Microphone and smart wearable device

Abstract

The application discloses a microphone and a smart wearable device, and relates to the technical field of microphones. The microphone comprises an ASIC chip, a substrate, and first and second sub-housings which are respectively arranged on the substrate. The substrate and the second sub-housing cooperate to form a containing cavity. The second sub-housing is arranged in the first sub-housing, and the first sub-housing and the second sub-housing are partially attached. The second sub-housing, the first sub-housing, and the substrate cooperate to form a cavity. A MEMS chip which is signal-connected with the ASIC chip is arranged in the containing cavity. The substrate is provided with a sound hole corresponding to the position of the MEMS. The substrate is provided with a sound leakage channel which is communicated with the sound hole and the cavity. The microphone has two air flow paths. One of the air flow paths is: external air - sound hole - containing cavity. The other air flow path is: external air - sound hole - sound leakage channel - cavity. The microphone has the advantages that the sensitivity and the signal-to-noise ratio of the microphone can be improved.

Description

Technical Field

[0001] This invention relates to the field of microphone technology, and in particular to a microphone and a smart wearable device. Background Technology

[0002] Directional microphones are widely used in voice pickup, conference communication, and intelligent interaction, but existing solutions have significant shortcomings in terms of sensitivity and signal-to-noise ratio (SNR). Directional microphones based on the differential principle exhibit a high-pass frequency response, leading to a significant decrease in low-frequency sensitivity. Simultaneously, low-frequency noise is amplified considerably, deteriorating the overall system SNR. This makes it difficult for existing directional microphones to effectively pick up target signals in low SNR environments, limiting their pickup quality and application effectiveness.

[0003] Therefore, it is necessary to provide a new microphone and smart wearable device to solve the above-mentioned technical problems. Summary of the Invention

[0004] The main objective of this invention is to provide a microphone and a smart wearable device that aims to improve the technical problems of poor microphone sensitivity and signal-to-noise ratio in the prior art.

[0005] To achieve the above objectives, according to some embodiments of the present invention, a microphone is provided, comprising an ASIC chip, a substrate, and a first sub-shell and a second sub-shell respectively disposed on the substrate. The substrate and the second sub-shell cooperate to form a receiving cavity. The second sub-shell is disposed within the first sub-shell, and the first sub-shell and the second sub-shell are partially attached to each other. The second sub-shell, the first sub-shell, and the substrate cooperate to form a cavity. A MEMS chip that is signal-connected to the ASIC chip is disposed within the receiving cavity. A sound hole is disposed on the substrate corresponding to the position of the MEMS chip. The substrate is provided with a sound leakage channel, which connects the sound hole and the cavity. The microphone has two airflow paths, one of which is: outside air—sound hole—accommodating cavity; the other is: outside air—sound hole—sound leakage channel—cavity.

[0006] In some embodiments, the first sub-shell has a first sub-hole, the second sub-shell has a second sub-hole, and the first sub-hole and the second sub-hole communicate to form an air inlet.

[0007] In some embodiments, the first sub-shell includes a first top plate and a first side plate, and the second sub-shell includes a second top plate and a second side plate. The first top plate is provided with a first sub-hole, and the second top plate is provided with a second sub-hole. The first top plate and the second top plate are fitted together to form the air inlet. The second side plate is disposed on one side of the first side plate and fitted together with the first side plate. The receiving cavity and the cavity body are arranged side by side along the extension direction of the substrate.

[0008] In some embodiments, the sound leakage channel is disposed inside the substrate, one end of the sound leakage channel penetrates through the sidewall of the sound hole, and the other end of the sound leakage channel passes through the substrate and communicates with the cavity.

[0009] In some embodiments, the sound leakage channel includes a horizontal channel and a vertical channel that are interconnected, the end of the horizontal channel away from the vertical channel being connected to the sound hole, and the end of the vertical channel away from the horizontal channel being connected to the cavity.

[0010] In some embodiments, the microphone further includes a bonding member, the second sub-shell cooperates with the substrate to form the receiving cavity, the first sub-shell covers the outer periphery of the second sub-shell, the bonding member is bonded to the first sub-shell and the second sub-shell on opposite sides respectively, the first sub-shell, the second sub-shell, the bonding member and the substrate cooperate to form the cavity, the first sub-shell forms a first sub-hole, the second sub-shell forms a second sub-hole, the bonding member forms a through hole, and the first sub-hole, the through hole and the second sub-hole communicate to form the air inlet.

[0011] In some embodiments, the first sub-shell includes a first top plate and a first side plate, the second sub-shell includes a second top plate and a second side plate, the first top plate and the second top plate are respectively attached to both sides of the bonding member, the first top plate is provided with a first sub-hole, the second top plate is provided with a second sub-hole, the second side plate is provided on the side close to the first side plate, and the receiving cavity and the cavity body are arranged side by side along the extension direction of the substrate.

[0012] In some embodiments, a gap is further formed between the first sub-shell and the second sub-shell, and the microphone includes a sealing layer disposed in the gap near the air inlet to isolate the gap from the air inlet.

[0013] In some embodiments, the sound leakage channel is an arc-shaped channel, a wave-shaped channel, or a stepped channel.

[0014] In some embodiments, the substrate includes a first sub-board and a second sub-board. The first sub-board has the acoustic hole formed therein. A first channel structure is provided on the surface of the first sub-board, and a second channel structure is provided on the surface of the second sub-board. The first sub-board and the second sub-board are spliced ​​together so that the first channel structure and the second channel structure cooperate to form the sound leakage channel.

[0015] According to one aspect of the present invention, the present invention also provides a smart wearable device, the smart wearable device including the microphone described above.

[0016] In the above solution, the microphone includes an ASIC chip, a substrate, and a first sub-shell and a second sub-shell respectively covering the substrate. The substrate and the second sub-shell cooperate to form a receiving cavity. The second sub-shell is disposed inside the first sub-shell, and the first sub-shell and the second sub-shell are partially attached. The second sub-shell, the first sub-shell, and the substrate cooperate to form a cavity. A MEMS chip that is signal-connected to the ASIC chip is disposed inside the receiving cavity. A sound hole is disposed on the substrate corresponding to the position of the MEMS chip. The substrate is provided with a sound leakage channel, which connects the sound hole and the cavity. The microphone has two airflow paths, one of which is: outside air—sound hole—receiving cavity; the other airflow path is: outside air—sound hole—sound leakage channel—cavity. This invention has the advantage of improving microphone sensitivity and signal-to-noise ratio. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0018] Figure 1 This is a cross-sectional structural diagram of the microphone according to an embodiment of the present invention; Figure 2 for Figure 1 A partial structural diagram; Figure 3 This is a three-dimensional structural diagram of the microphone according to an embodiment of the present invention; Figure 4 for Figure 3 A schematic diagram of the exploded structure; Figure 5 for Figure 1 Another part of the structural diagram; Figure 6 for Figure 1 Another part of the structural diagram; Figure 7This is a partial structural diagram of the first and second daughter boards of the microphone in an embodiment of the present invention; Figure 8 This is a schematic diagram of another part of the structure of the first and second daughter boards of the microphone in an embodiment of the present invention.

[0019] Explanation of icon numbers: 100. Microphone; 1. Substrate; 101. First sub-board; 102. Second sub-board; 21. First sub-shell; 210. First sub-hole; 211. First top plate; 212. First side plate; 22. Second sub-shell; 220. Second sub-hole; 221. Second top plate; 222. Second side plate; 23. Adhesive component; 3. Receiving cavity; 4. Cavity; 5. Sound leakage channel; 51. Sound leakage hole; 6. Air inlet; 7. Sound hole; 8. MEMS chip; 9. ASIC chip; 10. Gap; 11. Sealing layer.

[0020] The realization of the objective, functional features and advantages of the present invention will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0021] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.

[0022] It should be noted that if the embodiments of the present invention involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a specific posture. If the specific posture changes, the directional indicators will also change accordingly.

[0023] Furthermore, if the embodiments of this invention involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the use of "and / or" or "and / or" throughout the text includes three parallel solutions. For example, "A and / or B" includes solution A, solution B, or a solution where both A and B are satisfied simultaneously. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this invention.

[0024] Currently, judging from market trends, the applications of MEMS microphones are becoming increasingly widespread. MEMS microphones are not only widely used in consumer electronics such as smartphones, tablets, and laptops, but also in smart wearable devices, conferencing communications, voice pickup, and intelligent interaction. As the application areas of MEMS microphones continue to expand, the market demand is also constantly increasing.

[0025] The applicant noted that although directional microphones can achieve directional sound pickup, their frequency response is high-pass, which leads to a significant decrease in low-frequency sensitivity. At the same time, low-frequency noise is amplified, which deteriorates the overall signal-to-noise ratio of the system. As a result, existing directional microphones are unable to effectively pick up target signals in low signal-to-noise ratio environments, thus limiting their sound pickup quality and application effects.

[0026] To improve the sensitivity and signal-to-noise ratio of microphones, the applicant discovered that the frequency response characteristics can be optimized by adjusting the microphone's acoustic structure. The frequency response of a MEMS microphone is closely related to its internal acoustic resonance, and the Helmholtz resonant frequency is determined by both acoustic quality and acoustic compliance. By rationally designing the internal acoustic path and cavity structure of the microphone, the resonance peak can be shifted towards lower frequencies, thereby improving sensitivity in the low-frequency range and enhancing the signal-to-noise ratio.

[0027] Based on the above considerations, in order to solve the problems of insufficient low-frequency sensitivity and poor signal-to-noise ratio of microphones, the inventors, after in-depth research, designed a microphone comprising a substrate and a first and second sub-shell covering the substrate. The microphone has two airflow paths. One path involves outside air entering the receiving cavity through a sound hole, and the other path involves outside air entering the cavity through a sound hole and a sound leakage channel. The receiving cavity and the cavity form a parallel airflow relationship through the air inlet and the sound leakage channel.

[0028] In this type of microphone, the housing and the cavity are connected via a sound leakage channel and a sound hole, creating two parallel airflow paths. By adjusting the dimensions of the sound leakage channel and the volume parameters of the cavity, the microphone's acoustic resonant frequency can be altered, shifting the resonant peak towards lower frequencies and thus improving the microphone's sensitivity in the low-frequency range. Simultaneously, the introduction of the resonant peak effectively suppresses low-frequency noise, improving the microphone's signal-to-noise ratio. This parallel cavity structure design allows the microphone to significantly improve pickup quality while maintaining its directivity.

[0029] Specifically, this application provides a microphone.

[0030] Please see Figures 1 to 4 According to some embodiments of the present invention, a microphone 100 is provided, including an ASIC chip 9, a substrate 1, and a first sub-shell 21 and a second sub-shell 22 respectively covered on the substrate 1. The second sub-shell 22 cooperates with the substrate 1 to form a receiving cavity 3. The second sub-shell 22 is disposed inside the first sub-shell 21 and the first sub-shell 21 and the second sub-shell 22 are partially attached. The second sub-shell 22, the first sub-shell 21 and the substrate 1 cooperate to form a cavity 4. A MEMS chip 8 connected to the ASIC chip 9 is disposed in the receiving cavity 3. A sound hole 7 is disposed on the substrate 1 at the position corresponding to the MEMS. A sound leakage channel 5 is disposed on the substrate 1, which connects the sound hole 7 and the cavity 4. The microphone 100 has two air circulation paths, one of which is that outside air enters the receiving cavity 3 through the sound hole 7, and the other is that outside air enters the cavity 4 through the sound hole 7 and the sound leakage channel 5.

[0031] The substrate 1 of the microphone 100 can be a printed circuit board, used to carry the MEMS chip 8 and the ASIC chip 9 and provide electrical connections. A first sub-shell 21 and a second sub-shell 22 are respectively mounted on the substrate 1, together defining the internal space. Specifically, the second sub-shell 22 cooperates with the substrate 1 to form a receiving cavity 3. The first sub-shell 21 and the second sub-shell 22 cooperate to form a sound leakage channel 5 and an air inlet 6. The first sub-shell 21 covers the outer periphery of the second sub-shell 22. The outer wall of the second sub-shell 22 and the inner wall of the first sub-shell 21 cooperate with the substrate 1 to form a cavity 4. The receiving cavity 3 contains the MEMS chip 8. The ASIC chip 9 can be disposed within the receiving cavity 3, or it can be completely or partially embedded in the substrate 1. The cavity 4 is an additional space isolated from the receiving cavity 3 but connected to it by airflow through the sound hole 7 and the sound leakage channel 5. The partial fitting of the first sub-shell 21 and the second sub-shell 22 means that a sealed fit is formed at the fitting point. Specifically, the second top plate 221 of the second sub-shell 22 is completely fitted to a portion of the first top plate 211 of the first sub-shell 21, and one side of the second side panel 222 of the second sub-shell 22 is fitted to one side of the first side panel 212 of the first sub-shell 21. This ensures that incoming air, after passing through the air inlet 6, can only flow into the receiving cavity 3, thus further improving the accuracy of detection. The sound hole 7 is disposed on the substrate 1 and connects to the receiving cavity 3. The sound leakage channel 5 is disposed inside the substrate 1, with one end connected to the sound hole 7 and the other end connected to the cavity 4. Thus, after entering through the sound hole 7, the outside air is divided into two paths: one path directly enters the receiving cavity 3, and the other path enters the cavity 4 through the sound leakage channel 5. The receiving cavity 3 and the cavity 4 form a parallel airflow relationship through the sound hole 7 and the sound leakage channel 5. The two paths together determine the acoustic resonance characteristics of the microphone 100. By adjusting the geometry of the leakage channel 5 and the volume of the cavity 4, the acoustic resonant frequency can be changed, shifting the resonant peak towards lower frequencies. This improves the sensitivity of the microphone 100 in the low-frequency range and enhances the signal-to-noise ratio. Unlike existing technologies that use a series cavity 4 structure to increase the sound path, this application achieves frequency modulation through a parallel path and cavity 4 design, avoiding the acoustic loss problems associated with series structures. The specific adjustment principle can be found in the formula for calculating the leakage inductance resonant frequency: FR.leak= FR.leak refers to the resonant frequency of the leakage inductance, L leak The leakage inductance is related to leakage channel 5, and Ce refers to the equivalent capacitance, which is related to the volume of cavity 4. This can be achieved by adjusting L. Leak Together with Ce, we can optimize performance data.

[0032] Please see Figure 1 and Figure 4 In some embodiments, the first sub-shell 21 has a first sub-hole 210, the second sub-shell 22 has a second sub-hole 220, and the first sub-hole 210 and the second sub-hole 220 are connected to form an air inlet 6.

[0033] Taking the directional microphone 100 applied in this application embodiment as an example, the directional microphone 100 is a microphone 100 that has different sensitivities to sound from different directions. Its core objective is to preferentially pick up sound from a specific direction while suppressing or attenuating sound from other directions. The core of the operation of the directional microphone 100 is to cleverly utilize the time difference and phase difference of sound wave arrival, and through the principle of pressure gradient, to make the diaphragm produce different responses to sound from different directions.

[0034] The first sub-shell 21 is the outer shell, and the second sub-shell 22 is the inner shell. The first sub-shell 21 covers the outside of the second sub-shell 22. The space between the outer wall of the second sub-shell 22, the first sub-shell 21, and the substrate 1 forms a cavity 4, which is located on the outer periphery of the second sub-shell 22. A first sub-hole 210 is provided on the first sub-shell 21, and a second sub-hole 220 is provided on the second sub-shell 22. The positions of the first sub-hole 210 and the second sub-hole 220 are corresponding and interconnected, together forming an air inlet 6. Outside air enters through the first sub-hole 210 and then enters the receiving cavity 3 through the second sub-hole 220. Through the double-shell design, two interconnected acoustic spaces, the receiving cavity 3 and the cavity 4, are formed within a limited space, which is beneficial for the miniaturization design of the microphone 100.

[0035] Please see Figure 1 and Figure 2 In some embodiments, the sound leakage channel 5 is disposed inside the substrate 1, one end of the sound leakage channel 5 penetrates the side wall of the sound hole 7, and the other end of the sound leakage channel 5 passes through the substrate 1 and communicates with the cavity 4.

[0036] The sound leakage channel 5 is a channel structure formed inside the substrate 1 material. One end of it opens into the side wall of the sound hole 7, allowing outside air to enter through the sound hole 7 and then flow into the sound leakage channel 5. The other end of the sound leakage channel 5 passes through the solid portion of the substrate 1, extends to the surface of the substrate 1, and communicates with the cavity 4, allowing the air flowing through the sound leakage channel 5 to enter the cavity 4. The end of the sound leakage channel 5 connected to the cavity 4 can be defined as the sound leakage hole 51. By placing the sound leakage channel 5 inside the substrate 1, the thickness space of the substrate 1 is fully utilized, eliminating the need to increase the height of the microphone 100, which is beneficial for product miniaturization. At the same time, by processing the channel inside the substrate 1, the cross-sectional dimensions and length of the channel can be precisely controlled, thereby precisely controlling the acoustic resonant frequency.

[0037] Please see Figure 1 and Figure 2 In some embodiments, the sound leakage channel 5 includes a horizontal channel and a vertical channel that are interconnected. The end of the horizontal channel away from the vertical channel is connected to the sound hole 7, and the end of the vertical channel away from the horizontal channel is connected to the cavity 4.

[0038] The horizontal channel is a channel portion extending horizontally inside the substrate 1, with one end connected to the sidewall of the acoustic hole 7. The vertical channel is a channel portion extending vertically inside the substrate 1, with one end connected to the horizontal channel and the other end passing through the surface of the substrate 1 and connected to the cavity 4. The combination of the horizontal and vertical channels creates a channel path with bends within the substrate 1. This design allows for flexible adjustment of the channel direction based on the internal wiring and spatial layout of the substrate 1, making full use of the internal space. Furthermore, by adjusting the length and cross-sectional dimensions of the horizontal and vertical channels, the acoustic parameters of the sound leakage channel 5 can be flexibly adjusted.

[0039] Please see Figure 5 In some embodiments, the first sub-shell 21 includes a first top plate 211 and a first side plate 212. The second sub-shell 22 includes a second top plate 221 and a second side plate 222. The first top plate 211 is provided with a first sub-hole 210, and the second top plate 221 is provided with a second sub-hole 220. The first top plate 211 and the second top plate 221 are fitted together to form an air inlet 6. The second side plate 222 is disposed on one side of the first side plate 212 and is fitted together with the first side plate 212. The receiving cavity 3 and the cavity 4 are arranged side by side along the extension direction of the substrate 1.

[0040] The first top plate 211 is the top wall of the first sub-shell 21, and the first side plate 212 is the side wall of the first sub-shell 21. The second top plate 221 is the top wall of the second sub-shell 22, and the second side plate 222 is the side wall of the second sub-shell 22. A first sub-hole 210 is provided on the first top plate 211, and a second sub-hole 220 is provided on the second top plate 221. The first top plate 211 and the second top plate 221 are fitted together, and the fitting area between them forms an air inlet 6. The second side plate 222 is located inside the first side plate 212 and is fitted together with the first side plate 212, so that the second sub-shell 22 and the first sub-shell 21 are tightly fitted at the side wall. The fitting area forms a sealed fit, so that the air entering from the outside can only flow into the receiving cavity 3 after passing through the air inlet 6, which can further improve the accuracy of the detection. The receiving cavity 3 is located inside the second sub-shell 22, and the cavity 4 is located between the first sub-shell 21 and the second sub-shell 22 and is arranged side by side with the receiving cavity 3 in the extending direction of the substrate 1. By arranging the receiving cavity 3 and the cavity 4 side by side along the extending direction of the substrate 1, the space in the plane direction of the substrate 1 can be effectively utilized, the height of the microphone 100 can be reduced, and it is beneficial to the thinning of the product.

[0041] Please see Figure 1 and Figure 6In some embodiments, the microphone 100 further includes a bonding member 23. A second sub-shell 22 cooperates with the substrate 1 to form a receiving cavity 3. A first sub-shell 21 covers the outer periphery of the second sub-shell 22. The bonding member 23 is bonded to the first sub-shell 21 and the second sub-shell 22 on opposite sides. The first sub-shell 21, the second sub-shell 22, the bonding member 23, and the substrate 1 cooperate to form a cavity 4. The first sub-shell 21 has a first sub-hole 210. The second sub-shell 22 has a second sub-hole 220. The bonding member 23 has a through hole. The first sub-hole 210, the through hole, and the second sub-hole 220 communicate to form an air inlet 6.

[0042] The bonding component 23 is an intermediate member disposed between the first sub-shell 21 and the second sub-shell 22, with its opposite sides respectively bonded to the first sub-shell 21 and the second sub-shell 22. The bonding component 23, the first sub-shell 21, the second sub-shell 22, and the substrate 1 together form a cavity 4. The bonding component 23 is provided with a through hole, which connects the first sub-hole 210 and the second sub-hole 220, and the three together constitute an air inlet 6. By setting the bonding component 23, a stable gap can be formed between the first sub-shell 21 and the second sub-shell 22, which facilitates precise control of the volume of the cavity 4 and improves the consistency and reliability of the product. By setting an intermediate bonding component 23 to connect the first sub-shell 21 and the second sub-shell 22, the gap 10 between the first sub-shell 21 and the second sub-shell 22 can be sealed by the bonding component 23, reducing the manufacturing precision requirements of the first sub-shell 21 and the second sub-shell 22.

[0043] Please see Figure 6 In some embodiments, the first sub-shell 21 includes a first top plate 211 and a first side plate 212, and the second sub-shell 22 includes a second top plate 221 and a second side plate 222. The first top plate 211 and the second top plate 221 are respectively attached to both sides of the fitting member 23. The first top plate 211 is provided with a first sub-hole 210, and the second top plate 221 is provided with a second sub-hole 220. The second side plate 222 is provided on the side close to the first side plate 212. The receiving cavity 3 and the cavity 4 are arranged side by side along the extension direction of the substrate 1.

[0044] The first top plate 211 is the top wall of the first sub-shell 21, and the first side plate 212 is the side wall of the first sub-shell 21. The second top plate 221 is the top wall of the second sub-shell 22, and the second side plate 222 is the side wall of the second sub-shell 22. The second top plate 221 can be directly attached to the first top plate 211. When an adhesive member 23 is provided, the adhesive member 23 can be disposed between the first top plate 211 and the second top plate 221, with its opposite sides respectively attached to the first top plate 211 and the second top plate 221. A first sub-hole 210 is provided on the first top plate 211, and a second sub-hole 220 is provided on the second top plate 221. The through hole on the adhesive member 23 connects the first sub-hole 210 and the second sub-hole 220. The second side plate 222 is located inside the first side plate 212. The receiving cavity 3 is located inside the second sub-shell 22, and the cavity 4 is located between the first sub-shell 21 and the second sub-shell 22 and is arranged side by side with the receiving cavity 3 in the extending direction of the substrate 1. By setting the bonding member 23, the manufacturing requirements and fitting difficulty of the first sub-shell 21 and the second sub-shell 22 can be reduced, which is beneficial to the optimization of acoustic performance.

[0045] Please see Figure 6 In some embodiments, a gap 10 is formed between the first sub-shell 21 and the second sub-shell 22, and the microphone 100 also includes a sealing layer 11; the sealing layer 11 is disposed in the gap 10 near the air inlet 6 to isolate the gap 10 and the air inlet 6.

[0046] Aside from the location of the bonding member 23, gaps 10 may exist between the first sub-shell 21 and the second sub-shell 22 at other locations due to the thickness of the bonding member 23. A sealing layer 11 is positioned within these gaps 10 near the air inlet 6 to isolate the gaps 10 from the air inlet 6, preventing airflow leakage from the air inlet 6 into the gaps 10, which would affect acoustic performance. By providing the sealing layer 11, it is ensured that outside air enters the microphone 100 only through the air inlet 6, maintaining the integrity of the airflow path and preventing loss of acoustic performance.

[0047] Please see Figure 7 and Figure 8 In some embodiments, the sound leakage channel 5 is an arc-shaped channel, a wave-shaped channel, or a stepped channel.

[0048] Figure 7 This indicates that the shape of the sound leakage channel 5 is stepped. Figure 8This indicates that the sound leakage channel 5 is arc-shaped. The specific shape of the sound leakage channel 5 can be selected according to actual needs. An arc-shaped channel extends in a circular arc shape inside the substrate 1; an arc-shaped channel can also be formed by splicing multiple arc segments. A wavy channel extends in a wavy, undulating manner inside the substrate 1. A stepped channel extends in a stepped, turning manner inside the substrate 1. These different channel shapes can increase the effective length of the sound leakage channel 5 without changing the external dimensions of the substrate 1, thereby adjusting the acoustic resonant frequency. Specifically, increasing the channel length increases its "sound quality," and the increase in sound quality shifts the system's resonant frequency towards lower frequencies. This resonant peak can effectively compensate for the common low-frequency attenuation of directional microphones 100, thereby improving the sensitivity and signal-to-noise ratio in the low-frequency range. Simultaneously, different channel shapes can also change the flow resistance characteristics within the channel, further optimizing acoustic performance. For example, an arc-shaped channel has no right-angle bends, resulting in smoother airflow. Furthermore, different channel shapes can also change the flow resistance characteristics within the channel, further optimizing acoustic performance. This diverse design allows the technical solution of this application to flexibly adapt to different application needs and manufacturing conditions.

[0049] In some embodiments, the substrate 1 includes a first sub-board 101 and a second sub-board 102, wherein the first sub-board 101 has an acoustic hole 7. A first channel structure is provided on the surface of the first sub-board 101, and a second channel structure is provided on the surface of the second sub-board 102. The first sub-board 101 and the second sub-board 102 are spliced ​​together so that the first channel structure and the second channel structure cooperate to form a sound leakage channel 5.

[0050] Furthermore, when the designed sound leakage channel 5 is an irregularly shaped channel, such as the arc-shaped channel, wave-shaped channel, or stepped channel in the previous embodiment, it is very difficult to directly process the sound leakage channel 5 inside a single board. Therefore, the first sub-board 101 and the second sub-board 102 can be set as two layered structures of the substrate 1. The first sub-board 101 has sound holes 7, and a first channel structure is formed on its surface by etching, machining, or other methods. The surface of the second sub-board 102 forms a second channel structure in a similar manner. When the first sub-board 101 and the second sub-board 102 are spliced ​​and stacked together, the positions of the first channel structure and the second channel structure correspond to each other and together form a complete sound leakage channel 5. By setting the substrate 1 as a layered structure and processing channel structures on the surface of each layer, especially when the designed channel is an irregularly shaped channel, such as the arc-shaped channel, wave-shaped channel, or stepped channel in the previous embodiment, it is very difficult to directly process the sound leakage channel 5 inside a single board. This embodiment divides the sound leakage channel 5 into two parts, which are respectively set on the surfaces of the first sub-shell 21 and the second sub-shell 22. The sound leakage channel 5 is made by processing the channel structure on the surface of each sub-shell and then splicing them together. This embodiment can reduce the difficulty of channel processing, improve processing accuracy and yield, and is conducive to large-scale production and manufacturing.

[0051] In some embodiments, the first sub-shell 21 and the second sub-shell 22 are bonded together with sealant.

[0052] The sealant is an adhesive applied between the first sub-shell 21 and the second sub-shell 22 to fix them together as a single unit and simultaneously seal them. Through sealant bonding, not only is the connection strength between the first sub-shell 21 and the second sub-shell 22 guaranteed, but air from the receiving cavity 3 is also prevented from leaking into the gap between the first sub-shell 21 and the second sub-shell 22, ensuring the integrity of the two airflow paths and avoiding loss of acoustic performance. The sealant bonding process is simple, inexpensive, and suitable for mass production.

[0053] Please see Figure 2 In some embodiments, a waterproof and breathable membrane is provided on the side of the sound hole 7 away from the receiving cavity 3.

[0054] The waterproof and breathable membrane is a thin film material that allows air to pass through but prevents liquid water from passing through. By placing the waterproof and breathable membrane on the side of the sound hole 7 away from the receiving cavity 3, i.e., on the outside of the sound hole 7, it effectively prevents external moisture, dust, and other impurities from entering the microphone 100 through the sound hole 7, protecting the MEMS chip 8 and ASIC chip 9 inside the receiving cavity 3 from contamination and damage. At the same time, the waterproof and breathable membrane has good air permeability and will not significantly obstruct sound propagation, ensuring the acoustic performance of the microphone 100.

[0055] According to one aspect of the present invention, the present invention also provides a smart wearable device, which includes the microphone 100 described above. Since the smart wearable device includes all the technical solutions of any embodiment of the microphone 100 described above, it possesses at least all the beneficial effects brought about by all the above technical solutions, which will not be elaborated upon here.

[0056] The above are merely exemplary embodiments of the present invention and are not intended to limit the scope of protection of the present invention. Any equivalent structural transformations made using the contents of the present invention specification and drawings under the technical concept of the present invention, or direct / indirect applications in other related technical fields, are included within the scope of protection of the present invention.

Claims

1. A microphone, characterized in that, The device includes an ASIC chip, a substrate, and a first sub-shell and a second sub-shell respectively covering the substrate. The substrate and the second sub-shell cooperate to form a receiving cavity. The second sub-shell is disposed inside the first sub-shell, and the first sub-shell and the second sub-shell are partially attached to each other. The second sub-shell, the first shell, and the substrate cooperate to form a cavity. A MEMS chip that is signal-connected to the ASIC chip is disposed in the receiving cavity. The substrate has a sound hole corresponding to the position of the MEMS chip. The substrate has a sound leakage channel that connects the sound hole and the cavity. The microphone has two airflow paths, one of which is: outside air—sound hole—accommodating cavity; the other is: outside air—sound hole—sound leakage channel—cavity.

2. The microphone according to claim 1, characterized in that, The first sub-shell has a first sub-hole, and the second sub-shell has a second sub-hole. The first sub-hole and the second sub-hole are connected to form an air inlet.

3. The microphone according to claim 2, characterized in that, The first sub-shell includes a first top plate and a first side plate, and the second sub-shell includes a second top plate and a second side plate. The first top plate is provided with a first sub-hole, and the second top plate is provided with a second sub-hole. The first top plate and the second top plate are fitted together to form the air inlet. The second side plate is disposed on one side of the first side plate and is fitted together with the first side plate. The receiving cavity and the cavity body are arranged side by side along the extension direction of the substrate.

4. The microphone according to claim 1, characterized in that, The sound leakage channel is disposed inside the substrate, one end of the sound leakage channel penetrates the side wall of the sound hole, and the other end of the sound leakage channel passes through the substrate and communicates with the cavity.

5. The microphone according to claim 4, characterized in that, The sound leakage channel includes a horizontal channel and a vertical channel that are interconnected. The end of the horizontal channel away from the vertical channel is connected to the sound hole, and the end of the vertical channel away from the horizontal channel is connected to the cavity.

6. The microphone according to claim 1, characterized in that, The microphone also includes a bonding member. The second sub-shell cooperates with the substrate to form the receiving cavity. The first sub-shell covers the outer periphery of the second sub-shell. The opposite sides of the bonding member are respectively bonded to the first sub-shell and the second sub-shell. The first sub-shell, the second sub-shell, the bonding member, and the substrate cooperate to form the cavity. The first sub-shell has a first sub-hole, the second sub-shell has a second sub-hole, and the bonding member has a through hole. The first sub-hole, the through hole, and the second sub-hole communicate to form the air inlet.

7. The microphone according to claim 6, characterized in that, The first sub-shell includes a first top plate and a first side plate, and the second sub-shell includes a second top plate and a second side plate. The first top plate and the second top plate are respectively attached to both sides of the bonding member. The first top plate is provided with a first sub-hole, and the second top plate is provided with a second sub-hole. The second side plate is provided on the side close to the first side plate. The receiving cavity and the cavity body are arranged side by side along the extension direction of the substrate.

8. The microphone according to claim 6, characterized in that, A gap is also formed between the first sub-shell and the second sub-shell. The microphone also includes a sealing layer, which is disposed in the gap near the air inlet to isolate the gap from the air inlet.

9. The microphone according to claim 1, characterized in that, The sound leakage channel is an arc-shaped channel, a wave-shaped channel, or a stepped channel.

10. The microphone according to claim 9, characterized in that, The substrate includes a first sub-board and a second sub-board. The first sub-board has the acoustic hole formed therein. A first channel structure is provided on the surface of the first sub-board. A second channel structure is provided on the surface of the second sub-board. The first sub-board and the second sub-board are spliced ​​together so that the first channel structure and the second channel structure cooperate to form the sound leakage channel.

11. A smart wearable device, characterized in that, The smart wearable device includes the microphone according to any one of claims 1 to 10.

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