A headset

Abstract

The embodiment of the application provides an earphone, which comprises a control assembly, a loudspeaker, a mainboard, a first main body and a second main body connected with each other, and a first microphone and a second microphone installed on the mainboard. The control assembly comprises a first mounting bracket, an antenna assembly, a rotating piece, a first cover plate and at least one first sensing piece. The rotating piece is rotatably sleeved outside the first mounting bracket and the first cover plate, and a third through hole of the first mounting bracket is communicated with a gap between the rotating piece and the first cover plate. The loudspeaker is arranged in a second cavity of the second main body. The second main body is convex along the thickness direction, and when the earphone is in a wearing state, a first through hole of the first main body is located in a bottom region of the first main body. Through the design, the distance between the loudspeaker and the ear canal can be reduced, so that the sound quality is improved. The shape of the main body can better fit the human ear, and the wearing comfort is improved. The earphone has a touch function and a rotary knob control function, and the interaction with the user is better.

Description

Technical Field

[0001] This application relates to the field of electronic devices, and more particularly to a pair of headphones. Background Technology

[0002] With the development of technology, headphones have become a common electronic device. Wireless headphones communicate with mobile phones and other electronic devices via Bluetooth or other wireless signals, enabling them to play audio from the phone or receive the user's voice for functions such as audio playback, calls, and recording. True wireless stereo (TWS) headphones are typically in-ear or semi-in-ear headphones, which seal the ear canal when worn, creating a relatively closed space. Prolonged wear can easily cause discomfort. Furthermore, when the user sweats, the ear canal becomes moist and sealed, easily breeding bacteria. Open-ear stereo (OWS) headphones, on the other hand, do not extend into the ear canal, leaving a gap between the earpiece and the canal, allowing the ear canal to communicate with the outside world. This can lead to sound leakage, resulting in decreased sound quality and affecting the user experience. Because open-ear headphones can cause greater pressure on the ear, they are less comfortable. Therefore, there is a need for headphones that offer better sound quality, comfort, and interactivity. Summary of the Invention

[0003] This application provides an earphone for improving its sound quality, comfort, and interactivity.

[0004] This application provides an earphone, which includes a main body, a control component, a first microphone, a second microphone, a speaker, and a motherboard. The motherboard is installed inside the main body, and the first microphone and the second microphone are installed on the motherboard.

[0005] The control component includes a first mounting bracket, an antenna assembly, a rotating component, a first cover plate, and at least one first sensor. The first cover plate is located on the side of the first mounting bracket away from the interior of the main body along the thickness direction of the main body. The rotating component is sleeved on the outside of the first mounting bracket and the first cover plate, and the rotating component is rotatable relative to the first mounting bracket and the first cover plate. The first mounting bracket has a third through hole, and there is a gap between the first cover plate and the rotating component, and the gap connects the third through hole to the outside. The first microphone receives sound through the third through hole and the gap.

[0006] The antenna assembly and the first sensor are electrically connected to the motherboard. The antenna assembly is mounted on the first mounting bracket. The first sensor is used to sense the user's operation on the first cover plate.

[0007] The main body includes a first main body and a second main body connected to each other. The second main body protrudes along the thickness direction of the main body. The first mounting bracket is mounted on the first main body. The first main body has a first cavity and a first through hole that are connected to each other. The second microphone is located in the first cavity and receives sound through the first through hole. The second main body has a second cavity and a second through hole that are connected to each other. The speaker is located in the second cavity and transmits sound through the second through hole.

[0008] When the earphone is in the wearing state, the first through hole is located in the bottom region of the first body. The second body protrudes relative to the first body along the thickness direction of the body.

[0009] The first through-hole is located below the first main body and can be positioned on the outside of the ear. The second microphone picks up sound through the first through-hole. The first through-hole is positioned in the bottom region of the first main body. The bottom region refers to the side of the first main body closer to the chin when the headphones are worn. This design brings the first through-hole closer to the user's mouth when the headphones are worn, facilitating sound pickup when the user speaks and improving sound quality. When the headphones are worn, the second main body is located on the side of the first main body facing the ear and extends towards the ear canal, thus reducing the distance between the headphones and the ear canal. The second through-hole can serve as a sound outlet in the second main body. The second through-hole is typically located on the side of the second main body facing the ear canal. This design further reduces the distance between the second through-hole and the ear canal, reducing sound leakage and improving sound quality. At least part of the speaker is located in the second cavity of the second main body, which helps reduce the distance between the speaker and the ear canal, further reducing sound leakage and improving sound transmission from the speaker to the ear canal. Because the distance between the speaker and the second through-hole and the ear canal is relatively short, the distance between the speaker and the ear canal and the sound transmission distance are shortened, thus reducing sound loss during transmission. Therefore, the performance requirements for the speaker can be reduced, allowing for the use of a smaller speaker, which helps save costs and achieves the effect of a large speaker with a smaller size. When using a speaker of the same size as other headphones, the solution provided in this application has better sound quality than other headphones due to the shorter sound transmission distance and less loss. The second body protrudes and extends towards the ear canal, which helps the surface of the headphone to better fit the structure of the human ear. The protrusion of the second body can be an arc-shaped protrusion, and the parameters of the arc can be designed according to the structure of the human ear so that the headphone can fit the human ear better, thereby improving wearing comfort. The control component is a knob-type structure. When the headphones are worn, the control component is located on the outside of the ear, the second body extends into the ear, and the first body is located between the control component and the second body, with a part of the first body extending into the ear. The first sensor is used to sense the user's operation on the first cover. The integration of both knob and touch controls into the headphones enriches the user's control options, allowing users to choose different methods to interact with the headphones according to their needs, thereby improving the headphones' interactivity.

[0010] In one possible implementation, the first mounting bracket includes a first notch along the thickness direction of the body, and the first cover plate covers at least a portion of the first notch, the first notch communicating with the third through hole and the gap.

[0011] This design allows the path between the gap and the third through hole to include at least one corner, which helps improve the headphone's waterproof and dustproof capabilities, reduces the possibility of liquids, dust, and impurities entering the headphone's interior, and thus helps improve the stability of the headphone's operation.

[0012] In one possible implementation, the gap is annular, and the extension direction of the first notch is perpendicular to the axial direction of the third through hole.

[0013] This design allows the gap, the first notch, and the third through hole to form an approximate shape. The structure is such that when dust, liquid, or other impurities enter the gaps, they need to bend at least twice before reaching the area where the first microphone is located. This design reduces the possibility of dust, liquid, or other impurities coming into contact with the first microphone, thus improving the headphone's dustproof and waterproof capabilities.

[0014] In one possible implementation, the control assembly further includes a second cover plate located on the side of the first cover plate facing the first mounting bracket. The second cover plate is annular and located between the first mounting bracket and the rotating member. Along the thickness direction of the body, the second cover plate abuts against the first mounting bracket and the rotating member.

[0015] The second cover plate includes a second notch that extends radially through the second cover plate and connects the first notch and the gap.

[0016] The second cover plate can be used to limit the position of the first mounting bracket and the rotating component along the thickness direction of the main body, thereby improving the relative positional accuracy and installation stability of the first mounting bracket and the rotating component. By providing the second notch, the possibility of the second cover plate obstructing the third through hole and the gap can be reduced. At the same time, the second cover plate can also be used to cover the gap between the first mounting bracket and the rotating component, thereby reducing the impact of the gap between the first mounting bracket and the rotating component on sound transmission and reducing the possibility of excessive sound reflection during transmission.

[0017] In one possible implementation, the second cover plate includes at least two circumferentially spaced limiting protrusions that extend into the gap and abut against the limiting protrusions along the radial direction of the first cover plate.

[0018] By setting a limiting protrusion on the second cover plate, the first cover plate can be limited, which helps to improve the installation accuracy of the first cover plate and the relative positional accuracy between the first cover plate and components such as the first mounting bracket, so that the first cover plate can better protect the internal structure of the earphone.

[0019] In one possible implementation, the first mounting bracket has a first step portion and a second step portion arranged circumferentially along the first mounting bracket. Along the thickness direction of the body, the second step portion is located on the side of the first step portion facing the first cover plate. The first step portion is used to accommodate the rotating member, and the second step portion is used to accommodate the second cover plate.

[0020] By setting the first step and the second step, the rotating part and the second cover plate can be limited, which helps to improve the stability of the rotating part and the second cover plate when they are sleeved with the first mounting bracket.

[0021] In one possible implementation, the control component further includes a magnetic conductor, and the motherboard is further provided with at least one second sensing element;

[0022] The rotating component includes a body portion and a first elastic component. The body portion is annular, the first elastic component is located on the side of the body portion facing the first mounting bracket, and the magnetic conductive component is disposed on the side of the first elastic component facing the motherboard.

[0023] By incorporating a magnetic guide component into the rotating component, the magnetic guide component moves relative to the second sensing element as the rotating component rotates, causing a change in the second sensing element. When the second sensing element is energized, it generates a magnetic field. When the magnetic guide component moves relative to the second sensing element, it moves within the magnetic field of the second sensing element and cuts magnetic field lines, thereby generating an induced current and its own magnetic field. The magnetic field generated by the magnetic guide component interacts with the magnetic field of the second sensing element, altering the spatial magnetic field distribution. The movement of the magnetic guide component relative to the second sensing element causes changes in both the induced current and the magnetic field. Based on these changes, a corresponding signal can be generated, which is then used to control the headphones.

[0024] In one possible implementation, the motherboard is located in the first cavity, and the first microphone is located on the side of the motherboard away from the control component;

[0025] The motherboard is provided with a fourth through hole, which communicates with the third through hole. Along the thickness direction of the main body, at least a portion of the projection of the fourth through hole is located within the projection range of the first microphone.

[0026] This design allows the first microphone to be positioned on the side of the motherboard 3 furthest from the control components, reducing the possibility of interference between the first microphone and the control components and making the overall structure of the control components more compact. The fourth through-hole connects the third through-hole and the first microphone, enabling the first microphone to pick up sound through the third through-hole.

[0027] In one possible implementation, the third through-hole and the second microphone are located on opposite sides of the first sensor along the height direction of the earphone.

[0028] The third through-hole is located closer to the edge of the earphone, making its placement easier and minimizing its impact on other components. It also facilitates the installation of waterproof and dustproof components, reducing the likelihood of interference between these components. Typically, the first sensor is located in the center of the earphone, and its projection area on the first cover corresponds to the touch area. The third through-hole, positioned at the edge of the first mounting bracket, avoids the touch area, minimizing its impact. This design better suits practical usage needs and improves the user experience.

[0029] In one possible implementation, the antenna assembly and the first sensing element are located on opposite sides of the first mounting bracket;

[0030] Along the thickness direction of the main body, at least a portion of the projection of the antenna assembly lies within the projection range of the first sensing element.

[0031] This design allows for a certain degree of overlap between the antenna assembly and the first sensor, thereby reducing the radial space required by the antenna assembly and the first sensor in the control assembly. This helps to reduce the size of the control assembly, which in turn helps to reduce the overall size of the headphones, preventing excessive pressure on the ears when wearing the headphones and improving the user experience.

[0032] Along the thickness direction of the main body, in the projection along the thickness direction of the main body, the projection of the first sensing element is located within the projection range of the first cover plate.

[0033] In one possible implementation, the earphone includes a shield, a wiring harness, and a first circuit board. The first circuit board includes a first connecting portion, a second connecting portion, a third connecting portion, and a fourth connecting portion that are interconnected. The first sensor is embedded in the first connecting portion. The second connecting portion is electrically connected to the main board. The third connecting portion is used to connect the wiring harness. The shield is disposed in the fourth connecting portion. The fourth connecting portion connects the first connecting portion and the second connecting portion.

[0034] The ear hook can incorporate sensors, microphones, and other structures. The sensors detect the wearing status of the headphones, while the microphones collect ambient sound to aid in noise reduction. A wiring harness extends to the ear hook for electrical connection to the sensors, microphones, and other components, enabling signal transmission. The first sensor, wiring harness, etc., can be electrically connected to the main board via the same circuit board, saving on the number of circuit boards and making the internal structure of the headphones more compact, thus reducing the overall size of the headphones. In one possible implementation, along the thickness direction of the main body, the first connecting portion, the third connecting portion, and the fourth connecting portion are located on the same side of the main board, while the first connecting portion and the second connecting portion are located on opposite sides of the main board. A shielding element can be located at the fourth connecting portion to block signals that need to be shielded, reducing the possibility of additional signal transmission between the first sensor and the main board. The second and third connecting portions can be connected to opposite sides of the main board, a design that improves the utilization rate of the main board and saves space in the headphones.

[0035] In one possible implementation, the first circuit board includes a first bending segment, a second bending segment, and a third bending segment, wherein the first bending segment connects the second connecting portion and the fourth connecting portion, the second bending segment connects the second connecting portion and the third connecting portion, and the third bending segment connects the first connecting portion and the fourth connecting portion;

[0036] The first connecting part, the third connecting part, and the fourth connecting part are located on the side of the motherboard facing the first cover plate.

[0037] By incorporating bending sections to facilitate adjustments to the positions of the first, second, third, and fourth connecting parts, the headphone's structure becomes more compact. While each component is electrically connected to the main board via the first circuit board, the space occupied by the first circuit board within the headphone is reduced, thereby improving internal space utilization and decreasing the headphone's overall size.

[0038] In one possible implementation, the control component includes a second mounting bracket and a second elastic member, the second mounting bracket being located on the side of the first mounting bracket facing the first cavity, and the first connecting portion being located on the side of the second mounting bracket facing the first mounting bracket.

[0039] The second elastic element is located between the first connecting portion and the second mounting bracket, and the second mounting bracket and the second elastic element are used to support the first connecting portion.

[0040] The second mounting bracket supports the first sensor to stabilize its position. The first sensor is located at the first connection portion of the first circuit board; therefore, the second mounting bracket supports the first sensor by supporting the first connection portion. The second elastic element reduces the impact of assembly errors on the first sensor and the second mounting bracket. Simultaneously, the second elastic element tends to move the first sensor and the first circuit board containing the first sensor closer to the first mounting bracket, allowing the first sensor to be closer to the earphone surface, thus improving touch recognition accuracy.

[0041] In one possible implementation, the second mounting bracket and the motherboard are provided with a limiting post and a limiting hole, respectively, and the limiting post and the limiting hole cooperate with each other.

[0042] The second mounting bracket is provided with a limiting groove, which is located on the side of the second mounting bracket facing the motherboard, and at least a portion of the second microphone is located within the limiting groove.

[0043] This design improves the relative positional accuracy between the second mounting bracket and the motherboard, enhancing the stability of the second mounting bracket. Since the second mounting bracket provides support for the first sensor, it also contributes to improving the stability of the first sensor, better meeting practical usage requirements. This design also allows the second microphone to limit the position of the second mounting bracket, thereby improving the relative positional accuracy between the second mounting bracket and the motherboard. Simultaneously, the second microphone also supports the second mounting bracket, further enhancing its stability.

[0044] In one possible implementation, the second mounting bracket includes a first support portion and a second support portion connected to each other, the first support portion being used to support the first connecting portion and the second support portion being used to support the fourth connecting portion.

[0045] The limiting groove is located on the side of the second support portion facing the motherboard.

[0046] This design increases the contact area between the second mounting bracket and the first circuit board, and also elevates the first and fourth connecting parts. This allows the first and fourth connecting parts to avoid interference with the components on the motherboard, reducing the possibility of interference between the first and fourth connecting parts and other components.

[0047] In one possible implementation, the headphones further include a second circuit board, through which the speaker is electrically connected to the main board;

[0048] The earphone also includes at least one of a third microphone, a wear sensor, a charging connector, and a voice processing unit;

[0049] The third microphone is located in the second cavity, and the third microphone is electrically connected to the motherboard through the second circuit board;

[0050] The wearable sensor is disposed on the second main body, and the wearable sensor is electrically connected to the main board through the second circuit board;

[0051] The charging connection is electrically connected to the motherboard via the second circuit board;

[0052] The voice processing unit is located in the first cavity, and the voice processing unit is electrically connected to the motherboard through the second circuit board;

[0053] The thickness direction of the voice processing unit is perpendicular to the thickness direction of the speaker.

[0054] The third microphone is electrically connected to the main board via the second circuit board. A wear sensor is installed on the second main body and is also electrically connected to the main board via the second circuit board. The wear sensor detects the wearing status of the headphones. The charging connector (charging pin) is electrically connected to the main board via the second circuit board. The voice processing unit utilizes a bone conduction sensor, processing sound signals based on the principle of sound wave transmission through human bone vibration. The chip within the bone conduction sensor converts the vibration signal generated by the sound wave into an electrical signal. Electronic devices connected to the headphones combine the bone conduction signal detected by the voice processing unit with the air conduction signal detected by the microphone, improving the user experience. Especially in noisy environments, the combination of bone and air conduction allows users to receive audio more clearly. The voice processing unit captures sound by detecting the vibration of the user's skull, rather than through traditional air conduction. By detecting skull vibration, it can capture vibrations generated by the skull, thus enabling sound recognition. The bone conduction sound signal can be combined with the sound signal captured by a traditional microphone, improving the accuracy of speech recognition. Because bone conduction sound signals are less susceptible to interference from external environmental noise, it allows for more accurate recognition of the user's voice signal. The reduced interference from environmental noise significantly improves call clarity and quality. The speaker and voice processing unit work together to enable headphones to utilize both air conduction and bone conduction simultaneously. Headphones can include different usage modes, such as music mode and sports mode. When listening to music, the headphones are in music mode, transmitting sound through both air and bone conduction simultaneously, providing a sense of differentiation and musical layering, thus enhancing the user experience. When exercising, the headphones are in sports mode, using air conduction via the speaker. However, exercise can affect the stability of the headphones and the ear, impacting bone conduction effectiveness. Therefore, in sports mode, air conduction can be achieved solely through the speaker. When the voice processing unit is not perpendicular to the speaker, the area of ​​the voice processing unit that receives the speaker's drooping vibrations increases, and the vibrations generated by the speaker's drooping vibrations have a greater impact on the voice processing unit. Furthermore, the area of ​​the voice processing unit that receives ear vibrations decreases, and the speaker's drooping vibrations are more likely to cancel out the ear's vibrations, thus reducing the detection accuracy of the voice processing unit and affecting the user experience. By making the thickness direction of the voice processing unit perpendicular to the thickness direction of the speaker, the area of ​​the voice processing unit that receives the speaker's drooping vibrations can be reduced, thereby reducing the impact of the speaker's drooping vibrations on the voice processing unit. At the same time, the area of ​​the voice processing unit used to receive ear vibrations can be increased, which is beneficial to improving the quality of bone conduction by the voice processing unit, thus improving the user experience.

[0055] In one possible implementation, the second circuit board includes a connector that connects to the motherboard, and the control component includes a second mounting bracket that includes a connecting mating portion. The connector connects to the connecting mating portion to limit the relative position of the second mounting bracket and the motherboard.

[0056] This design allows the connector to limit the relative position of the motherboard and the second mounting bracket, thereby improving the positional accuracy and stability of the second mounting bracket. In the solution provided in this application, the second mounting bracket can be supported by a limiting post, a connector, and a second microphone, and its relative position to the motherboard can be limited from multiple directions, allowing for indirect connection with the motherboard and thus optimizing the stress on the motherboard.

[0057] In one possible implementation, the earphone includes a third mounting bracket located in the second cavity, the speaker being mounted on the third mounting bracket, the third mounting bracket having a third cavity, and at least a portion of the speaker being located in the third cavity;

[0058] The third mounting bracket is provided with at least one fifth through hole, and the third cavity is connected to the second cavity through the fifth through hole.

[0059] The third mounting bracket forms the front and rear cavities within the earphone. The third cavity serves as the rear cavity, while the space between the third mounting bracket and the second main body serves as the front cavity. The fifth through-hole connects the front and rear cavities. The front cavity primarily functions for sound output and diffusion, while also regulating high-frequency sound performance. Typically, the front cavity is smaller, and high-frequency sound waves have shorter wavelengths, making them easier to propagate and maintain their characteristics within a smaller space, resulting in brighter high-frequency sounds. The rear cavity primarily provides resonance space for low-frequency sounds and helps balance the sound signal. The rear cavity can adjust and buffer different frequency sound waves generated by the speaker to a certain extent, reducing distortion and interference in the sound signal. Connecting the inner and outer sides of the third mounting bracket through the fifth through-hole, i.e., connecting the front and rear cavities, allows sound waves to interact between them, helping to balance the propagation and energy distribution of different frequencies. By allowing sound waves to pass through and reflect between the front and rear cavities, high-frequency and low-frequency sounds can be better integrated, improving the coherence of the sound signal and thus enhancing the sound quality and user experience.

[0060] In one possible implementation, the main body is provided with a sixth through hole, which connects the third cavity to the outside of the main body, and the fifth through hole and the sixth through hole are located on the same side of the earphone.

[0061] The third cavity serves as the rear cavity of the earphone, and the sixth through-hole acts as a rear vent, connecting the third cavity to the outside. This sixth through-hole allows air to circulate between the earphone's interior and exterior during sound production, balancing the air pressure inside and outside the earphone. This reduces the possibility of sound distortion caused by pressure imbalances that could put extra stress on the speaker diaphragm. The rear vent also helps with the diffusion and reflection of low-frequency sounds, improving the realism of the sound quality. Furthermore, the rear vent can contribute to heat dissipation. Simultaneously, the airflow within the earphone helps reduce standing waves and resonance, minimizing noise and improving the user experience. The fifth and sixth through-holes are located on the same side of the earphone—the connection between the front and rear cavities and the rear vent. This design optimizes the sound transmission path, helps control sound propagation and reflection, improving clarity and layering, and allowing different frequencies to propagate and blend in an orderly manner, thus optimizing overall sound quality. The fifth and sixth through-holes on the same side work together to enhance low-frequency performance and reduce the possibility of low-frequency sound distortion. Simultaneously, placing the fifth and sixth through-holes on the same side of the earphone allows for a more concentrated acoustic channel, helping to break down potential resonance patterns within the earphone cavity. When sound waves propagate between the through-holes and the rear vent on the same side, they interfere with and suppress air vibrations within the cavity, thereby reducing cavity resonance and improving sound quality.

[0062] In one possible implementation, the second body and the third mounting bracket are provided with at least one protrusion and at least one recess, with at least a portion of the protrusion extending into the recess.

[0063] By setting protrusions and recesses, the relative positional accuracy of the second body and the second mounting bracket can be improved, which is beneficial to improving the stability of speaker installation and thus improving sound quality.

[0064] In one possible implementation, at least a portion of the second body protrudes downwards when the headphones are in a wearing state.

[0065] This design allows the second body to better fit the structure of the human ear, enabling the earphone to better conform to the ear and improve wearing comfort.

[0066] In one possible implementation, the earphone includes an ear hook, and the main body is connected to the ear hook.

[0067] When wearing headphones, they are worn on the ear via an ear hook. Compared to ear clips, ear hooks have a larger contact area with the ear and can make contact with the ear from multiple directions, resulting in a more stable fit. At the same time, compared to ear clips, ear hooks reduce pressure on the ear, thus improving wearing comfort.

[0068] This application provides an earphone, which includes a control component, a speaker, a motherboard, a first main body and a second main body connected to each other, and a first microphone and a second microphone mounted on the motherboard. The control component includes a first mounting bracket, an antenna assembly, a rotating member, a first cover plate, and at least one first sensor. The rotating member is rotatably sleeved on the outside of the first mounting bracket and the first cover plate, and a third through hole in the first mounting bracket communicates with the gap between the rotating member and the first cover plate. The speaker is disposed in the second cavity of the second main body. The second main body protrudes along its thickness, and when the earphone is worn, the first through hole of the first main body is located in the bottom region of the first main body. This design reduces the distance between the speaker and the ear canal, thereby improving sound quality. The shape of the main body better fits the human ear, improving wearing comfort. The earphone also features touch control and knob control, providing better user interaction. Attached Figure Description

[0069] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0070] Figure 1 This is a schematic diagram of the earphones worn on the human ear according to an embodiment of this application;

[0071] Figure 2 A schematic diagram of the headphones provided in an embodiment of this application;

[0072] Figure 3 This is a schematic diagram showing another perspective of the headphones provided in an embodiment of this application;

[0073] Figure 4 This is a schematic diagram of the internal structure of the earphone provided in an embodiment of this application;

[0074] Figure 5 A schematic diagram of the second body provided in an embodiment of this application;

[0075] Figure 6 for Figure 1 A sectional view;

[0076] Figure 7 A diagram illustrating the human ear;

[0077] Figure 8 A schematic diagram of another embodiment of the earphone provided in this application being worn on a human ear;

[0078] Figure 9 for Figure 1 A cross-sectional view from another direction;

[0079] Figure 10 An exploded view of the headphones provided in the embodiments of this application;

[0080] Figure 11 This is a schematic diagram of the control components and a portion of the first main body provided in an embodiment of this application;

[0081] Figure 12 This is an internal schematic diagram of another embodiment of the headphones provided in this application.

[0082] Figure 13 A schematic diagram of the rotating component provided in an embodiment of this application;

[0083] Figure 14 This is a cross-sectional view of the rotating component provided in an embodiment of this application;

[0084] Figure 15 An internal schematic diagram of yet another embodiment of the headphones provided in this application;

[0085] Figure 16 A cross-sectional view of the first body provided in an embodiment of this application;

[0086] Figure 17 This is a schematic diagram of the rotating component, the first cover plate, and the second cover plate provided in the embodiments of this application;

[0087] Figure 18 This is a cross-sectional view of the first mounting bracket provided in an embodiment of this application;

[0088] Figure 19 for Figure 15 A magnified view of the central position (I).

[0089] Figure 20 A schematic diagram of the second cover plate provided in an embodiment of this application;

[0090] Figure 21 This is a schematic diagram showing the selection of the third through hole position provided in an embodiment of this application;

[0091] Figure 22 A schematic diagram illustrating the isolation degree of the third through hole in various locations according to embodiments of this application;

[0092] Figure 23 A schematic diagram illustrating the coherence of the third through-hole in various positions according to embodiments of this application;

[0093] Figure 24 An internal schematic diagram of yet another embodiment of the headphones provided in this application;

[0094] Figure 25 This is a schematic diagram showing the position of the first sensing element provided in an embodiment of this application;

[0095] Figure 26 This is a schematic diagram of the internal structure of the earphone portion provided in an embodiment of this application;

[0096] Figure 27 This is a schematic diagram of the first circuit board and the motherboard provided in an embodiment of this application;

[0097] Figure 28 for Figure 27 A diagram from another perspective;

[0098] Figure 29 This is a cross-sectional schematic diagram of the first circuit board provided in an embodiment of this application;

[0099] Figure 30 A schematic diagram of the first circuit board provided in an embodiment of this application;

[0100] Figure 31 An internal schematic diagram of another embodiment of the headphones provided in this application;

[0101] Figure 32 An internal schematic diagram of yet another embodiment of the headphones provided in this application;

[0102] Figure 33 An internal schematic diagram of yet another embodiment of the headphones provided in this application;

[0103] Figure 34 A schematic diagram of the second mounting bracket provided in an embodiment of this application;

[0104] Figure 35 An internal schematic diagram of another embodiment of the headphones provided in this application;

[0105] Figure 36 This is a schematic diagram of the second mounting bracket provided in an embodiment of this application from another angle;

[0106] Figure 37 A schematic diagram of the second circuit board provided in an embodiment of this application;

[0107] Figure 38 An internal schematic diagram of yet another embodiment of the headphones provided in this application;

[0108] Figure 39This is a schematic diagram illustrating the positional relationship between the voice processing unit and the speaker provided in an embodiment of this application.

[0109] Figure 40 This is a schematic diagram showing another positional relationship between the voice processing unit and the speaker provided in an embodiment of this application;

[0110] Figure 41 A schematic diagram of the second main body and the third mounting bracket provided in the embodiments of this application;

[0111] Figure 42 This is a schematic diagram of the speaker and the third mounting bracket provided in an embodiment of this application;

[0112] Figure 43 A schematic diagram of the third mounting bracket provided in an embodiment of this application;

[0113] Figure 44 An internal schematic diagram of yet another embodiment of the headphones provided in this application;

[0114] Figure 45 This is a schematic diagram of the earphone provided in an embodiment of this application, without showing the second body;

[0115] Figure 46 This is a schematic diagram from another perspective of the third mounting bracket provided in an embodiment of this application;

[0116] Figure 47 A schematic diagram from another perspective of the second subject provided in an embodiment of this application;

[0117] Figure 48 This is a schematic diagram of the headphone function partitions provided in an embodiment of this application;

[0118] Figure 49 This is a schematic diagram of the headphone leakage test provided in an embodiment of this application.

[0119] Figure Labels

[0120] 1-Main body, 11-First main body, 111-First cavity, 112-First through hole, 113-Sixth through hole, 114-Voice processing unit, 12-Second main body, 121-Second cavity, 122-Second through hole, 123-Protrusion, 124-Third microphone, 125-Wear sensor, 13-Second sensor, 14-Third mounting bracket, 141-Third cavity, 142-Fifth through hole, 143-Recess, 144-Mounting space, 145-Connecting part, 145a-Seventh through hole, 15-Speaker;

[0121] 2-Control component; 21-First mounting bracket; 211-Third through hole; 212-First step portion; 213-First notch portion; 214-Second step portion; 22-Antenna assembly; 23-Rotating component; 231-Body part; 232-First elastic component; 233-Magnetic conductive component; 234-Limiting mating part; 24-First sensing component; 25-Second cover plate; 251-Second notch portion; 252-Limiting protrusion; 26-First cover plate; 27-Second mounting bracket; 271-Limiting hole; 272-Limiting groove; 273-Connecting mating part; 274-Second elastic component; 275-First support part; 276-Second support part;

[0122] 3-Main board, 31-Fourth through hole, 32-Limit post;

[0123] 4-Gap; 5-First microphone; 6-Second microphone; 7-First circuit board; 71-Shielding component; 72-First connecting part; 73-Second connecting part; 74-Third connecting part; 75-Fourth connecting part; 76-First bending section; 77-Second bending section; 78-Third bending section; 8-Second circuit board; 81-Charging connecting part; 82-Connector; 9-Ear hook; 91-Wire harness;

[0124] 10-Human ear, 101-Ear canal, 102-Crura helix, 103-Cavum conchae.

[0125] 20 - Speaker area; 30 - Electronic component area; 40 - Interaction area. Detailed Implementation

[0126] To better understand the technical solution of this application, the embodiments of this application will be described in detail below with reference to the accompanying drawings.

[0127] It should be understood that the described embodiments are merely some, not all, of the embodiments in this application. All other embodiments obtained by those skilled in the art based on the embodiments in this application without inventive effort are within the scope of protection of this application.

[0128] The terminology used in the embodiments of this application is for the purpose of describing particular embodiments only and is not intended to be limiting of this application. The singular forms “a,” “the,” and “the” used in the embodiments of this application and the appended claims are also intended to include the plural forms unless the context clearly indicates otherwise.

[0129] It should be understood that the term "and / or" used in this article is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, or B existing alone. Additionally, the character " / " in this article generally indicates that the preceding and following related objects have an "or" relationship.

[0130] This application provides an earphone that can be worn on the ear for playing audio or making voice calls. Typically, an earphone consists of two earpieces, worn on the left and right ears respectively. In some scenarios, users may wear only one earpiece, choosing to wear either the left or right earpiece as needed.

[0131] The earbuds can be charged via the charging case, and the earbuds can be stored in the charging case. When the earbuds are stored in the charging case, the charging case charges the earbuds. Users can wear only one earbud or both earbuds. For ease of use, the earbuds are ambidextrous, meaning that users do not need to distinguish between the left and right ears; they can choose to wear the earbud in either ear according to their needs. This wearing method allows the user to use one earbud to receive audio from the earbuds and the other earbud to receive ambient sounds. When walking on the road, the user can receive ambient sounds through the earbud not wearing an earbud, thus avoiding surrounding vehicles and improving safety. The earbuds can also be configured as separate left and right earbuds. When wearing the earbuds, the two earbuds can be worn in the left and right ears respectively. When the earbuds play audio, they can form stereo sound, which enhances the user experience. When a user wears two earbuds to listen to music, each earbud can play different sound signals, creating a stereo sound space, making the music more layered, enhancing the sense of space and realism, and giving the user an immersive feeling. When a user wears two headphones while gaming, each headphone can play different sounds. The user can use these sound differences to determine the direction and distance of the sound source, allowing them to quickly pinpoint the location of targets. The difference in sound between the left and right channels enhances the user's immersive gaming experience.

[0132] Headphones can be wireless, such as true wireless stereo (TWS) headphones and open wearable stereo (OWS) headphones. Because there are no headphone wires, wireless headphones are more convenient to wear and reduce the feeling of constraint. Connecting via wireless signals such as Bluetooth allows the headphones to be compatible with various electronic devices. TWS headphones are typically in-ear or semi-in-ear headphones, which can be inserted into the ear canal or rest on the earlobe when worn. OWS headphones do not need to be inserted into the ear canal, avoiding pressure on the ear canal when worn. When used outdoors or during exercise, users can receive both audio and ambient sound simultaneously, allowing them to perceive changes in their surroundings and improving safety.

[0133] As an audio playback device, the sound quality of headphones is one of the factors affecting the user experience. Improving the sound quality of headphones can enhance the user's immersion, thereby providing a better user experience.

[0134] Headphones can also be clip-on headphones, where the clip holds the ear in place. If the clip's clamping force is too weak, the headphones will be unstable, easily wobbling or even falling out during use. If the clip's clamping force is too strong, it will increase pressure on the ear, potentially causing pain and affecting the user experience.

[0135] Taking in-ear and semi-in-ear headphones as examples, in-ear headphones need to be inserted into the ear canal, which can cause pressure and lead to ear pain with prolonged use. In-ear headphones also keep the ear canal moist and relatively closed, increasing the risk of ear infections. Semi-in-ear headphones rely on the concha and external auditory canal for support, which can also cause pressure on the concha and pain with prolonged use. Furthermore, the overlapping fit between semi-in-ear headphones and the ear results in a less comfortable wearing experience.

[0136] Typically, headphones are controlled via touch controls. Users can tap or slide on the headphones to perform various operations, including but not limited to increasing or decreasing volume, starting playback, pausing playback, answering or ending calls, turning noise cancellation on or off, fast forwarding, rewinding, and activating the voice assistant. Due to the small overall size of the headphones and the limited area for touch recognition, high accuracy is required for touch operations, making accidental touches a possibility.

[0137] Therefore, embodiments of this application provide headphones with better sound quality, better wearing comfort, and better interactivity.

[0138] like Figure 1 As shown, Figure 1 This is a schematic diagram illustrating the wearing state of the earphone provided in this application embodiment. This application embodiment provides an earphone, including a main body 1 and an ear hook 9. The ear hook 9 is connected to the main body 1, and when worn by a user, it can be hooked onto the ear 10. The ear hook 9 can be an arc-shaped structure. The side of the face is considered the front, the side of the back of the head is considered the back, the side of the top of the head is considered the top, and the side of the chin is considered the bottom. When the user wears the earphone, part of the ear hook 9 can be positioned in the direction of the ear 10 and bend towards the back of the ear 10. Specifically, the ear hook 9 can be located between the ear 10 and the head.

[0139] When wearing the headphones, the headphones are worn on the ear 10 via a hook-on method. Compared to ear clips, ear hooks have a larger contact area with the ear 10, allowing for more stable contact from multiple directions. Furthermore, compared to ear clips, ear hooks reduce pressure on the ear 10, thus improving wearing comfort.

[0140] like Figure 2 As shown, Figure 2 This is a schematic diagram of the headphones provided in an embodiment of this application. The ear hook 9 can be curved as a whole so that it can better fit the human ear, thereby improving the stability of the headphones when worn.

[0141] like Figure 3 and Figure 4 As shown, Figure 3 This is a schematic diagram of the structure of the earphone provided in an embodiment of this application. Figure 4 This is a cross-sectional view of the earphone provided in an embodiment of this application. The embodiment of this application provides an earphone, which includes a main body 1. The main body 1 may include a first main body 11 and a second main body 12 connected to each other. The first main body 11 and the second main body 12 are connected to each other, and the second main body 12 protrudes along the thickness direction of the main body 1. The first main body 11 and the second main body 12 may be integrally formed or may be a separate structure, fixedly connected by means of snap-fit, adhesive, welding, etc. The main body 1 may be used to house a control component 2, a first microphone 5, a second microphone 6, a speaker 15, and a mainboard 3, etc. The first main body 11 may have a first cavity 111, and the mainboard 3, the first microphone 5, and the second microphone 6 may be located within the first cavity 111.

[0142] like Figure 4 and Figure 5 As shown, Figure 5 This is a schematic diagram of the second body provided in an embodiment of this application. (In conjunction with...) Figure 4 and Figure 5 The first body 11 has a first through hole 112, which communicates with the first cavity 111. The second body 12 has a second cavity 121 and a second through hole 122. The second through hole 122 communicates with the second cavity 121 and serves to connect the second cavity 121 to the outside of the second body 12. The first through hole 112 can serve as the receiving hole of the second microphone 6, and the second through hole 122 can serve as the sound outlet of the earphone.

[0143] Please continue to refer to this. Figure 4The speaker 15 is located in the second cavity 121 and transmits sound through the second through hole 122. The headset also includes a motherboard 3 and a second microphone 6. The motherboard 3 is located in the first cavity 111 and is installed in the first body 11. The second microphone 6 is installed in the motherboard 3 and is located in the first cavity 111. The second microphone 6 can be a call microphone, used to receive the user's voice when the user makes a phone call, records, etc.

[0144] Please continue to refer to this. Figure 6 , Figure 6 This is a diagram showing the headphones in a worn state; some internal structures of the headphones are not shown. Please refer to... Figure 4 and Figure 7 When the earphone is in the wearing state, the first through-hole 112 is located below the first main body 11, and the first through-hole 112 can be located on the outside of the ear. The second microphone 6 picks up sound through the first through-hole 112. By setting the first through-hole 112 in the bottom area of ​​the first main body 11, the first main body 11 is positioned closer to the chin when the earphone is in the wearing state. This design makes the first through-hole 112 closer to the user's mouth when the earphone is in the wearing state, which facilitates sound pickup when the user is speaking, thus improving the sound pickup quality.

[0145] Please continue to refer to this. Figure 7 , Figure 7 This is a schematic diagram of a human ear model. Because there is a crus 102 of the helix 102 above the ear canal 101 of the human ear 10, the crus 102 of the helix 102 protrudes laterally relative to the concha cavity 103. For example... Figure 8 As shown, Figure 8 This is a schematic diagram of an earphone in the wearing state according to related technology. Typically, when wearing earphones, the earpiece needs to avoid the helix base 102. Because the earphone needs to avoid the helix base 102 when worn, part of the earphone structure needs to be bent away from the ear canal 101. This results in a relatively large distance between the earphone shell 1 and the ear canal 101, and consequently, a relatively large distance between the second through-hole 122 and the ear canal 101, typically around 9 to 13 millimeters. An excessively large distance between the earphone and the ear canal 101 can easily lead to sound leakage, affecting sound quality.

[0146] To address this technical problem, the solutions provided in the embodiments of this application are described in conjunction with... Figure 4 and Figure 6 The second body 12 protrudes relative to the first body 11 along the thickness direction of the body 1. When the earphone is in the wearing state, the second body 12 is located on the side of the first body 11 facing the ear and extends towards the ear canal 101, thereby helping to reduce the distance between the earphone and the ear canal 101.

[0147] like Figure 6 As shown, Figure 6The internal structure of the earphone is not shown. The second through-hole 122 can serve as a sound outlet and is located on the second body 12. The second through-hole 122 is typically positioned on the side of the second body 12 directly opposite the ear canal 101, meaning the distance between the second through-hole 122 and the ear canal 101 is approximately 3 to 6 millimeters. This design further reduces the distance between the second through-hole 122 and the ear canal 101, thereby reducing sound leakage and improving sound quality. Additionally, as... Figure 7 As shown, the second main body 12 extends towards the ear canal 101 but does not penetrate into it. This prevents the ear canal from becoming relatively enclosed when the user wears the headphones, allowing air to circulate and helping to keep the ear canal dry and reduce bacterial growth. The fact that the headphones do not penetrate the ear canal also reduces pressure on it, improving wearing comfort and user experience. The second main body 12 protrudes and extends towards the ear canal 101, allowing the headphone surface to better conform to the structure of the human ear. The protrusion of the second main body 12 can be arc-shaped, and the parameters of the arc can be designed according to the structure of the human ear to ensure a better fit and improve wearing comfort.

[0148] Please combine Figure 6 and Figure 9 , Figure 9 This is a schematic diagram of the headphones in a wearing state according to an embodiment of this application, and some internal structures of the headphones are not shown. Additionally, Figure 9 To and Figure 6 A schematic diagram with a vertical viewing angle. In one possible implementation, when the headphones are worn, at least a portion of the second body 12 protrudes downwards, and at least a portion of the second body 12 protrudes backwards, so that the second body 12 can avoid the helix feet. The second through hole 122 can be formed on the side of the second body 12 near the ear canal 101. This design allows the second body 12 to protrude towards the ear canal 101 of the human ear 10, thereby allowing the second through hole 122 to be closer to the ear canal 101, which helps to reduce sound leakage, improve the sound quality of the headphones, and thus improve the user experience.

[0149] When designing the structure of the second main body, a human ear model can be used for virtual wearing, thereby adjusting the structure of the second main body to better fit the structure of the human ear, allowing the headphones to fit the ear better and improving wearing comfort.

[0150] like Figure 9As shown, in one possible implementation, the headphones provided in this application embodiment can be OWS headphones, and the second body 12 does not extend into the ear canal 101, thus reducing pressure on the ear canal 101. The ear canal 101 can communicate with the outside world to allow air circulation, which helps keep the ear canal 101 dry and reduces bacterial growth. At the same time, when the user wears the headphones, they can also receive ambient sound, allowing the user to promptly detect changes in the environment and improve safety.

[0151] In one specific embodiment, such as Figure 4 As shown, at least a portion of the speaker 15 is disposed within the second cavity 121 of the second body 12, which helps to reduce the distance between the speaker 15 and the ear canal, thereby reducing sound leakage from the headphones and facilitating the transmission of sound from the speaker 15 into the ear canal. Because the distance between the speaker 15 and the second through-hole 122 and the ear canal is relatively short, the distance between the speaker 15 and the ear canal, as well as the sound transmission distance, is shortened. Therefore, sound loss during transmission can be reduced, and the performance requirements for the speaker 15 can be lowered. A smaller speaker 15 can be used, thus saving costs and achieving the effect of a large speaker 15 with a smaller size. When using a speaker 15 of the same size as other headphones, the solution provided in this application embodiment has better sound quality than other headphones due to the shorter sound transmission distance and less sound loss.

[0152] In one possible implementation, the diameter of the speaker provided in this application embodiment can be 10 mm to 11 mm.

[0153] After testing, compared to Figure 8 In the solutions provided in the related technologies, specifically the solution provided in this application embodiment, when the diameter of the speaker is 10.86 mm, the sound quality of the headphones is equivalent to that of headphones using a speaker with a diameter of 11 mm in the related technologies. When the solution provided in this application embodiment uses a speaker with a diameter of 11 mm, the sound quality of the headphones can be improved by 10% to 15% compared to a speaker with a diameter of 10.86 mm.

[0154] Please continue to refer to this. Figure 10 and Figure 11 , Figure 10 for Figure 4 Explosion diagram, Figure 11This is a partial schematic diagram of the headphones. The headphones also include a control component 2, which is mounted on the first main body 11. The control component includes a first mounting bracket 21, an antenna assembly 22, a rotating element 23, and a first sensing element 24. The antenna assembly 22 is used to receive and transmit signals. The first sensing element 24 is used to sense the user's operation on the first cover plate 26 to identify the user's touch operation. The first mounting bracket 21 is connected to the first main body 11, and the rotating element 23 is sleeved on the outside of the first mounting bracket 21 and can rotate relative to the first mounting bracket 21. The control component 2 may also include the first cover plate 26, which is used to protect the structure of the control component 2. The first mounting bracket 21 is mounted on the first main body 11, and the antenna assembly 22 can be disposed on the first mounting bracket 21. When the user rotates the rotating element 23, the headphones can be controlled; that is, the control component 2 has a knob-type structure. Please refer to... Figure 6 When the headphones are worn, the control component 2 is located on the outside of the ear, the second body 12 extends into the ear, the first body 11 is located between the control component 2 and the second body 12, and a part of the first body 11 extends into the ear.

[0155] The control operations that can be achieved by rotating the rotating component 23 include, but are not limited to, increasing volume, decreasing volume, starting playback, pausing playback, answering a call, hanging up a call, turning noise cancellation on, turning noise cancellation off, fast forward, rewind, and activating a voice assistant. Taking volume adjustment by rotating the rotating component 23 as an example, opposite first and second directions can be preset, one of which can be clockwise and the other counterclockwise. When the user rotates the rotating component 23 in the first direction, the volume increases; when the user rotates the rotating component 23 in the second direction, the volume decreases. In use, the adjustment amount of the corresponding parameter can be determined based on the angle at which the user rotates the rotating component 23. Again, using the volume adjustment example mentioned earlier, when the user rotates the rotating component 23 in the first direction, the larger the angle of rotation, the greater the volume increase; the smaller the angle of rotation, the less the volume increase. When the user rotates the rotating component 23 in the second direction, the larger the angle of rotation, the greater the volume decrease; the smaller the angle of rotation, the less the volume decrease.

[0156] In one possible implementation, such as Figure 12 As shown, Figure 12 This is a schematic diagram of the internal structure of an earphone provided in an embodiment of this application. The first cavity 111 is provided with at least one second sensor 13. (As shown...) Figure 13 As shown, Figure 13This is a schematic diagram of the rotating component provided in an embodiment of this application. The rotating component 23 has a ring structure. The rotating component 23 is provided with at least one magnetic conductive element 233. When the rotating component 23 rotates relative to the first mounting bracket 21, the magnetic conductive element 233 moves relative to the second sensing element 13. The second sensing element 13 can be a coil or other component. The magnetic conductive element 233 can be a magnet, metal, or other component. The rotating component 23 can include multiple magnetic conductive elements 233. When the rotating component 23 includes multiple magnetic conductive elements 233, the magnetic conductive elements 233 are spaced apart along the circumference of the rotating component 23.

[0157] By incorporating a magnetic conductor 233 in the rotating component 23, the magnetic conductor 233 can move relative to the second sensing element 13 when the rotating component 23 rotates, thereby causing a change in the second sensing element 13. Taking a copper foil as the magnetic conductor 233 and a coil as the second sensing element 13 as an example: When the coil is energized, it generates a magnetic field. When the copper foil moves relative to the coil, it moves within the coil's magnetic field and cuts magnetic field lines, thus generating an induced current and its own magnetic field. The magnetic field generated by the copper foil interacts with the magnetic field of the coil, altering the spatial magnetic field distribution. When the magnetic conductor 233 moves relative to the second sensing element 13, it causes changes in the induced current and magnetic field. Based on these changes, a corresponding signal can be generated, which is then used to control the headphones.

[0158] like Figure 14 As shown, Figure 14 This is a schematic diagram of the structure of the rotating member provided in this application in a specific embodiment. In one possible implementation, the rotating member 23 includes a body portion 231 and a first elastic member 232. The body portion 231 is annular, the first elastic member 232 is located on the side of the body portion 231 facing the first mounting bracket 21, and a magnetic conductive member 233 is disposed on the first elastic member 232 and located inside the first elastic member 232.

[0159] The first elastic element 232 serves to seal and buffer, and can also compensate for fitting errors. The first elastic element 232 can be made of rubber or similar materials, which makes it easier to install the magnetic conductor 233. Furthermore, the elasticity of the first elastic element 232 can reduce the impact of assembly errors on the magnetic conductor 233, better meeting practical application requirements.

[0160] like Figure 15 and Figure 16 As shown, Figure 15 This is a schematic diagram of the internal structure of the earphone provided in an embodiment of this application. Figure 16 This is a partial schematic diagram of the first body provided in an embodiment of this application. (In conjunction with...) Figure 15 and Figure 16The first body 11 has a first cavity 111 and a first through hole 112. The first through hole 112 communicates with the first cavity 111 and is used to connect the first cavity 111 with the outside of the first body 11.

[0161] like Figure 15 As shown, the earphone includes a first microphone 5, which is mounted on the main board 3. The control component 2 includes a first cover plate 26, which is located along the thickness direction of the main body 1 on the side of the first mounting bracket 21 away from the interior of the main body 1. The first cover plate 26 can be a decorative piece or the like, used to protect the internal structure of the earphone. The first mounting bracket 21 includes a third through hole 211, which can serve as a pickup hole to improve the noise reduction effect of the earphone. The first cover plate 26 is located along the thickness direction of the main body 1 on the side of the first mounting bracket 21 away from the interior of the main body 1. A rotating component 23 is sleeved on the outside of the first cover plate 26 and the first mounting bracket 21, and can rotate relative to the first cover plate 26 and the first mounting bracket 21.

[0162] like Figure 17 As shown, there is a gap 4 between the rotating part 23 and the first cover plate 26, and the third through hole 211 communicates with the gap 4. The first microphone 5 picks up sound through the third through hole 211. The first microphone 5 can be a feed-forward microphone (FF mic). Feed-forward microphones can be used in active noise cancellation (ANC) technology. The basic principle of ANC noise cancellation technology is to neutralize noise by generating a sound wave that is opposite to the external noise through the noise cancellation system, thereby achieving noise reduction. The feed-forward microphone is used to collect noise signals in the environment and transmit the collected noise signals to the noise cancellation system for processing. Noise reduction is achieved by generating a sound wave with the opposite phase, frequency, and amplitude to the noise. The first microphone 5 can collect ambient sound through the third through hole 211 to obtain noise signals, so that the headphone's noise cancellation system can perform noise reduction, thereby improving the user experience.

[0163] like Figure 18 As shown, Figure 18 This is a cross-sectional view of the first mounting bracket provided in an embodiment of this application. The first mounting bracket 21 may include a first notch 213, one end of which penetrates the first mounting bracket 21 radially, and a third through hole 211 communicates with the first notch 213. Figure 19 As shown, Figure 19 for Figure 15 A magnified view of the central I position. (Combined with...) Figure 18 and Figure 19 The first cover plate 26 covers at least a portion of the first notch 213, which is used to connect the gap 4 and the third through hole 211.

[0164] This design allows the path between gap 4 and the third through hole to include at least one corner, which helps improve the waterproof and dustproof capabilities of the headphones, reduces the possibility of liquids, dust, and impurities entering the headphones, and thus helps improve the stability of the headphones' operation.

[0165] like Figure 19 As shown, in one possible implementation, the extending direction of the first notch 213 is perpendicular to the axial direction of the third through hole 211.

[0166] This design allows the gap 4, the first notch 213, and the third through hole 211 to form an approximate shape. The structure is such that when dust, liquid, or other impurities enter gap 4, they need to bend at least twice before reaching the area where the first microphone 5 is located. This design reduces the possibility of dust, liquid, or other impurities coming into contact with the first microphone 5, thus improving the headphone's dustproof and waterproof capabilities.

[0167] like Figure 19 As shown, in one possible implementation, the control assembly 2 further includes a second cover plate 25, which is located on the side of the first cover plate 26 facing the first mounting bracket 21. Figure 20 As shown, the second cover plate 25 can be approximately an annular structure and is located between the first mounting bracket 21 and the rotating member 23. Along the thickness direction of the main body 1, the second cover plate 25 abuts against the first mounting bracket 21 and the rotating member 23.

[0168] The second cover plate 25 can be used to limit the first mounting bracket 21 and the rotating member 23 along the thickness direction of the main body 1, so as to improve the relative position accuracy of the first mounting bracket 21 and the rotating member 23 and the stability of the installation.

[0169] like Figure 20 As shown, in one possible implementation, the second cover plate 25 includes a second notch 251 that extends radially through the second cover plate 25 and connects the first notch 213 and the gap 4.

[0170] By providing the second notch 251, the possibility of the second cover plate 25 obstructing the connection between the third through hole 211 and the gap 4 can be reduced. At the same time, the second cover plate 25 can also be used to block the gap between the first mounting bracket 25 and the rotating member 23, so as to reduce the impact of the gap between the first mounting bracket 25 and the rotating member on the transmission of sound and reduce the possibility of excessive reflection of sound during transmission.

[0171] like Figure 20As shown, in one possible implementation, the second cover plate 25 includes at least two circumferentially spaced limiting protrusions 252. (In conjunction with...) Figure 17 As shown, the limiting protrusion 252 extends into the gap 4. Along the radial direction of the first cover plate 26, the first cover plate 26 abuts against the limiting protrusion 252.

[0172] By setting a limiting protrusion 252 on the second cover plate 25, the first cover plate 26 can be limited, which helps to improve the installation accuracy of the first cover plate 26 and the relative position accuracy between the first cover plate 26 and components such as the first mounting bracket, so that the first cover plate 26 can better protect the internal structure of the earphone.

[0173] In one possible implementation, the inner ring of the second cover plate may have a recess, and the first mounting bracket may have a protrusion. The protrusion can engage with the recess to improve the fitting accuracy between the second cover plate and the first mounting bracket. Simultaneously, adhesive dispensing or other operations can be performed in the recess to improve the connection stability between the second cover plate and the first mounting bracket.

[0174] Please continue to refer to this. Figure 18 As shown, in one possible embodiment, the first mounting bracket 21 has a first step portion 212 and a second step portion 214 arranged circumferentially along the first mounting bracket 21. Along the thickness direction of the main body 1, the second step portion 214 is located on the side of the first step portion 212 facing the first cover plate 26. The first clearance portion 212 is used to accommodate the rotating member 23, and the second step portion 214 is used to accommodate the second cover plate 25.

[0175] By setting the first step portion 212 and the second step portion 214, the rotating member 23 and the second cover plate 25 can be limited, which helps to improve the stability of the rotating member 23 and the second cover plate 25 when they are sleeved with the first mounting bracket 21.

[0176] The cross-sectional area of ​​the end of the third through hole 211 facing the first microphone can be relatively large, meaning the third through hole 211 can be a tapered hole, a stepped hole, or other structures. This design can reduce the relative positional accuracy requirements of the first microphone, the fourth through hole, and the third through hole 211, and reduce the impact of machining and assembly errors on the relative position between the third through hole 211, the fourth through hole, and the first microphone.

[0177] Please continue to refer to this. Figure 15 In one possible implementation, the third through-hole 211 and the second microphone 6 are located on opposite sides of the first sensor 24 radially, that is, the first sensor 24 is located between the third through-hole 211 and the second microphone 6. The position of the third through-hole 211 corresponds to the position of the first microphone 5, and the specific position of the third through-hole 211 is described in detail below.

[0178] like Figure 21 As shown, the location of the third through hole on the first body can be chosen in several ways. For example, the third through hole can be made at positions 1, 2, and 3 in the figure, and tests can be conducted. The test results are as follows. Figure 22 and Figure 23 As shown. Figure 22 The vertical axis represents isolation, and the horizontal axis represents frequency. Figure 23 The vertical axis represents coherence, and the horizontal axis represents frequency. Isolation is the signal difference between the in-ear signal and the first microphone signal; the larger the absolute value of the isolation, the more stable the system. Coherence is the signal difference between the feedforward microphone and the feedback microphone (FB mic). In the embodiments of this application, please refer to... Figure 24 , Figure 24 This is a schematic diagram of the internal structure of the headphones provided in this embodiment. In the solution provided in this embodiment, the feedforward microphone is a first microphone 5, and the feedback microphone is a third microphone 124. The third microphone 124 is disposed in the second cavity. The third microphone 124 can be a feedback microphone (FB mic). The feedback microphone plays an important role in active noise-canceling headphones. Its principle is to collect noise signals inside the headphones by installing a microphone inside the headphones and facing the speaker 15. The noise cancellation system generates signals of the same magnitude but opposite phase based on these signals to cancel out the noise inside the headphones. Typically, the first microphone (FF mic) is used to collect noise signals outside the headphones, and the third microphone 124 (FB mic) is used to process noise signals inside the headphones. The simultaneous presence of the first microphone and the third microphone 124 can improve the noise cancellation effect and enhance the user experience.

[0179] A higher absolute value of coherence indicates stronger signal correlation, allowing the signal to be described using a transfer function. The controller can then use algorithms to calculate the required anti-phase sound waves and generate them to cancel noise, thus improving noise reduction capabilities. Conversely, a lower absolute value of coherence indicates weaker signal correlation, making it more difficult to describe the signal using a transfer function. This increases the difficulty and accuracy of calculating the anti-phase sound waves, negatively impacting noise reduction performance. Therefore, all other things being equal, a higher absolute value of isolation results in better headphone performance.

[0180] according to Figure 22 As shown in the curve, the absolute value of the isolation at position 3 is smaller than that at positions 1 and 2. Considering the isolation factor, opening a third through hole at positions 1 and 2 is more effective than opening a third through hole at position 3. Figure 23As shown in the curve, the absolute value of coherence at position 3 is greater than that at positions 1 and 2. Considering the coherence factor, opening the third through hole at position 3 is more effective than opening the third through hole at positions 1 and 2.

[0181] like Figure 24 As shown in the overall structure of the earphone provided in this embodiment, position 3 is relatively close to the first through-hole 112 and the second microphone 6, which will affect the arrangement and performance of the second microphone 6. The second microphone 6 is typically a call microphone. If a third through-hole is opened at position 3, it will affect the call beam, thus affecting the call quality and ruining the user experience. Therefore, a third through-hole is usually not opened at position 3. The overall difference in isolation and coherence between positions 1 and 2 is small, so the effect of opening a third through-hole at positions 1 and 2 is similar. Compared to position 2, position 1 is closer to the edge of the earphone, so it is easier to set a third through-hole at position 1, and the impact on other components of the earphone is relatively small. It also facilitates the arrangement of waterproof and dustproof components, and the possibility of interference between waterproof components and other components is small. The first sensor is usually located in the middle of the earphone, and the projection area of ​​the first sensor on the first cover plate corresponds to the touch area. The third through-hole is opened at the edge of the first mounting bracket, which can be used to avoid the touch area, thereby reducing the impact of the third through-hole on the touch area. It better meets actual usage needs and helps improve the user experience.

[0182] Antenna assembly 22 is electrically connected to motherboard 3 and is mounted on first mounting bracket 21. Antenna assembly 22 can be used to receive or transmit signals for wireless connection with electronic devices. Devices capable of wireless connection with headphones include, but are not limited to, mobile phones, tablets, personal digital assistants (PDAs), laptops, in-vehicle computers, and other electronic devices.

[0183] Please continue to refer to this. Figure 15The control component also includes at least one first sensor 24 electrically connected to the motherboard 3. The first sensor 24 is used to implement touch control. When the user taps or slides the headphones, the first sensor 24 can undergo a slight deformation, causing a change in its capacitance value. The headphone controller can identify the user's operation by detecting the change in the capacitance value of the first sensor 24, thereby realizing the corresponding control operation. The area on the surface of the headphones corresponding to the first sensor 24 can form a touch area. Different functions can be realized according to the number of taps, the direction of the slide, and the duration of the press, including but not limited to increasing volume, decreasing volume, starting playback, pausing playback, answering a call, hanging up a call, turning on noise cancellation, turning off noise cancellation, fast forward, rewind, and calling the voice assistant. The headphones can also have customizable functions, allowing users to set them according to their own usage habits. For example, when the headphones are being worn, the user can slide up to increase the volume and slide down to decrease the volume. Double-tapping pauses playback, and double-tapping again resumes playback. Three consecutive taps fast forward or play the next audio segment, and four consecutive taps rewind or play the previous audio segment. Users can long-press the touch area to turn noise reduction on or off.

[0184] The above content regarding touch control is for illustrative purposes only. In actual use, other control methods may also be included, such as tapping, swiping, and long-pressing the left and right earbuds to achieve different functions. In actual use, the design can be tailored to the user's needs, and no further limitations are imposed.

[0185] Control component 2 features a rotary knob design, allowing users to continuously adjust parameters without interruption. This means users can make continuous, uninterrupted adjustments via the knob, rather than being limited to switching between preset levels. This design improves the precision of user control over headphone parameters such as volume, enabling users to customize parameters to their needs and better meet their individual preferences, thus enhancing the user's interactive experience.

[0186] like Figure 17As shown, in one possible implementation, the gap 4 between the rotating member 23 and the first cover plate 26 is an annular gap. When the user rotates the rotating member 23, the first cover plate 26, the first mounting bracket 21, and the first microphone 5 all remain stationary, making the position of the third through hole 211 stationary relative to the first microphone 5. Since the annular rotating member 23 is sleeved with the first cover plate 26, and the gap 4 is located circumferentially between the rotating member 23 and the first cover plate 26, when the rotating member 23 rotates, no matter which position the rotating member 23 rotates to, there is always a gap 4 between the rotating member 23 and the first cover plate 26, and the position of the gap 4 will not change with the rotation of the rotating member 23. The third through hole 211 communicates with the outside through the gap 4. When the user controls the headphones through the rotating member 23, it will not affect the position of the third through hole 211 and the gap 4, that is, the first microphone 5 can always receive sound through the third through hole 211 and the gap 4 (the first microphone can receive sound through the gap 4). Figure 19 (The direction indicated by the thick line is used for sound pickup), which helps to improve the stability of the sound pickup of the first microphone 5.

[0187] like Figure 19 As shown, in one possible implementation, the first microphone 5 is disposed on the side of the motherboard 3 away from the control component 2. The motherboard 3 is provided with a fourth through hole 31, which communicates with the third through hole 211. In the projection along the thickness direction of the body 1, at least a portion of the fourth through hole 31 is located within the projection range of the first microphone 5.

[0188] This design allows the first microphone 5 to be positioned on the side of the motherboard 3 away from the control component 2, thereby reducing the possibility of interference between the first microphone 5 and the structure of the control component 2, and making the overall structure of the control component 2 more compact. The fourth through-hole 31 connects the third through-hole 211 and the first microphone 5, allowing the first microphone 5 to pick up sound through the third through-hole 211.

[0189] Please continue to refer to this. Figure 19 , Figure 19 This is a schematic diagram of the headphones provided in an embodiment of this application. Figure 19 In the figure, since the first sensor 24 is obscured by the first cover plate 26, the dashed line is used to indicate the position of the first sensor 24. In one possible embodiment, along the thickness direction of the body, the projection of the first sensor 24 is located within the projection range of the first cover plate 26.

[0190] This design allows at least a portion of the first cover plate 26 to serve as a touch area. The surface of the first cover plate 26 is relatively flat, which facilitates touch operation by the user and improves the recognition accuracy of the user's touch operation. This enhances the interactivity between the headphones and the user, thereby improving the user experience.

[0191] like Figure 25 As shown, Figure 25 This is a partial cross-sectional view of the earphone provided in an embodiment of this application. In one possible implementation, along the thickness direction of the body 1, the antenna assembly 22 and the second sensor 24 are located on opposite sides of the first mounting bracket 21.

[0192] By placing the antenna assembly 22 and the second sensor 13 on the first mounting bracket 21, the antenna assembly 22 and the first sensor 24 can be separated by the first mounting bracket 21, which helps to reduce the possibility of signal interference between the antenna assembly 22 and the first sensor 24, thereby improving the working stability of the antenna assembly 22 and the first sensor 24, and better meeting the actual use requirements.

[0193] Please refer to Figure 26 In one possible implementation, at least a portion of the projection of the antenna assembly 22 is located within the projection range of the first sensing element 24 along the thickness direction of the body 1.

[0194] This design allows the antenna assembly 22 and the first sensing element 24 to overlap to a certain extent, thereby reducing the radial space required for the antenna assembly 22 and the first sensing element 24 in the control assembly 2. This helps to reduce the size of the control assembly 2, which in turn helps to reduce the overall size of the headphones, prevents the headphones from putting too much pressure on the ears when worn, and improves the user experience.

[0195] like Figure 27 As shown, Figure 27 This is a partial internal schematic diagram of the earphone provided in an embodiment of this application. Figure 27 The main body and other structures of the headphones are not shown. In one possible embodiment, the headphones include a shielding member 71 and a first circuit board 7, with a first sensing member 24 disposed on the first circuit board 7 and the shielding member 71 disposed on the first circuit board 7. Figure 28 As shown, Figure 28 for Figure 27 A schematic diagram from another perspective. The first circuit board 7 is electrically connected to the main board 3. The shielding component 71 can be a radio frequency inductor (chock inductor), also known as a radio frequency choke or throttling inductor. For high-frequency signals of 2.4 GHz, the inductance of the shielding component 71 acts as a barrier, thereby providing shielding and reducing the possibility of mutual interference between the antenna assembly 22 and the first sensing element 24, which is beneficial to improving the operational stability of the antenna assembly 22 and the first sensing element 24. The first circuit board 7 can be a flexible printed circuit board (FPC).

[0196] The shielding component 71 is positioned as close as possible to the first sensor 24 during installation. Simultaneously, considering the structure of other components within the earphone, the shielding component 71 is positioned to avoid obstructing the first mounting bracket 21 and other structures.

[0197] like Figure 29 As shown, Figure 29 This is a cross-sectional view of the first circuit board provided in an embodiment of this application. In one possible implementation, the first sensor 24 can be embedded in the first circuit board 7, which can reduce electromagnetic interference to the first sensor 24 and thus improve the operational stability of the first sensor 24. Placing the first sensor 24 inside the first circuit board 7 also helps to protect the first sensor 24, reducing the possibility of damage caused by collisions or friction with other components, and also reducing the impact of moisture and oxidation on the first sensor 24.

[0198] like Figure 30 As shown, Figure 30 This is a schematic diagram of the first circuit board provided in an embodiment of this application. In one possible implementation, the earphone may further include a wiring harness 91. The first circuit board 7 includes a first connecting portion 72, a second connecting portion 73, and a third connecting portion 74 that are interconnected. Please refer to... Figure 27 The first sensing element 24 is embedded in the first connecting part 72, the second connecting part 73 is used for electrical connection with the motherboard 3, and the third connecting part 74 is used for connecting the wire harness 91. Figure 31 As shown, along the thickness direction of the main body 1, the first connecting part 72, the second connecting part 73 and the third connecting part 74 are spaced apart from each other.

[0199] The ear hook may be equipped with sensors, microphones, and other structures. The sensors can be used to detect the wearing status of the headphones, and the microphones can be used to collect ambient sound to help with noise reduction. The wiring harness 91 can extend to the ear hook 9 for electrical connection with the sensors, microphones, and other components of the ear hook to transmit signals.

[0200] The first sensing element 24, wiring harness 91, etc. can be electrically connected to the motherboard through the same circuit board, which helps to save the number of circuit boards, make the internal structure of the headphones more compact, and thus help to reduce the size of the headphones.

[0201] like Figure 31 As shown, Figure 31This is a cross-sectional view of the earphone provided in an embodiment of this application. In one possible implementation, along the thickness direction of the main body 1, the third connecting portion 74 is located between the first connecting portion 72 and the second connecting portion 73. The first connecting portion 72 may be located on the side of the first circuit board closer to the first mounting bracket 21, the second connecting portion 73 may be located on the side of the main board 3 away from the first mounting bracket 21, and the third connecting portion 74 may be located on the side of the main board 3 closer to the first mounting bracket 21.

[0202] This design allows the first circuit board 7 to form a stacked structure in the thickness direction of the main body 1, which helps to save space and reduce the overall size of the headphones.

[0203] Please refer to Figure 27 The first circuit board 7 may include a fourth connecting portion 75, which connects the first connecting portion 72 and the second connecting portion 73. A shielding member 71 may be disposed on the fourth connecting portion 75 to block signals that need to be shielded, thereby reducing the possibility of additional signal transmission between the first sensing element 24 and the motherboard. The second connecting portion 73 and the third connecting portion 74 may be connected to opposite sides of the motherboard 3, respectively. This design improves the utilization rate of the motherboard and saves space in the headphone.

[0204] Please combine Figure 27 and Figure 28 In one possible implementation, along the thickness direction of the main body 1, the first connecting portion 72, the third connecting portion 74, and the fourth connecting portion 75 are located on the same side of the main board 3, and the first connecting portion 72 and the second connecting portion 73 are located on opposite sides of the main board 3.

[0205] This design improves the space utilization of the motherboard 3, thereby reducing its size and making it more suitable for actual use.

[0206] like Figure 30 As shown, in one possible implementation, the first circuit board 7 includes a first bending segment 76, a second bending segment 77, and a third bending segment 78. The first bending segment 76 connects the second connecting portion 73 and the fourth connecting portion 75. The second bending segment 77 connects the second connecting portion 73 and the third connecting portion 74. The third bending segment 78 connects the first connecting portion 72 and the fourth connecting portion 75.

[0207] By incorporating bending sections to facilitate adjustments to the positions of the first connecting part 72, the second connecting part 73, the third connecting part 74, and the fourth connecting part 75, the headphone structure becomes more compact. While each component is electrically connected to the main board 3 via the first circuit board 7, the space occupied by the first circuit board 7 within the headphone is reduced, thereby improving the internal space utilization of the headphone and reducing its overall size.

[0208] like Figure 31 As shown, Figure 32 This application provides an internal schematic diagram of an earphone. In one possible implementation, the earphone may include a plurality of first sensors 24, the number of which may be two, three, four, five or more. Each of the first sensors 24 is arranged sequentially in the first connecting portion 72.

[0209] This design improves the accuracy of the first sensor 24 in recognizing user touch operations, especially swipe gestures. When a user swipes on the touch area of ​​the earphone, the capacitance value of the first sensor 24 corresponding to the finger's location changes. The current position of the user's finger can be determined based on the changes in capacitance values ​​of the first sensor 24 at different locations. Furthermore, the direction of the user's swipe can be identified based on the amount and sequence of changes in capacitance values ​​of each first sensor 24. Please refer to [reference needed]. Figure 25 ,by Figure 25 Taking the direction shown as an example, the three first sensors 24 are arranged sequentially from left to right in the diagram. Taking a user swiping from left to right in the diagram as an example, when the user first starts swiping, their finger is positioned on the left side of the earpiece. The capacitance value of the first sensor 24 located on the left changes first, and the change is larger than that of the other first sensors 24. When the user swipes to the middle position, the capacitance value of the first sensor 24 located in the middle position changes larger than that of the first sensors 24 located in other positions. When the user swipes to the right position, the capacitance value of the first sensor 24 located on the right changes larger than that of the first sensors 24 located in other positions. Based on the order of the changes in the capacitance values ​​of each first sensor 24, it can be determined that the user is swiping from left to right. Conversely, when the user swipes from right to left, the principle is the same: the capacitance value of the first sensor 24 located on the right changes first, followed by the capacitance value of the first sensor 24 located in the middle and then the capacitance value of the first sensor 24 located on the left.

[0210] By setting multiple first sensors 24, the user's swipe operation can be recognized, thereby enriching the user's operation methods. Users can customize the operation according to their own usage habits, which is conducive to improving the user experience.

[0211] like Figure 33 As shown, Figure 33This is a schematic diagram of the internal structure of the earphone provided in an embodiment of this application. In one possible implementation, the control component 2 further includes a second mounting bracket 27, which is located on the side of the first mounting bracket 21 facing the first cavity 111, and the first connecting portion 72 is located on the side of the second mounting bracket 27 facing the first mounting bracket 21.

[0212] The second mounting bracket 27 is used to support the first sensor 24 so that the position of the first sensor 24 remains stable.

[0213] The first sensor is disposed at the first connection portion of the first circuit board. Therefore, the second mounting bracket can support the first sensor by supporting the first connection portion.

[0214] Please combine Figure 34 and Figure 35 , Figure 34 This is a schematic diagram of the second mounting bracket provided in an embodiment of this application. Figure 35 This is a schematic diagram of the internal structure of the earphone provided in an embodiment of this application. In one possible implementation, one of the second mounting bracket 27 and the main board 3 is provided with a limiting post 32, and the other is provided with a limiting hole 271. The limiting post 32 can cooperate with the limiting hole 271 to limit the relative position of the second mounting bracket 27 and the main board 3. At least a portion of the limiting post 32 can extend into the limiting hole 271.

[0215] This design improves the relative positional accuracy between the second mounting bracket 27 and the motherboard 3, as well as the stability of the second mounting bracket 27 during installation. Since the second mounting bracket 27 can provide support for the first sensing element 24, it also helps to improve the stability of the first sensing element 24, which is more in line with actual usage requirements.

[0216] like Figure 34 As shown, in one possible implementation, the second mounting bracket 27 is provided with a limiting groove 272, which is located on the side of the second mounting bracket 27 facing the motherboard. Figure 35 As shown, the second microphone 6 is located on the side of the motherboard 3 facing the second mounting bracket.

[0217] The second microphone 6 engages with the limiting groove 272 to limit the position of the second mounting bracket 27. At least a portion of the second microphone 6 can extend into the limiting groove 272.

[0218] This design allows the second microphone 6 to limit the position of the second mounting bracket 27, thereby improving the relative positional accuracy between the second mounting bracket 27 and the motherboard 3. Simultaneously, the second microphone 6 also supports the second mounting bracket 27, thus enhancing its stability.

[0219] In one possible implementation, such as Figure 34 As shown, the second mounting bracket 27 includes a connecting mating part 273. (As indicated...) Figure 35 As shown, the headphones include a second circuit board 8, which has a connector 82. The second circuit board 8 is electrically connected to the main board via the connector 82. The connector 82 can be a board-to-board connector (BTB connector). The speaker is electrically connected to the main board via the second circuit board 8. The connector 82 mates with a connection mating part 273 to limit the relative position between the second mounting bracket 27 and the main board 3.

[0220] This design allows the connector 82 to limit the relative position of the motherboard and the second mounting bracket 27, thereby improving the positional accuracy and stability of the second mounting bracket 27.

[0221] In the solutions provided in the embodiments of this application, such as Figure 34 and Figure 35 As shown, the second mounting bracket 27 can be supported by the limiting post 32, the connector 82, and the second microphone 6, and restrict the relative position of the second mounting bracket 27 and the motherboard from multiple directions, and indirectly connect to the motherboard 3, thereby optimizing the stress on the motherboard 3.

[0222] like Figure 34 As shown, in one possible implementation, the connecting mating part 273 may include at least one recessed structure, and the number of recessed structures may be one, two, three or more. Typically, the contact between the connecting mating part 273 and the connector 82 is a surface-to-surface contact. During contact, factors such as machining accuracy and contact surface deformation can lead to uneven stress distribution between the connecting mating part 273 and the connector 82, easily causing deformation, wear, and other issues, resulting in damage to both. By providing a recessed structure, the contact area between the connecting mating part 273 and the connector 82 can be reduced to a certain extent, thereby facilitating a more even distribution of stress between them, reducing the possibility of damage, and improving the service life of the headphones.

[0223] In the solution provided in this application embodiment, the second mounting bracket does not directly contact the motherboard, but is indirectly mounted on the motherboard through a connector, a limiting post, and a second microphone. The force above the second mounting bracket, that is, the force exerted by the first connecting part on the second mounting bracket, can be transmitted to the motherboard through three different contact positions, which helps to reduce the possibility of stress problems on the motherboard.

[0224] like Figure 36 As shown, in one possible implementation, the second mounting bracket 27 includes a first support portion 275 and a second support portion 276 interconnected, the first support portion 275 supporting the first connecting portion 72, and the second support portion 276 supporting the fourth connecting portion 75. (Combined) Figure 34 and Figure 36 As shown, the limiting groove 272 is located on the side of the second support 276 facing the motherboard.

[0225] This design increases the contact area between the second mounting bracket 27 and the first circuit board, and also elevates the first and fourth connecting parts, allowing them to avoid interference with the components on the motherboard and reducing the possibility of interference between the first and fourth connecting parts and other components.

[0226] like Figure 33 As shown, in one possible implementation, the control component may further include a second elastic element 274 located between the first sensing element 24 and the second mounting bracket 27.

[0227] The first sensing element 24 is embedded inside the first circuit board. Therefore, the second elastic element 274 is disposed between the first connecting portion 72 and the second mounting bracket 27 of the first circuit board, and supports the first sensing element 24 by contacting the first connecting portion 72. The second elastic element 274 can be a component such as foam. The second elastic element 274 can be in a compressed state.

[0228] In one possible implementation, the compression ratio of the second elastic element 274 is between 40% and 60%. The compression ratio can be calculated as compression ratio = (original length - compressed length) / original length.

[0229] By incorporating the second elastic element 274, the impact of assembly errors on the first sensor 24 and the second mounting bracket 27 can be reduced. Simultaneously, the second elastic element 274 can cause the first sensor 24 and the first circuit board 7 containing the first sensor 24 to tend to move closer to the first mounting bracket 21. This allows the first sensor 24 to be closer to the surface of the earphone, improving the accuracy of touch recognition. Furthermore, the second elastic element 274 can absorb assembly errors, improving the relative positional accuracy between the first connecting part and the second mounting bracket.

[0230] like Figure 37 As shown, in one possible implementation, the headset may also include at least one of a third microphone 124, a wear sensor 125, a charging connection 81, and a voice processing unit 114.

[0231] The third microphone 124 is electrically connected to the main board via the second circuit board 8. A wearing sensor 125 is mounted on the second main body and is also electrically connected to the main board via the second circuit board 8. The wearing sensor 125 is used to detect the wearing status of the headphones. The charging connector 81 (charging pin) is electrically connected to the main board via the second circuit board 8. The voice processing unit 114 (VPU) utilizes a bone conduction sensor to process sound signals based on the principle of sound wave transmission through human bone vibration. The chip within the bone conduction sensor converts the vibration signal generated by the sound wave into an electrical signal. Electronic devices connected to the headphones combine the bone conduction signal detected by the voice processing unit 114 with the air conduction signal detected by the microphone, improving the user experience. Especially in noisy environments, the combination of bone and air conduction allows users to receive audio more clearly. The voice processing unit 114 captures sound by detecting the vibration of the user's skull, rather than through traditional air conduction. By detecting skull vibration, it can capture vibrations generated by the skull, thereby enabling sound recognition. Bone conduction audio signals can be combined with audio signals captured by traditional microphones, improving the accuracy of speech recognition. Because bone conduction audio signals are less susceptible to interference from ambient noise, they can be more accurately recognized when detecting a user's voice. The reduced interference from ambient noise significantly improves call clarity and quality.

[0232] The speaker and voice processing unit work together to enable headphones to utilize both air conduction and bone conduction. Headphones can include different usage modes, such as music mode and sports mode. When listening to music, the headphones are in music mode, transmitting sound through both air conduction and bone conduction simultaneously to create a sense of depth and layering in the music, thus enhancing the user experience. When exercising, the headphones are in sports mode, using air conduction via the speaker. However, during exercise, the stability of the headphones in the ear can be affected, impacting bone conduction performance. Therefore, in sports mode, air conduction can be achieved solely through the speaker.

[0233] like Figure 38 As shown, Figure 38 This is a schematic diagram of the internal structure of the earphone provided in an embodiment of this application. The dotted lines in the diagram represent the axes of the voice processing unit and the speaker, respectively. In one possible implementation, the thickness direction of the voice processing unit 114 is perpendicular to the thickness direction of the speaker 15. The voice processing unit 114 can be placed vertically relative to the motherboard 3.

[0234] like Figure 39 As shown, Figure 39This is a schematic diagram of the first state of the voice processing unit provided in an embodiment of this application. By making the thickness direction of the voice processing unit 114 perpendicular to the thickness direction of the speaker 15, the impact of the speaker 15's back leakage on the voice processing unit 114 can be reduced. Figure 40 As shown, Figure 40 This is a schematic diagram of the second state of the voice processing unit provided in this application embodiment. When the voice processing unit 114 is not perpendicular to the speaker 15, the area of ​​the voice processing unit 114 receiving the drooping vibration of the speaker 15 increases, and the vibration generated by the drooping of the speaker 15 has a greater impact on the voice processing unit 114. Furthermore, the area of ​​the voice processing unit 114 receiving the vibration of the human ear 10 decreases, and the drooping vibration of the speaker 15 easily cancels out the vibration of the human ear, thus reducing the detection accuracy of the voice processing unit 114 and affecting the user experience. By making the thickness direction of the voice processing unit 114 perpendicular to the thickness direction of the speaker 15, the area of ​​the voice processing unit 114 receiving the drooping vibration of the speaker 15 can be reduced, thereby reducing the impact of the drooping of the speaker 15 on the voice processing unit 114. Simultaneously, the area of ​​the voice processing unit 114 used to receive the vibration of the human ear can be increased, which is beneficial to improving the quality of bone conduction by the voice processing unit 114, thereby improving the user experience.

[0235] like Figure 41 and Figure 42 As shown, Figure 41 This is a schematic diagram of the second main body and the third mounting bracket provided in the embodiments of this application. Figure 42 This is a schematic diagram of the speaker and the third mounting bracket provided in an embodiment of this application. In one possible implementation, the earphone may further include a third mounting bracket 14, which can be a mounting bracket for the speaker. The third mounting bracket 14 is located in the second cavity, and the speaker is mounted on the third mounting bracket 14 and fixedly connected to the main body via the third mounting bracket 14. The third mounting bracket 14 has a third cavity 141, and at least a portion of the speaker is located in the third cavity 141. The third mounting bracket 14 has at least one fifth through hole 142, which serves as a connecting hole to connect the inner and outer sides of the third mounting bracket 14, i.e., the third cavity 141 can communicate with the outer side of the third mounting bracket 14 through the fifth through hole 142. The overall shape of the third mounting bracket 14 can be adapted to the overall shape of the second main body 12, i.e., the overall structure of the outer surface of the third mounting bracket 14 is similar to the overall structure of the inner surface of the second main body 12, so as to facilitate the fit between the third mounting bracket 14 and the second main body 12.

[0236] The third mounting bracket 14 can be used to form the front and rear cavities of the earphone inside the earphone. The third cavity 141 can serve as the rear cavity of the earphone, and the space between the third mounting bracket 14 and the second main body 12 can serve as the front cavity. The fifth through hole 142 can connect the front and rear cavities. The front cavity of the earphone is mainly used for sound output and diffusion, and at the same time, the front cavity has a certain regulating effect on the performance of high-frequency sounds. Generally, the front cavity has a small volume, and the wavelength of high-frequency sound waves is short. It is easier to propagate and maintain its characteristics in a smaller space, thus making the high-frequency sound brighter. The rear cavity is mainly used to provide resonance space for low-frequency sounds and helps to balance the sound signal. The rear cavity can adjust and buffer the sound waves of different frequencies generated by the speaker 15 to a certain extent, reducing distortion and interference in the sound signal. By connecting the inner and outer sides of the third mounting bracket 14 through the fifth through hole 142, that is, connecting the front and rear cavities of the earphone, the sound waves can interact between the front and rear cavities, which helps to balance the propagation and energy distribution of different frequencies of sound. By allowing sound waves to be transmitted and reflected between the front and back chambers, high-frequency and low-frequency sounds can be better integrated, which helps to improve the coherence of the sound signal, thereby improving the sound quality of the headphones and enhancing the user experience.

[0237] like Figure 43 As shown, Figure 43 This is a schematic diagram of the third mounting bracket provided in an embodiment of this application. The number of fifth through holes 142 in the third mounting bracket 14 can be set as needed. The third mounting bracket 14 can have two fifth through holes 142, and there can be a partition rib structure between the fifth through holes 142.

[0238] The design allows the total area of ​​the fifth through hole 142 to meet the usage requirements, while also reducing the impact of opening the fifth through hole 142 on the structural strength of the third mounting space 14.

[0239] The third mounting bracket 14 can also provide mounting space 144 for the third microphone and the wearable sensor, and the mounting space 144 can extend through the third mounting bracket 14. This is to limit the position of the third microphone and the wearable sensor when they are installed, and at the same time reduce the distance between the third microphone, the wearable sensor and the second main body, thereby improving the sound reception effect of the third microphone and the detection accuracy of the wearable sensor.

[0240] like Figure 44 As shown, Figure 44This is a schematic diagram of the structure of an earphone provided in an embodiment of this application. In one possible implementation, the main body 1 has a sixth through hole 113, and the third cavity 141 communicates with the sixth through hole 113 and is connected to the outside of the main body 1 through the sixth through hole 113. The fifth through hole 142 and the sixth through hole 113 are located on the same side of the earphone. The thick lines in the figure indicate the communication path between the third cavity 141 and the sixth through hole 113.

[0241] The sixth through hole 113 can be provided on the side of the first body 11 near the third mounting bracket 14 so that the sixth through hole 113 can communicate with the third cavity.

[0242] The third cavity serves as the rear cavity of the earphone, and the sixth through-hole 113 acts as a rear vent, connecting the third cavity to the outside. By setting the sixth through-hole 113, airflow between the earphone's interior and exterior is allowed during sound production, balancing the air pressure inside and outside the earphone. This reduces the possibility of sound distortion caused by excessive pressure on the speaker 15 diaphragm due to pressure imbalance. The rear vent also helps with the diffusion and reflection of low-frequency sounds, improving the realism of the sound quality. The rear vent can also contribute to heat dissipation. Furthermore, the rear vent allows airflow inside and outside the earphone, reducing standing waves and resonance within the earphone and minimizing noise generated by these phenomena, thus improving noise reduction and the user experience. The fifth through-hole 142 and the sixth through-hole 113 are located on the same side of the earphone, meaning the connection between the front and rear cavities and the rear vent are on the same side. This design optimizes the sound transmission path, helps control sound propagation and reflection, thereby improving clarity and layering, allowing different frequencies to propagate and blend in an orderly manner, thus optimizing the overall sound quality. The fifth through-hole 142 and the sixth through-hole 113 on the same side work together to enhance low-frequency performance and reduce the possibility of low-frequency sound distortion. Simultaneously, placing the fifth through-hole 142 and the sixth through-hole 113 on the same side of the earphone allows for a more concentrated acoustic channel, helping to break down potential resonance patterns within the earphone cavity. When sound waves propagate between the through-hole and the rear vent on the same side, they interfere with and suppress air vibrations within the cavity, thereby reducing cavity resonance and improving sound quality.

[0243] Please combine Figure 43 and Figure 44 In one possible implementation, the third mounting bracket 13 further includes a connecting portion 145 having a seventh through hole 145a. The connecting portion 145 protrudes radially along the third mounting bracket 14, and the seventh through hole 145a extends through the connecting portion 145 along the thickness direction of the third mounting bracket 14. The seventh through hole 145a can be used to connect the second cavity 121 and the sixth through hole 113.

[0244] The seventh through-hole 145a connects the second cavity 121 and the sixth through-hole 113, which helps to guide the flow of air, so that air can flow between the second cavity 121 as the rear cavity and the sixth through-hole 113, thereby improving the sound quality.

[0245] like Figure 45 As shown, the second housing is hidden. The third microphone 124 and the wear sensor 125 can also be mounted on the third mounting bracket 14. The third microphone 124 and the wear sensor 125 can be... Figure 45 The second circuit board shown is electrically connected to the main board. This design increases the integration of the speaker, the third microphone 124, and the wearable sensor 125, resulting in a more compact structure, which in turn reduces installation difficulty and saves space.

[0246] In one possible implementation, one of the second body and the third mounting bracket has at least one protrusion, and the other has at least one recess, with the protrusion and recess engaging. The protrusion can be a limiting post, a limiting protrusion, or a similar structure. The recess can be a mating groove, a mating hole, or a similar structure. At least a portion of the protrusion can extend into the recess to limit the relative position of the second body and the third mounting bracket. Figure 46 As shown, the third mounting bracket 14 may be provided with a recess 143. For example... Figure 47 As shown, the second body 12 may be provided with a protrusion 123.

[0247] By setting the protrusion 123 and the recess 143, the relative positional accuracy of the second body 12 and the second mounting bracket 27 can be improved, which is conducive to improving the stability of the speaker 15 installation and thus improving the sound quality.

[0248] In one possible implementation, the projection of the first body 11 along the thickness direction of the body is circular with a diameter of 14 mm to 22 mm.

[0249] By making the size of the first body 11 range from 14 mm to 22 mm, the first body 11 has enough space to install components such as the motherboard 3, while also ensuring wearing comfort and reducing pressure on the ear 10 from the headphones. At the same time, the circular first body 11 can have a larger coverage area to cover the area where the ear canal 101 is located, thereby reducing sound leakage and improving sound quality.

[0250] It should be noted that the projection of the first subject is not necessarily a perfect circle, but rather approximately circular; that is, the projection of the first subject is a visually circular shape. Because the first subject needs to have a connection structure for connecting to the ear hook, and because parts of the first subject need to conform to the auricle to improve the bone conduction effect of the voice processing unit, and because the structure of the first subject can also have a certain degree of curvature to better conform to the physiological curve of the human ear, some parts of the first subject may have protrusions or other structures, but the overall outline of the first subject is approximately circular.

[0251] like Figure 48 As shown, in one possible implementation, the headphones provided in this application embodiment can be roughly divided into three areas: a speaker area 20, an electronic component area 30, and an interaction area 40. The speaker area 20 can correspond to the area of ​​the second main body 12, the electronic component area 30 can be the area where the printed circuit board assembly (PCBA) is located, corresponding to the area of ​​the first main body 11, and the interaction area 40 can correspond to the area of ​​the control components. The speaker area 20 is equipped with a speaker 15, and the structural design of the fifth through hole, the third mounting bracket, and the second main body 12 can help improve sound quality. The electronic component area 30 is used to house components such as the motherboard, circuit board, and voice processing unit. The interaction area 40, by providing the third through hole and a rotating component, can improve the user experience.

[0252] like Figure 48 As shown, in one possible implementation, the interaction area 40 may include a knob area, which is the portion of the control component located on the outside of the main body 1, and typically includes a rotating member 23 and a first cover plate 26. The thickness dimension of the knob area along the thickness direction of the main body 1 is 'a', and 3 mm ≤ a ≤ 6 mm. Typically, the distance between the vertex of the first cover plate 26 and the side of the rotating member 23 away from the first cover plate along the thickness direction of the main body 1 is the thickness dimension of the knob area.

[0253] The rotating part 23 is sleeved with the first mounting bracket. The structure located in the middle of the annular rotating part 23 usually includes an antenna assembly, a first sensing element, and part of the first mounting bracket. By making the thickness of the rotating part 23 3 mm to 6 mm, there is enough space to set up each component in the thickness direction of the earphone, which is conducive to increasing the clearance of the antenna assembly, reducing the interference to the antenna assembly, and improving the stability of the signal.

[0254] like Figure 49 As shown, during the design process, materials such as modeling clay can be used to simulate the sealing area of ​​the headphones, thereby obtaining a suitable coverage area for the headphones and designing the headphone structure to reduce sound leakage.

[0255] In the solution provided in this application embodiment, by making the second main body protrude towards the ear canal, an ear-shaped ear cup on the side of the earphone facing the ear can better fit the ear, thus improving wearing comfort. The speaker is set in the second main body, and a fifth through hole is provided in the third mounting bracket, which helps to reduce sound leakage, improve sound quality, and facilitate active noise cancellation. The first sensor is supported by the second mounting bracket, which can reduce the stress on the main board. The integrated design of the circuit board allows the circuit board to be used for the electrical connection of multiple components simultaneously, which helps to reduce circuit board redundancy and facilitates assembly. The third through hole is located at the upper part of the earphone, which can effectively reduce the reflection of the auricle, and the gap between it and the rear bleeder helps to improve call quality and noise reduction effect. The antenna assembly and the first sensor are stacked in the thickness direction of the earphone, which can save space. At the same time, the third through hole, antenna assembly, and first sensor do not move with the rotation of the rotating part, decoupling the third through hole, antenna assembly, and first sensor from the rotating part, reducing the impact of the rotating part on the antenna assembly and first sensor, which helps to improve the stability of the earphone during operation, enabling interaction while reducing interference to the antenna assembly. By adjusting the layout of the internal components of the headphones, the area of ​​the motherboard can be reduced by 10% to 15%, while still retaining multiple functions such as knob control, touch control, and bone conduction, thus improving the user experience.

[0256] The antenna assembly is bonded to the first mounting bracket with adhesive backing. The first cover plate can be bonded to the first mounting bracket and the second cover plate with adhesive backing. The second cover plate is used to limit the first elastic element and the first mounting bracket, which helps to improve the relative position accuracy of each component.

[0257] Each opening in the earphone can be fitted with protective components such as dustproof and waterproof parts to reduce the possibility of liquids or debris entering the earphone. These protective components can be made of mesh fabric and processed using a heat-pressing method, which helps to reduce their size.

[0258] Users can also call a voice assistant through the earphones. The earphones can also connect with electronic devices such as smart glasses, mobile phones, and tablets. Users can give commands to electronic devices through voice. After receiving the corresponding command, the earphones will send a signal to the corresponding electronic device, so that users can interact with the electronic device.

[0259] This application provides an earphone, which includes a control component, a speaker, a motherboard, a first main body and a second main body connected to each other, and a first microphone and a second microphone mounted on the motherboard. The control component includes a first mounting bracket, an antenna assembly, a rotating component, a first cover plate, and at least one first sensor. The rotating component is rotatably sleeved on the outside of the first mounting bracket and the first cover plate, and a third through hole of the first mounting bracket communicates with the gap between the rotating component and the first cover plate. The speaker is disposed in the second cavity of the second main body. The second main body protrudes along its thickness, and when the earphone is worn, the first through hole of the first main body is located in the bottom area of ​​the first main body. This design can reduce the distance between the speaker and the ear canal, thereby improving sound quality. The second main body can be used to form an ear-shaped ear cup, that is, the second main body protrudes towards the ear canal and the surface shape of the second main body is similar to the shape of the human ear, and the shape of the main body can better fit the human ear, which is beneficial to improving wearing comfort. The earphone also has touch control and knob control, which improves the interactivity with the user. The knob position can form an approximately disc-like structure, which is beneficial to shielding part of the human ear, thereby reducing sound leakage and improving sound quality.

[0260] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. An earphone, characterized in that, The earphone includes a main body (1), a control component (2), a first microphone (5), a second microphone (6), a speaker (15), and a main board (3). The main board (3) is installed inside the main body (1), and the first microphone (5) and the second microphone (6) are installed on the main board (3). The control component (2) includes a first mounting bracket (21), an antenna assembly (22), a rotating member (23), a first cover plate (26), and at least one first sensor (24). The first cover plate (26) is located on the side of the first mounting bracket (21) away from the interior of the body (1) along the thickness direction of the body (1). The rotating member (23) is sleeved on the outside of the first mounting bracket (21) and the first cover plate (26), and the rotating member (23) is rotatable relative to the first mounting bracket (21) and the first cover plate (26). The first mounting bracket (21) has a third through hole (211). There is a gap (4) between the first cover plate (26) and the rotating member (23), and the gap (4) connects the third through hole (211) to the outside. The first microphone (5) receives sound through the third through hole (211) and the gap (4). The antenna assembly (22) and the first sensor (24) are electrically connected to the motherboard (3). The antenna assembly (22) is mounted on the first mounting bracket (21). The first sensor (24) is used to sense the user's operation on the first cover plate (26). The main body (1) includes a first main body (11) and a second main body (12) connected to each other. The second main body (12) protrudes along the thickness direction of the main body (1). The first mounting bracket (21) is mounted on the first main body (11). The first main body (11) has a first cavity (111) and a first through hole (112) that are connected. The second microphone (6) is located in the first cavity (111) and receives sound through the first through hole (112). The second main body (12) has a second cavity (121) and a second through hole (122) that are connected. The speaker (15) is located in the second cavity (121) and transmits sound through the second through hole (122). When the earphone is in the wearing state, the first through hole (112) is located in the bottom area of ​​the first body (11).

2. The earphone according to claim 1, characterized in that, The first mounting bracket (21) includes a first notch (213) along the thickness direction of the body (1), and the first cover plate (26) covers at least part of the first notch (213), the first notch (213) communicating with the third through hole (211) and the gap (4).

3. The earphone according to claim 2, characterized in that, The gap (4) is annular, and the extension direction of the first notch (213) is perpendicular to the axial direction of the third through hole (211).

4. The earphone according to claim 2, characterized in that, The control component (2) further includes a second cover plate (25), which is located on the side of the first cover plate (26) facing the first mounting bracket (21). The second cover plate (26) is annular and located between the first mounting bracket (21) and the rotating member (23). Along the thickness direction of the main body (1), the second cover plate (25) abuts against the first mounting bracket (21) and the rotating member (23). The second cover plate (25) includes a second notch (251) that extends radially through the second cover plate (25) and connects the first notch (213) and the gap (4).

5. The earphone according to claim 4, characterized in that, The second cover plate (25) includes at least two circumferentially spaced limiting protrusions (252) that extend into the gap and abut against the limiting protrusions (252) along the radial direction of the first cover plate (26).

6. The earphone according to claim 4, characterized in that, The first mounting bracket (21) has a first step portion (212) and a second step portion (214) arranged circumferentially along the first mounting bracket (21). Along the thickness direction of the main body (1), the second step portion (214) is located on the side of the first step portion (212) facing the first cover plate (26). The first step portion (212) is used to accommodate the rotating member (23), and the second step portion (214) is used to accommodate the second cover plate (25).

7. The earphone according to any one of claims 1 to 6, characterized in that, The control component (2) further includes a magnetic conductor (233), and the motherboard (3) is also provided with at least one second sensing element (13); The rotating member (23) includes a body part (231) and a first elastic member (232). The body part (231) is annular, and the first elastic member (232) is located on the side of the body part (231) facing the first mounting bracket (21). The magnetic conductive member (233) is disposed on the side of the first elastic member (232) facing the motherboard.

8. The headphones according to any one of claims 1 to 6, characterized in that, The motherboard (3) is located in the first cavity (111), and the first microphone (5) is located on the side of the motherboard (3) away from the control component (2); The motherboard (3) is provided with a fourth through hole (31), which is connected to the third through hole (211). Along the thickness direction of the body (1), at least a portion of the projection of the fourth through hole (31) is located within the projection range of the first microphone (5).

9. The headphones according to any one of claims 1 to 8, characterized in that, Along the height direction of the earphone, the third through hole (211) and the second microphone (6) are located on opposite sides of the first sensor (24).

10. The earphone according to any one of claims 1 to 9, characterized in that, The antenna assembly (22) and the first sensing element (24) are located on opposite sides of the first mounting bracket (21); Along the thickness direction of the main body (1), at least a portion of the projection of the antenna assembly (22) lies within the projection range of the first sensing element (24).

11. The earphone according to any one of claims 1 to 10, characterized in that, In the projection along the thickness direction of the main body (1), the projection of the first sensing element (24) is located within the projection range of the first cover plate (26).

12. The earphone according to any one of claims 1 to 11, characterized in that, The earphone includes a shield (71), a wire harness (91), and a first circuit board (7). The first circuit board (7) includes a first connecting part (72), a second connecting part (73), a third connecting part (74), and a fourth connecting part (75) that are connected to each other. The first sensor (24) is embedded in the first connecting part (72). The second connecting part (73) is electrically connected to the main board (3). The third connecting part (74) is used to connect the wire harness (91). The shield (71) is disposed in the fourth connecting part (75). The fourth connecting part (75) connects the first connecting part (72) and the second connecting part (73).

13. The earphone according to claim 12, characterized in that, Along the thickness direction of the main body (1), the first connecting part (72), the third connecting part (74) and the fourth connecting part (75) are located on the same side of the main board (3), and the first connecting part (72) and the second connecting part (73) are located on opposite sides of the main board (3).

14. The earphone according to claim 13, characterized in that, The first circuit board (7) includes a first bending segment (76), a second bending segment (77) and a third bending segment (78). The first bending segment (76) connects the second connecting part (73) and the fourth connecting part (75). The second bending segment (77) connects the second connecting part (73) and the third connecting part (74). The third bending segment (78) connects the first connecting part (72) and the fourth connecting part (75). The first connecting part (72), the third connecting part (73), and the fourth connecting part (74) are located on the side of the main board (3) facing the first cover plate (26).

15. The earphone according to claim 12, characterized in that, The control component (2) includes a second mounting bracket (27) and a second elastic element (274). The second mounting bracket (27) is located on the side of the first mounting bracket (21) facing the first cavity (111), and the first connecting part (72) is located on the side of the second mounting bracket (27) facing the first mounting bracket (21). The second elastic member (274) is located between the first connecting portion (72) and the second mounting bracket (27), and the second mounting bracket (27) and the second elastic member (274) are used to support the first connecting portion (72).

16. The earphone according to claim 15, characterized in that, In the second mounting bracket (27) and the motherboard (3), one is provided with a limiting post (32) and the other is provided with a limiting hole (271), and the limiting post (32) cooperates with the limiting hole (271); The second mounting bracket (27) is provided with a limiting groove (272), the limiting groove (272) is located on the side of the second mounting bracket (27) facing the motherboard (3), and at least a portion of the second microphone (6) is located in the limiting groove (272).

17. The earphone according to claim 16, characterized in that, The second mounting bracket (27) includes a first support portion (275) and a second support portion (276) connected to each other. The first support portion (275) is used to support the first connecting portion (72), and the second support portion (276) is used to support the fourth connecting portion (75). The limiting groove (272) is disposed on the side of the second support (276) facing the main board (3).

18. The earphone according to any one of claims 1 to 17, characterized in that, The earphone also includes a second circuit board (8), and the speaker (15) is electrically connected to the main board (3) through the second circuit board (8); The headset also includes at least one of a third microphone (124), a wear sensor (125), a charging connector (81), and a voice processing unit (114); The third microphone (124) is located in the second cavity (121), and the third microphone (124) is electrically connected to the main board (3) through the second circuit board (8); The wearable sensor (125) is disposed on the second main body (12), and the wearable sensor (125) is electrically connected to the main board (3) through the second circuit board (8); The charging connection part (81) is electrically connected to the motherboard (3) through the second circuit board (8); The voice processing unit (114) is located in the first cavity (111), and the voice processing unit (114) is electrically connected to the motherboard (3) through the second circuit board (8); The thickness direction of the voice processing unit (114) is perpendicular to the thickness direction of the speaker (15).

19. The headphones according to claim 18, characterized in that, The second circuit board (8) includes a connector (82) connected to the motherboard (3). The control component (2) includes a second mounting bracket (27) including a connecting mating part (273). The connector (82) is connected to the connecting mating part (273) to limit the relative position of the second mounting bracket (27) and the motherboard (3).

20. The earphone according to any one of claims 1 to 19, characterized in that, The earphone includes a third mounting bracket (14) located in the second cavity (121), the speaker (15) is mounted on the third mounting bracket (14), the third mounting bracket (14) has a third cavity (141), and at least a portion of the speaker (15) is located in the third cavity (141); The third mounting bracket (14) is provided with at least one fifth through hole (142), and the third cavity (141) is connected to the second cavity (121) through the fifth through hole (142).

21. The earphone according to claim 20, characterized in that, The main body (1) is provided with a sixth through hole (113), which connects the third cavity (141) to the outside of the main body (1). The fifth through hole (142) and the sixth through hole (113) are located on the same side of the earphone.

22. The headphones according to claim 20, characterized in that, In the second body (12) and the third mounting bracket (14), one is provided with at least one protrusion (123) and the other is provided with at least one recess (143), at least a portion of the protrusion (123) extending into the recess (143).

23. The earphone according to any one of claims 1 to 22, characterized in that, At least a portion of the second body (12) protrudes downwards when the earphone is in the wearing state.

24. The earphone according to any one of claims 1 to 22, characterized in that, The earphone includes an ear hook (9), and the main body (1) is connected to the ear hook (9).

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