A circuit board depth control etching hole device

Abstract

The application provides a circuit board depth control etching hole device and relates to the technical field of circuit board manufacturing. The device comprises a support assembly, a depth control assembly, a horizontal assembly, a vertical assembly, a clamping assembly, a self-lifting assembly, a suction assembly, an etching hole assembly and a controller. The support assembly is used to provide stable support force. The depth control assembly is arranged on the top of the support assembly and is used to control the etching hole depth. The horizontal assembly is arranged on the top of the support assembly and is used to provide horizontal movement function. The vertical assembly is arranged on the moving part of the horizontal assembly and is used to provide vertical movement function. The clamping assembly is arranged on the moving part of the vertical assembly and is used to provide a clamping position for the circuit board. When the etching hole depth is excessive, the self-lifting assembly, the clamping assembly and the suction assembly can automatically lift the circuit board upward, so that the circuit board is prevented from being excessively etched, the circuit board failure rate is reduced, and the circuit board loss cost is reduced.

Description

Technical Field

[0001] This invention relates to the field of circuit board manufacturing technology, specifically to a device for controlling the depth of etching holes in circuit boards. Background Technology

[0002] In the PCB manufacturing process, the treatment of holes directly affects the precision and reliability of subsequent processes. Back drilling is a secondary drilling technology for through-holes in multi-layer PCBs. Its core principle is to precisely remove excess copper pillars (residual studs) in the through-holes that are not used by signals, thereby eliminating reflections, attenuation, and distortion in high-speed / high-frequency signal transmission and improving signal integrity. Therefore, research on controlled-depth etching devices is essential.

[0003] In related technologies, such as the high-precision double-sided PCB circuit board deep etching device with announcement number CN216531981U, a base is provided. An adjusting top screw is installed on the upper surface of the base, and a sleeve is movably sleeved on the surface of the adjusting top screw. A board seat is placed on the upper surface of the sleeve. Support seats are provided on both sides above the base, and a hydraulic rod is connected to the top of the support seat. A drilling mechanism is installed on the inner side of the support seat.

[0004] The aforementioned devices typically use stops to limit the drilling depth of the drill bit. However, the blocking surface of the stops is small, and the depth control effect is not stable enough, which affects the quality and accuracy of the etched holes on the circuit board. Summary of the Invention

[0005] To address the shortcomings of existing technologies, this invention provides a circuit board depth-controlled etching device, which solves the problem that the small shielding surface of the stop block leads to unstable depth control, thus affecting the quality and accuracy of the etched holes on the circuit board.

[0006] To achieve the above objectives, the present invention provides the following technical solution: a device for controlled deep etching of circuit boards, comprising: Support components, which provide stable support forces; A depth control component, located on top of the support component, is used to control the depth of the etched hole; A lateral component, located on top of the support component, is used to provide lateral movement functionality; A longitudinal component, which is disposed on the moving part of the transverse component, is used to provide longitudinal movement function; A clamping assembly, which is disposed on the moving part of the longitudinal assembly, is used to provide a clamping position for the circuit board; The self-releasing component is disposed on the clamping component and is used to provide clamping force; An adsorption component, which is disposed on the self-releasing component, is used to provide an adsorption function; The etching assembly is located below the support assembly and is used to provide etching function; the self-release assembly and the adsorption assembly can automatically lift the circuit board when the etching depth is too deep; The controller, mounted on the support assembly, provides control functions. Through the self-release and clamping components, which work together, the circuit board is held firmly, ensuring its stability and improving the stability of the etching process. The self-release, clamping, and adsorption components automatically lift the circuit board when the etching depth is excessive, preventing over-etching, reducing defect rates, and minimizing circuit board wear costs. The horizontal and vertical components, working together, enable horizontal and vertical adjustment of the entire plane, ensuring accurate etching positions and reliable adjustment.

[0007] Preferably, the support assembly includes a base plate, a support leg fixedly connected to the lower part of the base plate, a light rod fixedly connected to the base plate, a top frame fixedly connected to the upper end of the light rod, an auxiliary sliding groove provided on the inner side of the top frame, and an extension plate fixedly connected to the side of the base plate.

[0008] Preferably, the depth control component includes a self-locking push rod fixedly installed on the top frame, the output end of the self-locking push rod being fixedly connected to a control frame, and the control frame being slidably engaged with the guide rod.

[0009] Preferably, the transverse assembly includes a transverse shell fixedly installed inside the top frame, a transverse motor fixedly installed at one end of the transverse shell, a transverse lead screw fixedly connected to the output end of the transverse motor, a transverse seat slidably connected inside the transverse shell, the transverse lead screw threadedly engaging with the transverse seat, and the transverse seat slidably engaging with an auxiliary slide groove.

[0010] Preferably, the longitudinal component includes a longitudinal shell fixedly mounted on a transverse seat, a longitudinal motor fixedly mounted at one end of the longitudinal shell, a longitudinal lead screw fixedly connected to the output end of the longitudinal motor, a longitudinal seat slidably connected inside the longitudinal shell, the longitudinal seat threadedly engaging with the longitudinal lead screw, a stabilizing plate fixedly connected to the longitudinal seat, a placement frame fixedly connected to the stabilizing plate, an insertion slot provided on the placement frame, and an infrared distance sensor fixedly mounted below the stabilizing plate.

[0011] Preferably, the clamping assembly includes a base fixedly mounted on the placement frame, a clamping cylinder rotatably mounted on the top of the base, a connecting block fixedly connected to the output end of the clamping cylinder, a drive rod rotatably connected to the connecting block, a clamping frame fixedly connected to the drive rod, a limiting seat rotatably connected to the lower part of the clamping frame, the limiting seat being fixedly connected to the placement frame, and a horizontal plate fixedly connected to the front part of the clamping frame, the limiting seat restricting the horizontal plate to a horizontal state.

[0012] Preferably, the self-releasing assembly includes a sliding rod slidably mounted on a horizontal plate, a top plate fixedly connected to the top of the sliding rod, a clamping plate fixedly connected to the lower end of the sliding rod, an electromagnet fixedly mounted on the lower part of the horizontal plate, a permanent magnet located directly below the electromagnet, the permanent magnet being fixedly connected to the clamping plate, the electromagnet having the same magnetism as the permanent magnet when energized, and a return spring sleeved on the upper part of the sliding rod, the return spring being located between the horizontal plate and the top plate.

[0013] Preferably, the adsorption assembly includes a mounting box fixedly installed in the middle of the clamping plate, a negative pressure suction cup fixedly installed at the lower part of the mounting box, and the upper part of the mounting box connected to an external negative pressure source via a flexible hose; the etching assembly includes a lifting push rod fixedly installed at the lower part of the base plate, a lifting plate fixedly connected to the output end of the lifting push rod, an etching motor fixedly connected to the lifting plate, an etching drill bit fixedly connected to the output end of the etching motor, and the lifting plate slidingly engaging with the guide rod via a sliding sleeve.

[0014] This invention provides a device for controlled deep etching of vias in circuit boards. It has the following advantages: 1. The present invention, through the setting of a self-releasing component and a clamping component, the clamping component and the self-releasing component cooperate with each other to press and hold the circuit board, ensuring the stability of the circuit board and improving the stability of the etching operation.

[0015] 2. The present invention, through the self-release component, clamping component, and adsorption component, can automatically lift the circuit board upward when the etching depth is excessive, thereby avoiding the circuit board from having excessive etching, reducing the circuit board defect rate, and reducing the circuit board loss cost.

[0016] 3. By setting up horizontal and vertical components, the present invention can achieve horizontal and vertical adjustment of the entire plane through the cooperation of the horizontal and vertical components, ensuring accurate positioning of the etched holes on the circuit board and reliable adjustment. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the overall structure of the present invention; Figure 2 This is a schematic diagram of the supporting component in this invention; Figure 3This is a schematic diagram of the structure of the depth control component in this invention; Figure 4 This is a schematic diagram of the structure of the horizontal component in this invention; Figure 5 This is a schematic diagram of the vertical component in this invention; Figure 6 This is a schematic diagram of the clamping component in the present invention; Figure 7 This is a schematic diagram of the self-releasing component in this invention; Figure 8 This is a schematic diagram of the adsorption component in this invention; Figure 9 This is a schematic diagram of the etching assembly in this invention; Figure 10 This is a structural schematic diagram of the placement frame portion from a lower viewpoint in this invention.

[0018] The components include: 1. Support assembly; 2. Depth control assembly; 3. Lateral assembly; 4. Longitudinal assembly; 5. Clamping assembly; 6. Self-releasing assembly; 7. Adsorption assembly; 8. Etching assembly; 101. Support leg; 102. Base plate; 103. Extension plate; 104. Top frame; 105. Smooth rod; 106. Auxiliary slide rail; 201. Self-locking push rod; 202. Control frame; 301. Lateral shell; 302. Lateral motor; 303. Lateral lead screw; 304. Lateral seat; 401. Longitudinal shell; 402. Longitudinal motor; 403. Longitudinal lead screw; 404. Longitudinal seat; 405. Stabilizing plate. ; 406, Placement frame; 407, Insertion slot; 408, Infrared distance sensor; 501, Base; 502, Clamping cylinder; 503, Connecting block; 504, Drive rod; 505, Clamping frame; 5051, Horizontal plate; 506, Limiting seat; 601, Sliding rod; 602, Return spring; 603, Top plate; 604, Clamping plate; 605, Permanent magnet; 606, Electromagnet; 701, Mounting box; 702, Negative pressure suction cup; 703, Hose; 801, Lifting push rod; 802, Lifting plate; 803, Sliding sleeve; 804, Etching motor; 805, Etching drill bit. Detailed Implementation

[0019] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0020] like Figures 1-10 As shown, an embodiment of the present invention provides a device for controlled deep etching of vias on circuit boards, comprising: refer to Figure 1 , Figure 2 Support component 1 is used to provide stable support force; support component 1 includes a base plate 102, a support leg 101 is fixedly connected to the lower part of the base plate 102, a smooth rod 105 is fixedly connected to the base plate 102, a top frame 104 is fixedly connected to the upper end of the smooth rod 105, an auxiliary sliding groove 106 is provided on the inner side of the top frame 104, and an extension plate 103 is fixedly connected to the side of the base plate 102. There are four bare poles 105, which provide stable support and guidance; there are four support legs 101, which are arranged symmetrically to ensure that the whole structure has stable support.

[0021] refer to Figure 1 , Figure 2 Depth control component 2 is located on the top of support component 1 and is used to control the depth of the etched hole. Depth control component 2 includes a self-locking push rod 201 fixedly installed on the top frame 104. The output end of the self-locking push rod 201 is fixedly connected to a control frame 202. The control frame 202 is slidably engaged with the light rod 105. The depth control component 2 is used to control the depth of the etching holes. Specifically, the self-locking push rod 201 works under the power supply and controller to drive the control frame 202 to move. Under the guidance of the light rod 105, the control frame 202 moves to the preset position. Then, by utilizing its own self-locking function, it can ensure that the etching hole depth is appropriate, avoid over-etching, and improve the etching hole quality of the circuit board.

[0022] refer to Figure 4 The lateral component 3 is located on top of the support component 1 and is used to provide lateral movement function. The lateral component 3 includes a lateral shell 301 fixedly installed inside the top frame 104. A lateral motor 302 is fixedly installed at the end of the lateral shell 301. A lateral lead screw 303 is fixedly connected to the output end of the lateral motor 302. A lateral seat 304 is slidably connected inside the lateral shell 301. The lateral lead screw 303 and the lateral seat 304 are threadedly engaged. The lateral seat 304 is slidably engaged with the auxiliary slide groove 106. During horizontal operation, the horizontal motor 302 works under the power supply and controller, driving the horizontal lead screw 303 to rotate. The horizontal lead screw 303 can drive the horizontal seat 304 to move, thereby changing the position of the etched holes on the circuit board.

[0023] refer to Figure 5 , Figure 10The longitudinal component 4 is disposed on the moving part of the transverse component 3 and is used to provide longitudinal movement function. The longitudinal component 4 includes a longitudinal shell 401 fixedly installed on the transverse seat 304. A longitudinal motor 402 is fixedly installed at the end of the longitudinal shell 401. A longitudinal lead screw 403 is fixedly connected to the output end of the longitudinal motor 402. A longitudinal seat 404 is slidably connected inside the longitudinal shell 401. The longitudinal seat 404 and the longitudinal lead screw 403 are threadedly engaged. A stabilizing plate 405 is fixedly connected to the longitudinal seat 404. A placement frame 406 is fixedly connected to the stabilizing plate 405. The placement frame 406 is provided with a placement slot 407. An infrared distance sensor 408 is fixedly installed below the stabilizing plate 405. During longitudinal operation, the longitudinal motor 402 operates under the power supply and controller, driving the longitudinal lead screw 403 to rotate. The longitudinal lead screw 403 drives the longitudinal seat 404 and the stabilizing plate 405 to move as a whole, thereby changing the longitudinal position of the circuit board and ensuring the stability of the etching position of the circuit board. The circuit board is placed in the placement slot 407, which provides a constraint for the circuit board. The infrared distance sensor 408 is used to calculate the distance between itself and the lifting plate 802 in real time. On the one hand, it plays a monitoring role in the etching operation. On the other hand, it can provide a trigger condition for the lifting operation of the self-releasing component 6 when the etching depth is too deep.

[0024] refer to Figure 6 The clamping assembly 5 is located on the moving part of the longitudinal assembly 4 and is used to provide a clamping position for the circuit board. The clamping assembly 5 includes a base 501 fixedly installed on the placement frame 406. A clamping cylinder 502 is rotatably installed on the top of the base 501. A connecting block 503 is fixedly connected to the output end of the clamping cylinder 502. A drive rod 504 is rotatably connected to the connecting block 503. A clamping frame 505 is fixedly connected to the drive rod 504. A limiting seat 506 is rotatably connected to the lower part of the clamping frame 505. The limiting seat 506 is fixedly connected to the placement frame 406. A horizontal plate 5051 is fixedly connected to the front part of the clamping frame 505. The limiting seat 506 can limit the horizontal plate 5051 to a horizontal state. The clamping component 5 has two states: one is in a vertically open state, which is convenient for inserting the circuit board, and the other is in a horizontally closed state, which is used to provide a horizontal position for the self-positioning component 6. Specifically, the clamping cylinder 502 works under the action of the air source and the controller, and drives the drive rod 504 through the connecting block 503. The drive rod 504 drives the clamping frame 505 to rotate around the limiting seat 506 as the center, which can realize the switching between the open state and the closed state.

[0025] refer to Figure 7The self-releasing component 6 is mounted on the clamping component 5 and is used to provide clamping force. The self-releasing component 6 includes a sliding rod 601 slidably mounted on the horizontal plate 5051. A top plate 603 is fixedly connected to the top of the sliding rod 601, and a clamping plate 604 is fixedly connected to the lower end of the sliding rod 601. An electromagnet 606 is fixedly mounted on the lower part of the horizontal plate 5051. A permanent magnet 605 is located directly below the electromagnet 606. The permanent magnet 605 is fixedly connected to the clamping plate 604. When the electromagnet 606 is energized, its magnetism is the same as that of the permanent magnet 605. A return spring 602 is sleeved on the upper part of the sliding rod 601. The return spring 602 is located between the horizontal plate 5051 and the top plate 603. The self-release operation has a clamping state and a non-clamping state. In the clamping state, the electromagnet 606 is energized and generates magnetism. Using the principle of like poles repulsion, it pushes the permanent magnet 605. The permanent magnet 605 drives the clamping plate 604, the clamping plate 604 drives the sliding rod 601, the sliding rod 601 drives the top plate 603, the top plate 603 moves down and applies pressure to the reset spring 602. The clamping plate 604 overcomes the elastic force of the reset spring 602 and presses against the circuit board to clamp the circuit board and ensure the stability of the circuit board etching process. In the non-clamping state, when the etch depth is excessive, the electromagnet 606 is de-energized, the magnetism of the electromagnet 606 disappears, and under the elastic force of the reset spring 602, it will push the top plate 603 upward, thereby driving the clamping plate 604 part to move upward and away from the circuit board through the sliding rod 601. The circuit board will then cancel the clamping state, and with the adsorption component 7, it can achieve the lifting state.

[0026] refer to Figure 8 The adsorption component 7 is disposed on the self-releasing component 6 and is used to provide adsorption function. The adsorption component 7 includes a mounting box 701 fixedly installed in the middle of the clamping plate 604. A negative pressure suction cup 702 is fixedly installed in the lower part of the mounting box 701, and the upper part of the mounting box 701 is connected to an external negative pressure source through a hose 703. During the adsorption operation, the external negative pressure source generates negative pressure suction at the negative pressure suction cup 702 through the hose 703. The negative pressure suction can be used to adsorb the circuit board, thereby enabling the lifting function in conjunction with the non-clamping state of the self-releasing component 6.

[0027] refer to Figure 9 The etching assembly 8 is located below the support assembly 1 and is used to provide etching function; the self-releasing assembly 6 and the adsorption assembly 7 can automatically lift the circuit board when the etching depth is too deep; the etching assembly 8 includes a lifting push rod 801 fixedly installed on the lower part of the base plate 102, the output end of the lifting push rod 801 is fixedly connected to a lifting plate 802, the lifting plate 802 is fixedly connected to an etching motor 804, the output end of the etching motor 804 is fixedly connected to an etching drill bit 805, and the lifting plate 802 slides with the guide rod 105 through a sliding sleeve 803; During the etching operation, the lifting push rod 801 operates under the power supply and controller, driving the lifting plate 802 to move upward. The lifting plate 802 moves upward along the guide rod 105 via the sliding sleeve 803, thereby driving the etching motor 804 to move upward. The etching motor 804 drives the etching drill bit 805 to move upward, and the etching drill bit 805 performs etching operations on the circuit board. Furthermore, the etching drill bit 805 moves from bottom to top, which facilitates the discharge of debris during the etching process and ensures the smooth progress of the etching.

[0028] The controller, which is mounted on the support component 1, is used to provide control functions; The controller is a programmable PLC controller, which enables automatic control functions.

[0029] Working principle: When in use, the horizontal component 3 and the vertical component 4 are adjusted according to the position of the holes to be etched on the circuit board. Specifically, during horizontal operation, the horizontal motor 302 works under the action of the power supply and controller, driving the horizontal lead screw 303 to rotate. The horizontal lead screw 303 can drive the horizontal seat 304 to move, thereby changing the position of the holes to be etched on the circuit board. During longitudinal operation, the longitudinal motor 402 works under the power supply and controller, driving the longitudinal lead screw 403 to rotate. The longitudinal lead screw 403 drives the longitudinal seat 404 and the stabilizing plate 405 to move as a whole, thereby changing the longitudinal position of the circuit board and ensuring the stability of the etching position of the circuit board. The circuit board that needs to be etched is placed in the slot 407. The clamping cylinder 502 works under the action of the air source and controller, and drives the drive rod 504 through the connecting block 503. The drive rod 504 drives the clamping frame 505 to rotate around the limiting seat 506 as the center, which can realize the open state. When clamped, the electromagnet 606 is energized and generates magnetism. Using the principle of like poles repulsion, it pushes the permanent magnet 605. The permanent magnet 605 drives the clamping plate 604, which in turn drives the sliding rod 601. The sliding rod 601 drives the top plate 603, which moves down to press the reset spring 602. The clamping plate 604 overcomes the elastic force of the reset spring 602 and presses against the circuit board to hold the circuit board and ensure the stability of the etching process. During the adsorption operation, the external negative pressure source generates negative pressure suction at the negative pressure suction cup 702 through the hose 703. The circuit board can be adsorbed by the negative pressure suction. Then, the lifting push rod 801 operates under the power supply and controller, driving the lifting plate 802 to move upward. The lifting plate 802 moves upward along the guide rod 105 through the sliding sleeve 803, thereby driving the etching motor 804 to move upward. The etching motor 804 drives the etching drill bit 805 to move upward. The etching drill bit 805 performs etching operations on the circuit board. Furthermore, the etching drill bit 805 moves from bottom to top, which facilitates the discharge of debris during the etching process and ensures the smooth progress of the etching. The infrared distance sensor 408 is used to calculate the distance between itself and the lifting plate 802 in real time. On the one hand, it can provide a trigger condition for the lifting operation of the self-releasing component 6 when the etched hole depth is too deep. When the etching depth is excessive, the electromagnet 606 is de-energized, the magnetism of the electromagnet 606 disappears, and under the elastic force of the reset spring 602, the top plate 603 will be pushed upward, thereby driving the clamping plate 604 part to move upward and away from the circuit board through the sliding rod 601. The circuit board will then be released from the clamping state. With the adsorption of the adsorption component 7, the lifting state can be achieved. This avoids drilling too deep into the circuit board, thus solving the problems of over-drilling, product defects, increased defect rates, and manufacturing costs.

[0030] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A device for controlled deep etching of vias on circuit boards, characterized in that, include: Support component (1), the support component (1) is used to provide stable support force; Depth control component (2), which is located on top of support component (1) and is used to control the depth of the etched hole; A lateral component (3) is disposed on top of the support component (1) and is used to provide lateral movement functionality; The longitudinal component (4) is disposed on the moving part of the transverse component (3) and is used to provide longitudinal movement function; Clamping assembly (5), which is disposed on the moving part of the longitudinal assembly (4) and is used to provide a clamping position for the circuit board; The self-releasing component (6) is disposed on the clamping component (5) and is used to provide clamping force; Adsorption component (7), which is disposed on self-releasing component (6) and is used to provide adsorption function; The etching assembly (8) is located at the lower part of the support assembly (1) and is used to provide etching function; the self-releasing assembly (6) and the adsorption assembly (7) can automatically lift the circuit board when the etching depth is too deep; A controller, which is mounted on the support assembly (1), is used to provide control functions.

2. The device for controlled deep etching of circuit boards according to claim 1, characterized in that: The support assembly (1) includes a base plate (102), a support leg (101) is fixedly connected to the lower part of the base plate (102), a light rod (105) is fixedly connected to the base plate (102), a top frame (104) is fixedly connected to the upper end of the light rod (105), an auxiliary sliding groove (106) is provided on the inner side of the top frame (104), and an extension plate (103) is fixedly connected to the side of the base plate (102).

3. The controlled deep etching via device for circuit boards according to claim 2, characterized in that: The depth control component (2) includes a self-locking push rod (201) fixedly installed on the top frame (104). The output end of the self-locking push rod (201) is fixedly connected to a control frame (202), and the control frame (202) slides with the light rod (105).

4. The controlled deep etching device for circuit boards according to claim 3, characterized in that: The transverse assembly (3) includes a transverse shell (301) fixedly installed inside the top frame (104). A transverse motor (302) is fixedly installed at the end of the transverse shell (301). A transverse lead screw (303) is fixedly connected to the output end of the transverse motor (302). A transverse seat (304) is slidably connected inside the transverse shell (301). The transverse lead screw (303) is threadedly engaged with the transverse seat (304). The transverse seat (304) is slidably engaged with the auxiliary slide groove (106).

5. The controlled deep etching via device for circuit boards according to claim 4, characterized in that: The longitudinal component (4) includes a longitudinal shell (401) fixedly mounted on a transverse seat (304). A longitudinal motor (402) is fixedly mounted at the end of the longitudinal shell (401). A longitudinal lead screw (403) is fixedly connected to the output end of the longitudinal motor (402). A longitudinal seat (404) is slidably connected inside the longitudinal shell (401). The longitudinal seat (404) is threadedly engaged with the longitudinal lead screw (403). A stabilizing plate (405) is fixedly connected to the longitudinal seat (404). A placement frame (406) is fixedly connected to the stabilizing plate (405). An insertion slot (407) is provided on the placement frame (406). An infrared distance sensor (408) is fixedly mounted below the stabilizing plate (405).

6. The device for controlled deep etching of circuit boards according to claim 5, characterized in that: The clamping assembly (5) includes a base (501) fixedly mounted on the placement frame (406). A clamping cylinder (502) is rotatably mounted on the top of the base (501). A connecting block (503) is fixedly connected to the output end of the clamping cylinder (502). A drive rod (504) is rotatably connected to the connecting block (503). A clamping frame (505) is fixedly connected to the drive rod (504). A limiting seat (506) is rotatably connected to the lower part of the clamping frame (505). The limiting seat (506) is fixedly connected to the placement frame (406). A horizontal plate (5051) is fixedly connected to the front part of the clamping frame (505). The limiting seat (506) can limit the horizontal plate (5051) to be in a horizontal state.

7. The controlled-deep-etching via device for circuit boards according to claim 6, characterized in that: The self-releasing assembly (6) includes a sliding rod (601) slidably mounted on a horizontal plate (5051). A top plate (603) is fixedly connected to the top of the sliding rod (601), and a clamping plate (604) is fixedly connected to the lower end of the sliding rod (601). An electromagnet (606) is fixedly mounted on the lower part of the horizontal plate (5051). A permanent magnet (605) is provided directly below the electromagnet (606). The permanent magnet (605) is fixedly connected to the clamping plate (604). When the electromagnet (606) is energized, its magnetism is the same as that of the permanent magnet (605). A return spring (602) is sleeved on the upper part of the sliding rod (601). The return spring (602) is located between the horizontal plate (5051) and the top plate (603).

8. The controlled-deep etching device for circuit boards according to claim 7, characterized in that: The adsorption assembly (7) includes a mounting box (701) fixedly installed in the middle of the clamping plate (604). A negative pressure suction cup (702) is fixedly installed in the lower part of the mounting box (701). The upper part of the mounting box (701) is connected to an external negative pressure source through a flexible hose (703). The etching assembly (8) includes a lifting push rod (801) fixedly installed in the lower part of the base plate (102). A lifting plate (802) is fixedly connected to the output end of the lifting push rod (801). An etching motor (804) is fixedly connected to the lifting plate (802). An etching drill bit (805) is fixedly connected to the output end of the etching motor (804). The lifting plate (802) slides with the polished rod (105) through a sliding sleeve (803).

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