Hdi board, laser drilling apparatus and process method thereof
CN122995033APending Publication Date: 2026-10-27HUIZHOU KING BROTHER CIRCUIT TECH
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Patent Information
- Application Number
- CN202611469867.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2026-09-21
- Publication Date
- 2026-10-27
AI Technical Summary
Technical Problem
[0003]现有量产方案存在明显技术短板：在加工板材时，并未针对板面区域进行差异化加工，采用的工艺参数全局统一；板材在生产的过程中，同时形成多种材质特性迥异的区域，由于上述板内材质不均问题的客观存在，采用全局统一参数进行钻孔加工时，部分微盲孔可能会因为激光能量过高，容易出现烧靶、基材碳化、孔壁发黑等问题，或者因为激光能量穿透不足，容易引发孔位偏位、钻蚀不到位、孔底残胶堆积等问题，HDI板激光钻孔方法仍有较大的改进空间
Benefits of technology
[0015]本申请提供的HDI板激光钻孔工艺方法，根据铜箔密集程度，在板材上划分出第一区域和第二区域，为操作人员进一步细化配置激光加工参数提供可靠依据，使激光加工参数更加匹配钻孔位置的板体，解决了相关技术中统一激光加工参数带来的伤铜、残胶等问题，提高HDI板上微盲孔整体打孔质量；在激光进行钻孔时，先通过激光祛除板材铜箔并扩大孔深，再降低脉冲宽度并提高脉冲数量以对孔壁修整除碳，最后再降低脉冲宽度和脉冲数量以清理孔底残胶，精准匹配材质阻力，孔壁粗糙度明显降低，减少孔底残胶残留量，后续沉铜层附着力大幅提升。
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Abstract
The application relates to the technical field of HDI board manufacturing, in particular to an HDI board, a laser drilling device and a process method thereof. The process method comprises the following steps: obtaining the copper foil density of a board; based on the copper foil density, at least one first area and a second area are divided on the board; copper is removed from a drilling position of the board by laser, and the hole depth is expanded, then the pulse width is reduced and the pulse number is increased to remove carbon on the hole wall, and finally the pulse width and the pulse number are reduced to clean the residual glue at the bottom of the hole. According to the process method, the first area and the second area are divided on the board according to the copper foil density, which provides a reliable basis for operators to further refine laser processing parameters, makes the laser processing parameters more matched with the board body at the drilling position, and solves the problems of copper damage and residual glue caused by unified laser processing parameters in the related art.
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