Camera device and optical instrument

Abstract

A camera device includes a mover including a first magnet, a lens, a stator including a first coil, a first substrate, a second substrate movably disposed on the first substrate, an image sensor disposed on the second substrate, a second coil disposed on the first substrate, and a second magnet disposed on the second substrate and facing the second coil, wherein the second substrate includes a coupling part coupled to the image sensor and an extension part extending outward from the coupling part such that at least a portion thereof overlaps the first substrate in an optical axis direction, and the camera device further includes a ball disposed between the first substrate and the extension part of the second substrate.

Description

[0001] This application is a divisional application of the invention patent application filed by LG Innotek Ltd., filed on June 27, 2019, with application number 201980044078.4, entitled "Camera Device and Optical Instrument". Technical Field

[0002] This exemplary embodiment relates to a camera device and an optical instrument. Background Technology

[0003] The following description provides background information for this exemplary embodiment but does not describe the prior art.

[0004] With the widespread availability and use of various portable terminals, and the commercialization of wireless Internet services, consumer demand for portable terminals has diversified, and various add-ons have been installed in portable terminals.

[0005] One type of camera device is used to capture objects as photographs or moving images. Furthermore, recent camera devices incorporate autofocus, which automatically adjusts the focus based on the distance to the object. Additionally, image stabilization functions are used to prevent image shake caused by the photographer's hand tremors.

[0006] Meanwhile, a method for performing image stabilization has been developed using lens shifting. However, in the case of the lens shifting model, there is a problem: the length of the camera device along the X / Y axis increases to the same as the travel length of the lens. Summary of the Invention

[0007] Technical Purpose

[0008] This embodiment provides a camera device that performs image stabilization by shifting the image sensor.

[0009] Furthermore, the present invention aims to provide a camera device that performs a more accurate image stabilization function by synchronizing the image sensor shift and lens shift.

[0010] Furthermore, the present invention aims to provide an optical instrument including a camera device.

[0011] Technical solution

[0012] A camera device according to this embodiment includes: a mover including a first magnet; a lens; a stator including a first coil; a first substrate; a second substrate movably disposed on the first substrate; an image sensor disposed on the second substrate; a second coil disposed on the first substrate; and a second magnet disposed on the second substrate and facing the second coil, wherein the second substrate includes: a coupling part coupled to the image sensor; and an extension part extending outward from the coupling part such that at least a portion thereof overlaps with the first substrate along the optical axis direction, and the camera device may further include a ball disposed between the extension parts of the first substrate and the second substrate.

[0013] The second substrate is a rigid substrate and may include a flexible third substrate that is electrically connected to the first substrate and the second substrate.

[0014] The first substrate includes a groove formed on the upper surface of the first substrate, and a ball may be disposed in the groove of the first substrate.

[0015] The first substrate includes a hole, an image sensor is disposed in the hole of the first substrate, a second coil overlaps with a sphere along the optical axis, and a second magnet can be disposed on the upper surface of the second substrate and overlap with the second coil along the optical axis.

[0016] The ball can be disposed between the groove of the first substrate and the extension of the second substrate.

[0017] The extension component of the second substrate includes a first extension component disposed relative to the image sensor along a first axis direction and a second extension component disposed relative to the image sensor along a second axis direction perpendicular to the first axis direction, wherein the third substrate may be disposed between the first axis and the second axis.

[0018] The third substrate can be positioned on the corner side of the image sensor.

[0019] The mover also includes: a housing; a bobbin disposed in the housing; a third coil disposed on the bobbin; and an elastic member connecting the housing and the bobbin, wherein a first magnet is disposed in the housing and faces the third coil, and wherein the camera device may also include a support member connecting the mover and the stator.

[0020] The optical instrument according to this embodiment includes: a main body; a camera device according to claim 1, which is disposed on the main body; and a display, which is disposed on the main body and outputs images captured by the camera device.

[0021] The camera device according to this embodiment may include: a housing; a coil holder disposed inside the housing; a lens connected to the coil holder; a substrate disposed below the housing; a first coil disposed on the coil holder; a first magnet disposed in the housing and facing the first coil; a second coil disposed on the substrate and facing the first magnet; a first substrate disposed below the substrate; a second substrate at least partially overlapping the first substrate along the optical axis; a sphere disposed between the first substrate and the second substrate; an image sensor disposed on the second substrate; a third coil disposed on the first substrate; a second magnet disposed on the image sensor and facing the third coil; and a flexible third substrate electrically connected to the first substrate and the second substrate.

[0022] The camera device according to this embodiment may include: a mover connected to a lens; a stator spaced apart from the mover; a first substrate disposed on one side of the stator; a second substrate movably disposed on the first substrate; an image sensor disposed on the second substrate; a second coil disposed on the first substrate; and a second magnet disposed on the second substrate and facing the second coil.

[0023] The stator includes a housing and a first magnet disposed within the housing. The mover may include a coil frame disposed within the housing and a first coil disposed on the coil frame and facing the first magnet.

[0024] The mover may include a housing, a coil frame disposed within the housing, a first coil disposed on the coil frame, and a first magnet disposed within the housing and facing the first coil. The stator may include a base disposed below the housing and a third coil disposed on the base and facing the first magnet.

[0025] The camera device according to this embodiment includes: a mover including a first magnet; a lens connected to a power source; a stator including a first coil facing the first magnet and disposed on one side of the mover; a first substrate disposed on one side of the stator; a second substrate movably disposed on the first substrate; an image sensor disposed on the second substrate and including a first side; a second coil disposed on the first substrate; and a second magnet disposed on the image sensor and facing the second coil, wherein the first substrate includes a first portion corresponding to the first side of the image sensor, and wherein the second substrate may include a plurality of flexible connecting portions connected to the first portion of the first substrate.

[0026] The second substrate may include: a substrate 2-1, which connects the first substrate and the image sensor along the first axis direction; and a substrate 2-2, which connects the first substrate and the image sensor along the second axis direction perpendicular to the first axis direction.

[0027] The second substrate includes an inner portion connected to the image sensor and an outer portion connected to the first substrate, and a plurality of flexible connecting portions can connect the inner portion and the outer portion.

[0028] The first substrate includes a hole, an image sensor is disposed in the hole of the first substrate, a second coil is disposed on the inner surface of the hole of the first substrate, and a second magnet may be disposed on the outer surface of the image sensor.

[0029] The second substrate can be coupled to one surface of the image sensor and one surface of the first substrate, and the third substrate, which includes a connection portion for external connection, can be coupled to another surface of the first substrate.

[0030] The camera device may also include a reinforcing plate connected to a third substrate.

[0031] The mover includes a housing, a coil frame disposed in the housing, a third coil disposed on the coil frame, and an elastic member connecting the housing and the coil frame. A first magnet is disposed in the housing and faces the third coil. The camera device may also include a support member connecting the mover and the stator.

[0032] The image sensor is connected to the second substrate via a flip chip, the second magnet is fixed to the second substrate by adhesive, and the second coil is formed as a patterned coil on the first substrate.

[0033] The optical instrument according to this embodiment includes a main body, a camera device mounted on the main body, and a display mounted on the main body that outputs images captured by the camera device.

[0034] The camera device according to this embodiment may include: a housing; a coil holder disposed in the housing; a lens connected to the coil holder; a substrate disposed below the housing; a first coil disposed on the coil holder; a first magnet disposed in the housing and facing the first coil; a second coil disposed on the substrate and facing the first magnet; a first substrate disposed below the substrate; an image sensor disposed below the substrate at a position corresponding to the lens; a third coil disposed on the first substrate; the second magnet disposed on the image sensor and facing the third coil; and a flexible second substrate connecting the first substrate and the image sensor.

[0035] The camera device according to this embodiment includes: a mover connected to a lens; a stator spaced apart from the mover; a first substrate disposed on one side of the stator; a second substrate movably disposed on the first substrate; an image sensor disposed on the second substrate and including a first side; a second coil disposed on the first substrate; and a second magnet disposed on the second substrate and facing the second coil, wherein the first substrate includes a first portion corresponding to the first side of the image sensor, and wherein the second substrate may include a plurality of flexible connecting portions connected to the first portion of the first substrate.

[0036] The stator may include a housing and a first magnet disposed in the housing, and the mover may include a coil frame disposed in the housing and a first coil disposed on the coil frame and facing the first magnet.

[0037] The mover includes: a housing; a coil frame disposed in the housing; a first coil disposed on the coil frame; and a first magnet disposed in the housing and facing the first coil, wherein the stator may include a base disposed below the housing and a third coil disposed on the base and facing the first magnet.

[0038] Beneficial effects

[0039] This embodiment demonstrates that image stabilization can be achieved by shifting the image sensor.

[0040] Furthermore, more precise image stabilization can be provided by synchronizing image sensor shift and lens shift. Attached Figure Description

[0041] Figure 1 It is a schematic cross-sectional view showing the structure related to the image sensor displacement of the camera device according to the first embodiment, and is also a conceptual diagram.

[0042] Figure 2 It is a plan view showing the structure related to the image sensor displacement of the camera device according to the first embodiment, and is also a conceptual diagram.

[0043] Figure 3 It is a schematic cross-sectional view showing the structure related to the image sensor displacement of the camera device according to a variant of the first embodiment, and is a conceptual diagram.

[0044] Figure 4 It is a schematic cross-sectional view showing a construction related to image sensor displacement of a camera device according to another variant of the first embodiment, and is a conceptual diagram.

[0045] Figure 5 It is a plan view showing the construction related to the image sensor displacement of a camera device according to another variant of the first embodiment, and is a conceptual diagram.

[0046] Figure 6 This is a schematic cross-sectional view showing the structure related to the image sensor displacement of the camera device according to the second embodiment, and is also a conceptual diagram.

[0047] Figure 7 It is a plan view showing the structure related to the image sensor displacement of the camera device according to the second embodiment, and is also a conceptual diagram.

[0048] Figure 8It is a plan view showing the structure related to the image sensor displacement of the camera device according to a variant of the second embodiment, and is a conceptual diagram.

[0049] Figure 9 It is a plan view showing the construction related to the image sensor displacement of a camera device according to another variant of the second embodiment, and is a conceptual diagram.

[0050] Figure 10 This is a perspective view of the lens driving device according to this embodiment.

[0051] Figure 11 From Figure 10 A cross-sectional view viewed in the XY direction.

[0052] Figure 12 This is an exploded perspective view of the lens driving device according to this embodiment.

[0053] Figure 13 From Figure 12 An exploded perspective view of the lens driving device according to this embodiment, viewed from different directions.

[0054] Figure 14 This is an exploded perspective view showing the first mover and related structures according to this embodiment.

[0055] Figure 15 This is an exploded perspective view showing the second mover according to this embodiment.

[0056] Figure 16 This is an exploded perspective view of the stator according to this embodiment.

[0057] Figure 17 This is an exploded perspective view showing the elastic member, support member and related structure according to this embodiment.

[0058] Figure 18 A plan view of the lens driving device according to this embodiment is shown with the cover omitted.

[0059] Figure 19 This is a cross-sectional view of the camera device according to the first embodiment.

[0060] Figure 20 This is a cross-sectional view of the camera device according to the second embodiment.

[0061] Figure 21 This is a perspective view showing the optical instrument according to this embodiment. Specific Implementation

[0063] Best mode

[0064] In the following description, some embodiments of the invention will be illustrated with reference to exemplary drawings. However, the inventive concept is not limited to these described embodiments.

[0065] When describing components of embodiments of the present invention, terms such as first, second, A, B, (a), (b) may be used. These terms are intended only to distinguish the components from other components, and they do not limit the nature, order, or sequence of the components.

[0066] When describing a component as “connected” or “linked” to another component, the component may be directly “connected”, “linked”, or “combined” to the other component, but it should be understood that another component may be “connected” or “linked” between the component and the other component.

[0067] The term "optical axis direction" as used below is defined as the direction of the optical axis of the lens connected to the lens drive device. Therefore, the "optical axis direction" can be consistent with the direction of the optical axis of the image sensor of the camera module.

[0068] The "autofocus function" used below is defined as follows: It automatically focuses on the object by moving the lens along the optical axis based on the object's distance, thereby obtaining a clear image of the object on the image sensor. "Autofocus" can be used interchangeably with "Auto Focus (AF)".

[0069] The “image stabilization function” used below is defined as follows: moving or tilting the lens module along a direction perpendicular to the optical axis to eliminate vibrations (movements) in the image sensor caused by external forces. “Image stabilization” can be used interchangeably with “Optical Image Stabilization (OIS)”.

[0070] In the following description, the construction of the optical instrument according to this embodiment will be described with reference to the accompanying drawings.

[0071] Figure 21 This is a perspective view showing the optical instrument according to this embodiment.

[0072] Optical instruments can be any of the following: handheld telephones, mobile phones, smartphones, portable communication devices, portable smart devices, digital cameras, laptops, digital broadcasting terminals, personal digital assistants (PDAs), portable multimedia players (PMPs), and navigators. However, the types of optical instruments are not limited to these, and optical instruments may include any device for capturing images or pictures.

[0073] The optical instrument may include a body 1. The body 1 may form the appearance of the optical instrument. The body 1 may house a camera device 3. A display 2 may be disposed on one surface of the body 1. For example, the display 2 and the camera device 3 may be disposed on one side of the body 1, and the camera device 3 may additionally be disposed on the other side of the body 1 (the side located on the opposite side of the body 1).

[0074] The optical instrument may include a display 2. The display 2 may be mounted on a surface of the main body 1. The display 2 may output images captured by the camera device 3.

[0075] The optical instrument may include a camera device 3. The camera device 3 may be mounted on the main body 1. At least a portion of the camera device 3 may be housed within the main body 1. Multiple camera devices 3 may be used. The camera device 3 may include a dual-camera setup. The camera devices 3 may be mounted on one side and the other side of the main body 1, respectively. The camera device 3 can capture images of an object.

[0076] In the following description, the construction of the camera device according to the first embodiment will be described with reference to the accompanying drawings.

[0077] Figure 1 It is a schematic cross-sectional view showing the structure related to the image sensor displacement of the camera device according to the first embodiment, and is a conceptual diagram; Figure 2 This is a plan view illustrating the structure related to the image sensor displacement of the camera device according to the first embodiment, and is also a conceptual diagram; and Figure 19 This is a cross-sectional view of the camera device according to the first embodiment.

[0078] The camera device 3 may include an image sensor 10. The image sensor 10 may be disposed on one side of the stator 400. The image sensor 10 may be disposed below the stator 400. The image sensor 10 may be disposed at a position corresponding to the lens. The image sensor 10 may be disposed in the first substrate 20. The image sensor 10 may be electrically connected to the first substrate 20. The image sensor 10 may be disposed on a second substrate 30. The image sensor 10 may be a flip chip connected to the second substrate 30. The image sensor 10 may be soldered to the second substrate 30. The image sensor 10 may be configured such that the lens and optical axis coincide. That is, the optical axis of the image sensor 10 and the optical axis of the lens may be aligned. The image sensor 10 can convert light illuminating the effective image area of ​​the image sensor 10 into an electrical signal. The image sensor 10 may be any one of a charge-coupled device (CCD), metal-oxide-semiconductor (MOS), CPD, and CID.

[0079] The camera device 3 may include a first substrate 20. The first substrate 20 may be a printed circuit board. The first substrate 20 may be a cavity PCB. The first substrate 20 may be a rigid substrate. The first substrate 20 may be a PCB including a hollow or holes. A lens driving device may be disposed on the first substrate 20. In this case, a sensor substrate 15 may be disposed between the first substrate 20 and the lens driving device. The sensor substrate 15 includes a recess, and a terminal portion 412 of the substrate 410 may be disposed in the recess of the sensor substrate 15. The first substrate 20 may be disposed on one side of the stator 400. The first substrate 20 may be disposed below the stator 400. The first substrate 20 may be electrically connected to the lens driving device. The first substrate 20 may be electrically connected to the image sensor 10. A fourth substrate 80, including a connection member 81 for external connection, may be connected to the other surface (lower surface) of the first substrate 20.

[0080] The first substrate 20 may include a hole 21. The hole 21 of the first substrate 20 may be formed in the center of the first substrate 20. An image sensor 10 may be disposed in the hole 21 of the first substrate 20. The hole 21 of the first substrate 20 may be formed in a shape corresponding to the image sensor 10. However, the size of the hole 21 of the first substrate 20 may be formed to be larger than the size of the image sensor 10 to ensure travel space of the image sensor 10 within the hole 21 of the first substrate 20.

[0081] The first substrate 20 may include a groove 22. The groove 22 may be formed on the upper surface of the first substrate 20. The groove 22 may accommodate at least a portion of the ball 70. The groove 22 may be formed to have a width corresponding to or greater than the diameter of the ball 70. The groove 22 may include four grooves spaced apart from each other. The ball 70 may be disposed in each of the four grooves. The four grooves may be formed at positions corresponding to the four extension members 32. The groove 22 may be formed such that the ball 70 disposed in the groove 22 does not separate from the groove 22.

[0082] The camera device 3 may include a second substrate 30. The second substrate 30 may be a rigid substrate. The second substrate 30 may be movably disposed on the first substrate 20. The second substrate 30 may be coupled to a surface (upper surface) of the image sensor 10. The image sensor 10 may be a flip chip coupled to the second substrate 30. The image sensor 10 may be fixed to the second substrate 30. The second substrate 30 and the image sensor 10 may move integrally. The connection between the second substrate 30 and the image sensor 10 may be performed using solder balls or Ag epoxy resin. The second substrate 30 may include a hollow or a hole. The optical path between the image sensor 10 and the lens may be formed through the hole or hollow of the second substrate 30.

[0083] The second substrate 30 may include a connecting member 31. The connecting member 31 may be connected to the image sensor 10. The connecting member 31 may have a rectangular frame shape. The connecting member 31 may overlap with the image sensor 10 along the optical axis. The connecting member 31 may be disposed on the image sensor 10.

[0084] The second substrate 30 may include an extension member 32. The extension member 32 may extend outward from the connecting member 31 such that at least a portion of the extension member 32 may overlap with the first substrate 20 along the optical axis. The extension member 32 may be supported by a ball 70. The extension member 32 may be formed as rigid.

[0085] The extension component 32 may include multiple extension components. Specifically, the extension component 32 may include four extension components 32. The extension component 32 may include a first extension component 32-1 disposed relative to the image sensor 10 along a first axis and a second extension component 32-2 disposed relative to the image sensor 10 along a second axis perpendicular to the first axis. In this case, one of the first axis and the second axis may be an X-axis and the other may be a Y-axis. Each of the first extension component 32-1 and the second extension component 32-2 may include two extension components disposed on opposite sides of each other.

[0086] The camera device 3 may include a second coil 40. The second coil 40 is disposed on the first substrate 20. The second coil 40 may be disposed on the inner surface of the hole 21 of the first substrate 20. The second coil 40 may be formed as a patterned coil on the first substrate 20. The second coil 40 may be integrally formed with the first substrate 20 as a finely patterned coil. The second coil 40 may overlap with the sphere 70 along the optical axis direction. With this structure, the size of the first substrate 20 along the X-axis / Y-axis direction can be minimized. When current is applied to the second coil 40, the second coil 40 can interact electromagnetically with the second magnet 50.

[0087] The second coil 40 may include multiple coils. The second coil 40 may include a 2-1 coil 41 disposed relative to the image sensor 10 along a first axis and a 2-2 coil 42 disposed relative to the image sensor 10 along a second axis perpendicular to the first axis. In a first embodiment, when current is applied to the 2-1 coil 41, the image sensor 10 moves along the first axis, and when current is applied to the 2-2 coil 42, the image sensor 10 can move along the second axis.

[0088] The camera device 3 may include a second magnet 50. The second magnet 50 may be disposed on the second substrate 30. The second magnet 50 may be disposed on the image sensor 10. The second magnet 50 may be movable integrally with the image sensor 10. The second magnet 50 may be spaced apart from the image sensor 10. The second magnet 50 may face the second coil 40. The second magnet 50 may be disposed on the outer surface of the image sensor 10. The second magnet 50 is fixed to the second substrate 30 by adhesive.

[0089] The second magnet 50 may include a 2-1 magnet 51 facing the 2-1 coil 41 and a 2-2 magnet 52 facing the 2-2 coil 42. Each of the 2-1 magnet 51 and the 2-2 magnet 52 may include two magnets.

[0090] In the first embodiment, image sensor shifting can be performed using a second magnet 50 disposed on the second substrate 30 or an image sensor 10 and a second coil 40 disposed on the first substrate 20. That is, when current is applied to the second coil 40, the second magnet 50 moves due to the electromagnetic interaction between the second coil 40 and the second magnet 50. At this time, when the image sensor 10 moves together with the second magnet 50, image stabilization (OIS) can be performed. The OIS drive of the image sensor shifting method of the first embodiment has the advantage of reducing the size of the lens and the lens driving device because there is no lens movement compared to the OIS drive of the lens shifting method. In particular, the size can be reduced along the X-axis / Y-axis direction. Furthermore, in the lens shifting method, the problem of wire breakage for supporting lens movement may occur, but this problem can be solved in the image sensor shifting method.

[0091] In the first embodiment, OIS can be performed simply by shifting the image sensor 10. However, a more precise OIS function can be performed by synchronizing the movement of the image sensor 10 and the lens. That is, the image sensor 10 and the lens can move the same distance in the same direction. When the synchronized shift between the image sensor 10 and the lens according to the first embodiment is performed, even if the camera device shakes due to the user's hand shake, there will be no movement between the image sensor 10 and the lens. Therefore, perfect image stabilization can be performed. In other words, compared to structures where only the image sensor 10 is shifted or only the lens is shifted, the synchronized shift structure between the image sensor 10 and the lens according to the first embodiment provides enhanced image stabilization (OIS) functionality.

[0092] In the first embodiment, the second coil 40 is disposed on the first substrate 20 and the second magnet 50 is disposed on the second substrate 30. However, in a variant embodiment, the second magnet 50 is disposed on the first substrate 20 and the second coil may be disposed on the second substrate 30.

[0093] The camera device 3 may include a third substrate 60. The third substrate 60 may include a flexible substrate. The third substrate 60 may be a flexible printed circuit board (FPCB). The third substrate 60 may electrically connect the first substrate 20 and the image sensor 10. The third substrate 60 may connect the second substrate 30 and the first substrate 20. The third substrate 60 may be attached to the upper surface of the first substrate 20. The third substrate 60 may be attached to an anisotropic conductive film (ACF) or a cavity PCB of the flip chip to the first substrate 20. The connection between the third substrate 60 and the first substrate 20 may be performed using solder balls or Ag epoxy resin. The third substrate 60 may extend from the side surface of the second substrate 30. The second substrate 30 and the third substrate 60 may be integrally formed rigid flexible printed circuit boards (RFPCBs). In this case, the second substrate 30 may include a rigid substrate and the third substrate 60 may include a flexible substrate. The third substrate 60 may electrically connect the image sensor 10 and the first substrate 20 while bending or unfolding. The third substrate 60 may be disposed at a corner of the second substrate 30.

[0094] The third substrate 60 may include multiple third substrates. The third substrate 60 may include four third substrates. The four third substrates may be arranged symmetrically to each other. Among the four third substrates, two third substrates may be arranged along a third axis, and the remaining two third substrates may be arranged along a fourth axis. The third substrate 60 may be disposed between the first extension member 32-1 and the second extension member 32-2 of the second substrate 30. The third substrate 60 may be disposed at a corner side of the image sensor 10. The third substrate 60 may be disposed between a first axis and a second axis. The third substrate 60 may be disposed in the space between the first axis and the second axis. In this case, the first axis may be an axis along the direction in which the first extension member 32-1 is disposed, and the second axis may be an axis along the direction in which the second extension member 32-2 is disposed.

[0095] The third substrate 60 may include: a connection part 61 connected to the second substrate 30; and a connecting part 62 formed at the end of the connection part 61 and connected to the upper surface of the first substrate 20. In the first embodiment, the connection part 61 may be arranged diagonally relative to the image sensor 10.

[0096] The camera device 3 may include a ball 70. The ball 70 may be disposed between the first substrate 20 and the second substrate 30. The ball 70 may be disposed in a recess 22 of the first substrate 20. The ball 70 may be disposed between an extension member 32 of the first substrate 20 and the second substrate 30. The ball 70 may movably support the second substrate 30. The ball 70 may include a "guide ball". The ball 70 may include multiple balls. The ball 70 includes a total of 12 balls, with three balls supporting one extension member 32, such that a total of 12 balls can support four extension members 32. The ball 70 may be rotatably accommodated in the recess 22 of the first substrate 20. The ball 70 may have a spherical shape.

[0097] The camera device 3 may include a fourth substrate 80. The fourth substrate 80 may be a printed circuit board. The fourth substrate 80 may include an open-circuit PCB. The fourth substrate 80 may be coupled to another surface (lower surface) of the first substrate 20. The fourth substrate 80 may include a connection component 81 connected to an external component. The connection component 81 may include a connector. The connection component 81 may be connected to components of an optical instrument located external to the camera device 3.

[0098] The camera device 3 may include a reinforcing plate 90. The reinforcing plate 90 may be connected to a fourth substrate 80. The reinforcing plate 90 may be formed of stainless steel (SUS). The reinforcing plate 90 may include a first reinforcing plate 91 disposed on the lower surface of the fourth substrate 80 at a position corresponding to the first substrate 20. The reinforcing plate 90 may include a second reinforcing plate 92 disposed on the upper surface of the fourth substrate 80 at a position corresponding to the connecting member 81.

[0099] The camera device 3 may include a lens module. The lens module may include at least one lens. The lens module may include a lens barrel and multiple lenses coupled to the interior of the lens barrel. The lens module may be coupled to the coil holder 210 of the lens drive device. The lens module may be coupled to the coil holder 210 via threaded connections and / or adhesive. The lens module is movable integrally with the coil holder 210. The lens may be coupled to movers 200 and 300. The lens may be coupled to the first mover 200.

[0100] The camera device 3 may include a filter. The filter may be an infrared filter. The infrared filter can block light in the infrared region from entering the image sensor 10. The infrared filter may be disposed between the lens and the image sensor 10. For example, the infrared filter may be disposed on a sensor substrate 15, which is disposed between the lens drive device and the first substrate 20. As another example, the infrared filter may be disposed on a substrate 430.

[0101] The camera device 3 may include a controller. The controller may be disposed on the first substrate 20. The controller may independently control the direction, intensity, and amplitude of the current supplied to the first coil 422, the second coil 40, and the third coil 220 of the lens driving device. The controller may perform autofocus and / or image stabilization functions by controlling the lens driving device. In addition, the controller may perform autofocus feedback control and / or image stabilization feedback control for the lens driving device.

[0102] Figure 3 It is a schematic cross-sectional view showing the structure related to the image sensor displacement of the camera device according to a variant of the first embodiment, and is a conceptual diagram.

[0103] A variant embodiment may include a fifth substrate 30a and a sixth substrate 60a, which are variations of the second substrate 30 and the third substrate 60 of the first embodiment. The sixth substrate 60a may extend from the inner surface of the fifth substrate 30a. In this case, the image sensor 10 may be a flip chip connected to the sixth substrate 60a. The sixth substrate 60a may be connected to the upper surface of the first substrate 20. That is, one end of the sixth substrate 60a may be connected to the image sensor 10, and the other end of the sixth substrate 60a may be connected to the first substrate 20.

[0104] Figure 4 It is a schematic cross-sectional view showing a construction related to image sensor displacement of a camera device according to another variant of the first embodiment, and is a conceptual diagram.

[0105] Another variant embodiment may include a fourth coil 40a and a fifth magnet 50a, which are variations of the second coil 40 and the second magnet 50 of the first embodiment. The fifth magnet 50a may be disposed on the upper surface of the second substrate 30. The fifth magnet 50a may overlap with the fourth coil 40a along the optical axis. The fourth coil 40a may be disposed below the sphere 70. The fourth coil 40a may overlap with the sphere 70 along the optical axis. The sphere 70 may be disposed between the fourth coil 40a and the fifth magnet 50a along the optical axis. According to another variant embodiment, compared with the first embodiment, the size of the first substrate 20 along the X-axis / Y-axis direction can be reduced.

[0106] Figure 5 It is a plan view showing the construction related to the image sensor displacement of a camera device according to another variant of the first embodiment, and is a conceptual diagram.

[0107] Another variant embodiment may include a seventh substrate 30b, a fifth coil 40b, a sixth magnet 50b, an eighth substrate 60b, and a ball 70b, all of which are variations of the second substrate 30, the second coil 40, the second magnet 50, the third substrate 60, and the ball 70 of the first embodiment.

[0108] The seventh substrate 30b may include a connecting member 31b and an extension member 32b. However, the position of the extension member 32b can be changed compared to the first embodiment. In the first embodiment, the extension member 32b is disposed at the center of one sidewall of the connecting member 31, but in another variant embodiment, the extension member 32b may be configured to be biased from one side of the connecting member 31b toward a corner side. Thus, the eighth substrate 60b can be disposed from one side of the connecting member 31b to the other corner side. That is, the eighth substrate 60b may be disposed on one side (edge) of the connecting member 31b instead of at the corner. The ball 70b may be configured to be biased toward the corner side of the first substrate 20 to support the extension member 32b. The fifth coil 40b may be configured to be biased toward the corner side of the first substrate 20. The sixth magnet 50b may be configured to face the fifth coil 40b at the corner side of the connecting member 31b. The eighth substrate 60b may include a connecting member 61b extending from the connecting member 31b along the X-axis or Y-axis direction and a connecting member 62b connected to the first substrate 20. The eighth substrate 60b may be arranged parallel to the extension member 32b. The eighth substrate 60b may be spaced apart from the extension member 32b. The eighth substrate 60b may be arranged in a direction corresponding to the extension member 32b. The eighth substrate 60b may be arranged in the same direction as the extension member 32b.

[0109] In the following description, the construction of the camera device according to the second embodiment will be described with reference to the accompanying drawings.

[0110] Figure 6 It is a schematic cross-sectional view showing the structure related to the image sensor displacement of the camera device according to the second embodiment, and is a conceptual diagram; Figure 7 This is a plan view illustrating the structure related to the image sensor displacement of the camera device according to the second embodiment, and is also a conceptual diagram; and Figure 20 This is a cross-sectional view of the camera device according to the second embodiment.

[0111] The camera device 3 may include an image sensor 1010. The image sensor 1010 may be disposed on one side of the stator 400. The image sensor 1010 may be disposed below the stator 400. The image sensor 1010 may be disposed at a position corresponding to a lens. The image sensor 1010 may be electrically connected to a first substrate 1020. The image sensor 1010 may be a flip chip coupled to a second substrate 1030. The image sensor 1010 may be configured such that the lens and optical axis coincide. That is, the optical axis of the image sensor 1010 and the optical axis of the lens may be aligned. The image sensor 1010 can convert light illuminating the effective image area of ​​the image sensor 1010 into an electrical signal. The image sensor 1010 may be any one of a charge-coupled device (CCD), metal-oxide-semiconductor (MOS), CPD, and CID. The image sensor 1010 may include a first side. The image sensor 1010 may include multiple sides. The image sensor 1010 may include four sides. The image sensor 1010 may include first to fourth sides. Multiple sides of the image sensor 1010 can be formed as multiple side surfaces of the image sensor 1010 intersecting with the upper or lower surface of the image sensor 1010.

[0112] The camera device 3 may include a first substrate 1020. The first substrate 1020 may be a printed circuit board. The first substrate 1020 may be a cavity PCB. The first substrate 1020 may be a rigid substrate. The first substrate 1020 may be a hollow PCB or a PCB including holes. A lens driving device may be disposed on the first substrate 1020. At this time, a sensor substrate 1015 may be disposed between the first substrate 1020 and the lens driving device. The sensor substrate 1015 may include a recess, and a terminal portion 412 of the substrate 410 may be disposed in the recess of the sensor substrate 1015. The first substrate 1020 may be disposed on one side of the stator 400. The first substrate 1020 may be disposed below the stator 400. The first substrate 1020 may be electrically connected to the lens driving device. The first substrate 1020 may be electrically connected to the image sensor 1010. A third substrate 1060, including a connecting member 1061 connected to an external component, may be connected to the other surface (lower surface) of the first substrate 1020.

[0113] The first substrate 1020 may include a first portion corresponding to a first side of the image sensor 1010. The first substrate 1020 may include a second portion corresponding to a second side of the image sensor 1010. The first substrate 1020 may include a third portion corresponding to a third side of the image sensor 1010. The first substrate 1020 may include a fourth portion corresponding to a fourth side of the image sensor 1010. Each of the first to fourth portions of the first substrate 1020 may be connected to a connection member 1033 of the second substrate 1030. That is, the second substrate 1030 includes units of the connection member 1033 divided into four regions, and the units of the connection member 1033 may be respectively connected to the first to fourth portions.

[0114] The first substrate 1020 may include a hole 1021. The hole 1021 of the first substrate 1020 may be formed at the center of the first substrate 1020. An image sensor 1010 may be disposed in the hole 1021 of the first substrate 1020. The hole 1021 of the first substrate 1020 may be formed in a shape corresponding to the image sensor 1010. However, the size of the hole 1021 of the first substrate 1020 may be formed to be larger than the size of the image sensor 1010, thereby ensuring sufficient travel space for the image sensor 1010 within the hole 1021 of the first substrate 1020.

[0115] The camera device 3 may include a second substrate 1030. The second substrate 1030 may be a flexible substrate. The second substrate 1030 may be a flexible printed circuit board (FPCB). The second substrate 1030 may connect the first substrate 1020 and the image sensor 1010. The second substrate 1030 may be coupled to one surface (upper surface) of the image sensor 1010 and one surface (upper surface) of the first substrate 1020. The image sensor 1010 may be a flip chip coupled to the second substrate 1030. The second substrate 1030 may be coupled to an anisotropic conductive film (ACF) or a cavity PCB to which the flip chip is coupled to the first substrate 1020. A portion of the lower surface of the second substrate 1030 may be coupled to the upper surface of the image sensor 1010, and another portion of the lower surface of the second substrate 1030 may be coupled to the upper surface of the first substrate 1020. The connections between the second substrate 1030 and the image sensor 1010, and between the second substrate 1030 and the first substrate 1020, may be performed using solder balls or Ag epoxy resin.

[0116] The second substrate 1030 may include: a 2-1 substrate 1010-1, connecting the first substrate 1020 and the image sensor 1010 along a first axis; and a 2-2 substrate 1030-2, connecting the first substrate 1020 and the image sensor 1010 along a second axis perpendicular to the first axis. In this case, one of the first axis and the second axis may be an X-axis, and the other may be a Y-axis. Each of the 2-1 substrate 1030-1 and the 2-2 substrate 1030-2 may include two substrates. The 2-1 substrate 1010-1 supports movement of the image sensor 1010 along the first axis, while the 2-2 substrate 1030-2 supports movement of the image sensor 1010 along the second axis.

[0117] The second substrate 1030 may include an inner portion 1031 connected to the image sensor 1010, an outer portion 1032 connected to the first substrate 1020, and a flexible connecting member 1033 connecting the inner portion 1031 and the outer portion 1032. The inner portion 1031 may have a rectangular frame shape. The inner portion 1031 includes a hole, and the optical path between the image sensor 1010 and the lens can be formed through the hole in the inner portion 1031. The outer portion 1032 may include four outer portions 1032 spaced apart from each other. At this time, two of the four outer portions 1032 are arranged relative to the image sensor 1010 along a first axis direction, and the other two outer portions 1032 may be arranged relative to the image sensor 1010 along a second axis direction. The connecting member 1033 may include four connecting members 1033 spaced apart from each other. The four connecting members 1033 may be connected to the four outer portions 1032 respectively. Each of the four connecting members 1033 may include multiple wires. Multiple conductors can be formed from multiple strands spaced apart from each other. The multiple conductors can include up to 10 conductors. The connecting member 1033 is elastic and can elastically support the movement of the image sensor 1010. That is, the second substrate 1030 can movably support the image sensor 1010.

[0118] The camera device 3 may include a second coil 1040. The second coil 1040 may be disposed on the first substrate 1020. The second coil 1040 may be disposed on the inner surface of the hole 1021 of the first substrate 1020. The second coil 1040 may be formed as a patterned coil on the first substrate 1020. The second coil 1040 may be integrally formed with the first substrate 1020 as a fine patterned coil.

[0119] The second coil 1040 may include multiple coils. The second coil 1040 may include a 2-1 coil 1041 disposed relative to the image sensor 1010 along a first axis and a 2-2 coil 1042 disposed relative to the image sensor 1010 along a second axis perpendicular to the first axis. In a second embodiment, when current is applied to the 2-1 coil 1041, the image sensor 1010 moves along the first axis, and when current is applied to the 2-2 coil 1042, the image sensor 1010 can move along the second axis.

[0120] The camera device 3 may include a second magnet 1050. The second magnet 1050 may be disposed on the image sensor 1010. The second magnet 1050 may move integrally with the image sensor 1010. The second magnet 1050 may be coupled to the inner side 1031 of the second substrate 1030 coupled to the image sensor 1010. In this case, the second magnet 1050 may be spaced apart from the image sensor 1010. However, even in this case, the second magnet 1050 and the image sensor 1010 may move integrally. The second magnet 1050 may face the second coil 1040. The second magnet 1050 may be disposed on the outer surface of the image sensor 1010. The second magnet 1050 may be fixed to the second substrate 1030 by adhesive.

[0121] The second magnet 1050 may include a 2-1 magnet 1051 facing the 2-1 coil 1041 and a 2-2 magnet 1052 facing the 2-2 coil 1042. Each of the 2-1 magnet 1051 and the 2-2 magnet 1052 may include two magnets.

[0122] In the second embodiment, image sensor shifting can be performed using a second magnet 1050 disposed on the image sensor 1010 and a second coil 1040 disposed on the first substrate 1020. That is, when current is applied to the second coil 1040, the second magnet 1050 moves due to the electromagnetic interaction between the second coil 1040 and the second magnet 1050. At this time, when moving together with the integrally moving image sensor 1010, image stabilization (OIS) can be performed. The OIS driving of the image sensor shifting method of the second embodiment has the advantage of reducing the size of the lens and lens driving device because there is no lens movement compared to the OIS driving of the lens shifting method. In particular, the size can be reduced along the X-axis / Y-axis direction. Furthermore, in the lens shifting method, the problem of wires supporting lens movement breaking may occur, but this problem can be solved in the image sensor shifting method.

[0123] In the second embodiment, OIS can be performed simply by shifting the image sensor 1010, and a more precise OIS function can be performed by synchronizing the movement of the image sensor 1010 and the lens. That is, the image sensor 1010 and the lens can move the same distance in the same direction. When the synchronized shift between the image sensor 1010 and the lens is performed according to the second embodiment, even if the camera device shakes due to the user's hand tremor, there is no movement between the image sensor 1010 and the lens, thus perfect image stabilization can be performed. In other words, compared to structures that only shift the image sensor 1010 or only shift the lens, the synchronized shift structure between the image sensor 1010 and the lens according to the second embodiment provides enhanced image stabilization (OIS) functionality.

[0124] In the second embodiment, the second coil 1040 is disposed on the first substrate 1020 and the second magnet 1050 is disposed on the second substrate 1030. However, in a variant embodiment, the second magnet 1050 is disposed on the first substrate 1020 and the second coil 1040 may be disposed on the second substrate 1030.

[0125] The camera device 3 may include a third substrate 1060. The third substrate 1060 may be a printed circuit board. The third substrate 1060 may include an open-circuit PCB. The third substrate 1060 may be coupled to another surface (lower surface) of the first substrate 1020. The third substrate 1060 may include a connecting member 1061 connected to an external component. The connecting member 1061 may include a connector. The connecting member 1061 may be connected to an optical instrument configuration located outside the camera device 3.

[0126] The camera device 3 may include a reinforcing plate 1070. The reinforcing plate 1070 may be connected to a third substrate 1060. The reinforcing plate 1070 may be formed of stainless steel (SUS). The reinforcing plate 1070 may include a first reinforcing plate 1071 disposed on the lower surface of the third substrate 1060 at a position corresponding to the first substrate 1020. The reinforcing plate 1070 may include a second reinforcing plate 1072 disposed on the upper surface of the third substrate 1060 at a position corresponding to the connecting member 1061.

[0127] The camera device 3 may include a lens module. The lens module may include at least one lens. The lens module may include a lens barrel and multiple lenses connected to the interior of the lens barrel. The lens module may be connected to the coil holder 210 of the lens drive device. The lens module may be connected to the coil holder 210 via threaded connections and / or adhesive. The lens module is movable integrally with the coil holder 210. The lens may be connected to movers 200 and 300. The lens may be connected to the first mover 200.

[0128] The camera device 3 may include a filter. The filter may include an infrared filter. The infrared filter can block light in the infrared region from entering the image sensor 1010. The infrared filter may be disposed between the lens and the image sensor 1010. For example, the infrared filter may be disposed on a sensor substrate 1015, which is disposed between the lens driving device and the first substrate 1020. As another example, the infrared filter may be disposed on a substrate 430.

[0129] The camera device 3 may include a controller. The controller may be disposed on the first substrate 1020. The controller can independently control the direction, intensity, and amplitude of the current supplied to the first coil 422, the second coil 1040, and the third coil 220 of the lens driving device. The controller can perform autofocus and / or image stabilization functions by controlling the lens driving device. In addition, the controller can perform autofocus feedback control and / or image stabilization feedback control on the lens driving device.

[0130] Figure 8 It is a plan view showing the structure related to the image sensor displacement of the camera device according to a variant of the second embodiment, and is a conceptual diagram.

[0131] In a variant embodiment, compared to the second embodiment, the positions of the second coil 1040, the second magnet 1050, and the connecting member 1033 of the second substrate 1030 can be changed. In the variant embodiment, the second coil 1040 may include: a 2-3 coil 1041-1, arranged along the first axis of the image sensor 1010; and a 2-4 coil 1042-1, arranged along the second axis of the image sensor 1010. In this case, the first axis and the second axis can be perpendicular to each other. The 2-3 coil 1041-1 and the 2-4 coil 1042-1 can be non-overlapping with the connecting member 1033 of the second substrate 1030 in the vertical direction. That is, in the variant example, the connecting member 1033 of the second coil 1040 and the second substrate 1030 can be configured to not interfere with each other. In a variant embodiment, the second magnet 1050 may include a 2-3 magnet 1051-1 facing the 2-3 coil 1041-1 and a 2-4 magnet 1052-1 facing the 2-4 coil 1042-1.

[0132] Figure 9 It is a plan view showing the construction related to the image sensor displacement of a camera device according to another variant of the second embodiment, and is a conceptual diagram.

[0133] In another variant embodiment, the positions of the second coil 1040 and the second magnet 1050 can be changed compared to the second embodiment. In another variant, the second coil 1040 and the second magnet 1050 can be disposed on the corner side of the image sensor 1010. In the second embodiment and the previous variant embodiments, the second coil 1040 and the second magnet 1050 are different from the second coil and the second magnet disposed on the side surface of the image sensor 1010. In another variant embodiment, the second coil 1040 may include a 2-5 coil 1041-2 disposed along a first axial direction and a 2-6 coil 1042-2 disposed along a second axial direction of the image sensor 1010, the first axial direction being the diagonal direction of the image sensor 1010. In this case, the first axis and the second axis can be perpendicular to each other. The 2-5 coil 1041-2 and the 2-6 coil 1042-2 can overlap non-vertically with the connecting member 1033 of the second substrate 1030. That is, in another variant embodiment, the connection member 1033 of the second coil 1040 and the second substrate 1030 can be configured not to interfere with each other. In another variant embodiment, the second magnet 1050 may include a 2-5 magnet facing the 2-5 coil 1041-2 and a 2-6 magnet facing the 2-6 coil 1042-2.

[0134] In the following description, the structure of the lens driving device according to this embodiment will be described with reference to the accompanying drawings.

[0135] Figure 10 This is a perspective view of the lens driving device according to this embodiment; Figure 11 From Figure 10 A cross-sectional view viewed in the XY directions; Figure 12 This is an exploded perspective view of the lens driving device according to this embodiment; Figure 13 From Figure 12 Exploded perspective view of the lens driving device according to this embodiment, viewed from different directions; Figure 14 This is an exploded perspective view showing the first mover and related structures according to this embodiment; Figure 15 This is an exploded perspective view of the second mover according to this embodiment; Figure 16 This is an exploded perspective view of the stator according to this embodiment; Figure 17 This is an exploded perspective view showing the elastic member, support member, and related structures according to this embodiment; Figure 18 This is a plan view of the lens driving device according to this embodiment without the cover.

[0136] The lens driving device can be a voice coil motor (VCM). It can also be a lens drive motor, a lens drive actuator, an AF module, or an OIS module. In this embodiment, the OIS module, capable of performing both AF and OIS driving, is described with reference to the accompanying drawings. However, in a variant embodiment, the lens driving device can be replaced by an AF module capable only of AF driving.

[0137] In another variant embodiment, the lens driving device may be of the fixed focal length (FF) type, which is fixed such that the lens does not move along the optical axis.

[0138] The lens driving device may include a cover 100. The cover 100 may be a "cover can". The cover 100 may be disposed outside the housing 310. The cover 100 may be attached to the substrate 430. The cover 100 may house the housing 310 within it. The cover 100 may form the appearance of the lens driving device. The cover 100 may be a hexahedral shape with an open lower surface. The cover 100 may be made of a non-magnetic material. The cover 100 may be formed of a metallic material. The cover 100 may be formed of a metal plate. The cover 100 may be connected to the grounding portion of the first substrate 20. Thus, the cover 100 may be grounded. The cover 100 may block electromagnetic interference (EMI). In this case, the cover 100 may be referred to as an "EMI shielding can".

[0139] The cover 100 may include an upper plate 110 and a side plate 120. The cover 100 may include: an upper plate 110 including a hole 111; and a side plate 120 extending downward from the outer circumference or edge of the upper plate 110. The lower end of the side plate 120 of the cover 100 may be disposed on a step 434 of the base 430. The inner surface of the side plate 120 of the cover 100 may be fixed to the base 430 by an adhesive.

[0140] The upper plate 110 of the cover 100 may include a hole 111. The hole 111 may include an "opening". The hole 111 may be formed in the upper plate 110 of the cover 100. When viewed from above, a lens can be seen through the hole 111. The hole 111 may be formed to a size and shape corresponding to the lens. The size of the hole 111 may be larger than the diameter of the lens module, allowing the lens module to be inserted and assembled through the hole 111. Light introduced through the hole 111 can pass through the lens. At this point, the light that has passed through the lens can be converted into an electrical signal by the image sensor 10 and acquired as an image.

[0141] The lens driving device may include movers 200 and 300. Movers 200 and 300 may be components that move when an electric current is applied to the lens driving device. Movers 200 and 300 may include a first mover 200 and a second mover 300.

[0142] The lens driving device may include a first mover 200. The first mover 200 may be coupled to the lens. The first mover 200 may be coupled to a second mover 300 via an elastic member 500. The first mover 200 may move through interaction with the second mover 300. At this time, the first mover 200 may move integrally with the lens. Simultaneously, the first mover 200 may move during AF driving. At this time, the first mover 200 may be referred to as the "AF mover". However, even during OIS driving, the first mover 200 may move together with the second mover 300.

[0143] The first mover 200 may include a coil holder 210. The coil holder 210 may be disposed inside the housing 310. The coil holder 210 may be disposed in a hole 311 in the housing 310. The coil holder 210 may be movably coupled to the housing 310. The coil holder 210 may be movable relative to the housing 310 along the optical axis. A lens may be coupled to the coil holder 210. The coil holder 210 and the lens may be coupled by threaded connection and / or adhesive. A third coil 220 may be coupled to the coil holder 210. A first elastic member 510 may be coupled to the upper surface of the coil holder 210. A second elastic member 520 may be coupled to the lower surface of the coil holder 210. The coil holder 210 may be coupled to the elastic member 500 by heat fusion and / or adhesive. The adhesive that bonds the coil holder 210 and the lens, and the coil holder 210 and the elastic member 500, may be an epoxy resin cured by at least one of ultraviolet (UV), heat, and laser.

[0144] The coil holder 210 may include a hole 211. The hole 211 may penetrate the coil holder 210 along the optical axis. The lens module may be accommodated in the hole 211. For example, a thread corresponding to a thread formed on the outer peripheral surface of the lens module may be provided on the inner peripheral surface of the coil holder 210 forming the hole 211.

[0145] The coil holder 210 may include a drive component connecting member 212. A third coil 220 may be connected to the drive component connecting member 212. The drive component connecting member 212 may be formed on the outer peripheral surface of the coil holder 210. The drive component connecting member 212 may include a groove formed by recessing a portion of the outer surface of the coil holder 210. The third coil 220 may be received in the groove of the drive component connecting member 212. The drive component connecting member 212 may include a protrusion supporting the lower surface of the third coil 220.

[0146] The first mover 200 may include a third coil 220. The third coil 220 may be an "AF drive coil" for AF driving. The third coil 220 may be disposed on a coil holder 210. The third coil 220 may be disposed between the coil holder 210 and the housing 310. The third coil 220 may be disposed on the outer surface or outer peripheral surface of the coil holder 210. The third coil 220 may be directly wound on the coil holder 210. Alternatively, the third coil 220 may be connected to the coil holder 210 while being directly wound. The third coil 220 may face the first magnet 320. The third coil 220 may be configured to face the first magnet 320. The third coil 220 may electromagnetically interact with the first magnet 320. In this case, when current is applied to the third coil 220 and an electromagnetic field is formed around the third coil 220, the third coil 220 may move relative to the first magnet 320 through the electromagnetic interaction between the third coil 220 and the first magnet 320. The third coil 220 may be formed as a single coil. Alternatively, the third coil 220 may include multiple coils spaced apart from each other.

[0147] The third coil 220 may include a pair of leads for power supply. In this case, one end (lead) of the third coil 220 is connected to the 1-5 elastic member 505, and the other end (lead) of the third coil 220 may be connected to the 1-6 elastic member 506. That is, the third coil 220 may be electrically connected to the first elastic member 510. More specifically, the third coil 220 may receive power sequentially through the first substrate 20, substrate 410, support member 600, and first elastic member 510. As a variant embodiment, the third coil 220 may be electrically connected to the second elastic member 520.

[0148] The lens driving device may include a second mover 300. The second mover 300 is movably connected to the stator 400 via a support member 600. The second mover 300 may support the first mover 200 via an elastic member 500. The second mover 300 may move the first mover 200, or may move together with the first mover 200. The second mover 300 may move through interaction with the stator 400. The second mover 300 may move during OIS driving. In this case, the second mover 300 may be referred to as the "OIS mover". During OIS driving, the second mover 300 may move integrally with the first mover 200.

[0149] The second mover 300 may include a housing 310. The housing 310 may be disposed outside the coil holder 210. The housing 310 may accommodate at least a portion of the coil holder 210. The housing 310 may be disposed inside the cover 100. The housing 310 may be disposed between the cover 100 and the coil holder 210. The housing 310 may be formed of a material different from that of the cover 100. The housing 310 may be formed of an insulating material. The housing 310 may be formed by injection molding. The outer surface of the housing 310 may be spaced apart from the inner surface of the side plate 120 of the cover 100. The housing 310 may be movable through the space between the housing 310 and the cover 100 for OIS actuation. A first magnet 320 may be disposed within the housing 310. The housing 310 and the first magnet 320 may be joined by an adhesive. A first elastic member 510 may be attached to the upper surface of the housing 310. A second elastic member 520 may be attached to the lower surface of the housing 310. The housing 310 may be joined to the elastic member 500 by heat fusion and / or adhesive. The adhesive used to join the housing 310 and the first magnet 320, as well as the housing 310 and the elastic member 500, may be an epoxy resin cured by at least one of ultraviolet (UV), heat, and laser.

[0150] The housing 310 may include four side portions 310a and four corner portions 310b disposed between the four side portions 310a. The side portions 310a of the housing 310 may include a first side portion, a second side portion disposed opposite to the first side portion, and a third side portion and a fourth side portion disposed opposite to each other between the first and second side portions. The corner portions 310b of the housing 310 may include a first corner portion disposed between the first and third side portions, a second corner portion disposed between the first and fourth side portions, a third corner portion disposed between the second and third side portions, and a fourth corner portion disposed between the second and fourth side portions. The side portions 310a of the housing 310 may include "sidewalls".

[0151] The housing 310 may include a hole 311. The hole 311 may be formed in the housing 310. The hole 311 may be formed to penetrate the housing 310 along the optical axis. The coil holder 210 may be disposed in the hole 311. The hole 311 may be formed to at least partially correspond to the shape of the coil holder 210. The inner peripheral surface or inner side surface of the housing 310 forming the hole 311 may be positioned spaced apart from the outer peripheral surface of the coil holder 210. However, the housing 310 and the coil holder 210 at least partially overlap each other along the optical axis to limit the travel distance of the coil holder 210 along the optical axis.

[0152] The housing 310 may include a drive component coupling member 312. A first magnet 320 may be coupled to the drive component coupling member 312. The drive component coupling member 312 may include a groove formed by recessing a portion of the inner peripheral surface and / or lower surface of the housing 310. The drive component coupling member 312 may be formed on each of the four sides 310a of the housing 310. As a variant embodiment, the drive component coupling member 312 may be formed in each of the four corner portions 310b of the housing 310.

[0153] The second mover 300 may include a first magnet 320. The first magnet 320 may be disposed within the housing 310. The first magnet 320 may be fixed to the housing 310 by adhesive. The first magnet 320 may be disposed between the coil holder 210 and the housing 310. The first magnet 320 may face the third coil 220. The first magnet 320 may electromagnetically interact with the third coil 220. The first magnet 320 may face the first coil 422. The first magnet 320 may electromagnetically interact with the first coil 422. The first magnet 320 may be used for both AF drive and OIS drive. The first magnet 320 may be disposed on the side 310a of the housing 310. In this case, the first magnet 320 may be a flat magnet with a flat plate shape. As a variant embodiment, the first magnet 320 may be disposed at a corner of the housing 310. In this case, the first magnet 320 may be a corner magnet with a hexahedral shape, where the inner surface is wider than the outer surface.

[0154] The lens driving device may include a stator 400. The stator 400 may be disposed on one side of the movers 200 and 300. The stator 400 may be disposed below the movers 200 and 300. The stator 400 may movably support the second mover 300. The stator 400 may move the second mover 300. At this time, the first mover 200 may also move together with the second mover 300.

[0155] Stator 400 may include substrate 410. Substrate 410 may include circuit components 420. However, substrate 410 may be described as a separate component as circuit component 420. Substrate 410 may include a first coil 422 facing the first magnet 320. Substrate 410 may be disposed on substrate 430. Substrate 410 may be disposed between housing 310 and substrate 430. Support member 600 may be coupled to substrate 410. Substrate 410 may supply power to the first coil 422. Substrate 410 may be coupled to circuit component 420. Substrate 410 may be coupled to the first coil 422. Substrate 410 may be coupled to a first substrate 20 disposed below substrate 430. Substrate 410 may include a flexible printed circuit board (FPCB). Substrate 410 may be partially bent.

[0156] The substrate 410 may include a main body portion 411. The substrate 410 may include a hole 411a formed in the main body portion 411. The substrate 410 may include a hole 411a corresponding to a lens connected to the coil holder 210.

[0157] The substrate 410 may include a terminal portion 412. The terminal portion 412 may extend downward from the main body portion 411 of the substrate 410. The terminal portion 412 may be formed by bending a portion of the substrate 410. At least a portion of the terminal portion 412 may be exposed to the outside. The terminal portion 412 may be soldered to a first substrate 20 disposed below the base 430. The terminal portion 412 may be disposed on a terminal receiving portion 433 of the base 430. The terminal portion 412 may include a plurality of terminals.

[0158] The stator 400 may include a circuit component 420. The circuit component 420 may be disposed on the substrate 430. The circuit component 420 may be disposed on the base plate 410. The circuit component 420 may be disposed between the first magnet 320 and the substrate 430. Here, although the circuit component 420 is described as a configuration separate from the base plate 410, the circuit component 420 can be understood as a configuration included in the base plate 410.

[0159] The circuit component 420 may include a substrate portion 421. The substrate portion 421 may include a "substrate". The substrate portion 421 may be an FPCB. The first coil 422 may be integrally formed on the substrate 421 as a fine patterned coil (FP coil). A hole through which the support member 600 passes may be formed in the substrate portion 421. The substrate portion 421 may include a hole 421a. The hole 421a of the substrate portion 421 may be configured to correspond to the hole 411a of the substrate 410.

[0160] The circuit component 420 may include a first coil 422. The first coil 422 may face the first magnet 320. The first coil 422 may interact electromagnetically with the first magnet 320. In this case, when a current is applied to the first coil 422 and a magnetic field is formed around the first coil 422, the first magnet 320 can move relative to the first coil 422 through the electromagnetic interaction between the first coil 422 and the first magnet 320. The first coil 422 can cause the housing 310 and the coil holder 210 to move relative to the substrate 430 in a direction perpendicular to the optical axis through the electromagnetic interaction with the first magnet 320. The first coil 422 may be a finely patterned coil (FP coil) integrally formed on the substrate portion 421.

[0161] The stator 400 may include a base 430. The base 430 may be disposed below the housing 310. The base 430 may be disposed below the substrate 410. The substrate 410 may be disposed on the upper surface of the base 430. The base 430 may be connected to the cover 100. The base 430 may be disposed on the first substrate 20.

[0162] The substrate 430 may include a hole 431. The hole 431 may be formed in the substrate 430. The hole 431 may be formed to penetrate the substrate 430 along the optical axis. Light passing through the lens module through the hole 431 can be incident on the image sensor 10. That is, light passing through the lens module can pass through the hole 421a of the circuit member 420, the hole 411a of the substrate 410, and the hole 431 of the substrate 430 to be incident on the image sensor 10.

[0163] The substrate 430 may include a sensor coupling member 432. A second sensor 900 may be disposed on the sensor coupling member 432. The sensor coupling member 432 may accommodate at least a portion of the second sensor 900. The sensor coupling member 432 may include a groove formed by recessing the upper surface of the substrate 430. The sensor coupling member 432 may include two grooves. In this case, the second sensor 900 is disposed in each of the two grooves to detect movement of the first magnet 320 along the X-axis and Y-axis directions.

[0164] The substrate 430 may include a terminal receiving portion 433. A terminal portion 412 of the substrate 410 may be disposed in the terminal receiving portion 433. The terminal receiving portion 433 may include a groove formed by recessing a portion of the side surface of the substrate 430. The width of the terminal receiving portion 433 may be formed to correspond to the width of the terminal portion 412 of the substrate 410. The length of the terminal receiving portion 433 may be formed to correspond to the length of the terminal portion 412 of the substrate 410. Alternatively, since the length of the terminal portion 412 of the substrate 410 is longer than the length of the terminal receiving portion 433, a portion of the terminal portion 412 may protrude below the substrate 430.

[0165] The base 430 may include a step 434. The step 434 may be formed on a side surface of the base 430. The step 434 may be formed around the outer peripheral surface of the base 430. The step 434 may be formed when a portion of the side surface of the base 430 protrudes or is recessed. The lower end of the side plate 120 of the cover 100 may be disposed in the step 434.

[0166] The lens driving device may include an elastic member 500. The elastic member 500 may connect the housing 310 and the coil holder 210. The elastic member 500 may be coupled to the coil holder 210 and the housing 310. The elastic member 500 may elastically support the coil holder 210. The elastic member 500 may be at least partially elastic. The elastic member 500 may movably support the coil holder 210. The elastic member 500 may support the movement of the coil holder 210 during AF driving. In this case, the elastic member 500 may be referred to as an "AF support member".

[0167] The elastic member 500 may include a first elastic member 510. The first elastic member 510 may be connected to the upper part of the coil holder 210 and the upper part of the housing 310. The first elastic member 510 may be connected to the upper surface of the coil holder 210. The first elastic member 510 may be connected to the upper surface of the housing 310. The first elastic member 510 may be connected to the support member 600. The first elastic member 510 may be formed of a leaf spring.

[0168] The first elastic member 510 may include elastic members 501, 502, 503, 504, 505, and 506 spaced apart from each other. The first elastic member 510 can be used as a conductor to supply power to the first sensor 710. The first elastic member 510 may include elastic members 501, 502, 503, and 504 spaced apart from each other. Each of the elastic members 501, 502, 503, and 504 can be connected to a substrate 720 connected to the first sensor 710. The first elastic member 510 and the substrate 720 can be joined by soldering. The first elastic member 510 can be used as a conductor to supply power to the third coil 220. The first elastic member 510 may include elastic members 505 and 506 spaced apart from each other. Elastic member 505 can be connected to one end of the third coil 220, and elastic member 506 can be connected to the other end of the third coil 220. The first elastic member 510 and the third coil 220 can be connected by welding.

[0169] The first elastic member 510 may include an outer portion 511. The outer portion 511 may be coupled to the housing 310. The outer portion 511 may be coupled to the upper surface of the housing 310. The outer portion 511 may include a hole or groove for engaging with a protrusion of the housing 310. The outer portion 511 may be secured to the housing 310 by an adhesive.

[0170] The first elastic member 510 may include an inner portion 512. The inner portion 512 may be coupled to the coil holder 210. The inner portion 512 may be coupled to the upper surface of the coil holder 210. The inner portion 512 may include a hole or groove that engages with a protrusion of the coil holder 210. The inner portion 512 may be fixed to the coil holder 210 by adhesive.

[0171] The first elastic member 510 may include a connecting member 513. The connecting member 513 may connect the outer portion 511 and the inner portion 512. The connecting member 513 may be elastic. In this case, the connecting member 513 may be referred to as an "elastic member". The connecting member 513 may be formed by being bent two or more times.

[0172] The first elastic member 510 may include a connecting member 514. The connecting member 514 may be connected to the support member 600. The connecting member 514 may be connected to the support member 600 by welding. The connecting member 514 may include a hole or groove for connecting with the support member 600. The connecting member 514 may extend from the outer side portion 511. The connecting member 514 may include a bent portion formed by bending.

[0173] The elastic member 500 may include a second elastic member 520. The second elastic member 520 may be disposed below the coil holder 210. The second elastic member 520 may be connected to the coil holder 210 and the housing 310. The second elastic member 520 may be connected to the lower surface of the coil holder 210. The second elastic member 520 may be formed of a leaf spring. The second elastic member 520 may be integrally formed.

[0174] The second elastic member 520 may include an outer portion 521. The outer portion 521 may be coupled to the housing 310. The outer portion 521 may be coupled to the lower surface of the housing 310. The outer portion 521 may include a hole or groove for engaging with a protrusion of the housing 310. The outer portion 521 may be secured to the housing 310 by an adhesive.

[0175] The second elastic member 520 may include an inner portion 522. The inner portion 522 may be coupled to the coil holder 210. The inner portion 522 may be coupled to the lower surface of the coil holder 210. The inner portion 522 may include a protruding hole or groove that engages with the coil holder 210. The inner portion 522 may be secured to the coil holder 210 by adhesive.

[0176] The second elastic member 520 may include a connecting member 523. The connecting member 523 may connect the outer portion 521 and the inner portion 522. The connecting member 523 may elastically connect the outer portion 521 and the inner portion 522. The connecting member 523 may be elastic. In this case, the connecting member 523 may be referred to as an "elastic member". The connecting member 523 may be formed by being bent two or more times.

[0177] The lens driving device may include a support member 600. The support member 600 may connect movers 200 and 300 and stator 400. The support member 600 may be coupled to a first elastic member 510 and a substrate 410. The support member 600 may be coupled to a circuit member 420 of the first elastic member 510 and the substrate 410. The support member 600 may movably support the housing 310. The support member 600 may elastically support the housing 310. The support member 600 may be at least partially elastic. The support member 600 may support the movement of the housing 310 and the coil holder 210 during OIS driving. In this case, the support member 600 may be referred to as an "OIS support member". The support member 600 may include an elastic member. The support member 600 may be formed of wire. As a variant embodiment, the support member 600 may be formed of a leaf spring.

[0178] The support member 600 may include multiple wires. The support member 600 may include six wires spaced apart from each other. The support member 600 may include first to sixth support portions 601, 602, 603, 604, 605, and 606 spaced apart from each other. The first to sixth support portions 601, 602, 603, 604, 605, and 606 can serve as wires located inside the lens driving device. The first to sixth support portions 601, 602, 603, 604, 605, and 606 can be connected to the substrate 410. The first support portion 601 can be connected to the 1-1 elastic member 501. The second support portion 602 can be connected to the 1-2 elastic member 502. The third support portion 603 can be connected to the 1-3 elastic member 503. The fourth support portion 604 can be connected to the 1-4 elastic member 504. The fifth support portion 605 can be connected to the 1-5 elastic member 505. The sixth support 606 can be connected to the 1-6 elastic members 506.

[0179] The lens driving device may include a damper (not shown). The damper may be disposed on the support member 600. The damper may be disposed on both the support member 600 and the housing 310. The damper may be disposed on the elastic member 500. The damper may be disposed on the elastic member 500 and the coil frame and / or the elastic member 500 and the housing 310. The damper may be disposed on the elastic member 500 and / or the support member 600 to prevent resonance in the elastic member 500 and / or the support member 600.

[0180] The lens driving device may include a first sensor unit 700. The first sensor unit 700 may be provided for autofocus feedback. The first sensor unit 700 may detect the movement of the coil holder 210 along the optical axis. The first sensor unit 700 may detect the amount of movement of the coil holder 210 along the optical axis and provide it to the controller in real time.

[0181] The lens driving device may include a first sensor 710. The first sensor 710 can be used for AF feedback driving. In this case, the first sensor 710 may be referred to as an "AF feedback driving sensor". The first sensor 710 may be disposed in the housing 310. In a variant embodiment, the first sensor 710 may be disposed on the coil holder 210. The first sensor 710 can detect the movement of the first mover 200. The first sensor 710 may include a Hall sensor. In this case, the Hall sensor can sense the magnetic force of the third magnet 730 to detect the movement of the coil holder 210 and the lens. The detection value sensed by the first sensor 710 can be used for AF feedback control.

[0182] The lens driving device may include a substrate 720. The substrate 720 may be disposed within the housing 310. The substrate 720 may be coupled to a first sensor 710. The substrate 720 may be electrically connected to the first sensor 710. The substrate 720 may be coupled to a first elastic member 510. The substrate 720 may include four terminals coupled to elastic members 501, 502, 503, and 504 (1-1 to 1-4). The substrate 720 and the first elastic member 510 may be joined by soldering.

[0183] The lens driving device may include a third magnet 730. The third magnet 730 may be a "sensing magnet." The third magnet 730 may be disposed on the coil holder 210. The third magnet 730 may be detected by the first sensor 710. The third magnet 730 may face the first sensor 710. The third magnet 730 may be disposed at a corner of the coil holder 210. That is, the third magnet 730 may be positioned facing the corner 310b of the housing 310.

[0184] The lens driving device may include a fourth magnet 800. The fourth magnet 800 may be a "compensating magnet". The fourth magnet 800 may be disposed on the coil holder 210. The fourth magnet 800 may be configured to achieve magnetic force balance with the third magnet 730. The fourth magnet 800 may be symmetrical to the third magnet 730, which is centered about the optical axis. The fourth magnet 800 may be disposed at a position corresponding to the third magnet 730, which is centered about the optical axis. The fourth magnet 800 may have a size and / or shape corresponding to the third magnet 730, which is centered about the optical axis. The third magnet 730 may be disposed on one side of the coil holder 210, and the fourth magnet 800 may be disposed on the other side of the coil holder 210. The fourth magnet 800 may be disposed at a corner of the coil holder 210. That is, the fourth magnet 800 may be disposed at the corner 310b facing the housing 310.

[0185] The lens driving device may include a second sensor 900. The second sensor 900 can be used for OIS feedback control. In this case, the second sensor 900 can be referred to as a "sensor for driving OIS feedback". The second sensor 900 can be disposed between the substrate 430 and the base plate 410. The second sensor 900 can detect the movement of the second mover 300. The second sensor 900 may include a Hall sensor. In this case, the Hall sensor can sense the magnetic force of the first magnet 320 to detect the movement of the housing 310 and the first magnet 320. The detected value sensed by the second sensor 900 can be used for OIS feedback control.

[0186] The operation of the camera device according to this embodiment will be described below.

[0187] The autofocus function of the camera device according to this embodiment will be described. When power is supplied to the third coil 220, the third coil 220 moves relative to the first magnet 320 due to the electromagnetic interaction between the third coil 220 and the first magnet 320. At this time, the coil holder 210 connected to the third coil 220 moves integrally with the third coil 220. That is, the coil holder 210 connected to the lens module moves relative to the housing 310 along the optical axis. Since this movement of the coil holder 210 causes the lens module to move closer to or further away from the image sensors 10 and 1010, in this embodiment, powering the third coil 220 enables focus adjustment to be performed on the object. At the same time, the aforementioned focus adjustment can be automatically performed according to the distance to the object.

[0188] In the camera device according to this embodiment, focus feedback control can be performed to achieve a more precise autofocus function. A first sensor 710 disposed in the housing 310 senses the magnetic field of a third magnet 730 disposed in the coil holder 210. Therefore, when the coil holder 210 performs relative movement relative to the housing 310, the amount of magnetic field sensed by the first sensor 710 changes. In this way, the first sensor 710 detects the amount of movement of the coil holder 210 along the optical axis or the position of the coil holder 210, and transmits the detected value to the controller. The controller determines whether to perform additional movement of the coil holder 210 based on the received detection value. Since this process occurs in real time, the autofocus function of the camera device according to this embodiment can be performed more precisely through autofocus feedback control.

[0189] The image stabilization function of the camera device according to this embodiment will be described. When power is supplied to the first coil 422, the first magnet 320 moves relative to the first coil 422 due to the electromagnetic interaction between the first coil 422 and the first magnet 320. At this time, the housing 310 connected to the first magnet 320 moves integrally with the first magnet 320. That is, the housing 310 moves horizontally (perpendicular to the optical axis) relative to the substrate 430. However, this may cause the housing 310 to tilt relative to the substrate 430. Simultaneously, the horizontal movement of the coil holder 210 relative to the housing 310 moves integrally with the housing 310. Therefore, this movement of the housing 310 causes the lens module connected to the coil holder 210 to move relative to the image sensors 10 and 1010 in a direction parallel to the direction in which the image sensors 10 and 1010 are placed. That is, in this embodiment, the image stabilization function can be performed by supplying power to the first coil 422.

[0190] In the camera device according to this embodiment, image stabilization feedback control can be performed to achieve image stabilization more accurately. A second sensor 900 disposed on the substrate 430 senses the magnetic field of a first magnet 320 disposed on the housing 310. Therefore, when the housing 310 moves relative to the substrate 430, the amount of magnetic field detected by the second sensor 900 changes. The pair of second sensors 900 detect the amount or position of the housing 310 along the horizontal direction (X-axis and Y-axis directions) in this way and transmit the detected values ​​to the controller. The controller determines whether to perform additional movement of the housing 310 based on the received detection values. Since this process occurs in real time, the image stabilization function of the camera device according to this embodiment can be performed more accurately through image stabilization feedback control.

[0191] In the above description, all components constituting the embodiments of the present invention are described as combinations or combined operations; however, the present invention is not necessarily limited to the above embodiments. In other words, within the scope of the present invention, all components can be selectively combined with one or more components. Furthermore, unless described to the contrary, the terms "comprising," "including," or "having" above mean that they can be embedded in the corresponding components; therefore, it should be understood that other components may be included in addition to those corresponding components. Unless otherwise defined, all terms (including technical and scientific terms) have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. Unless explicitly defined to the contrary, general terms such as predefined terms should be interpreted as consistent with the meaning in the context of the relevant art and should not be interpreted in an ideal or overly formal sense.

[0192] The above description illustrates the technical concept of the present invention by way of example only. Those skilled in the art will understand that various modifications and variations can be made without departing from the basic characteristics of the invention. Therefore, the embodiments disclosed in this invention are not intended to limit the technical concept of the invention but rather to describe it, and the scope of the technical concept of the invention is not limited to these embodiments. The scope of protection of this invention should be interpreted by the appended claims, and all technical concepts within the equivalent scope should be interpreted as being included within the scope of this invention.

Claims

1. A camera device, comprising: First substrate; The second substrate is movable relative to the first substrate; An image sensor, configured to move together with the second substrate; The second coil and the second magnet are configured to move the second substrate in a direction perpendicular to the optical axis through electromagnetic interaction; The ball can move to support the second substrate; as well as The third substrate connects the first substrate and the second substrate. Wherein, at least a portion of the third substrate is flexible, and The third substrate is electrically connected to the first substrate and the image sensor.

2. The camera device according to claim 1, wherein, At least a portion of the third substrate is flexible to allow the second substrate to move relative to the first substrate.

3. The camera device of claim 1, comprising a groove for receiving at least a portion of the sphere. in, The groove is formed such that the ball disposed in the groove does not separate from the groove.

4. The camera device according to claim 3, wherein, The groove is formed on the upper surface of the first substrate.

5. The camera device according to claim 3, comprising three balls, the three balls including the balls and disposed in the groove.

6. The camera device according to claim 3, wherein, The groove is formed to have a width greater than the diameter of the sphere.

7. The camera device according to claim 1, comprising: A coil frame configured to move along the optical axis; The third coil is mounted on the coil frame; The first magnet faces the third coil; as well as The lens is connected to the coil frame. The lens is configured to move along the optical axis via the electromagnetic interaction between the third coil and the first magnet.

8. The camera device according to claim 7, comprising: The third magnet is located at the corner of the coil frame; as well as The first sensor is configured to sense the third magnet.

9. The camera device according to claim 7, comprising: A housing, in which the first magnet is disposed; as well as An elastic member is attached to the upper surface of the coil frame and the upper surface of the housing.

10. The camera device according to claim 1, wherein, The third substrate is electrically connected to the image sensor and the first substrate while being bent or unfolded.

11. The camera device according to claim 1, wherein, The second substrate is a rigid substrate.

12. The camera device according to claim 11, wherein, The second substrate and the third substrate are integrally formed rigid-flexible printed circuit boards.

13. The camera device according to claim 1, wherein, The first substrate includes holes, and The image sensor at least partially overlaps with the hole in the first substrate in the optical axis direction.

14. The camera device according to claim 1, wherein, The second coil is disposed on the first substrate and overlaps with the sphere in the optical axis direction, and The second magnet is disposed on the upper surface of the second substrate and overlaps with the second coil in the optical axis direction.

15. A camera device, comprising: First substrate; The second substrate is movable relative to the first substrate; An image sensor, configured to move together with the second substrate; The ball can move to support the second substrate; A third substrate includes a flexible portion, the third substrate physically connecting the first substrate and the second substrate and electrically connecting the image sensor to the first substrate; as well as The second coil and the second magnet are configured to generate an electromagnetic force to move the second substrate and the image sensor together in a direction perpendicular to the optical axis. The flexible portion of the third substrate is configured to bend in response to movement of the second substrate relative to the first substrate.

16. The camera device of claim 15, comprising a groove for receiving at least a portion of the sphere. in, The groove is formed such that the ball disposed in the groove does not separate from the groove.

17. The camera device of claim 16, comprising three balls, the three balls including the balls and disposed in the groove.

18. The camera device according to claim 16, wherein, The groove is formed to have a width greater than the diameter of the sphere.

19. An optical instrument, comprising: main body; The camera device according to any one of claims 1 to 18 is disposed on the main body; as well as A display is disposed on the main body and configured to output images captured by the camera device.

20. A camera device, comprising: First substrate; The second substrate is movable relative to the first substrate; An image sensor, configured to move together with the second substrate; as well as The second coil and the second magnet are configured to move the second substrate in a direction perpendicular to the optical axis through electromagnetic interaction.

21. A lens driving device, comprising: The stator includes a base and a first coil; A housing is disposed on the stator; The coil frame is disposed within the housing; The third coil is mounted on the coil frame; A first magnet is disposed on the housing; The first elastic member is connected to the upper part of the housing and the upper part of the coil frame; A supporting member is connected to the first elastic member and the stator; A third magnet is mounted on the coil frame; A substrate is disposed in the corner area of ​​the housing; as well as A first sensor is disposed on the substrate and configured to sense the third magnet. The supporting member includes a first supporting part to a sixth supporting part. The shell includes a first corner region and a third corner region opposite to each other, and a second corner region and a fourth corner region opposite to each other. The first support portion is located in the first corner area. The second support portion and the third support portion are disposed on the second corner area. The fourth support portion is disposed on the third corner area, and The fifth support and the sixth support are located in the fourth corner area.

Images