Loudspeaker module and electronic device

Abstract

The application provides a loudspeaker module and an electronic device, which are used for improving the sound quality of the loudspeaker module and the sound quality experience of the electronic device. In the loudspeaker module, a second shell is mounted on a first shell and forms an acoustic cavity together with the first shell. A loudspeaker core is mounted in the acoustic cavity and divides the acoustic cavity into a front acoustic cavity and a rear acoustic cavity. The rear acoustic cavity includes a first rear acoustic cavity and a second rear acoustic cavity. The first rear acoustic cavity is arranged opposite to the loudspeaker core, and the second rear acoustic cavity is arranged staggered to the loudspeaker core. Sound-absorbing particles are filled in the first rear acoustic cavity. A separation piece is mounted in the first rear acoustic cavity and separates the sound-absorbing particles. The first shell is provided with a first separation rib. The first separation rib is located in the first rear acoustic cavity and is arranged on the side of the first shell facing the second shell. The first separation rib forms a first separation gap together with the second shell. The first separation gap is connected with the first rear acoustic cavity and the second rear acoustic cavity and separates the sound-absorbing particles.

Description

Technical Field

[0001] This application relates to the field of audio technology, and more particularly to a speaker module and electronic device. Background Technology

[0002] Speaker modules are commonly used audio components in electronic devices. With the trend towards thinner and lighter electronic devices, the installation space for speaker modules is becoming increasingly limited, leading to a trend towards thinner and lighter speaker modules. However, the smaller rear acoustic chamber of these thinner speaker modules reduces sound quality, resulting in a poorer audio experience for the electronic devices. Summary of the Invention

[0003] This application provides a speaker module and an electronic device for improving the sound quality of the speaker module and enhancing the sound quality experience of the electronic device.

[0004] In a first aspect, this application provides a speaker module, comprising:

[0005] First shell;

[0006] The second housing is installed on the first housing and together with the first housing forms a sound cavity;

[0007] The speaker core is installed in the sound cavity, and the sound cavity is divided into a front sound cavity and a rear sound cavity. The rear sound cavity includes a first rear sound cavity and a second rear sound cavity. The first rear sound cavity is arranged opposite to the speaker core, and the second rear sound cavity is arranged offset from the speaker core.

[0008] Sound-absorbing particles are filled in the first rear acoustic cavity;

[0009] An isolator is installed in the first rear acoustic cavity and isolates sound-absorbing particles;

[0010] The first housing is provided with a first partition rib, which is located in the first rear acoustic cavity and is located on the side of the first housing facing the second housing. It forms a first isolation gap with the second housing. The first isolation gap connects the first rear acoustic cavity and the second rear acoustic cavity and isolates the sound-absorbing particles.

[0011] In the speaker module shown in this application, sound-absorbing particles fill the first rear acoustic cavity, which can achieve acoustic expansion of the rear acoustic cavity, equivalent to increasing the volume of the rear acoustic cavity. This helps to achieve better low-frequency output performance of the speaker module and improves the sound quality of the speaker module. In addition, in the speaker module shown in this application, not only can the first isolation gap be used to connect the first and second rear acoustic cavities and ensure airflow between the first and second rear acoustic cavities, but the isolation component and the first isolation gap are also used to block the sound-absorbing particles. This can prevent the sound-absorbing particles from entering the second rear acoustic cavity from the first rear acoustic cavity, prevent the sound-absorbing particles from vibrating in the second rear acoustic cavity, avoid noise from the speaker module, and improve the sound quality of the speaker module.

[0012] In one embodiment, the second housing is provided with a second partition rib, which is located in the first rear acoustic cavity. Along the height direction of the speaker module, the second partition rib is disposed opposite to the first partition rib and together with the first partition rib forms a first isolation gap.

[0013] The speaker module shown in this application has a first partition rib on the first housing and a second partition rib on the second housing. The first partition rib and the second partition rib form a first isolation gap. The first isolation gap can not only connect the first rear acoustic cavity and the second rear acoustic cavity to ensure airflow between the first rear acoustic cavity and the second rear acoustic cavity, but also block sound-absorbing particles to prevent sound-absorbing particles from entering the second rear acoustic cavity from the first rear acoustic cavity. This prevents the sound-absorbing particles from vibrating in the second rear acoustic cavity, avoids noise from the speaker module, and improves the sound quality of the speaker module.

[0014] In one embodiment, the speaker core, the isolator, the first rib and the second rib enclose a second isolation gap, the second isolation gap connects the first rear acoustic cavity and the second rear acoustic cavity, and isolates the sound-absorbing particles.

[0015] The second isolation gap not only connects the first and second rear acoustic cavities, ensuring airflow between them, but also blocks sound-absorbing particles, preventing them from entering the second rear acoustic cavity from the first. This prevents the sound-absorbing particles from vibrating in the second rear acoustic cavity, avoids noise from the speaker module, and improves the sound quality of the speaker module.

[0016] In one embodiment, the first rear acoustic cavity includes a first cavity and a second cavity, the first cavity being disposed opposite to the speaker core, and the second cavity being disposed around the first cavity and communicating with the first cavity;

[0017] The isolator is installed in the first cavity and located between the speaker core and the second housing to prevent sound-absorbing particles from entering the second rear acoustic cavity from the first cavity through the isolator, to prevent the sound-absorbing particles from vibrating in the second rear acoustic cavity, to avoid noise from the speaker module, and to improve the sound quality of the speaker module.

[0018] The first partition rib is located in the second cavity. The first isolation gap connects the second cavity and the second rear acoustic cavity. It can not only connect the second cavity and the second rear acoustic cavity to ensure airflow between the first and second rear acoustic cavities, but also block sound-absorbing particles to prevent them from entering the second rear acoustic cavity from the second cavity through the first isolation gap. This prevents the sound-absorbing particles from vibrating in the second rear acoustic cavity, avoids noise from the speaker module, and improves the sound quality of the speaker module.

[0019] In one embodiment, the thickness of the second cavity is greater than the thickness of the second rear acoustic cavity. That is, the thickness of the second rear acoustic cavity is smaller, and if sound-absorbing particles enter the second rear acoustic cavity, they are very likely to experience particle vibration. The isolator and the first isolation gap can prevent sound-absorbing particles from entering the second rear acoustic cavity from the first rear acoustic cavity, prevent the sound-absorbing particles from experiencing particle vibration in the second rear acoustic cavity, avoid noise from the speaker module, and improve the sound quality of the speaker module.

[0020] In one embodiment, the isolator is an adhesive layer bonded between the speaker core and the second housing. In other words, the isolator can be formed by an adhesive process, which not only simplifies the assembly process of the isolator but also reduces its cost, thus helping to improve the product competitiveness of the speaker module.

[0021] In one embodiment, there are at least two first isolation gaps, which are spaced apart to improve the efficiency of airflow between the first rear acoustic cavity and the second rear acoustic cavity, thereby helping to improve the sound quality of the speaker module.

[0022] In one embodiment, the size of the first isolation gap is smaller than the particle size of the sound-absorbing particles, so as to ensure that the sound-absorbing particles cannot pass through the first isolation gap, thereby playing the role of isolating the sound-absorbing particles.

[0023] In one embodiment, the second housing is provided with a filling hole that penetrates the second housing along its thickness direction and communicates with the first rear acoustic cavity. Sound-absorbing particles are injected into the first rear acoustic cavity through the filling hole.

[0024] The speaker module also includes a seal that seals the filling hole to prevent sound-absorbing particles from leaking out.

[0025] Secondly, this application provides an electronic device, including a housing and any of the above-mentioned speaker modules, wherein the speaker module is installed inside the housing.

[0026] In the speaker module of the electronic device shown in this application, sound-absorbing particles are filled into the first rear acoustic cavity, which can achieve acoustic expansion of the rear acoustic cavity, equivalent to increasing the volume of the rear acoustic cavity. This helps to achieve better low-frequency output performance of the speaker module and improve the sound quality of the speaker module. In addition, in the speaker module shown in this application, not only can the first rear acoustic cavity and the second rear acoustic cavity be connected through the first isolation gap to ensure airflow between the first rear acoustic cavity and the second rear acoustic cavity, but the isolation component and the first isolation gap are also used to block the sound-absorbing particles. This can prevent the sound-absorbing particles from entering the second rear acoustic cavity from the first rear acoustic cavity, prevent the sound-absorbing particles from vibrating in the second rear acoustic cavity, avoid noise from the speaker module, improve the sound quality of the speaker module, and thus improve the sound quality experience of the electronic device. Attached Figure Description

[0027] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments of this application will be described below.

[0028] Figure 1 This is a schematic diagram of the structure of an electronic device provided in an embodiment of this application;

[0029] Figure 2 yes Figure 1 The diagram shows the structure of the speaker module in the electronic device shown.

[0030] Figure 3 yes Figure 2 The diagram shows the structure of the speaker module from another angle.

[0031] Figure 4 yes Figure 2 The exploded view of the speaker module shown.

[0032] Figure 5 yes Figure 2 The diagram shows the structure of the speaker module after being cut open along point II.

[0033] Figure 6 yes Figure 4 The diagram shows the structure of the first housing in the speaker module.

[0034] Figure 7 yes Figure 4 The diagram shows the structure of the second housing in the speaker module.

[0035] Figure 8 yes Figure 7 The diagram shows the structure of the second shell from another angle;

[0036] Figure 9 yes Figure 2 A partial structural diagram of the speaker module after being cut open along line II-II;

[0037] Figure 10 yes Figure 2 The diagram shows a partial structural diagram of the speaker module after it has been cut open along line III-III.

[0038] Figure 11 yes Figure 2 The diagram shows a partial structural diagram of the speaker module after being cut open along line IV-IV.

[0039] Figure 12 yes Figure 4 The diagram shows the assembly structure of the first housing, speaker core, and connecting circuit board in the speaker module. Detailed Implementation

[0040] The technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings.

[0041] Please see Figure 1 , Figure 1 This is a schematic diagram of the structure of an electronic device 1000 provided in an embodiment of this application.

[0042] Electronic device 1000 can be a personal computer (PC), laptop computer, tablet computer, television, multimedia player, e-book reader, in-vehicle device, mobile phone, wearable device, or portable music player, or other electronic product capable of emitting audio. This application embodiment uses a mobile phone as an example for illustration.

[0043] Electronic device 1000 includes a housing 100, a display module 200, a circuit board 300, a camera module 400, and a speaker module 500. The display module 200 is mounted on the housing 100, and the circuit board 300, camera module 400, and speaker module 500 are all mounted inside the housing 100. The display module 200, camera module 400, and speaker module 500 are all electrically connected to the circuit board 300. The circuit board 300 may be the mainboard of electronic device 1000. Functional devices such as a processor or memory may be mounted on the circuit board 300. The processor is electrically connected to the display module 200, camera module 400, and speaker module 500 through the circuit board 300, and can send electrical signals to the display module 200, camera module 400, and speaker module 500 through the circuit board 300.

[0044] The housing 100 includes a frame 110 and a rear cover 120, with the rear cover 120 fixedly connected to one side of the frame 110. The frame 110 has speaker holes 1101, which penetrate the inner and outer sides of the frame 110. The speaker holes 1101 are located at the bottom of the frame 110. Exemplarily, there are five speaker holes 1101, spaced apart. In other embodiments, the speaker holes 1101 may also be located on the rear cover 120 or at other positions on the frame 110, and / or there may be fewer than five or more than five speaker holes. This application does not specifically limit the position and number of speaker holes 1101.

[0045] It should be noted that the directional terms such as "top" and "bottom" used in the description of the electronic device 1000 in this application embodiment are mainly based on the orientation of the electronic device 1000 when held by the user. When the user holds the electronic device 1000, "top" refers to the direction towards the top and "bottom" refers to the direction towards the bottom. This does not indicate or imply that the device or component referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation on the orientation of the electronic device 1000 in actual application scenarios.

[0046] The display module 200 is mounted on the side of the frame 110 facing away from the back cover 120. In other words, the display module 200 and the back cover 120 are located on opposite sides of the frame 110. The display module 200 can display images or videos based on the electrical signals transmitted by the circuit board 300. When the user holds and uses the electronic device 1000, the display module 200 is placed facing the user, and the back cover 120 is placed facing away from the user. The display module 200 is provided with a camera hole 2001, which penetrates the display module 200 along its thickness direction. The camera hole 2001 is located at the top of the display module 200.

[0047] For example, the display module 200 may be a liquid crystal display (LCD), an organic light-emitting diode (OLED) display, an active-matrix organic light-emitting diode (AMOLED) display, a mini organic light-emitting diode (MLED) display, a micro organic light-emitting diode (MOLED) display, a micro organic light-emitting diode (MOLED) display, or a quantum dot light-emitting diode (QLED) display.

[0048] The camera module 400 is located on the top of the electronic device 1000. The camera module 400 serves as a front-facing camera module for the electronic device 1000. The camera module 400 receives electrical signals transmitted from the circuit board 300 and collects light through the camera hole 2001 based on these signals to capture images or videos. In some other embodiments, the electronic device 1000 may also include another camera module (not shown), which can serve as a rear-facing camera module. In this case, the rear cover 120 may also have a camera hole (not shown), and images or videos can be captured through the camera hole of the rear cover 120.

[0049] The speaker module 500 is located at the bottom of the electronic device 1000. The speaker module 500 serves as the speaker for the electronic device 1000. The speaker module 500 receives electrical signals transmitted from the circuit board 300 and vibrates to produce sound according to these signals. The sound emitted by the speaker module 500 is transmitted through the sound hole 1101 to the outside of the housing 100 to realize the sound playback function of the electronic device 1000.

[0050] In some other embodiments, the electronic device 1000 may also include another speaker module (not shown), located on top of the electronic device 1000 and serving as a receiver for the electronic device 1000. In this case, the top of the display module 200 is also provided with a receiver hole (not shown), through which the sound emitted by the other speaker module can be transmitted to the outside of the housing 100 to realize the sound playback function of the electronic device 1000.

[0051] Please see Figures 2 to 4 , Figure 2 yes Figure 1 A schematic diagram of the speaker module 5004 in the electronic device 1000 shown. Figure 3 yes Figure 2 The diagram shows the structure of the speaker module 500 from another angle. Figure 4 yes Figure 2 The exploded view of the speaker module 500 is shown.

[0052] For ease of description, the length direction of the speaker module 500 is defined as the X-axis direction, the width direction of the speaker module 500 is defined as the Y-axis direction, and the thickness direction of the speaker module 500 is defined as the Z-axis direction. The X-axis direction, Y-axis direction, and Z-axis direction are all perpendicular to each other.

[0053] The speaker module 500 includes a first housing 510, a second housing 520, a speaker core 530, a connecting circuit board 540, sound-absorbing particles (not shown), an isolator 550, and a seal 560. The first housing 510 is provided with a sound outlet 511. The sound outlet 511 penetrates the first housing 510 along its thickness direction and connects with the sound-emitting hole 1101 (e.g., Figure 1 (As shown) The first housing 510 is connected to the second housing 520. The second housing 520 is installed on the first housing 510 and together with the first housing 510 forms a sound cavity (not shown in the figure). The sound cavity is connected to the sound outlet 511. In this embodiment, the first housing 510 is used as the upper housing of the module, and the second housing 520 is used as the lower housing of the module. In some other embodiments, the first housing 510 can also be used as the lower housing of the module, and the second housing 520 can also be used as the upper housing of the module. This application does not make specific limitations in this regard.

[0054] A speaker core 530 is mounted in the acoustic cavity, dividing the acoustic cavity into a front acoustic cavity (not shown) and a rear acoustic cavity 503. The front acoustic cavity communicates with the sound outlet 511. The speaker core 530 and the first housing 510 enclose the front acoustic cavity to form the front acoustic cavity, and the side of the speaker core 530 facing away from the front acoustic cavity forms the rear acoustic cavity 503. The rear acoustic cavity 503 includes a first rear acoustic cavity 504 and a second rear acoustic cavity 505. The first rear acoustic cavity 504 is disposed opposite to the speaker core 530. The second rear acoustic cavity 505 is offset from the speaker core 530. A connecting circuit board 540 is mounted in the rear acoustic cavity 503.

[0055] One end of the connecting circuit board 540 is located in the first rear acoustic cavity 504 and is electrically connected to the speaker core 530. The other end passes through the second rear acoustic cavity 505, extends out of the second rear acoustic cavity 505, and is connected to the circuit board 300 (e.g., Figure 1 (As shown) Electrical connection. The connecting circuit board 540 can transmit the electrical signals transmitted by the circuit board 300 to the speaker core 530. The speaker core 530 can convert the electrical signals into sound signals, and the sound is transmitted sequentially through the sound outlet 511 and the speaker hole 1101 to the housing 100 (as shown). Figure 1On the outside of (as shown), electronic device 1000 (such as) is implemented. Figure 1 The sound is emitted as shown. Sound-absorbing particles fill the first rear acoustic cavity 504. An isolator 550 is installed in the first rear acoustic cavity 504 and isolates the sound-absorbing particles. It should be noted that the isolator 550 isolates the sound-absorbing particles in a way that the sound-absorbing particles cannot pass through the isolator 550. For example, the sound-absorbing particles located in the first rear acoustic cavity 504 cannot pass through the isolator 550 to enter the second rear acoustic cavity 505.

[0056] Please see Figure 5 and Figure 6 , Figure 5 yes Figure 2 The diagram shows the structure of the speaker module 500 after being cut along point II. Figure 6 yes Figure 4 The diagram shows the structure of the first housing 510 in the speaker module 500. The phrase "cut along II" refers to cutting along the plane containing II; similar descriptions in the following text can be understood in the same way.

[0057] The first housing 510 is provided with a mounting groove 512, a sound outlet 511, and a first clearance groove 513. The opening of the mounting groove 512 is located on the upper surface 510a of the first housing 510. The mounting groove 512 is recessed from the upper surface 510a of the first housing 510 to the lower surface 510b (negative Z-axis direction in the figure). The mounting groove 512 includes a first mounting groove 514 and a second mounting groove 515. The second mounting groove 515 communicates with the first mounting groove 514.

[0058] It should be noted that the directional terms such as "up" and "down" used in the description of the speaker module 500 in this application are described with reference to the coordinate axis shown in the figure. "Up" refers to the positive direction of the Z-axis and "down" refers to the negative direction of the Z-axis. This does not constitute a limitation on the actual application of the speaker module 500.

[0059] The sound outlet 511 communicates with the mounting groove 512. Specifically, the sound outlet 511 communicates with the first mounting groove 514. The sound outlet 511 has a first opening 511a and a second opening 511b. The first opening 511a is located on the side wall of the first mounting groove 514 and communicates with it. The second opening 511b is opposite to the first opening 511a and is located on the outer peripheral surface 510c of the first housing 510. The diameter of the sound outlet 511 gradually increases from the first opening 511a to the second opening 511b. In other words, the sound outlet 511 is horn-shaped to improve the loudness of the speaker module 500.

[0060] The opening of the first clearance groove 513 is located on the upper surface 510a of the first housing 510. The first clearance groove 513 is recessed from the upper surface 510a of the first housing 510 towards the lower surface 510b (negative Z-axis direction in the figure), and penetrates the groove side wall of the mounting groove 512 and the outer peripheral surface 510c of the first housing 510, and communicates with the mounting groove 512. The first clearance groove 513 also penetrates the groove side wall of the second mounting groove 515 and communicates with the second mounting groove 515.

[0061] In addition, the first housing 510 is also provided with a first partition 516, which is located on the side of the first housing 510 facing the second housing 520. Specifically, the first partition 516 is located on the side of the first mounting groove 514 near the second mounting groove 515. The first partition 516 is located on the groove sidewall of the first mounting groove 514 and extends from the groove sidewall of the first mounting groove 514 towards the first mounting groove 514, and connects to the groove bottom wall of the first mounting groove 514. There are two first partition 516s, which are spaced apart. For example, one first partition 516 extends parallel to the Y-axis direction, and the other first partition 516 extends parallel to the X-axis direction. In some other embodiments, there may be one or more first partition 516s, and this application does not impose specific limitations on this.

[0062] Please see Figure 7 and Figure 8 , Figure 7 yes Figure 4 The diagram shows the structure of the second housing 520 in the speaker module 500. Figure 8 yes Figure 7 The diagram shows the structure of the second housing 520 from another angle.

[0063] The second housing 520 is provided with a receiving groove 521, a second clearance groove 522, and a filling hole 523. The openings of the receiving groove 521 and the second clearance groove 522 are both located on the lower surface 520a of the second housing 520. Both the receiving groove 521 and the clearance groove 522 are recessed from the lower surface 520a to the upper surface 520b (positive Z-axis direction in the figure). The receiving groove 521 includes a first receiving groove 524 and a second receiving groove 525. The second receiving groove 525 communicates with the first receiving groove 524. The second clearance groove 522 penetrates the groove sidewall of the receiving groove 521 and the outer peripheral surface 520c of the second housing 520, and communicates with the receiving groove 521. The second clearance groove 522 penetrates the groove sidewall of the second receiving groove 525, and communicates with the second receiving groove 525.

[0064] The filling hole 523 extends through the second housing 520 along its thickness direction (Z-axis direction in the figure) and communicates with the receiving groove 521. Specifically, the filling hole 523 penetrates the upper surface 520b of the second housing 520 and the bottom wall of the receiving groove 521. The filling hole 523 also penetrates the bottom wall of the first receiving groove 524 and communicates with it. For example, there are two filling holes 523, spaced apart.

[0065] In addition, the second housing 520 is also provided with a second partition 526, which is located on the side of the second housing 520 facing the first housing 510. Specifically, the second partition 526 is located on the side of the first receiving groove 524 near the second receiving groove 525. The second partition 526 is located on the groove sidewall of the first receiving groove 524 and extends from the groove sidewall of the first receiving groove 524 towards the first receiving groove 524, and connects to the groove bottom wall of the first receiving groove 524. There are two second partition 526, which are spaced apart. For example, one second partition 526 extends parallel to the Y-axis direction, and the other second partition 526 extends parallel to the X-axis direction. In some other embodiments, there may be one or more second partition 526, and this application does not impose specific limitations on this.

[0066] Please refer to the following: Figure 6 and Figures 9 to 11 , Figure 9 yes Figure 2 The diagram shows a partial structural view of the speaker module 500 after being cut along line II-II. Figure 10 yes Figure 2 The diagram shows a partial structural view of the speaker module 500 after being cut along line III-III. Figure 11 yes Figure 2 The diagram shows a partial structural diagram of the speaker module 500 after being cut open along line IV-IV.

[0067] The second housing 520 is fixedly installed in the mounting groove 512 of the first housing 510. Exemplarily, the second housing 520 can be installed in the mounting groove 512 by ultrasonic welding. In other embodiments, the second housing 520 can also be installed in the mounting groove 512 by adhesive bonding. Specifically, the mounting groove 512 of the first housing 510 and the receiving groove 521 of the second housing 520 enclose to form a sound cavity 501. The first clearance groove 513 of the first housing 510 and the second clearance groove 522 of the second housing 520 enclose to form a clearance hole (not shown). The filling hole 523 of the second housing 520 communicates with the sound cavity 501. Along the height direction of the speaker module 500, each first partition 516 and a second partition 526 are spaced apart and opposite to each other. Each first partition 516 and a second partition 526 enclose to form a first isolation gap 506. The two first isolation gaps 506 are spaced apart and both are used to isolate sound-absorbing particles. It is understandable that when there are three or more first partition ribs 516 and second partition ribs 526, there are three or more first isolation gaps 506. The more first isolation gaps 506 there are, the higher the efficiency of airflow between the first rear acoustic cavity 504 and the second rear acoustic cavity 505, which helps to improve the sound quality of the speaker module 500.

[0068] In some other embodiments, the second housing 520 may not have the second partition 526. In this case, the first partition 516 and the second housing 520 enclose each other to form the first isolation gap 506. Alternatively, the first housing 510 may not have the first partition 516. In this case, the second housing 520 has the second partition 526, and the second partition 526 and the first housing 510 enclose each other to form the first isolation gap 506. This application does not impose specific limitations on this.

[0069] Please refer to the following: Figure 12 , Figure 12 yes Figure 4 The diagram shows the assembly structure of the first housing 510, the speaker core 530, and the connecting circuit board 540 in the speaker module 500.

[0070] The speaker core 530, the connecting circuit board 540, and the isolator 550 are all mounted on the first housing 510. Specifically, the speaker core 530 and the connecting circuit board 540 are both mounted in the mounting groove 512. The speaker core 530 is mounted in the first mounting groove 514 and is spaced apart from both the first partition 516 and the second partition 526. For example, the speaker core 530 may be a moving-coil speaker core.

[0071] The speaker core 530 and the first mounting groove 514 enclose a front acoustic cavity 502. The speaker core 530, mounting groove 512, and receiving groove 521 enclose a rear acoustic cavity 503. The rear acoustic cavity 503 communicates with a clearance hole (not shown) and a filling hole 523. The speaker core 530 and the filling hole 523 are offset. Specifically, the speaker core 530, the first mounting groove 514, and the first receiving groove 524 enclose a first rear acoustic cavity 504, which communicates with the filling hole 523. The first partition 516, the second partition 526, and the first isolation gap 506 are all located in the first rear acoustic cavity 504, and are located on the side of the first rear acoustic cavity 504 closest to the second rear acoustic cavity 505. The first isolation gap 506 connects the first rear acoustic cavity 504 and the second rear acoustic cavity 505 to ensure airflow communication between them.

[0072] In this embodiment, the first rear acoustic cavity 504 includes a first cavity 507 and a second cavity 508. The first cavity 507 is disposed opposite to the speaker core 530. The second cavity 508 is disposed around the first cavity 507 and communicates with the first cavity 507. The thickness of the second cavity 508 is greater than the thickness of the first cavity 507. The first partition 516, the second partition 526, and the first isolation gap 506 are all located in the second cavity 508, and are located on the side of the second cavity 508 closest to the second rear acoustic cavity 505. The first isolation gap 506 connects the second cavity 508 and the second rear acoustic cavity 505 to ensure airflow communication between the second cavity 508 and the second rear acoustic cavity 505.

[0073] The second mounting groove 515 and the second receiving groove 525 enclose and form a second rear acoustic cavity 505, which communicates with the clearance hole. The second rear acoustic cavity 505 is also connected to the first cavity 507 and the second cavity 508. The thickness of the second rear acoustic cavity 505 is less than the thickness of the second cavity 508. That is, the thickness of the second rear acoustic cavity 505 is very small. It should be noted that the second cavity 508 can also be referred to as the core peripheral cavity, and the second rear acoustic cavity 505 can also be referred to as the thin-film region cavity.

[0074] Sound-absorbing particles fill the first rear acoustic cavity 504, increasing its volume and consequently the volume of the rear acoustic cavity 503. This helps improve the low-frequency output performance of the speaker module 500, enhancing its sound quality and improving the audio experience of the electronic device 1000. The particle size of the sound-absorbing particles is larger than the size of the first isolation gap 506, preventing them from passing through the first isolation gap 506 to reach the second rear acoustic cavity 505. This prevents the sound-absorbing particles from generating vibrations in the second rear acoustic cavity 505, avoiding noise from the speaker module 500, improving its sound quality, and thus enhancing the audio experience of the electronic device 1000. For example, the sound-absorbing particles can be bass powder, with a particle size between 0.2mm and 0.3mm.

[0075] The sound-absorbing particles can be injected into the first rear acoustic cavity 504 through the filling hole 523. It should be noted that because the filling hole 523 is misaligned with the speaker core 530, the amount of sound-absorbing particles entering the speaker core 530 is reduced, ensuring the normal operation of the speaker core 530. Furthermore, the sealing member 560 seals the filling hole 523. After the sound-absorbing particles are injected into the first rear acoustic cavity 504 through the filling hole 523, the sealing member 560 prevents the sound-absorbing particles from leaking out. For example, there are two sealing members 560, each sealing one of the two filling holes 523.

[0076] The connecting circuit board 540 is mounted in the first mounting slot 514 and the second mounting slot 515, passes through the clearance hole, and extends out of the clearance hole into the rear acoustic cavity 503. In this embodiment, the connecting circuit board 540 may be a flexible printed circuit (FPC).

[0077] An isolator 550 is installed in the first cavity 507 and located between the speaker core 530 and the second housing 520, and is spaced apart from both the first partition 516 and the second partition 526. The isolator 550 isolates the first cavity 507 and the second rear acoustic cavity 505. With this configuration, not only can the air in the first cavity 507 and the second rear acoustic cavity 505 not circulate through the isolator 550, but the sound-absorbing particles located in the first rear acoustic cavity 504 cannot enter the second rear acoustic cavity 505 from the first cavity 507 (i.e., above the speaker core 530) through the isolator 550. This prevents the sound-absorbing particles from generating vibrations in the second rear acoustic cavity 505, avoids noise in the speaker module 500, improves the sound quality of the speaker module 500, and thus enhances the audio experience of the electronic device 1000.

[0078] For example, the isolator 550 is an adhesive layer, which is bonded between the speaker core 530 and the second housing 520. In other words, the isolator 550 can be formed by an adhesive process, which not only simplifies the assembly process of the isolator 550, but also reduces the cost of the isolator 550, thus helping to improve the product competitiveness of the speaker module 500.

[0079] In this embodiment, the isolator 550, the speaker core 530, a first partition 516, and a second partition 526 enclose a second isolation gap 509. Each second isolation gap 509 connects the first rear acoustic cavity 504 and the second rear acoustic cavity 505 to ensure airflow communication between the first rear acoustic cavity 504 and the second rear acoustic cavity 505. The second isolation gap 509 also isolates sound-absorbing particles. The size of the second isolation gap 509 is smaller than the particle size of the sound-absorbing particles. Sound-absorbing particles located in the first rear acoustic cavity 504 cannot pass through the second isolation gap 509 to reach the second rear acoustic cavity 505, preventing the sound-absorbing particles from generating particle vibration in the second rear acoustic cavity 505. This avoids noise generation in the speaker module 500, improves the sound quality of the speaker module 500, and thus enhances the audio experience of the electronic device 1000.

[0080] In the speaker module 500 shown in this application, sound-absorbing particles are filled in the first rear acoustic cavity 504, which realizes the acoustic expansion of the rear acoustic cavity 503, which is equivalent to increasing the volume of the rear acoustic cavity 503. This helps to achieve better low-frequency external playback performance of the speaker module 500 and improves the sound effect experience of the speaker module 500. Furthermore, the speaker module 500 is equipped with an isolator 550 to prevent sound-absorbing particles from flowing from the first cavity 507 (i.e., above the speaker core 530) to the second rear acoustic cavity 505, and a first isolation gap 506 to prevent sound-absorbing particles from flowing from the second cavity 508 (i.e., around the speaker core 530) to the second rear acoustic cavity 505. Sound-absorbing particles located in the first rear acoustic cavity 504 cannot enter the second rear acoustic cavity 505 via the isolator 550 and the first isolation gap 506, thus preventing sound-absorbing particles from entering the second rear acoustic cavity 505 and causing noise due to particle vibration. This helps improve the sound quality of the speaker module 500 and enhances the audio experience of the electronic device 1000. In addition, since the first isolation gap 506 also connects the first rear acoustic cavity 504 and the second rear acoustic cavity 505, it ensures gas flow between the two cavities, guaranteeing that the volume of the rear acoustic cavity 503 of the speaker module 500 is sufficiently large, further contributing to improved sound quality.

[0081] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Where there is no conflict, the embodiments and features in the embodiments of this application can be combined with each other. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A speaker module, characterized in that, include: First shell; The second housing is installed on the first housing and together with the first housing forms a sound cavity; A loudspeaker core is installed in the acoustic cavity, and the acoustic cavity is divided into a front acoustic cavity and a rear acoustic cavity. The rear acoustic cavity includes a first rear acoustic cavity and a second rear acoustic cavity. The first rear acoustic cavity is disposed opposite to the loudspeaker core, and the second rear acoustic cavity is disposed offset from the loudspeaker core. Sound-absorbing particles, which are filled in the first rear acoustic cavity; An isolator is installed in the first rear acoustic cavity and isolates the sound-absorbing particles; The first housing is provided with a first partition rib, which is located in the first rear acoustic cavity and is disposed on the side of the first housing facing the second housing, and forms a first isolation gap with the second housing. The first isolation gap connects the first rear acoustic cavity and the second rear acoustic cavity and isolates the sound-absorbing particles.

2. The speaker module according to claim 1, characterized in that, The second housing is provided with a second partition rib, which is located in the first rear acoustic cavity. Along the height direction of the speaker module, the second partition rib is disposed opposite to the first partition rib and together with the first partition rib forms the first isolation gap.

3. The speaker module according to claim 2, characterized in that, The speaker core, the insulating component, the first rib, and the second rib enclose a second isolation gap, which connects the first rear acoustic cavity and the second rear acoustic cavity and isolates the sound-absorbing particles.

4. The speaker module according to any one of claims 1 to 3, characterized in that, The first rear acoustic cavity includes a first cavity and a second cavity. The first cavity is disposed opposite to the speaker core, and the second cavity is disposed around the first cavity and communicates with the first cavity. The isolator is installed in the first cavity and is located between the speaker core and the second housing; The first partition is located in the second cavity, and the first isolation gap connects the second cavity and the second rear acoustic cavity.

5. The speaker module according to claim 4, characterized in that, The thickness of the second cavity is greater than the thickness of the second rear acoustic cavity.

6. The speaker module according to claim 4 or 5, characterized in that, The insulating component is an adhesive layer, which is bonded between the speaker core and the second housing.

7. The loudspeaker module according to any one of claims 1 to 6, characterized in that, There are at least two first isolation gaps, and the two first isolation gaps are spaced apart.

8. The loudspeaker module according to any one of claims 1 to 7, characterized in that, The size of the first isolation gap is smaller than the particle size of the sound-absorbing particles.

9. The speaker module according to any one of claims 1 to 8, characterized in that, The second housing is provided with a filling hole, which penetrates the second housing along the thickness direction and communicates with the first rear sound cavity; The speaker module also includes a seal that seals the filling hole.

10. An electronic device, characterized in that, It includes a housing and a speaker module as described in any one of claims 1 to 9, the speaker module being mounted inside the housing.

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