Circuit board assembly and electronic device

Abstract

The embodiment of the application discloses a circuit board assembly and an electronic device, and relates to the heat dissipation technical field of electronic devices. The circuit board assembly comprises a circuit board, a first heat source and an air flow generating component. The first heat source is arranged on the surface of the circuit board. The internal part of the circuit board is provided with a heat dissipation cavity. The circuit board is provided with an air inlet and an air outlet which are in communication with the heat dissipation cavity. The air inlet is in communication with the air outlet hole of the air flow generating component, or the air outlet is in communication with the air inlet hole of the air flow generating component. Therefore, the air flow can flow from the air inlet to the air outlet through the heat dissipation cavity by the air flow generating component. The electronic device comprises a device shell and the above-mentioned circuit board assembly. The circuit board assembly is arranged in the device shell.

Description

Technical Field

[0001] This application belongs to the field of heat dissipation technology for electronic devices, specifically relating to a circuit board assembly and an electronic device. Background Technology

[0002] In the field of communication technology, as the performance of electronic devices continues to improve, the power consumption of electronic components within these devices continues to increase, and the heat generation problem of electronic devices under high-load operating conditions becomes increasingly prominent.

[0003] In related technologies, heat dissipation for electronic devices mounted on the surface of circuit boards is usually achieved by external heat dissipation structures such as heat sinks. These structures are located on the side edges of the circuit board, allowing the heat generated during the operation of the electronic devices to be dissipated through the circuit board and the heat dissipation structure. However, this approach results in poor heat dissipation and requires a large overall space for the circuit board, electronic devices, and heat dissipation structure, which is not conducive to the miniaturization of electronic devices. Summary of the Invention

[0004] The purpose of this application is to provide a circuit board assembly and electronic device that can solve the problem of poor heat dissipation of circuit board assemblies in related technologies.

[0005] In a first aspect, embodiments of this application provide a circuit board assembly, including a circuit board, a first heat source, and an airflow generating component. The first heat source is disposed on the surface of the circuit board, and a heat dissipation cavity is provided inside the circuit board. The circuit board is provided with an air inlet and an air outlet communicating with the heat dissipation cavity. The air inlet is connected to the air outlet of the airflow generating component, or the air outlet is connected to the air inlet of the airflow generating component, so that the airflow generating component can make the airflow flow from the air inlet through the heat dissipation cavity to the air outlet.

[0006] Secondly, embodiments of this application also provide an electronic device, including a device housing and the aforementioned circuit board assembly, wherein the circuit board assembly is disposed within the device housing.

[0007] In this embodiment, a heat dissipation cavity is formed inside the circuit board. Airflow within the cavity dissipates heat from the first heat source on the circuit board surface, eliminating the need for external heat dissipation structures such as vapor chambers or heat dissipation channels. This simplifies the circuit board assembly structure and facilitates miniaturization of the electronic device. Furthermore, an airflow generating component is added to the circuit board assembly. This component actively generates airflow, which flows sequentially from the air inlet through the heat dissipation cavity to the air outlet. This actively promotes gas flow and achieves active heat dissipation, building upon the internal heat dissipation cavity. This facilitates rapid dissipation of heat from the first heat source through the airflow within the heat dissipation cavity, thus improving the overall heat dissipation effect. Attached Figure Description

[0008] Figure 1 This is a schematic diagram of the circuit board assembly disclosed in the embodiments of this application; Figure 2 This is a schematic diagram of the circuit board structure disclosed in the embodiments of this application; Figure 3 This is a cross-sectional view of a partial structure of a circuit board assembly disclosed in an embodiment of this application; Figure 4 This is a cross-sectional view of a partial structure of a circuit board assembly disclosed in another embodiment of this application. Figure 5 This is a cross-sectional view of a partial structure of a circuit board disclosed in an embodiment of this application; Figure 6 This is a cross-sectional view of a partial structure of a circuit board disclosed in another embodiment of this application; Figure 7 This is a schematic diagram of the heat dissipation cavity opened in the circuit board according to an embodiment of this application; Figure 8 This is a schematic diagram of the heat dissipation cavity opened in the circuit board according to another embodiment of this application; Figure 9 This is a schematic diagram of the structure of a heat sink disclosed in an embodiment of this application; Figure 10 This is a schematic diagram of the circuit board structure disclosed in another embodiment of this application.

[0009] Explanation of reference numerals in the attached figures: 100 - Circuit board, 110 - First circuit sub-board, 120 - Second circuit sub-board, 101 - Slotting 100a - Heat dissipation cavity, 100b - Air inlet, 100c - Air outlet, 100d - Heat conduction hole, 100e - Gap 200 - First heat source, 210 - Solder pad, 300-Airflow generating component 410 - First metal heat conductor, 420 - Second metal heat conductor 500 - Heatsink, 500a - Heat dissipation channel, 510 - Thermal conductive coating 600 - Second heat source 700-Third metal heat conductor, A - First direction. Detailed Implementation

[0010] The technical solutions of the embodiments of this application will be clearly described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application are within the scope of protection of this application.

[0011] The terms "first," "second," etc., used in the specification and claims of this application are used to distinguish similar objects and not to describe a specific order or sequence. It should be understood that such use of data can be interchanged where appropriate so that embodiments of this application can be implemented in orders other than those illustrated or described herein, and the objects distinguished by "first," "second," etc., are generally of the same class and the number of objects is not limited; for example, a first object can be one or more. Furthermore, in the specification and claims, "and / or" indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.

[0012] The circuit board assembly and electronic device provided in this application will be described in detail below with reference to the accompanying drawings, through specific embodiments and application scenarios.

[0013] Please refer to Figures 1 to 8 The circuit board assembly disclosed in this application includes a circuit board 100, a first heat source 200, and an airflow generating component 300. The circuit board 100 can be a printed circuit board, specifically a finished circuit board that has undergone surface mounting, insertion, soldering, cleaning, and testing. The first heat source can be an electronic device on the circuit board 100, such as a sensor, resistor, or capacitor. Of course, the first heat source can also be other structures on the circuit board 100 besides electronic devices, as long as they can generate heat. This application does not limit the specific type of the first heat source. The airflow generating component 300 is used to generate airflow, allowing the gas to flow in the channels formed by the circuit board 100 for heat dissipation.

[0014] refer to Figure 1 As shown, the first heat source 200 is disposed on the surface of the circuit board 100. Optionally, the first heat source 200 can be an electronic device soldered to the circuit board 100, and the pads 210 of the electronic device are connected to the surface of the circuit board 100. Alternatively, the first heat source 200 can be fixed to the circuit board 100 in other ways.

[0015] refer to Figure 6 and Figure 7 As shown, the circuit board 100 has a heat dissipation cavity 100a inside. The heat dissipation cavity 100a can be a square cavity, a circular cavity, or a cavity formed by a strip-shaped channel. The embodiments of this application do not limit the specific structure of the heat dissipation cavity 100a. Reference Figure 1 and Figure 2As shown, the circuit board 100 is provided with an air inlet 100b and an air outlet 100c. Optionally, the air inlet 100b and the air outlet 100c can be located on the wiring side of the circuit board 100 or on the non-wiring side of the circuit board 100; Reference Figures 4 to 7 As shown, the air inlet 100b and the air outlet 100c are respectively connected to the heat dissipation cavity 100a. The air inlet 100b and the air outlet 100c can be square, circular, etc. This embodiment does not limit the specific shape of the air inlet 100b and the air outlet 100c; in short, the air inlet 100b and the air outlet 100c only need to be connected to the heat dissipation cavity 100a.

[0016] Optionally, refer to Figure 7 As shown, the heat dissipation cavity 100a is a cavity formed by a strip-shaped channel, and the openings formed at both ends of the heat dissipation cavity 100a at the side edge of the circuit board 100 are an air inlet 100b and an air outlet 100c, respectively.

[0017] There may be one air outlet 100c or multiple air outlets 100c. The shapes of each air outlet 100c may be the same or different, so that the airflow passing through the heat dissipation cavity 100a can flow out from different air outlets 100c.

[0018] The airflow generating component 300 can be disposed on the circuit board 100. The airflow generating component 300 can be disposed at the air inlet 100b of the circuit board 100, and the air inlet 100b is connected to the air outlet of the airflow generating component 300. Alternatively, the airflow generating component 300 can be disposed at the air outlet 100c of the circuit board 100, and the air outlet 100c is connected to the air inlet of the airflow generating component 300. In short, the airflow generating component 300 enables airflow to flow from the air inlet 100b through the heat dissipation cavity 100a to the air outlet 100c.

[0019] At least a portion of the airflow generating component 300 is movable relative to the circuit board 100 to generate airflow, and the airflow flows from the air inlet 100b through the heat dissipation cavity 100a to the air outlet 100c. Optionally, a portion of the airflow generating component 300 is movable relative to the circuit board 100 to generate airflow; more preferably, the airflow generating component 300 can be a fan, with fan blades rotating relative to the circuit board 100 to generate airflow; or, the entire airflow generating component 300 is movable relative to the circuit board 100 to generate airflow; optionally, the airflow generating component 300 can be a piezoelectric sheet, which generates airflow by deforming and moving relative to the circuit board 100. Of course, the airflow generating component 300 can also be other types of structures; in short, the airflow generating component 300 is capable of actively promoting gas flow.

[0020] In this embodiment of the application, a heat dissipation cavity 100a is formed inside the circuit board 100. The air flow in the heat dissipation cavity 100a is used to dissipate heat from the first heat source 200 on the surface of the circuit board 100. There is no need to set up heat dissipation structures such as heat dissipation plates outside the circuit board 100, and there is no need to use external heat dissipation structures to set up heat dissipation channels and other structures. This helps to simplify the structure of the circuit board assembly and realize the miniaturization of electronic devices.

[0021] Furthermore, the circuit board assembly is equipped with an airflow generating component 300. The airflow generating component 300 actively generates airflow, which flows sequentially from the air inlet 100b through the heat dissipation cavity 100a to the air outlet 100c. Based on the heat dissipation cavity 100a built into the circuit board 100, the airflow is actively promoted to achieve active heat dissipation. This is beneficial for the heat of the first heat source 200 to be quickly dissipated through the airflow in the heat dissipation cavity 100a, thereby improving the heat dissipation effect.

[0022] In the alternative solutions of this application, refer to Figure 3 As shown, the circuit board 100 also includes a first metal heat-conducting element 410, at least a portion of which is embedded within the circuit board 100. The first metal heat-conducting element 410 is connected between the first heat source 200 and the heat dissipation cavity 100a to transfer heat. Optionally, a portion of the first metal heat-conducting element 410 is embedded within the circuit board 100, and another portion of the first metal heat-conducting element 410 is located in the heat dissipation cavity 100a; or, another portion of the first metal heat-conducting element 410 is located between the circuit board 100 and the first heat source 200; or, the entire first metal heat-conducting element 410 is embedded within the circuit board 100. In short, the first metal heat-conducting element 410 is located between the first heat source 200 and the heat dissipation cavity 100a. Optionally, the circuit board 100 may have a heat-conducting hole 100d, in which at least a portion of the first metal heat-conducting component 410 is embedded. Alternatively, a non-hole embedding method may be used, in which at least a portion of the first metal heat-conducting component 410 is pre-placed in the interlayer structure when the prepreg or core board of the circuit board 100 is stacked. Of course, embedding can also be achieved in other ways.

[0023] The first metal heat-conducting component 410 can be a metal heat-conducting block, specifically a copper block or other metal block. The thermal conductivity of the first metal heat-conducting component 410 is greater than that of the circuit board 100, and the first metal heat-conducting component 410 has excellent heat conduction effect.

[0024] In this embodiment, by setting the first metal heat-conducting component 410, the heat generated by the first heat source 200 is introduced into the heat dissipation cavity 100a through the first metal heat-conducting component 410. This is beneficial to improve the heat conduction efficiency between the first heat source 200 and the heat dissipation cavity 100a, and also to shorten the heat conduction path. This avoids the heat generated by the first heat source 200 being introduced into the heat dissipation cavity 100a through other areas on the surface of the circuit board 100, which is beneficial to further improve the heat conduction effect, and thus more beneficial to the airflow flowing through the heat dissipation cavity 100a to quickly dissipate heat from the first heat source 200.

[0025] Of course, in other embodiments, the circuit board 100 may not have the first metal heat-conducting element 410.

[0026] In an optional embodiment, the first heat source 200 includes electronic devices soldered onto the circuit board 100. These electronic devices can be sensors, resistors, capacitors, etc. During operation, the electronic devices generate heat. The circuit board 100 is electrically connected to the electronic devices, enabling the circuit board 100 to supply power to the electronic devices. This application does not limit the specific type of electronic device. One end of the first metal heat-conducting element 410 extends to the surface of the circuit board 100, and this end is connected to a pad 210 for fixing the electronic devices. Optionally, the first end of the first metal heat-conducting element 410 and the pad 210 can be connected by soldering or other thermally conductive connections. Soldering can be achieved using solder paste.

[0027] The pads 210 used to fix electronic components are the exposed copper areas of the circuit board 100, and the pads 210 are used to solder the pins or terminals of electronic components.

[0028] With this configuration, the first metal heat-conducting component 410 is directly connected to the pad 210 of the electronic device. The heat from the electronic device can be directly transferred to the first metal heat-conducting component 410 through the metal pad 210, and then transferred to the heat dissipation cavity 100a through the first metal heat-conducting component 410. This helps to improve the heat conduction efficiency between the electronic device and the first metal heat-conducting component 410, allowing the heat from the electronic device to be quickly transferred to the heat dissipation cavity 100a. This, in turn, helps the airflow to quickly remove the heat from the heat dissipation cavity 100a, further improving the heat dissipation effect.

[0029] Of course, in other embodiments, the first metal heat conductor 410 may not be connected to the pad 210 for fixing the electronic device, and the heat of the electronic device may be transferred to the first metal heat conductor 410 through the gap 100e between the electronic device and the circuit board 100.

[0030] In an optional embodiment, refer to Figure 3As shown, the other end of the first metal heat-conducting element 410 extends into the heat dissipation cavity 100a. That is, the distance between the surface of the circuit board 100 where the electronic device is located and the heat dissipation cavity 100a is equal to the size of the first metal heat-conducting element 410 in the thickness direction of the circuit board 100. Therefore, the heat from the electronic device is transferred to the first metal heat-conducting element 410 through the pad 210, and then directly transferred to the heat dissipation cavity 100a by the first metal heat-conducting element 410.

[0031] In this embodiment, the heat from the electronic device is transferred to the heat dissipation cavity 100a only through the pad 210 and the first metal heat conductor 410, without going through the heat conduction process of the circuit board 100. This helps to further improve the heat conduction efficiency between the electronic device and the heat dissipation cavity 100a, and further enhance the heat dissipation effect.

[0032] Of course, in other embodiments, the other end of the first metal heat conductor 410 may not extend to the heat dissipation cavity 100a. In that case, the heat of the electronic device is transferred to the first metal heat conductor 410 through the solder pad 210 and then passes through the circuit board 100 before entering the heat dissipation cavity 100a.

[0033] In an optional embodiment, the first metal heat-conducting component 410 is integrally connected to the pad 210. Optionally, the first metal heat-conducting component 410 and the pad 210 can be integrally connected by welding or by other means.

[0034] In this embodiment, the first metal heat-conducting component 410 is integrally connected with the pad 210. Therefore, the connection between the first metal heat-conducting component 410 and the pad 210 is fused together, with no gap between them. This avoids air heat transfer between them, which helps to improve the heat conduction effect between the first metal heat-conducting component 410 and the pad 210, and further enhances the heat dissipation effect.

[0035] Of course, in other embodiments, the first metal heat-conducting element 410 and the pad 210 can be connected separately.

[0036] In one alternative embodiment, at least a portion of the orthographic projection of the first heat source 200 onto the circuit board 100 lies outside the range of the orthographic projection of the heat dissipation cavity 100a onto the circuit board 100. The first heat source 200 may be an electronic device soldered onto the circuit board 100. "Orthographic projection" refers to the projection along the thickness direction of the circuit board 100.

[0037] Optionally, a portion of the orthographic projection of the first heat source 200 on the circuit board 100 is located within the range of the orthographic projection of the heat dissipation cavity 100a on the circuit board 100, and another portion of the orthographic projection of the first heat source 200 on the circuit board 100 is located outside the range of the orthographic projection of the heat dissipation cavity 100a on the circuit board 100; or, the entire orthographic projection of the first heat source 200 on the circuit board 100 is located outside the range of the orthographic projection of the heat dissipation cavity 100a on the circuit board 100.

[0038] In another embodiment, reference Figure 3 and Figure 4 As shown, the orthographic projection of the first heat source 200 on the circuit board 100 is located within the range of the orthographic projection of the heat dissipation cavity 100a on the circuit board 100. That is, along the thickness direction of the circuit board 100, the first heat source 200 and the heat dissipation cavity 100a are directly opposite each other, and the orthographic projection of the heat dissipation cavity 100a on the circuit board 100 covers the orthographic projection of the first heat source 200 on the circuit board 100.

[0039] In this embodiment, the heat from the first heat source 200 is directly transferred to the heat dissipation cavity 100a along the thickness direction of the circuit board 100, without being conducted laterally (i.e. in a direction parallel to the circuit board 100). This helps to shorten the heat conduction path, improve the heat conduction efficiency, and thus enhance the heat dissipation effect.

[0040] In one alternative embodiment, the number of first metal heat-conducting elements 410 is one.

[0041] In another embodiment, the circuit board 100 includes a plurality of first metal heat-conducting elements 410, which may be spaced apart. One end of each first metal heat-conducting element 410 is connected to a pad 210 for fixing electronic components, and the other end of each first metal heat-conducting element 410 extends to a heat dissipation cavity 100a. The structures of each first metal heat-conducting element 410 may be the same or different.

[0042] Optionally, a plurality of heat-conducting holes 100d may be provided at intervals on the surface of the circuit board 100. The plurality of heat-conducting holes 100d may be evenly or unevenly distributed. The shape of each heat-conducting hole 100d may be the same or different. Each heat-conducting hole 100d is provided with a first metal heat-conducting element 410.

[0043] With this configuration, the number of first metal heat-conducting elements 410 increases, and different parts or multiple first heat sources 200 transfer heat to the heat dissipation cavity 100a through different first metal heat-conducting elements 410. The increased heat conduction path facilitates the transfer of heat to the heat dissipation cavity 100a through different heat conduction paths, which is beneficial to further improve heat conduction efficiency and heat dissipation effect.

[0044] In a further embodiment, the orthographic projections of the plurality of first metal heat-conducting components 410 on the circuit board 100 are all located within the range of the orthographic projection of the heat dissipation cavity 100a on the circuit board 100. That is, along the thickness direction of the circuit board 100, the orthographic projection of the heat dissipation cavity 100a on the circuit board 100 covers the orthographic projections of the plurality of first metal heat-conducting components 410 on the circuit board 100.

[0045] With this configuration, the heat transferred to each of the first metal heat-conducting components 410 can be directly transferred to the heat dissipation cavity 100a along the thickness direction of the circuit board 100, without being conducted laterally (i.e. in a direction parallel to the circuit board 100). This helps to shorten the heat conduction path, improve the heat conduction efficiency, and thus enhance the heat dissipation effect.

[0046] Of course, in other embodiments, the orthographic projection of a portion of the plurality of first metal heat-conducting elements 410 on the circuit board 100 is within the range of the orthographic projection of the heat dissipation cavity 100a on the circuit board 100.

[0047] In the alternative solutions of this application, refer to Figure 4 As shown, the circuit board 100 may further include a third metal heat-conducting element 700 and a heat-conducting hole 100d, with the third metal heat-conducting element 700 disposed within the heat-conducting hole 100d. Optionally, the third metal heat-conducting element 700 may be embedded within the heat-conducting hole 100d, such that the third metal heat-conducting element 700 is in direct contact with the hole wall surface of the heat-conducting hole 100d; or, the third metal heat-conducting element 700 may be connected to the hole wall surface of the heat-conducting hole 100d by means of welding, bonding, or other methods.

[0048] Specifically, the circuit board also includes a third metal heat-conducting component 700 and a heat-conducting hole 100d extending from the surface of the circuit board 100 to the heat dissipation cavity. The heat-conducting hole 100d communicates with the heat dissipation cavity 100a. The heat-conducting hole 100d is located within the range of the orthographic projection of the first heat source 200 onto the circuit board: one side of the heat-conducting hole 100d connects to the gap between the heat source and the surface of the circuit board, and the other side of the heat-conducting hole 100d communicates with the heat dissipation cavity 100a; and / or, the first heat source 200 is an electronic device soldered onto the circuit board, and the third metal heat-conducting component 700 connects the non-pin area of ​​the electronic device and the heat dissipation cavity.

[0049] The third metal heat-conducting component 700 can also be a metal heat-conducting block, specifically a copper block or other metal block. Its structure can be the same as or different from that of the first metal heat-conducting component 410. In short, the thermal conductivity of the third metal heat-conducting component 700 is greater than that of the circuit board 100, and it has excellent heat conduction effect. The heat-conducting hole 100d can be opened along the thickness direction of the circuit board 100, that is, the axis of the heat-conducting hole 100d is parallel to the thickness direction of the circuit board 100. The heat-conducting hole 100d can be a square hole, a round hole, etc. The specific structure of the heat-conducting hole 100d is not limited in the embodiments of this application.

[0050] The orthographic projection of the heat-conducting hole 100d on the circuit board 100 lies within the range of the orthographic projection of the first heat source 200 on the circuit board 100. That is, along the thickness direction of the circuit board 100, the orthographic projection of the first heat source 200 on the circuit board 100 covers the orthographic projection of the heat-conducting hole 100d on the circuit board 100. Therefore, along the thickness direction of the circuit board 100, the heat from the first heat source 200 can be transferred to the heat dissipation cavity 100a through the third metal heat-conducting element 700 within the heat-conducting hole 100d.

[0051] In this embodiment, a third metal heat-conducting component 700 is added to the circuit board 100. The heat generated by the first heat source 200 is transferred to the heat dissipation cavity 100a through the third metal heat-conducting component 700. The heat conduction effect of the third metal heat-conducting component 700 is better, which helps to improve the heat conduction efficiency between the first heat source 200 and the heat dissipation cavity 100a, further enhances the heat conduction effect, and facilitates rapid heat dissipation.

[0052] Of course, in other embodiments, the circuit board 100 may not have the third metal heat-conducting element 700.

[0053] In an optional embodiment, the heat-conducting hole 100d can be a through hole, which extends from the surface of the circuit board 100 to the heat dissipation cavity 100a. One side of the heat-conducting hole 100d is connected to the gap 100e between the first heat source 200 and the surface of the circuit board 100, and the other side of the heat-conducting hole 100d is connected to the heat dissipation cavity 100a.

[0054] In this way, the heat generated by the first heat source 200 enters the gap 100e between the first heat source 200 and the surface of the circuit board 100, and is transferred to the heat dissipation cavity 100a through the third metal heat conductor 700 in the heat conduction hole 100d, without passing through other areas of the circuit board 100 for heat transfer, which is more conducive to further improving the heat conduction efficiency and further enhancing the heat dissipation effect.

[0055] Of course, in other embodiments, the heat conduction hole 100d can be a blind hole, the heat conduction hole 100d does not extend to the surface of the circuit board 100, or the heat conduction hole 100d is not directly connected to the heat dissipation cavity 100a.

[0056] In an optional embodiment, the first heat source 200 is an electronic device soldered onto the circuit board 100, and the third metal heat conductor 700 is connected between the non-pin area of ​​the electronic device and the heat dissipation cavity 100a. The non-pin area of ​​the electronic device refers to the area other than the pins used for electrical connections.

[0057] Optionally, along the thickness direction of the circuit board 100, one end of the third metal heat conductor 700 is thermally connected to the non-pin area of ​​the electronic device by means of welding or other methods, and the other end of the third metal heat conductor 700 extends to the heat dissipation cavity 100a. Since the non-pin area of ​​the electronic device is the main area that needs heat dissipation, in this embodiment, the heat generated by the electronic device during operation is transferred from the non-pin area to the heat dissipation cavity 100a through the third metal heat conductor 700. This is beneficial for quickly transferring the heat of the electronic device to the heat dissipation cavity 100a through the third metal heat conductor 700, and also helps to improve the heat conduction efficiency and achieve rapid heat dissipation.

[0058] In the alternative solutions of this application, refer to Figure 3 and Figure 4 As shown, the circuit board assembly also includes a second heat source 600. The first heat source 200 is disposed on the first surface of the circuit board 100, and the second heat source 600 is disposed on the second surface of the circuit board 100. The second surface is opposite to the first surface, and the first surface and the second surface are parallel. Both the first heat source 200 and the second heat source 600 can be electronic devices that generate heat during operation. The second heat source 600 may be of the same type as the first heat source 200 or different types.

[0059] The orthographic projection of the first heat source 200 on the first surface falls within the range of the orthographic projection of the heat dissipation cavity 100a on the first surface, and the orthographic projection of the second heat source 600 on the second surface also falls within the range of the orthographic projection of the heat dissipation cavity 100a on the second surface. Therefore, the heat from both the first heat source 200 and the second heat source 600 can be transferred to the heat dissipation cavity 100a along the thickness direction of the circuit board 100, and active heat dissipation is achieved by generating airflow through the airflow generating component 300. In this embodiment, the heat from different heat sources on the first and second surfaces of the circuit board 100 can be transferred to the heat dissipation cavity 100a, so that the airflow flowing through the heat dissipation cavity 100a can quickly dissipate the heat from the first heat source 200 and the second heat source 600, which is beneficial to further improve the heat dissipation effect of the circuit board 100.

[0060] Of course, in other embodiments, the circuit board assembly may not have the second heat source 600, or the orthographic projection of the second heat source 600 on the second surface may be outside the range of the orthographic projection of the heat dissipation cavity 100a on the second surface.

[0061] In an optional embodiment of this application, the circuit board assembly further includes a second heat source 600. The first heat source 200 is disposed on a first surface of the circuit board 100, and the second heat source 600 is disposed on a second surface of the circuit board 100 opposite to the first surface, with the first and second surfaces parallel to each other. Both the first heat source 200 and the second heat source 600 can be electronic devices that generate heat during operation. The second heat source 600 may be of the same or different type as the first heat source 200.

[0062] At least a portion of the first metal heat-conducting element 410 is embedded between the first inner wall and the first surface of the heat dissipation cavity 100a. Specifically, a portion of the first metal heat-conducting element 410 is embedded between the first inner wall and the first surface of the heat dissipation cavity 100a; or, the entire first metal heat-conducting element 410 is embedded between the first inner wall and the first surface of the heat dissipation cavity 100a. The circuit board 100 also includes a second metal heat-conducting element 420, at least a portion of which is embedded between the second surface and the second inner wall of the heat dissipation cavity 100a. The first inner wall and the second inner wall are opposite each other, specifically referring to two inner walls opposite each other along the thickness direction of the circuit board 100. Specifically, a portion or the entire second metal heat-conducting element 420 is embedded between the second surface and the second inner wall of the heat dissipation cavity 100a.

[0063] Optionally, the circuit board 100 may be provided with a first heat-conducting hole and a second heat-conducting hole, which are located on both sides of the heat dissipation cavity 100a respectively. One end of the first heat-conducting hole extends to the first surface of the circuit board 100, and the other end extends to the first inner wall of the heat dissipation cavity 100a. A first metal heat-conducting element 410 is disposed in the first heat-conducting hole. One end of the second heat-conducting hole extends to the second surface of the circuit board 100, and the other end extends to the second inner wall of the heat dissipation cavity 100a. A second metal heat-conducting element 420 is disposed in the second heat-conducting hole.

[0064] The second metal heat-conducting component 420 is connected between the second heat source 600 and the heat dissipation cavity 100a to transfer heat from the second heat source 600. Optionally, the second metal heat-conducting component 420 and the second heat source 600 can be thermally connected by means of soldering or other methods. More preferably, the second heat source 600 can be an electronic device disposed on the second surface of the circuit board 100, and the second metal heat-conducting component 420 is connected to a pad 210 for fixing the electronic device. In this way, the heat from the electronic device can be directly transferred to the second metal heat-conducting component 420 through the pad 210, and then transferred to the heat dissipation cavity 100a, which helps to improve the thermal conductivity between the electronic device and the second metal heat-conducting component 420, and further enhances the heat dissipation effect.

[0065] The second metal heat-conducting component 420 can be a metal heat-conducting block, specifically a copper block or other metal block. The thermal conductivity of the second metal heat-conducting component 420 is greater than that of the circuit board 100, and the second metal heat-conducting component 420 has excellent heat conduction effect.

[0066] In this embodiment, different heat sources located on the first and second surfaces of the circuit board 100 transfer heat to the heat dissipation cavity 100a through different metal heat-conducting components. This is beneficial to improving the heat transfer efficiency of the first heat source 200 and the second heat source 600, and allows the airflow flowing through the heat dissipation cavity 100a to quickly dissipate the heat from the first heat source 200 and the second heat source 600, which is beneficial to further improving the heat dissipation effect.

[0067] Of course, in other embodiments, the circuit board 100 may not be provided with the second metal heat conductor 420, and the heat from the second heat source 600 can be transferred to the heat dissipation cavity 100a through the circuit board 100.

[0068] In an optional embodiment of this application, the circuit board assembly further includes a heat sink 500. The heat sink 500 is used to enhance heat conduction. The heat sink 500 is disposed within the heat dissipation cavity 100a and extends within the heat dissipation cavity 100a; that is, the heat sink 500 has a certain coverage area. Furthermore, referring to… Figure 5 and Figure 6 As shown, the heat sink 500 extends along the extension direction of the heat dissipation cavity 100a, that is, along the direction from the air inlet 100b to the air outlet 100c, to divide the heat dissipation cavity 100a into multiple heat dissipation channels 500a. Each heat dissipation channel 500a extends along the direction from the air inlet 100b to the air outlet 100c. Each heat dissipation channel 500a is connected between the air inlet 100b and the air outlet 100c. In other words, the gas entering through the air inlet 100b flows through the heat dissipation channel 500a and flows out through the air inlet 100b. The heat dissipation channel 500a can guide the airflow to flow along the direction from the air inlet 100b to the air outlet 100c.

[0069] Optionally, the heat sink 500 can be a strip-shaped metal sheet or other structures. In short, the heat sink 500 has a higher thermal conductivity than air. Heat conducted into the heat dissipation cavity 100a is transferred to the heat sink 500 and rapidly conducted within it, distributing to different areas within the heat dissipation cavity 100a. Optionally, the cavity wall of the heat dissipation cavity 100a can be provided with heat pipes, and the heat sink 500 is disposed within the heat pipes, dividing the internal space of the heat pipes into heat dissipation channels 500a.

[0070] In this embodiment, a heat sink 500 is further added inside the heat dissipation cavity 100a. The heat sink 500 has a higher thermal conductivity than gas and stronger thermal conductivity. Moreover, the heat sink 500 has a larger laying area. The heat from the first heat source 200 can be distributed to different areas inside the heat dissipation cavity 100a through the heat sink 500, which is beneficial to increasing the heat conduction area and heat dissipation area and improving the heat dissipation effect.

[0071] Meanwhile, the heat sink 500 extends along the extension direction of the heat dissipation cavity 100a, which can divide the heat dissipation cavity 100a into multiple heat dissipation channels 500a. The heat sink 500 can fully dissipate heat from the airflow in each heat dissipation channel 500a. Moreover, the heat dissipation channel 500a can accurately guide the airflow entering from the air inlet 100b to the air outlet 100c, improve the direction accuracy of the airflow, and facilitate the rapid heat dissipation of the first heat source 200, thereby further improving the heat dissipation effect.

[0072] Of course, in other embodiments, the heat sink 500 may not be provided in the heat dissipation cavity 100a, and the airflow generated by the airflow generating component 300 may flow freely in the heat dissipation cavity 100a.

[0073] In one alternative embodiment, the number of heat sinks 500 is one.

[0074] In another embodiment, reference Figures 3 to 6 As shown, multiple heat sinks 500 are spaced apart along a first direction A. The first direction A intersects the plane containing the heat sinks 500. Optionally, the first direction A is perpendicular to the plane containing the heat sinks 500, or the first direction A intersects the plane containing the heat sinks 500 but is not perpendicular to it. Each heat sink 500 extends along the direction from the air inlet 100b to the air outlet 100c.

[0075] Optionally, the cavity formed by the strip-shaped channel is a heat dissipation cavity 100a, as shown in the reference. Figure 5 As shown, the extension direction of the heat dissipation cavity 100a is constant, that is, the extension direction of the heat sink 500 is constant, and the first direction A is the width direction of the heat dissipation cavity 100a; or, referring to Figure 6 As shown, the strip channel is a bent channel, the heat sink 500 is a bent structure, the extension direction of the heat dissipation cavity 100a and the length direction of the heat sink 500 are changed, and the bent structure of the heat dissipation cavity 100a is adapted to the bent structure of the heat sink 500. Different parts of the heat sink 500 extend in different areas of the heat dissipation cavity 100a.

[0076] In this embodiment, the number of heat sinks 500 is relatively large, and each heat sink 500 has a large coverage area. The use of multiple heat sinks 500 helps to further increase the heat conduction area and improve the heat dissipation effect. Moreover, a heat dissipation channel 500a is formed between any two adjacent heat sinks 500 to guide the gas in the heat dissipation cavity 100a, which is more conducive to the airflow along the direction from the air inlet 100b to the air outlet 100c, thus facilitating rapid heat dissipation.

[0077] In an optional embodiment, the air inlet 100b and / or the air outlet 100c are located on the non-wiring side of the circuit board 100. Specifically, only the air inlet 100b or only the air outlet 100c may be located on the non-wiring side of the circuit board 100; or both the air inlet 100b and the air outlet 100c may be located on the non-wiring side of the circuit board 100.

[0078] In this context, the wiring side of the circuit board 100 typically refers to the side where electronic components are routed, while the non-wiring side refers to the side where electronic components do not require routing. Optionally, the wiring side of the circuit board 100 can be the side where the surface of the circuit board 100 is located, and the non-wiring side of the circuit board 100 is the side where the edge of the circuit board 100 located between the first and second surfaces is located.

[0079] Optionally, the circuit board 100 has a square structure, with an air inlet 100b and an air outlet 100c simultaneously formed on one side of the circuit board 100; or, the air inlet 100b and the air outlet 100c are respectively formed on different sides of the circuit board 100; or, there are multiple air outlets 100c, with at least two air outlets 100c formed on at least two sides of the circuit board 100. With this configuration, the air inlet 100b and / or air outlet 100c are located on the non-wiring side, so the air inlet 100b and / or air outlet 100c will not occupy the wiring area, thus avoiding affecting the wiring and helping to ensure the working performance of the circuit board 100.

[0080] Of course, in other embodiments, the air inlet 100b and the air outlet 100c may be located on the wiring side of the circuit board 100.

[0081] In a further embodiment, reference is made to... Figure 7 and Figure 8As shown, the heat dissipation cavity 100a extends through the circuit board 100, and forms an air inlet 100b and an air outlet 100c on the non-wiring side of the circuit board 100a. The flow area of ​​the air inlet 100b and the air outlet 100c is equal to the flow area of ​​the heat dissipation cavity 100a. Optionally, the heat dissipation cavity 100a is a cavity formed by a straight channel, and the width of the channel is constant along the direction from the air inlet 100b to the air outlet 100c, so that the heat sink 500 can be installed inside the heat dissipation cavity 100a through the air inlet 100b or the air outlet 100c. That is, after the circuit board 100 is manufactured, the heat sink 500 can be installed inside the heat dissipation cavity 100a through the air inlet 100b or the air outlet 100c.

[0082] Optionally, multiple heat sinks 500 can be connected sequentially to form an integrated structure, specifically by welding. This configuration allows the multiple heat sinks 500 to form a single structure, facilitating their integration into the heat dissipation cavity 100a via the air inlet 100b or air outlet 100c.

[0083] In this embodiment, the heat dissipation cavity 100a is used to pass through the circuit board 100 to form the air inlet 100b and the air outlet 100c. This is beneficial for embedding the entire structure formed by multiple heat sinks 500 into the heat dissipation cavity 100a through the air inlet 100b or the air outlet 100c. This facilitates the installation and removal of the heat sinks 500, and eliminates the need to design heat sinks 500 during the manufacturing process of the circuit board 100, which simplifies the process.

[0084] In an optional embodiment, the heat sink 500 is made of metal. Optionally, the heat sink 500 can be a copper sheet or other metal sheets with good thermal conductivity. The embodiments of this application do not limit the specific material of the heat sink 500.

[0085] With this configuration, the metal heat sink 500 can be used for both heat conduction and heat dissipation. In addition, due to the high strength and rigidity of the metal material, the heat sink 500 can support the circuit board 100, which helps to improve the rigidity and strength of the circuit board 100 and avoid the problem that the circuit board 100 is prone to breakage due to the heat dissipation cavity 100a.

[0086] Of course, in other embodiments, the heat sink 500 may employ a non-metallic thermally conductive structure.

[0087] In an optional embodiment, refer to Figure 8 As shown, the surface of the heat sink 500 is provided with a thermally conductive coating 510.

[0088] Optionally, the thermally conductive coating 510 may be a graphite layer or a metal coating such as a copper foil. The thermally conductive coating 510 may be provided only on the surface of part of the plurality of heat dissipation fins 500, or may be provided on the surface of each of the heat dissipation fins 500; alternatively, the thermally conductive coating 510 may be provided only on one surface of the heat dissipation fin 500, or may be provided on two opposite surfaces of the same heat dissipation fin 500.

[0089] With this embodiment, the surface of the heat dissipation fin 500 is further coated with the thermally conductive coating 510, so that the heat of the heat dissipation fin 500 is quickly dissipated to the air in the heat dissipation cavity 100a through the thermally conductive coating 510, and then carried away by the air flow, which is beneficial to further improving the heat conduction efficiency and further enhancing the heat dissipation effect.

[0090] Of course, in other embodiments, the thermally conductive coating 510 may not be provided on the surface of the heat dissipation fin 500.

[0091] In an optional solution of the present application, with reference to Figure 1 as shown, the air flow generating component 300 includes a fan, which is disposed outside the circuit board 100, and the air outlet of the fan is opposite to the air inlet 100b, or the air inlet of the fan is opposite to the air outlet 100c. In short, an air flow is formed under the negative pressure environment generated by the fan, so that the air flow flows from the air inlet 100b to the air outlet 100c. The fan refers to a micro fan matched with the circuit board 100, which is specially used for dissipating heat from the first heat source 200 on the circuit board 100.

[0092] Optionally, the fan and the circuit board 100 may not be in contact with each other and are arranged at intervals, or the housing of the fan may be connected to the non-wiring side of the circuit board 100 by means of bonding, welding or the like, as long as the air flow generated by the fan blades of the fan can flow from the air inlet 100b to the air outlet 100c through the heat dissipation cavity 100a.

[0093] With this embodiment, the fan can continuously deliver a large flow of air by rotating the fan blades, which is suitable for effectively dissipating heat from the first heat source 200 with relatively high power. Moreover, the air flow direction of the fan is stable and the coverage range is relatively large, which is beneficial to simultaneously dissipating heat from a plurality of first heat sources 200 on the circuit board 100.

[0094] In an optional embodiment, the circuit board 100 has a single-layer board structure, and a heat dissipation cavity 100a is disposed inside the single-layer board structure.

[0095] In another embodiment, with reference to Figure 10As shown, the circuit board 100 includes a first circuit sub-board 110 and a second circuit sub-board 120 stacked together, forming a heat dissipation cavity 100a. Optionally, a slot 101 is provided on the surface of the first circuit sub-board 110 facing the second circuit sub-board 120, and the slot 101 and the second circuit sub-board 120 form the heat dissipation cavity 100a; or, a slot 101 is provided on the surface of the second circuit sub-board 120 facing the first circuit sub-board 110, and the slot 101 and the first circuit sub-board 110 form the heat dissipation cavity 100a; or, slots 101 are provided on both the surface of the first circuit sub-board 110 facing the second circuit sub-board 120 and the surface of the second circuit sub-board 120 facing the first circuit sub-board 110, and these two slots 101 form the heat dissipation cavity 100a.

[0096] Of course, in addition to the first circuit sub-board 110 and the second circuit sub-board 120, the circuit board 100 may also include other circuit sub-boards, and the first circuit sub-board 110, the second circuit sub-board 120 and other circuit sub-boards together form a heat dissipation cavity 100a. Optionally, the other circuit sub-boards may be located between the first circuit sub-board 110 and the second circuit sub-board 120, and the other circuit sub-boards may have through slots along their thickness direction, and the through slots together with the first circuit sub-board 110 and the second circuit sub-board 120 form a heat dissipation cavity 100a.

[0097] In this embodiment, at least two stacked circuit sub-boards are used to form a heat dissipation cavity 100a. Only a slot 101 or other structure needs to be opened on the surface of the circuit sub-board. There is no need to open a separate heat dissipation cavity 100a inside the single-layer circuit board 100. This simplifies the process flow of the circuit board 100 and also reduces the process difficulty of opening the heat dissipation cavity 100a.

[0098] Based on the circuit board assembly disclosed in this application, embodiments of this application also disclose an electronic device, which includes the circuit board assembly and device housing as described in the above embodiments, with the circuit board assembly disposed within the device housing.

[0099] Optionally, the electronic device also includes functional modules such as a battery module, and the circuit board assembly is electrically connected to the battery module so that the battery module supplies power to the circuit board 100.

[0100] In this embodiment, the electronic device employs a circuit board assembly with the aforementioned special structure. The heat dissipation cavity 100a built into the circuit board 100, along with the airflow generating component 300, promotes gas flow and simultaneously removes heat from the first heat source 200, achieving rapid heat dissipation. This eliminates the need for a separate heat dissipation structure such as a vapor chamber to construct a heat dissipation channel, simplifying the circuit board assembly structure and enabling miniaturization of the electronic device.

[0101] The embodiments of this application have been described above with reference to the accompanying drawings. However, this application is not limited to the specific embodiments described above. The specific embodiments described above are merely illustrative and not restrictive. Those skilled in the art can make many other forms under the guidance of this application without departing from the spirit and scope of the claims, and all of these forms are within the protection scope of this application.

Claims

1. A circuit board assembly, characterized in that, The device includes a circuit board (100), a first heat source (200), and an airflow generating component (300). The first heat source (200) is disposed on the surface of the circuit board (100). The circuit board (100) has a heat dissipation cavity (100a) inside. The circuit board (100) has an air inlet (100b) and an air outlet (100c) communicating with the heat dissipation cavity (100a). The air inlet (100b) is connected to the air outlet of the airflow generating component (300), or the air outlet (100c) is connected to the air inlet of the airflow generating component (300), so that the airflow can flow from the air inlet (100b) through the heat dissipation cavity (100a) to the air outlet (100c) through the airflow generating component (300).

2. The circuit board assembly according to claim 1, characterized in that, The circuit board (100) further includes a first metal heat-conducting element (410) at least partially embedded in the circuit board (100), the first metal heat-conducting element (410) being connected between the first heat source (200) and the heat dissipation cavity (100a) to transfer heat.

3. The circuit board assembly according to claim 2, characterized in that, The first heat source (200) includes electronic devices soldered on the circuit board (100): one end of the first metal heat conductor (410) is connected to a pad (210) for fixing the electronic device, and the other end of the first metal heat conductor (410) extends to the heat dissipation cavity (100a); or, the first metal heat conductor (410) is integrally connected to the pad (210).

4. The circuit board assembly according to claim 2, characterized in that, The orthographic projection of the first heat source (200) onto the circuit board (100) lies within the range of the orthographic projection of the heat dissipation cavity (100a) onto the circuit board (100); and / or, The circuit board (100) includes a plurality of the first metal heat-conducting elements (410), and the orthographic projections of the plurality of the first metal heat-conducting elements (410) on the circuit board (100) are all located within the range of the orthographic projection of the heat dissipation cavity (100a) on the circuit board (100).

5. The circuit board assembly according to claim 1, characterized in that, The circuit board assembly further includes a second heat source (600), the first heat source (200) is disposed on a first surface of the circuit board (100), and the second heat source (600) is disposed on a second surface of the circuit board (100) opposite to the first surface; the orthographic projection of the first heat source (200) on the first surface is within the range of the orthographic projection of the heat dissipation cavity (100a) on the first surface, and the orthographic projection of the second heat source (600) on the second surface is within the range of the orthographic projection of the heat dissipation cavity (100a) on the second surface.

6. The circuit board assembly according to claim 2, characterized in that, The circuit board assembly further includes a second heat source (600), the first heat source (200) is disposed on a first surface of the circuit board (100), and the second heat source (600) is disposed on a second surface of the circuit board (100) opposite to the first surface; at least a portion of the first metal heat conductor (410) is embedded between the first inner wall of the heat dissipation cavity (100a) and the first surface, and the circuit board (100) further includes a second metal heat conductor (420) at least partially embedded between the second surface and the second inner wall of the heat dissipation cavity (100a), the first inner wall and the second inner wall are opposite to each other, and the second metal heat conductor (420) is connected between the second heat source (600) and the heat dissipation cavity (100a) to transfer the heat of the second heat source (600).

7. The circuit board assembly according to claim 1, characterized in that, The circuit board assembly also includes a heat sink (500) disposed within the heat dissipation cavity (100a). The heat sink (500) extends along the extension direction of the heat dissipation cavity (100a) to divide the heat dissipation cavity (100a) into a plurality of heat dissipation channels (500a), each of the heat dissipation channels (500a) being connected between the air inlet (100b) and the air outlet (100c).

8. The circuit board assembly according to claim 7, characterized in that, The air inlet (100b) and / or the air outlet (100c) are located on the non-wiring side of the circuit board (100); or, The heat sink (500) is made of metal; or, The surface of the heat sink (500) is provided with a thermally conductive coating (510).

9. The circuit board assembly according to claim 1, characterized in that, The circuit board (100) includes a first circuit sub-board (110) and a second circuit sub-board (120) stacked together, the first circuit sub-board (110) and the second circuit sub-board (120) forming the heat dissipation cavity (100a).

10. An electronic device, characterized in that, The device includes the circuit board assembly as described in any one of claims 1-9 and the device housing, wherein the circuit board assembly is disposed within the device housing.

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