Circuit board and display module
Patent Information
- Application Number
- CN202510541495.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-04-25
- Publication Date
- 2026-10-27
AI Technical Summary
[0003]有鉴于此，本申请实施例致力于提供一种电路板和显示模组，以解决电路板电磁屏蔽性能差的问题
[0014]本申请的技术方案在电路板中设置至少一层导电层，在导电层的第一侧设置第一电磁屏蔽层，第一电磁屏蔽层与导电层之间设置具有第一孔的第一绝缘层，第一电磁屏蔽层通过填充在第一孔内的第一导电部，与第一绝缘层邻接的导电层的第一接地部电连接，增强电路板的电磁屏蔽性能。在导电层的第二侧，设有与导电层第一侧相对称的电磁屏蔽结构。通过电磁屏蔽层(包括第一电磁屏蔽层和第二电磁屏蔽层)与接地部(包括第一接地部和第二接地部)直接电连接，减少了电磁干扰，提高了电路板的电磁屏蔽性能。
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Figure CN122995006A_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of display technology, and more particularly to a circuit board and a display module. Background Technology
[0002] With the rapid development of modern display devices, the number of integrated functional modules is increasing, with some modules operating at frequencies up to the GHz level. This results in display devices carrying a large amount of electromagnetic signals within a limited space. The internal space of display devices is confined, with various signal lines and electronic components tightly packed together, leading to severe electromagnetic interference. For display modules, the Mobile Industry Processor Interface (MIPI) signal lines on their internal circuit boards are particularly susceptible to electromagnetic interference from other electronic components, and can also easily interfere with other electronic components. However, existing circuit boards have poor electromagnetic shielding performance. Summary of the Invention
[0003] In view of this, the embodiments of this application aim to provide a circuit board and a display module to solve the problem of poor electromagnetic shielding performance of the circuit board.
[0004] A first aspect of this application provides a circuit board comprising: at least one conductive layer, the at least one conductive layer including a first side and a second side disposed opposite to each other; a first electromagnetic shielding layer located on the first side of the conductive layer; a first insulating layer located between the conductive layer and the first electromagnetic shielding layer and adjacent to the first electromagnetic shielding layer, the first insulating layer having a first hole; a conductive layer adjacent to the first insulating layer and having a first ground portion; a first conductive portion filling the first hole, the first conductive portion being electrically connected to the first electromagnetic shielding layer and the first ground portion being electrically connected; a second electromagnetic shielding layer located on the second side of the conductive layer; a second insulating layer located between the conductive layer and the second electromagnetic shielding layer and adjacent to the second electromagnetic shielding layer, the second insulating layer having a second hole; a conductive layer adjacent to the second insulating layer and having a second ground portion; a second conductive portion filling the second hole, the second conductive portion being electrically connected to the second electromagnetic shielding layer and the second ground portion being electrically connected.
[0005] In one embodiment, the material of the first conductive part includes metal, and the material of the second conductive part includes metal; preferably, the material of the first conductive part is copper; preferably, the material of the second conductive part is copper.
[0006] In one embodiment, at least one conductive layer includes: a first conductive layer located between and adjacent to a first insulating layer and a second insulating layer; a second conductive layer located between and adjacent to a second insulating layer; each of the first and second conductive layers has at least one conductive wire; a third insulating layer is provided between the first and second conductive layers; preferably, the material of the third insulating layer includes polyimide; preferably, the material of the first insulating layer includes polyimide; preferably, the material of the second insulating layer includes polyimide.
[0007] In one embodiment, the first electromagnetic shielding layer is located on the side of the first insulating layer away from the first conductive layer; preferably, the first electromagnetic shielding layer is electrically connected to the first grounding portion through the first conductive portion in the first hole; preferably, the first electromagnetic shielding layer is a non-circuit layer, and the first electromagnetic shielding layer is a full-surface copper foil layer; preferably, the thickness of the first electromagnetic shielding layer is greater than or equal to 8 μm and less than or equal to 25 μm.
[0008] In one embodiment, the second electromagnetic shielding layer is located on the side of the second insulating layer away from the second conductive layer; preferably, the second electromagnetic shielding layer is electrically connected to the second grounding portion through the second conductive portion in the second hole; preferably, the second electromagnetic shielding layer is a non-circuit layer, and the second electromagnetic shielding layer is a full-surface copper foil layer; preferably, the thickness of the second electromagnetic shielding layer is greater than or equal to 8 μm and less than or equal to 25 μm.
[0009] In one embodiment, the first electromagnetic shielding layer and the second electromagnetic shielding layer have the same thickness.
[0010] In one embodiment, at least one conductive layer includes multiple conductive layers, with adjacent conductive layers being insulated from each other; preferably, the multiple conductive layers include a third conductive layer located between a third insulating layer and a first conductive layer, and a fourth insulating layer is provided between the first conductive layer and the third conductive layer; the third conductive layer is provided with at least one wire; preferably, the fourth insulating layer is provided with a third hole, through which the wire of the first conductive layer is electrically connected to the third conductive layer, and / or, through which the wire of the third conductive layer is electrically connected to the first conductive layer.
[0011] In one embodiment, the circuit board further includes: a first cover layer located on the side of the first electromagnetic shielding layer opposite to the first conductive layer; and a second cover layer located on the side of the second electromagnetic shielding layer opposite to the second conductive layer; preferably, the first cover layer completely covers the first electromagnetic shielding layer; and preferably, the second cover layer completely covers the second electromagnetic shielding layer.
[0012] In one embodiment, the first grounding portion includes a first extension that protrudes from the first cover layer and is grounded; preferably, the second grounding portion includes a second extension that protrudes from the second cover layer and is grounded.
[0013] A second aspect of this application provides a display module, including a circuit board as mentioned in any of the above embodiments.
[0014] The technical solution of this application includes at least one conductive layer in a circuit board. A first electromagnetic shielding layer is provided on a first side of the conductive layer. A first insulating layer with a first hole is provided between the first electromagnetic shielding layer and the conductive layer. The first electromagnetic shielding layer is electrically connected to a first grounding portion of the conductive layer adjacent to the first insulating layer through a first conductive portion filled in the first hole, thereby enhancing the electromagnetic shielding performance of the circuit board. On the second side of the conductive layer, an electromagnetic shielding structure symmetrical to the first side of the conductive layer is provided. By directly electrically connecting the electromagnetic shielding layer (including the first electromagnetic shielding layer and the second electromagnetic shielding layer) to the grounding portion (including the first grounding portion and the second grounding portion), electromagnetic interference is reduced, and the electromagnetic shielding performance of the circuit board is improved.
[0015] It should be understood that the description in this section is not intended to identify key or essential features of the embodiments of this application, nor is it intended to limit the scope of this application. Other features of this application will become readily apparent from the following description. Attached Figure Description
[0016] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0017] Figure 1 The diagram shown is a schematic diagram of the circuit board provided in one embodiment of this application.
[0018] Figure 2 The image shown is an embodiment provided by this application. Figure 1 A schematic diagram of the cross-sectional structure along section line A-A'.
[0019] Figure 3 The image shown is provided by another embodiment of this application. Figure 1 A schematic diagram of the cross-sectional structure along section line A-A'.
[0020] Figure 4 The diagram shown is a schematic representation of the slicing effect of the first hole provided in an embodiment of this application.
[0021] Figure 5 The image shown is provided in yet another embodiment of this application. Figure 1 A schematic diagram of the cross-sectional structure along section line A-A'.
[0022] Figure 6 The image shown is provided in yet another embodiment of this application. Figure 1A schematic diagram of the cross-sectional structure along section line A-A'.
[0023] Figure 7 The image shown is provided in yet another embodiment of this application. Figure 1 A schematic diagram of the cross-sectional structure along section line A-A'.
[0024] Figure 8 The diagram shown is a schematic diagram of the circuit board provided in another embodiment of this application.
[0025] Figure 9 The image shown is an embodiment provided by this application. Figure 8 A schematic diagram of the cross-sectional structure along section line B-B'. Detailed Implementation
[0026] To enable those skilled in the art to better understand the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present application, and not all embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative effort should fall within the scope of protection of the present application.
[0027] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of this application described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.
[0028] Figure 1 The diagram shown is a schematic diagram of the circuit board provided in one embodiment of this application. Figure 2 The image shown is an embodiment provided by this application. Figure 1 A schematic diagram of the cross-sectional structure along section line A-A'. Figure 3 The image shown is provided by another embodiment of this application. Figure 1 A schematic diagram of the cross-sectional structure along section line A-A'. See also... Figures 1-3The circuit board 100 includes: at least one conductive layer 101, which includes a first side 1011 and a second side 1012 disposed opposite to each other; a first electromagnetic shielding layer 102 located on the first side 1011 of the conductive layer 101; a first insulating layer 103 located between the conductive layer 101 and the first electromagnetic shielding layer 102, and adjacent to the first electromagnetic shielding layer 102, the first insulating layer 103 having a first hole 1031; a conductive layer 101 adjacent to the first insulating layer 103, and having a first ground portion 1013; a first conductive portion 104 filling the first hole 1031, the first conductive portion 104 being electrically connected to the first electromagnetic shielding layer 102, and the first conductive portion 104 being electrically connected to the first ground portion 1013; and a second electromagnetic shielding layer 105 located on the second side 1012 of the conductive layer 101. A second insulating layer 106 is located between and adjacent to the conductive layer 101 and the second electromagnetic shielding layer 105. The second insulating layer 106 has a second hole 1061. A conductive layer 101 is adjacent to the second insulating layer 106 and has a second grounding portion 1014. A second conductive portion 107 fills the second hole 1061, is electrically connected to the second electromagnetic shielding layer 105, and is also electrically connected to the second grounding portion 1014.
[0029] Specifically, the circuit board 100 has at least one conductive layer 101 for transmitting current. A first electromagnetic shielding layer 102 is located on the first side 1011 of the conductive layer 101, used to shield electromagnetic interference and protect the conductive layer 101 from electromagnetic signals. A first insulating layer 103 is located between the conductive layer 101 and the first electromagnetic shielding layer 102, serving as insulation to prevent short circuits between them. The circuit board 100 has a conductive layer 101 adjacent to the first insulating layer 103. This conductive layer 101 has a first grounding portion 1013 for grounding, providing a current loop and enhancing the electromagnetic shielding effect. The first insulating layer 103 has a first hole 1031, and a first conductive portion 104 is a conductive material filled in the first hole 1031, electrically connected to the first electromagnetic shielding layer 102 and the first grounding portion 1013, forming an electrical path.
[0030] The second electromagnetic shielding layer 105 is located on the second side 1012 of the conductive layer 101, corresponding to the first electromagnetic shielding layer 102, and is also used to shield electromagnetic interference. The second insulating layer 106 is located between the conductive layer 101 and the second electromagnetic shielding layer 105, and serves as insulation. The circuit board 100 has a conductive layer 101 adjacent to the second insulating layer 106. The conductive layer 101 has a second grounding portion 1014 for grounding. The second insulating layer 106 has a second hole 1061, which is filled with a second conductive portion 107. The second conductive portion 107 is electrically connected to both the second electromagnetic shielding layer 105 and the second grounding portion 1014, so that the second electromagnetic shielding layer 105 is grounded through the conductive layer 101, thereby enhancing the electromagnetic shielding effect.
[0031] It should be further explained that the adjacency described in this application can be understood as adjacent and in contact. For example, in the embodiment shown, the conductive layer 101 and the first insulating layer 103 are adjacent, which can be understood as the conductive layer 101 and the first insulating layer 103 being disposed adjacently and having a contact surface in direct contact.
[0032] For example, see Figure 2 The circuit board 100 has a conductive layer 101, with its two sides adjacent to a first insulating layer 103 and a second insulating layer 106, respectively. The conductive layer 101 has a first grounding portion 1013 and a second grounding portion 1014. The first grounding portion 1013 is electrically connected to a first electromagnetic shielding layer 102 via a first conductive portion 104, and the second grounding portion 1014 is electrically connected to a second electromagnetic shielding layer 105 via a second conductive portion 107. For example, see [link to example]. Figure 3 The circuit board 100 may have two or more conductive layers 101. A first grounding portion 1013 is disposed on the conductive layer 101 adjacent to the first insulating layer 103, and a second grounding portion 1014 is disposed on the conductive layer 101 adjacent to the second insulating layer 106, so that the first grounding portion 1013 is electrically connected to the first electromagnetic shielding layer 102 through the first conductive portion 104, and the second grounding portion 1014 is electrically connected to the second electromagnetic shielding layer 105 through the second conductive portion 107.
[0033] For example, Figure 4 The diagram shown is a schematic representation of the slicing effect of the first hole according to an embodiment of this application. See also... Figure 4 A first hole 1031 is formed in the first insulating layer 103, and a first conductive part 104 (e.g., copper) is deposited on the hole wall of the first hole 1031 by electroplating technology, so that the first grounding part 1013 is electrically connected to the first electromagnetic shielding layer 102 through the first conductive part 104.
[0034] In related technologies, the electromagnetic shielding layer is electrically connected to the grounding area in the circuit board 100 through a conductive adhesive layer. However, through long-term practice, the inventors have found that the grounding effect between the electromagnetic shielding layer and the grounding area of the circuit board 100 is poor, which affects the electromagnetic shielding effect of the electromagnetic shielding layer.
[0035] In this embodiment, the circuit board 100 has at least one conductive layer 101. A first electromagnetic shielding layer 102 is provided on the first side 1011 of the conductive layer 101. A first insulating layer 103 with a first hole 1031 is provided between the first electromagnetic shielding layer 102 and the conductive layer 101. The first electromagnetic shielding layer 102 is electrically connected to the first grounding portion 1013 of the conductive layer 101 adjacent to the first insulating layer 103 through a first conductive portion 104 filled in the first hole 1031, thereby enhancing the electromagnetic shielding performance of the circuit board 100. On the second side 1012 of the conductive layer 101, an electromagnetic shielding structure symmetrical to the first side 1011 of the conductive layer 101 is provided. By directly electrically connecting the electromagnetic shielding layer (including the first electromagnetic shielding layer 102 and the second electromagnetic shielding layer 105) to the grounding portion (including the first grounding portion 1013 and the second grounding portion 1014), electromagnetic interference is reduced, and the electromagnetic shielding performance of the circuit board 100 is improved.
[0036] In one embodiment, the first conductive portion 104 is made of metal, and the second conductive portion 107 is made of metal. Optionally, the first conductive portion 104 is made of copper. Optionally, the second conductive portion 107 is made of copper.
[0037] Specifically, the material of the first conductive part 104 may include a metallic material, which has good electrical conductivity and can enhance the connection between the first electromagnetic shielding layer 102 and the first grounding part 1013. The material of the second conductive part 107 includes a metallic material, which can enhance the connection between the second electromagnetic shielding layer 105 and the second grounding part 1014.
[0038] In an optional embodiment, the first conductive part 104 is specifically made of copper. Copper is a commonly used conductive material with excellent electrical and thermal conductivity, and is also easy to process and weld.
[0039] In an optional embodiment, the second conductive part 107 is also made of copper, consistent with the first conductive part 104, ensuring uniform and stable electromagnetic shielding performance of the entire circuit board 100. Furthermore, copper has high mechanical strength and stability, which improves the durability and lifespan of the circuit board 100. Copper is widely used in the electronics manufacturing field, its processing technology is mature, and it is easy to achieve mass production, reducing manufacturing costs.
[0040] In related technologies, the electromagnetic shielding layer is grounded through conductive adhesive, which has poor conductivity. The technical solution of this embodiment sets the materials of the first conductive part 104 and the second conductive part 107 to include metal, preferably copper, so that the first conductive part 104 and the second conductive part 107 have excellent conductivity, further enhancing the electrical connection between the first electromagnetic shielding layer 102 and the first grounding part 1013, as well as the second electromagnetic shielding layer 105 and the second grounding part 1014, and further improving the electromagnetic shielding performance of the circuit board 100.
[0041] Figure 5 The image shown is provided in yet another embodiment of this application. Figure 1 A schematic diagram of the cross-sectional structure along section line A-A'. (See diagram below.) Figure 5 As shown, at least one conductive layer 101 includes: a first conductive layer 1015, located between and adjacent to the first insulating layer 103 and the second insulating layer 106; and a second conductive layer 1016, located between and adjacent to the second insulating layer 106. Both the first conductive layer 1015 and the second conductive layer 1016 have at least one conductive wire, and a third insulating layer 108 is provided between the first conductive layer 1015 and the second conductive layer 1016. Optionally, the material of the third insulating layer 108 includes polyimide. Optionally, the material of the first insulating layer 103 includes polyimide. Optionally, the material of the second insulating layer 106 includes polyimide.
[0042] Specifically, the first conductive layer 1015 is located between the first insulating layer 103 and the second insulating layer 106, and is directly adjacent to the first insulating layer 103. At least one signal line is provided on the first conductive layer 1015 for transmitting current signals. Exemplarily, the first conductive layer 1015 has a complex circuit composed of multiple signal lines. These signal lines are fine and dense, and are electrically isolated from each other by tiny insulating gaps, ensuring the stability and reliability of signal transmission. Optionally, these signal lines are made of a highly conductive metal material, such as copper or silver, to reduce resistance and loss during signal transmission. Optionally, a reinforced conductive coating or metal vias are also provided in specific areas of the first conductive layer 1015 to provide additional electrical connections and heat dissipation channels. This structure not only enhances the mechanical strength of the circuit but also improves its thermal management performance, ensuring that the first conductive layer 1015 can still operate stably in high-temperature or high-power applications. The first conductive layer 1015 is also provided with a first grounding part 1013. The first electromagnetic shielding layer 102 is electrically connected to the first grounding part 1013 provided in the first conductive layer 1015. The charge accumulated by the wires in the first conductive layer 1015 due to friction or leakage can be conducted to the first electromagnetic shielding layer 102 and released, thereby grounding to protect against static electricity.
[0043] The second conductive layer 1016 is located between the first conductive layer 1015 and the second insulating layer 106, and is directly adjacent to the second insulating layer 106. The second conductive layer 1016 also has at least one signal line for transmitting current signals. Exemplarily, the second conductive layer 1016 can also have a complex circuit composed of multiple signal lines. The second conductive layer 1016 also has a second grounding portion 1014. The second electromagnetic shielding layer 105 is electrically connected to the second grounding portion 1014 of the second conductive layer 1016. Charge accumulated in the wires of the second conductive layer 1016 due to friction or leakage can be conducted to the second electromagnetic shielding layer 105 and released, thereby providing grounding to protect against static electricity.
[0044] A third insulating layer 108 is disposed between the first conductive layer 1015 and the second conductive layer 1016 to provide insulation and prevent short circuits between the first conductive layer 1015 and the second conductive layer 1016. Exemplarily, the material of the third insulating layer 108 can be polyimide. Polyimide is a high-performance insulating material with excellent electrical insulation properties, thermal stability, and mechanical strength. In some optional embodiments, the first insulating layer 103 can also be made of polyimide. In other optional embodiments, the second insulating layer 106 can be made of polyimide.
[0045] The technical solution of this embodiment enhances electromagnetic shielding performance by setting the first conductive layer 1015 adjacent to the first insulating layer 103, and the second conductive layer 1016 adjacent to the second insulating layer 106. The first electromagnetic shielding layer 102 is electrically connected to the first ground portion 1013 of the first conductive layer 1015, and the second electromagnetic shielding layer 105 is electrically connected to the second ground portion 1014 of the second conductive layer 1016. At least one conductor is provided on both the first conductive layer 1015 and the second conductive layer 1016 for electrical connection and signal transmission of the circuit board 100. The first conductive layer 1015 and the second conductive layer 1016 are insulated from each other by a third insulating layer 108. Polyimide can be selected as the insulating material; the excellent insulating properties of polyimide ensure electrical isolation between layers and reduce the risk of short circuits.
[0046] In one embodiment, the first electromagnetic shielding layer 102 is located on the side of the first insulating layer 103 opposite to the first conductive layer 1015. Optionally, the first electromagnetic shielding layer 102 is electrically connected to the first grounding portion 1013 through the first conductive portion 104 within the first hole 1031. Optionally, the first electromagnetic shielding layer 102 is a non-circuit layer, or it is a full-surface copper foil layer. Optionally, the thickness of the first electromagnetic shielding layer 102 is greater than or equal to 8 μm and less than or equal to 25 μm.
[0047] Specifically, the first electromagnetic shielding layer 102 is disposed on the side of the first insulating layer 103 away from the first conductive layer 1015, effectively isolating the first electromagnetic shielding layer 102 from the first conductive layer 1015. The first grounding portion 1013 is disposed on the first conductive layer 1015, and the first electromagnetic shielding layer 102 is electrically connected to the first grounding portion 1013 through the first conductive portion 104 within the first hole 1031, ensuring that the first electromagnetic shielding layer 102 can effectively guide electromagnetic interference signals to the ground. The first electromagnetic shielding layer 102 does not have any wiring; instead, it is a single sheet of copper foil, providing better electromagnetic shielding. In related technologies, electromagnetic shielding layers include metal layers with a thickness typically between 2µm and 3µm, resulting in poor electromagnetic shielding performance. In this embodiment, the thickness of the first electromagnetic shielding layer 102 is greater than or equal to 8µm and less than or equal to 25µm, for example, 8µm, 10µm, 15µm, or 25µm, ensuring sufficient shielding without excessively increasing the weight and cost of the circuit board 100.
[0048] The technical solution of this embodiment sets a first electromagnetic shielding layer 102 on the side of the first insulating layer 103 opposite to the first conductive layer 1015, so that it is electrically connected to the first grounding portion 1013 on the first conductive layer 1015 through the first conductive portion 104. By setting the first electromagnetic shielding layer 102 to be a whole copper foil, and its thickness controlled between 8um and 25um, the electromagnetic shielding performance of the circuit board 100 is further improved.
[0049] In one embodiment, the second electromagnetic shielding layer 105 is located on the side of the second insulating layer 106 opposite to the second conductive layer 1016. Optionally, the second electromagnetic shielding layer 105 is electrically connected to the second grounding portion 1014 through the second conductive portion 107 within the second hole 1061. Optionally, the second electromagnetic shielding layer 105 is a non-circuit layer, or a full-surface copper foil layer. Optionally, the thickness of the second electromagnetic shielding layer 105 is greater than or equal to 8 μm and less than or equal to 25 μm.
[0050] Specifically, the second electromagnetic shielding layer 105 is disposed on the side of the second insulating layer 106 away from the second conductive layer 1016, effectively isolating the second electromagnetic shielding layer 105 from the second conductive layer 1016. The second grounding portion 1014 is disposed on the second conductive layer 1016, and the second electromagnetic shielding layer 105 is electrically connected to the second grounding portion 1014 through the second conductive portion 107 within the second hole 1061, ensuring that the second electromagnetic shielding layer 105 can effectively guide electromagnetic interference signals to the ground. The second electromagnetic shielding layer 105 does not have any wiring; instead, it is a single sheet of copper foil, providing better electromagnetic shielding. The thickness of the second electromagnetic shielding layer 105 is greater than or equal to 8 μm and less than or equal to 25 μm, for example, 8 μm, 10 μm, 15 μm, 25 μm, etc., ensuring sufficient shielding effect without excessively increasing the weight and cost of the circuit board 100.
[0051] The technical solution of this embodiment provides a second electromagnetic shielding layer 105 on the side of the second insulating layer 106 opposite to the second conductive layer 1016, allowing it to be electrically connected to the second grounding portion 1014 on the second conductive layer 1016 via the second conductive portion 107. By providing the second electromagnetic shielding layer 105 as a single-sided copper foil with a thickness controlled between 8µm and 25µm, the electromagnetic shielding performance of the circuit board 100 is further improved.
[0052] In an optional embodiment, the first electromagnetic shielding layer 102 and the second electromagnetic shielding layer 105 have the same thickness and are distributed on both sides of the circuit board 100, providing a uniform electromagnetic shielding effect. For example, both the first electromagnetic shielding layer 102 and the second electromagnetic shielding layer 105 are made of copper foil with a thickness of 15 μm. The design of the first electromagnetic shielding layer 102 and the second electromagnetic shielding layer 105 with the same thickness simplifies the design process of the circuit board 100, reduces manufacturing complexity, and helps to improve the overall reliability and consistency of the circuit board 100.
[0053] In one optional embodiment, the circuit board 100 can be a flexible circuit board. The thickness of the first electromagnetic shielding layer 102 and the second electromagnetic shielding layer 105 can be calculated according to the material and electrostatic protection requirements. The thickness should be minimized as much as possible while ensuring the electromagnetic shielding effect and maintaining its integrity during production and use, so as to reduce the impact on the bending of the flexible circuit board and correspondingly reduce the overall thickness of the circuit board 100. This application does not impose specific limitations in this regard.
[0054] Figure 6 The image shown is provided in yet another embodiment of this application. Figure 1 A schematic diagram of the cross-sectional structure along section line A-A'. (See diagram below.) Figure 6As shown, at least one conductive layer 101 includes multiple conductive layers 101, with adjacent conductive layers 101 being insulated from each other. Optionally, the multiple conductive layers 101 include a third conductive layer 1017 located between a third insulating layer 108 and a first conductive layer 1015, and a fourth insulating layer 109 is provided between the first conductive layer 1015 and the third conductive layer 1017. The third conductive layer 1017 has at least one conductor. Optionally, the fourth insulating layer 109 has a third hole 1091, through which the conductor of the first conductive layer 1015 is electrically connected to the third conductive layer 1017, and / or, the conductor of the third conductive layer 1017 is electrically connected to the first conductive layer 1015 through the third hole 1091.
[0055] For example, the circuit board 100 is provided with multiple (i.e., two or more) conductive layers 101, with adjacent conductive layers 101 insulated from each other. Insulation means that adjacent conductive layers 101 are separated by insulating material to prevent direct current flow. For example, in addition to the first conductive layer 1015 and the second conductive layer 1016, the multi-layer conductive layers 101 also include a third conductive layer 1017. The third conductive layer 1017 is located between the third insulating layer 108 and the first conductive layer 1015, and a fourth insulating layer 109 is provided between the first conductive layer 1015 and the third conductive layer 1017. At least one wire is arranged on the third conductive layer 1017, which can be a single signal line or a complex circuit composed of multiple signal lines, for current transmission. The fourth insulating layer 109 has a third hole 1091 for realizing electrical connection between different conductive layers 101. For example, a conductor on the first conductive layer 1015 is electrically connected to the third conductive layer 1017 through a third hole 1091, and similarly, a conductor on the third conductive layer 1017 is electrically connected to the first conductive layer 1015 through a third hole 1091. Exemplarily, in a multilayer circuit board 100, a conductor on the first conductive layer 1015 is electrically connected to a corresponding conductor on the third conductive layer 1017 through a third hole 1091.
[0056] The technical solution of this embodiment provides multiple conductive layers 101 in the circuit board 100 and ensures insulation between adjacent conductive layers 101. The design of multiple conductive layers 101 allows for the arrangement of more circuits in a limited space, thereby increasing the circuit density of the circuit board 100 and facilitating the design of complex circuits. Optionally, a third conductive layer 1017 is provided, on which at least one wire is laid to further realize the electrical connection function of the circuit board 100. By opening a hole in the fourth insulating layer 109 between the third conductive layer 1017 and the first conductive layer 1015, the wires of the third conductive layer 1017 and the wires of the first conductive layer 1015 are electrically connected, simplifying the signal line interconnection process, helping to reduce electromagnetic interference, and also reducing manufacturing difficulty.
[0057] Figure 7The image shown is provided in yet another embodiment of this application. Figure 1 A schematic diagram of the cross-sectional structure along section line A-A'. (See diagram below.) Figure 7 As shown, the circuit board 100 further includes: a first cover layer 110 located on the side of the first electromagnetic shielding layer 102 opposite to the first conductive layer 1015; and a second cover layer 111 located on the side of the second electromagnetic shielding layer 105 opposite to the second conductive layer 1016. Optionally, the first cover layer 110 completely covers the first electromagnetic shielding layer 102. Optionally, the second cover layer 111 completely covers the second electromagnetic shielding layer 105.
[0058] Specifically, the first cover layer 110 is located on the side of the first electromagnetic shielding layer 102 opposite to the first conductive layer 1015, that is, it covers the first electromagnetic shielding layer 102 and does not directly contact the first conductive layer 1015. The second cover layer 111 is located on the side of the second electromagnetic shielding layer 105 opposite to the second conductive layer 1016, that is, it covers the second electromagnetic shielding layer 105 and does not directly contact the second conductive layer 1016. The first cover layer 110 and the second cover layer 111 are used to protect the conductive layer 101 in the circuit board. The materials of the first cover layer 110 and the second cover layer 111 can be organic insulating materials, such as polyimide. Polyimide has high light transmittance and a thin film layer, so when applied in the field of optoelectronic display, it will not affect the light output of the display module.
[0059] In an optional embodiment, the first covering layer 110 can completely cover the first electromagnetic shielding layer 102, the portion of the first electromagnetic shielding layer 102 that is not exposed.
[0060] In an alternative embodiment, the second cover layer 111 completely covers the second electromagnetic shielding layer 105, ensuring that no part of the entire second electromagnetic shielding layer 105 is exposed.
[0061] In one embodiment, for example, the first electromagnetic shielding layer 102 and the second electromagnetic shielding layer 105 are completely covered by the first cover layer 110 and the second cover layer 111, respectively. The first cover layer 110 and the second cover layer 111 may be made of heat-resistant and insulating materials, such as epoxy resin or polyimide.
[0062] The technical solution of this embodiment provides a protective barrier by setting a first cover layer 110 on the side of the first electromagnetic shielding layer 102 opposite to the first conductive layer 1015, and setting a second cover layer 111 on the side of the second electromagnetic shielding layer 105 opposite to the second conductive layer 1016, thereby further blocking external electromagnetic interference and enhancing the electromagnetic shielding performance of the circuit board 100. Optionally, the cover layer (including the first cover layer 110 and the second cover layer 111) completely covers the electromagnetic shielding layer (including the first electromagnetic shielding layer 102 and the second electromagnetic shielding layer 105), protecting the electromagnetic shielding layer (including the first electromagnetic shielding layer 102 and the second electromagnetic shielding layer 105) from physical damage, chemical corrosion, and environmental pollution, thereby improving the durability and reliability of the circuit board 100. By reducing electromagnetic interference and providing better protection, the overall electrical performance and stability of the circuit board 100 are improved.
[0063] Figure 8 The diagram shown is a schematic diagram of the circuit board provided in another embodiment of this application. Figure 9 The image shown is an embodiment provided by this application. Figure 8 A schematic diagram of the cross-sectional structure along section line B-B'. See also... Figure 8 and Figure 9 The first grounding portion 1013 includes a first extension 1013-1, which protrudes from the first cover layer 110 and is grounded. Optionally, the second grounding portion 1014 includes a second extension 1014-1, which protrudes from the second cover layer 111 and is grounded.
[0064] Specifically, the first extension 1013-1 is a portion of the first grounding portion 1013 extending away from the contact portion between the conductive layer 101 and the first insulating layer 103. The first extension 1013-1 protrudes from the first cover layer 110 and is exposed outside the first cover layer 110. It is used for grounding to ensure a good electrical connection between the conductive layer 101 adjacent to the first insulating layer 103 in the circuit board 100 and the ground, thereby ensuring a good electrical connection between the first electromagnetic shielding layer 102 and the ground. In an optional embodiment, the second grounding portion 1014 also includes a portion extending away from the contact portion between the conductive layer 101 and the second insulating layer 103, namely the second extension 1014-1. The second extension 1014-1 protrudes from the second cover layer 111, exposed outside the second cover layer 111, and is used for grounding. This ensures a good electrical connection between the conductive layer 101 adjacent to the second insulating layer 106 in the circuit board 100 and ground, thereby ensuring a good electrical connection between the second electromagnetic shielding layer 105 and ground. This arrangement helps to further enhance the electromagnetic shielding performance of the circuit board 100. The extension distance between the first extension 1013-1 and the second extension 1014-1 can be reasonably set according to actual needs. For example, in a multilayer circuit board 100, the first grounding portion 1013 and the second grounding portion 1014 are located in different conductive layers 101 of the circuit board 100, respectively. The first grounding portion 1013 is exposed outside the first cover layer 110 through a protruding metal piece (first extension 1013-1) and is connected to an external grounding device. Similarly, the second grounding portion 1014 is also exposed outside the second cover layer 111 through a protruding metal piece (second extension 1014-1) and is connected to an external grounding device.
[0065] For example, in the thickness direction of the circuit board 100, the first extension 1013-1 and the second extension 1014-1 are located on the same side of the first hole 1031; or, in the thickness direction of the circuit board 100, the first extension 1013-1 and the second extension 1014-1 are located on opposite sides of the first hole 1031. This application does not limit the specific location of the extensions (including the first extension 1013-1 and the second extension 1014-1).
[0066] The technical solution of this embodiment improves grounding reliability by providing a first extension 1013-1 and a second extension 1014-1 on the first grounding portion 1013 and the second grounding portion 1014, respectively. The first extension 1013-1 protrudes from the first covering layer 110 for grounding, and the second extension 1014-1 protrudes from the second covering layer 111 for grounding. Effective grounding reduces electromagnetic interference on the circuit board 100, enhances electromagnetic shielding performance, and facilitates stable operation of the circuit board 100.
[0067] This application also provides a display module, which includes the circuit board 100 mentioned in any of the above embodiments. Its technical principle and the effect produced are similar, and will not be described again here.
[0068] The embodiments described above are not exhaustive, nor do they limit the application to the specific embodiments described herein. Clearly, many modifications and variations can be made based on the above description. These embodiments are selected and specifically described in this specification to better explain the principles and practical applications of this application, thereby enabling those skilled in the art to effectively utilize this application and its modifications. This application is limited only by the claims and their full scope and equivalents.
[0069] It should be understood that the various forms of processes shown above can be used to rearrange, add, or delete steps. For example, the steps described in this application can be executed in parallel, sequentially, or in different orders, as long as the desired result of the technical solution of this application can be achieved, and this is not limited herein.
[0070] The specific embodiments described above do not constitute a limitation on the scope of protection of this application. Those skilled in the art should understand that various modifications, combinations, sub-combinations, and substitutions can be made according to design requirements and other factors. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the scope of protection of this application.
Claims
1. A circuit board, characterized in that, include: At least one conductive layer, the at least one conductive layer comprising a first side and a second side disposed opposite to each other; A first electromagnetic shielding layer is located on the first side of the conductive layer; A first insulating layer is located between the conductive layer and the first electromagnetic shielding layer, and is adjacent to the first electromagnetic shielding layer. The first insulating layer has a first hole. A conductive layer is adjacent to the first insulating layer and has a first grounding portion. A first conductive portion, the first conductive portion filling the first hole, the first conductive portion being electrically connected to the first electromagnetic shielding layer, and the first conductive portion being electrically connected to the first grounding portion; The second electromagnetic shielding layer is located on the second side of the conductive layer; The second insulating layer is located between the conductive layer and the second electromagnetic shielding layer, and is adjacent to the second electromagnetic shielding layer. The second insulating layer has a second hole. The first conductive layer is adjacent to the second insulating layer and is provided with a second grounding portion; The second conductive part fills the second hole, the second conductive part is electrically connected to the second electromagnetic shielding layer, and the second conductive part is electrically connected to the second grounding part.
2. The circuit board according to claim 1, characterized in that, The material of the first conductive part includes metal, and the material of the second conductive part includes metal; Preferably, the material of the first conductive part is copper; Preferably, the material of the second conductive part is copper.
3. The circuit board according to claim 1, characterized in that, The at least one conductive layer includes: A first conductive layer is located between the first insulating layer and the second insulating layer, and is adjacent to the first insulating layer; The second conductive layer is located between the first conductive layer and the second insulating layer, and is adjacent to the second insulating layer; both the first conductive layer and the second conductive layer are provided with at least one wire, and a third insulating layer is provided between the first conductive layer and the second conductive layer; Preferably, the material of the third insulating layer includes polyimide; Preferably, the material of the first insulating layer includes polyimide; Preferably, the material of the second insulating layer includes polyimide.
4. The circuit board according to claim 3, characterized in that, The first electromagnetic shielding layer is located on the side of the first insulating layer that is opposite to the first conductive layer; Preferably, the first electromagnetic shielding layer is electrically connected to the first grounding portion through the first conductive portion inside the first hole; Preferably, the first electromagnetic shielding layer is a non-circuit layer, and the first electromagnetic shielding layer is a full-surface copper foil layer; Preferably, the thickness of the first electromagnetic shielding layer is greater than or equal to 8 μm and less than or equal to 25 μm.
5. The circuit board according to claim 3, characterized in that, The second electromagnetic shielding layer is located on the side of the second insulating layer that is away from the second conductive layer; Preferably, the second electromagnetic shielding layer is electrically connected to the second grounding portion through the second conductive portion within the second hole; Preferably, the second electromagnetic shielding layer is a non-circuit layer, and the second electromagnetic shielding layer is a full-surface copper foil layer; Preferably, the thickness of the second electromagnetic shielding layer is greater than or equal to 8 μm and less than or equal to 25 μm.
6. The circuit board according to claim 1, characterized in that, The first electromagnetic shielding layer and the second electromagnetic shielding layer have the same thickness.
7. The circuit board according to claim 3, characterized in that, The at least one conductive layer includes multiple conductive layers, and adjacent conductive layers are insulated from each other. Preferably, the multilayer conductive layer includes a third conductive layer located between the third insulating layer and the first conductive layer, and a fourth insulating layer is provided between the first conductive layer and the third conductive layer; the third conductive layer is provided with at least one wire; Preferably, the fourth insulating layer has a third hole, through which the wires of the first conductive layer are electrically connected to the third conductive layer, and / or, through which the wires of the third conductive layer are electrically connected to the first conductive layer.
8. The circuit board according to claim 3, characterized in that, Also includes: The first covering layer is located on the side of the first electromagnetic shielding layer that is away from the first conductive layer; The second covering layer is located on the side of the second electromagnetic shielding layer that is away from the second conductive layer; Preferably, the first covering layer completely covers the first electromagnetic shielding layer; Preferably, the second covering layer completely covers the second electromagnetic shielding layer.
9. The circuit board according to claim 8, characterized in that, The first grounding portion includes a first extension portion that protrudes from the first covering layer and is grounded; Preferably, the second grounding portion includes a second extension portion that protrudes from the second covering layer and is grounded.
10. A display module, characterized in that, include: The circuit board according to any one of claims 1 to 9.