A method, apparatus, and equipment for slotting fiber optic channels in circuit boards.

Abstract

This invention belongs to the technical field of circuit board manufacturing, and particularly relates to a method, apparatus, and equipment for slotting fiber optic channels in circuit boards. The method involves acquiring fiber optic dimension data, calculating the slotting depth, width, and length based on this data, calculating a laser coordinate set based on the slotting width, length, preset slotting position, and preset laser hole diameter, creating laser holes of the specified depth at each coordinate within the laser coordinate set using a preset laser spot, and connecting these laser holes to form a fiber optic channel. Finally, the method removes adhesive and glass fiber from the fiber optic channel. This addresses the problems of inconsistent fiber optic channel height and the need for custom-made and frequently replaced router tools, which lead to high production costs and low slotting quality.

Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of circuit board manufacturing, and particularly relates to a circuit board optical fiber groove slotting method, device and equipment. BACKGROUND

[0002] With the rapid iteration of 5G communication, artificial intelligence computing terminal and vehicle-mounted high-speed interconnection system, the internal signal transmission rate of electronic equipment increases exponentially, and the traditional printed circuit board (PCB) electrical interconnection scheme based on copper wiring cannot meet the demand of ultra-high-speed short-distance board-to-board and board-to-board signal transmission. Therefore, the optical-electric co-integrated circuit board has become the mainstream research and development direction in the field of high-speed interconnection at present, and the optical fiber circuit board, as the core carrier of the optical-electric hybrid circuit board, can realize the integration of optical fiber optical path and circuit wiring, and is a key device for solving the pain point of high-speed signal transmission. At present, the mainstream optical fiber circuit board in the industry is mainly divided into two categories: surface-mounted optical fiber circuit board and embedded optical fiber circuit board. One is to fix the optical fiber on the surface of the PCB substrate. The second is the embedded optical fiber circuit board, which pre-embeds the optical fiber between the two medium substrates, and realizes the embedding and packaging of the optical fiber through the pressing process.

[0003] In the existing surface-mounted optical fiber circuit board technology, a mounting groove is set for the optical fiber before embedding the optical fiber. When the mounting groove is opened, a mechanical slotting method is usually used for slotting. However, the mechanical slotting is affected by the uniformity of the board thickness, resulting in uneven height in the slotting area, and the slotting cutter needs to be specially customized and frequently replaced, which leads to high production cost and low slotting quality during production. SUMMARY

[0004] In order to solve the technical problem that in the prior art, the optical fiber groove has uneven height, the slotting cutter needs to be specially customized and frequently replaced, and high production cost and low slotting quality exist during production, the application provides a circuit board optical fiber groove slotting method, device and equipment.

[0005] The application solves the above problems through the following technical solutions: In a first aspect, the application provides a circuit board optical fiber groove slotting method, comprising: Obtaining optical fiber size data, calculating the slotting depth, slotting width and slotting length according to the optical fiber size data; According to the slotting width, slotting length, preset slotting position and preset laser hole diameter, calculating a laser coordinate set; Opening a laser hole with a slotting depth for each coordinate in the laser coordinate set through a preset light spot, so that the laser holes are connected into an optical fiber groove; Removing glue and glass fibers from the optical fiber groove.

[0006] The circuit board optical fiber groove slotting method calculates a slotting depth, a slotting width and a slotting length according to optical fiber size data by obtaining the optical fiber size data; calculates a laser coordinate set according to the slotting width, the slotting length, a preset slotting position and a preset laser hole diameter; opens a laser hole with the slotting depth for each coordinate in the laser coordinate set by a preset light spot, so that the laser holes are connected into an optical fiber groove; and removes glue and glass fibers from the optical fiber groove. The problem of high production cost and low slotting quality in production is solved by solving the problem of the uneven height of the optical fiber groove, the need for special customization of the slotting knife and the need for frequent replacement of the slotting knife.

[0007] In some embodiments, the optical fiber size data is obtained, and the slotting depth, the slotting width and the slotting length are calculated according to the optical fiber size data; including: The diameter of the optical fiber and the length of the optical fiber are obtained; The slotting depth and the slotting width are calculated according to the diameter of the optical fiber; The slotting length is calculated according to the length of the optical fiber.

[0008] In some embodiments, the laser coordinate set is calculated according to the slotting width, the slotting length, the preset slotting position and the preset laser hole diameter; including: The first axis, the second axis, the third axis and the fourth axis are obtained according to the preset slotting position, the distance between the first axis and the second axis is the slotting length, and the distance between the third axis and the fourth axis is the slotting width; The preset light spot is lengthened in a direction perpendicular to the first axis and the second axis, so that the length of the preset light spot is consistent with the slotting length, and the position between the first axis and the second axis is taken as the first coordinate; The number of required lasers is calculated according to the distance between the third axis and the fourth axis and the preset laser hole diameter, the position of the laser is calculated according to the number of lasers, and the position of the laser is taken as the second coordinate; The laser coordinates are formed according to the first coordinate and the plurality of second coordinates respectively, and the laser coordinates are saved to the laser coordinate set.

[0009] In some embodiments, the number of required lasers is calculated according to the distance between the third axis and the fourth axis and the preset laser hole diameter; the number of lasers is calculated by the following formula:

[0010] wherein D is the preset laser hole diameter, is a preset first attenuation parameter, the first attenuation parameter is determined according to the preset laser diameter, is a preset second attenuation parameter, the second attenuation parameter is determined according to the first attenuation parameter, The preset light attenuation parameter is a preset parameter of the laser equipment, L is the distance between the third axis and the fourth axis and is the slot width, N is the number of complete preset light spots required, and the sum of the number of preset light spots multiplied by the first attenuation parameter on both sides and the number of preset light spots multiplied by the second attenuation parameter on both sides is the number of times of the required laser.

[0011] In some embodiments, according to the number of times of the laser, the position of the laser is calculated and taken as the second coordinate; comprising: A plurality of parallel third axis and fourth axis division lines are arranged between the third axis and the fourth axis, the third axis is taken as the starting point, the fourth axis is taken as the end point, the direction perpendicular to the third axis to the fourth axis is taken as the first direction, and the division line sequentially separates the distance between the third axis and the fourth axis into: one-half of the preset laser hole diameter length, the product length of the second attenuation parameter and the preset laser hole diameter, the product length of the first attenuation parameter and the preset laser hole diameter, the preset laser hole diameter length and the number of N, the product length of the first attenuation parameter and the preset laser hole diameter, the product length of the second attenuation parameter and the preset laser hole diameter, and one-half of the preset laser hole diameter length; the second coordinate is the position of the division line.

[0012] In some embodiments, a laser hole with a slot depth is opened to each coordinate in the laser coordinate set by a preset light spot, so that the laser holes are connected into a fiber slot; comprising: A laser hole with a slot depth is opened to each coordinate in the laser coordinate set by a preset light spot, wherein each coordinate in the laser coordinate set is formed by a plurality of times of irradiation of the same position and different energy of the preset light spot to form a laser hole with a slot depth.

[0013] In some embodiments, a laser hole with a slot depth is opened to each coordinate in the laser coordinate set by a preset light spot, wherein each coordinate in the laser coordinate set is formed by a plurality of times of irradiation of a same position and different energy of the preset light spot to form a laser hole with a slot depth; comprising: The preset light spot includes a first energy light spot, a second energy light spot and a third energy light spot; the energy of the first energy light spot, the second energy light spot and the third energy light spot decreases; According to the first energy light spot, a first laser hole is opened to each coordinate in the laser coordinate set with a first number of times; According to the second energy light spot, a second laser hole is opened to the hole bottom of the first laser hole with a second number of times; According to the third energy light spot, a third laser hole is opened to the hole bottom of the second laser hole with a third number of times; The third laser hole is a final laser hole with a slot depth.

[0014] In some embodiments, the fiber slot is removed and the glass fiber is removed; comprising: cleaning the optical fiber groove by a first power of a plasma gas with a ratio of 77% O2 / 10% N2 / 13% CF4, the plasma gas lasting for a first time; cleaning the optical fiber groove by a second power of oxygen with a first concentration, the oxygen lasting for a second time; dissolving the optical fiber in the optical fiber groove by a first temperature of H2SO4 with a second concentration; cleaning the optical fiber groove by water with a first pressure.

[0015] In a second aspect, the present application provides an optical fiber groove slotting device for performing the circuit board optical fiber groove slotting method of any one of the first aspect, comprising: a size calculation module for obtaining optical fiber size data, and calculating a slotting depth, a slotting width and a slotting length according to the optical fiber size data; a coordinate calculation module for calculating a laser coordinate set according to the slotting width, the slotting length, a preset slotting position and a preset laser hole diameter; a slotting module for opening a laser hole with a slotting depth for each coordinate in the laser coordinate set by a preset light spot, so that the laser holes are connected into an optical fiber groove; a cleaning module for removing glue and optical fiber from the optical fiber groove.

[0016] In a third aspect, the present application provides an optical fiber groove slotting device, comprising a processor, a memory, a communication interface and a communication bus, the processor, the memory and the communication interface complete communication with each other through the communication bus; The memory is used for storing at least one executable instruction, and the executable instruction makes the processor execute the operations of the circuit board optical fiber groove slotting method of any one of the first aspect.

[0017] The beneficial effects of the circuit board optical fiber groove slotting method, device and equipment of the present application are: 1) The optical fiber groove is opened by laser at a preset slotting position, avoiding the use of mechanical plate milling to open the optical fiber groove, and avoiding the customization and replacement of special milling tools.

[0018] 2) The laser slotting method can avoid the unevenness of the slotting area caused by the thickness of the plate.

[0019] 3) Removing glue and optical fiber from the optical fiber groove can make the inner wall of the groove smoother and avoid the problem of wear when the optical fiber is placed.

[0020] The above description is only a summary of the technical solutions of the embodiments of the present application, in order to more clearly understand the technical means of the embodiments of the present application, and to be implemented according to the content of the specification, and in order to make the above and other purposes, features and advantages of the embodiments of the present application more obvious and easy to understand, the specific embodiments of the present application are described as follows. BRIEF DESCRIPTION OF DRAWINGS

[0021] The accompanying drawings are included to provide a further understanding of the application and are incorporated in and constitute a part of this specification. In the drawings: Figure 1 Flow chart for steps S1-S4 of the embodiment 1 of the method for opening fiber slot of circuit board; Figure 2 Flow chart for steps S11-S13 of the embodiment 1 of the method for opening fiber slot of circuit board; Figure 3 Flow chart for steps S21-S24 of the embodiment 1 of the method for opening fiber slot of circuit board; Figure 4 Schematic diagram for the slot width separated according to the split line of the embodiment 1 of the method for opening fiber slot of circuit board; Figure 5 Flow chart for steps S31-S34 of the embodiment 1 of the method for opening fiber slot of circuit board; Figure 6 Flow chart for steps S41-S44 of the embodiment 1 of the method for opening fiber slot of circuit board; Figure 7 Structure diagram of the embodiment 2 of the fiber slot opening device; Figure 8 Frame diagram of the embodiment 3 of the fiber slot opening device. DETAILED DESCRIPTION

[0022] Exemplary embodiments of the present application will be described herein below with reference to the accompanying drawings. While exemplary embodiments of the present application are illustrated, it is to be understood that the application is not limited to the embodiments described herein, but can be practiced with variation within the spirit and scope of the present application.

[0023] Embodiment 1: As shown in the figure, the embodiment proposes a method for opening fiber slot of circuit board, comprising: Figures 1-6 Step S1: obtaining fiber size data, calculating slot depth, slot width and slot length according to the fiber size data; Specifically, the fiber size data needed to be pre-buried in the circuit is obtained, which includes the fiber size data calculating the slot depth, slot width and slot length. The fiber is usually a cylinder, and the slot width and slot depth are generally consistent and the diameter of the fiber. The slot length is the length of the fiber needed to be pre-buried. Further, the fiber size data also includes the slot coordinates on the circuit board, i.e. the position of the fiber needed to be pre-buried in the circuit board.

[0024] ​Step S2: calculate a laser coordinate set according to the slot width, the slot length, the preset slot position, and the preset laser hole diameter; Specifically, the laser coordinate set is calculated according to the slot width, the slot length, the preset slot position, and the preset laser hole diameter. There are usually multiple laser coordinates in the laser coordinate set. The reason is that the fiber slot is formed by multiple laser holes, so multiple laser holes need to be formed. The through holes of the laser holes are coincident or non-coincident. When non-coincident, the distance between the laser holes is small, which can be dissolved by high temperature laser to realize the effect of fusion of adjacent laser holes.

[0025] Step S3: open a laser hole with a slot depth for each coordinate in the laser coordinate set through a preset spot, so that the laser holes are connected into a fiber slot; Specifically, the preset spot is also the preset spot of the laser equipment. Usually, the spot can be elongated in one direction, but not in multiple directions. That is, the preset spot can be elongated to adapt to the slot length, but the width needs to be opened by multiple adjacent laser holes through multiple preset spots. The connection between the laser holes forms a fiber slot with a slot width. In some more specific embodiments, the preset spot is usually 20 pm, and the width is 140 pm to 150 pm. Multiple preset spots can be used to open laser holes. Specifically, 8 groups are used. Through the coincident or non-coincident manner of the laser holes, a cutting track with a width of 140 pm to 150 pm is formed, thereby being used for embedding the optical fiber.

[0026] Step S4: remove glue and glass fiber from the fiber slot.

[0027] Specifically, after laser opening, the fiber slot side wall will inevitably leave glass fiber, copper impurities and other protrusions. The protrusions will seriously affect the fitting degree of the optical fiber and the fiber slot, and further cause wear of the optical fiber. Therefore, after slotting, the slot needs to be removed from the glass fiber, the glue and the residual copper.

[0028] The fiber slot is opened by laser at the preset slot position, avoiding the use of mechanical plate milling to open the fiber slot, and avoiding the customization and replacement of special milling tools. The laser slotting method can avoid the uneven height of the slot area after slotting caused by the plate thickness. By removing the glue and glass fiber from the fiber slot, the inner wall of the slot body can be smoother to avoid the problem of wear when the optical fiber is placed. To solve the problem of uneven height of the fiber slot, the milling tool for milling the slot needs to be specially customized and frequently replaced, resulting in high production cost and low slotting quality during production.

[0029] In some embodiments, the fiber size data is obtained, and the slot depth, the slot width, and the slot length are calculated according to the fiber size data; including: Step S11: obtaining the diameter of the optical fiber and the length of the optical fiber; Specifically, the diameter and length of the optical fiber are obtained according to production materials, given parameters and the like, and in some more specific manners, the diameter of the optical fiber is 140-150 μm, and the length is determined according to requirements.

[0030] Step S12: calculating the slot depth and the slot width according to the diameter of the optical fiber; Specifically, the slot depth and the slot width are calculated according to the diameter of the optical fiber, and in the calculation of the slot depth, the slot depth is usually greater than or equal to the diameter of the optical fiber, so that the optical fiber can be embedded into the circuit board, and in some more specific embodiments, the slot depth of the optical fiber slot needs to be deeper, so that the optical fiber is above the surface of the circuit board, and further, after the optical fiber is embedded into the optical fiber slot, a cover plate is arranged, the cover plate has a limiting structure, and the cover plate is arranged on the optical fiber slot, so that the optical fiber is fixed in the optical fiber slot and is limited to avoid the optical fiber from being separated from the optical fiber slot.

[0031] Step S13: calculating the slot length according to the length of the optical fiber.

[0032] Specifically, the slot length is usually slightly greater than or equal to the length of the optical fiber, so as to avoid large distance deviation of the optical fiber in the optical fiber slot.

[0033] In some embodiments, the laser coordinate set is calculated according to the slot width, the slot length, the preset slot position and the preset laser hole diameter, and includes: Step S21: obtaining a first axis, a second axis, a third axis and a fourth axis according to the preset slot position, the distance between the first axis and the second axis being the slot length, and the distance between the third axis and the fourth axis being the slot width; Specifically, the preset slot position is usually a rectangle to adapt to the cylindrical optical fiber, the first axis and the second axis are parallel to each other, the distance between the first axis and the second axis is the slot length, and the third axis and the fourth axis are parallel to each other, and the distance between the third axis and the fourth axis is the slot width.

[0034] Step S22: lengthening the preset light spot in a direction perpendicular to the first axis and the second axis, so that the length of the preset light spot is consistent with the slot length, and taking the position between the first axis and the second axis as a first coordinate; Specifically, the preset light spot is lengthened in a direction perpendicular to the first axis and the second axis, so that the length of the light spot matches the length of the embedded circuit board when irradiated, so that only the width of the optical fiber, i.e. the slot width, is considered when the hole is drilled, thereby shortening the complexity and number of slotting processes, and avoiding complicated slotting procedures. The first coordinate is the line segment coordinate of the first axis and the second axis on the circuit board.

[0035] Step S23: calculating the number of required lasers according to the distance between the third axis and the fourth axis and the preset laser hole diameter, and calculating the position of the laser according to the number of lasers and taking the position of the laser as a second coordinate; Specifically, the preset laser aperture diameter is also the preset laser spot diameter. Although the preset laser spot can be stretched in one direction to match the slot length, it cannot be stretched in a second direction. Therefore, when determining the slot width, the slot width can only be matched according to the preset laser aperture diameter of the preset laser spot. Based on the distance between the third and fourth axes and the preset laser aperture diameter, the required number of laser strikes is calculated. The laser aperture formed by multiple laser strikes is then connected to match the required slot width. Based on the slot width and the preset laser diameter, the number of laser strikes required to satisfy the slot width is calculated. The number of laser strikes determines the position of each laser strike on the third and fourth axes, thus determining the second coordinate.

[0036] Step S24: Generate laser coordinates based on the first coordinates and multiple second coordinates respectively, and save the laser coordinates to the laser coordinate set.

[0037] Multiple laser coordinates are formed by combining the first and second coordinates. These laser coordinates are stored in a laser coordinate set. By calling the laser coordinates in the laser coordinate set, the slotting of the fiber optic groove is realized.

[0038] like Figure 4 As shown, in some embodiments, the required number of laser strikes is calculated based on the distance between the third and fourth axes and the preset laser aperture diameter; the number of laser strikes is calculated using the following formula: (1) Where D is the preset laser aperture diameter, The first attenuation parameter is a preset parameter, which is determined based on the preset laser diameter. The second attenuation parameter is a preset parameter, which is determined based on the first attenuation parameter. The preset light attenuation parameter is the preset parameter of the laser device. L is the distance between the third axis and the fourth axis and is the slot width. N is the number of complete preset light spots required. The sum of N, the number of preset light spots on both sides multiplied by the first attenuation parameter, and the number of preset light spots on both sides multiplied by the second attenuation parameter is the number of laser pulses required.

[0039] Specifically, when the slot is opened between the third axis and the fourth axis, the closer to the third axis and the fourth axis is the side position close to the optical fiber. In order to avoid the existence of too much copper scrap, glue and other impurities on the side position after the slot is opened, the position close to the third axis and the fourth axis can be opened by overlapping the laser when the laser is opened. This method can repeatedly burn the position close to the third axis and the fourth axis of the optical fiber slot, so as to completely remove the impurities. The middle position can be set by using the adjacent laser hole, so as to connect the adjacent laser hole by high temperature of the laser hole, so as to avoid the production waste caused by too many times of laser and the problem of uneven bottom of the optical fiber slot. In order to achieve this purpose, the required number of times is calculated by the above formula, wherein N is the number of adjacent laser holes in the middle, The first attenuation parameter is also the first attenuation parameter, that is, the first attenuation parameter can be 0.75, so that the second laser hole close to the third axis and the fourth axis appears partial overlap, for example, when D is about 20 μm, the distance between the middle laser holes is 20 μm, that is, adjacent, and the distance between the second laser holes close to the third axis and the fourth axis is 15 μm. The second attenuation parameter is smaller than the first attenuation parameter, so that the laser hole closest to the third axis and the fourth axis appears more overlap. For example, when the first attenuation parameter is 0.75, the second attenuation parameter is 0.25, that is, the adjacent of the outermost laser hole is 5 μm, further, the first attenuation parameter and the second attenuation parameter can also be equal ratio parameter, it can be understood that the first attenuation parameter and the second attenuation parameter are set according to the actual, which is not limited more specifically here, The preset light attenuation parameter is a preset parameter of the laser equipment, which also belongs to the light attenuation index, that is, the natural attenuation after light irradiation, which is usually 0.9. The size of the laser hole more than one is that the outermost of the two sides is the radius more than the laser hole, and the sum of the two side radii is the diameter of the laser hole more than one. Therefore, the required number of times of laser is N plus the preset spot quantity of the first attenuation parameter of the two sides, which is 2, plus the preset spot quantity of the second attenuation parameter of the two sides, which is 2. The sum of the above data is N+4, which is the required number of times of laser.

[0040] In some embodiments, according to the number of times of laser, the position of laser is calculated and taken as the second coordinate; comprising: Multiple dividing lines parallel to the third and fourth axes are set between the third and fourth axes. Taking the third axis as the starting point and the fourth axis as the ending point, and the direction perpendicular to the third axis to the fourth axis as the first direction, the dividing lines divide the distance between the third and fourth axes into the following values ​​in sequence: half the preset laser aperture diameter length, the product length of the second attenuation parameter and the preset laser aperture diameter, the product length of the first attenuation parameter and the preset laser aperture diameter, the preset laser aperture diameter length (N in total), the product length of the first attenuation parameter and the preset laser aperture diameter, the product length of the second attenuation parameter and the preset laser aperture diameter, and half the preset laser aperture diameter length. The second coordinate is the position of the dividing line.

[0041] Specifically, such as Figure 4 As shown, after obtaining the number of laser strikes, the second coordinate of the laser is determined based on the number of strikes. The first direction is the direction perpendicular to the fourth axis from the third axis. The distance between the third and fourth axes is divided into different segments according to the dividing line. The segmentation distances are arranged according to the first direction as follows: half the preset laser aperture diameter, the product of the second attenuation parameter and the preset laser aperture diameter, the product of the first attenuation parameter and the preset laser aperture diameter, N preset laser aperture diameters, the product of the first attenuation parameter and the preset laser aperture diameter, the product of the second attenuation parameter and the preset laser aperture diameter, and half the preset laser aperture diameter. In some more specific embodiments, for example, D is approximately 20 μm, the first attenuation parameter can be 0.75, the second attenuation parameter can be 0.25, and the optical attenuation parameter... The value is 0.9, and the required groove is 140μm~150μm. According to the above formula (1), N can be calculated as 5. The position of the dividing line is 0μm for the third axis and 140μm for the fourth axis. The positions of the dividing line are 10μm, 15μm, 30μm, 50μm, 70μm, 90μm, 110μm, 130μm, 145μm, and 150μm. Half of the preset laser diameter is also set on both sides of the dividing line, that is, between 0μm and 10μm and between 150μm and 160μm. That is, the total of the third axis and the fourth axis is 160μm. Multiply the light attenuation parameter After being set to 0.9, the value is approximately 144 μm, falling within the range of 140 μm to 150 μm, which meets the required specifications.

[0042] In some embodiments, laser holes with a pre-set laser spot depth are created at each coordinate within the laser coordinate set to form a fiber optic slot; including: A laser hole with a slot depth is created for each coordinate in the laser coordinate set by using a preset light spot. Each coordinate in the laser coordinate set is formed by multiple preset light spots of the same position and different energies to create a laser hole with a slot depth.

[0043] Specifically, when grooving, the same position is grooved multiple times by multiple small-energy lasers to avoid direct breakdown of the circuit board caused by excessive energy, and the bottom copper corrosion is controlled within 7 μm through special parameter control to ensure that the bottom copper is not broken. At the same time, in order to ensure the embedding angle of the optical fiber, the irradiation angle of the last two times is adjusted from 0° to 5°, so that the groove forms a trapezoidal shape to facilitate the embedding of the optical fiber.

[0044] In some embodiments, a preset light spot is used to open a grooving depth laser hole for each coordinate in the laser coordinate set, wherein each coordinate in the laser coordinate set is formed by multiple times of irradiation of the same position by a preset light spot with different energies; comprising: The preset light spot includes a first energy light spot, a second energy light spot, and a third energy light spot; the first energy light spot, the second energy light spot, and the third energy light spot have decreasing energies; comprising the following steps: Step S31: According to the first energy light spot, a first laser hole is opened for each coordinate in the laser coordinate set for a first number of times; Step S32: According to the second energy light spot, a second laser hole is opened for the bottom of the first laser hole for a second number of times; Step S33: According to the third energy light spot, a third laser hole is opened for the bottom of the second laser hole for a third number of times; The third laser hole is the final grooving depth laser hole.

[0045] Specifically, in some more specific embodiments, the light spot is divided into three levels of different energies, and the first energy light spot, the second energy light spot, and the third energy light spot decrease step by step. The first energy light spot is used for opening and cleaning the surface copper and opening the resin at the same time, the second energy light spot is used for continuously burning the remaining resin and opening at the same time, and the third energy light spot is used for cleaning and repairing the bottom and continuing to open at the same time. At the same time, the first number of times is usually twice, and the energy of the first energy light spot of the two times is 3W, the speed is 250mm / sec, and the polarization angle is 0°. The second number of times is usually twice, and the energy of the second energy light spot of the two times is 2W, the speed is 300mm / sec, and the polarization angle is 0°. The third number of times is twice, and the third energy light spot is 2W and 1W respectively, the speed is 300mm / sec, and the polarization angle is 0.5°.

[0046] In some embodiments, the optical fiber groove is degummed and the optical fiber is removed; comprising: Since the optical fiber needs to be in conduction with the bottom copper, in order to avoid the phenomenon of molten copper on the hole bottom after laser irradiation, a special program of plasma process is used to clean the residual fiber in the groove, which includes: Step S41: Clean the fiber optic trench with plasma gas of 77% O2 / 10% N2 / 13% CF4 at the first power, and the plasma gas is continuously applied for the first time. Specifically, the adhesive is removed for 10 minutes using a plasma gas with a ratio of 77% O2 / 10% N2 / 13% CF4 at a first power of 6KW.

[0047] Step S42: Clean the fiber optic tank with oxygen of a first concentration at a second power, with the oxygen supply lasting for a second time; Specifically, the fiber optic tank is cleaned for 10 minutes using 100% oxygen concentration at 8KW. Steps S41-S42 remove residual dirt on the bottom and walls of the tank that could affect the conduction of the fiber optic signal, allowing the fiber optic cable to conduct better with the copper substrate and ensuring signal transmission.

[0048] Step S43: Dissolve the glass fiber in the fiber optic trench using H2SO4 of a second concentration at a first temperature; Specifically, after completing the plasma process, due to the high density of glass fiber in some resin materials, some residue remains after laser and plasma cleaning. Therefore, it is necessary to clean by removing the glass fiber to ensure smooth hole walls. This is achieved by using H2SO4 at a second concentration of 40-100 ml / L, preferably 70 ml / L, and a temperature of 33℃~27℃, preferably 35℃, to chemically react with the solution in the tank to dissolve the glass fiber.

[0049] Step S44: Clean the fiber optic tank with water under the first pressure.

[0050] Specifically, after dissolution is completed in step S43, the solution is applied at a concentration of 1.0~3.0 kg / cm³. 2 The preferred value is 2kg / cm 2 The water washing pressure cleans the chemical solution in the tank, and finally cleans all the glass fiber on the tank wall that needs to be buried in the tank. This provides a smooth tank wall for the fiber optic cable to be buried, and avoids fiber breakage and damage caused by rough tank walls and protruding glass fibers.

[0051] Example 2: like Figure 7 As shown, this embodiment proposes a fiber optic slotting device to perform the fiber optic slotting method for circuit boards according to any one of Embodiment 1, including: The size calculation module 210 is used to perform the step S1 of obtaining optical fiber size data and to calculate the slotting depth, slotting width and slotting length based on the optical fiber size data. The coordinate calculation module 220 is used to execute step S2 after obtaining the slotting data for fiber size calculation in step S1, to calculate the laser coordinate set based on the slotting width, slotting length, preset slotting position and preset laser hole diameter. The slotting module 230 is configured to perform step S3 to open a laser hole with a preset spot to each coordinate in the laser coordinate set to a slotting depth after the laser coordinate set is calculated in step S2, so that the laser holes are connected to form the fiber slot. The cleaning module 240 is configured to perform step S4 to remove glue and glass fibers from the fiber slot after the slotting in steps S1-S3.

[0052] Embodiment 3 As shown in Figure 8 FIG. 3 shows a structural schematic diagram of the fiber slot slotting device according to Embodiment 3 of the present application. The present application does not limit the specific implementation of the fiber slot slotting device. The fiber slot slotting device can include a processor 402, a communications interface 404, a memory 406, and a communications bus 408.

[0053] The processor 402, the communications interface 404, and the memory 406 can communicate with each other through the communications bus 408. The communications interface 404 is configured to communicate with network elements such as clients or other servers. The processor 402 is configured to execute the program 410, and can execute the related steps in the above-described fiber slot slotting method embodiments.

[0054] Specifically, the program 410 can include program codes including computer executable instructions.

[0055] The processor 402 can be a central processing unit CPU, or an application specific integrated circuit ASIC, or one or more integrated circuits configured to implement embodiments of the present application. The one or more processors of the fiber slot slotting device can be the same type of processor, such as one or more CPUs; or can be different types of processors, such as one or more CPUs and one or more ASICs.

[0056] The memory 406 is configured to store the program 410. The memory 406 can include a high-speed RAM memory, and can also include a non-volatile memory such as at least one disk memory.

[0057] The algorithms or displays provided herein are not inherently related to any particular computer, virtual system, or other apparatus. In addition, embodiments of the present application are not described with reference to any particular programming language.

[0058] In the description provided herein, numerous specific details are set forth. However, it is understood that embodiments of the application can be practiced without these specific details. In other instances, well-known methods, structures and techniques have not been described in detail in order to avoid obscuring the understanding of this description. Like reference numerals refer to like elements throughout. Similarly, while operations can be depicted in the drawings in a particular order, this should not be understood as requiring or

[0059] It is understood by those skilled in the art that modules in the apparatus of the embodiments can be adapted and placed in one or more apparatuses other than the embodiments. Modules or units or components in the embodiments can be combined into one module or unit or component, and further can be divided into multiple sub-modules or sub-units or sub-components. Except that at least some of such features and / or processes or units are mutually exclusive.

[0060] It is noted that the foregoing examples have been provided merely for the purpose of explanation and are in no way to be construed as limiting of the present application. While the application has been described with reference to preferred embodiments, it is understood that the words which have been used herein are words of description and illustration, rather than words of limitation. Changes can be made, within the purview of the appended claims, as presently set forth, and as amended, without departing from the scope and spirit of the present application in its aspects. The advantages offered by the exemplary embodiments of this application can be further understood by the following claims. In the claims, any reference signs placed between parentheses shall not be construed as limiting the claim. The word "comprising" does not exclude the presence of elements or steps other than those listed in a claim. The word "a" or "an" preceding an element does not exclude the presence of a plurality of such elements. The application can be implemented by means of both hardware and software, and any combinations of these. In a unitary claim, several devices, apparatuses or means can be listed, comprising means for carrying out a certain function. The means can be embodied by one and the same item of hardware or by one and the same item of software. The word "comprising" does not exclude other elements or steps than those listed in a claim. The word "a" or "an" preceding an element does not exclude the presence of a plurality of such elements. The application can be implemented by means of both hardware and software, and any combinations of these. In a unitary claim, several devices, apparatuses or means can be listed, comprising means for carrying out a certain function. The means can be embodied by one and the same item of hardware or by one and the same item of software. The word "first", "second", "third", etc. does not necessarily indicate any order. It is thus possible that, depending on the context, the words "first", "second", "third", etc. are used only once, not to indicate any specific order. The use of the words "first", "second", "third", etc. does not limit the scope of items discussed, but each of them is construed to be a mere naming choice.

Claims

1. A method for slotting optical fiber grooves in a circuit board, characterized in that, include: Obtain fiber optic dimension data, and calculate the slotting depth, slotting width, and slotting length based on the fiber optic dimension data; Calculate the laser coordinate set based on the slot width, the slot length, the preset slot position, and the preset laser hole diameter; A laser hole of the specified groove depth is opened at each coordinate within the laser coordinate set by using a preset light spot, so that the laser holes are connected to form an optical fiber groove. Remove adhesive and glass fibers from the fiber optic slot.

2. The method for slotting optical fiber channels in a circuit board according to claim 1, characterized in that, The step of acquiring fiber optic dimension data and calculating the slotting depth, slotting width, and slotting length based on the fiber optic dimension data includes: Obtain the diameter and length of the optical fiber; The slot depth and the slot width are calculated based on the diameter of the optical fiber; The slot length is calculated based on the length of the optical fiber.

3. The method for slotting optical fiber grooves in a circuit board according to claim 1, characterized in that, The step of calculating the laser coordinate set based on the slot width, the slot length, the preset slot position, and the preset laser aperture diameter includes: The first axis, second axis, third axis and fourth axis are obtained according to the preset slotting position, the distance between the first axis and the second axis is the slotting length, and the distance between the third axis and the fourth axis is the slotting width; The preset light spot is elongated in a direction perpendicular to the first axis and the second axis so that the length of the preset light spot is consistent with the length of the slot, and the position between the first axis and the second axis is used as the first coordinate. The required number of laser strikes is calculated based on the distance between the third axis and the fourth axis and the preset laser aperture diameter; the laser position is calculated based on the number of laser strikes and the laser position is used as the second coordinate. Laser coordinates are formed based on the first coordinates and multiple second coordinates respectively, and the laser coordinates are saved to the laser coordinate set.

4. The method for slotting optical fiber grooves in a circuit board according to claim 3, characterized in that, The required number of laser strikes is calculated based on the distance between the third and fourth axes and the preset laser aperture diameter; the number of laser strikes is calculated using the following formula: Where D is the preset laser aperture diameter, The first attenuation parameter is a preset value, which is determined based on the preset laser diameter. The second attenuation parameter is a preset value, which is determined based on the first attenuation parameter. The preset light attenuation parameter is a preset parameter of the laser device, L is the distance between the third axis and the fourth axis and is the slot width, N is the number of complete preset light spots required, and the sum of N, the number of preset light spots on both sides multiplied by the first attenuation parameter, and the number of preset light spots on both sides multiplied by the second attenuation parameter is the number of laser pulses required.

5. The method for slotting optical fiber grooves in a circuit board according to claim 4, characterized in that, The step of calculating the position of the laser based on the number of laser strikes and using the laser position as the second coordinate includes: Multiple dividing lines parallel to the third and fourth axes are provided between the third and fourth axes. Starting from the third axis and ending at the fourth axis, with the direction perpendicular to the third axis towards the fourth axis as the first direction, the dividing lines sequentially divide the distance between the third and fourth axes into: half the length of the preset laser aperture diameter, the product of the second attenuation parameter and the preset laser aperture diameter, the product of the first attenuation parameter and the preset laser aperture diameter, N preset laser aperture diameters, the product of the first attenuation parameter and the preset laser aperture diameter, the product of the second attenuation parameter and the preset laser aperture diameter, and half the length of the preset laser aperture diameter; the second coordinate represents the position of the dividing line.

6. The method for slotting optical fiber grooves in a circuit board according to claim 1, characterized in that, The step of creating laser holes of the specified groove depth at each coordinate within the laser coordinate set using a preset light spot, so that the laser holes are connected to form an optical fiber groove, includes: A laser hole of the specified groove depth is created at each coordinate within the laser coordinate set by means of a preset light spot, wherein each coordinate within the laser coordinate set is formed by multiple irradiations of the preset light spot at the same position but with different energies to create a laser hole of the specified groove depth.

7. The method for slotting optical fiber grooves in a circuit board according to claim 6, characterized in that, The method involves creating a laser hole of the specified groove depth at each coordinate within the laser coordinate set using a preset light spot, wherein each coordinate within the laser coordinate set is irradiated multiple times by the preset light spot at the same position but with different energies to form the laser hole of the specified groove depth; including: The preset light spot includes a first energy light spot, a second energy light spot, and a third energy light spot; the energy of the first energy light spot, the second energy light spot, and the third energy light spot decreases in that order. Based on the first energy spot, a first laser aperture is opened for each coordinate in the laser coordinate set in the first number of pairs; A second laser hole is opened at the bottom of the first laser hole according to the second energy spot. A third laser hole is opened at the bottom of the second laser hole according to the third energy spot; The third laser hole is the laser hole at the final groove depth.

8. The method for slotting optical fiber grooves in a circuit board according to claim 1, characterized in that, The process of removing adhesive and removing glass fibers from the fiber optic slot includes: The fiber optic trench is cleaned with a plasma gas with a ratio of 77% O2 / 10% N2 / 13% CF4 at a first power, and the plasma gas is used continuously for a first time. The fiber optic slot is cleaned with oxygen of a first concentration at a second power for a second duration; The glass fibers in the fiber optic trench are dissolved by using H2SO4 of a second concentration at a first temperature. The fiber optic groove is cleaned with water under a first pressure.

9. A fiber optic slotting device, characterized in that, include: The size calculation module is used to acquire optical fiber size data and calculate the slotting depth, slotting width and slotting length based on the optical fiber size data. The coordinate calculation module is used to calculate the laser coordinate set based on the slot width, the slot length, the preset slot position, and the preset laser hole diameter; The grooving module is used to create laser holes of the grooving depth at each coordinate in the laser coordinate set through a preset light spot, so that the laser holes are connected to form an optical fiber groove. The cleaning module is used to remove adhesive and glass fibers from the fiber optic slots.

10. A fiber optic slotting device, characterized in that, include: The processor, memory, communication interface, and communication bus are provided, wherein the processor, memory, and communication interface communicate with each other via the communication bus. The memory is used to store at least one executable instruction that causes the processor to perform the operation of the fiber optic slotting method for circuit boards as described in any one of claims 1-8.

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