Wiring circuit board

Abstract

The present application relates to a wiring circuit substrate. The wiring circuit substrate of the present application includes a first insulating layer, a first circuit pattern, a metal support layer insulated from the first circuit pattern by the first insulating layer, and a second circuit pattern independent of the first circuit pattern. In addition, the second circuit pattern includes a first terminal including a metal layer continuous with the metal support layer, a terminal metal layer disposed on one side of the metal layer in a thickness direction, a terminal cover layer made of metal covering the terminal metal layer, and a close contact layer disposed between the metal layer and the terminal cover layer in the thickness direction.

Description

Technical Field

[0001] This invention relates to wiring circuit boards. Background Technology

[0002] Previously, a wiring circuit board was known to have a metal support layer, a base insulating layer disposed on one side of the metal support layer, and a conductor layer disposed on one side of the base insulating layer (for example, see Patent Document 1 below).

[0003] Existing technical documents Patent documents Patent Document 1: Japanese Patent Application Publication No. 2020-188189 Summary of the Invention The technical problem that the invention aims to solve Regarding the wiring circuit board described in Patent Document 1, further research can be conducted to increase the degree of freedom in circuit design.

[0004] This invention provides a wiring circuit board that enables greater freedom in circuit design.

[0005] Technical solutions for solving technical problems The present invention [1] includes a wiring circuit board comprising: a first insulating layer; a first circuit pattern disposed on one side of the first insulating layer in the thickness direction; a metal support layer disposed on the side of the first insulating layer opposite to the first circuit pattern in the thickness direction, insulating the first circuit pattern from the first insulating layer through the first insulating layer, and supporting the first circuit pattern and the first insulating layer; and a second circuit pattern independent of the first circuit pattern, the second circuit pattern having a first terminal, the first terminal comprising: a metal layer continuous with the metal support layer; a terminal metal layer disposed on one side of the metal layer in the thickness direction; a metal terminal cover layer covering the terminal metal layer; and an adhesive layer disposed between the metal layer and the terminal cover layer in the thickness direction.

[0006] According to this structure, the first terminal of the second circuit pattern has a metal layer that is continuous with the metal support layer.

[0007] Therefore, a second circuit pattern independent of the first circuit pattern can be designed using the metal support layer that supports the first circuit pattern.

[0008] As a result, it enables greater freedom in circuit design.

[0009] Furthermore, since the metal layer of the first terminal is continuous with the metal support layer, compared to the case where a portion of the metal support layer is separated from the metal support layer to form the second circuit pattern, it is possible to suppress the reduction in rigidity of the metal support layer due to the formation of the second circuit pattern.

[0010] Furthermore, since the terminal cover layer covers the terminal metal layer, it is possible to protect the terminal metal layer through the terminal cover layer.

[0011] Furthermore, according to this structure, the first terminal has an adhesive layer disposed between the metal layer and the terminal cover layer.

[0012] Therefore, it can suppress the peeling of the terminal cover layer.

[0013] The present invention [2] includes the wiring circuit board described in [1] above, wherein the sealing layer is disposed on the periphery of the terminal metal layer.

[0014] With this structure, peeling of the terminal cover layer can be suppressed at the periphery of the terminal metal layer.

[0015] The present invention [3] includes the wiring circuit board described in [1] or [2] above, wherein, in the thickness direction, the sealing layer is disposed between the metal layer and the terminal metal layer, the sealing layer has an opening, and the terminal metal layer is electrically connected to the metal layer through the opening.

[0016] The present invention [4] includes a wiring circuit board as described in any one of [1] to [3] above, wherein the wiring circuit board further comprises a conductor layer disposed between the first insulating layer and the metal support layer in the thickness direction.

[0017] This structure enables the improvement of the electrical characteristics of the wiring circuit board.

[0018] The present invention [5] includes a wiring circuit board as described in any one of [1] to [4] above, wherein the first terminal further comprises a terminal conductor layer disposed between the metal layer and the terminal metal layer in the thickness direction.

[0019] Based on this structure, the conductivity of the second circuit pattern can be improved.

[0020] The present invention [6] includes the wiring circuit board described above [5], wherein the terminal conductor layer is continuous with the conductor layer.

[0021] Based on this structure, a second circuit pattern, independent of the first circuit pattern, can be designed using the conductor layer.

[0022] As a result, it enables greater freedom in circuit design.

[0023] The present invention [7] includes the wiring circuit board described in [5] or [6] above, wherein, in the thickness direction, the sealing layer is disposed between the terminal conductor layer and the terminal metal layer, the sealing layer has an opening, and the terminal metal layer is electrically connected to the terminal conductor layer through the opening.

[0024] Invention Effects The wiring circuit board according to the present invention enables an increase in the degree of freedom in circuit design. Attached Figure Description

[0025] Figure 1 This is a top view illustrating one embodiment of the wiring circuit board of the present invention. It should be noted that... Figure 1 In this paper, the second insulating layer and the terminal cover layer are omitted.

[0026] Figure 2A yes Figure 1 The diagram shows a cross-sectional view (AA) of the wiring circuit board. Figure 2B yes Figure 1 The diagram shows a BB cross-sectional view of the wiring circuit board.

[0027] Figures 3A-3C It means Figure 1 The diagram shows the manufacturing process of the wiring circuit board. Figure 3A This indicates the conductor layer formation process. Figure 3B This indicates the first insulating layer formation process. Figure 3C This indicates the process of forming a conductor pattern.

[0028] Figures 4A to 4C Is following Figure 3C Next, a process diagram showing the manufacturing process of the wiring circuit board is provided. Figure 4A This indicates the process of forming the second insulating layer. Figure 4B Indicates the external processing steps. Figure 4C This indicates the process of forming the coating layer.

[0029] Figure 5A and Figure 5B Example of a variation of the wiring circuit board (1). Figure 5A It is equivalent to Figure 2A A sectional view of AA section view. Figure 5B It is equivalent to Figure 2B A sectional view of BB.

[0030] Figure 6A and Figure 6B Example of a modified wiring circuit board (2). Figure 6A It is equivalent to Figure 2A A sectional view of AA section view. Figure 6BIt is equivalent to Figure 2B A sectional view of BB.

[0031] Figure 7A and Figure 7B Example of a modified wiring circuit board (3). Figure 7A It is equivalent to Figure 2A A sectional view of AA section view. Figure 7B It is equivalent to Figure 2B A sectional view of BB.

[0032] Figure 8 A and Figure 8 B is a top view of a modified example (4) of the wiring circuit board.

[0033] Figure 9 This is a top view of a modified example (5) of the wiring circuit board.

[0034] Figure 10 This is a top view of a modified example (6) of the wiring circuit board.

[0035] Figure 11A and Figure 11B Example of a modified wiring circuit board (7). Figure 11A This is a top view of a modified example (7) of the wiring circuit board. Figure 11B yes Figure 11A The shown is a CC cross-sectional view of the wiring circuit board. Detailed Implementation

[0036] 1. Wiring circuit board like Figure 1 As shown, in this embodiment, the wiring circuit board 1 extends along a first direction and a second direction. The first direction is the direction in which the plurality of terminals 31A and 31B are arranged. The terminals 31A and 31B will be described later. The second direction is orthogonal to the first direction. The shape of the wiring circuit board 1 is not limited to this embodiment.

[0037] like Figure 2A and Figure 2B As shown, the wiring circuit board 1 includes a first insulating layer 2 as an example of an insulating layer and a first circuit pattern 3 (see reference). Figure 1 4. Metal support layer; 5. Conductor layer; 6. Second circuit pattern (refer to...) Figure 1 ) and the second insulating layer 7.

[0038] (1) First insulating layer The first insulating layer 2 insulates the metal support layer 4 and the conductor layer 5 from the first circuit pattern 3. The first insulating layer 2 comprises a resin. Examples of resins include polyimide, maleimide, epoxy resin, polybenzoxazole, and polyester. The first insulating layer 2 has through holes 22.

[0039] (2) First circuit pattern The first circuit pattern 3 is disposed on one side of the first insulating layer 2 in the thickness direction. The thickness direction is orthogonal to the first direction and the second direction. The first circuit pattern 3 is disposed on one side surface of the first insulating layer 2 in the thickness direction.

[0040] like Figure 1 As shown, the first circuit pattern 3 has multiple terminals 31A, 31B, multiple terminals 32A, 32B, and multiple wirings 33A, 33B. Terminals 31A and 31B are arranged in a first direction. Terminal 31B is configured to be separate from terminal 31A in the first direction. Terminals 31A and 31B extend along the first and second directions, respectively. Terminals 31A and 31B each have a generally rectangular shape.

[0041] like Figure 2A As shown, terminals 31A and 31B each have a conductor layer 311. Terminals 31A and 31B may each have a cover layer 312 as needed.

[0042] The conductor layer 311 is disposed on one side surface of the first insulating layer 2 in the thickness direction. The conductor layer 311 contains a metal. Examples of metals include copper, silver, gold, iron, aluminum, chromium, and alloys thereof. From the viewpoint of obtaining good electrical properties, the conductor layer 311 preferably contains copper.

[0043] A protective metal layer for protecting the conductor layer 311 is preferably disposed between the conductor layer 311 and the second insulating layer 7. The protective metal layer comprises a metal. Examples of materials for the protective metal layer include chromium, nickel, titanium, and alloys thereof.

[0044] It should be noted that the illustration of the protective metal layer has been omitted.

[0045] A capping layer 312 covers the surface of the conductor layer 311. In this embodiment, the capping layer 312 covers the central portion (the portion not covered by the second insulating layer 7) of one side surface of the conductor layer 311 in the thickness direction. The capping layer 312 has a surface layer 312A. The surface layer 312A contains a metal different from that of the conductor layer 311. The surface layer 312A contains, for example, gold. The capping layer 312 preferably has an intermediate layer 312B. The capping layer 312 may also not have an intermediate layer 312B. The intermediate layer 312B is disposed between the conductor layer 311 and the surface layer 312A. The intermediate layer 312B contains a metal different from that of the conductor layer 311 and the surface layer 312A. The intermediate layer 312B contains, for example, nickel.

[0046] like Figure 1As shown, terminal 32A is configured to be separate from terminal 31A in a second direction. Terminal 32B is configured to be separate from terminal 31B in a second direction. Terminals 32A and 32B are arranged in a first direction. Terminal 32B is configured to be separate from terminal 32A in a first direction. Terminals 32A and 32B each have, for example, a generally rectangular shape. The description of terminals 32A and 32B is the same as the description of terminals 31A and 31B. Therefore, the description of terminals 32A and 32B is omitted.

[0047] Wiring 33A electrically connects terminal 31A and terminal 32A. One end of wiring 33A is connected to terminal 31A. Specifically, one end of wiring 33A is connected to the conductor layer 311 of terminal 31A (see reference). Figure 2A The other end of wiring 33A is connected to terminal 32A. Specifically, the other end of wiring 33A is connected to the conductor layer 311 of terminal 32A (see reference). Figure 2A )connect.

[0048] Wiring 33B electrically connects terminal 31B and terminal 32B. One end of wiring 33B is connected to terminal 31B. The other end of wiring 33B is connected to terminal 32B.

[0049] Wiring 33A and 33B contain the same material as conductor layer 311.

[0050] (3) Metal support layer like Figure 2A and Figure 2B As shown, the metal support layer 4 is disposed on the other side of the first insulating layer 2 in the thickness direction. The metal support layer 4 is disposed on the side of the first insulating layer 2 opposite to the first circuit pattern 3 in the thickness direction. The metal support layer 4 is insulated from the first circuit pattern 3 by the first insulating layer 2. The metal support layer 4 supports the first circuit pattern 3 and the first insulating layer 2. The entire metal support layer 4 overlaps with the first insulating layer 2 in the thickness direction. Examples of materials for the metal support layer 4 include stainless steel and copper alloys.

[0051] (4) Conductor layer The conductor layer 5 is disposed on the other side of the first insulating layer 2 and on one side of the metal support layer 4 in the thickness direction. In other words, the conductor layer 5 is disposed between the first insulating layer 2 and the metal support layer 4 in the thickness direction. The conductor layer 5 is in contact with the other side surface of the first insulating layer 2 and with one side surface of the metal support layer 4 in the thickness direction. The conductor layer 5 is disposed on the side of the first insulating layer 2 opposite to the first circuit pattern 3 in the thickness direction. The conductor layer 5 is insulated from the first circuit pattern 3 by the first insulating layer 2. Figure 2A As shown, the conductor layer 5 extends from one end of the metal support layer 4 to the other end in a first direction, and as... Figure 2BAs shown, the conductor layer 5 extends from one end of the metal support layer 4 to the other end in the second direction. The conductor layer 5 does not have a wiring pattern. The entire conductor layer 5 overlaps with the first insulating layer 2 in the thickness direction. The conductor layer 5 also overlaps with the entire first circuit pattern 3 in the thickness direction. The conductivity of the conductor layer 5 is higher than that of the metal support layer 4. The conductor layer 5 may contain, for example, copper.

[0052] Between the metal support layer 4 and the conductor layer 5, a bonding layer may be disposed to join the metal support layer 4 and the conductor layer 5. The bonding layer comprises a metal. Examples of materials for the bonding layer include chromium, nickel, titanium, and alloys thereof.

[0053] Furthermore, a protective metal layer for protecting the conductor layer 5 is preferably disposed between the conductor layer 5 and the first insulating layer 2. The protective metal layer comprises a metal. Examples of materials for the protective metal layer include chromium, nickel, titanium, and alloys thereof.

[0054] It should be noted that the diagrams for the bonding layer and the protective metal layer have been omitted.

[0055] (5) Second circuit pattern like Figure 1 As shown, the second circuit pattern 6 is independent of the first circuit pattern 3. The second circuit pattern 6 has a first terminal 61 and a second terminal 62. The first terminal 61 and the second terminal 62 are connected via a conductor layer 5 (see reference). Figure 2A and Figure 2B The circuit pattern 6 is electrically connected, and thus, the second circuit pattern 6 functions as a circuit independent of the first circuit pattern 3.

[0056] (5-1) First terminal In this embodiment, the first terminal 61 is disposed between terminals 31B and 32B in the second direction. In other words, the first terminal 61 is parallel to wirings 33A and 33B in the first direction. The first terminal 61 is disposed on the side of wiring 33B opposite to wiring 33A in the first direction. The first terminal 61 has a prism shape extending in the first direction. The position and shape of the first terminal 61 are not limited to this embodiment.

[0057] The first terminal 61 does not overlap with the first insulating layer 2 in the thickness direction. Furthermore, the first terminal 61 does not overlap with the second insulating layer 7 in the thickness direction.

[0058] like Figure 2B As shown, the first terminal 61 is continuous with the metal support layer 4. Therefore, the first terminal 61 is electrically connected to the metal support layer 4.

[0059] The first terminal 61 includes a metal layer 611, a terminal conductor layer 612, a terminal metal layer 613, a terminal cover layer 614, and an adhesive layer 615.

[0060] Metal layer 611 is continuous with metal support layer 4. Metal layer 611 and metal support layer 4 are in the same layer. Metal layer 611 contains the same material as metal support layer 4. In this embodiment, metal layer 611 extends in a first direction from the end of metal support layer 4 on the side of wiring 33B opposite to wiring 33A toward the side of wiring 33B opposite to wiring 33A.

[0061] The terminal conductor layer 612 is disposed on one side of the metal layer 611 in the thickness direction. The terminal conductor layer 612 is disposed on one surface of the metal layer 611 in the thickness direction. In this embodiment, the terminal conductor layer 612 is disposed between the metal layer 611 and the terminal metal layer 613 in the thickness direction. It should be noted that in this embodiment, when projected along the thickness direction, the terminal conductor layer 612 includes the terminal metal layer 613, but it is not limited to this. When projected along the thickness direction, the terminal conductor layer 612 and the terminal metal layer 613 may partially overlap, and there may be non-overlapping portions.

[0062] Terminal conductor layer 612 is continuous with conductor layer 5. Terminal conductor layer 612 and conductor layer 5 are in the same layer. Terminal conductor layer 612 contains the same material as conductor layer 5. In this embodiment, terminal conductor layer 612 extends in a first direction from the end of conductor layer 5 on the side of wiring 33B opposite to wiring 33A toward the side of wiring 33B opposite to wiring 33A.

[0063] A bonding layer may be disposed between the metal layer 611 and the terminal conductor layer 612 to bond the metal layer 611 and the terminal conductor layer 612. The bonding layer comprises a metal. Examples of materials for the bonding layer include chromium, nickel, titanium, and alloys thereof.

[0064] Furthermore, a protective metal layer for protecting the terminal conductor layer 612 is preferably disposed between the terminal conductor layer 612 and the terminal metal layer 613, and between the terminal conductor layer 612 and the sealing layer 615. The protective metal layer comprises a metal. Examples of materials for the protective metal layer include chromium, nickel, titanium, and alloys thereof.

[0065] It should be noted that the diagrams for the bonding layer and the protective metal layer have been omitted.

[0066] like Figure 2BAs shown in the enlarged view, the terminal metal layer 613 is disposed on one side of the metal layer 611 in the thickness direction. In this embodiment, the terminal metal layer 613 is disposed on one side of the terminal conductor layer 612 in the thickness direction. The terminal metal layer 613 is disposed on one side surface of the terminal conductor layer 612 in the thickness direction. The terminal metal layer 613 is in contact with the terminal conductor layer 612. In other words, the terminal metal layer 613 is electrically connected to the terminal conductor layer 612. More specifically, the terminal metal layer 613 is electrically connected to the terminal conductor layer 612 via the opening 21 of the sealing layer 615, which will be described later.

[0067] The terminal metal layer 613 has a central portion 613A and a peripheral portion 613B. In this embodiment, the central portion 613A is disposed on one side surface of the terminal conductor layer 612 in the thickness direction.

[0068] The central portion 613A contacts the terminal conductor layer 612. More specifically, the central portion 613A is disposed within the opening 21 of the sealing layer 615 (described later) and is electrically connected to the terminal conductor layer 612. The side surface S14 of the central portion 613A of the terminal metal layer 613 contacts the inner peripheral surface of the sealing layer 615 facing the opening 21. Furthermore, the peripheral portion 613B is disposed on one side surface S13 of the sealing layer 615 in the thickness direction. The peripheral portion 613B contacts one side surface S13 of the sealing layer 615.

[0069] The terminal metal layer 613 comprises a metal. Examples of metals include copper, silver, gold, iron, aluminum, chromium, and their alloys. From the viewpoint of obtaining good electrical properties, the terminal metal layer 613 preferably comprises copper.

[0070] like Figure 2B As shown in the enlarged view, the terminal cover layer 614 covers the terminal metal layer 613. In this embodiment, the terminal cover layer 614 has a first portion 6141 covering one side surface S11 in the thickness direction of the terminal metal layer 613 and a second portion 6142 covering the side surface S12 of the peripheral portion 613B of the terminal metal layer 613. The first portion 6141 covers the entire one side surface S11 in the thickness direction of the terminal metal layer 613. Furthermore, the second portion 6142 covers the entire side surface S12 of the peripheral portion 613B of the terminal metal layer 613.

[0071] The terminal cover layer 614 contacts one side surface S13 in the thickness direction of the sealing layer 615. More specifically, the second portion 6142 contacts one side surface S13 in the thickness direction of the sealing layer 615.

[0072] like Figure 2BAs shown, the terminal cover layer 614 has a surface layer 614A. The terminal cover layer 614 preferably has an intermediate layer 614B. The terminal cover layer 614 may also lack an intermediate layer 614B. The intermediate layer 614B is disposed between the terminal metal layer 613 and the surface layer 614A. The surface layer 614A contains a metal different from the metal layer 611, the terminal conductor layer 612, and the terminal metal layer 613. For example, the surface layer 614A contains gold. The intermediate layer 614B contains a metal different from the metal layer 611, the terminal conductor layer 612, the terminal metal layer 613, and the surface layer 614A. For example, the intermediate layer 614B contains nickel. That is, the terminal cover layer 614 contains metal.

[0073] In this embodiment, such as Figure 1 As shown, the sealing layer 615 is disposed on the peripheral portion 613B of the terminal metal layer 613. More specifically, the sealing layer 615 is disposed on the entire peripheral portion 613B of the terminal metal layer 613.

[0074] An adhesive layer 615 is disposed between the metal layer 611 and the terminal cover layer 614 in the thickness direction. More specifically, the adhesive layer 615 is disposed between the metal layer 611 and the second portion 6142 in the thickness direction. In this embodiment, the adhesive layer 615 is disposed between the terminal conductor layer 612 and the terminal cover layer 614 in the thickness direction. More specifically, the adhesive layer 615 is disposed between the terminal conductor layer 612 and the second portion 6142 in the thickness direction. Additionally, the adhesive layer 615 is also disposed between the terminal conductor layer 612 and the terminal metal layer 613 in the thickness direction. More specifically, the adhesive layer 615 is disposed between the peripheral portion 613B of the terminal conductor layer 612 and the terminal metal layer 613 in the thickness direction.

[0075] The sealing layer 615 is disposed on one side of the metal layer 611 in the thickness direction. Furthermore, in the thickness direction, one side surface S13 of the sealing layer 615 contacts the terminal metal layer 613. More specifically, in the thickness direction, one side surface S13 of the sealing layer 615 contacts the peripheral portion 613B.

[0076] Additionally, one side surface S13 of the sealing layer 615 contacts the terminal cover layer 614. More specifically, in the thickness direction, one side surface S13 of the sealing layer 615 contacts the second portion 6142.

[0077] Furthermore, in this embodiment, the sealing layer 615 is disposed on one side surface of the terminal conductor layer 612 in the thickness direction. The sealing layer 615 is in contact with one side surface of the terminal conductor layer 612 in the thickness direction.

[0078] The sealing layer 615 has an opening 21. The number of openings 21 is not particularly limited. Furthermore, the shape of the opening 21 is not particularly limited. In this embodiment, the sealing layer 615 has one opening 21. Moreover, viewed from the thickness direction, the opening 21 is generally rectangular in shape. More specifically, viewed from the thickness direction, the opening 21 is generally quadrilateral in shape. The opening 21 of the sealing layer 615, when projected along the thickness direction, is contained within the terminal metal layer 613.

[0079] In the thickness direction, the ratio of the total area of ​​the openings 21 to one side surface of the terminal metal layer 613 is, for example, 0.001 or more, preferably 0.01 or more, and also, for example, 0.95 or less, preferably 0.7 or less. It should be noted that when the sealing layer 615 has multiple openings 21, the total area of ​​the openings 21 is the sum of the areas of each opening 21.

[0080] In this embodiment, viewed from the thickness direction, the sealing layer 615 is generally square annular in shape. In other words, the sealing layer 615 is square annular in shape when viewed from above. More specifically, viewed from the thickness direction, the sealing layer 615 is generally quadrilateral annular in shape. The inner peripheral surface of the sealing layer 615 facing the opening 21 contacts the side surface S14 of the central portion 613A of the terminal metal layer 613. Preferably, the inner peripheral surface of the sealing layer 615 facing the opening 21 contacts the entire side surface S14 of the central portion 613A of the terminal metal layer 613.

[0081] In this embodiment, the sealing layer 615 is continuous with the first insulating layer 2. The sealing layer 615 and the first insulating layer 2 are on the same layer. The sealing layer 615 contains the same material as the first insulating layer 2. The thickness of the sealing layer 615 may be the same as or different from the thickness of the first insulating layer 2. In this embodiment, the sealing layer 615 extends in a first direction from the end of the first insulating layer 2 on the side of the wiring 33B opposite to the side of the wiring 33A opposite to the side of the wiring 33B opposite to the side of the wiring 33A.

[0082] (5-2) Second terminal like Figure 1 As shown, in this embodiment, the second terminal 62 is disposed at the other end of the wiring circuit board 1 in a second direction. The second terminal 62 has a generally rectangular shape. The position and shape of the second terminal 62 are not limited to this embodiment.

[0083] like Figure 2A As shown, the second terminal 62 is disposed on one side of the first insulating layer 2 in the thickness direction. The second terminal 62 is electrically connected to the conductor layer 5 through the through hole 22 in the first insulating layer 2.

[0084] The second terminal 62 has a conductor layer 621, just like the terminal 31A of the first circuit pattern 3.

[0085] The second terminal 62 may also have a cover layer 622 as needed.

[0086] The conductor layer 621 is disposed on one side surface of the first insulating layer 2 in the thickness direction. The conductor layer 621 contains the same material as the terminals 31A of the first circuit pattern 3.

[0087] A protective metal layer for protecting the conductor layer 621 is preferably disposed between the conductor layer 621 and the second insulating layer 7. The protective metal layer comprises a metal. Examples of materials for the protective metal layer include chromium, nickel, titanium, and alloys thereof.

[0088] It should be noted that the illustration of the protective metal layer has been omitted.

[0089] A capping layer 622 covers the surface of the conductor layer 621. In this embodiment, the capping layer 622 covers the central portion (the portion not covered by the second insulating layer 7) of one side surface of the conductor layer 621 in the thickness direction. The capping layer 622 has a surface layer 622A. The surface layer 622A contains, for example, gold. The capping layer 622 preferably has an intermediate layer 622B. The capping layer 622 may also not have an intermediate layer 622B. The intermediate layer 622B is disposed between the conductor layer 621 and the surface layer 622A. The intermediate layer 622B contains, for example, nickel.

[0090] (6) Second insulating layer The second insulating layer 7 is disposed on one side of the first insulating layer 2 in the thickness direction. The second insulating layer 7 is disposed on one side surface of the first insulating layer 2 in the thickness direction. The second insulating layer 7 comprises a resin. Examples of resins include polyimide, maleimide, epoxy resin, polybenzoxazole, and polyester. The second insulating layer 7 covers at least a portion of the first circuit pattern 3. The second insulating layer 7 covers wirings 33A and 33B (see reference). Figure 1 The second insulating layer 7 may also cover the periphery of terminals 31A, 31B, 32A, 32B and the second terminal 62. The second insulating layer 7 does not cover the central portion of terminals 31A, 31B, 32A, 32B and the second terminal 62.

[0091] 2. Manufacturing method of wiring circuit board Next, the manufacturing method of the wiring circuit board 1 will be described.

[0092] The manufacturing method of wiring circuit board 1 includes a conductor layer formation process (see reference). Figure 3A ), the first insulating layer formation process (refer to Figure 3B Conductor pattern formation process (refer to) Figure 3C ), the second insulating layer formation process (refer to) Figure 4A ), External processing procedures (refer to) Figure 4B ) and the coating layer formation process (refer to Figure 4C ).

[0093] (1) Conductor layer formation process like Figure 3A As shown, in the conductor layer formation process, the conductor layer P is formed on the entire surface of the metal substrate M, for example by electroplating.

[0094] In detail, firstly, in the thickness direction, the aforementioned bonding layer is formed on one side surface of the substrate M. The bonding layer is formed, for example, by sputtering.

[0095] Next, a conductor layer P is formed on the bonding layer, for example by electroplating.

[0096] It should be noted that, without forming a bonding layer, a conductor layer P is formed on one side surface of the substrate M, for example, by electroplating.

[0097] (2) First insulating layer formation process Next, as Figure 3B As shown, in the first insulating layer forming process, a first insulating layer 2 and an adhesive layer 615 are formed on one side surface of the conductor layer P.

[0098] In detail, in the first insulating layer formation process, firstly, the aforementioned protective metal layer is formed on one side surface of the conductor layer P in the thickness direction. The protective metal layer is formed, for example, by sputtering.

[0099] Next, a solution of photosensitive resin (varnish) is coated onto the conductor layer P and dried to form a photosensitive resin coating. Then, the photosensitive resin coating is exposed and developed. This yields the first insulating layer 2 and the sealing layer 615.

[0100] In detail, after forming a photosensitive resin coating on the conductor layer P, the portions where the first insulating layer 2 and the adhesive layer 615 are not formed are shielded from light using a photomask or the like. Subsequently, if development is performed, the photosensitive resin coating on the shielded portions is removed, and the first insulating layer 2 or the adhesive layer 615 is not formed.

[0101] In the thickness direction, at least a portion of one side surface of the conductor layer P is not formed with the first insulating layer 2 and the sealing layer 615. Specifically, as Figure 3B As shown, in the thickness direction, the sealing layer 615 is not formed on one side surface of the conductor layer P at the location where the opening 21 is formed. That is, in the thickness direction, the coating of the photosensitive resin is removed from one side surface of the conductor layer P at the location where the opening 21 is formed. Thus, the opening 21 is formed.

[0102] Additionally, although not shown in the diagram, the coating of the photosensitive resin at the location where the through-hole 22 is formed is also removed. Thus, the through-hole 22 is formed.

[0103] (3) Conductor pattern formation process Next, as Figure 3C As shown, in the conductor pattern forming process, a conductor pattern 10 is formed on the first insulating layer 2. The conductor pattern 10 has: conductor layers 311 for each of terminals 31A, 31B, 32A, and 32B, wirings 33A and 33B, a terminal metal layer 613 for the first terminal 61, and a conductor layer 621 for the second terminal 62.

[0104] In detail, firstly, a seed layer is formed in the thickness direction on one side surface of the first insulating layer 2, one side surface of the adhesive layer 615, and one side surface of the conductor layer P. The seed layer is formed, for example, by sputtering. Examples of materials for the seed layer include chromium, copper, nickel, titanium, and alloys thereof.

[0105] Next, an anti-plating agent is used to cover the seed layer.

[0106] Next, the resist is exposed and developed. Thus, the resist in the areas where the conductor pattern 10 is formed is removed, and the seed layer is exposed in the areas where the conductor pattern 10 is formed. On the other hand, the resist remains in the areas where the conductor pattern 10 is not formed.

[0107] Next, a conductor pattern 10 is formed on the exposed seed layer by electroplating. After electroplating, the resist is stripped, and the seed layer exposed due to the stripping of the resist is removed by etching.

[0108] Thus, a conductor pattern 10 is formed on the first insulating layer 2.

[0109] (4) Second insulation layer formation process Next, as Figure 4A As shown, in the second insulating layer forming process, a second insulating layer 7 is formed on top of the first insulating layer 2.

[0110] In detail, in the second insulating layer forming process, firstly, the aforementioned protective metal layer is formed on the exposed surface of the conductor pattern 10 in the thickness direction. The protective metal layer is formed, for example, by chemical plating.

[0111] Next, a solution of photosensitive resin (varnish) is applied and dried over the conductor pattern 10, the first insulating layer 2, and the conductor layer P to form a photosensitive resin coating.

[0112] Next, the photosensitive resin coating is exposed and developed. As a result, a second insulating layer 7 is formed on the first insulating layer 2.

[0113] In detail, after forming a photosensitive resin coating on the conductor pattern 10 and the first insulating layer 2, the portion where the second insulating layer 7 will not form is shielded from light using a photomask or the like. Subsequently, if development is performed, the photosensitive resin coating on the shielded portion is removed, and the second insulating layer 7 will not form.

[0114] (5) External processing procedures Next, as Figure 4B As shown, in the shape processing step, the substrate M and the conductor layer P are etched to form the metal support layer 4, the conductor layer 5, the metal layer 611 and the terminal conductor layer 612.

[0115] (6) Covering layer formation process Next, as Figure 4C As shown, in the capping layer formation process, for example, electroless nickel plating and electroless gold plating are performed sequentially to simultaneously form capping layer 312, capping layer 622, and terminal capping layer 614. It should be noted that capping layer 312, capping layer 622, and terminal capping layer 614 can also be formed by electroplating.

[0116] Thus, the wiring circuit board 1 described above is obtained.

[0117] 3. Effects (1) According to the wiring circuit board 1, such as Figure 1 and Figure 2A As shown, the first terminal 61 of the second circuit pattern 6 has a metal layer 611 that is continuous with the metal support layer 4.

[0118] Therefore, a second circuit pattern 6 independent of the first circuit pattern 3 can be designed using the metal support layer 4 that supports the first circuit pattern 3.

[0119] As a result, it enables greater freedom in circuit design.

[0120] Furthermore, since the metal layer 611 of the first terminal 61 is continuous with the metal support layer 4, compared with the case where a part of the metal support layer 4 is separated from the metal support layer 4 to form the second circuit pattern 6, it is possible to suppress the decrease in rigidity of the metal support layer 4 due to the formation of the second circuit pattern 6.

[0121] Furthermore, since the terminal cover layer 614 covers the terminal metal layer 613, the terminal metal layer 613 can be protected by the terminal cover layer 614.

[0122] (2) According to the wiring circuit board 1, such as Figure 2B As shown, the first terminal 61 has an adhesive layer 615 disposed between the metal layer 611 and the terminal cover layer 614.

[0123] Therefore, it is possible to suppress the peeling of the terminal cover layer 614.

[0124] (3) According to the wiring circuit board 1, such as Figure 1 and Figure 2B As shown, the sealing layer 615 is disposed on the periphery 613B of the terminal metal layer 613.

[0125] Therefore, peeling of the terminal cover layer 614 can be suppressed at the periphery 613B of the terminal metal layer 613.

[0126] (4) According to the wiring circuit board 1, such as Figure 2A As shown, it also includes a conductor layer 5 disposed between the first insulating layer 2 and the metal support layer 4 in the thickness direction.

[0127] Therefore, it is possible to improve the electrical characteristics of the wiring circuit board 1.

[0128] (5) According to the wiring circuit board 1, such as Figure 2B As shown, the first terminal 61 further includes a terminal conductor layer 612 disposed in the thickness direction between the metal layer 611 and the terminal metal layer 613.

[0129] Therefore, it is possible to improve the conductivity of the second circuit pattern 6.

[0130] (6) According to the wiring circuit board 1, such as Figure 2B As shown, the terminal conductor layer 612 is continuous with the conductor layer 5.

[0131] Therefore, it is possible to use conductor layer 5 to design a second circuit pattern 6 that is independent of the first circuit pattern 3.

[0132] As a result, it enables greater freedom in circuit design.

[0133] 4. Variations The following describes a variation. In the variation, the same symbols are used to mark the same components as in the above-described embodiment, and the description is omitted.

[0134] (1) such as Figure 5A As shown, the wiring circuit board 1 may also not have a conductor layer 5. In this case, the metal support layer 4 is in contact with the other side surface of the first insulating layer 2 in the thickness direction.

[0135] In addition, such as Figure 5B As shown, the first terminal 61 may also have a metal layer 611, a terminal metal layer 613, a terminal cover layer 614, and an adhesive layer 615, but without a terminal conductor layer 612.

[0136] An adhesive layer 615 is disposed between the metal layer 611 and the terminal cover layer 614 in the thickness direction. More specifically, the adhesive layer 615 is disposed between the metal layer 611 and the second portion 6142 in the thickness direction. Additionally, the adhesive layer 615 is also disposed between the metal layer 611 and the terminal metal layer 613 in the thickness direction. More specifically, the adhesive layer 615 is disposed between the peripheral portion 613B of the metal layer 611 and the terminal metal layer 613 in the thickness direction.

[0137] Terminal metal layer 613 is disposed on one side of metal layer 611 in the thickness direction. Terminal metal layer 613 is disposed on one side surface of metal layer 611 in the thickness direction. Terminal metal layer 613 is in contact with metal layer 611. In other words, terminal metal layer 613 is electrically connected to metal layer 611. More specifically, terminal metal layer 613 is electrically connected to metal layer 611 via opening 21 of sealing layer 615.

[0138] The central portion 613A is disposed on one side surface of the metal layer 611 in the thickness direction. The central portion 613A is in contact with the metal layer 611. More specifically, the central portion 613A is disposed within the opening 21 of the sealing layer 615 and is electrically connected to the metal layer 611.

[0139] like Figure 5A As shown, the second terminal 62 is electrically connected to the metal support layer 4 through the through hole 22 of the first insulating layer 2.

[0140] Thus, the first terminal 61 and the second terminal 62 can be electrically connected via the metal support layer 4.

[0141] (2) such as Figure 6A and Figure 6B As shown, the wiring circuit board 1 may also have a cover layer 8.

[0142] The capping layer 8 covers the metal support layer 4. Specifically, the capping layer 8 covers the entire other surface of the metal support layer 4 in the thickness direction. Additionally, the capping layer 8 covers the entire end face of the metal support layer 4 and the entire end face of the conductor layer 5. It should be noted that in this modified example, the end face of the conductor layer 5 is continuous with the end face of the metal support layer 4 in the thickness direction. The end face of the conductor layer 5 is discontinuous with the end face of the first insulating layer 2. Furthermore, the end face of the conductor layer 5 is discontinuous with the end face of the sealing layer 615. The capping layer 8 has a surface layer 81. The capping layer 8 preferably has an intermediate layer 82. The capping layer 8 may also not have an intermediate layer 82. The intermediate layer 82 is disposed between the metal support layer 4 and the surface layer 81, and between the conductor layer 5 and the surface layer 81. The capping layer 8 contains metal. Specifically, the surface layer 81 contains a metal different from that of the metal support layer 4 and the conductor layer 5. The surface layer 81 contains, for example, gold. The intermediate layer 82 contains a metal different from that of the metal support layer 4, the conductor layer 5, and the surface layer 81. Intermediate layer 82, for example, contains nickel.

[0143] When the wiring circuit board 1 has a cover layer 8, the cover layer 8, cover layer 312, cover layer 622 and terminal cover layer 614 can be formed simultaneously in the cover layer forming process.

[0144] (3) such as Figure 7A and Figure 7B As shown, the end face of the metal support layer 4 may be discontinuous with the end face of the conductor layer 5, and the end face of the metal layer 611 may be discontinuous with the end face of the terminal conductor layer 612.

[0145] Specifically, such as Figure 7A As shown, the end face of the conductor layer 5 can be configured to be closer to the inside than the end face of the metal support layer 4, and is covered by the first insulating layer 2. Additionally, as... Figure 7B As shown, the end face of the terminal conductor layer 612 can be configured to be closer to the inside than the end face of the metal layer 611 and is covered by the sealing layer 615.

[0146] In the case of manufacturing the wiring circuit board 1 of this modified example, during the conductor layer formation process, after forming a resist in the portion where the conductor layer 5 or terminal conductor layer 612 is not formed, the conductor layer P is formed by electroplating. Afterwards, the resist is removed. It should be noted that if an bonding layer is formed on the substrate M, the bonding layer in the portion where the resist has been removed is also removed.

[0147] (4) such as Figure 8 A and Figure 8 As shown in Figure B, the first terminal 61 may have a terminal insulating layer 616. That is, the first terminal 61 may have a metal layer 611, a terminal conductor layer 612, a terminal metal layer 613, a terminal cover layer 614, an adhesive layer 615, and a terminal insulating layer 616.

[0148] The terminal cover layer 614 has a first portion 6141 that covers a portion of one side surface S11 in the thickness direction of the terminal metal layer 613 and a second portion 6142 that covers a portion of the side surface S12 of the peripheral portion 613B of the terminal metal layer 613. In this modified example, the end face of the terminal cover layer 614 other than the portion that contacts the sealing layer 615 contacts the terminal insulating layer 616.

[0149] The sealing layer 615 is disposed in the thickness direction between the second portion 6142 of the terminal conductor layer 612 and the terminal cover layer 614, and is also disposed between the terminal conductor layer 612 and the terminal insulation layer 616.

[0150] In the thickness direction, one side surface S13 of the sealing layer 615 contacts the second part 6142 and the terminal insulation layer 616.

[0151] The terminal insulating layer 616 has a portion that covers a portion of one side surface S11 in the thickness direction of the terminal metal layer 613, and a portion that covers a portion of the side surface S12 of the peripheral edge 613B of the terminal metal layer 613. More specifically, the terminal insulating layer 616 covers the remaining portion of the terminal metal layer 613 in the thickness direction. The remaining portion of the terminal metal layer 613 is the portion of one side surface S11 of the terminal metal layer 613 that is not covered by the terminal cover layer 614. In addition, the terminal insulating layer 616 covers the remaining portion of the peripheral edge 613B of the terminal metal layer 613. The remaining portion of the peripheral edge 613B of the terminal metal layer 613 is the portion of the side surface S12 of the peripheral edge 613B of the terminal metal layer 613 that is not covered by the terminal cover layer 614.

[0152] The terminal insulation layer 616 comprises a resin. Examples of resins include polyimide, maleimide, epoxy resin, polybenzoxazole, and polyester.

[0153] A protective metal layer for protecting the terminal metal layer 613 is preferably disposed between the terminal metal layer 613 and the terminal insulating layer 616. The protective metal layer comprises a metal. Examples of materials for the protective metal layer include chromium, nickel, titanium, and alloys thereof.

[0154] It should be noted that the illustration of the protective metal layer has been omitted.

[0155] When the first terminal 61 has a terminal insulating layer 616, the second insulating layer 7 and the terminal insulating layer 616 are formed simultaneously in the second insulating layer forming process.

[0156] (5) such as Figure 9 As shown, the sealing layer 615 can also be disposed on a portion of the peripheral portion 613B of the terminal metal layer 613.

[0157] Viewed from the thickness direction, the sealing layer 615 is roughly U-shaped. In other words, the sealing layer 615 is roughly U-shaped when viewed from above.

[0158] It should be noted that the end face of the terminal metal layer 613 exposed from the sealing layer 615 (if it is) Figure 9 Then the end face of the terminal metal layer 613 on the side of terminals 32A and 32B in the second direction is covered by the terminal cover layer (not shown).

[0159] (6) For example Figure 10 As shown, when viewed from the thickness direction, the opening 21 can be approximately circular in shape. In other words, the opening 21 can be approximately circular in shape when viewed from above.

[0160] (7) For example Figure 11A and Figure 11BAs shown, the sealing layer 615 may have multiple openings 21. In this modified example, the sealing layer 615 has four openings 21.

[0161] In this modified example, the central portion 613A is disposed inside each of the plurality of openings 21 of the sealing layer 615 and is electrically connected to the terminal conductor layer 612. Each side surface S14 of the central portion 613A of the terminal metal layer 613 contacts the inner peripheral surface of the sealing layer 615 facing the plurality of openings 21. In addition, the central portion 613A also contacts one side surface of the inner portion 6152 of the sealing layer 615 (described later) in the thickness direction.

[0162] The terminal cover layer 614 contacts one side surface S13 of the sealing layer 615 in the thickness direction. More specifically, in the thickness direction, the terminal cover layer 614 contacts one side surface S13 of the outer portion 6151 of the sealing layer 615, which will be described later.

[0163] In this modified example, the sealing layer 615 is disposed on a portion of the central portion 613A and the peripheral portion 613B of the terminal metal layer 613. More specifically, the sealing layer 615 has, in the thickness direction, an outer portion 6151 disposed between the terminal conductor layer 612 and the second portion 6142, and an inner portion 6152 disposed between the terminal conductor layer 612 and the central portion 613A.

[0164] In the thickness direction, one side surface S13 of the outer portion 6151 contacts the second portion 6142, and one side surface of the inner portion 6152 contacts the central portion 613A.

[0165] In this modified example, when viewed from the thickness direction, the sealing layer 615 is lattice-like. More specifically, when viewed from the thickness direction, the outer portion 6151 is approximately square-ring-shaped, and when viewed from the thickness direction, the inner portion 6152 is continuous with the outer portion 6151, forming an approximately cross shape.

[0166] (8) In the above variations (1) to (7), the degree of freedom of circuit design can be increased, just like in the above embodiments.

[0167] It should be noted that the above-described invention is provided as an illustrative embodiment of the present invention, but this is merely illustrative and should not be interpreted as limiting. Modifications of the invention that will be obvious to those skilled in the art are included within the scope of protection claimed in this application.

[0168] Industrial applicability The wiring circuit board of the present invention can be used for connecting electronic components.

[0169] Explanation of reference numerals in the attached figures 1. Wiring circuit board 2 First Insulation Layer 3. First circuit pattern 4 Metal support layer 5 Conductor layer 6. Second circuit pattern 61 First terminal 62 Second terminal 611 Metal Layer 612 Terminal Conductor Layer 613 Terminal Metal Layer 614 Terminal Cover Layer 615 Sealing layer.

Claims

1. A wiring circuit board, characterized in that, have: First insulating layer; A first circuit pattern is disposed on one side of the first insulating layer in the thickness direction of the first insulating layer. A metal support layer, disposed in the thickness direction on the side of the first insulating layer opposite to the first circuit pattern, is insulated from the first circuit pattern by the first insulating layer, and supports the first circuit pattern and the first insulating layer; and A second circuit pattern independent of the first circuit pattern. The second circuit pattern has a first terminal. The first terminal includes: A metal layer that is continuous with the metal support layer; A terminal metal layer disposed on one side of the metal layer in the thickness direction; A metal terminal cover layer that covers the terminal metal layer; as well as An adhesive layer is disposed between the metal layer and the terminal cover layer in the thickness direction.

2. The wiring circuit board according to claim 1, wherein, The sealing layer is disposed on the periphery of the terminal metal layer.

3. The wiring circuit board according to claim 1, wherein, In the thickness direction, the sealing layer is disposed between the metal layer and the terminal metal layer. The sealing layer has an opening. The terminal metal layer is electrically connected to the metal layer via the opening.

4. The wiring circuit board according to claim 1, wherein, The wiring circuit board further includes a conductor layer disposed between the first insulating layer and the metal support layer in the thickness direction.

5. The wiring circuit board according to claim 4, wherein, The first terminal further includes a terminal conductor layer disposed between the metal layer and the terminal metal layer in the thickness direction.

6. The wiring circuit board according to claim 5, wherein, The terminal conductor layer is continuous with the conductor layer.

7. The wiring circuit board according to claim 5, wherein, In the thickness direction, the sealing layer is disposed between the terminal conductor layer and the terminal metal layer. The sealing layer has an opening. The terminal metal layer is electrically connected to the terminal conductor layer via the opening.

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