Glass substrate structure and method of making glass substrate to prevent cracking
Patent Information
- Application Number
- CN202510519052.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-04-24
- Publication Date
- 2026-10-27
AI Technical Summary
详细来说，该玻璃基板结构100于一玻璃基板103上设有电路层104，而当该玻璃基板结构100的该切割道102受到该激光LS切割时，因为激光冲击该切割道102的能量会造成该切割道102内该玻璃基板103与该电路层104的交界处105之间承受极大应力，也就是不同热膨胀系数的材料受到加热之后所产生固化收缩的应力，故该切割道102内该玻璃基板103与该电路层104的交界处105会产生Seware缺陷106，并且此Seware缺陷106将会持续开裂延伸而影响该玻璃基板103，使该玻璃基板103无法稳固承载电路层104
[0042]本发明设有该第一缓冲层而缓冲了该第一电路层与该玻璃基板交界处的应力累积，进而大幅降低了Seware缺陷自发性的产生于该第一电路层与该玻璃基板交界处的可能性。并且，当本发明防止开裂的该玻璃基板结构受到激光开槽切割(grooving)分割时，该第一内凹结构遮蔽了该第一电路层与该玻璃基板的交界处，即结构性的避免了激光照射到该第一电路层与该玻璃基板的交界处，进而使激光照射到该玻璃基板的热能远离该第一电路层与该玻璃基板的交界处，而避免了因为激光的开槽切割(grooving)导致该第一电路层与该玻璃基板交界处产生Seware缺陷。如此，本发明可确保该第一电路层更为稳固的设置于该玻璃基板上。
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Figure CN122995003A_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of glass substrate technology, and more particularly to a glass substrate structure and a glass substrate manufacturing method that prevents cracking. Background Technology
[0002] In the field of circuit fabrication on glass substrates, the glass substrate and other dielectric material carriers are formed on the same plane, and a cutting groove is left between the glass substrate and the carrier for cutting. After the circuit is formed on the glass substrate, the glass substrate can be cut off along the cutting groove by a milling machine (router; slab cutting machine) to form multiple carrier unit units after cutting.
[0003] However, the cut-out between the glass substrate and the carrier often has a mismatch in coefficients of thermal expansion (CTE) with the material of the redistribution layer (RDL) supported on the glass substrate, such as between copper wires and dielectric materials. When thermal excursion occurs between the cut-out and the redistribution layer, stress from curing shrinkage occurs between the materials with different CTEs. This stress accumulates at the interface between the glass substrate and the redistribution layer along the cut-out, resulting in so-called seware defects. Furthermore, these seware defects will gradually extend inwards into the glass substrate over time, causing larger and more noticeable cracks, eventually rendering the glass substrate unable to stably support the redistribution layer.
[0004] To clarify, the term "seware defect" is borrowed from Scott R. McCann's numerous academic papers published in the IEEE Transactions on Device and Materials Reliability journal, which describe seware. These papers explain the formation mechanism of seware defects and explore the stress transmission mechanism in materials.
[0005] Please see Figure 4A and Figure 4BThe cross-sectional schematic diagram shown illustrates the current process for manufacturing circuits using glass substrates. First, a glass substrate structure 100 is formed. Then, a laser LS (Laser Scribing) is used to cut the glass substrate structure 100 along the cutting path 102 preserved on the glass substrate structure 100 through grooving, thereby dividing the glass substrate structure 100 into multiple glass substrate unit structures 101. In detail, the glass substrate structure 100 has a circuit layer 104 on a glass substrate 103. When the cleavage 102 of the glass substrate structure 100 is cut by the laser LS, the energy of the laser impact on the cleavage 102 will cause the interface 105 between the glass substrate 103 and the circuit layer 104 in the cleavage 102 to bear great stress, that is, the stress of solidification shrinkage generated by materials with different thermal expansion coefficients after heating. Therefore, a seware defect 106 will be generated at the interface 105 between the glass substrate 103 and the circuit layer 104 in the cleavage 102. This seware defect 106 will continue to crack and extend, affecting the glass substrate 103 and making the glass substrate 103 unable to stably support the circuit layer 104.
[0006] Please refer to the following: Figure 5 and Figure 6 The top-view diagram shown is from an experiment. Figure 5 The glass substrate structure 100 is pre-divided into four glass substrate unit structures 101 by two dicing lines 102, and the glass substrate structure 100 carries Ajinomoto Build-up Film (ABF) dielectric material. Importantly, even... Figure 5 The glass substrate structure 100 was not cut along the cutting path 102, and after approximately 3 days of flat placement, Figure 5 The glass substrate structure 100 will spontaneously erode and crack. Figure 6 The state shown.
[0007] The results of this experiment demonstrate that even if the interface 105 between the glass substrate 103 and the circuit layer 104 within the cutting path 102 is not heated by the laser, the glass substrate structure 100 will still spontaneously generate a seware defect 106 at the interface 105 due to the accumulation of multilayer structural stress between the glass substrate 103 and the circuit layer 104, eventually leading to cracking. Figure 6 The state shown makes the glass substrate 103 no longer able to stably support the circuit layer 104. Summary of the Invention
[0008] The present invention provides a glass substrate structure and a glass substrate manufacturing method that prevent cracking, so that the circuit layer is more stably disposed on the glass substrate.
[0009] The crack-preventing glass substrate structure of the present invention comprises:
[0010] A glass substrate having a first surface;
[0011] A first buffer layer is disposed on the first surface, and the first buffer layer has a first buffer layer opening and a first buffer zone, the first buffer layer opening exposing the first surface of the glass substrate, and the first buffer zone being disposed at the edge of the first buffer layer opening;
[0012] A first circuit layer is disposed on the first buffer layer; wherein the first circuit layer includes:
[0013] First sidewall;
[0014] A first concave structure is formed concavely from the first sidewall surface, and the first concave structure exposes the first buffer zone.
[0015] In a preferred embodiment of the present invention, the glass substrate has a second surface relative to the first surface;
[0016] The crack-preventing glass substrate structure further includes:
[0017] A second buffer layer is disposed on the second surface, and the second buffer layer has a second buffer layer opening and a second buffer zone, the second buffer layer opening exposing the second surface of the glass substrate, and the second buffer zone being disposed at the edge of the second buffer layer opening;
[0018] A second circuit layer is disposed on the second buffer layer; wherein the second circuit layer includes:
[0019] A second side wall;
[0020] A second concave structure is formed concavely from the second sidewall surface, and the second concave structure exposes the second buffer zone.
[0021] In a preferred embodiment of the present invention, the first sidewall is a sidewall of a first cutting channel, the first cutting channel penetrating the first circuit layer and connecting to the opening of the first buffer layer.
[0022] In a preferred embodiment of the present invention, the first sidewall surface has a first slope, and the direction of extension of a horizontal distance of the first slope is parallel to the first surface of the glass substrate.
[0023] The first concave structure has a concave distance, and the concave distance is greater than the horizontal distance of the first slope.
[0024] In a preferred embodiment of the present invention, the concave distance is between 250 μm and 300 μm.
[0025] The method for manufacturing a crack-preventing glass substrate according to the present invention includes the following steps:
[0026] A first buffer layer is disposed on a first surface of a glass substrate;
[0027] A first circuit layer is disposed on the first buffer layer, the first circuit layer including a first barrier layer, the first barrier layer being attached to the first buffer layer;
[0028] A first cutting channel is formed in the first circuit layer, and the first cutting channel passes through the first circuit layer and contacts the first barrier layer;
[0029] The first barrier layer is wet-etched to form a first concave structure;
[0030] The first buffer layer is exposed in the first cut channel by photolithography, thereby forming a first buffer layer opening and a first buffer zone in the first buffer layer; wherein the first buffer zone is disposed at the edge of the first buffer layer opening, and the first concave structure exposes the first buffer zone.
[0031] In a preferred embodiment of the present invention, the method for manufacturing a crack-preventing glass substrate further includes the following steps:
[0032] Cut the glass substrate exposed in the opening of the first buffer layer to segment the glass substrate structure that prevents cracking.
[0033] In a preferred embodiment of the present invention, the glass substrate has a second surface relative to the first surface, and the method for manufacturing the crack-preventing glass substrate further includes the following steps:
[0034] A second buffer layer is provided on the second surface of the glass substrate;
[0035] A second circuit layer is disposed on the second buffer layer, the second circuit layer includes a second barrier layer, and the second barrier layer is attached to the second buffer layer;
[0036] A second cleaving channel is formed in the second circuit layer, and the second cleaving channel passes through the second circuit layer and contacts the second barrier layer;
[0037] The second barrier layer is wet-etched to form a second concave structure;
[0038] The second buffer layer is exposed in the second cut path by photolithography, thereby forming a second buffer layer opening and a second buffer zone in the second buffer layer; wherein the second buffer zone is disposed at the edge of the second buffer layer opening, and the second concave structure exposes the second buffer zone.
[0039] In a preferred embodiment of the present invention, the first cutting channel has a first sidewall surface, the first sidewall surface has a first slope, and the extension direction of a horizontal distance of the first slope is parallel to the first surface of the glass substrate.
[0040] The first concave structure is formed in the first sidewall surface, and the first concave structure has a concave distance, which is greater than the horizontal distance of the first slope.
[0041] In a preferred embodiment of the present invention, the concave distance is between 250 μm and 300 μm.
[0042] The present invention incorporates a first buffer layer to buffer stress accumulation at the interface between the first circuit layer and the glass substrate, thereby significantly reducing the likelihood of spontaneous seware defects occurring at this interface. Furthermore, when the crack-preventing glass substrate structure of the present invention is subjected to laser grooving, the first concave structure shields the interface between the first circuit layer and the glass substrate, structurally preventing laser radiation from reaching this interface. This allows the heat energy from the laser radiation to be diverted away from the interface, thus preventing seware defects from forming at the interface due to laser grooving. In this way, the present invention ensures that the first circuit layer is more securely mounted on the glass substrate. Attached Figure Description
[0043] Figure 1 This is a cross-sectional schematic diagram of an embodiment of the glass substrate structure for preventing cracking according to the present invention.
[0044] Figure 2 This is a cross-sectional schematic diagram of another embodiment of the glass substrate structure for preventing cracking according to the present invention.
[0045] Figures 3A to 3G A cross-sectional schematic flowchart of the glass substrate structure of the present invention, prepared by the glass substrate manufacturing method for preventing cracking according to the present invention.
[0046] Figure 4A This is a cross-sectional schematic diagram of the glass substrate structure.
[0047] Figure 4BThis is a cross-sectional schematic diagram of the glass substrate unit structure.
[0048] Figure 5 This is a top view of the glass substrate structure.
[0049] Figure 6 This is a top view of a cracked glass substrate structure.
[0050] Explanation of reference numerals in the attached figures:
[0051] 10. Glass substrate structure; 11. Glass substrate unit structure; 13. Glass substrate;
[0052] 100. Glass substrate structure; 101. Glass substrate unit structure; 102. Cutting track; 103. Glass substrate; 104. Circuit layer; 105. Junction; 106. Seware defect;
[0053] 121. First cutting channel; 122. Second cutting channel; 123. First sidewall; 124. Second sidewall;
[0054] 131. First surface; 132. Second surface; 133. Perforation;
[0055] 141. First circuit layer; 142. Second circuit layer; 143. First barrier layer; 144. Second barrier layer;
[0056] 151. First concave structure; 152. Second concave structure;
[0057] 161. First buffer layer; 162. Second buffer layer;
[0058] 171. First buffer layer opening; 172. Second buffer layer opening; 173. First buffer zone; 174. Second buffer zone.
[0059] LS, laser. Detailed Implementation
[0060] This invention provides a glass substrate structure and a glass substrate manufacturing method to prevent cracking.
[0061] Please see Figure 1 As shown, in one embodiment of the present invention, the glass substrate structure 10 that prevents cracking has at least one cutting channel for the edge milling machine (router; slab cutting machine) to perform laser grooving along the at least one cutting channel. The glass substrate structure 10 is a plurality of glass substrate unit structures 11 as described in the present invention.
[0062] In detail, such as Figure 1As shown, the glass substrate structure 10 of the present invention includes a glass substrate 13, which has a first surface 131 and a second surface 132 opposite to each other.
[0063] A first buffer layer 161 is provided on the first surface 131 of the glass substrate 13, and a first circuit layer 141 is further provided on the first buffer layer 161. The first buffer layer 161 has a first buffer layer opening 171 and a first buffer zone 173, and the first buffer layer opening 171 exposes the first surface 131 of the glass substrate 13, and the first buffer zone 173 is disposed at the edge of the first buffer layer opening 171. Further, the first circuit layer 141 includes a first dicing channel 121 and a first recessed structure 151. The first dicing channel 121 penetrates the first circuit layer 141 and connects to the first buffer layer opening 171, and the first dicing channel 121 has a first sidewall surface 123, which is the sidewall surface of the first dicing channel 121. The first recessed structure 151 is formed recessed from the first sidewall surface 123, and the first recessed structure 151 exposes the first buffer zone 173.
[0064] Preferably, a second buffer layer 162 is further provided on the second surface 132 of the glass substrate 13, and a second circuit layer 142 is further provided on the second buffer layer 162. The second buffer layer 162 has a second buffer layer opening 172 and a second buffer zone 174, and the second buffer layer opening 172 exposes the second surface 132 of the glass substrate 13, and the second buffer zone 174 is disposed at the edge of the second buffer layer opening 172. Further, the second circuit layer 142 includes a second dicing channel 122 and a second recessed structure 152. The second dicing channel 122 penetrates the second circuit layer 142 and connects to the second buffer layer opening 172, and the second dicing channel 122 has a second sidewall surface 124, which is the sidewall surface of the second dicing channel 122. The second recessed structure 152 is formed recessed from the second sidewall surface 124, and the second recessed structure 152 exposes the second buffer zone 174.
[0065] The key feature of the glass substrate structure 10 described in this invention lies in the recessed structure and the provision of the buffer layer. Specifically, the first buffer layer 161 buffers the stress accumulation at the interface between the first circuit layer 141 and the first surface 131 of the glass substrate 13, thereby significantly reducing the possibility of spontaneous seware defects occurring at the interface between the first circuit layer 141 and the first surface 131. The second buffer layer 162 buffers the stress accumulation at the interface between the second circuit layer 142 and the second surface 132 of the glass substrate 13, thereby significantly reducing the possibility of spontaneous seware defects occurring at the interface between the second circuit layer 142 and the second surface 132. Thus, when the glass substrate structure 10 described in this invention is left to stand, seware defects will not spontaneously occur from the first cleavage 121 and the second cleavage 122.
[0066] Furthermore, when the glass substrate structure 10 of the present invention, which prevents cracking, is subjected to laser grooving to divide it into multiple glass substrate unit structures 11, the first recessed structure 151 shields the junction between the first circuit layer 141 and the first surface 131 of the glass substrate 13. In other words, it structurally prevents the laser from irradiating the first surface 131 located within the first recessed structure 151, thereby causing the heat energy of the laser irradiating the glass substrate 13 to be away from the first surface 131 located within the first recessed structure 151. This avoids the generation of seware defects at the junction between the first circuit layer 141 and the first surface 131 of the glass substrate 13 due to laser grooving. Similarly, the second recessed structure 152 also shields the interface between the second circuit layer 142 and the second surface 132 of the glass substrate 13, structurally preventing laser irradiation of the second surface 132 located within the second recessed structure 152. This avoids the heat energy from the laser irradiation of the glass substrate 13 being diverted away from the second surface 132 located within the second recessed structure 152, thus preventing seware defects from occurring at the interface between the second circuit layer 142 and the second surface 132 of the glass substrate 13 due to laser grooving. In this way, the present invention ensures that the first circuit layer 141 and the second circuit layer 142 are more securely disposed on the glass substrate 13.
[0067] In one embodiment, the first sidewall 123 of the first cutting channel 121 has a first slope, which can be mathematically represented by a horizontal distance and a vertical distance. The horizontal distance of the first slope extends parallel to the first surface 131 of the glass substrate 13, while the vertical distance of the first slope extends perpendicular to the first surface 131 of the glass substrate 13. Further, the first concave structure 151 has a concave distance, and the concave distance of the first concave structure 151 is greater than the horizontal distance of the first slope.
[0068] Furthermore, the second sidewall 124 of the second cutting channel 122 has a second slope, which can be mathematically represented by a horizontal distance and a vertical distance. The horizontal distance of the second slope extends parallel to the second surface 132 of the glass substrate 13, while the vertical distance of the second slope extends perpendicular to the second surface 132 of the glass substrate 13. Further, the second recessed structure 152 has a recessed distance, and the recessed distance of the second recessed structure 152 is greater than the horizontal distance of the second slope.
[0069] This arrangement ensures that the recessed distance of the first recessed structure 151 and the recessed distance of the second recessed structure 152 are appropriately far away from the laser grooving cutting positions outside the first recessed structure 151 and the second recessed structure 152, thereby preventing the junction of the first circuit layer 141 and the glass substrate 13 in the first recessed structure 151 and the junction of the second circuit layer 142 and the glass substrate 13 in the second recessed structure 152 from being affected by heat energy and causing seware defects due to material and structural stress.
[0070] Meanwhile, the recessed distances of the first recessed structure 151 and the second recessed structure 152 ensure that minor seware defects that may be caused by laser irradiation are insufficient to cause cracks that extend to the areas of the glass substrate 13 supporting the first circuit layer 141 and the second circuit layer 142. This is because the areas irradiated by the laser, namely the portions of the first surface 131 within the first cut channel 121 not shielded by the first recessed structure 151 and the portions of the second surface 132 within the second cut channel 122 not shielded by the second recessed structure 152, do not contact the first circuit layer 141 and the second circuit layer 142, respectively. In other words, these specific areas do not support the multilayer circuit structure of the first circuit layer 141 or the second circuit layer 142, and therefore do not need to bear the additional material stress caused by the multilayer circuit structure. Therefore, even if minor seware defects are generated in these specific areas due to laser irradiation, these seware defects can be confined to a fixed area and will not spread and crack to the contact area of the first circuit layer 141 and the second circuit layer 142. Furthermore, the arrangement of the first buffer zone 173 of the first buffer layer 161 and the second buffer zone 174 of the second buffer layer 162 also inhibits the continuous horizontal spread of minor seware defects generated in the aforementioned specific areas due to laser irradiation into the glass substrate 13. Based on the above-mentioned various structural arrangements, the present invention can prevent seware defects from cracking in multiple ways, thereby avoiding seware defects from affecting the arrangement of the first circuit layer 141 and the second circuit layer 142 on the glass substrate 13.
[0071] In one embodiment, the concave distance of the first concave structure 151 and the concave distance of the second concave structure 152 are the same, and the first buffer layer 161 and the second buffer layer 162 also have the same specifications. Preferably, the concave distance of both the first concave structure 151 and the second concave structure 152 is between 250 μm and 300 μm.
[0072] In one embodiment, both the first circuit layer 141 and the second circuit layer 142 are multi-layered circuit structures, such as redistribution layers (RDLs) using copper wires and Ajinomoto Build-up Film (ABF) dielectric material. In other embodiments, the first circuit layer 141 and the second circuit layer 142 may also be multi-layered circuit structures made using other types of metal materials and dielectric materials.
[0073] In one embodiment, a plurality of through holes 133 are formed on the glass substrate 13, and the plurality of through holes 133 penetrate the first surface 131 and the second surface 132. Furthermore, the first circuit layer 141 located on the first surface 131 and the second circuit layer 142 located on the second surface 132 are electrically connected to each other through the plurality of through holes 133 on the glass substrate 13.
[0074] Please see Figure 2 As shown, Figure 2 The multiple glass substrate unit structures 11 shown are composed of Figure 1 The structure shown is divided along the first cutting channel 121 and the second cutting channel 122. However, unlike... Figure 1 The embodiments shown are in accordance with the present invention as follows. Figure 2 In another embodiment shown, any one of the glass substrate unit structures 11 is another crack-preventing glass substrate structure to be protected by the present invention. For one glass substrate unit structure 11, that is, for the glass substrate structure of this embodiment, it includes a glass substrate 13, a first circuit layer 141, and a first buffer layer 161. The glass substrate 13 has opposing first surfaces 131 and second surfaces 132. The first buffer layer 161 has a first buffer layer opening 171 and a first buffer zone 173. The first buffer layer 161 is disposed on the first surface 131, and the first buffer layer opening 171 exposes the first surface 131 of the glass substrate 13. The first buffer zone 173 is disposed at the edge of the first buffer layer opening 171. The first circuit layer 141 includes a first sidewall 123 and a first recessed structure 151, and the first recessed structure 151 connects the first sidewall 123 and the first buffer layer opening 171. The first concave structure 151 is formed recessed from the first sidewall 123, and the first concave structure 151 exposes the first buffer zone 173.
[0075] Preferably, a second buffer layer 162 is further provided on the second surface 132, and a second circuit layer 142 is further provided on the second buffer layer 162. The second buffer layer 162 has a second buffer layer opening 172 and a second buffer zone 174. The second buffer layer opening 172 exposes the second surface 132 of the glass substrate 13, and the second buffer zone 174 is disposed at the edge of the second buffer layer opening 172. The second circuit layer 142 includes a second sidewall 124 and a second recessed structure 152, and the second recessed structure 152 connects the second sidewall 124 and the second buffer layer opening 172. The second recessed structure 152 is formed recessed from the second sidewall 124, and the second recessed structure 152 exposes the second buffer zone 174.
[0076] In one embodiment, the first sidewall 123 has a first slope, which can be mathematically represented by a horizontal distance and a vertical distance. The horizontal distance of the first slope extends parallel to the first surface 131 of the glass substrate 13, while the vertical distance of the first slope extends perpendicular to the first surface 131 of the glass substrate 13. Furthermore, the first recessed structure 151 has a recessed distance, and the recessed distance of the first recessed structure 151 is greater than the horizontal distance of the first slope.
[0077] Furthermore, the second sidewall 124 has a second slope, which can be mathematically represented by a horizontal distance and a vertical distance. The horizontal distance of the second slope extends parallel to the second surface 132 of the glass substrate 13, while the vertical distance of the second slope extends perpendicular to the second surface 132 of the glass substrate 13. Further, the second recessed structure 152 has a recessed distance, and the recessed distance of the second recessed structure 152 is greater than the horizontal distance of the second slope.
[0078] In one embodiment, the concave distance of the first concave structure 151 and the concave distance of the second concave structure 152 are the same, and the first buffer layer 161 and the second buffer layer 162 also have the same specifications. Preferably, the concave distance of both the first concave structure 151 and the second concave structure 152 is between 250 μm and 300 μm.
[0079] In one embodiment, the glass substrate 13 has a plurality of through holes 133 that penetrate the first surface 131 and the second surface 132. Furthermore, the first circuit layer 141 located on the first surface 131 and the second circuit layer 142 located on the second surface 132 are electrically connected to each other through the plurality of through holes 133 on the glass substrate 13.
[0080] Please see Figures 3A to 3G , Figures 3A to 3G This is a cross-sectional schematic flowchart illustrating the manufacturing process of the glass substrate structure 10 of the present invention using the method for preventing cracking. The method for manufacturing the glass substrate of the present invention includes the following steps.
[0081] like Figure 3A As shown, a glass substrate 13 is prepared.
[0082] like Figure 3B As shown, a plurality of through holes 133 are formed through the glass substrate 13, and a buffer layer is provided on the surface of the glass substrate 13. In other words, the plurality of through holes 133 are formed through the glass substrate 13, and a first buffer layer 161 is provided on the first surface 131 of the glass substrate 13, and a second buffer layer 162 is provided on the second surface 132 of the glass substrate 13.
[0083] like Figure 3C and Figure 3D As shown, a circuit layer is disposed on the buffer layer. This circuit layer includes a barrier layer that adheres to the glass substrate 13. In other words, a first circuit layer 141 is disposed on the first buffer layer 161, and a second circuit layer 142 is disposed on the second buffer layer 162. The first circuit layer 141 includes a first barrier layer 143, which adheres to the first buffer layer 161. The second circuit layer 142 includes a second barrier layer 144, which adheres to the second buffer layer 162. Both the first circuit layer 141 and the second circuit layer 142 are multi-layered circuit structures. Figures 3C to 3D The process of setting the first circuit layer 141 and the second circuit layer 142 on the glass substrate 13 according to the existing build-up (BU) steps will not be described again here. Preferably, Figure 3D The first circuit layer 141 and the second circuit layer 142, as shown in the diagram, are redistribution layers (RDLs) constructed from copper wires and Ajinomoto Build-up Film (ABF) dielectric material. Furthermore, the first circuit layer 141 located on the first surface 131 and the second circuit layer 142 located on the second surface 132 are electrically connected to each other through a plurality of through-holes 133 in the glass substrate 13.
[0084] like Figure 3E As shown, a dicing channel is etched in the circuit layer to pass through the circuit layer and contact the barrier layer. In other words, a first dicing channel 121 is formed in the first circuit layer 141 and a second dicing channel 122 is formed in the second circuit layer 142, so that the first dicing channel 121 passes through the first circuit layer 141 and contacts the first barrier layer 143, and the second dicing channel 122 passes through the second circuit layer 142 and contacts the second barrier layer 144.
[0085] like Figure 3F As shown, etching removes the barrier layer to form a recessed structure. In other words, a first recessed structure 151 is formed in the space where the first barrier layer 143 is removed by wet etching, and a second recessed structure 152 is formed in the space where the second barrier layer 144 is removed by wet etching. Thus, the first buffer layer 161 originally beneath the first barrier layer 143 and the second buffer layer 162 originally beneath the second barrier layer 144 are exposed.
[0086] like Figure 3GAs shown, a buffer layer exposed in the cutting channel is laser-etched, thereby forming a buffer layer opening and a buffer zone in the buffer layer. In other words, the first buffer layer 161 exposed in the first cutting channel 121 is laser-etched, thereby forming a first buffer layer opening 171 and a first buffer zone 173 in the first buffer layer 161, and the second buffer layer 162 exposed in the second cutting channel 122 is laser-etched, thereby forming a second buffer layer opening 172 and a second buffer zone 174 in the second buffer layer 162. In this way, the first recessed structure 151 connects the first sidewall 123 of the first cutting channel 121 with the first buffer zone 173, and the second recessed structure 152 connects the second sidewall 124 of the second cutting channel 122 with the second buffer zone 174. Figure 3G The structure shown is made using the glass substrate manufacturing method of the present invention to prevent cracking. Figure 1 The glass substrate structure 10 shown is illustrated.
[0087] Furthermore, such as Figure 3G and Figure 2 As shown, the method for manufacturing a crack-preventing glass substrate of the present invention further includes the following steps: cutting the glass substrate 13 exposed in the opening of the buffer layer; in other words, grooving the first surface 131 of the glass substrate 13 exposed in the first buffer layer opening 171, or grooving the second surface 132 of the glass substrate 13 exposed in the second buffer layer opening 172, to divide the crack-preventing glass substrate structure and form as shown in the figure. Figure 2 The glass substrate unit structure 11 shown is illustrated.
Claims
1. A glass substrate structure to prevent cracking, characterized in that, include: A glass substrate having a first surface; A first buffer layer is disposed on the first surface, and the first buffer layer has a first buffer layer opening and a first buffer zone, the first buffer layer opening exposing the first surface of the glass substrate, and the first buffer zone being disposed at the edge of the first buffer layer opening; A first circuit layer is disposed on the first buffer layer; wherein, the first circuit layer includes: First sidewall; A first concave structure is formed concavely from the first sidewall surface, and the first concave structure exposes the first buffer zone.
2. The crack-preventing glass substrate structure according to claim 1, characterized in that, The glass substrate has a second surface relative to the first surface; The crack-preventing glass substrate structure further includes: A second buffer layer is disposed on the second surface, and the second buffer layer has a second buffer layer opening and a second buffer zone, the second buffer layer opening exposing the second surface of the glass substrate, and the second buffer zone being disposed at the edge of the second buffer layer opening; A second circuit layer is disposed on the second buffer layer; wherein the second circuit layer includes: A second side wall; A second concave structure is formed concavely from the second sidewall surface, and the second concave structure exposes the second buffer zone.
3. The crack-preventing glass substrate structure according to claim 1, characterized in that, The first sidewall is a sidewall with a first cutting channel, which penetrates the first circuit layer and connects to the opening of the first buffer layer.
4. The crack-preventing glass substrate structure according to claim 1, characterized in that, The first sidewall surface has a first slope, and the direction of the extension of a horizontal distance of the first slope is parallel to the first surface of the glass substrate; The first concave structure has a concave distance, and the concave distance is greater than the horizontal distance of the first slope.
5. The crack-preventing glass substrate structure according to claim 4, characterized in that, The concave distance is between 250 μm and 300 μm.
6. A method for manufacturing a glass substrate to prevent cracking, characterized in that, Includes the following steps: A first buffer layer is disposed on a first surface of a glass substrate; A first circuit layer is disposed on the first buffer layer, the first circuit layer including a first barrier layer, the first barrier layer being attached to the first buffer layer; A first cutting channel is formed in the first circuit layer, and the first cutting channel passes through the first circuit layer and contacts the first barrier layer. The first barrier layer is wet-etched to form a first concave structure; The first buffer layer is exposed in the first cut channel by photolithography, thereby forming a first buffer layer opening and a first buffer zone in the first buffer layer; wherein the first buffer zone is disposed at the edge of the first buffer layer opening, and the first concave structure exposes the first buffer zone.
7. The method for manufacturing a crack-preventing glass substrate according to claim 6, characterized in that, It also includes the following steps: Cut the glass substrate exposed in the opening of the first buffer layer to segment the glass substrate structure that prevents cracking.
8. The method for manufacturing a crack-preventing glass substrate according to claim 6, characterized in that, The glass substrate has a second surface relative to the first surface, and the method for manufacturing the crack-preventing glass substrate further includes the following steps: A second buffer layer is provided on the second surface of the glass substrate; A second circuit layer is disposed on the second buffer layer, the second circuit layer includes a second barrier layer, and the second barrier layer is attached to the second buffer layer; A second cleaving channel is formed in the second circuit layer, and the second cleaving channel passes through the second circuit layer and contacts the second barrier layer; The second barrier layer is wet-etched to form a second concave structure; The second buffer layer is exposed in the second cut path by photolithography, thereby forming a second buffer layer opening and a second buffer zone in the second buffer layer; wherein the second buffer zone is disposed at the edge of the second buffer layer opening, and the second concave structure exposes the second buffer zone.
9. The method for manufacturing a crack-preventing glass substrate according to claim 6, characterized in that, The first cutting channel has a first sidewall surface, the first sidewall surface has a first slope, and the extension direction of a horizontal distance of the first slope is parallel to the first surface of the glass substrate. The first concave structure is formed in the first sidewall surface, and the first concave structure has a concave distance, which is greater than the horizontal distance of the first slope.
10. The method for manufacturing a crack-preventing glass substrate according to claim 9, characterized in that, The concave distance is between 250 μm and 300 μm.