Assembly sheet

Abstract

The assembly sheet has a wiring circuit substrate and a frame that supports the wiring circuit substrate. The wiring circuit substrate has a metal support layer, a first insulating layer, and a circuit pattern. The frame has a first metal layer that contains the same material as the metal support layer, a first resin layer that contains the same material as the first insulating layer, and a second metal layer that contains the same material as the terminal. The first insulating layer has a first portion that is disposed between the metal support layer and the terminal. The thickness of the first resin layer is thicker than the thickness of the first portion. In the thickness direction of the wiring circuit substrate, one side surface of the frame is disposed at a position that is closer to one side than one side surface of the terminal.

Description

Technical Field

[0001] This invention relates to composite sheet materials. Background Technology

[0002] Previously, a wiring circuit board assembly sheet was known, which included a metal substrate, a wiring circuit structure portion, and a dummy structure portion (for example, see Patent Document 1 below).

[0003] The dummy structure includes a dummy conductor layer and an insulating layer. The dummy conductor layer has the same layer structure as the terminal portion, and the insulating layer covers the dummy conductor layer. Corresponding to the insulating layer covering the dummy conductor layer, the height of the dummy structure is higher than that of the terminal portion of the wiring circuit structure. Therefore, damage to the terminal portion can be suppressed by the dummy structure.

[0004] Prior art literature Patent documents Patent Document 1: Japanese Patent Application Publication No. 2021-150625 Summary of the Invention The problem that the invention aims to solve In the composite sheet described in Patent Document 1, the difference between the height of the dummy structure portion and the height of the terminal portion is only the thickness of the insulating layer covering the dummy conductor layer, so the suppression of damage to the terminal may be insufficient.

[0005] The present invention provides an assembly sheet that can more reliably suppress terminal damage.

[0006] Technical solutions for solving the problem The present invention [1] includes an assembly sheet comprising: a wiring circuit board having a metal support layer, a first insulating layer disposed on the metal support layer and a circuit pattern having terminals and disposed on the first insulating layer; and a frame supporting the wiring circuit board and having: a first metal layer comprising the same material as the metal support layer, a first resin layer disposed on the first metal layer and comprising the same material as the first insulating layer, and a second metal layer disposed on the first resin layer and comprising the same material as the terminals, the first insulating layer having a first portion disposed between the metal support layer and the terminals, the thickness of the first resin layer of the frame being greater than the thickness of the first portion, and one side surface of the frame being disposed further to one side than one side surface of the terminals in the thickness direction of the wiring circuit board.

[0007] According to this structure, the thickness of the first resin layer of the frame is greater than the thickness of the first part.

[0008] Therefore, the thickness of the first resin layer can be used to position the second metal layer of the frame further to one side than the terminals of the wiring circuit board.

[0009] Thus, one side surface of the frame is reliably positioned further to the side than one side surface of the terminal.

[0010] Therefore, for example, in the case of conveying composite sheets, the frame can be used to prevent the conveying rollers from contacting the terminals.

[0011] As a result, damage to the terminals can be suppressed more reliably.

[0012] The present invention [2] includes the assembly sheet of [1] above, wherein the circuit pattern has wiring, and the first insulating layer has a second portion disposed between the wiring and the metal support layer, the second portion being thicker than the first portion.

[0013] This structure ensures the rigidity of the wiring portion in the wiring circuit board.

[0014] The present invention [3] includes the assembly sheet of [1] above, wherein the circuit pattern has: a first wiring having a first thickness; and a second wiring having a second thickness greater than the first thickness, the first insulating layer having a second portion disposed between at least one of the first wiring and the second wiring and the metal support layer, the second portion being thicker than the first portion.

[0015] With this structure, the rigidity of at least one of the portion of the wiring circuit board in which the first wiring is arranged and the portion in which the second wiring is arranged can be ensured.

[0016] The present invention [4] includes the assembly sheet of [1] above, wherein the circuit pattern has wiring, the first insulating layer has a second portion disposed between the wiring and the metal support layer, the thickness of the first portion being greater than the thickness of the second portion.

[0017] With this structure, by making the first part thicker, the terminals can be configured separately from the metal support layer.

[0018] Therefore, it is possible to reduce the impedance of the terminals.

[0019] The present invention [5] includes the assembly sheet of [1] above, wherein the circuit pattern has wiring, the wiring having a central portion and an end portion in the width direction of the wiring, the central portion protruding in the thickness direction relative to the first insulating layer toward the side opposite to the metal support layer compared to the end portion.

[0020] With this structure, the cross-sectional area of ​​the wiring can be increased without excessively increasing the width of the wiring by protruding the central part.

[0021] As a result, the resistance of the wiring can be reduced.

[0022] The present invention [6] includes an assembly sheet of any one of [1] to [5] above, wherein the terminal has: a first conductor layer disposed on the first portion; and a second conductor layer disposed on the first conductor layer, the second metal layer having: a first layer disposed on the first resin layer and comprising the same material as the first conductor layer; and a second layer disposed on the first layer and comprising the same material as the second conductor layer.

[0023] According to this structure, a first layer of the second metal layer can be formed together with the first conductor layer of the terminal, and a second layer of the second metal layer can be formed together with the second conductor layer of the terminal.

[0024] Therefore, by utilizing the terminal forming process, the second metal layer can be formed without increasing the processing time.

[0025] The present invention [7] includes an assembly sheet of any one of [1] to [6] above, wherein the circuit pattern has wiring, the wiring circuit substrate further includes a second insulating layer disposed on the first insulating layer and covering the wiring, and the frame further includes: a second resin layer disposed on the first resin layer, covering the second metal layer, and comprising the same material as the second insulating layer.

[0026] Based on this structure, a second resin layer can be formed together with the second insulating layer.

[0027] Therefore, by utilizing the process of forming the second insulating layer, the second resin layer can be formed without increasing the processing time.

[0028] Invention Effects The composite sheet according to the present invention can more reliably suppress damage to the terminals. Attached Figure Description

[0029] Figure 1 This is a top view showing one embodiment of the composite sheet of the present invention.

[0030] Figure 2 yes Figure 1 The AA section view of the assembled sheet material shown.

[0031] Figures 3A-3C It means Figure 2 The diagram shows the manufacturing process of the assembled sheet material. Figure 3AThis refers to the process of exposing the photosensitive resin coating during the first insulating layer formation process. Figure 3B This refers to the process of developing the exposed photosensitive resin coating in the first insulating layer formation process. Figure 3C This indicates the first conductor pattern formation process.

[0032] Figure 4A and Figure 4B It continues Figure 3C A process diagram showing the manufacturing process of an assembly of sheet materials. Figure 4A This indicates the second conductor pattern formation process. Figure 4B This indicates the process of forming the second insulating layer.

[0033] Figure 5 This is a cross-sectional view of the composite sheet material of variation example (1).

[0034] Figure 6 This is a top view of the composite sheet material of variation example (2).

[0035] Figure 7A yes Figure 6 The shown is a BB cross-sectional view of the assembled sheet material. Figure 7B yes Figure 6 The shown is a CC cross-sectional view of the assembled sheet material.

[0036] Figure 8 This is a cross-sectional view of the composite sheet material of variant example (3), which is equivalent to Figure 6 A cross-sectional view of the assembly sheet along the CC line.

[0037] Figure 9 This is a cross-sectional view of the composite sheet material of variant example (4), which is equivalent to Figure 6 A cross-sectional view of the assembly sheet along the CC line.

[0038] Figure 10A and Figure 10B These are cross-sectional views of the composite sheet material of variant example (5). Figure 10A It is equivalent to Figure 6 The cross-sectional view of the sheet assembly shown is along the BB line. Figure 10B It is equivalent to Figure 6 A cross-sectional view of the assembly sheet along the CC line.

[0039] Figure 11 This is a cross-sectional view of the composite sheet material of variant example (6), which is equivalent to Figure 6 A cross-sectional view of the assembly sheet along the CC line.

[0040] Figure 12A and Figure 12BThis is an explanatory diagram illustrating the first insulating layer formation process in a modified example (modified example (7)) of the manufacturing method of a wiring circuit board. Figure 12A Indicates the first process. Figure 12B This indicates the second process. Detailed Implementation

[0041] 1. Composite sheet like Figure 1 As shown, the assembly sheet 1 extends along both the width and flow directions. The assembly sheet 1 has a sheet shape. The flow direction is orthogonal to the width direction. The assembly sheet 1 includes a frame 3 and multiple wiring circuit boards 2.

[0042] (1) Wiring circuit board Multiple wiring circuit boards 2 are arranged at intervals in the width direction and at intervals in the flow direction. Each of the multiple wiring circuit boards 2 has the same structure. Therefore, only one wiring circuit board 2 will be described, and the description of the other wiring circuit boards 2 will be omitted.

[0043] The wiring circuit board 2 extends along both the width and flow directions. In this embodiment, the wiring circuit board 2 has a generally rectangular shape. However, the shape of the wiring circuit board 2 is not limited.

[0044] like Figure 2 As shown, the wiring circuit board 2 has a metal support layer 21, a first insulating layer 22, a circuit pattern 23, and a second insulating layer 24.

[0045] (1-1) Metal support layer The metal support layer 21 supports the first insulating layer 22, the circuit pattern 23, and the second insulating layer 24. Materials for the metal support layer 21 include, for example, stainless steel and copper alloys.

[0046] Furthermore, the metal support layer 21 may also have a protective metal layer (not shown). The protective metal layer is disposed on one side surface of the metal support layer 21 in the thickness direction of the wiring circuit board 2. The thickness direction is orthogonal to the width direction and the flow direction. The protective metal layer protects the metal support layer 21 from the influence of the first insulating layer 22. Examples of materials for the protective metal layer include chromium, nickel, titanium, and alloys thereof. The protective metal layer is preferably made of chromium.

[0047] (1-2) First insulating layer A first insulating layer 22 is disposed on one side of the metal support layer 21 in the thickness direction. The first insulating layer 22 is disposed on the metal support layer 21. The first insulating layer 22 is disposed between the metal support layer 21 and the circuit pattern 23 in the thickness direction. The first insulating layer 22 insulates the metal support layer 21 from the circuit pattern 23. The first insulating layer 22 comprises a transparent resin. Examples of resins include polyimide, maleimide, epoxy resin, polybenzoxazole, and polyester. Preferably, the first insulating layer 22 is made of polyimide.

[0048] The first insulating layer 22 has a first portion 221 and a second portion 222. The first portion 221 is disposed between the metal support layer 21 and the terminal 231. The second portion 222 is disposed between the wiring 232 and the metal support layer 21. The terminal 231 and the wiring 232 will be described later. In this embodiment, the thickness T2 of the second portion 222 is the same as the thickness T1 of the first portion 221.

[0049] Furthermore, in this invention, "identical" allows for dimensional errors that are unavoidable in manufacturing. That is, even if the thickness T2 is slightly different from the thickness T1, as long as it is within the range of dimensional errors that are unavoidable in manufacturing, the thickness T2 and the thickness T1 are "identical".

[0050] (1-3) Circuit diagram The circuit pattern 23 is disposed on one side of the first insulating layer 22 in the thickness direction. The circuit pattern 23 is disposed on the first insulating layer 22. The circuit pattern 23 is disposed on the side opposite to the metal support layer 21 in the thickness direction relative to the first insulating layer 22. The circuit pattern 23 has terminals 231 and wiring 232.

[0051] Terminal 231 has, for example, a square pad shape. In this embodiment, terminal 231 has a first conductor layer 2311 and a second conductor layer 2312.

[0052] A first conductor layer 2311 is disposed on the first portion 221. Examples of materials for the first conductor layer 2311 include copper, silver, gold, iron, aluminum, chromium, and alloys thereof. The first conductor layer 2311 is preferably made of copper.

[0053] The second conductor layer 2312 is disposed on the first conductor layer 2311. The material of the second conductor layer 2312 can be, for example, the same material as the first conductor layer 2311. Preferably, the second conductor layer 2312 is made of the same material as the first conductor layer 2311.

[0054] Wiring 232 is disposed on the second portion 222. Wiring 232 is connected to terminal 231. In this embodiment, wiring 232 is connected to the first conductor layer 2311 of terminal 231. As the material of wiring 232, for example, the same material as the first conductor layer 2311 of terminal 231 can be used. Wiring 232 is preferably made of the same material as the first conductor layer 2311 of terminal 231. The thickness of wiring 232 is the same as the thickness of the first conductor layer 2311 of terminal 231.

[0055] Furthermore, the circuit pattern 23 may also have a seed layer (not shown). The seed layer is disposed on the other side surface of the circuit pattern 23 in the thickness direction of the wiring circuit substrate 2. The seed layer protects the circuit pattern 23 from the influence of the first insulating layer 22. Examples of materials for the seed layer include chromium, nickel, titanium, and alloys thereof. The seed layer is preferably made of chromium.

[0056] (1-4) Second insulating layer The second insulating layer 24 is disposed on one side of the first insulating layer 22 in the thickness direction. The second insulating layer 24 is disposed on the first insulating layer 22. The second insulating layer 24 covers the wiring 232. The second insulating layer 24 does not cover at least a portion of the terminal 231. The second insulating layer 24 may also cover a portion of the terminal 231. The second insulating layer 24 comprises a resin. Examples of resins include polyimide, maleimide, epoxy resin, polybenzoxazole, and polyester. Preferably, the second insulating layer 24 is made of polyimide.

[0057] Furthermore, the thickness of the second insulating layer 24 on the wiring 232 is preferably thinner than the thickness of the second conductor layer 2312 of the terminal 231. When the thickness of the second insulating layer 24 on the wiring 232 is thinner than the thickness of the second conductor layer 2312, the maximum thickness T12 of the portion of the wiring circuit board 2 in which the wiring 232 is disposed is thinner than the maximum thickness T11 of the portion of the wiring circuit board 2 in which the terminal 231 is disposed.

[0058] (2) Framework like Figure 1 As shown, the frame 3 is disposed on the outer periphery of the assembly sheet 1. The frame 3 surrounds a plurality of wiring circuit boards 2. In this embodiment, the frame 3 has a frame shape.

[0059] In this embodiment, the assembly sheet 1 has notches 4 between the frame 3 and the wiring circuit board 2, and between the two wiring circuit boards 2. Furthermore, the assembly sheet 1 has a connecting portion 5A that connects the frame 3 and the wiring circuit board 2, and a connecting portion 5B that connects the two wiring circuit boards 2 to each other. Multiple wiring circuit boards 2 are connected to the frame 3 via connecting portions 5A while being interconnected via connecting portions 5B. Thus, the frame 3 supports multiple wiring circuit boards 2.

[0060] like Figure 2 As shown, the frame 3 has a first metal layer 31, a first resin layer 32, a second metal layer 33, and a second resin layer 34. Alternatively, the frame 3 may not have the second resin layer 34.

[0061] (2-1) First metal layer The first metal layer 31 comprises the same material as the metal support layer 21. The thickness of the first metal layer 31 is the same as the thickness of the metal support layer 21.

[0062] (2-2) First resin layer The first resin layer 32 is disposed on one side of the first metal layer 31 in the thickness direction. The first resin layer 32 is disposed on the first metal layer 31. The first resin layer 32 contains the same material as the first insulating layer 22. The thickness T3 of the first resin layer 32 is thicker than the thickness T1 of the first portion 221. Therefore, the second metal layer 33 of the frame 3 can be disposed further to one side than the terminal 231 of the wiring circuit board 2 by utilizing the thickness T3 of the first resin layer 32.

[0063] (2-3) Second metal layer The second metal layer 33 is disposed on one side of the first resin layer 32 in the thickness direction. The second metal layer 33 is disposed on the first resin layer 32. The second metal layer 33 contains the same material as the terminal 231. The thickness of the second metal layer 33 is the same as the thickness of the terminal 231. In detail, the second metal layer 33 has a first layer 331 and a second layer 332.

[0064] The first layer 331 is disposed on the first resin layer 32. The first layer 331 contains the same material as the first conductor layer 2311. The thickness of the first layer 331 is the same as the thickness of the first conductor layer 2311.

[0065] The second layer 332 is disposed on the first layer 331. The second layer 332 contains the same material as the second conductor layer 2312. The thickness of the second layer 332 is the same as the thickness of the second conductor layer 2312.

[0066] (2-4) Second resin layer The second resin layer 34 is disposed on one side of the first resin layer 32 in the thickness direction. The second resin layer 34 is disposed on the first resin layer 32. The second resin layer 34 covers the second metal layer 33. The second resin layer 34 contains the same material as the second insulating layer 24. The thickness of the second resin layer 34 is the same as the thickness of the second insulating layer 24.

[0067] The thickness of the first metal layer 31 is the same as the thickness of the metal support layer 21. The thickness T3 of the first resin layer 32 is thicker than the thickness T1 of the first portion 221. The thickness of the second metal layer 33 is the same as the thickness of the terminal 231. Moreover, the second metal layer 33 is covered by the second resin layer 34, so the maximum thickness T13 of the frame 3 is thicker than the maximum thickness T11 of the portion of the wiring circuit board 2 where the terminal 231 is disposed. Therefore, in the thickness direction of the wiring circuit board 2, one side surface S1 of the frame 3 is disposed further to one side than one side surface S2 of the terminal 231. In other words, in the thickness direction of the wiring circuit board 2, one side surface S1 of the frame 3 protrudes further to one side than one side surface S2 of the terminal 231.

[0068] Furthermore, when the frame 3 does not have the second resin layer 34, one side surface of the second metal layer 33 becomes one side surface S1 of the frame 3. Even in this case, the thickness of the first metal layer 31 is the same as the thickness of the metal support layer 21, the thickness T3 of the first resin layer 32 is thicker than the thickness T1 of the first portion 221, and the thickness of the second metal layer 33 is the same as the thickness of the terminal 231. Therefore, the maximum thickness T13 of the frame 3 is thicker than the maximum thickness T11 of the portion of the wiring circuit board 2 where the terminal 231 is disposed. Thus, in the thickness direction of the wiring circuit board 2, one side surface S1 of the frame 3 is disposed further to one side than one side surface S2 of the terminal 231. In other words, in the thickness direction of the wiring circuit board 2, one side surface S1 of the frame 3 protrudes further to one side than one side surface S2 of the terminal 231.

[0069] Therefore, for example, when conveying the assembly sheet 1 along the flow direction, the frame 3 can be used to prevent the conveying roller from contacting the terminal 231. As a result, damage to the terminal 231 can be suppressed more reliably.

[0070] 2. Manufacturing method of composite sheet material Next, the manufacturing method of the above-mentioned composite sheet 1 will be described.

[0071] The manufacturing method of the composite sheet 1 includes a first insulating layer forming process (see reference). Figure 3A and Figure 3B ), the first conductor pattern formation process (refer to) Figure 3C ), the second conductor pattern formation process (refer to) Figure 4A ) and the second insulating layer formation process (refer to Figure 4B ).

[0072] (1) First insulating layer formation process like Figure 3A and Figure 3BAs shown, in the first insulating layer forming process, a first insulating layer 22 is formed on a metal substrate S, and a first resin layer 32 is formed. The substrate S is a metal support layer 21 (see reference). Figure 2 ) and the first metal layer 31 (refer to Figure 2 (materials).

[0073] In detail, in the first insulating layer forming process, a solution (varnish) of photosensitive resin (preferably photosensitive polyimide) is coated on the substrate S and dried to form a photosensitive resin coating F.

[0074] Next, as Figure 3A As shown, a photosensitive resin coating F is exposed through a photomask M. The photomask M has a light-blocking portion M1, a fully transparent portion M2, and a semi-transparent portion M3. The light-blocking portion M1 is opposite to the portion where the first insulating layer 22 and the first resin layer 32 are not formed. The fully transparent portion is opposite to the portion where the first resin layer 32 is formed. The portion where the first resin layer 32 is formed is exposed with a first exposure amount. The semi-transparent portion M3 allows a smaller amount of light to pass through than the fully transparent portion M2. The semi-transparent portion M3 is opposite to the portion where the first insulating layer 22 is formed. That is, the portion where the first insulating layer 22 is formed is exposed with a second exposure amount, which is less than the first exposure amount.

[0075] Next, the exposed coating F is developed. If necessary, the coating F can also be heated.

[0076] Based on the above, such as Figure 3B As shown, a first insulating layer 22 and a first resin layer 32 are formed on the substrate S.

[0077] (2) First conductor pattern formation process Next, as Figure 3C As shown, in the first conductor pattern forming process, a first conductor layer 2311 and wiring 232 constituting part of the terminal 231 are formed, and a first layer 331 of the second metal layer 33 is formed.

[0078] In detail, in the first conductor patterning process, a seed layer is first formed on one side surface of the first insulating layer 22 in the thickness direction and on one side surface of the first resin layer 32 in the thickness direction. Furthermore, the seed layer is also formed on one side surface of the substrate S in the thickness direction. The seed layer is formed, for example, by sputtering.

[0079] Next, an anti-plating agent is adhered to one side surface of the substrate S in the thickness direction. The anti-plating agent covers the first insulating layer 22 and the first resin layer 32.

[0080] Next, the resist is exposed and developed. Thus, in the areas where the first conductor layer 2311, wiring 232, and the first layer 331 are formed, the resist is removed, exposing the seed layer. On the other hand, in the areas where the first conductor layer 2311, wiring 232, and the first layer 331 are not formed, resist remains.

[0081] Next, on the exposed seed layer, a first conductor layer 2311, wiring 232 and a first layer 331 are formed by electroplating.

[0082] Then, the anti-plating agent is stripped off.

[0083] (3) Second conductor pattern formation process Next, as Figure 4A As shown, in the second conductor pattern forming process, a second conductor layer 2312 is formed for the terminal 231, and a second layer 332 for the second metal layer 33 is formed.

[0084] Specifically, an anti-plating agent is adhered to one side surface of the substrate S in the thickness direction. The anti-plating agent covers the first insulating layer 22, the first conductor layer 2311, the wiring 232, the first resin layer 32, and the first layer 331.

[0085] Next, the resist is exposed and developed. Thus, the resist in the portions forming the second conductor layer 2312 and the second layer 332 is removed, exposing the first conductor layer 2311 in the portion forming the second conductor layer 2312, and the first layer 331 in the portion forming the second layer 332. On the other hand, resist remains in the portions where the second conductor layer 2312 and the second layer 332 are not formed.

[0086] Next, by electroplating, a second conductor layer 2312 constituting another part of the terminal 231 is formed on the exposed first conductor layer 2311, and a second layer 332 is formed on the exposed first layer 331.

[0087] Next, the anti-plating agent is stripped off, and the seed layer exposed by the stripping of the anti-plating agent is removed by etching.

[0088] (4) Second insulation layer formation process Next, as Figure 4B As shown, in the second insulating layer forming process, a second insulating layer 24 is formed, and a second resin layer 34 is formed.

[0089] Specifically, a solution (varnish) of photosensitive resin (preferably photosensitive polyimide) is coated onto the first insulating layer 22, the first resin layer 32, and the substrate S, and then dried to form a photosensitive resin coating. The photosensitive resin coating covers the circuit pattern 23 and the second metal layer 33.

[0090] Next, the photosensitive resin coating is exposed and developed. If necessary, the coating can also be heated.

[0091] Thus, the second insulating layer 24 and the second resin layer 34 are formed.

[0092] Then, by etching the substrate S, such as... Figure 1 and Figure 2 As shown, this forms the outline of the wiring circuit board 2.

[0093] 3. Effects (1) According to the aggregate sheet 1, such as Figure 2 As shown, the thickness T3 of the first resin layer 32 of the frame 3 is thicker than the thickness T1 of the first part 221.

[0094] Therefore, by utilizing the thickness T3 of the first resin layer 32, the second metal layer 33 of the frame 3 can be positioned further to one side than the terminal 231 of the wiring circuit board 2.

[0095] Thus, one side surface S1 of the frame 3 is reliably positioned further to one side than one side surface S2 of the terminal 231.

[0096] Therefore, for example, when conveying the assembly sheet 1, the frame 3 can be used to prevent the conveying roller from contacting the terminal 231.

[0097] As a result, damage to terminal 231 can be suppressed more reliably.

[0098] (2) According to the aggregate sheet 1, such as Figure 2 As shown, the second metal layer 33 has a first layer 331 containing the same material as the first conductor layer 2311 and a second layer 332 containing the same material as the second conductor layer 2312.

[0099] Therefore, in the first conductor pattern forming process (refer to...) Figure 3C In the process of forming the second metal layer 33, the first layer 331, which can be formed together with the first conductor layer 2311 of the terminal 231, is in the second conductor pattern forming process (see reference). Figure 4A In the second metal layer 332, a second metal layer 33 can be formed together with the second conductor layer 2312 of the terminal 231.

[0100] As a result, the second metal layer 33 can be formed without increasing the processing time by utilizing the process of forming terminal 231.

[0101] (3) According to the aggregate sheet 1, such as Figure 2 As shown, the frame 3 also has a second resin layer 34 covering the second metal layer 33. The second resin layer 34 contains the same material as the second insulating layer 24.

[0102] Therefore, in the second insulating layer formation process (refer to...) Figure 4B In the process, it can form a second resin layer 34 together with the second insulating layer 24.

[0103] As a result, by utilizing the process of forming the second insulating layer 24, the second resin layer 34 can be formed without increasing the processing time.

[0104] 4. Variations The following describes a variation. In the variation, the same symbols are used to mark the same components as in the above-described embodiment, and their descriptions are omitted.

[0105] (1) such as Figure 5 As shown, the thickness T2 of the second portion 222 can also be thicker than the thickness T1 of the first portion 221. In this case, the rigidity of the portion of the wiring circuit board 2 in which the wiring 232 is disposed can be ensured. The thickness T2 of the second portion 222 can also be the same as the thickness T3 of the first resin layer 32. In this case, the maximum thickness T12 of the portion of the wiring circuit board 2 in which the wiring 232 is disposed is thicker than the maximum thickness T11 of the portion of the wiring circuit board 2 in which the terminal 231 is disposed, but thinner than the maximum thickness T13 of the frame 3.

[0106] (2) such as Figure 6 As shown, the wiring circuit board 10 may also have multiple support portions 11A, 11B and multiple wiring portions 12A, 12B.

[0107] Support portion 11A supports one end of each of wiring portions 12A and 12B. Support portion 11B is disposed separately from support portion 11A. Support portion 11B supports the other end of each of wiring portions 12A and 12B.

[0108] Wiring portions 12A and 12B are disposed between support portion 11A and support portion 11B. One end of each wiring portion 12A and 12B is connected to support portion 11A. The other end of each wiring portion 12A and 12B is connected to support portion 11B. Wiring portions 12B and wiring portions 12A are arranged at intervals.

[0109] like Figure 7A As shown, terminal 231 can also be disposed on support portion 11A.

[0110] like Figure 7B As shown, the circuit pattern 23 can also have two types of wiring 232 (first wiring 232A and second wiring 232B).

[0111] The first wiring 232A is connected to the first conductor layer 2311 of the terminal 231. The first wiring 232A contains the same material as the first conductor layer 2311 of the terminal 231. The first wiring 232A has a first thickness T21. The first thickness T21 is the same as the thickness of the first conductor layer 2311 of the terminal 231. At least a portion of the first wiring 232A is disposed in the wiring portion 12A.

[0112] The second wiring 232B is connected to the second conductor layer 2312 of the terminal 231. The second wiring 232B contains the same material as the second conductor layer 2312 of the terminal 231. The second wiring 232B has a second thickness T22. The second thickness T22 is thicker than the first thickness T21. The second thickness T22 is the same as the thickness of the second conductor layer 2312 of the terminal 231. At least a portion of the second wiring 232B is disposed in the wiring portion 12B.

[0113] The first insulating layer 22 has a first portion 221 disposed on the support portion 11A (see reference). Figure 7A The second portion 222A is disposed in the wiring section 12A, and the second portion 222B is disposed in the wiring section 12B. The second portion 222A is disposed between the first wiring 232A and the metal support layer 21. The second portion 222B is disposed between the second wiring 232B and the metal support layer 21.

[0114] In this modified example, the thickness T2A of the second portion 222A is greater than the thickness T1 of the first portion 221. Therefore, the rigidity of the wiring section 12A can be ensured. The thickness T2A of the second portion 222A is the same as the thickness T3 of the first resin layer 32 of the frame 3. In addition, the thickness T2B of the second portion 222B is the same as the thickness T1 of the first portion 221.

[0115] In this modified example, the maximum thickness T13 of the frame 3 is also thicker than the maximum thickness T11 of the portion of the support 11A where the terminal 231 is disposed.

[0116] Furthermore, in this modified example, the maximum thickness T12A of the wiring portion 12A is thicker than the maximum thickness T11 of the portion of the support portion 11A where the terminal 231 is disposed, and thinner than the maximum thickness T13 of the frame 3. The maximum thickness T12B of the wiring portion 12B is thinner than the maximum thickness T11 of the portion of the support portion 11A where the terminal 231 is disposed.

[0117] (3) such as Figure 8As shown, the thickness T2B of the second part 222B can also be thicker than the thickness T1 of the first part 221. In this case, the rigidity of the wiring section 12B can be ensured. The thickness T2B of the second part 222B can also be the same as the thickness T3 of the first resin layer 32 of the frame 3. The thickness T2A of the second part 222A can also be the same as the thickness T1 of the first part 221.

[0118] In this modified example, the maximum thickness T12B of the wiring portion 12B is thicker than the maximum thickness T11 of the portion of the support portion 11A where the terminal 231 is disposed, and thinner than the maximum thickness T13 of the frame 3. The maximum thickness T12A of the wiring portion 12A is thinner than the maximum thickness T11 of the portion of the support portion 11A where the terminal 231 is disposed.

[0119] (4) such as Figure 9 As shown, the thickness T2A of the second part 222A and the thickness T2B of the second part 222B can be thicker than the thickness T1 of the first part 221. In this case, the rigidity of both the wiring portion 12A and the wiring portion 12B can be ensured. The thickness T2A of the second part 222A and the thickness T2B of the second part 222B can also be the same as the thickness T3 of the first resin layer 32 of the frame 3.

[0120] In this modified example, the maximum thickness T12A of the wiring portion 12A and the maximum thickness T12B of the wiring portion 12B are thicker than the maximum thickness T11 of the portion of the support portion 11A in which the terminal 231 is disposed, and thinner than the maximum thickness T13 of the frame 3.

[0121] (5) As shown in Figure 10, the thickness T1 of the first part 221 can also be thicker than the thickness T2A and the thickness T2B of the second part 222A. By making the thickness T1 of the first part 221 thicker, the terminal 231 can be configured separately from the metal support layer 21. Therefore, the impedance of the terminal 231 can be reduced.

[0122] Furthermore, in this modified example, the thickness T3 of the first resin layer 32 is also thicker than the thickness T1 of the first portion 221.

[0123] (6) For example Figure 11As shown, the second wiring 232B has a central portion C and an end portion E in the width direction. The central portion C may also protrude in the thickness direction relative to the first insulating layer 22 towards the side opposite to the metal support layer 21, compared to the end portion E. By protruding the central portion C, the width of the second wiring 232B is not excessively increased, allowing for an increase in the cross-sectional area of ​​the second wiring 232B. As a result, a reduction in the resistance of the second wiring 232B can be achieved. The maximum thickness T12B of the wiring portion 12B may also be thicker than the maximum thickness T11 of the portion of the support portion 11A where the terminal 231 is disposed, and thinner than the maximum thickness T13 of the frame 3.

[0124] (7) The first insulating layer forming process may also include a first process (see reference). Figure 12A ) and the second process (refer to Figure 12B ).

[0125] like Figure 12A As shown, in the first process, a first layer 101A is formed in the portion where the first insulating layer 22 and the first resin layer 32 are formed.

[0126] In detail, in the first step, a solution (varnish) of photosensitive resin (preferably photosensitive polyimide) is coated on the substrate S and dried to form a coating film of photosensitive resin.

[0127] Next, the photosensitive resin coating is exposed through a photomask having a light-blocking portion and a fully transparent portion but no semi-transparent portion. The light-blocking portion is opposite to the portion where the first layer 101A is not formed. The fully transparent portion is opposite to the portion where the first layer 101A is formed.

[0128] Next, the exposed coating is developed. The coating can also be heated if necessary.

[0129] Thus, a first layer 101A is formed on the substrate S.

[0130] Next, as Figure 12B As shown, in the second process, a second layer 101B is formed in the portion where the first resin layer 32 is formed.

[0131] In detail, in the second step, a solution (varnish) of photosensitive resin (preferably photosensitive polyimide) is applied to the first layer 101A and the substrate S and dried to form a photosensitive resin coating.

[0132] Next, the photosensitive resin coating is exposed through a photomask having a light-blocking portion and a fully transparent portion but no semi-transparent portion. The light-blocking portion is opposite to the portion where the second layer 101B does not form. The fully transparent portion is opposite to the portion where the second layer 101B forms.

[0133] Next, the exposed coating is developed. The coating can also be heated if necessary.

[0134] Thus, in the portion where the first resin layer 32 is formed, a second layer 101B is formed on the first layer 101A.

[0135] That is, in this modified example, the first resin layer 32 has a first layer 101A and a second layer 101B disposed on the first layer 101A. The first portion 221 of the first insulating layer 22 has the first layer 101A but does not have the second layer 101B.

[0136] Furthermore, in manufacturing the wiring circuit board 2, the thickness of the second portion 222 is the same as the thickness of the first portion 221 (for example, see reference). Figure 1 In the case of the first insulating layer 22, the second portion 222 also has the first layer 101A, just like the first portion 221, but does not have the second layer 101B. On the other hand, in manufacturing a wiring circuit board 2 where the thickness of the second portion 222 is greater than the thickness of the first portion 221 (for example, see reference 101B), the second portion 222 has a thickness of 101A, but not the second layer 101B. Figure 5 In the case of the first resin layer 32, the second part 222 has the same first layer 101A and second layer 101B as the first resin layer 32.

[0137] (8) In the variations (1) to (7), the same effect as the above-described embodiments can also be obtained.

[0138] Furthermore, the above-described invention is provided as an illustrative embodiment of the present invention, but this is merely illustrative and should not be interpreted as limiting. Variations of the invention that will be apparent to those skilled in the art are included within the scope of the patent claims.

[0139] Industrial availability The composite sheet of the present invention can be used in the manufacture of wiring circuit boards.

[0140] Symbol Explanation 1. Composite sheet 2 Wiring circuit board 3 Framework 21 Metal support layer 22 First Insulation Layer 221 Part One 222 Part Two 23 Circuit Pattern 231 terminal 2311 First Conductor Layer 2312 Second Conductor Layer 232 wiring 24 Second Insulation Layer 31 First metal layer 331 First Floor 332 Second Floor 32 First resin layer 33 Second metal layer 34 Second resin layer One side surface of the S1 frame One side surface of the S2 terminal.

Claims

1. A composite sheet material, comprising: A wiring circuit board having a metal support layer, a first insulating layer disposed on the metal support layer, and a circuit pattern having terminals disposed on the first insulating layer; and A frame supporting the wiring circuit board, and having: a first metal layer comprising the same material as the metal support layer; a first resin layer disposed on the first metal layer and comprising the same material as the first insulating layer; and a second metal layer disposed on the first resin layer and comprising the same material as the terminals. The first insulating layer has a first portion disposed between the metal support layer and the terminal. The thickness of the first resin layer of the frame is greater than the thickness of the first portion. In the thickness direction of the wiring circuit board, one side surface of the frame is positioned further to one side than one side surface of the terminal.

2. The composite sheet according to claim 1, wherein, The circuit pattern has wiring. The first insulating layer has a second portion disposed between the wiring and the metal support layer. The second part is thicker than the first part.

3. The composite sheet according to claim 1, wherein, The circuit pattern has: a first wiring having a first thickness; and a second wiring having a second thickness greater than the first thickness. The first insulating layer has a second portion disposed between at least one of the first wiring and the second wiring and the metal support layer. The second part is thicker than the first part.

4. The composite sheet according to claim 1, wherein, The circuit pattern has wiring. The first insulating layer has a second portion disposed between the wiring and the metal support layer. The thickness of the first part is greater than the thickness of the second part.

5. The composite sheet according to claim 1, wherein, The circuit pattern has wiring. The wiring has a central portion and end portions in the width direction of the wiring. Compared to the end portion, the central portion protrudes in the thickness direction relative to the first insulating layer toward the side opposite to the metal support layer.

6. The composite sheet according to claim 1, wherein, The terminal has: A first conductor layer disposed on the first portion; and A second conductor layer is disposed on the first conductor layer. The second metal layer has: A first layer, disposed on the first resin layer, and comprising the same material as the first conductor layer; and The second layer is disposed on the first layer and contains the same material as the second conductor layer.

7. The composite sheet according to claim 1, wherein, The circuit pattern has wiring. The wiring circuit board also includes: A second insulating layer is disposed on the first insulating layer and covers the wiring. The framework also features: A second resin layer is disposed on the first resin layer, covers the second metal layer, and contains the same material as the second insulating layer.

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