Electronic device and method of manufacturing

Abstract

The present application provides an electronic device and a preparation method. The electronic device comprises an electronic interconnection substrate, a connector assembly and a reinforcing support part. The electronic interconnection substrate comprises a first surface and a second surface opposite to each other in the thickness direction. The connector assembly comprises at least one connector which is crimped on the first surface of the electronic interconnection substrate. The reinforcing support part is connected with the electronic interconnection substrate and is attached to the second surface of the electronic interconnection substrate. The reinforcing support part and the connector assembly are oppositely arranged in the thickness direction of the electronic interconnection substrate. The reinforcing support part of the electronic device supports the electronic interconnection substrate, thereby sharing the pressure received by the electronic interconnection substrate, reinforcing the structural strength of the electronic interconnection substrate, reducing the risk of deformation of the electronic interconnection substrate and increasing the product quality of the electronic device.

Description

Technical Field

[0001] This invention relates to the field of packaging technology, and more specifically to an electronic device and its manufacturing method. Background Technology

[0002] The connection between connectors and electronic interconnect substrates is mostly crimped. When connectors are crimped onto electronic interconnect substrates, the force exerted on the substrate is significant. In related technologies, the connection between connectors and electronic interconnect substrates is usually soldered or directly fixed with screws, which can easily lead to deformation of the electronic interconnect substrate. For example, after CPC connectors (co-packaged copper interconnect connectors) and NPC connectors (non-grinding fiber optic connectors) are crimped onto PCB boards (printed circuit boards) and directly fixed with screws, the PCB board will deform, thus affecting product quality. Summary of the Invention

[0003] The present invention aims to at least partially solve one of the technical problems in related technologies. To this end, embodiments of the present invention provide an electronic device and a method for its fabrication.

[0004] The electronic device of this invention includes:

[0005] An electronic interconnect substrate, the electronic interconnect substrate including a first surface and a second surface opposite to each other in the thickness direction; A connector assembly, the connector assembly including at least one connector, the connector being pressed against the first surface of the electronic interconnect substrate; A reinforcing support portion is connected to the electronic interconnect substrate and is attached to the second surface of the electronic interconnect substrate. The reinforcing support portion and the connector assembly are disposed opposite to each other in the thickness direction of the electronic interconnect substrate.

[0006] The reinforcing support portion of the electronic device in this embodiment of the invention supports the electronic interconnect substrate, thereby distributing the pressure on the electronic interconnect substrate, reinforcing the structural strength of the electronic interconnect substrate, reducing the risk of deformation of the electronic interconnect substrate, and increasing the product quality of the electronic device.

[0007] In some embodiments, a chip is provided on the first surface of the electronic interconnect substrate, and the connector assembly is located around the chip.

[0008] In some embodiments, there are multiple connector assemblies, and the multiple connector assemblies are arranged at circumferential intervals along the chip; The reinforcing support portion is one or more, and the reinforcing support portion is a plate body that is aligned with the thickness direction of the electronic interconnect substrate; In a cross-section perpendicular to the thickness direction of the electronic interconnect substrate, the projection of the connector assembly is located inside the outer periphery of the projection of the reinforcing support.

[0009] In some embodiments, the plurality of connector assemblies include a first connector assembly, a second connector assembly, a third connector assembly, and a fourth connector assembly, wherein the length direction of each of the first connector assembly, the second connector assembly, the third connector assembly, and the fourth connector assembly is consistent with the length direction of the side of the chip adjacent to it; The first connector assembly, the second connector assembly, the third connector assembly, and the fourth connector assembly are arranged around the periphery of the chip. The first connector assembly and the third connector assembly are arranged opposite each other in a first direction. The length directions of the first connector assembly and the third connector assembly are both in a second direction. The second connector assembly and the fourth connector assembly are arranged opposite each other in the second direction. The length directions of the second connector assembly and the fourth connector assembly are both in the first direction. Any two of the first direction, the second direction, and the thickness direction of the electronic interconnect substrate are perpendicular to each other.

[0010] In some embodiments, the reinforcing support is a single component, which is arranged around the outer periphery of the chip.

[0011] In some embodiments, there are multiple reinforcing support portions, and each reinforcing support portion is disposed opposite to at least one connector assembly in the thickness direction of the electronic interconnect substrate; At least one of the reinforcing support portions extends in a direction consistent with the length direction of the corresponding connector assembly; and / or, at least one of the reinforcing support portions includes a first plate and a second plate, the extending directions of the first plate and the second plate forming an angle.

[0012] In some embodiments, each connector assembly includes pins and bolts, wherein the pins extend in the same direction as the thickness direction of the electronic interconnect substrate; The peripheral side of the pin includes a first side, a second side, a third side, and a fourth side connected in sequence. The first side and the third side are arranged facing away from each other in a third direction, and the second side and the fourth side are arranged facing away from each other in a fourth direction. The thickness direction of the electronic interconnect substrate, the third direction, and the fourth direction are perpendicular to each other. The distance between the first side and the third side in the third direction is a first preset value, and the distance between the second side and the fourth side in the fourth direction is a second preset value. The first preset value is greater than the second preset value, and at least one of the first side and the third side has an external thread. The electronic interconnect substrate has a first pin hole extending through its thickness direction, the first pin hole being an elongated hole to adapt to the shape of the cross-section of the pin pin; The reinforcing support portion has a second pin hole that penetrates through it along the thickness direction of the electronic interconnect substrate. The pin leads pass through the first pin hole and the second pin hole and are threaded into the bolt.

[0013] In some embodiments, each connector assembly includes a connector housing and a plurality of connectors, the connector housing including a plurality of mounting slots, and the plurality of connectors of each connector assembly being disposed one-to-one in the plurality of mounting slots of the corresponding connector housing; The connector housing has multiple pins and is located on the side of the connector housing facing the first surface of the electronic interconnect substrate. Each of the first pin hole and the second pin hole has multiple pins and corresponds one-to-one with the multiple connector pins.

[0014] In some embodiments, both the first side and the third side have external threads; and / or The pins are integrally formed with the connector housing; and / or The plurality of pins on each connector housing are arranged in a matrix; and / or The connector housing is provided with a mounting plate that covers the mounting slot; and / or A washer fitted onto the pin pin is provided between the reinforcing support and the bolt; and / or The total load-bearing capacity of the plurality of pins of each connector assembly is greater than or equal to the pressure exerted by the plurality of connectors of each connector assembly on the electronic interconnect substrate.

[0015] The present invention also proposes a method for manufacturing the above-described electronic device, comprising the following steps: Prepare the connector housing having the said pin pins; A first pin hole adapted to the pin is formed on the electronic interconnect substrate; The reinforcing support portion is attached to the second surface of the electronic interconnect substrate; The pins of the connector assembly are passed through the first pin holes of the electronic interconnect substrate and the second pin holes of the reinforcing support and are threaded onto the bolt. Attached Figure Description

[0016] Figure 1 This is a perspective view of an electronic device according to an embodiment of the present invention.

[0017] Figure 2 This is an exploded view of an electronic device according to an embodiment of the present invention.

[0018] Figure 3 This is a schematic diagram of the reinforcing support portion according to an embodiment of the present invention.

[0019] Figure 4 This is a schematic diagram of the pins according to an embodiment of the present invention.

[0020] Figure 5 This is a first side view of the pins according to an embodiment of the present invention.

[0021] Figure 6 This is a second side view of the pins according to an embodiment of the present invention.

[0022] Figure label: 1. Electronic interconnect substrate; 11. First surface; 12. Second surface; 13. First pin hole; 2. Connector assembly; 21. Connector; 22. Connector housing; 23. Pin pin; 231. First side; 232. Second side; 233. Third side; 234. Fourth side; 25. Bolt; 26. Washer; 27. Mounting plate; 201. First connector assembly; 202. Second connector assembly; 203. Third connector assembly; 204. Fourth connector assembly; 3. Reinforcing support section; 31. Second pin hole; 4. Chip. Detailed Implementation

[0023] Embodiments of the present invention are described in detail below, examples of which are illustrated in the accompanying drawings. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the present invention, and should not be construed as limiting the present invention.

[0024] The electronic device according to embodiments of the present invention will now be described with reference to the accompanying drawings. Figures 1 to 6 As shown, the electronic device according to an embodiment of the present invention includes an electronic interconnect substrate 1, a connector assembly 2, and a reinforcing support portion 3.

[0025] The electronic interconnect substrate 1 includes a first surface 11 and a second surface 12 that are opposite to each other in the thickness direction. Specifically, a chip 4 is disposed on the first surface 11 of the electronic interconnect substrate 1, and a connector assembly 2 is located around the chip 4. The electronic interconnect substrate 1 can be a circuit board, a chip substrate, or an adapter board. For example, the thickness direction of the electronic interconnect substrate 1 is vertical, the first surface 11 is the upper surface of the electronic interconnect substrate 1, and the second surface 12 is the lower surface of the electronic interconnect substrate 1. Another example is that the electronic interconnect substrate 1 is a PCB (printed circuit board).

[0026] like Figure 1 As shown, the connector assembly 2 includes at least one connector 21, which is pressed onto the first surface 11 of the electronic interconnect substrate 1. Specifically, there are multiple connector assemblies 2, which are spaced apart circumferentially along the chip 4. The length direction of the connector assembly 2 is consistent with the length direction of the side of the adjacent chip 4. This allows the multiple connector assemblies 2 to be reasonably distributed on the electronic interconnect substrate 1, resulting in a uniform distribution.

[0027] For example, there are four connector assemblies 2 located on the four sides of the chip 4. Also, for example, each connector assembly 2 includes a plurality of connectors 21 spaced apart along its length. Yet another example is that the connectors are CPC connectors (co-packaged copper interconnect connectors) or NPC connectors (polished fiber optic connectors).

[0028] like Figure 1 As shown, in some embodiments, the plurality of connector assemblies 2 include a first connector assembly 201, a second connector assembly 202, a third connector assembly 203, and a fourth connector assembly 204. The length direction of each of the first connector assembly 201, the second connector assembly 202, the third connector assembly 203, and the fourth connector assembly 204 is consistent with the length direction of the side of the chip 4 adjacent to it. The first connector assembly 201, the second connector assembly 202, the third connector assembly 203, and the fourth connector assembly 204 are arranged around the periphery of the chip 4.

[0029] The first connector assembly 201 and the third connector assembly 203 are disposed opposite each other in a first direction, and the length direction of the first connector assembly 201 and the third connector assembly 203 is the second direction. The second connector assembly 202 and the fourth connector assembly 204 are disposed opposite each other in a second direction, and the length direction of the second connector assembly 202 and the fourth connector assembly 204 is the first direction. Any two of the first direction, the second direction and the thickness direction of the electronic interconnect substrate 1 are perpendicular to each other.

[0030] For example, the first connector assembly 201 is adjacent to the first side of the chip 4, the second connector assembly 202 is adjacent to the second side of the chip 4, the third connector assembly 203 is adjacent to the third side of the chip 4, and the fourth connector assembly 204 is adjacent to the fourth side of the chip 4. The first and third sides of the chip 4 are arranged opposite each other in a first direction, and the length direction of the first and third sides of the chip 4 is both in a second direction. The second and fourth sides of the chip 4 are arranged opposite each other in a second direction, and the length direction of the second and fourth sides of the chip 4 is both in the first direction.

[0031] like Figures 1 to 3 As shown, the reinforcing support 3 is connected to the electronic interconnect substrate 1 and is attached to the second surface 12 of the electronic interconnect substrate 1. The reinforcing support 3 and the connector assembly 2 are disposed opposite to each other in the thickness direction of the electronic interconnect substrate 1. The connector assembly 2 applies pressure to the electronic interconnect substrate 1 from one side of the first surface 11. The reinforcing support 3 is located on one side of the second surface 12 of the electronic interconnect substrate 1 to support the electronic interconnect substrate 1, thereby distributing the pressure on the electronic interconnect substrate 1, reinforcing the structural strength of the electronic interconnect substrate 1, reducing the risk of deformation of the electronic interconnect substrate 1, and improving the product quality of the electronic interconnect substrate 1.

[0032] like Figures 1 to 3 As shown, the reinforcing support 3 is a plate and aligns with the thickness direction of the electronic interconnect substrate 1 to reduce the space occupied by the reinforcing support 3. For example, the reinforcing support 3 is a metal plate. Alternatively, the thickness direction of the reinforcing support 3 may be vertical, and it may be located on the lower surface of the electronic interconnect substrate 1.

[0033] In some embodiments, in a cross-section perpendicular to the thickness direction of the electronic interconnect substrate 1, the projection of the connector assembly 2 is located inside the outer peripheral contour of the projection of the reinforcing support portion 3. That is, in a cross-section perpendicular to the thickness direction of the electronic interconnect substrate 1, the projection of the outer peripheral contour of the reinforcing support portion 3 is located outside the connector assembly 2, thereby enabling the reinforcing support portion 3 to support the pressure applied by the connector assembly 2 to the electronic interconnect substrate 1.

[0034] In some embodiments, there are one or more reinforcing support parts 3. The structure and number of reinforcing support parts 3 are set according to the number and distribution of connector assemblies 2 and the installation difficulty of reinforcing support parts 3, so as to increase the number of installations.

[0035] In some embodiments, there is one reinforcing support 3, which is arranged around the outer periphery of the chip 4. For example, multiple connector assemblies 2 are disposed opposite to one reinforcing support 3 in the thickness direction of the electronic interconnect substrate 1. For another example, the reinforcing support 3 is an L-shaped plate and is disposed opposite to two connector assemblies 2. For yet another example, the reinforcing support 3 is a U-shaped plate and is disposed opposite to three connector assemblies 2. Still another example, the reinforcing support 3 is an annular plate and is disposed opposite to the first connector assembly 201, the second connector assembly 202, the third connector assembly 203, and the fourth connector assembly 204.

[0036] like Figure 2 and Figure 3 As shown, in some embodiments, there are multiple reinforcing support portions 3, each of which is disposed opposite to at least one connector assembly 2 in the thickness direction of the electronic interconnect substrate 1. Specifically, multiple reinforcing support portions 3 are disposed on the second surface 12 of the electronic interconnect substrate 1 to support multiple connector assemblies 2 on the electronic interconnect substrate 1, thereby reinforcing the structural strength of the electronic interconnect substrate 1.

[0037] In some embodiments, the extending direction of at least one reinforcing support 3 is aligned with the length direction of the corresponding connector assembly 2. And / or, at least one reinforcing support 3 includes a first plate and a second plate, the extending directions of the first plate and the second plate forming an angle. In other words, the plates of the plurality of reinforcing support 3 may include at least one of a straight plate or a bent plate. For example, at least one reinforcing support 3 is a rectangular plate, and / or, at least one reinforcing support 3 is an L-shaped plate, a U-shaped plate, or an annular plate.

[0038] In some embodiments, each connector assembly 2 includes pins 23, bolts 25, connector housing 22, and a plurality of connectors 21.

[0039] like Figures 1 to 6 As shown, the connector housing 22 includes multiple mounting slots, and the multiple connectors 21 of each connector assembly 2 are correspondingly disposed in the multiple mounting slots of the corresponding connector housing 22. Specifically, the connector housing 22 is used to limit the multiple connectors 21, thereby facilitating the installation of the connector assembly 2 on the electronic interconnect substrate 1.

[0040] Multiple pins 23 are disposed on one side of the connector housing 22 facing the first surface 11 of the electronic interconnect substrate 1, and the extending direction of the pins 23 is consistent with the thickness direction of the electronic interconnect substrate 1. For example, the pins 23 extend in the vertical direction, and multiple pins 23 are disposed on the lower surface of the connector housing 22.

[0041] like Figures 4 to 6As shown, the periphery of the pin 23 includes a first side surface 231, a second side surface 232, a third side surface 233, and a fourth side surface 234 connected in sequence. The first side surface 231 and the third side surface 233 are arranged facing away from each other in a third direction, and the second side surface 232 and the fourth side surface 234 are arranged facing away from each other in a fourth direction. The thickness direction, the third direction, and the fourth direction of the electronic interconnect substrate 1 are perpendicular to each other. For example, the first side surface 231 and the third side surface 233 are curved surfaces, and the second side surface 232 and the fourth side surface 234 are flat surfaces and perpendicular to the fourth direction.

[0042] The distance between the first side 231 and the third side 233 in the third direction is a first preset value, and the distance between the second side 232 and the fourth side 234 in the fourth direction is a second preset value. The first preset value is greater than the second preset value, and at least one of the first side 231 and the third side 233 has external threads. For example, the ratio of the first preset value to the second preset value is 3:(0.5-2). Another example is that the distance between the first side 231 and the third side 233 in the third direction is 3mm, and the distance between the second side 232 and the fourth side 234 in the fourth direction is 1mm.

[0043] Specifically, the pin 23 is generally flat, and its cross-section is generally an elongated oval hole. Both the first side 231 and the third side 233 have external threads. The electronic interconnect substrate 1 has a first pin hole 13 extending through its thickness direction. The first pin hole 13 is an elongated oval hole to match the shape of the cross-section of the pin 23. An elongated oval hole (also called a semi-circular hole or racetrack hole) is a closed shape composed of two semicircles of equal diameter and two parallel straight line segments smoothly tangent to each other. It has no sharp corners and belongs to the straight groove type of elongated oval hole (distinguished from an ellipse); its centerline is the major axis, and the minor axis is the diameter of the semicircle. Compared to a circular hole, the first pin hole 13 can reduce the opening area of ​​the electronic interconnect substrate 1 and improve space utilization. For example, the first pin hole 13 extends in the vertical direction.

[0044] The reinforcing support portion 3 has a second pin hole 31 that extends through it along the thickness direction of the electronic interconnect substrate 1. For example, the second pin hole 31 is a circular hole or an oblong hole, and the second pin hole 31 extends in the vertical direction.

[0045] The pin 23 passes through the first pin hole 13 and the second pin hole 31 and is threaded to the bolt 25. Thus, the connector assembly 2 (connector housing 22), the electronic interconnect substrate 1 and the reinforcing support 3 can be fixed together by the pin 23 and the bolt 25.

[0046] In some embodiments, the plurality of pins 23 on each connector housing 22 are arranged in a matrix, and each of the first pin holes 13 and the second pin holes 31 has multiple pins, each corresponding to one of the plurality of pins 23. This improves the uniformity of the pin arrangement, thereby making the connector assembly 2 (connector housing 22), the electronic interconnect substrate 1 and the reinforcing support 3 securely connected.

[0047] In some embodiments, the pin pin 23 is integrally formed with the connector housing 22, thereby ensuring a secure connection between the pin pin 23 and the connector housing 22. For example, the pin pin 23 and the connector housing 22 are integrally injection molded.

[0048] In some embodiments, the connector housing 22 is provided with a mounting plate 27 that covers the mounting groove. For example, there may be one or more mounting plates 27.

[0049] In some embodiments, a gasket 26 is provided between the reinforcing support 3 and the bolt 25, and is fitted onto the pin 23.

[0050] In some embodiments, the total load-bearing capacity of the plurality of pins 23 of each connector assembly 2 is greater than or equal to the pressure exerted by the plurality of connectors 21 of each connector assembly 2 on the electronic interconnect substrate 1. For example, the pins 23 are made of magnesium alloy. The number of pins 23 is determined according to the thread specification of the pins 23 so that the total load-bearing capacity of the plurality of pins 23 of each connector assembly 2 is greater than or equal to the pressure exerted by the plurality of connectors 21 of each connector assembly 2 on the electronic interconnect substrate 1.

[0051] As shown in the table below, the thread specification of the pin 23 can be M1.6, M2.0, M3.0 or M4.0. Preferably, the thread specification of the pin 23 is M3.0, the stress cross-sectional area is 5.03mm², the fracture bearing capacity and actual bearing capacity are 377.3N, and the thread thread bearing capacity is 402.5N.

[0052]

[0053] For example, the multiple connector assemblies 2 include a first connector assembly 201, a second connector assembly 202, a third connector assembly 203, and a fourth connector assembly 204. The first connector assembly 201, the second connector assembly 202, the third connector assembly 203, and the fourth connector assembly 204 exert a pressure of 1000N on the electronic interconnect substrate 1. The reinforcing support part 3 supports the electronic interconnect substrate 1, so that the maximum deformation of the electronic interconnect substrate 1 is 0.11mm (less than 0.3mm), thereby making the electronic interconnect substrate 1 less prone to deformation.

[0054] The present invention also proposes a method for manufacturing an electronic device according to an embodiment of the present invention, the method comprising the following steps: A connector housing 22 with pin leads 23 is fabricated. For example, a stud is formed on the connector housing 22, and the stud is cut to form the pin leads 23.

[0055] A first pin hole 13 is formed on the electronic interconnect substrate 1 to match the pin 23. The shape of the first pin hole 13 matches the shape and distance of the cross-section of the pin 23, and reduces the opening distance to the electronic interconnect substrate 1.

[0056] The reinforcing support 3 is attached to the second surface 12 of the electronic interconnect substrate 1. The pins 23 of the connector assembly 2 are passed through the first pin hole 13 of the electronic interconnect substrate 1 and the second pin hole 31 of the reinforcing support 3 and threadedly connected with the bolts 25. This allows the connector assembly 2 (connector housing 22), the electronic interconnect substrate 1, and the reinforcing support 3 to be fixed together by the pins 23 and the bolts 25, so that the reinforcing support 3 can support and reinforce the electronic interconnect substrate 1.

[0057] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this invention and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0058] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this invention, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0059] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a connection that allows communication between them; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0060] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "over," and "on top" of the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0061] In this invention, the terms "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., refer to a specific feature, structure, material, or characteristic described in connection with that embodiment or example, which is included in at least one embodiment or example of the invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0062] Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of the present invention.

Claims

1. An electronic device, characterized in that, include: An electronic interconnect substrate, the electronic interconnect substrate including a first surface and a second surface opposite to each other in the thickness direction; A connector assembly, the connector assembly including at least one connector, the connector being pressed against the first surface of the electronic interconnect substrate; A reinforcing support portion is connected to the electronic interconnect substrate and is attached to the second surface of the electronic interconnect substrate. The reinforcing support portion and the connector assembly are disposed opposite to each other in the thickness direction of the electronic interconnect substrate.

2. The electronic device according to claim 1, characterized in that, A chip is disposed on the first surface of the electronic interconnect substrate, and the connector assembly is located on the periphery of the chip.

3. The electronic device according to claim 2, characterized in that, There are multiple connector assemblies, and the multiple connector assemblies are arranged at intervals along the circumferential direction of the chip; The reinforcing support portion is one or more, and the reinforcing support portion is a plate body that is aligned with the thickness direction of the electronic interconnect substrate; In a cross-section perpendicular to the thickness direction of the electronic interconnect substrate, the projection of the connector assembly is located inside the outer periphery of the projection of the reinforcing support.

4. The electronic device according to claim 3, characterized in that, The plurality of connector assemblies include a first connector assembly, a second connector assembly, a third connector assembly, and a fourth connector assembly, wherein the length direction of each of the first connector assembly, the second connector assembly, the third connector assembly, and the fourth connector assembly is consistent with the length direction of the side of the chip adjacent to it; The first connector assembly, the second connector assembly, the third connector assembly, and the fourth connector assembly are arranged around the periphery of the chip. The first connector assembly and the third connector assembly are arranged opposite each other in a first direction. The length directions of the first connector assembly and the third connector assembly are both in a second direction. The second connector assembly and the fourth connector assembly are arranged opposite each other in the second direction. The length directions of the second connector assembly and the fourth connector assembly are both in the first direction. Any two of the first direction, the second direction, and the thickness direction of the electronic interconnect substrate are perpendicular to each other.

5. The electronic device according to claim 3 or 4, characterized in that, The reinforcing support is a single unit, which is arranged around the outer periphery of the chip.

6. The electronic device according to claim 3 or 4, characterized in that, The reinforcing support portion is multiple, and each of the reinforcing support portions is disposed opposite to at least one of the connector assemblies in the thickness direction of the electronic interconnect substrate; At least one of the reinforcing supports extends in the same direction as the length direction of the corresponding connector assembly. And / or, at least one of the reinforcing support portions includes a first plate and a second plate, the extension directions of the first plate and the second plate forming an angle.

7. The electronic device according to any one of claims 1-4, characterized in that, Each of the connector assemblies includes pins and bolts, wherein the pins extend in the same direction as the thickness direction of the electronic interconnect substrate; The peripheral side of the pin includes a first side, a second side, a third side, and a fourth side connected in sequence. The first side and the third side are arranged facing away from each other in a third direction, and the second side and the fourth side are arranged facing away from each other in a fourth direction. The thickness direction of the electronic interconnect substrate, the third direction, and the fourth direction are perpendicular to each other. The distance between the first side and the third side in the third direction is a first preset value, and the distance between the second side and the fourth side in the fourth direction is a second preset value. The first preset value is greater than the second preset value, and at least one of the first side and the third side has an external thread. The electronic interconnect substrate has a first pin hole extending through its thickness direction, the first pin hole being an elongated hole to adapt to the shape of the cross-section of the pin pin; The reinforcing support portion has a second pin hole that penetrates through it along the thickness direction of the electronic interconnect substrate. The pin leads pass through the first pin hole and the second pin hole and are threaded into the bolt.

8. The electronic device according to claim 7, characterized in that, Each connector assembly includes a connector housing and a plurality of connectors. The connector housing includes a plurality of mounting slots, and the plurality of connectors of each connector assembly are respectively disposed in the plurality of mounting slots of the corresponding connector housing. The connector housing has multiple pins and is located on the side of the connector housing facing the first surface of the electronic interconnect substrate. Each of the first pin hole and the second pin hole has multiple pins and corresponds one-to-one with the multiple connector pins.

9. The electronic device according to claim 8, characterized in that, Both the first side and the third side have external threads; and / or The pins are integrally formed with the connector housing; and / or The plurality of pins on each connector housing are arranged in a matrix; and / or The connector housing is provided with a mounting plate that covers the mounting slot; and / or A washer fitted onto the pin pin is provided between the reinforcing support and the bolt; and / or The total load-bearing capacity of the plurality of pins of each connector assembly is greater than or equal to the pressure exerted by the plurality of connectors of each connector assembly on the electronic interconnect substrate.

10. A method for manufacturing an electronic device according to claim 8 or 9, characterized in that, Includes the following steps: Prepare the connector housing having the said pin pins; A first pin hole adapted to the pin is formed on the electronic interconnect substrate; The reinforcing support portion is attached to the second surface of the electronic interconnect substrate; The pins of the connector assembly are passed through the first pin holes of the electronic interconnect substrate and the second pin holes of the reinforcing support and are threaded onto the bolt.

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