Wiring circuit board

Abstract

The present invention relates to a wiring circuit substrate. The wiring circuit substrate of the present invention includes a first insulating layer, a first circuit pattern, a metal support layer insulated from the first circuit pattern by the first insulating layer, and a second circuit pattern independent of the first circuit pattern. In addition, the second circuit pattern includes a first terminal having a metal layer continuous with the metal support layer and a terminal insulating layer disposed on one side of the metal layer in a thickness direction, the first terminal having a first end disposed apart from the metal support layer and a second end disposed between the first end and the metal support layer, the terminal insulating layer being disposed between the first end and the second end.

Description

Technical Field

[0001] This invention relates to wiring circuit boards. Background Technology

[0002] Previously, a wiring circuit board was known, which had a metal support layer, a base insulating layer disposed on one side of the metal support layer, and a conductor layer disposed on one side of the base insulating layer (for example, see Patent Document 1 below).

[0003] Existing technical documents Patent documents Patent Document 1: Japanese Patent Application Publication No. 2020-188189 Summary of the Invention The technical problem that the invention aims to solve Regarding the wiring circuit board described in Patent Document 1, further research can be conducted to increase the degree of freedom in circuit design.

[0004] This invention provides a wiring circuit board that enables greater freedom in circuit design.

[0005] Technical solutions for solving technical problems The present invention [1] includes a wiring circuit board comprising: a first insulating layer; a first circuit pattern disposed on one side of the first insulating layer in the thickness direction; a metal support layer disposed on the side of the first insulating layer opposite to the first circuit pattern in the thickness direction, insulating the first circuit pattern through the first insulating layer, and supporting the first circuit pattern and the first insulating layer; and a second circuit pattern independent of the first circuit pattern, the second circuit pattern having a first terminal having a metal layer continuous with the metal support layer and a terminal insulating layer disposed on one side of the metal layer in the thickness direction, the first terminal having a first end disposed away from the metal support layer and a second end disposed between the first end and the metal support layer, the terminal insulating layer being disposed between the first end and the second end.

[0006] According to this structure, the first terminal of the second circuit pattern has a metal layer that is continuous with the metal support layer.

[0007] Therefore, a second circuit pattern independent of the first circuit pattern can be designed using the metal support layer that supports the first circuit pattern.

[0008] As a result, it enables greater freedom in circuit design.

[0009] Furthermore, since the metal layer of the first terminal is continuous with the metal support layer, compared to the case where a portion of the metal support layer is separated from the metal support layer to form the second circuit pattern, it is possible to suppress the decrease in rigidity of the metal support layer due to the formation of the second circuit pattern.

[0010] Furthermore, based on this structure, a terminal insulating layer is disposed between the first end and the second end of the first terminal. Therefore, when the electronic component is joined at the first terminal, the flow of solder to the second end side (metal support layer side) can be suppressed, and the solder is concentrated closer to the first end side than the terminal insulating layer.

[0011] As a result, the reliability of the connection between the first terminal and the electronic components can be improved.

[0012] The present invention [2] includes the wiring circuit board described above [1], wherein, in the thickness direction, the terminal insulating layer is disposed at least on one side of the metal layer at the second end.

[0013] With this structure, when the electronic component is joined at the first terminal, the flow of solder to the second terminal can be suppressed, and the solder is concentrated at the first terminal side, which is closer to the terminal insulation layer.

[0014] As a result, the reliability of the connection between the first terminal and the electronic components can be improved.

[0015] The present invention [3] includes the wiring circuit board described in [1] or [2] above, wherein the terminal insulating layer is continuous with the first insulating layer.

[0016] With this structure, when the electronic component is joined at the first terminal, the flow of solder to the second end (metal support layer side) can be more reliably suppressed.

[0017] As a result, the reliability of the connection between the first terminal and the electronic components can be improved.

[0018] The present invention [4] includes the wiring circuit board described in [1] or [2] above, wherein the wiring circuit board further comprises a second insulating layer covering at least a portion of the first circuit pattern, and the terminal insulating layer is continuous with the second insulating layer.

[0019] With this structure, when the electronic component is joined at the first terminal, the flow of solder to the second end (metal support layer side) can be more reliably suppressed.

[0020] As a result, the reliability of the connection between the first terminal and the electronic components can be improved.

[0021] The present invention [5] includes the wiring circuit board described in [4] above, wherein the terminal insulating layer is continuous with the first insulating layer and the second insulating layer.

[0022] With this structure, when the electronic component is joined at the first terminal, the flow of solder to the second end (metal support layer side) can be more reliably suppressed.

[0023] As a result, the reliability of the connection between the first terminal and the electronic components can be improved.

[0024] The present invention [6] includes a wiring circuit board as described in any one of [1] to [5] above, wherein the terminal insulating layer at least covers the metal layer at the second end, and at least a portion of one side surface of the metal layer in the thickness direction is exposed from the terminal insulating layer.

[0025] With this structure, when the electronic component is joined at the first terminal, one side surface of the metal layer can be used as the joining surface. In addition, the solder can be concentrated on one side surface of the exposed metal layer through the terminal insulating layer.

[0026] As a result, the reliability of the connection between the first terminal and the electronic components can be improved.

[0027] The present invention [7] includes the wiring circuit board described in any one of [1] to [6] above, wherein the first terminal further has a metal terminal cover layer covering at least a portion of the metal layer.

[0028] With this structure, the metal layer can be protected by the terminal cover layer.

[0029] The present invention [8] includes the wiring circuit board described above [7], wherein the terminal insulating layer at least covers the metal layer at the second end, and the terminal covering layer covers the remaining portion of the metal layer.

[0030] With this structure, the metal layer can be protected by the terminal insulation layer and the terminal cover layer.

[0031] Furthermore, with this structure, when the electronic component is joined at the first terminal, one side surface of the terminal cover layer can be used as a joining surface. In addition, solder can be concentrated on one side surface of the terminal cover layer through the terminal insulating layer.

[0032] As a result, the reliability of the connection between the first terminal and the electronic components can be improved.

[0033] The present invention [9] includes the wiring circuit board described in [7] or [8] above, wherein the thickness of the terminal insulating layer is greater than the thickness of the terminal covering layer.

[0034] With this structure, when the electronic component is joined at the first terminal, the flow of solder to the second terminal side (metal support layer side) can be more reliably suppressed by the thickness of the terminal insulation layer.

[0035] As a result, the reliability of the connection between the first terminal and the electronic components can be further improved.

[0036] The present invention

[10] includes a wiring circuit board as described in any one of [1] to [9] above, wherein the wiring circuit board further comprises a conductor layer disposed between the first insulating layer and the metal support layer in the thickness direction.

[0037] This structure enables the improvement of the electrical characteristics of the wiring circuit board.

[0038] The present invention

[11] includes the wiring circuit board described above

[10] , wherein the first terminal further has a terminal conductor layer that is continuous with the conductor layer.

[0039] Based on this structure, a second circuit pattern, independent of the first circuit pattern, can be designed using the conductor layer.

[0040] As a result, it is possible to increase the degree of freedom in circuit design and improve the conductivity of the second circuit pattern.

[0041] The present invention

[12] includes the wiring circuit board described above

[11] , wherein the terminal insulating layer at least covers the terminal conductor layer at the second end, and at least a portion of one side surface of the terminal conductor layer in the thickness direction is exposed from the terminal insulating layer.

[0042] With this structure, when the electronic component is joined at the first terminal, one side surface of the terminal conductor layer can be used as a joining surface. In addition, solder can be concentrated on one side surface of the exposed terminal conductor layer through the terminal insulating layer.

[0043] As a result, the reliability of the connection between the first terminal and the electronic components can be improved.

[0044] The present invention

[13] includes the wiring circuit board described in

[11] or

[12] above, wherein the first terminal further has a metal terminal cover layer covering at least a portion of the terminal conductor layer.

[0045] With this structure, the terminal conductor layer can be protected by the terminal cover layer.

[0046] The present invention

[14] includes the wiring circuit board described above

[13] , wherein the terminal insulating layer at least covers the terminal conductor layer at the second end, and the terminal cover layer covers the remaining portion of the terminal conductor layer.

[0047] With this structure, the terminal conductor layer can be protected by the terminal insulation layer and the terminal cover layer.

[0048] Furthermore, with this structure, when the electronic component is joined at the first terminal, one side surface of the terminal cover layer can be used as a joining surface. In addition, solder can be concentrated on one side surface of the terminal cover layer through the terminal insulating layer.

[0049] As a result, the reliability of the connection between the first terminal and the electronic components can be improved.

[0050] The present invention

[15] includes the wiring circuit board described in

[13] or

[14] above, wherein the thickness of the terminal insulating layer is greater than the thickness of the terminal covering layer.

[0051] With this structure, when the electronic component is joined at the first terminal, the flow of solder to the second terminal side (metal support layer side) can be more reliably suppressed by the thickness of the terminal insulation layer.

[0052] As a result, the reliability of the connection between the first terminal and the electronic components can be further improved.

[0053] Invention Effects The wiring circuit board according to the present invention enables an increase in the degree of freedom in circuit design. Attached Figure Description

[0054] Figure 1 This is a top view illustrating one embodiment of the wiring circuit board of the present invention. It should be noted that... Figure 1 In this paper, the second insulating layer, the covering layer, and the terminal covering layer are omitted.

[0055] Figure 2A yes Figure 1 The diagram shows a cross-sectional view (AA) of the wiring circuit board. Figure 2B yes Figure 1 The diagram shows a BB cross-sectional view of the wiring circuit board.

[0056] Figures 3A-3C It means Figure 1 The diagram shows the manufacturing process of the wiring circuit board. Figure 3A This indicates the conductor layer formation process. Figure 3B This indicates the first insulating layer formation process. Figure 3C This indicates the process of forming a conductor pattern.

[0057] Figures 4A to 4C Is following Figure 3C Next, a process diagram showing the manufacturing process of the wiring circuit board is provided. Figure 4A This indicates the process of forming the second insulating layer. Figure 4B Indicates the external processing steps. Figure 4C This indicates the process of forming the coating layer.

[0058] Figure 5A and Figure 5B Example of a modified wiring circuit board (1). Figure 5A It is equivalent to Figure 2A A sectional view of AA section view. Figure 5B It is equivalent to Figure 2B A sectional view of BB.

[0059] Figure 6 This is a cross-sectional view of a modified example (2) of the wiring circuit board.

[0060] Figure 7 This is a cross-sectional view of a modified example (3) of the wiring circuit board.

[0061] Figure 8A and Figure 8B Example of a modified wiring circuit board (4). Figure 8A It is equivalent to Figure 2A A sectional view of AA section view. Figure 8B It is equivalent to Figure 2B A sectional view of BB.

[0062] Figure 9 This is a cross-sectional view of a modified example (5) of the wiring circuit board.

[0063] Figure 10 This is a cross-sectional view of a modified example (6) of the wiring circuit board.

[0064] Figure 11 This is a cross-sectional view of a modified example (7) of a wiring circuit board.

[0065] Figure 12 This is a cross-sectional view of a modified example (8) of a wiring circuit board.

[0066] Figure 13 This is a cross-sectional view of a modified example (9) of a wiring circuit board.

[0067] Figure 14 This is a top view of a modified example (10) of the wiring circuit board.

[0068] Figure 15 This is a top view of a modified example (11) of the wiring circuit board.

[0069] Figure 16This is a top view of a modified example (12) of the wiring circuit board.

[0070] Figure 17A and Figure 17B Example of a modified wiring circuit board (13). Figure 17A This is a top view of a modified example (13) of the wiring circuit board. Figure 17B yes Figure 17A AA sectional view. Detailed Implementation

[0071] 1. Wiring circuit board like Figure 1 As shown, in this embodiment, the wiring circuit board 1 extends along a first direction and a second direction. The first direction is the direction in which the plurality of terminals 31A and 31B are arranged. The terminals 31A and 31B will be described later. The second direction is orthogonal to the first direction. The shape of the wiring circuit board 1 is not limited to this embodiment.

[0072] like Figure 2A and Figure 2B As shown, the wiring circuit board 1 includes a first insulating layer 2 as an example of an insulating layer and a first circuit pattern 3 (see reference). Figure 1 4. Metal support layer; 5. Conductor layer; 6. Cover layer; 7. Second circuit pattern (refer to...) Figure 1 ) and the second insulating layer 8.

[0073] (1) First insulating layer The first insulating layer 2 insulates the metal support layer 4 and the conductor layer 5 from the first circuit pattern 3. The first insulating layer 2 comprises a resin. Examples of resins include polyimide, maleimide, epoxy resin, polybenzoxazole, and polyester. The first insulating layer 2 has through holes 21.

[0074] (2) First circuit pattern The first circuit pattern 3 is disposed on one side of the first insulating layer 2 in the thickness direction. The thickness direction is orthogonal to the first direction and the second direction. The first circuit pattern 3 is disposed on one side surface of the first insulating layer 2 in the thickness direction.

[0075] like Figure 1 As shown, the first circuit pattern 3 has multiple terminals 31A, 31B, multiple terminals 32A, 32B, and multiple wirings 33A, 33B. Terminals 31A and 31B are arranged in a first direction. Terminal 31B is disposed away from terminal 31A in the first direction. Terminals 31A and 31B extend along the first direction and the second direction, respectively. Terminals 31A and 31B each have a generally rectangular shape.

[0076] like Figure 2AAs shown, terminals 31A and 31B each have a conductor layer 311. Terminals 31A and 31B may each have a cover layer 312 as needed.

[0077] The conductor layer 311 is disposed on one side surface of the first insulating layer 2 in the thickness direction. The conductor layer 311 contains a metal. Examples of metals include copper, silver, gold, iron, aluminum, chromium, and alloys thereof. From the viewpoint of obtaining good electrical properties, the conductor layer 311 preferably contains copper.

[0078] A protective metal layer for protecting the conductor layer 311 is preferably disposed between the conductor layer 311 and the second insulating layer 8. The protective metal layer comprises a metal. Examples of materials for the protective metal layer include chromium, nickel, titanium, and alloys thereof.

[0079] It should be noted that the illustration of the protective metal layer has been omitted.

[0080] A capping layer 312 covers the surface of the conductor layer 311. In this embodiment, the capping layer 312 covers the central portion (the portion not covered by the second insulating layer 8) of one side surface of the conductor layer 311 in the thickness direction. The capping layer 312 has a surface layer 312A. The surface layer 312A contains a metal different from that of the conductor layer 311. The surface layer 312A contains, for example, gold. The capping layer 312 preferably has an intermediate layer 312B. The capping layer 312 may also not have an intermediate layer 312B. The intermediate layer 312B is disposed between the conductor layer 311 and the surface layer 312A. The intermediate layer 312B contains a metal different from that of the conductor layer 311 and the surface layer 312A. The intermediate layer 312B contains, for example, nickel.

[0081] like Figure 1 As shown, terminal 32A is disposed away from terminal 31A in a second direction. Terminal 32B is disposed away from terminal 31B in a second direction. Terminals 32A and 32B are arranged in a first direction. Terminal 32B is disposed away from terminal 32A in a first direction. Terminals 32A and 32B each have, for example, a generally rectangular shape. The description of terminals 32A and 32B is the same as the description of terminals 31A and 31B. Therefore, the description of terminals 32A and 32B is omitted.

[0082] Wiring 33A electrically connects terminal 31A and terminal 32A. One end of wiring 33A is connected to terminal 31A. Specifically, one end of wiring 33A is connected to the conductor layer 311 of terminal 31A (see reference). Figure 2A The other end of wiring 33A is connected to terminal 32A. Specifically, the other end of wiring 33A is connected to the conductor layer 311 of terminal 32A (see reference). Figure 2A )connect.

[0083] Wiring 33B electrically connects terminal 31B and terminal 32B. One end of wiring 33B is connected to terminal 31B. The other end of wiring 33B is connected to terminal 32B.

[0084] Wiring 33A and 33B contain the same material as conductor layer 311.

[0085] (3) Metal support layer like Figure 2A and Figure 2B As shown, the metal support layer 4 is disposed on the other side of the first insulating layer 2 in the thickness direction. The metal support layer 4 is disposed on the side of the first insulating layer 2 opposite to the first circuit pattern 3 in the thickness direction. The metal support layer 4 is insulated from the first circuit pattern 3 by the first insulating layer 2. The metal support layer 4 supports the first circuit pattern 3 and the first insulating layer 2. The entire metal support layer 4 overlaps with the first insulating layer 2 in the thickness direction. Examples of materials for the metal support layer 4 include stainless steel and copper alloys.

[0086] (4) Conductor layer The conductor layer 5 is disposed on the other side of the first insulating layer 2 and on one side of the metal support layer 4 in the thickness direction. In other words, the conductor layer 5 is disposed between the first insulating layer 2 and the metal support layer 4 in the thickness direction. The conductor layer 5 is in contact with the other side surface of the first insulating layer 2 and with one side surface of the metal support layer 4 in the thickness direction. The conductor layer 5 is disposed on the side of the first insulating layer 2 opposite to the first circuit pattern 3 in the thickness direction. The conductor layer 5 is insulated from the first circuit pattern 3 by the first insulating layer 2. Figure 2A As shown, the conductor layer 5 extends from one end of the metal support layer 4 to the other end in a first direction, and as... Figure 2B As shown, the conductor layer 5 extends from one end of the metal support layer 4 to the other end in the second direction. The conductor layer 5 does not have a wiring pattern. The entire conductor layer 5 overlaps with the first insulating layer 2 in the thickness direction. The conductor layer 5 also overlaps with the entire first circuit pattern 3 in the thickness direction. The conductivity of the conductor layer 5 is higher than that of the metal support layer 4. The conductor layer 5 may contain, for example, copper.

[0087] A bonding layer may be disposed between the metal support layer 4 and the conductor layer 5 to join the metal support layer 4 and the conductor layer 5. The bonding layer comprises a metal. Examples of materials for the bonding layer include chromium, nickel, titanium, and alloys thereof.

[0088] Furthermore, a protective metal layer for protecting the conductor layer 5 is preferably disposed between the conductor layer 5 and the first insulating layer 2. The protective metal layer comprises a metal. Examples of materials for the protective metal layer include chromium, nickel, titanium, and alloys thereof.

[0089] It should be noted that the diagrams for the bonding layer and the protective metal layer have been omitted.

[0090] (5) Covering layer The cover layer 6 covers the metal support layer 4. Specifically, the cover layer 6 covers the entire other surface S1 of the metal support layer 4 in the thickness direction. Additionally, the cover layer 6 covers the entire end face S2 of the metal support layer 4 and the entire end face S3 of the conductor layer 5. It should be noted that in this embodiment, the end face S3 of the conductor layer 5 is continuous with the end face S2 of the metal support layer 4 in the thickness direction. The end face S3 of the conductor layer 5 is discontinuous with the end face of the first insulating layer 2. The cover layer 6 has a surface layer 61. The cover layer 6 preferably has an intermediate layer 62. The cover layer 6 may also not have an intermediate layer 62. The intermediate layer 62 is disposed between the metal support layer 4 and the surface layer 61, and between the conductor layer 5 and the surface layer 61. The cover layer 6 contains metal. Specifically, the surface layer 61 contains a metal different from that of the metal support layer 4 and the conductor layer 5. The surface layer 61 contains, for example, gold. The intermediate layer 62 contains a metal different from that of the metal support layer 4, the conductor layer 5, and the surface layer 61. The intermediate layer 62 contains, for example, nickel.

[0091] (6) Second circuit pattern like Figure 1 As shown, the second circuit pattern 7 is independent of the first circuit pattern 3. The second circuit pattern 7 has a first terminal 71 and a second terminal 72. The first terminal 71 and the second terminal 72 are connected via a conductor layer 5 (see reference 3). Figure 2A and Figure 2B The circuit pattern 7 is electrically connected, and thus, the second circuit pattern 7 functions as a circuit independent of the first circuit pattern 3.

[0092] (6-1) First terminal In this embodiment, the first terminal 71 is disposed between terminals 31B and 32B in the second direction. In other words, the first terminal 71 is parallel to wirings 33A and 33B in the first direction. The first terminal 71 is disposed on the side of wiring 33B opposite to wiring 33A in the first direction. The first terminal 71 has a prism shape extending in the first direction. The position and shape of the first terminal 71 are not limited to this embodiment.

[0093] The first terminal 71 does not overlap with the first insulating layer 2 in the thickness direction. In addition, the first terminal 71 does not overlap with the second insulating layer 8 in the thickness direction.

[0094] like Figure 2B As shown, the first terminal 71 is continuous with the metal support layer 4. Therefore, the first terminal 71 is electrically connected to the metal support layer 4.

[0095] In addition, such as Figure 1As shown, the first terminal 71 has a first end 71A disposed away from the metal support layer 4 and a second end 71B disposed between the first end 71A and the metal support layer 4. In other words, the first end 71A is disposed spaced apart from the metal support layer 4 in a first direction. Additionally, the second end 71B is disposed spaced apart from the first end 71A in the first direction toward the metal support layer 4. The second end 71B may also be connected to the metal support layer 4.

[0096] like Figure 2B As shown, the first terminal 71 has a metal layer 711, a terminal conductor layer 712, a terminal cover layer 713, and a terminal insulating layer 714.

[0097] Metal layer 711 is continuous with metal support layer 4. Metal layer 711 and metal support layer 4 are in the same layer. Metal layer 711 contains the same material as metal support layer 4. In this embodiment, metal layer 711 extends in a first direction from the end of metal support layer 4 on the side of wiring 33B opposite to wiring 33A to the side of wiring 33B opposite to wiring 33A.

[0098] Terminal conductor layer 712 is disposed on one side of metal layer 711 in the thickness direction. Terminal conductor layer 712 is disposed on one side surface of metal layer 711 in the thickness direction. Terminal conductor layer 712 is continuous with conductor layer 5. Terminal conductor layer 712 and conductor layer 5 are in the same layer. Terminal conductor layer 712 contains the same material as conductor layer 5. In this embodiment, terminal conductor layer 712 extends in a first direction from the end of conductor layer 5 on the side of wiring 33B opposite to wiring 33A to the side of wiring 33B opposite to wiring 33A.

[0099] A bonding layer may be disposed between the metal layer 711 and the terminal conductor layer 712 to bond the metal layer 711 and the terminal conductor layer 712. The bonding layer comprises a metal. Examples of materials for the bonding layer include chromium, nickel, titanium, and alloys thereof.

[0100] Furthermore, a protective metal layer for protecting the terminal conductor layer 712 is preferably disposed between the terminal conductor layer 712 and the terminal insulating layer 714. The protective metal layer comprises a metal. Examples of materials for the protective metal layer include chromium, nickel, titanium, and alloys thereof.

[0101] It should be noted that the diagrams for the bonding layer and the protective metal layer have been omitted.

[0102] In the thickness direction, the terminal cover layer 713 covers at least a portion of the terminal conductor layer 712. The terminal cover layer 713 covers at least a portion of one side surface S11 of the terminal conductor layer 712 in the thickness direction. In the thickness direction, the terminal cover layer 713 covers the remaining portion of the terminal conductor layer 712. The remaining portion of the terminal conductor layer 712 is the portion of one side surface S11 of the terminal conductor layer 712 that is not covered by the terminal insulating layer 714. In other words, in the thickness direction, the terminal cover layer 713 covers the entire one side surface S11 of the terminal conductor layer 712 exposed from the terminal insulating layer 714. In this embodiment, in the thickness direction, the terminal cover layer 713 at least covers one side surface S11 of the terminal conductor layer 712 at the first end 71A. In the thickness direction, the terminal cover layer 713 does not cover one side surface S11 of the terminal conductor layer 712 at the second end 71B. Furthermore, the terminal cover layer 713 covers the entire other surface S12 of the metal layer 711 in the thickness direction, the entire end face S13 of the terminal conductor layer 712, and the entire end face S14 of the metal layer 711. It should be noted that, in this embodiment, the end face S13 of the terminal conductor layer 712 is continuous with the end face S14 of the metal layer 711 in the thickness direction.

[0103] Terminal cover layer 713 has a surface layer 713A. Terminal cover layer 713 preferably has an intermediate layer 713B. Terminal cover layer 713 may also lack an intermediate layer 713B. Intermediate layer 713B is disposed between metal layer 711 and surface layer 713A, and between terminal conductor layer 712 and surface layer 713A. Terminal cover layer 713 is continuous with cover layer 6. Specifically, surface layer 713A is continuous with surface layer 61 of cover layer 6. Intermediate layer 713B is continuous with intermediate layer 62 of cover layer 6. Surface layer 713A contains a metal different from metal layer 711 and terminal conductor layer 712. Surface layer 713A contains the same material as surface layer 61 of cover layer 6. Surface layer 713A contains, for example, gold. Intermediate layer 713B contains a metal different from metal layer 711, terminal conductor layer 712, and surface layer 713A. Intermediate layer 713B contains the same material as intermediate layer 62 of cover layer 6. The intermediate layer 713B contains, for example, nickel. That is, the terminal cover layer 713 contains metal.

[0104] The terminal insulating layer 714 is disposed on one side of the metal layer 711 in the thickness direction. Specifically, in the thickness direction, the terminal insulating layer 714 is disposed on at least one side of the metal layer 711 at the second end 71B.

[0105] The terminal insulating layer 714 covers at least a portion of the terminal conductor layer 712 in the thickness direction. The terminal insulating layer 714 also covers at least a portion of one side surface S11 of the terminal conductor layer 712 in the thickness direction. In the thickness direction, the terminal insulating layer 714 at least covers one side surface S11 of the terminal conductor layer 712 at the second end 71B. In this embodiment, the terminal insulating layer 714 does not cover one side surface S11 of the terminal conductor layer 712 at the first end 71A in the thickness direction. At least a portion of one side surface S11 of the terminal conductor layer 712 in the thickness direction is exposed from the terminal insulating layer 714.

[0106] In this embodiment, the terminal insulating layer 714 is continuous with the first insulating layer 2. The terminal insulating layer 714 and the first insulating layer 2 are on the same layer. The terminal insulating layer 714 contains the same material as the first insulating layer 2. The thickness of the terminal insulating layer 714 may be the same as or different from the thickness of the first insulating layer 2. In this embodiment, the terminal insulating layer 714 extends in a first direction from the end of the first insulating layer 2 on the side of the wiring 33B opposite to the side of the wiring 33A opposite to the side of the wiring 33B opposite to the side of the wiring 33A.

[0107] The thickness of the terminal insulation layer 714 is preferably thicker than the thickness of the terminal cover layer 713.

[0108] In addition, in this embodiment, such as Figure 1 As shown, viewed from the thickness direction, the terminal insulating layer 714 is approximately rectangular in shape. In other words, the terminal insulating layer 714 is approximately rectangular in shape when viewed from above.

[0109] (6-2) Second terminal like Figure 1 As shown, in this embodiment, the second terminal 72 is disposed at the other end of the wiring circuit board 1 in a second direction. The second terminal 72 has a generally rectangular shape. The position and shape of the second terminal 72 are not limited to this embodiment.

[0110] like Figure 2A As shown, the second terminal 72 is disposed on one side of the first insulating layer 2 in the thickness direction. The second terminal 72 is electrically connected to the conductor layer 5 through the through hole 21 in the first insulating layer 2.

[0111] The second terminal 72 has a conductor layer 721, just like the terminal 31A of the first circuit pattern 3.

[0112] The second terminal 72 may also have a cover layer 722 as needed.

[0113] The conductor layer 721 is disposed on one side surface of the first insulating layer 2 in the thickness direction. The conductor layer 721 contains the same material as the terminal 31A of the first circuit pattern 3.

[0114] A protective metal layer for protecting the conductor layer 721 is preferably disposed between the conductor layer 721 and the second insulating layer 8. The protective metal layer comprises a metal. Examples of materials for the protective metal layer include chromium, nickel, titanium, and alloys thereof.

[0115] It should be noted that the illustration of the protective metal layer has been omitted.

[0116] A capping layer 722 covers the surface of the conductor layer 721. In this embodiment, the capping layer 722 covers the central portion (the portion not covered by the second insulating layer 8) of one side surface of the conductor layer 721 in the thickness direction. The capping layer 722 has a surface layer 722A. The surface layer 722A contains, for example, gold. The capping layer 722 preferably has an intermediate layer 722B. The capping layer 722 may also not have an intermediate layer 722B. The intermediate layer 722B is disposed between the conductor layer 721 and the surface layer 722A. The intermediate layer 722B contains, for example, nickel.

[0117] (7) Second insulating layer The second insulating layer 8 is disposed on one side of the first insulating layer 2 in the thickness direction. The second insulating layer 8 is disposed on one side surface of the first insulating layer 2 in the thickness direction. The second insulating layer 8 comprises a resin. Examples of resins include polyimide, maleimide, epoxy resin, polybenzoxazole, and polyester. The second insulating layer 8 covers at least a portion of the first circuit pattern 3. The second insulating layer 8 covers wirings 33A and 33B (see reference). Figure 1 The second insulating layer 8 may also cover the periphery of terminals 31A, 31B, 32A, 32B and the second terminal 72. The second insulating layer 8 does not cover the central portion of terminals 31A, 31B, 32A, 32B and the second terminal 72.

[0118] 2. Manufacturing method of wiring circuit board Next, the manufacturing method of the wiring circuit board 1 will be described.

[0119] The manufacturing method of wiring circuit board 1 includes a conductor layer formation process (see reference). Figure 3A ), the first insulating layer formation process (refer to Figure 3B Conductor pattern formation process (refer to) Figure 3C ), the second insulating layer formation process (refer to) Figure 4A ), External processing procedures (refer to) Figure 4B ) and the coating layer formation process (refer to Figure 4C ).

[0120] (1) Conductor layer formation process like Figure 3A As shown, in the conductor layer formation process, the conductor layer P is formed on the entire surface of the metal substrate M, for example by electroplating.

[0121] In detail, firstly, in the thickness direction, the aforementioned bonding layer is formed on one side surface of the substrate M. The bonding layer is formed, for example, by sputtering.

[0122] Next, a conductor layer P is formed on the bonding layer, for example by electroplating.

[0123] It should be noted that, without forming a bonding layer, a conductor layer P is formed on one side surface of the substrate M, for example, by electroplating.

[0124] (2) First insulating layer formation process Next, as Figure 3B As shown, in the first insulating layer forming process, a first insulating layer 2 and a terminal insulating layer 714 are formed on one side surface of the conductor layer P.

[0125] In detail, in the first insulating layer formation process, firstly, the aforementioned protective metal layer is formed on one side surface of the conductor layer P in the thickness direction. The protective metal layer is formed, for example, by sputtering.

[0126] Next, a solution of photosensitive resin (varnish) is coated onto the conductor layer P and dried to form a photosensitive resin coating. Then, the photosensitive resin coating is exposed and developed. This yields the first insulating layer 2 and the terminal insulating layer 714.

[0127] In detail, after forming a photosensitive resin coating on the conductor layer P, the portions where the first insulating layer 2 and the terminal insulating layer 714 will not form are shielded from light using a photomask or the like. Subsequently, if development is performed, the photosensitive resin coating on the shielded portions is removed, preventing the formation of the first insulating layer 2 or the terminal insulating layer 714.

[0128] In the thickness direction, at least a portion of one side surface of the conductor layer P is not formed with the first insulating layer 2 and the terminal insulating layer 714. Specifically, as Figure 3B As shown, in the thickness direction, the terminal insulating layer 714 is not formed on one side surface of the terminal cover layer 713 of the conductor layer P. That is, in the thickness direction, the photosensitive resin coating is removed from one side surface of the terminal cover layer 713 of the conductor layer P. In addition, although not shown, the photosensitive resin coating at the location where the through hole 21 is formed is also removed. Thus, the through hole 21 is formed.

[0129] (3) Conductor pattern formation process Next, as Figure 3C As shown, in the conductor pattern forming process, a conductor pattern 10 is formed on the first insulating layer 2. The conductor pattern 10 has conductor layers 311 for each of terminals 31A, 31B, 32A, and 32B, wirings 33A and 33B, and a conductor layer 721 for the second terminal 72.

[0130] In detail, firstly, a seed layer is formed on one side surface of the first insulating layer 2 and one side surface of the conductor layer P in the thickness direction. The seed layer is formed, for example, by sputtering. Examples of materials for the seed layer include chromium, copper, nickel, titanium, and alloys thereof.

[0131] Next, the seed layer is covered with an anti-plating agent.

[0132] Next, the resist is exposed and developed. Thus, the resist in the areas where the conductor pattern 10 is formed is removed, and the seed layer is exposed in the areas where the conductor pattern 10 is formed. On the other hand, the resist remains in the areas where the conductor pattern 10 is not formed.

[0133] Next, a conductor pattern 10 is formed on the exposed seed layer by electroplating. After electroplating, the resist is stripped, and the seed layer exposed due to the stripping of the resist is removed by etching.

[0134] Thus, a conductor pattern 10 is formed on the first insulating layer 2.

[0135] (4) Second insulation layer formation process Next, as Figure 4A As shown, in the second insulating layer forming process, a second insulating layer 8 is formed on top of the first insulating layer 2.

[0136] In detail, in the second insulating layer forming process, firstly, the aforementioned protective metal layer is formed on the exposed surface of the conductor pattern 10 in the thickness direction. The protective metal layer is formed, for example, by chemical plating.

[0137] Next, a solution of photosensitive resin (varnish) is applied and dried over the conductor pattern 10, the first insulating layer 2, and the conductor layer P to form a photosensitive resin coating.

[0138] Next, the photosensitive resin coating is exposed and developed. As a result, a second insulating layer 8 is formed on the first insulating layer 2.

[0139] In detail, after a photosensitive resin coating is formed on the conductor pattern 10, the first insulating layer 2 and the conductor layer P, the portion where the second insulating layer 8 is not formed is shielded using a photomask or the like.

[0140] If development is then performed, the coating of the photosensitive resin on the shaded area is removed, and a second insulating layer 8 is not formed.

[0141] (5) External processing procedures Next, as Figure 4B As shown, in the shape processing step, the substrate M and the conductor layer P are etched to form the metal support layer 4, the conductor layer 5, the metal layer 711 and the terminal conductor layer 712.

[0142] (6) Covering layer formation process Next, as Figure 4C As shown, in the capping layer formation process, for example, electroless nickel plating and electroless gold plating are performed sequentially to simultaneously form capping layer 312, capping layer 722, capping layer 6, and terminal capping layer 713. It should be noted that capping layer 312, capping layer 722, capping layer 6, and terminal capping layer 713 can also be formed by electroplating.

[0143] Thus, the wiring circuit board 1 described above is obtained.

[0144] 3. Effects (1) According to the wiring circuit board 1, such as Figure 1 and Figure 2B As shown, the first terminal 71 of the second circuit pattern 7 has a metal layer 711 that is continuous with the metal support layer 4.

[0145] Therefore, a second circuit pattern 7 independent of the first circuit pattern 3 can be designed using the metal support layer 4 that supports the first circuit pattern 3.

[0146] As a result, it enables greater freedom in circuit design.

[0147] Furthermore, since the metal layer 711 of the first terminal 71 is continuous with the metal support layer 4, compared with the case where a part of the metal support layer 4 is separated from the metal support layer 4 to form the second circuit pattern 7, it is possible to suppress the reduction of the rigidity of the metal support layer 4 due to the formation of the second circuit pattern 7.

[0148] (2) According to the wiring circuit board 1, such as Figure 2B As shown, a terminal insulating layer 714 is disposed between the first end 71A and the second end 71B of the first terminal 71.

[0149] Therefore, when the electronic component is joined at the first terminal 71, the flow of solder to the second terminal 71B side (metal support layer 4 side) can be suppressed, and the solder is concentrated on the side closer to the first terminal 71A than the terminal insulating layer 714.

[0150] As a result, the reliability of the connection between the first terminal 71 and the electronic components can be improved.

[0151] (3) According to the wiring circuit board 1, such as Figure 2B As shown, the terminal insulating layer 714 is disposed at least on one side of the metal layer 711 at the second end 71B.

[0152] Therefore, when the electronic component is joined at the first terminal 71, the flow of solder to the second terminal 71B can be suppressed, and the solder is concentrated on the side closer to the first terminal 71A than the terminal insulating layer 714.

[0153] As a result, the reliability of the connection between the first terminal 71 and the electronic components can be improved.

[0154] (4) According to the wiring circuit board 1, such as Figure 2B As shown, the terminal insulating layer 714 is continuous with the first insulating layer 2.

[0155] Therefore, when the electronic component is joined at the first terminal 71, the flow of solder to the second terminal 71B side (metal support layer 4 side) can be more reliably suppressed.

[0156] As a result, the reliability of the connection between the first terminal 71 and the electronic components can be improved.

[0157] (5) such as Figure 2A and Figure 2B As shown, the wiring circuit board 1 includes a conductor layer 5. The conductor layer 5 is disposed between the first insulating layer 2 and the metal support layer 4 in the thickness direction.

[0158] Therefore, it is possible to improve the electrical characteristics of the wiring circuit board 1.

[0159] (6) According to the wiring circuit board 1, such as Figure 2B As shown, the first terminal 71 has a terminal conductor layer 712 that is continuous with the conductor layer 5.

[0160] Therefore, it is possible to use conductor layer 5 to design a second circuit pattern 7 that is independent of the first circuit pattern 3.

[0161] As a result, the degree of freedom in circuit design can be increased, and the conductivity of the second circuit pattern 7 can be improved.

[0162] (7) According to the wiring circuit board 1, such as Figure 2B As shown, the first terminal 71 has a terminal cover layer 713 that covers at least a portion of the terminal conductor layer 712.

[0163] Therefore, the terminal conductor layer 712 can be protected by the terminal cover layer 713.

[0164] (8) According to the wiring circuit board 1, such as Figure 2B As shown, the terminal insulation layer 714 at least covers the terminal conductor layer 712 at the second end 71B, and the terminal cover layer 713 covers the remaining portion of the terminal conductor layer 712.

[0165] Therefore, the terminal conductor layer 712 can be protected by the terminal insulation layer 714 and the terminal cover layer 713.

[0166] Furthermore, according to this structure, when the electronic component is joined at the first terminal 71, one side surface of the terminal cover layer 713 can be used as a joining surface. In addition, solder can be concentrated on one side surface of the terminal cover layer 713 by the terminal insulating layer 714.

[0167] As a result, the reliability of the connection between the first terminal 71 and the electronic components can be improved.

[0168] (9) According to the wiring circuit board 1, such as Figure 2B As shown, the thickness of the terminal insulation layer 714 is greater than the thickness of the terminal cover layer 713.

[0169] Therefore, the terminal conductor layer 712 can be protected by the terminal insulation layer 714 and the terminal cover layer 713.

[0170] Furthermore, with this structure, when the electronic component is joined at the first terminal 71, the flow of solder to the second terminal 71B side (metal support layer 4 side) can be more reliably suppressed by the thickness of the terminal insulating layer 714.

[0171] As a result, the reliability of the connection between the first terminal 71 and the electronic components can be further improved.

[0172] 4. Variations The following describes a variation. In the variation, the same symbols are used to mark the same components as in the above-described embodiment, and the description is omitted.

[0173] (1) such as Figure 5A As shown, the wiring circuit board 1 may also not have a conductor layer 5. In this case, the metal support layer 4 is in contact with the other side surface of the first insulating layer 2 in the thickness direction.

[0174] In addition, such as Figure 5B As shown, the first terminal 71 may also have a metal layer 711, a terminal cover layer 713 and a terminal insulation layer 714, but without a terminal conductor layer 712.

[0175] In the thickness direction, the terminal cover layer 713 covers at least a portion of the metal layer 711. The terminal cover layer 713 covers at least a portion of one side surface S15 of the metal layer 711 in the thickness direction. In the thickness direction, the terminal cover layer 713 covers the remaining portion of the metal layer 711. The remaining portion of the metal layer 711 is the portion of one side surface S15 of the terminal conductor layer 712 that is not covered by the terminal insulating layer 714. In other words, in the thickness direction, the terminal cover layer 713 covers the entire side surface S15 of the metal layer 711 exposed from the terminal insulating layer 714. In this modified example, in the thickness direction, the terminal cover layer 713 covers at least one side surface S15 of the metal layer 711 at the first end 71A. In the thickness direction, the terminal cover layer 713 does not cover one side surface S15 of the metal layer 711 at the second end 71B. Furthermore, the terminal cover layer 713 covers the entire other side surface S12 of the metal layer 711 in the thickness direction and the entire end face S14 of the metal layer 711.

[0176] The terminal insulating layer 714 covers at least a portion of the metal layer 711 in the thickness direction. The terminal insulating layer 714 also covers at least a portion of one side surface S15 of the metal layer 711 in the thickness direction. In the thickness direction, the terminal insulating layer 714 at least covers one side surface S15 at the second end 71B of the metal layer 711. In this modified example, the terminal insulating layer 714 does not cover one side surface S15 at the first end 71A of the metal layer 711 in the thickness direction. At least a portion of one side surface S15 of the metal layer 711 in the thickness direction is exposed from the terminal insulating layer 714.

[0177] like Figure 5A As shown, when the wiring circuit board 1 does not have a conductor layer 5, the second terminal 72 is electrically connected to the metal support layer 4 through the through hole 21 of the first insulating layer 2.

[0178] Thus, the first terminal 71 and the second terminal 72 can be electrically connected via the metal support layer 4.

[0179] According to the wiring circuit board 1, such as Figure 5B As shown, the terminal insulating layer 714 at least covers the metal layer 711 at the second end 71B, and the terminal cover layer 713 covers the remaining portion of the metal layer 711. Therefore, the metal layer can be protected by the terminal insulating layer and the terminal cover layer.

[0180] Furthermore, according to this wiring circuit board 1, when bonding with an electronic component at the first terminal 71, one side surface of the terminal cover layer 713 can be used as a bonding surface, and solder can be concentrated on one side surface of the terminal cover layer 713 by the terminal insulating layer 714. As a result, the bonding reliability between the first terminal 71 and the electronic component can be improved.

[0181] (2) such as Figure 6 As shown, the wiring circuit board 1 may not have a cover layer 6. Furthermore, the first terminal 71 may have a metal layer 711, a terminal conductor layer 712, and a terminal insulating layer 714, but not a terminal cover layer 713.

[0182] The terminal insulating layer 714 covers at least a portion of the terminal conductor layer 712 in the thickness direction. The terminal insulating layer 714 covers at least a portion of one side surface S11 of the terminal conductor layer 712 in the thickness direction. In the thickness direction, the terminal insulating layer 714 at least covers one side surface S11 of the terminal conductor layer 712 at the second end 71B. At least a portion of one side surface S11 of the terminal conductor layer 712 in the thickness direction is exposed from the terminal insulating layer 714.

[0183] If the wiring circuit board 1 does not have a cover layer 6, the cover layer forming process can be performed after the second insulating layer forming process and before the shape processing process.

[0184] According to the wiring circuit board 1, such as Figure 6 As shown, the terminal insulating layer 714 at least covers the metal layer 711 at the second end 71B, and at least a portion of one side surface of the metal layer 711 in the thickness direction is exposed from the terminal insulating layer 714. Therefore, when bonding with an electronic component at the first terminal 71, one side surface of the metal layer 711 can be used as a bonding surface, and solder can be concentrated on the exposed side surface of the metal layer 711 through the terminal insulating layer 714. As a result, the bonding reliability between the first terminal 71 and the electronic component can be improved.

[0185] (3) such as Figure 7 As shown, the wiring circuit board 1 may not have a cover layer 6. It should be noted that the first terminal 71 has a metal layer 711, a terminal conductor layer 712, a terminal cover layer 713, and a terminal insulating layer 714.

[0186] (4) such as Figure 8A and Figure 8B As shown, the wiring circuit board 1 may not have a cover layer 6. Furthermore, the end face S2 of the metal support layer 4 may be discontinuous with the end face S3 of the conductor layer 5, and the end face S14 of the metal layer 711 may be discontinuous with the end face S13 of the terminal conductor layer 712.

[0187] Specifically, such as Figure 8A As shown, the end face S3 of the conductor layer 5 can be configured to be closer to the inside than the end face S2 of the metal support layer 4, and is covered by the first insulating layer 2. Additionally, as... Figure 8B As shown, the end face S13 of the terminal conductor layer 712 can be configured to be closer to the inside than the end face S14 of the metal layer 711, and is covered by the terminal cover layer 713.

[0188] In the case of manufacturing the wiring circuit board 1 of this modified example, in the conductor layer formation process, after forming a resist in the portion where the conductor layer 5 or terminal conductor layer 712 is not formed, the conductor layer P is formed by electroplating. Then, the resist is removed. It should be noted that if an bonding layer is formed on the substrate M, the bonding layer in the portion where the resist has been removed is also removed.

[0189] (5) such as Figure 9 As shown, the wiring circuit board 1 may not have the conductor layer 5 and the cover layer 6. Furthermore, the first terminal 71 may have a metal layer 711 and a terminal insulating layer 714, but not a terminal conductor layer 712 and a terminal cover layer 713.

[0190] The terminal insulating layer 714 covers at least a portion of the metal layer 711 in the thickness direction. The terminal insulating layer 714 also covers at least a portion of one side surface S15 of the metal layer 711 in the thickness direction. In the thickness direction, the terminal insulating layer 714 at least covers one side surface S15 at the second end 71B of the metal layer 711. In this modified example, the terminal insulating layer 714 does not cover one side surface S15 at the first end 71A of the metal layer 711 in the thickness direction. At least a portion of one side surface S15 of the metal layer 711 in the thickness direction is exposed from the terminal insulating layer 714.

[0191] (6) For example Figure 10 As shown, the wiring circuit board 1 may not have a conductor layer 5 and a cover layer 6. Furthermore, the first terminal 71 may have a metal layer 711, a terminal cover layer 713, and a terminal insulating layer 714, but not a terminal conductor layer 712.

[0192] (7) For example Figure 11 As shown, the terminal insulating layer 714 can be continuous with the second insulating layer 8. The terminal insulating layer 714 and the second insulating layer 8 are on the same layer. The terminal insulating layer 714 contains the same material as the second insulating layer 8. The thickness of the terminal insulating layer 714 can be the same as or different from the thickness of the second insulating layer 8. It should be noted that, in this modified example, the thickness of the terminal insulating layer 714 is thinner than the total thickness of the first insulating layer 2 and the second insulating layer 8.

[0193] According to the wiring circuit board 1, such as Figure 11 As shown, the terminal insulating layer 714 is continuous with the second insulating layer 8. Therefore, when the electronic component is bonded at the first terminal 71, the flow of solder to the second terminal 71B side (metal support layer 4 side) can be more reliably suppressed. As a result, the bonding reliability between the first terminal 71 and the electronic component can be improved.

[0194] (8) such as Figure 12As shown, the terminal insulating layer 714 can be continuous with the first insulating layer 2 and the second insulating layer 8. The terminal insulating layer 714 is a stack of the first insulating layer 2 and the second insulating layer 8. The thickness of the terminal insulating layer 714 can be the same as or different from the total thickness of the first insulating layer 2 and the second insulating layer 8. It should be noted that in this modified example, the thickness of the terminal insulating layer 714 is the same as the total thickness of the first insulating layer 2 and the second insulating layer 8.

[0195] According to the wiring circuit board 1, such as Figure 9 As shown, the terminal insulating layer 714 is continuous with the first insulating layer 2 and the second insulating layer 8. Therefore, when the electronic component is bonded at the first terminal 71, the flow of solder to the second terminal 71B side (metal support layer 4 side) can be more reliably suppressed. As a result, the bonding reliability between the first terminal 71 and the electronic component can be improved.

[0196] (9) such as Figure 13 As shown, the terminal insulating layer 714 may not be continuous with the first insulating layer 2 and the second insulating layer 8. The terminal insulating layer 714 is formed independently of the first insulating layer 2 and the second insulating layer 8.

[0197] In this modified example, the terminal insulating layer 714 is disposed on one side of the metal layer 711 between the first end 71A and the second end 71B in the thickness direction. Specifically, the terminal insulating layer 714 is disposed on the side of the second end 71B with a distance spaced apart from the first end 71A. In addition, the terminal insulating layer 714 is disposed on the side of the first end 71A with a distance spaced apart from the second end 71B.

[0198] Furthermore, in this modified example, in the thickness direction, the terminal insulating layer 714 does not cover one side surface S11 at the first end 71A and the second end 71B of the terminal conductor layer 712. At least a portion of one side surface S11 of the terminal conductor layer 712 in the thickness direction is exposed from the terminal insulating layer 714.

[0199] (10) such as Figure 14 As shown, when viewed from the thickness direction, the terminal insulating layer 714 can be approximately L-shaped. In other words, the terminal insulating layer 714 can be approximately L-shaped when viewed from above.

[0200] A portion of the terminal insulating layer 714 on the second direction side extends toward the first end 71A. In this modified example, a portion of the terminal insulating layer 714 on the second direction side extends to the first end 71A.

[0201] (11) such as Figure 15 As shown, when viewed from the thickness direction, the terminal insulating layer 714 can be approximately U-shaped. In other words, the terminal insulating layer 714 can be approximately U-shaped when viewed from above.

[0202] A portion of the terminal insulating layer 714 on one side of the second direction and the other side of the second direction extends toward the first end 71A. In this modified example, a portion of the terminal insulating layer 714 on one side of the second direction and the other side of the second direction extends to the first end 71A.

[0203] (12) such as Figure 16 As shown, when viewed from the thickness direction, the terminal insulating layer 714 can be approximately square annular in shape. In other words, the terminal insulating layer 714 can be square annular in shape when viewed from above. In this modified example, when viewed from the thickness direction, the terminal insulating layer 714 is approximately quadrilateral annular in shape.

[0204] In this modified example, the terminal insulating layer 714 covers one side surface S11 of the terminal conductor layer 712 at the first end 71A and the second end 71B, and has an opening between the first end 71A and the second end 71B. Viewed in the thickness direction, the opening is approximately rectangular in shape. More specifically, viewed in the thickness direction, the opening is approximately quadrilateral in shape.

[0205] It should be noted that in this modified example, the terminal cover layer 713 is not continuous with the cover layer 6.

[0206] (13) such as Figure 17A As shown, the second circuit pattern 7 may include a wiring portion 73. The second circuit pattern 7 includes a wiring portion 73 between the first terminal 71 and the metal support layer 4.

[0207] like Figure 17B As shown, the wiring section 73 has a metal layer 731, a conductor layer 732 and an insulating layer 733.

[0208] The metal layer 711 of the first terminal 71 is continuous with the metal support layer 4 via the metal layer 731. In other words, the metal layer 711 of the first terminal 71 is electrically connected to the metal support layer 4 via the metal layer 731. The terminal conductor layer 712 of the first terminal 71 is continuous with the conductor layer 5 via the conductor layer 732. In other words, the terminal conductor layer 712 of the first terminal 71 is electrically connected to the conductor layer 5 via the conductor layer 732. In addition, the terminal insulating layer 714 of the first terminal 71 is continuous with the first insulating layer 2 via the insulating layer 733.

[0209] In addition, the first terminal 71 and the second terminal 72 are electrically connected via the conductor layer 5 and the conductor layer 732 of the wiring portion 73.

[0210] It should be noted that, although not shown in the figure, when the wiring circuit board 1 does not have the conductor layer 5 and the terminal conductor layer 712, the wiring section 73 does not have the conductor layer 732. In this case, the first terminal 71 and the second terminal 72 are electrically connected to the metal layer 731 of the wiring section 73 via the metal support layer 4.

[0211] (14) In the above variations (1) to (13), the degree of freedom of circuit design can be increased, just like in the above embodiments.

[0212] It should be noted that the above-described invention is provided as an illustrative embodiment of the present invention, but this is merely illustrative and should not be interpreted as limiting. Modifications of the invention that will be obvious to those skilled in the art are included within the scope of protection claimed in this application.

[0213] Industrial applicability The wiring circuit board of the present invention can be used for connecting electronic components.

[0214] Explanation of reference numerals in the attached figures 1. Wiring circuit board 3. First circuit pattern 4 Metal support layer 5 Conductor layer 6. Covering layer 7. Second Circuit Diagram 71 First terminal 71A First End 71B Second End 72 Second Terminal 711 metal layer 712 Terminal Conductor Layer 713 Terminal Cover Layer 714 Terminal Insulation Layer.

Claims

1. A wiring circuit board, characterized in that, have: First insulating layer; A first circuit pattern is disposed on one side of the first insulating layer in the thickness direction of the first insulating layer. A metal support layer is disposed in the thickness direction on the side of the first insulating layer opposite to the first circuit pattern, is insulated from the first circuit pattern by the first insulating layer, and supports the first circuit pattern and the first insulating layer. as well as A second circuit pattern independent of the first circuit pattern. The second circuit pattern has a first terminal. The first terminal has: a metal layer continuous with the metal support layer, and a terminal insulating layer disposed on one side of the metal layer in the thickness direction. The first terminal has: a first end disposed away from the metal support layer, and a second end disposed between the first end and the metal support layer. The terminal insulation layer is disposed between the first end and the second end.

2. The wiring circuit board according to claim 1, wherein, In the thickness direction, the terminal insulating layer is disposed at least on one side of the metal layer at the second end.

3. The wiring circuit board according to claim 1, wherein, The terminal insulation layer is continuous with the first insulation layer.

4. The wiring circuit board according to claim 1, wherein, The wiring circuit board also includes a second insulating layer that covers at least a portion of the first circuit pattern. The terminal insulation layer is continuous with the second insulation layer.

5. The wiring circuit board according to claim 4, wherein, The terminal insulation layer is continuous with the first insulation layer and the second insulation layer.

6. The wiring circuit board according to claim 1, wherein, The terminal insulation layer at least covers the metal layer at the second end. At least a portion of the metal layer on one side surface in the thickness direction is exposed from the terminal insulation layer.

7. The wiring circuit board according to claim 1, wherein, The first terminal also has a metal terminal cover layer that covers at least a portion of the metal layer.

8. The wiring circuit board according to claim 7, wherein, The terminal insulation layer at least covers the metal layer at the second end. The terminal cover layer covers the remaining portion of the metal layer.

9. The wiring circuit board according to claim 7, wherein, The thickness of the terminal insulation layer is greater than the thickness of the terminal cover layer.

10. The wiring circuit board according to claim 1, wherein, The wiring circuit board further includes a conductor layer disposed in the thickness direction between the first insulating layer and the metal support layer.

11. The wiring circuit board according to claim 10, wherein, The first terminal also has a terminal conductor layer that is continuous with the conductor layer.

12. The wiring circuit board according to claim 11, wherein, The terminal insulation layer at least covers the terminal conductor layer at the second end. At least a portion of one side surface of the terminal conductor layer in the thickness direction is exposed from the terminal insulation layer.

13. The wiring circuit board according to claim 11, wherein, The first terminal also has a metallic terminal cover layer that covers at least a portion of the terminal conductor layer.

14. The wiring circuit board according to claim 13, wherein, The terminal insulation layer at least covers the terminal conductor layer at the second end. The terminal cover layer covers the remaining portion of the terminal conductor layer.

15. The wiring circuit board according to claim 13, wherein, The thickness of the terminal insulation layer is greater than the thickness of the terminal cover layer.

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