is assembled, and the assembled optical imaging module is re-inspected to obtain the re-inspection results; if at least one of the resolution parameter detection results from the active alignment stage and the detection results corresponding to each optical detection parameter in the detection results is unqualified, the optical imaging module is processed.
[0057] Among them, the dispensing station can be a downstream curing station on the production line. It can use ultraviolet (UV) glue / thermosetting glue to dispense and cure the relative pose of the lens and image sensor, permanently locking the alignment posture, which is an essential process for producing good products.
[0058] In this embodiment, if all the optical detection parameters in the detection results are qualified, the optical imaging module with the currently locked relative pose (which can be referred to as a good product at this time) is transferred to the dispensing station. Adhesive is dispensed at the bonding position between the lens and the image sensor, and the adhesive is cured by ultraviolet (UV) light / heating to permanently fix their relative pose. After curing, the optical imaging module is finally assembled, including integrating mounting brackets, connectors, and other auxiliary components to complete the encapsulation of the entire camera module. After assembly, a re-inspection is performed: a second light source is used again to provide a uniform light field, and images are collected to re-inspect the uniformity of the image and imaging defects, to verify whether the curing and assembly process introduced new optical defects, and to obtain the re-inspection results. These re-inspection results are used for final factory quality confirmation and as label data for training samples, used for subsequent model training and threshold optimization. In this embodiment, the method of transfer is not limited; for example, a transfer command can be sent to a conveyor belt, a precisely positioned robotic arm, a servo motor-driven linear module, or a collaborative robot to transfer the module to the dispensing station. If at least one of the optical testing parameters in the test results is unqualified, the optical imaging module (which can be referred to as a defective product) will be processed. The processing methods include removing the optical imaging module from the current production line using a high-speed, high-precision three-axis robotic arm or a customized pneumatic throwing device, discarding the optical imaging module, or repairing it.
[0059] In this embodiment, the optical imaging module is automatically sorted based on the results of the complete set of optical inspections. Good products are solidified first and then re-inspected to ensure the quality of products leaving the factory, while defective products are intercepted in advance to avoid occupying downstream resources, thereby reducing material and labor waste and improving the overall yield and production efficiency of the production line.
[0060] Optionally, the optical imaging module is processed, including: removing the optical imaging module from the production line; if the test results corresponding to the image uniformity parameter and the imaging defect parameter in the optical performance test results are both qualified, but the resolution parameter test result in the active alignment stage is unqualified, then the optical imaging module is repaired and the calibration image step corresponding to the test chart is collected under the illumination of the first light source is returned and re-executed; otherwise, the optical imaging module is discarded.
[0061] In this embodiment, if the detection results for the resolution parameters (such as SFR / MTF) measured during the active alignment stage (under the illumination of the first light source) are unqualified, but the detection results for the image uniformity parameters and imaging defect parameters measured during the second stage (under the illumination of the second light source) are qualified, then the optical imaging module is determined to be repairable and will be repaired. That is, among the detection results of various optical detection parameters, if only the resolution parameters during the active alignment stage are unqualified (usually caused by alignment deviation, a reversible defect), while the image uniformity parameters and imaging defect parameters (usually caused by hardware defects, an irreversible defect) are qualified, then the corresponding optical imaging module can be repaired. If the detection result for the image uniformity parameters is unqualified, and / or the detection result for the imaging defect parameters is unqualified, then the corresponding optical imaging module can be directly scrapped. Specifically, a dedicated high-speed ejection mechanism (such as a three-axis servo robotic arm or pneumatic push rod) can be used to remove the optical imaging module from the main production line within a set time (such as <0.5 seconds) and place it in a designated waste box to ensure that defective components do not enter the dispensing station, thus fundamentally eliminating ineffective processing in subsequent processes.
[0062] In this embodiment, the repair process can involve precisely placing the device in the repair area or a specific return hopper. Subsequently, operators or automated equipment can reload the device and return it to the step of acquiring the calibration image corresponding to the test chart under the illumination of the first light source. This process is repeated for secondary alignment and testing: the optical imaging module is returned to the active alignment station, switched to the first light source, and the calibration image of the test chart is reacquired. The planar offset and tilt angle are calculated sequentially, and the relative pose between the lens and the image sensor is fine-tuned through multiple iterations. After realignment, the device enters the optical performance index detection and retesting process. This mechanism can reduce yield losses caused by temporary process fluctuations.
[0063] In this embodiment, defective products are distinguished by the detection results corresponding to various optical detection parameters. Products with poor resolution caused by alignment deviation can be repaired, while products with hardware defects are scrapped directly. The system distinguishes between reversible and irreversible defective products, avoids ineffective repairs that waste production line time, and can improve production line operating efficiency.
[0064] Optionally, after the optical imaging module is split based on the resolution parameter detection results and the optical performance detection results from the active alignment stage, the process further includes: establishing training samples based on calibration images, relative pose information, actual measured plane offset and tilt angle, measured values of various optical detection parameters in the optical performance index detection, detection results corresponding to various optical detection parameters, and re-inspection results; the re-inspection result is the result obtained by re-inspecting the optical imaging module after assembly if the detection result is qualified; training a basic prediction model based on a set number of training samples to obtain a target prediction model; adjusting the preset tilt angle threshold, preset offset error threshold, and preset parameter thresholds corresponding to various optical detection parameters in the active alignment stage based on the target prediction model; and predicting the re-inspection results for the new optical imaging module based on the target prediction model.
[0065] The preset tilt angle threshold and preset offset error threshold are both thresholds used in determining relative pose information. Training samples refer to the entire process data set of each optical imaging module from active alignment to re-inspection, including: calibration images from the active calibration phase, relative pose information, actually measured plane offset and tilt angle, various optical detection parameters and results, and re-inspection results after adhesive curing. The re-inspection results serve as the labels for the training samples. The calibration images, relative pose information, actually measured plane offset and tilt angle, and various optical detection parameters and results from the active calibration phase serve as the preliminary data for the training samples.
[0066] Here, the base prediction model refers to the initial model that has not been trained with training samples. In this embodiment, there are no restrictions on the base prediction model; for example, it can be a classification algorithm such as random forest or neural network.
[0067] The target prediction model refers to the optimized model that has been trained on a certain number of training samples.
[0068] It should be noted that during continuous mass production on the production line, the entire process data of each optical imaging module is bound to and stored with the module's unique identifier. Mass production data is continuously accumulated, and model training begins when the number of training samples reaches a set number (e.g., 10,000). The basic prediction model is called, using the measured feature data of all training samples as input and the re-examination results as output labels. The model is iteratively trained periodically, and its parameters are optimized to ultimately obtain the target prediction model with the required prediction accuracy. By analyzing the correlation between measured process parameters, such as actual offset and actual SFR value, and the re-inspection pass rate using a target prediction model, the system automatically adjusts the preset tilt angle threshold, preset offset error threshold, and preset parameter thresholds for various optical detection parameters in the active alignment stage, achieving adaptive optimization of the production line process. If the re-inspection failure rate after curing significantly increases under a certain preset tilt angle threshold, preset offset error threshold, and / or preset parameter threshold, the corresponding threshold is tightened to intercept risky products in advance. If the yield is stable and the re-inspection pass rate is high under a certain preset tilt angle threshold, preset offset error threshold, and / or preset parameter threshold, the corresponding threshold can be appropriately relaxed to increase the production cycle. The adjusted preset tilt angle threshold and preset offset error threshold will be applied to the active alignment process of the new (next batch) optical imaging module. Similarly, the preset parameter thresholds corresponding to the adjusted optical detection parameters will be applied to the optical performance index testing process of the new (next batch) optical imaging module.
[0069] In this embodiment, the target prediction model can deeply explore the correlation between the parameters of each degree of freedom of active alignment and the final optical performance. When it is found that the plane offset or tilt angle of active alignment has a significant impact on the optical detection parameters, the correlation is fed back to the active alignment process parameter library to optimize the weight allocation of the corresponding plane offset or tilt angle in the alignment iteration process. The plane offset or tilt angle with high influence is adjusted first, thereby improving the final optical quality and alignment efficiency of the product from the root.
[0070] In this embodiment, for the new optical imaging module, after completing active alignment and optical performance index detection, the pre-data is input into the target prediction model to predict the probability of passing the re-inspection after the module is cured by dispensing. Modules with high predicted risk can be diverted for rework in advance to avoid material waste caused by entering the dispensing process.
[0071] In this embodiment, a basic prediction model is trained using a set number of training samples throughout the entire process. The preset tilt angle threshold and preset offset error threshold in the active alignment stage are dynamically optimized to predict the re-inspection results in advance. This allows the model to adapt to changes in the production line and reduce defects and losses in the later stages from the source.
[0072] In this embodiment, a database server can also be built to store production data from all processes, including active alignment, optical testing, dispensing and curing, and re-inspection. A visual interface can also be provided to monitor production line status, yield statistics, and equipment efficiency in real time, and to support historical data queries and the generation of in-depth analysis reports.
[0073] The technical solution of this disclosure includes an optical imaging module comprising a lens and an image sensor; acquiring a calibration image corresponding to a test chart under illumination by a first light source; determining the relative pose information between the lens and the image sensor based on the calibration image, and obtaining the resolution parameter detection results of the active alignment stage; adjusting the lens and the image sensor according to the relative pose information, switching to a second light source and performing optical performance index detection to obtain optical performance detection results; wherein the first light source and the second light source are different types of illumination sources; and performing a split processing of the optical imaging module based on the resolution parameter detection results of the active alignment stage and the optical performance detection results. This disclosure, through a switchable light source, enables adjustment of the relative pose between the lens and the image sensor and optical performance index detection, eliminating the need for a material handling station and allowing active alignment and optical performance index detection to be performed at the same station, simplifying the production line layout. Furthermore, the split processing of the optical imaging module based on the optical performance index detection results avoids scrapping after dispensing, reduces material waste, and improves the production efficiency of the optical imaging module.
[0074] Figure 3 This is a schematic flowchart of a processing method for an optical imaging module provided in an embodiment of this application.
[0075] S301. Acquire the calibration image corresponding to the test chart under the illumination of the first light source.
[0076] S302. Determine the relative pose information between the lens and the image sensor based on the calibration image, and obtain the resolution parameter detection results during the active alignment stage.
[0077] S303. Adjust the lens and image sensor according to the relative pose information, switch to the second light source and perform optical performance index detection to obtain the optical performance detection results.
[0078] The first light source and the second light source are different types of lighting sources; the detection results mainly include image uniformity parameters and imaging defect parameters.
[0079] S304. If all test results in the active alignment stage and the optical performance testing stage are qualified, the optical imaging module will be transferred to the dispensing station for dispensing and curing.
[0080] S305. Assemble the optical imaging module and re-inspect the assembled optical imaging module to obtain the re-inspection results.
[0081] S306. If at least one of the test results in the active alignment stage or the optical performance testing stage is unqualified, the optical imaging module shall be removed from the production line. If the test results corresponding to the image uniformity parameter and the imaging defect parameter in the optical performance testing stage are both qualified, but the test result corresponding to the resolution parameter in the active alignment stage is unqualified, the optical imaging module shall be repaired and the calibration image corresponding to the test chart under the illumination of the first light source shall be collected and re-executed. Otherwise, the optical imaging module shall be discarded.
[0082] In this embodiment, the active alignment and optical performance index detection stations are combined into one, eliminating the need for separate manufacturing and testing stations. This allows for both active alignment and optical performance index detection to be performed at the same station, simplifying the production line layout. Furthermore, the method of sorting and processing based on the detection results corresponding to various comprehensive optical detection parameters avoids scrapping after dispensing, reduces material waste, and improves the production efficiency of optical imaging modules.
[0083] Figure 4 This is a schematic diagram of a processing device for an optical imaging module provided in an embodiment of this application. This device is applicable to situations involving the processing of optical imaging modules. The processing device for the optical imaging module can be implemented in hardware and / or software and is generally integrated into an electronic device. Figure 4 As shown, the device includes: an acquisition module 401, a relative pose information determination module 402, a detection module 403, and a splitting processing module 404; wherein, the optical imaging module includes a lens and an image sensor.
[0084] The acquisition module 401 is used to acquire the calibration image corresponding to the test chart under the illumination of the first light source; The relative pose information determination module 402 is used to determine the relative pose information between the lens and the image sensor based on the calibration image, and to obtain the resolution parameter detection results during the active alignment stage. The detection module 403 is used to adjust the lens and the image sensor according to the relative pose information, switch to the second light source and perform optical performance index detection to obtain optical performance detection results; wherein the first light source and the second light source are different types of illumination sources; The split processing module 404 is used to perform split processing on the optical imaging module based on the resolution parameter detection results of the active alignment stage and the optical performance detection results.
[0085] The technical solution of this disclosure includes: acquiring a calibration image corresponding to a test chart under illumination by a first light source using an acquisition module; obtaining resolution parameter detection results during the active alignment stage using a relative pose information determination module; determining the relative pose information between the lens and the image sensor based on the calibration image using the calibration image; adjusting the lens and the image sensor according to the relative pose information using a detection module; switching to a second light source and performing optical performance index detection to obtain optical performance detection results; wherein the first light source and the second light source are different types of illumination sources; and performing a flow splitting process based on the resolution parameter detection results during the active alignment stage and the optical performance detection results to perform flow splitting processing on the optical imaging module. This disclosure, through a switchable light source, enables adjustment of the relative pose between the lens and the image sensor and optical performance index detection, eliminating the need for a material handling station and allowing active alignment and optical performance index detection to be performed at the same station, simplifying the production line layout. Furthermore, the flow splitting processing of the optical imaging module based on the optical performance index detection results avoids scrapping after dispensing, reduces material waste, and improves the production efficiency of the optical imaging module.
[0086] Optionally, the relative pose information determination module is specifically used to: extract the imaging coordinates corresponding to the hypotenuse reference pattern in the calibration image, and combine them with the reference center coordinates of the photosensitive area of the image sensor to determine the planar offset between the lens and the image sensor; extract the sharpness gradient features of the calibration image, and determine the tilt angle between the lens and the image sensor based on the sharpness gradient features; and determine the relative pose information between the lens and the image sensor based on the planar offset and the tilt angle.
[0087] Optionally, the relative pose information determination module is further configured to: perform the following iterative process: if the planar offset is greater than or equal to a preset offset error threshold and / or the tilt angle is greater than or equal to a preset tilt angle threshold, then re-acquire a new calibration image corresponding to the test chart under the illumination of the first light source; determine a new planar offset and a new tilt angle between the lens and the image sensor based on the new calibration image, and determine new relative pose information based on the new planar offset and the new tilt angle; adjust the lens and the image sensor according to the new relative pose information; repeat the iterative process using the new planar offset as the planar offset and the new tilt angle as the tilt angle; if the planar offset is less than a preset offset error threshold and the tilt angle is less than a preset tilt angle threshold, then exit the iterative process.
[0088] Optionally, the detection module is specifically used to: control a movable second light source unit to move into the optical path area, and the second light source unit provides a uniform light field; acquire a test image corresponding to the uniform light field under the illumination of the second light source; extract at least one optical detection parameter from the image uniformity parameter and the imaging defect parameter in the test image; compare each optical detection parameter with its corresponding preset parameter threshold, and generate a detection result corresponding to each optical detection parameter.
[0089] Optionally, the diversion processing module is specifically used for: if the resolution parameter detection results of the active alignment stage and the detection results corresponding to each optical detection parameter in the detection results are all qualified, then the optical imaging module is transferred to the dispensing station for dispensing and curing; the optical imaging module is assembled, and the assembled optical imaging module is re-inspected to obtain the re-inspection results; if at least one of the resolution parameter detection results of the active alignment stage and the detection results corresponding to each optical detection parameter in the detection results is unqualified, then the optical imaging module is processed.
[0090] Optionally, the diversion processing module is also used to: remove the optical imaging module from the production line; if the detection results corresponding to the image uniformity parameter and the imaging defect parameter in the optical performance test results are both qualified, but the resolution parameter detection result in the active alignment stage is unqualified, then the optical imaging module is repaired, and the calibration image step corresponding to the test chart is collected under the illumination of the first light source is returned and re-executed; otherwise, the optical imaging module is discarded.
[0091] Optionally, the above device further includes a threshold update module, which is specifically used for: establishing training samples based on the calibration image, the relative pose information, the actually measured plane offset and tilt angle, the measured values of various optical detection parameters in the optical performance index detection, the detection results corresponding to the various optical detection parameters, the preset parameter thresholds corresponding to the various optical detection parameters, and the re-inspection results; the re-inspection results are obtained by re-inspecting the optical imaging module after the detection results are qualified and the module is assembled; training a basic prediction model based on a set number of training samples to obtain a target prediction model; adjusting the preset tilt angle threshold, the preset offset error threshold, and the preset parameter thresholds corresponding to the various optical detection parameters in the optical performance detection stage based on the target prediction model; and predicting the re-inspection results for a new optical imaging module based on the target prediction model.
[0092] The processing apparatus for the optical imaging module provided in this application embodiment can perform the processing of the optical imaging module provided in any embodiment of the present invention, and has the corresponding functional modules and beneficial effects of the execution method.
[0093] Figure 5 This is a schematic diagram of an electronic device provided for an embodiment of this application. The electronic device is intended to represent various forms of digital computers, such as laptop computers, desktop computers, workstations, personal digital assistants, servers, blade servers, mainframe computers, and other suitable computers. The electronic device can also represent various forms of mobile devices, such as personal digital processors, cellular phones, smartphones, wearable devices (such as helmets, glasses, watches, etc.), and other similar computing devices. The components shown herein, their connections and relationships, and their functions are merely illustrative and are not intended to limit the implementation of the invention described and / or claimed herein.
[0094] like Figure 5 As shown, the electronic device 50 includes at least one processor 51 and a memory, such as a read-only memory (ROM) 52 or a random access memory (RAM) 53, communicatively connected to the at least one processor 51. The memory stores computer programs executable by the at least one processor. The processor 51 can perform various appropriate actions and processes based on the computer program stored in the ROM 52 or loaded from storage unit 58 into the RAM 53. The RAM 53 can also store various programs and data required for the operation of the electronic device 50. The processor 51, ROM 52, and RAM 53 are interconnected via a bus 54. An input / output (I / O) interface 55 is also connected to the bus 54.
[0095] Multiple components in electronic device 50 are connected to I / O interface 55, including: input unit 56, such as keyboard, mouse, etc.; output unit 57, such as various types of monitors, speakers, etc.; storage unit 58, such as disk, optical disk, etc.; and communication unit 59, such as network card, modem, wireless transceiver, etc. Communication unit 59 allows electronic device 50 to exchange information / data with other devices through computer networks such as the Internet and / or various telecommunications networks.
[0096] Processor 51 can be a variety of general-purpose and / or special-purpose processing components with processing and computing capabilities. Some examples of processor 51 include, but are not limited to, a central processing unit (CPU), a graphics processing unit (GPU), various special-purpose artificial intelligence (AI) computing chips, various processors running machine learning model algorithms, a digital signal processor (DSP), and any suitable processor, controller, microcontroller, etc. Processor 51 performs the various methods and processes described above, such as the processing of an optical imaging module.
[0097] In some embodiments, the processing of the optical imaging module may be implemented as a computer program tangibly contained in a computer-readable storage medium, such as storage unit 58. In some embodiments, part or all of the computer program may be loaded and / or installed on the electronic device 50 via ROM 52 and / or communication unit 59. When the computer program is loaded into RAM 53 and executed by processor 51, one or more steps of the processing of the optical imaging module described above may be performed. Alternatively, in other embodiments, processor 51 may be configured to perform the processing of the optical imaging module by any other suitable means (e.g., by means of firmware).
[0098] Various embodiments of the systems and techniques described above herein can be implemented in digital electronic circuit systems, integrated circuit systems, field-programmable gate arrays (FPGAs), application-specific integrated circuits (ASICs), application-specific standard products (ASSPs), systems-on-a-chip (SoCs), payload-programmable logic devices (CPLDs), computer hardware, firmware, software, and / or combinations thereof. These various embodiments may include implementations in one or more computer programs that can be executed and / or interpreted on a programmable system including at least one programmable processor, which may be a dedicated or general-purpose programmable processor, capable of receiving data and instructions from a storage system, at least one input device, and at least one output device, and transmitting data and instructions to the storage system, the at least one input device, and the at least one output device.
[0099] Computer programs used to implement the methods of the present invention may be written in any combination of one or more programming languages. These computer programs may be provided to a processor of a general-purpose computer, a special-purpose computer, or other programmable data processing device, such that when executed by the processor, the computer programs cause the functions / operations specified in the flowcharts and / or block diagrams to be performed. The computer programs may be executed entirely on a machine, partially on a machine, or as a standalone software package, partially on a machine and partially on a remote machine, or entirely on a remote machine or server.
[0100] In the context of this invention, a computer-readable storage medium can be a tangible medium that may contain or store a computer program for use by or in conjunction with an instruction execution system, apparatus, or device. A computer-readable storage medium may include, but is not limited to, electronic, magnetic, optical, electromagnetic, infrared, or semiconductor systems, apparatus, or devices, or any suitable combination thereof. Alternatively, a computer-readable storage medium may be a machine-readable signal medium. More specific examples of machine-readable storage media include electrical connections based on one or more wires, portable computer disks, hard disks, random access memory (RAM), read-only memory (ROM), erasable programmable read-only memory (EPROM or flash memory), optical fibers, portable compact disk read-only memory (CD-ROM), optical storage devices, magnetic storage devices, or any suitable combination thereof.
[0101] To provide interaction with a user, the systems and techniques described herein can be implemented on an electronic device having: a display device (e.g., a CRT (cathode ray tube) or LCD (liquid crystal display) monitor) for displaying information to the user; and a keyboard and pointing device (e.g., a mouse or trackball) through which the user provides input to the electronic device. Other types of devices can also be used to provide interaction with the user; for example, feedback provided to the user can be any form of sensory feedback (e.g., visual feedback, auditory feedback, or tactile feedback); and input from the user can be received in any form (including sound input, voice input, or tactile input).
[0102] The systems and technologies described herein can be implemented in computing systems that include backend components (e.g., as data servers), or middleware components (e.g., application servers), or frontend components (e.g., user computers with graphical user interfaces or web browsers through which users can interact with implementations of the systems and technologies described herein), or any combination of such backend, middleware, or frontend components. The components of the system can be interconnected via digital data communication of any form or medium (e.g., communication networks). Examples of communication networks include local area networks (LANs), wide area networks (WANs), blockchain networks, and the Internet.
[0103] A computing system can include clients and servers. Clients and servers are generally located far apart and typically interact through communication networks. The client-server relationship is created by computer programs running on the respective computers and having a client-server relationship with each other. The server can be a cloud server, also known as a cloud computing server or cloud host, which is a hosting product within the cloud computing service system to address the shortcomings of traditional physical hosts and VPS services, such as high management difficulty and weak business scalability.
[0104] This application also provides a computer program product, including a computer program that, when executed by a processor, implements the processing of an optical imaging module as provided in any embodiment of the present invention.
[0105] In implementing a computer program product, computer program code for performing the operations of this disclosure can be written in one or more programming languages or a combination thereof. These programming languages include, but are not limited to, object-oriented programming languages such as Java, Smalltalk, and C++, as well as conventional procedural programming languages such as C or similar languages. The program code can be executed entirely on the user's computer, partially on the user's computer, as a standalone software package, partially on the user's computer and partially on a remote computer, or entirely on a remote computer or server. In cases involving remote computers, the remote computer can be connected to the user's computer via any type of network—including a local area network (LAN) or a wide area network (WAN)—or can be connected to an external computer (e.g., via the Internet using an Internet service provider).
[0106] It should be understood that the various forms of processes shown above can be used, with steps reordered, added, or deleted. For example, the steps described in this invention can be executed in parallel, sequentially, or in different orders, as long as the desired result of the technical solution of this invention can be achieved, and this is not limited herein.
[0107] The specific embodiments described above do not constitute a limitation on the scope of protection of this invention. Those skilled in the art should understand that various modifications, combinations, sub-combinations, and substitutions can be made according to design requirements and other factors. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this invention should be included within the scope of protection of this invention.
Claims
1. A processing method for an optical imaging module, characterized in that, include: The optical imaging module includes a lens and an image sensor; Acquire the calibration image corresponding to the test chart under the illumination of the first light source; Based on the calibration image, the relative pose information between the lens and the image sensor is determined, and the resolution parameter detection results of the active alignment stage are obtained. The lens and the image sensor are adjusted according to the relative pose information, the second light source is switched and optical performance indicators are detected to obtain the optical performance detection results; wherein, the first light source and the second light source are different types of illumination sources; The optical imaging module is subjected to split processing based on the resolution parameter detection results of the active alignment stage and the optical performance detection results.
2. The method according to claim 1, characterized in that, Determining the relative pose information between the lens and the image sensor based on the calibration image includes: Extract the imaging coordinates corresponding to the oblique reference pattern in the calibration image, and combine them with the reference center coordinates of the photosensitive area of the image sensor to determine the planar offset between the lens and the image sensor; Extract the sharpness gradient features of the calibration image, and determine the tilt angle between the lens and the image sensor based on the sharpness gradient features; The relative pose information between the lens and the image sensor is determined based on the plane offset and the tilt angle.
3. The method according to claim 2, characterized in that, After adjusting the lens and the image sensor according to the relative pose information, the method further includes: Perform the following iterative process: If the planar offset is greater than or equal to a preset offset error threshold and / or the tilt angle is greater than or equal to a preset tilt angle threshold, then a new calibration image corresponding to the test chart is re-acquired under the illumination of the first light source; based on the new calibration image, a new planar offset and a new tilt angle are determined between the lens and the image sensor, and new relative pose information is determined based on the new planar offset and the new tilt angle; the lens and the image sensor are adjusted according to the new relative pose information; the iterative process is repeated using the new planar offset as the planar offset and the new tilt angle as the tilt angle; If the plane offset is less than a preset offset error threshold and the tilt angle is less than a preset tilt angle threshold, then the iteration process is terminated.
4. The method according to claim 1, characterized in that, Adjust the lens and the image sensor according to the relative pose information, switch to the second light source and perform optical performance index detection to obtain the optical performance detection results, including: A movable second light source unit is controlled to move into the optical path region, and a uniform light field is provided by the second light source unit; a test image corresponding to the uniform light field is acquired under the illumination of the second light source. Extract at least one optical detection parameter from the image uniformity parameter and the imaging defect parameter in the test image; Each optical detection parameter is compared with its corresponding preset parameter threshold to generate the detection result for each optical detection parameter.
5. The method according to claim 1, characterized in that, The resolution parameter detection results based on the active alignment stage and the optical performance detection results are used to perform split processing on the optical imaging module, including: If the resolution parameter detection results during the active alignment stage are all qualified, and the detection results corresponding to each optical detection parameter in the detection results are qualified, then the optical imaging module is transferred to the dispensing station for dispensing and curing. The optical imaging module is assembled, and the assembled optical imaging module is re-inspected to obtain the re-inspection results; If at least one of the detection results of the resolution parameters in the active alignment stage is unqualified compared with the detection results of each optical detection parameter in the detection results, then the optical imaging module shall be processed.
6. The method according to claim 5, characterized in that, The processing of the optical imaging module includes: Remove the optical imaging module from the production line; If the detection results for the image uniformity parameter and the imaging defect parameter in the optical performance test results are both qualified, but the resolution parameter detection result in the active alignment stage is unqualified, then the optical imaging module is repaired, and the step of acquiring the calibration image corresponding to the test chart under the illumination of the first light source is returned and re-executed. Otherwise, the optical imaging module will be discarded.
7. The method according to claim 5, characterized in that, After the resolution parameter detection results based on the active alignment stage and the optical performance detection results are used to split the optical imaging module, the process further includes: Training samples are established based on the calibration image, the relative pose information, the actual measured plane offset and tilt angle, the measured values of various optical detection parameters in the optical performance index detection, the detection results corresponding to the various optical detection parameters, and the re-inspection results; the re-inspection results are obtained by re-inspecting the optical imaging module after the detection results are qualified. A basic prediction model is trained based on a set number of training samples to obtain a target prediction model; Based on the target prediction model, the preset tilt angle threshold, the preset offset error threshold, and the preset parameter thresholds corresponding to various optical detection parameters in the optical performance detection stage are adjusted. The re-inspection results of the new optical imaging module are predicted based on the target prediction model.
8. A processing system for an optical imaging module, characterized in that, The system, used to perform the processing method as described in any one of claims 1-7, comprises: a switchable light source module, a test pattern card, a motion platform, and an optical imaging module; the spatial arrangement order along the optical path from top to bottom is: a first light source unit in the switchable light source module, the test pattern card, a second light source unit in the switchable light source module, and the motion platform; the optical imaging module is disposed on the motion platform; the optical imaging module includes an image sensor and a lens; the first light source unit is fixedly disposed on the top of the test pattern card, and the second light source unit is movably disposed between the test pattern card and the motion platform; the motion platform includes an active gripper and a support platform; the active gripper is used to grip the lens, and the support platform is used to support the image sensor; The switchable light source module is used to control the second light source unit to move out of the optical path during the active alignment phase, so as to switch to the first light source; The image sensor is used to acquire the calibration image corresponding to the test chart under the illumination of the first light source. The image sensor is also used to determine the relative pose information between the lens and the image sensor based on the calibration image; The motion platform is used to adjust the lens and the image sensor according to the relative pose information; The switchable light source module is also used to control the second light source unit to move into the corresponding detection position during the optical performance detection stage, so as to switch to the second light source; The image sensor is also used to perform optical performance index detection and obtain optical performance detection results; wherein the first light source and the second light source are different types of illumination sources; the optical imaging module is subjected to split processing based on the resolution parameter detection results of the active alignment stage and the optical performance detection results.
9. A processing device for an optical imaging module, characterized in that, include: The optical imaging module includes a lens and an image sensor; The acquisition module is used to acquire the calibration image corresponding to the test chart under the illumination of the first light source; The relative pose information determination module is used to determine the relative pose information between the lens and the image sensor based on the calibration image, and to obtain the resolution parameter detection results during the active alignment stage. The detection module is used to adjust the lens and the image sensor according to the relative pose information, switch to the second light source and perform optical performance index detection to obtain optical performance detection results; wherein, the first light source and the second light source are different types of illumination sources; The split processing module is used to perform split processing on the optical imaging module based on the resolution parameter detection results of the active alignment stage and the optical performance detection results.
10. An electronic device, characterized in that, include: At least one processor; as well as A memory communicatively connected to the at least one processor; wherein, The memory stores a computer program that can be executed by the at least one processor, the computer program being executed by the at least one processor to enable the at least one processor to perform the processing of the optical imaging module as described in any one of claims 1-7.
11. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores computer instructions that cause a processor to perform the processing of the optical imaging module as described in any one of claims 1-7.