first module and a plurality of modules including the first module

Abstract

A light emitting module includes: a first device having a first base and a power consumption component, the first base having first and second conductive portions; a first wiring substrate provided with first and second electrode portions for supplying power to the power consumption component, and having a plurality of wiring components, the power consumption component having first and second electrodes, the first and second electrode portions being electrically connected to the power consumption component on the first and second electrode sides, respectively, the first and second conductive portions being joined to the first wiring substrate, the second conductive portion having first and second conductive regions that are not electrically connected to each other in the state of the first base, the plurality of wiring components having a first wiring region connected to the first conductive region, and a second wiring region opposite the first wiring region across the second conductive region in plan view, the first and second wiring regions constituting part of a current path, and the wiring component forming the current path between the first conductive region and the second wiring region not being in contact with the second conductive region.

Description

Technical Field

[0001] The present invention relates to a first module and a plurality of modules including the first module. Background Technology

[0002] Japanese Patent Application Publication No. 2021-197414 discloses a substrate module in which a powered device is arranged on a substrate having multiple wiring areas. In this substrate module, power is supplied to powered devices such as light-emitting devices, which consume power and provide the desired functions such as light emission.

[0003] Existing technical documents

[0004] Patent documents

[0005] Patent Document 1: (Japan) Japanese Patent Application Publication No. 2021-197414 Summary of the Invention

[0006] The technical problem that the invention aims to solve

[0007] This disclosure addresses the technical problem of improving performance while fulfilling the desired functionality within the scope of the technical field of this disclosure.

[0008] Alternatively, in the field of this disclosure, instead of addressing the aforementioned technical problem, this disclosure addresses the technical problem of providing a module suitable for a specific usage mode of an apparatus that is selective in its usage mode.

[0009] Alternatively, this disclosure, within the technical field of this disclosure, addresses the aforementioned technical problems by disclosing a technical problem such as improving the installation accuracy of modules.

[0010] Alternatively, in the technical field of this disclosure, instead of the aforementioned technical problems, a technical problem such as suppressing the large-scale development of modules is disclosed.

[0011] In addition, not limited to the technical problems mentioned above, there are technical problems that can be recognized based on the description in this application, based on common technical knowledge in the field of this disclosure.

[0012] In addition, not limited to the technical problems mentioned above, any effect that can be obtained from the technical matters described in this application can also be considered a technical problem, based on common technical knowledge in the field of this disclosure.

[0013] The present invention solves at least one of the above-mentioned technical problems.

[0014] Technical solutions for solving technical problems

[0015] The first module disclosed in the embodiment includes: a first device having a first base and a first power-consuming component, the first base having an upper surface, a lower surface, and a first conductive portion and a second conductive portion disposed on the lower surface, the first power-consuming component being disposed on the first base and consuming power supplied via the first base; and a first wiring board having a first electrode portion and a second electrode portion for supplying power to the first power-consuming component, and having a plurality of wiring components for forming a first current path via the first device from the first electrode portion to the second electrode portion or from the second electrode portion to the first electrode portion, the first power-consuming component having a first electrode and a second electrode, the first electrode portion being electrically connected to the first power-consuming component at the first electrode side, and the second electrode portion being electrically connected to the first power-consuming component at the second electrode side. The first conductive portion and the second conductive portion of the first device are bonded to the first wiring substrate in a first bonding region. The second conductive portion has a first conductive region and a second conductive region that are not electrically connected to each other in the state of the first substrate. The plurality of wiring components of the first wiring substrate have: a first wiring region that is connected to the first conductive region of the second conductive portion in the first bonding region; and a second wiring region that, when viewed from above, is opposite to the first wiring region across the second conductive portion. The second wiring region of the first wiring substrate is located outside the first bonding region. The first wiring region and the second wiring region constitute part of the first current path. The wiring component forming the first current path between the first conductive region and the second wiring region of the second conductive portion does not contact the second conductive region of the second conductive portion.

[0016] In addition to the first module, the multiple modules disclosed in the embodiments also include a second module. This second module comprises: a third device having a third substrate and a third power-consuming component; the third substrate having an upper surface, a lower surface, and a first conductive portion and a second conductive portion disposed on the lower surface; the third power-consuming component being disposed on the upper surface of the third substrate and consuming power supplied via the third substrate; and a second wiring board having a first electrode portion and a second electrode portion for supplying power to the third power-consuming component, and having multiple wiring components for forming a second current path via the third device from the first electrode portion to the second electrode portion or from the second electrode portion to the first electrode portion. The first substrate and the third substrate are the same substrate. The first conductive portion and the second conductive portion of the third device are bonded to the second wiring substrate in the bonding region of the second wiring substrate. The first conductive portion of the third substrate has a first conductive region and a second conductive region that are not electrically connected to each other. The second conductive portion of the third substrate also has a first conductive region and a second conductive region that are not electrically connected to each other. The plurality of wiring components of the second wiring substrate include: a first wiring component that is connected to the first conductive region of the first conductive portion in the bonding region of the second wiring substrate; and a second wiring component that is connected to the second conductive region of the first conductive portion in the bonding region of the second wiring substrate. The second conductive portion of the third device is not required in the formation of the second current path. Attached Figure Description

[0017] Figure 1 This is a perspective view of the light-emitting module according to the first embodiment.

[0018] Figure 2 This is a top view of the light-emitting module according to the first embodiment.

[0019] Figure 3 This is a top view of the wiring board according to the first embodiment.

[0020] Figure 4 yes Figure 3 A schematic cross-sectional view of the wiring substrate at line IV-IV.

[0021] Figure 5A This is a perspective view of the light-emitting device in each embodiment.

[0022] Figure 5B This is a top view of the light-emitting device in each embodiment.

[0023] Figure 5C This is a side view of the light-emitting device in each embodiment.

[0024] Figure 5D yes Figure 5BCross-sectional view of the light-emitting device of each embodiment at the VD-VD line.

[0025] Figure 5E This is a perspective view of the interior of the package of the light-emitting device in each embodiment.

[0026] Figure 5F This is a top view of the interior of the package of the light-emitting device in each embodiment.

[0027] Figure 5G It is a 3D view of the package.

[0028] Figure 5H Is with Figure 5B A cross-sectional view of the package corresponding to the VD-VD line.

[0029] Figure 5I This is a top view of the substrate.

[0030] Figure 5J This is a bottom view of the substrate.

[0031] Figure 5K Is with Figure 5B A cross-sectional view of the matrix corresponding to the VD-VD line.

[0032] Figure 5L This is a top view showing the mounting base with other components arranged on it.

[0033] Figure 5M This is a side view showing the state in which other components are arranged on the mounting base.

[0034] Figure 6 This is a top view of the interior of the light-emitting device package observed in the light-emitting module of the first embodiment.

[0035] Figure 7 This is a top view of the wiring board after the insulation has been removed according to the first embodiment.

[0036] Figure 8 This is an enlarged top view used to illustrate the connection state between the light-emitting device and the wiring board in the light-emitting module of the first embodiment.

[0037] Figure 9 This is a perspective view of the light-emitting module according to the second embodiment.

[0038] Figure 10 This is a top view of the light-emitting module according to the second embodiment.

[0039] Figure 11 This is a top view of the wiring board according to the second embodiment.

[0040] Figure 12This is a top view of the interior of the light-emitting device package in the light-emitting module of the second embodiment.

[0041] Figure 13 This is a top view of the wiring board after the insulation has been removed according to the second embodiment.

[0042] Figure 14 This is an enlarged top view used to illustrate the connection state between the light-emitting device and the wiring board in the light-emitting module of the second embodiment.

[0043] Figure 15 This is a perspective view of the second light-emitting module in the third embodiment.

[0044] Figure 16 This is a top view of the second light-emitting module in the third embodiment.

[0045] Figure 17 This is a top view of the wiring substrate of the second light-emitting module in the third embodiment.

[0046] Figure 18 This is a top view of the interior of the light-emitting device package observed in the second light-emitting module of the third embodiment.

[0047] Figure 19 This is a top view of the wiring board after the insulation has been removed according to the third embodiment. Detailed Implementation

[0048] In this specification or claims, the term "polygon" includes shapes formed by rounding, chamfering, corner beveling, or rounding the corners of polygons such as triangles and quadrilaterals. Furthermore, shapes formed by processing the middle portions of the sides, not limited to the corners (ends of the sides), are also referred to as polygons. In other words, shapes that are based on a polygon but have undergone partial processing are also included in the interpretation of "polygon" in this specification and claims.

[0049] Furthermore, this applies not only to polygons, but also to terms representing specific shapes such as trapezoids, circles, and concave / convex shapes. Additionally, the same applies when operations are performed on the edges that form the shape. That is, even if processing is performed on a corner or the middle portion of a single edge, the interpretation of "edge" includes the processed portion. It should be noted that when distinguishing between a "polygon" or "edge" without partial processing and the processed shape, it is labeled "rigid," for example, written as "rigid quadrilateral," etc.

[0050] Furthermore, in this specification or claims, the descriptions of top and bottom, left and right, front and back, front and back, front and back, inside and outside, etc., are merely descriptions of relative positions, orientations, directions, etc., and may not be consistent with the actual relationship in use.

[0051] Additionally, in the accompanying drawings, arrows are sometimes used to indicate directions such as the X, Y, and Z directions. The direction of these arrows is matched across multiple drawings of the same embodiment. Furthermore, in the drawings, the direction of the arrows labeled X, Y, and Z is designated as the positive direction, and the opposite direction as the negative direction. For example, the direction marked with X at the tip of the arrow is the X direction and is positive. It should be noted that in this specification, the positive X direction is referred to as the "positive X direction," and the opposite direction is referred to as the "negative X direction." When referred to as the "X direction," it includes both positive and negative directions. The same applies to the Y and Z directions.

[0052] Furthermore, in this specification, when an object is described as "one or more," both the method of having one object and the method of having multiple objects are summarized and described separately. Therefore, by specifying "one or more," implementations having one or more objects, implementations having at least one object, and implementations having multiple objects are all supported.

[0053] Furthermore, in this specification, the description of "one or each" objects is a summary of descriptions of one object in an embodiment having one object, descriptions of one object in an embodiment having multiple objects, and descriptions of multiple objects separately in an embodiment having multiple objects. Therefore, by describing "one or each" objects, it is supported that in an embodiment having one object, at least one of these objects has description content; in an embodiment having multiple objects, each of these multiple objects has description content; and in an embodiment having one or more objects, all objects have description content.

[0054] Furthermore, in this specification, for example, when describing constituent elements, the terms "component" or "part" are sometimes used. "Companion" refers to an object that is physically treated as a single unit. An object that is physically treated as a single unit can also be described as an object treated as a component during the manufacturing process. On the other hand, "part" refers to an object that does not physically need to be treated separately. For example, "part" is used when partially capturing a part of a component, or when multiple components are grouped together as a single object.

[0055] It should be noted that the distinction between "component" and "part" in the above-mentioned writing does not imply a conscious limitation of the scope of claims in the interpretation of the theory of equality. That is, even if there is a constituent element described as a "component" in the claims, the applicant does not solely rely on this situation to consider that physically treating that constituent element individually is essential for the application of the present invention.

[0056] Furthermore, in this specification or claims, a certain constituent element may have multiple components. When these components are presented separately, they are sometimes distinguished by the prefixes "first" and "second." Additionally, the objects distinguished in this specification and the claims may differ. Therefore, even if a constituent element in the claims is described with the same appendix as in this specification, the object defined by that constituent element may not be consistent between this specification and the claims.

[0057] For example, in this specification, there are constituent elements distinguished by the designations "first," "second," and "third." When these constituent elements, marked with "first" and "third" in this specification, are described in the claims, it is easy to observe that they are sometimes distinguished by the designations "first" and "second" in the claims. In this case, the constituent elements marked "first" and "second" in the claims refer to the constituent elements marked "first" and "third" in this specification, respectively. Furthermore, this rule is not limited to constituent elements and can be reasonably and flexibly applied to other objects.

[0058] The following describes a method for implementing the present invention. Furthermore, specific methods for implementing the present invention will be described with reference to the accompanying drawings. It should be noted that the method for implementing the present invention is not limited to this specific method. That is, the illustrated embodiments are not the only way to implement the present invention. It should also be noted that the size, positional relationships, etc., of the components shown in the drawings are sometimes exaggerated for ease of understanding.

[0059] <First Implementation>

[0060] The light-emitting module 901 of the first embodiment will be described. Figures 1 to 8 This is a diagram illustrating an exemplary manner of the light-emitting module 901. Figure 1 This is a 3D view of the light-emitting module 901. Figure 2 This is a top view of the light-emitting module 901. Figure 3 This is a top view of the wiring board 101. It should be noted that... Figure 3 In the diagram, the joint area 102 is marked with a shaded line. Additionally, the rectangle is indicated by a dashed line. Figure 8 The magnified portion of the top view. Figure 4 yes Figure 3A schematic cross-sectional view of the wiring substrate 101 at the IV-IV line. Figure 5A This is a three-dimensional view of the light-emitting device 1. Figure 5B This is a top view of the light-emitting device 1. Figure 5C This is a side view of the light-emitting device 1. Figure 5D yes Figure 5B A cross-sectional view of the light-emitting device 1 at the VD-VD line. Figure 5E This is a perspective view of the interior of the package 10 of the light-emitting device 1. Wiring 60 is omitted in this view. Figure 5F This is a top view of the interior of the package 10 of the light-emitting device 1. Figure 5G This is a 3D view of package 10. Figure 5H yes Figure 5B A cross-sectional view of package 10 at the VD-VD line. Figure 5I This is a top view of base 11. Figure 5J This is a bottom view of base 11. Figure 5K yes Figure 5B A cross-sectional view of the substrate 11 at the VD-VD line. Figure 5L This is a top view of the mounting base 30 with other components arranged on it. Figure 5M This is a side view of the mounting base 30 with other components arranged on it. Figure 6 This is a top view of the interior of the package 10 of the light-emitting device 1 seen in the light-emitting module 901. Figure 7 This is a top view of the wiring board 101 with the insulation portion 101F removed. It should be noted that... Figure 7 In the diagram, the winding area 122D is marked with a shaded line. Figure 8 This is an enlarged top view used to illustrate the connection status between the light-emitting device 1 in the light-emitting module 901 and the wiring board 101. Figure 8 Enlarged Figure 3 , Figure 6 as well as Figure 7 The rectangular area enclosed by dashed lines. Additionally, to easily understand the connection state, parts of the constituent elements are appropriately shown or removed.

[0061] The light-emitting module 901 has multiple components. These components include one or more light-emitting devices 1, a wiring board 101, a connector 201, and a thermistor 301.

[0062] It should be noted that the light-emitting module 901 may also have other constituent elements besides these. For example, the light-emitting module 901 may also have a light-emitting device different from the light-emitting device 1. In addition, the light-emitting module 901 may not have some of the constituent elements listed herein.

[0063] The light-emitting device 1 has multiple components. These components include a package 10, one or more semiconductor laser elements 20, one or more mounting substrates 30, one or more reflective components 40, one or more protective components 50, multiple wirings 60, and optical components 70.

[0064] It should be noted that the light-emitting device 1 may also include other constituent elements. For example, the light-emitting device 1 may include a semiconductor laser element in addition to one or more semiconductor laser elements 20. Alternatively, the light-emitting device 1 may not include some of the constituent elements listed herein.

[0065] First, let’s explain each of the constituent elements.

[0066] (Package 10)

[0067] Package 10 includes a base 11 and a cover 14. The cover 14 is joined to the base 11 to form package 10. An internal space is defined within package 10 for configuring other components. This internal space is a closed space surrounded by the base 11 and the cover 14. Furthermore, this internal space can be sealed in a vacuum or hermetically sealed state.

[0068] When viewed from above, the outer edge of package 10 is rectangular. This rectangle can be a rectangle with a long side and a short side. In the illustrated package 10, the long side of the rectangle is in the same direction as the X direction, and the short side is in the same direction as the Y direction. It should be noted that the outer edge shape of package 10 may not be rectangular when viewed from above.

[0069] In package 10, an internal space is formed for configuring other constituent elements. The first upper surface 11A of package 10 is part of the area defining the internal space. In addition, each inner surface 11E and the lower surface 14B of package 10 are part of the area defining the internal space.

[0070] The substrate 11 has a first upper surface 11A and a lower surface 11B. The substrate 11 has a second upper surface 11C. The substrate 11 has one or more outer surfaces 11D. The substrate 11 has one or more inner surfaces 11E. One or more outer surfaces 11D intersect with the second upper surface 11C. One or more outer surfaces 11D intersect with the lower surface 11B. One or more inner surfaces 11E intersect with the second upper surface 11C.

[0071] Viewed from above, the outer edge of the substrate 11 is rectangular. Viewed from above, the outer edge of the substrate 11 is the same as the outer edge of the package 10. Viewed from above, the outer edge of the first upper surface 11A is rectangular. This rectangle can be a rectangle with a long side and a short side. The direction of the long side of the first upper surface 11A is parallel to the direction of the long side of the outer edge of the substrate 11. It should be noted that, viewed from above, the outer edge of the first upper surface 11A may not be rectangular.

[0072] When viewed from above, the first upper surface 11A is surrounded by the second upper surface 11C. The second upper surface 11C is an annular surface that surrounds the first upper surface 11A when viewed from above. The second upper surface 11C is a rectangular annular surface. Here, the frame defined by the inner edge of the second upper surface 11C is referred to as the inner frame of the second upper surface 11C, and the frame defined by the outer edge of the second upper surface 11C is referred to as the outer frame of the second upper surface 11C.

[0073] The substrate 11 has a recess surrounded by a frame formed by a second upper surface 11C. The recess defines a portion in the substrate 11 that is recessed downwards from the second upper surface 11C. A first upper surface 11A is part of the recess. One or more inner side surfaces 11E are part of the recess. The second upper surface 11C is located above the first upper surface 11A.

[0074] The base 11 has one or more stepped portions 11F. Each stepped portion 11F has an upper surface 11G and a side surface 11H that intersects with and extends downward from the upper surface 11G. Here, a stepped portion 11F has only one upper surface 11G and one side surface 11H. The upper surface 11G intersects with the inner side surface 11E. The side surface 11H intersects with the first upper surface 11A.

[0075] In top view, one or more stepped portions 11F are disposed inside the inner frame of the second upper surface 11C. In top view, one or more stepped portions 11F are formed along part or all of the inner side surface 11E. In the base 11, the side surface 11H is the inner side surface, but the side surface 11H and the inner side surface 11E are different surfaces. One or more inner side surfaces 11E and one or more side surfaces 11H are perpendicular to the first upper surface 11A. The perpendicularity here is allowed to be ±3 degrees.

[0076] One or more step portions 11F may include a first step portion 11F1 and a second step portion 11F2. The first step portion 11F1 and the second step portion 11F2 are disposed at opposite positions on their respective side surfaces 11H. The first step portion 11F1 and the second step portion 11F2 are disposed on the short side side of the inner frame of the second upper surface 11C.

[0077] The substrate 11 has a base portion 11M and a frame portion 11N. The base portion 11M and the frame portion 11N can be components made of different materials. The substrate 11 can be configured to include a base component corresponding to the base portion 11M and a frame component corresponding to the frame portion 11N.

[0078] The base 11M includes a first upper surface 11A. The frame portion 11N includes a second upper surface 11C. The frame portion 11N includes one or more outer side surfaces 11D and one or more inner side surfaces 11E. The frame portion 11N includes one or more stepped portions 11F.

[0079] The lower surface of the base 11M constitutes part or all of the lower surface 11B of the base 11. When the lower surface of the base 11M constitutes part of the lower surface 11B of the base 11, the lower surface of the frame portion 11N constitutes the remaining area of ​​the lower surface 11B of the base.

[0080] The substrate 11 has multiple wiring portions 12A. The multiple wiring portions 12A include one or more inner wiring portions 12A1 disposed in the internal space of the package 10 and one or more outer wiring portions 12A2 disposed on the outer surface of the package 10.

[0081] One or more inner wiring portions 12A1 are provided on the upper surface 11G of the stepped portion 11F. The base 11 has one or more inner wiring portions 12A1 provided on the upper surface 11G of the first stepped portion 11F1. The base 11 has one or more inner wiring portions 12A1 provided on the upper surface 11G of the second stepped portion 11F2.

[0082] One or more inner wiring portions 12A1 can be composed of a plurality of inner wiring portions 12A1, including one or more first inner wiring portions 12A11 disposed on one first side and one or more second inner wiring portions 12A12 disposed on one second side. Here, both the first side and the second side are either outer side 11D or inner side 11E. In addition, the first side and the second side are opposite to each other or have the other side on the opposite side of one side.

[0083] In the base 11 shown in the figure, one or more inner wiring portions 12A1 provided on the upper surface 11G of the first step portion 11F1 can be designated as the first inner wiring portion 12A11, and one or more inner wiring portions 12A1 provided on the upper surface 11G of the second step portion 11F2 can be designated as the second inner wiring portion 12A12.

[0084] One or more first inner wiring sections 12A11 may be composed of a plurality of first inner wiring sections 12A11 that are not electrically connected to each other. One or more second inner wiring sections 12A12 may be composed of a plurality of second inner wiring sections 12A12 that are not electrically connected to each other. The plurality of first inner wiring sections 12A11 are arranged in the direction along the first side. The plurality of second inner wiring sections 12A12 are arranged in the direction along the second side.

[0085] One or more outer wiring portions 12A2 are disposed on the lower surface 11B of the package 10. One or more outer wiring portions 12A2 are disposed on the lower surface of the frame portion 11N. It should be noted that the outer wiring portions 12A2 may also be disposed on an outer surface of the package 10 that is different from the lower surface 11B.

[0086] One or more outer wiring portions 12A2 can be composed of a plurality of outer wiring portions 12A2, which include one or more first outer wiring portions 12A21 disposed on a first side side and one or more second outer wiring portions 12A22 disposed on a second side side.

[0087] One or more first outer wiring sections 12A21 can be composed of a plurality of first outer wiring sections 12A21 that are not electrically connected to each other. One or more second outer wiring sections 12A22 can be composed of a plurality of second outer wiring sections 12A22 that are not electrically connected to each other. The plurality of first outer wiring sections 12A21 are arranged in a direction along a first side. The plurality of second outer wiring sections 12A22 are arranged in a direction along a second side.

[0088] In the substrate 11, one or more inner wiring sections 12A1 are electrically connected to outer wiring sections 12A2. One or more inner wiring sections 12A1 are electrically connected to different outer wiring sections 12A2.

[0089] One or more first inner wiring portions 12A11 include one or more first inner wiring portions 12A11 electrically connected to the first outer wiring portion 12A21 and the second outer wiring portion 12A22. Here, the inner wiring portion 12A1 electrically connected to both the outer wiring portion 12A2 on the first side and the outer wiring portion 12A2 on the second side is referred to as the inner wiring portion 12A1 connected on both sides.

[0090] One or more second inner wiring portions 12A12 include one or more second inner wiring portions 12A12 that are electrically connected to the first outer wiring portion 12A21 and the second outer wiring portion 12A22. In other words, it can be said that one or more second inner wiring portions 12A12 include one or more second inner wiring portions 12A12 connected on both sides.

[0091] In this way, by having an inner wiring portion 12A1 connected on both sides of the substrate 11, it is possible to appropriately select which side of the first side and the second side the outer wiring portion 12A2 is used in the formation of the current path, thus enabling selective use.

[0092] By employing such selectivity, the appropriate selection for forming a current path may result in a situation where only one of the two outer wiring portions 12A2 is utilized for forming the current path. In this case, even if the two outer wiring portions 12A2 are electrically connected, it is possible for only one outer wiring portion 12A2 to substantially contribute to the formation of the current path. In other words, the other outer wiring portion 12A2 may not substantially function as part of the wiring constituting the current path.

[0093] Whether or not it substantially functions as a wiring that forms a current path depends on the actual usage of the device. However, in either case, each inner wiring section 12A1 that is electrically connected to any one outer wiring section 12A2 can be described as a conductive region, at least in the sense of providing an electrical connection. Similarly, each outer wiring section 12A2 that is electrically connected to any one inner wiring section 12A1 can also be described as a conductive region.

[0094] There are combinations of two external wiring sections 12A2 that are electrically connected to each other, and combinations of two external wiring sections 12A2 that are not electrically connected to each other. In the plurality of first external wiring sections 12A21, each first external wiring section 12A21 is not electrically connected to other first external wiring sections 12A21. In the plurality of second external wiring sections 12A22, each second external wiring section 12A22 is not electrically connected to other second external wiring sections 12A22.

[0095] The substrate 11 has a bonding pattern 13A. The bonding pattern 13A is disposed on the second upper surface 11C. The bonding pattern 13A is arranged in a ring shape. The bonding pattern 13A is arranged in a rectangular ring shape. In a top view, the first upper surface 11A is surrounded by the bonding pattern 13A.

[0096] The substrate 11 can be formed, for example, using ceramic as the main material. Examples of ceramics that can be used as the main material of the substrate 11 include aluminum nitride, silicon nitride, aluminum oxide, or silicon carbide.

[0097] Here, the main material refers to the material that constitutes the largest proportion of the mass or volume in the formed object. It should be noted that when an object is formed from a single material, that material is the main material. That is, when a material is the main material, its proportion can be 100%.

[0098] The substrate 11 can also be formed using base components and frame components made from different main materials. For example, the base component can be formed using a metal or a metal-containing composite, graphite, diamond, or other materials with excellent heat dissipation as the main material. Examples of metals that can be used as the main material for the base component include copper, aluminum, or iron. Examples of composites that include a metal that can be used as the main material for the base component include copper-molybdenum or copper-tungsten. For example, the frame component can be formed using ceramics, which are listed as main materials for the substrate 11 above, as the main material.

[0099] The wiring section 12A can be formed using a metallic material as the main material, for example. Examples of metallic materials that can be used as the main material of the wiring section 12A include single metals such as Cu, Ag, Ni, Au, Ti, Pt, Pd, Cr, and W, or alloys comprising these metals. The wiring section 12A can be composed of one or more metal layers, for example.

[0100] The bonding pattern 13A can be formed, for example, using a metallic material as the main material. Examples of metallic materials that can serve as the main material of the bonding pattern 13A include single metals such as Cu, Ag, Ni, Au, Sn, Ti, and Pd, or alloys comprising these metals. The bonding pattern 13A can, for example, be composed of more than one metallic layer.

[0101] The cover 14 has an upper surface 14A and a lower surface 14B. Additionally, the cover 14 has one or more side surfaces 14C. The cover 14 is constructed from a rectangular flat plate. It should be noted that the shape of the cover 14 may not be rectangular.

[0102] The cover 14 is joined to the base 11. The lower surface 14B of the cover 14 is joined to the second upper surface 11C of the base 11. The cover 14 is joined to the base 11 by the joining pattern 13A. The cover 14 is joined to the base 11 by an adhesive.

[0103] The cover 14 is translucent, allowing light to pass through. Here, translucency refers to a transmittance of 80% or more for light incident on the cover 14. It should be noted that the cover 14 may also have some opaque areas (areas without light transmission).

[0104] The cover 14 can be formed, for example, using glass as the main material. Alternatively, the cover 14 can be formed, for example, using sapphire as the main material.

[0105] (Semiconductor laser element 20)

[0106] The semiconductor laser element 20 has an upper surface 21A, a lower surface 21B, and multiple side surfaces 21C. The upper surface 21A is rectangular with long and short sides. The shape of the semiconductor laser element 20 when viewed from above is also rectangular with long and short sides. It should be noted that the shape of the upper surface 21A and the shape of the semiconductor laser element 20 when viewed from above are not limited to these.

[0107] The semiconductor laser element 20 has a light emitting surface 22. For example, the side surface 21C can serve as the light emitting surface 22. The side surface 21C that serves as the light emitting surface 22 intersects with the short side of the upper surface 21A. Alternatively, for example, the upper surface 21A can serve as the light emitting surface 22.

[0108] The semiconductor laser element 20 has a first electrode and a second electrode. For example, the first electrode is an anode electrode and the second electrode is a cathode electrode. It should be noted that it is also possible for the first electrode to be a cathode electrode and the second electrode to be an anode electrode. For example, the first electrode can be disposed on the upper surface 21A and the second electrode can be disposed on the lower surface 21B.

[0109] The semiconductor laser element 20 can be a single-emitter semiconductor laser element consisting of one emitter. Alternatively, the semiconductor laser element 20 can be a multi-emitter semiconductor laser element consisting of multiple emitters.

[0110] For example, the semiconductor laser element 20 can be a semiconductor laser element that emits blue light. Alternatively, for example, the semiconductor laser element 20 can be a semiconductor laser element that emits green light. Alternatively, for example, the semiconductor laser element 20 can be a semiconductor laser element that emits red light. Furthermore, the semiconductor laser element 20 can also be a semiconductor laser element that emits light of other colors or wavelengths.

[0111] Here, blue light refers to light with a peak emission wavelength in the range of 420nm to 494nm. Green light refers to light with a peak emission wavelength in the range of 495nm to 570nm. Red light refers to light with a peak emission wavelength in the range of 605nm to 750nm.

[0112] Semiconductor laser elements 20 that emit blue or green light can include semiconductor laser elements comprising nitride semiconductors. Examples of GaN-based semiconductors include GaN, InGaN, and AlGaN. Semiconductor laser elements 20 that emit red light can include semiconductor laser elements comprising InAlGaP, GaInP, and GaAs-based semiconductors such as GaAs and AlGaAs.

[0113] Semiconductor laser element 20 emits directional laser light. Diverging light is emitted from the light emitting surface 22 (emission end face) of semiconductor laser element 20. The light emitted from semiconductor laser element 20 forms an elliptical far-field pattern (hereinafter referred to as "FFP") in a plane parallel to the light emitting surface 22. FFP is the shape and intensity distribution of the emitted light at a position away from the light emitting surface of semiconductor laser element.

[0114] Here, light passing through the center of the elliptical shape of the FFP, in other words, light with peak intensity in the FFP's intensity distribution, is referred to as light traveling along the optical axis or light passing through the optical axis. Furthermore, in the intensity distribution of the FFP, light with a peak intensity value of 1 / e... 2 Light of the above intensities is called the primary component of light.

[0115] The shape of the FFP (Factor-Free Plane) emitted from the semiconductor laser element 20 is an ellipse in a plane parallel to the light-emitting surface 22, where the stacking direction is longer than the direction perpendicular to the stacking direction. The stacking direction refers to the direction in which multiple semiconductor layers, including the active layer, are stacked in the semiconductor laser element 20. The direction perpendicular to the stacking direction can also be called the planar direction of the semiconductor layer. Alternatively, the major axis of the elliptical shape of the FFP can be called the fast axis direction of the semiconductor laser element 20, and the minor axis direction can be called the slow axis direction of the semiconductor laser element 20.

[0116] Based on the light intensity distribution of FFP, 1 / e of the peak light intensity 2 The light spread angle of the semiconductor laser element 20 is defined as the light spread angle of the peak light intensity (the light passing through the optical axis) and 1 / e of the peak light intensity. 2 The angle formed by the light intensity is represented by the light beam. It should be noted that the light spread angle is different from 1 / e of the peak light intensity. 2 In addition to the light intensity, it is sometimes calculated from, for example, the light intensity at half the peak light intensity. In this specification, when simply referred to as the "light spread angle," it refers to 1 / e of the peak light intensity. 2 The spread angle of light under light intensity.

[0117] The spread angle of the light emitted from the semiconductor laser element 20 along the fast axis can be greater than 45 degrees and less than 71 degrees. Furthermore, the spread angle along the slow axis can exceed 0 degrees and be less than 13 degrees. Additionally, the spread angle along the fast axis is larger than the spread angle along the slow axis.

[0118] For example, the spread angle of blue light emitted from the semiconductor laser element 20 along the fast axis can be 35 degrees or more and less than 55 degrees, and the spread angle along the slow axis can be 5 degrees or more and less than 16 degrees. Similarly, for example, the spread angle of green light emitted from the semiconductor laser element 20 along the fast axis can be 30 degrees or more and less than 51 degrees, and the spread angle along the slow axis can be 5 degrees or more and less than 16 degrees. Furthermore, for example, the spread angle of red light emitted from the semiconductor laser element 20 along the fast axis can be 45 degrees or more and less than 71 degrees, and the spread angle along the slow axis can be 6 degrees or more and less than 16 degrees.

[0119] (Mounting substrate 30)

[0120] The mounting substrate 30 has an upper surface 31A, a lower surface 31B, and one or more side surfaces 31C. The upper surface 31A can be considered a mounting surface for mounting other components. The upper surface 31A is rectangular in shape. This rectangle of the upper surface 31A may have a short side and a long side. It should be noted that the shape of the upper surface 31A may not be rectangular.

[0121] The mounting substrate 30, viewed from above, has a rectangular shape. This rectangle of the mounting substrate 30 may have a short side and a long side. It should be noted that the shape of the mounting substrate 30, viewed from above, may not be rectangular. When viewed from above, the mounting substrate 30 may have a shape in which the length in one direction (hereinafter referred to as the short side direction of the mounting substrate 30) is smaller than the length in the direction perpendicular to it (hereinafter referred to as the long side direction of the mounting substrate 30). In the illustrated mounting substrate 30, the short side direction is the same as the X direction, and the long side direction is the same as the Y direction.

[0122] The mounting substrate 30 can be configured to have a substrate 32A and an upper metal member 32B. Alternatively, the mounting substrate 30 can also be configured to have a lower metal member 32C. The upper metal member 32B is disposed on the upper surface of the substrate 32A. The lower metal member 32C is disposed on the lower surface of the substrate 32A. The mounting substrate 30 also includes a wiring layer 33. The wiring layer 33 is disposed above the upper metal member 32B.

[0123] The substrate 32A is insulating. The substrate 32A is formed, for example, from silicon nitride, aluminum nitride, or silicon carbide. The main material of the substrate 32A can be a ceramic with good heat dissipation (high thermal conductivity).

[0124] The upper metal component 32B is primarily made of metals such as copper and aluminum. The upper metal component 32B has one or more metal layers. The upper metal component 32B may have multiple metal layers, each primarily made of a different metal.

[0125] The lower metal component 32C is primarily made of metals such as copper and aluminum. The lower metal component 32C has one or more metal layers. The lower metal component 32C may have multiple metal layers, each primarily made of a different metal.

[0126] The wiring layer 33 can be formed using metal. For example, the wiring layer 33 can be formed using AuSn solder (AuSn metal layer).

[0127] For example, the length of the mounting substrate 30 in the short dimension or short side direction is 750 μm or more and 850 μm or less. Furthermore, the length of the mounting substrate 30 in the long dimension or long side direction is 2000 μm or more and 2150 μm or less. Additionally, the difference between the length of the mounting substrate 30 in the long side direction and the length in the short side direction is 1200 μm or more and 1400 μm or less.

[0128] For example, the thickness of the mounting substrate 30 (width in the direction perpendicular to the upper surface 31A) is 250 μm or more and 350 μm or less. Additionally, for example, the thickness of the substrate 32A is 180 μm or more and 220 μm or less. Additionally, for example, the thickness of the upper metal member 32B is 35 μm or more and 65 μm or less. Additionally, for example, the thickness of the lower metal member 32C is 35 μm or more and 65 μm or less. Additionally, for example, the thickness of the wiring layer 33 is 2 μm or more and 4 μm or less.

[0129] (Reflective component 40)

[0130] The reflecting component 40 has a lower surface 41A and a light-reflecting surface 41B that reflects light. Furthermore, the light-reflecting surface 41B is inclined relative to the lower surface 41A. The straight line connecting the lower and upper ends of the light-reflecting surface 41B is inclined relative to the lower surface 41A. The angle at which the light-reflecting surface 41B is inclined relative to the lower surface 41A is called the tilt angle of the light-reflecting surface 41B.

[0131] The light-reflecting surface 41B is a plane. It should be noted that the light-reflecting surface 41B can also be a curved surface. The tilt angle of the light-reflecting surface 41B is 45 degrees. It should be noted that the tilt angle of the light-reflecting surface 41B can also be other than 45 degrees.

[0132] The main material of the reflective component 40 can be glass, metal, etc. Heat-resistant materials can be used as the main material of the reflective component 40. Examples of main materials include quartz or BK7 (borosilicate glass) glass, and metals such as Al. The reflective component 40 can also be formed using Si as the main material.

[0133] If the main material is a reflective material such as Al, the light-reflecting surface 41B can be formed from the main material. Alternatively, instead of forming the light-reflecting surface 41B from the main material, the main material can be used to form the approximate shape of the reflective component 40, and the light-reflecting surface 41B can be formed on the surface of the approximate shape. In this case, the light-reflecting surface 41B can be formed, for example, using a metal layer such as Ag or Al, or a dielectric multilayer film such as Ta2O5 / SiO2, TiO2 / SiO2, or Nb2O5 / SiO2.

[0134] The reflectivity of the light reflecting surface 41B relative to the peak wavelength of the light incident on it is 90% or more. Alternatively, this reflectivity may be 95% or more. Furthermore, the reflectivity may be 99% or more. The reflectivity may be 100% or less.

[0135] (Protective Component 50)

[0136] The protective element 50 has an upper surface, a lower surface, and one or more side surfaces. The protective element 50 is rectangular in shape. It should be noted that the protective element 50 may not be rectangular in shape.

[0137] The protection element 50 is used to prevent excessive current from flowing through a specific component (such as a semiconductor laser component) and causing damage. A Zener diode can be used as an example of the protection element 50. Furthermore, a Zener diode formed of Si can be employed as the Zener diode.

[0138] (Wiring 60)

[0139] Wiring 60 is a wire-shaped conductive material with its two ends serving as joints. The joints at both ends become joints with other components. Wiring 60 is used for electrical connection between two components. Wiring 60 is, for example, a metallic conductor. Metals such as gold, aluminum, silver, and copper can be used.

[0140] (Optical component 70)

[0141] The optical component 70 has an upper surface 71A, a lower surface 71B, and one or more side surfaces 71C. The optical component 70 imparts optical effects to light incident upon it. The optical effects imparted to light by the optical component 70 include, for example, focusing, collimation, diffusion, polarization, diffraction, wave combining, guiding, reflection, and wavelength conversion.

[0142] The optical component 70 has an optically active surface that imparts optical effects. The upper surface 71A, lower surface 71B, or side surface 71C can serve as the optically active surface. Alternatively, the optically active surface can be located at a different position than the upper surface 71A, lower surface 71B, and side surface 71C. For example, the optically active surface can also be formed internally, rather than on the surface of the optical component 70.

[0143] Optical component 70 may have one or more lens surfaces 71D. Lens surface 71D is the optical working surface of optical component 70. It should be noted that optical component 70 with lens surface 71D can also be referred to as a lens component. Light emitted from optical component 70 through lens surface 71D is given the optical function of focusing, diffusing, or collimating by optical component 70. For example, optical component 70 is a collimating lens that causes light entering optical component 70 to be collimated and emitted outwards.

[0144] One or more lens surfaces 71D are disposed on the upper surface 71A side. It should be noted that the lens surface 71D can also be disposed on the lower surface 71B side. The upper surface 71A and the lower surface 71B are planes. One or more lens surfaces 71D intersect with the upper surface 71A. When viewed from above, one or more lens surfaces 71D are surrounded by the upper surface 71A.

[0145] When viewed from above, the optical component 70 has a rectangular shape. It should be noted that the shape of the optical component 70 when viewed from above may not be rectangular. The lower surface 71B is flat. No lens surface 71D is formed on the lower surface 71B side of the optical component 70. The lower surface 71B has a rectangular shape. It should be noted that the shape of the lower surface 71B may not be rectangular.

[0146] In the optical component 70, the portion that overlaps with the lens surface 71D when viewed from above is designated as a lens portion 72A. In the optical component 70, the portion that overlaps with the upper surface 71A when viewed from above is designated as a non-lens portion 72B. The lower surface 71B has a region that constitutes the lower surface of one or more lens portions 72A and a region that constitutes the lower surface of the non-lens portion 72B.

[0147] The optical component 70 may have a plurality of lens surfaces 71D continuously formed in one direction. When viewed from above, the direction in which the plurality of lens surfaces 71D are arranged is called the lens connection direction. In the illustrated optical component 70, the connection direction is the same as the X-direction.

[0148] Multiple lens surfaces 71D are formed such that the vertices of each lens surface 71D are aligned on a straight line. This imaginary straight line connecting the vertices is parallel to the lower surface 71B of the optical component 70. It should be noted that this parallelism includes a difference within ±5 degrees.

[0149] The curvature of some or all of the multiple lens surfaces 71D, and more than two lens surfaces 71D, can be the same. All of the multiple lens surfaces 71D can have the same curvature.

[0150] The optical component 70 is transparent. The transmittance of the optical component 70 relative to the peak wavelength of the light incident on it is 80% or more. The optical component 70 may also have transparent areas and opaque areas (hereinafter referred to as opaque areas). In the opaque areas, the transmittance relative to the peak wavelength of the light incident on the optical component 70 is 50% or less. The optical component 70 can be formed using, for example, glass such as BK7.

[0151] (Light-emitting device 1)

[0152] In the light-emitting device 1, one or more semiconductor laser elements 20 are disposed within the internal space of the package 10. One or more semiconductor laser elements 20 are disposed on the substrate 11. One or more semiconductor laser elements 20 are disposed on the first upper surface 11A.

[0153] One or more semiconductor laser elements 20 emit light from the light emitting surface 22 in a first direction. In the example of the illustrated light-emitting device 1, the first direction is the same as the positive Y direction. More than one semiconductor laser element 20 emits red light.

[0154] One or more semiconductor laser elements 20 may be constituted by a plurality of semiconductor laser elements 20 arranged in a second direction. The second direction may be a direction perpendicular to the first direction. In the example of the illustrated light-emitting device 1, the second direction is the same as the X direction.

[0155] Light traveling in the same direction is emitted from multiple semiconductor laser elements 20. Light of the same color can be emitted from multiple semiconductor laser elements 20. The multiple semiconductor laser elements 20 can be composed of five or more semiconductor laser elements 20. Alternatively, the multiple semiconductor laser elements 20 can be composed of five or more but less than 15, 10 or less, 8 or less, or 7 or less semiconductor laser elements 20.

[0156] One or more semiconductor laser elements 20 can be mounted on one or more mounting substrates 30. One or more semiconductor laser elements 20 can be disposed on a substrate 11 via one or more mounting substrates 30. One or more semiconductor laser elements 20 are bonded to a wiring layer 33 of the mounting substrate 30. Disposing the semiconductor laser elements 20 on the substrate 11 via the mounting substrate 30 improves heat dissipation from the semiconductor laser elements 20 compared to disposing the semiconductor laser elements 20 on the substrate 11 without using the mounting substrate 30.

[0157] In the light-emitting device 1, one or more reflective elements 40 are disposed within the internal space of the package 10. The one or more reflective elements 40 are disposed on the substrate 11. The one or more reflective elements 40 are disposed on the first upper surface 11A.

[0158] One or more reflective elements 40 are positioned away from one or more semiconductor laser elements 20 in a first direction. Light emitted from the one or more semiconductor laser elements 20 is reflected by the one or more reflective elements 40. The light reflected by the one or more reflective elements 40 travels in a third direction. The light traveling in the third direction passes through the package 10 and is emitted outside the package 10. The third direction can be a direction perpendicular to the first and second directions. In the example of the illustrated light-emitting device 1, the third direction is the same as the positive Z direction.

[0159] One or more reflective elements 40 may be composed of a plurality of reflective elements 40 arranged in a fourth direction. The fourth direction can be the same as the second direction. By aligning the second direction with the fourth direction, it is possible to miniaturize the light-emitting device 1.

[0160] A light-reflecting surface 41B of a reflective component 40 can correspond to light emitted from a semiconductor laser element 20. The main portion of the light emitted from one or more semiconductor laser elements 20 is reflected by the corresponding light-reflecting surface 41B of the reflective component 40. It should be noted that light emitted from multiple semiconductor laser elements 20 can also be reflected by a light-reflecting surface 41B of a reflective component 40.

[0161] In the light-emitting device 1, one or more protective elements 50 are disposed within the internal space of the package 10. The one or more protective elements 50 are disposed on the substrate 11 or the mounting substrate 30. The one or more protective elements 50 are configured to protect one or more semiconductor laser elements 20. In the illustrated light-emitting device 1, more than one protective element 50 is disposed on the substrate 11.

[0162] In the light-emitting device 1, multiple wirings 60 are provided to electrically connect one or more semiconductor laser elements 20 to the substrate 11. The multiple wirings 60 are connected to the semiconductor laser elements 20, the wiring layer 33 of the mounting substrate 30, or the inner wiring portion 12A1 of the substrate 11. As a result, one or more semiconductor laser elements 20 are electrically connected to the outer wiring portion 12A2 of the substrate 11.

[0163] One or more semiconductor laser elements 20 include one or more semiconductor laser elements 20, namely first semiconductor laser elements 20A, which are electrically connected to the first inner wiring portion 12A11 and the second inner wiring portion 12A12. In the illustrated light-emitting device 1, one or more semiconductor laser elements 20 are all first semiconductor laser elements 20A. Multiple semiconductor laser elements 20 can be connected in series through multiple wirings 60.

[0164] The plurality of wirings 60 includes a first wiring 60A that is coupled to the first inner wiring portion 12A11 and electrically connected to the first semiconductor laser element 20A. The plurality of wirings 60 also includes a second wiring 60B that is coupled to the second inner wiring portion A12 and electrically connected to the first semiconductor laser element 20A.

[0165] A first inner wiring portion 12A11, which is connected to the first wiring 60A, is electrically connected to the first semiconductor laser element 20A on the first electrode side. A second inner wiring portion 12A12, which is connected to the second wiring 60B, is electrically connected to the first semiconductor laser element 20A on the second electrode side. It should be noted that the first electrode side refers to the side in the current path where the first electrode is closer to the second electrode than the second electrode, and the second electrode side refers to the side in the current path where the second electrode is closer to the first electrode than the second electrode.

[0166] The first inner wiring section 12A11, which is connected to the first wiring 60A, is an inner wiring section 12A1 connected to both sides. The second inner wiring section 12A12, which is connected to the second wiring 60B, is an inner wiring section 12A1 connected to both sides. It should be noted that either the first inner wiring section 12A11 or the second inner wiring section 12A12 may not be an inner wiring section 12A1 connected to both sides. In other words, an inner wiring section 12A1 that is not an inner wiring section 12A1 connected to both sides refers to an inner wiring section 12A1 that satisfies either the first outer wiring section 12A21 or the second outer wiring section 12A22 that does not have an electrical connection.

[0167] In the light-emitting device 1, an optical component 70 is disposed on the outside of the package 10. The optical component 70 is bonded to the package 10. The optical component 70 is bonded to the upper surface 14A of the package 10 via an adhesive. The optical component 70 is bonded to the cover 14. The adhesive can be a UV-curable or thermosetting resin adhesive.

[0168] Light emitted from the package 10 enters the optical component 70. The light entering the optical component 70 enters the optical action surface, is given an optical action, and exits from the optical action surface. For example, light collimated by the lens surface 71D, which serves as the optical action surface, exits from the optical component 70.

[0169] A lens surface 71D or lens section 72A can correspond to light emitted from a semiconductor laser element 20. The main portion of the light emitted from one or each semiconductor laser element 20 passes through the lens surface 71D of the corresponding lens section 72A.

[0170] (Wireline board 101)

[0171] Wiring substrate 101 has an upper surface 101A, a lower surface 101B, and one or more side surfaces. Wiring substrate 101 has a plate-like shape. When viewed from above, the outer edge of wiring substrate 101 is rectangular. This rectangle can be a rectangle with a long side and a short side. In the illustrated package 10, the short side of this rectangle is in the same direction as the X-direction, and the long side is in the same direction as the Y-direction.

[0172] The wiring board 101 has a heat dissipation section 101D, a wiring section 101E, and an insulation section 101F. The heat dissipation section 101D functions as a heat dissipation path for heat emitted from other components mounted on the wiring board 101. The wiring section 101E is electrically connected to the other components mounted on the wiring board 101.

[0173] The insulating portion 101F insulates the heat dissipation portion 101D from the wiring portion 101E. In the wiring board 101, the heat dissipation portion 101D and the wiring portion 101E are not electrically connected. Alternatively, it may be provided to protect a portion of the wiring portion 101E from contact with other components.

[0174] The wiring board 101 has a joint portion 101G. The joint portion 101G is provided to engage with other components in a sufficient manner. Here, sufficient manner means, for example, ensuring sufficient engagement strength, and also, for example, ensuring sufficient positional accuracy. The joint portion 101G is insulated from the heat dissipation portion 101D and the wiring portion 101E by an insulating portion 101F.

[0175] Here, on the upper surface 101A of the wiring board 101, the area where the heat dissipation part 101D is located at the top of the heat dissipation part 101D, the wiring part 101E and the insulation part 101F are designated as the upper surface 101A of the heat dissipation part 101D, the area where the wiring part 101E is located at the top of the wiring part 101E, and the area where the insulation part 101F is located at the top of the insulation part 101F are designated as the upper surface 101A of the insulation part 101F.

[0176] In addition, the area on the upper surface 101A of the wiring board 101, where the heat dissipation part 101D, wiring part 101E, insulation part 101F and the joint part 101G of the joint part 101A are located, is defined as the upper surface 101A of the joint part 101G.

[0177] The wiring board 101 includes a heat dissipation component 111, multiple conductive components 121, and one or more insulating components 131. The heat dissipation section 101D may be composed of the heat dissipation component 111. The wiring section 101E may be composed of multiple conductive components 121. The insulating section 101F may be composed of one or more insulating components 131.

[0178] The junction 101G can be composed of multiple conductive components 121. Both the wiring portion 101E and the junction 101G can be composed of conductive components 121 made of the same material. Here, the component constituting the wiring portion 101E is referred to as wiring component 121A, and the component constituting the junction 101G is referred to as junction component 121B. It should be noted that the junction component 121B can also be a component different from the conductive component 121 constituting the wiring component 121A. The wiring substrate 101 includes multiple wiring components 121A.

[0179] One or more through holes 101H are provided on the wiring board 101. The one or more through holes 101H include through holes 101H for fixing the wiring board 101 to other components (constituents). For example, a screw is inserted into the through hole 101H to fix the wiring board 101 to the other component. The one or more through holes 101H also include through holes 101H for determining the position when the wiring board 101 is fixed to the other component.

[0180] The heat dissipation component 111 has a first upper surface 111A. The heat dissipation component 111 has a second upper surface 111B located at a lower position than the first upper surface 111A. The heat dissipation component 111 has a protrusion projecting from the second upper surface 111B, and the first upper surface 111A can serve as the upper surface of the protrusion. The height of the protrusion of the heat dissipation component 111 (the height from the second upper surface 111B to the first upper surface 111A) is smaller than the height from the lower surface of the heat dissipation component 111 to the second upper surface 111B.

[0181] One or more insulating components 131 are disposed on the heat dissipation component 111. One or more insulating components 131 are disposed on the second upper surface 111B. A plurality of conductive components 121 are disposed on the second upper surface 111B via the insulating components 131. The plurality of conductive components 121 are separated from each other and are not electrically connected.

[0182] One or more insulating components 131 are disposed between the heat dissipation component 111 and each conductive component 121. In a top view, the one or more insulating components 131 are partially disposed above the conductive components 121. Through the insulating components 131, a connected conductive component 121 appears to be divided into multiple regions. Thus, a wiring pattern is formed on the upper surface 101A of the wiring substrate 101.

[0183] The main material of the heat dissipation component 111 can be a metallic material. For example, single metals such as Cu, Ag, Al, Ni, Rh, Au, Ti, Pt, Pd, Mo, Cr, and W, or alloys comprising these metals, can be used as the main material of the heat dissipation component 111. The heat dissipation component 111 is preferably formed of a material with excellent heat dissipation properties. The heat dissipation component 111 may comprise 95% by mass or more copper.

[0184] The main material of the conductive component 121 can be a metallic material. For example, individual metals such as Cu, Ag, Al, Ni, Rh, Au, Ti, Pt, Pd, Mo, Cr, and W, or alloys including these metals, can be used as the main material of the conductive component 121.

[0185] The insulating component 131 is formed of an insulating material. For example, polyimide can be used as the main material of the insulating component 131. Alternatively, the insulating component 131 can be made of glass epoxy resin, liquid crystal polymer, or the like, by impregnating one or more sheets of glass cloth with a thermosetting insulating resin such as epoxy resin and then curing the thermosetting insulating resin. The insulating portion 101F can be formed using multiple insulating components 131 formed of different main materials. For example, one of the insulating components 131 can be a film-like polyimide, while other insulating components 131 can be made of a solder resist or other corrosion resist.

[0186] (Connector 201)

[0187] Connector 201 has an insertion port for inserting connector cables.

[0188] (Thermistor 301)

[0189] Thermistor 301 can be used as a temperature measuring element.

[0190] Next, the light-emitting module 901 will be described.

[0191] (Light-emitting module 901)

[0192] In the light-emitting module 901, one or more light-emitting devices 1 are mounted on the wiring substrate 101. The lower surface 11B of one or more light-emitting devices 1 is disposed on the upper surface 101A of the wiring substrate 101. The wiring substrate 101 has one or more bonding regions 102. The light-emitting devices 1 are bonded to the bonding regions 102 of the wiring substrate 101.

[0193] The bonding region 102 includes the upper surface 101A of the wiring portion 101E. The bonding region 102 includes the upper surface 101A of the bonding portion 101G. The bonding region 102 includes the upper surface 101A of the heat dissipation portion 101D. The bonding region 102 includes the upper surface 101A of the insulating portion 101F. The bonding region 102 can be, for example, set as the smallest rectangular region that includes the light-emitting device 1 and the area in the upper surface 101A of the wiring portion 101E that is bonded to the light-emitting device 1.

[0194] One or more light-emitting devices 1 have one or more outer wiring portions 12A2 in the bonding region 102 that are engaged with the wiring portion 101E. One or more light-emitting devices 1 have one or more outer wiring portions 12A2 in the bonding region 102 that are engaged with the bonding portion 101G. The base portion 11M is engaged with the heat dissipation portion 101D.

[0195] One or more first outer wiring portions 12A21 are joined to the wiring substrate 101 in the joining region 102. One or more second outer wiring portions 12A22 are joined to the wiring substrate 101 in the joining region 102.

[0196] Here, one or more first outer wiring portions 12A21 of the light-emitting device 1 that are joined to the wiring substrate 101 in the joining region 102 are referred to as first conductive portions 12B1. In addition, one or more second outer wiring portions 12A22 of the light-emitting device 1 that are joined to the wiring substrate 101 in the joining region 102 are referred to as second conductive portions 12B2.

[0197] The first conductive portion 12B1 has a first conductive region 12B11 and a second conductive region 12B12 that are not electrically connected to each other when the substrate 11 is in its state. The second conductive portion 12B2 has a first conductive region 12B21 and a second conductive region 12B22 that are not electrically connected to each other when the substrate 11 is in its state. It should be noted that one conductive region can correspond to one wiring portion 12A.

[0198] Furthermore, "in the state of substrate 11" does not refer to the state of becoming light-emitting device 1 or light-emitting module 901, but rather to the state when viewed as a single unit of substrate 11. For example, two conductive areas that are not electrically connected in the state of substrate 11 can be electrically connected via semiconductor laser element 20, mounting substrate 30, wiring 60, etc., when they become light-emitting device 1.

[0199] The wiring section 101E of the wiring board 101 is provided with a first electrode section 101E1 and a second electrode section 101E2 for supplying power to one or more semiconductor laser elements 20. The first electrode section 101E1 is electrically connected to the first semiconductor laser element 20A on the first electrode side, and the second electrode section 101E2 is electrically connected to the first semiconductor laser element 20A on the second electrode side.

[0200] The multiple wiring components 121A can be described as components used to form a current path (hereinafter referred to as a first current path) from the first electrode portion 101E1 to the second electrode portion 101E2 or from the second electrode portion 101E2 to the first electrode portion 101E1 via one or more light-emitting devices 1. It should be noted that the first current path may be formed by only one or more light-emitting devices 1 and multiple wiring components 121A, for example, multiple wiring components 121A may be connected by leads, or it may also include other components.

[0201] The first current path is formed in the order of first electrode portion 101E1, first conductive portion 12B1, one or more semiconductor laser elements 20, second conductive portion 12B2, and second electrode portion 101E2, or the reverse order thereof. The one or more semiconductor laser elements 20 are capable of consuming the power supplied via the substrate 11 and emitting light.

[0202] Multiple wiring components 121A have multiple wiring regions 122. Each wiring component 121A has a wiring region 122 that is connected to a first conductive portion 12B1 within a junction region 102. This wiring region 122 is connected to a first conductive region 12B11 of the first conductive portion 12B1. In top view, this wiring region 122 is not covered by the insulating member 131. This wiring region 122 is included on the upper surface 101A of the wiring portion 101E. The multiple wiring components 121A are not connected to a second conductive region 12B12 of the first conductive portion 12B1.

[0203] Multiple wiring components 121A have wiring regions 122 connected to the second conductive portion 12B2 within the junction region 102. These wiring regions 122 are connected to the first conductive region 12B21 of the second conductive portion 12B2. In plan view, these wiring regions 122 are not covered by the insulating member 131. These wiring regions 122 are included on the upper surface 101A of the wiring portion 101E. The multiple wiring components 121A are not connected to the second conductive region 12B22 of the second conductive portion 12B2. Here, the wiring region 122 of the second conductive portion 12B2 connected to the first conductive region 12B21 is referred to as the first wiring region 122A.

[0204] Multiple wiring components 121A have a first wiring region 122A connected to a first conductive region 12B21 of a second conductive portion 12B2 within a junction region 102, and a second wiring region 122B opposite to the first wiring region 122A when viewed from above, separated by a second conductive region 12B22 of the second conductive portion 12B2. The first wiring region 122A and the second wiring region 122B constitute part of a first current path.

[0205] The second wiring region 122B is located outside the bonding region 102 of the light-emitting device 1. Furthermore, the wiring component 121A that forms the first current path between the first conductive region 12B21 of the second conductive portion 12B2 and the second wiring region 122B does not contact the second conductive region 12B22 of the second conductive portion 12B2. Even when multiple wiring components 121A form the first current path between the first conductive region 12B21 of the second conductive portion 12B2 and the second wiring region 122B, none of these wiring components 121A contact the second conductive region 12B22 of the second conductive portion 12B2. Therefore, a first current path can be formed such that no current path is formed between the first wiring region 122A of the wiring substrate 101 and the second conductive region 12B22 of the light-emitting device 1, and no current path through the second conductive region 12B22 of the light-emitting device 1 is formed between the first wiring region 122A and the wiring region 122 for the second external connection.

[0206] If the current path through the substrate 11 of the light-emitting device 1 increases, the heat generated in the substrate 11 increases, and the performance (light output) of the semiconductor laser element 20 disposed in the package 10 may decrease. By studying the structure of the wiring portion 101E of the wiring substrate 101, the current path through the substrate 11 can be reduced, the wiring resistance of the light-emitting module 901 can be reduced, and the performance of the light-emitting module 901 can be improved.

[0207] Multiple wiring components 121A have a connection region 122C that connects the first wiring region 122A to the second wiring region 122B. In other words, the first wiring region 122A, the second wiring region 122B, and the connection region 122C are all included in one wiring component 121A, and it is efficient to manufacture these regions by using a single wiring component 121A. It should be noted that the connection region 122C does not contact the second conductive region 12B22 of the second conductive part 12B2.

[0208] When viewed from above, the connection area 122C is covered by the insulating component 131 and is not exposed on the upper surface 101A. When viewed from above, the upper surface 101A of the wiring board 101 that overlaps with the connection area 122C is the upper surface 101A of the insulating component 101F. As a result, external contact between the connection area 122C and the light-emitting module 901 can be avoided.

[0209] When viewed from above, the second wiring area 122B is covered by the insulating member 131 and is not exposed on the upper surface 101A. When viewed from above, the upper surface 101A of the wiring substrate 101 that overlaps with the second wiring area 122B is the upper surface 101A of the insulating part 101F.

[0210] When viewed from above, the plurality of wiring components 121A have a meandering region 122D on the outside of the light-emitting device 1 and the junction region 102 of the light-emitting device 1, which is connected to the second wiring region 122B and extends in the direction from the second conductive portion 12B2 toward the first conductive portion 12B1. When viewed from above, the upper surface 101A of the wiring substrate 101 that overlaps with the meandering region 122D is the upper surface 101A of the insulating portion 101F.

[0211] To supply power to one or more semiconductor laser elements 20, wiring regions 122 for connecting to external power supplies are provided in the first electrode portion 101E1 and the second electrode portion 101E2, respectively. These wiring regions 122 are, for example, connected to external power supplies or connected to connectors 201 for inserting these external power supplies. These wiring regions 122 are referred to as the first external connection wiring region 122 and the second external connection wiring region 122, respectively, to distinguish them from other wiring regions 122.

[0212] When viewed from above, when the upper surface 101A of the wiring board 101 is divided into two regions by an imaginary straight line L1 passing through the light-emitting device 1 but not through the first and second sides of the substrate 11, the wiring region 122 for the first external connection and the wiring region 122 for the second external connection are both disposed in one region. By placing these wiring regions 122 close together in one region, wiring connections are made easier.

[0213] When viewed from above, both the first external connection wiring area 122 and the second external connection wiring area 122 are located on the side of the first conductive portion 12B1 of the light-emitting device 1. When viewed from above, the distance from the first conductive portion 12B1 to the first external connection wiring area 122 is shorter than the distance from the second conductive portion 12B2 to the first external connection wiring area 122.

[0214] The second external connection wiring area 122 is located at a position away from the first external connection wiring area 122 in the fifth direction. The imaginary line L1 is a line parallel to the fifth direction. In the illustrated light-emitting module 901, the fifth direction is the same as the positive Y direction.

[0215] The plurality of wiring components 121A include: a first wiring component 121A1, which includes a wiring area 122 for a first external connection; and a second wiring component 121A2, which includes a wiring area 122 for a second external connection. The first wiring component 121A1 is included in a first electrode portion 101E1, and the second wiring component 121A2 is included in a second electrode portion 101E2.

[0216] Within the junction area 102, a wiring area 122 that is joined with the first conductive portion 12B1 is included in the first wiring component 121A1. The wiring area 122 for the first external connection is electrically connected to the first conductive portion 12B1 via the first wiring component 121A1.

[0217] Within the junction area 102, a wiring area 122 that engages with the second conductive portion 12B2 is included in the second wiring component 121A2. The wiring area 122 for second external connection is electrically connected to the second conductive portion 12B2 via the second wiring component 121A2.

[0218] The second wiring component 121A2 includes a second wiring region 122B. Additionally, the second wiring component 121A2 may include a first wiring region 122A and a connection region 122C. Furthermore, the second wiring component 121A2 may include a detour region 122D. Including the wiring region 122 for the second external connection, constituting the second electrode portion 101E2 with a single wiring component 121A is highly efficient in manufacturing.

[0219] When viewed from above, the second conductive region 12B12 of the first conductive portion 12B1 is positioned away from the first conductive region 12B11 of the first conductive portion 12B1 in the sixth direction. In the illustrated light-emitting module 901, the sixth direction is the same as the positive Y direction.

[0220] In a top view, the second conductive region 12B22 of the second conductive portion 12B2 is located at a position away from the first conductive region 12B21 of the second conductive portion 12B2 in the sixth direction. In a top view, the connecting region 122C is located at a position away from the second conductive region 12B22 of the second conductive portion 12B2 in a direction perpendicular to the sixth direction.

[0221] When viewed from above, the width of the connection region 122C is smaller than the width of the first wiring region 122A in the direction perpendicular to the sixth direction. This helps to suppress the enlargement of the wiring substrate 101 or the light-emitting module 901. Furthermore, when viewed from above, the width of the connection region 122C is smaller than the width of the second wiring region 122B in the direction perpendicular to the sixth direction.

[0222] The second conductive region 12B22 of the second conductive part 12B2 is electrically connected to the first conductive part 12B1. In this way, with the second conductive region 12B22 of the second conductive part 12B2 electrically connected to the first conductive part 12B1, the technical significance of studying the structure of the wiring part 101E in the wiring board 101 is enhanced in order to reduce the current path passing through the substrate 11 of the light-emitting device 1.

[0223] The second conductive region 12B22 of the second conductive part 12B2 is electrically connected to the first conductive region 12B11 of the first conductive part 12B1. In this case, if the wiring component 121A forming the first current path between the first conductive region 12B21 of the second conductive part 12B2 and the second wiring region 122B comes into contact with the second conductive region 12B22 of the second conductive part 12B2, the light-emitting device 1 may sometimes fail to operate normally.

[0224] The first conductive region 12B21 of the second conductive portion 12B2 is electrically connected to the second conductive region 12B12 of the first conductive portion 12B1. The second conductive region 12B12 of the first conductive portion 12B1 is not connected to the wiring portion 101E of the wiring board 101. As a result, it is possible to avoid an increase in the current path passing through the substrate 11 and prevent the light-emitting device 1 from malfunctioning.

[0225] With the substrate 11 in place, the first inner wiring portion 12A11, which is joined with the first wiring 60A, is electrically connected to the first conductive region 12B11 of the first conductive portion 12B1. With the substrate 11 in place, the second inner wiring portion 12A12, which is joined with the second wiring 60B, is electrically connected to the first conductive region 12B21 of the second conductive portion 12B2.

[0226] The first current path is formed in the order of the wiring area 122 for the first external connection, the first conductive area 12B11 of the first conductive part 12B1, the first inner wiring part 12A11 for the first wiring 60A to be joined, one or more semiconductor laser elements 20, the second inner wiring part 12A12 for the second wiring 60B to be joined, the first conductive area 12B21 of the second conductive part 12B2, and the wiring area 122 for the second external connection, or the reverse order thereof.

[0227] The second conductive region 12B12 of the first conductive portion 12B1 is joined to the junction portion 101G of the wiring board 101. The second conductive region 12B12 of the first conductive portion 12B1 does not substantially function as wiring that forms part of the current path. By joining the second conductive region 12B12 of the first conductive portion 12B1 to the junction portion 101G, the mounting of the light-emitting device 1 to the wiring board 101 is stabilized, and mounting accuracy can be improved.

[0228] The second conductive region 12B22 of the second conductive portion 12B2 is joined to the junction portion 101G of the wiring board 101. The second conductive region 12B22 of the second conductive portion 12B2 does not substantially function as wiring that forms part of the current path. By joining the second conductive region 12B22 of the second conductive portion 12B2 to the junction portion 101G, the mounting of the light-emitting device 1 to the wiring board 101 is stabilized, and mounting accuracy can be improved.

[0229] In the light-emitting module 901 of the first embodiment, among the first conductive region 12B11 of the first conductive part 12B1, the second conductive region 12B12 of the first conductive part 12B1, the first conductive region 12B21 of the second conductive part 12B2, and the second conductive region 12B22 of the second conductive part 12B2, the first conductive region 12B11 of the first conductive part 12B1 and the first conductive region 12B21 of the second conductive part 12B2 play a substantial role in the formation of the first current path, while the second conductive region 12B12 of the first conductive part 12B1 and the second conductive region 12B22 of the second conductive part 12B2 do not play a substantial role.

[0230] In the light-emitting module 901, connector 201 is mounted on the wiring board 101. Connector 201 is connected to the wiring section 101E. Connector 201 is connected to the wiring area 122 for first external connection and the wiring area 122 for second external connection. By providing connector 201, power supply to the light-emitting device 1 can be easily achieved via connector 201.

[0231] In the light-emitting module 901, a thermistor 301 is mounted on the wiring board 101. The thermistor 301 is connected to the wiring section 101E. The thermistor 301 is electrically connected to the connector 201. By setting the thermistor 301, the temperature of the light-emitting device 1 can be detected.

[0232] <Second Implementation>

[0233] The light-emitting module 901 of the second embodiment will be described. Figures 5A to 5M ,as well as Figures 9 to 14 This is an accompanying drawing illustrating an exemplary embodiment of the light-emitting module 901 of the second embodiment. Figures 5A to 5M The accompanying drawings are those described in the first embodiment. Figure 9 This is a perspective view of the light-emitting module 901. It should be noted that the light-emitting device 1 that matches the light-emitting module 901 in the X, Y, and Z directions is the first light-emitting device 1A. Figure 10 This is a top view of the light-emitting module 901. Figure 11 This is a top view of the wiring board 101. It should be noted that... Figure 11 In the middle, the joint area 102 is marked with a shaded line. Figure 12 This is a top view of the interior of the package 10 of the light-emitting device 1 seen in the light-emitting module 901. Figure 13 This is a top view of the wiring board 101 with the insulation portion 101F removed. Figure 14 This is an enlarged top view used to illustrate the connection status between the light-emitting device 1 in the light-emitting module 901 and the wiring board 101. Figure 14 Enlarged Figures 11 to 13The area enclosed by the dashed rectangular line. Additionally, to easily understand the connection state, a portion of the constituent elements is appropriately shown or removed.

[0234] The description of the light-emitting module 901 of the first embodiment and its constituent elements described above, from the light-emitting module 901 of the second embodiment... Figures 5A to 5M ,as well as Figures 9 to 14 The entire description of the light-emitting module 901 in the accompanying drawings, after removing any potentially contradictory content, also applies to the description of the second embodiment. All non-contradictory content will not be repeated here.

[0235] (Light-emitting module 901)

[0236] Regarding the light-emitting module 901 of the first embodiment, an example in which the number of light-emitting devices 1 mounted on the wiring board 101 is one is illustrated, and a technical description based thereon is provided (it should be noted that the invention disclosed by the light-emitting module 901 of the first embodiment is not limited to the illustrated example). Regarding the light-emitting module 901 of the second embodiment, an example in which the number of light-emitting devices 1 mounted on the wiring board 101 is two is illustrated and described.

[0237] In the light-emitting module 901, two light-emitting devices 1 are mounted on the wiring board 101. The wiring board 101 has two bonding regions 102. Here, each light-emitting device 1 is referred to as the first light-emitting device 1A and the second light-emitting device 1B, and each bonding region 102 is referred to as the first bonding region 102A and the second bonding region 102B.

[0238] The first light-emitting device 1A and the second light-emitting device 1B can use the same substrate 11. At least the number and position of the wiring portions 12A, and the electrical connection relationship between the inner wiring portions 12A1 and the outer wiring portions 12A2, can be the same substrate 11; "same substrate 11" here means at least satisfying this condition. It should be noted that having the same shape for the wiring portions 12A in the substrate 11 can also be added to satisfying the condition of "same substrate 11". Alternatively, having the same outer edge shape when viewed from above can also be added to satisfying the condition of "same substrate 11". Furthermore, having the same overall shape can also be added to satisfying the condition of "same substrate 11".

[0239] The second bonding region 102B is separated from the first bonding region 102A. The first light-emitting device 1A is bonded to the first bonding region 102A of the wiring substrate 101, and the second light-emitting device 1B is bonded to the second bonding region 102B of the wiring substrate 101.

[0240] The first light-emitting device 1A and the second light-emitting device 1B are arranged opposite each other on the upper surface 101A of the wiring substrate 101 in a top view. The direction from the first conductive portion 12B1 of the first light-emitting device 1A toward the second conductive portion 12B2 is the same as the direction from the second conductive portion 12B2 of the second light-emitting device 1B toward the first conductive portion 12B1. The first direction in the first light-emitting device 1A is the direction toward the second light-emitting device 1B, and the first direction in the second light-emitting device 1B is the direction toward the first light-emitting device 1A.

[0241] The first electrode portion 101E1 of the wiring board 101 is electrically connected to the first semiconductor laser element 20A of the first light-emitting device 1A and the first semiconductor laser element 20A of the second light-emitting device 1B on the first electrode side of these first semiconductor laser elements 20A, and the second electrode portion 101E2 is electrically connected to the first semiconductor laser element 20A of the first light-emitting device 1A and the first semiconductor laser element 20A of the second light-emitting device 1B on the second electrode side of these first semiconductor laser elements 20A.

[0242] For convenience, the current path in the light-emitting module 901 of the second embodiment is referred to as the second current path. However, as described above, the non-contradictory content in the description of the first current path applies to the description of the second current path.

[0243] The second current path is formed in the order of the first electrode portion 101E1, the first conductive portion 12B1 of the first light-emitting device 1A, one or more semiconductor laser elements 20 of the first light-emitting device 1A, the second conductive portion 12B2 of the first light-emitting device 1A, the first conductive portion 12B1 of the second light-emitting device 1B, one or more semiconductor laser elements 20 of the second light-emitting device 1B, the second conductive portion 12B2 of the second light-emitting device 1B, and the second electrode portion 101E2, or the reverse order thereof.

[0244] Multiple wiring components 121A include: a first wiring region 122A, which is connected within a first bonding region 102A to a first conductive region 12B21 of a second conductive portion 12B2 of a first light-emitting device 1A; and a second wiring region 122B, which, when viewed from above, is opposite to the first wiring region 122A across a second conductive region 12B22 of the second conductive portion 12B2 of the first light-emitting device 1A. The second wiring region 122B is located within the second bonding region 102B.

[0245] The second wiring region 122B is connected to the first conductive portion 12B1 of the second light-emitting device 1B within the second bonding region 102B. The second wiring region 122B is connected to the first conductive region 12B11 of the first conductive portion 12B1 of the second light-emitting device 1B. In a top view, the second wiring region 122B is not covered by the insulating member 131.

[0246] The wiring component 121A, which forms the first current path between the first conductive region 12B21 of the second conductive portion 12B2 of the first light-emitting device 1A and the second wiring region 122B, does not contact the second conductive region 12B22 of the second conductive portion 12B2 of the first light-emitting device 1A and the second conductive region 12B22 of the first conductive portion 12B1 of the second light-emitting device 1B. The connection region 122C does not contact the second conductive region 12B22 of the second conductive portion 12B2 of the first light-emitting device 1A and the second conductive region 12B22 of the first conductive portion 12B1 of the second light-emitting device 1B.

[0247] When viewed from above, both the wiring area 122 for the first external connection and the wiring area 122 for the second external connection are located on the side of the first conductive part 12B1 of the first light-emitting device 1 and the side of the second conductive part 12B2 of the second light-emitting device 1B.

[0248] Within the first bonding region 102A, a wiring region 122 bonded to the first conductive portion 12B1 is included in the first wiring component 121A1. Within the second bonding region 102B, a wiring region 122 bonded to the second conductive portion 12B2 is included in the second wiring component 121A2. The second wiring component 121A2 does not include the second wiring region 122B.

[0249] In the second light-emitting device 1B, when viewed from above, the second conductive region 12B12 of the first conductive portion 12B1 is positioned away from the first conductive region 12B11 of the first conductive portion 12B1 in a direction opposite to the sixth direction. Furthermore, when viewed from above, the second conductive region 12B22 of the second conductive portion 12B2 is positioned away from the first conductive region 12B21 of the second conductive portion 12B2 in a direction opposite to the sixth direction.

[0250] When viewed from above, the connecting region 122C is positioned away from the second conductive region 12B22 of the second conductive part 12B2 of the first light-emitting device 1A and the second conductive region 12B12 of the first conductive part 12B1 of the second light-emitting device 1B in a direction perpendicular to the sixth direction.

[0251] The second conductive region 12B12 of the first conductive part 12B1 of the first light-emitting device 1A and the second conductive region 12B22 of the second conductive part 12B2 of the second light-emitting device 1B are not connected to the wiring part 101E of the wiring board 101.

[0252] In the light-emitting module 901 of the second embodiment illustrated, assuming that the connection region 122C is replaced with an insulating component to electrically insulate the first wiring region 122A from the second wiring region 122B, and a single wiring component 121A forms a junction 101G that engages with the second conductive region 12B12 of the first conductive portion 12B1 of the first light-emitting device 1A and a junction 101G that engages with the second conductive region 12B22 of the second conductive portion 12B2 of the second light-emitting device 1B, the current path of the light-emitting module 901 can also be formed. However, in this case, the number of current paths passing through the first light-emitting device 1A and the number of current paths passing through the second light-emitting device 1B increase respectively. The light-emitting module 901 of the second embodiment can improve light output.

[0253] Here, based on the light-emitting module 901 of the first and second embodiments described above, the disclosed technical content is summarized. The light-emitting function of the light-emitting device 1 can be considered as the function expected of the device mounted on the wiring board 101. As long as the device performs the expected function, the device mounted on the wiring board 101 is not limited to the light-emitting device 1. However, if the design of the wiring board 101 is to improve the performance of the device's function, then the device mounted on the wiring board 101 is a power-consuming component that consumes at least power to perform its function. Therefore, the semiconductor laser element 20 can be considered an example of a power-consuming component. Furthermore, if the performance of the function is improved based on the principle of reducing heat generated within the device through the design of the wiring board 101, then the performance of the function should be a power-consuming component whose performance is affected by temperature. Therefore, an electronic component including many semiconductor elements can be an example of a power-consuming component. The names light-emitting device 1 and light-emitting module 901 also correspond to the semiconductor laser element as an example of a power-consuming component. From the perspective of the disclosed technical content, the limitation of a function or application such as "light emission" is not necessary. By removing words like "light-emitting" and referring to it as a device or module, it is made clear that its purpose is not limited to "light-emitting," but can be applied to the whole device or module with power-consuming components.

[0254] <Third Implementation Method>

[0255] The third embodiment of the multiple light-emitting modules 901 will be described. The multiple light-emitting modules 901 are manufactured or managed by the same entity at the same time. The entity may be, for example, a natural person or a legal person. More specifically, this includes manufacturers of the multiple light-emitting modules 901, sellers of the multiple light-emitting modules 901, and sellers of products equipped with the multiple light-emitting modules 901.

[0256] The multiple light-emitting modules 901 include a first light-emitting module 901A and a second light-emitting module 901B. Furthermore, the sellers of products equipped with the first light-emitting module 901A, as well as sellers of products equipped with the second light-emitting module 901B, are also subject to the aforementioned definition of "sellers of products equipped with multiple light-emitting modules 901". For example, if these equipped products are offered as a product line at the same time and a complete system is in place for selling them to potential buyers, it can be said that they are managed by the same entity at the same time.

[0257] The first light-emitting module 901A is either the light-emitting module 901 of the first embodiment or the light-emitting module 901 of the second embodiment. Figures 5A to 5M as well as Figures 15 to 19 This is a diagram illustrating one way of showing an example of the second light-emitting module 901B. Figures 5A to 5M The accompanying drawings are those described in the first embodiment. Figure 15 This is a 3D view of the second light-emitting module 901B. Figure 16 This is a top view of the second light-emitting module 901B. Figure 17 This is a top view of the wiring board 101. It should be noted that... Figure 17 In the middle, the joint area 102 is marked with a shaded line. Figure 18 This is a top view of the interior of the package 10 of the light-emitting device 1 as observed from the second light-emitting module 901B. Figure 19 This is a top view of the wiring board 101 with the insulation portion 101F removed.

[0258] The description of the light-emitting module 901 and its constituent elements in the first and second embodiments described above, starting from the second light-emitting module 901B Figures 5A to 5M as well as Figures 15 to 19 The entire description of the second light-emitting module 901B, after removing any potentially contradictory content from the attached diagram, also applies. All non-contradictory content will not be repeated here.

[0259] (Second light-emitting module 901B)

[0260] In the second light-emitting module 901B, a light-emitting device 1 using only either the first conductive portion 12B1 or the second conductive portion 12B2 in the formation of the current path for supplying power to the semiconductor laser element 20 is mounted on the wiring substrate 101. In particular, a light-emitting device 1 using only the conductive portion near the wiring area 122 for external connection can be mounted.

[0261] One reason for using only one conductive portion when supplying power to the semiconductor laser element 20 of the light-emitting device 1 is to avoid increasing the size of the wiring board 101. Shortening the current path within the light-emitting device 1 involves supplementing the current path with components outside the light-emitting device 1, primarily the wiring board 101. By having an inner wiring portion 12A1 connected on both sides of the substrate 11, using a first inner wiring portion 12A11 and a second inner wiring portion 12A12 in the formation of the current path, and being able to appropriately select which of the first conductive portion 12B1 and the second conductive portion 12B2, or both, to use, the light-emitting device 1 can be selective in its usage.

[0262] For example, as shown in the second light-emitting module 901B, two light-emitting devices 1 are mounted on the wiring board 101. One light-emitting device 1 is the same as the light-emitting device 1 in the light-emitting module 901 exemplified in the first and second embodiments. A current path is formed through the light-emitting device 1 from the first electrode portion 101E1 to the second electrode portion 101E2 or from the second electrode portion 101E2 to the first electrode portion 101E1.

[0263] However, the current path is formed in the order of the first electrode portion 101E1, the first conductive region 12B11 of the first conductive portion 12B1, one or more semiconductor laser elements 20, the second conductive region 12B12 of the first conductive portion B1, and the second electrode portion 101E2, or the reverse order thereof. In the second light-emitting module 901B, the second conductive portion 12B2 is not required in the formation of the current path for the one or more semiconductor laser elements 20 included in a light-emitting device 1.

[0264] In this way, by making the wiring portion 12A used in the formation of the current path selectively substrate 11, for the light-emitting device 1 which is selective in usage mode, a light-emitting module 901 suitable for a specific usage mode can be provided by using the wiring substrate 101 corresponding to its usage mode.

[0265] In the second light-emitting module 901B, one of the two light-emitting devices 1 is bonded to the first bonding area 102A of the wiring substrate 101, and the other light-emitting device 1 is bonded to the second bonding area 102B.

[0266] The plurality of wiring components 121A include a wiring component 121A connected to a first conductive region 12B11 of the first conductive portion 12B1 within a first bonding region 102A and a wiring component 121A connected to a second conductive region 12B12 of the first conductive portion 12B1 within the first bonding region 102A. The former wiring component 121A can be designated as the first wiring component 121A1, and the latter wiring component 121A can be designated as the second wiring component 121A2.

[0267] In the second light-emitting module 901B, the two light-emitting devices 1 are arranged in the same orientation. The first direction in one light-emitting device 1 is the same as the first direction in the other light-emitting device 1.

[0268] In another light-emitting device 1, one or more semiconductor laser elements 20 connected in series in two groups are disposed on a substrate 11. One or more semiconductor laser elements 20 in the first group are electrically connected to two first inner wiring portions 12A11, and one or more semiconductor laser elements 20 in the second group are electrically connected to two second inner wiring portions 12A12.

[0269] Another light-emitting device 1 includes one or more semiconductor laser elements 20, including one or more semiconductor laser elements 20, namely second semiconductor laser elements 20B, which are electrically connected to the two first inner wiring portions 12A11. All one or more semiconductor laser elements 20 in the first group are second semiconductor laser elements 20B. The second semiconductor laser elements 20B are not electrically connected to the second inner wiring portions 12A12.

[0270] In another light-emitting device 1, one or more semiconductor laser elements 20 include one or more semiconductor laser elements 20, namely third semiconductor laser elements 20C, which are electrically connected to the two second inner wiring portions 12A12. All one or more semiconductor laser elements 20 in the second group are third semiconductor laser elements 20C. The third semiconductor laser elements 20C are not electrically connected to the first inner wiring portion 12A11.

[0271] Multiple wiring components 121A include wiring component 121A connected to a first conductive region 12B11 of the first conductive portion 12B1 within the second bonding region 102B and wiring component 121A connected to a second conductive region 12B12 of the first conductive portion 12B1 within the second bonding region 102B. These two wiring components 121A are electrically connected to two first inner wiring portions 12A11 electrically connected to one or more semiconductor laser elements 20 of the first group.

[0272] The wiring board 101 is provided with a first electrode portion 101E1 and a second electrode portion 101E2 for supplying power to one or more semiconductor laser elements 20 in the first group. As a result, a current path for one or more semiconductor laser elements 20 in the first group is formed via another light-emitting device 1 from the first electrode portion 101E1 to the second electrode portion 101E2 or from the second electrode portion 101E2 to the first electrode portion 101E1.

[0273] Another light-emitting device 1 has a third conductive region 12B13 and a fourth conductive region 12B14 in the first conductive part 12B1 that are not electrically connected to each other in the state of the substrate 11. Neither the third conductive region 12B13 nor the fourth conductive region 12B14 is electrically connected to the first conductive region 12B11 or the second conductive region 12B12.

[0274] Multiple wiring components 121A include a wiring component 121A connected within the second bonding region 102B to a third conductive region 12B13 of the first conductive portion 12B1, and a wiring component 121A connected within the second bonding region 102B to a fourth conductive region 12B14 of the first conductive portion 12B1. These two wiring components 121A are electrically connected to two first inner wiring portions 12A11 electrically connected to one or more semiconductor laser elements 20 of the second group.

[0275] A first electrode portion 101E1 and a second electrode portion 101E2 are provided on the wiring board 101 for supplying power to one or more semiconductor laser elements 20 of the second group. As a result, a current path for one or more semiconductor laser elements 20 of the second group is formed via another light-emitting device 1 from the first electrode portion 101E1 to the second electrode portion 101E2 or from the second electrode portion 101E2 to the first electrode portion 101E1.

[0276] The substrate 11 may have a third conductive region 12B23 and a fourth conductive region 12B24 in the second conductive portion 12B2, which are not electrically connected to each other when the substrate 11 is in its original state. Neither the third conductive region 12B23 nor the fourth conductive region 12B24 is electrically connected to the first conductive region 12B21 or the second conductive region 12B22. Therefore, even when the two light-emitting devices 1 are arranged opposite each other as in the second embodiment, the same current path can be formed without the first conductive portion 12B1. It should be noted that the same substrate 11 can be used for both the light-emitting devices 1 installed in the first light-emitting module 901A and the second light-emitting module 901B.

[0277] It should be noted that, for example, the first light-emitting module 901A emits light of one color, while the second light-emitting module 901B emits light of three colors: red, green, and blue.

[0278] The various embodiments of the present invention have been described above, but the module of the present invention is not strictly limited to the light-emitting module of each embodiment. That is, the present invention cannot be realized as long as it is not limited to the shape and structure of the light-emitting module disclosed in each embodiment. The present invention does not necessarily have to have all the constituent elements to be applied. For example, if a part of the constituent elements of the module disclosed in the embodiments is not described in the claims, substitution, omission, shape modification, material change, etc., are allowed for that part of the constituent elements, giving those skilled in the art design freedom, and the invention described in the claims can be specifically applied on this basis.

[0279] The following technical matters are disclosed based on the content described above in this specification.

[0280] (Project 1)

[0281] A first module, comprising:

[0282] A first device includes a first base and a first power-consuming component. The first base has an upper surface, a lower surface, and a first conductive portion and a second conductive portion disposed on the lower surface. The first power-consuming component is disposed on the first base and consumes power supplied via the first base.

[0283] The first wiring board has a first electrode portion and a second electrode portion for supplying power to the first power-consuming component, and has a plurality of wiring components for forming a first current path via the first device from the first electrode portion to the second electrode portion or from the second electrode portion to the first electrode portion.

[0284] The first power-consuming component has a first electrode and a second electrode.

[0285] The first electrode portion is electrically connected to the first power-consuming component on the first electrode side of the first power-consuming component.

[0286] The second electrode portion is electrically connected to the first power-consuming component on the second electrode side of the first power-consuming component.

[0287] The first conductive portion and the second conductive portion of the first device are bonded to the first wiring substrate in the first bonding region of the first wiring substrate.

[0288] The second conductive portion has a first conductive region and a second conductive region that are not electrically connected to each other when in the state of the first substrate.

[0289] The plurality of wiring components of the first wiring substrate include: a first wiring region connected to the first conductive region of the second conductive portion within the first bonding region; and a second wiring region, which, when viewed from above, is opposite to the first wiring region via the second conductive portion.

[0290] The second wiring region of the first wiring substrate is located outside the first bonding region.

[0291] The first wiring area and the second wiring area constitute part of the first current path.

[0292] The wiring component of the first current path forming the second conductive portion between the first conductive region and the second wiring region does not contact the second conductive region of the second conductive portion.

[0293] (Project 2)

[0294] According to the first module of claim 1,

[0295] The plurality of wiring components of the first wiring substrate have a connection area that connects the first wiring area and the second wiring area.

[0296] (Project 3)

[0297] According to the first module of claim 2,

[0298] When viewed from above, the second conductive region of the second conductive part is positioned away from the first conductive region of the second conductive part in a first direction.

[0299] When viewed from above, the connection area is positioned away from the second conductive area of ​​the second conductive part in a direction perpendicular to the first direction.

[0300] (Project 4)

[0301] According to the first module described in Project 2 or 3

[0302] The first wiring board has insulating components.

[0303] When viewed from above, the connection area is covered by the insulating component and is not exposed on the upper surface.

[0304] (Project 5)

[0305] According to any one of items 1 to 4, the first module

[0306] The first substrate has a first outer surface and an outer surface opposite to the first outer surface, namely a second outer surface.

[0307] The first conductive part is disposed on one side of the first outer surface.

[0308] The second conductive part is disposed on one side of the second outer surface.

[0309] In order to supply power to the first power-consuming component, a first external connection wiring area is provided in the first electrode portion for connecting wiring to an external power source.

[0310] In order to supply power to the first power-consuming component, a second external connection wiring area is provided in the second electrode section for connecting wiring to an external power source.

[0311] When viewed from above, when the upper surface of the first wiring substrate is divided into two regions by an imaginary straight line passing through the first device but not through the first outer side and the second outer side of the first substrate, the wiring region for the first external connection and the wiring region for the second external connection are both located in one region.

[0312] (Project 6)

[0313] According to any one of items 1 to 5, the first module

[0314] In the first substrate, the second conductive region of the second conductive part is electrically connected to the first conductive part.

[0315] (Project 7)

[0316] According to the first module described in Project 6

[0317] The first conductive portion has a first conductive region and a second conductive region that are not electrically connected to each other when in the state of the first substrate.

[0318] The first conductive region of the second conductive part is electrically connected to the second conductive region of the first conductive part.

[0319] The second conductive region of the second conductive part is electrically connected to the first conductive region of the first conductive part.

[0320] (Project 8)

[0321] According to the first module described in Project 7

[0322] When viewed from above, the second conductive region of the first conductive part is positioned away from the first conductive region of the first conductive part in a first direction.

[0323] (Project 9)

[0324] According to the first module described in Project 5

[0325] The plurality of wiring components include: a first wiring component, which includes a wiring area for the first external connection; and a second wiring component, which includes a wiring area for the second external connection.

[0326] The second wiring component includes the second wiring area.

[0327] (Project 10)

[0328] According to the first module described in Project 5

[0329] The plurality of wiring components include: a first wiring component, which includes a wiring area for the first external connection; and a second wiring component, which includes a wiring area for the second external connection.

[0330] It also includes a second device having a second base and a second power-consuming component. The second base has an upper surface, a lower surface, and a first conductive portion and a second conductive portion disposed on the lower surface. The second power-consuming component is disposed on the upper surface of the second base and consumes the power supplied via the second base.

[0331] The first conductive portion and the second conductive portion of the second device are bonded to the first wiring substrate in a second bonding region of the first wiring substrate separated from the first bonding region.

[0332] The second wiring area is located within the second junction area.

[0333] The second wiring component does not include the second wiring area.

[0334] (Project 11)

[0335] According to the first module described in Project 10

[0336] The first base body and the second base body are the same base body.

[0337] (Project 12)

[0338] A plurality of modules, including:

[0339] The first module as described in any one of items 1 to 11; and

[0340] The second module,

[0341] This second module has the following features:

[0342] A third device has a third substrate and a third power-consuming component. The third substrate has an upper surface, a lower surface, and a first conductive portion and a second conductive portion disposed on the lower surface. The third power-consuming component is disposed on the upper surface of the third substrate and consumes power supplied via the third substrate.

[0343] The second wiring board is provided with a first electrode portion and a second electrode portion for supplying power to the third power-consuming component, and has a plurality of wiring components for forming a second current path via the third device from the first electrode portion to the second electrode portion or from the second electrode portion to the first electrode portion.

[0344] The first matrix and the third matrix are the same matrix.

[0345] The first conductive portion and the second conductive portion of the third device are bonded to the second wiring substrate in the bonding region of the second wiring substrate.

[0346] The first conductive portion of the third substrate has a first conductive region and a second conductive region that are not electrically connected to each other.

[0347] The second conductive portion of the third substrate has a first conductive region and a second conductive region that are not electrically connected to each other.

[0348] The plurality of wiring components of the second wiring substrate include: a first wiring component connected to the first conductive region of the first conductive portion within the bonding region of the second wiring substrate; and a second wiring component connected to the second conductive region of the first conductive portion within the bonding region of the second wiring substrate.

[0349] The second conductive part of the third device is not required in the formation of the second current path.

[0350] Industrial availability

[0351] The modules described in the embodiments can be used in projectors. That is, a projector can be considered one application of the present invention. It should be noted that the present invention is not limited thereto, and can be used in various applications such as lighting, exposure, automotive headlights, head-mounted displays, and backlights for other displays.

[0352] Explanation of reference numerals in the attached figures

[0353] 1: Light-emitting device

[0354] 1A: First light-emitting device

[0355] 1B: Second light-emitting device

[0356] 10: Packaging

[0357] 11: Matrix

[0358] 11A: First upper surface

[0359] 11B: Lower surface

[0360] 11C: Second upper surface

[0361] 11D: Outer surface

[0362] 11E: Inner surface

[0363] 11F: Staircase

[0364] 11F1: First step

[0365] 11F2: Second Step

[0366] 11G: Upper surface

[0367] 11H: Side view

[0368] 11M: Base

[0369] 11N: Frame

[0370] 12A: Wiring section

[0371] 12A1: Internal wiring section

[0372] 12A11: First inner wiring section

[0373] 12A12: Second inner wiring section

[0374] 12A2: Outer wiring section

[0375] 12A21: First outer wiring section

[0376] 12B1: First conductive part

[0377] 12B11: First conductive region

[0378] 12B12: Second conductive region

[0379] 12B13: Third conductive region

[0380] 12B14: Fourth conductive region

[0381] 12A22: Second outer wiring section

[0382] 12B2: Second conductive part

[0383] 12B21: First conductive region

[0384] 12B22: Second conductive region

[0385] 12B23: Third conductive region

[0386] 12B24: Fourth conductive region

[0387] 13A: Joining pattern

[0388] 14: Cover

[0389] 14A: Top surface

[0390] 14B: Lower surface

[0391] 14C: Side view

[0392] 20: Semiconductor laser components

[0393] 20A: First semiconductor laser element

[0394] 20B: Second semiconductor laser element

[0395] 20C: Third semiconductor laser element

[0396] 21A: Upper surface

[0397] 21B: Lower surface

[0398] 21C: Side view

[0399] 22: Light exit surface

[0400] 30: Mounting the substrate

[0401] 31A: Upper surface

[0402] 31B: Lower surface

[0403] 31C: Side view

[0404] 32A: Substrate

[0405] 32B: Upper metal component

[0406] 32C: Lower metal component

[0407] 33: Wiring layer

[0408] 40: Reflective component

[0409] 41A: Lower surface

[0410] 41B: Light reflecting surface

[0411] 50: Protective components

[0412] 60: Wiring

[0413] 60A: First wiring

[0414] 60B: Second wiring

[0415] 70: Optical components (lens components)

[0416] 71A: Upper surface

[0417] 71B: Lower surface

[0418] 71C: Side View

[0419] 71D: Lens surface (optical working surface)

[0420] 72A: Lens section

[0421] 72B: Non-lens section

[0422] 101: Wiring board

[0423] 101A: Upper surface

[0424] 101B: Lower surface

[0425] 101D: Heat dissipation unit

[0426] 101E: Wiring Section

[0427] 101E1: First electrode section

[0428] 101E2: Second electrode section

[0429] 101F: Insulation section

[0430] 101G: Joint

[0431] 101H: Through hole

[0432] 102: Joint area

[0433] 102A: First joint region

[0434] 102B: Second joint region

[0435] 111: Heat dissipation components

[0436] 111A: First upper surface

[0437] 111B: Second upper surface

[0438] 111E: Lower surface

[0439] 121: Conductive components

[0440] 121A: Wiring components

[0441] 121A1: First wiring component

[0442] 121A2: Second wiring component

[0443] 121B: Joining component

[0444] 122: Wiring Area

[0445] 122A: First wiring area

[0446] 122B: Second wiring area

[0447] 122C: Connection Area

[0448] 122D: Detour Area

[0449] 131: Insulating components

[0450] 201: Connector

[0451] 301: Thermistor

[0452] 901: Light-emitting module

[0453] 901A: First Light-Emitting Module

[0454] 901B: Second light-emitting module.

Claims

1. A first module, comprising: A first device includes a first base and a first power-consuming component. The first base has an upper surface, a lower surface, and a first conductive portion and a second conductive portion disposed on the lower surface. The first power-consuming component is disposed on the first base and consumes power supplied via the first base. The first wiring board has a first electrode portion and a second electrode portion for supplying power to the first power-consuming component, and has a plurality of wiring components for forming a first current path via the first device from the first electrode portion to the second electrode portion or from the second electrode portion to the first electrode portion. The first power-consuming component has a first electrode and a second electrode. The first electrode portion is electrically connected to the first power-consuming component on the first electrode side of the first power-consuming component. The second electrode portion is electrically connected to the first power-consuming component on the second electrode side of the first power-consuming component. The first conductive portion and the second conductive portion of the first device are bonded to the first wiring substrate in the first bonding region of the first wiring substrate. The second conductive portion has a first conductive region and a second conductive region that are not electrically connected to each other when in the state of the first substrate. The plurality of wiring components of the first wiring substrate include: a first wiring region connected to the first conductive region of the second conductive portion within the first bonding region; and a second wiring region, which, when viewed from above, is opposite to the first wiring region via the second conductive portion. The second wiring region of the first wiring substrate is located outside the first bonding region. The first wiring area and the second wiring area constitute part of the first current path. The wiring component of the first current path forming the second conductive portion between the first conductive region and the second wiring region does not contact the second conductive region of the second conductive portion.

2. The first module according to claim 1, The plurality of wiring components of the first wiring substrate have a connection area that connects the first wiring area and the second wiring area.

3. The first module according to claim 2, When viewed from above, the second conductive region of the second conductive part is positioned away from the first conductive region of the second conductive part in a first direction. When viewed from above, the connection area is positioned away from the second conductive area of ​​the second conductive part in a direction perpendicular to the first direction.

4. The first module according to claim 2 or 3, The first wiring board has insulating components. When viewed from above, the connection area is covered by the insulating component and is not exposed on the upper surface.

5. The first module according to any one of claims 1 to 4, The first substrate has a first outer surface and an outer surface opposite to the first outer surface, namely a second outer surface. The first conductive part is disposed on one side of the first outer surface. The second conductive part is disposed on one side of the second outer surface. In order to supply power to the first power-consuming component, a first external connection wiring area is provided in the first electrode portion for connecting wiring to an external power source. In order to supply power to the first power-consuming component, a second external connection wiring area is provided in the second electrode section for connecting wiring to an external power source. When viewed from above, when the upper surface of the first wiring substrate is divided into two regions by an imaginary straight line passing through the first device but not through the first outer side and the second outer side of the first substrate, the wiring region for the first external connection and the wiring region for the second external connection are both located in one region.

6. The first module according to any one of claims 1 to 5, In the first substrate, the second conductive region of the second conductive part is electrically connected to the first conductive part.

7. The first module according to claim 6, The first conductive portion has a first conductive region and a second conductive region that are not electrically connected to each other when in the state of the first substrate. The first conductive region of the second conductive part is electrically connected to the second conductive region of the first conductive part. The second conductive region of the second conductive part is electrically connected to the first conductive region of the first conductive part.

8. The first module according to claim 7, When viewed from above, the second conductive region of the first conductive part is positioned away from the first conductive region of the first conductive part in a first direction.

9. The first module according to claim 5, The plurality of wiring components include: The first wiring component includes the wiring area for the first external connection; The second wiring component includes a wiring area for the second external connection. The second wiring component includes the second wiring area.

10. The first module according to claim 5, The plurality of wiring components include: The first wiring component includes the wiring area for the first external connection; The second wiring component includes a wiring area for the second external connection. It also includes a second device having a second base and a second power-consuming component. The second base has an upper surface, a lower surface, and a first conductive portion and a second conductive portion disposed on the lower surface. The second power-consuming component is disposed on the upper surface of the second base and consumes the power supplied via the second base. The first conductive portion and the second conductive portion of the second device are bonded to the first wiring substrate in a second bonding region of the first wiring substrate separated from the first bonding region. The second wiring area is located within the second junction area. The second wiring component does not include the second wiring area.

11. The first module according to claim 10, The first base body and the second base body are the same base body.

12. A plurality of modules, comprising: The first module according to any one of claims 1 to 11; as well as The second module, This second module has the following features: A third device has a third base and a third power-consuming component. The third base has an upper surface, a lower surface, and a first conductive portion and a second conductive portion disposed on the lower surface. The third power-consuming component is disposed on the upper surface of the third base and consumes power supplied via the third base. as well as The second wiring board is provided with a first electrode portion and a second electrode portion for supplying power to the third power-consuming component, and has a plurality of wiring components for forming a second current path via the third device from the first electrode portion to the second electrode portion or from the second electrode portion to the first electrode portion. The first matrix and the third matrix are the same matrix. The first conductive portion and the second conductive portion of the third device are bonded to the second wiring substrate in the bonding region of the second wiring substrate. The first conductive portion of the third substrate has a first conductive region and a second conductive region that are not electrically connected to each other. The second conductive portion of the third substrate has a first conductive region and a second conductive region that are not electrically connected to each other. The plurality of wiring components of the second wiring substrate include: a first wiring component, which is connected to the first conductive region of the first conductive portion in the bonding region of the second wiring substrate; The second wiring component is connected to the second conductive region of the first conductive portion within the bonding region of the second wiring substrate. The second conductive part of the third device is not required in the formation of the second current path.

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