An X-ray generating device

Abstract

The application provides an X-ray generating device, comprising a ray tube, including: a grounding cavity; a filament located inside the grounding cavity and used for emitting electrons to form an electron beam; a grid assembly located inside the grounding cavity and used for controlling the electron beam; and an anode target located on the exit side of the electron beam and used for receiving electron impact and generating X-rays; a high-voltage generating system connected with the ray tube and used for providing a high-voltage electric field; an optical detection device, a light transmission window is sealingly arranged on the grounding cavity of the ray tube, the optical detection device is arranged outside the light transmission window, and the optical detection device is used for detecting an optical signal inside the ray tube; and a control system connected with the optical detection device and the high-voltage generating system in signal connection; the control system automatically adjusts the output voltage and / or current of the high-voltage generating system according to the optical signal, and the X-ray generating device provided in the embodiment can detect the spark discharge in real time and automatically adjust the operation parameters during the operation of the X-ray tube.

Description

Technical Field

[0001] This invention relates to the field of X-ray technology, and more specifically, to an X-ray generating device. Background Technology

[0002] As an X-ray output source, X-ray tubes generate X-rays that can be used for non-destructive testing of the interior of objects, and are widely used in various fields such as medical, security inspection, and industrial flaw detection. This has placed higher demands on non-destructive testing equipment, requiring both high penetration and high precision. Currently, microfocus X-ray sources operating at 300 kilovolts have become indispensable core equipment. These devices need to stably generate micron-sized focal spots of X-rays under extremely high voltage to ensure that CT imaging has sufficient penetration depth and clarity, thereby meeting the stringent accuracy requirements of high-end manufacturing fields.

[0003] However, under 300 kV high-voltage conditions, the electric field strength between the high-voltage electrodes inside the X-ray tube is extremely high, making it highly susceptible to arcing discharges in localized areas. These arcing discharges not only interfere with the stable output of X-rays and introduce artifacts in CT images, but also accelerate the aging of internal components and shorten the lifespan of the X-ray tube. Therefore, real-time monitoring and effective suppression of arcing discharges are crucial for the stable operation of high-voltage X-ray sources.

[0004] Currently, monitoring of arcing and discharge inside X-ray tubes relies on indirect methods such as current fluctuation monitoring or periodic manual inspection. This makes it difficult to achieve real-time capture and precise location of discharge events, and further hinders the automatic adjustment and protection of equipment operating parameters based on the severity of the discharge. Under high-voltage operating conditions, critical interface parts such as high-voltage cable connections require frequent maintenance, increasing equipment maintenance costs and operational complexity.

[0005] Meanwhile, existing high-voltage X-ray sources mostly employ reflective target structures to avoid damage to the target surface due to excessive heat load. This typically requires increasing the target angle and correspondingly enlarging the electron beam focal spot size, which directly leads to a decrease in spatial resolution, making it difficult to achieve an effective balance between high penetration and high resolution. Furthermore, the open X-ray tube operates in a high-vacuum environment. Under the influence of a strong electric field, the high-voltage electrodes, such as the grounding cavity and grid assembly, are prone to electric field distortion due to tiny burrs or rough areas on their surfaces, resulting in arcing discharge phenomena. Summary of the Invention

[0006] Given that the existing technologies described above mainly rely on current fluctuation monitoring or manual periodic inspection to monitor arcing and discharge inside the X-ray tube, this application provides an X-ray generating device to solve the problem of real-time detection of arcing and discharge and automatic adjustment of operating parameters during the operation of the X-ray tube.

[0007] To achieve the above and other related objectives, the present invention provides an X-ray generating apparatus, comprising:

[0008] The X-ray tube includes: a grounded cavity; a filament located inside the grounded cavity for emitting electrons to form an electron beam; a grid assembly located inside the grounded cavity for controlling the electron beam; and an anode target located on the emission side of the electron beam for receiving electron impacts and generating X-rays.

[0009] A high-voltage generating system, connected to the ray tube, is used to provide a high-voltage electric field;

[0010] An optical detection device is provided, wherein a light-transmitting window is sealed on the grounded cavity of the X-ray tube, and the optical detection device is disposed outside the light-transmitting window. The optical detection device is used to detect the light signal inside the X-ray tube.

[0011] The control system is connected to the optical detection device and the high-voltage generating system via signal connection; the control system automatically adjusts the output voltage and / or current of the high-voltage generating system according to the optical signal.

[0012] Optionally, the optical detection device includes a solar-blind ultraviolet sensor for detecting solar-blind ultraviolet light signals generated by arc discharge.

[0013] Optionally, it further includes: a sensor driving circuit, which is communicatively connected to the solar-blind ultraviolet sensor and the control system, wherein the sensor driving circuit processes the light signal output by the solar-blind ultraviolet sensor and transmits it to the control system.

[0014] Optionally, the optical detection device includes a solar-blind ultraviolet imager for imaging and locating the arcing position inside the ray tube.

[0015] Optionally, it also includes a host computer, which is connected to the solar-blind ultraviolet imager and the control system; the host computer is used to receive and display the arcing and discharge images acquired by the solar-blind ultraviolet imager, and to send control parameters to the control system.

[0016] Optionally, the gate assembly includes a protrusion and a gate cap, the filament is disposed on the protrusion, the gate cap is upside down on the protrusion, and an opening is provided on the bottom surface of the gate cap so that the electron beam passes through the opening.

[0017] Optionally, the ray tube further includes:

[0018] A high-voltage insulator, located inside the grounding cavity, is used to support the gate assembly and to electrically insulate the gate assembly from the grounding cavity;

[0019] An anode plate is located at the top of the grounding cavity, and a through hole is provided in the center of the anode plate to allow the electron beam to pass through;

[0020] An electrode shoe assembly is located between the anode plate and the anode target, with the center hole of the electrode shoe assembly aligned with the through hole;

[0021] A focusing coil is arranged around the pole shoe assembly to focus the electron beam.

[0022] Optionally, the anode target includes a target substrate and a coating layer, the coating layer being disposed on the side surface of the target substrate facing the electron beam incident.

[0023] Optionally, the target substrate is made of single-crystal diamond sheet; the coating layer is made of tungsten.

[0024] Optionally, the inner surface of the grounding cavity and the outer surface of the gate assembly are subjected to surface processing, including polishing and high-gloss treatment, so that the surface roughness Ra of the inner surface of the grounding cavity and the outer surface of the gate assembly is ≤0.8μm.

[0025] As described above, the X-ray generating apparatus provided by the present invention has at least the following beneficial technical effects:

[0026] In the X-ray generating device of this invention, through the coordinated operation of optical detection and feedback adjustment, abnormal operating conditions inside the tube can be detected and actively intervened in real time without damaging the vacuum seal. When an anomaly occurs in the optical signal due to discharge, the control system automatically reduces the output of the high-voltage generating system and / or adjusts the current parameters in a timely manner. This helps to suppress the continued development of the discharge process to a certain extent, reduces the risk of damage to the anode target caused by frequent arcing, and mitigates the adverse effects of discharge on the electron beam focusing stability. At the same time, the dynamic adjustment based on the optical signal enables the high-voltage generating system to adaptively optimize the output within a certain range according to the actual operating conditions. This is beneficial for balancing imaging resolution and output power under micro-focus conditions, thereby helping to improve the performance balance during high-voltage operation and enhancing the overall stability and reliability of the device.

[0027] In addition, the inner surface of the grounding cavity and the outer surface of the gate assembly are polished and high-gloss treated to reduce surface roughness, remove micro burrs, make the internal electric field distribution uniform, avoid electric field distortion, and reduce the probability of arcing discharge from the physical structure level. Attached Figure Description

[0028] Figure 1 The diagram shown is a structural schematic of the X-ray generating device provided by the present invention.

[0029] Figure 2 Displayed as Figure 1The diagram shows the structure of the anode target.

[0030] Reference numerals: 1. X-ray tube; 11. Grounding cavity; 111. Through hole; 112. Light-transmitting window; 12. Filament; 13. Grid assembly; 131. Protrusion; 132. Grid cap; 14. Anode target; 141. Target substrate; 142. Coating layer; 15. High-voltage insulator; 151. Bottom flange; 152. Central support column; 16. Anode plate; 161. Through hole; 17. Pole shoe assembly; 18. Focusing coil; 2. High-voltage generation system; 21. High-voltage cable; 22. High-voltage plug; 3. Optical detection device; 31. Solar-blind ultraviolet sensor; 32. Solar-blind ultraviolet imager; 33. Sensor bracket; 4. Control system; 5. Sensor drive circuit; 6. Host computer. Detailed Implementation

[0031] The following specific examples illustrate the implementation of the present invention. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through other different specific embodiments, and various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of the present invention.

[0032] It should be noted that the illustrations provided in this embodiment are only schematic representations of the basic concept of the present invention. Although the illustrations only show components related to the present invention and are not drawn according to the actual number, shape and size of the components, the shape, quantity, positional relationship and proportion of each component can be arbitrarily changed under the premise of realizing the technical solution of this invention, and the layout of the components may also be more complex.

[0033] This embodiment provides an X-ray generating device, such as... Figure 1 The diagram shows a schematic of the X-ray generating device provided in this embodiment. The X-ray generating device includes: a ray tube 1, a high-voltage generating system 2, an optical detection device 3, and a control system 4. The ray tube 1 is the X-ray generating component. The high-voltage generating system 2 is connected to the ray tube 1 and is used to provide a high-voltage electric field to the ray tube 1. The optical detection device 3 is disposed outside the ray tube 1 and is used to detect the light signal inside the ray tube 1 through the light-transmitting window 112. When arcing occurs inside the ray tube 1 due to distortion of the high-voltage electric field, the arcing will generate a light signal of a specific wavelength, which the optical detection device 3 captures in real time. The control system 4 is signal-connected to both the optical detection device 3 and the high-voltage generating system 2. The control system 4 receives the light signal output by the optical detection device 3 and automatically adjusts the output voltage and / or current of the high-voltage generating system 2 according to the light signal to suppress arcing.

[0034] Reference Figure 1As shown, the X-ray tube 1 includes a grounded cavity 11, a filament 12, a grid assembly 13, and an anode target 14 disposed inside the grounded cavity 11. The grounded cavity 11 is a sealed metal shell with an internal vacuum environment, providing space for the acceleration and transmission of the electron beam, ensuring the quality of the electron beam and the purity of the X-rays. The filament 12 serves as an electron emission source, used to emit electrons to form an electron beam. The anode target 14 is disposed above the grounded cavity 11, on the emission side of the electron beam, used to receive electron impacts and generate X-rays.

[0035] The gate assembly 13 is located outside the filament 12 and is used to control the emission and cutoff of the electron beam. The gate assembly 13 is disposed above the high-voltage insulator 15 and includes a protrusion 131 and a gate cap 132. The filament 12 is disposed on the protrusion 131. The gate cap 132 is a hollow cylindrical structure, including a bottom surface and an enclosing sidewall structure. An opening is provided on the bottom surface, which is located at the center of the bottom surface of the gate cap 132. The gate cap 132 is inverted and placed above the protrusion 131. The electron beam emitted by the filament 12 passes through the opening on the bottom surface of the gate cap 132 and is transmitted along the central axis of the ray tube 1.

[0036] Specifically, the inner surface of the grounding cavity 11 and the outer surface of the gate assembly 13 undergo special surface processing treatment. This surface processing includes at least one of mechanical polishing, electrolytic polishing, or chemical polishing to remove minute burrs and processing marks from the surfaces. Then, based on the polishing treatment, a high-gloss finish is applied to the surfaces. This reduces the surface roughness of the inner surface of the grounding cavity 11 and the outer surface of the gate assembly 13. Optionally, the surface roughness Ra ≤ 0.8 μm; further, the surface roughness Ra ≤ 0.4 μm.

[0037] The grounding cavity 11 is at zero potential, and the gate assembly 13 is a high-voltage energized component. The inner surface of the grounding cavity 11 and the outer surface of the gate assembly 13 are treated with a surface treatment process, resulting in a smooth, flat surface without any microscopic sharp protrusions. This makes the electric field distribution between the grounding cavity 11 and the gate assembly 13 more uniform, avoiding localized electric field distortion and concentration caused by surface burrs or roughness. Eliminating electric field distortion effectively reduces the probability of inducing high-voltage discharge, and from a physical structural perspective, reduces the frequency of internal arcing discharges in the X-ray tube 1, enhancing the stability and reliability of the X-ray tube 1 under 300kV high voltage operation.

[0038] Reference Figure 1As shown, the X-ray tube 1 also includes a high-voltage insulator 15, which is disposed inside the grounding cavity 11. The high-voltage insulator 15 supports the grid assembly 13 and provides electrical insulation between the grid assembly 13 and the grounding cavity 11. The high-voltage insulator 15 includes a bottom flange portion 151 and a central support column portion 152. The bottom flange portion 151 is disposed at the bottom of the grounding cavity 11 and is fixedly connected to the inner wall of the grounding cavity 11; the central support column portion 152 is disposed at the center of the bottom flange portion 151 and extends upward along the central axis of the grounding cavity 11. The top end of the central support column portion 152 is fixedly connected to the bottom of the grid assembly 13, serving to support the grid assembly 13 and the filament 12 disposed on the grid assembly 13. The bottom flange portion 151 and the central support column portion 152 are integrally formed, forming an inverted T-shape. Generally, the high-voltage insulator 15 is made of materials such as ceramic materials and engineering plastics.

[0039] The filament 12 is disposed inside the grid assembly 13 and is used to emit electrons to form an electron beam. During operation, the high-voltage generating system 2 is connected to a high-voltage lead-in wire passing through the high-voltage insulator 15 via a high-voltage cable 21. The other end of the high-voltage lead-in wire is electrically connected to the terminals of the grid assembly 13 and the filament 12, providing heating current to the filament 12 and creating a high-voltage electric field between the filament 12 and the anode target 14. When the temperature of the filament 12 reaches a set value, electrons on its tip surface are drawn out under the action of the high-voltage electric field, forming an electron beam. The grid assembly 13 is used to control the beam current of the electrons emitted by the filament 12, performing preliminary focusing and shaping of the electron beam.

[0040] The ray tube 1 also includes an anode plate 16, which is disposed on the top of the grounding cavity 11 and serves as the top cover of the grounding cavity 11 to achieve vacuum sealing. A through hole 161 is provided in the center of the anode plate 16 so that the electron beam emitted by the filament 12 can pass through the inside of the grounding cavity 11 and enter the area where the pole shoe assembly 17 is located.

[0041] The X-ray tube 1 also includes an electrode assembly 17 and a focusing coil 18. The electrode assembly 17 is disposed above the anode plate 16 and is made of a high-permeability material. The central hole of the electrode assembly 17 is aligned with the through hole 161. The filament 12 extends along the central axis of the X-ray tube 1 and passes through the through hole 161 and the central hole. The electrode assembly 17 is used to guide and focus the magnetic field. The focusing coil 18 is arranged around the electrode assembly 17 and is used to focus the electron beam. When the focusing coil 18 is activated by direct current, a magnetic field is generated. The magnetic field induces an induced magnetic field in the electrode assembly 17, thereby forming a magnetic lens magnetic field at the end of the electrode assembly 17, which focuses the electron beam passing through it, so that the electron beam forms a microfocal spot on the anode target 14.

[0042] The anode target 14 is disposed above the pole shoe assembly 17 and is used to receive the focused electron beam impact and generate X-rays. In this embodiment, the anode target 14 is a transmission anode target. Specifically, as shown... Figure 2 The diagram shows a schematic of the anode target structure. The anode target 14 includes a target substrate 141 and a coating layer 142, with the coating layer 142 disposed on the surface of the target substrate 141 facing the electron beam incident. Specifically, the electron beam is incident from the coating layer 142 side of the anode target 14 and exits from the other side of the anode target 14, i.e., the target substrate 141 side. Generally, the target substrate 141 is made of materials such as single-crystal / polycrystalline diamond, graphite, and beryllium; the coating layer 142 is made of materials such as tungsten, molybdenum, and alloys. In this embodiment, the target substrate 141 is made of single-crystal diamond, and the coating layer 142 is made of tungsten. Single-crystal diamond has an extremely high thermal conductivity (≥2000 W / m·K), which can quickly conduct away the heat deposited on the coating layer 142, thereby maintaining a micro-focal spot while ensuring high power and achieving high-resolution imaging.

[0043] Specifically, the thickness of the coating layer 142 is matched to the operating voltage of the X-ray generator. Specifically, when the maximum operating voltage is 160kV, the thickness of the coating layer 142 is a first thickness, ranging from 5 to 7 μm; when the maximum operating voltage is 225kV, the thickness of the coating layer 142 is a second thickness, ranging from 7 to 10 μm; and when the maximum operating voltage is 300kV, the thickness of the coating layer 142 is a third thickness, ranging from 10 to 15 μm. By setting corresponding coating layer thicknesses for different voltage levels, the transmission target maintains optimal heat dissipation efficiency and X-ray generation efficiency under different high voltages. In this embodiment, the maximum operating voltage of the X-ray generator is 300kV, and the thickness of the coating layer 142 is 10 to 15 μm. Under 300kV and 50W power conditions, the limiting resolution can reach 15 μm; when the target power is less than 10W, the limiting resolution can reach 1 μm.

[0044] Specifically, the high-voltage generating system 2 is connected to the ray tube 1 to provide a high-voltage electric field. The high-voltage generating system 2 is connected via a high-voltage cable to a high-voltage lead-in wire passing through the high-voltage insulator 15. The other end of the high-voltage lead-in wire is electrically connected to the terminals of the grid assembly 13 and the filament 12, thereby providing high-voltage electrical energy to the grid assembly 13 and the filament 12. The output voltage and / or current of the high-voltage generating system 2 is controlled by the control system 4.

[0045] Specifically, such as Figure 1As shown, the high-voltage generating system 2 is connected to the X-ray tube 1 via a high-voltage cable 21. High-voltage plugs 22 are installed at both ends of the high-voltage cable 21. One high-voltage plug 22 is connected to the high-voltage output terminal of the high-voltage generating system 2, and the other high-voltage plug 22 is connected to the high-voltage input terminal at the bottom of the high-voltage insulator 15. The high-voltage electrical energy output from the high-voltage generating system 2 is sequentially transmitted through the high-voltage cable 21, the high-voltage plug 22, and the high-voltage input line to the grid assembly 13 and the filament 12, providing high-voltage electrical energy to the grid assembly 13 and the filament 12, and establishing a high-voltage electric field between the filament 12 and the anode target 14. The output voltage and / or current of the high-voltage generating system 2 are controlled by the control system 4.

[0046] The high-voltage plug 22 is pluggable to the high-voltage inlet at the bottom of the high-voltage insulator 15 for easy installation and disassembly. When the X-ray tube 1 is running, the high-voltage plug 22 remains reliably plugged into the corresponding component; when the X-ray tube 1 is shut down for maintenance, the high-voltage plug 22 can be unplugged to clean and maintain the connection surface between the high-voltage plug 22 and the high-voltage inlet to ensure the reliability and good contact of the high-voltage connection.

[0047] like Figure 1 As shown, a through hole 111 is provided on the grounding cavity 11, and a light-transmitting window 112 is sealed at the through hole 111. The optical detection device 3 is located outside the light-transmitting window 112 and is used to detect the light signal generated by the arcing discharge inside the X-ray tube 1 through the light-transmitting window 112.

[0048] Generally, the through hole 111 is formed on the side wall of the grounding cavity 11. Specifically, the height of the through hole 111 is approximately the same as the height of the filament 12 and the grid assembly 13, so that the field of view of the light-transmitting window 112 can cover the filament 12 and the grid assembly 13. Generally, the diameter of the through hole 111 is between 5 mm and 20 mm.

[0049] Specifically, the light-transmitting window 112 is sealed at the through hole 111. Generally, the material of the light-transmitting window 112 is quartz glass or sapphire glass. It is sealed to the grounding cavity 11 through a metal sealing gasket or an oxygen-free copper gasket to ensure that the vacuum environment inside the grounding cavity 11 is not destroyed.

[0050] The optical detection device 3 is located outside the light-transmitting window 112, specifically, it is fixedly connected to the outer wall of the grounding cavity 11 of the ray tube 1 via a sensor bracket 33. One end of the sensor bracket 33 is fixedly connected to the outer wall of the grounding cavity 11, and the other end is fixedly connected to the optical detection device 3. The optical detection device 3 includes a solar-blind ultraviolet sensor 31, located outside the light-transmitting window 112, for detecting solar-blind ultraviolet light signals generated by arc discharge.

[0051] Specifically, such as Figure 1As shown, the X-ray generating device also includes a sensor driving circuit 5. The input terminal of the sensor driving circuit 5 is electrically connected to the solar-blind ultraviolet sensor 31, and the output terminal of the sensor driving circuit 5 is electrically connected to the control system 4. Specifically, the sensor driving circuit 5 and the solar-blind ultraviolet sensor 31 are electrically connected via a shielded signal line, and the sensor driving circuit 5 and the control system 4 are electrically connected via a shielded cable; the raw electrical signal output by the solar-blind ultraviolet sensor 31 is transmitted to the sensor driving circuit 5 through the shielded signal line. When an arcing discharge occurs inside the X-ray tube 1, the arcing discharge generates a solar-blind ultraviolet light signal. The solar-blind ultraviolet sensor 31 receives the signal through the light-transmitting window 112 and converts the received light signal into an electrical signal. The sensor driving circuit 5 processes the light signal output by the solar-blind ultraviolet sensor 31, including amplifying and filtering the electrical signal, and then transmits it to the control system 4.

[0052] Specifically, the control system 4 is connected to both the optical detection device 3 and the high-voltage generating system 2. The control system 4 receives signals from the optical detection device 3 and determines the intensity of the arcing discharge based on the frequency and / or intensity of the received electrical signals. It then adjusts the output voltage and / or current of the high-voltage generating system 2 according to the arcing discharge frequency and intensity levels. Specifically, when the arcing discharge intensity is low, the control system 4 can slightly reduce the output voltage; when the arcing discharge intensity exceeds a preset threshold, the control system 4 controls the high-voltage generating system 2 to reduce the output voltage and / or current to a preset safe value, and resumes output after the arcing discharge stops. This achieves real-time detection and automatic suppression of arcing discharge inside the X-ray tube, ensuring stable X-ray output and protecting the X-ray tube 1.

[0053] The optical detection device 3 also includes a solar-blind ultraviolet imager 32, located outside the light-transmitting window 112. The solar-blind ultraviolet imager 32 is used to image and locate the arcing position inside the ray tube 1. Optionally, the solar-blind ultraviolet imager 32 employs solar-blind ultraviolet and visible light dual-spectrum imaging technology, superimposing and fusing the ultraviolet image with the visible light image to accurately locate the arcing discharge location. When the solar-blind ultraviolet sensor 31 detects an arcing discharge signal, the solar-blind ultraviolet imager 32 simultaneously images the arcing discharge location and transmits the acquired arcing discharge image to the host computer 6 for display and storage.

[0054] Optionally, the X-ray generating device also includes a host computer 6, which is signal-connected to the solar-blind ultraviolet imager 32 and the control system 4. The host computer 6 communicates with the control system 4 via a shielded wire, receiving and displaying the arcing discharge images acquired by the solar-blind ultraviolet imager 32; and sending control parameters to the control system 4, including the arcing intensity threshold, voltage and current setpoints, etc. Operators can monitor the internal operating status of the X-ray tube 1 in real time through the host computer 6 and manually adjust the control parameters when necessary. Maintenance personnel can directly locate the fault point based on the arcing discharge images acquired and saved by the solar-blind ultraviolet imager 32 without extensive disassembly of the X-ray tube 1, significantly shortening troubleshooting time and maintenance cycles, and reducing operation and maintenance costs.

[0055] The X-ray generating device in this embodiment, by setting up an optical detection device 3 and a control system 4, realizes real-time detection, positioning and automatic suppression of internal arcing discharge of the 300kV high-voltage X-ray tube, avoiding the problem of unstable output and reduced CT imaging quality caused by arcing discharge of the X-ray source under high voltage; by polishing and high-gloss treatment of the inner surface of the grounding cavity 11 and the outer surface of the gate assembly 13 to remove microburrs, the internal electric field distribution is made uniform, avoiding electric field distortion, and reducing the probability of arcing discharge from the physical structure level.

[0056] The above embodiments are merely illustrative of the principles and effects of the present invention and are not intended to limit the invention. Any person skilled in the art can modify or alter the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or alterations made by those skilled in the art without departing from the spirit and technical concept disclosed in the present invention should still be covered by the claims of the present invention.

Claims

1. An X-ray generating device, characterized in that, include: X-ray tube (1) includes: a grounded cavity (11); a filament (12) located inside the grounded cavity for emitting electrons to form an electron beam; a gate assembly (13) located inside the grounded cavity (11) for controlling the electron beam; and an anode target (14) located on the emission side of the electron beam for receiving electron impacts and generating X-rays. A high-voltage generating system (2) is connected to the ray tube (1) and is used to provide a high-voltage electric field; An optical detection device (3) is provided with a light-transmitting window (112) sealed on the grounding cavity (11) of the ray tube (1). The optical detection device (3) is located outside the light-transmitting window (112) and is used to detect the light signal inside the ray tube (1). The control system (4) is connected to the optical detection device (3) and the high voltage generating system (2) by signal connection; the control system (4) automatically adjusts the output voltage and / or current of the high voltage generating system (2) according to the optical signal.

2. The X-ray generating apparatus according to claim 1, characterized in that, The optical detection device (3) includes a solar-blind ultraviolet sensor (31) for detecting solar-blind ultraviolet light signals generated by arcing discharge.

3. The X-ray generating apparatus according to claim 2, characterized in that, Also includes: The sensor driving circuit (5) is communicatively connected to the solar-blind ultraviolet sensor (31) and the control system (4). The sensor driving circuit (5) processes the light signal output by the solar-blind ultraviolet sensor (31) and transmits it to the control system (4).

4. The X-ray generating apparatus according to claim 1, characterized in that, The optical detection device (3) includes a solar-blind ultraviolet imager (32) for imaging and locating the firing position inside the ray tube (1).

5. The X-ray generating apparatus according to claim 4, characterized in that, It also includes a host computer (6), which is connected to the solar-blind ultraviolet imager (32) and the control system (4); the host computer (6) is used to receive and display the arcing and discharge images collected by the solar-blind ultraviolet imager (32), and to send control parameters to the control system (4).

6. The X-ray generating apparatus according to claim 1, characterized in that, The gate assembly (13) includes a protrusion (131) and a gate cap (132). The filament (12) is disposed on the protrusion (131), and the gate cap (132) is upside down on the protrusion. An opening is provided on the bottom surface of the gate cap (132) so that the electron beam passes through the opening.

7. The X-ray generating apparatus according to claim 1, characterized in that, The ray tube also includes: A high-voltage insulator (15) is located inside the grounding cavity (11) to support the gate assembly (13) and to electrically insulate the gate assembly (13) from the grounding cavity (11). An anode plate (16) is located at the top of the grounding cavity (11), and a through hole (161) is provided in the center of the anode plate (16) to allow the electron beam to pass through; An electrode shoe assembly (17) is located between the anode plate (16) and the anode target (14), with the center hole of the electrode shoe assembly (17) aligned with the through hole (161); A focusing coil (18) is arranged around the pole shoe assembly (17) for focusing the electron beam.

8. The X-ray generating apparatus according to claim 1, characterized in that, The anode target (14) includes a target substrate (141) and a coating layer (142), wherein the coating layer (142) is disposed on the side surface of the target substrate (141) facing the electron beam incident.

9. The X-ray generating apparatus according to claim 8, characterized in that, The target substrate (141) is made of single-crystal diamond sheet; the coating layer (142) is made of tungsten.

10. The X-ray generating apparatus according to claim 1, characterized in that, The inner surface of the grounding cavity (11) and the outer surface of the gate assembly (13) are subjected to a surface treatment process, which includes polishing and high-gloss treatment, so that the surface roughness Ra of the inner surface of the grounding cavity (11) and the outer surface of the gate assembly (13) is ≤0.8μm.

Images