Loudspeaker module and electronic device

Abstract

A loudspeaker module and an electronic device, wherein the loudspeaker module comprises a housing and a core, and the core is arranged in the housing. The core comprises a support, and the support comprises a sealing part arranged at the side of the core, and the sealing part is sealingly connected with the housing. In the application, the sealing part can realize the sealing and covering of the side of the diaphragm, the magnetic circuit system and other components in the core. At the same time, the sealing part only has a small wall thickness, and the sealing connection with the housing can be realized by the adhesive method. In the case that the size of the core is fixed, the size of the housing in the direction perpendicular to the thickness direction can be reduced, which is beneficial to the miniaturization of the loudspeaker module. In addition, in the case that the size of the loudspeaker module is fixed, the core has a larger design space in the direction perpendicular to the thickness direction due to the small wall thickness of the sealing part, which is beneficial to further increasing the size of the core and increasing the area of the diaphragm, so as to improve the sensitivity of the loudspeaker module.

Description

Technical Field

[0001] This application relates to the field of electronic product technology, specifically to a speaker module and electronic device. Background Technology

[0002] As mobile phones and other electronic devices become increasingly thinner and lighter, the demand for efficient use of internal space is rising, which in turn places greater demands on the size of speaker modules. Existing speaker modules consist of a housing and a core, with the core housed within the housing. The sides of the core need to be bonded to the inner wall of the housing. Therefore, a large space needs to be reserved between the housing and the core for filling with adhesive, resulting in a relatively large speaker module size. Summary of the Invention

[0003] In view of this, this application provides a speaker module and electronic device to solve the problem that the speaker module is too large in size because there is a large space for filling glue between the shell and the core of the speaker module in the prior art.

[0004] In a first aspect, embodiments of this application provide a speaker module, comprising a housing and a core, the core being disposed within the housing. The core includes a support, the support including a sealing portion disposed laterally to the core, and the sealing portion being sealingly connected to the housing.

[0005] In this application, the sealing part can achieve a sealed enclosure of the sides of components such as the diaphragm and magnetic circuit system in the core. Simultaneously, the sealing part, with only a small wall thickness, can achieve a sealed connection with the housing via adhesive bonding. With a fixed core size, the size of the housing in the direction perpendicular to the thickness direction can be reduced, which is beneficial for the miniaturization of the speaker module. Furthermore, with a fixed speaker module size, the small wall thickness of the sealing part provides more design space for the core in the direction perpendicular to the thickness direction. This allows for a further increase in the core size, resulting in a larger diaphragm area and thus improved speaker module sensitivity.

[0006] In one possible implementation, the housing includes a first housing and a second housing, with the core disposed between the first housing and the second housing. Along the thickness direction of the speaker module, the first housing is sealed to one end of the sealing portion, and the second housing is sealed to the other end of the sealing portion. The sealing portion, the first housing, and the second housing are bonded and sealed along the thickness direction of the speaker module, eliminating the need for adhesive sealing in other directions. For example, there is no need for adhesive sealing in a direction perpendicular to the thickness direction of the speaker module, thus eliminating the need to reserve space for adhesive filling in that direction. This saves space while ensuring airtightness, which is beneficial for reducing the overall size of the speaker module.

[0007] In one possible implementation, the first housing includes a first mounting groove, and the bracket is disposed in the first mounting groove. Along the thickness direction of the speaker module, one end of the sealing part is bonded and fixed to the inner wall of the first mounting groove, that is, the first end of the sealing part can be bonded to the inner wall of the first mounting groove to achieve connection, fixation and sealing. During the assembly process, glue can be pre-filled at a predetermined position in the first mounting groove, and then the core is installed into the first mounting groove as a whole, so that the core squeezes the glue, and at the same time, the first end of the sealing part can be bonded to the first mounting groove through the glue, thereby fixing the core to the first housing.

[0008] In one possible implementation, the first mounting groove includes a first groove and a second groove, with a stepped surface formed between the first groove and the second groove along the thickness direction of the speaker module. At least a portion of the bracket is bonded to the first groove. Along the thickness direction of the speaker module, the end of the sealing part facing the first housing is bonded and fixed to the stepped surface. The first groove can position the core for mounting and facilitate the placement of components such as the diaphragm within the core. The second groove provides space for the sealing part. During assembly, adhesive can be applied to a designated area in the first groove and the stepped surface. When the core is assembled into the first housing, the core can squeeze the adhesive in the first groove, and simultaneously, the sealing part can squeeze the adhesive on the stepped surface. This results in a large bonding area between the adhesive in the first groove and the adhesive on the stepped surface and the core, ensuring reliable connection and fixation between the core and the first housing.

[0009] In one possible implementation, the second housing includes a second mounting groove, and the inner wall of the second mounting groove is bonded and fixed to one end of the sealing portion facing the second housing along the thickness direction of the speaker module. For ease of explanation, the end of the sealing portion facing the second housing is referred to as the second end. During assembly, adhesive can be applied to the second end of the sealing portion, or to the inner wall of the second mounting groove facing the sealing portion. When the second housing and the first housing are snapped together, the adhesive can be used to bond and fix the second housing to the second end of the sealing portion, thereby achieving a seal.

[0010] In one possible implementation, along the thickness direction of the speaker module, the sidewall of the first mounting groove abuts against the sidewall of the second mounting groove, thereby preventing a large gap from forming at the mating interface between the sidewalls of the first and second mounting grooves, which could allow moisture or dust to enter.

[0011] In one possible implementation, the mating interface between the sidewall of the first mounting groove and the sidewall of the second mounting groove is planar, which simplifies the structure of the first housing and the second housing, and also reduces the wall thickness of the sidewalls of the first mounting groove and the second mounting groove, which is beneficial to reducing the overall size of the speaker module.

[0012] In one possible implementation, the inner surface of the sidewall of the first mounting groove and / or the inner surface of the sidewall of the second mounting groove are bonded and fixed to the sealing part, thereby increasing the bonding area between the sealing part and the first housing and / or the second housing, and thus improving the sealing performance.

[0013] In one possible implementation, the projection of the sealing portion overlaps the projection of the mating interface between the first and second housings in a direction perpendicular to the thickness direction. Since moisture or dust can easily enter at the mating location between the first and second housings, by aligning the sealing portion with the mating interface between the first and second housings, the path for moisture or dust to enter the core can be extended. This path is the distance from the mating location between the first and second housings to the first or second end of the sealing portion, thereby effectively preventing moisture or dust from entering the core.

[0014] In one possible implementation, the bracket further includes a body portion for mounting devices, and a sealing portion is disposed at at least one end of the body portion, with the sealing portion positioned laterally to the device. The device can be a diaphragm, magnetic circuit system, etc. Devices such as the magnetic circuit system and diaphragm can be mounted to the body portion, and the sealing portion can cover the side of the device, thereby achieving a lateral seal on the core. Therefore, when the core is installed in the housing, there is no need to reserve a large space between the housing and the core for filling adhesive; the sealing portion can be simply bonded and sealed to a predetermined position within the housing using a thin adhesive layer, saving space and facilitating the miniaturization of the speaker module.

[0015] In one possible implementation, the sealing portion is sealed to the side of the device. The sealing portion can be bonded to the side of the magnetic circuit system with adhesive to achieve a seal and reduce the risk of acoustic leakage.

[0016] In one possible implementation, the sealing part and the body part are integrally formed, that is, the sealing part and the body part can be formed in one process during the fabrication of the bracket, which facilitates the manufacturing process and ensures the structural reliability of the bracket.

[0017] Secondly, this application also provides an electronic device, which includes the speaker module provided in the first aspect of this application. The electronic device including the speaker module provided in the first aspect of this application has similar technical effects to the aforementioned speaker module, and will not be described in detail here.

[0018] It should be understood that the above general description and the following detailed description are merely exemplary and do not limit this application. Attached Figure Description

[0019] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0020] Figure 1 This is a schematic diagram of the structure of an electronic device provided in one embodiment of this application;

[0021] Figure 2 An exploded view of an electronic device provided in one embodiment of this application;

[0022] Figure 3 This is a schematic diagram of the structure of a speaker module provided in one embodiment of this application;

[0023] Figure 4This is a schematic diagram of the core structure in a speaker module provided in one embodiment of this application;

[0024] Figure 5 This is a cross-sectional view of a speaker module in a related technology;

[0025] Figure 6 for Figure 5 Enlarged view at point A;

[0026] Figure 7 for Figure 5 The diagram shown illustrates the speaker module after adhesive has been filled between the core and the lower shell.

[0027] Figure 8 This is a cross-sectional view of a speaker module provided in one embodiment of this application;

[0028] Figure 9 This is a schematic diagram of the structure of the bracket in the speaker module provided in the embodiments of this application;

[0029] Figure 10 A partial schematic diagram of the core in the speaker module provided in the embodiments of this application;

[0030] Figure 11 for Figure 8 A magnified view at point B.

[0031] Figure label:

[0032] 100 - Housing; 200 - Camera module; 300 - Screen assembly; 400 - Mid-frame; 500 - Speaker module;

[0033] 10-Upper shell;

[0034] 20-Lower shell; 201-First groove; 202-Second groove; 203-Stepped surface; 204-Mating interface;

[0035] 30-Core; 301-Support; 302-Diaphragm; 303-Voice Coil; 304-Magnetic Circuit System;

[0036] 40a - First adhesive; 40b - Second adhesive;

[0037] 1-Cover; 11-First housing; 11a-Side wall; 111-First mounting groove; 111a-First recess; 111b-Second recess; 111c-Stepped surface; 12-Second housing; 12a-Side wall; 121-Second mounting groove; 13-Sound outlet; 14-Mating interface;

[0038] 2-Core; 21-Support; 211-Sealing part; 211a-First end; 211b-Second end; 212-Body part; 22-Diaphragm; 23-Voice coil; 24-Magnetic circuit system; 25-Side;

[0039] 3-Anterior cavity;

[0040] 4-Postcavity. Detailed Implementation

[0041] To better understand the technical solution of this application, the embodiments of this application will be described in detail below with reference to the accompanying drawings.

[0042] It should be understood that the described embodiments are merely some, not all, of the embodiments in this application. All other embodiments obtained by those skilled in the art based on the embodiments in this application without inventive effort are within the scope of protection of this application.

[0043] The terminology used in the embodiments of this application is for the purpose of describing particular embodiments only and is not intended to be limiting of this application. The singular forms “a,” “the,” and “the” used in the embodiments of this application and the appended claims are also intended to include the plural forms unless the context clearly indicates otherwise.

[0044] It should be understood that the term "and / or" used in this article is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, or B existing alone. Additionally, the character " / " in this article generally indicates that the preceding and following related objects have an "or" relationship.

[0045] In the description of this application, unless otherwise expressly specified and limited, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance; unless otherwise specified or explained, the term "multiple" refers to two or more; the terms "connected," "fixed," etc., should be interpreted broadly. For example, "connected" can be a fixed connection, a detachable connection, an integral connection, or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0046] This application provides a speaker module that can be used in electronic devices to emit sound into the external environment. The electronic device can be a mobile phone, tablet personal computer, laptop computer, personal digital assistant (PDA), smartwatch, monitor, camera, personal computer, laptop computer, wearable device, etc. This application does not limit the type of electronic device. For ease of explanation, the following examples use a mobile phone as an example.

[0047] Figure 1 This is a schematic diagram of the structure of an electronic device provided in one embodiment of this application, such as... Figure 1 As shown, the electronic device is a mobile phone. For ease of explanation, let's take a rectangular plate-like structure as an example, with the length direction of the electronic device as the X-axis, the width direction as the Y-axis, and the thickness direction as the Z-axis. It can be understood that... Figure 1 The electronic device is shown only as an example of some components, such as housing 100, camera module 200, etc. The actual shape, size, position and construction of these components are not subject to change. Figure 1 Restrictions.

[0048] Figure 2 An exploded view of an electronic device provided in one embodiment of this application, such as... Figure 2 As shown, this exploded view is of a mobile phone. The electronic device may include a screen assembly 300, a housing 100, a mid-frame 400, a speaker module 500, and a camera module 200. The screen assembly 300 can be connected to the mid-frame 400 and is used to display images and other content. The housing 100 can be connected to the mid-frame 400 and is located on the side of the mid-frame 400 opposite to the screen module; the housing 100 is used to protect the electronic components inside the electronic device. The mid-frame 400 can be used to support the electronic components, such as, but not limited to, the speaker module 500 and the camera module 200.

[0049] The electronic device may include one or more speaker modules 500. For example, such as... Figure 2 As shown, the speaker module 500 can be located on the middle frame 400 near the camera module 200; this speaker module 500 can be referred to as the upper speaker. Alternatively, the speaker module can be located on the middle frame 400 away from the camera module 200; this speaker module can be referred to as the lower speaker. The upper and lower speakers can be simultaneously installed in the electronic device, or one of them can be installed selectively. Figure 2 The embodiment shown is illustrated using a loudspeaker as an example.

[0050] Figure 3 This is a schematic diagram of the structure of a speaker module provided in one embodiment of this application, as shown below. Figure 3 As shown, the speaker module 500 may include a housing 1 and a core 2, with the core 2 disposed within the housing 1, which protects the core 2. Exemplarily, the housing 1 may include a first housing 11 and a second housing 12, which, when engaged, enclose the core 2 between them. A front cavity and a rear cavity may be formed between the core 2 and the housing 1. The housing 1 may be provided with a sound outlet 13 and a gas channel. The front cavity may communicate with the sound outlet 13, allowing sound to propagate into the external environment. The rear cavity may communicate with the external environment through the gas channel to prevent pressure buildup.

[0051] Figure 4 This is a schematic diagram of the core structure in a speaker module provided in one embodiment of this application, as shown below. Figure 4 As shown, the core 2 may include a support 21, a diaphragm 22, a voice coil (not shown), and a magnetic circuit system 24. The voice coil can be bonded and fixed to the diaphragm 22, and can also be fixedly mounted on the support 21. The magnetic circuit system 24 can also be fixedly mounted on the support 21 and can generate a magnetic field. When current flows through the voice coil, it experiences a Lorentz force perpendicular to both the magnetic field and the current direction. This Lorentz force causes the voice coil to vibrate axially, which in turn drives the bonded diaphragm 22 to vibrate synchronously. During this vibration, the diaphragm 22 can alternately compress air, generating sound waves.

[0052] Figure 5 This is a cross-sectional view of a speaker module in a related art, such as... Figure 5 As shown, the speaker module may include an upper shell 10, a lower shell 20, and a core 30. The upper shell 10 and the lower shell 20 are connected and fixed, and the core 30 is disposed between the upper shell 10 and the lower shell 20. The core 30 can be fixed to the lower shell 20 by adhesive bonding, and the upper shell 10 can also be fixed to the lower shell 20 by gluing. During assembly, the core 30 and the lower shell 20 can be glued and fixed first, and then the upper shell 10 can be glued and fixed to the lower shell 20, thus completing the assembly of the speaker module. The core 30 includes components such as a bracket 301, a voice coil 303, a diaphragm 302, and a magnetic circuit system 304. The voice coil 303 is glued and fixed to the diaphragm 302. Both the diaphragm 302 and the magnetic circuit system 304 can be connected to the bracket 301. The sides of the magnetic circuit system 304 and the bracket 301 can be coplanar, meaning that the side of the core 30 can be formed by the side of the magnetic circuit system 304 and the side of the bracket 301.

[0053] Figure 6 for Figure 5 The enlarged view at point A, as shown Figure 6As shown, to ensure effective bonding between the core 30 and the lower shell 20, a sufficiently large space needs to be reserved between the side of the core 30 and the inner wall of the lower shell 20 in a direction perpendicular to the thickness direction of the speaker module for filling with adhesive. This direction perpendicular to the thickness direction of the speaker module can be either the length direction (X) or the width direction (Y) of the speaker module. Figure 6 An exemplary illustration shows a space reserved between the side surface of the core 30 and the inner wall surface of the lower shell 20 along the width direction Y of the speaker module. Exemplarily, the lower shell 20 includes a first groove 201 and a second groove 202. The second groove 202 is disposed on the side of the first groove 201 facing the upper shell 10. The width of the second groove 202 is greater than the width of the first groove 201, allowing a stepped surface 203 to be formed between the second groove 202 and the first groove 201 along the thickness direction of the speaker module, facing the upper shell 10. At least a portion of the core 30 can be disposed in the first groove 201 and can be adhesively fixed therein. Simultaneously, the second groove 202 can be used for filling with adhesive to achieve bonding and fixation between the core 30 and the lower shell 20.

[0054] Figure 7 for Figure 6 The diagram shown is a schematic of the speaker module after the glue has been applied between the core 30 and the lower shell 20. Figure 7 As shown, in the specific operation process, the first adhesive 40a can be filled into the first groove 201 first, and the core 30 can be installed in the first groove 201. The core 30 can squeeze the first adhesive 40a to bond and fix it. There is a gap between the core 30 and the inner wall of the first groove 201. When the first adhesive 40a is squeezed by the core 30, it can fill the gap between the side of the core 30 and the inner wall of the first groove 201. Then, the second adhesive 40b can be filled into the second groove 202. The second adhesive 40b can accumulate in the space enclosed by the stepped surface 203, the first adhesive 40a located between the side of the core 30 and the inner wall of the first groove 201, the inner wall of the second groove 202, and the side of the core 30. The second adhesive 40b can further improve the reliability of the bonding and fixation between the core 30 and the lower shell 20.

[0055] The first adhesive 40a and the second adhesive 40b can be made of different adhesives. For example, the first adhesive 40a can be a soft adhesive to protect the diaphragm 302 and pre-position the core 30, facilitating the adjustment of the core 30's position within the first groove 201. The second adhesive 40b can be a hard adhesive to improve the reliability of the connection between the core 30 and the lower shell 20. Thus, as... Figure 7As shown, a large gap H is required between the inner wall of the second groove 202 and the side of the core 30 to allow for sufficient filling of hard glue, ensuring the reliability of the connection between the core 30 and the lower shell 20. This design necessitates a larger lower shell 20, which leads to an increase in the overall size of the speaker module.

[0056] In addition, such as Figure 7 As shown, a sealed connection is required between the upper shell 10 and the lower shell 20. For example, the upper shell 10 and the lower shell 20 can be connected and fixed by adhesive along the thickness direction of the speaker module. If the mating interface 204 between the upper shell 10 and the lower shell 20 is planar, the adhesive on the mating interface 204 between the upper shell 10 and the lower shell 20 can easily overflow onto the outer surfaces of the upper shell 10 and the lower shell 20. To address this, the mating interface 204 between the upper shell 10 and the lower shell 20 can be designed in a stepped shape to prevent adhesive overflow. However, if the aforementioned stepped shape is formed at the mating interface 204 between the upper shell 10 and the lower shell 20, the sidewalls of the upper shell 10 and the lower shell 20 need to have a larger thickness B, which will also lead to an increase in the overall size of the speaker module.

[0057] Figure 8 This is a cross-sectional view of a speaker module provided in one embodiment of this application, as shown below. Figure 8 As shown, the speaker module includes a housing 1 and a core 2, with the core 2 housed within the housing 1, which provides protection for the core 2. Exemplarily, the housing 1 may include a first housing 11 and a second housing 12, which, when engaged, enclose the core 2 between them. The core 2 includes a support 21, a voice coil 23, a diaphragm 22, and a magnetic circuit system 24. The diaphragm 22 is connected to the support 21, the voice coil 23 is connected to the diaphragm 22, and the magnetic circuit system 24 may also be connected to the support 21. The support 21 serves a load-bearing function, supporting components such as the diaphragm 22, voice coil 23, and magnetic circuit system 24. The diaphragm 22 is closer to the first housing 11 than the voice coil 23 and magnetic circuit system 24. A front cavity 3 can be formed between the first housing 11 and the diaphragm 22. A sound outlet 13 is provided on the first housing 11, communicating with the front cavity 3. The front cavity 3 influences the high-frequency response of the speaker module. A rear cavity 4 can be formed between the end of the core 2 away from the diaphragm 22 and the second housing 12, and the rear cavity 4 affects the low-frequency response of the speaker module.

[0058] Among them, such as Figure 8As shown, the support 21 includes a sealing part 211, which is disposed on the side of the core 2 and is sealed to the cover 1. The sealing part 211 is an integrally formed part of the support 21. The sealing part 211 can seal and cover the sides of components such as the diaphragm 22 and the magnetic circuit system 24 in the core 2. At the same time, the sealing part 211 can be sealed to the cover 1. For example, the sealing connection can be achieved by applying adhesive to the outer surface of the sealing part 211 and the cover 1. Therefore, it is not necessary to reserve a large adhesive filling space between the side of the core 2 and the cover 1.

[0059] In this embodiment, the sealing part 211 located on the side of the core 2 only needs a small wall thickness to achieve a sealed connection with the casing 1 by adhesive bonding. This wall thickness can be significantly smaller than... Figure 7 The width of the spacing H shown, that is, the distance between the side 25 of the core 2 and the cover 1, is slightly greater than the wall thickness of the sealing part 211. With the size of the core 2 fixed, the size of the cover 1 in the direction perpendicular to the thickness direction Z can be reduced, which is beneficial to the miniaturization of the speaker module.

[0060] With the size of the speaker module fixed, for Figure 8 The speaker module shown has a smaller wall thickness in the sealing part 211, and the core 2 has more design space in the direction perpendicular to the thickness direction Z. This allows for a further increase in the size of the core 2, which in turn increases the area of ​​the diaphragm 22 and improves the sensitivity of the speaker module.

[0061] The sealing part 211 can be disposed on one side of the core 2 or on multiple sides of the core 2. For example, sealing parts 211 can be disposed on opposite sides or adjacent sides of the bracket 21, or sealing parts 211 can be disposed around the entire circumference of the bracket 21. The sealing part 211 can be disposed according to the structure of the speaker module and the structure in the electronic device used to cooperate with the speaker module.

[0062] Figure 9 This is a schematic diagram of the structure of the bracket 21 in the speaker module provided in the embodiments of this application, as shown below. Figure 9 As shown, the bracket 21 also includes a body portion 212 for mounting devices. A sealing portion 211 is disposed at at least one end of the body portion 212, and the sealing portion 211 is disposed laterally to the device. The device can be the aforementioned diaphragm 22, magnetic circuit system 24, etc. "Laterally to the device" refers to a direction perpendicular to the thickness direction Z of the speaker module. The body portion 212 protrudes from the surface of the sealing portion 211 along the thickness direction Z of the speaker module. Exemplarily, the body portion 212 and the sealing portion 211 form an "L"-shaped structure.

[0063] Figure 10This is a partial schematic diagram of the kernel 2 in the speaker module provided in the embodiments of this application, as shown below. Figure 10 As shown, components such as the magnetic circuit system 24 and the diaphragm 22 can be mounted onto the main body 212, and the sealing part 211 can cover the side of the components such as the magnetic circuit system 24. In one embodiment, the sealing part 211 can be bonded to the side of the magnetic circuit system 24 with adhesive, thereby achieving a lateral seal for the core 2. Therefore, when the core 2 is installed in the housing 1, it is not necessary to reserve a large space for filling adhesive between the housing 1 and the core 2; the sealing part 211 can be bonded and sealed to a predetermined position inside the housing 1 with a thin layer of adhesive, saving space and facilitating the miniaturization of the speaker module.

[0064] The sealing part 211 and the body part 212 can be integrally formed, meaning that the sealing part 211 and the body part 212 can be formed in one process during the fabrication of the bracket 21, which facilitates manufacturing and ensures the structural reliability of the bracket 21. The material of the bracket 21 can be a metal or plastic, or other materials with a certain degree of hardness, to ensure a stable structural shape; this embodiment does not impose any limitations on this.

[0065] Figure 11 for Figure 8 The enlarged view at point B, as shown Figure 11 As shown, along the thickness direction Z of the speaker module, the first housing 11 is sealed to one end of the sealing part 211, and the second housing 12 is sealed to the other end of the sealing part 211. For ease of explanation, the sealing part 211 can be defined as having a first end 211a and a second end 211b, where the first end 211a and the second end 211b are respectively the two ends of the sealing part 211 along the thickness direction Z of the speaker module.

[0066] During the speaker module assembly process, the core 2 can be installed into the first housing 11 firstly, and the first end 211a of the sealing part 211 can be bonded to the first housing 11 along the thickness direction Z of the speaker module. Then, the second housing 12 can be installed onto the first housing 11, so that the second housing 12 is bonded and fixed to the second end 211b of the sealing part 211. All of the above bonding and fixing methods can be achieved using sealant, thereby sealing the first housing 11 and the second housing 12 through the sealing part 211, preventing sound leakage and ensuring sound transmission quality.

[0067] The sealing part 211, the first housing 11, and the second housing 12 are bonded and sealed along the thickness direction Z of the speaker module, eliminating the need for adhesive sealing in other directions. For example, there is no need for adhesive sealing in the direction perpendicular to the thickness direction Z of the speaker module, thus eliminating the need to reserve space for adhesive filling in the direction perpendicular to the thickness direction Z of the speaker module. This saves space while ensuring airtightness, which is beneficial for reducing the overall size of the speaker module. In addition, on the side of the housing 1 where the sealing part 211 is located, the first housing 11 and the second housing 12 do not need to be bonded together with adhesive. The first housing 11 and the second housing 12 may or may not be in contact. That is, the connection form between the first housing 11 and the second housing 12 does not affect the sealing effect between the sealing part 211 and the first housing 11 and the second housing 12, thereby making the assembly of the first housing 11 and the second housing 12 more convenient and flexible.

[0068] like Figure 11 As shown, along a direction perpendicular to the thickness direction Z, the projection of the sealing portion 211 overlaps the projection of the mating interface 14 of the first housing 11 and the second housing 12. Moisture or dust can easily enter at the mating position between the first housing 11 and the second housing 12. By positioning the sealing portion 211 opposite the mating interface 14 of the first housing 11 and the second housing 12, the path for moisture or dust to enter the core 2 can be extended. This path is the distance from the mating position between the first housing 11 and the second housing 12 to the first end 211a or the second end 211b of the sealing portion 211, thereby effectively preventing moisture or dust from entering the core 2.

[0069] like Figure 11 As shown, the first housing 11 may include a first mounting groove 111, and a bracket 21 is disposed in the first mounting groove 111. Along the thickness direction Z of the speaker module, one end of the sealing part 211 is bonded and fixed to the inner wall of the first mounting groove 111, that is, the first end 211a of the sealing part 211 can be bonded to the inner wall of the first mounting groove 111 to achieve connection, fixation and sealing. During the assembly process, glue can be pre-filled at a predetermined position in the first mounting groove 111, and then the core 2 is installed into the first mounting groove 111 as a whole, so that the core 2 squeezes the glue, and at the same time, the first end 211a of the sealing part 211 can be bonded to the first mounting groove 111 through the glue, thereby fixing the core 2 to the first housing 11.

[0070] like Figure 11As shown, the first mounting groove 111 includes a first groove 111a and a second groove 111b. The first groove 111a is located on the side of the second groove 111b away from the second housing 12. Along a direction perpendicular to the thickness direction Z of the speaker module, the width of the second groove 111b is greater than the width of the first groove 111a. Therefore, a stepped surface 111c can be formed between the first groove 111a and the second groove 111b along the thickness direction Z of the speaker module. At least a portion of the bracket 21 can be bonded to the first groove 111a. Along the thickness direction Z of the speaker module, the end of the sealing part 211 facing the first housing 11 is bonded and fixed to the stepped surface 111c. The first groove 111a can facilitate the positioning of the core 2 and also provides space for accommodating devices such as the diaphragm 22 within the core 2. The second groove 111b provides space for the sealing part 211.

[0071] During the assembly process, adhesive can be applied to the designated area in the first groove 111a and the step surface 111c. When the core 2 is assembled into the first housing 11, the core 2 can squeeze the adhesive in the first groove 111a. At the same time, the sealing part 211 can squeeze the adhesive on the step surface 111c. Thus, the adhesive in the first groove 111a and the adhesive on the step surface 111c can have a large bonding area with the core 2, ensuring the reliability of the connection and fixation between the core 2 and the first housing 11.

[0072] When the core 2 squeezes the adhesive in the first groove 111a, the adhesive in the first groove 111a can be squeezed to the side of the core 2, that is, part of the adhesive can fill the space between the side of the core 2 and the side wall of the first groove 111a, thereby giving the core 2 and the first groove 111a a larger bonding area and ensuring bonding reliability.

[0073] Similarly, when the adhesive on the step surface 111c is squeezed by the sealing part 211, some of the adhesive on the step surface 111c can also be squeezed between the side of the sealing part 211 and the side wall of the second groove 111b, thereby increasing the bonding area between the sealing part 211 and the first housing 11, ensuring bonding reliability, and improving the sealing performance between the sealing part 211 and the first housing 11.

[0074] The second housing 12 includes a second mounting groove 121. Along the thickness direction Z of the speaker module, the inner wall surface of the second mounting groove 121 is bonded and fixed to one end of the sealing part 211 facing the second housing 12. The end of the sealing part 211 facing the second housing 12 is the aforementioned second end 211b. During assembly, adhesive can be applied to the second end 211b of the sealing part 211, or to the inner wall surface of the second mounting groove 121 facing the sealing part 211. When the second housing 12 is fastened to the first housing 11, the adhesive can bond and fix the second housing 12 to the second end 211b of the sealing part 211, thus achieving a seal.

[0075] The sidewall 12a of the second mounting groove 121 prevents the adhesive from overflowing to the outside of the housing 1 when squeezed. When the adhesive is squeezed, some of the adhesive can also fill the space between the side of the sealing part 211 and the sidewall 12a of the second mounting groove 121 through the squeezing force, thereby increasing the bonding area between the sealing part 211 and the second housing 12, ensuring bonding reliability, and improving the sealing performance between the sealing part 211 and the second housing 12.

[0076] To improve the sealing performance between the sealing part 211 and the first housing 11 and / or the second housing 12, adhesive can be applied to the inner surface of the side wall 11a of the first mounting groove 111 and / or the inner surface of the side wall 12a of the second mounting groove 121, thereby increasing the bonding area between the sealing part 211 and the first housing 11 and / or the second housing 12, and thus improving the sealing performance.

[0077] When the first housing 11 and the second housing 12 are fastened together, the side wall of the first mounting groove 111 and the side wall of the second mounting groove 121 can abut against each other to avoid a large gap at the mating interface 14 between the side wall of the first mounting groove 111 and the side wall of the second mounting groove 121, which would allow water vapor or dust to enter.

[0078] Since the sealing part 211 is bonded and sealed to the first housing 11 and the second housing 12 respectively in the thickness direction Z of the speaker module, no bonding or fixing is required at the mating interface 14 between the sidewalls of the first mounting groove 111 and the sidewalls of the second mounting groove 121. This facilitates the assembly of the first housing 11 and the second housing 12, and also avoids the problem of adhesive overflowing to the outside of the cover 1. In this embodiment, since no bonding is required between the sidewalls of the first mounting groove 111 and the sidewalls of the second mounting groove 121, the mating interface 14 between the sidewalls of the first mounting groove 111 and the sidewalls of the second mounting groove 121 can be a plane, and does not need to be designed as... Figure 7 The stepped shape shown simplifies the structure of the first housing 11 and the second housing 12, and also reduces the wall thickness of the sidewalls of the first mounting groove 111 and the second mounting groove 121, which helps to reduce the overall size of the speaker module.

[0079] The above are merely preferred embodiments of this application and are not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A speaker module, characterized in that, include: Enclosure; The kernel is located within the casing; The core includes a support, the support includes a sealing portion, the sealing portion is disposed on the side of the core, and the sealing portion is sealed to the cover.

2. The speaker module according to claim 1, characterized in that, The enclosure includes a first housing and a second housing, and the core is disposed between the first housing and the second housing; Along the thickness direction of the speaker module, the first housing is sealed to one end of the sealing part, and the second housing is sealed to the other end of the sealing part.

3. The speaker module according to claim 2, characterized in that, The first housing includes a first mounting groove, the bracket is disposed in the first mounting groove, and one end of the sealing part is bonded and fixed to the inner wall of the first mounting groove along the thickness direction of the speaker module.

4. The speaker module according to claim 3, characterized in that, The first mounting groove includes a first groove and a second groove, and a stepped surface is formed between the first groove and the second groove along the thickness direction of the speaker module; At least a portion of the bracket is adhered to the first groove; Along the thickness direction of the speaker module, the sealing part is bonded and fixed to the stepped surface at one end facing the first housing.

5. The speaker module according to claim 3 or 4, characterized in that, The second housing includes a second mounting groove, and along the thickness direction of the speaker module, the inner wall surface of the second mounting groove is bonded and fixed to one end of the sealing part facing the second housing.

6. The speaker module according to claim 5, characterized in that, Along the thickness direction of the speaker module, the sidewall of the first mounting groove abuts against the sidewall of the second mounting groove.

7. The speaker module according to claim 6, characterized in that, The mating interface between the sidewall of the first mounting groove and the sidewall of the second mounting groove is a plane.

8. The loudspeaker module according to any one of claims 5-7, characterized in that, The inner surface of the sidewall of the first mounting groove and / or the inner surface of the sidewall of the second mounting groove are bonded and fixed to the sealing part.

9. The loudspeaker module according to any one of claims 2-8, characterized in that, Along a direction perpendicular to the thickness direction, the projection of the sealing portion overlaps the projection of the mating interface between the first housing and the second housing.

10. The loudspeaker module according to any one of claims 1-9, characterized in that, The bracket also includes a body portion for mounting the device, and a sealing portion is disposed at at least one end of the body portion and is disposed on the side of the device.

11. The speaker module according to claim 10, characterized in that, The sealing part is sealed to the side of the device.

12. The speaker module according to claim 10 or 11, characterized in that, The sealing part and the body part are integrally formed.

13. An electronic device, characterized in that, Includes the speaker module as described in any one of claims 1-12.

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