Circuit board and server

Abstract

The application discloses a circuit board and a server, relates to the technical field of electronic equipment, and provides a liquid cooling component, the liquid cooling component comprises a first liquid cooling component and a second liquid cooling component, the first liquid cooling component comprises a metal surface, the second liquid cooling component is in contact with the metal surface, and the second liquid cooling component is connected with a heating device; therefore, heat generated by the heating device can be transmitted to the metal surface through the second liquid cooling component, the liquid cooling medium can quickly take away the heat transmitted to the metal surface when flowing through a liquid cooling flow channel in the first liquid cooling component, the temperature of the heating device is reduced, and the operation stability of the heating device is improved.

Description

Technical Field

[0001] This invention relates to the field of electronic equipment technology, and more particularly to circuit boards and servers. Background Technology

[0002] Cooling the motherboard of a conventional server is a key factor in ensuring the stable operation of the server, especially in high-load and high-power-density scenarios. It is necessary to keep the temperature of key components in the server within a safe range (such as CPU temperature below 85°C).

[0003] Common server cooling methods include air cooling, heat pipe cooling, passive cooling, and liquid cooling. Air cooling uses fans to force convection and remove heat, typically employing aluminum or copper heatsink fins. Heat is conducted to the fins via heat pipes and then blown away by the fan. Heat pipe cooling utilizes the principle of phase change to rapidly transfer heat, embedding heat pipes at the bottom of the heatsink and connecting the CPU / GPU to the heatsink. Passive cooling is used in low-power or edge computing scenarios, increasing the heat dissipation area and utilizing natural convection and radiation. Liquid cooling works by using the high thermal conductivity and heat capacity of a liquid medium to quickly absorb and transfer heat generated inside the server to external cooling devices.

[0004] The above-mentioned heat dissipation methods are not very effective at dissipating heat from heat-generating components. Summary of the Invention

[0005] This application provides a circuit board and a server to at least solve the problem of poor heat dissipation for heat-generating devices in related technologies.

[0006] This application provides a circuit board, including:

[0007] substrate;

[0008] The heating element is disposed on the surface of the substrate.

[0009] A liquid cooling component is disposed on a substrate. The liquid cooling component includes a first liquid cooling component and a second liquid cooling component. The first liquid cooling component has a built-in liquid cooling channel and includes a first surface. The second liquid cooling component is in contact with the first surface and is connected to a heat-generating device.

[0010] In one alternative embodiment, the first surface is a ground plane, the heating device is provided with a ground connection part, and the second liquid cooling component is a conductor with one end connected to the ground connection part.

[0011] In one alternative embodiment, the first liquid cooling component is a metal component, and the surface of the metal component near the heat-generating device forms a first surface.

[0012] In one alternative embodiment, a groove is provided on the side of the substrate away from the heating device, and the first liquid cooling component is embedded in the groove.

[0013] In one alternative embodiment, the cross-sectional shape of the first liquid cooling component includes one of a stepped shape, a triangle, and a rectangle.

[0014] In one alternative implementation, a resistor or capacitor is connected to the first surface.

[0015] In one optional embodiment, the substrate includes a first sub-substrate located on the side of the first liquid cooling component closer to the heat-generating device, a second sub-substrate located on the side of the first liquid cooling component farther from the heat-generating device, and a third sub-substrate and a fourth sub-substrate located on both sides of the first liquid cooling component. The thickness of the third sub-substrate and the fourth sub-substrate is equal to the thickness of the liquid cooling component, and the first liquid cooling component is simultaneously connected to the first sub-substrate, the second sub-substrate, the third sub-substrate, and the fourth sub-substrate.

[0016] In one alternative embodiment, the first liquid cooling component is disposed on the side of the substrate away from the heat-generating device, and the second liquid cooling component penetrates the substrate and is connected to the first liquid cooling component.

[0017] In one alternative embodiment, the first liquid cooling component has a through hole through which the components or chip modules to be mounted on the substrate are connected to the substrate.

[0018] In one alternative embodiment, the first liquid cooling component is connected to the surface of the substrate away from the heat-generating device; or the second liquid cooling component is connected to the first liquid cooling component.

[0019] In one optional embodiment, the first liquid cooling component includes a plurality of parallel metal liquid cooling conduits, an inlet pipe connected to the inlet end of the plurality of metal liquid cooling conduits, and an outlet pipe connected to the outlet end of the plurality of metal liquid cooling conduits.

[0020] In one alternative embodiment, the first liquid cooling component further includes a first metal sheet that contacts the side of the plurality of metal liquid cooling conduits near the heat-generating device, the surface of the first metal sheet near the heat-generating device forming a first surface.

[0021] In one alternative embodiment, a metal liquid cooling conduit penetrates the substrate along a first direction, and a second liquid cooling component passes through the substrate along a second direction, the second direction having an angle with the first direction, and the orthographic projections of the metal liquid cooling conduit and the second liquid cooling component do not overlap.

[0022] In one optional embodiment, the substrate includes a fifth sub-substrate disposed on the side of the first liquid cooling component closer to the heat-generating device and a sixth sub-substrate disposed on the side of the first liquid cooling component away from the heat-generating device. Plastic structures are provided on both sides of the metal liquid cooling conduit, and the first liquid cooling component is connected to both the fifth and sixth sub-substrates.

[0023] In one optional embodiment, the outer diameter of the metal liquid cooling conduit is 1.0-1.5 mm, and the inner diameter of the metal liquid cooling conduit is 0.5-0.7 mm.

[0024] And / or, the distance between the wall of the metal liquid cooling conduit and the second liquid cooling component is 0.4-0.6 mm;

[0025] And / or, the spacing between two second liquid cooling components located between two adjacent metal liquid cooling conduits is 0.5-1.5 mm;

[0026] And / or, the spacing between two adjacent metal liquid cooling conduits is 2-4 mm.

[0027] In one alternative embodiment, the first liquid cooling component includes a ceramic core plate and a metal plate, wherein the ceramic core plate is provided with liquid cooling channels and the metal plate covers the ceramic core plate.

[0028] In one alternative embodiment, a second metal sheet is covered on the metal plate, the surface of the second metal sheet near the heating device forms a first surface, and the second metal sheet has a clearance hole corresponding to the signal via.

[0029] In one alternative implementation, the second liquid cooling component and the signal via penetrate the ceramic core plate and are misaligned with the liquid cooling channel.

[0030] In one optional embodiment, the substrate includes a seventh sub-substrate disposed on the side of the first liquid cooling component closer to the heat-generating device and an eighth sub-substrate disposed on the side of the first liquid cooling component away from the heat-generating device, and the first liquid cooling component is simultaneously connected to the seventh sub-substrate and the eighth sub-substrate.

[0031] In one alternative embodiment, the second liquid cooling component has multiple contact points with the first surface, and the multiple contact points are arranged in a mesh pattern.

[0032] In one alternative embodiment, the substrate includes multiple signal layers, and the substrate is provided with signal vias. The first end of the signal via is connected to a heating device, and the second end is connected to the signal layer.

[0033] This application also provides a server, including a circuit board and a liquid cooling system, the liquid cooling system being connected to a liquid cooling channel.

[0034] This application incorporates a liquid cooling component, comprising a first liquid cooling component and a second liquid cooling component. The first liquid cooling component includes a first surface, and the second liquid cooling component is in contact with the first surface and connected to a heat-generating device. Therefore, the heat generated by the heat-generating device can be transferred to the first surface through the second liquid cooling component. When the liquid cooling medium flows through the liquid cooling channels inside the first liquid cooling component, it can quickly remove the heat transferred to the first surface, reducing the temperature of the heat-generating device and thus improving its operational stability. Furthermore, the liquid cooling component is mounted on the substrate, increasing the integration of the circuit board and facilitating the miniaturization of servers. Attached Figure Description

[0035] To more clearly illustrate the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0036] Figure 1 A front cross-sectional view of a circuit board provided for an optional embodiment of this application. Figure 1 ;

[0037] Figure 2 A front cross-sectional view of a circuit board provided for an optional embodiment of this application. Figure 2 ;

[0038] Figure 3 for Figure 1 The image shows a bottom view of a circuit board.

[0039] Figure 4 A front sectional view of a circuit board provided for an optional embodiment of this application;

[0040] Figure 5 A side view of a circuit board provided for one alternative embodiment of this application;

[0041] Figure 6 for Figure 4 Top sectional view of the first liquid cooling component;

[0042] Figure 7 A front sectional view of a circuit board provided for an optional embodiment of this application;

[0043] Figure 8 for Figure 7 Top sectional view of the first liquid cooling component;

[0044] Figure 9 A schematic diagram of a circuit board provided for one optional embodiment of this application;

[0045] Figure 10 for Figure 9 The diagram shows a front sectional view of the circuit board.

[0046] Figure 11 for Figure 9 The diagram shows a front sectional view of the circuit board.

[0047] Figure 12 for Figure 9 Top view of the first liquid cooling component;

[0048] Figure 13 A front sectional view of a circuit board provided for an optional embodiment of this application;

[0049] Figure 14 A side view of a circuit board provided for one alternative embodiment of this application;

[0050] Figure 15 for Figure 14 Top view of the ceramic core plate.

[0051] The above figures include the following reference numerals:

[0052] 1. Substrate; 101. Ninth Substrate; 102. Tenth Substrate; 103. First Substrate; 104. Second Substrate; 105. Third Substrate; 106. Fourth Substrate; 107. Fifth Substrate; 108. Sixth Substrate; 109. Seventh Substrate; 110. Eighth Substrate; 2. Heating Device; 3. First Liquid Cooling Component; 300. First Surface; 301. Liquid Cooling Channel; 302. Liquid Inlet; 303. Liquid Outlet; 304. Metal Liquid Cooling Conduit; 305. Liquid Inlet Pipe; 306. Liquid Outlet Pipe; 307. Plastic Structure; 308. Ceramic Core Board; 309. Metal Plate; 310. Through Hole; 311. First Metal Sheet; 312. Second Metal Sheet; 3121. Clearance Hole; 4. Second Liquid Cooling Component; 5. Signal Via. Detailed Implementation

[0053] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of this application.

[0054] It should be noted that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential," etc., indicating orientation or positional relationships, are based on the orientation or positional relationships shown in the accompanying drawings and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. The terms "installed," "connected," and "linked" should be interpreted broadly, for example, they can be fixed connections, detachable connections, or integral connections; they can be mechanical connections or electrical connections; they can be direct connections or indirect connections through an intermediate medium; they can be internal connections between two elements. The terms "parallel," "perpendicular," and "equal" include the described situation and situations similar to the described situation, the range of which is within an acceptable deviation range, wherein the acceptable deviation range is determined by those skilled in the art taking into account the measurement under discussion and the error associated with the measurement of a particular quantity (i.e., the limitations of the measurement system). For example, "parallel" includes absolute parallelism and approximate parallelism, where an acceptable deviation range for approximate parallelism can be, for example, within 5°; "perpendicular" includes absolute perpendicularity and approximate perpendicularity, where an acceptable deviation range for approximate perpendicularity can also be, for example, within 5°. "Equal" includes absolute equality and approximate equality, where an acceptable deviation range for approximate equality can be, for example, a difference between the two equal items being less than or equal to 5% of either one. Those skilled in the art will understand the specific meaning of the above terms in this application based on the specific circumstances.

[0055] Cooling the motherboard of a conventional server is a key factor in ensuring the stable operation of the server, especially in high-load and high-power-density scenarios. It is necessary to keep the temperature of key components in the server within a safe range (such as CPU temperature below 85°C).

[0056] Common server cooling methods include air cooling, heat pipe cooling, passive cooling, and liquid cooling. Air cooling uses fans to force convection and remove heat, typically employing aluminum or copper heatsink fins. Heat is conducted to the fins via heat pipes and then blown away by the fan. Heat pipe cooling utilizes the principle of phase change to rapidly transfer heat, embedding heat pipes at the bottom of the heatsink and connecting the CPU / GPU to the heatsink. Passive cooling is used in low-power or edge computing scenarios, increasing the heat dissipation area and utilizing natural convection and radiation. Liquid cooling works by using the high thermal conductivity and heat capacity of a liquid medium to quickly absorb and transfer heat generated inside the server to external cooling devices.

[0057] The above-mentioned heat dissipation methods are not very effective at dissipating heat from heat-generating components.

[0058] To enable those skilled in the art to better understand the present application, the present application will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0059] The embodiments of this application provide a circuit board, and the device is described in detail in conjunction with the structure and working principle of the circuit board.

[0060] This embodiment provides a circuit board, including a substrate 1, a heating element 2, and a liquid cooling component.

[0061] The heating element 2 is disposed on the surface of the substrate 1; the liquid cooling component is disposed on the substrate 1, and the liquid cooling component includes a first liquid cooling component 3 and a second liquid cooling component. The first liquid cooling component 3 has a built-in liquid cooling channel 301 and includes a first surface 300. The second liquid cooling component 4 is in contact with the first surface 300 and is connected to the heating element 2.

[0062] In this embodiment, a liquid cooling component is provided, comprising a first liquid cooling component 3 and a second liquid cooling component 4. The first liquid cooling component 3 includes a first surface 300, and the second liquid cooling component 4 is in contact with the first surface 300 and connected to the heat-generating device 2. Therefore, the heat generated by the heat-generating device 2 can be transferred to the first surface 300 through the second liquid cooling component 4. When the liquid cooling medium flows through the liquid cooling channel 301 inside the first liquid cooling component 3, it can quickly remove the heat transferred to the first surface 300, reducing the temperature of the heat-generating device 2 and thus improving the operational stability of the heat-generating device 2. In addition, the liquid cooling component is disposed on the substrate 1, which improves the integration of the circuit board and is beneficial to the miniaturization of the server.

[0063] Specifically, the second liquid cooling component 4 has multiple contact points with the first surface 300, which can increase the contact area between the second liquid cooling component 4 and the first surface 300, thereby further improving the heat dissipation efficiency of the heat-generating device 2.

[0064] Specifically, the second liquid cooling component 4 intersects the first surface 300 perpendicularly, and the intersection point is the contact point between the second liquid cooling component 4 and the first surface.

[0065] The first liquid cooling component 3 can be disposed on the surface of the substrate 1 or disposed inside the substrate 1. The first liquid cooling component 3 can be integrated with the substrate 1 by means of embedding, pressing, welding or other methods.

[0066] Specifically, the heat-generating component is a high-power chip such as a CPU or GPU. The heat generated by the high-power chip can be transferred to the first surface 300 through the second liquid cooling component 4. When the liquid cooling medium flows through the liquid cooling channel 301 inside the first liquid cooling component 3, it can quickly remove the heat transferred to the first surface 300, reduce the temperature of the heat-generating device 2, and thus improve the operational stability of the high-power chip.

[0067] In this embodiment, the second liquid cooling component 4 has multiple contact points with the first surface 300, and the multiple contact points are arranged in a mesh pattern.

[0068] In this embodiment, since the second liquid cooling component 4 and the first surface 300 have multiple contact points arranged in a mesh pattern, the contact area between the second liquid cooling component 4 and the first surface 300 can be further increased, thereby further improving the heat dissipation efficiency of the heat-generating device 2.

[0069] In this embodiment, the first surface 300 is a ground plane, the heating device 2 is provided with a ground connection part, and the second liquid cooling component 4 is a conductor with one end connected to the ground connection part.

[0070] In this embodiment, the first surface 300 is a ground plane, and the second liquid cooling component 4 is a conductor. One end of the second liquid cooling component 4 is connected to the ground connection part of the heating device 2, and the other end is in contact with the ground plane. Therefore, the second liquid cooling component 4 can serve to ground the heating device 2. Thus, the heat of the heating device 2 is transferred to the grounding surface by using the second liquid cooling component 4. The second liquid cooling component 4 can both ground the heating device 2 and transfer heat.

[0071] Related technologies disclose a circuit board, a circuit board assembly, and an electronic device. The circuit board assembly includes a heat-generating device and a circuit board, with the heat-generating device disposed on the surface of the circuit board. The circuit board includes a substrate and a circuit layer disposed on the substrate, the circuit layer being electrically connected to the heat-generating device. The substrate includes an insulating substrate and a metal substrate, which are fixedly disposed. A coolant channel is provided within the metal substrate for transmitting coolant, and the metal substrate is thermally connected to the heat-generating device for heat dissipation. In this related technology, the heat-generating device and the metal substrate are thermally connected through metal holes, requiring additional metal holes to be formed in the substrate. Compared to this related technology, in this embodiment, the second liquid-cooling component 4 can ground the heat-generating device 2. Therefore, the second liquid-cooling component 4 is used to transfer the heat from the heat-generating device 2 to the grounding surface. The second liquid-cooling component 4 can both ground the heat-generating device 2 and transfer heat.

[0072] It should be noted that the first surface 300 is grounded by applying a GND network to the first surface.

[0073] In this embodiment, the substrate 1 includes multiple signal layers. The substrate 1 is provided with signal vias 5. The first end of the signal via 5 is connected to the heating device 2, and the second end is connected to the signal layer, so that fan-out wiring can be completed in the signal layer.

[0074] It should be noted that the second end of different signal vias 5 can be connected to different signal layers. In this embodiment, the specific location of the signal layer to which the signal via 5 is connected is not limited. Those skilled in the art can design it according to actual needs.

[0075] It should be noted that the signal layer can be on the same plane as the first surface 300 or on a different plane. When the signal layer is on the same plane as the first surface 300, care should be taken to disconnect the adjacent parts of the signal layer and the first surface to avoid short circuits.

[0076] Specifically, the second liquid cooling component 4 has multiple contact points arranged in a mesh pattern with the ground surface. The heat generated by the heating device 2 can be transferred to the ground surface through the second liquid cooling component 4. When the liquid cooling medium flows through the liquid cooling channel 301 inside the first liquid cooling component 3, it can quickly carry away the heat transferred to the ground surface, reduce the temperature of the heating device 2, and thus improve the operational stability of the heating device 2.

[0077] The second liquid cooling component 4 can be a metal via, specifically a copper via. Copper vias have good thermal conductivity and can transfer the heat generated by the heating device 2 to the grounding surface.

[0078] Preferably, solid copper can be placed inside the copper via to further improve heat conduction efficiency and heat dissipation efficiency for the heat-generating device 2.

[0079] In this embodiment, the first liquid cooling component 3 is a metal component, and the side surface of the metal component near the heating device 2 forms the first surface 300.

[0080] In this embodiment, since the first liquid cooling component 3 is a metal component, the surface of the metal component near the heating device 2 forms the first surface 300. The metal component can conduct heat, so the heat generated by the heating device 2 is transferred to the first surface 300 through the second liquid cooling component 4, and then transferred to the interior of the metal component through the metal component. When the liquid cooling medium flows through the liquid cooling channel 301 inside the first liquid cooling component 3, it can quickly carry away the heat transferred to the interior of the metal component, reduce the temperature of the heating device 2, and thus improve the operational stability of the heating device 2.

[0081] Specifically, in this embodiment, the metal component can be made of copper, iron, aluminum, etc., with copper being the preferred material.

[0082] In this embodiment, the liquid cooling channel 301 is curved.

[0083] In this embodiment, the curved design of the liquid cooling channel 301 increases the length and heat dissipation area of ​​the liquid cooling channel 301, further improving heat dissipation efficiency and enabling a rapid reduction in the temperature of the heat-generating device 2, thereby enhancing the operational stability of the heat-generating device 2.

[0084] In one alternative embodiment, such as Figures 1 to 3 A circuit board is provided, including a substrate 1, a heating element 2, and a liquid cooling component. The heating element 2 is disposed on the surface of the substrate 1; the liquid cooling component is disposed on the substrate 1 and includes a first liquid cooling component 3 and a second liquid cooling component 4. The first liquid cooling component 3 has a built-in liquid cooling channel 301 and includes a first surface 300. The second liquid cooling component 4 is in contact with the first surface 300 and is connected to the heating element 2. The first liquid cooling component 3 is partially embedded in the substrate 1.

[0085] In this embodiment, the second liquid cooling component 4 has multiple contact points with the first surface 300, and the multiple contact points are arranged in a mesh pattern.

[0086] In this embodiment, the first surface 300 is a ground plane, the heating device 2 is provided with a ground connection part, and the second liquid cooling component 4 is a conductor with one end connected to the ground connection part. The second liquid cooling component 4 is used to transfer the heat of the heating device 2 to the ground plane. The second liquid cooling component 4 can both ground the heating device 2 and transfer heat.

[0087] The second liquid cooling component 4 can be a metal via, specifically a copper via. Copper vias have good thermal conductivity and can transfer the heat generated by the heating device 2 to the grounding surface.

[0088] In this embodiment, the substrate 1 includes multiple signal layers. The substrate 1 is provided with signal vias 5. The first end of the signal via 5 is connected to the heating device 2, and the second end is connected to the signal layer, so that fan-out wiring can be completed in the signal layer.

[0089] In this embodiment, the first liquid cooling component 3 is a metal component, and the side surface of the metal component near the heating device 2 forms the first surface 300.

[0090] In this embodiment, the substrate 1 is provided with a groove, and the first liquid cooling component 3 is embedded in the groove.

[0091] In this embodiment, during processing, the entire substrate 1 is first fabricated by pressing together according to the overall thickness and stacking of the substrate 1. Then, a milling cutter is used to mill a groove of the corresponding size according to the size of the first liquid cooling component 3 to be embedded. After that, the first liquid cooling component 3 is embedded in the groove.

[0092] like Figure 1As shown, the substrate 1 includes a ninth sub-substrate 101 located on the side of the first liquid cooling component 3 near the heating device 2, and two tenth sub-substrates 102 located on both sides of the first liquid cooling component 3 and having the same thickness as the first liquid cooling component 3. The ninth sub-substrate 101 and the two tenth sub-substrates 102 form a groove, and the first liquid cooling component 3 is embedded in the groove.

[0093] Specifically, the first liquid cooling component 3 can be connected to the sidewall of the groove by an adhesive, thereby connecting the first liquid cooling component 3 and the substrate 1 as one unit, making the overall structure more stable and preventing the first liquid cooling component 3 from becoming loose and causing poor contact.

[0094] Specifically, during processing, the ninth sub-substrate 101 located on the side of the first liquid cooling component 3 near the heating device 2 is first processed, and then two tenth sub-substrates 102 with the same thickness as the first liquid cooling component 3 are processed. Finally, a lamination process is used to press the ninth sub-substrate 101, the two tenth sub-substrates 102 and the first liquid cooling component 3 together to complete the partial embedding of the first liquid cooling component 3 into the substrate 1.

[0095] In this embodiment, the first liquid cooling component 3 is embedded in the substrate 1. The surface of the first liquid cooling substrate 1 closest to the heat-generating device 2 forms a first surface 300. The second liquid cooling component 4 is in contact with the first surface 300 and has multiple contact points. The second liquid cooling component 4 is connected to the heat-generating device 2. Therefore, the heat generated by the heat-generating device 2 can be transferred to the first surface 300 through the second liquid cooling component 4. When the liquid cooling medium flows through the liquid cooling channel 301 inside the first liquid cooling component 3, it can quickly remove the heat transferred to the first surface 300, reducing the temperature of the heat-generating device 2 and thus improving the operational stability of the heat-generating device 2. Furthermore, since the second liquid cooling component 4 is in contact with the first surface 300 and has multiple contact points, the contact area between the second liquid cooling component 4 and the first surface 300 can be increased, thereby further improving the heat dissipation efficiency of the heat-generating device 2.

[0096] It should be noted that both the ninth sub-substrate 101 and the tenth sub-substrate 102 include several signal layers and dielectric layers. During lamination, high temperature and high pressure melt the resin in the dielectric, thereby connecting the two adjacent layers into one.

[0097] It should be noted that, firstly, several layers of ninth sub-substrate 101 are processed on the side of the first liquid cooling component 3 near the heat-generating device 2. Then, two tenth sub-substrates 102 with the same thickness as the first liquid cooling component 3 are processed. Finally, a lamination process is used to press the ninth sub-substrate 101, the two tenth sub-substrates 102, and the first liquid cooling component 3 together to complete the partial embedding of the first liquid cooling component 3 into the substrate 1. Compared with the method of first pressing the entire substrate 1 according to its overall thickness and stacking to complete the fabrication of the entire substrate 1 in one go, and then using a milling cutter to mill a groove of the corresponding size according to the size of the first liquid cooling component 3 to be embedded, and then embedding the first liquid cooling component 3 into the groove, the processed circuit board is more robust and reliable. The first liquid cooling component 3 has a better connection with the grounding component and faster heat conduction. At the same time, the secondary lamination and the local PP glue flow can better fix the first liquid cooling component 3. The method of milling a groove of the corresponding size according to the size of the first liquid cooling component 3 to be embedded requires a precise milling process, but this solution is low in cost.

[0098] Specifically, in this embodiment, the metal component is a metal block.

[0099] The metal component can specifically be a copper block.

[0100] Specifically in this embodiment, such as Figure 1 As shown, the liquid cooling channel 301 inside the metal component has a bent design. The liquid cooling channel 301 has a liquid inlet 302 and a liquid outlet 303, which are located on the same side of the metal component and on the side away from the heat-generating device 2. The fact that the liquid inlet 302 and the liquid outlet 303 are located on the same side of the metal component facilitates connection to the liquid cooling system.

[0101] Further reference Figure 1 The liquid cooling channel 301 includes multiple vertical and horizontal channels, which are connected in sequence to make the entire liquid cooling channel 301 have a bent design.

[0102] This embodiment does not limit the specific bending shape of the liquid cooling channel 301; any shape can satisfy the heat dissipation of the heat-generating device 2. However, it is necessary to ensure that the projected length and width of the liquid cooling channel 301 on the horizontal plane are as close as possible to the length and width of the heat-generating device 2, so as to dissipate heat from all directions, achieve rapid temperature reduction of the heat-generating device 2, and thus improve the operational stability of the heat-generating device 2.

[0103] Specifically in this embodiment, the liquid cooling channel 301 includes multiple vertical and horizontal channels, and the cross-sectional shape of the vertical and horizontal channels can be square or circular.

[0104] In this embodiment, the cross-sectional shape of the first liquid cooling component 3 includes one of a stepped shape, a triangle, and a rectangle.

[0105] In this embodiment, when designing the circuit board, apart from the grounding component, the signal vias 5 of the heat-generating device 2 need to be fan-out routed on the signal layer of the substrate 1 on the side of the first liquid cooling component 3 near the heat-generating device 2. Under the condition of meeting the heat dissipation requirements, the cross-section of the first liquid cooling component 3 is designed as a stepped shape, a triangle, or a rectangle. The shape of the first liquid cooling component 3 can be designed according to the layout position of the signal vias 5, and the position of the signal vias 5 can be avoided as much as possible. This can facilitate the completion of fan-out routed on the signal layer of the substrate 1 on the side of the first liquid cooling component 3 near the heat-generating device 2, reduce the size of the substrate 1, and reduce the number of stacked traces.

[0106] Specifically, such as Figure 2 As shown, Figure 2 The diagram illustrates that the first liquid cooling component 3 has a stepped cross-sectional shape, which facilitates fan-out wiring of the signal layer on the substrate 1 near the heat-generating device 2. It is understood that the first liquid cooling component 3 can be modified into any other shape according to wiring requirements.

[0107] It should be noted that the cross-section of the first liquid cooling component 3 can specifically refer to a cross-section parallel to the surface of the substrate 1, or a cross-section perpendicular to the surface of the substrate 1.

[0108] In this embodiment, a resistor or capacitor is connected to the first surface 300.

[0109] In this embodiment, since the first liquid cooling component 3 is a metal component, it is prone to static electricity. By connecting a resistor or capacitor to the first surface 300, static electricity can be eliminated, making it safer.

[0110] Specifically in this embodiment, the first surface 300 is connected to a 0-ohm resistor or capacitor.

[0111] In one alternative embodiment, such as Figures 4 to 6 A circuit board is provided, including a substrate 1, a heating element 2, and a liquid cooling component. The heating element 2 is disposed on the surface of the substrate 1; the liquid cooling component is disposed on the substrate 1 and includes a first liquid cooling component 3 and a second liquid cooling component 4. The first liquid cooling component 3 has a built-in liquid cooling channel 301 and includes a first surface 300. The second liquid cooling component 4 is in contact with the first surface 300 and is connected to the heating element 2. The first liquid cooling component 3 is embedded inside the substrate 1.

[0112] In this embodiment, the second liquid cooling component 4 is in contact with the first surface 300 and has multiple contact points, which are arranged in a mesh pattern.

[0113] In this embodiment, the first surface 300 is a ground plane, the heating device 2 is provided with a ground connection part and one end is connected to the ground connection part, and the second liquid cooling component 4 is a conductor. The second liquid cooling component 4 is used to transfer the heat of the heating device 2 to the ground plane. The second liquid cooling component 4 can both ground the heating device 2 and transfer heat.

[0114] The second liquid cooling component 4 can be a metal via, specifically a copper via. Copper vias have good thermal conductivity and can transfer the heat generated by the heating device 2 to the grounding surface.

[0115] In this embodiment, the substrate 1 includes multiple signal layers. The substrate 1 is provided with signal vias 5. The first end of the signal via 5 is connected to the heating device 2, and the second end is connected to the signal layer, so that fan-out wiring can be completed in the signal layer.

[0116] In this embodiment, the first liquid cooling component 3 is a metal component, and the side surface of the metal component near the heating device 2 forms the first surface 300.

[0117] In this embodiment, the substrate 1 includes a first sub-substrate 103 located on the side of the first liquid cooling component 3 near the heat-generating device 2, a second sub-substrate 104 located on the side of the first liquid cooling component 3 away from the heat-generating device 2, and a third sub-substrate 105 and a fourth sub-substrate 106 located on both sides of the first liquid cooling component 3. The thickness of the third sub-substrate 105 and the fourth sub-substrate 106 is equal to the thickness of the liquid cooling component. The first liquid cooling component 3 is simultaneously connected to the first sub-substrate 103, the second sub-substrate 104, the third sub-substrate 105, and the fourth sub-substrate 106.

[0118] Specifically, during processing, the first sub-substrate 103 located on the side of the first liquid cooling component 3 near the heat-generating device 2, the second sub-substrate 104 located on the side of the first liquid cooling component 3 away from the heat-generating device 2, and the third sub-substrate 105 and the fourth sub-substrate 106 located on both sides of the first liquid cooling component 3 are firstly processed separately. Then, a pressing process is used to align and press the four sub-substrates and the first liquid cooling component 3 directly in sequence, thereby integrating the first liquid cooling component 3 into the substrate 1. The overall structure is stable and the thickness of the entire circuit board can be reduced.

[0119] It should be noted that the first sub-substrate 103, the second sub-substrate 104, the third sub-substrate 105 and the fourth sub-substrate 106 in this embodiment all include several signal layers and dielectric layers. During the pressing process, the high temperature and high pressure melt the resin in the dielectric, thereby connecting the two adjacent layers into one.

[0120] In the circuit board provided in this embodiment, the first liquid cooling component 3 is integrally embedded in the substrate 1. The surface of the first liquid cooling component 3 near the heat-generating device 2 forms a first surface 300. The second liquid cooling component 4 is in contact with the first surface 300 and has multiple contact points. The second liquid cooling component 4 is connected to the heat-generating device 2, so the heat generated by the heat-generating device 2 can be transferred to the first surface 300 through the second liquid cooling component 4. When the liquid cooling medium flows through the liquid cooling channel 301 inside the first liquid cooling component 3, it can quickly remove the heat transferred to the first surface 300, reduce the temperature of the heat-generating device 2, and thus improve the operational stability of the heat-generating device 2. Furthermore, since the second liquid cooling component 4 is in contact with the first surface 300 and has multiple contact points, the contact area between the second liquid cooling component 4 and the first surface 300 can be increased, thereby further improving the heat dissipation efficiency of the heat-generating device 2.

[0121] Specifically in this embodiment, the first liquid cooling component 3 is located directly below the heating device 2, the width of the first liquid cooling component 3 is slightly wider than the width of the heating device 2, and the length of the first liquid cooling component 3 is the same as the length of the substrate 1.

[0122] In this embodiment, the thickness of the first liquid cooling component 3 is 1.5-2 mm, and the inner diameter of the liquid cooling channel 301 is 0.5-0.8 mm.

[0123] Specifically, the thickness of the first liquid cooling component 3 is 1.5 mm, and the inner diameter of the liquid cooling channel 301 is 0.5 mm.

[0124] Specifically, the thickness of the first liquid cooling component 3 is 2mm, and the inner diameter of the liquid cooling channel 301 is 0.5mm.

[0125] Specifically, the thickness of the first liquid cooling component 3 is 1.7 mm, and the inner diameter of the liquid cooling channel 301 is 0.5 mm.

[0126] Specifically, the thickness of the first liquid cooling component 3 is 1.5 mm, and the inner diameter of the liquid cooling channel 301 is 0.8 mm.

[0127] Specifically, the thickness of the first liquid cooling component 3 is 2mm, and the inner diameter of the liquid cooling channel 301 is 0.8mm.

[0128] Specifically, the thickness of the first liquid cooling component 3 is 1.7 mm, and the inner diameter of the liquid cooling channel 301 is 0.8 mm.

[0129] Specifically, the thickness of the first liquid cooling component 3 is 1.5 mm, and the inner diameter of the liquid cooling channel 301 is 0.75 mm.

[0130] Specifically, the thickness of the first liquid cooling component 3 is 2mm, and the inner diameter of the liquid cooling channel 301 is 0.75mm.

[0131] Specifically, the thickness of the first liquid cooling component 3 is 1.7 mm, and the inner diameter of the liquid cooling channel 301 is 0.75 mm.

[0132] In this embodiment, such as Figure 5 As shown in the figure, it is a top cross-sectional view of the first liquid cooling component 3. The liquid cooling channel 301 has a bent design. One end of the liquid cooling channel 301 is the liquid inlet 302 and the other end is the liquid outlet 303. The liquid cooling channel 301 has a large length and extends to the edge of the first liquid cooling component 3, which can dissipate heat from the heat-generating device 2 in all directions, realize the rapid reduction of the temperature of the heat-generating device 2, and thus improve the operational stability of the heat-generating device 2.

[0133] In this embodiment, the liquid cooling channel 301 should avoid right angles as much as possible to avoid restricting the flow of the liquid cooling medium. Preferably, the bending angle of the liquid cooling channel 301 at the bend is greater than or equal to 135°.

[0134] It should be noted that in this embodiment, only blind vias can be drilled in the area of ​​the substrate 1 directly above or below the first liquid cooling component 3, while other areas can be drilled and wired freely without affecting the circuit board design.

[0135] In this embodiment, all vias for grounding directly above or below the first liquid cooling component 3 are connected to the surface of the first liquid cooling component 3.

[0136] In one alternative embodiment, such as Figure 7 and Figure 8 A circuit board is provided, including a substrate 1, a heating element 2, and a liquid cooling component. The heating element 2 is disposed on the surface of the substrate 1; the liquid cooling component is disposed on the substrate 1 and includes a first liquid cooling component 3 and a second liquid cooling component 4. The first liquid cooling component 3 has a built-in liquid cooling channel 301 and includes a first surface 300. The second liquid cooling component 4 is in contact with the first surface 300 and is connected to the heating element 2. The first liquid cooling component 3 is located on the side of the substrate 1 away from the heating element 2.

[0137] In this embodiment, the second liquid cooling component 4 is in contact with the first surface 300 and has multiple contact points, which are arranged in a mesh pattern.

[0138] In this embodiment, the first surface 300 is a ground plane, the heating device 2 is provided with a ground connection part, and the second liquid cooling component 4 is a conductor with one end connected to the ground connection part. The second liquid cooling component 4 is used to transfer the heat of the heating device 2 to the ground plane. The second liquid cooling component 4 can both ground the heating device 2 and transfer heat.

[0139] The second liquid cooling component 4 can be a metal via, specifically a copper via. Copper vias have good thermal conductivity and can transfer the heat generated by the heating device 2 to the grounding surface.

[0140] In this embodiment, the substrate 1 includes multiple signal layers. The substrate 1 is provided with signal vias 5. The first end of the signal via 5 is connected to the heating device 2, and the second end is connected to the signal layer, so that fan-out wiring can be completed in the signal layer.

[0141] In this embodiment, the first liquid cooling component 3 is a metal component, and the side surface of the metal component near the heating device 2 forms the first surface 300.

[0142] In this embodiment, the first liquid cooling component 3 is disposed on the side of the substrate 1 away from the heat-generating device 2, and the second liquid cooling component 4 penetrates the substrate 1 and is connected to the first liquid cooling component 3.

[0143] In this embodiment, the first liquid cooling component 3 is located on the side of the substrate 1 away from the heat-generating device 2, which facilitates the integration of the first liquid cooling component 3 with the substrate 1. The second liquid cooling components 4 all penetrate the substrate 1, which facilitates drilling. All the second liquid cooling components 4 penetrate the substrate 1 and are connected to the first liquid cooling component 3, which can ensure all-round heat dissipation of the heat-generating device 2, realize the rapid reduction of the temperature of the heat-generating device 2, and thus improve the operational stability of the heat-generating device 2.

[0144] Specifically, in this embodiment, the length and width of the first liquid cooling component 3 are equal to the length and width of the surface layer of the substrate 1.

[0145] In the circuit board provided in this embodiment, the first liquid cooling component 3 is disposed on the side of the substrate 1 away from the heat-generating device 2. The side of the first liquid cooling component 3 closest to the substrate 1 forms a first surface 300. The second liquid cooling component 4 is in contact with the first surface 300 and has multiple contact points. The second liquid cooling component 4 is connected to the heat-generating device 2, so the heat generated by the heat-generating device 2 can be transferred to the first surface 300 through the second liquid cooling component 4. When the liquid cooling medium flows through the liquid cooling channel 301 inside the first liquid cooling component 3, it can quickly remove the heat transferred to the first surface 300, reduce the temperature of the heat-generating device 2, and thus improve the operational stability of the heat-generating device 2. Furthermore, since the second liquid cooling component 4 is in contact with the first surface 300 and has multiple contact points, the contact area between the second liquid cooling component 4 and the first surface 300 can be increased, thereby further improving the heat dissipation efficiency of the heat-generating device 2.

[0146] In this embodiment, the first liquid cooling component 3 is provided with a through hole 310, through which the components or chip modules to be installed on the substrate 1 are connected to the substrate 1.

[0147] In this embodiment, if it is necessary to lay out small components or chip modules on the bottom layer of the substrate 1, through holes 310 can be formed at the corresponding positions of the first liquid cooling component 3 according to the actual circuit board design requirements, so that the components or chip modules can be soldered to the bottom layer of the circuit board through the through holes 310.

[0148] In this embodiment, the first liquid cooling component 3 is connected to the surface of the substrate 1 away from the heat-generating device 2; or the second liquid cooling component 4 is connected to the first liquid cooling component 3.

[0149] If the circuit board design is relatively simple, with low wiring density, and the entire first liquid cooling component 3 has no cutout area, then the first liquid cooling component 3 can be directly connected to the substrate 1. If the first liquid cooling component 3 has through holes corresponding to the components or chip modules to be installed, then the first liquid cooling component 3 needs to be connected to the second liquid cooling component 4.

[0150] Specifically, if the circuit board design is relatively simple, the wiring density is low, and the entire first liquid cooling component 3 has no cut-out area, then the first liquid cooling component 3 can be laminated with the substrate 1 in one step to complete the circuit board fabrication. This solution can ensure good contact between the first liquid cooling component 3 and the grounding component. If the first liquid cooling component 3 has through holes corresponding to the components or chip modules to be installed, then the substrate 1 is first fabricated according to the conventional process. The bottom surface of the substrate 1 has windows to expose copper at the locations where components or chip modules need to be soldered. At the same time, the bottom surface of the substrate 1 also needs to have windows to expose copper at the locations corresponding to the second liquid cooling component 4. Then, the components or chip modules to be soldered are soldered to the bottom surface of the substrate 1. Finally, the first liquid cooling component 3 and the second liquid cooling component 4 are soldered at the exposed copper areas.

[0151] It should be noted that for the solution where the bottom surface of the substrate 1 needs to open a window to expose copper at the location corresponding to the second liquid cooling component 4, the second liquid cooling component 4 should open a window to expose copper as large as possible in the open area of ​​the substrate 1 to facilitate welding and heat conduction with the first liquid cooling component 3.

[0152] In this embodiment, such as Figure 7 As shown, Figure 7 This is a top sectional view of the first liquid cooling component 3. The liquid cooling channel 301 has a bent design. One end of the liquid cooling channel 301 is the liquid inlet 302, and the other end is the liquid outlet 303. The liquid cooling channel 301 has a large length and extends to the edge of the first liquid cooling component 3, which can dissipate heat from the heat-generating device 2 in all directions, realize the rapid reduction of the temperature of the heat-generating device 2, and thus improve the operational stability of the heat-generating device 2.

[0153] In this embodiment, the liquid cooling channel 301 should avoid right angles as much as possible to avoid restricting the flow of the liquid cooling medium. Preferably, the bending angle of the liquid cooling channel 301 at the bend is greater than or equal to 135°.

[0154] In one alternative embodiment, such as Figures 9 to 12 A circuit board is provided, including a substrate 1, a heating element 2, and a liquid cooling component. The heating element 2 is disposed on the surface of the substrate 1; the liquid cooling component is disposed on the substrate 1 and includes a first liquid cooling component 3 and a second liquid cooling component 4. The first liquid cooling component 3 has a built-in liquid cooling channel 301 and includes a first surface 300. The second liquid cooling component 4 is in contact with the first surface 300 and is connected to the heating element 2. The first liquid cooling component 3 is embedded in the inner layer of the substrate 1.

[0155] In this embodiment, the second liquid cooling component 4 is in contact with the first surface 300 and has multiple contact points, which are arranged in a mesh pattern.

[0156] In this embodiment, the first surface 300 is a ground plane, the heating device 2 is provided with a ground connection part, and the second liquid cooling component 4 is a conductor with one end connected to the ground connection part. The second liquid cooling component 4 is used to transfer the heat of the heating device 2 to the ground plane. The second liquid cooling component 4 can both ground the heating device 2 and transfer heat.

[0157] The second liquid cooling component 4 can be a metal via, specifically a copper via. Copper vias have good thermal conductivity and can transfer the heat generated by the heating device 2 to the grounding surface.

[0158] In this embodiment, the substrate 1 includes multiple signal layers. The substrate 1 is provided with signal vias 5. The first end of the signal via 5 is connected to the heating device 2, and the second end is connected to the signal layer, so that fan-out wiring can be completed in the signal layer.

[0159] In this embodiment, the first liquid cooling component 3 includes multiple parallel metal liquid cooling conduits 304, an inlet pipe 305 connected to the inlet end of the multiple metal liquid cooling conduits 304, and an outlet pipe 306 connected to the outlet end of the multiple metal liquid cooling conduits 304.

[0160] In this embodiment, the first liquid cooling component 3 includes multiple parallel metal liquid cooling conduits 304, an inlet pipe 305 connected to the inlet ends of the multiple metal liquid cooling conduits 304, and an outlet pipe 306 connected to the outlet ends of the multiple metal liquid cooling conduits 304. Therefore, after the liquid cooling medium enters the inlet pipe 305, it can flow into each of the metal liquid cooling conduits 304 respectively, and then converge into the outlet pipe 306 and flow out through the outlet pipe 306. The liquid cooling medium enters from one end of the metal liquid cooling conduit 304 and flows out from the other end. Compared with the embodiment in which a liquid cooling channel 301 is opened inside the metal component, there is no need to open a liquid cooling channel 301, and the structure is simpler. Furthermore, the multiple parallel metal liquid cooling conduits 304 can increase the heat dissipation area and improve the heat dissipation effect.

[0161] In this embodiment, the first liquid cooling component 3 further includes a first metal sheet 311 that contacts the side of the multiple metal liquid cooling conduits 304 near the heating device 2. The surface of the first metal sheet 311 near the heating device 2 forms a first surface 300. The first metal sheet 311 contacts the multiple metal liquid cooling conduits 304, and the surface of the first metal sheet 311 near the heating device 2 forms the first surface 300. The second liquid cooling component 4 contacts the first surface 300 and has multiple contact points. The second liquid cooling component 4 is connected to the heating device 2. Therefore, the heat generated by the heating device 2 can be transferred to the first surface 300 through the second liquid cooling component 4. When the liquid cooling medium flows through each metal liquid cooling conduit 304, it can carry away the heat transferred to the first surface 300, reduce the temperature of the heating device 2, and thus improve the operational stability of the heating device 2.

[0162] In this embodiment, the metal liquid cooling conduit 304 penetrates the substrate 1 along the first direction, and the second liquid cooling component 4 passes through the substrate 1 along the second direction. The second direction has an angle with the first direction, and the orthographic projections of the metal liquid cooling conduit 304 and the second liquid cooling component 4 do not overlap.

[0163] In this embodiment, by contacting the first metal sheet 311 with multiple metal liquid cooling conduits 304, the surface of the first metal sheet 311 near the heating device 2 forms a first surface 300. The second liquid cooling component 4 contacts the first surface 300 and has multiple contact points. The second liquid cooling component 4 is connected to the heating device 2, so the heat generated by the heating device 2 can be transferred to the first surface 300 through the second liquid cooling component 4. When the liquid cooling medium flows through each metal liquid cooling conduit 304, it can carry away the heat transferred to the first surface 300, reducing the temperature of the heating device 2 and thus improving the operational stability of the heating device 2. Since the orthographic projections of the metal liquid cooling conduits 304 and the second liquid cooling component 4 do not overlap, the metal liquid cooling conduits 304 do not affect conventional circuit board drilling and wiring.

[0164] Specifically, in this embodiment, the first direction refers to the direction parallel to the upper and lower surfaces of the substrate 1, and the second direction refers to the direction perpendicular to the upper and lower surfaces of the substrate 1.

[0165] Specifically in this embodiment, such as Figure 9 As shown, both the liquid inlet pipe 305 and the liquid outlet pipe 306 are located outside the substrate 1.

[0166] like Figure 10 and Figure 11 The first metal sheet 311 is in contact with the upper surface of multiple metal liquid cooling conduits 304 at the same time, and the second liquid cooling component 4 passes through the first metal sheet 311.

[0167] In this embodiment, both the signal via 5 and the second liquid cooling component 4 can penetrate the space between two adjacent metal liquid cooling conduits 304 along the second direction, which facilitates wiring.

[0168] In this embodiment, the substrate 1 includes a fifth sub-substrate 107 disposed on the side of the liquid cooling component closer to the heating device 2, and a sixth sub-substrate 108 disposed on the side of the liquid cooling component away from the heating device 2. The metal liquid cooling conduit 304 is integrally pressed with the plastic structure 307, the fifth sub-substrate 107, and the sixth sub-substrate 108. The plastic structure 307 is disposed on both sides of the metal liquid cooling conduit 304, and the first liquid cooling component 3 is simultaneously connected to both the fifth sub-substrate 107 and the sixth sub-substrate 108.

[0169] Specifically, in this embodiment, the first liquid cooling component 3 and the substrate 1 are integrated by pressing, which is beneficial to the miniaturization of the entire circuit board.

[0170] In the circuit board provided in this embodiment, the first metal component is in contact with multiple metal liquid cooling conduits 304. The surface of the first metal sheet near the heat-generating device 2 forms a first surface 300. The second liquid cooling component 4 is in contact with the first surface 300 and has multiple contact points. The second liquid cooling component 4 is connected to the heat-generating device 2, so the heat generated by the heat-generating device 2 can be transferred to the first surface 300 through the second liquid cooling component 4. When the liquid cooling medium flows through the liquid cooling channel 301 inside the first liquid cooling component 3, it can quickly remove the heat transferred to the first surface 300, reduce the temperature of the heat-generating device 2, and thus improve the operational stability of the heat-generating device 2. Furthermore, since the second liquid cooling component 4 is in contact with the first surface 300 and has multiple contact points, the contact area between the second liquid cooling component 4 and the first surface 300 can be increased, thereby further improving the heat dissipation efficiency of the heat-generating device 2.

[0171] In this embodiment, the first metal sheet may be a copper sheet, and the first surface 300 may specifically be the surface of the copper sheet.

[0172] In the circuit board provided in this embodiment, during processing, a fifth sub-substrate 107 located on the side of the first liquid cooling component 3 near the heat-generating device 2 and a sixth sub-substrate 108 located on the side of the first liquid cooling component 3 away from the heat-generating device 2 are firstly processed. Then, multiple parallel metal liquid cooling conduits 304 are placed on the sixth sub-substrate 108, and plastic structures 307 are placed on both sides of the metal liquid cooling conduits 304. Then, the fifth sub-substrate 107 is placed on the metal liquid cooling conduits 304. Using a pressing process, the first liquid cooling component 3, the fifth sub-substrate 107, and the sixth sub-substrate 108 are pressed together to achieve the integration of the metal liquid cooling conduits 304 inside the substrate 1.

[0173] It should be noted that the fifth sub-substrate 107 and the sixth sub-substrate 108 in this embodiment both include several signal layers and dielectric layers. During the pressing process, the high temperature and high pressure melt the resin in the dielectric, thereby connecting the two adjacent layers into one.

[0174] Specifically, in this embodiment, the position and number of multiple metal liquid cooling pipes 304 are determined based on the position of the heat-generating device 2 on the circuit board, the wiring density inside the substrate 1, and the heat dissipation requirements.

[0175] In this embodiment, each metal liquid cooling conduit 304 is a straight pipe without bends. Therefore, when the liquid cooling medium flows in the metal liquid cooling conduit 304, the flow resistance is small, the flow is fast, and the heat dissipation efficiency is high.

[0176] Since each metal liquid cooling conduit 304 is a straight tube without bends, the flow resistance is small and the flow is fast when the liquid cooling medium flows in the metal liquid cooling conduit 304, resulting in high heat dissipation efficiency. Therefore, the diameter of the metal liquid cooling conduit 304 can be reduced, which is beneficial to reducing the thickness of the circuit board.

[0177] Since the metal liquid cooling conduit 304 has plastic structures 307 on both sides, the second liquid cooling component 4 can pass through the areas on both sides of the metal liquid cooling conduit 304 without affecting the conventional circuit board design for drilling and wiring.

[0178] In this embodiment, the outer diameter of the metal liquid cooling conduit 304 is 1.0-1.5 mm, and the inner diameter of the metal liquid cooling conduit 304 is 0.5-0.7 mm.

[0179] Specifically, the outer diameter of the metal liquid cooling conduit 304 is 1.0 mm, and the inner diameter of the metal liquid cooling conduit 304 is 0.5 mm; or, the outer diameter of the metal liquid cooling conduit 304 is 1.5 mm, and the inner diameter of the metal liquid cooling conduit 304 is 0.7 mm; or, the outer diameter of the metal liquid cooling conduit 304 is 1.0 mm, and the inner diameter of the metal liquid cooling conduit 304 is 0.7 mm; or, the outer diameter of the metal liquid cooling conduit 304 is 1.5 mm, and the inner diameter of the metal liquid cooling conduit 304 is 0.5 mm; or, the outer diameter of the metal liquid cooling conduit 304 is 1.5 mm, and the inner diameter of the metal liquid cooling conduit 304 is 0.6 mm.

[0180] In this embodiment, the outer diameter of the metal liquid cooling conduit 304 is relatively small, which is beneficial for reducing the thickness of the circuit board.

[0181] In this embodiment, the distance between the wall of the metal liquid cooling conduit 304 and the second liquid cooling component 4 is 0.4-0.6 mm.

[0182] In this embodiment, the distance between the wall of the metal liquid cooling conduit 304 and the second liquid cooling component 4 is 0.4-0.6 mm, which is relatively small. The plastic structure 307 also has a certain thermal conductivity. Therefore, the heat transferred from the heating device 2 through the second liquid cooling component 4 can be transferred to the metal liquid cooling conduit 304 through the plastic structures 307 on both sides. When the liquid cooling medium flows through each metal liquid cooling conduit 304, it can carry away the heat transferred to the metal liquid cooling conduit 304, reduce the temperature of the heating device 2, and thus improve the operational stability of the heating device 2.

[0183] Specifically, the distance between the wall of the metal liquid cooling conduit 304 and the second liquid cooling component 4 is 0.4 mm; or, the distance between the wall of the metal liquid cooling conduit 304 and the second liquid cooling component 4 is 0.5 mm; or, the distance between the wall of the metal liquid cooling conduit 304 and the second liquid cooling component 4 is 0.6 mm.

[0184] Specifically, the second liquid cooling component 4 is a grounding component, and the distance between the wall of the metal liquid cooling conduit 304 and the second liquid cooling component 4 is 0.4-0.6 mm. The heat transferred from the heating device 2 through the grounding component can be transferred to the metal liquid cooling conduit 304 through the plastic structures 307 on both sides. When the liquid cooling medium flows through each metal liquid cooling conduit 304, it can carry away the heat transferred to the metal liquid cooling conduit 304, reduce the temperature of the heating device 2, and thus improve the operational stability of the heating device 2.

[0185] In this embodiment, the second liquid cooling component 4 penetrates the first metal sheet 311 and the plastic structure 307, and the distance between the two second liquid cooling components 4 located between two adjacent metal liquid cooling conduits 304 is 0.5-1.5mm.

[0186] In this embodiment, the second liquid cooling component 4 penetrates the first surface 300 and the plastic structure 307, facilitating the fabrication of the second liquid cooling component 4. The second liquid cooling component 4 is in contact with the first surface 300, allowing heat generated by the heating device 2 to be transferred to the first surface 300 via the second liquid cooling component 4. As the liquid cooling medium flows through each metal liquid cooling conduit 304, it carries away the heat transferred to the first surface 300, reducing the temperature of the heating device 2 and thus improving its operational stability. The spacing between two second liquid cooling components 4 located between two adjacent metal liquid cooling conduits 304 is 0.5-1.5 mm. As many second liquid cooling components 4 as needed, the heat dissipation efficiency can be improved.

[0187] Specifically, the distance between the two second liquid cooling components 4 located between two adjacent metal liquid cooling conduits 304 is 0.5 mm; or, the distance between the two second liquid cooling components 4 located between two adjacent metal liquid cooling conduits 304 is 1 mm; or, the distance between the two second liquid cooling components 4 located between two adjacent metal liquid cooling conduits 304 is 1.5 mm.

[0188] In this embodiment, the distance between two adjacent metal liquid cooling conduits 304 is 2-4 mm.

[0189] In this embodiment, the spacing between two adjacent metal liquid cooling conduits 304 is 2-4mm, and the area between two adjacent metal liquid cooling conduits 304 is sufficient to accommodate a second liquid cooling conduit. The metal liquid cooling conduits 304 do not affect the conventional circuit board design for drilling and wiring.

[0190] Specifically, the distance between two adjacent metal liquid cooling conduits 304 is 2 mm; or, the distance between two adjacent metal liquid cooling conduits 304 is 3 mm; or, the distance between two adjacent metal liquid cooling conduits 304 is 4 mm.

[0191] In one alternative embodiment, such as Figures 13 to 15 A circuit board is provided, including a substrate 1, a heating element 2, and a liquid cooling component. The heating element 2 is disposed on the surface of the substrate 1; the liquid cooling component is disposed on the substrate 1 and includes a first liquid cooling component 3 and a second liquid cooling component 4. The first liquid cooling component 3 has a built-in liquid cooling channel 301 and includes a first surface 300. The second liquid cooling component 4 is in contact with the first surface 300 and has multiple contact points, and is connected to the heating element 2. The first liquid cooling component 3 includes a ceramic core plate 308 and a metal plate 309.

[0192] In this embodiment, the second liquid cooling component 4 is in contact with the first surface 300 and has multiple contact points, which are arranged in a mesh pattern.

[0193] In this embodiment, the first surface 300 is a ground plane, the heating device 2 is provided with a ground connection part, and the second liquid cooling component 4 is a conductor with one end connected to the ground connection part. The second liquid cooling component 4 is used to transfer the heat of the heating device 2 to the ground plane. The second liquid cooling component 4 can both ground the heating device 2 and transfer heat.

[0194] The second liquid cooling component 4 can be a metal via, specifically a copper via. Copper vias have good thermal conductivity and can transfer the heat generated by the heating device 2 to the grounding surface.

[0195] In this embodiment, the first liquid cooling component 3 includes a ceramic core plate 308 and a metal plate 309. The ceramic core plate 308 is provided with a liquid cooling channel 301, and the metal plate 309 covers the ceramic core plate 308.

[0196] In this embodiment, the ceramic core plate 308 is provided with a liquid cooling channel 301, and a metal plate 309 covers the ceramic core plate 308. The metal core plate covers the liquid cooling channel 301 of the ceramic core plate 308, preventing the liquid cooling channel 301 from being recessed when the first liquid cooling component 3 is pressed with the substrate 1. The second liquid cooling component 4 is in contact with the metal plate 309 and has multiple contact points. The second liquid cooling component 4 is connected to the heating device 2, so the heat generated by the heating device 2 can be transferred to the metal plate 309 through the second liquid cooling component 4. When the liquid cooling medium flows through the liquid cooling channel 301 inside the first liquid cooling component 3, it can quickly remove the heat transferred to the metal plate 309, reduce the temperature of the heating device 2, and thus improve the operational stability of the heating device 2. Furthermore, since the second liquid cooling component 4 is in contact with the metal plate 309 and has multiple contact points, the contact area between the second liquid cooling component 4 and the metal plate 309 can be increased, thereby further improving the heat dissipation efficiency of the heating device 2. In addition, since the ceramic core board 308 has insulation, low CTE and excellent thermal conductivity, it can achieve insulation between itself and the signal via 5, and can transfer the heat of the second liquid cooling component 4 to the liquid cooling channel 301.

[0197] In this embodiment, the thickness of the ceramic core plate 308 is 0.4-0.8 mm, and the width of the liquid cooling channel 301 is 1.5-2 mm.

[0198] In this embodiment, the ceramic core plate 308 has a small thickness, which can help reduce the overall thickness of the circuit board. The width of the liquid cooling channel 301 is 1.5-2mm, which is conducive to the smooth flow of the liquid cooling medium.

[0199] Specifically, the ceramic core plate 308 has a thickness of 0.4 mm and a liquid cooling channel 301 has a width of 1.5 mm; or, the ceramic core plate 308 has a thickness of 0.4 mm and a liquid cooling channel 301 has a width of 1.8 mm; or, the ceramic core plate 308 has a thickness of 0.4 mm and a liquid cooling channel 301 has a width of 2 mm; or, the ceramic core plate 308 has a thickness of 0.6 mm and a liquid cooling channel 301 has a width of 1.5 mm; or, the ceramic core plate 308 has a thickness of 0.6 mm. The thickness of the liquid cooling channel 301 is 1.8 mm; or the thickness of the ceramic core plate 308 is 0.6 mm and the width of the liquid cooling channel 301 is 2 mm; or the thickness of the ceramic core plate 308 is 0.8 mm and the width of the liquid cooling channel 301 is 1.5 mm; or the thickness of the ceramic core plate 308 is 0.8 mm and the width of the liquid cooling channel 301 is 1.8 mm; or the thickness of the ceramic core plate 308 is 0.8 mm and the width of the liquid cooling channel 301 is 2 mm.

[0200] In this embodiment, a second metal sheet 312 is covered on the metal plate 309. The side surface of the second metal sheet 312 near the heating device forms a first surface 300. A clearance hole 3121 is provided on the second metal sheet 312 corresponding to the signal via 5.

[0201] In this embodiment, a second metal sheet 312 covers the metal plate 309. The surface of the second metal sheet 312 closest to the heating device 2 forms a first surface 300. The second liquid cooling component 4 is in contact with the copper foil and has multiple contact points. The second liquid cooling component 4 is connected to the heating device 2, so the heat generated by the heating device 2 can be transferred to the copper foil through the second liquid cooling component 4. When the liquid cooling medium flows through the liquid cooling channel 301 inside the first liquid cooling component 3, it can quickly remove the heat transferred to the second metal sheet 312, reducing the temperature of the heating device 2 and thus improving the operational stability of the heating device 2. The second metal sheet 312 has a clearance hole corresponding to the signal via 5 to avoid short circuits.

[0202] Specifically, the second metal sheet 312 is a copper foil, and the copper foil has a clearance hole 3121 corresponding to the signal via 5.

[0203] In this embodiment, the second liquid cooling component 4 and the signal via 5 penetrate the ceramic core plate 308 and are misaligned with the liquid cooling channel 301.

[0204] In this embodiment, since the second liquid cooling component 4 and the signal via 5 penetrate the ceramic core plate 308, it is convenient to process the second liquid cooling component 4 and the signal via 5, and to facilitate the wiring of the circuit board.

[0205] In this embodiment, the substrate 1 includes a seventh sub-substrate 109 disposed on the side of the first liquid cooling component 3 near the heating device 2 and an eighth sub-substrate 110 disposed on the side of the first liquid cooling component 3 away from the heating device 2. The first liquid cooling component 3 is connected to both the seventh sub-substrate 109 and the eighth sub-substrate 110.

[0206] In this embodiment, the first liquid cooling component 3 is connected to both the seventh sub-substrate 109 and the eighth sub-substrate 110, which can stably integrate the ceramic core plate 308 inside the substrate 1.

[0207] In this embodiment, such as Figure 13 As shown in the figure, this is a top view of the ceramic core plate 308. The liquid cooling channel 301 has a bent design. One end of the liquid cooling channel 301 is the liquid inlet 302, and the other end is the liquid outlet 303. The liquid cooling channel 301 has a large length and extends to the edge near the first liquid cooling component 3, which can dissipate heat from the heat-generating device 2 in all directions, thereby rapidly reducing the temperature of the heat-generating device 2 and improving the operational stability of the heat-generating device 2.

[0208] The circuit board provided in this embodiment is manufactured according to the following process:

[0209] 1. Mill grooves into the ceramic core board 308 to create liquid cooling channels 301. The liquid cooling channels 301 can be designed according to the circuit board's schematics, avoiding the signal vias 5 within the substrate 1. The width of the liquid cooling channels 301 is determined based on the liquid cooling medium flow rate and heat dissipation efficiency, ranging from 1.5-2mm. The thickness of the ceramic core board 308 is 0.4-0.8mm, thus facilitating a reduction in the overall thickness of the circuit board. The width of the liquid cooling channels 301 should be as consistent as possible to avoid excessively narrow areas that restrict liquid flow. Furthermore, the liquid cooling channels 301 should ideally avoid right angles, with bends not less than 135° to reduce the impact force of the liquid flow. This ensures that the liquid flow rate and heat dissipation efficiency are met while minimizing the size of the liquid cooling channels 301.

[0210] 2. Covering the liquid cooling channel 301 with a hard metal plate 309, such as iron or aluminum, can prevent the circuit board from being recessed on the upper and lower sides of the liquid cooling channel 301 area during subsequent pressing.

[0211] 3. Copper foil is inlaid on the entire rigid metal plate 309 and the ceramic core plate 308 area not covered by the rigid metal plate 309. The copper foil forms the ground plane, and its thickness is 1-2 oz. The copper foil facilitates connection with the circuit board's overall grounding components and other grounding planes, enhancing the heat conduction rate. At the same time, the roughness of the copper foil should be as large as possible, at least 6-8 μm. This design facilitates subsequent bonding with the fiberglass board, enhancing the adhesion strength. Furthermore, according to the circuit board design drawings, the copper foil needs to be cut away in the areas of non-grounding signal vias 5 to avoid subsequent connection with the ground plane and short circuits. After this step is completed, the first liquid cooling component 3 is finished.

[0212] 4. Place the fabricated first liquid cooling component 3 between the seventh sub-substrate 109 and the eighth sub-substrate 110. The first liquid cooling component 3 is located at the exact center of the entire circuit board. The first liquid cooling component 3 is then pressed together with the seventh sub-substrate 109 and the eighth sub-substrate 110 in one step. Since the first liquid cooling component 3 is located at the exact center of the entire circuit board, it is beneficial to ensure that the force is evenly distributed on the top and bottom of the circuit board during pressing, thereby improving the manufacturing yield and reducing the manufacturing cost.

[0213] Specifically, the seventh sub-substrate 109 and the eighth sub-substrate 110 include a glass fiber core board and resin fibers, and the glass fiber core board and the ceramic core board 308 are bonded together by melting the resin fibers.

[0214] Example 7

[0215] This embodiment provides a server, including the circuit board and liquid cooling system provided in embodiments 1 to 7 above, the liquid cooling system being connected to the liquid cooling channel 301.

[0216] In this embodiment, a liquid cooling component is provided, which includes a first liquid cooling component 3 and a second liquid cooling component 4. The first liquid cooling component 3 includes a first surface 300, and the second liquid cooling component 4 is in contact with the first surface 300 and has multiple contact points. The second liquid cooling component 4 is connected to the heating device 2. Therefore, the heat generated by the heating device 2 can be transferred to the first surface 300 through the second liquid cooling component 4. When the liquid cooling medium provided by the liquid cooling system flows through the liquid cooling channel 301 inside the first liquid cooling component 3, it can quickly remove the heat transferred to the first surface 300, reduce the temperature of the heating device 2, and thus improve the operational stability of the heating device 2.

[0217] In this embodiment, the second liquid cooling component 4 is in contact with the first surface 300 and has multiple contact points, which can increase the contact area between the second liquid cooling component 4 and the first surface 300, thereby further improving the heat dissipation efficiency of the heat-generating device 2. In addition, the liquid cooling component is integrated with the substrate 1, which improves the integration of the circuit board and is conducive to the miniaturization of servers.

[0218] Specifically, the liquid cooling channel 301 has a liquid inlet 302 and a liquid outlet 303, which are connected to the liquid cooling system through pipelines.

[0219] Specifically, the liquid cooling system includes a liquid storage tank, a liquid pump, and a heat exchanger. The liquid storage tank, liquid pump, and heat exchanger are connected to the liquid inlet 302 and the liquid outlet 303 via pipelines. The liquid storage tank is used to store the liquid cooling medium, the heat exchanger is used to exchange heat with the liquid cooling medium to cool it down, and the liquid pump drives the liquid cooling medium to circulate between the liquid storage tank, the heat exchanger, and the liquid cooling channel 301, so that the liquid cooling medium dissipates heat from the heat-generating device 2 as it flows through the liquid cooling channel 301.

[0220] The circuit board and server provided in this application have been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of this application. The descriptions of the embodiments above are only for the purpose of helping to understand the method and core ideas of this application. It should be noted that those skilled in the art can make several improvements and modifications to this application without departing from the principles of this application, and these improvements and modifications also fall within the protection scope of this application.

Claims

1. A circuit board, characterized in that, include: base(1); A heating element (2) is disposed on the surface of the substrate (1); A liquid cooling component is disposed on the substrate (1). The liquid cooling component includes a first liquid cooling component (3) and a second liquid cooling component (4). The first liquid cooling component (3) has a built-in liquid cooling channel (301) and includes a first surface (300). The second liquid cooling component (4) is in contact with the first surface (300) and is connected to the heating device (2).

2. The circuit board according to claim 1, characterized in that, The first surface (300) is a ground plane, the heating device (2) is provided with a ground connection part, and the second liquid cooling component (4) is a conductor, with one end connected to the ground connection part.

3. The circuit board according to claim 1 or 2, characterized in that, The first liquid cooling component (3) is a metal component, and the side surface of the metal component near the heating device (2) constitutes the first surface (300).

4. The circuit board according to claim 3, characterized in that, The substrate (1) has a groove on the side away from the heating device (2), and the first liquid cooling component (3) is embedded in the groove.

5. The circuit board according to claim 4, characterized in that, The cross-sectional shape of the first liquid cooling component (3) includes one of the following: stepped, triangular, and rectangular.

6. The circuit board according to claim 4, characterized in that, The first surface (300) is connected to a resistor or capacitor.

7. The circuit board according to claim 3, characterized in that, The substrate (1) includes a first sub-substrate (103) located on the side of the first liquid cooling component (3) closer to the heat-generating device (2), a second sub-substrate (104) located on the side of the first liquid cooling component (3) away from the heat-generating device (2), and a third sub-substrate (105) and a fourth sub-substrate (106) located on both sides of the first liquid cooling component (3). The thickness of the third sub-substrate (105) and the fourth sub-substrate (106) is equal to the thickness of the first liquid cooling component. The first liquid cooling component (3) is simultaneously connected to the first sub-substrate (103), the second sub-substrate (104), the third sub-substrate (105), and the fourth sub-substrate (106).

8. The circuit board according to claim 3, characterized in that, The first liquid cooling component (3) is disposed on the side of the substrate (1) away from the heat-generating device (2), and the second liquid cooling component (4) penetrates the substrate (1) and is connected to the first liquid cooling component (3).

9. The circuit board according to claim 8, characterized in that, The first liquid cooling component (3) is provided with a through hole (310), through which the components or chip modules to be installed on the substrate (1) are connected to the substrate (1).

10. The circuit board according to claim 8, characterized in that, The first liquid cooling component (3) is connected to the side surface of the substrate (1) away from the heating device (2); or the second liquid cooling component (4) is connected to the first liquid cooling component (3).

11. The circuit board according to claim 1 or 2, characterized in that, The first liquid cooling component (3) includes multiple parallel metal liquid cooling conduits (304), an inlet pipe (305) connected to the inlet end of the multiple metal liquid cooling conduits (304), and an outlet pipe (306) connected to the outlet end of the multiple metal liquid cooling conduits (304).

12. The circuit board according to claim 11, characterized in that, The first liquid cooling component (3) further includes a first metal sheet (311) that contacts the side of the plurality of metal liquid cooling conduits (304) near the heating device (2), and the surface of the first metal sheet (311) near the heating device (2) constitutes the first surface (300).

13. The circuit board according to claim 11, characterized in that, The metal liquid cooling conduit (304) penetrates the substrate (1) along a first direction, and the second liquid cooling component (4) passes through the substrate (1) along a second direction. The second direction has an angle with the first direction, and the orthographic projections of the metal liquid cooling conduit (304) and the second liquid cooling component (4) do not overlap.

14. The circuit board according to claim 12 or 13, characterized in that, The substrate (1) includes a fifth sub-substrate (107) disposed on the side of the first liquid cooling component near the heating device (2) and a sixth sub-substrate (108) disposed on the side of the first liquid cooling component away from the heating device (2). Plastic structures (307) are provided on both sides of the metal liquid cooling conduit (304). The first liquid cooling component (3) is connected to both the fifth sub-substrate (107) and the sixth sub-substrate (108).

15. The circuit board according to claim 12 or 13, characterized in that, The outer diameter of the metal liquid cooling conduit (304) is 1.0-1.5 mm, and the inner diameter of the metal liquid cooling conduit (304) is 0.5-0.7 mm; And / or, the distance between the wall of the metal liquid cooling conduit (304) and the second liquid cooling component (4) is 0.4-0.6 mm; And / or, the spacing between the two second liquid cooling components (4) located between two adjacent metal liquid cooling conduits (304) is 0.5-1.5 mm; And / or, the spacing between two adjacent metal liquid cooling conduits (304) is 2-4 mm.

16. The circuit board according to claim 1 or 2, characterized in that, The first liquid cooling component (3) includes a ceramic core plate (308) and a metal plate (309). The ceramic core plate (308) is provided with the liquid cooling channel (301), and the metal plate (309) covers the ceramic core plate (308).

17. The circuit board according to claim 16, characterized in that, The metal plate (309) is covered with a second metal sheet (312), and the surface of the second metal sheet (312) near the heating device (2) forms the first surface (300). The second metal sheet (312) has a clearance hole (3121) corresponding to the signal via (5).

18. The circuit board according to claim 16, characterized in that, The second liquid cooling component penetrates the ceramic core plate (308) and is misaligned with the liquid cooling channel (301).

19. The circuit board according to claim 16, characterized in that, The substrate (1) includes a seventh sub-substrate (109) disposed on the side of the first liquid cooling component (3) close to the heating device (2) and an eighth sub-substrate (110) disposed on the side of the first liquid cooling component (3) away from the heating device (2). The first liquid cooling component (3) is connected to both the seventh sub-substrate (109) and the eighth sub-substrate (110).

20. The circuit board according to any one of claims 1, 2, 4 to 10, 12, 13, 17 to 19, characterized in that, The second liquid cooling component (4) has multiple contact points with the first surface (300), and the multiple contact points are arranged in a mesh pattern.

21. The circuit board according to any one of claims 1, 2, 4 to 10, 12, 13, 17 to 19, characterized in that, The substrate (1) includes multiple signal layers. The substrate (1) is provided with signal vias (5). The first end of the signal via (5) is connected to the heating device (2), and the second end is connected to the signal layer.

22. A server, characterized in that, The circuit board included in any one of claims 1 to 21 and the liquid cooling system, wherein the liquid cooling system is in communication with the liquid cooling channel (301).

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