Flexible circuit board and electronic device

Abstract

The application discloses a flexible circuit board and an electronic device, wherein the flexible circuit board comprises: a first substrate, the first substrate comprises a first electrode area and first and second extension areas extending outward from both sides of the first electrode area, the first electrode area is provided with a first electrode matrix composed of a plurality of first electrode pieces, and the extension areas are provided with metal interfaces away from one side of the first electrode area; a second substrate, the second substrate comprises a second electrode area and third and fourth extension areas extending outward from both sides of the second electrode area, the second electrode area is provided with a second electrode matrix composed of a plurality of second electrode pieces, and the extension areas are provided with metal interfaces away from one side of the second electrode area; and a medium connecting layer, the first and second substrates are arranged on both sides of the medium connecting layer respectively. The application can accurately simulate human tactile perception.

Description

Technical Field

[0001] This application relates to the field of flexible circuit board technology, and more particularly to a flexible circuit board and an electronic device. Background Technology

[0002] Human touch can perceive external stimuli such as continuous pressure, lateral skin stretching, and skin sliding, thus easily enabling sensory functions such as finger position, stable grasping, tangential force, and direction of movement. However, the extreme complexity of the human body's sensory units significantly hinders biomimetic research on human skin function. Compared to the human hand, existing robotic hands have limitations in flexibility and adaptability, unable to handle objects of various shapes and materials as flexibly as a human hand. This is mainly because the human hand acquires environmental information through touch and other sensory means and can adjust hand movements in real time, while robotic hands have relatively limited perception and feedback capabilities, unable to accurately perceive object characteristics, resulting in imprecise operation. There is a lack of electronic skin that can simulate human tactile perception to endow robotic hands with the tactile sense to perceive the magnitude of force applied to objects. Summary of the Invention

[0003] This application provides a flexible circuit board and an electronic device that can accurately simulate human tactile perception.

[0004] In a first aspect, embodiments of this application provide a flexible circuit board, including: A first substrate includes a first electrode region and a first extension region and a second extension region extending outward from both sides of the first electrode region. The first electrode region is provided with a first electrode matrix composed of a plurality of first electrode sheets. A first metal interface is provided on the side of the first extension region away from the first electrode region. A second metal interface is provided on the side of the second extension region away from the first electrode region. The first electrode sheets are connected to the first metal interface and the second metal interface respectively through metal traces. The second substrate includes a second electrode region and a third extension region and a fourth extension region extending outward from both sides of the second electrode region. The second electrode region is provided with a second electrode matrix composed of a plurality of second electrode sheets. The third extension region is provided with a third metal interface on the side away from the second electrode region, and the fourth extension region is provided with a fourth metal interface on the side away from the second electrode region. The second electrode sheets are connected to the third metal interface and the fourth metal interface respectively through metal traces. A dielectric interconnect layer, wherein the first substrate and the second substrate are respectively disposed on both sides of the dielectric interconnect layer.

[0005] The flexible circuit board according to the first aspect of this application has at least the following advantages: by providing a first electrode matrix on a first substrate and a second electrode matrix on a second substrate, when subjected to external pressure, the first electrode sheet at the pressed portion moves closer to the second electrode sheet, thereby affecting the current signals at the first metal interface, the second metal interface, the third metal interface, and the fourth metal interface, and tactile perception is achieved by analyzing the current signals. Furthermore, by providing a dielectric interconnect layer between the first substrate and the second substrate, mechanical wear caused by direct contact between the first electrode matrix and the second electrode matrix can be avoided.

[0006] According to some embodiments of the first aspect of this application, the first end of the first electrode sheet is connected to the first metal interface and the second metal interface respectively through metal traces, and the second end of the first electrode sheet passes through the first substrate through a metal via and is connected to the first metal interface and the second metal interface on the other side of the first substrate through metal traces.

[0007] According to some embodiments of the first aspect of this application, the first ends of the first electrode sheets located in the same column in the first electrode matrix are connected in parallel to each other, and the second ends of the first electrode sheets located in the same row in the first electrode matrix are connected in parallel to each other.

[0008] According to some embodiments of the first aspect of this application, the first end of the second electrode sheet is connected to the third metal interface and the fourth metal interface respectively through metal traces, and the second end of the second electrode sheet passes through the second substrate through a metal via and is connected to the third metal interface and the fourth metal interface on the other side of the second substrate through metal traces.

[0009] According to some embodiments of the first aspect of this application, the first ends of the second electrode sheets located in the same column of the second electrode matrix are connected in parallel to each other, and the second ends of the second electrode sheets located in the same row of the second electrode matrix are connected in parallel to each other.

[0010] According to some embodiments of the first aspect of this application, the flexible circuit board further includes a first coating layer and a second coating layer, the first coating layer and the second coating layer respectively covering both sides of the first substrate, the first coating layer having a first exposed area, and the first electrode matrix located in the first exposed area to expose the first end of the first electrode sheet.

[0011] According to some embodiments of the first aspect of this application, the flexible circuit board further includes a third coating layer and a fourth coating layer, the third coating layer and the fourth coating layer respectively covering both sides of the second substrate, the third coating layer having a second exposed area, the second electrode matrix being located in the second exposed area to expose the first end of the second electrode sheet, wherein both the first exposed area and the second exposed area face the dielectric interconnect layer.

[0012] According to some embodiments of the first aspect of this application, the flexible circuit board further includes a rigid base and a TPU coating, the rigid base being disposed on the side of the fourth coating layer away from the second substrate, and the TPU coating being disposed on the side of the second coating layer away from the first substrate.

[0013] According to some embodiments of the first aspect of this application, the dielectric bonding layer is a polydimethylsiloxane component.

[0014] Thirdly, embodiments of this application provide an electronic device, including the flexible circuit board provided in the first aspect of the embodiments above.

[0015] Other features and advantages of the invention will be set forth in the description which follows, and will be apparent in part from the description, or may be learned by practicing the invention. The objects and other advantages of the invention may be realized and obtained by means of the structures particularly pointed out in the description, claims, and drawings. Attached Figure Description

[0016] The accompanying drawings are provided to further understand the technical solutions of the present invention and constitute a part of the specification. They are used together with the embodiments of the present invention to explain the technical solutions of the present invention, and do not constitute a limitation on the technical solutions of the present invention.

[0017] Figure 1 This is a schematic diagram of the structure of a flexible circuit board provided in an embodiment of this application; Figure 2 A front view of the first substrate provided in an embodiment of this application; Figure 3 This is a reverse view of the first substrate provided in an embodiment of this application; Figure 4 This is a schematic diagram of the structure of the first electrode sheet provided in an embodiment of this application; Figure 5 This is a schematic diagram of the structure of the first electrode sheet provided in another embodiment of this application; Figure 6 A front view of the second substrate provided in an embodiment of this application; Figure 7 This is a reverse view of the second substrate provided in an embodiment of this application. Detailed Implementation

[0018] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.

[0019] It is understandable that although functional modules are divided in the device schematic diagram and a logical order is shown in the flowchart, in some cases, the steps shown or described may be performed in a different order than the module division in the device or the order in the flowchart. The terms "first," "second," etc., in the specification, claims, or the aforementioned drawings are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence.

[0020] Human touch can perceive external stimuli such as continuous pressure, lateral skin stretching, and skin sliding, thus easily enabling sensory functions such as finger position, stable grasping, tangential force, and direction of movement. However, the extreme complexity of the human body's sensory units significantly hinders biomimetic research on human skin function. Compared to the human hand, existing robotic hands have limitations in flexibility and adaptability, unable to handle objects of various shapes and materials as flexibly as a human hand. This is mainly because the human hand acquires environmental information through touch and other sensory means and can adjust hand movements in real time, while robotic hands have relatively limited perception and feedback capabilities, unable to accurately perceive object characteristics, resulting in imprecise operation. There is a lack of electronic skin that can simulate human tactile perception to endow robotic hands with the tactile sense to perceive the magnitude of force applied to objects.

[0021] Based on this, embodiments of this application provide a flexible circuit board and an electronic device. By setting a first electrode matrix on a first substrate and a second electrode matrix on a second substrate, under external pressure, the first electrode sheet at the pressed portion moves closer to the second electrode sheet, thereby affecting the current signals at the first, second, third, and fourth metal interfaces. Tactile perception is achieved by analyzing the current signals. Furthermore, by setting a dielectric interconnect layer between the first and second substrates, mechanical wear caused by direct contact between the first and second electrode matrices can be avoided.

[0022] Firstly, referring to Figure 1 , Figure 2 as well as Figure 6 , Figure 1 This is a schematic diagram of a flexible circuit board provided in an embodiment of this application. Figure 2 A front view of the first substrate provided in an embodiment of this application. Figure 6 This is a front view of the second substrate provided in an embodiment of this application.

[0023] It is understood that the flexible circuit board includes a first substrate 100, a second substrate 200, a dielectric interconnect layer 300, a first coating layer 400, a second coating layer 500, a third coating layer 600, a fourth coating layer 700, a rigid base 800, and a TPU coating 900. The rigid base 800 is located at the bottom, and the fourth coating layer 700 is above the rigid base 800. The second substrate 200 is disposed above the fourth coating layer 700. The third coating layer 600 is disposed between the second substrate 200 and the dielectric interconnect layer 300. The first substrate 100 and the second substrate 200 are respectively disposed on both sides of the dielectric interconnect layer 300. The first coating layer 400 is disposed between the first substrate 100 and the dielectric interconnect layer 300. The first coating layer 400, the second coating layer 500, the third coating layer 600, and the fourth coating layer 700 can be polyimide (PI) coating films. The first substrate 100 includes a first electrode region 130 and a first extension region 110 and a second extension region 140 extending outward from both sides of the first electrode region 130. The first electrode region 130 is provided with a first electrode matrix 120 composed of a plurality of first electrode pieces 121. A first metal interface 111 is provided on the side of the first extension region 110 away from the first electrode region 130, and a second metal interface 112 is provided on the side of the second extension region 140 away from the first electrode region 130. The first electrode pieces 121 are connected to the first metal interface 111 and the second metal interface 112 via metal traces. The second substrate 200 includes a second electrode region 230 and a third extension region 210 and a fourth extension region 240 extending outward from both sides of the second electrode region 230. The second electrode region 230 is provided with a second electrode matrix 220 composed of multiple second electrode sheets. A third metal interface 211 is provided on the side of the third extension region 210 away from the second electrode region 230, and a fourth metal interface 212 is provided on the side of the fourth extension region 240 away from the second electrode region 230. The second electrode sheets are connected to the third metal interface 211 and the fourth metal interface 212 through metal traces. When the TPU coating 900 comes into contact with an object, since both the TPU coating 900 and the second coating layer 500 are flexible components, when the first substrate 100 is squeezed by external pressure, the first electrode sheet 121 at the pressed part moves closer to the second electrode sheet, thereby affecting the current signals at the first metal interface 111, the second metal interface 112, the third metal interface 211, and the fourth metal interface 212. The tactile sensation is realized by analyzing the current signals. By providing a dielectric interconnect layer 300 between the first substrate 100 and the second substrate 200, mechanical wear caused by direct contact between the first electrode matrix 120 and the second electrode matrix 220 can be avoided.

[0024] It should be noted that the first coating layer 400 and the second coating layer 500 respectively cover both sides of the first substrate 100. The first coating layer 400 has a first exposed area, and the first electrode matrix 120 is located in the first exposed area to expose the first electrode sheet 121 so that when the first substrate 100 is subjected to external pressure, the first electrode sheet 121 can directly contact the dielectric connection layer 300.

[0025] It should be noted that the third coating layer 600 and the fourth coating layer 700 cover both sides of the second substrate 200 respectively. The third coating layer 600 has a second exposed area, and the second electrode matrix 220 is located in the second exposed area to expose the second electrode sheet. The first exposed area and the second exposed area both face the dielectric interconnect layer 300 so that when the first substrate 100 is subjected to external pressure, the first electrode sheet 121 and the second electrode sheet can directly contact the dielectric interconnect layer 300.

[0026] Specifically, the dielectric bonding layer 300 is a polydimethylsiloxane component, or it can be an ion gel fiber layer.

[0027] Reference Figure 3 , Figure 4 and Figure 5 , Figure 3 This is a reverse view of the first substrate provided in an embodiment of this application. Figure 4 This is a schematic diagram of the structure of the first electrode sheet provided in an embodiment of this application. Figure 5 This is a schematic diagram of the structure of the first electrode sheet provided in another embodiment of this application.

[0028] It is understood that a first electrode matrix 120 composed of multiple first electrode pieces 121 is provided on the first electrode region 130, a first metal interface 111 is provided on the side of the first extension region 110 away from the first electrode region 130, and a second metal interface 112 is provided on the side of the second extension region 140 away from the first electrode region 130. The first metal interface 111 is composed of a metal piece provided on the first side of the first extension region 110 and a metal piece provided on the second side of the first extension region 110, and the second metal interface 112 is composed of a metal piece provided on the first side of the second extension region 140 and a metal piece provided on the second side of the second extension region 140. The first electrode sheet 121 can be a spiral electrode sheet. The first end 122 of the first electrode sheet 121 penetrates the first substrate 100 through a metal via. The first end 122 of the first electrode sheet 121 is connected to the metal sheet on the second side of the first extension region 110 and the metal sheet on the second side of the second extension region 140 through metal traces. The last end 123 of the first electrode sheet 121 is connected to the metal sheet on the first side of the first extension region 110 and the metal sheet on the first side of the second extension region 140 through metal traces. The last end 123 of the first electrode sheet 121 faces the dielectric interconnect layer 300. In the first electrode matrix 120, the last ends 123 of the first electrode sheets 121 located in the same column are connected in parallel, and the first ends 123 of the first electrode sheets 121 located in the same row are connected in parallel.

[0029] Specifically, in some embodiments, the side of the first electrode matrix 120 away from the dielectric interconnect layer 300 can be divided into a first upper electrode matrix and a first lower electrode matrix. The metal traces corresponding to the first upper electrode matrix are connected to the metal sheet on the second side of the first extension region 110, and the metal traces corresponding to the first lower electrode matrix are connected to the metal sheet on the second side of the second extension region 140. The side of the first electrode matrix 120 near the dielectric interconnect layer 300 can be divided into multiple staggered first column matrices and second column matrices. The ends 123 of all the first electrode sheets 121 in the first column matrix are connected in parallel, and the ends 123 of all the first electrode sheets 121 in the second column matrix are connected in parallel. The first column matrix is ​​connected to the metal sheet on the first side of the first extension region 110, and the second column matrix is ​​connected to the metal sheet on the first side of the second extension region 140. Dividing the metal traces of the first electrode matrix 120 can improve the processing efficiency of the first substrate 100.

[0030] It is understandable that the first electrode plate 121 can be as follows: Figure 4 The square spiral metal sheet shown, the first electrode sheet 121 can also be as follows: Figure 5 The circular spiral metal sheet shown.

[0031] Reference Figure 7 , Figure 7This is a reverse view of the second substrate provided in an embodiment of this application.

[0032] It is understood that a second electrode matrix 220 composed of multiple second electrode sheets is provided on the second electrode region 230, a third metal interface 211 is provided on the side of the third extension region 210 away from the second electrode region 230, and a fourth metal interface 212 is provided on the side of the fourth extension region 240 away from the second electrode region 230. The third metal interface 211 is composed of a metal sheet provided on the first side of the third extension region 210 and a metal sheet provided on the second side of the third extension region 210, and the fourth metal interface 212 is composed of a metal sheet provided on the first side of the fourth extension region 240 and a metal sheet provided on the second side of the fourth extension region 240. The second electrode sheet can be a spiral electrode sheet. The first end of the second electrode sheet penetrates the second substrate 200 through a metal via. The first end of the second electrode sheet is connected to the metal sheets on the second side of the third extension region 210 and the second side of the fourth extension region 240 through metal traces. The last end of the second electrode sheet is connected to the metal sheets on the first side of the third extension region 210 and the first side of the fourth extension region 240 through metal traces. The last end of the second electrode sheet faces the dielectric interconnect layer 300. The ends of the second electrode sheets located in the same column of the second electrode matrix 220 are connected in parallel, and the first ends of the second electrode sheets located in the same row of the second electrode matrix 220 are connected in parallel.

[0033] It should be noted that, in order to ensure the stability of electrical signal recognition, the first electrode 121 and the second electrode are the same type of electrode.

[0034] Specifically, in some embodiments, the side of the second electrode matrix 220 away from the dielectric interconnect layer 300 can be divided into a second upper electrode matrix and a second lower electrode matrix. The metal traces corresponding to the second upper electrode matrix are connected to the metal sheet on the second side of the third extension region 210, and the metal traces corresponding to the second lower electrode matrix are connected to the metal sheet on the second side of the fourth extension region 240. The side of the second electrode matrix 220 near the dielectric interconnect layer 300 can be divided into multiple staggered third and fourth column matrices. The ends of all second electrode sheets in the third column matrix are connected in parallel, and the ends of all second electrode sheets in the fourth column matrix are connected in parallel. The third column matrix is ​​connected to the metal sheet on the first side of the third extension region 210, and the fourth column matrix is ​​connected to the metal sheet on the first side of the fourth extension region 240. Dividing the metal traces of the second electrode matrix 220 can improve the processing efficiency of the second substrate 200.

[0035] Secondly, embodiments of this application provide an electronic device including the flexible circuit board provided in the first aspect embodiment above. By providing a first electrode matrix 120 on a first substrate 100 and a second electrode matrix 220 on a second substrate 200, under external pressure, the first electrode sheet 121 at the pressed portion moves closer to the second electrode sheet, thereby affecting the current signals at the first metal interface 111, the second metal interface 211, the third metal interface, and the fourth metal interface. By analyzing the current signals, tactile perception is achieved. Furthermore, by providing a dielectric interconnect layer 300 between the first substrate 100 and the second substrate 200, mechanical wear caused by direct contact between the first electrode matrix 120 and the second electrode matrix 220 can be avoided.

[0036] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0037] The above is a detailed description of the preferred embodiments of this application. However, this application is not limited to the above embodiments. Those skilled in the art can make various equivalent modifications or substitutions without departing from the spirit of this application. All such equivalent modifications or substitutions are included within the scope defined by the claims of this application.

Claims

1. A flexible circuit board, characterized in that, include: A first substrate includes a first electrode region and a first extension region and a second extension region extending outward from both sides of the first electrode region. The first electrode region is provided with a first electrode matrix composed of a plurality of first electrode sheets. A first metal interface is provided on the side of the first extension region away from the first electrode region. A second metal interface is provided on the side of the second extension region away from the first electrode region. The first electrode sheets are connected to the first metal interface and the second metal interface respectively through metal traces. The second substrate includes a second electrode region and a third extension region and a fourth extension region extending outward from both sides of the second electrode region. The second electrode region is provided with a second electrode matrix composed of a plurality of second electrode sheets. The third extension region is provided with a third metal interface on the side away from the second electrode region, and the fourth extension region is provided with a fourth metal interface on the side away from the second electrode region. The second electrode sheets are connected to the third metal interface and the fourth metal interface respectively through metal traces. A dielectric interconnect layer, wherein the first substrate and the second substrate are respectively disposed on both sides of the dielectric interconnect layer.

2. The flexible circuit board according to claim 1, characterized in that, The first end of the first electrode is connected to the first metal interface and the second metal interface respectively through metal traces. The second end of the first electrode penetrates the first substrate through a metal via and is connected to the first metal interface and the second metal interface on the other side of the first substrate through metal traces.

3. The flexible circuit board according to claim 2, characterized in that, The first ends of the first electrode pieces located in the same column of the first electrode matrix are connected in parallel to each other, and the second ends of the first electrode pieces located in the same row of the first electrode matrix are connected in parallel to each other.

4. The flexible circuit board according to claim 1, characterized in that, The first end of the second electrode is connected to the third metal interface and the fourth metal interface respectively through metal traces. The second end of the second electrode penetrates the second substrate through a metal via and is connected to the third metal interface and the fourth metal interface on the other side of the second substrate through metal traces.

5. The flexible circuit board according to claim 4, characterized in that, The first ends of the second electrode pieces located in the same column of the second electrode matrix are connected in parallel to each other, and the second ends of the second electrode pieces located in the same row of the second electrode matrix are connected in parallel to each other.

6. The flexible circuit board according to claim 1, characterized in that, The flexible circuit board further includes a first coating layer and a second coating layer, which cover both sides of the first substrate respectively. The first coating layer has a first exposed area, and the first electrode matrix is ​​located in the first exposed area to expose the first end of the first electrode sheet.

7. The flexible circuit board according to claim 6, characterized in that, The flexible circuit board further includes a third coating layer and a fourth coating layer, which respectively cover both sides of the second substrate. The third coating layer has a second exposed area, and the second electrode matrix is ​​located in the second exposed area to expose the first end of the second electrode sheet. Both the first exposed area and the second exposed area face the dielectric interconnect layer.

8. The flexible circuit board according to claim 7, characterized in that, The flexible circuit board further includes a rigid base and a TPU coating. The rigid base is disposed on the side of the fourth coating layer away from the second substrate, and the TPU coating is disposed on the side of the second coating layer away from the first substrate.

9. The flexible circuit board according to claim 1, characterized in that, The dielectric bonding layer is made of polydimethylsiloxane.

10. An electronic device, characterized in that, The electronic device is provided with a flexible circuit board as described in any one of claims 1 to 9.

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